Heat pump control method, apparatus, device, and storage medium

Abstract

The application provides a heat pump control method, device, equipment and storage medium. The heat pump control method comprises the following steps: in response to a heat pump control request for a target heat pump, obtaining a heat pump operating temperature and a heat pump operating frequency of the target heat pump; determining a target saturation temperature corresponding to a target pressure state of the target heat pump according to the heat pump operating temperature and the heat pump operating frequency; and adjusting a heat pump operating parameter of the target heat pump based on the target saturation temperature to obtain a heat pump control result. In the heat pump operation, a pressure sensor is not used. By obtaining each heat pump operating parameter of the target heat pump and the heat pump operating frequency of the target heat pump, the target saturation temperature corresponding to the target pressure state of the target heat pump under each operating condition is simulated according to the heat pump operating parameter and the heat pump operating frequency, and the target heat pump is adjusted according to the target saturation temperature, so that the operating cost of the heat pump system is reduced, and the operating stability of the heat pump system is improved.

Description

Technical Field

[0001] This application relates to the field of heat pump control technology, specifically to a heat pump control method, apparatus, equipment, and storage medium. Background Technology

[0002] Currently, with the rapid development of heat pump technology, more and more users are using systems such as air source heat pumps for cooling or heating to meet their temperature control needs. Existing heat pump systems require pressure sensors on both the high-pressure and low-pressure sides for monitoring, in order to control system operation and ensure reliable system operation. However, using pressure sensors increases the cost of the heat pump and also increases the risk of quality issues, such as pressure sensor failure leading to abnormal heat pump operation, and pipe rupture causing refrigerant leakage. Summary of the Invention

[0003] This application provides a heat pump control method, apparatus, device, and storage medium, aiming to solve the technical problem that the use of pressure sensors for monitoring in existing heat pump systems leads to increased costs and increased heat pump quality risks.

[0004] On one hand, embodiments of this application provide a heat pump control method, which includes the following steps:

[0005] In response to a heat pump control request for a target heat pump, the heat pump operating temperature and heat pump operating frequency of the target heat pump are obtained;

[0006] The target saturation temperature of the target heat pump at the target pressure state is determined based on the heat pump operating temperature and the heat pump operating frequency.

[0007] The heat pump operating parameters of the target heat pump are adjusted based on the target saturation temperature to obtain the heat pump control result.

[0008] In one possible implementation of this application, the target pressure state includes a cooling high-pressure state, a cooling low-pressure state, a heating high-pressure state, and a heating low-pressure state.

[0009] Determining the target saturation temperature of the target heat pump at the target pressure state based on the heat pump operating temperature and the heat pump operating frequency includes:

[0010] Obtain the outer ring temperature corresponding to the target heat pump, and calculate the first target saturation temperature corresponding to the refrigeration high-pressure state based on the heat pump condensing temperature, outer ring temperature and heat pump operating frequency in the heat pump operating temperature.

[0011] And / or, calculate the second target saturation temperature corresponding to the low-pressure state of refrigeration based on the heat pump refrigerant temperature, the refrigeration water circuit temperature and the heat pump operating frequency in the heat pump operating temperature;

[0012] And / or, calculate the third target saturation temperature corresponding to the heating high-pressure state based on the hot water circuit temperature, the refrigerant liquid pipe temperature and the heat pump operating frequency in the heat pump operating temperature;

[0013] And / or, calculate the fourth target saturation temperature corresponding to the heating low-pressure state based on the heat pump condensing temperature, compressor return gas temperature in the heat pump operating temperature, the outer ring temperature and the heat pump operating frequency.

[0014] In one possible implementation of this application, the step of calculating the first target saturation temperature corresponding to the refrigeration high-pressure state based on the heat pump condensing temperature, the outer ring temperature, and the heat pump operating frequency in the heat pump operating temperature includes:

[0015] Obtain the first and second simulation coefficients corresponding to the refrigeration high-pressure state;

[0016] The outer ring temperature is adjusted according to the first simulation coefficient to obtain the first outer ring temperature, and the heat pump operating frequency is adjusted according to the second simulation coefficient to obtain the first operating frequency;

[0017] The first target saturation temperature is calculated based on the heat pump condensation temperature, the first outer ring temperature, and the first operating frequency.

[0018] In one possible implementation of this application, the step of calculating the second target saturation temperature corresponding to the low-pressure state of the cooling system based on the heat pump refrigerant temperature, the cooling water circuit temperature, and the heat pump operating frequency in the heat pump operating temperature includes:

[0019] Obtain the third and fourth simulation coefficients corresponding to the low-pressure cooling state;

[0020] The target refrigerant temperature is determined based on the refrigerant liquid pipe temperature and refrigerant gas pipe temperature in the heat pump refrigerant temperature, as well as the compressor return gas temperature.

[0021] The average temperature of the cooling water circuit is calculated based on the cooling water inlet temperature and cooling water outlet temperature in the cooling water circuit temperature.

[0022] The second target saturation temperature is calculated based on the target refrigerant temperature, the third simulation coefficient, the average temperature of the cooling water circuit, the heat pump operating frequency, and the fourth simulation coefficient.

[0023] In one possible implementation of this application, the step of calculating the third target saturation temperature corresponding to the heating high-pressure state based on the hot water circuit temperature, the refrigerant liquid pipe temperature, and the heat pump operating frequency in the heat pump operating temperature includes:

[0024] Obtain the fifth and sixth simulation coefficients corresponding to the heating high-pressure state;

[0025] The average temperature of the hot water circuit is calculated based on the heating inlet water temperature and the heating outlet water temperature in the hot water circuit.

[0026] The third target saturation temperature is calculated based on the refrigerant liquid pipe temperature, the average temperature of the hot water circuit, the fifth simulation coefficient, the sixth simulation coefficient, and the heat pump operating frequency.

[0027] In one possible implementation of this application, the step of calculating the fourth target saturation temperature corresponding to the heating low-pressure state based on the heat pump condensing temperature, compressor return gas temperature, outer ring temperature, and heat pump operating frequency in the heat pump operating temperature includes:

[0028] Obtain the seventh and eighth simulation coefficients corresponding to the heating low-pressure state;

[0029] The target heating refrigerant pipeline temperature is determined based on the heat pump condensing temperature and the compressor return gas temperature.

[0030] The fourth target saturation temperature is calculated based on the target heating refrigerant pipeline temperature, the outer ring temperature, the seventh simulation coefficient, the eighth simulation coefficient, and the heat pump operating frequency.

[0031] In one possible implementation of this application, adjusting the heat pump operating parameters of the target heat pump based on the target saturation temperature to obtain the heat pump control result includes:

[0032] If the target heat pump is in heating mode and the third target saturation temperature of the target heat pump is greater than the first temperature threshold, then the compressor speed and fan speed of the target heat pump are reduced according to the heating high pressure adjustment strategy to obtain the first heat pump control result.

[0033] If the target heat pump is in heating mode and the third target saturation temperature of the target heat pump is lower than the second temperature threshold, then the compressor speed and fan speed of the target heat pump are increased or decreased according to the high-pressure heating strategy to obtain the second heat pump control result.

[0034] On the other hand, this application provides a heat pump control device, the heat pump control device comprising:

[0035] The parameter acquisition module is configured to respond to a heat pump control request for a target heat pump and acquire the heat pump operating temperature and heat pump operating frequency of the target heat pump.

[0036] The parameter conversion module is configured to determine the target saturation temperature of the target heat pump at the target pressure state based on the heat pump operating temperature and the heat pump operating frequency.

[0037] The heat pump control module is configured to adjust the heat pump operating parameters of the target heat pump based on the target saturation temperature to obtain the heat pump control result.

[0038] On the other hand, this application also provides a heat pump control device, the heat pump control device comprising:

[0039] One or more processors;

[0040] Memory; and

[0041] One or more applications, wherein the one or more applications are stored in the memory and configured to be executed by the processor to implement the steps of the heat pump control method.

[0042] On the other hand, this application also provides a computer-readable storage medium having a computer program stored thereon, the computer program being loaded by a processor to execute the steps in the heat pump control method.

[0043] This application responds to a heat pump control request for a target heat pump, acquires the heat pump operating temperature and frequency of the target heat pump, determines the target saturation temperature of the target heat pump at a target pressure state based on the heat pump operating temperature and frequency, and adjusts the heat pump operating parameters of the target heat pump based on the target saturation temperature to obtain the heat pump control result. This achieves heat pump operation without the need for a pressure sensor. By acquiring various heat pump operating parameters and the target heat pump operating frequency, the target saturation temperature of the target heat pump at the target pressure state under various operating conditions is simulated using these parameters and frequency. The target heat pump parameters are then adjusted based on this target saturation temperature, thereby reducing the operating cost of the heat pump system and improving its operational stability. Attached Figure Description

[0044] To more clearly illustrate the technical solutions in the embodiments of this application, the accompanying drawings used in the description of the embodiments will be briefly introduced below. Obviously, the accompanying drawings described below are only some embodiments of the present invention. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.

[0045] Figure 1 This is a schematic diagram of a scenario for the heat pump control method according to an embodiment of this application;

[0046] Figure 2 This is a flowchart illustrating one embodiment of the heat pump control method in this application.

[0047] Figure 3A schematic diagram of the structure of an embodiment of the target heat pump in the heat pump control method provided in this application;

[0048] Figure 4 A flowchart illustrating an embodiment of the heat pump control method provided in this application for determining the target saturation temperature corresponding to the heating low-pressure state;

[0049] Figure 5 A schematic diagram of one embodiment of the heat pump control device provided in this application;

[0050] Figure 6 This is a schematic diagram of one embodiment of the heat pump control device provided in this application. Detailed Implementation

[0051] The technical solutions of the embodiments of this application will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some embodiments of the present invention, and not all embodiments. Based on the embodiments of the present invention, all other embodiments obtained by those skilled in the art without creative effort are within the scope of protection of the present invention.

[0052] In the description of this invention, it should be understood that the terms "center," "longitudinal," "lateral," "length," "width," "thickness," "upper," "lower," "front," "rear," "left," "right," "vertical," "horizontal," "top," "bottom," "inner," and "outer," etc., indicating orientation or positional relationships based on the orientation or positional relationships shown in the accompanying drawings, are only for the convenience of describing the invention and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation, and therefore should not be construed as a limitation of the invention. Furthermore, the terms "first" and "second" are used for descriptive purposes only and should not be construed as indicating or implying relative importance or implicitly specifying the number of indicated technical features. Thus, features defined with "first" and "second" may explicitly or implicitly include one or more of the stated features. In the description of this invention, "a plurality of" means two or more, unless otherwise explicitly specified.

[0053] In this application, the term "exemplary" is used to mean "serving as an example, illustration, or description." Any embodiment described as "exemplary" in this application is not necessarily to be construed as being more preferred or advantageous than other embodiments. The following description is provided to enable any person skilled in the art to make and use the invention. Details are set forth in the following description for purposes of explanation. It should be understood that those skilled in the art will recognize that the invention can be made without using these specific details. In other instances, well-known structures and processes will not be described in detail to avoid obscuring the description of the invention with unnecessary detail. Therefore, the invention is not intended to be limited to the embodiments shown, but is consistent with the broadest scope of the principles and features disclosed in this application.

[0054] Currently, with the rapid development of heat pump technology, more and more users are using systems such as air source heat pumps for cooling or heating to meet their temperature control needs. Existing heat pump systems require pressure sensors on both the high-pressure and low-pressure sides for monitoring, in order to control system operation and ensure reliable system operation. However, using pressure sensors increases the cost of the heat pump and also increases the risk of quality issues, such as pressure sensor failure leading to abnormal heat pump operation, and pipe rupture causing refrigerant leakage.

[0055] Based on this, this application proposes a heat pump control method, apparatus, device, and computer-readable storage medium to solve the technical problem that the use of pressure sensors for monitoring in existing heat pump systems leads to increased costs and increased heat pump quality risks.

[0056] The heat pump control method in this embodiment of the invention is applied to a heat pump control device, which is disposed in a heat pump control equipment. The heat pump control equipment is provided with one or more processors, a memory, and one or more application programs, wherein the one or more application programs are stored in the memory and configured to be executed by the processor to implement the heat pump control method. The heat pump control equipment can be the heat pump master controller of the target heat pump itself. In addition, the heat pump control equipment can also be a smart terminal for controlling the target heat pump, such as a mobile phone, tablet computer, network device, heat pump master controller, and smart computer.

[0057] like Figure 1 As shown, Figure 1This is a schematic diagram of a scenario illustrating the heat pump control method according to an embodiment of this application. The heat pump control scenario in this embodiment includes a heat pump control device 100 (which integrates a heat pump control unit) and a target heat pump 200. The heat pump control device 100 is equipped with a computer-readable storage medium corresponding to the heat pump control method to execute the steps of the heat pump control method. The target heat pump 200 is an air-source heat pump or other heat pump that is communicatively connected to the heat pump control device 100 and controls the temperature of a designated indoor area.

[0058] Understandable, Figure 1 The heat pump control device in the heat pump control method scenario shown, or the device included in the heat pump control device, does not constitute a limitation on the embodiments of the present invention. That is, the number or type of heat pump control device included in the heat pump control method scenario, or the number or type of devices included in each device, does not affect the overall implementation of the technical solution in the embodiments of the present invention, and can all be considered as equivalent substitutions or derivatives of the technical solutions claimed in the embodiments of the present invention.

[0059] In this embodiment of the invention, the heat pump control device 100 is mainly used to: respond to a heat pump control request for a target heat pump, and obtain the heat pump operating temperature and heat pump operating frequency of the target heat pump;

[0060] The target saturation temperature of the target heat pump at the target pressure state is determined based on the heat pump operating temperature and the heat pump operating frequency.

[0061] The heat pump operating parameters of the target heat pump are adjusted based on the target saturation temperature to obtain the heat pump control result.

[0062] This application provides a heat pump control method, apparatus, device, and computer-readable storage medium, which will be described in detail below.

[0063] It will be understood by those skilled in the art that Figure 1 The application environment shown is only one application scenario related to the solution of this application and does not constitute a limitation on the application scenario of this application. Other application environments may include more than one application scenario. Figure 1 The number of heat pump control devices shown, or the heat pump control network connections, for example... Figure 1 Only one heat pump control device is shown in the diagram. It is understood that the scenario of this heat pump control method may also include one or more heat pump control devices, which are not specifically limited here. The heat pump control device 100 may also include a memory for storing operating parameters and other data.

[0064] It should be noted that, Figure 1The schematic diagram of the heat pump control method shown is merely an example. The scenarios of the heat pump control method described in the embodiments of the present invention are intended to more clearly illustrate the technical solutions of the embodiments of the present invention and do not constitute a limitation on the technical solutions provided in the embodiments of the present invention.

[0065] Based on the scenarios described above for heat pump control methods, various embodiments of the heat pump control method disclosed in this invention are proposed.

[0066] like Figure 2 As shown, Figure 2 This is a flowchart illustrating one embodiment of the heat pump control method in this application. The heat pump control method includes the following steps 201 to 203:

[0067] 201. Respond to the heat pump control request for the target heat pump, and obtain the heat pump operating temperature and heat pump operating frequency of the target heat pump;

[0068] The heat pump control method in this embodiment is applied to a heat pump control device. The type and number of heat pump control devices are not specifically limited; that is, the heat pump control device can be a target heat pump and its own heat pump main control module. Optionally, the heat pump control device can also be a smart terminal that is communicatively connected to the target heat pump and used to control the operating status of the target heat pump. For example, the heat pump control device can also be a heat pump remote control, mobile phone, tablet computer, or other smart terminal. In a specific embodiment, the heat pump control device is the heat pump main controller corresponding to the target heat pump. The target heat pump is a heat pump device capable of regulating the temperature of a specified area.

[0069] Specifically, installing a pressure sensor in the target heat pump increases hardware costs such as the pressure sensor itself, piping, and electrical control components, and may also increase stability issues such as pressure sensor failure, pipe breakage, and refrigerant leakage. Therefore, to reduce the hardware cost of the target heat pump and improve its operational stability, when the target heat pump does not have a pressure sensor or the pressure sensor in the target heat pump is faulty, the heat pump control equipment can simulate the target saturation temperature corresponding to different target pressure states. Then, it adjusts the heat pump operating parameters according to the target saturation temperature to obtain the heat pump operating results. This allows the system operating pressure parameters to be simulated using the heat pump operating temperature of the target heat pump, thereby eliminating the need for a pressure sensor in the target heat pump, reducing its cost, and improving system operational stability.

[0070] Specifically, during operation, the heat pump control equipment responds to heat pump control requests for a target heat pump. These requests are control commands that drive the heat pump control equipment to simulate a target saturation temperature corresponding to a target pressure state based on the target heat pump's operating temperature and efficiency. The control command then uses this target saturation temperature to control the operation of the target heat pump. This heat pump control request can be triggered when no pressure sensor is installed in the target heat pump. Furthermore, it can also be triggered when a pressure sensor is installed in the target heat pump and the sensor malfunctions.

[0071] Specifically, after receiving a heat pump control request for a target heat pump, the heat pump control equipment acquires the heat pump operating temperature and heat pump operating frequency of the target heat pump. The heat pump operating temperature refers to the temperature parameters of each component of the target heat pump system during operation. The heat pump operating frequency characterizes the compressor's operating frequency during the operation of the target heat pump.

[0072] Optionally, the heat pump operating temperature includes at least the target operating temperatures corresponding to the heat pump's operation, such as the heat pump condensing temperature, the heat pump refrigerant temperature, the refrigeration water circuit temperature, and the compressor return gas temperature.

[0073] The heat pump condensing temperature is a temperature parameter characterizing either the condenser inlet temperature or the condenser outlet temperature during the operation of the target heat pump. Specifically, when the target heat pump is in heating mode, the condensing temperature characterizes the condenser inlet temperature. When the target heat pump is in cooling mode, the condensing temperature characterizes the refrigerant outlet temperature.

[0074] The refrigerant temperature of a heat pump is a temperature parameter characterizing the refrigerant gas pipe temperature and the refrigerant liquid pipe temperature in the hydraulic module of the target heat pump. In one specific embodiment, the heat pump refrigerant temperature includes both the refrigerant liquid pipe temperature and the refrigerant gas pipe temperature.

[0075] The cooling water circuit temperature is an operating temperature parameter characterizing the inlet and outlet water temperatures of the hydraulic module when the target heat pump is running in cooling mode. In one specific embodiment, the cooling water circuit temperature includes the cooling inlet water temperature and the cooling outlet water temperature.

[0076] The compressor return gas temperature is the return gas temperature of the target heat pump compressor during operation.

[0077] The operating temperature of the heat pump can be detected by a temperature sensing bulb or temperature sensor installed in the corresponding heat pump area of ​​the target heat pump, such as... Figure 3 As shown, Figure 3 This is a schematic diagram of the structure of an embodiment of the target heat pump in the heat pump control method provided in this application. Figure 3It can be seen that the heat pump operating parameters can be collected by the inlet water temperature sensor, outlet water temperature sensor, gas pipe temperature sensor, liquid pipe temperature sensor, exhaust temperature sensor and return gas temperature sensor when the target heat pump is running.

[0078] 202. Determine the target saturation temperature of the target heat pump at the target pressure state based on the heat pump operating temperature and the heat pump operating frequency;

[0079] Specifically, after acquiring the heat pump operating temperature and frequency, the heat pump control equipment simulates the target saturation temperature corresponding to the target pressure state based on these operating temperatures and frequencies. This allows for state control of the target heat pump without using a pressure sensor. The target saturation temperature is the temperature at which the refrigerant reaches equilibrium under a specific pressure state in the target heat pump.

[0080] The target pressure state includes a high-pressure cooling state, a low-pressure cooling state, a high-pressure heating state, and a low-pressure heating state. Different target pressure states indicate that the target heat pump is operating under different high-pressure or different low-pressure conditions.

[0081] For example, the high-pressure state of refrigeration is the pressure value information that characterizes the high-pressure state generated by the compressor during the refrigeration process of the target heat pump.

[0082] The low-pressure state of refrigeration is the pressure value information that characterizes the compressor under low-pressure conditions during the target heat pump refrigeration process.

[0083] The high-pressure state during heating is the pressure value information that characterizes the high-pressure state generated by the compressor during the heating process of the target heat pump.

[0084] The low-pressure state during heating is the pressure value information that characterizes the compressor under low-pressure conditions during the target heating process.

[0085] Specifically, the heat pump control equipment acquires the outer ring temperature corresponding to the target heat pump, wherein the outer ring temperature is the outdoor ambient temperature characterizing the operating area of ​​the target heat pump.

[0086] Specifically, after obtaining the outer ring temperature, the heat pump operating temperature, and the heat pump operating frequency, the heat pump control equipment also calculates the first target saturation temperature corresponding to the target heat pump under the refrigeration high pressure state based on the heat pump condensing temperature, the outer ring temperature, and the heat pump operating frequency in the heat pump operating temperature.

[0087] Specifically, the heat pump control equipment also sets simulation coefficients according to different target pressure states and different heat pump models. For example, under high-pressure cooling conditions, a first simulation coefficient and a second simulation coefficient corresponding to the target heat pump are set. When simulating high-pressure cooling conditions, the first and second simulation coefficients are used to adjust the outer ring temperature and the heat pump operating frequency. In one specific embodiment, the first simulation coefficient is -0.05 and the second simulation coefficient is 0.18. The values ​​of each simulation coefficient can be customized according to the actual needs of the scenario.

[0088] Specifically, when the heat pump control device simulates the first target saturation temperature corresponding to the high-pressure state of cooling, it acquires a first simulation coefficient and a second simulation coefficient corresponding to that high-pressure state. Furthermore, it adjusts the outer ring temperature based on the first simulation coefficient to obtain the first outer ring temperature, and adjusts the heat pump operating frequency based on the second simulation coefficient to obtain the first operating frequency. In other words, the heat pump control device calculates the product of the first simulation coefficient and the outer ring temperature to obtain the first outer ring temperature. Finally, it calculates the product between the second simulation coefficient and the heat pump operating frequency to obtain the first operating frequency.

[0089] Specifically, after acquiring the first outer ring temperature and the first operating frequency, the heat pump control equipment calculates the sum of the heat pump condensing temperature, the first outer ring temperature, and the first operating frequency to obtain the first target saturation temperature of the target heat pump under high-pressure cooling conditions. The specific formula for calculating the first target saturation temperature is as follows:

[0090] T1 = T df +C1*T env +C2*F;

[0091] Where T1 is the first target saturation temperature, T df C1 is the heat pump condensing temperature, C2 is the first simulation coefficient, C2 is the second simulation coefficient, and F is the heat pump operating frequency.

[0092] Optionally, the heat pump control device can also calculate the second target saturation temperature of the target heat pump in the low-pressure cooling state based on the heat pump refrigerant temperature, cooling water circuit temperature and heat pump operating frequency in the heat pump operating temperature.

[0093] That is, the heat pump control equipment acquires the third and fourth simulation coefficients pre-set for the target heat pump under low-pressure cooling conditions. In subsequent steps, the third simulation coefficient is used to adjust the uniform temperature of the cooling water circuit, and the fourth simulation coefficient is used to adjust the operating frequency of the heat pump. In one specific embodiment, the third simulation coefficient is -0.02, and the fourth simulation coefficient is -0.002.

[0094] The heat pump control equipment also determines the target refrigerant temperature based on the refrigerant liquid pipe temperature, refrigerant gas pipe temperature, and compressor return gas temperature within the heat pump refrigerant temperature range. This target refrigerant temperature is the lowest temperature characteristic of the refrigerant piping. Specifically, the heat pump control equipment acquires the refrigerant liquid pipe temperature, refrigerant gas pipe temperature, and compressor return gas temperature from the heat pump refrigerant temperature range, compares these temperatures, and determines the minimum value between the heat pump refrigerant temperature and the compressor return gas temperature. This minimum temperature is then defined as the target refrigerant temperature.

[0095] Specifically, the heat pump control equipment also calculates the average temperature of the cooling water circuit of the target heat pump based on the cooling water inlet temperature and cooling water outlet temperature in the commanded water circuit temperature. This average temperature of the cooling water circuit is the average temperature of the cooling water circuit under the current operating state of the target heat pump. That is, the heat pump control equipment calculates the average temperature of the cooling water inlet temperature and cooling water outlet temperature to obtain the average temperature of the cooling water circuit.

[0096] Specifically, after obtaining the target refrigerant temperature and the average temperature of the cooling water circuit, the heat pump control equipment calculates the second target saturation temperature corresponding to the target heat pump in the low-pressure cooling state based on the target refrigerant temperature, the third simulation coefficient, the average temperature of the cooling water circuit, the heat pump operating frequency, and the fourth simulation coefficient. That is, the heat pump control equipment adjusts the average temperature of the cooling water circuit using the third simulation coefficient to obtain the adjusted average temperature, and adjusts the heat pump operating frequency using the fourth simulation coefficient to obtain the second operating frequency. Finally, it calculates the sum of the target refrigerant temperature, the adjusted average temperature of the cooling water circuit, and the second operating frequency to obtain the second target saturation temperature corresponding to the target heat pump in the low-pressure cooling state. The specific formula for calculating the second target saturation temperature is shown below:

[0097] T2 = MIN(T) L ,T G ,T s )+C3*AVE(T in ,T out )+C4*F;

[0098] Where T2 is the second target saturation temperature, MIN(T L ,T G ,T s C3 is the target refrigerant temperature, C4 is the third simulation coefficient, and AVE(T) is the target refrigerant temperature. in ,T out ) represents the average temperature of the cooling water circuit, C4 is the fourth simulation coefficient, and F is the operating frequency of the heat pump.

[0099] Optionally, the heat pump control equipment can also calculate the third target saturation temperature of the target heat pump under high-pressure heating conditions based on the hot water circuit temperature, refrigerant pipe temperature, and heat pump operating frequency in the heat pump operating temperature.

[0100] That is, the heat pump control equipment acquires the fifth and sixth simulation coefficients of the target heat pump pre-set for the heating high-pressure state. In subsequent steps, the fifth simulation coefficient is used to adjust the uniform temperature of the hot water circuit, and the sixth simulation coefficient is used to adjust the heat pump operating frequency. In one specific embodiment, the fifth simulation coefficient is -0.05 and the sixth simulation coefficient is 0.13.

[0101] Specifically, after obtaining the temperature of the hot water supply circuit, the heat pump control equipment calculates the average temperature of the hot water supply circuit based on the heating inlet water temperature and the heating outlet water temperature within that temperature range. This average temperature of the hot water supply circuit represents the average temperature of the hot water supply circuit under the current operating state of the target heat pump. That is, the heat pump control equipment calculates the average temperature of the heating inlet water temperature and the heating outlet water temperature to obtain the average temperature of the hot water supply circuit.

[0102] Specifically, after obtaining the average temperature of the hot water circuit, the heat pump control equipment calculates the third target saturation temperature based on the refrigerant liquid pipe temperature, the average temperature of the hot water circuit, the fifth simulation coefficient, the sixth simulation coefficient, and the heat pump operating frequency. That is, the heat pump control equipment adjusts the average temperature of the hot water circuit using the fifth simulation coefficient to obtain the adjusted average temperature, adjusts the heat pump operating frequency using the sixth simulation coefficient to obtain the third operating frequency, and then calculates the sum of the refrigerant liquid pipe temperature, the adjusted average temperature of the hot water circuit, and the third operating frequency to obtain the third target saturation temperature corresponding to the target heat pump under high-pressure heating conditions. The specific formula for calculating the third target saturation temperature is as follows:

[0103] T3 = T L +C5*AVE(T in ,T out )+C6*F;

[0104] Where T3 is the third target saturation temperature, T L AVE(T) represents the temperature of the refrigerant liquid pipe. in ,T out ) represents the average temperature of the hot water circuit, F represents the operating frequency of the heat pump, C5 represents the fifth simulation coefficient, and C6 represents the sixth simulation coefficient.

[0105] Optionally, in another specific embodiment, the heat pump control device can also calculate the fourth target saturation temperature corresponding to the target heat pump under heating low-pressure state based on the heat pump condensing temperature, compressor return gas temperature, outer ring temperature and heat pump operating frequency in the heat pump operating temperature.

[0106] 203. Adjust the heat pump operating parameters of the target heat pump based on the target saturation temperature to obtain the heat pump control result.

[0107] Specifically, after obtaining the target saturation temperature corresponding to different target pressure states, the heat pump control equipment uses the target saturation temperature to replace the heat pump operating pressure value to adjust the heat pump operating parameters of the target heat pump in order to obtain the heat pump control result.

[0108] Optionally, the heat pump control device can adjust the compressor speed of the target heat pump according to the magnitude and change of the target saturation temperature, so as to improve the refrigerant flow and compression efficiency of the target heat pump.

[0109] Optionally, the heat pump control device can also adjust the opening of the expansion valve of the target heat pump according to the magnitude and change of the target saturation temperature, so as to increase the refrigerant flow and evaporation efficiency of the target heat pump.

[0110] Optionally, the heat pump control equipment can also adjust the fan speed of the target heat pump according to the magnitude and changes of the target saturation temperature, thereby increasing the heat dissipation efficiency and condensation effect of the target heat pump.

[0111] Optionally, in other embodiments, the heat pump control device can also adjust other heat pump operating parameters of the target heat pump according to the target saturation temperature to improve the heat pump operation effect of the target heat pump.

[0112] For example, in one specific embodiment, when the target heat pump is in heating mode, the heat pump control device can make corresponding adjustments to the target heat pump based on the comparison result between the third saturation temperature of the target heat pump and the preset first and second temperature thresholds, so as to improve the heat pump operation effect of the target heat pump.

[0113] That is, if the third target saturation temperature of the target heat pump is greater than the first temperature threshold, the compressor speed and fan speed of the target heat pump are reduced according to the heating high pressure adjustment strategy, and the expansion valve is prohibited from being closed or opened, so as to obtain the first heat pump control result.

[0114] If the third target saturation temperature of the target heat pump is less than the first temperature threshold, the compressor speed and fan speed of the target heat pump are increased according to the heating high pressure adjustment strategy, and the opening or closing of the expansion valve is prohibited, so as to obtain the second heat pump control result.

[0115] In this embodiment, the heat pump control device responds to a heat pump control request for a target heat pump, acquires the heat pump operating temperature and operating frequency of the target heat pump, determines the target saturation temperature of the target heat pump at the target pressure state based on the heat pump operating temperature and operating frequency, and adjusts the heat pump operating parameters of the target heat pump based on the target saturation temperature to obtain the heat pump control result. This achieves heat pump operation without the need for a pressure sensor. By acquiring various heat pump operating parameters and the target heat pump operating frequency, the target saturation temperature of the target heat pump at the target pressure state under various operating conditions is simulated using these parameters and frequency. The target heat pump parameters are then adjusted based on this target saturation temperature, thereby reducing the operating cost of the heat pump system and improving its operational stability.

[0116] like Figure 4 As shown, Figure 4 This is a flowchart illustrating an embodiment of the heat pump control method for determining the target saturation temperature corresponding to the low-pressure heating state provided in this application. Specifically, in this embodiment, the heat pump control method further includes steps 301 to 303:

[0117] 301. Obtain the seventh and eighth simulation coefficients corresponding to the heating low-pressure state;

[0118] 302. Determine the target heating refrigerant pipeline temperature based on the heat pump condensing temperature and the compressor return gas temperature;

[0119] 303. Calculate the fourth target saturation temperature based on the target heating refrigerant pipeline temperature, the outer ring temperature, the seventh simulation coefficient, the eighth simulation coefficient, and the heat pump operating frequency.

[0120] Specifically, in this embodiment, the heat pump control device can also calculate the fourth target saturation temperature corresponding to the target heat pump under low-pressure heating state based on the heat pump condensing temperature, compressor return gas temperature, outer ring temperature and heat pump operating frequency in the heat pump operating temperature.

[0121] Specifically, the heat pump control device acquires the preset seventh and eighth simulation coefficients of the target heat pump under low-pressure heating conditions. In one specific embodiment, the value of the seventh simulation coefficient is -0.02, and the value of the eighth simulation coefficient is -0.02.

[0122] Specifically, the heat pump control equipment also determines the target heating refrigerant temperature based on the heat pump condensing temperature and the compressor return gas temperature of the target heat pump. This target heating refrigerant temperature is the lowest temperature in the heating refrigerant pipeline that characterizes the target heat pump during heating. That is, after obtaining the heat pump condensing temperature and the compressor return gas temperature of the target heat pump, the heat pump control equipment compares these two temperatures and sets the lower of the two temperatures as the target heating refrigerant temperature.

[0123] Specifically, after determining the target heating refrigerant temperature, the heat pump control equipment calculates the fourth target saturation temperature based on the target heating refrigerant pipeline temperature, the outer loop temperature, the seventh simulation coefficient, the eighth simulation coefficient, and the heat pump operating frequency. That is, the heat pump control equipment adjusts the outer loop temperature using the seventh simulation coefficient to obtain the adjusted outer loop temperature, and adjusts the heat pump operating frequency using the eighth simulation coefficient to obtain the fourth operating frequency. Finally, it calculates the sum of the target heating refrigerant pipeline temperature, the adjusted outer loop temperature, and the fourth operating frequency to obtain the fourth target saturation temperature of the target heat pump under low-pressure heating conditions. The specific formula for calculating the fourth target saturation temperature is as follows:

[0124] T4 = MIN(T df ,T s )+C7*T env +C8*F;

[0125] Where T4 is the fourth target saturation temperature, MIN(T df ,T s T represents the target heating refrigerant temperature. env Where is the outer ring temperature, F is the heat pump operating frequency, C7 is the seventh simulation coefficient, and C8 is the eighth simulation coefficient.

[0126] Specifically, after determining the fourth target saturation temperature of the target heat pump under low-pressure heating conditions, the heat pump control equipment also uses this fourth target saturation temperature to control the heat pump operating parameters of the target heat pump, thereby obtaining the heat pump control result.

[0127] In this embodiment, the heat pump control device acquires the seventh and eighth analog coefficients corresponding to the low-pressure heating state; determines the target heating refrigerant pipeline temperature based on the heat pump condensing temperature and the compressor return gas temperature; and calculates the fourth target saturation temperature based on the target heating refrigerant pipeline temperature, the outer ring temperature, the seventh and eighth analog coefficients, and the heat pump operating frequency. This achieves the calculation of the fourth target saturation temperature of the target heat pump under low-pressure heating state without the need for a pressure sensor, providing a control basis for subsequent adjustments to the target heat pump's operating state, reducing the heat pump cost, and improving the heat pump's operational stability.

[0128] To better implement the heat pump control method in the embodiments of this application, a heat pump control device is also provided in the embodiments of this application, such as... Figure 5 As shown, Figure 5 This is a schematic diagram of the structure of the heat pump control device provided in the embodiments of this application. Specifically, the heat pump control device 400 includes:

[0129] The parameter acquisition module 401 is configured to respond to a heat pump control request for a target heat pump and acquire the heat pump operating temperature and heat pump operating frequency of the target heat pump.

[0130] The parameter conversion module 402 is configured to determine the target saturation temperature of the target heat pump at the target pressure state based on the heat pump operating temperature and the heat pump operating frequency.

[0131] The heat pump control module 403 is configured to adjust the heat pump operating parameters of the target heat pump based on the target saturation temperature to obtain the heat pump control result.

[0132] In one possible implementation of this embodiment, the heat pump control device determines the target saturation temperature of the target heat pump at the target pressure state based on the heat pump operating temperature and the heat pump operating frequency, including:

[0133] Obtain the outer ring temperature corresponding to the target heat pump, and calculate the first target saturation temperature corresponding to the refrigeration high-pressure state based on the heat pump condensing temperature, outer ring temperature and heat pump operating frequency in the heat pump operating temperature.

[0134] And / or, calculate the second target saturation temperature corresponding to the low-pressure state of refrigeration based on the heat pump refrigerant temperature, the refrigeration water circuit temperature and the heat pump operating frequency in the heat pump operating temperature;

[0135] And / or, calculate the third target saturation temperature corresponding to the heating high-pressure state based on the hot water circuit temperature, the refrigerant liquid pipe temperature and the heat pump operating frequency in the heat pump operating temperature;

[0136] And / or, calculate the fourth target saturation temperature corresponding to the heating low-pressure state based on the heat pump condensing temperature, compressor return gas temperature in the heat pump operating temperature, the outer ring temperature and the heat pump operating frequency.

[0137] In one possible implementation of this embodiment, the heat pump control device calculates the first target saturation temperature corresponding to the refrigeration high-pressure state based on the heat pump condensing temperature, the outer ring temperature, and the heat pump operating frequency within the heat pump operating temperature, including:

[0138] Obtain the first and second simulation coefficients corresponding to the refrigeration high-pressure state;

[0139] The outer ring temperature is adjusted according to the first simulation coefficient to obtain the first outer ring temperature, and the heat pump operating frequency is adjusted according to the second simulation coefficient to obtain the first operating frequency;

[0140] The first target saturation temperature is calculated based on the heat pump condensation temperature, the first outer ring temperature, and the first operating frequency.

[0141] In one possible implementation of this embodiment, the heat pump control device calculates the second target saturation temperature corresponding to the low-pressure state of the cooling system based on the heat pump refrigerant temperature, the cooling water circuit temperature, and the heat pump operating frequency within the heat pump operating temperature, including:

[0142] Obtain the third and fourth simulation coefficients corresponding to the low-pressure cooling state;

[0143] The target refrigerant temperature is determined based on the refrigerant liquid pipe temperature and refrigerant gas pipe temperature in the heat pump refrigerant temperature, as well as the compressor return gas temperature.

[0144] The average temperature of the cooling water circuit is calculated based on the cooling water inlet temperature and cooling water outlet temperature in the cooling water circuit temperature.

[0145] The second target saturation temperature is calculated based on the target refrigerant temperature, the third simulation coefficient, the average temperature of the cooling water circuit, the heat pump operating frequency, and the fourth simulation coefficient.

[0146] In one possible implementation of this embodiment, the heat pump control device calculates the third target saturation temperature corresponding to the heating high-pressure state based on the hot water circuit temperature, the refrigerant liquid pipe temperature, and the heat pump operating frequency in the heat pump operating temperature, including:

[0147] Obtain the fifth and sixth simulation coefficients corresponding to the heating high-pressure state;

[0148] The average temperature of the hot water circuit is calculated based on the heating inlet water temperature and the heating outlet water temperature in the hot water circuit.

[0149] The third target saturation temperature is calculated based on the refrigerant liquid pipe temperature, the average temperature of the hot water circuit, the fifth simulation coefficient, the sixth simulation coefficient, and the heat pump operating frequency.

[0150] In one possible implementation of this embodiment, the heat pump control device calculates the fourth target saturation temperature corresponding to the heating low-pressure state based on the heat pump condensing temperature, compressor return gas temperature, outer ring temperature, and heat pump operating frequency within the heat pump operating temperature, including:

[0151] Obtain the seventh and eighth simulation coefficients corresponding to the heating low-pressure state;

[0152] The target heating refrigerant pipeline temperature is determined based on the heat pump condensing temperature and the compressor return gas temperature.

[0153] The fourth target saturation temperature is calculated based on the target heating refrigerant pipeline temperature, the outer ring temperature, the seventh simulation coefficient, the eighth simulation coefficient, and the heat pump operating frequency.

[0154] In one possible implementation of this embodiment, the heat pump control device adjusts the heat pump operating parameters of the target heat pump based on the target saturation temperature to obtain the heat pump control result, including:

[0155] If the target heat pump is in heating mode and the third target saturation temperature of the target heat pump is greater than the first temperature threshold, then the compressor speed and fan speed of the target heat pump are reduced according to the heating high pressure adjustment strategy to obtain the first heat pump control result.

[0156] If the target heat pump is in heating mode and the third target saturation temperature of the target heat pump is lower than the second temperature threshold, then the compressor speed and fan speed of the target heat pump are increased or decreased according to the high-pressure heating strategy to obtain the second heat pump control result.

[0157] In this embodiment, the heat pump control device responds to a heat pump control request for a target heat pump, acquires the heat pump operating temperature and operating frequency of the target heat pump, determines the target saturation temperature of the target heat pump at the target pressure state based on the heat pump operating temperature and operating frequency, and adjusts the heat pump operating parameters of the target heat pump based on the target saturation temperature to obtain the heat pump control result. This achieves heat pump operation without the need for a pressure sensor. By acquiring various heat pump operating parameters and the target heat pump operating frequency, the target saturation temperature of the target heat pump at the target pressure state under various operating conditions is simulated using these parameters and frequency. The target heat pump parameters are then adjusted based on this target saturation temperature, thereby reducing the operating cost of the heat pump system and improving its operational stability.

[0158] This invention also provides a heat pump control device, such as... Figure 6 As shown, Figure 6 This is a schematic diagram of one embodiment of the heat pump control device provided in this application.

[0159] The heat pump control device integrates any one of the heat pump control devices provided in the embodiments of the present invention, and the heat pump control device includes:

[0160] One or more processors;

[0161] Memory; and

[0162] One or more applications, wherein the one or more applications are stored in the memory and configured to be executed by the processor in the steps of the heat pump control method described in any of the embodiments of the above-described heat pump control method.

[0163] Specifically, a heat pump control device may include components such as a processor 501 with one or more processing cores, a memory 502 with one or more computer-readable storage media, a power supply 503, and an input unit 504. Those skilled in the art will understand that... Figure 5 The structure of the heat pump control device shown does not constitute a limitation on the heat pump control device. It may include more or fewer components than shown, or combine certain components, or have different component arrangements. Wherein:

[0164] The processor 501 is the control center of the heat pump control device. It connects various parts of the heat pump control device via various interfaces and lines. By running or executing software programs and / or modules stored in the memory 502, and by calling data stored in the memory 502, it performs various functions and processes data of the heat pump control device, thereby providing overall monitoring of the heat pump control device. Optionally, the processor 501 may include one or more processing cores; preferably, the processor 501 may integrate an application processor and a modem processor, wherein the application processor mainly handles the operating system, user interface, and applications, and the modem processor mainly handles wireless communication. It is understood that the modem processor may not be integrated into the processor 501.

[0165] The memory 502 can be used to store software programs and modules. The processor 501 executes various functional applications and data processing by running the software programs and modules stored in the memory 502. The memory 502 may mainly include a program storage area and a data storage area. The program storage area may store the operating system, application programs required for at least one function (such as sound playback function, image playback function, etc.), etc.; the data storage area may store data created based on the use of the heat pump control device, etc. In addition, the memory 502 may include high-speed random access memory, and may also include non-volatile memory, such as at least one disk storage device, flash memory device, or other volatile solid-state storage device. Accordingly, the memory 502 may also include a memory controller to provide the processor 501 with access to the memory 502.

[0166] The heat pump control device also includes a power supply 503 that supplies power to the various components. Preferably, the power supply 503 can be logically connected to the processor 501 through a power management system, thereby enabling functions such as charging, discharging, and power consumption management through the power management system. The power supply 503 may also include one or more DC or AC power supplies, recharging systems, power fault detection circuits, power converters or inverters, power status indicators, and other arbitrary components.

[0167] The heat pump control device may also include an input unit 504, which can be used to receive input digital or character information, and generate keyboard, mouse, joystick, optical or trackball signal inputs related to user settings and function control.

[0168] Although not shown, the heat pump control device may also include a display unit, etc., which will not be described in detail here. Specifically, in this embodiment, the processor 501 in the heat pump control device loads the executable files corresponding to the processes of one or more application programs into the memory 502 according to the following instructions, and the processor 501 runs the application programs stored in the memory 502 to realize various functions, as follows:

[0169] In response to a heat pump control request for a target heat pump, the heat pump operating temperature and heat pump operating frequency of the target heat pump are obtained;

[0170] The target saturation temperature of the target heat pump at the target pressure state is determined based on the heat pump operating temperature and the heat pump operating frequency.

[0171] The heat pump operating parameters of the target heat pump are adjusted based on the target saturation temperature to obtain the heat pump control result.

[0172] Therefore, embodiments of the present invention provide a computer-readable storage medium, which may include: read-only memory (ROM), random access memory (RAM), magnetic disk, or optical disk, etc. A computer program is stored thereon, which is loaded by a processor to execute the steps in any of the heat pump control methods provided in the embodiments of the present invention. For example, the computer program loaded by the processor can execute the following steps:

[0173] In response to a heat pump control request for a target heat pump, the heat pump operating temperature and heat pump operating frequency of the target heat pump are obtained;

[0174] The target saturation temperature of the target heat pump at the target pressure state is determined based on the heat pump operating temperature and the heat pump operating frequency.

[0175] The heat pump operating parameters of the target heat pump are adjusted based on the target saturation temperature to obtain the heat pump control result.

[0176] In the above embodiments, the descriptions of each embodiment have different focuses. For parts not described in detail in a certain embodiment, please refer to the detailed descriptions of other embodiments above, which will not be repeated here.

[0177] In practice, each of the above units or structures can be implemented as an independent entity or can be arbitrarily combined to be implemented as the same or several entities. For the specific implementation of each of the above units or structures, please refer to the previous method embodiments, which will not be repeated here.

[0178] For details on the implementation of each of the above operations, please refer to the previous examples, which will not be repeated here.

[0179] The above provides a detailed description of a heat pump control method provided by the embodiments of this application. Specific embodiments have been used to illustrate the principles and implementation methods of the present invention. The description of the above embodiments is only for the purpose of helping to understand the method and core ideas of the present invention. At the same time, for those skilled in the art, there will be changes in the specific implementation methods and application scope based on the ideas of the present invention. Therefore, the content of this specification should not be construed as a limitation of the present invention.

Claims

1. A heat pump control method, characterized in that, The heat pump control method includes: In response to a heat pump control request for a target heat pump, the heat pump operating temperature and heat pump operating frequency of the target heat pump are obtained; The target saturation temperature of the target heat pump at the target pressure state is determined based on the heat pump operating temperature and the heat pump operating frequency. The target pressure state includes a cooling high-pressure state, a cooling low-pressure state, a heating high-pressure state, and a heating low-pressure state. The target saturation temperature includes a first target saturation temperature, a second target saturation temperature, and a third target saturation temperature. Obtain the outer ring temperature corresponding to the target heat pump, and calculate the first target saturation temperature corresponding to the refrigeration high-pressure state based on the heat pump condensing temperature, outer ring temperature and heat pump operating frequency in the heat pump operating temperature. And / or, calculate the second target saturation temperature corresponding to the low-pressure state of refrigeration based on the heat pump refrigerant temperature, the refrigeration water circuit temperature and the heat pump operating frequency in the heat pump operating temperature; And / or, calculate the third target saturation temperature corresponding to the heating high-pressure state based on the hot water circuit temperature, the refrigerant liquid pipe temperature and the heat pump operating frequency in the heat pump operating temperature; And / or, calculate the fourth target saturation temperature corresponding to the heating low-pressure state based on the heat pump condensing temperature, compressor return gas temperature in the heat pump operating temperature, the outer ring temperature and the heat pump operating frequency; The heat pump operating parameters of the target heat pump are adjusted based on the target saturation temperature to obtain the heat pump control result.

2. The heat pump control method according to claim 1, characterized in that, The calculation of the first target saturation temperature corresponding to the refrigeration high-pressure state based on the heat pump condensing temperature, outer ring temperature, and heat pump operating frequency in the heat pump operating temperature includes: Obtain the first and second simulation coefficients corresponding to the refrigeration high-pressure state; The outer ring temperature is adjusted according to the first simulation coefficient to obtain the first outer ring temperature, and the heat pump operating frequency is adjusted according to the second simulation coefficient to obtain the first operating frequency; The first target saturation temperature is calculated based on the heat pump condensation temperature, the first outer ring temperature, and the first operating frequency.

3. The heat pump control method according to claim 1, characterized in that, The calculation of the second target saturation temperature corresponding to the low-pressure state of refrigeration based on the heat pump refrigerant temperature, the refrigeration water circuit temperature, and the heat pump operating frequency includes: Obtain the third and fourth simulation coefficients corresponding to the low-pressure cooling state; The target refrigerant temperature is determined based on the refrigerant liquid pipe temperature and refrigerant gas pipe temperature in the heat pump refrigerant temperature, as well as the compressor return gas temperature. The average temperature of the cooling water circuit is calculated based on the cooling water inlet temperature and cooling water outlet temperature in the cooling water circuit temperature. The second target saturation temperature is calculated based on the target refrigerant temperature, the third simulation coefficient, the average temperature of the cooling water circuit, the heat pump operating frequency, and the fourth simulation coefficient.

4. The heat pump control method according to claim 1, characterized in that, The calculation of the third target saturation temperature corresponding to the high-pressure heating state based on the hot water circuit temperature, refrigerant pipe temperature, and heat pump operating frequency in the heat pump operating temperature includes: Obtain the fifth and sixth simulation coefficients corresponding to the heating high-pressure state; The average temperature of the hot water circuit is calculated based on the heating inlet water temperature and the heating outlet water temperature in the hot water circuit. The third target saturation temperature is calculated based on the refrigerant liquid pipe temperature, the average temperature of the hot water circuit, the fifth simulation coefficient, the sixth simulation coefficient, and the heat pump operating frequency.

5. The heat pump control method according to claim 1, characterized in that, The step of calculating the fourth target saturation temperature corresponding to the low-pressure heating state based on the heat pump condensing temperature, compressor return gas temperature, outer ring temperature, and heat pump operating frequency in the heat pump operating temperature includes: Obtain the seventh and eighth simulation coefficients corresponding to the heating low-pressure state; The target heating refrigerant pipeline temperature is determined based on the heat pump condensing temperature and the compressor return gas temperature. The fourth target saturation temperature is calculated based on the target heating refrigerant pipeline temperature, the outer ring temperature, the seventh simulation coefficient, the eighth simulation coefficient, and the heat pump operating frequency.

6. The heat pump control method according to any one of claims 1-5, characterized in that, The process of adjusting the heat pump operating parameters of the target heat pump based on the target saturation temperature to obtain the heat pump control result includes: If the target heat pump is in heating mode and the third target saturation temperature of the target heat pump is greater than the first temperature threshold, then the compressor speed and fan speed of the target heat pump are reduced according to the heating high pressure adjustment strategy to obtain the first heat pump control result. If the target heat pump is in heating mode and the third target saturation temperature of the target heat pump is lower than the second temperature threshold, then the compressor speed and fan speed of the target heat pump are increased or decreased according to the high-pressure heating strategy to obtain the second heat pump control result.

7. A heat pump control device, characterized in that, The heat pump control device includes: The parameter acquisition module is configured to respond to a heat pump control request for a target heat pump and acquire the heat pump operating temperature and heat pump operating frequency of the target heat pump. The parameter conversion module is configured to determine the target saturation temperature of the target heat pump at the target pressure state based on the heat pump operating temperature and the heat pump operating frequency. The target pressure state includes a cooling high-pressure state, a cooling low-pressure state, a heating high-pressure state, and a heating low-pressure state. The target saturation temperature includes a first target saturation temperature, a second target saturation temperature, and a third target saturation temperature. Determining the target saturation temperature of the target heat pump at the target pressure state based on the heat pump operating temperature and the heat pump operating frequency includes: Obtain the outer ring temperature corresponding to the target heat pump, and calculate the first target saturation temperature corresponding to the refrigeration high-pressure state based on the heat pump condensing temperature, outer ring temperature and heat pump operating frequency in the heat pump operating temperature. And / or, calculate the second target saturation temperature corresponding to the low-pressure state of refrigeration based on the heat pump refrigerant temperature, the refrigeration water circuit temperature and the heat pump operating frequency in the heat pump operating temperature; And / or, calculate the third target saturation temperature corresponding to the heating high-pressure state based on the hot water circuit temperature, the refrigerant liquid pipe temperature and the heat pump operating frequency in the heat pump operating temperature; And / or, calculate the fourth target saturation temperature corresponding to the heating low-pressure state based on the heat pump condensing temperature, compressor return gas temperature in the heat pump operating temperature, the outer ring temperature and the heat pump operating frequency; The heat pump control module is configured to adjust the heat pump operating parameters of the target heat pump based on the target saturation temperature to obtain the heat pump control result.

8. A heat pump control device, characterized in that, The heat pump control device includes: One or more processors; Memory; and One or more applications, wherein the one or more applications are stored in the memory and configured to be executed by the processor to implement the steps of the heat pump control method according to any one of claims 1 to 6.

9. A computer-readable storage medium, characterized in that, It stores a computer program, which is loaded by a processor to execute the steps of the heat pump control method according to any one of claims 1 to 6.

Images