Server, server mainboard, MOS tube and whole cabinet server

Abstract

The embodiment of the invention provides a server, a server mainboard, an MOS tube and a whole cabinet server, the server comprises a power supply module and the server mainboard, the server mainboard comprises a control chip and the MOS tube, and the MOS tube comprises a gate pin, a source pin, a drain pin, an MOS unit, a first metal piece, a second metal piece and a fusing structure; the power supply module is connected with the drain electrode pin and is used for supplying power to the server mainboard; the control chip is connected with a grid pin of the MOS tube and is used for controlling the slow start conduction of the MOS tube; the MOS unit comprises a grid electrode, a source electrode and a drain electrode; the grid electrode pin is connected with the grid electrode of the MOS unit, and the drain electrode pin is connected with the drain electrode of the MOS unit; the first metal piece is connected with the source electrode of the MOS unit, and the second metal piece is connected with the source electrode pin; a fusing structure is connected between the first metal piece and the second metal piece. Based on the server provided by the embodiment of the invention, burnout of the MOS tube and the server mainboard can be prevented.

Description

Technical Field

[0001] The present application relates to the field of computer technology, and in particular to a server, a server motherboard, a MOS tube and a whole cabinet server. Background Art

[0002] When the server motherboard is connected to the power supply, that is, when the server motherboard is powered on, the instantaneous large current generated will impact the power supply, causing the power supply voltage to drop. If the power supply also provides power to other server motherboards, it may affect the normal operation of other server motherboards. At the same time, due to the instantaneous large current, obvious sparking will occur on the server motherboard. By adding a slow start circuit to the server motherboard, the power-on time of the server motherboard is delayed, thereby reducing the current generated when the server is powered on, thereby reducing the impact on the power supply.

[0003] The slow start circuit integrates a metal-oxide-semiconductor field-effect transistor (MOSFET). Currently, the voltage of the server motherboard is controlled to rise slowly by controlling the gate voltage of the MOS tube in the slow start circuit, thereby delaying the power-on time of the server motherboard. According to the working principle of the MOS tube, when the gate voltage of the MOS tube is less than the rated working voltage, the impedance between the source and the drain of the MOS tube is large, which will cause the temperature of the MOS tube to continue to rise. When the abnormality of other devices in the server motherboard causes the temperature of the MOS tube to be too high, it will cause the MOS tube to overheat and burn, thereby causing the MOS tube and the server motherboard to burn. Summary of the invention

[0004] The embodiments of the present application provide a server, a server mainboard, a MOS tube and a whole cabinet server, which can prevent the MOS tube and the server mainboard from being burned.

[0005] In a first aspect, an embodiment of the present application provides a server, the server comprising a power module and a server mainboard, wherein the server mainboard comprises a control chip and a MOS tube, wherein the MOS tube comprises a gate pin, a source pin, a drain pin, a MOS unit, a first metal part, a second metal part and a fuse structure;

[0006] The power module is connected to the drain pin and is used to provide power to the server mainboard;

[0007] The control chip is connected to the gate pin of the MOS tube to control the MOS tube to start slowly and turn on;

[0008] The MOS unit includes a gate, a source and a drain; the gate pin is connected to the gate of the MOS unit, and the drain pin is connected to the drain of the MOS unit;

[0009] The first metal piece is connected to the source of the MOS unit, and the second metal piece is connected to the source pin; a fuse structure is connected between the first metal piece and the second metal piece.

[0010] In the above scheme, since there is a fuse structure between the first metal part and the second metal part of the MOS tube, it can be ensured that the MOS tube can be fused in time when the temperature is too high, so as to achieve the purpose of timely opening of the MOS, thereby preventing the MOS tube from burning out, and further avoiding the burning out of the server motherboard, thereby maintaining the normal operation of the server.

[0011] In a possible implementation, the fuse structure of the MOS tube is an I-shaped structure, one end of the fuse structure is connected to the first metal member, and the other end of the fuse structure is connected to the second metal member.

[0012] In the above solution, selecting a reasonable structural shape can ensure that the MOS tube is blown in time when the temperature reaches a preset value.

[0013] In a possible implementation, the fuse structure is a temperature fuse, one end of the temperature fuse is connected to the first metal part, and the second end of the temperature fuse is connected to the second metal part. The temperature fuse disconnects the conduction path between the first metal part and the second metal part when the temperature reaches a preset value.

[0014] In the above scheme, when the temperature in the MOS tube reaches a preset value, the path between the first metal part and the second metal part can be cut off by melting to avoid burning of the MOS tube, and when the temperature of the MOS tube does not reach the preset value, the fuse structure will not melt, which can ensure the normal operation of the MOS tube and avoid affecting the normal operation of the server.

[0015] In a possible implementation, the preset value is greater than the junction temperature of the MOS tube and less than the temperature when the MOS tube burns out.

[0016] In the above scheme, it is possible to ensure that the fuse structure is blown in time before the MOS tube burns out when the MOS tube operates abnormally, and to ensure that the fuse structure does not blow when the MOS tube operates normally.

[0017] In a possible implementation, the temperature fuse is an alloy fuse.

[0018] In the above scheme, the melting point of the alloy fuse is fixed, so it can be ensured that when the temperature of the MOS tube rises to the melting point of the alloy fuse, it can be blown in time to achieve the purpose of timely opening of the MOS circuit, and when the temperature of the MOS tube does not reach the melting point of the fuse structure, the fuse structure will not be blown, which can ensure the normal operation of the MOS tube and avoid affecting the normal operation of the server.

[0019] In a possible implementation, the fuse structure is a current fuse, one end of the current fuse is connected to the first metal part, and the second end of the current fuse is connected to the second metal part. The current fuse disconnects the conduction path between the first metal part and the second metal part when the current flowing through the fuse reaches a preset value.

[0020] In the above scheme, when the current in the MOS tube reaches a preset value, the path between the first metal part and the second metal part can be cut off by melting to avoid burning of the MOS tube, and when the current of the MOS tube does not reach the preset value, the fuse structure will not melt, which can ensure the normal operation of the MOS tube and avoid affecting the normal operation of the server.

[0021] In a possible implementation, the MOS tube further includes a gate lead;

[0022] A first end of the gate lead is connected to the gate pin, and a second end of the gate lead is connected to the gate of the MOS unit.

[0023] In the above solution, the gate pin is connected to the gate of the MOS unit through the gate lead.

[0024] In a possible implementation, the MOS tube further includes a third metal member;

[0025] The third metal member is connected to the drain of the MOS unit.

[0026] In the above solution, the drain of the MOS unit is covered by the third metal member, thereby achieving the purpose of connecting the third metal member to the drain of the MOS unit.

[0027] In a possible implementation manner, the third metal member and the drain pin are an integrated structure.

[0028] In the above scheme, the purpose of connecting the drain pin to the drain of the MOS unit is achieved.

[0029] In a possible implementation, the drain of the MOS unit is located below the gate and the source.

[0030] In the above solution, it is ensured that the insulation between the drain and the source of the MOS unit is maintained when the MOS tube is not working.

[0031] In a possible implementation, the MOS tube further includes a packaging structure;

[0032] The packaging structure is used for packaging a gate pin, a source pin, a drain pin, a MOS unit, a first metal piece, a second metal piece and a third metal piece.

[0033] In the above solution, the packaging structure provides support and protection for the MOS tube, maintaining the structural stability of the MOS tube.

[0034] In a possible implementation, the packaging structure includes epoxy resin.

[0035] In the above solution, the insulation of the MOS tube to other external devices is guaranteed.

[0036] In a possible implementation, the server further includes a chassis.

[0037] The chassis is provided with a slot, the slot is provided with a first power contact, and the first power contact is connected to the power module;

[0038] The server mainboard is provided with a second power contact corresponding to the first power contact, and when the server mainboard is inserted into the slot, the power module provides power to the server mainboard through the first power contact and the second power contact;

[0039] Under the power supply of the power module, the control chip controls the MOS tube to slowly start and turn on.

[0040] In the above solution, the purpose of the power module supplying power to the server mainboard is achieved by connecting the first power contact point with the second power contact point.

[0041] In a second aspect, an embodiment of the present application provides a server motherboard, the server motherboard comprising: a control chip and a MOS tube, wherein the MOS tube comprises a gate pin, a source pin, a drain pin, a MOS unit, a first metal part, a second metal part and a fuse structure;

[0042] The control chip is connected to the gate pin of the MOS tube to control the MOS tube to start slowly and turn on;

[0043] The MOS unit includes a gate, a source and a drain; the gate pin is connected to the gate of the MOS unit, and the drain pin is connected to the drain of the MOS unit;

[0044] The first metal piece is connected to the source of the MOS unit, and the second metal piece is connected to the source pin; a fuse structure is connected between the first metal piece and the second metal piece.

[0045] In the above scheme, since there is a fuse structure between the first metal part and the second metal part of the MOS tube, it can be ensured that the MOS tube can be fused in time when the temperature of the MOS tube rises to a preset value, so as to achieve the purpose of timely opening the MOS circuit to prevent the MOS tube from burning out, and when the temperature of the MOS tube does not reach the preset value, the fuse structure will not be fused, which can ensure the normal operation of the MOS tube and avoid affecting the normal operation of the server motherboard.

[0046] In a third aspect, an embodiment of the present application provides a MOS tube, the MOS tube comprising a gate pin, a source pin, a drain pin, a MOS unit, a first metal part, a second metal part and a fuse structure;

[0047] The MOS unit includes a gate, a source and a drain; the gate pin is connected to the gate of the MOS unit, and the drain pin is connected to the drain of the MOS unit;

[0048] The first metal piece is connected to the source of the MOS unit, and the second metal piece is connected to the source pin; a fuse structure is connected between the first metal piece and the second metal piece.

[0049] In the above scheme, since there is a fuse structure between the first metal part and the second metal part of the MOS tube, it can be ensured that the MOS tube can be fused in time when the temperature of the MOS tube rises to a preset value, so as to achieve the purpose of timely opening the MOS circuit to prevent the MOS tube from burning out, and when the temperature of the MOS tube does not reach the preset value, the fuse structure will not be fused, which can ensure the normal operation of the MOS tube and avoid affecting the normal operation of the MOS tube.

[0050] In a fourth aspect, an embodiment of the present application provides a whole cabinet server, the whole cabinet server includes a cabinet and a plurality of servers, the plurality of servers are arranged inside the cabinet, each server includes a power module and a server motherboard, the server motherboard includes: a control chip and a MOS tube, wherein the MOS tube includes a gate pin, a source pin, a drain pin, a MOS unit, a first metal part, a second metal part and a fuse structure;

[0051] The control chip is connected to the gate pin of the MOS tube to control the MOS tube to start slowly and turn on;

[0052] The MOS unit includes a gate, a source and a drain; the gate pin is connected to the gate of the MOS unit, and the drain pin is connected to the drain of the MOS unit;

[0053] The first metal piece is connected to the source of the MOS unit, and the second metal piece is connected to the source pin; a fuse structure is connected between the first metal piece and the second metal piece.

[0054] In the above scheme, since there is a fuse structure between the first metal part and the second metal part of the MOS tube, it can be ensured that the MOS tube can be blown in time when the temperature of the MOS tube rises to a preset value, so as to achieve the purpose of timely opening the MOS circuit to prevent the MOS tube from burning out, and when the temperature of the MOS tube does not reach the preset value, the fuse structure will not blow, which can ensure the normal operation of the MOS tube and avoid affecting the normal operation of the entire cabinet server.

[0055] The server, server motherboard, MOS tube and whole cabinet server provided in the embodiments of the present application have a fuse structure arranged between the first metal part and the second metal part of the MOS tube. The fuse structure can be blown in time when the preset temperature is reached, and the MOS is opened in time to avoid being damaged by the sun. When the temperature of the MOS tube does not reach the preset value, the fuse structure will not be blown, thereby ensuring the normal operation of the MOS tube and avoiding affecting the normal operation of the whole cabinet server. BRIEF DESCRIPTION OF THE DRAWINGS

[0056] The accompanying drawings, which are incorporated in and constitute a part of this specification, illustrate embodiments consistent with the present application and, together with the description, serve to explain the principles of the present application.

[0057] Figure 1 A schematic diagram of an application scenario provided for an embodiment of the present application;

[0058] Figure 2 A schematic diagram of the structure of a server as an example;

[0059] Figure 3 A schematic diagram of the structure of a MOS tube is shown as an example;

[0060] Figure 4 A schematic diagram of the structure of another MOS tube as an example;

[0061] Figure 5 A left side view of an exemplary MOS unit;

[0062] Figure 6 A schematic diagram of another MOS tube structure is shown as an example;

[0063] Figure 7 A schematic diagram of the structure of another server as an example;

[0064] Figure 8 The following is a schematic diagram of the structure of an example whole cabinet server.

[0065] The above drawings have shown clear embodiments of the present application, which will be described in more detail later. These drawings and text descriptions are not intended to limit the scope of the present application in any way, but to illustrate the concept of the present application to those skilled in the art by referring to specific embodiments. DETAILED DESCRIPTION

[0066] Exemplary embodiments will be described in detail herein, examples of which are shown in the accompanying drawings. When the following description refers to the drawings, the same numbers in different drawings represent the same or similar elements unless otherwise indicated. The implementations described in the following exemplary embodiments do not represent all implementations consistent with the present application. Instead, they are merely examples of devices and methods consistent with some aspects of the present application as detailed in the appended claims.

[0067] First, the nouns designed in this application are explained:

[0068] Junction temperature: The normal operating temperature of a semiconductor in an electronic device.

[0069] Figure 1 A schematic diagram of an application scenario provided in an embodiment of the present application, such as Figure 1 As shown, the server may include a power module and multiple server mainboards, the slow start circuit is located on the server mainboard, the server mainboard is connected to the power module, and the voltage of the power module can be selected to be 12 V. The current slow start circuit has a MOS tube and a control chip, and the control chip controls the slow rise of the voltage of the MOS tube gate in the slow start circuit, thereby realizing the slow rise of the server mainboard voltage and delaying the power-on time of the server mainboard.

[0070] In other embodiments, the server may be a single-motherboard server, that is, it includes a power module and a server motherboard.

[0071] The embodiment of the present application adds a fuse structure between the source and the drain of the MOS tube. After the temperature of the MOS tube reaches a preset value, the fuse structure can be disconnected to open the MOS tube, thereby timely preventing the MOS tube and the server motherboard from being burned due to the continuous increase in the temperature of the MOS tube.

[0072] The technical solutions of the present application and the technical solutions of the present application are described in detail with specific embodiments below. The following specific embodiments can be combined with each other, and the same or similar concepts or processes may not be repeated in some embodiments. In the description of the present application, unless otherwise clearly specified and limited, each term should be understood in a broad sense in the art. The embodiments of the present application will be described below in conjunction with the accompanying drawings.

[0073] Figure 2 A schematic diagram of a server structure is shown as an example, comprising: a power module and one or more server mainboards, wherein the server mainboard comprises a control chip and a MOS tube, wherein the MOS tube comprises a gate pin, a source pin, a drain pin, a MOS unit, a first metal part, a second metal part and a fuse structure;

[0074] The power module is connected to the drain pin and is used to provide power to the server mainboard;

[0075] The control chip is connected to the gate pin of the MOS tube to control the MOS tube to start slowly and turn on;

[0076] The MOS unit includes a gate, a source and a drain; the gate pin is connected to the gate of the MOS unit, and the drain pin is connected to the drain of the MOS unit;

[0077] The first metal piece is connected to the source of the MOS unit, and the second metal piece is connected to the source pin; a fuse structure is connected between the first metal piece and the second metal piece.

[0078] Combined with scenario examples, such as Figure 2 The drain pin of the MOS tube is connected to the power module on one hand, and can be formed by connecting four metal teeth. The four metal teeth constituting the drain pin are an integrated structure, and the voltage of the power supply can be selected as 12V. One end of the control chip is connected to the power module, and the power module supplies power to the control chip. The other end of the control chip is connected to the gate pin, and the gate pin can be composed of a metal tooth, which is used to control the voltage of the MOS gate to rise slowly, so as to achieve the purpose of slowly rising the voltage of the server motherboard and delaying the power-on time of the server motherboard. The control chip can be selected as a slow-start controller, such as Joulwatt.

[0079] The source pin may be formed by connecting three metal teeth, the three metal teeth constituting the source pin are an integrated structure, a portion of the second metal member covers a portion of the source pin to achieve connection between the second metal member and the source pin, and Figure 2 As shown, the size of the second metal part needs to exceed a portion of the source pin to connect with the fuse structure. The MOS unit of the MOS tube structure can be made into two doped P regions on an N-type substrate (substrate) to obtain the source and drain of the MOS unit, and the gate of the MOS unit is obtained by the insulating layer between the source and the drain, wherein the drain pin is connected to the drain of the MOS unit, and the gate pin is connected to the gate of the MOS unit. The connection between the first metal part and the source of the MOS unit can be a covering connection, and the first metal part can completely cover the source area on the MOS unit, so on the MOS unit, the area covered by the first metal part is the source. Due to the coverage of the first metal part, the first metal part forms a connection with the source. In addition, as Figure 2 As shown, the size of the first metal member needs to exceed a portion of the source of the MOS unit and be connected to the fuse structure. The fuse structure is located between the first metal member and the second metal member, connecting the first metal member and the second metal member to form a path between the first metal member and the second metal member, so as to achieve the connection between the source pin and the source of the MOS unit.

[0080] The voltages of other electronic components in the server motherboard may not correspond to the working voltages. For example, the working voltage of the CPU is 1V, and the working voltage of the memory is 3.3V. However, the voltage provided by the power module to the server motherboard is 12V. Therefore, the 12V power supply can be converted to voltages with different preset voltage values ​​through a transformer on the server motherboard. For example, Figure 2As shown, the source pins are connected to two transformers T1 and T2 respectively, and the two transformers T1 and T2 respectively step down the 12V voltage to 1V and 3.3V, wherein the 1V voltage provides the working voltage for the CPU in the server motherboard, and the 3.3V voltage provides the working voltage for the memory in the server motherboard.

[0081] The control chip controls the voltage of the MOS gate to rise slowly through the connection between the gate pin and the gate of the MOS unit, so as to achieve the purpose of slowly rising the voltage of the server mainboard and delaying the power-on time of the server mainboard. In this process, the temperature of the MOS tube continues to rise. Since there is a fuse structure between the first metal part and the second metal part, a suitable fuse structure is selected according to the actual situation, so that it can be ensured that the MOS tube can be fused in time when the temperature rises to a preset value, so as to achieve the purpose of timely opening the MOS circuit and prevent the MOS tube from burning out. When the temperature of the MOS tube does not reach the preset value, the fuse structure will not be fused, so as to ensure the normal operation of the MOS tube and avoid affecting the normal operation of the server.

[0082] Further, Figure 3 A schematic diagram of the structure of a MOS tube is shown as an example. Figure 3 As shown, the fuse structure of the MOS tube is an I-shaped structure, one end of the fuse structure is connected to the first metal member, and the other end of the fuse structure is connected to the second metal member.

[0083] Combined with the scenario example, the fuse structure can be implemented using a purely physical structure, such as an I-shaped structure. Figure 3 As shown, the upper part of the I-shaped part is connected to the second metal part, and the upper half of the I-shaped part can be overlapped with the second metal part and then welded to achieve connection with the second metal part. Similarly, the lower part of the I-shaped part is connected to the first metal part, and the lower half of the I-shaped part can be overlapped with the first metal part and then welded to achieve connection with the first metal part. The upper and lower parts of the I-shaped part have a large area, which is convenient for connection with the corresponding metal parts to ensure the stability of the connection. The middle part of the I-shaped part is thinner than the two ends, which can ensure that the MOS tube is blown in time when the temperature reaches the preset value. In addition, the shape of the fuse structure can also be selected according to actual conditions, such as X-type or T-type.

[0084] Furthermore, the fuse structure is a temperature fuse, one end of the temperature fuse is connected to the first metal part, and the second end of the temperature fuse is connected to the second metal part. The temperature fuse disconnects the conduction path between the first metal part and the second metal part when the temperature reaches a preset value.

[0085] In combination with the scenario example, the fuse structure can be a temperature fuse, which is also called a thermal fuse. It is a temperature sensing circuit cutting device. The temperature fuse can sense the overheating generated by the abnormal operation of the MOS tube. When the temperature in the MOS tube reaches a preset value, it can melt and cut off the path between the first metal part and the second metal part to avoid burning of the MOS tube. When the temperature of the MOS tube does not reach the preset value, the fuse structure will not melt, which can ensure the normal operation of the MOS tube and avoid affecting the normal operation of the server.

[0086] Furthermore, the preset value is greater than the junction temperature of the MOS tube and less than the temperature when the MOS tube burns out.

[0087] Combined with the scenario example, the preset value can be determined according to the temperature point of the MOS tube junction temperature and the temperature that causes the MOS tube to burn out. If the temperature point of the MOS tube junction temperature is 100°C and the temperature of the MOS tube burning out is 150°C, the preset value can be set between 100°C and 150°C. Based on the preset value range selected in this example, it can be ensured that the fuse structure is blown in time when the MOS tube is not operating normally and before the MOS tube burns out, and it can be ensured that the fuse structure does not blow when the MOS tube is operating normally.

[0088] Furthermore, the temperature fuse is an alloy fuse.

[0089] Combined with the scenario example, the melting point range of the alloy used in the temperature fuse can be determined according to the range of the preset value. For example, if the preset value is set between 100°C and 150°C, a low melting point alloy with a melting point between 100°C and 150°C can be selected as the alloy fuse used in the temperature fuse, such as a low melting point alloy with bismuth and tin as the main components. In this example, the melting point of the alloy fuse is fixed. By selecting a low melting point alloy as the alloy fuse of the temperature fuse, it can be ensured that the MOS tube can be blown in time when the temperature rises to the melting point temperature of the alloy fuse, so as to achieve the purpose of timely opening of the MOS, and when the temperature of the MOS tube does not reach the melting point temperature of the fuse structure, the fuse structure will not blow, which can ensure the normal operation of the MOS tube and avoid affecting the normal operation of the server.

[0090] Furthermore, the fusing structure is a current fuse, one end of the current fuse is connected to the first metal part, and the second end of the current fuse is connected to the second metal part. The current fuse disconnects the conduction path between the first metal part and the second metal part when the current flowing through reaches a preset value.

[0091] In combination with the scenario example, the fuse structure can be selected as a current fuse, which can be blown when the current rises to a preset blow current value, thereby cutting off the path between the first metal part and the second metal part to avoid burning of the MOS tube. The blow current value of the current fuse can be determined according to the rated working current of the MOS tube and the current that causes the burning of the MOS tube. For example, if the rated working current of the MOS tube is 100A and the current that causes the burning of the MOS tube is 300A, the blow current value of the current fuse can be preset to 150A, so when the current flowing through the current fuse reaches 150A, the current fuse blows.

[0092] Further, Figure 4 A schematic diagram of the structure of another MOS tube is shown as an example. Figure 4 As shown, the MOS tube also includes a gate lead;

[0093] A first end of the gate lead is connected to the gate pin, and a second end of the gate lead is connected to the gate of the MOS unit.

[0094] In combination with the scenario example, the gate pin can be connected to the gate of the MOS unit through a gate lead. The gate lead is usually made of metal material and can provide good conductivity and stability.

[0095] Furthermore, the MOS tube also includes a third metal member;

[0096] The third metal member is connected to the drain of the MOS unit.

[0097] In combination with the scenario example, the third metal member covers the drain of the MOS unit, and the third metal member achieves connection with the drain by covering the drain of the MOS unit.

[0098] Furthermore, the third metal member and the drain pin are an integrated structure.

[0099] In combination with the scenario example, the third metal part is connected to the drain of the MOS unit by covering the drain of the MOS unit. If the drain pin and the third metal part are an integrated structure, the connection between the drain pin and the drain of the MOS unit can be achieved at the same time.

[0100] Optionally, the drain of the MOS unit is located below the gate and the source.

[0101] Combined with the scene example, Figure 5 The left side view of the MOS unit is shown as Figure 5 As shown, the MOS unit is composed of a gate, a source and a drain, wherein the gate and the source are located at the upper part of the MOS unit, and the drain is located at the lower part of the MOS unit. Figure 4 It can be seen that in the upper part of the MOS unit, the area covered by the first metal member is the source of the MOS unit, and the rest is the gate. Figure 5 In the case of a grid-shaped electrode, the gate pin and the source pin overlap due to the obstruction of the viewing angle. Figure 5 The gate pin is not marked. The drain of the MOS unit is the lower part of the entire MOS unit, so the third metal piece covers the lower surface of the entire MOS unit, and the third metal piece and the drain pin can be an integrated structure. The drain of the MOS unit is designed below the MOS unit to maintain the insulation between the drain and source of the MOS unit when the MOS tube is not working.

[0102] Further, Figure 6 Another MOS tube structure diagram is shown as an example. Figure 6 As shown, the MOS tube also includes a packaging structure;

[0103] The packaging structure is used for packaging a gate pin, a source pin, a drain pin, a MOS unit, a first metal piece, a second metal piece and a third metal piece.

[0104] Combined with the scenario example, based on the packaging structure being the shell of a MOS tube, the gate pin, source pin, drain pin, MOS unit, first metal part, second metal part and third metal part are all packaged inside the packaging structure, wherein only a part of the source pin, gate pin and drain pin is packaged, and the other part of the source pin, gate pin and drain pin is retained outside the packaging structure so that the source pin, gate pin and drain pin can be connected to other components. The packaging structure provides support and protection for the MOS tube and maintains the structural stability of the MOS tube.

[0105] Further, the packaging structure includes epoxy resin.

[0106] Combined with the scenario example, epoxy resin has the advantages of small shrinkage, good heat resistance, excellent sealing and electrical insulation, so the material selection of the packaging structure can be epoxy resin to ensure the insulation of the MOS tube to other external devices.

[0107] Further, Figure 7 A schematic diagram of the structure of another server is shown as an example. Figure 7 As shown, the server further includes a chassis, the chassis is provided with a slot, the slot is provided with a first power contact, and the first power contact is connected to the power module;

[0108] The server mainboard is provided with a second power contact corresponding to the first power contact, and when the server mainboard is inserted into the slot, the power module provides power to the server mainboard through the first power contact and the second power contact;

[0109] Under the power supply of the power module, the control chip controls the MOS tube to start slowly and turn on. Combined with the scenario example, at least one card slot is set on the chassis, and the card slot is used to place the server motherboard. There is a one-to-one correspondence between the card slot and the server motherboard, so there can be multiple server motherboards on the chassis at the same time and placed in different card slots. The power module of the server is used to provide the working voltage of the server motherboard. The power module can be connected to the first power contact point on the card slot. When the server motherboard is placed in the card slot, the first power contact point and the second power contact point are connected to achieve the purpose of the power module supplying power to the server motherboard. After the control chip is powered by the server mainboard when inserted into the card slot, the voltage of the MOS gate is controlled to rise slowly, so as to achieve the purpose of slowly rising the voltage of the server mainboard and delaying the power-on time of the server mainboard. In this process, the temperature of the MOS tube continues to rise. Since there is a fuse structure between the first metal part and the second metal part, a suitable fuse structure is selected according to the actual situation, so as to ensure that the MOS tube can be fused in time when the temperature rises to a preset value, so as to achieve the purpose of timely opening the MOS circuit, so as to prevent the server mainboard from burning out. When the temperature of the MOS tube does not reach the preset value, the fuse structure will not be fused, so as to ensure the normal operation of the MOS tube and avoid affecting the normal operation of the server mainboard and the server.

[0110] Based on the above embodiments, an embodiment of the present application provides a whole cabinet server. Figure 8 The schematic diagram of the structure of the whole cabinet server is shown as an example. Figure 8 As shown, the whole cabinet server includes a cabinet and multiple servers, the multiple servers are arranged inside the cabinet, and each server includes a power module and a server motherboard in any of the above embodiments. The technical effect of each server in the whole cabinet server can refer to the embodiments corresponding to the above servers, and will not be repeated here.

[0111] After considering the invention disclosed in the specification and practice, those skilled in the art will easily think of other embodiments of the present application. The embodiments of the present application are intended to cover any variation, use or adaptive change of the embodiments of the present application, which follows the general principles of the embodiments of the present application and includes common knowledge or conventional technical means in the technical field that are not disclosed in the embodiments of the present application.

Claims

1. A server, characterized in that: The server comprises a power module and a server mainboard, wherein the server mainboard comprises a control chip and a MOS tube, wherein the MOS tube comprises a gate pin, a source pin, a drain pin, a MOS unit, a first metal part, a second metal part and a fuse structure; The power module is connected to the drain pin and is used to provide power to the server mainboard; The control chip is connected to the gate pin of the MOS tube and is used to control the MOS tube to start slowly and turn on; The MOS unit includes a gate, a source and a drain; the gate pin is connected to the gate of the MOS unit, and the drain pin is connected to the drain of the MOS unit; The first metal piece is connected to the source of the MOS unit, and the second metal piece is connected to the source pin; a fuse structure is connected between the first metal piece and the second metal piece.

2. The server according to claim 1, characterized in that: The fuse structure of the MOS tube is an I-shaped structure, one end of the fuse structure is connected to the first metal member, and the other end of the fuse structure is connected to the second metal member.

3. The server according to claim 2, characterized in that: The fuse structure is a temperature fuse, one end of the temperature fuse is connected to the first metal part, and the second end of the temperature fuse is connected to the second metal part. The temperature fuse disconnects the conduction path between the first metal part and the second metal part when the temperature reaches a preset value.

4. The server according to claim 3, characterized in that: The preset value is greater than the junction temperature of the MOS tube and less than the temperature when the MOS tube burns out.

5. The server according to claim 2, characterized in that: The fuse structure is a current fuse, one end of the current fuse is connected to the first metal part, and the second end of the current fuse is connected to the second metal part. The current fuse disconnects the conduction path between the first metal part and the second metal part when the current flowing through the fuse reaches a preset value.

6. The server according to any one of claims 1 to 5, characterized in that: The MOS tube also includes a third metal piece; The third metal member is connected to the drain of the MOS unit.

7. The server according to claim 6, characterized in that: The server also includes a chassis, The chassis is provided with a slot, the slot is provided with a first power contact, and the first power contact is connected to the power module; The server mainboard is provided with a second power contact corresponding to the first power contact, and when the server mainboard is inserted into the slot, the power module provides power to the server mainboard through the first power contact and the second power contact; Under the power supply of the power module, the control chip controls the MOS tube to start slowly and turn on.

8. A server motherboard, characterized in that: The server motherboard includes: a control chip and a MOS tube, wherein the MOS tube includes a gate pin, a source pin, a drain pin, a MOS unit, a first metal part, a second metal part and a fuse structure; The control chip is connected to the gate pin of the MOS tube and is used to control the MOS tube to start slowly and turn on; The MOS unit includes a gate, a source and a drain; the gate pin is connected to the gate of the MOS unit, and the drain pin is connected to the drain of the MOS unit; The first metal piece is connected to the source of the MOS unit, and the second metal piece is connected to the source pin; a fuse structure is connected between the first metal piece and the second metal piece.

9. A MOS tube, characterized in that: The MOS tube includes a gate pin, a source pin, a drain pin, a MOS unit, a first metal part, a second metal part and a fuse structure; The MOS unit includes a gate, a source and a drain; the gate pin is connected to the gate of the MOS unit, and the drain pin is connected to the drain of the MOS unit; The first metal piece is connected to the source of the MOS unit, and the second metal piece is connected to the source pin; a fuse structure is connected between the first metal piece and the second metal piece.

10. A whole cabinet server, characterized in that: The whole cabinet server includes a cabinet and a plurality of servers, wherein the plurality of servers are arranged inside the cabinet, each server includes a power module and a server motherboard, and the server motherboard includes: a control chip and a MOS tube, wherein the MOS tube includes a gate pin, a source pin, a drain pin, a MOS unit, a first metal part, a second metal part and a fuse structure; The control chip is connected to the gate pin of the MOS tube and is used to control the MOS tube to start slowly and turn on; The MOS unit includes a gate, a source and a drain; the gate pin is connected to the gate of the MOS unit, and the drain pin is connected to the drain of the MOS unit; The first metal piece is connected to the source of the MOS unit, and the second metal piece is connected to the source pin; a fuse structure is connected between the first metal piece and the second metal piece.

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