Apparatus for processing substrate

Abstract

The present application discloses an apparatus for processing a substrate, the apparatus comprising: a housing having an internal space; a plurality of outer cups arranged in a row in the inner space, each outer cup having a processing space; a rotary chuck for supporting and rotating the substrate in each of the processing spaces; and processing liquid nozzles provided in a plurality to respectively correspond to the plurality of outer cups and for supplying a processing liquid onto a substrate supported by the rotary chuck, in which the outer cups include a side wall surrounding the rotary chuck, the side wall including a first region and a second region positioned adjacent to each other in a circumferential direction of the side wall, and the outer cup includes a first protrusion mounted in the first region, the first protrusion extending upward at a top end of the sidewall.

Description

[0001] CROSS-REFERENCE TO RELATED APPLICATIONS

[0002] This application claims priority to and the benefit of Korean Patent Application No. 10-2023-0079407 filed in the Korean Intellectual Property Office on June 21, 2023, the entire contents of which are incorporated herein by reference. Technical Field

[0003] The present invention relates to an apparatus for processing a substrate, and more particularly to a substrate processing apparatus for performing liquid processing on a substrate by supplying a processing liquid to the substrate. Background Art

[0004] In order to manufacture semiconductor devices or flat panel display panels, various processes such as deposition, photography, etching and cleaning are performed. Among these processes, the photography process includes a coating process (application process) of applying a photosensitive liquid (such as photoresist) to the surface of a substrate to form a film, an exposure process of transferring a circuit pattern to the film formed on the substrate, and a development process of selectively removing the film formed on the substrate from an exposed region or an opposite region of the exposed region. In addition, a heat treatment process is performed before and after the coating process, the exposure process and the development process.

[0005] In the development process, when a treatment liquid (such as a developer) is discharged onto a substrate, a film formed on the substrate is removed and discharged together with the treatment liquid. In a development chamber, a plurality of cups may be provided to process a substrate, and as the number of cups provided in a single chamber increases, the intervals between the cups decrease. When the treatment liquid that needs to be discharged through an outlet provided for each cup spreads into another cup, particles contained in the treatment liquid may contaminate a substrate being processed in another cup, resulting in process failure. Summary of the invention

[0006] In order to solve the above problems, the present invention provides a substrate processing apparatus capable of improving substrate processing efficiency.

[0007] In order to solve the above problems, the present invention provides a substrate processing apparatus capable of minimizing contamination of a substrate to minimize process failures.

[0008] Furthermore, in order to solve the above-mentioned problem, the present invention provides a substrate processing apparatus for preventing a processing liquid from being spread to another outer cup.

[0009] The objects of the present invention are not limited thereto, and other objects not mentioned will be clearly understood from the following description by those of ordinary skill in the art.

[0010] An exemplary embodiment of the present invention provides an apparatus for processing a substrate, the apparatus comprising: a shell having an internal space; a plurality of external cups arranged in a row in the internal space, each of the external cups having a processing space; a rotating chuck for supporting and rotating the substrate in each processing space; and a processing liquid nozzle, the processing liquid nozzle being arranged in plurality to correspond to the plurality of external cups, respectively, and for supplying processing liquid to the substrate supported by the rotating chuck, wherein the external cup comprises a side wall surrounding the rotating chuck, the side wall comprising a first region and a second region positioned adjacent to each other in a circumferential direction of the side wall, and the external cup comprises a first protrusion installed in the first region, the first protrusion extending upward above a top end of the side wall.

[0011] According to an exemplary embodiment, the first region may be a region facing another adjacent outer cup.

[0012] According to an exemplary embodiment, the sidewall may further include a third region and a fourth region, and the third region may face the first region, the fourth region may face the second region, and the third region may be configured to have a second protrusion extending upward from a top end of the sidewall.

[0013] According to an exemplary embodiment, the first protrusion and the second protrusion may be provided in an arc shape.

[0014] According to an exemplary embodiment, the apparatus may further include a nozzle arm for supporting the treatment liquid nozzle, wherein the nozzle arm may be configured to enter a space surrounded by the first protrusion, the second area, and the second protrusion, and be movable to the top of the rotating chuck.

[0015] According to an exemplary embodiment, the apparatus may further include a transfer robot for transferring the substrate to the spin chuck, wherein the transfer robot may be configured to enter a space surrounded by the first protrusion, the fourth region, and the second protrusion to transfer the substrate to the spin chuck.

[0016] According to an exemplary embodiment, the first protrusion and the second protrusion may each have the same height extending upward from a top end of the side wall.

[0017] According to an exemplary embodiment, the first protrusion and the second protrusion may be provided to be detachably.

[0018] According to an exemplary embodiment, a width of the second region in the circumferential direction may be set to be wider than a width of the first region in the circumferential direction and a width of the third region in the circumferential direction.

[0019] According to an exemplary embodiment, the outer cup may further include a top wall which may be arranged to be inclined upward from a top end of the side wall toward a central axis of the outer cup, and respective top ends of the first protrusion and the second protrusion may be arranged to be positioned higher than a top end of the top wall.

[0020] Another exemplary embodiment of the present invention provides an apparatus for processing a substrate, the apparatus comprising: a shell having an internal space; an external cup disposed in the internal space and having a processing space; a rotating chuck for supporting and rotating the substrate in the processing space; a processing liquid nozzle for supplying a processing liquid to the substrate supported by the rotating chuck; and a nozzle arm for supporting the processing liquid nozzle, wherein the external cup comprises a side wall surrounding the rotating chuck, the external cup being provided with a protrusion extending upward from a top end of the side wall, and the protrusion being provided only in a portion of the side wall.

[0021] According to an exemplary embodiment, the side wall may include a first region and a second region located adjacent to each other in a circumferential direction of the side wall, and the first region may be provided with a protrusion.

[0022] According to an exemplary embodiment, the side wall may further include a third region and a fourth region, and the third region may face the first region, and the fourth region may face the second region, and the protrusion may further be provided in the third region.

[0023] According to an exemplary embodiment, the protrusion may be provided in an arc shape.

[0024] According to an exemplary embodiment, one of the spaces between the protrusions may be provided as a space into which the nozzle arm enters.

[0025] According to an exemplary embodiment, the apparatus may further include a transfer robot for transferring the substrate to the spin chuck, wherein one of the spaces between the protrusions may be set as a space into which the transfer robot enters.

[0026] According to an exemplary embodiment, the outer cup may further include a top wall which may be arranged to be inclined upward from a top end of the side wall toward a central axis of the outer cup, and a top end of the protrusion may be arranged to be positioned higher than a top end of the top wall.

[0027] Another exemplary embodiment of the present invention provides an apparatus for processing a substrate, the apparatus comprising: a shell having an internal space; and a first external cup and a second external cup, the first external cup and the second external cup being arranged in the internal space, the first external cup and the second external cup each having a processing space, wherein the first external cup and the second external cup are arranged in a row along one direction in the internal space, the first external cup and the second external cup each comprising: a rotating chuck, the rotating chuck being used to support and rotate the substrate within the processing space; a processing liquid nozzle, the processing liquid nozzle being used to supply processing liquid to the substrate supported by the rotating chuck; a nozzle arm, the nozzle arm being used to support the processing liquid nozzle; a side wall, the side wall surrounding the rotating chuck, and the first external cup comprising a first region, a second region, a third region and a fourth region in the side wall, the first region being provided with a first protrusion extending upward from the top end of the side wall, the first protrusion being provided in an arc shape, and the first region being a region facing the second external cup.

[0028] According to an exemplary embodiment, the third region may face the first region, and the fourth region may face the second region, and the third region may be provided with a second protrusion extending upward from a top end of the sidewall, and the second protrusion may be provided in an arc shape.

[0029] According to an exemplary embodiment, the device may further include a transfer robot for transferring the substrate to the spin chuck, wherein one space between the first protrusion and the second protrusion can be set as a space for the nozzle arm to enter, and another space between the first protrusion and the second protrusion can be set as a space for the transfer robot to enter.

[0030] According to the exemplary embodiments of the present invention, contamination of the substrate by the spread processing liquid can be minimized.

[0031] According to the exemplary embodiments of the present invention, process defects caused by substrate contamination can be minimized.

[0032] According to the exemplary embodiments of the present invention, substrate processing efficiency can be improved.

[0033] The effects of the present invention are not limited to the above-mentioned effects, and unmentioned effects will be clearly understood from the specification and the accompanying drawings by those skilled in the art. BRIEF DESCRIPTION OF THE DRAWINGS

[0034] By reviewing the detailed description in conjunction with the accompanying drawings, various features and advantages of the non-limiting exemplary embodiments of the present specification may become apparent. The accompanying drawings are for illustrative purposes only and should not be construed as limiting the scope of the claims. Unless explicitly stated, the drawings are not considered to be drawn to scale. For clarity, the various dimensions in the drawings may be exaggerated.

[0035] Figure 1 is a perspective view schematically showing a substrate processing apparatus according to an exemplary embodiment of the present invention.

[0036] Figure 2 for Figure 1 Front view of a substrate processing apparatus.

[0037] Figure 3 for Figure 1 A top plan view of an applying block in a substrate processing apparatus.

[0038] Figure 4 for Figure 1 A top plan view of a developing block in a substrate processing device.

[0039] Figure 5 To schematically illustrate Figure 3 Top view of the transfer robot.

[0040] Figure 6 For schematic illustration Figure 3 or Figure 4 A top plan view of an example of a thermal processing chamber.

[0041] Figure 7 for Figure 6 Front view of the heat treatment chamber.

[0042] Figure 8 for Figure 3 or Figure 4 A top view of an exemplary embodiment of a liquid processing chamber.

[0043] Fig. 9 To schematically show Figure 8 Cross-sectional views of some configurations.

[0044] Fig.10 To show the Fig. 9 Figure 4. The outer cup of the .

[0045] Figures 11 to 14 FIG. 1 is a diagram showing a liquid processing chamber according to another exemplary embodiment of the present invention. DETAILED DESCRIPTION

[0046] Example embodiments will now be described more fully with reference to the accompanying drawings. Example embodiments are provided so that the disclosure is thorough and the scope is fully conveyed to those skilled in the art. Many specific details (such as examples of specific components, equipment, and methods) are set forth to provide a thorough understanding of the embodiments of the present disclosure. It will be apparent to those skilled in the art that specific details need not be adopted, that example embodiments can be embodied in many different forms, and that example embodiments should not be construed as limiting the scope of the present disclosure. In some example embodiments, known processes, known equipment structures, and known technologies are not described in detail.

[0047] The terms used herein are only for the purpose of describing specific example embodiments and are not intended to be restrictive. As used herein, unless the context clearly indicates otherwise, the singular forms "a", "an" and "the" may be intended to also include plural forms. The terms "comprises", "comprising", "including" and "having" are inclusive and therefore specifically refer to the presence of the features, integers, steps, operations, elements and / or components, but do not exclude the presence or increase of one or more other features, integers, steps, operations, elements, components and / or combinations thereof. Unless explicitly identified as an execution order, the method steps, processes and operations described herein should not be interpreted as having to be performed in the specific order discussed or illustrated. It should also be understood that additional or alternative steps may be adopted.

[0048] When an element or layer is referred to as being "on another element or layer," "engaged to another element or layer," "connected to another element or layer," or "coupled to another element or layer," the element or layer may be directly on, engaged to, connected to, or coupled to the other element or layer, or there may be intermediate elements or layers. In contrast, when an element is referred to as being "directly on another element or layer," "directly engaged to another element or layer," "directly connected to another element or layer," or "directly coupled to another element or layer," there may be no intermediate elements or layers. Other words used to describe the relationship between elements should be interpreted in a similar manner (e.g., "between" versus "directly between," "adjacent" versus "directly adjacent," etc.). As used herein, the term "and / or" includes any and all combinations of one or more of the relevant listed items.

[0049] Although the term first, second, third etc. can be used to describe different elements, components, regions, layers and / or parts in this article, these elements, components, regions, layers and / or parts should not be limited by these terms.These terms can only be used to distinguish an element, component, region, layer and / or part from another region, layer or part.When used in this article, unless the context clearly indicates, otherwise the terms such as "first", "second" and other numerical items do not imply order or sequence.Therefore, without departing from the teaching of the example embodiment, the first element, the first component, the first area, the first layer or the first part discussed below can be referred to as the second element, the second component, the second area, the second layer or the second part.

[0050] For ease of description, spatially relative terms such as "inside," "outside," "below," "below," "below," "above," and "above" may be used herein to describe the relationship of one element or feature to another element or elements or another feature or features, as shown in the figures. Spatially relative terms may be intended to cover different orientations of the device in use or operation in addition to the orientations described in the drawings. For example, if the device in the figure is turned over, an element described as being "below" or "below" other elements or features will subsequently be oriented to be "above" the other elements or features. Thus, the example term "below" is able to cover both above and below orientations. The device may be oriented in other ways (rotated 90 degrees or oriented in other orientations), and the spatially relative descriptors used herein are interpreted accordingly.

[0051] When the terms "same" or "identical" are used in the description of example embodiments, it should be understood that some imprecision may exist. Thus, when an element or value is referred to as being the same as another element or value, it should be understood that the element or value is the same as the other element or value within a manufacturing or operating tolerance range (e.g., ±10%).

[0052] When the term "approximately" or "substantially" is used with a numerical value, it should be understood that the associated numerical value includes a manufacturing or operating tolerance (e.g., ±10%) around the numerical value. In addition, when the words "generally" and "substantially" are used in connection with geometric shapes, it should be understood that the precision of the geometric shape is not required, but the latitude of the shape is within the scope of the present disclosure.

[0053] Unless otherwise defined, all terms (including technical and scientific terms) used herein have the same meaning as commonly understood by one of ordinary skill in the art to which the example embodiments belong. It should also be understood that terms (including those defined in commonly used dictionaries) should be interpreted as having a meaning consistent with their meaning in the context of the relevant art, and will not be interpreted in an idealized or overly formal sense unless explicitly defined herein.

[0054] In the present exemplary embodiment, a wafer will be described as an example of an object to be processed. However, in addition to the wafer, the technical spirit of the present invention can also be applied to equipment for processing other types of substrates.

[0055] Hereinafter, exemplary embodiments of the present invention will be described with reference to the accompanying drawings.

[0056] Figure 1 is a perspective view schematically showing a substrate processing apparatus according to an exemplary embodiment of the present invention, and Figure 2 for Figure 1 Front view of a substrate processing apparatus. Figure 3 for Figure 1 A top plan view of a coating block in a substrate processing apparatus, and Figure 4 for Figure 1 A top plan view of a developing module in a substrate processing device.

[0057] See also Figures 1 to 4 , the substrate processing device 10 includes an index module 100, a processing module 300, and an interface module 500. According to an exemplary embodiment, the index module 100, the processing module 300, and the interface module 500 are sequentially arranged in a row. Hereinafter, a direction in which the index module 100, the processing module 300, and the interface module 500 are arranged is defined as a first direction 12, a direction perpendicular to the first direction 12 when viewed from above is defined as a second direction 14, and a direction perpendicular to both the first direction 12 and the second direction 14 is defined as a third direction 16.

[0058] The index module 100 is provided for transferring the substrate W between the container F containing the substrate W therein and the process module 300. The longitudinal direction of the index module 100 is arranged along the second direction 14. The index module 100 includes a loading port 110 and an index frame 130. The container F containing the substrate W therein is placed on the loading port 110. The loading port 110 is positioned on the opposite side of the process module 300 with respect to the index frame 130. A plurality of loading ports 110 may be provided, and the plurality of loading ports 110 may be arranged along the second direction 14.

[0059] In the example, an airtight container F such as a front open unified pod (FOUP) may be used as the container F. The container F may be placed on the load port 110 by a transfer device (not shown) such as an overhead transfer, an overhead conveyor belt, or an automated guided vehicle, or by an operator.

[0060] The index robot 132 is disposed inside the index frame 130. A guide rail 136 is disposed inside the index frame 130. The longitudinal direction of the guide rail 136 is disposed along the second direction 14. The index robot 132 is mounted on the guide rail 136 so as to be movable along the guide rail 136. The index robot 132 includes a hand 132a on which the substrate W is placed. The hand 132a can be configured to be movable forward and backward, linearly movable along the third direction, and rotationally movable around the axis of the third direction 16.

[0061] The process module 300 performs a coating process and a developing process on the substrate W. The process module 300 includes a coating block 300a and a developing block 300b.

[0062] The coating block 300a performs a coating process on the substrate W before the exposure process. The developing block 300b performs a developing process on the substrate W after the exposure process. A plurality of coating blocks 300a are provided. A plurality of coating blocks 300a may be provided in a state where they are stacked on top of each other. A plurality of developing blocks 300b are provided. A plurality of developing blocks 300b may be provided to be stacked on top of each other. In one example, two coating blocks 300a are provided, and two developing blocks 300b are provided. A plurality of coating blocks 300a may be located below the developing blocks 300b.

[0063] In one example, a plurality of coating blocks 300a can be arranged to have the same structure as each other. The film applied to the substrate W in each of the plurality of coating blocks 300a can be a film of the same type. Alternatively, the film applied to the substrate W by each coating block 300a can be a film of different types. The film applied to the substrate W includes a photoresist film. The film applied to the substrate W can also include an anti-reflection film. Alternatively, the film applied to the substrate W can also include a protective film.

[0064] In addition, the two developing blocks 300b may be provided to have the same structure as each other. The developer supplied to the substrate W in the plurality of developing blocks 300b may be the same type of liquid. Alternatively, the developer supplied to the substrate W may be a different type of developer according to the developing block 300b.

[0065] See also Figure 3The coating block 300 a includes a buffer unit 310 , a cooling unit 320 , a hydrophobizing chamber 340 , a transfer chamber 350 , a heat treatment chamber 360 , and a liquid treatment chamber 1000 .

[0066] The buffer unit 310, the cooling unit 320, and the hydrophobizing chamber 340 are disposed adjacent to the index module 100. The hydrophobizing chamber 340 and the buffer unit 310 may be sequentially disposed along the second direction 14. In addition, the cooling unit 320 and the buffer unit 310 may be disposed to be stacked on top of each other in a vertical direction.

[0067] The buffer unit 310 includes one or more buffer zones 312. When multiple buffer zones 312 are provided, the multiple buffer zones 312 may be arranged to be stacked on top of each other. When the substrate W is transferred between the index module 100 and the processing module 300, the buffer zone 312 provides a space for the substrate W to stay. The hydrophobic chamber 340 provides a hydrophobic treatment to the surface of the substrate W. The hydrophobic treatment may be performed before the coating process is performed on the substrate W. The hydrophobic treatment may be completed by supplying a hydrophobic gas to the substrate W while heating the substrate W. The cooling unit 320 cools the substrate W. The cooling unit 320 includes one or more cooling plates. When multiple cooling plates are provided, the multiple cooling plates may be arranged to be stacked on top of each other. In one example, the cooling unit 320 may be provided below the buffer unit 310. The cooling plate may have a flow path through which a coolant flows. The substrate W after the hydrophobic treatment may be cooled on the cooling plate.

[0068] The transfer mechanism 330 is disposed between the hydrophobizing chamber 340 and the buffer unit 310 and between the hydrophobizing chamber 340 and the cooling unit 320. The transfer mechanism 330 is provided to transfer the substrate W between the buffer unit 310, the hydrophobizing chamber 340, and the cooling unit 320.

[0069] The conveying mechanism 330 includes a hand 332 on which the substrate W is placed, and the hand 332 can be arranged to be movable forwardly and backwardly, rotatable around the third direction 16, and movable along the third direction 16. In one example, the conveying mechanism 330 moves in the third direction 16 along a guide rail 334. The guide rail 334 extends from the coating block located at the lowest point of the coating block 300a to the developing block located at the highest point of the developing block 300b. This allows the conveying mechanism 330 to convey the substrate W between the coating block 300a and the developing block 300b arranged on different layers. For example, the conveying mechanism 330 can convey the substrate W between the coating block 300a and the developing block 300b arranged on different layers. The conveying mechanism 330 can also convey the substrate W between the coating block 300a and the developing block 300b.

[0070] In addition, another conveying unit 331 may be further provided on the opposite side of the hydrophobizing chamber 340 relative to the side where the buffer unit 310 is provided. The another conveying unit 331 may be provided to convey the substrate W between the buffer unit 310 and the cooling unit 320 provided in the same blocks 300a and 300b. Further, the another conveying unit 331 may be provided to convey the substrate W between the buffer unit 310 and the cooling unit 320 provided in different blocks 300a and 300b.

[0071] The transfer chamber 350 is disposed such that its longitudinal direction is parallel to the first direction 12. One end of the transfer chamber 350 may be located adjacent to the buffer unit 310 and / or the cooling unit 320. The other end of the transfer chamber 350 may be located adjacent to the interface module 500.

[0072] A plurality of heat treatment chambers 360 are provided. Some of the heat treatment chambers 360 are arranged along the first direction 12. In addition, some of the heat treatment chambers 360 may be stacked along the third direction 16. The heat treatment chambers 360 may all be located on one side of the transfer chamber 350.

[0073] The liquid processing chamber 1000 performs a liquid film forming process to form a liquid film on the substrate W. In one example, the liquid film forming process includes a resist film forming process. The liquid film forming process may include an anti-reflective film forming process. Optionally, the liquid film forming process may also include a protective film forming process. A plurality of liquid processing chambers 1000 are provided. The liquid processing chamber 1000 may be located on opposite sides of the thermal treatment chamber 360. For example, all liquid processing chambers 1000 may be located on the other side of the transfer chamber 350. The liquid processing chambers 1000 are arranged side-by-side along a first direction 12. Optionally, some liquid processing chambers 1000 may be stacked along a third direction 16.

[0074] In one example, the liquid processing chamber 1000 includes a front-end liquid processing chamber 1002 and a back-end liquid processing chamber 1004. The front-end liquid processing chamber 1002 is disposed relatively close to the index module 100, and the back-end liquid processing chamber 1004 is disposed closer to the interface module 500.

[0075] The front-end liquid processing chamber 1002 applies the first liquid to the substrate W, and the rear-end liquid processing chamber 1004 applies the second liquid to the substrate W. The first liquid and the second liquid can be different types of liquids. In one example, the first liquid can be a liquid for forming an anti-reflective film, and the second liquid can be a liquid for forming a photoresist film. The photoresist film can be formed on a substrate W coated with an anti-reflective film. Alternatively, the first liquid can be a liquid for forming a photoresist film, and the second liquid can be a liquid for forming an anti-reflective film. In this case, the anti-reflective film can be formed on a substrate on which a photoresist film is formed. Alternatively, the first liquid and the second liquid can be the same type of liquid, and both can be liquids for forming a photoresist film.

[0076] See also Figure 4 , the developing block 300b includes a buffer unit 310, a cooling unit 320, a transfer chamber 350, a heat treatment chamber 360, and a liquid treatment chamber 1000. The arrangement of the buffer unit 310, the cooling unit 320, the transfer chamber 350, the heat treatment chamber 360, and the liquid treatment chamber 1000 in the developing block 300b may be the same as the arrangement of the buffer unit 310, the cooling unit 320, the transfer chamber 350, the heat treatment chamber 360, and the liquid treatment chamber 1000 in the coating block 300a. When viewed from above, the buffer unit 310, the cooling unit 320, the transfer chamber 350, the heat treatment chamber 360, and the liquid treatment chamber 1000 in the developing block 300b and the buffer unit 310, the cooling unit 320, the transfer chamber 350, the heat treatment chamber 360, and the liquid treatment chamber 1000 in the coating block 300a may be disposed in an overlapping position.

[0077] The heat treatment chamber 360 performs a heating process on the substrate W. The heating process includes a post-exposure bake process performed on the substrate W after completing an exposure process, and a hard bake process performed on the substrate W after completing a development process.

[0078] The liquid processing chamber performs a developing process by supplying a developer onto the substrate W and developing the substrate W.

[0079] exist Figure 3 or Figure 4In the embodiment, the transfer chamber 350 is provided with a transfer robot 351. The transfer robot 351 transfers the substrate W between the buffer unit 310, the cooling unit 320, the heat treatment chamber 360, the liquid treatment chamber 1000, and the buffer unit 510 or the cooling unit 520 of the interface module 500. In one example, the transfer robot 351 includes a hand 352 on which the substrate W is placed. The hand 352 can be configured to be movable forward and backward, rotatable around the third direction 16, and movable along the third direction 16. A guide rail 356 whose longitudinal direction is parallel to the first direction 12 is provided in the transfer chamber 350, and the transfer robot 351 can be configured to be movable on the guide rail 356.

[0080] Figure 5 FIG. 1 is a diagram showing an example of a hand of a transfer robot. Figure 5 , the hand 352 includes a base 352a and a support protrusion 352b. The base 352a may have an annular ring shape in which a portion of the circumference is curved. The inner diameter of the base 352a is greater than the diameter of the substrate W. The support protrusion 352b extends inward from the base 352a. A plurality of support protrusions 352b are provided, and the plurality of support protrusions support the edge region of the substrate W. In one example, the support protrusions 352b may be provided in a manner of four equidistant arrangements.

[0081] Figure 6 For schematic illustration Figure 3 or Figure 4 A top plan view of an example of a thermal processing chamber, and Figure 7 for Figure 6 Front view of the heat treatment chamber.

[0082] See also Figure 6 and Figure 7 The heat treatment chamber 360 includes a shell 361 , a heating unit 363 and a transfer plate 364 .

[0083] The housing 361 is configured to be substantially in the shape of a rectangular parallelepiped. On the side wall of the housing 361, an inlet opening (not shown) is formed, through which the substrate W enters and leaves. The inlet opening can remain open. Alternatively, a door (not shown) can be provided to open and close the inlet opening. The heating unit 363 and the conveying plate 364 are provided in the housing 361.

[0084] The heating unit 323 includes a heating plate 363a, a cover 363c and a heater 323b. When viewed from above, the heating plate 363a has a substantially circular shape. The heating plate 363a has a diameter larger than the substrate W. The heater 363b is installed in the heating plate 363a. The heater 363b can be set as a heating wire or a heating pattern heated by supplying electricity. The heating plate 363a is provided with a lifting pin 363e. The lifting pin 363e is set to be movable upward and downward along the third direction 16. The lifting pin 363e receives the substrate W from the conveying robot 351 and places the received substrate W on the heating plate 363a, or lifts the substrate W from the heating plate 363a and transfers the substrate W to the conveying robot 351. According to an example, three lifting pins 363e can be provided. The cover 363c has a space with an open lower portion therein. The cover 363c is positioned above the heating plate 363a and is moved in the vertical direction by the driver 363d. A space formed by the cover 363c and the heating plate 363a according to the movement of the cover 363c is set as a heating space for heating the substrate W.

[0085] The transfer plate 364 is configured to be substantially disk-shaped and has a diameter corresponding to the diameter of the substrate W. A notch 364b is formed at the edge of the transfer plate 364. The notch 364b may have a shape corresponding to the protrusion 352b formed on the hand 352 of the above-mentioned transfer robot 351. In addition, the notch 364b is provided in a number corresponding to the protrusion 352b formed on the hand 352 and is formed at a position corresponding to the protrusion 352b. In a position where the hand and the transfer plate 364 are arranged in the vertical direction, when the vertical position of the hand and the transfer plate 364 is changed, the substrate W is transferred between the hand 354 and the transfer plate 364. The transfer plate 364 is mounted on a guide rail 364d and may be movable along the guide rail 364d by a driver 364c.

[0086] A plurality of slit-shaped guide grooves 364a are provided in the transfer plate 364. The guide grooves 364a extend from the distal end of the transfer plate 364 to the inside of the transfer plate 364. The longitudinal directions of the guide grooves 364a are provided along the second direction 14, and the guide grooves 364a are spaced apart from each other along the first direction 12. When the substrate W is transferred between the transfer plate 364 and the heating unit 363, the guide grooves 364a prevent the transfer plate 364 and the lifting pins 343e from interfering with each other.

[0087] The transfer plate 364 is provided with a heat conductive material. In one example, the transfer plate 364 can be provided by a metal material.

[0088] A cooling channel 364 is formed in the transfer plate 362. A coolant is supplied to the cooling channel 362. The substrate W that has been heated in the heating unit 363 can be cooled while being transferred by the transfer plate 364. In addition, in a case where the transfer plate 364 stops so that the substrate W is taken over by the transfer robot 351, the substrate W can be cooled on the transfer plate 364.

[0089] Optionally, a cooling unit may also be provided in the housing 361. In this case, the cooling unit may be arranged in parallel with the heating unit 363. The cooling unit may be provided as a cooling plate having a channel formed therein through which a coolant flows. The substrate that has been heated in the heating unit may be returned to the cooling unit for cooling.

[0090] The interface module 500 connects the process module 300 with the external exposure device 700. The interface module 500 has an interface frame 501, a buffer unit 510, a cooling unit 520, a transfer mechanism 530, an interface robot 540, and an additional process chamber 560.

[0091] The top of the interface frame 501 may be provided with a fan filter unit forming a downward airflow therein. The buffer unit 510 , the cooling unit 520 , the transfer mechanism 530 , the interface robot 540 , and the additional process chamber 560 are disposed within the interface frame 501 .

[0092] The structures and arrangements of the buffer unit 510 and the cooling unit 520 may be the same or similar to those of the buffer unit 310 and the cooling unit 320 provided in the process module 300. The buffer unit 510 and the cooling unit 520 are provided adjacent to the end of the transfer chamber 350. The substrate W transferred between the process module 300, the cooling unit 520, the additional process chamber 560, and the exposure device 700 may temporarily stay in the buffer unit 510. The cooling unit 520 may be provided only at a height corresponding to the coating block 300a between the coating block 300a and the developing block 300b.

[0093] The conveying mechanism 530 may convey the substrate W between the buffer units 510. The conveying mechanism 530 may convey the substrate W between the buffer unit 510 and the cooling unit 520. The conveying mechanism 530 may be provided with a structure that is the same as or similar to the conveying mechanism 330 of the process module 300. Another conveying mechanism 531 may also be provided in an area opposite to the area where the conveying mechanism 530 is provided with respect to the buffer unit 510.

[0094] The interface robot 540 is disposed between the buffer unit 510 and the exposure device 700. The interface unit 540 is configured to transfer the substrate W between the buffer unit 510, the cooling unit 520, the additional process chamber 560, and the exposure device 700. The interface robot 540 has a hand 542 on which the substrate W is placed, and the hand 542 may be configured to be movable forward and backward, rotatable around an axis parallel to the third direction 16, and movable along the third direction 16.

[0095] The additional process chamber 560 may perform a predetermined additional process before loading the substrate W processed in the coating block 300a into the exposure device 700. Alternatively, the additional process chamber 560 may perform a predetermined additional process before loading the substrate W processed in the exposure device 700 into the developing block 300b. In one example, the additional process may be an edge exposure process for exposing an edge area of ​​the substrate W, or a top surface cleaning process for cleaning the top surface of the substrate W, or a bottom surface cleaning process for cleaning the bottom surface of the substrate W, or an inspection process for performing a predetermined inspection on the substrate W. A plurality of additional process chambers 560 may be provided, and they may be stacked on top of each other.

[0096] In the following, reference will be made to Figures 8 to 10 An exemplary embodiment of a liquid processing chamber of the present invention is described.

[0097] Figure 8 for Figure 3 or Figure 4 A top view of an exemplary embodiment of a liquid processing chamber.

[0098] See also Figure 8 , the liquid processing chamber 1000 has a housing 1100 , an outer cup 1220 , a spin chuck 1400 , and a liquid supply unit 1600 .

[0099] The housing 1100 is provided in a rectangular cylindrical shape having an inner space. An opening 1102 is formed at one side of the housing 1100. The opening 1102 serves as a passage for the substrate W to enter and leave. A door (not shown) is installed in the opening 1102, which opens and closes the opening.

[0100] The inner space of the housing 1100 is provided with an outer cup 1220. The outer cup 1220 may be provided in plural. In this case, the plural outer cups 1220 are arranged in a row in the inner space of the housing 1100. Figure 8Three outer cups 1220 are shown, namely a first outer cup 1220a, a second outer cup 1220b, and a third outer cup 1220c. The direction in which the outer cups 1220a, 1220b, and 1220c are arranged is a direction parallel to the first direction 12. An opening 1102 is provided in an outer wall of the housing 1100 corresponding to the outer cup 1220. A plurality of openings 1102 may be provided to correspond to the plurality of outer cups 1220. The direction in which the openings 1102a, 1102b, and 1102c are provided is a direction parallel to the first direction 12.

[0101] The liquid supply unit 1600 supplies the processing liquid onto the substrate W. When the liquid processing chamber 1000 is disposed in the coating block 300a, the processing liquid may be a liquid for forming a photoresist film, an anti-reflective film, or a protective film. When the liquid processing chamber 1000 is disposed in the developing block 300b, the processing liquid may be a developing liquid.

[0102] The liquid supply unit 1600 may be provided in plurality to correspond to the plurality of outer cups 1220. The liquid supply units 1600a, 1600b, and 1600c are arranged side by side along the first direction 12. The liquid supply unit 1600 is provided at the opposite side of the opening 1102 relative to the outer cup 1220. The liquid supply unit 1600 includes a treatment liquid nozzle 1620 which will be described later.

[0103] The opening 1102 , the outer cup 1220 , and the liquid supply unit 1600 are sequentially disposed along the second direction 14 .

[0104] because Figure 8 The configurations of the outer cups 1220 and the spin chuck 1400 and the liquid supply unit 1600 corresponding to the outer cups 1220 are the same, and thus the outer cups 1220 will be described herein with reference to the first outer cup 1220a.

[0105] Fig. 9 To schematically show Figure 8 Cross-sectional views of some configurations.

[0106] The outer cup 1220 has a processing space with an open top. The spin chuck 1400 supports the substrate W in the processing space of the outer cup 1220. The spin chuck 1400 has a support plate 1420, a rotation axis 1440, and a driver 1460. The support plate 1420 is provided with a circular top surface. The diameter of the support plate 1420 is smaller than the substrate W. The support plate 1420 is provided to support the substrate W under vacuum pressure. The rotation axis 1440 is coupled to the center of the bottom surface of the support plate 1420, and the rotation axis 1440 is provided with a driver 1460 that provides a rotational force to the rotation axis 1440. The driver 1460 may be a motor. In addition, a height driver (not shown) may be provided to adjust the relative height of the support plate 1420 and the outer cup 1220.

[0107] The liquid supply unit 1600 has a treatment liquid nozzle 1620, a nozzle arm 1640, and a liquid supply source (not shown). The treatment liquid nozzle 1620 distributes the treatment liquid onto the substrate W. The treatment liquid nozzle 1620 is supported by the nozzle arm 1640. The nozzle arm 1640 moves the treatment liquid nozzle 1620 between the process position and the standby position. At the process position, the treatment liquid nozzle 387a supplies the treatment liquid to the substrate W placed on the support plate 1420, and after completing the supply of the treatment liquid, the treatment liquid nozzle 1620 waits in the standby position.

[0108] The standby position of the treatment liquid nozzle 1620 is disposed at the opposite side of the opening 1102, centered on the outer cup 1220. The treatment liquid nozzle 1620 may move in a straight line in a direction parallel to the second direction 14.

[0109] A fan filter unit 1260 that provides downward airflow to the inner space is provided on the top wall of the housing 1100. The fan filter unit 1260 has a fan that introduces air from the outside into the inner space and a filter that filters the outside air.

[0110] The outer cup 1220 has a bottom wall 1222, a side wall 1224, a top wall 1226 and a protrusion 1228. The inner space as described above is provided inside the outer cup 1220. The inner space includes a processing space at the top and a discharge space at the bottom.

[0111] The bottom wall 1222 is provided in an annular shape. An opening is formed in the center of the bottom wall. The side wall 1224 extends upward from the outer end of the bottom wall 1222. The side wall 1224 is provided in an annular shape and is provided perpendicular to the bottom wall 1222. In one example, the side wall 1224 extends to a height equal to the top surface of the support plate 1420. Alternatively, the side wall may extend to a height slightly lower than the top surface of the support plate 1420.

[0112] The top wall 1226 has a circular ring shape. The top wall 1226 has an opening at the center of the top wall 1226. The top wall 1226 is arranged to be inclined upward from the top of the side wall 1224 toward the central axis of the outer cup 1220.

[0113] The protrusion 1228 is configured to extend upward from the top of the side wall 1224 .

[0114] The protrusion 1228 is configured in an arc shape.

[0115] The top end of the protrusion 1228 extending upward from the top end of the side wall 1224 is configured to be positioned at a higher position than the top end of the top wall.

[0116] Further references Fig.10 Protrusion 1228 is described in more detail.

[0117] Fig.10 To show the Fig. 9 The side wall 1224 of the outer cup 1220 is provided with a first region 1310a, a second region 1310b, a third region 1310c and a fourth region 1310d.

[0118] The regions are adjacent to each other in the circumferential direction of the side wall 1224. The first region 1310a may be a region facing another adjacent outer cup.

[0119] The third region 1310c is a region facing the first region 1310a, and the fourth region 1310d is a region facing the second region 1310b. The first region 1310a and the third region 1310c are arranged in a direction parallel to the first direction 12. The second region 1310b and the fourth region 1310d are arranged in a direction parallel to the second direction 14.

[0120] The protrusions 1228 are installed in some areas of the side wall 1224. In the present exemplary embodiment, the first protrusion 1228a is installed in the first area 1310a, and the second protrusion 1228c is installed in the third area 1310c.

[0121] Since the side wall 1224 is provided in a ring shape, and the protrusions 1228a and 1228c are installed to extend from the side wall 1224 in a height direction, the protrusions 1228a and 1228c are provided in an arc shape.

[0122] The substrate transfer space is provided by the fourth region 1310d, the first protrusion 1228a, and the second protrusion 1228c. The substrate transfer space is a space surrounded by the first protrusion 1228a, the fourth region 1310d, and the second protrusion 1228c on the top of the sidewall 1224, and is provided in the second region 1310b.

[0123] The nozzle entrance space is provided by the first protrusion 1228a, the second protrusion 1228c and the second area 1310b. The nozzle entrance space is a space surrounded by the first protrusion 1228a, the second area 1310b and the second protrusion 1228c on the top of the side wall 1224, and is provided in the fourth area 1310d.

[0124] The width of each region is proportional to the arc length of the side wall 1324 of each region or the width of the side wall 1324 in the circumferential direction.

[0125] The first region 1310a and the third region 1310c have the same width in the circumferential direction of the side wall 1224. In addition, the second region 1310b and the fourth region 1310d have the same width in the circumferential direction of the side wall 1224.

[0126] The widths of the second region 1310b and the fourth region 1310d are set to be wider than the widths of the first region 1310a and the third region 1310c. That is, the central angle formed by the second region 1310b and the fourth region 1310d and the circumferential center of the side wall 1224 is greater than 90°. The central angle formed by the first region 1310a and the third region 1310c and the circumferential center of the side wall 1224 is less than 90°.

[0127] Since the hand 352 of the transfer robot 351 and the substrate W need to be able to enter and exit the substrate transfer space provided in the second area 1310 b , the second area 1320 b is provided with a width wider than the diameter of the substrate W.

[0128] Because the fourth area 1320d needs to allow the treatment liquid nozzle 1620 or the nozzle arm 1640 to enter and exit the nozzle entry space set in the fourth area 1310d, the width of the fourth area 1320d is set wide enough to allow the treatment liquid nozzle 1620 or the nozzle arm 1640 to enter and exit.

[0129] The first protrusion 1228 a and the second protrusion 1228 c are provided with the same height extending upward from the top of the side wall 1224 .

[0130] The guide cup 1240 is located inside the outer cup 1220. The guide cup 1240 has an inner wall 1242, an outer wall 1244 and a top wall 1246. The inner wall 1242 has a through-hole perforated in an upward and downward direction. The inner wall 1242 is arranged to surround the driver 1460. The inner wall 1242 minimizes the exposure of the driver 1460 to the airflow in the processing space. The rotating shaft 1440 and / or the driver 1460 of the rotary chuck 1400 extend upward and downward through the through-hole. The outer wall 1244 is spaced apart from the inner wall 1242 and is arranged to surround the inner wall 1242. The outer wall 1244 is spaced apart from the side wall 1224 of the outer cup 1220. The inner wall 1242 is spaced apart upward from the bottom wall 1222 of the outer cup 1220. The top wall 1246 connects the top end of the outer wall 1244 with the top end of the inner wall 1242. The top wall 1246 has a ring shape and is provided to surround the support plate 1420. In one example, the top wall 1246 has an upward convex shape.

[0131] The space below the support plate 1420 in the processing space can be set as a discharge space. In one example, the discharge space can be defined by the guide cup 1240. The space surrounded by the outer wall 1244, the top wall 1246 and the inner wall 1242 of the guide cup 1240 and / or the space below the space can be set as the discharge space.

[0132] The outer cup 1220 may be provided with a gas-liquid separation plate 1230. The gas-liquid separation plate 1230 may be provided to extend upward from the bottom wall 1222 of the outer cup 1220. The gas-liquid separation plate 1230 may be provided in an annular shape. When viewed from above, the gas-liquid separation plate 1230 may be positioned between the side wall 1224 of the outer cup 1220 and the outer wall 1244 of the guide cup 1240. The top end of the gas-liquid separation plate 1230 may be positioned lower than the bottom end of the outer wall 1244 of the guide cup 1240.

[0133] The bottom wall 1222 of the outer cup 1220 is connected to an outlet pipe 1250a and a discharge pipe 1250b for discharging the process liquid. The discharge pipe 1250a may be connected to the outer cup 1220 from the outside of the gas-liquid separation plate 1230. The discharge pipe 1250b may be connected to the outer cup 1220 inside the gas-liquid separation plate 1230.

[0134] Although not shown, an elevating drive may be provided to adjust the relative heights of the support plate 1420 and the outer cup 1220. In one example, the elevating drive may elevate the outer cup 1220 in the vertical direction. For example, the support plate 1420 is located at a height higher than the top end of the outer cup 1220 to prevent a conveying member conveying the substrate W from interfering with the outer cup 1220 when the substrate W is loaded onto the support plate 1420 or unloaded from the support plate 1420. In addition, the support plate 1420 is located at a lower height than the top end of the outer cup 1220 so that the substrate W is located within the processing space during processing.

[0135] As described above, the transfer robot 351 has the hand 352 on which the substrate W is placed. The hand 352 moves in the second direction 14 to transfer the substrate W on the spin chuck 1400 .

[0136] In this case, the transfer robot 351 enters the substrate transfer space and transfers the substrate W to the spin chuck 1400 . That is, the hand 352 of the transfer robot 351 passes through the substrate transfer space and transfers the substrate W to the spin chuck 1400 .

[0137] After transferring the substrate W, the nozzle arm 1640 enters the top of the spin chuck 1400 through the above-mentioned nozzle entry space. That is, when the processing liquid nozzle 1620 moves linearly from the outside of the outer cup 1220 to the inside of the outer cup 1220, the nozzle arm 1640 passes through the nozzle entry space.

[0138] After reaching the top of the spin chuck 1400 , the processing liquid nozzle 1620 discharges the processing liquid onto the substrate W placed on the spin chuck 1400 .

[0139] When the liquid processing chamber 1000 is disposed in the developing block 300b, the processing liquid may be a developing liquid. This removes a portion of the photoresist applied to the substrate W. The removed photoresist particles are discharged through the outer cup 1220 together with the processing liquid.

[0140] At this time, the processing liquid (such as developer) may be spread outside the substrate or spread into the processing space due to the centrifugal force of the rotation of the spin chuck 1400. Although most of the spread processing liquid is received inside the outer cup 1220, some of the processing liquid may be spread outside the outer cup 1220. In this case, when the processing liquid is spread onto another substrate W being processed in another adjacent outer cup 1220, the processing liquid or particles contained in the processing liquid may contaminate the other substrate W and cause process failure.

[0141] By providing the protrusion 1228 on the outer cup 1220, it is possible to prevent the process liquid and the particles contained in the process liquid from spreading to the outside of the outer cup 1220. The process liquid is guided to the inside of the outer cup 1220 by hitting the protrusion 1228, so that the process liquid and the particles contained in the process liquid are spread to other adjacent outer cups, or particularly to the processing spaces of other outer cups, to minimize process defects.

[0142] The protrusion 1228 needs to protrude at a suitable height to minimize the splashing of the treatment liquid. The height of the protrusion protruding upward from the top of the side wall 1224 needs to be such that the outer cup 1220 can be freely used in the internal space of the housing 1100 without interference. The protrusion is also set at a height that does not hinder the airflow circulation in the housing 1100. The protrusion is also set at a height sufficient to prevent the treatment liquid from spreading into the adjacent outer cup. For example, the protrusion 1228 can have a protrusion height of about 30 mm or more.

[0143] The protrusion 1228 may be removably provided. In this case, the protrusion 1228 may be removed for cleaning when the liquid treatment of the substrate W is terminated or during maintenance of the liquid treatment chamber 1000, or the protrusion may be replaced.

[0144] In the above example, the developing chamber 1000 as the liquid processing chamber provided in the developing block 300b is described as having a structure with the protrusion 1228. However, the coating chamber provided in the coating block 300a may also have a structure with the protrusion 1228.

[0145] The present invention is described based on an apparatus for performing a coating process or a developing process as an example. However, in contrast, a structure having the protrusion 1228 such as the above-described liquid processing chamber 1000 may also be provided in an apparatus for performing cleaning of a substrate W by supplying a cleaning liquid.

[0146] In the above example, three outer cups 1220 are provided in the liquid processing chamber 1000. However, one or more outer cups 1220 may be provided in the liquid processing chamber 1000 instead.

[0147] In the above example, the protrusions 1228, namely the first protrusion 1228a and the second protrusion 1228c, are provided with the same height extending upward from the top end of the side wall 1224. On the contrary, the protrusions 1228 may be provided at different heights as required.

[0148] In the above example, the hand 352 of the transfer robot 351 passes through the substrate transfer space to transfer the substrate W onto the spin chuck 1400. However, in contrast to this, an exemplary embodiment may also be included in which the hand 352 of the transfer robot 351 is inserted into the substrate transfer space while the hand 352 of the transfer robot 351 moves downward from the upper side of the processing space of the outer cup 1220 into the processing space of the outer cup 1220, and the hand 352 enters the substrate transfer space to transfer the substrate W.

[0149] In the above example, it has been described that the nozzle arm 1640 passes through the nozzle entry space when the treatment liquid nozzle 1620 moves straightly from the outside of the outer cup 1220 to the inside of the outer cup 1220. However, an exemplary embodiment may also be included in which the nozzle arm 1640 may be inserted into the nozzle entry space and enter through the nozzle entry space when the treatment liquid nozzle 1620 moves downward from the top of the processing space of the outer cup 1220 into the processing space of the outer cup 1220.

[0150] Figures 11 to 14 FIG. 1 is a diagram showing a liquid processing chamber according to another exemplary embodiment of the present invention.

[0151] In the following, only the Figures 8 to 10 The liquid processing chamber 1000 described in the present invention has a different configuration and is represented by the same symbols or omitted from the description. Figures 8 to 10 The liquid processing chamber 1000 has the same configuration as described in FIG.

[0152] In the above example, it has been described that two protrusions 1228 are provided on each outer cup 1220. However, in contrast, Fig.11 As shown, only one outer cup 1220 may be disposed in a region adjacent to another outer cup 1220. Therefore, when a plurality of outer cups 1220 exist in the liquid processing chamber 1000, only one protrusion 1228 may be disposed on the outermost outer cup 1220.

[0153] In the above example, it has been described that the second region 1310b and the fourth region 1310d have the same width in the circumferential direction of the side wall 1224. However, alternatively, the width of the second region 1310b may be set to be wider than the width of the fourth region 1310d, such as Fig.12 shown.

[0154] In this case, the second area 1320b needs to have a width wider than the diameter of the substrate W because the hand 352 of the transfer robot 351 and the substrate W need to be able to enter and exit the substrate transfer space provided in the second area 1310b. The fourth area 1320d also needs to be wide enough to allow the processing liquid nozzle 1620 to enter and exit the nozzle entry space because the processing liquid nozzle 1620 needs to be able to enter and exit the nozzle entry space provided in the fourth area 1310d.

[0155] In the above example, the widths of the second region 1310b and the fourth region 1310d are set to be wider than the widths of the first region 1310a and the third region 1310c. However, on the contrary, each region may be the same width, such as Fig.13 That is, the central angle formed by each area and the circumferential center of the side wall 1224 may be 90°.

[0156] In the above examples, it has been described that the protrusion is formed integrally with the side wall. Fig.14 As shown, the protrusion 1228 may be provided separately from the side wall and detachably attached to the side wall. In this case, the protrusion 1228 may be removed for cleaning when liquid processing of the substrate W is terminated or during maintenance of the liquid processing chamber 1000, or the protrusion 1228 may be replaced.

[0157] It should be understood that exemplary embodiments are disclosed herein and that other variations are possible. Individual components or features of a particular exemplary embodiment are generally not limited to that particular exemplary embodiment, but are interchangeable and can be used in a selected exemplary embodiment where applicable, even if not specifically shown or described. These modifications should not be considered as departing from the spirit and scope of the present disclosure, and all such modifications that are obvious to one of ordinary skill in the art are intended to be included within the scope of the appended claims.

Claims

1. An apparatus for processing a substrate, wherein: The device comprises: a housing having an inner space; a plurality of external cups, the plurality of external cups being arranged in a row in the internal space, each of the plurality of external cups having a processing space; a rotating chuck for supporting and rotating the substrate in each of the processing spaces; a processing liquid nozzle provided in plural to correspond to the plurality of outer cups respectively and used to supply a processing liquid onto the substrate supported by the spin chuck, wherein the outer cup includes a side wall surrounding the rotating chuck, The side wall includes a first region and a second region located adjacent to each other in a circumferential direction of the side wall, and The outer cup includes a first protrusion mounted in the first region, the first protrusion extending upwardly above a top end of the side wall.

2. The device according to claim 1, wherein: The first area is an area facing another adjacent outer cup.

3. The device according to claim 2, wherein: The side wall further includes a third region and a fourth region, and The third area faces the first area, and the fourth area faces the second area, and The third region is configured to have a second protrusion extending upward from a top end of the side wall.

4. The device according to claim 3, wherein: The first protrusion and the second protrusion are configured in an arc shape.

5. The device according to claim 3, wherein: The device also includes: a nozzle arm, the nozzle arm being used to support the treatment liquid nozzle, The nozzle arm is configured to enter a space surrounded by the first protrusion, the second area, and the second protrusion, and is movable to the top of the rotation chuck.

6. The device according to claim 3, wherein: The device also includes: a transfer robot, the transfer robot being used to transfer the substrate to the rotation chuck, The transfer robot is configured to enter a space surrounded by the first protrusion, the fourth region, and the second protrusion to transfer the substrate to the spin chuck.

7. The device according to claim 3, wherein: The first protrusion and the second protrusion each have the same height extending upward from a top end of the side wall.

8. The device according to claim 3, wherein: The first protrusion and the second protrusion are configured to be separable.

9. The device according to claim 3, wherein: The width of the second region in the circumferential direction is set to be wider than the width of the first region in the circumferential direction and the width of the third region in the circumferential direction.

10. The device according to claim 3, wherein: The outer cup also includes a top wall, The top wall is arranged to be inclined upward from the top end of the side wall toward the central axis of the outer cup, and The top end of the first protrusion and the top end of the second protrusion are each configured to be positioned higher than the top end of the top wall.

11. An apparatus for processing a substrate, wherein: The device comprises: a housing having an inner space; an outer cup disposed in the inner space and having a processing space; a rotary chuck for supporting and rotating a substrate within the processing space; a processing liquid nozzle for supplying a processing liquid onto the substrate supported by the spin chuck; and a nozzle arm, the nozzle arm being used to support the treatment liquid nozzle, wherein the outer cup includes a side wall surrounding the rotating chuck, The outer cup is provided with a protrusion extending upwardly from a top end of the side wall, and The protrusion is provided in only a portion of the side wall.

12. The device according to claim 11, wherein The side wall includes a first region and a second region located adjacent to each other in a circumferential direction of the side wall, and The first area is provided with the protrusion.

13. The device according to claim 12, wherein: The side wall further includes a third region and a fourth region, and The third area faces the first area, and the fourth area faces the second area, and The protrusion is further disposed in the third region.

14. The device according to claim 13, wherein: The protrusion is configured in an arc shape.

15. The device according to claim 13, wherein: One of the spaces between the protrusions is provided as a space into which the nozzle arm enters.

16. The device according to claim 13, wherein: The device also includes: a transfer robot, the transfer robot being used to transfer the substrate to the rotation chuck, Wherein, a space between the protrusions is set as a space for the conveying robot to enter.

17. The device according to claim 11, wherein: The outer cup also includes a top wall, The top wall is arranged to be inclined upward from the top end of the side wall toward the central axis of the outer cup, and The top end of the protrusion is configured to be positioned higher than the top end of the top wall.

18. An apparatus for processing a substrate, wherein: The device comprises: a housing having an interior space; and a first outer cup and a second outer cup, the first outer cup and the second outer cup being disposed in the inner space, the first outer cup and the second outer cup each having a processed space, wherein the first outer cup and the second outer cup are arranged in a row along one direction in the inner space, The first outer cup and the second outer cup each include: a rotary chuck for supporting and rotating a substrate within the processing space; a processing liquid nozzle for supplying a processing liquid onto the substrate supported by the spin chuck; a nozzle arm, the nozzle arm being used to support the treatment liquid nozzle; a side wall surrounding the rotating chuck, and The first outer cup includes a first region, a second region, a third region and a fourth region in the side wall, The first area is provided with a first protrusion extending upward from the top end of the side wall, The first protrusion is configured in an arc shape, and The first region is a region facing the second outer cup.

19. The device according to claim 18, wherein: The third area faces the first area, and the fourth area faces the second area, and The third area is provided with a second protrusion extending upward from the top end of the side wall, and The second protrusion is configured to be in an arc shape.

20. The device according to claim 19, wherein The device also includes: a transfer robot, the transfer robot being used to transfer the substrate to the rotation chuck, wherein a space between the first protrusion and the second protrusion is set as a space into which the nozzle arm enters, and Another of the spaces between the first protrusion and the second protrusion is set as a space into which the transfer robot enters.

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