Semiconductor multi-station flip packaging equipment

Abstract

The invention relates to the technical field of semiconductor packaging, in particular to semiconductor multi-station flip packaging equipment which comprises a support and a conveying mechanism installed on the support, a glue removing mechanism is installed on the conveying mechanism, and a dust suction mechanism is installed on the conveying mechanism. A semiconductor with optical cement can be placed in a placing hopper before a substrate and the semiconductor are packaged, acid liquor is contained in a box body, a roller shaft can drive a cam to rotate when driving a conveying belt to rotate, the cam collides with an abutting plate on a fixing rod when rotating, and due to the fact that the placing hopper is installed on a sliding plate, the semiconductor can be placed in the placing hopper. A first spring is arranged at the bottom of the sliding plate, when the cam and the abutting plate collide and are separated, the first spring resets the sliding plate, so that the shaking of the placing hopper is realized, the reaction between the acid liquor and the optical cement on the semiconductor is facilitated, the removal of the optical cement on the semiconductor before station packaging is realized, and the placing hopper can be lifted through the airing mechanism after removal; and the semiconductors in the placing hopper are dried.

Description

Technical Field

[0001] The invention relates to the technical field of semiconductor packaging, in particular to a semiconductor multi-station flip-chip packaging device. Background Art

[0002] Semiconductors refer to materials with electrical conductivity between conductors and insulators at room temperature. Semiconductors are used in integrated circuits, consumer electronics, communication systems, photovoltaic power generation, lighting, high-power power conversion and other fields. For example, diodes are devices made of semiconductors. The semiconductor packaging process requires the semiconductor to be installed in a semiconductor groove coated with glue on the carrier. Flip-chip packaging is a packaging method in which the active surface (i.e. the side with the circuit pattern) of the integrated circuit chip faces downward and is directly connected to the substrate, carrier or circuit board through solder joints. Gluing is required during the manufacturing of semiconductors.

[0003] A multi-station packaging equipment for semiconductor manufacturing is disclosed in the patent publication number CN115527902B, including a packaging chamber, on which a first conveyor, a second conveyor, and a third conveyor are fixedly installed. By setting a rotating tray and cooperating with multiple rotating stations, multiple steps of semiconductor packaging can be performed simultaneously. The setting of the upper limit plate on the rotating station can meet the positioning requirements of carriers of different sizes and has certain applicability. By setting multiple push plate assemblies on the rotating belt and corresponding negative pressure plates, multiple negative pressure plates can continuously adsorb semiconductors.

[0004] The prior art has the following defects:

[0005] 1. By setting up a rotating tray and cooperating with multiple rotating stations, multiple steps of semiconductor packaging can be performed simultaneously. A limit plate is provided on the rotating station to press substrates of different sizes, and there is also a lifting mechanism to press the semiconductor. Although multiple stations are used to press substrates of different sizes, the dust between the gaps between the substrate and the semiconductor is not cleaned when pressing the filler. Directly pressing the filler is likely to cause a short circuit or an open circuit. Dust particles may also interfere with signal transmission, affecting the quality of signal transmission inside the chip or between the chip and external devices.

[0006] 2. After filling, the substrate and semiconductor are dried at the workstation by drying equipment. The drying time is usually several hours. However, the filling speed is fast and the drying time is long, resulting in a situation of oversupply and continuous waiting at the drying station. No collection mechanism is set at the finished product unloading point for collective drying.

[0007] 3. There is no degumming mechanism at the workstation. The semiconductor needs to be cleaned of photoresist before being packaged with the substrate. It is difficult to degumm and dry the semiconductor at the workstation. The degree of integration is low, which is not conducive to the packaging of the semiconductor and the substrate. Summary of the invention

[0008] In view of the problems in the prior art, the present invention provides a semiconductor multi-station flip-chip packaging device.

[0009] The technical solution adopted by the present invention to solve its technical problems is: a semiconductor multi-station flip-chip packaging equipment, including a bracket, a conveying mechanism installed on the bracket, a degumming mechanism installed on the conveying mechanism, a drying mechanism installed on the degumming mechanism, a dust collection mechanism installed on the conveying mechanism, a filling robot installed on the conveying mechanism, and a collection mechanism installed at the end of the conveying mechanism; the conveying mechanism includes a side frame fixed to the bracket, two rollers are rotatably connected to the side frame, the degumming mechanism includes a cam, one end of the roller is fixedly connected to the cam, the side wall of the bracket is fixedly connected to the bottom plate, and the bottom plate is installed A box body is provided, and four columns are fixed in a rectangular array inside the box body. Slide plates are slidably connected to two columns on the same side, and a placement bucket with a hole at the bottom is rotatably connected to one of the slide plates through two rotating shafts. A first spring is clamped between the two slide plates and the box body, and two clamping columns are relatively slidably connected inside the placement bucket, and a second spring is clamped between the two clamping columns and the placement bucket. The two clamping columns are engaged with holes on the other slide plate, and a fixing rod is fixedly connected to the slide plate with holes, and a resistance plate is fixedly connected to the fixing rod by screws, and the resistance plate resists the cam. The filling robot is installed on the side frame.

[0010] Specifically, the conveying mechanism further includes a conveyor belt, the conveyor belt is wound around the two rollers, a first motor is mounted on the side frame, and the first motor is connected to the roller on the side away from the box body.

[0011] Specifically, the lengths of the four columns are equal, and the distance between the two slide plates located on the two groups of columns is greater than the length of the placement bucket.

[0012] Specifically, the drying mechanism includes a first hydraulic rod, wherein the first hydraulic rod is installed between two columns, a hook is connected to the end of the first hydraulic rod, one end of the hook extends to the bottom of the slide, and a placement rod is fixedly connected between two columns away from one end of the first hydraulic rod.

[0013] Specifically, the drying mechanism further includes a dryer, and the dryer is installed between the four columns, and the cross-section of the hook is an L-shaped structure.

[0014] Specifically, the dust suction mechanism includes a second hydraulic rod, and the second hydraulic rod is installed on the side of the side frame. The end of the second hydraulic rod is fixedly connected to a connecting plate, and a dust collector is installed on the end of the connecting plate. The inner side of the dust collector is provided with dust suction ports in a rectangular array, and the dust collector is arranged opposite to the conveyor belt.

[0015] Specifically, the vacuum cleaner further includes a third spring and a pressure plate. The third spring is installed at the bottom of the vacuum cleaner, and the pressure plate is installed at the bottom of the third spring.

[0016] Specifically, the dust suction mechanism further includes a rubber pad, and the rubber pad is bonded to the bottom of the pressing plate.

[0017] Specifically, the collecting mechanism includes a mounting plate, the end of the side frame is fixedly connected to the mounting plate, the mounting plate is located on the bottom side of the conveyor belt, a second motor is installed at the bottom of the mounting plate, a turntable is placed on the mounting plate, the turntable has storage openings equidistantly provided, a slot is provided at the bottom of the turntable, an insertion rod is connected to the end of the second motor, and the insertion rod is inserted into the slot.

[0018] Specifically, the cross sections of the insertion rod and the slot are both hexagonal structures, and the storage opening on the turntable is fan-shaped.

[0019] The beneficial effects of the present invention are:

[0020] (1) The semiconductor multi-station flip-chip packaging equipment described in the present invention has a debonding mechanism installed on the bracket, which can place the semiconductor with photoresist in the placement bucket before the substrate and the semiconductor are packaged. The box body is filled with acid liquid. When the roller drives the conveyor belt to rotate, it can drive the cam to rotate. When the cam rotates, it hits the contact plate on the fixed rod. Since the placement bucket is installed on the slide plate, a first spring is provided at the bottom of the slide plate. When the cam hits and separates from the contact plate, the first spring resets it. The reciprocating movement of the placement bucket realizes the shaking of the placement bucket, which is beneficial to the reaction between the acid liquid and the photoresist on the semiconductor, and realizes the removal of the photoresist on the semiconductor before the station packaging. After removal, the placement bucket can be lifted by the drying mechanism to dry the semiconductor inside the placement bucket.

[0021] (2) The semiconductor multi-station flip-chip packaging equipment described in the present invention has a dust collection mechanism on the conveying mechanism. When the conveyor belt conveys the substrate and semiconductor that need to be filled, they need to pass through the bottom of the dust collector. At this time, the conveying mechanism can stop for a period of time, and the second hydraulic rod drives the dust collector to descend. The rubber pad at the bottom of the pressure plate further presses the semiconductor. The third spring contracts. As the second hydraulic rod descends, the rubber pad presses the semiconductor. The dust collector cleans the dust and debris inside the gap between the semiconductor and the substrate to avoid mixing with the filler, thereby ensuring that the packaged semiconductor will not be short-circuited or open-circuited due to foreign matter.

[0022] (3) The semiconductor multi-station flip-chip packaging equipment described in the present invention has a collecting mechanism at the end of the side frame. When the conveyor belt conveys the filled semiconductors to the end of the conveyor belt, the semiconductors will fall into the inside of the storage port on the turntable. Each time the material is loaded, the second motor will drive the turntable to rotate an angle, which is beneficial to the independent storage of the semiconductors. The turntable can be disassembled to facilitate replacement. The bottom of the turntable is provided with holes, which is beneficial to the stacking and drying by directly placing the turntable on the bottom of the drying equipment. BRIEF DESCRIPTION OF THE DRAWINGS

[0023] The present invention is further described below in conjunction with the accompanying drawings and embodiments.

[0024] Figure 1 A schematic diagram of the overall structure of a preferred embodiment of a semiconductor multi-station flip-chip packaging device provided by the present invention;

[0025] Figure 2 It is a schematic diagram of the connection structure between the cam and the roller shaft of the present invention;

[0026] Figure 3 It is a schematic diagram of the connection structure of the column, the slide plate and the first spring of the present invention;

[0027] Figure 4 It is a schematic diagram of the connection structure between the hook and the slide plate of the present invention;

[0028] Figure 5 It is a schematic diagram of the connection structure of the slide plate, the rotating shaft and the placing bucket of the present invention;

[0029] Figure 6 It is a schematic diagram of the connection structure of the placing bucket, the clamping column and the second spring of the present invention;

[0030] Figure 7 It is a schematic diagram of the connection structure of the vacuum cleaner, the third spring and the pressure plate of the present invention;

[0031] Figure 8 It is a schematic diagram of the connection structure between the pressing plate and the rubber pad of the present invention;

[0032] Fig. 9 It is a schematic diagram of the connection structure between the turntable and the receiving port of the present invention;

[0033] Fig.10 It is a schematic diagram of the connection structure between the insertion rod and the slot of the present invention.

[0034] In the figure: 1, bracket; 2, conveying mechanism; 201, side frame; 202, first motor; 203, conveyor belt; 204, roller; 3, glue removal mechanism; 301, bottom plate; 302, box; 303, column;

[0035] 304, placing bucket; 305, cam; 306, slide plate; 307, first spring; 308, fixing rod;

[0036] 309, contact plate; 310, rotating shaft; 311, second spring; 313, clamping column; 4, drying mechanism;

[0037] 401, first hydraulic rod; 402, dryer; 403, hook; 404, placement rod; 5, dust suction mechanism; 501, connecting plate; 502, vacuum cleaner; 503, second hydraulic rod; 504, third spring; 505, pressure plate; 506, rubber pad; 507, dust suction port; 6, filling robot; 7, collecting mechanism; 701, mounting plate; 702, turntable; 703, storage port; 704, second motor; 705, slot; 706, insertion rod. DETAILED DESCRIPTION

[0038] In order to make the technical means, creative features, objectives and effects achieved by the present invention easy to understand, the present invention is further explained below in conjunction with specific implementation methods.

[0039] Embodiment 1

[0040] like Figure 1-Figure 10As shown, a semiconductor multi-station flip chip packaging device described in the present invention includes a bracket 1, a conveying mechanism 2 installed on the bracket 1, a degumming mechanism 3 is installed on the conveying mechanism 2, a drying mechanism 4 is installed on the degumming mechanism 3, a dust collection mechanism 5 is installed on the conveying mechanism 2, a filling robot 6 is installed on the conveying mechanism 2, and a collecting mechanism 7 is installed at the end of the conveying mechanism 2; the conveying mechanism 2 includes a side frame 201 fixed to the bracket 1, and two rollers 204 are rotatably connected to the side frame 201, and the degumming mechanism 3 includes a cam 305, one end of which is fixedly connected to the cam 305, the side wall of the bracket 1 is fixedly connected to a bottom plate 301, a box body 302 is installed on the bottom plate 301, and four columns 303 are fixed in a rectangular array inside the box body 302, and two columns 303 on the same side are slidably connected to a slide plate 306, one of the slide plates 306 is rotatably connected to a placement bucket 304 with a bottom opening through two rotating shafts 310, and a first spring 307 is clamped between the two slide plates 306 and the box body 302, and two clamping columns 313 are relatively slidably connected inside the placement bucket 304, and a second spring 307 is clamped between the two clamping columns 313 and the placement bucket 304 11. The two clamping columns 313 are engaged with the holes on another slide plate 306. The slide plate 306 with the hole is fixedly connected with a fixing rod 308. The fixing rod 308 is fixedly connected with a contact plate 309 by screws. The contact plate 309 contacts the cam 305. The filling robot 6 is installed on the side frame 201. The conveying mechanism 2 also includes a conveyor belt 203. The conveyor belt 203 is wound around the two roller shafts 204. The side frame 201 is equipped with a first motor 202. The first motor 202 is connected to the roller shaft 204 on the side away from the box body 302. The lengths of the four columns 303 are equal. , and the distance between the two slides 306 located on the two groups of the columns 303 is greater than the length of the placement bucket 304; the drying mechanism 4 includes a first hydraulic rod 401, wherein the first hydraulic rod 401 is installed between the two columns 303, the end of the first hydraulic rod 401 is connected to a hook 403, one end of the hook 403 extends to the bottom of the slide 306, and a placement rod 404 is fixedly connected between the two columns 303 away from one end of the first hydraulic rod 401; the drying mechanism 4 also includes a dryer 402, the dryer 402 is installed between the four columns 303, and the cross-section of the hook 403 is an L-shaped structure;When performing flip-chip packaging on the substrate and the semiconductor, the two are flip-chip bonded and placed on the surface of the conveyor belt 203. The first motor 202 drives the roller 204 to rotate to realize the movement of the conveyor belt 203 in the direction of the turntable 702. The roller 204 has power to drive the cam 305 to rotate when rotating. Then, an acid solution to remove the colloid on the semiconductor can be added to the inside of the box 302, and the semiconductor without the colloid removed can be placed in the inside of the placing bucket 304. As the roller 204 rotates, the cam 305 will push the resistance on the fixing rod 308 The plate 309 performs intermittent impact. Since the fixing rod 308 is fixed to one of the slide plates 306, and the slide plate 306 contacts the first spring 307 on the column 303, when the abutment plate 309 is separated from the cam 305, the first spring 307 resets the slide plate 306, thereby realizing the shaking of the placing bucket 304, which is beneficial to the shaking of the semiconductor inside it, so that the colloid on the semiconductor reacts comprehensively with the acid liquid inside the box 302, which is beneficial to the removal of the colloid on the semiconductor, and the removal of the colloid on the semiconductor is realized at one station. When the semiconductor inside the placing bucket 304 is taken out, the contact plate 309 is rotated so as not to interfere with the cam 305, and the first hydraulic rod 401 is further driven to realize that the hook 403 drives the slide plate 306 to rise, and then the placing bucket 304 is lifted, and the acid liquid will fall from the hole at the bottom of the placing bucket 304 to the inside of the box body 302. Further, the clamping column 313 can be pulled out from the hole on one of the slide plates 306 by wearing gloves, and the second spring 311 is contracted to continue to lift the first hydraulic rod 401, so that the slide plate 306 on the rotating shaft 310 is lifted. Continue to rise. When the height of the rotating shaft 310 exceeds the placement rod 404, the two clamping columns 313 are placed on the placement rod 404, which is convenient for taking out the semiconductor inside the placement bucket 304, and the dryer 402 is started to dry the semiconductor inside the placement bucket 304. When pickling again, the first hydraulic rod 401 is extended to realize the lowering of the hook 403, and the clamping column 313 is removed from the placement rod 404. The clamping column 313 is further clamped to the hole on the slide 306, and then the placement bucket 304 is placed inside the box 302. ;

[0041] Embodiment 2

[0042] like Figure 1-Figure 10As shown, a semiconductor multi-station flip chip packaging device described in the present invention includes a bracket 1, a conveying mechanism 2 installed on the bracket 1, a degumming mechanism 3 is installed on the conveying mechanism 2, a drying mechanism 4 is installed on the degumming mechanism 3, a dust collection mechanism 5 is installed on the conveying mechanism 2, a filling robot 6 is installed on the conveying mechanism 2, and a collecting mechanism 7 is installed at the end of the conveying mechanism 2; the conveying mechanism 2 includes a side frame 201 fixed to the bracket 1, and two rollers 204 are rotatably connected to the side frame 201, and the degumming mechanism 3 includes a cam 305, one end of which is fixedly connected to the cam 305, the side wall of the bracket 1 is fixedly connected to a bottom plate 301, a box body 302 is installed on the bottom plate 301, and four columns 303 are fixed in a rectangular array inside the box body 302, and two columns 303 on the same side are slidably connected to a slide plate 306, one of the slide plates 306 is rotatably connected to a placement bucket 304 with a bottom opening through two rotating shafts 310, and a first spring 307 is clamped between the two slide plates 306 and the box body 302, and two clamping columns 313 are relatively slidably connected inside the placement bucket 304, and a second spring 307 is clamped between the two clamping columns 313 and the placement bucket 304 11. The two clamping columns 313 are engaged with the holes on another slide plate 306. The slide plate 306 with the hole is fixedly connected with a fixing rod 308. The fixing rod 308 is fixedly connected with a contact plate 309 by screws. The contact plate 309 contacts the cam 305. The filling robot 6 is installed on the side frame 201. The conveying mechanism 2 also includes a conveyor belt 203. The conveyor belt 203 is wound around the two roller shafts 204. The side frame 201 is equipped with a first motor 202. The first motor 202 is connected to the roller shaft 204 on the side away from the box body 302. The lengths of the four columns 303 are equal. , and the distance between the two slides 306 located on the two groups of the columns 303 is greater than the length of the placement bucket 304; the drying mechanism 4 includes a first hydraulic rod 401, wherein the first hydraulic rod 401 is installed between the two columns 303, the end of the first hydraulic rod 401 is connected to a hook 403, one end of the hook 403 extends to the bottom of the slide 306, and a placement rod 404 is fixedly connected between the two columns 303 away from one end of the first hydraulic rod 401; the drying mechanism 4 also includes a dryer 402, the dryer 402 is installed between the four columns 303, and the cross-section of the hook 403 is an L-shaped structure;When performing flip-chip packaging on the substrate and the semiconductor, the two are flip-chip bonded and placed on the surface of the conveyor belt 203. The first motor 202 drives the roller 204 to rotate to realize the movement of the conveyor belt 203 in the direction of the turntable 702. The roller 204 has power to drive the cam 305 to rotate when rotating. Then, an acid solution to remove the colloid on the semiconductor can be added to the inside of the box 302, and the semiconductor without the colloid removed can be placed in the inside of the placing bucket 304. As the roller 204 rotates, the cam 305 will push the resistance on the fixing rod 308 The plate 309 performs intermittent impact. Since the fixing rod 308 is fixed to one of the slide plates 306, and the slide plate 306 contacts the first spring 307 on the column 303, when the abutment plate 309 is separated from the cam 305, the first spring 307 resets the slide plate 306, thereby realizing the shaking of the placing bucket 304, which is beneficial to the shaking of the semiconductor inside it, so that the colloid on the semiconductor reacts comprehensively with the acid liquid inside the box 302, which is beneficial to the removal of the colloid on the semiconductor, and the removal of the colloid on the semiconductor is realized at one station. When the semiconductor inside the placing bucket 304 is taken out, the contact plate 309 is rotated so as not to interfere with the cam 305, and the first hydraulic rod 401 is further driven to realize that the hook 403 drives the slide plate 306 to rise, and then the placing bucket 304 is lifted, and the acid liquid will fall from the hole at the bottom of the placing bucket 304 to the inside of the box body 302. Further, the clamping column 313 can be pulled out from the hole on one of the slide plates 306 by wearing gloves, and the second spring 311 is contracted to continue to lift the first hydraulic rod 401, so that the slide plate 306 on the rotating shaft 310 is lifted. Continue to rise. When the height of the rotating shaft 310 exceeds the placement rod 404, the two clamping columns 313 are placed on the placement rod 404, which is convenient for taking out the semiconductor inside the placement bucket 304, and the dryer 402 is started to dry the semiconductor inside the placement bucket 304. When pickling again, the first hydraulic rod 401 is extended to realize the lowering of the hook 403, and the clamping column 313 is removed from the placement rod 404. The clamping column 313 is further clamped to the hole on the slide 306, and then the placement bucket 304 is placed inside the box 302. ;

[0043] Specifically, the dust suction mechanism 5 includes a second hydraulic rod 503, a second hydraulic rod 503 is installed on the side of the side frame 201, the end of the second hydraulic rod 503 is fixedly connected to a connecting plate 501, a dust collector 502 is installed on the end of the connecting plate 501, and a dust suction port 507 is opened in a rectangular array on the inner side of the dust collector 502, and the dust collector 502 is arranged opposite to the conveyor belt 203; the dust collector 502 also includes a third spring 504 and a pressure plate 505, the bottom of the dust collector 502 is installed with a third spring 504, and the bottom of the third spring 504 is installed with a pressure plate 505; the dust suction mechanism 5 also includes a rubber pad 506, and the bottom of the pressure plate 505 is bonded with a rubber pad 506; after the laminated substrate and semiconductor are placed on the surface of the conveyor belt 203, the first motor 202 drives the conveyor belt 203 Move toward the direction of the vacuum cleaner 502. When the semiconductor moves to the bottom of the vacuum cleaner 502, the conveyor belt 203 can stop for a while, and the second hydraulic rod 503 is started to drive the connecting plate 501 to descend, further realizing the movement of the vacuum cleaner 502 to the back side of the semiconductor. First, the rubber pad 506 presses the back side of the semiconductor. As the vacuum cleaner 502 descends, the third spring 504 contracts to press the semiconductor and the substrate. The vacuum cleaner 502 is further started to realize the suction port 507 on the inner wall of the vacuum cleaner 502 to suck air, thereby realizing the dust in the gap between the substrate and the semiconductor. It is avoided that the filling robot 6 fills the gap between the two with dust and debris, causing short circuit and open circuit. After vacuuming, the second hydraulic rod 503 is reset, and the vacuum cleaner 502 rises. Further, the rubber pad 506 no longer squeezes the semiconductor, and the two are flip-chip packaged by the filling robot 6.

[0044] Embodiment 3

[0045] like Figure 1-Figure 10As shown, a semiconductor multi-station flip chip packaging device described in the present invention includes a bracket 1, a conveying mechanism 2 installed on the bracket 1, a degumming mechanism 3 is installed on the conveying mechanism 2, a drying mechanism 4 is installed on the degumming mechanism 3, a dust collection mechanism 5 is installed on the conveying mechanism 2, a filling robot 6 is installed on the conveying mechanism 2, and a collecting mechanism 7 is installed at the end of the conveying mechanism 2; the conveying mechanism 2 includes a side frame 201 fixed to the bracket 1, and two rollers 204 are rotatably connected to the side frame 201, and the degumming mechanism 3 includes a cam 305, one end of which is fixedly connected to the cam 305, the side wall of the bracket 1 is fixedly connected to a bottom plate 301, a box body 302 is installed on the bottom plate 301, and four columns 303 are fixed in a rectangular array inside the box body 302, and two columns 303 on the same side are slidably connected to a slide plate 306, one of the slide plates 306 is rotatably connected to a placement bucket 304 with a bottom opening through two rotating shafts 310, and a first spring 307 is clamped between the two slide plates 306 and the box body 302, and two clamping columns 313 are relatively slidably connected inside the placement bucket 304, and a second spring 307 is clamped between the two clamping columns 313 and the placement bucket 304 11. The two clamping columns 313 are engaged with the holes on another slide plate 306. The slide plate 306 with the hole is fixedly connected with a fixing rod 308. The fixing rod 308 is fixedly connected with a contact plate 309 by screws. The contact plate 309 contacts the cam 305. The filling robot 6 is installed on the side frame 201. The conveying mechanism 2 also includes a conveyor belt 203. The conveyor belt 203 is wound around the two roller shafts 204. The side frame 201 is equipped with a first motor 202. The first motor 202 is connected to the roller shaft 204 on the side away from the box body 302. The lengths of the four columns 303 are equal. , and the distance between the two slides 306 located on the two groups of the columns 303 is greater than the length of the placement bucket 304; the drying mechanism 4 includes a first hydraulic rod 401, wherein the first hydraulic rod 401 is installed between the two columns 303, the end of the first hydraulic rod 401 is connected to a hook 403, one end of the hook 403 extends to the bottom of the slide 306, and a placement rod 404 is fixedly connected between the two columns 303 away from one end of the first hydraulic rod 401; the drying mechanism 4 also includes a dryer 402, the dryer 402 is installed between the four columns 303, and the cross-section of the hook 403 is an L-shaped structure;When performing flip-chip packaging on the substrate and the semiconductor, the two are flip-chip bonded and placed on the surface of the conveyor belt 203. The first motor 202 drives the roller 204 to rotate to realize the movement of the conveyor belt 203 in the direction of the turntable 702. The roller 204 has power to drive the cam 305 to rotate when rotating. Then, an acid solution to remove the colloid on the semiconductor can be added to the inside of the box 302, and the semiconductor without the colloid removed can be placed in the inside of the placing bucket 304. As the roller 204 rotates, the cam 305 will push the resistance on the fixing rod 308 The plate 309 performs intermittent impact. Since the fixing rod 308 is fixed to one of the slide plates 306, and the slide plate 306 contacts the first spring 307 on the column 303, when the abutment plate 309 is separated from the cam 305, the first spring 307 resets the slide plate 306, thereby realizing the shaking of the placing bucket 304, which is beneficial to the shaking of the semiconductor inside it, so that the colloid on the semiconductor reacts comprehensively with the acid liquid inside the box 302, which is beneficial to the removal of the colloid on the semiconductor, and the removal of the colloid on the semiconductor is realized at one station. When the semiconductor inside the placing bucket 304 is taken out, the contact plate 309 is rotated so as not to interfere with the cam 305, and the first hydraulic rod 401 is further driven to realize that the hook 403 drives the slide plate 306 to rise, and then the placing bucket 304 is lifted, and the acid liquid will fall from the hole at the bottom of the placing bucket 304 to the inside of the box body 302. Further, the clamping column 313 can be pulled out from the hole on one of the slide plates 306 by wearing gloves, and the second spring 311 is contracted to continue to lift the first hydraulic rod 401, so that the slide plate 306 on the rotating shaft 310 is lifted. Continue to rise. When the height of the rotating shaft 310 exceeds the placement rod 404, the two clamping columns 313 are placed on the placement rod 404, which is convenient for taking out the semiconductor inside the placement bucket 304, and the dryer 402 is started to dry the semiconductor inside the placement bucket 304. When pickling again, the first hydraulic rod 401 is extended to realize the lowering of the hook 403, and the clamping column 313 is removed from the placement rod 404. The clamping column 313 is further clamped to the hole on the slide 306, and then the placement bucket 304 is placed inside the box 302. ;

[0046] Specifically, the dust suction mechanism 5 includes a second hydraulic rod 503, a second hydraulic rod 503 is installed on the side of the side frame 201, the end of the second hydraulic rod 503 is fixedly connected to a connecting plate 501, a dust collector 502 is installed on the end of the connecting plate 501, and a dust suction port 507 is opened in a rectangular array on the inner side of the dust collector 502, and the dust collector 502 is arranged opposite to the conveyor belt 203; the dust collector 502 also includes a third spring 504 and a pressure plate 505, the bottom of the dust collector 502 is installed with a third spring 504, and the bottom of the third spring 504 is installed with a pressure plate 505; the dust suction mechanism 5 also includes a rubber pad 506, and the bottom of the pressure plate 505 is bonded with a rubber pad 506; after the laminated substrate and semiconductor are placed on the surface of the conveyor belt 203, the first motor 202 drives the conveyor belt 203 Move toward the direction of the vacuum cleaner 502. When the semiconductor moves to the bottom of the vacuum cleaner 502, the conveyor belt 203 can stop for a while, and the second hydraulic rod 503 is started to drive the connecting plate 501 to descend, further realizing the movement of the vacuum cleaner 502 to the back side of the semiconductor. First, the rubber pad 506 presses the back side of the semiconductor. As the vacuum cleaner 502 descends, the third spring 504 contracts to press the semiconductor and the substrate. The vacuum cleaner 502 is further started to realize the suction port 507 on the inner wall of the vacuum cleaner 502 to suck air, thereby realizing the dust in the gap between the substrate and the semiconductor. It is avoided that the filling robot 6 fills the gap between the two with dust and debris, causing short circuit and open circuit. After vacuuming, the second hydraulic rod 503 is reset, and the vacuum cleaner 502 rises. Further, the rubber pad 506 no longer squeezes the semiconductor, and the two are flip-chip packaged by the filling robot 6.

[0047] Specifically, the collecting mechanism 7 includes a mounting plate 701, the end of the side frame 201 is fixedly connected with the mounting plate 701, the mounting plate 701 is located on the bottom side of the conveyor belt 203, a second motor 704 is installed at the bottom of the mounting plate 701, a turntable 702 is placed on the mounting plate 701, and storage openings 703 are equidistantly provided on the turntable 702, a slot 705 is provided at the bottom of the turntable 702, an insertion rod 706 is connected to the end of the second motor 704, and the insertion rod 706 is inserted into the inside of the slot 705; the cross-sections of the insertion rod 706 and the slot 705 are both hexagonal structures, and the storage opening 703 on the turntable 702 is a fan-shaped structure; the semiconductors after packaging are moved toward the direction of the turntable 702 as the conveyor belt 203 rotates, and fall into the inside of the storage opening 703 on the turntable 702. To collect the finished products, the second motor 704 can be used to drive the turntable 702 to rotate to collect the semiconductors individually. When the storage port 703 is full, the turntable 702 can be separated from the insertion rod 706 and replaced with a new turntable 702 for collection again. The bottom hole of the turntable 702 is convenient for placing it inside a drying device to dry the semiconductors. Multiple turntables 702 can also be stacked to dry the semiconductors without causing congestion in the workstations.

[0048] When the present invention is used, first, when performing flip-chip packaging on the substrate and the semiconductor, the two are flip-chip bonded and placed on the surface of the conveyor belt 203. The first motor 202 drives the roller 204 to rotate to realize the movement of the conveyor belt 203 in the direction of the turntable 702. When the roller 204 rotates, it has power to drive the cam 305 to rotate. Then, an acid solution to remove the colloid on the semiconductor can be added to the inside of the box 302, and the semiconductor with the colloid not removed can be placed in the inside of the placing bucket 304. As the roller 204 rotates, the cam 305 will fix the semiconductor. The abutment plate 309 on the rod 308 performs intermittent impact. Since the fixed rod 308 is fixed to one of the slide plates 306, and the slide plate 306 contacts the first spring 307 on the column 303, when the abutment plate 309 is separated from the cam 305, the first spring 307 resets the slide plate 306, thereby achieving the shaking of the placing bucket 304, which is beneficial to the shaking of the semiconductor inside it, so that the colloid on the semiconductor reacts fully with the acid liquid inside the box 302, which is beneficial to the removal of the colloid on the semiconductor, and the removal of the colloid on the semiconductor is achieved at one station. When the semiconductor inside the placing bucket 304 is to be taken out, the contact plate 309 is rotated so as not to interfere with the cam 305, and the first hydraulic rod 401 is further driven to realize that the hook 403 drives the slide plate 306 to rise, and then the placing bucket 304 is lifted, and the acid liquid will fall from the hole at the bottom of the placing bucket 304 to the inside of the box body 302, and the clamping column 313 can be further pulled out from the hole on one of the slide plates 306 by wearing gloves, and the second spring 311 is contracted to continue to lift the first hydraulic rod 401, so that the slide plate 306 on the rotating shaft 310 is lifted. 06 continues to rise. When the height of the rotating shaft 310 exceeds the placement rod 404, the two clamping columns 313 are placed on the placement rod 404, which is convenient for taking out the semiconductor inside the placement bucket 304, and the dryer 402 is started to dry the semiconductor inside the placement bucket 304. When pickling again, the first hydraulic rod 401 is extended to realize the lowering of the hook 403, and the clamping column 313 is removed from the placement rod 404. The clamping column 313 is further clamped to the hole on the slide plate 306, and then the placement bucket 304 is placed inside the box body 302.

[0049] Then, after placing the bonded substrate and semiconductor on the surface of the conveyor belt 203, the first motor 202 drives the conveyor belt 203 to move in the direction of the vacuum cleaner 502. When the semiconductor moves to the bottom of the vacuum cleaner 502, the conveyor belt 203 can stop for a period of time, and the second hydraulic rod 503 is started to drive the connecting plate 501 to descend, further realizing the movement of the vacuum cleaner 502 to the back of the semiconductor. First, the rubber pad 506 presses the back of the semiconductor. As the vacuum cleaner 502 descends, the third spring 504 contracts to press the semiconductor and the substrate. The vacuum cleaner 502 is further started to realize the suction port 507 on the inner wall of the vacuum cleaner 502 to suck air, thereby realizing the dust in the gap between the substrate and the semiconductor. It is prevented that the filling robot 6 fills the gap between the two with dust and debris, causing short circuit and open circuit. After vacuuming, the second hydraulic rod 503 is reset, and the vacuum cleaner 502 rises. Further, the rubber pad 506 no longer squeezes the semiconductor, and the two are flip-chip packaged by the filling robot 6.

[0050] Finally, the packaged semiconductor moves toward the turntable 702 as the conveyor belt 203 rotates, and falls into the inside of the receiving port 703 on the turntable 702. To collect the finished products, the turntable 702 can be driven by the second motor 704 to rotate to collect the semiconductors separately, and when the receiving port 703 is full, the turntable 702 can be separated from the insertion rod 706, and a new turntable 702 can be replaced to collect again, and the bottom hole of the turntable 702 is convenient for placing it inside the drying equipment to dry the semiconductors, and multiple turntables 702 can also be stacked to dry the semiconductors, which will not cause congestion in the workstations.

[0051] It will be apparent to those skilled in the art that the invention is not limited to the details of the exemplary embodiments described above and that the invention can be implemented in other specific forms without departing from the spirit or essential features of the invention. Therefore, the embodiments should be considered exemplary and non-limiting in all respects, and the scope of the invention is defined by the appended claims rather than the foregoing description, and it is intended that all variations falling within the meaning and scope of the equivalent elements of the claims be included in the invention. Any reference numeral in a claim should not be considered as limiting the claim to which it relates.

[0052] In addition, it should be understood that although the present specification is described according to implementation modes, not every implementation mode contains only one independent technical solution. This description of the specification is only for the sake of clarity. Those skilled in the art should regard the specification as a whole. The technical solutions in each embodiment may also be appropriately combined to form other implementation modes that can be understood by those skilled in the art.

Claims

1. A semiconductor multi-station flip chip packaging equipment, characterized in that: The invention comprises a support (1), a conveying mechanism (2) mounted on the support (1), a glue removal mechanism (3) mounted on the conveying mechanism (2), a drying mechanism (4) mounted on the glue removal mechanism (3), a dust collection mechanism (5) mounted on the conveying mechanism (2), a filling robot (6) mounted on the conveying mechanism (2), and a collecting mechanism (7) mounted at the end of the conveying mechanism (2); The conveying mechanism (2) comprises a side frame (201) fixed on the support (1), and two rollers (204) are rotatably connected to the side frame (201). The glue removal mechanism (3) comprises a cam (305), and one end of the rollers (204) is fixedly connected to the cam (305). The side wall of the support (1) is fixedly connected to a bottom plate (301), and a box (302) is installed on the bottom plate (301). Four columns (303) are fixed in a rectangular array inside the box (302), and two columns (303) on the same side are slidably connected to a slide plate (306), and one of the slide plates (306) is rotatably connected to a bottom opening via two rotating shafts (310). The placing bucket (304) is provided with a first spring (307) between the two slide plates (306) and the box body (302). Two clamping columns (313) are relatively slidably connected inside the placing bucket (304). A second spring (311) is clamped between the two clamping columns (313) and the placing bucket (304). The two clamping columns (313) are engaged with holes on another slide plate (306). A fixing rod (308) is fixedly connected to the slide plate (306) with the hole. A contact plate (309) is fixedly connected to the fixing rod (308) by screws. The contact plate (309) contacts the cam (305). The filling robot (6) is installed on the side frame (201).

2. The semiconductor multi-station flip chip packaging equipment according to claim 1, characterized in that: The conveying mechanism (2) further comprises a conveying belt (203), the conveying belt (203) being wound around the two roller shafts (204), a first motor (202) being mounted on the side frame (201), and the first motor (202) being connected to the roller shaft (204) on the side facing away from the box body (302).

3. The semiconductor multi-station flip chip packaging equipment according to claim 1, characterized in that: The lengths of the four columns (303) are equal, and the distance between the two slide plates (306) located on the two groups of columns (303) is greater than the length of the placement bucket (304).

4. The semiconductor multi-station flip chip packaging equipment according to claim 1, characterized in that: The drying mechanism (4) comprises a first hydraulic rod (401), wherein the first hydraulic rod (401) is installed between two upright posts (303), a hook (403) is connected to the end of the first hydraulic rod (401), one end of the hook (403) extends to the bottom of the slide plate (306), and a placement rod (404) is fixedly connected between the two upright posts (303) at one end away from the first hydraulic rod (401).

5. The semiconductor multi-station flip chip packaging equipment according to claim 4, characterized in that: The drying mechanism (4) further comprises a drying machine (402), the drying machine (402) being installed between the four upright posts (303), and the cross section of the hook (403) being an L-shaped structure.

6. The semiconductor multi-station flip chip packaging equipment according to claim 2, characterized in that: The dust suction mechanism (5) comprises a second hydraulic rod (503), the second hydraulic rod (503) is installed on the side of the side frame (201), the end of the second hydraulic rod (503) is fixedly connected to a connecting plate (501), the end of the connecting plate (501) is installed with a dust collector (502), the inner side of the dust collector (502) is provided with dust suction ports (507) in a rectangular array, and the dust collector (502) is arranged opposite to the conveyor belt (203).

7. The semiconductor multi-station flip chip packaging equipment according to claim 6, characterized in that: The vacuum cleaner (502) further comprises a third spring (504) and a pressure plate (505); the third spring (504) is installed at the bottom of the vacuum cleaner (502), and the pressure plate (505) is installed at the bottom of the third spring (504).

8. The semiconductor multi-station flip chip packaging equipment according to claim 7, characterized in that: The dust suction mechanism (5) further comprises a rubber pad (506), and the rubber pad (506) is bonded to the bottom of the pressing plate (505).

9. The semiconductor multi-station flip chip packaging equipment according to claim 1, characterized in that: The collecting mechanism (7) comprises a mounting plate (701), the end of the side frame (201) is fixedly connected to the mounting plate (701), the mounting plate (701) is located on the bottom side of the conveyor belt (203), a second motor (704) is installed at the bottom of the mounting plate (701), a turntable (702) is placed on the mounting plate (701), the turntable (702) is provided with receiving openings (703) at equal intervals, a slot (705) is provided at the bottom of the turntable (702), and an insertion rod (706) is connected to the end of the second motor (704), and the insertion rod (706) is inserted into the inside of the slot (705).

10. The semiconductor multi-station flip chip packaging equipment according to claim 9, characterized in that: The cross sections of the insertion rod (706) and the slot (705) are both hexagonal structures, and the storage opening (703) on the rotating disk (702) is fan-shaped.

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