COB light source and lamp

By using blue and red LED chip combinations of different peak wavelengths in COB light sources, green and red phosphors are excited, and the problems of blue light hazard and low red light saturation are solved, achieving smoother blue light band radiation and higher Red light saturation enhances the effect on wound repair and cell regeneration.

CN119181757AActive Publication Date: 2024-12-24SHENZHEN TONGYIFANG OPTOELECTRONIC TECH CO LTD

Patent Information

Application Number
CN202411324709.7
Authority / Receiving Office
CN · China
Patent Type
Applications(China)
Current Assignee / Owner
Filing Date
2024-09-23
Publication Date
2024-12-24
Estimated Expiration
2044-09-23

AI Technical Summary

Technical Problem

The existing COB light sources have problems such as high blue light damage and low red light saturation, which limits their application range.

Method used

The formed fluorescent glue layer is encapsulated on the substrate by combining blue and red LED chips with different peak wavelengths to stimulate green and red phosphors to reduce the Blue light radiates power and increases red light saturation.

Benefits of technology

It effectively reduces the harm of blue light, improves the radiation power and saturation of the red light band, enhances the effect on wound repair and cell regeneration, and has better spectral continuity and higher color rendering index.

✦ Generated by Eureka AI based on patent content.

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Abstract

The invention provides a COB light source and a lamp, and relates to the technical field of LED packaging. The COB light source comprises a substrate, a fluorescent glue layer and an LED chip set. The fluorescent glue layer is arranged on the substrate, and the components of the fluorescent glue layer comprise silica gel, green fluorescent powder and red fluorescent powder; the LED chip set is arranged on the substrate and packaged in the fluorescent glue layer, and the LED chip set comprises a first short-wave blue light chip, a second short-wave blue light chip, a first long-wave blue light chip, a second long-wave blue light chip, a first red light chip, a second red light chip and a third red light chip. The relative radiation power of the spectrum of the COB light source in the blue light band is lower, and the spectrum curve of the blue light band is smoother, so that the harm of blue light can be effectively reduced; compared with the prior art, the composite material has higher saturation in the red light band, and has enough high relative radiation power in the red light band of 600-780nm, so that the effects of enhancing wound repair and promoting cell regeneration can be achieved.
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Description

Technical Field

[0001] The present invention relates to the technical field of LED packaging, and in particular to a COB light source and a lamp. Background Art

[0002] COB (chip-on-board) technology is an emerging LED packaging technology that integrates light-emitting chips into PCB boards, effectively improving the light color of LED display screens while reducing risks and costs.

[0003] However, existing COB light sources have problems such as high blue light hazards and low red light saturation, which limits their application. Summary of the invention

[0004] In order to solve the problems existing in the prior art, one of the objectives of the present invention is to provide a COB light source.

[0005] The present invention provides the following technical solutions:

[0006] A COB light source, comprising:

[0007] substrate;

[0008] A fluorescent adhesive layer is disposed on the substrate, wherein the components of the fluorescent adhesive layer include silica gel, green fluorescent powder and red fluorescent powder; and

[0009] An LED chipset is disposed on the substrate and encapsulated in the fluorescent glue layer, wherein the LED chipset includes a first short-wave blue light chip, a second short-wave blue light chip, a first long-wave blue light chip, a second long-wave blue light chip, a first red light chip, a second red light chip, and a third red light chip;

[0010] Among them, the peak wavelengths of the first short-wave blue light chip and the second short-wave blue light chip are different, the peak wavelengths of the first long-wave blue light chip and the second long-wave blue light chip are different, and the peak wavelengths of the first red light chip, the second red light chip and the third red light chip are different.

[0011] As a further optional solution for the COB light source, the peak wavelength of the first short-wave blue light chip is λ1, 437.5nm≤λ1≤440nm;

[0012] The peak wavelength of the second short-wave blue light chip is λ2, 447.5nm≤λ2≤450nm;

[0013] The peak wavelength of the first long-wave blue light chip is λ3, 457.5nm≤λ3≤460nm;

[0014] The peak wavelength of the second long-wave blue light chip is λ4, 467.5nm≤λ4≤470nm;

[0015] The peak wavelength of the first red light chip is λ5, 700nm≤λ5≤720nm;

[0016] The peak wavelength of the second red light chip is λ6, 730nm≤λ6≤750nm;

[0017] The peak wavelength of the third red light chip is λ7, 760nm≤λ7≤780nm.

[0018] As a further optional solution for the COB light source, the number ratio of the first short-wave blue light chip, the second short-wave blue light chip, the first long-wave blue light chip and the second long-wave blue light chip is 2:2:3:3.

[0019] As a further optional scheme for the COB light source, the ratio of the sum of the number of the first short-wave blue light chip, the second short-wave blue light chip, the first long-wave blue light chip and the second long-wave blue light chip to the sum of the number of the first red light chip, the second red light chip and the third red light chip is 10:3.

[0020] As a further optional solution for the COB light source, any two of the first short-wave blue light chips are not adjacent to each other, any two of the second short-wave blue light chips are not adjacent to each other, any two of the first long-wave blue light chips are not adjacent to each other, and any two of the second long-wave blue light chips are not adjacent to each other;

[0021] The first red light chip, the second red light chip and the third red light chip are evenly distributed among the first short-wave blue light chip, the second short-wave blue light chip, the first long-wave blue light chip and the second long-wave blue light chip according to the light-emitting area.

[0022] As a further optional solution for the COB light source, the weight ratio of the silica gel, the green phosphor and the red phosphor in the fluorescent glue layer is 1:(1.33-2.35):(0.173-0.365).

[0023] As a further optional solution for the COB light source, the weight ratio of silica gel, green phosphor and red phosphor in the fluorescent glue layer is 1:2.35:0.365; or

[0024] The weight ratio of silica gel, green phosphor and red phosphor in the fluorescent glue layer is 1:1.8:0.264; or

[0025] The components of the fluorescent glue layer further include blue-green fluorescent powder, and the weight ratio of silica gel, green fluorescent powder, blue-green fluorescent powder and red fluorescent powder in the fluorescent glue layer is 1:1.76:0.1:0.242; or

[0026] The components of the fluorescent glue layer also include blue-green fluorescent powder. The weight ratio of silica gel, green fluorescent powder, blue-green fluorescent powder and red fluorescent powder in the fluorescent glue layer is 1:1.33:0.167:0.173.

[0027] As a further optional solution for the COB light source, the peak wavelength of the green phosphor in the fluorescent glue layer is 540 nm.

[0028] As a further optional solution for the COB light source, the peak wavelength of the red phosphor in the fluorescent glue layer is 655 nm.

[0029] Another object of the present invention is to provide a lamp.

[0030] The present invention provides the following technical solutions:

[0031] A lamp comprises the above-mentioned COB light source.

[0032] The embodiments of the present invention have the following beneficial effects:

[0033] In the above COB light source, the first short-wave blue light chip, the second short-wave blue light chip, the first long-wave blue light chip, the second long-wave blue light chip, the first red light chip, the second red light chip and the third red light chip with different peak wavelengths are encapsulated on the substrate by a fluorescent glue composed of silica gel, green phosphor and red phosphor, and excite the green phosphor and the red phosphor when in use. On the one hand, the spectrum formed by the LED chipset exciting the green phosphor and the red phosphor has a lower relative radiation power in the blue light band, and the spectrum curve in the blue light band is smoother and has better continuity, thereby effectively reducing the hazards of blue light. On the other hand, the spectrum formed by the LED chipset exciting the green phosphor and the red phosphor has a higher saturation and better continuity in the red light band, and has a sufficiently high relative radiation power in the 600-780nm red light band, thereby enhancing the effect of wound repair and promoting cell regeneration.

[0034] In order to make the above-mentioned objects, features and advantages of the present invention more obvious and understandable, preferred embodiments are given below and described in detail with reference to the accompanying drawings. BRIEF DESCRIPTION OF THE DRAWINGS

[0035] In order to more clearly illustrate the technical solutions of the embodiments of the present invention, the drawings required for use in the embodiments are briefly introduced below. It should be understood that the following drawings only show certain embodiments of the present invention and therefore should not be regarded as limiting the scope. For ordinary technicians in this field, other related drawings can be obtained based on these drawings without creative work.

[0036] Figure 1 The overall structure diagram of a COB light source provided by an embodiment of the present invention is shown;

[0037] Figure 2 A schematic diagram of a spectrum curve of a COB light source provided by Embodiment 1 of the present invention is shown;

[0038] Figure 3 A schematic diagram of a spectrum curve of a COB light source provided by Embodiment 2 of the present invention is shown;

[0039] Figure 4 A schematic diagram of a spectrum curve of a COB light source provided by Embodiment 3 of the present invention is shown;

[0040] Figure 5 A schematic diagram of a spectrum curve of a COB light source provided by Embodiment 4 of the present invention is shown;

[0041] Figure 6 A schematic diagram of a spectrum curve of a COB light source provided in Comparative Example 1 of the present invention is shown.

[0042] Description of main component symbols:

[0043] 100-substrate; 200-fluorescent adhesive layer; 300-LED chipset; 310-first short-wave blue light chip; 320-second short-wave blue light chip; 330-first long-wave blue light chip; 340-second long-wave blue light chip; 350-first red light chip; 360-second red light chip; 370-third red light chip; 400-dam. DETAILED DESCRIPTION

[0044] Embodiments of the present invention are described in detail below, examples of which are shown in the accompanying drawings, wherein the same or similar reference numerals throughout represent the same or similar elements or elements having the same or similar functions. The embodiments described below with reference to the accompanying drawings are exemplary and are only used to explain the present invention, and cannot be understood as limiting the present invention.

[0045] It should be noted that when an element is referred to as being "fixed to" another element, it may be directly on the other element or there may be a central element. When an element is considered to be "connected to" another element, it may be directly connected to the other element or there may be a central element at the same time. In contrast, when an element is referred to as being "directly on" another element, there is no intermediate element. The terms "vertical", "horizontal", "left", "right" and similar expressions used herein are for illustrative purposes only.

[0046] In the present invention, unless otherwise clearly specified and limited, the terms "installed", "connected", "connected", "fixed" and the like should be understood in a broad sense, for example, it can be a fixed connection, a detachable connection, or an integral connection; it can be a mechanical connection or an electrical connection; it can be a direct connection or an indirect connection through an intermediate medium, it can be the internal connection of two elements or the interaction relationship between two elements. For ordinary technicians in this field, the specific meanings of the above terms in the present invention can be understood according to specific circumstances.

[0047] In addition, the terms "first" and "second" are used for descriptive purposes only and should not be understood as indicating or implying relative importance or implicitly indicating the number of the indicated technical features. Therefore, the features defined as "first" and "second" may explicitly or implicitly include one or more of the features. In the description of the present invention, the meaning of "plurality" is two or more, unless otherwise clearly and specifically defined.

[0048] Unless otherwise defined, all technical and scientific terms used herein have the same meaning as those commonly understood by those skilled in the art to which this application belongs. The terms used herein in the specification of the template are only for the purpose of describing specific embodiments and are not intended to limit the present invention. The term "and / or" used herein includes any and all combinations of one or more of the related listed items.

[0049] See also Figure 1 This embodiment provides a COB light source, specifically a healthy light COB light source with improved spectral continuity. The COB light source includes a substrate 100, a fluorescent glue layer 200 and an LED chipset 300.

[0050] The fluorescent adhesive layer 200 is disposed on the substrate 100 , and components of the fluorescent adhesive layer 200 include silica gel, green fluorescent powder and red fluorescent powder.

[0051] The LED chipset 300 is disposed on the substrate 100 and packaged in the fluorescent glue layer 200. The LED chipset 300 includes a first short-wave blue chip 310, a second short-wave blue chip 320, a first long-wave blue chip 330, a second long-wave blue chip 340, a first red chip 350, a second red chip 360 and a third red chip 370.

[0052] Among them, the peak wavelengths of the first short-wave blue light chip 310 and the second short-wave blue light chip 320 are different, the peak wavelengths of the first long-wave blue light chip 330 and the second long-wave blue light chip 340 are different, and the peak wavelengths of the first red light chip 350, the second red light chip 360 and the third red light chip 370 are different.

[0053] In the above-mentioned COB light source, the first short-wave blue light chip 310, the second short-wave blue light chip 320, the first long-wave blue light chip 330, the second long-wave blue light chip 340, the first red light chip 350, the second red light chip 360 and the third red light chip 370 with different peak wavelengths are encapsulated on the substrate 100 by a fluorescent glue composed of silica gel, green phosphor and red phosphor, and the green phosphor and the red phosphor are excited when in use.

[0054] On the one hand, the spectrum formed by the LED chipset 300 exciting the green phosphor and the red phosphor has a lower relative radiation power in the blue light band, and the spectrum curve in the blue light band is smoother and has better continuity, thereby effectively reducing the blue light hazard.

[0055] On the other hand, the spectrum formed by the LED chipset 300 exciting the green phosphor and the red phosphor has a higher saturation and better continuity in the red light band, and has a sufficiently high relative radiation power in the 600-780nm red light band, thereby enhancing the effect of wound repair and promoting cell regeneration.

[0056] Specifically, the substrate 100 is an aluminum substrate 100, and a ring-shaped dam 400 is disposed on the substrate 100, and a packaging area is formed inside the dam 400. The LED chipset 300 is located in the packaging area, and the fluorescent glue layer 200 fills the packaging area to encapsulate the LED chipset 300 therein.

[0057] In some embodiments, the weight ratio of silica gel, green phosphor and red phosphor in the phosphor layer 200 is 1:(1.33-2.35):(0.173-0.365).

[0058] Furthermore, the peak wavelength of the green phosphor in the phosphor glue layer 200 is 540 nm.

[0059] Optionally, the green phosphor used in this embodiment is BH540A.

[0060] Furthermore, the peak wavelength of the red phosphor in the phosphor glue layer 200 is 655 nm.

[0061] Optionally, the red phosphor used in this embodiment is BR655-A.

[0062] In some embodiments, the phosphor glue layer 200 further includes anti-precipitation powder DM-30 to prevent the green phosphor and the red phosphor from precipitating and make the green phosphor and the red phosphor evenly distributed.

[0063] In some embodiments, the number ratio of the first short-wave blue light chip 310 , the second short-wave blue light chip 320 , the first long-wave blue light chip 330 , and the second long-wave blue light chip 340 is 2:2:3:3.

[0064] Further, the ratio of the sum of the first short-wave blue light chip 310 , the second short-wave blue light chip 320 , the first long-wave blue light chip 330 and the second long-wave blue light chip 340 to the sum of the first red light chip 350 , the second red light chip 360 and the third red light chip 370 is 10:3.

[0065] Specifically, the number ratio of the first shortwave blue light chip 310 , the second shortwave blue light chip 320 , the first longwave blue light chip 330 , the second longwave blue light chip 340 , the first red light chip 350 , the second red light chip 360 and the third red light chip 370 is 2:2:3:3:1:1:1.

[0066] In some embodiments, any two first short-wave blue light chips 310 are not adjacent to each other, any two second short-wave blue light chips 320 are not adjacent to each other, any two first long-wave blue light chips 330 are not adjacent to each other, and any two second long-wave blue light chips 340 are not adjacent to each other.

[0067] In addition, the first red light chip 350 , the second red light chip 360 and the third red light chip 370 are evenly distributed among the first short-wave blue light chip 310 , the second short-wave blue light chip 320 , the first long-wave blue light chip 330 and the second long-wave blue light chip 340 according to the light emitting area.

[0068] Specifically, the first short-wave blue light chip 310 , the second short-wave blue light chip 320 , the first long-wave blue light chip 330 , and the second long-wave blue light chip 340 are alternately arranged in the vertical direction.

[0069] Among them, the first short-wave blue light chip 310, the second short-wave blue light chip 320, the first long-wave blue light chip 330 and the second long-wave blue light chip 340 are in a positive structure, and the first red light chip 350, the second red light chip 360 and the third red light chip 370 are in a positive vertical structure.

[0070] In addition, the first short-wave blue light chip 310 , the second short-wave blue light chip 320 , the first long-wave blue light chip 330 , the second long-wave blue light chip 340 , the first red light chip 350 , the second red light chip 360 and the third red light chip 370 are connected in 13 series and 2 parallel.

[0071] In some embodiments, the peak wavelength of the first short-wave blue light chip 310 is λ1, satisfying 437.5nm≤λ1≤440nm. The peak wavelength of the second short-wave blue light chip 320 is λ2, satisfying 447.5nm≤λ2≤450nm. The peak wavelength of the first long-wave blue light chip 330 is λ3, satisfying 457.5nm≤λ3≤460nm. The peak wavelength of the second long-wave blue light chip 340 is λ4, satisfying 467.5nm≤λ4≤470nm. The peak wavelength of the first red light chip 350 is λ5, satisfying 700nm≤λ5≤720nm. The peak wavelength of the second red light chip 360 is λ6, satisfying 730nm≤λ6≤750nm. The peak wavelength of the third red light chip 370 is λ7, satisfying 760nm≤λ7≤780nm.

[0072] In short, the relative radiation power of the spectrum of the above COB light source in the blue light band is lower, and the spectrum curve in the blue light band is smoother and more continuous, which can effectively reduce the blue light hazard. At the same time, the spectrum of the above COB light source has a higher saturation and better continuity in the red light band, and has a sufficiently high relative radiation power in the 600-780nm red light band, which can enhance the effect of wound repair and promote cell regeneration.

[0073] Among them, 620nm red light can promote osteoblast proliferation and differentiation; 633nm red light can effectively enhance the activity of skin collagen cells; 640nm red light can promote wound healing; 650nm red light matches the light absorption peak of cell mitochondria, which can enhance cell function and promote metabolism; 660nm red light can enhance the migration ability of bone marrow mesenchymal stem cells, thereby preventing leukemia; 670nm red light can promote the metabolism of the cortex layer, which is beneficial to deep cell repair; 683nm red light matches the light absorption peak of hair follicle cells, which can promote hair regeneration and maintain a youthful state; 690nm red light can promote cell regeneration.

[0074] In addition, the COB light source uses a variety of blue light band chips and a variety of red light band chips to excite two kinds of phosphors. Compared with the conventional spectrum, its spectrum has the advantages of good continuity, high color temperature and low blue light, and high color reproduction. The chips and phosphors used have good matching in light efficiency and stability, and the reliability of the light source is good. The COB light source uses the peak wavelength phosphor in conjunction with the chip combination, and its spectrum is closer to the solar spectrum, with a higher color rendering index.

[0075] This embodiment also provides a lamp, including the above-mentioned COB light source.

[0076] Example 1

[0077] The present embodiment provides a COB light source with a power of 12W, including a substrate 100, a dam 400, a fluorescent glue layer 200 and an LED chipset 300. The dam 400 is arranged on the substrate 100 to surround and form a packaging area. The LED chipset 300 is located in the packaging area, and the fluorescent glue layer 200 fills the packaging area to encapsulate the LED chipset 300. Among them, the fluorescent glue layer 200 is composed of silica gel, green phosphor and red phosphor, and the weight ratio of silica gel, green phosphor and red phosphor is 1:2.35:0.365. The green phosphor used is BH540A, and the peak wavelength is 540nm. The red phosphor used is BR655-A, and the peak wavelength is 655nm. In addition, the LED chipset 300 is composed of a first short-wave blue light chip 310, a second short-wave blue light chip 320, a first long-wave blue light chip 330, a second long-wave blue light chip 340, a first red light chip 350, a second red light chip 360 and a third red light chip 370 in a quantity ratio of 2:2:3:3:1:1:1. The peak wavelength of the first short-wave blue light chip 310 is 437.5nm-440nm, the peak wavelength of the second short-wave blue light chip 320 is 447.5nm-450nm, the peak wavelength of the first long-wave blue light chip 330 is 457.5nm-460nm, the peak wavelength of the second long-wave blue light chip 340 is 467.5nm-470nm, the peak wavelength of the first red light chip 350 is 700nm-720nm, the peak wavelength of the second red light chip 360 is 730nm-750nm, and the peak wavelength of the third red light chip 370 is 760nm-780nm.

[0078] The spectral color temperature of the COB light source in this embodiment is Tc=2744k, the color rendering index is Ra=98.2, the color fidelity is Rf=97.3, and the color saturation is Rg=101.99. Its spectral curve is as follows: Figure 2 shown.

[0079] Example 2

[0080] The present embodiment provides a COB light source with a power of 12W, including a substrate 100, a dam 400, a fluorescent glue layer 200 and an LED chipset 300. The dam 400 is arranged on the substrate 100 to surround and form a packaging area. The LED chipset 300 is located in the packaging area, and the fluorescent glue layer 200 fills the packaging area to encapsulate the LED chipset 300. Among them, the fluorescent glue layer 200 is composed of silica gel, green phosphor and red phosphor, and the weight ratio of silica gel, green phosphor and red phosphor is 1:1.8:0.264. The green phosphor used is BH540A, and the peak wavelength is 540nm. The red phosphor used is BR655-A, and the peak wavelength is 655nm. In addition, the LED chipset 300 is composed of a first short-wave blue light chip 310, a second short-wave blue light chip 320, a first long-wave blue light chip 330, a second long-wave blue light chip 340, a first red light chip 350, a second red light chip 360 and a third red light chip 370 in a quantity ratio of 2:2:3:3:1:1:1. The peak wavelength of the first short-wave blue light chip 310 is 437.5nm-440nm, the peak wavelength of the second short-wave blue light chip 320 is 447.5nm-450nm, the peak wavelength of the first long-wave blue light chip 330 is 457.5nm-460nm, the peak wavelength of the second long-wave blue light chip 340 is 467.5nm-470nm, the peak wavelength of the first red light chip 350 is 700nm-720nm, the peak wavelength of the second red light chip 360 is 730nm-750nm, and the peak wavelength of the third red light chip 370 is 760nm-780nm.

[0081] The spectral color temperature of the COB light source in this embodiment is Tc=3066k, the color rendering index is Ra=97.7, the color fidelity is Rf=97.06, and the color saturation is Rg=101.74. Its spectral curve is as follows: Figure 3 shown.

[0082] Example 3

[0083] The present embodiment provides a COB light source with a power of 12W, including a substrate 100, a dam 400, a fluorescent glue layer 200 and an LED chipset 300. The dam 400 is arranged on the substrate 100 to surround and form a packaging area. The LED chipset 300 is located in the packaging area, and the fluorescent glue layer 200 fills the packaging area to encapsulate the LED chipset 300. Among them, the fluorescent glue layer 200 is composed of silica gel, green phosphor, blue-green phosphor and red phosphor, and the weight ratio of silica gel, green phosphor, blue-green phosphor and red phosphor is 1:1.76:0.1:0.242. The green phosphor used is BH540A, and the peak wavelength is 540nm. The peak wavelength of the blue-green phosphor used is 496nm. The red phosphor used is BR655-A, and the peak wavelength is 655nm. In addition, the LED chipset 300 is composed of a first short-wave blue light chip 310, a second short-wave blue light chip 320, a first long-wave blue light chip 330, a second long-wave blue light chip 340, a first red light chip 350, a second red light chip 360 and a third red light chip 370 in a quantity ratio of 2:2:3:3:1:1:1. The peak wavelength of the first short-wave blue light chip 310 is 437.5nm-440nm, the peak wavelength of the second short-wave blue light chip 320 is 447.5nm-450nm, the peak wavelength of the first long-wave blue light chip 330 is 457.5nm-460nm, the peak wavelength of the second long-wave blue light chip 340 is 467.5nm-470nm, the peak wavelength of the first red light chip 350 is 700nm-720nm, the peak wavelength of the second red light chip 360 is 730nm-750nm, and the peak wavelength of the third red light chip 370 is 760nm-780nm.

[0084] The spectral color temperature of the COB light source in this embodiment is Tc=3484k, the color rendering index is Ra=97.6, the color fidelity is Rf=97.46, and the color saturation is Rg=100.67. Its spectral curve is as follows: Figure 4 shown.

[0085] Example 4

[0086] The present embodiment provides a COB light source with a power of 12W, including a substrate 100, a dam 400, a fluorescent glue layer 200 and an LED chipset 300. The dam 400 is arranged on the substrate 100 to surround and form a packaging area. The LED chipset 300 is located in the packaging area, and the fluorescent glue layer 200 fills the packaging area to encapsulate the LED chipset 300. Among them, the fluorescent glue layer 200 is composed of silica gel, green phosphor, blue-green phosphor and red phosphor, and the weight ratio of silica gel, green phosphor, blue-green phosphor and red phosphor is 1:1.33:0.167:0.173. The green phosphor used is BH540A, and the peak wavelength is 540nm. The peak wavelength of the blue-green phosphor used is 496nm. The red phosphor used is BR655-A, and the peak wavelength is 655nm. In addition, the LED chipset 300 is composed of a first short-wave blue light chip 310, a second short-wave blue light chip 320, a first long-wave blue light chip 330, a second long-wave blue light chip 340, a first red light chip 350, a second red light chip 360 and a third red light chip 370 in a quantity ratio of 2:2:3:3:1:1:1. The peak wavelength of the first short-wave blue light chip 310 is 437.5nm-440nm, the peak wavelength of the second short-wave blue light chip 320 is 447.5nm-450nm, the peak wavelength of the first long-wave blue light chip 330 is 457.5nm-460nm, the peak wavelength of the second long-wave blue light chip 340 is 467.5nm-470nm, the peak wavelength of the first red light chip 350 is 700nm-720nm, the peak wavelength of the second red light chip 360 is 730nm-750nm, and the peak wavelength of the third red light chip 370 is 760nm-780nm.

[0087] The spectral color temperature of the COB light source in this embodiment is Tc=3998k, the color rendering index is Ra=98.7, the color fidelity is Rf=97.55, and the color saturation is Rg=101.06. Its spectral curve is as follows: Figure 5 shown.

[0088] Comparative Example 1

[0089] The present embodiment provides a COB light source with a power of 12W, including a substrate 100, a dam 400, a fluorescent glue layer 200 and an LED chipset 300. The dam 400 is arranged on the substrate 100 to surround and form a packaging area. The LED chipset 300 is located in the packaging area, and the fluorescent glue layer 200 fills the packaging area to encapsulate the LED chipset 300. Among them, the fluorescent glue layer 200 is composed of silica gel, green phosphor, blue-green phosphor and red phosphor, and the weight ratio of silica gel, green phosphor, blue-green phosphor and red phosphor is 1:1.33:0.167:0.173. The green phosphor used is BH540A, and the peak wavelength is 540nm. The peak wavelength of the blue-green phosphor used is 496nm. The red phosphor used is BR655-A, and the peak wavelength is 655nm. In addition, the LED chipset 300 is composed of a first short-wave blue light chip 310, a second short-wave blue light chip 320, a first long-wave blue light chip 330, a second long-wave blue light chip 340, a first red light chip 350, a second red light chip 360 and a third red light chip 370 in a quantity ratio of 2:2:3:3:1:1:1. The peak wavelength of the first short-wave blue light chip 310 is 437.5nm-442.5nm, the peak wavelength of the second short-wave blue light chip 320 is 447.5nm-452.5nm, the peak wavelength of the first long-wave blue light chip 330 is 457.5nm-462.5nm, the peak wavelength of the second long-wave blue light chip 340 is 467.5nm-472.5nm, the peak wavelength of the first red light chip 350 is 660nm-670nm, the peak wavelength of the second red light chip 360 is 700nm-710nm, and the peak wavelength of the third red light chip 370 is 730nm-740nm.

[0090] The spectral color temperature of the COB light source in this embodiment is Tc=4031k, the color rendering index is Ra=98.3, the color fidelity is Rf=96.7, and the color saturation is Rg=99.3. Its spectral curve is as follows: Figure 6 shown.

[0091] By comparing Example 1 with Comparative Example 1, it can be seen that the spectrum formed by selecting a first short-wave blue light chip 310 with a peak wavelength of 437.5nm-440nm, a second short-wave blue light chip 320 with a peak wavelength of 447.5nm-450nm, a first long-wave blue light chip 330 with a peak wavelength of 457.5nm-460nm, a second long-wave blue light chip 340 with a peak wavelength of 467.5nm-470nm, a first red light chip 350 with a peak wavelength of 700nm-720nm, a second red light chip 360 with a peak wavelength of 730nm-750nm and a third red light chip 370 with a peak wavelength of 760nm-780nm, the spectral curves in the blue light band and the red light band are smoother and have better continuity.

[0092] In contrast, the spectra formed by chips with other peak wavelengths have obvious fluctuations in the spectral curves of the blue light band and the red light band, and have poor continuity.

[0093] In all examples shown and described herein, any specific values ​​should be interpreted as merely exemplary and not as limiting, and thus other examples of the exemplary embodiments may have different values.

[0094] It should be noted that similar reference numerals and letters denote similar items in the following drawings, and therefore, once an item is defined in one drawing, further definition and explanation thereof is not required in subsequent drawings.

[0095] The above-mentioned embodiments only express several implementation methods of the present invention, and the description thereof is relatively specific and detailed, but it cannot be understood as limiting the scope of the present invention. It should be pointed out that for ordinary technicians in this field, several modifications and improvements can be made without departing from the concept of the present invention, which all belong to the protection scope of the present invention.

Claims

1. A COB light source, characterized in that: include: substrate; A fluorescent adhesive layer is disposed on the substrate, wherein the components of the fluorescent adhesive layer include silica gel, green fluorescent powder and red fluorescent powder; and An LED chipset is disposed on the substrate and encapsulated in the fluorescent glue layer, wherein the LED chipset includes a first short-wave blue light chip, a second short-wave blue light chip, a first long-wave blue light chip, a second long-wave blue light chip, a first red light chip, a second red light chip, and a third red light chip; Among them, the peak wavelengths of the first short-wave blue light chip and the second short-wave blue light chip are different, the peak wavelengths of the first long-wave blue light chip and the second long-wave blue light chip are different, and the peak wavelengths of the first red light chip, the second red light chip and the third red light chip are different.

2. The COB light source according to claim 1, characterized in that: The peak wavelength of the first short-wave blue light chip is λ1, 437.5nm≤λ1≤440nm; The peak wavelength of the second short-wave blue light chip is λ2, 447.5nm≤λ2≤450nm; The peak wavelength of the first long-wave blue light chip is λ3, 457.5nm≤λ3≤460nm; The peak wavelength of the second long-wave blue light chip is λ4, 467.5nm≤λ4≤470nm; The peak wavelength of the first red light chip is λ5, 700nm≤λ5≤720nm; The peak wavelength of the second red light chip is λ6, 730nm≤λ6≤750nm; The peak wavelength of the third red light chip is λ7, 760nm≤λ7≤780nm.

3. The COB light source according to claim 1, characterized in that: The number ratio of the first short-wave blue light chip, the second short-wave blue light chip, the first long-wave blue light chip and the second long-wave blue light chip is 2:2:3:

3.

4. The COB light source according to claim 3, characterized in that: The ratio of the sum of the number of the first short-wave blue light chip, the second short-wave blue light chip, the first long-wave blue light chip and the second long-wave blue light chip to the sum of the number of the first red light chip, the second red light chip and the third red light chip is 10:

3.

5. The COB light source according to claim 4, characterized in that: Any two of the first short-wave blue light chips are not adjacent to each other, any two of the second short-wave blue light chips are not adjacent to each other, any two of the first long-wave blue light chips are not adjacent to each other, and any two of the second long-wave blue light chips are not adjacent to each other; The first red light chip, the second red light chip and the third red light chip are evenly distributed among the first short-wave blue light chip, the second short-wave blue light chip, the first long-wave blue light chip and the second long-wave blue light chip according to the light-emitting area.

6. The COB light source according to claim 1, characterized in that: The weight ratio of silica gel, green phosphor and red phosphor in the fluorescent glue layer is 1:(1.33-2.35):(0.173-0.365).

7. The COB light source according to claim 6, characterized in that: The weight ratio of silica gel, green phosphor and red phosphor in the fluorescent glue layer is 1:2.35:0.365; or The weight ratio of silica gel, green phosphor and red phosphor in the fluorescent glue layer is 1:1.8:0.264; or The components of the fluorescent glue layer further include blue-green fluorescent powder, and the weight ratio of silica gel, green fluorescent powder, blue-green fluorescent powder and red fluorescent powder in the fluorescent glue layer is 1:1.76:0.1:0.242; or The components of the fluorescent glue layer also include blue-green fluorescent powder. The weight ratio of silica gel, green fluorescent powder, blue-green fluorescent powder and red fluorescent powder in the fluorescent glue layer is 1:1.33:0.167:0.

173.

8. The COB light source according to claim 1, characterized in that: The peak wavelength of the green phosphor in the phosphor glue layer is 540 nm.

9. The COB light source according to claim 1, characterized in that: The peak wavelength of the red phosphor in the phosphor glue layer is 655 nm.

10. A lamp, characterized in that: The COB light source comprises the COB light source described in any one of claims 1 to 9.

Citation Information

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