Electronic device with antenna module

Abstract

An antenna module implemented as a multi-layer package includes: a PCB including a plurality of layers; an array antenna unit including a plurality of antenna elements disposed on the PCB; the radio frequency integrated circuit chip is an RFIC (Radio Frequency Integrated Circuit) chip and is jointed on the second surface of the PCB, and the second surface is the other outermost contour surface of the PCB; and a plurality of signal connection lines configured so as to be connected from the RFIC chip to the array antenna unit. The length of the plurality of signal connection lines is the length of the connection between the RFIC chip and the array antenna part, and the plurality of signal connection lines may be the same in length.

Description

Technical Field

[0001] The present invention relates to an electronic device, and more particularly to an electronic device with an antenna module for wirelessly receiving data. Background Art

[0002] As image technology changes from analog to digital, in order to provide images that are closer to the actual screen, it has developed from SD (Standard-Definition) to HD (Hi-Definition). SD supports a resolution of 704×480 and is composed of about 350,000 pixels. HD is divided into HD and Full HD (Full HD). Among them, Full HD, which supports a higher resolution, supports a resolution of 1920×1080 and is composed of 2 million pixels. Therefore, compared with the above SD, it provides significantly higher quality images.

[0003] Image technology in recent years has surpassed Full HD and further grown into UHD (Ultra High-Definition), which has attracted much attention as a new generation of media environment that supports ultra-high image quality and ultra-high resolution. UHD supports 4K (3840×2160) and 8K (7680×4320) resolutions, as well as surround audio with a maximum of 22.2 channels. As described above, UHD provides four times clearer image quality than HD, even with 4K UHD as the benchmark, and in the case of 8K UHD, it provides 16 times clearer image quality than HD.

[0004] In recent years, wireless display systems have emerged that wirelessly transmit such high-resolution images to a display device.

[0005] The wireless display system is a system that transmits and receives A / V data between an A / V transmitting device and an A / V receiving device through a local area network.

[0006] The A / V receiving device displays the A / V data received from the A / V transmitting device.

[0007] An example of the A / V transmission device is a transmission box having an antenna module for wirelessly transmitting A / V data.

[0008] An example of the A / V receiving device may be a display device having an antenna module for receiving A / V data transmitted from an A / V transmitting device and outputting the received A / V data.

[0009] The display device may include a pair of antenna modules and an IR module disposed between the pair of antenna modules, and the pair of antenna modules may be spaced apart from each other on the left and right.

[0010] In a wireless display system, the antenna module of the A / V transmitting device can be located on the left or right side of the display device. In this case, a pair of antenna modules arranged on the display device can receive data sent from the antenna module of the A / V transmitting device in a dual-stream manner, and the display device can output an image.

[0011] When the A / V transmission device is disposed on the left or right side of the display device, one of the pair of antenna modules of the display device is blocked by the IR module and cannot receive data, and the display device can operate in a single-stream manner.

[0012] When operating in a single-stream mode, the compression rate needs to be doubled compared to the case of dual-stream mode in order to send and receive data at the same level as in the dual-stream mode. However, when the compression rate is increased, the image quality level may be reduced. Summary of the invention

[0013] Problem that the invention aims to solve

[0014] An object of the present invention is to provide an electronic device capable of performing A / V wireless communication of data regardless of the location of an A / V transmitting device.

[0015] An object of the present invention is to perform A / V wireless communication in an optimized manner according to the array antenna configuration structure of an A / V transmitting device and an electronic device.

[0016] An object of the present invention is to perform A / V wireless communication in an optimized manner in consideration of the positions of an A / V transmitting device and an electronic device and the polarity characteristics of an array antenna.

[0017] An object of the present invention is to provide A / V wireless communication without interruption even when an obstacle is arranged on the wireless communication path between an A / V transmission device and an electronic device.

[0018] An object of the present invention is to realize an antenna module that can transmit signals to the front area of ​​an A / V transmission device over a long distance and can also transmit signals in an upward direction.

[0019] An object of the present invention is to realize an antenna module capable of achieving a wider beam coverage to the side area of ​​an A / V transmission device than to the front or lower area.

[0020] Means used to solve problems

[0021] The antenna module implemented in this specification as a multi-layer package includes: a PCB, including a plurality of layers; an array antenna unit, including a plurality of antenna elements configured on the PCB; a radio frequency integrated circuit chip, i.e., an RFIC chip, bonded to the second surface of the PCB, the second surface being the other outermost surface of the PCB; and a plurality of signal connection lines, configured to connect from the RFIC chip to the array antenna unit. The length of the plurality of signal connection lines is the length of the connection between the RFIC chip and the array antenna unit, and the plurality of signal connection lines can be the same length.

[0022] According to an embodiment, each of the plurality of antenna elements may be composed of a structure of two patch antennas, a first patch antenna of the two patch antennas may be located on a first surface of the PCB, and the first surface may be the outermost surface of the PCB. A second patch antenna of the two patch antennas may be configured inside the PCB, a portion of the first patch antenna may overlap and stack with a portion of the second patch antenna. The second surface may be another outermost surface of the PCB.

[0023] According to an embodiment, the plurality of signal connection lines may be arranged between the plurality of second patch antennas inside the PCB and the RFIC chip. Each of the plurality of signal connection lines may include: a first portion on the second surface of the PCB; a third portion constituting a coplanar waveguide structure inside the PCB; a second portion electrically connecting the first portion to the third portion; and a fourth portion electrically connecting the third portion to one of the plurality of second patch antennas.

[0024] According to an embodiment, a first grounding region may be formed between the coplanar waveguide structure and the RFIC chip, the first grounding region being configured as a metal surface, and a second grounding region may be configured between the coplanar waveguide structure and the second patch antenna.

[0025] According to an embodiment, each of the plurality of antenna elements may be composed of a patch antenna structure, and the patch antenna may be located on a first surface of the PCB, and the first surface may be the outmost surface of the PCB. Each of the plurality of signal connection lines may be connected to and fed by the plurality of patch antennas in the plurality of antenna elements arranged inside the PCB. The length of the plurality of signal connection lines may be the length of the connection line connected between the RFIC chip and the patch antenna, and the plurality of signal connection lines may be the same length.

[0026] Effects of the Invention

[0027] The electronic device of this embodiment can perform A / V wireless communication of data regardless of the location of the A / V transmitting device by using the first antenna structure and the second antenna structure configured with a plurality of array antennas.

[0028] In addition, the A / V transmission device can transmit data in a dual-stream manner, thereby minimizing the degradation of image quality caused by increasing the data compression rate.

[0029] In addition, a horizontally polarized antenna and a vertically polarized antenna can be disposed on one substrate at the same time, thereby having the advantages of being able to make the antenna module compact and improving the data reception rate.

[0030] In addition, according to the array antenna configuration structure of the A / V transmission device and the electronic device, it is possible to use horizontally polarized and vertically polarized signals to increase communication capacity while performing A / V wireless communication with reduced interference between them.

[0031] In addition, considering the positions of the A / V transmission device and the electronic device and the polarization characteristics of the array antenna, it is possible to utilize horizontally polarized and vertically polarized signals to perform A / V wireless communication that reduces interference between them while increasing communication capacity.

[0032] Furthermore, even when an obstacle is placed on the wireless communication path between the A / V transmission device and the electronic device, A / V wireless communication can be provided uninterruptedly by changing the beamforming direction and utilizing reflected waves.

[0033] In addition, the number of array antennas arranged in the front area of ​​the antenna module of the A / V transmission device can be configured to be greater than the number of antennas in the side area or the lower area. As a result, the signal can be transmitted to the front area at a longer distance than the side area or the lower area of ​​the antenna module. In addition, it can also be implemented as a two-dimensional array antenna, so that an antenna module that can also transmit signals in the upper direction through beamforming can be implemented.

[0034] In addition, the number of array antennas arranged in the side area of ​​the antenna module of the A / V transmission device can be configured to be smaller than the number of antennas arranged in other areas, thereby realizing an antenna module that forms a wider beam coverage in the side area than in the front or lower area.

[0035] The additional scope of the applicability of this specification can be clearly seen from the following detailed description. However, since those skilled in the art can clearly understand various changes and modifications within the concept and scope of this specification, it should be understood that the detailed description and specific embodiments such as the preferred embodiments of this specification are provided only as examples. BRIEF DESCRIPTION OF THE DRAWINGS

[0036] Figure 1 It is a diagram for explaining the configuration of the wireless display system of this embodiment.

[0037] Figure 2 It is a block diagram for explaining the detailed configuration of the communication device 100 and the electronic device 200 .

[0038] Figure 3 The configuration structure of the antenna module configured in the electronic device according to the embodiment is shown.

[0039] Figure 4 A structural diagram showing an electronic device formed with a display performing AV wireless communication with another communication device that can be arranged in various positions.

[0040] Figure 5 The structure of the antenna module arranged at the lower part of the electronic device is shown.

[0041] Figure 6 and Figure 7 A front view and a cross-sectional view of a substrate formed with an antenna module that can be configured on one side of an electronic device are shown.

[0042] Figure 8 yes Figure 6 A three-dimensional image of the antenna module and an enlarged image of a portion of the area.

[0043] Figure 9a and Figure 9b It is shown Figure 7 A front view of the various layers of the antenna module in FIG.

[0044] Fig.9c It is shown Figure 9a Diagram of the connection structure of the feeder lines of the first, third and sixth layers.

[0045] Fig.10 yes Figure 9a An enlarged view of the first layer and the sixth layer among the multiple layers of the PCB.

[0046] Fig.11 yes Figure 9b An enlarged view of the tenth and twelfth layers among the multiple layers of the PCB.

[0047] Fig.12a and Figure 12b A cross-sectional view and a side view of the monopole antenna of the present specification are shown.

[0048] Fig.13 A front view of the dipole antenna of the present specification is shown.

[0049] Fig.14 and Fig.15A front view and a cross-sectional view of a substrate formed with an antenna module that can be configured on the other side of an electronic device are shown.

[0050] Fig.16 yes Fig.14 A three-dimensional image of the antenna module and an enlarged image of a portion of the area. DETAILED DESCRIPTION

[0051] Hereinafter, specific embodiments of the present specification will be described in detail with reference to the accompanying drawings.

[0052] The following is a more detailed description of the embodiments related to this specification with reference to the accompanying drawings. The suffixes "module" and "unit" used in the following description are given or used interchangeably for the convenience of writing the specification, and do not have different meanings or functions.

[0053] For example, the image / audio (hereinafter referred to as A / V) transmission device of the embodiment of the present specification is an intelligent device that adds computer support functions to the broadcast receiving function. While fully executing the broadcast receiving function, it adds Internet functions, etc., and therefore has a more user-friendly interface such as a handwriting input device, a touch screen or a space remote control.

[0054] In addition, with the support of wired or wireless Internet functions, it is possible to connect to the Internet and a computer and perform functions such as email, browser, banking, or games. For such diverse functions, a standardized general-purpose OS may be used.

[0055] Therefore, in the A / V transmission device described in this specification, for example, various application programs can be freely added or deleted on a general-purpose OS kernel, thereby being able to execute various user-friendly functions.

[0056] Figure 1 It is a diagram for explaining the configuration of the wireless display system of this embodiment.

[0057] Reference Figure 1 , the wireless display system 1 of this embodiment includes a communication device 100 and an electronic device 200 .

[0058] The wireless display system 1 may be a system in which the communication device 100 transmits A / V data to the electronic device 200 in a wireless manner, and the electronic device 200 outputs the A / V data.

[0059] The communication device 100 may be a device capable of encoding images and audio and transmitting the encoded contents images and audio in a wireless manner.

[0060] An example of the communication device 100 may be an AIO (All In One) box capable of transmitting data, and an example of the communication device 100 may be a set-top box.

[0061] As another example of the communication device 100 , an external device such as a set-top box or a USB memory may be connected. The communication device 100 may transmit an image signal or an audio signal received from the connected external device to the electronic device 200 .

[0062] The electronic device 200 may be a display device capable of wirelessly receiving encoded images and audio and performing decoding on the received images and audio.

[0063] The communication device 100 and the electronic device 200 may constitute a video wall display system.

[0064] In a video wall, a display screen with a thin bezel plays an important role in the visualization of content images. In order to have a thin bezel of the display screen, it is more efficient to have only components that can play a minimal role and to implement circuits or components for the main functions on additional devices.

[0065] The communication device 100 may determine the type of the content image and determine the compression rate of the content image based on the determined type. The compression rate of the content image may be defined as the ratio of the size of the image data before encoding to the size of the image data after encoding.

[0066] The types of content images may include a static image type, a general video type, and a game video type.

[0067] The communication device 100 may compress the content image according to the determined compression rate and wirelessly transmit the compressed content image to the electronic device 200 .

[0068] The electronic device 200 may restore the compressed content image received from the communication device 100 and display the restored content image on a display. For example, the electronic device 200 may be a display device.

[0069] Figure 2 It is a block diagram for explaining the detailed configuration of the communication device 100 and the electronic device 200 .

[0070] Reference Figure 2 , the communication device 100 may include a microphone 110 , a wireless fidelity (Wi-Fi) module 120 , a Bluetooth module 130 , a memory 140 , an RF transmission module 150 , and a processor 190 .

[0071] Microphone 110 may receive audio signals and pass them to processor 190 .

[0072] The microphone 110 can receive the voice uttered by the user.

[0073] The Wi-Fi module 120 may perform wireless communication through the Wi-Fi standard.

[0074] The Wi-Fi module 120 may perform wireless communication with an external device or the electronic device 200 through the Wi-Fi standard.

[0075] The Bluetooth module 130 may perform wireless communication via the Bluetooth Low Energy (BLE) standard.

[0076] The Bluetooth module 130 may perform wireless communication with an external device such as a remote controller or the electronic device 200 through the Bluetooth Low Energy (BLE) standard.

[0077] The memory 140 may store programs for signal processing and control, and store image, voice, or data signals after signal processing.

[0078] The memory 140 may perform a function for temporarily storing an image, voice or data signal input from the outside, and may also store information related to a prescribed image through a channel memory function.

[0079] The RF transmitting module 150 may transmit the A / V signal to the RF receiving module 240 of the electronic device 200 through RF (Radio Frequency) communication.

[0080] The RF transmission module 150 may transmit the compressed A / V signal in a digital form to the RF reception module 240 .

[0081] The RF transmission module 150 may transmit the A / V signal to the RF reception module 240 through one or more channels.

[0082] The processor 190 may control the overall operation of the communication device 100 .

[0083] The processor 190 may be configured as a system on chip (SoC).

[0084] A plurality of processors 190 may be provided.

[0085] The processor 190 may compress an image signal or an audio signal input from the outside and transfer the compressed signal to the RF transmission module 150 .

[0086] The processor 190 may have an encoder for compressing an image signal or an audio signal.

[0087] The processor 190 may be named a master system on chip.

[0088] The processor 190 may have one or more interfaces for connection with external devices. For example, the processor 190 may have one or more HDMI ports and one or more USB ports.

[0089] The processor 190 may also have a tuner for receiving broadcast signals.

[0090] The electronic device 200 may include a Wi-Fi module 210 , a Bluetooth module 220 , an IR module 230 , an RF receiving module 240 , a memory 250 , a display panel 260 , and a processor 290 .

[0091] The Wi-Fi module 210 may perform wireless communication through the Wi-Fi standard.

[0092] The Wi-Fi module 120 may perform wireless communication with an external device or the communication device 100 through the Wi-Fi standard.

[0093] The Bluetooth module 220 may perform wireless communication via the Bluetooth Low Energy (BLE) standard.

[0094] The Bluetooth module 220 may perform wireless communication with an external device such as a remote controller or an A / V transmitting device through the Bluetooth Low Energy (BLE) standard.

[0095] The IR module 230 may receive a signal from a remote controller (not shown) through IR (Infrared) communication.

[0096] The RF receiving module 240 may receive the A / V signal from the RF transmitting module 150 .

[0097] The RF receiving module 240 may include a plurality of antennas and may be disposed at a lower end of the display panel 260 .

[0098] As an example of the RF receiving module 240, a first antenna module and a second antenna module may be included. The first antenna module and the second antenna module may include a plurality of antennas respectively.

[0099] As another example of the RF receiving module 240 , an antenna module may be included. Such an antenna module may include a plurality of antennas.

[0100] The RF receiving module 240 may receive the compressed A / V signal in a digital form from the RF transmitting module 150 and transfer the received A / V signal to the processor 290 .

[0101] The memory 250 may store programs for signal processing and control, and store image, voice or data signals after signal processing.

[0102] The display panel 260 may be a display panel 260 capable of displaying an image signal received from the processor 290. As an example of such a display panel 260, an LED panel may be used.

[0103] The display panel 260 may display an image signal according to the driving of a timing controller (not shown).

[0104] The processor 290 may control the overall operation of the electronic device 200 .

[0105] The processor 290 may restore the compressed A / V signal received by the RF receiving module 240. To this end, the processor 290 may include a decoder.

[0106] On the other hand, the antenna module of the present specification can be configured in a vertical configuration structure or a horizontal configuration structure. In this regard, Figure 3 The configuration structure of the antenna module configured in the electronic device according to the embodiment is shown.

[0107] Reference Figure 3 In (a), the antenna structure 1000 may be combined at the end of the heat sink 203 disposed in the space between the first cover 201 and the second cover 202. The first cover 201 and the second cover 202 may correspond to the front cover and the rear cover, respectively. The length of the lower end of the first cover 201 combined with the antenna structure 1000 may be implemented to be less than a specified first length (e.g., 15 mm). The upper and lower ends of the antenna structure 1000 may be combined with the upper and lower grooves of the first cover 201, so that the antenna structure 1000 may be configured vertically.

[0108] The end of the heat sink 203 and the antenna structure 1000 can be configured as a vertical structure with the horizontal plane as the reference. The end of the heat sink 203 and the antenna structure 1000 can be configured in parallel with the Y axis as the vertical axis as the reference. To this end, the heat sink 203 is combined with the first cover 201 and the second cover 202 and the antenna structure 1000 on the front and back sides of the heat sink 203 by an assembly structure such as a screw or an additional compression structure. The assembly structure or the compression structure can be assembled or compressed in the first direction D1 as the front direction or the second direction D2 as the back direction.

[0109] The antenna structure 1000 may include a plurality of side surfaces BS1 to BS6. A first surface BS1 among the plurality of side surfaces may be formed to face the front direction D1 of the electronic device 200, and a second surface BS2 among the plurality of side surfaces may be formed to face the rear direction D2 of the electronic device 200. A third surface (not shown) among the plurality of side surfaces may be formed to face the left side direction of the electronic device 200, and a fourth surface BS4 among the plurality of side surfaces may be formed to face the right side direction of the electronic device 200. A fifth surface BS5 among the plurality of side surfaces may be formed to face the bottom direction D3 of the electronic device 200.

[0110] Reference Figure 3 In (b), the antenna structure 1000' can be combined with the end of the heat sink 204 arranged in the space between the first cover 201 and the second cover 202. The length of the lower end of the first cover 201 combined with the antenna structure 1000' can be implemented to be less than the specified second length (for example: 9.8 mm). One side end and the back side of the antenna structure 1000' can be combined with the side area and the back side of the first cover 201, so that the antenna structure 1000' is configured to be parallel to the horizontal plane. The assembled structure or the compressed structure can be assembled or compressed in the fifth direction D5 as the upper direction or the sixth direction D6 as the lower direction.

[0111] The end of the heat sink 204 and the antenna structure 1000' may be configured as a horizontal structure corresponding to the horizontal plane. The end of the heat sink 204 and the antenna structure 1000' may be configured in parallel with the X-axis as the horizontal axis. To this end, on the front and back sides of the heat sink 204, the heat sink 204 may be combined with the first cover 201 and the antenna structure 1000' by an assembly structure such as a screw or an additional compression structure. The assembly structure or the compression structure may be assembled or compressed in a first direction D1 as the front direction and a second direction D2 as the back direction.

[0112] On the other hand, the antenna module configured in the electronic device of this specification is described. In this regard, Figure 4 A structural diagram showing an electronic device formed with a display performing AV wireless communication with another communication device that can be arranged in various positions.

[0113] Reference Figure 4The communication device 100 may be arranged in the front direction, the lower direction, the one side direction or the other side direction of the electronic device 200. The communication device 100 may be an AV transmission device that transmits AV content to the electronic device 200. The communication device 100 may be a set-top box, but is not limited to this. The electronic device 200 may be an AV receiving device that receives AV content from the communication device 100. The electronic device 200 may be a display device, but is not limited to this. Although the electronic device 200 receives data from the communication device 100, it may also transmit data to the communication device 100.

[0114] The communication device 100 may be arranged in a first direction D1 which is a front direction of the electronic device 200. In this regard, the electronic device 200 may transmit or receive wireless signals along the first direction D1 which is a front direction. The rear direction of the electronic device 200 may be defined as a second direction D2.

[0115] The communication device 100 may be arranged in the third direction D3 as the left direction or in the fourth direction D4 as the right direction of the electronic device 200. In this regard, the electronic device 200 may transmit or receive wireless signals along the third direction D3 as the left direction or the fourth direction D4 as the right direction.

[0116] The communication device 100 may be arranged in a fifth direction D5 which is a lower direction of the electronic device 200. In this regard, the electronic device 200 may transmit or receive a wireless signal along the fifth direction D5 which is a lower direction. The upper direction of the electronic device 200 may be defined as a sixth direction D6.

[0117] On the other hand, there may be obstacles between the communication device 100 and the electronic device 200, resulting in the inability to form a wireless link on the LOS (line-of-sight) path. In this regard, the electronic device 200 can send and receive wireless signals through a wireless link on a non-LOS (non-line-of-sight) path such as a reflection path. The communication device 100 can send or receive wireless signals along the ceiling direction as the upper front direction. It is possible to communicate between the communication device 100 and the electronic device 200 through wireless signals reflected from the ceiling or wall.

[0118] On the other hand, the electronic device of the present specification includes a plurality of antenna modules (structures), and wireless communication with a communication device can be performed through the plurality of antenna modules (structures). In this regard, Figure 5 The structure of the antenna module arranged at the lower part of the electronic device is shown.

[0119] Reference Figures 3 to 5The electronic device 200 may include a display panel 260 and an antenna module 1000a. A first antenna structure 1000a and a second antenna structure 1000b may be disposed around the display panel 260. Figure 5 The first antenna structure 1000a and the second antenna structure 1000b may be respectively connected to Figure 7 and Fig.15 The antenna modules 1000a and 1000b correspond to each other.

[0120] The first antenna structure 1000 a may be disposed on one side of the electronic device 200 , and the second antenna structure 1000 b may be disposed on the other side of the electronic device 200 .

[0121] The first antenna structure 1000a may include a first array antenna 1200a and a second array antenna 1300a. The first array antenna 1200a operates as a horizontally polarized antenna that receives or transmits signals in the front direction. The second array antenna 1300a operates as a horizontally polarized antenna that receives or transmits signals in the lower direction. The first array antenna 1200a may radiate polarized signals that are polarized in the Y-axis direction and advance in the X-axis direction. The second array antenna 1300a may radiate polarized signals that are polarized in the Y-axis direction and advance in the Z-axis direction of the lower part.

[0122] The first antenna structure 1000a may further include a third array antenna 1100a and a fourth array antenna 1100b. The third array antenna 1100a operates as a horizontally polarized antenna that receives or transmits signals in the left direction. The fourth array antenna 1100b operates as a horizontally polarized antenna that receives or transmits signals in the right direction. The third array antenna 1100a may radiate a polarized signal that is polarized in the X-axis direction and moves toward the Y-axis direction on the left. The fourth array antenna 1100b may radiate a polarized signal that is polarized in the X-axis direction and moves toward the Y-axis direction on the right.

[0123] The second antenna structure 1000b may include a fifth array antenna 1200b and a sixth array antenna 1300b. The fifth array antenna 1200b may operate as a horizontally polarized antenna that receives or sends signals in the front direction. The sixth array antenna 1300b may operate as a vertically polarized antenna that receives or sends signals in the lower direction. The fifth array antenna 1200b may radiate a polarized signal that is polarized in the Y-axis direction and moves in the X-axis direction. The sixth array antenna 1300b may radiate a polarized signal that is polarized in the X-axis direction and moves in the Z-axis direction of the lower part.

[0124] The second antenna structure 1000b may also include a seventh array antenna 1100c and an eighth array antenna 1100d. The seventh array antenna 1100c and the eighth array antenna 1100d operate as horizontally polarized antennas. The seventh array antenna 1100c operates as a horizontally polarized antenna that receives or sends signals in the left direction. The eighth array antenna 1100d operates as a horizontally polarized antenna that receives or sends signals in the right direction. The seventh array antenna 1100c can radiate a polarized signal that is polarized in the X-axis direction and moves toward the Y-axis direction on the left. The eighth array antenna 1100d can radiate a polarized signal that is polarized in the X-axis direction and moves toward the Y-axis direction on the right.

[0125] On the other hand, the antenna module configured in the electronic device of this specification is described. In this regard, Figure 6 and Figure 7 A front view and a cross-sectional view of a substrate formed with an antenna module that can be configured on one side of an electronic device are shown. Figure 8 yes Figure 6 A three-dimensional image of the antenna module and an enlarged image of a portion of the area.

[0126] Figure 6 (a) in FIG. 1 is a diagram for distinguishing a substrate on which an antenna module 1000a is formed according to regions. The substrate 1010a may include a center portion CR and a periphery PE surrounding the center portion CR. The periphery PE of the substrate 1010a may include a first portion P1 to a fourth portion P4. The first portion P1 constitutes a lower region of the substrate 1010a, and the second portion P2 constitutes a side region of the substrate 1010a. The third portion P3 constitutes the other side region of the substrate 1010a, and the fourth portion P4 constitutes an upper region of the substrate 1010a.

[0127] Reference Figure 5 and Figure 6 The antenna module 1000a may be configured to include a substrate 1010a, a first array antenna 1200a, a second array antenna 1300a, a third array antenna 1100a, and a fourth array antenna 1100b. Since the third array antenna 1100a and the fourth array antenna 1100b are arranged on one side and the other side of the substrate 1010a, they may be referred to as a first side array antenna and a second side array antenna.

[0128] Figure 7 (a) is a cross-sectional view of the antenna module 1000a. Figure 7 (b) is a cross-sectional view showing each layer of the substrate 1010a. Figure 8 (a) in FIG. 1 is a perspective view showing a side area based on the center of the antenna module 1000 a . Figure 8(b) is an enlarged view of a region where parts DA1 to DA4 of dipole antennas constituting the second array antenna 1300a of the antenna module are arranged.

[0129] Reference Figure 7 , the first layer La1 of the antenna module 1000a may be configured with RFIC1400a. A plurality of ground layers may be configured in the internal area of ​​the antenna module 1000a. For example, the first ground layer GND1 may be configured in the second layer La2, the second ground layer GND2 may be configured in the fourth layer La4, the third ground layer GND3 may be configured in the fifth layer La5, and the fourth ground layer GND4 may be configured in the seventh layer La7.

[0130] The conductive pattern of the inner region of the antenna module 1000a may be separated and stacked by a plurality of dielectric layers in the height direction. For example, the first dielectric layer DL1 may be arranged between the first layer La1 and the second layer La2, the second dielectric layer DL2 may be arranged between the third layer La3 and the fourth layer La4, the third dielectric layer DL3 may be arranged between the fourth layer La4 and the fifth layer La5, and the fourth dielectric layer DL4 may be arranged between the sixth layer La6 and the seventh layer La7.

[0131] A plurality of coplanar waveguide layers may be configured in each layer of the inner region of the antenna module 1000a. A first coplanar waveguide layer WG1 may be formed in the third layer La3, and a plurality of signal connection lines and a plurality of grounding portions may be formed in the first coplanar waveguide layer WG1. A second coplanar waveguide layer WG2 may be formed in the sixth layer La6, and a plurality of signal connection lines and a plurality of grounding portions may be formed in the second coplanar waveguide layer WG2.

[0132] It can be considered that a plurality of dielectric layers are formed on a layer corresponding to a ground layer of the antenna module 1000a. In this regard, a plurality of dielectric layers can be configured in the internal area of ​​the antenna module 1000a. For example, a first dielectric layer DL1 can be configured in the second layer La2, a second dielectric layer DL2 can be configured in the fourth layer La4, a third dielectric layer DL3 can be configured in the fifth layer La5, and a fourth dielectric layer DL4 can be configured in the seventh layer La7.

[0133] Reference Figure 7 The first layer La1 is the interface layer IL of RFIC1400a, and the second layer La2 is the first ground layer GND1 formed by grounding and vias. A first dielectric layer DL1 may be disposed between the first layer La1 and the second layer La2, or the second layer La2 may include the first ground layer GND1 and the first dielectric layer DL1.

[0134] The third layer La3 is a first coplanar waveguide layer WG1 formed with a plurality of conductive patterns and a ground portion. The fourth layer La4 is a second ground layer GND2 formed of a ground and a via. A second dielectric layer DL2 may be disposed between the third layer La3 and the fourth layer La4, or the fourth layer La4 may include the second dielectric layer DL2.

[0135] A third dielectric layer DL3 may be disposed between the fourth layer La4 and the fifth layer La5, or the fifth layer La5 may include the third dielectric layer DL3. The fifth layer La5 is a third ground layer GND3 formed of a ground and a through hole. The sixth layer La6 is a second coplanar waveguide layer WG2 formed with a plurality of conductive patterns and a ground portion. A fourth dielectric layer DL4 may be disposed between the sixth layer La6 and the seventh layer La7, or the seventh layer La7 may include the fourth dielectric layer DL4.

[0136] Reference Figures 6 to 8 The ground wall (GW) 1130 is formed at the periphery PE of the substrate 1010a and has through holes connecting multiple layers. The ground wall (GW) 1130 is arranged along one axial direction and another axial direction between the multiple patch antennas PA11 to PA28 and is formed to surround each of the multiple patch antennas PA11 to PA28.

[0137] The ground wall (GW) 1130 can act as a ground for the radiation of the patch antennas PA11 to PA28 and is called a ground cavity wall. The ground wall (GW) 1130 suppresses the side radiation and back radiation of the patch antennas PA11 to PA28 of the front radiation structure, and performs a reflector function toward the front. In addition, the ground wall (GW) 1130 suppresses the back radiation in the other side direction of the monopole antennas MA1 to MA6 of the side radiation structure, and performs a reflector function toward the front in one side direction. In addition, the ground wall 1130, GW suppresses the back radiation in the upper direction of the dipole antennas DA1 to DA10 of the lower radiation structure, and performs a reflector function toward the lower direction.

[0138] The first array antenna 1200a may also include a plurality of dummy pads DP11 to DP22 configured on one side and the other side of the plurality of patch antennas PA11 to PA28. The first dummy pad DP11 of the plurality of dummy pads DP11 to DP22 is configured between the first patch antenna PA11 of the first row and the second portion P2. The second dummy pad DP12 is configured between the eighth patch antenna PA18 of the first row and the third portion P3. The third dummy pad DP21 of the plurality of dummy pads DP11 to DP22 is configured between the first patch antenna PA21 of the second row and the second portion P2. The fourth dummy pad DP22 is configured between the eighth patch antenna PA28 of the second row and the third portion P3.

[0139] A ground wall (GW) 1130 may be formed to surround a plurality of dummy pads DP11 to DP22. A first patch antenna 1220 of each of the plurality of patch antennas PA11 to PA28 is not connected to a feed line. A plurality of dummy pads DP11 to DP22 are formed to be not connected to a plurality of feed lines. A second patch antenna 1210 of each of the plurality of patch antennas PA11 to PA28 may be connected to a feed line.

[0140] The spacing distance and dimensions between the ground wall (GW) 1130 and the plurality of dummy pads DP11 to DP22 can be implemented within a specified range based on the half wavelength of 60 GHz as the operating frequency. The layer positions and dimensions of the plurality of first patch antennas CP11 to CP28 corresponding to the coupling pads and the overlapping areas with the plurality of patch antennas PA11 to PA28 can be designed in consideration of radiation characteristics and arrangement characteristics.

[0141] Reference Figure 3 , Figures 6 to 8 The antenna module 1000a may be configured to further include a millimeter wave transceiver circuit 1400a.

[0142] The substrate 1010a may have a first surface S1, a second surface S2, a periphery PE, and a center portion CR. A periphery PE may be formed between the first surface S1 and the second surface S2. The first surface S1 may be formed as an opposite side to the second surface S2. The substrate 1010a may be implemented as a multi-layer substrate. For example, the substrate 1010a may be implemented as a 12-layer substrate, but is not limited thereto and may be changed according to the application. The first surface S1 of the substrate 1010a may correspond to the surface of the twelfth layer La12.

[0143] The substrate 1010a may form a plurality of side surfaces. The first surface S1 of the plurality of side surfaces may be formed to face the front direction of the antenna module 1000a, and the second surface S2 may be formed to face the back direction of the antenna module 1000a. The third surface S3 and the fourth surface S4 of the plurality of side surfaces may be formed to face the left side direction and the right side direction of the antenna module 1000a. The fifth surface S5 of the plurality of side surfaces may be formed to face the bottom direction of the antenna module.

[0144] A third array antenna 1100a and a fourth array antenna 1100b may be formed at the second portion P2 and the third portion P3 of the periphery PE of the substrate 1010a. The third array antenna 1100a and the fourth array antenna 1100b may form beam patterns toward a plurality of side regions of the electronic device. The third array antenna 1100a and the fourth array antenna 1100b may radiate horizontally polarized signals toward a plurality of side regions of the electronic device.

[0145] The third array antenna 1100a may include a plurality of monopole antennas MA1 to MA3 formed at a second portion P2 of the periphery PE of the substrate 1010a. The fourth array antenna 1100b may include a plurality of monopole antennas MA4 to MA6 formed at a third portion P3 of the periphery PE of the substrate 1010a. The third array antenna 1100a and the fourth array antenna 1100b may be implemented as three antenna elements on one side and the other side of the periphery PE of the substrate 1010a, respectively. The third array antenna 1100a may be implemented as a 1x3 array antenna on one side of the substrate 1010a, but is not limited thereto. The fourth array antenna 1100b may be implemented as a 1x3 array antenna on the other side of the substrate 1010a, but is not limited thereto.

[0146] A first array antenna 1200a may be formed on the first surface S1 of the substrate 1010a. The first array antenna 1200a may form a beam pattern toward the front area of ​​the electronic device. The first array antenna 1200a may radiate horizontally polarized signals toward the front area of ​​the electronic device. The first array antenna 1200a may be implemented as 16 antenna elements in the center portion CR of the substrate 1010a.

[0147] The first array antenna 1200a may include a plurality of patch antennas PA11 to PA18, PA21 to PA28 formed on the first surface S1 of the substrate 1010a. A plurality of dummy pads DP11, DP21 may be configured on one side of the plurality of patch antennas PA11, PA21, so as to suppress side surface radiation. A plurality of dummy pads DP12, DP22 may be configured on the other side of the plurality of patch antennas PA11, PA21, so as to suppress side surface radiation. The first array antenna 1200a may be implemented as 16 2x8 array antennas in the center portion CR of the substrate 1010a, but is not limited thereto.

[0148] Each of the patch antennas of the first array antenna 1200a may include a first patch antenna 1220 and a second patch antenna 1210. The second patch antenna 1210 is stacked on the first patch antenna 1220 in a vertical direction to couple a signal of the first patch antenna 1220. The center of the second patch antenna 1210 may be formed to be offset in an axial direction relative to the center of the first patch antenna 1220.

[0149] The second interval between the adjacent plurality of first patch elements 1221, 1222 may be greater than the first interval between the adjacent plurality of second patch elements 1211, 1212. To this end, the first patch element 1221 of the first column may be configured to be offset in the left direction relative to the second patch element 1211 of the first column. On the other hand, the first patch element 1222 of the second column may be configured to be offset in the right direction relative to the second patch element 1212 of the second column. The current direction of the signal applied to the second patch element 1211 of the first column is the left direction, and the current direction of the signal applied to the second patch element 1212 of the second column is the right direction. The current directions of the signals applied to the second patch element 1211 of the first column and the second patch element 1212 of the second column are opposite directions. Therefore, it is necessary to make the phase difference of the signals applied to the second patch elements 1211, 1212 of the first column and the second column 180 degrees, so as to form currents in the same direction. To this end, RFIC 1400 a may control a phase shifter so that the phase difference between the signals applied to the second patch elements 1211 and 1212 of the first column and the second column becomes 180 degrees.

[0150] A second array antenna 1300a may be formed at a first portion P1 of the periphery PE of the substrate 1010a. The second array antenna 1300a may form a beam pattern toward a lower region of the electronic device. The second array antenna 1300a may radiate horizontally polarized signals toward a lower region of the electronic device.

[0151] The second array antenna 1300a may include a plurality of dipole antennas DA1 to DA10 formed at a first portion P1 of the periphery PE of the substrate 1010a. The second array antenna 1300a may be implemented as 10 antenna elements at the lower side of the periphery PE of the substrate 1010a. The second array antenna 1300a may be implemented as 10 1x10 array antennas at the lower side of the periphery PE of the substrate 1010a, but is not limited thereto.

[0152] The plurality of array antennas may be arranged along the X-axis direction (one axial direction) and the Y-axis direction (another axial direction) of the substrate 1010a. The third array antenna 1100a and the fourth array antenna 1100b may be a plurality of monopole antennas MA1 to MA3, MA4 to MA6 arranged along another axial direction. The first array antenna 1200a may be a plurality of patch antennas PA11 to PA18, PA21 to PA28 arranged along one axial direction. The second array antenna 1300a may be a plurality of dipole antennas DA1 to DA10 arranged along one axial direction.

[0153] The millimeter wave transceiver circuit 1400a can be configured on the second surface S2. The millimeter wave transceiver circuit 1400a can be configured to use at least one of the first array antenna 1200a, the second array antenna 1300a, the third array antenna 1100a and the fourth array antenna 1100b to send and receive signals with frequencies between 10 GHz and 400 GHz. The millimeter wave transceiver circuit 1400a can be configured to use at least one of a plurality of monopole antennas MA1 to MA6, a plurality of patch antennas PA11 to PA18, PA21 to PA28 and a plurality of dipole antennas DA1 to DA10 to send and receive signals with frequencies between 10 GHz and 400 GHz. The millimeter wave transceiver circuit 1400a can be called an RFIC (Radio Frequency Integrated Chip).

[0154] The number of elements of the first array antenna 1200a forming a beam pattern toward the front area may be set to be greater than the number of elements of the second array antenna 1300a forming a beam pattern toward the lower area. The number of elements of the second array antenna 1300a forming a beam pattern toward the lower area may be set to be greater than the number of the third array antenna 1100a and the fourth array antenna 1100b forming a beam pattern toward the side area.

[0155] In this regard, 16 of the 32 pins of RFIC1400a may be connected to the first array antenna 1200a that forms a beam pattern toward the front region. 10 of the 32 pins of RFIC1400a may be connected to the second array antenna 1300a that forms a beam pattern toward the lower region. 6 of the 32 pins of RFIC1400a may be connected to the third array antenna 1100a and the fourth array antenna 1100b that form a beam pattern toward the side region.

[0156] In this regard, the first array antenna 1200a has the largest number of elements and is therefore capable of transmitting signals over long distances to the front area of ​​the electronic device, but with a narrower beam coverage. The beam direction can be changed by beamforming in the horizontal direction of the front area to compensate for the narrower beam coverage. Thus, the number of elements of the first array antenna 1200a can be implemented as a plurality along one axial direction and as two along another axial direction. For example, the first array antenna 1200a can be implemented as a 2x8 array antenna. By applying a phase difference between the plurality of signals of the antenna elements of the first row and the antenna elements of the second row, a beam can be formed from the front direction at a specified angle toward the upper direction.

[0157] The electronic device needs to perform AV wireless communication with another electronic device configured in the lower area of ​​the electronic device. For AV wireless communication, beamforming can be implemented in the lower area of ​​the electronic device along the horizontal direction as an axial direction with a narrow beam coverage unit. On the other hand, it is not necessary to transmit signals to the lower area of ​​the electronic device over a long distance. Thus, the number of elements of the second array antenna 1300a can be implemented as a plurality along one axial direction and as one along another axial direction. For example, the second array antenna 1300a can be implemented as a 1x8, 1x10 or 1x12 array antenna.

[0158] In an indoor radio wave environment equipped with an electronic device, signals can also be transmitted to multiple side areas of the electronic device. For multiple side areas of the electronic device, it is more important to achieve wide beam coverage without beamforming than to transmit signals over long distances. In this regard, since the third array antenna 1100a and the fourth array antenna 1100b have the least number of elements, wide beam coverage can be provided to multiple side areas of the electronic device. Thus, the number of elements of the third array antenna 1100a and the fourth array antenna 1100b can be implemented as a plurality along one axial direction and as one along another axial direction. For example, the third array antenna 1100a and the fourth array antenna 1100b can be implemented as a 1x3 array antenna on one side and the other side.

[0159] The following describes the configuration structure of each layer of the antenna module of this specification. Figure 9a and Figure 9b It is shown Figure 7 A front view of the various layers of the antenna module. Fig.9c It is shown Figure 9a Diagram of the connection structure of the feeder lines of the first, third and sixth layers.

[0160] Reference Figures 6 to 9c, each layer of the antenna module 1000a is described in detail. The antenna module 1000a can be a stacked structure consisting of a first layer La1 configured with a transceiver circuit 1400a to a sixth layer La6 formed with a plurality of feeder lines of the first array antenna 1200a. In addition, the antenna module 1000a can also include a seventh layer La7 as a ground layer of the sixth layer La6 to a twelfth layer La12 configured with a plurality of antenna elements of the first array antenna 1200a.

[0161] The first layer La1 may be provided with a transceiver circuit 1400a, which may have a plurality of pins and a plurality of connection lines connected to the plurality of pins. The transceiver circuit 1400a may be provided with a central line of an axial direction of the first layer La1 as a reference.

[0162] The second layer La2 may form a metal layer at the center portion CR and constitute the first ground layer GND1 of the first layer La1. The third array antenna 1100a and the fourth array antenna 1100b may be configured with a plurality of monopole antennas MA1 to MA6 at one side and the other side of the third layer La3. The ends of the plurality of first feed lines of the plurality of monopole antennas MA1 to MA6 may be connected to the plurality of lines of the first layer La1 through the first type through holes Va1 to Va6.

[0163] The lower region of the third layer La3 may be provided with a plurality of dipole antennas DA1 to DA10 of the second array antenna 1300a. Ends of the plurality of second feed lines of the plurality of dipole antennas DA2 to DA9 may be connected to the plurality of lines of the first layer La1 through second type vias Vb2 to Vb9.

[0164] The fourth layer La4 may form a metal layer at the center portion CR and constitute the second ground layer GND2 of the fourth layer La4. The plurality of first feed lines and the plurality of second feed lines of the third layer La3 are arranged between the first ground layer of the second layer La2 and the second ground layer of the fourth layer La4. Thus, the plurality of first feed lines and the plurality of second feed lines of the third layer La3 form a first coplanar waveguide structure having ground layers formed in the upper and lower layers in the height direction. A portion of the metal layer of the first ground layer and the second ground layer may be removed to allow the first type through hole and the second type through hole to be vertically connected.

[0165] The fifth layer La5 may form a metal layer at the center portion CR and constitute the third ground layer GND3 of the fifth layer La5. The sixth layer La6 may be configured with a plurality of third feeders of the plurality of patch antennas PA11 to PA18, PA21 to PA28 of the first array antenna 1200a. The distances between one end and the other end of the plurality of third feeders may be formed to be the same. The third type through holes Vc1 to Vc8, Vc9 to Vc16 formed at one end of the plurality of third feeders may be used to connect to the plurality of wires of the first layer La1.

[0166] The outermost plural dipole antennas DA1 and DA10 of the third layer La3 can be connected through the fourth feeder line of the sixth layer La6. Therefore, the plural wires of the first layer La1 can be connected to the plural fourth feeders of the sixth layer La6 through the second type through holes Vb1 and Vb10. The plural fourth feeders of the sixth layer La6 can be connected to the plural dipole antennas DA1 and DA10 of the third layer La3 through the second type through holes Vb1′ and Vb10′ at the other end.

[0167] The seventh layer La7 may form a metal layer at the center portion CR and constitute the fourth ground layer GND4 of the seventh layer La7. The plurality of third feed lines and the fourth feed line of the sixth layer La6 are arranged between the third ground layer of the fifth layer La5 and the fourth ground layer of the seventh layer La7. Thus, the third feed line and the fourth feed line of the sixth layer La6 are formed into a second coplanar waveguide structure having ground layers formed in the upper and lower layers in the height direction. A portion of the metal layer of the third ground layer and the fourth ground layer may be removed so that the second type through hole and the third type through hole can be vertically connected.

[0168] As described above, the second layer La2, the fourth layer La4, the fifth layer La5, and the seventh layer La7 can be respectively constituted as the first ground layer GND1 to the fourth ground layer GND4. The substrate 1010a may include the first ground layer GND1 of the transceiver circuit 1400a to the fourth ground layer GND4 of the first array antenna 1200a. The third array antenna 1100a and the fourth array antenna 1100b may vertically extend from the layer between the first ground layer GND1 and the second ground layer GND2 to the upper layer of the fourth ground layer GND4.

[0169] The first array antenna 1200a can be configured in the upper layer of the fourth ground layer GND4. The second array antenna 1300a can be configured in the layer between the first ground layer GND1 and the second ground layer GND2. Thus, under the action of the second ground layer GND2 to the fourth ground layer GND4, even if the first array antenna 1200a and the second array antenna 1300a are implemented as the same horizontal polarization, there is almost no interference with each other.

[0170] In RFIC1400a, the length of the feeding pattern of the first array antenna 1200a can be configured to be the same relative to all multiple antenna elements. The length of the feeding pattern of the first array antenna 1200a can be determined as the sum of the first length L1a to the fourth length L4a. For all multiple patch antennas PA11 to PA18, PA21 to PA28 of the first array antenna 1200a, the length of the feeding pattern can be configured to be the same. For all multiple patch antennas PA11 to PA18, PA21 to PA28, the first length L1a to the fourth length L4a can be configured to be the same, respectively. Thus, the signals applied from RFIC1400a to all multiple patch antennas PA11 to PA18, PA21 to PA28 can be in the same phase and form a beam toward the center position in the front direction.

[0171] A first through-hole pad VP1 may be formed on the eighth layer La8, and a second through-hole pad VP2 may be formed on the ninth layer La9 for vertical connection of the third type through holes Vc1 to Vc8, Vc9 to Vc16. A plurality of first patch antennas CP11 to CP18, CP21 to CP28 connected to the ends of the third type through holes Vc1 to Vc8, Vc9 to Vc16 may be configured on the tenth layer La10. The plurality of first patch antennas CP11 to CP18, CP21 to CP28 may be referred to as a plurality of feeding plates. The first interval G1 between adjacent first patch antennas CP11, CP12 may be formed to be smaller than the second interval G2 between other adjacent first patch antennas CP12, CP13.

[0172] The eleventh layer La11 may be provided with a portion of a metal layer forming a ground wall GW. The one side and the other side regions from the third layer La3 to the eleventh layer La11 may be provided with a plurality of conductive plates constituting a plurality of monopole antennas MA1 to MA6 of the third array antenna 1100a and the fourth array antenna 1100b.

[0173] The twelfth layer La12 may be provided with a plurality of patch antennas PA11 to PA18, PA21 to PA28 of the first array antenna 1200a. The centers of the plurality of patch antennas PA11 to PA18, PA21 to PA28 may be configured to deviate from the plurality of first patch antennas CP11 to CP18, CP21 to CP28 toward another axial direction. The third interval G3 between adjacent patch antennas PA11 and PA12 may be formed to be greater than the first interval G1 and less than the second interval G2.

[0174] On the other hand, the feeding structure of each layer constituting the first array antenna for front radiation in the antenna module implemented as a multi-layered antenna package in this specification is described in detail. Fig.10 yes Figure 9a An enlarged view of the first layer and the sixth layer among the multiple layers of the PCB. Fig.11 yes Figure 9b An enlarged view of the tenth and twelfth layers among the multiple layers of the PCB.

[0175] Reference Figures 7 to 11 , the plurality of signal connection lines (plurality of feeder lines) of the first layer La1 and the sixth layer La6 can be formed into a coplanar waveguide structure. The plurality of signal connection lines of the first layer La1 and the sixth layer La6 can be formed into a feeder line FL in the central part of the coplanar waveguide structure. In the coplanar waveguide structure of the first layer La1 and the sixth layer La6, grounding areas GL and GR can be configured on one side and the other side of the feeder line FL in the central part. A plurality of grounding vias can be formed in the grounding areas GL and GR to connect to the grounding area of ​​another layer. One side boundary and the other side boundary of the feeder line FL of the coplanar waveguide structure can be separated from the boundary of the grounding areas GL and GR by a specified interval.

[0176] RFIC1400a may be disposed at the center of the first layer La1. The plurality of pins of RFIC1400a may be connected to the plurality of feeders of the first side Sd1 as the upper region, the plurality of feeders of the second side Sd2 as the one side region, the plurality of feeders of the third side Sd3 as the other side region, and the plurality of feeders of the fourth side Sd4 as the lower region.

[0177] Based on the central axis of the PCB 1010a, ends Vc1 to Vc8 of the first to eighth feeders F1 to F8 may be disposed in the upper region. Based on the central axis of the PCB 1010a, ends Vc9 to Vc16 of the ninth to sixteenth feeders F9 to F16 may be disposed in the lower region.

[0178] The first to third feeders F1, F2, and F3 of the sixth layer La6 are formed into a structure configured in the upper (left) area of ​​PCB1010a. The fourth feeder F4 of the sixth layer La6 is formed into a structure connected from the upper area of ​​PCB1010a to the upper area again via the lower area. A portion of the fourth feeder F4 is configured at a position overlapping with the inner side of RFIC1400a.

[0179] The ninth to eleventh feeders F9, F10, and F11 of the sixth layer La6 are formed into a structure configured in the lower (left) area of ​​PCB1010a. The twelfth feeder F12 of the sixth layer La6 is formed into a structure connected from the upper area to the lower area of ​​PCB1010a. One end Vx12 of the twelfth feeder F12 is configured in the upper area, and the other end Vc12 is configured in the lower area. A portion of the twelfth feeder F12 is configured at a position overlapping with the inner side of RFIC1400a.

[0180] The sixth to eighth feed lines F6, F7, and F8 of the sixth layer La6 are formed into a structure configured in the upper (right) area of ​​PCB1010a. The fifth feed line F5 of the sixth layer La6 is formed into a structure connected from the upper area of ​​PCB1010a via the lower area and then to the upper area. A portion of the fifth feed line F5 is configured at a position overlapping with the inner side of RFIC1400a.

[0181] The fourteenth to sixteenth feeders F14, F15, and F16 of the sixth layer La6 are formed into a structure arranged in the lower (right) area of ​​PCB1010a. The thirteenth feeder F13 of the sixth layer La6 is formed into a structure connected from the upper area to the lower area of ​​PCB1010a. One end Vx13 of the thirteenth feeder F13 is arranged in the upper area, and the other end Vc13 is arranged in the lower area. A portion of the thirteenth feeder F13 is arranged at a position overlapping with the inner side of RFIC1400a.

[0182] The ends of the plurality of feeders on the first side Sd1 of the first layer La1 can be connected to one ends Vx2, Vx3, Vx4, Vx12, Vx13, Vx5, Vx6, Vx7 of the plurality of feeders F2, F3, F4, F12, F13, F5, F6, F7 of the sixth layer La6 through vertical through holes. The ends of the plurality of feeders on the second side Sd2 of the first layer La1 can be connected to one ends Vx1, Vx9, Vx10, Vx11 of the plurality of feeders F1, F9, F10, F11 of the sixth layer La6 through vertical through holes. The ends of the plurality of feeders on the third side Sd3 of the first layer La1 can be connected to one ends Vx8, Vx14, Vx15, Vx16 of the plurality of feeders F8, F14, F15, F16 of the sixth layer La6 through vertical through holes.

[0183] The plurality of feed lines F1 to F16 constituting all antenna elements of the first array antenna 1200a can be formed with the same length on the sixth layer La6. A ground layer having a plurality of through holes is disposed on one side and the other side of the plurality of feed lines F1 to F16. Thus, the sixth layer La6 having the plurality of feed lines F1 to F16 is formed as a coplanar waveguide layer.

[0184] The center positions of the other ends Vc1 to Vc16 of the plurality of feed lines F1 to F16 constituting all antenna elements of the first array antenna 1200a correspond to the feeding points of all antenna elements through vertical through holes. Fig.11 yes Figure 9b An enlarged view of the tenth and twelfth layers in which the first patch elements and the second patch elements are arranged among the multiple layers.

[0185] The plurality of feeders F1 to F16 constituting all antenna elements of the first array antenna 1200a may form a symmetrical structure with the Y axis as the vertical axis as the reference. The first feeder F1 and the eighth feeder F8 may form a symmetrical structure with the Y axis as the reference. Most areas of the first feeder F1 and the eighth feeder F8 are formed as straight lines parallel to the X axis. Considering the vertical axis coordinate difference between one end Vx1 and the other end Vc1 of the first feeder F1 and one end Vx8 and the other end Vc8 of the eighth feeder F8, a part of the end areas of the first feeder F1 and the eighth feeder F8 may be formed as a curved portion and an inclined straight line.

[0186] The second feeder F2 and the seventh feeder F7 may form a symmetrical structure with the Y axis as a reference. Most areas of the second feeder F2 and the seventh feeder F7 are formed as straight lines parallel to the X axis. Considering the vertical axis coordinate difference between one end Vx2 and the other end Vc2 of the second feeder F2 and one end Vx7 and the other end Vc7 of the seventh feeder F7, a part of the end areas of the second feeder F2 and the seventh feeder F7 may be formed as a curved portion and an inclined straight line. The lengths of the first feeder F1 and the eighth feeder F8 may be formed identically to the lengths of the second feeder F2 and the seventh feeder F7.

[0187] The third feeder F3 and the sixth feeder F6 may form a symmetrical structure with the Y axis as a reference. The third feeder F3 and the sixth feeder F6 may have two straight lines parallel to the X axis. The interval between the two straight lines of the third feeder F3 and the sixth feeder F6 is formed to be more than 1 / 4 of the wavelength corresponding to the operating frequency, so that the interference between each other can be kept below a preset level. The lengths of the first feeder F1 and the eighth feeder F8, the lengths of the second feeder F2 and the seventh feeder F7, and the lengths of the third feeder F3 and the sixth feeder F6 may be formed identically.

[0188] The fourth feeder F4 and the fifth feeder F5 may form a symmetrical structure with the Y axis as a reference. The fourth feeder F4 and the fifth feeder F5 may have two straight lines parallel to the Y axis. The interval between the two straight lines of the fourth feeder F4 and the fifth feeder F5 is formed to be more than 1 / 4 of the wavelength corresponding to the operating frequency, so that the interference between each other can be kept below a preset level. The lengths of the first feeder F1 and the eighth feeder F8, the lengths of the second feeder F2 and the seventh feeder F7, the third feeder F3 and the sixth feeder F6, and the lengths of the fourth feeder F4 and the fifth feeder F5 may all be formed identically.

[0189] The ninth feeding line F9 and the sixteenth feeding line F16 may form a symmetrical structure with respect to the Y axis. The ninth feeding line F9 and the sixteenth feeding line F16 may include a straight line parallel to the X axis, a straight line inclined in an upper direction, and a straight line inclined in a lower direction.

[0190] The tenth feeder F10 and the fifteenth feeder F15 may form a symmetrical structure with the Y axis as a reference. The tenth feeder F10 and the fifteenth feeder F15 may include a straight line parallel to the X axis, a straight line inclined toward the upper direction, and two straight lines parallel to the Y axis. The interval between the two straight lines of the tenth feeder F10 and the fifteenth feeder F15 is formed to be greater than 1 / 4 of the wavelength corresponding to the operating frequency, so that the interference between them can be kept below a preset level. The lengths of the ninth feeder F9 and the sixteenth feeder F16 and the lengths of the tenth feeder F10 and the fifteenth feeder F15 may be formed identically.

[0191] The eleventh feeder F11 and the fourteenth feeder F14 may form a symmetrical structure with the Y axis as a reference. The eleventh feeder F11 and the fourteenth feeder F14 may include two straight lines parallel to the X axis and two straight lines parallel to the Y axis. The interval between the two straight lines of the eleventh feeder F11 and the fourteenth feeder F14 is formed to be more than 1 / 4 of the wavelength corresponding to the operating frequency, so that the interference between each other can be kept below a preset level. The lengths of the ninth feeder F9 and the sixteenth feeder F16, the lengths of the tenth feeder F10 and the fifteenth feeder F15, and the lengths of the eleventh feeder F11 and the fourteenth feeder F14 may all be formed identically.

[0192] The twelfth feeder F12 and the thirteenth feeder F13 may form a symmetrical structure with the Y axis as a reference. The twelfth feeder F12 and the thirteenth feeder F13 may include a straight line parallel to the X axis and a straight line parallel to the Y axis. The lengths of the ninth feeder F9 and the sixteenth feeder F16, the lengths of the tenth feeder F10 and the fifteenth feeder F15, the lengths of the eleventh feeder F11 and the fourteenth feeder F14, and the lengths of the twelfth feeder F12 and the thirteenth feeder F13 may all be formed identically.

[0193] In addition, the first feeder F1 to the eighth feeder F8 in the upper region based on the X-axis of the sixth layer La6 and the ninth feeder F9 to the sixteenth feeder F16 in the lower region based on the X-axis can be formed in the same manner. Thus, it is possible to prevent the beam direction from changing or the beam quality from decreasing due to the phase difference applied to each antenna element caused by the difference in the length of the feeder of each layer.

[0194] The tenth layer La10 may include a plurality of first patch antennas CP11 to CP18, CP21 to CP28. The patch antennas CP11 and CP12 adjacent to each other along an axial direction in the plurality of first patch antennas may be configured to be separated by a first interval G1. The other patch elements CP12 and CP13 adjacent to each other along an axial direction in the plurality of first patch antennas may be configured to be separated by a second interval G2.

[0195] The twelfth layer La12 may include a plurality of second patch antennas PA11 to PA18, PA21 to PA28. Adjacent patch elements in the plurality of second patch antennas PA11 to PA18, PA21 to PA28 may be spaced apart by a third interval G3 along an axial direction.

[0196] In this regard, the plurality of first patch antennas CP11 and CP21 in the first column may be configured to be offset by a first distance Lx1 toward a positive axial direction from the center of the window area WR in the ground wall 1130. On the other hand, the plurality of first patch antennas CP12 and CP22 in the second column may be configured to be offset by a first distance Lx1 along a negative axial direction from the center of the window area WR in the ground wall 1130. The first distance Lx1 may be determined as (G3-G1) / 2.

[0197] The plurality of first patch antennas CP13, CP15, CP17, CP23, CP25, CP27 in the third, fifth, and seventh columns may be configured to be offset by a first distance Lx1 toward a positive axial direction from the center of the window area WR in the ground wall 1130. On the other hand, the plurality of first patch antennas CP14, CP16, CP18, CP24, CP26, CP28 in the fourth, sixth, and eighth columns may be configured to be offset by a first distance Lx1 along a negative axial direction from the center of the window area WR in the ground wall 1130. The first distance Lx1 may be determined as (G3-G1) / 2.

[0198] The feeding points Vc1 to Vc16 of the plurality of feeding lines F1 to F16 constituting all antenna elements of the first array antenna 1100a correspond to the feeding positions of the plurality of first patch antennas CP11 to CP18, CP21 to CP28. Therefore, the feeding points Vc1 to Vc16 of the plurality of feeding lines F1 to F16 are vertically connected to the positions deviated from the centers of the plurality of first patch antennas CP11 to CP18, CP21 to CP28 through vertical through holes. Therefore, according to the feeding points Vc1 to Vc16 determined for impedance matching, points deviated from the centers of the plurality of first patch antennas CP11 to CP18, CP21 to CP28 are formed.

[0199] The center positions of the other ends Vc1 to Vc16 of the plurality of feeding lines F1 to F16 constituting all antenna elements of the first array antenna 1200a correspond to the center positions of the feeding points of all antenna elements through vertical through holes.

[0200] On the other hand, refer to Figures 1 to 11 The multi-layered antenna package of this specification is described. The antenna module 1000a may be configured to include a PCB 1010a, a phased array antenna portion 1200a, an RFIC 1400a, and a plurality of signal connection lines SL1 to SL4.

[0201] PCB1010a may include a plurality of layers. The plurality of layers may include a plurality of metal surfaces and dielectric layers. The plurality of metal surfaces may be stacked in an electrically separated manner under the action of the dielectric layers therebetween.

[0202] The array antenna unit 1200a may be configured to include a plurality of antenna elements PA11 to PA18, PA21 to PA28 disposed on the PCB 1010a. Each of the plurality of antenna elements PA11 to PA18, PA21 to PA28 may be configured to radiate a wireless signal. Figure 7 As shown in (b) of FIG. 1 , each of the plurality of antenna elements may be configured as a patch antenna structure including at least two patch antennas 1210 and 1220. As another embodiment, Figure 7 As shown in (c) in FIG. 1 , the array antenna portion 1200a may be configured as a patch antenna structure including a patch antenna 1210b.

[0203] Reference Figure 7 In (b), the first patch antenna 1220 of the two patch antennas may be located on the first surface S1 of the PCB 1010a, and the first surface S1 may be the outmost surface of the PCB 1010a. The second patch antenna 1210 of the two patch antennas may be disposed inside the PCB 1010a. A portion of the first patch antenna 1220 and a portion of the second patch antenna 1210 may overlap and stack with each other.

[0204] Reference Figure 7 In (c), the patch antenna 1210b may be located on the first surface S1 of the PCB 1010a, and the first surface S1 may be the outmost surface of the PCB 1010a.

[0205] Reference Figures 1 to 11 , the RFIC 1400a may be configured to be bonded to the second surface S2. The second surface S2 may be another outermost surface of the PCB 1010a.

[0206] Each of the plurality of signal connection lines can be configured to connect from RFIC1400a to the array antenna unit 1200a. Wireless signals can be transmitted between the array antenna unit 1200a and the RFIC1400a through the plurality of signal connection lines SL1 to SL4. Each of the plurality of signal connection lines SL1 to SL4 can be connected to and fed by the second patch antenna 1210 located inside the PCB1010a. Each of the plurality of signal connection lines SL1 to SL4 can be configured not to be directly connected to the first patch antenna 1220 located on the first surface S1 of the PCB1010a. The length of the plurality of signal connection lines SL1 to SL4 can be the length connected between the RFIC1400a and the array antenna unit 1200a. The plurality of signal connection lines can be formed with the same length.

[0207] The plurality of signal connection lines SL1 to SL4 may be arranged between the array antenna part 1200a and the RFIC 1400a inside the PCB 1010a. The plurality of signal connection lines SL1 to SL4 may include a coplanar waveguide layer. The coplanar waveguide layer may be arranged on a conductive plate between two ground conductive plates inside the PCB 1010a.

[0208] The conductive plate of the coplanar waveguide layer may include a plurality of signal connection lines SL1 to SL4 and a ground portion. The plurality of signal connection lines and the ground portion may be arranged on the same conductive plate between two ground conductive plates inside the PCB 1010a.

[0209] Each of the plurality of signal connection lines SL1 to SL4 may include a first portion SL1, a second portion SL2, a third portion SL3, and a fourth portion SL4. The first portion SL1 may be configured on the second surface S2 of the PCB 1010a. The third portion SL3 may be configured to form a coplanar waveguide structure WG2. The second portion SL2 may be configured to electrically connect the first portion SL1 to the third portion SL3. The fourth portion SL4 may be configured to electrically connect the third portion SL3 to one of the plurality of second patch antennas 1210.

[0210] A first grounding region 1100g formed of a metal surface may be formed between the coplanar waveguide structure WG2 and the RFIC chip 1400a. A second grounding region 1200g may be formed between the coplanar waveguide structure WG2 and the patch antenna 1210b.

[0211] PCB1010a may include a first layer La1 to a sixth layer La6. A first portion SL1 of a plurality of signal connection lines may be configured on the first layer La1 of PCB1010a. A second portion SL2 of a plurality of signal connection lines may be formed as a first vertical through hole from the first layer La1 to the sixth layer La6 of PCB1010a. A third portion SL3 of a plurality of signal connection lines may be configured on the sixth layer La6 of PCB1010a. A fourth portion SL4 of a plurality of signal connection lines may be formed as a second vertical through hole from the sixth layer La6 to the second patch antennas CP11 to CP18, CP21 to CP28.

[0212] For the plurality of antenna elements PA11 to PA18, PA21 to PA28, the lengths of the first portions SL1 of the plurality of signal connection lines on the first layer La1 can all be formed identically. For the plurality of antenna elements PA11 to PA18, PA21 to PA28, the lengths of the third portions SL3 of the plurality of signal connection lines on the sixth layer La6 can all be formed identically.

[0213] For the plurality of antenna elements PA11 to PA18, PA21 to PA28, the lengths (heights) of the first vertical through holes corresponding to the second portion SL2 can all be formed in the same manner. The end points of the first vertical through holes in the sixth layer La6 are represented by Vx1 to Vx16. For the plurality of antenna elements PA11 to PA18, PA21 to PA28, the lengths (heights) of the second vertical through holes corresponding to the fourth portion SL4 can all be formed in the same manner. The starting points of the second vertical through holes in the sixth layer La6 are represented by Vc1 to Vc16. The lengths of the plurality of feed lines F1 to F16 in the sixth layer La6 can all be formed as the same feed length.

[0214] A portion of the plurality of upper feeder lines F3, F4, F5, and F6 may be composed of two parallel lines spaced at a predetermined interval or more, so as to be formed to have the same length as the other plurality of feeder lines. A portion of the plurality of lower feeder lines F10, F11, F12, F13, F14, and F15 may also be composed of two parallel lines spaced at a predetermined interval or more, so as to be formed to have the same length as the other plurality of feeder lines. The two parallel lines are arranged so that the interval between them is greater than 1 / 4 of the wavelength corresponding to the operating frequency, so that the interference between the plurality of lines can be reduced to below a preset level. This is because when the two parallel lines are arranged so that the interval between them is less than 1 / 4 of the wavelength, the effective electrical length may be reduced due to the interference between the plurality of lines.

[0215] According to the same feeding length, in-phase signals can be applied to each of the plurality of antenna elements PA11 to PA18, PA21 to PA28 on each layer of PCB1010a, thereby preventing the degradation of beam quality caused by phase errors of signals applied to each antenna element.

[0216] The plurality of feed lines of the first layer La1 can be connected to the plurality of feed lines of the sixth layer La6 using the first vertical through hole passing through the first ground layer and the second ground layer. The plurality of feed lines of the sixth layer La6 can be connected to the plurality of second patch antennas CP11 to CP18, CP21 to CP28. The plurality of feed lines of the sixth layer La6 can all be formed with the same length.

[0217] The array antenna portion 1200a may include a first array antenna portion 1250a and a second array antenna portion 1250b. The first array antenna portion 1250a may be configured with eight first patch antennas PA11 to PA18 and eight second patch antennas CP11 to CP18 in a first row along the X-axis direction. The second array antenna portion 1250b may be configured with eight first patch antennas PA21 to PA28 and eight second patch antennas CP21 to CP28 in a second row along the X-axis direction. The array antenna portion 1200a may be implemented as a 2x8 array antenna.

[0218] The first part SL1 of the plurality of signal connection lines can be connected to the plurality of pins of the first side Sd1, the second side Sd2 and the fourth side Sd4 of the RFIC1400a. The first side Sd1 can be the upper area of ​​the RFIC1400a. The second side Sd2 can be a side area of ​​the RFIC1400a. The fourth side Sd4 can be the other side area of ​​the RFIC1400a.

[0219] The first portion SL1 of the plurality of signal connection lines arranged on the first layer La1 can form a symmetrical structure with the center of the Y axis of the PCB1010a as the reference. The third portion SL3 of the plurality of signal connection lines arranged on the sixth layer La6 can form a symmetrical structure with the center of the Y axis of the PCB1010a as the reference.

[0220] The first array antenna unit 1250a may be arranged at an upper portion centered on the X-axis. The second array antenna unit 1250b may be arranged at a lower portion centered on the X-axis. Beamforming may be performed in an upper direction or a lower direction based on the front center by applying a phase difference between signals between the first array antenna unit 1250a and the second array antenna unit 1250b. Figure 6 In the embodiment, when an obstacle is arranged between the communication device 100 and the electronic device 200 arranged in the front area, it is possible to transmit content by using a signal reflected by the ceiling by performing beamforming from the center of the front toward the upper part.

[0221] The first patch CP11 of the first array antenna part 1250a can be connected to the second side Sd2 of the RFIC1400a through the feeder F1. The second patch CP12 of the first array antenna part 1250a can be connected to the first side Sd1 of the RFIC1400a through the feeder F2. The third patch CP13 of the first array antenna part 1250a can be connected to the first side Sd1 of the RFIC1400a through the feeder F3. The fourth patch CP14 of the first array antenna part 1250a can be connected to the first side Sd1 of the RFIC1400a through the feeder F4. The first patch CP11 to the fourth patch CP14 can be sequentially arranged on the upper left side of the PCB1010a. The plurality of feeders F1 to F4 of the first patch CP11 to the fourth patch CP14 can be arranged on the upper left side of the PCB1010a, and can all be formed with the same length.

[0222] The fifth patch CP15 of the first array antenna portion 1250a can be connected to the first side Sd1 of the RFIC1400a through the feeder F5. The sixth patch CP16 of the first array antenna portion 1250a can be connected to the first side Sd1 of the RFIC1400a through the feeder F6. The seventh patch CP17 of the first array antenna portion 1250a can be connected to the first side Sd1 of the RFIC1400a through the feeder F7. The eighth patch CP18 of the first array antenna portion 1250a can be connected to the fourth side Sd4 of the RFIC1400a through the feeder F8. The fifth patch CP15 to the eighth patch CP18 can be sequentially arranged on the upper right side of the PCB1010a. The plurality of feeders F5 to F8 of the fifth patch CP15 to the eighth patch CP18 can be arranged on the upper right side of the PCB1010a, and can all be formed with the same length.

[0223] The spacing distances between adjacent antenna elements of the array antenna unit 1200a may be different from each other. The adjacent antenna elements of the array antenna unit 1200a may be configured to be alternately offset in one direction and another direction on the X-axis. The first interval G1 between the feeding point of the first patch CP11 and the feeding point of the second patch CP12 may be formed to be smaller than the second interval G2 between the feeding point of the second patch CP12 and the feeding point of the third patch CP13.

[0224] The first patch CP21 of the second array antenna part 1250b can be connected to the second side Sd2 of RFIC1400a through the feed line F9. The second patch CP22 of the second array antenna part 1250b can be connected to the second side Sd2 of RFIC1400a through the feed line F10. The third patch CP23 of the second array antenna part 1250b can be connected to the second side Sd2 of RFIC1400a through the feed line F11. The fourth patch CP24 of the second array antenna part 1250b can be connected to the first side Sd1 of RFIC1400a through the feed line F12. The first patch CP21 to the fourth patch CP24 can be sequentially arranged at the lower left side of PCB1010a. The plurality of feed lines F9 to F12 of the first patch CP21 to the fourth patch CP24 can be arranged at the lower left side of PCB1010a, and can all be formed with the same length.

[0225] The fifth patch CP25 of the second array antenna portion 1250b can be connected to the first side Sd1 of RFIC1400a through the feed line F13. The sixth patch CP26 of the second array antenna portion 1250b can be connected to the fourth side Sd4 of RFIC1400a through the feed line F14. The seventh patch CP27 of the second array antenna portion 1250b can be connected to the fourth side Sd4 of RFIC1400a through the feed line F15. The eighth patch CP28 of the second array antenna portion 1250b can be connected to the fourth side Sd4 of RFIC1400a through the feed line F16. The fifth patch CP25 to the eighth patch CP28 can be sequentially arranged at the lower right side of PCB1010a. The plurality of feed lines F13 to F16 of the fifth patch CP25 to the eighth patch CP28 can be arranged at the lower right side of PCB1010a, and can all be formed with the same length.

[0226] The spacing distances between adjacent antenna elements of the array antenna unit 1200a may be different from each other. Adjacent antenna elements of the array antenna unit 1200a may be configured to be alternately offset in one direction and another direction on the X-axis. A first spacing G1 between a feeding point of the first patch CP21 and a feeding point of the second patch CP22 may be formed to be smaller than a second spacing G2 between a feeding point of the second patch CP22 and a feeding point of the third patch CP23.

[0227] On the other hand, the monopole antenna and dipole antenna constituting the array antenna of this specification are described in detail. In this regard, Fig.12a and Figure 12b A cross-sectional view and a side view of the monopole antenna of the present specification are shown. Fig.13 A front view of the dipole antenna of the present specification is shown.

[0228] Reference Fig.12a and Figure 12b The monopole antenna 1110 is configured to include via pads 1112 arranged in a plurality of layers and vias 1111 connecting the via pads 1112. The vias 1111 may include a first via 1111a and a second via 1111b arranged in parallel with the first via 1111a in a lateral direction.

[0229] The via pad 1112 may include a plurality of via pads 1112a to 1112n disposed at n layers different from each other. Figures 7 to 12b , the through-hole pads in the nine layers from the third layer La3 to the eleventh layer La11 can be connected by eight through-holes, but are not limited thereto and can be changed according to the application. The first through-hole 1111a, the second through-hole 1111b and the through-hole pad 1112 are formed to have inductance and capacitance in structure. Therefore, under the effect of the capacitor-inductor resonant cavity circuit (LC Tank) structure, the antenna operating frequency is reduced and the width is widened, so that the antenna can be miniaturized.

[0230] The antenna module 1000a may further include a via wall structure 1130 spaced apart at a specified interval toward the inner side direction of the substrate 1010a. The via wall structure 1130 may be configured to include a plurality of vertical vias vertically connected to each other at a plurality of positions between a plurality of pads. The via wall structure 1130 may be formed as a ground via wall electrically connected to the ground of the multilayer substrate 1010a. The via wall structure 1130 forms a ground structure and can act as a reflector for signals radiated from the monopole antenna 1110. According to another embodiment, the via wall structure 1130 may be formed as a floating via wall that is not electrically connected to the ground of the substrate 1010a.

[0231] The feeder 1120f connected to the monopole antenna 1110 is configured to feed a signal to the monopole antenna 1110. A ground layer 1120g may be disposed at the lower layer of the feeder 1120f. Thus, the feeder 1120f may be formed into a microstrip line structure. As another example, a ground layer may be further disposed at the upper layer of the feeder 1120f to form a stripline structure (or a coplanar waveguide structure).

[0232] Reference Fig.13 The feeding pattern 1310f for feeding the dipole antenna 1310 may be disposed between the first ground layer GND1 and the second ground layer GND2. The first ground layer GND1 and the second ground layer GND2 may be connected through a plurality of vias.

[0233] The dipole antenna 1310 may be configured to include a first conductive pattern 1311 and a second conductive pattern 1312. The first conductive pattern 1311 may not be connected to the ground pattern but may be connected to the internal feed pattern 1310f. The second conductive pattern 1312 may be connected to the first ground layer GND1 through a through hole 1320v. The second conductive pattern 1312 may be connected to a ground pattern 1320g of the second ground layer GND2 through the through hole 1320v. The through hole 1310v may be configured to pass through a plurality of layers to connect the first ground layer GND1, the first conductive pattern 1311, and the second ground layer GND2.

[0234] The feed pattern 1310f may be configured with a first ground layer GND1 and a second ground layer GND2 in the upper layer and the lower layer, and formed into a stripline structure (or a coplanar waveguide structure). Figure 9a and Fig.11 The dipole antenna 1310 may be disposed on the third layer La3. The first ground layer GND1 may correspond to the first ground layer of the second layer La2. The second ground layer GND2 may correspond to the second ground layer of the fourth layer La4.

[0235] Reference Figure 6 , Fig.12a as well as Figure 12b , the monopole antenna 1110 forms a radiation pattern toward the side direction of the substrate 1010a, thereby being able to send and receive signals toward the side direction of the substrate 1010a. Figure 6 and Fig.13 , the dipole antenna 1310 forms a radiation pattern toward the lower direction of the substrate 1010a, thereby being able to transmit and receive signals toward the lower direction of the substrate 1010a.

[0236] On the other hand, at least one of the plurality of array antennas of the antenna module that can be configured in the other side area of ​​the electronic device of the present specification can be implemented as a vertically polarized antenna. In this regard, Fig.14 and Fig.15 A front view and a cross-sectional view of a substrate formed with an antenna module that can be configured on the other side of an electronic device are shown. Fig.16 yes Fig.14 A three-dimensional image of the antenna module and an enlarged image of a portion of the area.

[0237] Fig.14(a) in FIG. 1 is a diagram of a substrate on which an antenna module 1000a is formed, divided according to regions. The substrate 1010b may include a center portion CR and a periphery PE (periphery) surrounding the center portion CR. The periphery PE of the substrate 1010b may include a first portion P1 to a fourth portion P4. The first portion P1 constitutes a lower region of the substrate 1010b, and the second portion P2 constitutes a side region of the substrate 1010b. The third portion P3 constitutes the other side region of the substrate 1010b, and the fourth portion P4 constitutes an upper region of the substrate 1010b.

[0238] Reference Figure 5 and Fig.14 The antenna module 1000b may be configured to include a substrate 1010b, a first array antenna 1200b, a second array antenna 1300b, a third array antenna 1100c, and a fourth array antenna 1100d. Since the third antenna module 1000c and the fourth array antenna 1100d are arranged on one side and the other side of the substrate 1010a, they may be referred to as a third side array antenna and a fourth side array antenna.

[0239] Fig.15 (a) is a cross-sectional view of the antenna module 1000b. Fig.15 (b) is a cross-sectional view showing each layer of the substrate 1010b. Fig.16 (a) in FIG. 1 is a perspective view showing a region on one side with the center of the antenna module 1000 b as a reference. Fig.16 (b) is an enlarged view of a region where a portion of the plurality of monopole antennas MA11 to MA14 constituting the second array antenna 1300b of the antenna module is arranged.

[0240] Reference Fig.15 , the RFIC 1400a may be configured on the first layer La1 of the antenna module 1000b. A plurality of ground layers may be configured in the internal area of ​​the antenna module 1000b. For example, the first ground layer GND1, the second ground layer GND2, the third ground layer GND3, and the fourth ground layer GND4 may be configured on the second layer La2, the fourth layer La4, the fifth layer La5, and the seventh layer La7.

[0241] The plurality of conductive patterns in the inner region of the antenna module 1000b may be separated and stacked by a plurality of dielectric layers in the height direction. For example, the first dielectric layer DL1 may be disposed between the first layer La1 and the second layer La2, the second dielectric layer DL2 may be disposed between the third layer La3 and the fourth layer La4, the third dielectric layer DL3 may be disposed between the fourth layer La4 and the fifth layer La5, and the fourth dielectric layer DL4 may be disposed between the sixth layer La6 and the seventh layer La7.

[0242] A plurality of coplanar waveguide layers may be configured at each layer in the inner region of the antenna module 1000b. A first coplanar waveguide layer WG1 having a plurality of signal connection lines and a plurality of ground portions may be formed in the third layer La3. A second coplanar waveguide layer WG2 having a plurality of signal connection lines and a plurality of ground portions may be formed in the sixth layer La6.

[0243] It can be considered that a plurality of dielectric layers are formed in a layer corresponding to the ground layer of the antenna module 1000b. In this regard, a plurality of dielectric layers can be configured in the inner region of the antenna module 1000b. For example, a first dielectric layer DL1 can be configured in the second layer La2, a second dielectric layer DL2 can be configured in the fourth layer La4, a third dielectric layer DL3 can be configured in the fifth layer La5, and a fourth dielectric layer DL4 can be configured in the seventh layer La7.

[0244] Reference Fig.15 The first layer La1 is the interface layer IL of RFIC1400b, and the second layer La2 is the first ground layer GND1 formed by grounding and vias. A first dielectric layer DL1 may be configured between the first layer La1 and the second layer La2, or the second layer La2 may include the first ground layer GND1 and the first dielectric layer DL1.

[0245] The third layer La3 is a first coplanar waveguide layer WG1 formed with a plurality of conductive patterns and a ground portion. The fourth layer La4 is a second ground layer GND2 formed of a ground and a via. A second dielectric layer DL2 may be disposed between the third layer La3 and the fourth layer La4, or the fourth layer La4 may include the second dielectric layer DL2.

[0246] A third dielectric layer DL3 may be disposed between the fourth layer La4 and the fifth layer La5, or the fifth layer La5 may include the third dielectric layer DL3. The fifth layer La5 is a third ground layer GND3 formed of a ground and a through hole. The sixth layer La6 is a second coplanar waveguide layer WG2 formed with a plurality of conductive patterns and a ground portion. A fourth dielectric layer DL4 may be disposed between the sixth layer La6 and the seventh layer La7, or the seventh layer La7 may include the fourth dielectric layer DL4.

[0247] Reference Figure 5 , Figures 14 to 16, the first array antenna 1200b may also include a plurality of dummy pads DP11 to DP22 configured on one side and the other side of the plurality of patch antennas PA11 to PA28. The first dummy pad DP11 of the plurality of dummy pads DP11 to DP22 is configured between the first patch antenna PA11 of the first row and the second portion P2. The second dummy pad DP12 is configured between the eighth patch antenna PA18 of the first row and the third portion P3. The third dummy pad DP21 of the plurality of dummy pads DP11 to DP22 is configured between the first patch antenna PA21 of the second row and the second portion P2. The fourth dummy pad DP22 is configured between the eighth patch antenna PA28 of the second row and the third portion P3.

[0248] A ground wall (GW) 1130 may be formed to surround a plurality of dummy pads DP11 to DP22. A first patch antenna 1220 of each of the plurality of patch antennas PA11 to PA28 is not connected to a feed line. A plurality of dummy pads DP11 to DP22 are formed to be not connected to a plurality of feed lines. A second patch antenna 1210 of each of the plurality of patch antennas PA11 to PA28 may be connected to a feed line.

[0249] The spacing distance and dimensions between the ground wall (GW) 1130 and the plurality of dummy pads DP11 to DP22 can be implemented within a specified range based on the half wavelength of 60 GHz as the operating frequency. The layer positions and dimensions of the plurality of first patch antennas CP11 to CP28 corresponding to the coupling pads and the overlapping areas with the plurality of patch antennas PA11 to PA28 can be designed in consideration of radiation characteristics and arrangement characteristics.

[0250] Reference Figures 14 to 16 The antenna module 1000b may further include a millimeter wave transceiver circuit 1400b.

[0251] The substrate 1010b may have a first surface S1, a second surface S2, a periphery PE, and a center portion CR. A periphery PE may be formed between the first surface S1 and the second surface S2. The first surface S1 may be formed as an opposite side to the second surface S2. The substrate 1010b may be implemented as a multi-layer substrate. For example, the substrate 1010b may be implemented as a 12-layer substrate, but is not limited thereto and may be changed according to the application. The first surface S1 of the substrate 1010b may correspond to the surface of the twelfth layer La12.

[0252] The substrate 1010b may form a plurality of side surfaces. The first surface S1 of the plurality of side surfaces may be formed to face the front direction of the antenna module 1000b, and the second surface S2 may be formed to face the back direction of the antenna module 1000b. The third surface S3 and the fourth surface S4 of the plurality of side surfaces may be formed to face the left side direction and the right side direction of the antenna module 1000b. The fifth surface S5 of the plurality of side surfaces may be formed to face the bottom direction of the antenna module.

[0253] A third array antenna 1100c and a fourth array antenna 1100d may be formed at the second portion P2 and the third portion P3 of the periphery PE of the substrate 1010b. The third array antenna 1100c and the fourth array antenna 1100d may form beam patterns toward a plurality of side regions of the electronic device. The third array antenna 1100c and the fourth array antenna 1100d may radiate a plurality of horizontally polarized signals toward a plurality of side regions of the electronic device.

[0254] The third array antenna 1100c may include a plurality of first monopole antennas MA1 to MA3 formed at a second portion P2 of the periphery PE of the substrate 1010b. The fourth array antenna 1100d may include a plurality of first monopole antennas MA4 to MA6 formed at a third portion P3 of the periphery PE of the substrate 1010b. The third array antenna 1100c and the fourth array antenna 1100d may be implemented as three antenna elements on one side and the other side of the periphery PE of the substrate 1010b, respectively, and the third array antenna 1100c may be implemented as a 1x3 array antenna on one side of the substrate 1010b, but is not limited thereto. The fourth array antenna 1100d may be implemented as a 1x3 array antenna on the other side of the substrate 1010b, but is not limited thereto.

[0255] A first array antenna 1200b may be formed on the first surface S1 of the substrate 1010b. The first array antenna 1200b may form a beam pattern toward the front area of ​​the electronic device. The first array antenna 1200b may radiate horizontally polarized signals toward the front area of ​​the electronic device. The first array antenna 1200b may be implemented as 16 antenna elements in the center portion CR of the substrate 1010b.

[0256] The first array antenna 1200b may include a plurality of patch antennas PA11 to PA18, PA21 to PA28 formed on the first surface S1 of the substrate 1010b. A plurality of dummy pads DP11, DP21 may be configured on one side of the plurality of patch antennas PA11, PA21, so as to suppress side surface radiation. A plurality of dummy pads DP12, DP22 may be configured on the other side of the plurality of patch antennas PA11, PA21, so as to suppress side surface radiation. The first array antenna 1200b may be implemented as 16 2x8 array antennas in the center portion CR of the substrate 1010b, but is not limited thereto.

[0257] Each of the patch antennas of the first array antenna 1200b may include a first patch antenna 1220 and a second patch antenna 1210. The second patch antenna 1210 is stacked on the first patch antenna 1220 in a vertical direction to couple the signal of the first patch antenna 1220. The center of the second patch antenna 1210 may be formed to be offset in an axial direction relative to the center of the first patch antenna 1220. The center of the second patch antenna 1210 may be aligned and configured along another axial direction perpendicular to the one axial direction relative to the center of the first patch antenna 1220.

[0258] The second interval between the adjacent plurality of first patch elements 1221, 1222 can be formed to be larger than the first interval between the adjacent plurality of second patch elements 1211, 1212. To this end, the first patch element 1221 of the first column can be configured to be offset in the left direction relative to the second patch element 1211 of the first column. On the other hand, the first patch element 1222 of the second column can be configured to be offset in the right direction relative to the second patch element 1212 of the second column. The current direction of the signal applied to the second patch element 1211 of the first column is the left direction, and the current direction of the signal applied to the second patch element 1212 of the second column is the right direction. The current directions of the signals applied to the second patch elements 1211, 1212 of the first column and the second column are opposite directions. Therefore, it is necessary to make the phase difference of the signals applied to the second patch elements 1211, 1212 of the first column and the second column 180 degrees, so as to form currents in the same direction. To this end, RFIC 1400 b may control a phase shifter so that the phase difference between the signals applied to the second patch elements 1211 and 1212 in the first column and the second column is 180 degrees.

[0259] A second array antenna 1300b may be formed at a first portion P1 of the periphery PE of the substrate 1010b. The second array antenna 1300b may form a beam pattern toward a lower region of the electronic device. The second array antenna 1300b may radiate vertically polarized signals toward a lower region of the electronic device.

[0260] The second array antenna 1300b may include a plurality of second monopole antennas MA11 to MA20 formed at a first portion P1 of the periphery PE of the substrate 1010b. The second array antenna 1300b may be implemented as 10 antenna elements at the lower side of the periphery PE of the substrate 1010b. The second array antenna 1300b may be implemented as 10 1x10 array antennas at the lower side of the periphery PE of the substrate 1010b, but is not limited thereto.

[0261] The millimeter wave transceiver circuit 1400b can be configured on the second surface S2. The millimeter wave transceiver circuit 1400b can be configured to use at least one of the first array antenna 1200b, the second array antenna 1300b, the third array antenna 1100c and the fourth array antenna 1100d to send and receive signals with frequencies between 10 GHz and 400 GHz. The millimeter wave transceiver circuit 1400b can be configured to use at least one of the plurality of first monopole antennas MA1 to MA6, the plurality of patch antennas PA11 to PA18, PA21 to PA28 and the plurality of second monopole antennas MA11 to MA20 to send and receive signals with frequencies between 10 GHz and 400 GHz. The millimeter wave transceiver circuit 1400b can be called an RFIC (Radio Frequency Integrated Chip).

[0262] The number of elements of the first array antenna 1200b forming a beam pattern toward the front region may be set to be greater than the number of elements of the second array antenna 1300b forming a beam pattern toward the lower region. The number of elements of the second array antenna 1300b forming a beam pattern toward the lower region may be set to be greater than the number of the third array antenna 1100c and the fourth array antenna 1100d forming a beam pattern toward the side region.

[0263] In this regard, 16 of the 32 pins of RFIC1400b may be connected to the first array antenna 1200b that forms a beam pattern toward the front region. 10 of the 32 pins of RFIC1400b may be connected to the second array antenna 1300b that forms a beam pattern toward the lower region. 6 of the 32 pins of RFIC1400b may be connected to the third array antenna 1100c and the fourth array antenna 1100d that form a beam pattern toward the side region.

[0264] In this regard, since the first array antenna 1200b has the largest number of elements, it is able to transmit signals over a long distance to the front area of ​​the electronic device, but there is a narrow beam coverage. The beam direction can be changed by beamforming in the horizontal direction of the front area to compensate for the narrow beam coverage. Thus, the number of elements of the first array antenna 1200b can be implemented as a plurality along one axial direction and as two along another axial direction. For example, the first array antenna 1200b can be implemented as a 2x8 array antenna. By applying a phase difference between the plurality of signals between the antenna elements of the first row and the antenna elements of the second row, a beam can be formed from the front direction at a specified angle toward the upper direction.

[0265] The electronic device needs to perform AV wireless communication with another electronic device configured in the lower area of ​​the electronic device. For AV wireless communication, beamforming can be implemented in the lower area of ​​the electronic device in a horizontal direction as an axial direction with a narrow beam coverage unit. On the other hand, it is not necessary to transmit signals to the lower area of ​​the electronic device over a long distance. Thus, the number of elements of the second array antenna 1300b can be implemented as a plurality along one axial direction and as one along another axial direction. For example, the second array antenna 1300b can be implemented as a 1x8, 1x10, or 1x12 array antenna.

[0266] In an indoor radio wave environment equipped with an electronic device, signals can also be transmitted to multiple side areas of the electronic device. For multiple side areas of the electronic device, it is more important to achieve wide beam coverage without beamforming than to transmit signals over long distances. In this regard, since the third array antenna 1100c and the fourth array antenna 1100d have the least number of elements, wide beam coverage can be provided to multiple side areas of the electronic device. Thus, the number of elements of the third array antenna 1100c and the fourth array antenna 1100d can be implemented as a plurality along one axial direction and as one along another axial direction. For example, the third array antenna 1100c and the fourth array antenna 1100d can be implemented as a 1x3 array antenna on one side and the other side.

[0267] The above is a description of the configuration structure of multiple feeder lines in each layer of a multilayer antenna package having multiple array antennas according to one aspect of the present specification. The following is a description of the configuration structure of multiple feeder lines in each layer of an antenna module implemented by a multilayer antenna package having multiple array antennas formed into a multiple coplanar waveguide structure according to another aspect of the present specification. Figures 1 to 16 , an antenna module implemented as a multi-layer antenna package having a plurality of array antennas formed into a plurality of coplanar waveguide structures is described.

[0268] The antenna modules 1000a and 1000b include transceiver circuits 1400a and 1400b, a plurality of first resonating elements 1300a and 1300b, a plurality of second resonating elements 1200a and 1200b, and a plurality of signal connection lines SL1 to SL4. The antenna modules 1000a and 1000b may further include a first coplanar waveguide WG1 and a second coplanar waveguide WG2. The plurality of first resonating elements 1300a and 1300b may correspond to the second array antennas 1300a and 1300b. The plurality of second resonating elements 1200a and 1200b may correspond to the first array antennas 1200a and 1200b and the array antenna units 1200a and 1200b.

[0269] The first coplanar waveguide WG1 may be configured to convey a first signal having a frequency of 10 GHz or more between the transceiver circuits 1400a, 1400b and the plurality of first resonant elements 1300a, 1300b. The second coplanar waveguide WG2 may be configured to convey a second signal having a frequency of 10 GHz or more between the transceiver circuits 1400a, 1400b and the plurality of second resonant elements 1200a, 1200b.

[0270] The first coplanar waveguide WG1 may be interposed between the second coplanar waveguide WG2 and the transceiver circuits 1400a and 1400b. The second coplanar waveguide WG2 may be interposed between the first coplanar waveguide WG1 and the plurality of second resonant elements 1200a and 1200b.

[0271] The plurality of first resonant elements 1300a and 1300b may be interposed between the second coplanar waveguide WG2 and the transceiver circuits 1400a and 1400b. The plurality of second resonant elements 1200a and 1200b may be disposed on the opposite side to the transceiver circuits 1400a and 1400b.

[0272] Each of the plurality of second resonant elements 1200a, 1200b may be configured to radiate a wireless signal. The plurality of second resonant elements 1200a, 1200b may include a first patch antenna 1220 and a second patch antenna 1210. As another embodiment, the plurality of second resonant elements 1200a, 1200b may include a patch antenna 1210b.

[0273] Each of the plurality of second resonant elements 1200a, 1200b may be composed of two patch antenna structures. A first patch antenna 1220 of the two patch antennas may be located on a first surface S1 of the PCB 1010a, 1010b. The first surface S1 may be the outmost surface of the PCB 1010a, 1010b. A second patch antenna 1210 of the two patch antennas may be disposed inside the PCB 1010a, 1010b. A portion of the first patch antenna 1220 and a portion of the second patch antenna 1210 may overlap and stack with each other.

[0274] Each of the plurality of second resonant elements 1200a, 1200b may be formed of a patch antenna structure. The patch antenna 1210b may be located on a first surface S1 of the PCB 1010a, 1010b. The first surface S1 may be the outmost surface of the PCB 1010a, 1010b. The patch antenna 1210b may be disposed inside the PCB 1010a, 1010b.

[0275] The plurality of signal connection lines SL1 to SL4 may be configured to connect from the transceiver circuits 1400a and 1400b to the array antenna units 1200a and 1200b, and each of the plurality of signal connection lines SL1 to SL4 may be connected to and fed by the plurality of second patch antennas 1210 located inside the PCBs 1010a and 1010b. Each of the plurality of signal connection lines SL1 to SL4 may be configured not to be directly connected to the plurality of first patch antennas 1220 located on the first surface S1 of the PCBs 1010a and 1010b.

[0276] The length of the plurality of signal connection lines SL1 to SL4 may be defined as the connection length between the transceiver circuits 1400a, 1400b and the array antenna units 1200a, 1200b. For each of the plurality of second resonant elements 1200a, 1200b, the length of the plurality of signal connection lines SL1 to SL4 may be formed with the same length. The length of the plurality of signal connection lines SL1 to SL4 may be defined as the connection length between the transceiver circuits 1400a, 1400b and the patch antennas 1210, 1210b.

[0277] The plurality of signal connection lines SL1 to SL4 may be disposed between the array antenna parts 1200a, 1200b and the transceiver circuits 1400a, 1400b inside the PCBs 1010a, 1010b. The plurality of signal connection lines SL1 to SL4 may be disposed on the second coplanar waveguide WG2.

[0278] The second coplanar waveguide WG2 may be configured on a conductive plate between two ground conductive plates GND3 and GND4 inside PCB1010a and 1010b. The conductive plate of the second coplanar waveguide WG2 may include a plurality of signal connection lines SL3 and a grounding portion. The plurality of signal connection lines SL3 and the grounding portion may be configured on a conductive plate on the same plane between two ground conductive plates GND3 and GND4 inside PCB1010a and 1010b.

[0279] Each of the plurality of signal connection lines SL1 to SL4 may include a first portion SL1, a second portion SL2, a third portion SL3, and a fourth portion SL4. The first portion SL1 may be configured on the second surface S2 of the PCB 1010a. The third portion SL3 may be configured to form a coplanar waveguide structure WG2. The second portion SL2 may be configured to electrically connect the first portion SL1 to the third portion SL3. The fourth portion SL4 may be configured to electrically connect the third portion SL3 to one of the plurality of second patch antennas 1210.

[0280] A first ground region 1100g formed as a metal surface may be formed between the coplanar waveguide structure WG2 and the RFIC chip 1400a. A second ground region 1200g may be formed between the coplanar waveguide structure WG2 and the patch antenna 1210b.

[0281] PCB1010a, 1010b may be configured to include the first layer La1 to the sixth layer La6. The first portion SL1 of the plurality of signal connection lines may be configured on the first layer La1 of PCB1010a, 1010b. The second portion SL2 of the plurality of signal connection lines may be formed as a first vertical through hole from the first layer La1 to the sixth layer La6 of PCB1010a, 1010b. The third portion SL3 of the plurality of signal connection lines may be configured on the sixth layer La6 of PCB1010a, 1010b. The fourth portion SL4 of the plurality of signal connection lines may be formed as a second vertical through hole from the sixth layer La6 to the second patch antenna 1210.

[0282] For the plurality of second resonant elements 1200a and 1200b, the lengths of the first portions SL1 on the first layer La1 may be formed to be the same. For the plurality of second resonant elements 1200a and 1200b, the lengths of the third portions SL3 on the sixth layer La6 may be formed to be the same.

[0283] For the plurality of second resonant elements 1200a and 1200b, the lengths (heights) of the first vertical through holes corresponding to the second portion SL2 may be formed identically. For the plurality of second resonant elements 1200a and 1200b, the heights of the second vertical through holes corresponding to the fourth portion SL4 may be formed identically.

[0284] The plurality of feed lines of the first layer La1 may be connected to the plurality of feed lines F1 to F16 of the sixth layer La6 using a first vertical through hole passing through the first ground layer GND1 and the second ground layer GND2. The plurality of feed lines F1 to F16 of the sixth layer La6 may be connected to the plurality of second patch antennas 1210. The plurality of feed lines F1 to F16 of the sixth layer La6 may all be formed with the same length.

[0285] The electronic device with the antenna module is described above. The technical effects of the electronic device with the antenna module of this specification are as follows.

[0286] The electronic device of this embodiment can perform A / V wireless communication of data regardless of the location of the A / V transmitting device by using the first antenna structure and the second antenna structure configured with a plurality of array antennas.

[0287] In addition, the A / V transmission device can transmit data in a dual-stream manner, thereby minimizing the degradation of image quality caused by increasing the data compression rate.

[0288] In addition, a horizontally polarized antenna and a vertically polarized antenna can be disposed on one substrate at the same time, thereby having the advantages of being able to make the antenna module compact and improving the data reception rate.

[0289] In addition, according to the array antenna configuration structure of the A / V transmission device and the electronic device, it is possible to use horizontally polarized and vertically polarized signals to increase communication capacity while performing A / V wireless communication with reduced interference between them.

[0290] In addition, considering the positions of the A / V transmission device and the electronic device and the polarization characteristics of the array antenna, it is possible to utilize horizontally polarized and vertically polarized signals to perform A / V wireless communication that reduces interference between them while increasing communication capacity.

[0291] Furthermore, even when an obstacle is placed on the wireless communication path between the A / V transmission device and the electronic device, A / V wireless communication can be provided uninterruptedly by changing the beamforming direction and utilizing reflected waves.

[0292] In addition, the number of array antennas arranged in the front area of ​​the antenna module of the A / V transmission device can be configured to be greater than the number of antennas in the side area or the lower area. As a result, the signal can be transmitted to the front area at a longer distance than the side area or the lower area of ​​the antenna module. In addition, it can also be implemented as a two-dimensional array antenna, so that an antenna module that can also transmit signals in the upper direction through beamforming can be implemented.

[0293] In addition, the number of array antennas arranged in the side areas of the antenna module of the A / V transmission device can be configured to be smaller than the number of antennas arranged in other areas, thereby realizing an antenna module that forms a wider beam coverage to the side areas than to the front or lower areas.

[0294] The additional scope of the applicable possibilities of this specification can be clearly understood from the following detailed description. However, since those skilled in the art can clearly understand the various changes and modifications within the concept and scope of this specification, it should be understood that the detailed description and specific embodiments such as the preferred embodiments of this specification are provided only as examples. The detailed description should not be interpreted restrictively in all aspects, but should be considered as exemplary. The scope of the present invention should be determined according to the reasonable interpretation of the attached claims, and all changes made within the equivalent scope of the present invention are included in the scope of the present invention.

Claims

1. An antenna module, implemented as a multi-layer package, in, include: PCB, including multiple layers; An array antenna section, comprising a plurality of antenna elements arranged on the PCB, each of the plurality of antenna elements being composed of a structure of two patch antennas, a first patch antenna of the two patch antennas being located on a first surface of the PCB, the first surface being an outermost surface of the PCB, a second patch antenna of the two patch antennas being arranged inside the PCB, a portion of the first patch antenna and a portion of the second patch antenna being overlapped and stacked with each other; A radio frequency integrated circuit chip, namely, an RFIC chip, is bonded to the second surface of the PCB, the second surface being the other outermost surface of the PCB; and A plurality of signal connection lines are configured to connect from the RFIC chip to the array antenna unit, Each of the plurality of signal connection lines is connected to and fed by a plurality of the second patch antennas in the plurality of antenna elements arranged inside the PCB, The lengths of the plurality of signal connection lines are the lengths of the connection lines connecting the RFIC chip and the second patch antenna. The plurality of signal connection lines are of the same length.

2. The antenna module according to claim 1, wherein: The plurality of signal connection lines are arranged between the plurality of second patch antennas inside the PCB and the RFIC chip, Each of the plurality of signal connection lines comprises: a first portion on a second surface of the PCB; A third part constituting a coplanar waveguide structure inside the PCB; a second portion electrically connecting the first portion to the third portion; and A fourth portion electrically connects the third portion to one of the plurality of second patch antennas.

3. The antenna module according to claim 2, wherein: The PCB includes the first layer to the sixth layer, The first part of the plurality of signal connection lines is arranged on the first layer of the PCB, The second portions of the plurality of signal connection lines are formed as first vertical through holes from the first layer to the sixth layer of the PCB, The third portion of the plurality of signal connection lines is disposed on the sixth layer of the PCB, The fourth portion of the plurality of signal connection lines is formed as a second vertical through hole from the sixth layer to the second patch antenna, For the plurality of antenna elements, the first portions of the plurality of signal connection lines on the first layer are formed to have the same length. For the plurality of antenna elements, the third portions of the plurality of signal connection lines on the sixth layer are formed to have the same length.

4. The antenna module according to claim 3, wherein: For the plurality of antenna elements, the first vertical through holes corresponding to the second portion are formed to have the same height. For the plurality of antenna elements, the second vertical through holes corresponding to the fourth portion are formed to have the same height. The plurality of feed lines of the first layer are connected to the plurality of feed lines of the sixth layer by using a first vertical through hole passing through the first ground layer and the second ground layer. The plurality of feed lines of the sixth layer are connected to the second patch antenna, The plurality of feed lines on the sixth layer are all formed with the same length.

5. The antenna module according to claim 2, wherein: The array antenna unit comprises: A first array antenna unit, in which eight first patch antennas and eight second patch antennas are arranged in a first row along the X-axis direction; and The second array antenna unit is provided with eight first patch antennas and eight second patch antennas arranged in the second row along the X-axis direction. The array antenna unit is implemented as a 2x8 array antenna, The first array antenna unit is arranged at an upper portion centered on the X-axis. The second array antenna unit is arranged at a lower portion centered on the X-axis.

6. The antenna module according to claim 5, wherein: The first parts of the plurality of signal connection lines are connected to the plurality of pins on the first side, the second side and the fourth side of the RFIC chip, The first side is an upper area of ​​the RFIC chip, The second side is a side area of ​​the RFIC chip, The fourth side is another side area of ​​the RFIC chip, The third portions of the plurality of signal connection lines form a symmetrical structure with the center of the Y-axis of the PCB as a reference.

7. The antenna module according to claim 6, wherein: The first patch of the first array antenna unit is connected to the second side of the RFIC chip through a feeder line. The second patch of the first array antenna unit is connected to the first side of the RFIC chip through a feeder line. The third patch of the first array antenna unit is connected to the first side of the RFIC chip through a feeder line. The fourth patch of the first array antenna unit is connected to the first side of the RFIC chip through a feeder line, The first patch to the fourth patch are sequentially arranged on the upper left side of the PCB. A plurality of feed lines from the first patch to the fourth patch are arranged at the upper left side of the PCB.

8. The antenna module according to claim 7, wherein: The fifth patch of the first array antenna unit is connected to the first side of the RFIC chip through a feeder line, The sixth patch of the first array antenna unit is connected to the first side of the RFIC chip through a feeder line, The seventh patch of the first array antenna unit is connected to the first side of the RFIC chip through a feeder line, The eighth patch of the first array antenna unit is connected to the fourth side of the RFIC chip through a feeder line, The fifth patch to the eighth patch are sequentially arranged on the upper right side of the PCB. A plurality of feed lines from the fifth patch to the eighth patch are arranged on the upper right side of the PCB.

9. The antenna module according to claim 6, wherein: The first patch of the second array antenna unit is connected to the second side of the RFIC chip through a feeder line. The second patch of the second array antenna unit is connected to the second side of the RFIC chip through a feeder line. The third patch of the second array antenna unit is connected to the second side of the RFIC chip through a feeder line. The fourth patch of the second array antenna unit is connected to the first side of the RFIC chip through a feeder line, The first patch to the fourth patch are sequentially arranged at the lower left side of the PCB. A plurality of feed lines from the first patch to the fourth patch are arranged at the lower left side of the PCB.

10. The antenna module according to claim 9, wherein: The fifth patch of the second array antenna unit is connected to the first side of the RFIC chip through a feeder line, The sixth patch of the second array antenna unit is connected to the fourth side of the RFIC chip through a feed line, The seventh patch of the second array antenna unit is connected to the fourth side of the RFIC chip through a feeder line. The eighth patch of the second array antenna unit is connected to the fourth side of the RFIC chip through a feeder line. The fifth patch to the eighth patch are sequentially arranged at the lower right side of the PCB. A plurality of feed lines from the fifth patch to the eighth patch are arranged at the lower right portion of the PCB.

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