Chip glue uniformizing device and method

Abstract

The invention provides a chip glue uniformizing device and method, and belongs to the field of semiconductors. The chip glue uniformizing device comprises a bearing table used for bearing a chip. And the clamping mechanism is configured on the bearing table and is movably connected with the chip. Wherein the clamping mechanism is provided with a placing area, the placing area is used for placing a chip, the edge of the chip is attached to the clamping mechanism at the edge of the placing area, and the surface of the clamping mechanism and the glue uniformizing surface of the chip are on the same horizontal plane. The clamping mechanism is arranged, and the placing area is formed by the clamping mechanism. The chip is placed in the placing area, the edge of the chip is attached to the clamping mechanism at the edge of the placing area, and the surface of the clamping mechanism and the glue uniformizing surface of the chip are on the same horizontal plane, so that glue stacking at the edge of the chip can be avoided. Difference of photoetching patterns is avoided, and edge pixels can be prevented from being connected after being developed. Therefore, the pattern effect is good.

Description

Technical Field

[0001] The present invention relates to the field of semiconductor technology, and in particular to a chip glue spreading device and method. Background Art

[0002] Infrared focal plane detection technology has significant advantages such as wide spectral response band, more ground target information, and day and night operation. It is widely used in early warning detection, intelligence reconnaissance, damage effect assessment, and agriculture, animal husbandry, forest resource investigation, development and management, weather forecasting, geothermal distribution, earthquakes, volcanic activities, space astronomical detection, etc. Mercury cadmium telluride infrared detector is one of the representative products of infrared detection technology.

[0003] The single crystal rate of the material of HgCdTe chip is low, which results in the HgCdTe material being cut into squares of inconsistent sizes and small sizes, making it impossible to use automated equipment for mass production. Similarly, photolithography processes such as glue leveling are all manually or semi-automatically operated. Especially when the chip is square, the chip size is inconsistent, and it is impossible to use edge removal equipment to remove the edges of the chip after glue leveling, resulting in more serious glue accumulation at the four corners. In addition, due to the contact exposure used in photolithography, during the rotation of the machine, due to the centrifugal force, the photoresist coated on the surface of the HgCdTe chip is accumulated thicker at the edges of the four corners, while the thickness of the photoresist in the middle of the surface of the HgCdTe chip is relatively thin. At present, edge glue is mostly used to remove the glue accumulation, but the operation is time-consuming and labor-intensive. On the other hand, inconsistent glue thickness will cause differences in the photolithography graphics, and in severe cases, the edge pixels will be connected after development, resulting in poor graphics.

[0004] It should be noted that the information disclosed in the background technology section of the invention is only intended to deepen the understanding of the general background technology of the invention, and should not be regarded as an admission or suggestion in any form that the information constitutes prior art already known to those skilled in the art. Summary of the invention

[0005] The object of the present invention is to provide a chip glue-spreading device and method to solve the problem of glue accumulation on the edge of the chip when the chip is glued.

[0006] In order to solve the above technical problems, the present invention provides a chip glue spreading device, comprising:

[0007] A carrier, used for carrying chips;

[0008] A clamping mechanism, disposed on the carrier platform and movably connected to the chip;

[0009] The clamping mechanism forms a placement area for placing the chip, the edge of the chip fits with the clamping mechanism at the edge of the placement area, and the surface of the clamping mechanism is on the same level as the side of the chip where the chip is glued.

[0010] Preferably, the clamping mechanism comprises a plurality of clamping components, and the plurality of clamping components enclose a placement area for placing the chip.

[0011] Preferably, the clamping assembly comprises:

[0012] A first clamping assembly, movably disposed on the carrying platform;

[0013] A second clamping assembly, fixedly disposed on the carrying platform;

[0014] A limiting component, which passes through the second clamping component and is connected to the first clamping component, and is used to limit and fix the first clamping component and the second clamping component;

[0015] Wherein, the first clamping assembly and the second clamping assembly enclose a placement area for placing the chip.

[0016] Preferably, the second clamping assembly includes a third clamping portion and a fourth clamping portion, and the third clamping portion and the fourth clamping portion are both fixedly disposed on the bearing platform;

[0017] The first clamping assembly comprises a first clamping portion, a second clamping portion and a connecting portion, wherein the connecting portion is connected to the third clamping portion and the fourth clamping portion and is sleeved with the first clamping portion and the second clamping portion;

[0018] The limiting assembly includes a limiting portion, which passes through the third clamping portion and / or the fourth clamping portion and is connected to the first clamping assembly.

[0019] Preferably, the limiting portion is a limiting rod, and one limiting rod is provided. The limiting rod passes through the fourth clamping portion and is connected to the second clamping portion to limit and fix the fourth clamping portion and the second clamping portion.

[0020] Preferably, the first clamping portion, the second clamping portion, the third clamping portion and the fourth clamping portion enclose a placement area of ​​a square structure for placing the chip, wherein the size of the placement area is equal to that of the chip.

[0021] Preferably, the adjacent ends of the first clamping portion and the second clamping portion are fixedly connected, and the adjacent ends of the third clamping portion and the fourth clamping portion are fixedly connected.

[0022] Preferably, the clamping mechanism comprises:

[0023] A first clamping assembly includes a moving part and a sliding part, wherein the moving part is movably disposed on the bearing platform, and the moving part is sleeved with the sliding part;

[0024] A second clamping assembly includes a fixing portion fixedly disposed on the bearing platform, and one end of the sliding portion is connected to the fixing portion;

[0025] A limiting assembly, comprising a blocking portion, sleeved with the sliding portion, and used to limit and fix the moving portion and the fixed portion;

[0026] The movable part and the fixed part form a placement area for placing the chip.

[0027] Preferably, the placement area is a circular structure, and the diameter of the circular structure is equal to the diameter of the chip.

[0028] Based on the same inventive concept, the present invention also provides a chip coating method, comprising:

[0029] The chip is glued using the chip glue-spreading device described above.

[0030] Compared with the prior art, the chip glue dispensing device of the present invention has the following advantages:

[0031] The present invention is provided with a clamping mechanism, and the clamping mechanism is formed with a placement area. The chip is placed in the placement area, the edge of the chip is fitted with the clamping mechanism at the edge of the placement area, and the surface of the clamping mechanism is on the same horizontal plane as the side of the chip where the glue is applied. Thus, the area of ​​the glue application can be expanded, and when the glue is rotated, glue accumulation will only be generated at the edge of the clamping mechanism, and glue accumulation will not be generated at the edge of the chip. Therefore, the glue accumulation problem can be transferred from the chip to the clamping mechanism, thereby avoiding glue accumulation at the edge of the chip. Not only can the differences in the lithography patterns be avoided, but also the edge pixels can be avoided from being connected after development. Thus, the resulting graphics have a good effect.

[0032] The chip glue method provided by the present invention and the chip glue device provided by the present invention belong to the same inventive concept. Therefore, the chip glue method provided by the present invention at least has all the advantages of the chip glue device provided by the present invention, and can transfer the glue accumulation problem from the chip to the clamping mechanism, thereby avoiding glue accumulation on the edge of the chip. Not only can it avoid differences in the photolithography patterns, but it can also avoid causing edge pixels to be connected after development. As a result, the resulting graphics have a good effect. BRIEF DESCRIPTION OF THE DRAWINGS

[0033] Figure 1 is a schematic diagram of a top view of a clamping mechanism in one embodiment of the present invention;

[0034] Figure 2 yes Figure 1 A schematic diagram of the structure of a chip clamped in a middle clamping mechanism;

[0035] Figure 3 is a schematic diagram of a top view of a clamping structure in another embodiment of the present invention;

[0036] Figure 4 yes Figure 3 A schematic diagram of the structure of a chip clamped in a middle clamping structure;

[0037] In the figure,

[0038] 10-carrying platform; 20-clamping mechanism;

[0039] 30-chip; 100-first clamping assembly;

[0040] 110-first clamping portion; 120-second clamping portion;

[0041] 130-first connecting portion; 140-second connecting portion;

[0042] 150-moving part; 160-sliding part;

[0043] 200 - second clamping assembly; 210 - third clamping portion;

[0044] 220- fourth clamping portion; 230- fixing portion;

[0045] 300-limiting assembly; 310-limiting part;

[0046] 320- blocking part; 400- placement area. DETAILED DESCRIPTION

[0047] In order to make the purpose, advantages and features of the present invention clearer, the chip glue-splitting device and method proposed in the present invention are further described in detail in combination with the accompanying drawings and specific embodiments. It should be noted that the drawings are all in a very simplified form and are not in precise proportions, which are only used to conveniently and clearly assist in explaining the purpose of the embodiments of the present invention. It should be understood that the drawings in the specification do not necessarily show the specific structure of the present invention in proportion, and the illustrative features used to illustrate certain principles of the present invention in the drawings in the specification will also adopt a slightly simplified drawing method. The specific design features of the present invention disclosed herein include, for example, specific dimensions, directions, positions and shapes, which will be determined in part by the specific environment to be applied and used. And, in the embodiments described below, sometimes the same figure mark is used in common between different drawings to represent the same part or a part with the same function, and its repeated description is omitted. In this specification, similar numbers and letters are used to represent similar items, so once an item is defined in one drawing, it does not need to be further discussed in subsequent drawings.

[0048] In addition, the terms "first" and "second" are used for descriptive purposes only and should not be understood as indicating or implying relative importance or implicitly indicating the number of the indicated technical features. Therefore, the features defined as "first" and "second" may explicitly or implicitly include at least one of the features. In the description of the present invention, the meaning of "plurality" is at least two, such as two, three, etc., unless otherwise clearly and specifically defined.

[0049] In the description of this specification, the description with reference to the terms "one embodiment", "some embodiments", "example", "specific example", or "some examples" etc. means that the specific features, structures, materials or characteristics described in conjunction with the embodiment or example are included in at least one embodiment or example of the present invention. In this specification, the schematic representations of the above terms do not necessarily refer to the same embodiment or example. Moreover, the specific features, structures, materials or characteristics described may be combined in any one or more embodiments or examples in a suitable manner. In addition, those skilled in the art may combine and combine the different embodiments or examples described in this specification and the features of the different embodiments or examples, without contradiction.

[0050] Ginseng Figures 1 to 4 A specific embodiment of a chip glue spreading device disclosed. The chip glue spreading device comprises: a carrier platform for carrying a chip. A clamping mechanism is arranged on the carrier platform and movably connected to the chip. The clamping mechanism is formed with a placement area, the placement area is used to place the chip, the edge of the chip is in contact with the clamping mechanism at the edge of the placement area, and the surface of the clamping mechanism is on the same horizontal plane as the side of the chip glue spreading.

[0051] For traditional chip glue spreading devices, the chip is placed on a carrier and directly rotated to spread the glue. However, due to the effect of surface tension, there will be glue accumulation on the edge of the chip during the rotation process. Moreover, most of the current HgCdTe chips are square, and the glue accumulation at the four corners is more serious. In addition, currently most HgCdTe chips use contact exposure, so the presence of glue accumulation will cause exposure abnormalities. Currently, the method of wiping the edge glue is mostly used to remove the glue accumulation, but the operation is time-consuming and labor-intensive. On the other hand, inconsistent glue thickness will cause differences in the photolithography pattern, and in severe cases, the edge pixels will be connected after development.

[0052] However, the chip glue-smoothing device provided in the present embodiment is provided with a clamping mechanism, and the clamping mechanism is formed with a placement area. The chip is placed in the placement area, the edge of the chip is fitted with the clamping mechanism at the edge of the placement area, and the surface of the clamping mechanism is on the same horizontal plane as the side of the chip glue-smoothing. Thereby, the glue-smoothing area can be expanded. When the glue is rotated, glue accumulation will only be generated at the edge of the clamping mechanism, and glue accumulation will not be generated at the edge of the chip. Therefore, the glue accumulation problem can be transferred from the chip to the clamping mechanism, thereby avoiding glue accumulation at the edge of the chip. Not only can the differences in the lithography patterns be avoided, but also the edge pixels can be avoided from being connected after development. The resulting graphics have a good effect.

[0053] Exemplarily, the clamping mechanism includes a plurality of clamping components, and the plurality of clamping components enclose a placement area for placing the chip.

[0054] Specifically, refer to Figure 1 and Figure 2 As shown, as one of the embodiments, in this embodiment, the chip has a square structure. The clamping assembly includes: a first clamping assembly 100, which is movably configured on the carrier 10. A second clamping assembly 200, which is fixedly configured on the carrier 10. A limiting assembly 300, which passes through the second clamping assembly 200 and is connected to the first clamping assembly 100, is used to limit and fix the first clamping assembly 100 and the second clamping assembly 200. Among them, the first clamping assembly 100 and the second clamping assembly 200 enclose a placement area 400 for placing the chip 30.

[0055] The second clamping assembly 200 includes a third clamping portion 210 and a fourth clamping portion 220, and the third clamping portion 210 and the fourth clamping portion 220 are both fixedly disposed on the carrier 10. The third clamping portion 210 and the fourth clamping portion 220 can both be plate-shaped structures. The adjacent ends of the third clamping portion 210 and the fourth clamping portion 220 can be fixedly connected to form a Figure 1 and Figure 2 The L-shaped connector shown in the figure can also be movably connected. As long as the surface of the third clamping part 210 and the fourth clamping part 220 in contact with the chip fits, and the surface of the third clamping part 210 and the fourth clamping part 220 is on the same level as the surface of the chip glue. The third clamping part 210 and the fourth clamping part 220 can be made of plastic, silicone and other materials, which are not limited here. Preferably, in this embodiment, the third clamping part 210 and the fourth clamping part 220 are made of silicone material to protect the edge of the chip.

[0056] The first clamping assembly 100 includes a first clamping portion 110, a second clamping portion 120 and a connecting portion, wherein the connecting portion is connected to the third clamping portion 210 and the fourth clamping portion 220 and is sleeved with the first clamping portion 110 and the second clamping portion 120. Similarly, the adjacent ends of the first clamping portion 110 and the second clamping portion 120 can be fixedly connected to form a Figure 1 and Figure 2 The L-shaped connecting member shown in the figure can also be movably connected. As long as the first clamping part 110 and the second clamping part 120 are in contact with the surface of the chip, and the surface of the first clamping part 110 and the second clamping part 120 is on the same horizontal plane as the surface of the chip glue. The first clamping part 110 and the second clamping part 120 can be made of materials such as plastic and silicone, which are not limited here. Preferably, in this embodiment, the first clamping part 110 and the second clamping part 120 are made of silicone material to protect the edge of the chip. The connecting part includes a first connecting part 130 and a second connecting part 140. The first connecting part 130 and the second connecting part 140 can both be rod-shaped structures. One end of the first connecting part 130 is fixedly connected to the fourth clamping part 220. The second clamping part 120 is sleeved with the first connecting part 130, and the second clamping part 120 can slide on the first connecting part 130. One end of the second connecting part 140 is fixedly connected to the third clamping part 210, and the second connecting part 140 is sleeved with the first clamping part 110. The first clamping portion 110 can slide on the second connecting portion 140 .

[0057] The limiting assembly 300 includes a limiting portion 310, which may be a connector such as a screw or a bolt. The limiting portion 310 passes through the third clamping portion 210 and / or the fourth clamping portion 220, and is threadedly connected to the first clamping assembly 100. The limiting portion 310 may be two screws. That is, one of the screws is threadedly connected to the third clamping portion 210 and to the first clamping portion 110. The other screw is threadedly connected to the fourth clamping portion 220 and to the second clamping portion 120. The limiting portion may also be provided with one screw, or multiple screws. There is no limitation here, as long as the first clamping assembly 100 and the second clamping assembly 200 can be fixedly connected.

[0058] Preferably, the first clamping portion 110 and the second clamping portion 120 are formed as follows Figure 1 and Figure 2 The third clamping portion 210 and the fourth clamping portion 220 form an L-shaped structure as shown. Figure 1 and Figure 2 The two "L"-shaped structures enclose a square-shaped placement area 400 for placing the chip, wherein the size of the square-shaped placement area 400 is equal to that of the chip 30, so that the edge of the chip fits with the "L"-shaped structure at the edge of the placement area 400.

[0059] As another example, Figure 3 and Figure 4 As shown, in this embodiment, the chip is a circular structure. The clamping mechanism includes: a first clamping assembly 100, including a moving part 150 and a sliding part 160, the moving part 150 is movably arranged on the carrier platform 10, and the moving part 150 is sleeved with the sliding part 160. A second clamping assembly 200 includes a fixed part 230, which is fixedly arranged on the carrier platform 10, and one end of the sliding part 160 is connected to the fixed part 230. A limiting assembly 300 includes a blocking part 320, which is sleeved with the sliding part 160, and is used to limit and fix the moving part 150 and the fixed part 230; wherein the moving part 150 and the fixed part 230 form a placement area 400 for placing the chip. The placement area 400 is a circular structure, and the diameter of the circular structure is equal to the diameter of the chip.

[0060] The projections of the movable part 150 and the fixed part 230 on the horizontal plane are both semicircular structures. When the movable part 150 and the sliding part 160 are put together, a circular placement area 400 is formed, and the diameter of the placement area 400 matches the diameter of the chip 30, and can fit with the movable part 150 and the fixed part 230 at the edge of the placement area. The sliding part 160 can be a rod-shaped structure. One end of the sliding part 160 is fixedly connected to the fixed part 230. The sliding part 160 is sleeved with the movable part 150. The movable part 150 can slide on the sliding part 160. The blocking part 320 can be a plate-shaped structure. The blocking part 320 is threadedly connected to the sliding part 160, which can limit and fix the movable part 150 and the fixed part 230, thereby limiting and fixing the chip 30.

[0061] This embodiment also discloses a chip glue leveling method, which includes using the chip glue leveling device described above to perform glue leveling on the chip.

[0062] The chip glue method provided in this embodiment and the chip glue device provided in this embodiment belong to the same inventive concept. Therefore, the chip glue method provided in this embodiment has at least all the advantages of the chip glue device provided in this embodiment, and can transfer the glue accumulation problem from the chip to the clamping mechanism, thereby avoiding glue accumulation on the edge of the chip. Not only can it avoid differences in the lithography patterns, but it can also avoid causing edge pixels to be connected after development. As a result, the resulting graphics have a good effect.

[0063] In summary, the above embodiments have detailed descriptions of different configurations of chip glue spreading devices and methods. Of course, the above description is only a description of the preferred embodiments of the present invention, and is not any limitation to the scope of the present invention. The present invention includes but is not limited to the configurations listed in the above implementations. Those skilled in the art can draw inferences based on the contents of the above embodiments. Any changes and modifications made by ordinary technicians in the field of the present invention based on the above disclosures are within the scope of protection of the claims.

Claims

1. A chip glue dispensing device, characterized in that: include: A carrier, used for carrying chips; A clamping mechanism, disposed on the carrier platform and movably connected to the chip; The clamping mechanism forms a placement area for placing the chip, the edge of the chip fits with the clamping mechanism at the edge of the placement area, and the surface of the clamping mechanism is on the same level as the side of the chip where the chip is glued.

2. The chip glue dispensing device according to claim 1, characterized in that: The clamping mechanism includes a plurality of clamping components, and the plurality of clamping components enclose a placement area for placing the chip.

3. The chip glue dispensing device according to claim 2, characterized in that: The clamping assembly comprises: A first clamping assembly, movably disposed on the carrying platform; A second clamping assembly, fixedly disposed on the carrying platform; A limiting component, which passes through the second clamping component and is connected to the first clamping component, and is used to limit and fix the first clamping component and the second clamping component; Wherein, the first clamping assembly and the second clamping assembly enclose a placement area for placing the chip.

4. The chip glue dispensing device according to claim 3, characterized in that: The second clamping assembly includes a third clamping portion and a fourth clamping portion, and the third clamping portion and the fourth clamping portion are both fixedly disposed on the bearing platform; The first clamping assembly comprises a first clamping portion, a second clamping portion and a connecting portion, wherein the connecting portion is connected to the third clamping portion and the fourth clamping portion and is sleeved with the first clamping portion and the second clamping portion; The limiting assembly includes a limiting portion, which passes through the third clamping portion and / or the fourth clamping portion and is connected to the first clamping assembly.

5. The chip glue dispensing device according to claim 4, characterized in that: The limiting part is a limiting rod, and one limiting rod is provided. The limiting rod passes through the fourth clamping part and is connected to the second clamping part to limit and fix the fourth clamping part and the second clamping part.

6. The chip glue dispensing device according to claim 4, characterized in that: The first clamping portion, the second clamping portion, the third clamping portion and the fourth clamping portion enclose a placement area of ​​a square structure for placing the chip, wherein the placement area has the same size as the chip.

7. The chip glue dispensing device according to claim 4, characterized in that: The adjacent ends of the first clamping portion and the second clamping portion are fixedly connected, and the adjacent ends of the third clamping portion and the fourth clamping portion are fixedly connected.

8. The chip glue dispensing device according to claim 1, characterized in that: The clamping mechanism comprises: A first clamping assembly includes a moving part and a sliding part, wherein the moving part is movably disposed on the bearing platform, and the moving part is sleeved with the sliding part; A second clamping assembly includes a fixing portion fixedly disposed on the bearing platform, and one end of the sliding portion is connected to the fixing portion; A limiting assembly, comprising a blocking portion, sleeved with the sliding portion, and used to limit and fix the moving portion and the fixed portion; The movable part and the fixed part form a placement area for placing the chip.

9. The chip glue dispensing device according to claim 8, characterized in that: The placement area is a circular structure, and the diameter of the circular structure is equal to the diameter of the chip.

10. A chip coating method, characterized in that: include: The chip is coated with glue using the chip coating device as described in any one of claims 1 to 9.

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