Diamond laser cutting apparatus

Abstract

The present application relates to the technical field of diamond laser cutting, in particular to a diamond laser cutting device. It comprises a machine body, a laser is arranged on the top of the machine body, a moving seat is arranged in the machine body, a B-axis motor is arranged on the end of the supporting plate, a transmission assembly is arranged below the rotating gear, a beating assembly is arranged on one side of the transmission assembly, when the output end of the B-axis motor drives the swing platform to rotate, the beating assembly is used for knocking the bottom of the object table, the double-head gear below the rack is driven to mesh and rotate by the transmission gear, so that the transmission gear drives the meshing gear to rotate, the meshing gear drives the coaxial rotation of the beating ball rod, when the swing platform drives the object table to rotate, the side below the horizontal position is continuously beaten by the meshing gear, the surface of the object table is vibrated, so that the cutting slag falling on the surface of the object table automatically falls into the collecting groove, which is beneficial to reduce the labor intensity of the operator.

Description

TECHNICAL FIELD

[0001] The present application relates to the technical field of diamond laser cutting, in particular to a diamond laser cutting device. BACKGROUND

[0002] Diamond is a natural mineral, which is the original stone of diamond. It is the hardest substance in nature. Crystal clear diamond jewelry is composed of many facets. In order to process diamond jewelry, the traditional processing method is to split, saw, rough grind, cross-cut grind and multi-face cut grind on diamond blanks. The traditional processing method is contact processing, which causes large wear of the grinding wheel and generates a lot of dust, which is harmful to the health of the processing personnel. Therefore, laser cutting devices are now used to cut diamond raw stones.

[0003] There are many existing technologies for laser cutting devices, such as:

[0004] Chinese patent publication No. CN115781005A discloses a high-efficiency diamond laser cutting device, which comprises a rack, an industrial computer, a control box, a two-dimensional workbench, a clamp, a Z-axis module, a mirror assembly, a beam combination mirror assembly, a galvanometer, a field lens, a CCD camera, a camera lens, a laser, and an external light path. The rack is divided into an upper layer, a middle layer, and a lower layer. The industrial computer and the control box are arranged in the lower layer. The two-dimensional workbench is arranged in the middle layer. A rotating structure is arranged on the two-dimensional workbench. The clamp is arranged on the rotating structure. The beam combination mirror assembly and the galvanometer are arranged on the Z-axis module, and the galvanometer is located on the left side of the beam combination mirror assembly. The mirror assembly is arranged on the right side of the beam combination mirror assembly. The camera lens is arranged on the front side of the beam combination mirror assembly. The CCD camera is arranged on the front side of the camera lens. The field lens is arranged on the bottom side of the galvanometer. The laser and the external light path are arranged in the upper layer. The laser emits laser light, which passes through the external light path, the mirror assembly, the beam combination mirror assembly, and the galvanometer in sequence and is focused by the field lens. The present application can speed up the processing, improve the work efficiency and the processing precision.

[0005] In the current use of traditional laser cutting devices, the fixed raw stone is cut, and the broken material generated by the cutting of the raw stone has secondary utilization value. Therefore, it is necessary to collect the broken slag particles falling during cutting. Since the broken slag particles are small, the labor intensity of the workers is increased when they sweep the surface of the workbench. Moreover, since the broken slag particles are small, part of the broken slag particles can be missed when collecting the broken slag particles.

[0006] In view of the above, we propose a diamond laser cutting device. SUMMARY

[0007] The purpose of the present application is to provide a diamond laser cutting device to solve the problems raised in the background art.

[0008] In order to achieve the above object, the present application aims to provide a diamond laser cutting device, which comprises a machine body, a laser device arranged on the top of the machine body, a moving seat arranged in the machine body, a base plate arranged on the surface of the moving seat, collecting grooves arranged on both sides of the base plate, a support plate arranged on one side of the base plate, a B-axis motor arranged at the end of the support plate, a transmission shaft penetrating through the support plate and connected with the output end of the B-axis motor, a swing table arranged on the surface of the transmission shaft, a loading table arranged on the top of the swing table, an electric drive shaft arranged on the surface of the loading table, a clamp arranged on the top of the electric drive shaft, the clamp being used for fixing the diamond, rotating gears arranged on both sides of the transmission shaft, a transmission assembly arranged below the rotating gears, and a knocking assembly arranged on one side of the transmission assembly.

[0009] As a further improvement of the present technical solution, the transmission assembly comprises a rack arranged below the rotating gear, the rack comprising a first rack section and a second rack section, the first rack section being engaged with the rotating gear for rotation, the second rack section and the first rack section having a tooth ratio of 2:1, and the rotating gear being used for driving the rack to move horizontally when the rotating gear rotates.

[0010] As a further improvement of the present technical solution, a double-head gear is arranged below the second rack section, a transmission gear is vertically engaged above one end of the double-head gear away from the second rack section, and the knocking assembly is arranged above the transmission gear.

[0011] As a further improvement of the present technical solution, the swing table swings at an angle of ±120° along the B-axis direction, and the electric drive shaft drives the clamp to rotate at an angle of 360° along the axis.

[0012] As a further improvement of the present technical solution, the knocking assembly comprises an extension rod arranged on one side of the support plate, a rotating rod rotatably arranged at the end of the extension rod, an engaging gear arranged on the surface of the rotating rod, the engaging gear and the transmission gear rotating in the core, the tooth ratio of the rotating rod and the transmission gear being 3:1, a knocking ball rod arranged at the end of the rotating rod, and the knocking ball rod being made of rubber.

[0013] As a further improvement of the present technical solution, a baffle is arranged on the top of the loading table, and through grooves are arranged on both sides of the baffle along the rotating direction of the B-axis, so that the diamond debris cut by the laser device falls into the collecting groove through the through grooves.

[0014] As a further improvement of the technical solution, the collecting groove is internally provided with a slope plate, which is symmetrically placed at the bottom of the collecting groove.

[0015] As a further improvement of the technical solution, the aggregate assembly comprises a servo motor arranged at one side of the collecting groove, the output end of the servo motor penetrates the collecting groove and is provided with a screw rod at the end, the screw rod surface is symmetrically threaded, the screw rod surface is provided with a moving plate, rotating the screw rod causes the relative movement of the moving plate, the moving plate is provided below with a brush head, the moving plate drives the brush head to move horizontally to sweep and collect the diamond debris on the surface of the slope plate, and a fitting assembly is arranged between the moving plate and the brush head.

[0016] As a further improvement of the technical solution, the fitting assembly comprises a cylinder arranged at the bottom of the moving plate, a sliding rod is slidably arranged in the inner wall of the cylinder, and the end of the sliding rod is fixed to the top of the collecting groove.

[0017] Compared with the prior art, the present application has the following advantages:

[0018] 1. In the diamond laser cutting device, the gear is rotated to drive the rack to move, the double-headed gear arranged below the rack drives the transmission gear to mesh and rotate, the transmission gear drives the meshing gear to rotate, the meshing gear drives the hitting rod to rotate coaxially, and when the turntable drives the turntable to rotate, the side below the horizontal position is continuously hit by the meshing gear, so that the surface of the turntable vibrates, thereby the debris cut and fallen on the surface of the turntable automatically falls into the interior of the collecting groove, which is beneficial to reduce the labor intensity of the workers.

[0019] 2. In the diamond laser cutting device, the servo motor output end drives the screw rod to rotate, the moving plate arranged on the surface of the screw rod moves relatively, the brush head arranged at the bottom of the moving plate sweeps the surface of the slope plate, and in the sweeping process of the brush head, the sliding rod slides in the inner wall of the cylinder under the action of the elastic member, so that the brush head arranged at the end of the sliding rod is always in contact with the surface of the slope plate, the debris falling on the surface of the slope plate is automatically gathered to the center of the collecting groove under the pushing force, thereby improving the collection efficiency of the debris.

[0020] 3. In the diamond laser cutting device, the diamond rough stone is fixed on the surface of the clamp, the transmission shaft connected to the end of the B-axis motor drives the turntable to rotate, the turntable surface is provided with a turntable, the electric drive shaft on the surface of the turntable drives the clamp to rotate, so that the laser can automatically cut the diamond at multiple angles fixed on the surface of the clamp, thereby improving the cutting efficiency of the diamond surface. BRIEF DESCRIPTION OF DRAWINGS

[0021] Figure 1 Fig. 1 is a schematic diagram of the overall structure of the present application;

[0022] Figure 2 Fig. 2 is a schematic diagram of the substrate structure of the present application;

[0023] Figure 3 Fig. 3 is a schematic diagram of the stage structure of the present application;

[0024] Figure 4 Fig. 4 is a schematic diagram of the transmission assembly structure of the present application;

[0025] Figure 5 Fig. 5 is a schematic diagram of the A of the present application; Figure 4

[0026] Figure 6 Fig. 6 is a schematic diagram of the aggregate assembly structure of the present application;

[0027] Figure 7 Fig. 7 is a schematic diagram of the B of the present application; Figure 6

[0028] Fig. 8 is a schematic diagram of the hitting assembly structure of the present application. Figure 8 The meanings of the respective reference numerals in the drawings are as follows:

[0029] 100, machine body; 101, laser; 102, moving seat;

[0030] 200, substrate; 201, B-axis motor; 202, swing table; 203, stage; 204, electric drive shaft; 205, clamp; 206, baffle; 207, rotating gear; 208, collection groove; 209, ramp plate; 210, support plate;

[0031] 300, transmission assembly; 301, first rack segment; 302, second rack segment; 303, double-headed gear; 304, transmission gear;

[0032] 400, hitting assembly; 401, extension rod; 402, meshing gear; 403, rotating rod; 404, hitting ball rod; 500, aggregate assembly; 501, servo motor; 502, lead screw; 503, moving plate; 504, brush head; 505, cylinder; 506, sliding rod; 507, elastic member.

[0033] DETAILED DESCRIPTION

[0034] The technical solutions in the embodiments of the present application will be clearly and completely described below with reference to the drawings in the embodiments of the present application. Obviously, the described embodiments are only part of the embodiments of the present application, rather than all the embodiments of the present application. Based on the embodiments in the present application, all other embodiments obtained by those of ordinary skill in the art without creative labor fall within the protection scope of the present application.​​

[0035] In the description of the present application, it should be understood that the terms "center", "longitudinal", "transverse", "length", "width", "thickness", "upper", "lower", "front", "rear", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer", "clockwise", "counterclockwise" and the like indicate the orientation or positional relationship shown in the drawings, which are only for the convenience of describing the present application and simplifying the description, and do not indicate or imply that the devices or elements referred to must have a particular orientation, be constructed and operated in a particular orientation, and therefore cannot be understood as limiting the present application.

[0036] The present embodiment aims to provide a diamond laser cutting device, as shown in Figures 1-8 The machine body 100 is provided with a laser 101 at the top, and a moving seat 102 is arranged inside the machine body 100. The surface of the moving seat 102 is provided with a base plate 200, and the two sides of the base plate 200 are provided with collecting grooves 208. One side of the base plate 200 is provided with a supporting plate 210, and the end of the supporting plate 210 is provided with a B-axis motor 201. The output end of the B-axis motor 201 penetrates through the supporting plate 210 and is connected with a transmission shaft at the end. The surface of the transmission shaft is provided with a swing table 202, and the top of the swing table 202 is provided with a carrier 203. The surface of the carrier 203 is provided with an electric drive shaft 204, and the top of the electric drive shaft 204 is provided with a clamp 205 for fixing the diamond. The two sides of the transmission shaft are provided with rotating gears 207, and the lower side of the rotating gears 207 is provided with a transmission assembly 300. One side of the transmission assembly 300 is provided with a knocking assembly 400. When the output end of the B-axis motor 201 drives the swing table 202 to rotate, the knocking assembly 400 is used to knock the bottom of the carrier 203, so that the laser cutting stone debris falls into the inside of the collecting groove 208. The inside of the collecting groove 208 is provided with a material collecting assembly 500 for quickly collecting the debris.

[0037] The improvement of the present embodiment is that the rotating gear 207 drives the rack to move, so that the double-head gear 303 arranged below the rack drives the transmission gear 304 to mesh and rotate, so that the transmission gear 304 drives the meshing gear 402 to rotate, and the meshing gear 402 drives the knocking ball rod 404 to rotate coaxially. During the rotation of the swing table 202 and the carrier 203, the side below the horizontal position is continuously knocked by the meshing gear 402, so that the surface of the carrier 203 vibrates, and the debris cut off and falling on the surface of the carrier 203 automatically falls into the inside of the collecting groove 208, which is beneficial to reduce the labor intensity of the workers.

[0038] In the process of processing diamond, the diamond needs to be cut on multiple facets. In order to improve the processing efficiency, the transmission assembly 300 includes a rack arranged below the rotating gear 207, the rack includes a first rack segment 301 and a second rack segment 302, the first rack segment 301 is engaged with the rotating gear 207 to rotate, the second rack segment 302 and the first rack segment 301 have a tooth ratio of 2:1, the rotating gear 207 drives the rack to move horizontally, the second rack segment 302 is arranged below a double-headed gear 303, the double-headed gear 303 is vertically engaged with a transmission gear 304 above one end away from the second rack segment 302, and the transmission gear 304 is arranged above a hitting assembly 400. When cutting the facets, the transmission shaft connected to the end of the B-axis motor 201 drives the swing table 202 to rotate, the swing table 202 is arranged with a carrier 203 on the surface, the motor-driven shaft 204 on the surface of the carrier 203 drives the clamp 205 to rotate, so that the laser 101 can cut the diamond fixed on the surface of the clamp 205 at multiple angles, thereby improving the cutting efficiency of the diamond surface. At the same time, when the transmission shaft rotates, the rotating gear 207 arranged on the surface of the transmission shaft rotates coaxially, the rotating gear 207 drives the first rack segment 301 arranged below to move horizontally, the second rack segment 302 arranged on both sides of the first rack segment 301 drives the double-headed gear 303 to rotate when moving, the double-headed gear 303 drives the transmission gear 304 to rotate when rotating, and since the second rack segment 302 and the first rack segment 301 have a tooth ratio of 2:1, the second rack segment 302 can drive the double-headed gear 303 to rotate when moving horizontally, so that the double-headed gear 303 drives the transmission gear 304 to rotate, thereby enabling the hitting assembly 400 to hit the bottom of the carrier 203 at multiple frequencies, so that the slag falling on the surface of the carrier 203 during laser cutting falls quickly into the collection groove 208.

[0039] During the cutting and processing of diamonds, by adjusting the angle of the diamond, the cutter can avoid the natural defects or inclusions of the diamond affecting the final result, which can maximize the gloss and transparency of the diamond and reduce potential cutting defects. Therefore, the swing angle of the swing table 202 along the B-axis direction is ±120°, and the angle of rotation of the clamp 205 driven by the motor-driven shaft 204 along the axis is 360°. During cutting and processing, the output end of the B-axis motor 201 drives the transmission shaft to rotate, so that the swing table 202 fixed on the surface of the transmission shaft is adjusted along the B-axis direction at a maximum angle of ±120°, thereby allowing the cutter to adjust the angle according to the shape and characteristics of the diamond, thereby performing more accurate cutting and optimizing the optical performance and appearance of the diamond. At the same time, the device can rotate ±120° to adapt to various cutting requirements of diamonds, especially when processing irregular or special-shaped diamonds.

[0040] In the process of cutting diamond, when the diamond particles are small, the size of the cutting slag is also small, and the work personnel needs to clean the surface of the loading table 203 to recycle the slag falling on the surface, which increases the labor intensity of the work personnel. Therefore, the knocking assembly 400 includes an extension rod 401 arranged on one side of the support plate 210. The end of the extension rod 401 is rotatably provided with a rotating rod 403. The surface of the rotating rod 403 is provided with an engagement gear 402. The engagement gear 402 and the transmission gear 304 rotate. The tooth ratio of the rotating rod 403 and the transmission gear 304 is 3:1. The end of the rotating rod 403 is provided with a knocking ball rod 404. The knocking ball rod 404 is made of rubber. During the multi-angle cutting of the diamond ore particles, the B-axis motor 201 needs to be frequently driven to rotate the transmission shaft, so that the swing table 202 arranged on the surface of the transmission shaft rotates. During the rotation of the swing table 202, the rack is driven to move by the rotating gear 207, so that the double-head gear 303 arranged below the rack drives the transmission gear 304 to mesh and rotate, so that the transmission gear 304 drives the engagement gear 402 to rotate, and the engagement gear 402 drives the coaxial rotation of the knocking ball rod 404. When the swing table 202 drives the loading table 203 to rotate, the side below the horizontal position is continuously knocked by the engagement gear 402, so that the surface of the loading table 203 vibrates, so that the cutting slag falling on the surface of the loading table 203 automatically falls into the collecting groove 208, which is beneficial to reduce the labor intensity of the work personnel.

[0041] In the process of cutting and processing diamond, the cutting and falling of the slag can be recycled. The slag is processed into diamond powder. Due to the high hardness of the diamond powder, it is widely used in various industrial abrasives and cutting tools. Due to the small size of the slag in the processing process, the work personnel cannot easily find the position of the falling slag, which affects the collection of the slag and the secondary utilization of the slag. Considering that the diamond slag falls during cutting, due to the high hardness of the diamond, when the diamond slag falls from the cutting tool or the surface of the diamond, the elasticity and kinetic energy of the slag will cause it to bounce up when it hits the desktop, which will affect the rapid collection of the slag. Therefore, the top of the loading table 203 is provided with a baffle 206. The baffle 206 is provided with a through groove on both sides along the B-axis rotation direction. The diamond slag cut by the laser cutter 101 falls into the collecting groove 208 through the through groove. By arranging the baffle 206 on the surface of the loading table 203, when the diamond slag bounces up after falling on the edge of the loading table 203, the baffle 206 blocks it, so that the slag falling on the surface of the loading table 203 is uniformly collected into the collecting groove 208 through the through groove, thereby improving the collection efficiency of the slag.

[0042] Due to the diamond cutting process, the diamond size is small, and the amount of diamond slag is small during the collection process. In order to be able to collect the diamond slag quickly when the cutting is completed, the inside of the collection tank 208 is provided with a slope plate 209, which is symmetrically placed at the bottom of the collection tank 208. When the diamond slag falls on the surface of the slope plate 209, the diamond slag slides to the middle of the collection tank 208 under the action of gravity. The center of the collection tank 208 is provided with a gas cylinder, and the piston rod at the end of the gas cylinder penetrates the collection tank 208 and is provided with a push plate at the end. The slag falling into the collection tank 208 is rolled from the surface of the slope plate 209 to the middle of the collection tank 208 under the action of gravity, and the piston rod at the end of the gas rod drives the push plate to move horizontally, pushing the slag out of the collection tank 208, thereby facilitating the recycling of diamond slag and improving the collection efficiency of the slag.

[0043] Considering that the slag falling on the surface of the slope plate 209 is not easy to collect, the operator needs to sweep it with a brush to gather it inside the collection tank 208. Therefore, the material collecting assembly 500 includes a servo motor 501 provided on one side of the collection tank 208. The output end of the servo motor 501 penetrates the collection tank 208 and is provided with a lead screw 502 at the end. The threads on the surface of the lead screw 502 are symmetrical. The surface of the lead screw 502 is provided with a moving plate 503. Rotating the lead screw 502 causes the moving plate 503 to move relatively. A brush head 504 is provided below the moving plate 503. The moving plate 503 drives the brush head 504 to move horizontally to sweep and collect the diamond slag on the surface of the slope plate 209. A fitting assembly is provided between the moving plate 503 and the brush head 504. The fitting assembly includes a cylinder 505 provided at the bottom of the moving plate 503. A sliding rod 506 is slidably provided in the inner wall of the cylinder 505. The end of the sliding rod 506 is fixed to the top of the collection tank 208. An elastic member 507 is provided between the cylinder 505 and the sliding rod 506. The output end of the servo motor 501 drives the lead screw 502 to rotate, causing the moving plate 503 provided on the surface of the lead screw 502 to move relatively. The brush head 504 provided at the bottom of the moving plate 503 sweeps the surface of the slope plate 209, causing the slag falling on the surface of the slope plate 209 to accumulate towards the center of the collection tank 208. Since the surface of the slope plate 209 is sloped, the sliding rod 506 slides in the inner wall of the cylinder 505 under the action of the elastic member 507 during the movement of the brush head 504 for sweeping, so that the brush head 504 provided at the end of the sliding rod 506 is always in contact with the surface of the slope plate 209. Thus, the slag is automatically swept and accumulated, thereby improving the collection efficiency of the slag.

[0044] In conclusion, the working principle of the present application is as follows: by fixing the rough diamond on the surface of the clamp 205, the transmission shaft connected to the end of the B-axis motor 201 drives the swing table 202 to rotate, the swing table 202 is provided on the surface of the object table 203, the electric drive shaft 204 on the surface of the object table 203 drives the clamp 205 to rotate, so that the laser 101 can automatically cut the rough diamond fixed on the surface of the clamp 205 at multiple angles, thereby improving the cutting efficiency of the diamond surface. During the process of cutting the rough diamond particles at multiple angles, the output end of the B-axis motor 201 drives the transmission shaft to rotate, and the swing table 202 provided on the surface of the transmission shaft rotates. During the rotation of the swing table 202, the rack is driven to move by the rotating gear 207, the double-head gear 303 provided below the rack drives the transmission gear 304 to mesh and rotate, thereby driving the meshing gear 402 to rotate, and the meshing gear 402 drives the hitting ball rod 404 to rotate coaxially. When the swing table 202 drives the object table 203 to rotate, the side below the horizontal position is continuously hit by the meshing gear 402, so that the surface of the object table 203 vibrates, thereby automatically dropping the cuttings dropped on the surface of the object table 203 into the collection groove 208, which is beneficial to reduce the labor intensity of the workers. When the cutting of the rough diamond is completed, the servo motor 501 drives the lead screw 502 to rotate, the moving plate 503 provided on the surface of the lead screw 502 moves relatively, the brush head 504 provided at the bottom of the moving plate 503 sweeps the surface of the inclined plate 209, and the cuttings dropped on the surface of the inclined plate 209 are pushed to the center of the collection groove 208. Since the surface of the inclined plate 209 is inclined, the brush head 504 moves and sweeps during the movement, the slide rod 506 slides in the inner wall of the cylinder 505 under the action of the elastic member 507, and the brush head 504 provided at the end of the slide rod 506 is always attached to the surface of the inclined plate 209, thereby automatically sweeping and collecting the cuttings, thereby improving the collection efficiency of the cuttings.

[0045] The basic principle, main features and advantages of the present application are shown and described above. Those skilled in the art should understand that the present application is not limited by the above examples, and the above examples and descriptions in the specification are only preferred examples of the present application and are not intended to limit the present application. Without departing from the spirit and scope of the present application, various changes and improvements can be made to the present application, and these changes and improvements all fall within the scope of the claimed present application. The scope of protection of the present application is defined by the appended claims and their equivalents.

Claims

1. A diamond laser cutting apparatus, characterized by: The utility model provides a laser cutting device for cutting stone, including body (100), the top of body (100) is equipped with laser (101), the inside of body (100) is equipped with mobile seat (102), mobile seat (102) surface is equipped with base plate (200), base plate (200) both sides are equipped with collection groove (208), one side of base plate (200) is equipped with support plate (210), the end of support plate (210) is equipped with B axle motor (201), B axle motor (201) output penetrates support plate (210) and is connected with transmission shaft at the end, transmission shaft surface is equipped with swing table (202), swing table (202) top is equipped with object table (203), object table (203) surface is equipped with electric drive shaft (204), electric drive shaft (204) top is equipped with clamp (205), clamp (205) is used for fixed diamond, transmission shaft both sides are equipped with rotation gear (207), rotation gear (207) below is equipped with transmission assembly (300), transmission assembly (300) one side is equipped with beating assembly (400), transmission assembly (300) including the rack of being equipped below rotation gear (207), rack includes first rack section (301) and second rack section (302), first rack section (301) with rotation gear (207) meshing rotation, the tooth pattern ratio of second rack section (302) and first rack section (301) is 2:1, when B axle motor (201) output drives swing table (202) rotation, beating assembly (400) is used for the knocking of object table (203) bottom, makes laser cutting brick and stone debris fall into collection groove (208) inside, beating assembly (400) including the extension rod (401) of being equipped one side of support plate (210), the end of extension rod (401) is rotatably equipped with rotating rod (403), rotating rod (403) surface is equipped with meshing gear (402), meshing gear (402) and transmission gear (304) inner core rotation, the tooth pattern ratio of rotating rod (403) and transmission gear (304) is 3:1, the end of rotating rod (403) is equipped with beating ball rod (404), beating ball rod (404) is overall rubber material, collection groove (208) inside is equipped with material collecting assembly (500), material collecting assembly (500) is used for the collection of quick debris.

2. The diamond laser cutting apparatus of claim 1, wherein: The second rack section (302) below is equipped with double -end gear (303), the double -end gear (303) is vertically meshed with transmission gear (304) above one end away from the second rack section (302), transmission gear (304) above is equipped with beating assembly (400).

3. The diamond laser cutting apparatus of claim 1, wherein: The angle of swing table (202) swing along B axle direction is ±120 DEG, the angle of electric drive shaft (204) drive clamp (205) rotation along the axis is 360 DEG.

4. The diamond laser cutting apparatus of claim 1, wherein: The top of the carrier platform (203) is provided with a baffle (206), the baffle (206) is provided with a through slot on both sides along the rotating direction of B axis, the diamond debris cut off by the laser (101) falls into the collecting groove (208) through the through slot.

5. The diamond laser cutting apparatus of claim 4, wherein: The collecting groove (208) is internally provided with a slope plate (209), the slope plate (209) is symmetrically placed at the bottom of the collecting groove (208), when the diamond debris falls on the surface of the slope plate (209), the diamond debris slides to the middle of the collecting groove (208) under the action of gravity, the center of the collecting groove (208) is provided with an air cylinder, the piston rod at the end of the air cylinder penetrates the collecting groove (208) and is provided with a push plate at the end.

6. The diamond laser cutting apparatus of claim 1, wherein: The aggregate assembly (500) includes a servo motor (501) arranged on one side of the collecting groove (208), the output end of the servo motor (501) penetrates the collecting groove (208) and is provided with a lead screw (502) at the end, the surface thread of the lead screw (502) is symmetrically arranged, the surface of the lead screw (502) is provided with a moving plate (503), rotating the lead screw (502) makes the moving plate (503) move relatively, the lower side of the moving plate (503) is provided with a brush head (504), the moving plate (503) drives the brush head (504) to move horizontally to sweep and collect the diamond debris on the surface of the slope plate (209), a fitting assembly is arranged between the moving plate (503) and the brush head (504).

7. The diamond laser cutting apparatus of claim 6, wherein: The fitting assembly includes a cylinder (505) arranged at the bottom of the moving plate (503), a sliding rod (506) is slidably arranged in the inner wall of the cylinder (505), the end of the sliding rod (506) is fixed on the top of the collecting groove (208), an elastic member (507) is arranged between the cylinder (505) and the sliding rod (506).

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