Large-caliber CPP magnetorheological polishing method and device

Abstract

The invention discloses a large-caliber CPP magnetorheological polishing method and device. The machining effect of MRF equipment is controlled by controlling the feeding speed of polishing spots of the MRF equipment. Firstly, a residence time matrix of a two-dimensional area of a polishing spot machining surface shape is equivalent to a one-dimensional track space, and the follow-up calculation amount is greatly reduced. Besides, step length division is carried out according to the function curve of the one-dimensional equivalent residence time function, namely, the path step length of the polishing spot and the area with the steeper surface shape fluctuation height, the area with the shorter step length and the smoother surface shape fluctuation height are automatically calculated according to the fluctuation morphology of the surface shape structure, and the longer step length is achieved, so that the machining precision of the CPP element is improved.

Description

Technical Field

[0001] The present application relates to the field of optical technology, and in particular to a large-caliber CPP magnetorheological polishing method and device. Background Art

[0002] The continuous phase plate (CPP) is an optical element with important functions in the laser system. The CPP with a free-form surface structure effectively controls the morphology, energy utilization and uniformity of the laser system output focal spot, so as to achieve and meet the target surface light intensity smoothing requirements of laser target high-energy physics experiments. It has the characteristics of multi-period, large phase depth and large gradient.

[0003] Magnetic Rheological Finishing (MRF) technology removes materials by controlling the dwell time or feed speed of the polishing tool of the MRF equipment at different positions on the component to achieve CPP component processing. Due to the limited acceleration response capability of existing MRF equipment, the method of dwell time control will result in uneven surface shape of the component after polishing, which is easy to introduce mid-frequency errors. Therefore, it is necessary to change the point dwell time control to speed control based on trajectory segment division, that is, to control the feed speed of each trajectory segment for MRF processing until the surface shape converges.

[0004] The traditional method of converting the point dwell time control mode into the speed control mode is to discretize the machining trajectory according to a certain step length, that is, the equal step length method. For those components with a flat surface distribution, the equal step length method can basically meet the machining requirements. However, for the processing of CPP components with large diameter, large depth, high steepness and multiple cycles, the corresponding dwell time function matrix must also have a multi-random characteristic. It is difficult for the above-mentioned equal step length method to achieve the convergence of the surface accuracy of CPP components. Summary of the invention

[0005] The purpose of this application is to provide a large-caliber CPP magnetorheological polishing method and device, which can improve the above-mentioned problems.

[0006] The embodiment of the present application is implemented as follows:

[0007] In the first aspect, the present application provides a large-diameter CPP magnetorheological polishing method, which includes steps S1 to S5, wherein S1, S2, etc. are merely step identifiers, and the execution order of the method is not necessarily in ascending order of numbers. For example, step S2 may be executed first and then step S1, and the present application does not impose any restrictions thereon.

[0008] S1, receiving the CPP surface shape data and polishing spot parameters to be processed.

[0009] S2, calculating, according to the surface shape data of the CPP to be processed and the polishing spot parameters, a one-dimensional equivalent residence time function of the magnetorheological polishing spot on the CPP element to be processed during the processing.

[0010] S3, discretizing the function curve of the one-dimensional equivalent residence time function to obtain a discrete point array.

[0011] S4, dividing the processing trajectory of the polishing spot into steps according to the discrete point array to obtain various adaptive steps, so that the difference between the maximum processing depth and the minimum processing depth in each of the adaptive steps is equal to a preset tolerance value.

[0012] S5, calculating the feed speed of the polishing spot within each of the adaptive steps.

[0013] It can be understood that the present application discloses a large-caliber CPP magnetorheological polishing method, which controls the processing effect of the MRF equipment by controlling the polishing spot feed speed of the MRF equipment. The present application first calculates the residence time of the polishing spot on the CPP element to be processed based on the surface shape data of the CPP to be processed and the polishing spot parameters. The present application equates the residence time matrix of the two-dimensional area of ​​the polishing spot processing surface shape to the one-dimensional trajectory space, which greatly reduces the subsequent calculation amount. The present application also divides the step length according to the function curve of the one-dimensional equivalent residence time function. Since the equivalent one-dimensional method of the residence time matrix can maximize the reflection of the high-steepness structural characteristics of the CPP element, the greater the curvature of the function curve of the one-dimensional equivalent residence time function, the steeper the current surface of the CPP element, and the denser the corresponding trajectory segment step length division; the smaller the curvature, the flatter the current surface of the CPP element, and the sparser the corresponding trajectory segment step length division. The present application no longer uses the traditional equal step length method to calculate the polishing spot feed speed, but automatically calculates the path step length of the polishing spot according to the undulating morphology of the surface structure. The steeper the surface undulation, the shorter the step length, and the flatter the surface undulation, the longer the step length, thereby improving the processing accuracy of the CPP component.

[0014] In an optional embodiment of the present application, the CPP surface shape data to be processed includes the design surface shape data of the CPP surface to be processed and the surface shape error function; the polishing spot parameters include the half-height width of the polishing spot, the peak value of the polishing spot, and the polishing spot function. Among them, the surface shape error function is the difference between the design surface shape data and the actual surface shape data.

[0015] In an optional embodiment of the present application, S2 includes:

[0016] The one-dimensional equivalent residence time function of the magnetorheological polishing spot on the CPP component to be processed during the processing is calculated according to the following formula:

[0017]

[0018] Among them, δ(x, y) represents the one-dimensional equivalent residence time of the midpoint ρ(x, y) of the CPP component to be processed, k represents the equivalent influence coefficient, R represents the half-height width of the polishing spot, and r max represents the polishing spot peak value, r(x,y) represents the polishing spot function, τ(x,y) represents the surface error function, Σ represents the processing area of ​​the polishing spot,

[0019] in, Represents the weighting factor, satisfying the following formula:

[0020]

[0021] Among them, p x 、p y Represents the horizontal and vertical pixel values ​​of the face shape, x s ,y s represents the coordinate value of the center point of the polishing spot, and n represents the influence adjustment coefficient.

[0022] In an optional embodiment of the present application, the equivalent influence coefficient, the weighting factor, and the influence adjustment coefficient may be set by those skilled in the art according to specific circumstances.

[0023] In an optional embodiment of the present application, S3 includes:

[0024] The function curve of the one-dimensional equivalent dwell time function is discretized according to the following formula to obtain a discrete point array D[K]:

[0025]

[0026] K represents the number of discrete points in the discrete point array, s x 、s y represents the size represented by the horizontal and vertical pixel values ​​of the face shape, L represents the curve length of the function curve, and a represents the adjustment coefficient.

[0027] In an optional embodiment of the present application, the S4 specifically includes the following steps:

[0028] S41, finding the starting discrete point and the ending discrete point corresponding to the i-th adaptive step size from the discrete point array;

[0029] S42, along the processing trajectory, calculating the path distance between the processing position corresponding to the starting discrete point and the processing position corresponding to the ending discrete point as the i-th adaptive step length.

[0030] In an optional embodiment of the present application, the S41 includes the following steps:

[0031] S411, determining a starting discrete point of the i-th adaptive step size from the discrete point array;

[0032] S412, starting from the starting discrete point, searching point by point until the difference between the processing depth corresponding to the first target discrete point and the processing depth corresponding to the second target discrete point is found to be equal to a preset tolerance value;

[0033] S413, using the corresponding discrete point when the search is terminated as the termination discrete point for determining the i-th adaptive step length, and using the corresponding discrete point when the search is terminated as the starting discrete point for determining the (i+1)-th adaptive step length.

[0034] In an optional embodiment of the present application, S5 includes:

[0035] S51, calculating the sum of the values ​​of the discrete points between the starting discrete point and the ending discrete point corresponding to the i-th adaptive step in the discrete point array as the path duration of the i-th adaptive step;

[0036] S52: Taking the ratio of the i-th adaptive step length to the corresponding path duration as the feeding speed within the i-th adaptive step length.

[0037] In an optional embodiment of the present application, the following step S6 is also included, generating a control file of the MRF equipment according to the one-dimensional equivalent residence time function and the feed speed.

[0038] In the second aspect, the present application discloses a large-caliber CPP magnetorheological polishing device, including a data interaction module, a surface shape editing module and a post-processing module; wherein the data interaction module is used to receive the surface shape data of the CPP to be processed and the polishing spot parameters; the surface shape editing module is used to calculate the one-dimensional equivalent residence time function of the magnetorheological polishing spot on the CPP element to be processed during the processing according to the surface shape data of the CPP to be processed and the polishing spot parameters; the function curve of the one-dimensional equivalent residence time function is discretized to obtain a discrete point array; the processing trajectory of the polishing spot is divided into steps according to the discrete point array to obtain each adaptive step, so that the difference between the maximum processing depth and the minimum processing depth within each of the adaptive step is equal to the preset tolerance value; the post-processing module is used to generate a control file for the MRF equipment according to the one-dimensional equivalent residence time function and the feed speed.

[0039] In an optional embodiment of the present application, the above-mentioned large-caliber CPP magnetorheological polishing device also includes a polishing spot production module, which is used to generate magnetorheological removal function information to provide matching data for residence time solution.

[0040] In a third aspect, the present application discloses a large-diameter CPP magnetorheological polishing device, comprising a processor, an input device, an output device and a memory, wherein the processor, input device, output device and memory are interconnected, wherein the memory is used to store a computer program, and the computer program includes program instructions, and the processor is configured to call the program instructions to execute the method described in any one of the first aspects.

[0041] Beneficial effects:

[0042] The present application discloses a large-caliber CPP magnetorheological polishing method, which controls the processing effect of the MRF equipment by controlling the polishing spot feed speed of the MRF equipment.

[0043] The present application first calculates the residence time of the polishing spot on the CPP element to be processed based on the CPP surface shape data to be processed and the polishing spot parameters. The present application converts the residence time matrix of the two-dimensional area of ​​the polishing spot processing surface shape into a one-dimensional trajectory space, which greatly reduces the subsequent calculation amount.

[0044] The present application also divides the step length according to the function curve of the one-dimensional equivalent dwell time function. Since the equivalent one-dimensional method of the dwell time matrix can reflect the high-steepness structural characteristics of the CPP element to the maximum extent, the greater the curvature of the function curve of the one-dimensional equivalent dwell time function, the steeper the current surface of the CPP element, and the denser the corresponding trajectory segment step length division; the smaller the curvature, the flatter the current surface of the CPP element, and the sparser the corresponding trajectory segment step length division. The present application no longer uses the traditional equal step length method to calculate the polishing spot feed speed, but automatically calculates the path step length of the polishing spot according to the undulating morphology of the surface structure. The steeper the surface undulation height, the shorter the step length, and the flatter the surface undulation height, the longer the step length, thereby improving the processing accuracy of the CPP element.

[0045] In order to make the above-mentioned objects, features and advantages of the present application more obvious and understandable, optional embodiments are specifically listed below and described in detail with reference to the attached drawings. BRIEF DESCRIPTION OF THE DRAWINGS

[0046] In order to more clearly illustrate the technical solutions of the embodiments of the present application, the drawings required for use in the embodiments will be briefly introduced below. It should be understood that the following drawings only show certain embodiments of the present application and therefore should not be regarded as limiting the scope. For ordinary technicians in this field, other related drawings can be obtained based on these drawings without paying creative work.

[0047] Figure 1 It is a schematic flow chart of a large-caliber CPP magnetorheological polishing method provided by the present application;

[0048] Figure 2It is a schematic diagram of the residence time distribution of the polishing spot of the MRF equipment provided by the present application on the CPP element;

[0049] Figure 3 yes Figure 2 Equivalent one-dimensional schematic diagram of the residence time distribution diagram shown. DETAILED DESCRIPTION

[0050] The following will be combined with the drawings in the embodiments of the present application to clearly and completely describe the technical solutions in the embodiments of the present application. Obviously, the described embodiments are only part of the embodiments of the present application, not all of the embodiments. Based on the embodiments in the present application, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of this application.

[0051] Magnetic Rheological Finishing (MRF) technology removes materials by controlling the dwell time or feed speed of the polishing tool of the MRF equipment at different positions on the component to achieve CPP component processing. Compared with other traditional control algorithms of computer-controlled surface shaping and polishing (CCOS), the difficulty of writing CPP magnetorheological polishing control algorithm lies in:

[0052] 1) The distribution of magnetorheological polishing spots is uneven and non-rotationally symmetrical, which is an asymmetric removal function. Compared with the rotationally symmetrical removal function, its processing process is more complicated;

[0053] 2) The surface shape of CPP components is a multi-periodic structure with diverse local features. It is necessary to develop a control algorithm suitable for MRF processing of CPP complex structures to achieve ultra-precision processing of CPP components.

[0054] The main function of the CPP magnetorheological polishing control algorithm is to generate machine tool CNC code for MRF processing after processing the polishing spot and CPP component surface data. Through precise calculation, a simulated surface diagram with high similarity to the actual processing surface shape is obtained, providing a reference for engineering and technical personnel to predict the actual processing results and optimize the process parameters.

[0055] Assuming that the magnetorheological device has the ability to respond quickly to absolute acceleration in the direction of motion, the residence time of the magnetorheological polishing wheel at each point can be controlled according to the residence time matrix to achieve MRF polishing of CPP components. Due to the limited acceleration response capability of existing magnetorheological polishing equipment, the residence time control method will lead to uneven surface shape of the component after polishing, and easily introduce mid-frequency errors. Therefore, it is necessary to change the point residence time control to speed control based on trajectory segment division, that is, to control the feed speed of each trajectory segment for MRF processing until the surface shape converges.

[0056] For components with a flat surface distribution, the traditional equal step method can basically meet the processing requirements. However, for the processing of CPP components with large diameter, large depth, high steepness and multiple cycles, the corresponding dwell time function matrix must also have multi-random characteristics, and the above-mentioned equal step method is difficult to achieve the convergence of CPP component surface accuracy.

[0057] In order to solve the above problems, in the first aspect, the present application provides a large-caliber CPP magnetorheological polishing method, such as Figure 1 As shown, it includes steps S1 to S5, wherein S1, S2, etc. are merely step identifiers, and the execution order of the method is not necessarily in ascending order of numbers, for example, step S2 may be executed first and then step S1, and this application does not impose any limitation thereto.

[0058] S1, receiving the CPP surface shape data and polishing spot parameters to be processed.

[0059] In an optional embodiment of the present application, the CPP surface shape data to be processed includes the design surface shape data of the CPP surface to be processed and the surface shape error function; the polishing spot parameters include the half-height width of the polishing spot, the peak value of the polishing spot, and the polishing spot function. Among them, the surface shape error function is the difference between the design surface shape data and the actual surface shape data.

[0060] S2, according to the surface shape data of the CPP to be processed and the polishing spot parameters, a one-dimensional equivalent residence time function of the magnetorheological polishing spot on the CPP element to be processed during the processing is calculated.

[0061] like Figure 2 The figure shows the residence time distribution diagram of the polishing spot of the MRF equipment on the CPP component. It can be seen that in the conventional calculation method, the residence time distribution is a two-dimensional distribution diagram. When calculating the residence time of a polishing spot at a certain point on the component during the processing of the CPP component by the magnetorheological polishing spot, it is necessary to calculate and solve the two-dimensional surface area covered by the polishing spot. The calculation amount is quite large and complicated. Therefore, it is proposed to use an equivalent one-dimensional model of the residence time matrix to equate the residence time matrix of the two-dimensional area of ​​the polishing spot processing surface to the one-dimensional trajectory space.

[0062] The equivalent one-dimensional model of the dwell time matrix has a strong correlation with the dwell time matrix of the entire affected area covered by the polishing spot and the removal distribution characteristics of the polishing spot itself. This model not only reduces the calculation time of the feed speed, but also can maximize the reflection of the high steepness structural characteristics of the CPP component. The greater the curvature of the function curve of the one-dimensional equivalent dwell time function, the steeper the current surface of the CPP component; the smaller the curvature, the flatter the current surface of the CPP component.

[0063] In an optional embodiment of the present application, S2 includes:

[0064] The one-dimensional equivalent residence time function of the magnetorheological polishing spot on the CPP component to be processed during the processing is calculated according to the following formula:

[0065]

[0066] Among them, δ(x, y) represents the one-dimensional equivalent residence time of the midpoint ρ(x, y) of the CPP component to be processed, k represents the equivalent influence coefficient, R represents the half-height width of the polishing spot, and r max represents the polishing spot peak value, r(x,y) represents the polishing spot function, τ(x,y) represents the surface error function, Σ represents the processing area of ​​the polishing spot,

[0067] in, Represents the weighting factor, satisfying the following formula:

[0068]

[0069] Among them, p x 、p y Represents the horizontal and vertical pixel values ​​of the face shape, x s ,y s represents the coordinate value of the center point of the polishing spot, and n represents the influence adjustment coefficient.

[0070] In an optional embodiment of the present application, the equivalent influence coefficient, the weighting factor, and the influence adjustment coefficient may be set by those skilled in the art according to specific circumstances.

[0071] S3, discretizing the function curve of the one-dimensional equivalent residence time function to obtain a discrete point array.

[0072] In an optional embodiment of the present application, S3 includes:

[0073] The function curve of the one-dimensional equivalent dwell time function is discretized according to the following formula to obtain a discrete point array D[K]:

[0074]

[0075] K represents the number of discrete points in the discrete point array, s x 、s y represents the size of the face represented by the horizontal and vertical pixel values, L represents the length of the function curve, and a represents the adjustment coefficient.

[0076] S4, dividing the processing trajectory of the polishing spot into steps according to the discrete point array to obtain each adaptive step, so that the difference between the maximum processing depth and the minimum processing depth in each adaptive step is equal to the preset tolerance value.

[0077] S5, calculating the feed speed of the polishing spot in each adaptive step.

[0078] It can be understood that the present application divides the step length according to the function curve of the one-dimensional equivalent dwell time function. Since the equivalent one-dimensional method of the dwell time matrix can reflect the high steepness structural characteristics of the CPP element to the maximum extent, the greater the curvature of the function curve of the one-dimensional equivalent dwell time function, the steeper the current surface of the CPP element, and the denser the corresponding trajectory segment step length division; the smaller the curvature, the flatter the current surface of the CPP element, and the sparser the corresponding trajectory segment step length division. The present application no longer uses the traditional equal step length method to calculate the feed speed of the polishing spot, but automatically calculates the path step length of the polishing spot according to the undulating morphology of the surface structure. The steeper the surface undulation height, the shorter the step length, and the flatter the surface undulation height, the longer the step length, thereby improving the processing accuracy of the CPP element.

[0079] In an optional embodiment of the present application, S4 specifically includes the following steps:

[0080] S41, finding the starting discrete point and the ending discrete point corresponding to the i-th adaptive step size from the discrete point array.

[0081] Specifically, S41 includes the following steps:

[0082] S411, determining a starting discrete point of the i-th adaptive step from the discrete point array;

[0083] S412, starting from the starting discrete point, searching point by point until the difference between the processing depth corresponding to the first target discrete point and the processing depth corresponding to the second target discrete point is found to be equal to a preset tolerance value;

[0084] S413, using the corresponding discrete point when the search is terminated as the termination discrete point for determining the i-th adaptive step length, and using the corresponding discrete point when the search is terminated as the starting discrete point for determining the (i+1)-th adaptive step length.

[0085] S42, along the processing trajectory, calculating the path distance between the processing position corresponding to the starting discrete point and the processing position corresponding to the ending discrete point as the i-th adaptive step length.

[0086] For example, for the discrete point array D[K], start searching point by point from the starting discrete point o to solve the height difference between the maximum data point and the minimum data point. When the height difference is equal to the given tolerance value, the search is terminated and this point is the ending discrete point q. The length of a single step is the distance from the starting discrete point to the ending discrete point. Similarly, continue searching for the length of the next step starting from the ending discrete point q to complete the next iteration, so that the length of each step on the entire processing trajectory can be obtained. The length of a single step can be expressed as:

[0087]

[0088] Where doq represents the length of a single step; di represents the length from point i to point i+1.

[0089] In an optional embodiment of the present application, S5 includes:

[0090] S51, calculating the sum of the values ​​of each discrete point between the starting discrete point and the ending discrete point corresponding to the ith adaptive step in the discrete point array as the path duration of the ith adaptive step.

[0091] S52, taking the ratio of the i-th adaptive step length to the corresponding path duration as the feed speed within the i-th adaptive step length.

[0092] In an optional embodiment of the present application, the following step S6 is also included, generating a control file of the MRF equipment according to the one-dimensional equivalent residence time function and the feed speed.

[0093] In a second aspect, the present application discloses a large-caliber CPP magnetorheological polishing device, including a data interaction module, a surface editing module and a post-processing module.

[0094] The data interaction module is used to receive the CPP surface shape data and polishing spot parameters to be processed. The data interaction module can provide a simple and practical interactive operation method, and the CPP surface shape and polishing spot data to be processed can be easily input into the software, which improves work efficiency and facilitates operators to operate and use it skillfully.

[0095] The surface editing module is used to calculate the one-dimensional equivalent dwell time function of the magnetorheological polishing spot on the CPP component to be processed during the processing according to the surface data of the CPP to be processed and the parameters of the polishing spot; discretize the function curve of the one-dimensional equivalent dwell time function to obtain a discrete point array; divide the processing trajectory of the polishing spot into steps according to the discrete point array to obtain each adaptive step, so that the difference between the maximum processing depth and the minimum processing depth in each adaptive step is equal to the preset tolerance value. The surface editing module mainly realizes the functions of translation, rotation, patching, and trimming of the surface, performs corresponding processing on the surface data, and realizes the function of data analysis, as shown in the interface of the surface editing module; the surface processing module is the core module of the process software. It is based on the Preston equation, establishes a relationship model between relative speed and processing removal, and compiles corresponding algorithms to realize the simulation processing of CPP components. This module includes several sub-modules such as basic data preprocessing, trajectory planning, dwell time solution, feed speed solution, surface simulation, and polishing spot preprocessing.

[0096] The post-processing module is used to generate the control file of the MRF equipment according to the one-dimensional equivalent residence time function and the feed speed.

[0097] In an optional embodiment of the present application, the above-mentioned large-caliber CPP magnetorheological polishing device also includes a polishing spot production module, which is used to generate magnetorheological removal function information to provide matching data for residence time solution.

[0098] In a third aspect, the present application provides a large-diameter CPP magnetorheological polishing device. The large-diameter CPP magnetorheological polishing device includes one or more processors; one or more input devices, one or more output devices and a memory. The above-mentioned processor, input device, output device and memory are connected via a bus. The memory is used to store a computer program, which includes program instructions, and the processor is used to execute the program instructions stored in the memory. Among them, the processor is configured to call the program instructions to perform the operation of any method of the first aspect.

[0099] It should be understood that in the embodiments of the present invention, the processor referred to may be a central processing unit (CPU), and the processor may also be other general-purpose processors, digital signal processors (DSP), application-specific integrated circuits (ASIC), field-programmable gate arrays (FPGA) or other programmable logic devices, discrete gate or transistor logic devices, discrete hardware components, etc. A general-purpose processor may be a microprocessor or the processor may also be any conventional processor, etc.

[0100] The memory may include a read-only memory and a random access memory, and provide instructions and data to the processor. A portion of the memory may also include a non-volatile random access memory. For example, the memory may also store information about the device type.

[0101] In a specific implementation, the processor, input device, and output device described in the embodiments of the present invention may execute the implementation method described in any method of the first aspect, or may execute the implementation method of the terminal device described in the embodiments of the present invention, which will not be repeated here.

[0102] In a third aspect, the present invention provides a computer-readable storage medium storing a computer program, wherein the computer program includes program instructions, and when the program instructions are executed by a processor, the steps of any method of the first aspect are implemented.

[0103] The computer-readable storage medium may be an internal storage unit of the terminal device of any of the aforementioned embodiments, such as a hard disk or memory of the terminal device. The computer-readable storage medium may also be an external storage device of the terminal device, such as a plug-in hard disk, a smart memory card (Smart Media Card, SMC), a secure digital (Secure Digital, SD) card, a flash card (Flash Card), etc. equipped on the terminal device. Furthermore, the computer-readable storage medium may also include both an internal storage unit of the terminal device and an external storage device. The computer-readable storage medium is used to store the computer program and other programs and data required by the terminal device. The computer-readable storage medium may also be used to temporarily store data that has been output or is to be output.

[0104] Those of ordinary skill in the art will appreciate that the units and algorithm steps of each example described in conjunction with the embodiments disclosed herein can be implemented in electronic hardware, computer software, or a combination of the two. In order to clearly illustrate the interchangeability of hardware and software, the composition and steps of each example have been generally described in terms of function in the above description. Whether these functions are performed in hardware or software depends on the specific application and design constraints of the technical solution. Professional and technical personnel can use different methods to implement the described functions for each specific application, but such implementation should not be considered to be beyond the scope of the present invention.

[0105] In the several embodiments provided in the present application, it should be understood that the disclosed terminal device and method can be implemented in other ways. For example, the device embodiments described above are only schematic. For example, the division of the above units is only a logical function division. There may be other division methods in actual implementation, such as multiple units or components can be combined or integrated into another system, or some features can be ignored or not executed. In addition, the mutual coupling or direct coupling or communication connection shown or discussed can be an indirect coupling or communication connection through some interfaces, devices or units, or it can be an electrical, mechanical or other form of connection.

[0106] The units described above as separate components may or may not be physically separated, and the components shown as units may or may not be physical units, that is, they may be located in one place or distributed on multiple network units. Some or all of the units may be selected according to actual needs to achieve the purpose of the embodiments of the present invention.

[0107] In addition, each functional unit in each embodiment of the present invention may be integrated into one processing unit, or each unit may exist physically separately, or two or more units may be integrated into one unit. The above-mentioned integrated unit may be implemented in the form of hardware or in the form of software functional units.

[0108] If the above-mentioned integrated unit is implemented in the form of a software functional unit and sold or used as an independent product, it can be stored in a computer-readable storage medium. Based on such an understanding, the technical solution of the present invention is essentially or the part that contributes to the prior art, or all or part of the technical solution can be embodied in the form of a software product, and the computer software product is stored in a storage medium, including a number of instructions for a computer device (which can be a personal computer, a server, or a network device, etc.) to perform all or part of the steps of the method in each embodiment of the present invention. The aforementioned storage medium includes: U disk, mobile hard disk, read-only memory (ROM, Read-Only Memory), random access memory (RAM, Random Access Memory), disk or optical disk and other media that can store program codes.

[0109] The expressions "first", "second", "the first" or "the second" used in various embodiments of the present disclosure may modify various components regardless of order and / or importance, but these expressions do not limit the corresponding components. The above expressions are only configured for the purpose of distinguishing an element from other elements. For example, a first user device and a second user device represent different user devices, although both are user devices. For example, a first element may be referred to as a second element, and similarly, a second element may be referred to as a first element without departing from the scope of the present disclosure.

[0110] When one element (e.g., a first element) is referred to as being "(operably or communicatively) coupled" or "(operably or communicatively) coupled to" or "connected to" another element (e.g., a second element), it is understood that the one element is directly connected to the other element or the one element is indirectly connected to the other element via yet another element (e.g., a third element). Conversely, it is understood that when an element (e.g., a first element) is referred to as being "directly connected" or "directly coupled" to another element (the second element), no element (e.g., a third element) is interposed between the two.

[0111] It should be noted that, in this article, the terms "include", "comprises" or any other variants thereof are intended to cover non-exclusive inclusion, so that a process, method, article or device including a series of elements includes not only those elements, but also includes other elements not explicitly listed, or also includes elements inherent to such process, method, article or device. In the absence of further restrictions, an element defined by the sentence "includes a ..." does not exclude the existence of other identical elements in the process, method, article or device including the element. In addition, components, features, and elements with the same name in different embodiments of the present application may have the same meaning or different meanings, and their specific meanings need to be determined by their explanation in the specific embodiment or further combined with the context of the specific embodiment.

[0112] The above description is only an optional embodiment of the present application and an explanation of the technical principles used. Those skilled in the art should understand that the scope of the invention involved in the present application is not limited to the technical solution formed by a specific combination of the above technical features, but should also cover other technical solutions formed by any combination of the above technical features or their equivalent features without departing from the above invention concept. For example, the above features are replaced with the technical features with similar functions disclosed in this application (but not limited to) by each other.

[0113] As used herein, the words "if" and "if" may be interpreted as "at the time of" or "when" or "in response to determining" or "in response to detecting", depending on the context. Similarly, the phrases "if it is determined" or "if (stated condition or event) is detected" may be interpreted as "when it is determined" or "in response to determining" or "when detecting (stated condition or event)" or "in response to detecting (stated condition or event)", depending on the context.

[0114] The above description is only an optional embodiment of the present application and an explanation of the technical principles used. Those skilled in the art should understand that the scope of the invention involved in the present application is not limited to the technical solution formed by a specific combination of the above technical features, but should also cover other technical solutions formed by any combination of the above technical features or their equivalent features without departing from the above invention concept. For example, the above features are replaced with the technical features with similar functions disclosed in this application (but not limited to) by each other.

[0115] The above description is only an optional embodiment of the present application and is not intended to limit the present application. For those skilled in the art, the present application may have various modifications and variations. Any modification, equivalent replacement, improvement, etc. made within the spirit and principle of the present application shall be included in the protection scope of the present application.

Claims

1. A large-caliber CPP magnetorheological polishing method, characterized in that: The following steps are involved: S1, receiving the CPP surface shape data and polishing spot parameters to be processed; S2, calculating a one-dimensional equivalent residence time function of the magnetorheological polishing spot on the CPP element to be processed during the processing according to the surface shape data of the CPP to be processed and the polishing spot parameters; S3, discretizing the function curve of the one-dimensional equivalent residence time function to obtain a discrete point array; S4, dividing the processing trajectory of the polishing spot into steps according to the discrete point array to obtain various adaptive step lengths, so that the difference between the maximum processing depth and the minimum processing depth in each of the adaptive step lengths is equal to a preset tolerance value; S5, calculating the feed speed of the polishing spot within each of the adaptive steps.

2. The large-caliber CPP magnetorheological polishing method according to claim 1 is characterized in that: The CPP surface data to be processed includes the design surface data of the CPP surface to be processed and a surface error function; The polishing spot parameters include the polishing spot half-height width, the polishing spot peak value, and the polishing spot function.

3. The large-caliber CPP magnetorheological polishing method according to claim 2 is characterized in that: The S2 includes: The one-dimensional equivalent residence time function of the magnetorheological polishing spot on the CPP component to be processed during the processing is calculated according to the following formula: Among them, δ(x, y) represents the one-dimensional equivalent residence time of the midpoint ρ(x, y) of the CPP component to be processed, k represents the equivalent influence coefficient, R represents the half-height width of the polishing spot, and r max represents the polishing spot peak value, r(x,y) represents the polishing spot function, τ(x,y) represents the surface error function, Σ represents the processing area of ​​the polishing spot, in, Represents the weighting factor, satisfying the following formula: Among them, p x 、p y Represents the horizontal and vertical pixel values ​​of the face shape, x s ,y s represents the coordinate value of the center point of the polishing spot, and n represents the influence adjustment coefficient.

4. The large-caliber CPP magnetorheological polishing method according to claim 1 is characterized in that: The S3 includes: The function curve of the one-dimensional equivalent dwell time function is discretized according to the following formula to obtain a discrete point array D[K]: K represents the number of discrete points in the discrete point array, s x 、s y represents the size represented by the horizontal and vertical pixel values ​​of the face shape, L represents the curve length of the function curve, and a represents the adjustment coefficient.

5. The large-caliber CPP magnetorheological polishing method according to claim 4 is characterized in that: The S4 specifically comprises the following steps: S41, finding the starting discrete point and the ending discrete point corresponding to the i-th adaptive step size from the discrete point array; S42, along the processing trajectory, calculating the path distance between the processing position corresponding to the starting discrete point and the processing position corresponding to the ending discrete point as the i-th adaptive step length.

6. The large-caliber CPP magnetorheological polishing method according to claim 5 is characterized in that: The S41 comprises the following steps: S411, determining a starting discrete point of the i-th adaptive step size from the discrete point array; S412, starting from the starting discrete point, searching point by point until the difference between the processing depth corresponding to the first target discrete point and the processing depth corresponding to the second target discrete point is found to be equal to a preset tolerance value; S413, using the corresponding discrete point when the search is terminated as the termination discrete point for determining the i-th adaptive step length, and using the corresponding discrete point when the search is terminated as the starting discrete point for determining the (i+1)-th adaptive step length.

7. The large-caliber CPP magnetorheological polishing method according to claim 6 is characterized in that: The S5 includes: S51, calculating the sum of the values ​​of the discrete points between the starting discrete point and the ending discrete point corresponding to the i-th adaptive step in the discrete point array as the path duration of the i-th adaptive step; S52: Taking the ratio of the i-th adaptive step length to the corresponding path duration as the feeding speed within the i-th adaptive step length.

8. The large-caliber CPP magnetorheological polishing method according to claim 7 is characterized in that: The method further includes the following step S6, generating a control file of the MRF equipment according to the one-dimensional equivalent residence time function and the feed speed.

9. A large-caliber CPP magnetorheological polishing device, characterized in that: include, A data interaction module is used to receive the surface shape data of the CPP to be processed and the polishing spot parameters; A surface shape editing module is used to calculate a one-dimensional equivalent residence time function of a magnetorheological polishing spot on a CPP element to be processed during processing according to the surface shape data of the CPP to be processed and the polishing spot parameters; discretize the function curve of the one-dimensional equivalent residence time function to obtain a discrete point array; divide the processing trajectory of the polishing spot into steps according to the discrete point array to obtain various adaptive step lengths, so that the difference between the maximum processing depth and the minimum processing depth in each of the adaptive step lengths is equal to a preset tolerance value; The post-processing module is used to generate a control file of the MRF device according to the one-dimensional equivalent residence time function and the feed speed.

10. The large-caliber CPP magnetorheological polishing device according to claim 9, characterized in that: Also includes: The polishing spot making module is used to generate magnetorheological removal function information and provide matching data for dwell time solution.

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