Ceramic-based circuit board processing equipment

Abstract

The present invention relates to the technical field of grinding machine tools, and specifically discloses a ceramic-based circuit board processing equipment, wherein an adsorption mechanism includes a plurality of adsorption members arranged closely in rows and columns, the adsorption members can slide in the vertical direction and are used to adsorb the ceramic-based circuit board, a first grinding mechanism includes a propulsion unit corresponding to the row seam, the propulsion unit includes a propulsion member, a grinding wheel and a linear drive, the propulsion member can move along the row direction of the adsorption member, the grinding wheel is mounted on the propulsion member, and is used to grind the row edge of the ceramic-based circuit board, and the linear drive is used to drive the propulsion member to slide; the second grinding mechanism has the same structure as the first grinding mechanism and is orthogonally arranged, and the grinding wheel of the second grinding mechanism is used to grind the column edge of the ceramic-based circuit board. In the ceramic-based circuit board processing equipment of the present invention, the first grinding mechanism and the second grinding mechanism utilize the row-column grinding method to improve the grinding efficiency, and have better adaptability to square and rectangular ceramic-based circuit boards.

Description

Technical Field

[0001] The invention relates to the technical field of grinding machine tools, and in particular to a ceramic-based circuit board processing device. Background Art

[0002] Ceramic-based circuit boards, also known as ceramic circuit boards or ceramic substrates, are high-tech products that use ceramic materials as the matrix and form circuit patterns on the surface through precise manufacturing processes. Ceramic substrates have many excellent properties, such as high thermal conductivity, good electrical properties, matching thermal expansion coefficients, and excellent chemical and thermal stability. Due to their excellent properties, ceramic substrates are used in LEDs, power devices, microwave devices, automotive electronics, medical equipment, communications equipment, aerospace and other fields.

[0003] During manufacturing, ceramic substrates are generally cut and diced to form multiple cutting lines on their surface. Then, stress is applied along the cutting lines to separate the material at the stress position, thereby achieving the separation of the ceramic substrate. After the ceramic substrate is separated, burrs, broken edges or unevenness will occur on its edges. In order to improve the surface finish and smoothness of the ceramic substrate, the edges of the ceramic substrate are usually ground.

[0004] The Chinese patent application with application publication number CN117428607A discloses a substrate bearing mechanism and substrate grinding equipment, wherein the substrate bearing mechanism includes a suction cup assembly for adsorbing the substrate, a mounting seat for supporting the suction cup assembly, and a driving member for driving the mounting seat to rotate, and the substrate grinding equipment includes a grinding module arranged above the substrate bearing mechanism, and the grinding module includes a rough grinding wheel and a fine grinding wheel. When the mounting seat rotates, the suction cup assembly and the substrate thereon are driven to rotate, and the rough grinding wheel and the fine grinding wheel grind the edge of the substrate in turn.

[0005] However, the grinding module can only grind a single substrate at a time by means of rotational grinding and cannot form batch grinding of substrates, thus the working efficiency is low. Summary of the invention

[0006] The invention provides a ceramic-based circuit board processing device, aiming to solve the problem of low working efficiency of rotary grinding in the related art.

[0007] The ceramic-based circuit board processing equipment of the present invention comprises a machine tool, a mounting frame, an adsorption mechanism, a first grinding mechanism and a second grinding mechanism. The mounting frame protrudes above the machine tool, and a mounting cavity is formed in the mounting frame. The adsorption mechanism is arranged in the mounting cavity, and comprises a plurality of adsorption members arranged closely in rows and columns. The adsorption members can slide in the vertical direction and are used to adsorb the ceramic-based circuit board. The edge of the ceramic-based circuit board in the upward direction of the row of the adsorption members is set as the row edge, and the edge of the ceramic-based circuit board in the upward direction of the column of the adsorption members is set as the column edge. A row seam is formed between two adjacent rows of adsorption members. The first grinding mechanism comprises a propulsion unit corresponding to the row seam one by one. The propulsion unit comprises a propulsion member, a grinding wheel and a linear drive. The propulsion member can move along the row direction of the adsorption member. The grinding wheel is mounted on the propulsion member and is used to grind the row edge of the ceramic-based circuit board. The linear drive is used to drive the propulsion member to slide. The second grinding mechanism has the same structure as the first grinding mechanism and is arranged orthogonally. The grinding wheel of the second grinding mechanism is used to grind the column edge of the ceramic-based circuit board.

[0008] A negative pressure cavity is formed in the mounting frame and is located below the mounting cavity and can be connected to a negative pressure suction device. A hollow structure is formed inside the adsorbent. The bottom is connected to the negative pressure cavity through an elastic telescopic tube, and the top is provided with an adsorption port for negative pressure adsorption of the ceramic-based circuit board.

[0009] The ceramic-based circuit board processing equipment also includes a first pressing mechanism, which includes a clamping member and a driving member, wherein the number of the clamping members is equal to the number of rows of the elastic telescopic tubes and the clamping members are clamped on the elastic telescopic tubes in the corresponding rows, and the driving member is arranged on the mounting frame and is used to drive the plurality of clamping members to move downward in an offset manner, so that when some of the clamping members move downward, a single clamping member is retained in place;

[0010] The driving member includes a lifting platform and a slide seat. At least one end of the clamping member protrudes from the outside of the mounting frame and forms a protrusion. The lifting platform is vertically slidably installed on the outside of the mounting frame. A pressing member corresponding to the protrusion is elastically slidably connected to the lifting platform. The pressing member is used to press down the corresponding protrusion when moving downward. The mounting frame is provided with a lifting device for controlling the sliding of the lifting platform; the slide seat is slidably installed on the lifting platform along the column direction of the elastic telescopic tube. A wedge structure is provided between the slide seat and the pressing member. The wedge structure is used to force the pressing member to retract when the slide seat slides to the position of the pressing member; the lifting platform is provided with a linear driving device for driving the slide seat to slide.

[0011] The effect is that: by gradually moving down the adsorption members of each row or column, a single row or column of ceramic-based circuit boards can be isolated. Then, by moving the pusher and grinding the grinding wheel, the entire row or column of ceramic-based circuit boards can be ground, thereby forming a batch grinding effect and greatly improving work efficiency. The first grinding mechanism and the second grinding mechanism use the row and column grinding method to improve the adaptability to square and rectangular ceramic-based circuit boards.

[0012] After the negative pressure suction equipment forms a negative pressure vacuum environment in the negative pressure chamber, the negative pressure adsorption force is transmitted to the adsorption port through the elastic telescopic tube and the adsorption piece, thereby achieving tight adsorption of the ceramic-based circuit board and proper locking of the ceramic-based circuit board on the adsorption piece.

[0013] When the lifting platform moves downward, the retracted pressing member no longer presses down the corresponding protrusion, so that the elastic telescopic tube and the adsorbent of the corresponding row can remain in place. The adsorbents of the remaining rows are pressed downward by the remaining pressing members, and gradually shift their positions up and down from the adsorbents in place. In this way, the connection between the ceramic-based circuit board on the adsorbent in place and the ceramic-based circuit board on the adsorbents in the remaining rows is disconnected, thus avoiding manual breaking, reducing labor intensity, and saving time and effort. In addition, the ceramic-based circuit board in place is isolated for easy independent grinding.

[0014] Preferably, the wedge structure comprises a wedge block provided on the slide and a wedge portion formed on the push-down member, and when the slide moves to any position of the push-down member, the wedge block can squeeze the wedge portion to retract the push-down member.

[0015] The effect is that the wedge-shaped block and the wedge-shaped tip design of the wedge-shaped portion facilitate the transmission of the movement power of the slide to the pressing member, thereby retracting the pressing member, thereby the pressing member avoids the protrusion, and facilitates the isolation of a single row of adsorption parts and ceramic-based circuit boards.

[0016] Preferably, the top of the slide is elastically slidably connected vertically with a stopper located above the adsorbent, and the stopper extends along the direction of the adsorbent. When the slide moves downward, the stopper can press down on the ceramic-based circuit board adsorbed by the adsorbent.

[0017] The effect is that when the original ceramic-based circuit boards are isolated and disassembled, the stopper can be pressed tightly against the row of ceramic-based circuit boards under the action of elastic force, so that the row of ceramic-based circuit boards are firmly pressed against the adsorption member, thereby ensuring the locking effect of the ceramic-based circuit boards on the adsorption member, avoiding the ceramic-based circuit boards from shifting to one side or tipping over when the connection of the row of ceramic-based circuit boards is disconnected, and ensuring the stability and reliability of the ceramic-based circuit boards when they are disassembled.

[0018] Preferably, the ceramic-based circuit board processing equipment further comprises a second pressing mechanism, which has the same structure as the first pressing mechanism and is arranged orthogonally, and is used to drive the multiple columns of the adsorption members to move downward in an offset manner.

[0019] The effect is that after the operation of the first pressing mechanism, the connection between the ceramic-based circuit boards in adjacent rows is disconnected, and the ceramic-based circuit boards are split into multiple strips. After the operation of the second pressing mechanism, the connection between the ceramic-based circuit boards in adjacent columns is disconnected, and the ceramic-based circuit boards are split into multiple pieces, thereby realizing the individual molding of the ceramic-based circuit boards.

[0020] Preferably, the ceramic-based circuit board processing equipment further comprises a slitting device for slitting a mother board into a plurality of ceramic-based circuit boards.

[0021] The effect is that the slitting equipment cuts the ceramic-based circuit board into multiple unit blocks along the row and column directions, each block forms a ceramic-based circuit board, and a thin layer of connecting wire is retained between adjacent blocks, so that a weak connection relationship is maintained between each ceramic-based circuit board, avoiding the ceramic-based circuit board from being completely cut off and shifting or offsetting, ensuring the regularity of the overall layout and facilitating subsequent processing.

[0022] By adopting the above technical solution, the beneficial effects of the present invention are as follows:

[0023] By gradually moving down the adsorption parts of each row or column, a single row or column of ceramic-based circuit boards can be isolated, and then the entire row or column of ceramic-based circuit boards can be ground by moving the pusher and rotating the grinding wheel, thereby forming a batch grinding effect and greatly improving work efficiency; and the first grinding mechanism and the second grinding mechanism use the row and column grinding method to improve the adaptability to square and rectangular ceramic-based circuit boards. Through the alternating operation of the first pressing mechanism and the second pressing mechanism, the automatic splitting of the ceramic-based circuit board is realized, avoiding manual breaking, reducing labor intensity, and saving time and effort. At the same time of splitting, the ceramic-based circuit board in situ is isolated for independent grinding. BRIEF DESCRIPTION OF THE DRAWINGS

[0024] Figure 1 It is a schematic diagram of the appearance of the ceramic-based circuit board processing equipment of the present invention.

[0025] Figure 2 It is a cross-sectional schematic diagram of the ceramic-based circuit board processing equipment of the present invention.

[0026] Figure 3 The present invention Figure 2 A magnified schematic diagram of center A.

[0027] Figure 4 It is an axonometric schematic diagram of the mounting frame portion of the present invention.

[0028] Figure 5 It is an axonometric schematic diagram of the clamping member to the adsorption member portion of the present invention.

[0029] Figure 6It is a schematic structural diagram of the pressing member to the clamping member portion of the present invention.

[0030] Figure 7 It is a structural schematic diagram of the motherboard part of the present invention.

[0031] Reference numerals:

[0032] 100, motherboard; 101, ceramic-based circuit board; 102, connecting wire;

[0033] 1. Machine tools;

[0034] 2. Installation frame; 21. Installation cavity; 22. Negative pressure cavity;

[0035] 31. adsorption member; 311. row seam; 312. column seam; 313. adsorption port; 32. elastic telescopic tube; 321. outer tube; 322. inner tube; 323. compression spring; 324. convex edge;

[0036] 4. First slitting mechanism; 41. Slitting unit; 411. Sliding member; 412. Linear drive; 413. Cutting blade; 414. Support seat; 415. Cutting motor;

[0037] 5. The second cutting mechanism;

[0038] 6. First pressing mechanism; 61. Clamping member; 611. Protruding portion; 62. Driving member; 621. Lifting platform; 622. Sliding seat; 622a. Wedge block; 622b. Vertical rod; 623. Pressing member; 623a. Push spring; 623b. Wedge portion; 624. Lifting device; 625. Linear driving device; 63. Stop member; 631. Spring;

[0039] 7. The second pressing mechanism;

[0040] 8. First grinding mechanism; 81. Propelling unit; 811. Propelling member; 812. Grinding wheel; 813. Linear drive; 814. Bearing seat;

[0041] 9. Second grinding mechanism. DETAILED DESCRIPTION

[0042] Embodiments of the present invention are described in detail below, and examples of the embodiments are shown in the accompanying drawings. The embodiments described below with reference to the accompanying drawings are exemplary and intended to be used to explain the present invention, but should not be understood as limiting the present invention.

[0043] Combine the following Figures 1 to 7 The ceramic-based circuit board processing apparatus of the present invention is described.

[0044] like Figures 1 to 4As shown, the ceramic-based circuit board processing equipment of the present invention includes a machine tool 1, a mounting frame 2, an adsorption mechanism, a slitting device, a first pressing mechanism 6, a second pressing mechanism 7, a first grinding mechanism 8 and a second grinding mechanism 9.

[0045] The mounting frame 2 protrudes above the machine tool 1, and a partition is fixed inside the mounting frame 2, which divides the internal space of the mounting frame 2 into an upper mounting chamber 21 and a lower negative pressure chamber 22. The negative pressure chamber 22 is externally connected to a negative pressure suction device to form a negative pressure vacuum environment inside the negative pressure chamber 22. The negative pressure suction device in this embodiment can be an existing negative pressure pump.

[0046] The adsorption mechanism is arranged in the installation cavity 21, and the adsorption mechanism includes a plurality of adsorption members 31 arranged closely in rows and columns. For the convenience of description, the row direction of the adsorption members 31 is defined as the left-right direction, such as Figure 1 The direction indicated by the arrow C in FIG. 3; the column direction of the adsorption member 31 is defined as the front-to-back direction, such as Figure 1 The direction indicated by the arrow B in FIG. A row gap 311 is formed between two adjacent rows of adsorbents 31, and a column gap 312 is formed between two adjacent columns of adsorbents 31. The adsorbents 31 are vertically slidable, and the bottom of the adsorbents 31 is connected to the negative pressure chamber 22 through an elastic telescopic tube 32. The interior of the adsorbents 31 forms a hollow structure, and a suction port 313 for negative pressure adsorption of the ceramic-based circuit board 101 is provided on the top.

[0047] In this embodiment, the elastic telescopic tube 32 includes an outer tube 321 and an inner tube 322. The top of the outer tube 321 is integrally formed with the adsorption member 31, the bottom of the inner tube 322 is fixedly connected to the partition, the lower part of the outer tube 321 is slidably sleeved on the upper part of the inner tube 322, and the outer peripheral side of the inner tube 322 is sleeved with a compression spring 323, which connects the outer tube 321 and the partition. The adsorption member 31, the outer tube 321, the inner tube 322, and the negative pressure chamber 22 are connected in sequence, so that the negative pressure chamber 22 can transmit the adsorption force to the adsorption port 313, thereby realizing the close adsorption of the ceramic-based circuit board 101.

[0048] It should be noted that, after the motherboard 100 of the ceramic-based circuit board 101 is adsorbed on the adsorbent 31, the slitting device is used to slit the motherboard 100 into a plurality of ceramic-based circuit boards 101. The slitting device includes a first slitting mechanism 4 and a second slitting mechanism 5, the first slitting mechanism 4 is located on the right side of the mounting frame 2, and the second slitting mechanism 5 is located on the front side of the mounting frame 2, and the first slitting mechanism 4 and the second slitting mechanism 5 have the same structure and are orthogonal to each other.

[0049] Taking the first slitting mechanism 4 as an example, the first slitting mechanism 4 includes a plurality of slitting units 41, and the number of slitting units 41 is equal to and corresponds to the number of row seams 311. The slitting unit 41 includes a sliding member 411, a linear driver 412 and a cutting blade 413. A support seat 414 is provided on the machine tool 1, and the sliding member 411 is slidably assembled on the support seat 414 along the left and right directions; the linear driver 412 is installed on the support seat 414 and is used to drive the sliding member 411 to slide. The linear driver 412 in this embodiment is a hydraulic rod, a cylinder or an electric push rod, etc.; the cutting blade 413 is rotatably assembled on the sliding member 411. It can be understood that the cutting blade 413 here is a circular blade, which is convenient for rotary cutting. A cutting motor 415 for controlling the rotation of the cutting blade 413 is installed on the sliding member 411.

[0050] When the linear drive 412 drives the sliding member 411 to slide, the cutting motor 415 synchronously drives the cutting blade 413 to rotate, and the cutting blade 413 cuts the motherboard 100 during the rotation. In actual operation, the first cutting mechanism 4 can first cut the motherboard 100 into multiple strips along the row seam 311, and then the second cutting mechanism 5 can cut the motherboard 100 into multiple blocks along the column seam 312, and each block forms a ceramic-based circuit board 101. Figure 1 and Figure 7 The first slitting mechanism 4 and the second slitting mechanism 5 do not completely cut through the motherboard 100, but retain a thin layer of connecting wire 102, so that the ceramic-based circuit boards 101 maintain a weak connection relationship, avoiding the ceramic-based circuit boards 101 from being completely cut off and shifting or offsetting, ensuring the regularity of the overall layout and facilitating subsequent processing.

[0051] Continue to refer Figures 3 to 6 The first pressing mechanism 6 includes a clamping member 61 and a driving member 62. The number of the clamping members 61 is equal to the number of rows of the elastic telescopic tubes 32, and each clamping member 61 corresponds to one row of the elastic telescopic tubes 32. A convex edge 324 is provided on the outer tube 321 of the elastic telescopic tube 32. The clamping member 61 is a fork-shaped structure and is forked on the corresponding row of the elastic telescopic tubes 32. The bottom of the clamping member 61 is pressed against the convex edge 324, thereby achieving the clamping of the single row of the elastic telescopic tubes 32.

[0052] The driving member 62 is arranged on the mounting frame 2 and is used to drive the multiple clamping members 61 to move downward in an offset manner, so that when some of the clamping members 61 move downward, a single clamping member 61 is retained in place, so that one row of ceramic-based circuit boards 101 is retained in place, and the ceramic-based circuit boards 101 in this row are offset from the other ceramic-based circuit boards 101 that move downward, thereby realizing the detachment of the ceramic-based circuit boards 101 in this row and isolating the ceramic-based circuit boards 101 in this row for easy grinding.

[0053] The driving member 62 includes a lifting platform 621 and a slide 622. The lifting platform 621 is installed on the outer side of the mounting frame 2 along the vertical sliding direction. A lifting device 624 is installed on the outer side of the mounting frame 2. The lifting device 624 is connected to the lifting platform 621 through a connecting rod frame to control the vertical sliding of the lifting platform 621. In this embodiment, the lifting device 624 can be a telescopic motor, a telescopic cylinder, etc.

[0054] The end of the clamping member 61 protrudes from the outside of the mounting frame 2 and forms a protrusion 611. A pressing member 623 is mounted on the lifting platform 621 for sliding left and right. The number of the pressing members 623 is equal to and corresponds to the protrusion 611. The pressing members 623 are also connected to the lifting platform 621 through a push spring 623a. Under normal conditions, the push spring 623a pushes the pressing member 623 out, so that the pressing member 623 is exposed on the lifting platform 621. When the pressing member 623 moves downward with the lifting platform 621, it can press down the corresponding protrusion 611, so that the clamping member 61 presses the convex edge 324 downward, thereby causing the entire row of elastic telescopic tubes 32 to shrink downward, causing the entire row of adsorbents 31 to move downward.

[0055] The slide 622 is slidably assembled on the lifting platform 621 along the front-back direction, and a wedge structure is arranged between the slide 622 and the pressing member 623, and the wedge structure includes a wedge block 622a arranged on the slide 622 and a wedge portion 623b formed on the pressing member 623. When the slide 622 slides to any position of the pressing member 623, the wedge block 622a can contact and squeeze the wedge portion 623b, thereby forcing the pressing member 623 to retract, so as to avoid the corresponding protrusion 611.

[0056] At this time, the lifting platform 621 moves downward, and the retracted pressing member 623 no longer presses down the corresponding protrusion 611, so that the corresponding row of elastic telescopic tubes 32 and adsorbents 31 are retained in place, and the adsorbents 31 in place are staggered up and down from the other adsorbents 31 that move downward. In the process of staggering, the connecting wire 102 between the ceramic-based circuit board 101 on the adsorbent 31 in place and the other ceramic-based circuit boards 101 is disconnected, thereby avoiding manual breaking, reducing labor intensity, and saving time and effort. In addition, the ceramic-based circuit board 101 in place can be isolated separately for subsequent grinding. A linear drive device 625 for driving the slide 622 to slide is provided on the lifting platform 621. In this embodiment, the linear drive device 625 can be an electric slide rail, a screw nut mechanism, etc.

[0057] It is worth noting that both ends of the clamping member 61 form a protrusion 611, and there are two driving members 62, which are respectively arranged on the left and right sides of the mounting frame 2, and each driving member 62 corresponds to one side of the protrusion 611. A vertical rod 622b is fixed on the top of each slide 622, and a stopper 63 is arranged between the two vertical rods 622b. The stopper 63 is located above the adsorption member 31 and extends in the left and right direction. The two ends of the stopper 63 are respectively slidably sleeved on the two vertical rods 622b, and the stopper 63 is connected to the vertical rod 622b by a spring 631, and the spring 631 applies a downward elastic force to the stopper 63.

[0058] When the lifting platform 621 moves downward, the slide 622 and the stopper 63 move downward accordingly, and the stopper 63 will press down on the ceramic-based circuit board 101 of the adsorbent 31 in the original position, and then the stopper 63 is blocked and stops moving downward, while the slide 622 continues to move downward. At this time, relative movement occurs between the slide 622 and the stopper 63, the spring 631 is compressed, and the elastic force applied by the spring 631 on the stopper 63 gradually increases. The stopper 63 presses the ceramic-based circuit board 101 firmly on the adsorbent 31, ensuring the locking effect of the ceramic-based circuit board 101 on the adsorbent 31, preventing the ceramic-based circuit board 101 from deviating to one side or directly tipping over when the connecting wire 102 of the ceramic-based circuit board 101 in this row is disconnected, ensuring the stability and reliability of the ceramic-based circuit board 101 when it is detached.

[0059] The second pressing mechanism 7 has the same structure as the first pressing mechanism 6 and is orthogonally arranged. The second pressing mechanism 7 is used to drive the multiple columns of adsorbents 31 to shift downward. After the operation of the first pressing mechanism 6, the connecting wires 102 of the ceramic-based circuit boards 101 between adjacent rows are disconnected, and the ceramic-based circuit boards 101 are split into multiple pieces. After the operation of the second pressing mechanism 7, the connecting wires 102 of the ceramic-based circuit boards 101 between adjacent columns are disconnected, and the ceramic-based circuit boards 101 are split into multiple pieces, thereby realizing the separate molding of the ceramic-based circuit boards 101.

[0060] Continue to refer Figures 1 to 4 The edges of the ceramic base circuit board 101 extending upward in the row are set as row edges, and the edges of the ceramic base circuit board 101 extending upward in the column are set as column edges.

[0061] The first grinding mechanism 8 includes a propulsion unit 81 corresponding to the row seam 311, and the propulsion unit 81 includes a propulsion member 811, a grinding wheel 812 and a linear drive 813. A bearing seat 814 is provided on the machine tool 1, and the propulsion member 811 is slidably mounted on the bearing seat 814 along the left and right directions; the grinding wheel 812 is rotatably mounted on the propulsion member 811, and a grinding motor for controlling the rotation of the grinding wheel 812 is provided on the propulsion member 811. When the grinding motor drives the grinding wheel 812 to rotate, the grinding wheel 812 is used to grind the row edge of the ceramic-based circuit board 101; the linear drive 813 is installed on the bearing seat 814 and is used to drive the propulsion member 811 to slide. The linear drive 813 in this embodiment can be a hydraulic rod, a cylinder or an electric push rod.

[0062] When a row of adsorbents 31 in the original position is isolated, the linear driver 813 can control the corresponding pusher 811 to slide, and the pusher 811 drives the grinding wheel 812 to slide, and the grinding wheel 812 grinds the row edge of the ceramic-based circuit board 101 on the row of adsorbents 31 to remove the burrs and broken edges, and improve the surface finish and smoothness of the ceramic-based circuit board 101. It is worth noting that the row edges of the front and back sides of the ceramic-based circuit board 101 may have burrs. At this time, the corresponding two push units 81 can be started, and the grinding wheels 812 of the two push units 81 grind the burrs on both sides respectively.

[0063] The second grinding mechanism 9 has the same structure as the first grinding mechanism 8 and is arranged orthogonally. The grinding wheel 812 of the second grinding mechanism 9 is used to grind the row edge of the ceramic-based circuit board 101 .

[0064] When grinding the ceramic-based circuit board 101, the first grinding mechanism 8 and the second grinding mechanism 9 can grind the ceramic-based circuit board 101 in rows and columns, thereby forming batch grinding and improving work efficiency. In addition, the first grinding mechanism 8 and the second grinding mechanism 9 use the row and column grinding method to improve the adaptability to square and rectangular ceramic-based circuit boards 101.

[0065] refer to Figures 1 to 7 The working principle of the ceramic-based circuit board processing equipment of the present invention includes the following steps:

[0066] The first step is negative pressure adsorption. The motherboard 100 is laid on multiple adsorption pieces 31 arranged in rows and columns, and the external negative pressure suction equipment is started. A negative pressure vacuum environment is formed in the negative pressure chamber 22. The adsorption force uniformly and reliably adsorbs the motherboard 100 through multiple adsorption ports 313, thereby achieving proper locking of the motherboard 100 on the adsorption piece 31.

[0067] In the second step, the motherboard 100 is cut, and the first cutting mechanism 4 and the second cutting mechanism 5 are controlled to cut the motherboard 100 in rows and columns, so that the motherboard 100 is split into blocks, and each block forms a ceramic-based circuit board 101. It is worth noting that during cutting, the motherboard 100 is not cut through, so as to avoid the ceramic-based circuit board 101 from being completely removed, thereby avoiding the ceramic-based circuit board 101 from being disturbed by the cutting blade 413 and causing position change and position deviation. Therefore, after cutting, a thin layer of connecting wires 102 will be formed between adjacent ceramic-based circuit boards 101.

[0068] In the third step, the ceramic-based circuit board 101 is split and ground. The linear drive device 625 drives the slide 622 to slide from front to back. When the slide 622 slides backward, it passes through each pressing member 623 in sequence. When the slide 622 slides to one of the pressing members 623, the wedge block 622a can squeeze the wedge portion 623b, so that the pressing member 623 retracts and avoids the corresponding protrusion 611. Then, the lifting device 624 controls the lifting platform 621 to move downward, and the retracted pressing member 623 no longer presses the protrusion 611, so that the corresponding row of adsorbents 31 is retained in place. The remaining pressing members 623 continue to press down the remaining rows of adsorption members 31, so that the remaining rows of adsorption members 31 move downward as the lifting platform 621 moves downward, thereby gradually shifting their positions up and down from the original adsorption members 31. In the process of shifting their positions up and down, the connecting wires 102 between the single row of ceramic-based circuit boards 101 on the original adsorption members 31 and the remaining rows of ceramic-based circuit boards 101 are disconnected, so that the original ceramic-based circuit boards 101 are detached, thereby avoiding relying on manual breaking of the connecting wires 102, saving time and effort.

[0069] Next, the lifting platform 621 stops moving, and the original suction member 31 and the ceramic-based circuit board 101 are isolated separately. At this time, the linear drive 813 can control the corresponding propeller 811 to move, that is, the propeller 811 immediately before and after the original suction member 31 is moving, and the grinding wheel 812 moves with the propeller 811. During the movement, the grinding motor drives the grinding wheel 812 to rotate, and the grinding wheel 812 grinds the row edge of the ceramic-based circuit board 101 on the suction member 31, achieving the effect of batch grinding of the entire row, thereby improving work efficiency. By analogy, the first pressing mechanism 6 and the first grinding mechanism 8 realize the gradual splitting and grinding of each row of ceramic-based circuit boards 101. Afterwards, the second pressing mechanism 7 and the second grinding mechanism 9 realize the gradual splitting and grinding of each column of ceramic-based circuit boards 101, thereby realizing the molding and cleaning of a single ceramic-based circuit board 101.

[0070] The present invention realizes the step-by-step downward movement of the adsorption members 31 in each row and column through the alternating operation of the first pressing mechanism 6 and the second pressing mechanism 7, thereby isolating a single row or column of ceramic-based circuit boards 101, and then realizes the grinding of the entire row or column of ceramic-based circuit boards 101 through the movement of the pusher 811 and the rotation of the grinding wheel 812, thereby forming a batch grinding effect and greatly improving work efficiency; and the first grinding mechanism 8 and the second grinding mechanism 9 use the row and column grinding method to improve the adaptability to square and rectangular ceramic-based circuit boards 101. In addition, the alternating operation of the first pressing mechanism 6 and the second pressing mechanism 7 realizes the automatic disassembly of the ceramic-based circuit board 101, avoids manual breaking, reduces labor intensity, and saves time and effort. At the same time of disassembly, the ceramic-based circuit board 101 in situ is isolated for independent grinding.

[0071] In other embodiments of the present invention, the slitting equipment may also directly adopt a slitting machine; the driving member 62 may also be a plurality of electric telescopic rods, which respectively control the up and down movement of a plurality of clamping members 61, and the operation programs of the plurality of electric telescopic rods may be set by an external electric control device, thereby realizing the staggered downward movement of the plurality of clamping members 61; only one of the wedge block 622a and the wedge portion 623b in the wedge structure may be retained, and the retraction of the pressing member 623 is realized by the extrusion of the wedge block 622a or the wedge portion 623b and the straight surface part of the component.

[0072] In the description of the present invention, it should be understood that the terms "center", "longitudinal", "lateral", "length", "width", "thickness", "up", "down", "front", "back", "left", "right", "vertical", "horizontal", "top", "bottom", "inside", "outside", "clockwise", "counterclockwise", "axial", "radial", "circumferential" and the like indicate orientations or positional relationships based on the orientations or positional relationships shown in the accompanying drawings, and are only for the convenience of describing the present invention and simplifying the description, and do not indicate or imply that the referred device or element must have a specific orientation, be constructed and operated in a specific orientation, and therefore should not be understood as limiting the present invention.

[0073] In addition, the terms "first" and "second" are used for descriptive purposes only and should not be understood as indicating or implying relative importance or implicitly indicating the number of the indicated technical features. Therefore, the features defined as "first" and "second" may explicitly or implicitly include at least one of the features. In the description of the present invention, the meaning of "plurality" is at least two, such as two, three, etc., unless otherwise clearly and specifically defined.

[0074] Although the embodiments of the present invention have been shown and described above, it is to be understood that the above embodiments are exemplary and are not to be construed as limitations of the present invention. A person skilled in the art may change, modify, replace and vary the above embodiments within the scope of the present invention.

Claims

1. A ceramic-based circuit board processing device, comprising a machine tool (1) and a mounting frame (2) protruding above the machine tool (1), wherein a mounting cavity (21) is formed in the mounting frame (2), characterized in that: The device also comprises an adsorption mechanism, a first grinding mechanism (8) and a second grinding mechanism (9), wherein the adsorption mechanism is arranged in the mounting cavity (21), and comprises a plurality of adsorption members (31) arranged closely in rows and columns, wherein the adsorption members (31) are vertically slidable and used to adsorb the ceramic-based circuit board (101), wherein the edges of the ceramic-based circuit board (101) on the adsorption members (31) that are upward in the row are set as row edges, and the edges of the ceramic-based circuit board (101) on the adsorption members (31) that are upward in the column are set as column edges; a row gap (311) is formed between two adjacent rows of adsorption members (31), and the first grinding mechanism (8) comprises a pusher member (31) that corresponds one to one to the row gap (311). The propulsion unit (81) comprises a propulsion member (811), a grinding wheel (812) and a linear drive (813); the propulsion member (811) is capable of moving along the row direction of the adsorption member (31); the grinding wheel (812) is mounted on the propulsion member (811) and is used to grind the row edge of the ceramic-based circuit board (101); and the linear drive (813) is used to drive the propulsion member (811) to slide; the second grinding mechanism (9) has the same structure as the first grinding mechanism (8) and is arranged orthogonally; the grinding wheel (812) of the second grinding mechanism (9) is used to grind the column edge of the ceramic-based circuit board (101); A negative pressure cavity (22) is formed in the mounting frame (2) and is located below the mounting cavity (21) and is capable of being connected to an external negative pressure suction device. The interior of the adsorbent (31) forms a hollow structure, the bottom of which is connected to the negative pressure cavity (22) via an elastic telescopic tube (32), and the top of the adsorbent is provided with an adsorption port (313) for negative pressure adsorption of the ceramic-based circuit board (101); The ceramic-based circuit board processing equipment further comprises a first pressing mechanism (6), the first pressing mechanism (6) comprising a clamping member (61) and a driving member (62), the number of the clamping members (61) being equal to the number of rows of the elastic telescopic tubes (32) and being clamped on the elastic telescopic tubes (32) in the corresponding row, the driving member (62) being arranged on the mounting frame (2) and being used to drive a plurality of the clamping members (61) to move downward in an offset manner, so that when some of the clamping members (61) move downward, a single clamping member (61) is retained in place; The driving member (62) comprises a lifting platform (621) and a sliding seat (622). At least one end of the clamping member (61) protrudes from the outside of the mounting frame (2) to form a protruding portion (611). The lifting platform (621) is vertically slidably mounted on the outside of the mounting frame (2). A pressing member (623) corresponding to the protruding portion (611) is elastically slidably connected to the lifting platform (621). The pressing member (623) is used to press down the corresponding protruding portion (611) when moving downward. The mounting frame (2 ) is provided with a lifting device (624) for controlling the sliding of the lifting platform (621); the slide seat (622) is installed on the lifting platform (621) in a columnar sliding manner along the elastic telescopic tube (32), and a wedge structure is provided between the slide seat (622) and the pressing member (623), and the wedge structure is used to force the pressing member (623) to retract when the slide seat (622) slides to the position of the pressing member (623); the lifting platform (621) is provided with a linear driving device (625) for driving the slide seat (622) to slide.

2. The ceramic-based circuit board processing equipment according to claim 1, characterized in that: The wedge-shaped structure comprises a wedge-shaped block (622a) provided on the sliding seat (622) and a wedge-shaped portion (623b) formed on the pressing member (623); when the sliding seat (622) moves to any position of the pressing member (623), the wedge-shaped block (622a) can squeeze the wedge-shaped portion (623b) to retract the pressing member (623).

3. The ceramic-based circuit board processing equipment according to claim 1, characterized in that: The top of the slide seat (622) is elastically slidably connected in the vertical direction to a stopper (63) located above the adsorption member (31); the stopper (63) extends in the direction of the adsorption member (31); when the slide seat (622) moves downward, the stopper (63) can press down on the ceramic-based circuit board (101) adsorbed by the adsorption member (31).

4. The ceramic-based circuit board processing equipment according to claim 1, characterized in that: The ceramic-based circuit board processing equipment further comprises a second pressing mechanism (7), the second pressing mechanism (7) having the same structure as the first pressing mechanism (6) and being arranged orthogonally, the second pressing mechanism (7) being used to drive the plurality of rows of adsorption members (31) to move downward in an offset manner.

5. The ceramic-based circuit board processing equipment according to claim 1, characterized in that: The ceramic-based circuit board processing equipment further comprises a slitting device for slitting a motherboard (100) into a plurality of ceramic-based circuit boards (101).

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