Polishing device and polishing method

Abstract

The invention belongs to the field of additive manufacturing, and relates to a grinding device and a grinding method.The grinding device comprises a connecting plate, a floating mechanism and a grinding mechanism; the polishing mechanism is arranged on the connecting plate through the floating mechanism; the floating mechanism drives the polishing mechanism to move in the axial direction of the floating mechanism. According to the polishing device and the polishing method, removal is convenient, and smooth printing can be ensured.

Description

Technical Field

[0001] The present invention belongs to the field of additive manufacturing, and relates to a grinding device and a grinding method, and in particular to a grinding device and a grinding method for arc-formed oxide layers. Background Art

[0002] Wire Arc Additive Manfacture (WAAM) is a process that uses an electric arc as a forming heat source to melt the metal wire, stack each layer according to the set forming path, and form the required three-dimensional solid parts in a layer-by-layer stacking manner. During the arc forming process, some forming materials are prone to form a hard and insulating oxide layer on the surface of the part after melting and solidification, which affects the subsequent arc starting. For example, the chromium (Cr) content in stainless steel is high. After the welding wire melts and solidifies, the Cr-containing oxide layer formed on the surface of the part has a high hardness and insulation, which isolates the positive and negative poles of the power supply, resulting in arc starting failure. In order to remove the above-mentioned oxide layer, manual grinding, wire friction arc starting, constant force grinding and other methods can be used. However, manual grinding and wire friction arc starting require a lot of manpower and material resources, and constant force grinding requires matching sensors and other equipment, which is costly. Summary of the invention

[0003] In order to solve the above technical problems existing in the background technology, the present invention provides a grinding device and a grinding method with simple structure and low cost.

[0004] In order to achieve the above object, the present invention adopts the following technical solution:

[0005] A grinding device, characterized in that: the grinding device comprises a connecting plate, a floating mechanism and a grinding mechanism; the grinding mechanism is arranged on the connecting plate through the floating mechanism; the floating mechanism drives the grinding mechanism to move along the axial direction where the floating mechanism is located.

[0006] The above-mentioned floating mechanism includes a sliding shaft, an upper floating spring and a lower floating spring; the sliding shaft is arranged on a connecting plate; the upper floating spring, the grinding mechanism and the lower floating spring are arranged on the sliding shaft in sequence from top to bottom and move along the axial direction of the sliding shaft; preferably, the spring coefficient of the lower floating spring is greater than the spring coefficient of the upper floating spring.

[0007] The above-mentioned floating mechanism also includes an upper spring fixing plate and a lower spring fixing plate; the upper floating spring is arranged on the sliding shaft through the upper spring fixing plate; the lower floating spring is arranged on the sliding shaft through the lower spring fixing plate; the sliding shaft is connected to the connecting plate through the lower spring fixing plate.

[0008] The floating mechanism also includes an adjustment screw and a spring adjustment plate; the spring adjustment plate is placed between the upper spring fixing plate and the upper floating spring; the adjustment screw penetrates the upper spring fixing plate along the axial direction of the sliding shaft and is pressed on the spring adjustment plate.

[0009] The floating mechanism further comprises a sliding bushing sleeved on the sliding shaft; the spring adjustment plate is movably arranged on the sliding shaft through the sliding bushing and moves along the axial direction of the sliding shaft.

[0010] The above-mentioned floating mechanism also includes a stroke cylinder; the connecting plate is connected to the lower spring fixing plate through the stroke cylinder; the axial direction of the stroke cylinder is parallel to the axial direction of the sliding shaft; the stroke cylinder drives the sliding shaft to move along the axial direction of the stroke cylinder through the lower spring fixing plate.

[0011] The above-mentioned grinding mechanism includes a motor, a grinding head, a sleeve, a linear bearing and a motor connecting part; the upper floating spring, the linear bearing and the lower floating spring are arranged on the sliding shaft in sequence from top to bottom and move along the axial direction of the sliding shaft; the motor is arranged on the linear bearing through the motor connecting part; the grinding head is arranged on the motor through the sleeve; the motor drives the grinding head to rotate around the axial direction of the grinding head.

[0012] The motor connector comprises a motor mounting plate and a motor holder; the motor holder surrounds the motor and moves along the axial direction of the motor; the motor holder is arranged on a linear bearing through the motor mounting plate.

[0013] An additive manufacturing device based on the grinding device as described above is characterized in that: the additive manufacturing device includes a robot, a welding gun and a grinding device; the welding gun and the grinding device can be adjustably arranged on the robot; when the additive manufacturing device is working, the point to be ground of the grinding device is the same as the point to be arced of the welding gun.

[0014] A grinding method, characterized in that: the grinding method is performed based on the grinding device as described above or based on the additive manufacturing equipment as described above; the grinding method comprises the following steps:

[0015] 1) Before arc forming, a region to be polished is determined based on the arc starting point, and the region to be polished covers the arc starting point;

[0016] 2) Use a grinding device to grind the area to be polished;

[0017] Preferably, the method of determining the area to be polished based on the arc starting point in step 1) includes a normal method or a ring method;

[0018] Preferably, the normal method is to move the grinding head of the grinding device from the arc-starting point along the normal direction to the area outside the part to be processed or the substrate to be determined as the area to be polished; the annular method is to take the arc-starting point as the center of the circle and the area with a length of 1.5-2.5 times the diameter of the grinding head as the radius to determine the area to be polished;

[0019] Preferably, when the normal method is used to determine the area to be polished, the polishing in step 2) is specifically: the polishing head of the polishing device is moved from the arc-starting point along the normal direction to the outside of the part to be processed or the substrate to complete the polishing; preferably, the polishing head of the polishing device is moved from the arc-starting point along the normal direction in a manner of gradually reducing the Z-axis height to the outside of the part to be processed or the substrate to complete the polishing;

[0020] Preferably, when the ring method is used to determine the area to be polished, the polishing in step 2) is specifically: using a polishing device to move along a point shape in the area to be polished, and completing the polishing after traversing the area to be polished;

[0021] Preferably, when the grinding method is performed based on an additive manufacturing device, the grinding method further comprises, before step 1):

[0022] 0) Pre-set the additive manufacturing equipment;

[0023] Preferably, the step 0) specifically includes:

[0024] 0.1) Construct a rectangular coordinate system with the plane perpendicular to the welding gun as the XY plane;

[0025] 0.2) Calibrate the arc starting point of the welding gun in the rectangular coordinate system;

[0026] 0.3) Move the robot in the XY plane to align the grinding head of the grinding device with the arc starting point;

[0027] 0.4) adjusting the height of the grinding device along the Z axis to make the grinding head contact with the arc starting point to be calibrated, and calibrating the position of the grinding head in the XY plane; preferably, the grinding head contacts with the arc starting point to be calibrated and the grinding head is aligned with the arc starting point to generate a compression of 5-20 mm;

[0028] 0.5) According to the positional relationship of the grinding head before and after calibration, the calibration of the grinding head is completed, and the presetting of the additive manufacturing equipment is completed.

[0029] The advantages of the present invention are:

[0030] The present invention provides a grinding device and a grinding method, wherein the grinding device comprises a connecting plate, a floating mechanism and a grinding mechanism; the grinding mechanism is arranged on the connecting plate through the floating mechanism; the floating mechanism drives the grinding mechanism to move along the axial direction where the floating mechanism is located. The present invention drives the grinding mechanism to grind the oxide layer through the floating structure, and the device has a simple structure, is easy to operate, stable and reliable, and has a low cost. BRIEF DESCRIPTION OF THE DRAWINGS

[0031] Figure 1 It is a schematic diagram of the overall structure of the grinding device provided by the present invention;

[0032] Figure 2 is a front view structural schematic diagram of the grinding device provided by the present invention;

[0033] Figure 3 is a schematic diagram of the additive manufacturing device provided by the present invention when in use;

[0034] Figure 4 It is a schematic diagram of the grinding method provided by the present invention using the frame normal method for grinding;

[0035] Figure 5 It is a schematic diagram of the grinding method provided by the present invention using the annular area method for grinding;

[0036] in:

[0037] 1-connecting plate; 2-stroke cylinder; 3-temperature sensor; 4-upper spring fixing plate; 5-sliding bushing; 6-spring adjustment plate; 7-motor holder; 8-motor; 9-upper floating spring; 10-motor mounting plate; 11-lower floating spring; 12-lower spring fixing plate; 13-jacket; 14-grinding head; 15-sliding shaft; 16-linear bearing; 17-robot; 18-welding gun; 19-parts to be processed; 20-wait; 21-arc starting point to be waited for; 22-adjusting screw. DETAILED DESCRIPTION

[0038] See also Figure 1 as well as Figure 2The present invention provides a grinding device, including a connecting plate 1, a floating mechanism and a grinding mechanism; the grinding mechanism is arranged on the connecting plate 1 through the floating mechanism; the floating mechanism drives the grinding mechanism to move along the axial direction of the floating mechanism. The present invention provides Z-axis floating to the grinding mechanism through the floating mechanism, thereby improving the working range of the grinding mechanism and the working efficiency. The grinding device provided by the present invention can grind the surface of an object, especially the arc starting point to be formed by electric arc, through the floating of the Z-axis in combination with the grinding mechanism, to form an active grinding mechanism. In addition, it can also be combined with devices such as force sensors and PLC controls to form an active grinding mechanism. Regardless of whether it is a passive grinding mechanism or an active grinding mechanism, the core content of the grinding device provided by the present invention remains unchanged.

[0039] See also Figure 1 as well as Figure 2 The floating mechanism used in the present invention includes a sliding shaft 15, an upper floating spring 9 and a lower floating spring 11; the sliding shaft 15 is arranged on the connecting plate 1; the upper floating spring 9, the grinding mechanism and the lower floating spring 11 are arranged on the sliding shaft 15 from top to bottom and move along the axial direction of the sliding shaft 15; preferably, the spring coefficient of the lower floating spring 11 is greater than the spring coefficient of the upper floating spring 9. When the grinding device provided by the present invention is working, the grinding mechanism is pressed on the lower floating spring 11, and the gravity of the grinding mechanism is equal to the upward supporting force of the lower floating spring 11. During the grinding process, the pressure between the grinding mechanism and the area to be polished or the part to be processed gradually increases, that is, the grinding mechanism gradually moves along the sliding shaft 15 in the direction away from the lower floating spring 11, and the lower floating spring 11 gradually separates from the grinding mechanism, which is bound to gradually affect the grinding effect. At this time, when the grinding mechanism moves away from the lower floating spring 11, due to the action of the upper floating spring 9, it gradually contacts the upper floating spring 9, and the upper floating spring 9 provides the grinding mechanism with a downward elastic force (i.e., in the direction of the area to be ground or the part to be processed), thereby ensuring the smooth operation of the grinding mechanism. Since grinding is a continuous process, the grinding mechanism will float up and down between the upper floating spring 9 and the lower floating spring 11, thus realizing the first movement adjustment of the grinding mechanism along the Z axis.

[0040] In order to facilitate the upper floating spring 9 and the lower floating spring 11 to be firmly fixed on the sliding shaft 15, and at the same time, to limit the upper floating spring 9 and the lower floating spring 11, the floating mechanism provided by the present invention also includes an upper spring fixing plate 4 and a lower spring fixing plate 12; the upper floating spring 9 is arranged on the sliding shaft 15 through the upper spring fixing plate 4; the lower floating spring 11 is arranged on the sliding shaft 15 through the lower spring fixing plate 12; the sliding shaft 15 is connected to the connecting plate 1 through the lower spring fixing plate 12.

[0041] In order to adjust the relative position between the upper floating spring 9 and the lower floating spring 11, or adjust the downward elastic force (i.e., the direction close to the lower floating spring 11) provided by the upper floating spring 9 to the grinding mechanism, see Figure 1 The floating mechanism provided by the present invention also includes an adjustment screw 22 and a spring adjustment plate 6; the spring adjustment plate 6 is placed between the upper spring fixing plate 4 and the upper floating spring 9; the adjustment screw 22 passes through the upper spring fixing plate 4 along the axial direction of the sliding shaft 15 and is pressed on the spring adjustment plate 6. When the adjustment screw 22 is turned, the adjustment screw 22 drives the spring adjustment plate 6 to squeeze the upper floating spring 9 and move downward along the axial direction of the sliding shaft 15 (towards the direction of the lower floating spring 11). The relative position with the lower floating spring 11 or the adjustment of the preload force is completed. By setting the upper and lower floating springs, the floating allowance and the grinding force range can be adjusted to ensure the grinding effect. See Figure 1 In order to facilitate the spring adjustment plate 6 to move downward along the axial direction of the sliding shaft 15, the floating mechanism provided by the present invention also includes a sliding bushing 5 mounted on the sliding shaft 15; the spring adjustment plate 6 is movably arranged on the sliding shaft 15 through the sliding bushing 5 and moves along the axial direction of the sliding shaft 15.

[0042] See also Figure 1 as well as Figure 2 The floating mechanism provided by the present invention also includes a stroke cylinder 2; the connecting plate 1 is connected to the lower spring fixing plate 12 through the stroke cylinder 2; the axial direction of the stroke cylinder 2 is parallel to the axial direction of the sliding shaft 15; the stroke cylinder 2 drives the sliding shaft 15 to move along the axial direction of the stroke cylinder 2 through the lower spring fixing plate 12. Since the axial direction of the stroke cylinder 2 is parallel to the axial direction of the sliding shaft 15, when the free end of the stroke cylinder 2 (connected to the lower spring fixing plate 12) is extended, the grinding mechanism is driven to move along the axial direction of the stroke cylinder 2 through the lower spring fixing plate 12 and the sliding shaft 15. For example, the movement mode can be fine-tuning or floating, so as to realize the second movement adjustment of the grinding mechanism along the Z axis.

[0043] See also Figure 1 as well as Figure 2The grinding mechanism used in the present invention includes a motor 8, a grinding head 14, a jacket 13, a linear bearing 16 and a motor connector; the upper floating spring 9, the linear bearing 16 and the lower floating spring 11 are arranged on the sliding shaft 15 from top to bottom and move along the axial direction of the sliding shaft 15; the motor 8 is arranged on the linear bearing 16 through the motor connector; the grinding head 14 is arranged on the motor 8 through the jacket 13; the motor 8 drives the grinding head 14 to rotate around the axial direction of the grinding head 14. The motor 8 can be a pneumatic motor with higher stability, no heat and no burnout. It should also be noted that the present invention does not limit the material and type of the grinding head 14. For example, the grinding head 14 can be a diamond grinding head, an alloy grinding head, a ceramic grinding head, etc.; the grinding head 14 can also be a grinding wheel grinding head, an electroplating grinding head, etc. If the grinding head 14 is a grinding wheel grinding head, the grinding area of ​​the side grinding is large and the life of the grinding head is longer.

[0044] Exemplarily, the motor connector includes a motor mounting plate 10 and a motor holder 7; the motor holder 7 surrounds the motor 8 and moves along the axial direction of the motor 8; the motor holder 7 is arranged on a linear bearing 16 through the motor mounting plate 10. Since the motor holder 7 can move along the axial direction of the motor 8, the third movement adjustment of the grinding mechanism, especially the grinding head 14 along the Z axis, can be achieved by adjusting the relative positions of the two.

[0045] The grinding device grinds the oxide layer through a floating mechanism electric grinding mechanism, has a simple structure, is easy to operate, does not require the use of a high-cost pressure detection device, does not require a large amount of manpower or frequent replacement of the conductive nozzle, and can effectively reduce costs. At the same time, after removing the oxide layer, subsequent arc failure can be avoided, thereby improving printing efficiency.

[0046] Based on the foregoing, for example, see Figure 3The present invention also provides an additive manufacturing device based on the grinding device, the additive manufacturing device includes a robot 17, a welding gun 18 and the grinding device as described above; the welding gun 18 and the grinding device can be adjustably arranged on the robot 17; when the additive manufacturing device is working, the grinding point 20 of the grinding device is the same as the arc starting point 21 of the welding gun 18. For example, the robot 17 can be an existing conventional six-axis robot or robot arm. When in use, especially before the welding gun 18 starts the arc, the grinding device is first used to grind the point 21 to be polished (the motor 8 drives the grinding head 14 to rotate at the point 20 to be polished to achieve the grinding of the point 20 to be polished). Due to the use of the floating mechanism, when the grinding head 14 and the point 20 to be polished are in contact and a certain amount of interference is generated, the motor floats upward at this time. Under the limit or constraint of the floating mechanism, the motor 8 is always in a balanced position, which is convenient for the grinding head 14 to float up and down, and can effectively improve the working efficiency of the grinding head 14, and complete the removal or grinding of the oxide layer. After the oxide layer on the surface of the point 21 to be polished is removed, the position of the welding gun 18 and the grinding device is switched, and the arc is started at the point 21 to complete the corresponding additive manufacturing.

[0047] The present invention also provides a grinding method, which is performed based on the grinding device as described above or based on the additive manufacturing equipment as described above; the grinding method comprises the following steps:

[0048] 1) Before arc forming, the area to be polished is determined based on the arc starting point 21, and the area to be polished covers the arc starting point 21; wherein, in step 1), the method of determining the area to be polished based on the arc starting point 21 includes a normal method or a circular method; the normal method is to move the grinding head 14 of the grinding device from the arc starting point 21 along the normal direction to the area outside the part 19 to be processed or the substrate to be determined as the area to be polished; the circular method is to take the arc starting point 21 as the center and the area with a radius of 1.5-2.5 times the length of the diameter of the grinding head 14 as the radius to determine the area to be polished.

[0049] 2) A grinding device is used to grind the area to be polished. Since the arc starting point 21 is generally up and down, in order to improve the arc starting rate of grinding, the present invention adopts the following method when grinding:

[0050] When the normal method is used to determine the area to be polished, the polishing in step 2) is specifically: Figure 4 , so that the grinding head 14 of the grinding device moves from the arc starting point 21 to the outside of the part 19 to be processed or the substrate along the normal direction to complete the grinding, forming a larger grinding area, ensuring that the grinding area covers the arc starting point, and improving the arc starting rate; in particular, moving from the arc starting point 21 to the outside of the part 19 to be processed or the substrate along the normal direction in a manner of gradually reducing the Z-axis height to complete the grinding;

[0051] When the ring method is used to determine the area to be polished, the specific polishing in step 2 is: Figure 5 The grinding device is used to move along the point-shaped path in the area to be ground, and the grinding is completed after traversing the area to be ground, ensuring that the grinding area covers the arc starting area and improving the arc starting rate.

[0052] It should be noted that the grinding method provided by the present invention is based on Figure 3 When the additive manufacturing device shown is completed, the grinding method further includes, before step 1):

[0053] 0) Pre-set the additive manufacturing equipment. The specific implementation method of pre-setting is:

[0054] 0.1) Construct a rectangular coordinate system with the plane perpendicular to the welding gun as the XY plane;

[0055] 0.2) calibrating the arc starting point 21 of the welding gun 18 in a rectangular coordinate system;

[0056] 0.3) Move the robot 17 in the XY plane to align the grinding head 14 of the grinding device with the arc starting point 21;

[0057] 0.4) adjusting the height of the grinding device along the Z axis to make the grinding head 14 contact with the arc starting point 21, and calibrating the position of the grinding head 14 in the XY plane; preferably, the grinding head 14 contacts with the arc starting point 21 and makes the grinding head 14 align with the arc starting point 21 to generate a compression of 5-20 mm;

[0058] 0.5) According to the positional relationship of the grinding head 14 before and after the calibration, the calibration of the grinding head 14 is completed, and the presetting of the additive manufacturing equipment is completed.

Claims

1. A grinding device, characterized in that: The grinding device comprises a connecting plate (1), a floating mechanism and a grinding mechanism; the grinding mechanism is arranged on the connecting plate (1) via the floating mechanism; and the floating mechanism drives the grinding mechanism to move along the axial direction where the floating mechanism is located.

2. The grinding device according to claim 1, characterized in that: The floating mechanism comprises a sliding shaft (15), an upper floating spring (9) and a lower floating spring (11); the sliding shaft (15) is arranged on the connecting plate (1); the upper floating spring (9), the grinding mechanism and the lower floating spring (11) are arranged on the sliding shaft (15) in sequence from top to bottom and move along the axial direction of the sliding shaft (15); preferably, the spring coefficient of the lower floating spring (11) is greater than the spring coefficient of the upper floating spring (9).

3. The grinding device according to claim 2, characterized in that: The floating mechanism also includes an upper spring fixing plate (4) and a lower spring fixing plate (12); the upper floating spring (9) is arranged on the sliding shaft (15) through the upper spring fixing plate (4); the lower floating spring (11) is arranged on the sliding shaft (15) through the lower spring fixing plate (12); the sliding shaft (15) is connected to the connecting plate (1) through the lower spring fixing plate (12).

4. The grinding device according to claim 3, characterized in that: The floating mechanism also includes an adjustment screw (22) and a spring adjustment plate (6); the spring adjustment plate (6) is placed between the upper spring fixing plate (4) and the upper floating spring (9); the adjustment screw (22) penetrates the upper spring fixing plate (4) along the axial direction of the sliding shaft (15) and is pressed on the spring adjustment plate (6).

5. The grinding device according to claim 4, characterized in that: The floating mechanism also includes a sliding bushing (5) sleeved on the sliding shaft (15); the spring adjustment plate (6) is movably arranged on the sliding shaft (15) through the sliding bushing (5) and moves along the axial direction of the sliding shaft (15).

6. The grinding device according to claim 5, characterized in that: The floating mechanism also includes a stroke cylinder (2); the connecting plate (1) is connected to the lower spring fixing plate (12) via the stroke cylinder (2); the axial direction of the stroke cylinder (2) is parallel to the axial direction of the sliding shaft (15); the stroke cylinder (2) drives the sliding shaft (15) to move along the axial direction of the stroke cylinder (2) via the lower spring fixing plate (12).

7. The grinding device according to any one of claims 2 to 6, characterized in that: The grinding mechanism comprises a motor (8), a grinding head (14), a sleeve (13), a linear bearing (16) and a motor connecting piece; the upper floating spring (9), the linear bearing (16) and the lower floating spring (11) are arranged on the sliding shaft (15) in sequence from top to bottom and move along the axial direction of the sliding shaft (15); the motor (8) is arranged on the linear bearing (16) through the motor connecting piece; the grinding head (14) is arranged on the motor (8) through the sleeve (13); the motor (8) drives the grinding head (14) to rotate around the axial direction of the grinding head (14).

8. The grinding device according to claim 7, characterized in that: The motor connecting member comprises a motor mounting plate (10) and a motor holder (7); the motor holder (7) surrounds the motor (8) and moves along the axial direction of the motor (8); the motor holder (7) is arranged on a linear bearing (16) through the motor mounting plate (10).

9. An additive manufacturing device based on the grinding device according to any one of claims 1 to 8, characterized in that: The additive manufacturing equipment comprises a robot (17), a welding gun (18) and a grinding device as described in any one of claims 1 to 8; the welding gun (18) and the grinding device can be adjustably arranged on the robot (17); when the additive manufacturing equipment is working, the point to be ground (20) of the grinding device is the same as the point to be struck (21) of the welding gun (18).

10. A grinding method, characterized in that: The grinding method is performed based on the grinding device according to any one of claims 1 to 8 or based on the additive manufacturing equipment according to claim 9; the grinding method comprises the following steps: 1) before arc forming, determining a region to be polished based on the arc starting point (21), wherein the region to be polished covers the arc starting point (21); 2) Use a grinding device to grind the area to be polished; Preferably, the method of determining the area to be polished based on the arc starting point (21) in step 1) includes a normal method or a ring method; Preferably, the normal method is to move the grinding head (14) of the grinding device from the arc-starting point (21) along the normal direction to an area outside the part (19) to be processed or the substrate to be determined as the area to be ground; the annular method is to take the arc-starting point (21) as the center of the circle and a length of 1.5 to 2.5 times the diameter of the grinding head (14) as the radius to determine the area to be ground; Preferably, when the normal method is used to determine the area to be polished, the polishing in step 2) is specifically: the polishing head (14) of the polishing device is moved from the arc-starting point (21) along the normal direction to the outside of the part to be processed (19) or the substrate to complete the polishing; preferably, the polishing head (14) of the polishing device is moved from the arc-starting point (21) along the normal direction in a manner of gradually decreasing the Z-axis height to the outside of the part to be processed (19) or the substrate to complete the polishing; Preferably, when the ring method is used to determine the area to be polished, the polishing in step 2) is specifically: using a polishing device to move along a point shape in the area to be polished, and completing the polishing after traversing the area to be polished; Preferably, when the grinding method is completed based on the additive manufacturing device according to claim 9, the grinding method further comprises before step 1): 0) Pre-set the additive manufacturing equipment; Preferably, the step 0) specifically includes: 0.1) Construct a rectangular coordinate system with the plane perpendicular to the welding gun as the XY plane; 0.2) calibrating the arc starting point (21) of the welding gun (18) in a rectangular coordinate system; 0.3) moving the robot (17) in the XY plane so that the grinding head (14) of the grinding device is aligned with the arc starting point (21); 0.4) adjusting the height of the grinding device along the Z axis to make the grinding head (14) contact the arc starting point (21) to be calibrated, and calibrating the position of the grinding head (14) in the XY plane; preferably, the grinding head (14) contacts the arc starting point (21) to make the grinding head (14) align with the arc starting point (21) to generate a compression of 5-20 mm; 0.5) According to the positional relationship of the grinding head (14) before and after the calibration, the grinding head (14) is calibrated and the additive manufacturing equipment is pre-set.

Images