Monocrystalline silicon wafer slicing device
By using anti-slip suction cups and telescopic rods to fix the crystal column in the single crystal silicon wafer slicing device, the problem of wafer drop is solved, the cutting efficiency and yield rate are improved, and the quality of the cutting surface is ensured.
Patent Information
- Application Number
- CN202411482302.7
- Authority / Receiving Office
- CN · China
- Patent Type
- Applications(China)
- Current Assignee / Owner
- Filing Date
- 2024-10-23
- Publication Date
- 2024-12-27
- Estimated Expiration
- Not applicable · inactive patent
AI Technical Summary
During the cutting process of single crystal silicon columns, the cut wafer is prone to falling off, resulting in a high waste rate and cannot be effectively limited during the cutting process, affecting production efficiency.
Design a single crystal silicon wafer slicing device, which uses anti-slip suction cups and telescopic rods to vertically fix the crystal columns, and provides support through anti-slip suction cups to ensure the stability of the wafer during cutting, and efficient cutting through saw ropes to prevent wafers from being cut Drop.
It effectively avoids wafer drop and damage, improves cutting yield and production efficiency, and ensures that the cutting surface is smooth and smooth.
Smart Images
Figure CN119189081A_ABST
Abstract
Description
Technical Field
[0001] The invention relates to the technical field of slicing equipment, and in particular to a single crystal silicon wafer slicing device. Background Art
[0002] The wafer is one of the important components in chip manufacturing. It is cut from single-crystal silicon columns and then made into a carrier that can carry chips through multiple processes. It is also one of the main carriers for chip production. Due to the production characteristics of single-crystal silicon columns, the ones produced must be cylindrical structures, so they need to be cut.
[0003] The current cutting method generally involves laying a single crystal silicon column on the equipment and then cutting it with a cutting knife. This method easily leads to the cut wafer not being effectively limited, which causes the wafer to fall during the cutting process because it is not clamped, increasing the wafer scrap rate and delaying the production yield. For this reason, a single crystal silicon wafer slicing device is proposed. Summary of the invention
[0004] The technical solution adopted by the present invention to solve the technical problem is: a single crystal silicon wafer slicing device comprises a processing table, a vertical plate is fixedly connected to the middle of the top of the processing table and near one end edge, a lifting groove is opened in the middle of one side wall of the vertical plate, a slider is slidably connected in the lifting groove, and one end of the slider is fixedly connected to a connecting plate, a collecting hole is opened through the side wall of the top of the processing table and opposite to the connecting plate, a suspension column is detachably connected to the side wall of the bottom of the processing table and near the collecting hole, a support arm is rotatably set at the end of the suspension column away from the processing table, a driver is detachably embedded in the suspension column, and the output end of the driver is detachably connected to the center point of the top side wall of the support arm, the top side walls at both ends of the support arm are detachably connected with auxiliary telescopic rods, the output end of the auxiliary telescopic rod is fixedly connected with an anti-slip suction cup, and the anti-slip suction cup is located at the center point of the collecting hole.
[0005] As a preferred technical solution of the present invention, the top side wall of the vertical plate is detachably connected to a main telescopic rod, and the output end of the main telescopic rod extends into the lifting slot and is detachably connected to the top side wall of the slider.
[0006] As a preferred technical solution of the present invention, the side walls of the connecting plate opposite to the collecting hole are evenly fixedly connected with fixed suction cups, the bottom side wall of the connecting plate is fixedly connected with an anti-deflection ring, the anti-deflection ring is a ring-shaped structure, the fixed suction cup is in the middle of the anti-deflection ring, and a crystal column is fixedly connected inside the anti-deflection ring by adsorption of the fixed suction cup, and the diameter of the collecting hole is 2-5 cm larger than the crystal column.
[0007] As a preferred technical solution of the present invention, side grooves are provided on the side walls at the top of the processing table and close to the edges on both sides, a moving block is slidably connected in the side groove, a follower block is detachably connected to the top of the moving block, a fixed cross bar is telescopically connected between the two follower blocks, and a saw rope is detachably connected between the two fixed cross bars.
[0008] As a preferred technical solution of the present invention, a supporting plate is fixedly connected to the side wall located below the fixed cross bar on the side away from each other of the two follower blocks, and a motor is detachably connected to the bottom side wall of the end of the supporting plate away from the follower block, and the output end of the motor is detachably connected to a turntable through the supporting plate.
[0009] As a preferred technical solution of the present invention, the top side wall of the turntable close to one side edge is rotatably connected to a rotating sleeve column, one side of the rotating sleeve column is fixedly connected to a linkage rod, and the linkage rod is rotatably connected to the middle of one end of the fixed cross bar through its end away from the rotating sleeve column.
[0010] The present invention has the following advantages: the crystal column is set in an upright state, so that its bottom end can be placed on the anti-skid suction cup when it descends, and the anti-skid suction cup can provide an upward supporting force for the crystal column to ensure the overall stability of the crystal column. At the same time, because it is vertically downward, when the crystal column is cut, the cut wafer will fit tightly on the anti-skid suction cup under the action of gravity, ensuring the stability of the wafer. In addition, because the anti-skid suction cup has an adsorption effect, it can effectively avoid the problem of wafer falling and being damaged, thereby improving the cutting yield. BRIEF DESCRIPTION OF THE DRAWINGS
[0011] Figure 1 It is a schematic diagram of the three-dimensional structure of a preferred embodiment of the present invention;
[0012] Figure 2 It is a bottom-up stereoscopic structural schematic diagram of a preferred embodiment of the present invention;
[0013] Figure 3 It is a schematic diagram of the exploded three-dimensional structure of a preferred embodiment of the present invention.
[0014] Explanation of the reference numerals in the accompanying drawings: 1. Processing table; 2. Vertical plate; 3. Lifting slot; 4. Main telescopic rod; 5. Connecting plate; 6. Anti-deflection ring; 7. Crystal column; 8. Collecting hole; 9. Side slot; 10. Moving block; 11. Follower block; 12. Fixed cross bar; 13. Saw rope; 14. Support plate; 15. Motor; 16. Turntable; 17. Rotating sleeve column; 18. Linkage rod; 19. Suspension column; 20. Support arm; 21. Auxiliary telescopic rod; 22. Anti-slip suction cup; 23. Fixed suction cup. DETAILED DESCRIPTION
[0015] The present invention will be further described below in conjunction with the accompanying drawings.
[0016] Please refer to Figure 1-3 The present invention discloses a single crystal silicon wafer slicing device, comprising a processing table 1, a vertical plate 2 is fixedly connected to the middle of the top of the processing table 1 and near one end edge, a lifting groove 3 is provided in the middle of one side wall of the vertical plate 2, a slider is slidably connected in the lifting groove 3, and a connecting plate 5 is fixedly connected to one end of the slider, a collecting hole 8 is provided through the top of the processing table 1 and the side wall opposite to the connecting plate 5, a suspension column 19 is detachably connected to the side wall of the bottom of the processing table 1 and near the collecting hole 8, and a support arm 20 is rotatably provided at the end of the suspension column 19 away from the processing table 1, and the suspension column 1 9 is detachably embedded with a driver, and the output end of the driver is detachably connected to the center point of the top side wall of the support arm 20, the top side walls at both ends of the support arm 20 are detachably connected with auxiliary telescopic rods 21, the output end of the auxiliary telescopic rod 21 is fixedly connected with a non-slip suction cup 22, and the non-slip suction cup 22 is located at the center point of the collecting hole 8, the top side wall of the vertical plate 2 is detachably connected with the main telescopic rod 4, the output end of the main telescopic rod 4 extends into the lifting slot 3 and is detachably connected to the top side wall of the slider, and the diameter of the collecting hole 8 is 2-5cm larger than the crystal column 7.
[0017] The technical effect of this solution is as follows: because the auxiliary telescopic rod 21 and the anti-skid suction cup 22 are connected to the bottom of the processing table 1, when the crystal column 7 passes through the collecting hole 8, its bottom end will fit with the anti-skid suction cup 22, and the anti-skid suction cup 22 can provide auxiliary support for the crystal column 7, and can still provide stability assistance for the cut wafer during cutting, thereby ensuring the stability of the cut wafer, avoiding it from falling and causing damage due to not being firmly grasped, and improving the cutting yield. Because the anti-skid suction cups 22 are connected to both ends of the support arm 20 and can rotate, continuous processing can be achieved, thereby improving production efficiency.
[0018] The side walls of the connecting plate 5 opposite to the collecting hole 8 are evenly fixedly connected with fixed suction cups 23, the bottom side wall of the connecting plate 5 is fixedly connected with an anti-deflection ring 6, the anti-deflection ring 6 is annular, the fixed suction cup 23 is in the middle of the anti-deflection ring 6, the anti-deflection ring 6 is fixedly connected with a crystal column 7 by adsorption of the fixed suction cup 23, the top of the processing table 1 and the side walls close to the edges on both sides are provided with side grooves 9, the side grooves 9 are slidably connected with a moving block 10, the top of the moving block 10 is detachably connected with a follower block 11, the middle of the two follower blocks 11 is telescopically connected with a fixed cross bar 12, and the two fixed cross bars 12 are connected between them. A saw rope 13 is detachably connected, and a supporting plate 14 is fixedly connected to the side wall at which the two follower blocks 11 are away from each other and located below the fixed cross bar 12. A motor 15 is detachably connected to the bottom side wall at one end of the supporting plate 14 away from the follower block 11, and an output end of the motor 15 is detachably connected to a turntable 16 through the supporting plate 14. A rotating sleeve column 17 is rotatably connected to the top side wall of the turntable 16 near one edge, and a linkage rod 18 is fixedly connected to one side of the rotating sleeve column 17. The linkage rod 18 is rotatably connected to the middle of one end of the fixed cross bar 12 through its end away from the rotating sleeve column 17.
[0019] The technical effect of this solution is as follows: the anti-deflection ring 6 can be set up to reinforce the crystal column 7 to prevent the thrust generated during the cutting process from causing the crystal column 7 to tilt, thereby fully ensuring the flatness of the cut wafer and improving the yield rate. The high-speed reciprocating saw rope 13 can efficiently cut the crystal column 7, and the saw rope 13 will not apply rotational force to the cut wafer, thereby ensuring the stability of the cut wafer itself, and because of the characteristics of the rope saw, the smoothness of the cut surface can be guaranteed.
[0020] Specifically, when the present invention is used, the crystal column 7 to be cut is inserted into the anti-deflection ring 6, and the crystal column 7 is fixed in the anti-deflection ring 6 by the fixed suction cup 23, and then the main telescopic rod 4 is started to push the crystal column 7 down. After it is lowered to a suitable position, the auxiliary telescopic rod 21 is started, and the anti-skid suction cup 22 is driven to rise by the auxiliary telescopic rod 21 so that it finally fits the bottom center of the crystal column 7. Then, the guide cylinder is started to drive the moving block 10 to move along the side groove 9, and the motor 15 is started in advance to drive the saw rope 13 to reciprocate at high speed. As the saw rope 13 moves, the crystal column 7 is cut, and the cut wafer is adsorbed on the anti-skid suction cup 22. Then, the auxiliary telescopic rod 21 is started to bring the wafer to the bottom of the processing table 1, and the driver in the suspension column 19 is started to drive the support arm 20 to rotate to send the empty anti-skid suction cup 22 to the middle of the collecting hole 8, and the cut wafer is sent to the storage rack. Then, the crystal column 7 is continued to be lowered and the saw rope 13 is started to perform continuous cutting operations, thereby improving the cutting efficiency.
[0021] The above are only preferred embodiments of the present invention. It should be pointed out that, for ordinary technicians in this technical field, several improvements and modifications can be made without departing from the principles of the present invention. These improvements and modifications should also be regarded as the scope of protection of the present invention.
[0022] Other parts of the present invention not described in detail belong to the prior art and will not be described in detail here.
[0023] Finally, it should be noted that the above embodiments are only used to illustrate the technical solutions of the present invention, rather than to limit it. Although the present invention has been described in detail with reference to the aforementioned embodiments, those skilled in the art should understand that they can still modify the technical solutions described in the aforementioned embodiments, or replace some or all of the technical features therein with equivalents. However, these modifications or replacements do not cause the essence of the corresponding technical solutions to deviate from the scope of the technical solutions of the embodiments of the present invention.
Claims
1. A single crystal silicon wafer slicing device, comprising a processing table (1), characterized in that: A vertical plate (2) is fixedly connected to the middle of the top of the processing table (1) and near one end edge, a lifting groove (3) is provided in the middle of one side wall of the vertical plate (2), a slider is slidably connected in the lifting groove (3), and a connecting plate (5) is fixedly connected to one end of the slider, a collecting hole (8) is provided through the top of the processing table (1) and the side wall opposite to the connecting plate (5), a suspension column (19) is detachably connected to the bottom of the processing table (1) and the side wall near the collecting hole (8), and the suspension column (19) is provided on the side wall of the processing table (1) and near the collecting hole (8). A support arm (20) is rotatably provided at one end of the suspension column (19) away from the processing table (1); a driver is detachably embedded in the suspension column (19), and the output end of the driver is detachably connected to the center point of the top side wall of the support arm (20); the top side walls at both ends of the support arm (20) are detachably connected to auxiliary telescopic rods (21); the output end of the auxiliary telescopic rod (21) is fixedly connected to an anti-skid suction cup (22), and the anti-skid suction cup (22) is located at the center point of the collecting hole (8).
2. A single crystal silicon wafer slicing device as claimed in claim 1, characterized in that: The top side wall of the vertical plate (2) is detachably connected to a main telescopic rod (4), and the output end of the main telescopic rod (4) extends into the lifting groove (3) and is detachably connected to the top side wall of the slider.
3. A single crystal silicon wafer slicing device as claimed in claim 1, characterized in that: The side wall of the connecting plate (5) opposite to the collecting hole (8) is evenly fixedly connected with a fixed suction cup (23); the bottom side wall of the connecting plate (5) is fixedly connected with an anti-deflection ring (6); the anti-deflection ring (6) is an annular structure; the fixed suction cup (23) is located in the middle of the anti-deflection ring (6); a crystal column (7) is fixedly connected in the anti-deflection ring (6) by adsorption of the fixed suction cup (23); and the diameter of the collecting hole (8) is 2-5 cm larger than that of the crystal column (7).
4. A single crystal silicon wafer slicing device as claimed in claim 1, characterized in that: The top of the processing table (1) and the side walls close to the two side edges are provided with side grooves (9), a moving block (10) is slidably connected in the side groove (9), a follower block (11) is detachably connected to the top of the moving block (10), a fixed cross bar (12) is telescopically movably connected between the two follower blocks (11), and a saw rope (13) is detachably connected between the two fixed cross bars (12).
5. A single crystal silicon wafer slicing device as claimed in claim 4, characterized in that: A supporting plate (14) is fixedly connected to a side wall of the two follower blocks (11) that is away from each other and located below the fixed cross bar (12); a motor (15) is detachably connected to a bottom side wall of one end of the support plate (14) away from the follower block (11); and an output end of the motor (15) is detachably connected to a turntable (16) through the support plate (14).
6. A single crystal silicon wafer slicing device as claimed in claim 5, characterized in that: A top side wall of the rotating disk (16) close to one side edge is rotatably connected to a rotating sleeve column (17), one side of the rotating sleeve column (17) is fixedly connected to a linkage rod (18), and the linkage rod (18) is rotatably connected to the middle of one end of the fixed cross bar (12) through one end thereof away from the rotating sleeve column (17).