Electromagnetic levitation in-mold injection molding process and structure

Abstract

The invention discloses an electro-magnetic levitation in-mold injection molding process, and belongs to the technical field of in-mold injection molding processes. The electro-magnetic levitation in-mold injection molding process comprises the following steps: connecting a memory steel wire and a power line in a product cavity of a first molding mold by using silica gel by using the first molding mold; the periphery of the product cavity of the second forming mold is arranged into an electro-magnetic levitation structure form by utilizing a high-temperature-resistant magnet and a power supply device, and a magnetic field formed by a power line input by the power supply device and current in a memory steel wire is matched with a magnetic field of the high-temperature-resistant magnet; therefore, the power line and the memory steel wire are suspended in the product cavity of the second forming die by means of the magnetic field acting force generated after electrification. Finally, silica gel raw materials are injected into a product cavity of the second forming mold after mold closing through a silica gel injection molding machine, so that the technical problem that after a product is subjected to injection molding in the mold, due to the fact that the position of a power line or a memory steel wire cannot be controlled, the power line and the memory steel wire are exposed out of a silica gel shell is solved.

Description

Technical Field

[0001] The invention relates to the technical field of in-mold injection molding technology, and in particular to an electromagnetic floating mold in-mold injection molding technology and a structure using the electromagnetic floating mold in-mold injection molding technology. Background Art

[0002] Existing Bluetooth headset neck hanging products are mainly composed of the following components: memory steel wire, power cord, and product appearance silicone.

[0003] The traditional production method of the aforementioned Bluetooth headset neckband product is: mainly using the in-mold molding process of hydraulic silicone / solid silicone, specifically: first calculate the amount of silicone for a single mold; then put the silicone, power cord, and memory steel wire into the preset mold cavity according to the direction and sequence requirements; finally, start the hydraulic machine to perform in-mold molding to complete the production.

[0004] For example, Chinese patent CN117382076A discloses a hydraulic molding device for silicone products and its use method, which includes: a base, on which are arranged a molding component, a transfer component, and a material discharge component, the transfer component is used to realize the transportation of silicone products; the molding component is used to mold silicone and prevent accidental start-up from causing harm to personnel; the material discharge component is used to take the material after molding and cut off the burr waste. The technical solution disclosed in this patent can ensure that the mold is in place and filled with silicone before the molding operation, while protecting the safety of personnel; it realizes the transportation of products, so that the discharge pipe will not interfere with the material discharge operation, and improves the material discharge speed; it can quickly discharge the product, and at the same time cut off the burr of the product, and directly collect and pack the finished product without manual operation by personnel, simplifying the operation process and improving efficiency.

[0005] However, the above-disclosed in-mold hydraulic molding process for silicone products cannot avoid the technical problem of the power cord and memory steel wire being exposed during the hydraulic molding of existing Bluetooth headset neckband products. Specifically, when the hydraulic silicone molding process is used to produce existing Bluetooth headset neckband products, after the mold closing action, the state inside the mold cavity in the mold cannot be observed or perceived by the operator in real time; therefore, the operator cannot control or adjust the position of the power cord and memory steel wire in real time; thus, the defective products produced are high, which is mainly manifested in: the power cord and memory steel wire are not in the middle tolerance position of the product, the power cord and memory steel wire will swing in the up and down direction of the product, resulting in the power cord or memory steel wire in the finished product being exposed outside the silicone shell.

[0006] Furthermore, in-mold injection molding is a plastic processing technology that melts solid plastic at a certain melting point, injects it into the mold at a certain speed through the pressure of the injection machine, and solidifies the plastic through water channel cooling to obtain a product that is the same as the designed mold cavity. This plastic processing technology is mainly used for the molding of thermoplastic plastics, and can also be used for the molding of thermosetting plastics.

[0007] Based on this, in-mold injection molding and silicone oil pressure technology can be combined to solve the technical problem of the power cord and memory steel wire being exposed during oil pressure molding of current Bluetooth headset neck hanging products. Summary of the invention

[0008] Based on this, it is necessary to provide an electromagnetic floating mold injection molding process to solve the technical problem of how to solve the exposure of the power cord and memory steel wire of Bluetooth headset neck hanging products during oil pressure molding.

[0009] An electromagnetic floating mold injection molding process comprises the following steps: S1: First, the power cord required for making the Bluetooth headset neck hanging product is connected to the memory steel wire through the first molding die to obtain a one-shot product; S2: An electromagnetic floating structure is provided around the product cavity of the second molding die, so that the first shot product placed in the product cavity of the second molding die is always suspended at a preset position in the product cavity structure after power is turned on; S3: starting the injection molding machine to inject the filling material into the product cavity of the second molding mold, so that the filling material covers the periphery of the first shot product filled in suspension, so as to obtain the second shot product; S4: The second shot product is further processed to obtain a Bluetooth headset neck hanging product.

[0010] Specifically, the method of providing an electromagnetic floating structure around the product cavity of the second molding mold is as follows: S21: Magnets are installed on both sides of the top of the product cavity of the second molding mold where the first shot product passes, in a manner of N level on one side and S level on the other side in the direction of the magnetic field; S22: A power positive and negative electrode device which is insulated from the second molding die on all sides is provided at the junction of the power cord parts of the Bluetooth headset neck hanging product, and the energized structure is led from the power positive and negative electrode device to the outside of the second molding die; S23: placing the first shot product into the product cavity of the second molding mold, so that the first shot product is electrically connected to the positive and negative electrode devices of the power supply; S24: connecting the positive and negative electrode devices of the power supply to power, and adjusting the output voltage of the positive and negative electrode devices of the power supply and the injection parameters of the injection molding machine so that the first shot product in the product cavity of the second molding mold is always suspended at a preset position.

[0011] Furthermore, a structure using the aforementioned electromagnetic floating mold injection molding process comprises: an injection cavity structure, a molding skeleton structure, a magnet structure and an external power supply positive and negative electrode structure; the molding skeleton structure is movably arranged in the injection cavity structure, the N-level magnet structure is arranged on one side of the injection cavity structure, and the S-level magnet structure is arranged on the other side of the injection cavity structure; the external power supply positive and negative electrode structure is arranged on the adjacent side of the injection cavity structure, and the external power supply positive and negative electrode structure is electrically connected to the molding skeleton structure.

[0012] Furthermore, the positive and negative electrode structure of the external power supply has an insulating support base, an insulating isolation cover, an electrode connecting column structure, an electrode locking structure, an electrode top end sealing structure and an electrode bottom end sealing structure.

[0013] Furthermore, the insulating isolation cover is arranged above the insulating support seat, and the two electrode connecting column structures are movably sleeved in the insulating support seat.

[0014] Furthermore, each of the electrode connection column structures is electrically connected to one end of the molded skeleton structure, and the insulating isolation cover is disposed on the connection between each of the electrode connection column structures and the molded skeleton structure.

[0015] Furthermore, each of the electrode locking structures is correspondingly connected to an electrode connecting column structure, the electrode top sealing structure passes through the insulating isolation cover and covers the two electrode connecting column structures, and the electrode bottom sealing structure covers the bottom of the two electrode connecting column structures.

[0016] Furthermore, the electrode locking structure has an electrode locking portion and an electrode connecting piece.

[0017] Furthermore, the electrode locking portion is movably disposed on the electrode connecting column structure, and the electrode connecting member is respectively connected to the electrode locking portion and the electrode connecting column structure.

[0018] Furthermore, the electrode top sealing structure has a top sealing block, a clamping piece and a spring structure; the top sealing block is covered on the two electrode connecting column structures, the clamping piece passes through the insulating isolation cover and abuts against the top of the top sealing block, and the spring structure is connected to the clamping piece.

[0019] In summary, the electromagnetic floating mold injection molding process of the present invention first uses the first molding mold to connect the memory steel wire of the Bluetooth headset neck hanging product and the power cord with silicone in the product cavity of the first molding mold, and the silicone material can be injected by the silicone injection machine after the first molding mold is closed. After that, the product cavity in the second molding mold is structurally optimized, so that the high-temperature resistant magnet and the power supply device are used around the product cavity of the molding mold to form an electromagnetic floating structure, and the magnetic field formed by the current input into the power cord and the memory steel wire by the power supply device is combined with the magnetic field of the high-temperature resistant magnet itself, so that the power cord and the memory steel wire are suspended in the product cavity of the second molding mold by relying on the magnetic field force generated after power is turned on. Finally, a silicone injection molding machine is used to inject silicone raw materials into the product cavity of the second molding mold after mold closing. By adjusting the injection parameters such as injection pressure and injection speed of the silicone injection machine and cooperating with the aforementioned magnetic field force, it can be ensured that the skeleton material is always controlled within the range of the preset intermediate tolerance value of the product; thus, the technical problem that the power cord or memory steel wire cannot be controlled after the product is injection molded in the mold, resulting in both being exposed outside the silicone shell. Therefore, the electromagnetic floating mold injection molding process of the present invention solves the technical problem that the power cord and memory steel wire of Bluetooth headset neck hanging products are easily exposed during oil pressure molding. BRIEF DESCRIPTION OF THE DRAWINGS

[0020] Figure 1 It is a schematic diagram of the process of electromagnetic floating mold injection molding process of the present invention; Figure 2 It is a structural schematic diagram of an electromagnetic floating mold injection molding structure of the present invention; Figure 3 It is a schematic diagram of the explosion structure of the electromagnetic floating mold injection molding structure in another direction of the present invention; Figure 4 It is a schematic diagram of the explosion structure of the electromagnetic floating mold injection molding structure part in another direction of the present invention; Figure 5 It is a schematic structural diagram of another direction of a partial structure of an electromagnetic floating mold injection molding structure of the present invention; Figure 6 It is a schematic diagram of the explosion structure of the electromagnetic floating mold injection molding structure part in another direction of the present invention; Figure 7 It is a schematic structural diagram of another direction of an electromagnetic floating mold injection molding structure of the present invention. DETAILED DESCRIPTION

[0021] In order to make the above-mentioned objects, features and advantages of the present invention more obvious and easy to understand, the specific embodiments of the present invention are described in detail below in conjunction with the accompanying drawings. In the following description, many specific details are set forth to facilitate a full understanding of the present invention. However, the present invention can be implemented in many other ways different from those described herein, and those skilled in the art can make similar improvements without violating the connotation of the present invention, so the present invention is not limited by the specific embodiments disclosed below.

[0022] In the description of the present invention, it should be understood that the terms "center", "longitudinal", "lateral", "length", "width", "thickness", "up", "down", "front", "back", "left", "right", "vertical", "horizontal", "top", "bottom", "inside", "outside", "clockwise", "counterclockwise", "axial", "radial", "circumferential" and the like indicate orientations or positional relationships based on the orientations or positional relationships shown in the accompanying drawings, and are only for the convenience of describing the present invention and simplifying the description, and do not indicate or imply that the referred device or element must have a specific orientation, be constructed and operated in a specific orientation, and therefore should not be understood as limiting the present invention.

[0023] In addition, the terms "first" and "second" are used for descriptive purposes only and should not be understood as indicating or implying relative importance or implicitly indicating the number of the indicated technical features. Therefore, the features defined as "first" and "second" may explicitly or implicitly include at least one of the features. In the description of the present invention, the meaning of "plurality" is at least two, such as two, three, etc., unless otherwise clearly and specifically defined.

[0024] In the present invention, unless otherwise clearly specified and limited, the terms "installed", "connected", "connected", "fixed" and the like should be understood in a broad sense, for example, it can be a fixed connection, a detachable connection, or an integral connection; it can be a mechanical connection or an electrical connection; it can be a direct connection or an indirect connection through an intermediate medium, it can be the internal connection of two elements or the interaction relationship between two elements, unless otherwise clearly defined. For ordinary technicians in this field, the specific meanings of the above terms in the present invention can be understood according to specific circumstances.

[0025] In the present invention, unless otherwise clearly specified and limited, a first feature being "above" or "below" a second feature may mean that the first and second features are in direct contact, or the first and second features are in indirect contact through an intermediate medium. Moreover, a first feature being "above", "above" or "above" a second feature may mean that the first feature is directly above or obliquely above the second feature, or simply means that the first feature is higher in level than the second feature. A first feature being "below", "below" or "below" a second feature may mean that the first feature is directly below or obliquely below the second feature, or simply means that the first feature is lower in level than the second feature.

[0026] It should be noted that when an element is referred to as being "fixed to" or "disposed on" another element, it may be directly on the other element or there may be a central element. When an element is considered to be "connected to" another element, it may be directly connected to the other element or there may be a central element at the same time. The terms "vertical", "horizontal", "upper", "lower", "left", "right" and similar expressions used herein are for illustrative purposes only and are not intended to be the only implementation method.

[0027] See also Figure 1 The present invention provides an electromagnetic floating mold injection molding process, which comprises the following steps: Prepare the first molding mold, the second molding mold, the silicone injection machine, the power transformer, the high temperature resistant magnet, the silicone material, the Bluetooth headset neck hanging product power cord material, the Bluetooth headset neck hanging product memory steel wire material and other necessary materials in advance; S1: First, use the first molding die to connect the power cord required for making the Bluetooth headset neck hanging product with the memory steel wire to obtain a one-shot product; S2: Magnets are installed on both sides of the top where the first shot product of the product cavity of the second molding mold passes, with N-grade magnets on one side and S-grade magnets on the other side according to the direction of the magnetic field; S3: A power positive and negative electrode device which is insulated from the second molding die on all sides is provided at the junction of the power cord of the Bluetooth headset neck hanging product, and the power is led to the outside of the second molding die from the side of the power positive and negative electrode device; S4: placing the first shot product obtained in step S1 into the product cavity of the second molding mold, so that the intersection of the power line of the first shot product is electrically connected with the positive and negative power supply devices; S5: connecting the positive and negative electrode devices of the power supply to power, and adjusting the output voltage of the positive and negative electrode devices of the power supply and the injection parameters of the silicone injection machine so that the first shot product in the product cavity of the second molding mold is always suspended at a preset position; S6: Start the silicone injection machine to inject silicone material into the product cavity of the second molding mold, so as to obtain a two-shot product, and then perform finishing processing such as trimming the two-shot product to obtain a Bluetooth headset neck hanging product.

[0028] Specifically, in an electromagnetic floating mold injection molding process of the present invention, first, the skeleton material of the Bluetooth headset neck hanging product, that is, the memory steel wire and the power cord material are connected to each other using the first molding mold; the connection between the two can be connected with silicone in the product cavity of the first molding mold, and the silicone material can be injected by a silicone injection machine after the first molding mold is closed. Thereafter, the product cavity in the second molding mold is structurally optimized, so that the high-temperature resistant magnet and the power supply device are used around the product cavity to form an electromagnetic floating structure, and the magnetic field formed by the current input into the power cord and the memory steel wire by the power supply device is combined with the magnetic field of the high-temperature resistant magnet itself, so that the power cord and the memory steel wire are suspended in the product cavity of the second molding mold by relying on the magnetic field force after power is turned on. Finally, a silicone injection molding machine is used to inject silicone raw materials into the product cavity of the second molding mold after the mold is closed. By adjusting the injection parameters of the silicone injection machine, such as injection pressure and injection speed, and cooperating with the aforementioned magnetic field force, it can be ensured that the skeleton material is always controlled within the range of the preset intermediate tolerance value of the product; thus, the technical problem of the power cord or memory steel wire being exposed outside the silicone shell after the product is injection molded in the mold is eliminated.

[0029] For further information, please refer to Figures 2 to 7 ; A structure using the aforementioned electromagnetic floating mold injection molding process, comprising: an injection cavity structure 1, a molding skeleton structure 2, a magnet structure 3 and an external power supply positive and negative electrode structure 4; the molding skeleton structure 2 is movably arranged in the injection cavity structure 1, the N-level magnet structure 3 is arranged on one side of the injection cavity structure 1, and the S-level magnet structure 3 is arranged on the other side of the injection cavity structure 1; the external power supply positive and negative electrode structure 4 is arranged on the adjacent side of the injection cavity structure 1, and the external power supply positive and negative electrode structure 4 is electrically connected to the molding skeleton structure 2.

[0030] Specifically, in the technical solution of the aforementioned electromagnetic floating mold injection molding structure, the injection cavity structure 1 is provided in the injection molding mold, and the molding skeleton structure 2 is movably placed therein, and the two ends of the molding skeleton structure 2 are respectively electrically connected to the positive and negative electrodes in the external power supply positive and negative electrode structure 4; thus, when the external power supply is connected to the external power supply positive and negative electrode structure 4, the current of the external power supply can flow from the positive electrode structure of the external power supply positive and negative electrode structure 4 into the skeleton molding structure 2, and then flow back to the external power supply from the skeleton molding structure 2 through the negative electrode structure of the aforementioned external power supply positive and negative electrode structure 4. Since the skeleton molding structure 2 is made of conductive material, for example, it can be composed of a power cord of a Bluetooth headset neck hanging product and a memory steel wire structure that are connected. When current flows into the molding skeleton structure 2, due to the principle of electromagnetic induction, it will generate a magnetic field around the molding skeleton structure 2. The N-level and S-level magnet structures 3 are respectively arranged on both sides of the injection cavity structure 1. Specifically, the N-level magnet can be arranged on one side of the injection cavity structure 1, and the S-level magnet can be arranged on the other side; the two magnets can constitute the magnet structure 3; in addition, the N-level and S-level magnets of the same magnet can be arranged on both sides of the injection cavity structure 1, and the magnets can constitute the magnet structure 3. Thus, the magnet structure 3 can construct the force of the magnetic field in the injection cavity structure 1; the force of the magnetic field can act on the magnetic field generated by the molding skeleton structure 2 after power is turned on; and then, the molding skeleton structure 2 can be suspended in the injection cavity structure 1 after power is turned on. Thereafter, the injection cavity structure 1 can be filled with materials such as silica gel by using an external injection mechanism, and these materials will be evenly coated around the molding skeleton structure 2 to form its shell structure; thus, the molding skeleton structure 2 can be formed into an in-mold molded product with uniform texture.

[0031] Furthermore, the positive and negative electrode structure 4 of the external power supply has an insulating support base 401, an insulating isolation cover 402, an electrode connecting column structure 403, an electrode locking structure 404, an electrode top blocking structure 405 and an electrode bottom blocking structure 406; the insulating isolation cover 402 is arranged above the insulating support base 401, and two electrode connecting column structures 403 are movably mounted in the insulating support base 401; each of the electrode connecting column structures 403 is electrically connected to one end of the molded skeleton structure 2, and the insulating isolation cover 402 is covered on the connection between each of the electrode connecting column structures 403 and the molded skeleton structure 2; each of the electrode locking structures 404 is connected to one of the electrode connecting column structures 403, the electrode top blocking structure 405 passes through the insulating isolation cover 402 and is covered on the two electrode connecting column structures 403, and the electrode bottom blocking structure 406 is covered on the bottom of the two electrode connecting column structures 403.

[0032] Specifically, the positive and negative electrode structures 4 of the external power supply mainly serve to connect the molded skeleton structure 2 with the external power supply and to insulate and isolate the conductive connection parts thereof from the rest of the injection molding mold. More specifically, usually, the molded skeleton structure 2 has two ends, and each end thereof is electrically connected to an electrode connection column structure 403, wherein one electrode connection column structure 403 serves as the positive electrode of the external power supply, and the other serves as the negative electrode; thereby, the molded skeleton structure 2 and the external power supply can form a conductive loop. In addition, the insulating support seat 401 can pass through the plate structure of the mold and form an insulating isolation so that the electrode connection column structure 403 is arranged therein; the insulating isolation cover 402 can further insulate and cover the connection between the electrode connection column structure 403 and the molded skeleton structure 2. Furthermore, after the two electrode connection column structures 403 are electrically connected to the molded skeleton structure 2, the electrode locking structure 404 can lock and connect the conductive connection between the two; then, the electrode top end blocking structure 405 is used to perform supplementary insulation isolation on the connection. In addition, the bottom of the two electrode connecting column structures 403 is pulled to the connection part with the external power supply, and this part can be insulated and blocked by the electrode bottom end blocking structure 406, thereby achieving complete insulation isolation between the setting range of the insulating support seat 401 and the insulating isolation cover body 402, so as to completely insulate and isolate the positive and negative electrode structures 4 of the external power supply from the external mold plate.

[0033] Furthermore, the electrode locking structure 404 has an electrode locking portion 404a and an electrode connector 404b; the electrode locking portion 404a is movably disposed on the electrode connecting column structure 403, and the electrode connector 404b is respectively connected to the electrode locking portion 404a and the electrode connecting column structure 403. Specifically, one end of the cable connecting the electrode connecting column structure 403 and the forming skeleton structure 2 is connected to the forming skeleton structure 2, and the other end thereof can be placed between the electrode locking portion 404a and the electrode connecting column structure 403, and then the two are locked and connected by the electrode connector 404b.

[0034] Furthermore, the electrode top end blocking structure 405 comprises a top end blocking block 405a, a pressing member 405b and a spring structure 405c; the top end blocking block 405a is covered on the two electrode connection column structures 403, the pressing member 405b passes through the insulating isolation cover 402 and abuts against the top of the top end blocking block 405a, and the spring structure 405c is connected to the pressing member 405b. Specifically, after the external mold plate structure presses the spring structure 405c, the spring can be transferred to the top end blocking block 405a through the pressing member 405b, so that the top end blocking block 405a covers the two electrode connection column structures 403.

[0035] Furthermore, in one embodiment, an upper mold core structure 5 is arranged above the positive and negative electrode structure 4 of the external power supply, and a lower mold core structure 6 is arranged below the positive and negative electrode structure 4 of the external power supply; the upper mold core structure 5 and the lower mold core structure 6 are arranged to open and close relative to each other, and the injection cavity structure 1 is arranged between the upper mold core structure 5 and the lower mold core structure.

[0036] Furthermore, the molded skeleton structure 2 has a power line portion 201 and a memory steel wire portion 202, the power line portion 201 and the memory steel wire portion 202 are stacked, and the power line portion 201 and the memory steel wire portion 202 can be connected by using silicone coating through mold molding.

[0037] In summary, the electromagnetic floating mold injection molding process of the present invention first uses the first molding mold to connect the memory steel wire of the Bluetooth headset neck hanging product and the power cord with silicone in the product cavity of the first molding mold, and the silicone material can be injected by the silicone injection machine after the first molding mold is closed. After that, the product cavity in the second molding mold is structurally optimized, so that the high-temperature resistant magnet and the power supply device are used around the product cavity of the molding mold to form an electromagnetic floating structure, and the magnetic field formed by the current input into the power cord and the memory steel wire by the power supply device is combined with the magnetic field of the high-temperature resistant magnet itself, so that the power cord and the memory steel wire are suspended in the product cavity of the second molding mold by relying on the magnetic field force generated after power is turned on. Finally, a silicone injection molding machine is used to inject silicone raw materials into the product cavity of the second molding mold after mold closing. By adjusting the injection parameters such as injection pressure and injection speed of the silicone injection machine and cooperating with the aforementioned magnetic field force, it can be ensured that the skeleton material is always controlled within the range of the preset intermediate tolerance value of the product; thus, the technical problem that the power cord or memory steel wire cannot be controlled after the product is injection molded in the mold, resulting in both being exposed outside the silicone shell. Therefore, the electromagnetic floating mold injection molding process of the present invention solves the technical problem that the power cord and memory steel wire of Bluetooth headset neck hanging products are easily exposed during oil pressure molding.

[0038] The technical features of the above-described embodiments may be arbitrarily combined. To make the description concise, not all possible combinations of the technical features in the above-described embodiments are described. However, as long as there is no contradiction in the combination of these technical features, they should be considered to be within the scope of this specification.

[0039] The above-mentioned embodiments only express several implementation methods of the present invention, and the descriptions thereof are relatively specific and detailed, but they cannot be understood as limiting the scope of the invention patent. It should be pointed out that, for ordinary technicians in this field, several variations and improvements can be made without departing from the concept of the present invention, and these all belong to the protection scope of the present invention. Therefore, the protection scope of the patent of the present invention shall be subject to the attached claims.

Claims

1. An electromagnetic floating mold injection molding process, characterized in that: It includes the following steps: S1: First, the power cord required for making the Bluetooth headset neck hanging product is connected to the memory steel wire through the first molding die to obtain a one-shot product; S2: An electromagnetic floating structure is provided around the product cavity of the second molding die, so that the first shot product placed in the product cavity of the second molding die is always suspended at a preset position in the product cavity structure after power is turned on; S3: starting the injection molding machine to inject the filling material into the product cavity of the second molding mold, so that the filling material covers the periphery of the first shot product filled in suspension, so as to obtain the second shot product; S4: The second shot product is further processed to obtain a Bluetooth headset neck hanging product.

2. The electromagnetic floating mold injection molding process according to claim 1, characterized in that: The method of providing an electromagnetic floating structure around the product cavity of the second molding mold is as follows: S21: Magnets are installed on both sides of the top of the product cavity of the second molding mold where the first shot product passes, in a manner of N level on one side and S level on the other side in the direction of the magnetic field; S22: A power positive and negative electrode device which is insulated from the second molding die on all sides is provided at the junction of the power cord parts of the Bluetooth headset neck hanging product, and the energized structure is led from the power positive and negative electrode device to the outside of the second molding die; S23: placing the first shot product into the product cavity of the second molding mold, so that the first shot product is electrically connected to the positive and negative electrode devices of the power supply; S24: connecting the positive and negative electrode devices of the power supply to power, and adjusting the output voltage of the positive and negative electrode devices of the power supply and the injection parameters of the injection molding machine so that the first shot product in the product cavity of the second molding mold is always suspended at a preset position.

3. A structure using an electromagnetic floating mold injection molding process as described in any one of claims 1-2, characterized in that: It comprises: an injection cavity structure (1), a molding skeleton structure (2), a magnet structure (3) and an external power source positive and negative electrode structure (4); the molding skeleton structure (2) is movably arranged in the injection cavity structure (1), the N-level magnet structure (3) is arranged on one side of the injection cavity structure (1), and the S-level magnet structure (3) is arranged on the other side of the injection cavity structure (1); the external power source positive and negative electrode structure (4) is arranged on the adjacent side of the injection cavity structure (1), and the external power source positive and negative electrode structure (4) is electrically connected to the molding skeleton structure (2).

4. The electromagnetic floating mold injection molding structure according to claim 3, characterized in that: The external power source positive and negative electrode structure (4) comprises an insulating support base (401), an insulating isolation cover (402), an electrode connection column structure (403), an electrode locking structure (404), an electrode top end sealing structure (405) and an electrode bottom end sealing structure (406).

5. The electromagnetic floating mold injection molding structure according to claim 4, characterized in that: The insulating isolation cover (402) is arranged above the insulating support seat (401), and the two electrode connection column structures (403) are movably sleeved in the insulating support seat (401).

6. The electromagnetic floating mold injection molding structure according to claim 5, characterized in that: Each of the electrode connection column structures (403) is electrically connected to one end of the molded skeleton structure (2), and the insulating isolation cover (402) is arranged to cover the connection between each of the electrode connection column structures (403) and the molded skeleton structure (2).

7. The electromagnetic floating mold injection molding structure according to claim 6, characterized in that: Each of the electrode locking structures (404) is correspondingly connected to one of the electrode connecting column structures (403); the electrode top end sealing structure (405) passes through the insulating isolation cover (402) and is covered on the two electrode connecting column structures (403); and the electrode bottom end sealing structure (406) is covered on the bottom of the two electrode connecting column structures (403).

8. The electromagnetic floating mold injection molding structure according to claim 7, characterized in that: The electrode locking structure (404) comprises an electrode locking portion (404a) and an electrode connecting member (404b).

9. The electromagnetic floating mold injection molding structure according to claim 8, characterized in that: The electrode locking portion (404a) is movably disposed on the electrode connecting column structure (403), and the electrode connecting member (404b) is respectively connected to the electrode locking portion (404a) and the electrode connecting column structure (403).

10. The electromagnetic floating mold injection molding structure according to claim 9, characterized in that: The electrode top end sealing structure (405) comprises a top end sealing block (405a), a pressing piece (405b) and a spring structure (405c); the top end sealing block (405a) is covered on the two electrode connecting column structures (403), the pressing piece (405b) passes through the insulating isolation cover (402) and abuts against the top of the top end sealing block (405a), and the spring structure (405c) is connected to the pressing piece (405b).

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