Laser chip packaging material and preparation method and application thereof

Abstract

The invention relates to the technical field of illumination, and discloses a laser chip packaging material and a preparation method and application thereof. The laser chip packaging material comprises the following raw materials in parts by weight: 80-91 parts of epoxy resin AB glue and 10-21 parts of powder, wherein the powder comprises hollow glass beads and fluorescent powder, and the weight ratio of the hollow glass beads to the fluorescent powder is (22-26): (4-8); the particle size of the hollow glass beads is 30-70 [mu] m, and the particle size of the fluorescent powder is 1-20 [mu] m. According to the technical scheme, the hollow glass beads are matched with the fluorescent powder, the color of light can be adjusted, the emitting angle of the light can be adjusted, the light emitting efficiency is effectively improved, and the laser chip can work under the high-power condition and can be well applied to the fields of high-pole illumination and the like.

Description

Technical Field

[0001] The present application relates to the field of lighting technology, and in particular to a laser chip packaging material and a preparation method and application thereof. Background Art

[0002] The most widely used LED lighting products on the market currently use LED chips as light-emitting components. As the power increases, the heat generated also increases. Higher heat easily leads to a decrease in the light output of the LED chip, or even LED chip failure. Therefore, the power of existing LED lighting products does not exceed 200W, and the light output efficiency is 100-120lm / W, which is difficult to meet the use needs of the high-power, high-lumen market, especially in some large-area application scenarios, such as stadiums, ports, docks, high-pole lighting and other fields.

[0003] Laser lighting can meet the needs of high-power lighting. However, the parallel light beams emitted by its light-emitting elements (i.e., laser chips) limit its application in areas such as high-pole lighting. Summary of the invention

[0004] The main purpose of the present application is to provide a laser chip packaging material and a preparation method and application thereof, aiming to solve the problem in the prior art that the parallel light beams emitted by the light-emitting element limit the application of laser lighting in fields such as high pole lighting.

[0005] To achieve the above-mentioned purpose, the present application proposes a laser chip packaging material, comprising the following raw materials in parts by weight: 80 to 91 parts of epoxy resin AB glue, 10 to 21 parts of powder;

[0006] The powder material includes hollow glass microspheres and fluorescent powder, and the weight ratio of the hollow glass microspheres to the fluorescent powder is (22-26): (4-8);

[0007] The particle size of the hollow glass microspheres is 30 to 70 μm, and the particle size of the phosphor is 1 to 20 μm.

[0008] Optionally, the laser chip packaging material includes the following raw materials in parts by weight: 86 parts of epoxy resin AB glue and 17 to 21 parts of powder.

[0009] Preferably, the laser chip packaging material comprises the following raw materials in parts by weight: 86 parts of epoxy resin AB glue and 17 parts of powder.

[0010] Optionally, the weight ratio of the hollow glass microspheres to the phosphor is (24-25):(5-6).

[0011] Preferably, the weight ratio of the hollow glass microspheres to the phosphor is 24:6.

[0012] Optionally, the chemical composition of the hollow glass microspheres includes SiO2 and Al2O3, and the specific gravity of the hollow glass microspheres is 0.2-0.3 g / cm 3 , with a specific surface area of ​​1 to 1.5 m 2 / g.

[0013] Optionally, the phosphor includes YAG:Ce 3+ Phosphor.

[0014] Optionally, the epoxy resin AB glue includes epoxy resin A glue and epoxy resin B glue, and the weight ratio of the epoxy resin A glue to the epoxy resin B glue is 1:(1-1.5).

[0015] Preferably, the epoxy resin AB glue includes epoxy resin A glue and epoxy resin B glue, and the weight ratio of the epoxy resin A glue to the epoxy resin B glue is 1:1.

[0016] The present application also proposes a method for preparing a laser chip packaging material, comprising the following steps:

[0017] Epoxy resin AB glue and powder are provided according to a ratio, the powder is added into the epoxy resin AB glue, and the mixture is fully mixed to obtain the laser chip packaging material.

[0018] The present application also proposes the application of any of the above-mentioned laser chip packaging materials in the field of lighting.

[0019] In the technical solution of the present application, epoxy resin AB glue, hollow glass microbeads and phosphor powder are used in a specific ratio to form a slurry for encapsulation, and the slurry is wrapped on the laser chip by dispensing or molding. After the slurry is cured, a light-transmitting layer is formed. During operation, the laser chip emits a blue parallel light beam with a wavelength of 450 to 460 nm. The blue parallel light beam contacts the light-transmitting layer. The phosphor powder in the light-transmitting layer absorbs part of the blue light and emits yellow light with a wavelength of 550 to 560 nm. The yellow light and the blue light complement each other to form white light. Due to its special structure and refractive index, the hollow glass microbeads can effectively scatter the incident light. The hollow glass microbeads form scattering centers, so that the light is more evenly distributed in multiple directions, which can not only make the phosphor and the blue light contact more fully, but also make the light emit at a larger angle. The combination of hollow glass microbeads and phosphors can not only adjust the color of light, but also adjust the angle of light emission, effectively improving the light output efficiency. The laser chip can work under high-power conditions and can be well applied to fields such as high-pole lighting. BRIEF DESCRIPTION OF THE DRAWINGS

[0020] In order to more clearly illustrate the embodiments of the present application or the technical solutions in the prior art, the drawings required for use in the embodiments or the description of the prior art will be briefly introduced below. Obviously, the drawings described below are only some embodiments of the present application. For ordinary technicians in this field, other drawings can be obtained based on the structures shown in these drawings without paying any creative work.

[0021] Figure 1 A schematic diagram of the structure of the laser chip packaging material wrapped around the laser chip provided in the performance test example of this application;

[0022] Figure 2 for Figure 1 Schematic diagram of the structure in which the laser chip packaging material adjusts the light output angle of the parallel light beam emitted by the laser chip.

[0023] Description of Figure Numbers:

[0024] 1. Substrate; 11. Circuit structure; 2. Laser chip; 21. Parallel light beam; 3. Light-transmitting layer.

[0025] The realization of the purpose, functional features and advantages of this application will be further explained in conjunction with embodiments and with reference to the accompanying drawings. DETAILED DESCRIPTION

[0026] The following will be combined with the drawings in the embodiments of the present application to clearly and completely describe the technical solutions in the embodiments of the present application. Obviously, the described embodiments are only part of the embodiments of the present application, not all of the embodiments. Based on the embodiments in the present application, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of this application.

[0027] It should be noted that if the embodiments of the present application involve directional indications (such as up, down, left, right, front, back...), the directional indications are only used to explain the relative position relationship, movement status, etc. between the components under a certain specific posture (as shown in the accompanying drawings). If the specific posture changes, the directional indication will also change accordingly.

[0028] In addition, if there are descriptions involving "first", "second", etc. in the embodiments of the present application, the descriptions of "first", "second", etc. are only used for descriptive purposes and cannot be understood as indicating or implying their relative importance or implicitly indicating the number of technical features indicated. Therefore, the features defined as "first" and "second" may explicitly or implicitly include at least one of the features. In addition, the meaning of "and / or" appearing in the full text includes three parallel schemes. Taking "A and / or B" as an example, it includes scheme A, or scheme B, or a scheme that satisfies both A and B. In addition, the technical solutions between the various embodiments can be combined with each other, but it must be based on the ability of ordinary technicians in the field to implement. When the combination of technical solutions is contradictory or cannot be implemented, it should be considered that such a combination of technical solutions does not exist and is not within the scope of protection required by this application.

[0029] Laser lighting can meet the needs of high-power lighting. However, the parallel light beams emitted by the light-emitting element (i.e., laser chip) limit its application in fields such as high-pole lighting. In view of this, the present application proposes a laser chip packaging material and its preparation method and application, aiming to solve the problem in the prior art that the parallel light beams emitted by the light-emitting element limit the application of laser lighting in fields such as high-pole lighting.

[0030] A laser chip packaging material proposed in the present application includes the following raw materials in parts by weight: 80 to 91 parts of epoxy resin AB glue and 10 to 21 parts of powder; wherein the powder includes hollow glass beads and fluorescent powder, and the weight ratio of the hollow glass beads to the fluorescent powder is (22 to 26): (4 to 8), the particle size of the hollow glass beads is 30 to 70 μm, and the particle size of the fluorescent powder is 1 to 20 μm.

[0031] In the technical solution of the present application, epoxy resin AB glue, hollow glass microbeads and phosphor powder are used in a specific ratio to form a slurry for encapsulation, and the slurry is wrapped on the laser chip by dispensing or molding. After the slurry is cured, a light-transmitting layer is formed. During operation, the laser chip emits a blue parallel light beam with a wavelength of 450 to 460 nm. The blue parallel light beam contacts the light-transmitting layer. The phosphor powder in the light-transmitting layer absorbs part of the blue light and emits yellow light with a wavelength of 550 to 560 nm. The yellow light and the blue light complement each other to form white light. Due to its special structure and refractive index, the hollow glass microbeads can effectively scatter the incident light. The hollow glass microbeads form scattering centers, so that the light is more evenly distributed in multiple directions, which can not only make the phosphor and the blue light contact more fully, but also make the light emit at a larger angle. The combination of hollow glass microbeads and phosphors can not only adjust the color of light, but also adjust the angle of light emission, effectively improving the light output efficiency. The laser chip can work under high-power conditions and can be well applied to fields such as high-pole lighting.

[0032] It should be noted that if the amount of hollow glass microspheres is too low, the amount of scattering centers is reduced, the direction of light emission cannot be adjusted well, and the light absorption performance of the phosphor is affected, affecting the light output efficiency of the light source; if the amount of hollow glass microspheres is too high, it is easy to affect the stability of the encapsulation slurry system and increase the cost. It is understandable that if the hollow glass microspheres are replaced with solid glass microspheres of equal mass, the stability of the encapsulation slurry system will also be affected.

[0033] Furthermore, the laser chip packaging material includes the following raw materials in parts by weight: 86 parts of epoxy resin AB glue and 17 to 21 parts of powder.

[0034] In the technical solution of the present application, the light extraction efficiency of the corresponding light source can be improved by further adjusting the amount of raw materials used in the laser chip packaging material.

[0035] Furthermore, the weight ratio of the hollow glass microspheres to the phosphor is (24-25):(5-6).

[0036] In the technical solution of the present application, by optimizing the dosage of hollow glass microspheres and phosphors, the hollow glass microspheres and phosphors are combined to better adjust the color of light and the emission angle of light, so as to effectively improve the light extraction efficiency.

[0037] Furthermore, the chemical composition of the hollow glass microspheres includes SiO2 and Al2O3, and the specific gravity of the hollow glass microspheres is 0.2-0.3 g / cm 3 , with a specific surface area of ​​1 to 1.5 m 2 / g.

[0038] In the technical solution of the present application, the chemical composition of the hollow glass microspheres includes: SiO2 55-65wt%, Al2O3 26-35wt%, MgO 1-2wt%, Fe2O3 1-5wt%, TiO2 0.5-2wt%, C 0.01-2wt%, and 0.5-4wt% of Na2O and K2O, wherein wt% refers to the mass percentage. The specific gravity of the hollow glass microspheres is 0.2-0.3g / cm 3 , with a specific surface area of ​​1 to 1.5 m 2 / g, and the light diffusion rate is 80-88%. Glass micro beads with this characteristic can be well matched with fluorescent powder to improve the light output efficiency of the corresponding light source.

[0039] Furthermore, the phosphor comprises YAG:Ce 3+ Phosphor.

[0040] In the technical solution of this application, YAG:Ce is used 3+Phosphor can be well matched with hollow glass beads to achieve the purpose of effectively adjusting the light color.

[0041] Furthermore, the epoxy resin AB glue includes epoxy resin A glue and epoxy resin B glue, and the weight ratio of the epoxy resin A glue to the epoxy resin B glue is 1: (1 to 1.5).

[0042] In the technical solution of the present application, the raw material of epoxy resin AB glue is JL-510AB produced by Polyli Adhesive. When in use, epoxy resin A glue and epoxy resin B glue are mixed according to a ratio to form epoxy resin AB glue.

[0043] The present application also proposes a method for preparing a laser chip packaging material, comprising the following steps:

[0044] Epoxy resin AB glue and powder are provided according to a ratio, the powder is added into the epoxy resin AB glue, and the mixture is fully mixed to obtain the laser chip packaging material.

[0045] By adopting the above technical solution, the powder can be more fully dispersed in the epoxy resin AB glue to form a more uniform slurry system, that is, to form a laser chip packaging material, and the laser chip packaging material is wrapped on the laser chip by dispensing or molding (molding, also known as compression molding). After the slurry is cured, a light-transmitting layer is formed. The formed light-transmitting layer can better adjust the color and light output angle of the light, effectively improve the light output efficiency, and the laser chip can work under high power conditions, and can be better used in high pole lighting and other fields.

[0046] The present application also proposes the application of the above laser chip packaging material in the field of lighting.

[0047] The technical solution of the present application is further described in detail below in conjunction with specific embodiments and drawings. It should be understood that the following embodiments are only used to explain the present application and are not used to limit the present application.

[0048] Example 1

[0049] A method for preparing a laser chip packaging material comprises the following steps:

[0050] S10, preparing powder

[0051] 24g of hollow glass microspheres with an average particle size of 50μm and 6g of YAG:Ce with an average particle size of 15μm were mixed. 3+ The phosphor (Intermetallic YAG-04 phosphor) is mixed and stirred thoroughly to form a powder.

[0052] S20, preparation of epoxy resin AB glue

[0053] Mix epoxy resin A glue and epoxy resin B glue (JL-510AB from Polyli Adhesive) in a weight ratio of 1:1 and stir thoroughly to form epoxy resin AB glue.

[0054] S30, taking 14 g of the powder obtained in step S10 and 86 g of the epoxy resin AB glue obtained in step S20, and adding 14 g of the powder into 86 g of the epoxy resin AB glue, and stirring thoroughly to obtain a laser chip packaging material.

[0055] In step S10, the chemical composition of the hollow glass microspheres includes: SiO2 61wt%, Al2O3 31.5wt%, MgO 1.5wt%, Fe2O3 3.5wt%, TiO2 1.25wt%, and the remainder is Na2O and K2O, wherein wt% refers to the mass percentage; and the specific gravity of the hollow glass microspheres is 0.25g / cm 3 , with a specific surface area of ​​1.3m 2 / g, and the light diffusion rate is 85%.

[0056] Embodiments 2 to 6

[0057] Examples 2 to 4 are based on Example 1, and the difference is that in step S30, the amount of epoxy resin AB glue is kept unchanged, and the amount of powder is changed, as shown in Table 1 below.

[0058] Examples 5 to 6 are based on Example 3, and the difference is that in step S30, the amount of powder is kept unchanged, and the amount of epoxy resin AB glue is changed, as shown in Table 1 below.

[0059] Table 1 Amount of epoxy resin AB glue and powder (unit: g)

[0060]

[0061]

[0062] Embodiments 7 to 9

[0063] Embodiments 7 to 9 are based on embodiment 3, and the difference is that in step S10, the hollow glass microspheres and YAG:Ce 3+ The total mass of the phosphor remains unchanged at 30g, and the hollow glass microspheres and YAG:Ce 3+ The mass ratios of the phosphors are specifically shown in Table 2 below.

[0064] Table 2 Hollow glass microspheres and YAG:Ce 3+ Amount of phosphor used (unit: g)

[0065] Hollow glass microspheres <![CDATA[YAG:Ce 3+ Phosphor]]> Example 3 24 6 Example 7 22 8 Example 8 25 5 Example 9 26 4

[0066] Comparative Example 1

[0067] This comparative example is based on Example 1, and the difference is that in step S10, equal masses of YAG:Ce are used. 3+ The hollow glass microspheres are replaced by fluorescent powder, and the rest are the same as those in Example 1.

[0068] Performance Testing

[0069] See also Figure 1 and Figure 2 , 10 aluminum nitride substrates 1 and 10 VCSEL blue laser chips 2 are provided, a circuit structure 11 is arranged on the aluminum nitride substrate 1, and the 10 laser chips 2 are fixed on the corresponding aluminum nitride substrates, and each laser chip is electrically connected to the corresponding circuit structure to form 10 light-emitting devices, and the 10 light-emitting devices correspond to Examples 1 to 9 and Comparative Example 1.

[0070] The laser chip packaging materials prepared in Examples 1 to 9 and Comparative Example 1 are wrapped on the corresponding laser chips by dispensing. After the laser chip packaging materials are cured, a hemispherical light-transmitting layer 3 is formed to obtain a finished laser chip package, wherein the thickness of the light-transmitting layer is 0.1 mm.

[0071] The luminous flux of the finished laser chip package of Examples 1-9 and Comparative Example 1 was measured using a remote integrating sphere at a voltage of 2.4 V and a current of 1 A, and the light extraction efficiency was obtained by the luminous flux and power. The light extraction efficiency = (luminous flux / power) × 100%, wherein power = voltage × current. The test results are shown in Table 3 below.

[0072] Table 3 Luminous flux and light output efficiency

[0073] Luminous flux (lm) Light output efficiency (lm / w) Example 1 691.68 288.2 Example 2 695.04 289.6 Example 3 699.12 291.3 Example 4 701.04 292.1 Example 5 695.76 289.9 Example 6 691.92 288.3 Example 7 690.24 287.6 Example 8 697.20 290.5 Example 9 694.32 289.3 Comparative Example 1 288.00 120.0

[0074] It can be seen from Table 3 that the light output efficiency of the light sources corresponding to Examples 1 to 9 of the present application exceeds 280 lm / w, indicating that the laser chip packaging material prepared in the embodiments of the present application can better adjust the light output direction, so that the parallel light beam 21 emitted by the laser chip is more evenly distributed in multiple directions.

[0075] Examples 1 to 4 investigated the effect of the amount of powder on the light extraction efficiency. Among them, the light extraction efficiencies corresponding to Examples 3 and 4 were relatively high and close to each other. Although Example 4 had a higher light extraction efficiency than Example 3, the amount of powder used in Example 4 was relatively large compared to Example 3. Considering factors such as comprehensive cost, Example 3 was a better example. Comparative Example 1 was based on Example 1 and did not contain hollow glass microspheres, resulting in a significant decrease in light extraction efficiency.

[0076] Examples 5 to 6 are based on Example 3, and the effect of the amount of epoxy resin AB glue on the light output efficiency is investigated. If the amount of epoxy resin AB glue is too low or too high, the light output efficiency will be affected. The reasons may be: the amount of epoxy resin is too low, which is equivalent to a high concentration of powder, which can easily affect the stability of the slurry system and affect the matching effect of hollow glass microbeads and phosphors; the amount of epoxy resin is too high, which is equivalent to diluting the powder, and the powder cannot fully adjust the direction of light, affecting the light output efficiency.

[0077] Examples 7 to 9 are based on Example 3, keeping the total mass of the hollow glass microspheres and the phosphor unchanged, and investigating the effect of the mass ratio between the two on the light extraction efficiency.

[0078] The above are only preferred embodiments of the present application, and do not limit the scope of the present application. For those skilled in the art, the present application may have various changes and modifications. Any modification, equivalent replacement, improvement, etc. made within the spirit and principle of the present application shall be included in the scope of the patent protection of the present application.

Claims

1. A laser chip packaging material, characterized in that: The method comprises the following raw materials in parts by weight: 80 to 91 parts of epoxy resin AB glue and 10 to 21 parts of powder; The powder material includes hollow glass microspheres and fluorescent powder, and the weight ratio of the hollow glass microspheres to the fluorescent powder is (22-26): (4-8); The particle size of the hollow glass microspheres is 30 to 70 μm, and the particle size of the phosphor is 1 to 20 μm.

2. The laser chip packaging material according to claim 1, characterized in that: The laser chip packaging material comprises the following raw materials in parts by weight: 86 parts of epoxy resin AB glue and 17 to 21 parts of powder.

3. The laser chip packaging material according to claim 1, characterized in that: The weight ratio of the hollow glass microspheres to the phosphor is (24-25):(5-6).

4. The laser chip packaging material according to claim 1, characterized in that: The chemical composition of the hollow glass microspheres includes SiO2 and Al2O3, and the specific gravity of the hollow glass microspheres is 0.2-0.3 g / cm 3 , with a specific surface area of ​​1 to 1.5 m 2 / g.

5. The laser chip packaging material according to claim 1, characterized in that: The phosphor includes YAG:Ce 3+ Phosphor.

6. The laser chip packaging material according to claim 1, characterized in that: The epoxy resin AB glue includes epoxy resin A glue and epoxy resin B glue, and the weight ratio of the epoxy resin A glue to the epoxy resin B glue is 1: (1-1.5).

7. A method for preparing a laser chip packaging material, characterized in that: The following steps are involved: Epoxy resin AB glue and powder are provided according to a ratio, the powder is added into the epoxy resin AB glue, and the mixture is fully mixed to obtain the laser chip packaging material.

8. Use of the laser chip packaging material according to any one of claims 1 to 6 in the field of lighting.

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