Automatic electroplating additive adding device and detection system

Abstract

The invention relates to the technical field of electroplating additive quantitative adding devices, and discloses an electroplating additive automatic adding device and a detection system.The electroplating additive automatic adding device comprises an electroplating pool, a detection system, a control system and a control system, the input assembly is mounted on the outer side of the electroplating pool and used for adding an electroplating agent into the electroplating pool; and the adding assembly is used for automatically adding an electroplating agent according to the concentration of electroplating liquid in the electroplating pool and comprises a tilting rod, the tilting rod is rotationally connected to the top of the electroplating pool, one end of the tilting rod is rotationally connected with a second connecting arm, the bottom of the second connecting arm is rotationally connected with a floating ball, and the other end of the tilting rod is rotationally connected with a first connecting arm. The floating ball floats up and down according to the concentration of an electroplating agent in the electroplating tank to drive the baffle to move up and down and adjust opening and closing of an outlet of the water inlet pipe, so that automatic adding of the electroplating agent is achieved, manual intervention is not needed, the working efficiency is greatly improved, and the stability of the adding amount can be ensured.

Description

Technical Field

[0001] The invention relates to the technical field of electroplating agent quantitative adding devices, in particular to an electroplating additive automatic adding device and a detection system. Background Art

[0002] During electroplating, the plating metal or other insoluble material acts as the anode, and the workpiece to be plated acts as the cathode. The cations of the plating metal are reduced on the surface of the workpiece to form a plating layer. The purpose of electroplating is to plate a metal coating on the substrate to change the surface properties or dimensions of the substrate.

[0003] The existing method of adding electroplating agents is to add them manually by the operator. When adding, the operator needs to manually control the amount of addition, which is time-consuming and laborious. At the same time, during the adding process, the agents are not mixed evenly inside the electroplating tank, which affects the electroplating effect. Summary of the invention

[0004] In view of the deficiencies in the prior art, the present invention provides an automatic electroplating additive adding device and a detection system to solve the problem that electroplating agents are currently often added manually, which cannot guarantee the accuracy of addition and is time-consuming.

[0005] To achieve the above objectives, the present invention is implemented through the following technical solutions: an automatic electroplating additive adding device and detection system, comprising:

[0006] Electroplating tank, storing electroplating solution, used for electroplating operation;

[0007] An input component, which is installed outside the electroplating tank and is used to add electroplating agent into the electroplating tank;

[0008] An adding component, used for automatically adding electroplating agent according to the concentration of electroplating solution in the electroplating pool, comprising a tilting rod, the tilting rod is rotatably connected to the top of the electroplating pool, one end of the tilting rod is rotatably connected to a connecting arm 2, the bottom of the connecting arm 2 is rotatably connected to a floating ball, the other end of the tilting rod is rotatably connected to a connecting arm 1, the top of the connecting arm 1 is rotatably connected to a movable rod, the top of the movable rod is fixedly connected to a baffle, and the baffle is used to open and close the input port of the input component;

[0009] A stirring component is installed on the inner wall of the electroplating tank and is used to mix the added electroplating agent with the electroplating solution inside the electroplating tank.

[0010] Preferably, the input component includes a downpipe, which is installed on the outside of the electroplating pool and communicated with the inside of the electroplating pool. A water inlet hopper is fixedly connected to the top of the downpipe, a water inlet pipe is fixedly connected to one side of the top of the water inlet hopper, and the baffle is fitted with the output end of the water inlet pipe.

[0011] Preferably, a second positioning hoop is fixedly connected to the outside of the water inlet bucket, the movable rod is slidably connected to the middle of the second positioning hoop, a first positioning hoop is fixedly connected to the inside of the electroplating pool, and the float is slidably connected to the middle of the first positioning hoop.

[0012] Preferably, the stirring assembly includes two stirring blades, both of which are rotatably connected to the inner side of the electroplating pool, the ends of the stirring blades pass through the side wall of the electroplating pool and are fixedly connected to gears, the two gears are meshed with each other, and a guard plate is fixedly connected to the outer side of the electroplating pool, and the gear is located in the middle of the guard plate.

[0013] Preferably, a motor is fixedly connected to the outside of the electroplating cell, one of the stirring blades is fixedly connected to the output end of the motor, and a controller is fixedly connected to the outside of the electroplating cell, and the controller is electrically connected to the motor.

[0014] Preferably, a partition net is fixedly connected to the inner side of the electroplating pool, and the float is placed in a space formed by the partition net and the side wall of the electroplating pool.

[0015] An automatic detection system for electroplating additives, comprising:

[0016] A detection component, installed inside the electroplating tank, used to detect the concentration of the plating agent in the electroplating solution;

[0017] An intervention component is used to assist in adjusting the adding component to add the plating agent into the plating tank according to the detected concentration of the plating agent;

[0018] An alarm will sound when the concentration of the plating agent in the plating solution exceeds the set range;

[0019] A recorder is used to record the changes in the concentration of the plating agent in the plating solution.

[0020] Preferably, the detection component comprises:

[0021] Electrochemical sensor 1, installed inside the electroplating cell, displays the change of the concentration of the electroplating solution inside the electroplating cell through the change of current, potential or resistance;

[0022] Electrochemical sensor 2 is installed inside the sewer pipe and displays the concentration of the added plating solution through changes in current, potential or resistance.

[0023] Preferably, the controller drives the intervention component to adjust the adding speed and the adding amount of the adding component according to the changing range of the electroplating agent concentration requirement.

[0024] Preferably, the alarm emits an alarm by means of sound or light to remind operators to pay attention to abnormal changes in the concentration of the plating agent in the plating solution.

[0025] Working principle: Before use, connect the water inlet pipe to the external liquid supply pipe, then install the downpipe on the outside of the electroplating tank, and place the float inside the electroplating tank. During the electroplating operation, the concentration of the electroplating solution inside the electroplating tank continues to decrease, which will cause the liquid density to decrease. At this time, the buoyancy of the float is less than the gravity, which will cause the float to sink. At this time, the connecting arm 2 can drive the tilting rod to rotate, and then lift the connecting arm 1 and the movable rod upward, so as to separate the baffle from the outlet end of the water inlet pipe. At this time, the electroplating solution inside the water inlet pipe can flow into the water inlet bucket, and then flow smoothly into the electroplating tank through the downpipe, and mix with the liquid inside the electroplating tank, so as to complete the addition of the electroplating solution.

[0026] When the electroplating liquid flows from the drain pipe to the inside of the electroplating tank, the driving motor works to drive one of the stirring blades to rotate, and then the two stirring blades rotate in opposite directions under the action of the two gears, so that the electroplating liquid can be mixed with the liquid inside the electroplating tank to ensure the electroplating effect;

[0027] Electrochemical sensor 1 and electrochemical sensor 2 respectively detect the concentration of the plating solution in the plating pool and the concentration of the plating agent input into the sewer pipe. When it is necessary to add the plating agent and the baffle is open, but the amount of plating agent flowing into the sewer pipe is insufficient to adjust the concentration of the plating solution in the plating pool to an appropriate range, electrochemical sensor 1 and electrochemical sensor 2 transmit signals to the controller to drive the alarm to remind that the capacity of the supplementary plating agent is insufficient. At the same time, when it is necessary to adjust the concentration range of the plating solution in the plating pool without changing the float model, the concentration range set in the controller is adjusted. After the concentration reaches the set range, the intervention component actively drives the addition component to add the plating agent.

[0028] The present invention provides an automatic electroplating additive adding device and a detection system, which have the following beneficial effects:

[0029] 1. The present invention uses a float to float up and down according to the concentration of the electroplating agent inside the electroplating pool, so as to drive the baffle to move up and down and adjust the opening and closing of the water inlet pipe outlet, thereby realizing automatic addition of the electroplating agent without manual intervention, greatly improving work efficiency, and ensuring the stability of the added amount.

[0030] 2. The present invention stirs the added electroplating agent by means of a stirring component to accelerate the mixing of the electroplating agent and the electroplating solution inside the electroplating cell, thereby improving the uniformity of the mixing.

[0031] 3. The present invention automatically intervenes to control the liquid output when the concentration needs to be changed through the intervention of the control component and the intervention component. BRIEF DESCRIPTION OF THE DRAWINGS

[0032] Figure 1 A perspective view of the present invention;

[0033] Figure 2 It is a structural schematic diagram of the tilting lever of the present invention;

[0034] Figure 3 is a schematic diagram of a stirring assembly in the present invention;

[0035] Figure 4 It is an overall schematic diagram of the automatic detection system of the present invention;

[0036] Figure 5 It is a schematic diagram of the automatic liquid adding part in the automatic detection system of the present invention;

[0037] Figure 6 It is an overall schematic diagram of the operation in the automatic detection system of the present invention;

[0038] Figure 7 It is a schematic diagram of the components of the detection assembly in the automatic detection system of the present invention.

[0039] Among them, 1. electroplating tank; 2. sewer pipe; 3. water inlet bucket; 4. water inlet pipe; 5. lifting rod; 6. connecting arm 1; 7. movable rod; 8. baffle; 9. connecting arm 2; 10. float; 11. positioning hoop 1; 12. positioning hoop 2; 13. partition net; 14. controller; 15. motor; 16. stirring blade; 17. gear; 18. guard plate. DETAILED DESCRIPTION

[0040] The following will be combined with the drawings in the specification of the present invention to clearly and completely describe the technical solutions in the embodiments of the present invention. Obviously, the described embodiments are only part of the embodiments of the present invention, not all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the present invention.

[0041] Example:

[0042] Please refer to the attached Figure 1 -Attached Figure 3 , the embodiment of the present invention provides an automatic electroplating additive adding device and detection system, including an electroplating cell 1, storing an electroplating solution, for performing an electroplating operation;

[0043] An input component is installed outside the electroplating tank 1 and is used to add the electroplating agent into the electroplating tank 1. The input component includes a downpipe 2, which is installed outside the electroplating tank 1 and communicates with the inside of the electroplating tank 1. A water inlet hopper 3 is fixedly connected to the top of the downpipe 2, and a water inlet pipe 4 is fixedly connected to one side of the top of the water inlet hopper 3.

[0044] An adding component is used to automatically add plating agent according to the concentration of the plating solution inside the plating pool 1, including a tilting rod 5, the tilting rod 5 is rotatably connected to the top of the plating pool 1, one end of the tilting rod 5 is rotatably connected to a connecting arm 2 9, and the bottom of the connecting arm 2 9 is rotatably connected to a float 10. When the electroplating operation is performed, the concentration of the plating solution inside the plating pool 1 continues to decrease, which will cause the liquid density to decrease. At this time, the buoyancy of the float 10 is less than the gravity, which will cause the float 10 to sink, and the connecting arm 2 9 can be pulled downward to lift the other side of the tilting rod 5. The other end of the tilting rod 5 is rotatably connected to a connecting arm 6, and the top of the connecting arm 6 is rotatably connected to a movable rod 7, and the top of the movable rod 7 is fixedly connected to a baffle 8, which is used to open and close the input port of the input component. The baffle 8 fits with the output end of the water inlet pipe 4. The tilting rod 5 rotates to lift the connecting arm 6 and the movable rod 7 upward, so that the baffle 8 is separated from the outlet section of the water inlet pipe 4. At this time, the electroplating solution in the water inlet pipe 4 can flow into the water inlet bucket 3, and then smoothly flow into the electroplating tank 1 through the downpipe 2, and mix with the liquid in the electroplating tank 1, so as to complete the addition of the electroplating solution;

[0045] A stirring assembly is installed on the inner wall of the electroplating tank 1, and is used to mix the added electroplating agent with the electroplating liquid inside the electroplating tank 1. The stirring assembly includes two stirring blades 16, and the two stirring blades 16 are both rotatably connected to the inner side of the electroplating tank 1. The ends of the stirring blades 16 penetrate the side wall of the electroplating tank 1 and are fixedly connected to a gear 17. The two gears 17 are meshed with each other. When the electroplating liquid flows from the sewer pipe 2 to the inside of the electroplating tank 1, one of the stirring blades 16 can be impacted, and the two stirring blades 16 are rotated in the opposite direction under the action of the two gears 17, so that the electroplating liquid can be mixed with the electroplating liquid inside the electroplating tank 1, so as to ensure the electroplating effect. A guard plate 18 is fixedly connected to the outside of the electroplating tank 1, and the gear 17 is located in the middle of the guard plate 18. The guard plate 18 is used to cover the gear 17. A motor 15 is fixedly connected to the outside of the electroplating pool 1, and one of the stirring blades 16 is fixedly connected to the output end of the motor 15. A controller 14 is fixedly connected to the outside of the electroplating pool 1, and the controller 14 is electrically connected to the motor 15. After adding the motor 15, one of the stirring blades 16 can be driven to rotate directly by driving the motor 15, thereby further improving the mixing effect.

[0046] Please refer to the attached Figure 1 -Attached Figure 3 The outer side of the water inlet hopper 3 is fixedly connected with a second positioning hoop 12, the movable rod 7 is slidably connected to the middle of the second positioning hoop 12, the inner side of the electroplating tank 1 is fixedly connected with a first positioning hoop 11, and the floating ball 10 is slidably connected to the middle of the first positioning hoop 11. The movable rod 7 and the floating ball 10 are positioned by the second positioning hoop 12 and the first positioning hoop 11, respectively, to ensure the stability of the movement of the movable rod 7 and the floating ball 10.

[0047] A screen 13 is fixedly connected to the inside of the electroplating tank 1, and the float 10 is placed in the space formed by the screen 13 and the side wall of the electroplating tank 1. The screen 13 is used to block the waves generated during the use of the electroplating solution to prevent the waves from affecting the normal operation of the float 10.

[0048] Please refer to the attached Figure 4 -Attached Figure 7 As part of the present invention, the present invention also provides an automatic detection system for electroplating additives, comprising:

[0049] The detection component is installed inside the electroplating tank 1 and is used to detect the concentration of the electroplating agent in the electroplating solution. The detection component includes:

[0050] Electrochemical sensor 1, installed inside the electroplating cell 1, displays the change of the concentration of the electroplating solution inside the electroplating cell 1 through the change of current, potential or resistance;

[0051] Electrochemical sensor 2 is installed inside the sewer pipe 2 and displays the concentration of the added plating solution through changes in current, potential or resistance. When plating agent needs to be added and the baffle 8 has been opened, but the amount of plating agent flowing into the sewer pipe 2 is not enough to adjust the concentration of the plating solution in the plating pool 1 to an appropriate range, electrochemical sensor 1 and electrochemical sensor 2 transmit signals to the controller 14.

[0052] The intervention component assists in adjusting the adding component to add the plating agent to the inside of the plating tank 1 according to the detected concentration of the plating agent; the controller 14 drives the intervention component to work to adjust the adding speed and amount of the adding component according to the change range of the required concentration of the plating agent. When it is necessary to adjust the concentration range of the plating solution in the plating tank 1 without changing the float model, at this time, by adjusting the concentration range set in the controller 14, after the concentration reaches the set range, the intervention component actively drives the adding component to work to add the plating agent.

[0053] The alarm sounds an alarm when the concentration of the plating agent in the plating solution exceeds the set range. The alarm sounds an alarm through sound and light to remind the operator to pay attention to abnormal changes in the concentration of the plating agent in the plating solution. When the amount of plating agent flowing into the sewer pipe 2 is not enough to adjust the concentration of the plating solution in the plating pool 1 to a suitable range, the controller 14 drives the alarm to work to remind the operator that the capacity of the supplementary plating agent is insufficient.

[0054] The recorder records the changes in the concentration of the plating agent in the plating solution. It is used to record the changes in the concentration of the plating solution per unit time to obtain the plating agent loss data for better automatic addition.

[0055] Although embodiments of the present invention have been shown and described, it will be appreciated by those skilled in the art that various changes, modifications, substitutions and variations may be made to the embodiments without departing from the principles and spirit of the present invention, and that the scope of the present invention is defined by the appended claims and their equivalents.

Claims

1. An automatic electroplating additive adding device, characterized in that: include: An electroplating tank (1) stores electroplating solution for electroplating operations; An input component, which is installed outside the electroplating tank (1) and is used to add electroplating agent into the electroplating tank (1); An adding component, used for automatically adding electroplating agent according to the concentration of electroplating solution inside an electroplating tank (1), comprises a tilting rod (5), the tilting rod (5) is rotatably connected to the top of the electroplating tank (1), one end of the tilting rod (5) is rotatably connected to a connecting arm 2 (9), the bottom of the connecting arm 2 (9) is rotatably connected to a floating ball (10), the other end of the tilting rod (5) is rotatably connected to a connecting arm 1 (6), the top of the connecting arm 1 (6) is rotatably connected to a movable rod (7), the top of the movable rod (7) is fixedly connected to a baffle (8), and the baffle (8) is used to open and close the input port of the input component; A stirring component is installed on the inner wall of the electroplating tank (1) and is used to mix the added electroplating agent with the electroplating liquid inside the electroplating tank (1).

2. The automatic electroplating additive adding device according to claim 1, characterized in that: The input component comprises a downpipe (2), the downpipe (2) being installed on the outside of the electroplating tank (1) and being connected to the inside of the electroplating tank (1), the top of the downpipe (2) being fixedly connected to a water inlet hopper (3), the top side of the water inlet hopper (3) being fixedly connected to a water inlet pipe (4), and the baffle (8) being fitted with the output end of the water inlet pipe (4).

3. The automatic electroplating additive adding device according to claim 2, characterized in that: The outer side of the water inlet bucket (3) is fixedly connected with a second positioning hoop (12), the movable rod (7) is slidably connected to the middle of the second positioning hoop (12), the inner side of the electroplating pool (1) is fixedly connected with a first positioning hoop (11), and the float (10) is slidably connected to the middle of the first positioning hoop (11).

4. The automatic electroplating additive adding device according to claim 1, characterized in that: The stirring assembly comprises two stirring blades (16), both of which are rotatably connected to the inner side of the electroplating tank (1), the ends of the stirring blades (16) pass through the side wall of the electroplating tank (1) and are fixedly connected to a gear (17), the two gears (17) are meshed with each other, and a guard plate (18) is fixedly connected to the outer side of the electroplating tank (1), and the gear (17) is located in the middle of the guard plate (18).

5. The automatic electroplating additive adding device according to claim 4, characterized in that: A motor (15) is fixedly connected to the outside of the electroplating cell (1), one of the stirring blades (16) is fixedly connected to the output end of the motor (15), and a controller (14) is fixedly connected to the outside of the electroplating cell (1), and the controller (14) is electrically connected to the motor (15).

6. The automatic electroplating additive adding device according to claim 1, characterized in that: A partition net (13) is fixedly connected to the inner side of the electroplating pool (1), and the float ball (10) is placed in a space formed by the partition net (13) and the side wall of the electroplating pool (1).

7. An automatic detection system for electroplating additives, characterized in that: Using the automatic electroplating additive adding device according to any one of claims 1 to 6, include, A detection component installed inside the electroplating tank (1) and used to detect the concentration of the electroplating agent in the electroplating solution; An intervention component is used to assist in adjusting the addition component to add the electroplating agent to the inside of the electroplating tank (1) according to the detected electroplating agent concentration; An alarm will sound when the concentration of the plating agent in the plating solution exceeds the set range; A recorder is used to record the changes in the concentration of the plating agent in the plating solution.

8. The automatic detection system for electroplating additives according to claim 7, characterized in that: The detection component comprises: An electrochemical sensor 1 is installed inside the electroplating cell (1) and displays changes in the concentration of the electroplating solution inside the electroplating cell (1) through changes in current, potential or resistance; The second electrochemical sensor is installed inside the sewer pipe (2) and displays the concentration of the added electroplating solution through changes in current, potential or resistance.

9. The automatic detection system for electroplating additives according to claim 7, characterized in that: The controller (14) drives the intervention component to adjust the adding speed and adding amount of the adding component according to the changing range of the electroplating agent concentration requirement.

10. The automatic detection system for electroplating additives according to claim 7, characterized in that: The alarm device sends out an alarm by means of sound or light to remind operators to pay attention to abnormal changes in the concentration of the plating agent in the plating solution.

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