Ejection driver and device based on shape memory alloy and control method

Abstract

The invention provides a shape memory alloy-based ejection driver, a shape memory alloy-based ejection device and a shape memory alloy-based ejection control method, the shape memory alloy-based ejection driver comprises a rigid body and a bent beam, and two ends of the bent beam are fixedly mounted on the rigid body, so that the bent beam forms a convex structure; the bent beam is made of a shape memory alloy material, and the bent beam is switched from a first state to a second state under the action of temperature; in the first state, the protruding structure of the bent beam protrudes downwards, and in the second state, the protruding structure of the bent beam protrudes upwards. The ejection driver is simple in structure, easy to miniaturize and light and good in ejection effect.

Description

Technical Field

[0001] The present application relates to the field of drive technology, and in particular to a shape memory alloy-based ejection drive, device and control method. Background Art

[0002] With the continuous development of science and technology, the demand for miniaturized, fast, efficient and high-load-capable autonomous drive systems is increasing. For example, the high-speed movement of micro-robots requires the actuator to be lightweight, fast-response, large-force output and high-energy storage. This new demand has promoted the exploration of innovative drive methods for non-traditional drives. Among them, the new actuator with bistable structure design has attracted widespread attention.

[0003] The existing bistable drive device needs to be pressed by external force and relies on the elastic deformation of highly elastic materials to quickly complete the drive. However, highly elastic materials are mainly polymer materials and metal materials. Although polymer materials have large elastic strain, their modulus and strength are low. Metal materials have high elastic modulus, but their elastic strain limit is small, which limits the elastic energy storage capacity of the drive device, resulting in poor ejection effect of the existing drive device. Summary of the invention

[0004] The present application provides an ejection driver, device and control method based on shape memory alloy, which effectively improves the ejection effect.

[0005] In a first aspect, the present application provides a catapult driver, comprising: a rigid body and a bending beam,

[0006] Both ends of the curved beam are fixedly mounted to the rigid body so that the curved beam forms a convex structure;

[0007] The bending beam is made of shape memory alloy material, and the bending beam switches from a first state to a second state under the action of temperature; in the first state, the convex structure of the bending beam convexes downward, and in the second state, the convex structure of the bending beam convexes upward.

[0008] In an optional implementation, the rigid body includes: a bearing portion and a pressing portion;

[0009] The bearing portion is provided with a groove, and the two ends of the bending beam are respectively fixedly connected to the side walls on both sides of the groove;

[0010] The pressing portion has a protrusion protruding downward.

[0011] In an optional implementation, the protrusion includes a mounting groove, and the protruding structure of the curved beam is embedded in the mounting groove.

[0012] In an optional implementation, the method includes: in a first state, the pressing portion and the bearing portion are in contact with each other; and in a second state, the pressing portion and the bearing portion are separated.

[0013] In an optional implementation, t is the thickness of the bending beam, l is the horizontal length of the bending beam, and h is the vertical length of the bending beam; the ejection drive further includes:

[0014] When 0.075≤h / l<0.125, 0.01≤t / l<0.05;

[0015] When 0.125≤h / l<0.175, 0.03≤t / l<0.07;

[0016] When 0.175≤h / l<0.225, 0.05≤t / l<0.09;

[0017] When 0.225≤h / l<0.275, 0.07≤t / l<0.11;

[0018] When 0.275≤h / l≤0.325, 0.11≤t / l≤0.13.

[0019] In an optional embodiment, the shape memory alloy is a nickel-titanium shape memory alloy.

[0020] In an optional implementation, the rigid body is a metal rigid body.

[0021] In a second aspect, the present application provides an ejection device, comprising: an ejection driver and a temperature adjustment component;

[0022] The rigid body of the ejection drive is a heat-conducting rigid body, and the temperature regulating component is fitted and fixed on the surface of the rigid body.

[0023] In a third aspect, the present application provides a method for controlling an ejection, which is applied to the ejection device of the second aspect, comprising:

[0024] receiving a control instruction, the control instruction being used to instruct to drive or not drive the ejection device;

[0025] If the control instruction indicates to drive the ejection device, the temperature adjustment component is controlled to adjust the temperature until the temperature reaches the phase change temperature of the bending beam of the ejection drive;

[0026] If the control command indicates not to drive the ejection device, the temperature of the bending beam of the ejection actuator is maintained at a temperature outside the phase change temperature.

[0027] In a fourth aspect, the present application provides a launch control device, comprising:

[0028] A receiving module, used for receiving a control instruction, wherein the control instruction is used for instructing to drive or not drive the ejection device;

[0029] A control module, for controlling the temperature regulating component to adjust the temperature until the temperature reaches the phase change temperature of the bending beam of the ejection drive if the control instruction indicates to drive the ejection device;

[0030] If the control command indicates not to drive the ejection device, the temperature of the bending beam of the ejection actuator is maintained at a temperature outside the phase change temperature.

[0031] The present application provides an ejection drive, device and control method based on shape memory alloy, wherein the ejection drive comprises: a rigid body and a bending beam, wherein both ends of the bending beam are fixedly mounted on the rigid body so that the bending beam forms a convex structure; the bending beam is made of shape memory alloy material, and the bending beam switches from a first state to a second state under the action of temperature; in the first state, the convex structure of the bending beam convexes downward, and in the second state, the convex structure of the bending beam convexes upward. That is to say, in the scheme of this example, since the bending beam is made of shape memory alloy material, under the action of temperature, the convex structure of the bending beam is converted from a downward convex state to an upward convex state, and in this state conversion process, the ejection drive has high output power, can quickly output a large force and displacement, realizes ejection drive, has a simple structure, is easy to miniaturize and lighten, and has a good ejection effect. BRIEF DESCRIPTION OF THE DRAWINGS

[0032] The accompanying drawings, which are incorporated in and constitute a part of this specification, illustrate embodiments consistent with the present application and, together with the description, serve to explain the principles of the present application.

[0033] Figure 1A is a structural example diagram of an exemplary ejection drive;

[0034] Figure 1B is a structural example diagram of an exemplary ejection drive;

[0035] Figure 2 is an example diagram of structural parameters of a curved beam;

[0036] Figure 3 is a structural example diagram of an exemplary ejection device;

[0037] Figure 4 is a flowchart of an exemplary ejection control method;

[0038] Figure 5 This is an example diagram of an application scenario;

[0039] Figure 6 is a structural diagram of an exemplary ejection control device;

[0040] Figure 7 The figure is a structural example diagram of an exemplary electronic device.

[0041] The above drawings have shown clear embodiments of the present application, which will be described in more detail later. These drawings and text descriptions are not intended to limit the scope of the present application in any way, but to illustrate the concept of the present application to those skilled in the art by referring to specific embodiments. DETAILED DESCRIPTION

[0042] Exemplary embodiments will be described in detail herein, examples of which are shown in the accompanying drawings. When the following description refers to the drawings, the same numbers in different drawings represent the same or similar elements unless otherwise indicated. The implementations described in the following exemplary embodiments do not represent all implementations consistent with the present application. Instead, they are merely examples of devices and methods consistent with some aspects of the present application as detailed in the appended claims.

[0043] It should be noted that the brief description of the terms in this application is only for the convenience of understanding the embodiments described below, and is not intended to limit the embodiments of the present application. Unless otherwise specified, these terms should be understood according to their common and usual meanings. The terms "including" and "having" in the specification and claims and the above-mentioned drawings in this application and any variation thereof are intended to cover but not exclude inclusion. For example, a product or device containing a series of components is not necessarily limited to those components clearly listed, but may include other components that are not clearly listed or inherent to these products or devices. The term "module" used in this application refers to any known or later developed hardware, software, firmware, artificial intelligence, fuzzy logic or a combination of hardware and / or software code that can perform functions related to the element.

[0044] With the continuous development of science and technology, the demand for miniaturized, fast, efficient and high-load-capable autonomous drive systems is increasing. For example, the high-speed movement of micro-robots requires the actuator to be lightweight, fast-response, large-force output and high-energy storage. This new demand has promoted the exploration of innovative drive methods for non-traditional drives. Among them, the new actuator with bistable structure design has attracted widespread attention.

[0045] The existing bistable drive device needs to be pressed by external force and relies on the elastic deformation of highly elastic materials to quickly complete the drive. However, highly elastic materials are mainly polymer materials and metal materials. Although polymer materials have large elastic strain, their modulus and strength are low. Metal materials have high elastic modulus, but their elastic strain limit is small, which limits the elastic energy storage capacity of the drive device, resulting in poor ejection effect of the existing drive device.

[0046] In order to solve the above technical problems, the present application provides an ejection driver, device and control method based on shape memory alloy, the ejection driver comprises: a rigid body and a bending beam, the two ends of the bending beam are fixedly mounted on the rigid body, so that the bending beam forms a convex structure; the bending beam is made of shape memory alloy material, and the bending beam switches from a first state to a second state under the action of temperature; in the first state, the convex structure of the bending beam convexes downward, and in the second state, the convex structure of the bending beam convexes upward. In other words, since the bending beam is made of shape memory alloy material, under the action of temperature, the convex structure of the bending beam is converted from a downward convex state to an upward convex state. In this state conversion process, the ejection driver has high output power, can quickly output a large force and displacement, realize ejection drive, has a simple structure, is easy to miniaturize and lighten, and effectively improves the ejection effect.

[0047] The technical solutions of the present application and the technical solutions of the present application are described in detail with specific embodiments below. The following specific embodiments can be combined with each other, and the same or similar concepts or processes may not be repeated in some embodiments. In the description of the present application, unless otherwise clearly specified and limited, each term should be understood in a broad sense in the art. The embodiments of the present application will be described below in conjunction with the accompanying drawings.

[0048] Embodiment 1

[0049] Figure 1A FIG. 1 is a structural example diagram of an exemplary ejection drive, such as Figure 1A As shown, the ejection drive 1 comprises: a rigid body 11 and a bending beam 12,

[0050] Both ends of the curved beam 12 are fixedly mounted to the rigid body 11 so that the curved beam 12 forms a convex structure;

[0051] The bending beam 12 is made of shape memory alloy material, and the bending beam 12 switches from a first state to a second state under the action of temperature; in the first state, the protruding structure of the bending beam 12 protrudes downward, and in the second state, the protruding structure of the bending beam 12 protrudes upward.

[0052] In this example, the ejection drive 1 includes: a rigid body 11 and a curved beam 12, both ends of the curved beam 12 are fixedly mounted on the rigid body 11 to form a protruding structure, and the protruding structure of the curved beam 12 includes two states: an upwardly protruding state and a downwardly protruding state. For example, in the first state, the protruding structure of the curved beam 12 protrudes downward, and in the second state, the protruding structure of the curved beam 12 protrudes upward.

[0053] Shape memory alloy is an alloy material with shape memory effect. After deformation below As (starting temperature of martensitic reverse phase transformation), residual strain will be generated. When heated to above Af (ending temperature of martensitic reverse phase transformation), shape recovery will occur, the residual strain will be eliminated, and the recovery strain can reach 8% (much higher than traditional metal materials), outputting force and displacement, which is called shape memory effect.

[0054] The bending beam 12 in this example is made of shape memory alloy material, so due to the shape memory effect, the bending beam 12 can deform with the change of temperature. For example, the bending beam 12 switches from the first state to the second state under the action of temperature, outputs a large force and displacement, and completes the ejection drive. Therefore, the ejection drive 1 in this example has a simple structure and does not require external force. It can complete the ejection drive under the excitation of temperature. The ejection drive 1 can not only eject itself to a certain height, but also eject and drive heavy objects. The weight of the ejection-driven heavy object is greater than 1000 times the weight of the bending beam 12 itself, and the ejection effect is good.

[0055] As an example, the shape memory alloy is a nickel-titanium shape memory alloy.

[0056] In this example, the shape memory alloy can be a copper-based shape memory alloy, an iron-based shape memory alloy, a nickel-titanium-based shape memory alloy, etc. The present application does not specifically limit the type of shape memory alloy material. Exemplarily, the shape memory alloy is a nickel-titanium shape memory alloy, wherein the mass percentage of nickel is 50% to 50.8%. Due to the high nickel content of the shape memory alloy, the bending beam can be repeatedly deformed during the heating and cooling cycle, rather than being limited to a single shape change, which is beneficial to improving the ejection drive effect.

[0057] As an example, Figure 1A As shown, the rigid body 11 includes: a bearing portion 112 and a pressing portion 111;

[0058] The bearing portion 112 is provided with a groove, and both ends of the bending beam 12 are fixedly connected to the side walls on both sides of the groove;

[0059] The pressing portion 111 has a protrusion that protrudes downward.

[0060] In this example, the rigid body 11 includes a bearing portion 112 and a pressing portion 111. The bearing portion 112 is a concave structure with a groove. The two ends of the curved beam 12 are respectively fixedly connected to the side walls on both sides of the groove. The fixed connection method can be welding, bonding, etc., which is not specifically limited in this application. The pressing portion 111 is a "T"-shaped structure with a protruding portion protruding downward. The protruding structure of the curved beam 12 is fixedly connected to the protruding portion of the rigid body 11.

[0061] As an example, the length of the groove is smaller than the length of the bending beam 12 in the straightened state, the width of the groove is consistent with the width of the bending beam 12, and the depth of the groove is the same as the height of the protrusion.

[0062] In this example, Figure 1A As shown, the length of the groove is less than the length of the curved beam 12 in the straight state, the width of the groove is consistent with the width of the curved beam 12, and the depth of the groove is the same as the height of the protrusion. t is the thickness of the curved beam 12, l is the horizontal length of the curved beam 12, and h is the vertical height of the curved beam 12. The curved beam 12 needs to meet a certain range of structural parameters. For example, Figure 2 This is an example diagram of the structural parameters of a curved beam. Figure 2 As shown, when the structural parameters are too small or too large, the bending beam 12 cannot be ejected. The structural parameter range in which the bending beam 12 can be ejected includes:

[0063] When 0.075≤h / l<0.125, 0.01≤t / l<0.05;

[0064] When 0.125≤h / l<0.175, 0.03≤t / l<0.07;

[0065] When 0.175≤h / l<0.225, 0.05≤t / l<0.09;

[0066] When 0.225≤h / l<0.275, 0.07≤t / l<0.11;

[0067] When 0.275≤h / l≤0.325, 0.11≤t / l≤0.13.

[0068] When the structural parameters of the bending beam 12 are too small, the shape of the bending beam 12 changes very slowly under the effect of temperature, and it is difficult to output a large force and displacement. Therefore, the ejection drive of the ejection drive 1 is slow, and it is difficult to achieve a good ejection drive effect.

[0069] When the structural parameters of the bending beam 12 are too large, the bending beam 12 is prone to failure and fracture during the shape change process, so the ejection drive cannot be achieved.

[0070] Exemplarily, when the thickness t of the bending beam 12 is 0.4 mm, the vertical height h of the bending beam 12 is 1 mm, and the horizontal length l of the bending beam 12 is 4.5 mm, the ejection drive switches from the first state to the second state under the action of temperature, and the ejection height itself is 170 mm; when ejecting a weight of 200 g, the ejection height of the weight that can be achieved is 16 mm.

[0071] Therefore, the structural parameters of the bending beam 12 in this example are set within the ejection parameter range. The bending beam 12 switches from the first state to the second state under the action of temperature, outputs a larger force and displacement, can realize ejection drive, and has a high ejection height and a good ejection effect.

[0072] As an example, Figure 1A As shown, the protrusion has a mounting groove, and the convex structure of the bending beam 12 is embedded in the mounting groove.

[0073] In this example, the protrusion has a mounting groove, and the protruding structure of the curved beam 12 is fixedly connected to the rigid body 11 by being embedded in the mounting groove. In addition, the protruding structure of the curved beam 12 can also be fixedly connected by bonding, welding, etc., which is not specifically limited in this application. It should be noted that the structures such as the curved beam 12, the rigid body 11 and the ejection drive 1 in this example can also be manufactured by 3D printing.

[0074] As an example, Figure 1B FIG. 1 is a structural example diagram of an exemplary ejection drive, such as Figure 1A and Figure 1B As shown, in the first state, the pressing portion 111 and the carrying portion 112 are in contact with each other; in the second state, the pressing portion 111 and the carrying portion 112 are separated.

[0075] In the ejection drive 1 of this example, in a first state, the pressing portion 111 and the bearing portion 112 of the rigid body 11 are in contact with each other, and the protruding structure of the bending beam 12 protrudes downward. In a second state, the protruding structure of the bending beam 12 protrudes upward, and the pressing portion 111 and the bearing portion 112 are separated.

[0076] In practical applications, the ejection drive 1 of this example can be switched from the first state to the second state, or from the second state to the first state. For example, the initial state of the ejection drive 1 is the second state. When the pressing portion 111 of the rigid body 11 is subjected to external pressure, the pressing portion 111 and the bearing portion 112 fit together, and the protruding structure of the curved beam 12 protrudes downward. At this time, the ejection drive 1 is switched from the second state to the first state. Then, the ambient room temperature of the environment where the ejection drive 1 is located is gradually increased by heating, and the curved beam 12 returns to its original shape as the temperature increases. At this time, the ejection drive 1 is switched from the first state to the second state. During the state conversion process from the first state to the second state, the ejection drive 1 of this example can quickly output a large force and displacement to achieve a good ejection effect.

[0077] It should be noted that, in the above examples, the types of shape memory alloy materials are different, and accordingly, the temperature control range is also different, and this application does not impose any limitation on this.

[0078] As an example, the rigid body 11 is a metal rigid body 11 .

[0079] In this example, the rigid body 11 can be any metal material, including but not limited to: stainless steel, titanium alloy, aluminum alloy, nickel-titanium alloy, etc. For example, considering the mechanism of the shape memory alloy material used by the bending beam 12 being affected by temperature, in order to improve the sensitivity of the bending beam 12 to temperature perception, the rigid body 11 can be made of a metal material with good thermal conductivity, so that the bending beam 12 can sense the temperature change faster and achieve a good ejection effect.

[0080] In the ejection drive 1 of this example, both ends of the bending beam 12 are fixedly mounted on the rigid body 11, so that the bending beam 12 forms a convex structure; the bending beam 12 is made of shape memory alloy material, and the bending beam 12 switches from a first state to a second state under the action of temperature; in the first state, the convex structure of the bending beam 12 convexes downward, and in the second state, the convex structure of the bending beam 12 convexes upward. That is to say, in the scheme of this example, since the bending beam 12 is made of shape memory alloy material, under the action of temperature, the convex structure of the bending beam 12 is converted from a downward convex state to an upward convex state. In this state conversion process, the ejection drive 1 has high output power, can quickly output a large force and displacement, and achieve a good ejection effect, and has a simple structure, which is easy to miniaturize and lighten.

[0081] Embodiment 2

[0082] Figure 3 FIG. 1 is a structural diagram of an exemplary ejection device, as shown in FIG. Figure 3 As shown, the device comprises: an ejection drive 1 and a temperature adjustment component 2;

[0083] The rigid body 11 of the ejection driver 1 is a heat-conducting rigid body 11 , and the temperature adjustment component 2 is attached and fixed on the surface of the rigid body 11 .

[0084] In this example, the ejection device includes an ejection drive 1 and a temperature control component 2, wherein the temperature control component 2 is used to adjust the temperature so that the bending beam 12 of the ejection drive 1 is deformed as the temperature changes, so that the ejection drive 1 can achieve ejection drive or not achieve ejection drive. For example, when the temperature control component is lowered to a first preset temperature, the bending beam 12 of the ejection drive 1 is deformed so that the pressing portion 111 and the bearing portion 112 of the rigid body 11 fit together, and the ejection drive 1 does not eject; when the temperature control component is heated to a second preset temperature, the bending beam 12 of the ejection drive 1 is deformed, such as restoring its original shape, so that the pressing portion 111 and the bearing portion 112 of the rigid body 11 are separated, and the ejection drive 1 is ejected. The temperature control component 2 can be a heating plate, a radiator, etc., but is not limited to this.

[0085] The temperature control component 2 and the ejection drive 1 are fixedly connected. For example, the temperature control component 2 is fixed to the surface of the steel body, such as by bonding. It can be seen that the ejection device of this example is conducive to reducing the occupied space, has a simple structure, and is easy to be miniaturized and lightweight.

[0086] In addition, in order to make the bending beam 12 more sensitive to temperature changes and thus deform with temperature changes, the rigid body 11 of the ejection drive 1 is a heat-conducting rigid body 11 so that the rigid body 11 transfers heat to the bending beam 12 .

[0087] It should be noted that the ejection drive 1 in this example can quickly complete the ejection drive only when it senses that the current temperature changes to the preset temperature. Exemplarily, the ejection drive 1 quickly completes the ejection drive when it senses that the current temperature changes to the preset temperature.

[0088] The ejection device of this example includes: an ejection driver 1 and a temperature adjustment component 2, wherein the rigid body 11 of the ejection driver 1 is a heat-conducting rigid body 11, and the temperature adjustment component 2 is fixed to the surface of the rigid body 11. In the solution of this example, the temperature is adjusted by the temperature adjustment component 2, so that the bending beam 12 of the ejection driver 1 is deformed with the change of temperature, so that the ejection driver 1 can realize the ejection drive or not realize the ejection drive, the structure is simple, the space is small, and it is easy to be miniaturized and lightweight. Only the ejection driver 1 and the temperature adjustment component 2 are needed to realize the ejection drive.

[0089] Embodiment 3

[0090] Figure 4 FIG. 1 is a flow chart of an exemplary ejection control method, which is applied to the ejection device as described above. Figure 4 As shown, the method includes:

[0091] Step 401, receiving a control instruction, the control instruction is used to instruct to drive or not drive the ejection device;

[0092] Step 402 : If the control instruction indicates to drive the ejection device, the temperature adjustment component 2 is controlled to adjust the temperature until the temperature reaches the phase transition temperature of the bending beam 12 of the ejection driver 1 .

[0093] If the control instruction indicates not to drive the ejection device, the temperature of the bending beam 12 of the ejection actuator 1 is maintained at a temperature other than the phase change temperature.

[0094] The executor of the ejection control method of this example can be an ejection control device, which can be implemented in many ways. For example, it can be implemented through a computer program, such as application software, etc.; or it can be implemented as a medium storing relevant computer programs, such as a cloud disk, etc.; or it can be implemented through a physical device integrated or installed with relevant computer programs, such as a chip, etc.

[0095] In this example, the specific content of the control instruction includes: driving the ejection device and not driving the ejection device. After receiving the control instruction, in step 402, different processing processes are performed according to different contents of the control instruction. Specifically, if the control instruction indicates to drive the ejection device, the temperature adjustment component 2 is controlled to adjust the temperature, for example, the temperature is controlled to increase or decrease until the temperature reaches the phase change temperature of the bending beam 12 of the ejection drive 1, the bending beam 12 is deformed, and a large force and displacement are quickly output to drive the ejection device; if the control instruction indicates not to drive the ejection device, the temperature of the bending beam 12 of the ejection drive 1 is maintained at a temperature outside the phase change temperature, the bending beam 12 is not deformed or slightly deformed, which is not enough to output a large force and displacement, and the ejection device is not driven. The temperature adjustment component 2 can be a heating plate, a radiator, etc., but is not limited to this.

[0096] In practical applications, the ejection control method of this example can be applied to fields such as micro-robots with ejection functions, and can also be applied to fields such as fire alarm, controlling water pipe water temperature, maintaining greenhouse temperature, etc. For example, when the temperature in the greenhouse is too low or too high, a control instruction is received, and the control instruction instructs to drive the ejection device, then the temperature control component 2 is controlled to adjust the temperature until the temperature reaches the phase change temperature of the bending beam 12 of the ejection drive 1, thereby realizing the ejection drive and automatically opening or closing the heater valve; when the temperature in the greenhouse is within a suitable temperature range, a control instruction is received, and the control instruction instructs not to drive the ejection device, then the temperature of the bending beam 12 of the ejection drive 1 is maintained at a temperature outside the phase change temperature, and the ejection drive is not performed, that is, the current valve is maintained in an open or closed state.

[0097] For example, Figure 5 This is an example diagram of an application scenario, such as Figure 5 As shown, the application scenario may include: a terminal device 501 and a control system 502. The number of terminal devices 501 may be one or more, and the number of control systems 502 may also be one or more. The embodiment of the present application does not specifically limit the number of terminal devices 501 and control systems 502.

[0098] Applications are pre-installed in the terminal device 501, where the applications may be client applications, web applications, small program applications, etc. The terminal device 501 may be a mobile phone, a smart TV, a wearable device, a smart speaker, a smart security device, a smart gateway, a tablet computer (Pad), a computer with wireless transceiver function, a virtual reality (VR) terminal device 501, an augmented reality (AR) terminal device 501, a wireless terminal in industrial control, a wireless terminal in self-driving, a wireless terminal in a smart grid, a wireless terminal in transportation safety, a wireless terminal in a smart city, a wireless terminal in a smart home, etc. The above-mentioned terminal devices 501 include but are not limited to smart phones, tablet computers, laptop portable computers, and desktop computers.

[0099] The control system 502 is the background server of the application. The control system 502 can be an independent physical server, or a server cluster or distributed system composed of multiple physical servers, or a cloud server that provides basic cloud computing services such as cloud services, cloud databases, cloud computing, cloud functions, cloud storage, network services, cloud communications, middleware services, domain name services, security services, content delivery networks (CDN), and big data and artificial intelligence platforms. The terminal device 501 and the control system 502 can be directly or indirectly connected through wireless or wired communication, and this application does not limit this.

[0100] Specifically, the user sends a control instruction based on the terminal device 501, and the control system 502 receives the control instruction and parses the specific content of the control instruction, and instructs to drive or not drive the ejection device according to the specific content of the control instruction.

[0101] The ejection control method of this example first receives a control instruction, and then executes different processing procedures according to different contents of the control instruction. If the control instruction indicates to drive the ejection device, the temperature adjustment component 2 is controlled to adjust the temperature, for example, the temperature is controlled to increase or decrease until the temperature reaches the phase change temperature of the bending beam 12 of the ejection drive 1, and the bending beam 12 is deformed, and a large force and displacement are quickly output to drive the ejection device; if the control instruction indicates not to drive the ejection device, the temperature of the bending beam 12 of the ejection drive 1 is maintained at a temperature outside the phase change temperature, and the bending beam 12 is not deformed or is slightly deformed, which is not enough to output a large force and displacement, and the ejection device is not driven. The method of this example is simple to operate, and only the temperature adjustment component 2 needs to be controlled to realize the autonomous driving of the ejection drive 1.

[0102] Embodiment 4

[0103] Figure 6 FIG. 1 is a structural diagram of an exemplary ejection control device, as shown in FIG. Figure 6 As shown, the device comprises:

[0104] A receiving module 601 is used to receive a control instruction, where the control instruction is used to instruct to drive or not drive the ejection device;

[0105] The control module 602 is used to control the temperature adjustment component 2 to adjust the temperature until the temperature reaches the phase change temperature of the bending beam 12 of the ejection driver 1 if the control instruction indicates to drive the ejection device;

[0106] If the control instruction indicates not to drive the ejection device, the temperature of the bending beam 12 of the ejection actuator 1 is maintained at a temperature other than the phase change temperature.

[0107] In this example, the specific content of the control instruction includes: driving the ejection device and not driving the ejection device. The receiving module 601 receives the control instruction and sends it to the control module 602. The control module 602 performs different processing according to the different contents of the control instruction. Specifically, if the control instruction indicates to drive the ejection device, the control module 602 controls the temperature adjustment component 2 to adjust the temperature, for example, controlling the temperature to rise or fall until the temperature reaches the phase change temperature of the bending beam 12 of the ejection drive 1, the bending beam 12 deforms, and quickly outputs a large force and displacement to drive the ejection device; if the control instruction indicates not to drive the ejection device, the control module 602 maintains the temperature of the bending beam 12 of the ejection drive 1 at a temperature outside the phase change temperature, the bending beam 12 does not deform or deforms slightly, which is not enough to output a large force and displacement, and the ejection device is not driven. The temperature adjustment component 2 can be a heating plate, a radiator, etc., but is not limited to this.

[0108] In practical applications, the ejection control device of this example can be applied to fields such as micro robots with ejection functions, and can also be applied to fields such as fire alarm, controlling water pipe water temperature, maintaining greenhouse temperature, etc. For example, when the temperature in the greenhouse is too low or too high, the receiving module 601 receives the control instruction and sends it to the control module 602. The control instruction instructs to drive the ejection device. The control module 602 controls the temperature adjustment component 2 to adjust the temperature until the temperature reaches the phase change temperature of the bending beam 12 of the ejection drive 1, thereby realizing the ejection drive and automatically opening or closing the heater valve; when the temperature in the greenhouse is within a suitable temperature range, the receiving module 601 receives the control instruction. The control instruction instructs not to drive the ejection device. The control module 602 maintains the temperature of the bending beam 12 of the ejection drive 1 at a temperature outside the phase change temperature and does not eject the drive, that is, maintains the current valve open or closed state.

[0109] The ejection control device of this example first receives the control instruction through the receiving module 601, and then executes different processing procedures according to the different contents of the control instruction through the control module 602. Specifically, if the control instruction indicates to drive the ejection device, the control module 602 controls the temperature adjustment component 2 to adjust the temperature, for example, controls the temperature to rise or fall until the temperature reaches the phase change temperature of the bending beam 12 of the ejection drive 1, and the bending beam 12 is deformed, and a large force and displacement are quickly output to drive the ejection device; if the control instruction indicates not to drive the ejection device, the control module 602 maintains the temperature of the bending beam 12 of the ejection drive 1 at a temperature outside the phase change temperature, and the bending beam 12 is not deformed or is slightly deformed, which is not enough to output a large force and displacement, and the ejection device is not driven. The ejection control device of this example has a simple structure and only requires the cooperation of the receiving module 601 and the control module 602 to control the temperature adjustment component 2 to realize the autonomous driving of the ejection drive 1.

[0110] Figure 7 FIG. 1 is a structural diagram of an exemplary electronic device. Figure 7 As shown, the electronic device 70 provided in this embodiment includes: at least one processor 701 and a memory 702. The device 70 also includes a communication component 703. The processor 701, the memory 702 and the communication component 703 are connected via a bus 704.

[0111] In a specific implementation process, at least one processor 701 executes the computer-executable instructions stored in the memory 702, so that at least one processor 701 executes the above method.

[0112] The specific implementation process of the processor 701 can be found in the above method embodiment, and its implementation principle and technical effect are similar, so this embodiment will not be repeated here.

[0113] In the above embodiments, it should be understood that the processor may be a central processing unit (CPU), or other general-purpose processors, digital signal processors (DSP), application-specific integrated circuits (ASIC), etc. A general-purpose processor may be a microprocessor or any conventional processor. The steps of the method disclosed in the invention may be directly implemented as being executed by a hardware processor, or may be executed by a combination of hardware and software modules in the processor.

[0114] The memory may include a high-speed memory (Random Access Memory, RAM), and may also include a non-volatile memory (Non-volatile Memory, NVM), such as at least one disk memory.

[0115] The bus may be an Industry Standard Architecture (ISA) bus, a Peripheral Component Interconnect (PCI) bus, or an Extended Industry Standard Architecture (EISA) bus, etc. The bus may be divided into an address bus, a data bus, a control bus, etc. For ease of representation, the bus in the drawings of the present application is not limited to only one bus or one type of bus.

[0116] The present application also provides a computer program product, including a computer program, which implements the above method when executed by a processor.

[0117] The present application also provides a computer-readable storage medium, in which computer-executable instructions are stored. When a processor executes the computer-executable instructions, the above method is implemented.

[0118] The above-mentioned readable storage medium can be implemented by any type of volatile or non-volatile storage device or a combination thereof, such as static random access memory (SRAM), electrically erasable programmable read-only memory (EEPROM), erasable programmable read-only memory (EPROM), programmable read-only memory (PROM), read-only memory (ROM), magnetic memory, flash memory, magnetic disk or optical disk. The readable storage medium can be any available medium that can be accessed by a general or special-purpose computer.

[0119] An exemplary readable storage medium is coupled to a processor so that the processor can read information from the readable storage medium and write information to the readable storage medium. Of course, the readable storage medium can also be a component of the processor. The processor and the readable storage medium can be located in an application specific integrated circuit (Application Specific Integrated Circuits, referred to as: ASIC). Of course, the processor and the readable storage medium can also exist in the device as discrete components.

[0120] The division of units is only a logical function division, and there may be other divisions in actual implementation, such as multiple units or components can be combined or integrated into another system, or some features can be ignored or not executed. Another point is that the mutual coupling or direct coupling or communication connection shown or discussed can be an indirect coupling or communication connection through some interface, device or unit, which can be electrical, mechanical or other forms.

[0121] The units described as separate components may or may not be physically separated, and the components shown as units may or may not be physical units, that is, they may be located in one place or distributed on multiple network units. Some or all of the units may be selected according to actual needs to achieve the purpose of the solution of this embodiment.

[0122] In addition, each functional unit in each embodiment of the present invention may be integrated into one processing unit, or each unit may exist physically separately, or two or more units may be integrated into one unit.

[0123] If the function is implemented in the form of a software functional unit and sold or used as an independent product, it can be stored in a computer-readable storage medium. Based on this understanding, the technical solution of the present invention, or the part that contributes to the prior art, or the part of the technical solution, can be embodied in the form of a software product. The computer software product is stored in a storage medium, including several instructions for a computer device (which can be a personal computer, server, or network device, etc.) to perform all or part of the steps of the methods of each embodiment of the present invention. The aforementioned storage medium includes: U disk, mobile hard disk, read-only memory (ROM, Read-Only Memory), random access memory (RAM, Random Access Memory), disk or optical disk, etc. Various media that can store program codes.

[0124] Those skilled in the art can understand that all or part of the steps of implementing the above-mentioned method embodiments can be completed by hardware related to program instructions. The aforementioned program can be stored in a computer-readable storage medium. When the program is executed, the steps of the above-mentioned method embodiments are executed; and the aforementioned storage medium includes: ROM, RAM, disk or optical disk and other media that can store program codes.

[0125] Finally, it should be noted that those skilled in the art will readily conceive of other embodiments of the present invention after considering the specification and practicing the invention disclosed herein. The present invention is intended to cover any variations, uses or adaptations of the present invention, which follow the general principles of the present invention and include common knowledge or customary technical means in the art not disclosed by the present invention, are not limited to the precise structure described above and shown in the drawings, and may be modified and changed in various ways without departing from the scope thereof. The scope of the present invention is limited only by the appended claims.

Claims

1. A catapult drive, characterized in that: Includes: rigid body and curved beam, Both ends of the curved beam are fixedly mounted to the rigid body so that the curved beam forms a convex structure; The bending beam is made of shape memory alloy material, and the bending beam switches from a first state to a second state under the action of temperature; in the first state, the convex structure of the bending beam convexes downward, and in the second state, the convex structure of the bending beam convexes upward.

2. The ejection drive according to claim 1, characterized in that: The rigid body comprises: a bearing portion and a pressing portion; The bearing portion is provided with a groove, and the two ends of the bending beam are respectively fixedly connected to the side walls on both sides of the groove; The pressing portion has a protrusion protruding downward.

3. The ejection drive according to claim 2, characterized in that: include: The protruding portion has a mounting groove, and the convex structure of the bending beam is embedded in the mounting groove.

4. The ejection drive according to claim 3, characterized in that: include: In the first state, the pressing portion and the bearing portion are in contact with each other; In the second state, the pressing portion and the bearing portion are separated.

5. The ejection driver according to any one of claims 1 to 4, characterized in that: t is the thickness of the bending beam, l is the horizontal length of the bending beam, and h is the vertical length of the bending beam; the ejection drive further includes: When 0.075≤h / l<0.125, 0.01≤t / l<0.05; When 0.125≤h / l<0.175, 0.03≤t / l<0.07; When 0.175≤h / l<0.225, 0.05≤t / l<0.09; When 0.225≤h / l<0.275, 0.07≤t / l<0.11; When 0.275≤h / l≤0.325, 0.11≤t / l≤0.

13.

6. The ejection drive according to claim 1, wherein: include: The shape memory alloy is a nickel-titanium shape memory alloy.

7. The ejection drive according to claim 1, wherein: include: The rigid body is a metal rigid body.

8. An ejection device, characterized in that: include: Ejection drive and temperature control components; The rigid body of the ejection driver is a heat-conducting rigid body, and the temperature adjustment component is fitted and fixed on the surface of the rigid body.

9. An ejection control method, applied to the ejection device as claimed in claim 8, characterized in that: include: receiving a control instruction, wherein the control instruction is used to instruct to drive or not drive the ejection device; If the control instruction indicates to drive the ejection device, the temperature adjustment component is controlled to adjust the temperature until the temperature reaches the phase change temperature of the bending beam of the ejection driver; If the control instruction indicates not to drive the ejection device, the temperature of the bending beam of the ejection actuator is maintained at a temperature other than the phase change temperature.

10. An ejection control device, characterized in that: include: A receiving module, used for receiving a control instruction, wherein the control instruction is used for instructing to drive or not drive the ejection device; a control module, configured to control the temperature regulating component to adjust the temperature until the temperature reaches the phase transition temperature of the bending beam of the ejection driver if the control instruction indicates to drive the ejection device; If the control instruction indicates not to drive the ejection device, the temperature of the bending beam of the ejection actuator is maintained at a temperature other than the phase change temperature.

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