Wide-temperature-range infrared thermal detection device

Abstract

The invention discloses a wide-temperature-range infrared thermal detection device which comprises a high and low temperature box, germanium glass, an infrared imaging lens, a data processing unit and an equipment bracket, wherein the germanium glass is arranged at the top of the high-low temperature box; the infrared imaging lens is arranged on the germanium glass, and the infrared imaging lens can penetrate through the germanium glass to shoot and image the interior of the high and low temperature box; the equipment bracket is mounted in the high-low temperature box and is used for fixing to-be-detected electronic equipment; and the data processing unit is connected with the infrared imaging lens. According to the invention, the real-time detection of the electronic equipment in a wide temperature range is met.

Description

Technical Field

[0001] The present invention belongs to the technical field of wide-temperature-range infrared thermal detection, and in particular relates to a wide-temperature-range infrared thermal detection device. Background Art

[0002] Existing infrared thermal detection devices are generally used as detection devices at room temperature, which cannot meet the infrared temperature detection of PCB components at high and low temperatures. Summary of the invention

[0003] The technical problem solved by the present invention is to overcome the deficiencies of the prior art and provide a wide temperature range infrared thermal detection device to meet the requirements of real-time detection of electronic equipment under a wide temperature range.

[0004] The object of the present invention is achieved through the following technical solutions: a wide temperature range infrared thermal detection device, comprising: a high and low temperature box, germanium glass, an infrared imaging lens, a data processing unit and an equipment bracket; wherein the germanium glass is arranged on the top of the high and low temperature box; the infrared imaging lens is arranged on the germanium glass, and the infrared imaging lens can shoot and image the inside of the high and low temperature box through the germanium glass; the equipment bracket is installed inside the high and low temperature box, and is used to fix the electronic equipment to be detected; the data processing unit is connected to the infrared imaging lens.

[0005] In the above-mentioned wide temperature range infrared thermal detection device, the infrared imaging lens photographs and images the electronic device to be detected inside the high and low temperature box to obtain an infrared image, and transmits the infrared image to the data processing unit; the data processing unit processes the infrared image to obtain the relationship between the temperature curve of the electronic device to be detected and the position coordinates of the electronic device to be detected.

[0006] In the above wide temperature range infrared thermal detection device, the germanium glass is a coated glass, and its transmittance is above %.

[0007] In the above wide temperature range infrared thermal detection device, the high and low temperature box can meet the temperature regulation within the range of -40°C to 150°C.

[0008] In the above-mentioned wide temperature range infrared thermal detection device, the field angle of the infrared imaging lens is ≥40°.

[0009] The above-mentioned wide temperature range infrared thermal detection device also includes: a high temperature resistant sealing rubber pad; wherein the high temperature resistant sealing rubber pad is arranged between the germanium glass and the high and low temperature box.

[0010] In the above-mentioned wide temperature range infrared thermal detection device, the equipment bracket includes a support plate and a telescopic mechanism; wherein the bottom of the support plate is connected to the telescopic mechanism; and the support plate is used to place the electronic equipment to be detected.

[0011] In the above-mentioned wide temperature range infrared thermal detection device, the telescopic mechanism includes a first telescopic column, a second telescopic column, a third telescopic column, a fourth telescopic column, a first spring pin and a second spring pin; wherein, one end of the first telescopic column is connected to the bottom of one end of the support plate, and the other end of the first telescopic column is inserted into the interior of the second telescopic column; the first spring pin is arranged on the side wall of the second telescopic column, and the first spring pin is used to fix the relative position of the first telescopic column and the second telescopic column; one end of the third telescopic column is connected to the bottom of the other end of the support plate, and the other end of the third telescopic column is inserted into the interior of the fourth telescopic column; the second spring pin is arranged on the side wall of the fourth telescopic column, and the second spring pin is used to fix the relative position of the third telescopic column and the fourth telescopic column.

[0012] In the above wide temperature range infrared thermal detection device, there are multiple first spring pins, and the multiple first spring pins are distributed along the height of the second telescopic column.

[0013] In the above wide temperature range infrared thermal detection device, there are multiple second spring pins, and the multiple second spring pins are distributed along the height of the fourth telescopic column.

[0014] Compared with the prior art, the present invention has the following beneficial effects:

[0015] (1) The present invention can detect the temperature of electronic equipment not only at room temperature, but also in the range of -40°C to 150°C.

[0016] (2) The present invention can display in real time the relationship between the temperature change curve of the electronic device to be tested and the position coordinates of the electronic device to be tested. BRIEF DESCRIPTION OF THE DRAWINGS

[0017] Various other advantages and benefits will become apparent to those of ordinary skill in the art by reading the detailed description of the preferred embodiments below. The accompanying drawings are only for the purpose of illustrating the preferred embodiments and are not to be considered as limiting the present invention. Moreover, the same reference symbols are used throughout the accompanying drawings to represent the same components. In the accompanying drawings:

[0018] Figure 1 is a structural block diagram of a wide temperature range infrared thermal detection device provided by an embodiment of the present invention;

[0019] Figure 2 It is a schematic diagram of information interaction between a data processing unit and an infrared imaging lens provided by an embodiment of the present invention;

[0020] Figure 3 is a schematic diagram of the germanium glass provided in an embodiment of the present invention being installed on a high and low temperature box;

[0021] Figure 4It is a schematic diagram of a device bracket provided in an embodiment of the present invention. DETAILED DESCRIPTION

[0022] Exemplary embodiments of the present disclosure will be described in more detail below with reference to the accompanying drawings. Although exemplary embodiments of the present disclosure are shown in the accompanying drawings, it should be understood that the present disclosure can be implemented in various forms and should not be limited by the embodiments set forth herein. On the contrary, these embodiments are provided in order to enable a more thorough understanding of the present disclosure and to be able to fully convey the scope of the present disclosure to those skilled in the art. It should be noted that, in the absence of conflict, the embodiments of the present invention and the features described in the embodiments can be combined with each other. The present invention will be described in detail below with reference to the accompanying drawings and in combination with the embodiments.

[0023] Figure 1 is a structural block diagram of a wide temperature range infrared thermal detection device provided by an embodiment of the present invention; Figure 2 It is a schematic diagram of information interaction between a data processing unit and an infrared imaging lens provided by an embodiment of the present invention; Figure 3 Schematic diagram of the germanium glass provided by the embodiment of the present invention installed on a high and low temperature box. Figure 1 , Figure 2 and Figure 3 As shown, the wide temperature range infrared thermal detection device includes: a high and low temperature box 1, a germanium glass 2, an infrared imaging lens 3, a data processing unit 4 and an equipment bracket 5. Among them,

[0024] The germanium glass 2 is arranged on the top of the high and low temperature box 1; the infrared imaging lens 3 is arranged on the germanium glass 2, and the infrared imaging lens 3 can shoot and image the inside of the high and low temperature box 1 through the germanium glass 2; the equipment bracket 5 is installed inside the high and low temperature box 1, and is used to fix the electronic equipment to be tested; the data processing unit 4 is connected to the infrared imaging lens 3.

[0025] The infrared imaging lens 3 photographs the electronic device to be detected inside the high and low temperature box 1 to obtain an infrared image, and transmits the infrared image to the data processing unit 4; the data processing unit 4 processes the infrared image to obtain the relationship between the temperature curve of the electronic device to be detected and the position coordinates of the electronic device to be detected.

[0026] The germanium glass 2 is inlaid on the high and low temperature box 1, and the infrared imaging lens 3 is fixed on the high and low temperature box 1, which can shoot the interior of the high and low temperature box 1 through the germanium glass. The equipment bracket 5 is installed inside the high and low temperature box 1 to fix the electronic equipment to be tested.

[0027] The germanium glass 2 has the dual characteristics of heat insulation and high temperature resistance. The germanium glass 2 is a coated glass with a transmittance of more than 90%. The high and low temperature box 1 satisfies the temperature regulation function within the range of -40°C to 150°C. The infrared imaging lens 3 has a field of view angle of ≥40°.

[0028] like Figure 2 As shown, the data processing unit 4 is connected to the infrared imaging lens 3 and is used to process the temperature data of the electronic device to be detected in real time. The data processing unit 4 can generate a temperature curve of the electronic device to be detected in real time and display the relationship between the temperature curve and the position coordinates on the device.

[0029] like Figure 3 As shown, when the germanium glass 2 is mounted on the high and low temperature box 1, a high temperature resistant sealing rubber pad 6 needs to be installed. The high temperature resistant sealing rubber pad 6 is designed between the germanium glass 2 and the high and low temperature box 1. The high temperature resistant sealing rubber pad 6 is bonded and fixed to the germanium glass 2 and the high and low temperature box 1 respectively by high temperature resistant glue.

[0030] Figure 4 Schematic diagram of the equipment support provided by the embodiment of the present invention. Figure 4 As shown, the equipment bracket 5 includes a support plate 7 and a telescopic mechanism; wherein the bottom of the support plate 7 is connected to the telescopic mechanism; the support plate 7 is used to place the electronic equipment to be tested.

[0031] like Figure 4 As shown, the telescopic mechanism includes a first telescopic column 81, a second telescopic column 91, a third telescopic column 82, a fourth telescopic column 92, a first spring pin 101 and a second spring pin 102.

[0032] One end of the first telescopic column 81 is connected to the bottom of one end of the support plate 7, and the other end of the first telescopic column 81 is inserted into the interior of the second telescopic column 91; the first spring pin 101 is arranged on the side wall of the second telescopic column 91, and the first spring pin 101 is used to fix the relative position of the first telescopic column 81 and the second telescopic column 91; one end of the third telescopic column 82 is connected to the bottom of the other end of the support plate 7, and the other end of the third telescopic column 82 is inserted into the interior of the fourth telescopic column 92; the second spring pin 102 is arranged on the side wall of the fourth telescopic column 92, and the second spring pin 102 is used to fix the relative position of the third telescopic column 82 and the fourth telescopic column 92.

[0033] There are multiple first spring pins 101 , and the multiple first spring pins 101 are distributed along the height of the second telescopic column 91 .

[0034] There are multiple second spring pins 102 , and the multiple second spring pins 102 are distributed along the height of the fourth telescopic column 92 .

[0035] like Figure 4As shown, the equipment support 5 is placed in the high and low temperature box 1, and the equipment support 5 has a telescopic function to ensure that the equipment to be tested is in a suitable imaging area. The first telescopic column is fixedly connected to the support plate, and the first telescopic column can slide in the second telescopic column, and the relative position of the first telescopic column and the second telescopic column is fixed after the first spring pin is in place. The third telescopic column can slide in the fourth telescopic column, and the relative position of the third telescopic column and the fourth telescopic column is fixed after the second spring pin is in place.

[0036] The present invention can not only detect the temperature of electronic equipment at room temperature, but also detect the real-time temperature of electronic equipment in the range of -40°C to 150°C; the present invention can display in real time the relationship between the temperature change curve of the electronic equipment to be tested and the position coordinates of the electronic equipment to be tested.

[0037] Although the present invention has been disclosed as above in the form of a preferred embodiment, it is not intended to limit the present invention. Any person skilled in the art may make possible changes and modifications to the technical solution of the present invention by using the methods and technical contents disclosed above without departing from the spirit and scope of the present invention. Therefore, any simple modifications, equivalent changes and modifications made to the above embodiments based on the technical essence of the present invention without departing from the content of the technical solution of the present invention shall fall within the protection scope of the technical solution of the present invention.

Claims

1. A wide temperature range infrared thermal detection device, characterized in that include: A high and low temperature box (1), germanium glass (2), an infrared imaging lens (3), a data processing unit (4) and an equipment bracket (5); wherein: The germanium glass (2) is arranged on the top of the high and low temperature box (1); The infrared imaging lens (3) is arranged on the germanium glass (2), and the infrared imaging lens (3) is capable of photographing and imaging the interior of the high and low temperature box (1) through the germanium glass (2); The equipment bracket (5) is installed inside the high and low temperature box (1) and is used to fix the electronic equipment to be tested; The data processing unit (4) is connected to the infrared imaging lens (3).

2. The wide temperature range infrared thermal detection device according to claim 1, characterized in that: The infrared imaging lens (3) photographs the electronic device to be detected inside the high and low temperature box (1) to obtain an infrared image, and transmits the infrared image to the data processing unit (4); The data processing unit (4) processes the infrared image to obtain the relationship between the temperature curve of the electronic device to be detected and the position coordinates of the electronic device to be detected.

3. The wide temperature range infrared thermal detection device according to claim 1, characterized in that: The germanium glass (2) is a coated glass with a transmittance of more than 90%.

4. The wide temperature range infrared thermal detection device according to claim 1, characterized in that: The high and low temperature box (1) can regulate the temperature within the range of -40°C to 150°C.

5. The wide temperature range infrared thermal detection device according to claim 1, characterized in that: The field of view angle of the infrared imaging lens (3) is ≥40°.

6. The wide temperature range infrared thermal detection device according to claim 1, characterized in that Also includes: High temperature resistant sealing rubber pad (6); wherein, The high temperature resistant sealing rubber pad (6) is arranged between the germanium glass (2) and the high and low temperature box (1).

7. The wide temperature range infrared thermal detection device according to claim 1, characterized in that: The equipment support (5) comprises a support plate (7) and a telescopic mechanism; wherein: The bottom of the support plate (7) is connected to the telescopic mechanism; The support plate (7) is used for placing the electronic equipment to be tested.

8. The wide temperature range infrared thermal detection device according to claim 7, characterized in that: The telescopic mechanism comprises a first telescopic column (81), a second telescopic column (91), a third telescopic column (82), a fourth telescopic column (92), a first spring pin (101) and a second spring pin (102); wherein, One end of the first telescopic column (81) is connected to the bottom of one end of the support plate (7), and the other end of the first telescopic column (81) is inserted into the interior of the second telescopic column (91); The first spring pin (101) is arranged on a side wall of the second telescopic column (91), and the first spring pin (101) is used to fix the relative position of the first telescopic column (81) and the second telescopic column (91); One end of the third telescopic column (82) is connected to the bottom of the other end of the support plate (7), and the other end of the third telescopic column (82) is inserted into the interior of the fourth telescopic column (92); The second spring pin (102) is arranged on a side wall of the fourth telescopic column (92), and the second spring pin (102) is used to fix the relative position of the third telescopic column (82) and the fourth telescopic column (92).

9. The wide temperature range infrared thermal detection device according to claim 8, characterized in that: There are multiple first spring pins (101), and the multiple first spring pins (101) are distributed along the height of the second telescopic column (91).

10. The wide temperature range infrared thermal detection device according to claim 8, characterized in that: There are multiple second spring pins (102), and the multiple second spring pins (102) are distributed along the height of the fourth telescopic column (92).

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