Transmission loss simulation method and device, electronic equipment and storage medium

Abstract

The invention provides a transmission loss simulation method and device, electronic equipment and a storage medium, and relates to the technical field of computers. The transmission loss simulation method comprises the steps that first transmission loss of a signal line in a to-be-analyzed PCB is acquired, and the first transmission loss is the transmission loss of the signal line in the to-be-analyzed PCB without considering the influence of the glass fiber effect; acquiring unit transmission loss; wherein the unit transmission loss is the transmission loss caused by the glass fiber effect of a unit length signal line parallel to the weft of the glass fiber cloth in the PCB to be analyzed; based on the routing angle of each section of signal line in the PCB to be analyzed, the length of each section of signal line and the unit transmission loss, obtaining the second transmission loss of the signal line in the PCB to be analyzed; wherein the second transmission loss is the transmission loss of the signal line in the to-be-analyzed PCB considering the influence of the glass fiber effect; and determining the sum of the first transmission loss and the second transmission loss as the total transmission loss of the PCB to be analyzed.

Description

Technical Field

[0001] The present application relates to the technical field of computers, and in particular to a transmission loss simulation method, device, electronic device and storage medium. Background Art

[0002] "Glass-Fiber Effect (GFE)" refers to the phenomenon that the gaps in the glass fiber mesh structure (also known as glass fiber cloth) of the printed circuit board (PCB) cause the relative dielectric constant (Dielectric Constant) to change. Generally speaking, the dielectric layer of the PCB is usually composed of glass fiber cloth and resin. The dielectric constants of glass fiber cloth and resin are often quite different. There are usually certain gaps in the weaving of glass fiber cloth, and it cannot be perfectly connected. When the transmission line is located in the gap of the glass fiber cloth, the medium environment where the transmission line is located will not be wrapped by an ideal uniform medium, forming a glass fiber effect.

[0003] At present, in the design, tightly woven glass fiber cloth is usually used to reduce the influence of glass fiber effect; or Zig routing is used in the design to avoid that the transmission line is located in the gap of glass cloth in a large area to reduce the influence of glass fiber effect; or the material is cut at a rotating angle in PCB production to reduce the influence of glass fiber effect. However, these methods cannot eliminate the influence of glass fiber effect on transmission line, and because the above measures to eliminate glass fiber effect have great uncertainty, it is impossible to effectively evaluate the influence of the actual transmission environment of the transmission line on signal transmission. Summary of the invention

[0004] The present application provides a transmission loss simulation method, device, electronic device and storage medium to solve the problem in the prior art that it is difficult to evaluate the impact of the actual transmission environment of the signal line on the signal transmission.

[0005] In a first aspect, the present application provides a transmission loss simulation method, comprising: obtaining a first transmission loss of a signal line in a PCB board to be analyzed, wherein the first transmission loss is the transmission loss of the signal line in the PCB board to be analyzed without considering the influence of the glass fiber effect; obtaining a unit transmission loss; wherein the unit transmission loss is the transmission loss of a unit length signal line parallel to the weft line of the glass fiber cloth in the PCB board to be analyzed due to the glass fiber effect; obtaining a second transmission loss of the signal line in the PCB board to be analyzed based on the routing angle of each section of the signal line in the PCB board to be analyzed, the length of each section of the signal line and the unit transmission loss; wherein the second transmission loss is the transmission loss of the signal line in the PCB board to be analyzed considering the influence of the glass fiber effect; and determining the sum of the first transmission loss and the second transmission loss as the total transmission loss of the PCB board to be analyzed.

[0006] In the embodiment of the present application, since the glass fiber effect is not considered in the first transmission loss, and the transmission loss caused by the glass fiber effect is considered in the second transmission loss, the total transmission loss of the signal line in the PCB board to be analyzed can be obtained according to the first transmission loss and the second transmission loss. Thus, the impact of the actual transmission environment of the signal line on the signal transmission can be evaluated. And through the unit transmission loss and the routing angle of each signal line in the PCB board to be analyzed, and the length of each signal line, the second transmission loss of the signal line in the PCB board to be analyzed can be obtained, and there is no need to obtain the unit transmission loss separately for the signal line of each routing angle, which reduces the workload required for simulation.

[0007] In combination with the technical solution provided in the first aspect above, in some possible implementations, obtaining the unit transmission loss includes: using a glass fiber effect simulation model corresponding to the PCB board to be analyzed to simulate the transmission loss of the signal line in the PCB board to be analyzed, to obtain the unit transmission loss.

[0008] In the embodiment of the present application, since the glass fiber effect simulation model corresponds to the PCB board to be analyzed, the unit transmission loss obtained by simulating the glass fiber effect simulation model can be used to evaluate the transmission loss of the signal line in the PCB board to be analyzed, thereby improving the accuracy of the present solution.

[0009] In combination with the technical solution provided in the first aspect above, in some possible implementations, the transmission loss of the signal line in the PCB board to be analyzed is simulated using a glass fiber effect simulation model to obtain the unit transmission loss, including: simulating the glass fiber effect simulation model to obtain the test transmission loss caused by the glass fiber effect; moving the test signal line in the glass fiber effect simulation model multiple times according to a preset offset, and simulating the glass fiber effect simulation model after each movement of the test signal line to obtain the test transmission loss of the test signal line per unit length after each movement due to the glass fiber effect; wherein the offset is less than the interval between adjacent weft lines of the glass fiber cloth; and obtaining the unit transmission loss based on all the test transmission losses obtained.

[0010] In the embodiment of the present application, by moving the signal line multiple times according to the offset, multiple test transmission losses of different relative positions of the signal line and the glass fiber cloth can be obtained, and then all the test transmission losses are used to obtain the initial transmission loss. The initial transmission loss takes into account the various situations of different relative positions of the signal line and the glass fiber cloth, so that the initial transmission loss is more consistent with the actual situation of the signal line, so that the final total transmission loss is more accurate.

[0011] In combination with the technical solution provided in the first aspect above, in some possible implementations, the glass fiber effect simulation model is established by the following steps: obtaining the attribute information of the PCB board to be analyzed, wherein the attribute information includes: signal line specification parameters, glass fiber cloth type, and resin type; using horizontally arranged rectangular blocks to simulate the weft of the glass fiber cloth corresponding to the glass fiber cloth type, and using vertically arranged rectangular blocks to simulate the warp of the glass fiber cloth corresponding to the glass fiber cloth type, to obtain a glass fiber cloth model corresponding to the glass fiber cloth type; based on the signal line specification parameters, laying a test signal line on the glass fiber cloth model that is parallel to the weft and has a length greater than or equal to a unit length; based on the resin type, establishing a resin model on the glass fiber cloth model to obtain the glass fiber effect simulation model.

[0012] In an embodiment of the present application, the glass fiber effect simulation model obtained by modeling the property information of the PCB board to be analyzed can be closer to the PCB board to be analyzed, so that the unit transmission loss simulated by using the glass fiber effect simulation model can more accurately reflect the transmission loss of the signal line in the PCB board to be analyzed.

[0013] In combination with the technical solution provided in the first aspect above, in some possible implementations, the offset is 1 / N of the spacing distance between adjacent weft lines of the glass fiber cloth model in the glass fiber effect simulation model, where N is a positive integer greater than or equal to 2; accordingly, the number of times the test signal line moves according to the offset is greater than or equal to N.

[0014] In the embodiment of the present application, by setting the offset to 1 / N of the spacing between adjacent wefts of the glass fiber cloth, the relative position movement between the test signal line and the glass fiber cloth can be made more precise. By setting the number of times the test signal line moves according to the offset to be greater than or equal to N, the relative position between the test signal line and the glass fiber cloth under the offset can be obtained more comprehensively.

[0015] In combination with the technical solution provided in the first aspect above, in some possible implementations, the test transmission loss of the test signal line includes: the test transmission loss of the test signal line when the vertical projection area of ​​the test signal line on the glass fiber cloth does not coincide with the weft of the glass fiber cloth, and the test transmission loss of the test signal line when the vertical projection area of ​​the test signal line on the glass fiber cloth coincides with the weft of the glass fiber cloth.

[0016] In the embodiment of the present application, since the two situations that the vertical projection area of ​​the test signal line on the glass fiber cloth does not overlap with the weft lines of the glass fiber cloth, and the vertical projection area of ​​the test signal line on the glass fiber cloth is completely covered by the weft lines of the glass fiber cloth are relatively special, when the test transmission loss is obtained in these two situations, the accuracy of the obtained initial transmission loss is relatively higher.

[0017] In combination with the technical solution provided in the first aspect above, in some possible implementations, based on the routing angle, length and unit transmission loss of each signal line in the PCB board to be analyzed, the second transmission loss of the signal line is obtained, including: obtaining the glass fiber factor corresponding to the routing angle of each signal line in the PCB board to be analyzed; based on the glass fiber factor corresponding to the routing angle of each signal line in the PCB board to be analyzed, the length of each signal line, and the unit transmission loss, calculating the third transmission loss of each signal line due to the glass fiber effect; based on all the obtained third transmission losses, calculating the second transmission loss.

[0018] In the embodiment of the present application, since the routing angle of each line segment included in the signal line may be different in actual application, the third transmission loss is calculated for each line segment included in the signal line, so that the transmission loss caused by the glass fiber effect of each line segment can be accurately obtained. Then, the second transmission loss can be calculated based on all the third transmission losses. Thereby, the accuracy of the second transmission loss is improved.

[0019] In combination with the technical solution provided in the first aspect above, in some possible implementations, obtaining the glass fiber factor corresponding to the routing angle of each signal line in the PCB board to be analyzed includes: obtaining the tangent function value of the routing angle corresponding to each signal line in the PCB board to be analyzed; based on the tangent function value of the routing angle corresponding to each signal line in the PCB board to be analyzed, calculating the glass fiber factor corresponding to each signal line; wherein the glass fiber factor corresponding to each signal line is equal to the inverse of the tangent function value of the routing angle of the signal line.

[0020] In a second aspect, the present application provides a transmission loss simulation device, comprising: an acquisition module and a processing module, the acquisition module being used to acquire a first transmission loss of a signal line in a PCB board to be analyzed, wherein the first transmission loss is the transmission loss of the signal line in the PCB board to be analyzed without considering the influence of the glass fiber effect; the acquisition module is also used to acquire a unit transmission loss; wherein the unit transmission loss is the transmission loss of a unit length signal line parallel to the weft line of the glass fiber cloth in the PCB board to be analyzed due to the glass fiber effect; the processing module is used to obtain a second transmission loss of the signal line in the PCB board to be analyzed based on the routing angle of each signal line segment in the PCB board to be analyzed, the length of each signal line segment and the unit transmission loss; wherein the second transmission loss is the transmission loss of the signal line in the PCB board to be analyzed considering the influence of the glass fiber effect; the processing module is also used to determine the sum of the first transmission loss and the second transmission loss as the total transmission loss of the PCB board to be analyzed.

[0021] In a third aspect, the present application provides an electronic device, comprising: a memory and a processor, the memory and the processor being connected; the memory being used to store programs; and the processor being used to call the programs stored in the memory to execute the method described in the first aspect above and / or in combination with any possible implementation of the first aspect above.

[0022] In a fourth aspect, the present application provides a computer-readable storage medium having a computer program stored thereon. When the computer program is executed by a computer, the computer program executes the method described in the first aspect and / or in combination with any possible implementation of the first aspect. BRIEF DESCRIPTION OF THE DRAWINGS

[0023] In order to more clearly illustrate the technical solutions of the embodiments of the present application, the drawings required for use in the embodiments will be briefly introduced below. It should be understood that the following drawings only show certain embodiments of the present application and therefore should not be regarded as limiting the scope. For ordinary technicians in this field, other related drawings can be obtained based on these drawings without paying creative work.

[0024] Figure 1 A schematic diagram of a flow chart of a transmission loss simulation method shown in an embodiment of the present application;

[0025] Figure 2 A structural schematic diagram of a glass fiber effect simulation model shown in an embodiment of the present application;

[0026] Figure 3 A structural schematic diagram of a glass fiber effect simulation model shown in an embodiment of the present application;

[0027] Figure 4 A structural schematic diagram of a glass fiber effect simulation model shown in an embodiment of the present application;

[0028] Figure 5 A structural schematic diagram of a glass fiber effect simulation model shown in an embodiment of the present application;

[0029] Figure 6 A schematic diagram of a flow chart of a transmission loss simulation method shown in an embodiment of the present application;

[0030] Figure 7 A structural block diagram of a transmission loss simulation device shown in an embodiment of the present application;

[0031] Figure 8 A structural block diagram of an electronic device shown in an embodiment of the present application. DETAILED DESCRIPTION

[0032] The technical solutions in the embodiments of the present application will be described below in conjunction with the drawings in the embodiments of the present application.

[0033] It should be noted that similar numbers and letters represent similar items in the following drawings, so once an item is defined in one drawing, it is not necessary to further define and explain it in the subsequent drawings. At the same time, in the description of this application, relational terms such as "first", "second", etc. are only used to distinguish one entity or operation from another entity or operation, and do not necessarily require or imply that there is any such actual relationship or order between these entities or operations. Moreover, the term "include", "comprise" or any other variant thereof is intended to cover non-exclusive inclusion, so that the process, method, article or equipment including a series of elements includes not only those elements, but also includes other elements that are not clearly listed, or also includes elements inherent to such process, method, article or equipment. In the absence of more restrictions, the elements limited by the sentence "including one..." do not exclude the existence of other identical elements in the process, method, article or equipment including the elements.

[0034] The technical solution of the present application will be described in detail below with reference to the accompanying drawings.

[0035] See also Figure 1 , Figure 1 This is a flow chart of a transmission loss simulation method shown in an embodiment of the present application. Figure 1 Describe the steps it involves.

[0036] S100: Obtain a first transmission loss of a signal line in a PCB board to be analyzed.

[0037] The first transmission loss is the transmission loss of the signal line in the PCB board to be analyzed without considering the influence of the glass fiber effect.

[0038] The first transmission loss of the PCB board to be analyzed may be acquired in advance and stored in a local storage medium, and can be directly called when needed, or may be acquired from a third party in real time when needed.

[0039] In one implementation manner, the first transmission loss of the PCB board to be analyzed may also be obtained by modeling and simulating the PCB board to be analyzed.

[0040] Specifically, the attribute information of the PCB to be analyzed may be first obtained, the attribute information including the stacking information, signal line wiring parameters, signal line transmission line length, and glass fiber cloth type of the PCB to be analyzed. Then, based on the stacking information, signal line wiring parameters, signal line transmission line length, and glass fiber cloth type of the PCB to be analyzed, simulation modeling analysis is performed on the PCB to be analyzed to obtain the first transmission loss.

[0041] The stacking information refers to the stacking content of the PCB board to be analyzed, including the number of layers of the PCB board to be analyzed, the thickness of each layer, the board type of each layer, the copper foil type, and the dielectric type.

[0042] The signal line wiring parameters include the specification parameters of the signal line and the wiring route of the signal line.

[0043] By clarifying the type of glass fiber cloth, we can know the weaving method of the glass fiber cloth, and then clarify the relative dielectric constant of the glass fiber cloth and resin, providing modeling parameters for subsequent model creation.

[0044] Optionally, the simulation modeling of the PCB board to be analyzed based on the stacking information, signal line routing parameters, signal line transmission line length, and glass fiber cloth type of the PCB board to be analyzed can be: first start the simulation software (such as HFSS software, etc.). Then, based on the attribute information, establish a model of the PCB board to be analyzed in the simulation software (including all layers, signal lines, vias, etc. of the PCB board). Then, perform frequency domain simulation based on the frequency domain simulation function of the simulation software to obtain a first transmission loss.

[0045] Alternatively, the model of the PCB to be analyzed may be directly obtained, and then the model may be imported into the simulation software. Then, the stacking information (plate type, copper foil type, etc.), center frequency point, and simulated frequency range information of the model may be set. Finally, a frequency domain simulation may be performed based on the frequency domain simulation function of the simulation software to obtain the first transmission loss.

[0046] Optionally, in addition to analyzing transmission loss, the model created here can also analyze indicators such as impedance fluctuation and skew deviation of differential pairs.

[0047] The specific method and principle of establishing the model of the PCB board to be analyzed according to the attribute information of the PCB board to be analyzed are well known to those skilled in the art and will not be described here for the sake of brief description.

[0048] S200: Obtain unit transmission loss.

[0049] The unit transmission loss is the transmission loss of the unit length signal line parallel to the weft of the glass fiber cloth in the PCB board to be analyzed due to the glass fiber effect.

[0050] The unit transmission loss may be acquired in advance and stored in a local storage medium, and can be directly called when needed, or may be acquired from a third party in real time when needed.

[0051] In one implementation manner, the unit transmission loss may also be obtained by simulating the transmission loss of the signal line in the PCB board to be analyzed using a glass fiber effect simulation model corresponding to the PCB board to be analyzed to obtain the unit transmission loss.

[0052] Among them, the glass fiber effect simulation model corresponding to the PCB board to be analyzed is: the parameters of the glass fiber cloth model in the glass fiber effect simulation model correspond to the parameters of the glass fiber cloth in the PCB board to be analyzed (for example, the width and length of the warp of the glass fiber cloth model are the same as the width and length of the warp of the glass fiber cloth). The specification parameters of the signal line in the glass fiber effect simulation model (including the width, thickness, weaving material, etc. of the signal line) are the same as the specification parameters of the signal line in the PCB board to be analyzed. The resin type of the signal line in the glass fiber effect simulation model (including the type and thickness of the resin, etc.) corresponds to the type of resin in the PCB board to be analyzed.

[0053] Optionally, the glass fiber effect simulation model is established by the following steps: first, the attribute information of the PCB board to be analyzed is obtained, wherein the attribute information includes: signal line specification parameters, glass fiber cloth type, and resin type. Then, the weft of the glass fiber cloth corresponding to the glass fiber cloth type is simulated by using the horizontally arranged rectangular blocks, and the warp of the glass fiber cloth corresponding to the glass fiber cloth type is simulated by using the vertically arranged rectangular blocks, so as to obtain a glass fiber cloth model corresponding to the glass fiber cloth type. Then, based on the signal line specification parameters, a test signal line parallel to the weft and with a length greater than or equal to the unit length is laid on the glass fiber cloth model. Finally, based on the resin type, a resin model is established on the glass fiber cloth model to obtain a glass fiber effect simulation model.

[0054] The glass fiber effect simulation model obtained by modeling based on the property information of the PCB board to be analyzed can be closer to the PCB board to be analyzed, so that the unit transmission loss simulated by using the glass fiber effect simulation model can more accurately reflect the transmission loss of the signal line in the PCB board to be analyzed.

[0055] In order to facilitate understanding of the above-mentioned use of horizontally arranged rectangular blocks to simulate the weft of the glass fiber cloth corresponding to the glass fiber cloth type, and use of vertically arranged rectangular blocks to simulate the warp of the glass fiber cloth corresponding to the glass fiber cloth type, the glass fiber cloth model corresponding to the glass fiber cloth type is obtained. Figure 2 (resin not shown) is used as an example for explanation.

[0056] like Figure 2 As shown, the horizontally arranged rectangular blocks are the warp lines of the glass fiber cloth model, and the vertically arranged rectangular blocks are the weft lines of the glass fiber cloth model.

[0057] Among them, the length, width and thickness of the horizontally arranged cuboids are determined according to the weft of the glass fiber cloth in the PCB board to be analyzed. The length, width and thickness of the vertically arranged cuboids are determined according to the warp of the glass fiber cloth in the PCB board to be analyzed. The spacing distance between two adjacent horizontally arranged cuboids is determined according to the spacing between two adjacent wefts of the glass fiber cloth in the PCB board to be analyzed. The spacing distance between two adjacent vertically arranged cuboids is determined according to the spacing between two adjacent warps of the glass fiber cloth in the PCB board to be analyzed.

[0058] In one implementation, the transmission loss of the signal line in the PCB to be analyzed is simulated using the glass fiber effect simulation model, and the specific method of obtaining the unit transmission loss can be: directly using the glass fiber effect simulation model to simulate the transmission loss of the signal line in the PCB to be analyzed to obtain the transmission loss. Then the transmission loss is divided by the length of the signal line in the PCB to be analyzed to obtain the unit transmission loss.

[0059] In one embodiment, the transmission loss of the signal line in the PCB board to be analyzed is simulated using a glass fiber effect simulation model, and the specific method of obtaining the unit transmission loss can be: first, the glass fiber effect simulation model is simulated to obtain the test transmission loss caused by the glass fiber effect. Then, the test signal line in the glass fiber effect simulation model is moved multiple times according to a preset offset, and the glass fiber effect simulation model after each movement of the test signal line is simulated to obtain the test transmission loss of the test signal line per unit length after each movement caused by the glass fiber effect; wherein the offset is less than the interval between adjacent wefts of the glass fiber cloth. Then, based on all the test transmission losses obtained, the unit transmission loss is obtained.

[0060] By moving the signal line multiple times according to the offset, multiple test transmission losses with different relative positions of the signal line and the glass fiber cloth can be obtained, and then the initial transmission loss is obtained by using all the test transmission losses. The initial transmission loss takes into account the various situations of different relative positions of the signal line and the glass fiber cloth, so that the initial transmission loss is more consistent with the actual situation of the signal line, and the final total transmission loss is more accurate.

[0061] The glass fiber effect simulation model can be imported into the simulation software to perform the above simulation analysis. The specific method of performing simulation analysis based on the model is well known to those skilled in the art and will not be described here for the sake of brief description.

[0062] Optionally, the preset offset may be a fixed value, and each movement is performed according to the fixed value.

[0063] The offset value can be set according to actual needs, and its specific value is not limited here.

[0064] Optionally, the preset offset may include multiple ones, and accordingly, the specific method of moving the test signal line in the glass fiber effect simulation model multiple times according to the preset offset may be: for the i-th offset, moving the test signal line in the glass fiber effect simulation model according to the i-th offset.

[0065] The test signal line in the glass fiber effect simulation model is moved according to the ith offset, and the position after the (i-1)th movement is used as the starting position, and the test signal line in the glass fiber effect simulation model is moved according to the ith offset.

[0066] Alternatively, the test signal line in the glass fiber effect simulation model is moved according to the i-th offset, or the initial position (in the glass fiber effect simulation model where the signal line is not moved, the position of the signal line is the initial position) is used as the starting position, and the test signal line in the glass fiber effect simulation model is moved according to the i-th offset.

[0067] In one implementation, the offset may be 1 / N of the spacing between adjacent wefts of the glass fiber cloth model in the glass fiber effect simulation model, where N is a positive integer greater than or equal to 2. Accordingly, the number of times the test signal line moves according to the offset is greater than or equal to N.

[0068] By setting the offset to 1 / N of the spacing between adjacent wefts of the fiberglass cloth, the relative position movement between the test signal line and the fiberglass cloth can be made more precise. By setting the number of times the test signal line moves according to the offset to be greater than or equal to N, the relative position between the test signal line and the fiberglass cloth can be obtained more comprehensively under the offset.

[0069] The larger the value of N is, the finer the relative position movement between the test signal line and the glass fiber cloth is, and accordingly, the final unit transmission loss is more accurate.

[0070] In one embodiment, the test transmission loss of the test signal line includes: the test transmission loss of the test signal line when the vertical projection area of ​​the test signal line on the glass fiber cloth does not coincide with the weft of the glass fiber cloth (such as Figure 3 In the case shown in the figure, the test transmission loss obtained by simulation), the test signal line when the vertical projection of the test signal line on the glass fiber cloth coincides with the weft of the glass fiber cloth, the test transmission loss of the test signal line (such as Figure 4 The test transmission loss obtained by simulation in the case shown).

[0071] Since the two situations that the vertical projection area of ​​the test signal line on the glass fiber cloth does not overlap with the weft lines of the glass fiber cloth, and the vertical projection area of ​​the test signal line on the glass fiber cloth is completely covered by the weft lines of the glass fiber cloth are relatively special, when obtaining the test transmission loss in these two situations, the accuracy of the initial transmission loss obtained is relatively higher.

[0072] In one implementation, based on all the test transmission losses obtained, the unit transmission loss can be obtained by dividing each test transmission loss by the length of the test signal line to obtain the unit test transmission loss. Then, the average value of all the unit test transmission losses is used as the final unit transmission loss.

[0073] Alternatively, the maximum and minimum values ​​of all the test transmission losses can be discarded, and then each of the remaining test transmission losses can be divided by the length of the test signal line to obtain the unit test transmission loss. Then, the average value of all the unit test transmission losses can be used as the final unit transmission loss.

[0074] S300: Obtaining a second transmission loss of the signal line in the PCB board to be analyzed based on a routing angle of each signal line segment in the PCB board to be analyzed, a length of each signal line segment, and a unit transmission loss.

[0075] The second transmission loss is the transmission loss of the signal line in the PCB board to be analyzed taking into account the influence of the glass fiber effect.

[0076] In one implementation manner, based on the routing angle, length, and unit transmission loss of each signal line in the PCB board to be analyzed, a specific method for obtaining the second transmission loss of the signal line may be: first, obtaining the glass fiber factor corresponding to the routing angle of each signal line in the PCB board to be analyzed. Then, based on the glass fiber factor corresponding to the routing angle of each signal line in the PCB board to be analyzed, the length of each signal line, and the unit transmission loss, the third transmission loss of each signal line due to the glass fiber effect is calculated. Finally, based on all the obtained third transmission losses, the second transmission loss is calculated.

[0077] In practical applications, the routing angle of each line segment included in the signal line may be different. Therefore, the third transmission loss is calculated for each line segment included in the signal line, so that the transmission loss of each line segment caused by the glass fiber effect can be accurately obtained. Then, the second transmission loss can be calculated based on all the third transmission losses, thereby improving the accuracy of the second transmission loss.

[0078] Optionally, the glass fiber factor corresponding to the routing angle of each signal line in the PCB to be analyzed can be pre-acquired and stored in a storage medium, and can be directly called when needed. Alternatively, it can be obtained from a third party in real time when needed.

[0079] Optionally, the glass fiber factor corresponding to the routing angle of each signal line in the PCB to be analyzed may be obtained by first obtaining the tangent function value of the routing angle corresponding to each signal line in the PCB to be analyzed. Then, based on the tangent function value of the routing angle corresponding to each signal line in the PCB to be analyzed, the glass fiber factor corresponding to each signal line is calculated; wherein the glass fiber factor corresponding to each signal line is equal to the inverse of the tangent function value of the routing angle of the signal line.

[0080] If α represents the routing angle and P represents the glass fiber factor, then P = 1 / tanα.

[0081] Among them, the routing angle corresponding to each signal line segment is: the angle between the signal line segment and the latitude line is converted into the angle in the first quadrant of the preset coordinate system. Among them, the angle in the second quadrant (90°~180°) is subtracted by 90° to obtain the angle in the first quadrant of the preset coordinate system. The angle in the third quadrant (180°~270°) is subtracted by 180° to obtain the angle in the first quadrant of the preset coordinate system. The angle in the fourth quadrant (270°~360°) is subtracted by 270° to obtain the angle in the first quadrant of the preset coordinate system.

[0082] For ease of understanding, Figure 5 Take the following example to illustrate this. Figure 5 As shown, the angle between line segment L1 and the latitude is A, which is in the first quadrant (less than 90° and greater than 0°), so no conversion is required. The angle between line segment L2 and the latitude is B1, but this angle is not in the first quadrant (greater than 90°), so it needs to be converted to the first quadrant, so the alignment angle of line segment L2 is B2.

[0083] The horizontal axis of the preset coordinate system is parallel to the latitude of the glass fiber cloth, and the vertical axis of the preset coordinate system is parallel to the warp of the glass fiber cloth.

[0084] Optionally, based on the glass fiber factor corresponding to the routing angle of each signal line in the PCB board to be analyzed, the length of each signal line, and the unit transmission loss, the method for calculating the third transmission loss of each signal line due to the glass fiber effect can be: calculate the product of the glass fiber factor corresponding to the routing angle of each signal line, the length of each signal line, and the unit transmission loss to obtain the third transmission loss of each signal line due to the glass fiber effect.

[0085] Optionally, based on all the obtained third transmission losses, the second transmission loss may be calculated by adding all the third transmission losses to obtain the third transmission loss.

[0086] For ease of understanding, let the unit transmission loss be X, the PCB board to be analyzed includes 4 signal lines, and the routing angle corresponding to signal line 1 is α1, and the length is L1; the routing angle corresponding to signal line 2 is α2, and the length is L2; ​​the routing angle corresponding to signal line 3 is α3, and the length is L3; the routing angle corresponding to signal line 4 is α4, and the length is L4. Then the second transmission loss = L1×(1 / tanα1)×X+L2×(1 / tanα2)×X+L3×(1 / tanα3)×X+L4×(1 / tanα4)×X. The examples here are only for ease of understanding and should not be used as limitations on this application.

[0087] In one implementation, based on the routing angle, length and unit transmission loss of each signal line in the PCB board to be analyzed, the specific method of obtaining the second transmission loss of the signal line can be: first determine the sum of the lengths of all signal lines with the same routing angle in the PCB board to be analyzed, and obtain the glass fiber factor corresponding to each routing angle. Then, for each routing angle, based on the product of the glass fiber factor corresponding to the routing angle, the sum of the lengths of the signal line corresponding to the routing angle, and the unit transmission loss, obtain the fourth transmission loss corresponding to the routing angle. Finally, sum all the fourth transmission losses obtained to obtain the second transmission loss.

[0088] S400: Determine the sum of the first transmission loss and the second transmission loss as the total transmission loss of the PCB board to be analyzed.

[0089] Since the first transmission loss does not take into account the glass fiber effect, while the second transmission loss takes into account the transmission loss caused by the glass fiber effect, the total transmission loss of the signal line in the PCB board to be analyzed can be obtained based on the first transmission loss and the second transmission loss. Thus, the impact of the actual transmission environment of the signal line on the signal transmission can be evaluated.

[0090] In order to facilitate the understanding of the above transmission loss simulation method, the following will combine Figure 6 Give an example.

[0091] like Figure 6 As shown, first obtain the stacking information, signal line wiring parameters, signal line transmission line length, and glass fiber cloth type of the PCB board to be analyzed. Then, based on the stacking information, signal line wiring parameters, signal line transmission line length, and glass fiber cloth type of the PCB board to be analyzed, perform simulation modeling analysis on the PCB board to be analyzed to obtain the first transmission loss.

[0092] Then, a glass fiber effect simulation model is established based on the signal line specification parameters, glass fiber cloth type, and resin type of the PCB board to be analyzed. Then, the glass fiber effect simulation model is simulated to obtain the test transmission loss caused by the glass fiber effect. The test signal line in the glass fiber effect simulation model is moved multiple times according to the preset offset, and the glass fiber effect simulation model after each movement of the test signal line is simulated to obtain the test transmission loss of the test signal line per unit length after each movement caused by the glass fiber effect. Finally, based on all the test transmission losses obtained, the unit transmission loss is obtained.

[0093] Based on the routing angle, length and initial transmission loss of each signal line in the PCB board to be analyzed, the second transmission loss of the signal line is obtained; wherein the second transmission loss is the transmission loss of the signal line in the PCB board to be analyzed when only the glass fiber effect is considered.

[0094] Finally, the sum of the first transmission loss and the second transmission loss is determined as the total transmission loss of the PCB board to be analyzed.

[0095] Figure 6 The specific implementation methods of each step shown have been clearly described in the previous text and will not be repeated here for the sake of brevity.

[0096] Based on the same technical concept, the present application also provides a transmission loss simulation device, such as Figure 7 As shown, the transmission loss simulation device 100 includes an acquisition module 110 and a processing module 120 .

[0097] The acquisition module 110 is used to acquire a first transmission loss of a signal line in a PCB board to be analyzed, wherein the first transmission loss is the transmission loss of the signal line in the PCB board to be analyzed without considering the influence of glass fiber effect.

[0098] The acquisition module 110 is also used to acquire a unit transmission loss, wherein the unit transmission loss is the transmission loss of a unit length signal line parallel to the weft line of the glass fiber cloth in the PCB board to be analyzed caused by the glass fiber effect.

[0099] The processing module 120 is used to obtain a second transmission loss of the signal line in the PCB board to be analyzed based on the routing angle of each signal line in the PCB board to be analyzed, the length of each signal line and the unit transmission loss; wherein the second transmission loss is the transmission loss of the signal line in the PCB board to be analyzed taking into account the influence of the glass fiber effect.

[0100] The processing module 120 is further configured to determine the sum of the first transmission loss and the second transmission loss as the total transmission loss of the PCB board to be analyzed.

[0101] The acquisition module 110 is specifically configured to simulate the transmission loss of the signal line in the PCB board to be analyzed by using the glass fiber effect simulation model corresponding to the PCB board to be analyzed, so as to obtain the unit transmission loss.

[0102] The acquisition module 110 is specifically used to simulate the glass fiber effect simulation model to obtain the test transmission loss caused by the glass fiber effect; move the test signal line in the glass fiber effect simulation model multiple times according to a preset offset, and simulate the glass fiber effect simulation model after each movement of the test signal line to obtain the test transmission loss of the test signal line per unit length after each movement caused by the glass fiber effect; wherein the offset is less than the interval between adjacent weft lines of the glass fiber cloth; and obtain the unit transmission loss based on all the test transmission losses obtained.

[0103] The acquisition module 110 is also used to obtain the attribute information of the PCB board to be analyzed, wherein the attribute information includes: signal line specification parameters, glass fiber cloth type, and resin type; using horizontally arranged rectangular blocks to simulate the weft of the glass fiber cloth corresponding to the glass fiber cloth type, and using vertically arranged rectangular blocks to simulate the warp of the glass fiber cloth corresponding to the glass fiber cloth type, to obtain a glass fiber cloth model corresponding to the glass fiber cloth type; based on the signal line specification parameters, laying out a test signal line on the glass fiber cloth model that is parallel to the weft and has a length greater than or equal to a unit length; based on the resin type, establishing a resin model on the glass fiber cloth model to obtain the glass fiber effect simulation model.

[0104] In one implementation, the offset is 1 / N of the spacing distance between adjacent weft lines of the glass fiber cloth model in the glass fiber effect simulation model, where N is a positive integer greater than or equal to 2; accordingly, the test signal line moves greater than or equal to N times according to the offset.

[0105] In one embodiment, the test transmission loss of the test signal line includes: the test transmission loss of the test signal line when the vertical projection area of ​​the test signal line on the glass fiber cloth does not coincide with the weft of the glass fiber cloth, and the test transmission loss of the test signal line when the vertical projection area of ​​the test signal line on the glass fiber cloth coincides with the weft of the glass fiber cloth.

[0106] The processing module 120 is specifically used to obtain the glass fiber factor corresponding to the routing angle of each signal line in the PCB board to be analyzed; based on the glass fiber factor corresponding to the routing angle of each signal line in the PCB board to be analyzed, the length of each signal line, and the unit transmission loss, calculate the third transmission loss of each signal line due to the glass fiber effect; based on all the obtained third transmission losses, calculate the second transmission loss.

[0107] The processing module 120 is specifically used to obtain the tangent function value of the routing angle corresponding to each signal line in the PCB board to be analyzed; based on the tangent function value of the routing angle corresponding to each signal line in the PCB board to be analyzed, calculate the glass fiber factor corresponding to each signal line; wherein the glass fiber factor corresponding to each signal line is equal to the inverse of the tangent function value of the routing angle of the signal line.

[0108] The transmission loss simulation device 100 provided in the embodiment of the present application has the same implementation principle and technical effects as those of the aforementioned transmission loss simulation method embodiment. For the sake of brief description, for matters not mentioned in the device embodiment, reference may be made to the corresponding contents in the aforementioned transmission loss simulation method embodiment.

[0109] See also Figure 8 , which is an electronic device 200 provided in an embodiment of the present application. The electronic device 200 includes: a processor 210 and a memory 220.

[0110] The memory 220 and the processor 210 are electrically connected to each other directly or indirectly to achieve data transmission or interaction. For example, these components can be electrically connected to each other via one or more communication buses or signal lines. The memory 220 is used to store computer programs, such as storing Figure 3 The software function module shown in the figure is the transmission loss simulation device 100. The transmission loss simulation device 100 includes at least one software function module that can be stored in the memory 220 in the form of software or firmware or fixed in the operating system (OS) of the electronic device 200. The processor 210 is used to execute the executable module stored in the memory 220, such as the software function module or computer program included in the transmission loss simulation device 100. At this time, the processor 210 is used to obtain a first transmission loss of the signal line in the PCB board to be analyzed, wherein the first transmission loss is the transmission loss of the signal line in the PCB board to be analyzed without considering the influence of the glass fiber effect; obtain a unit transmission loss; wherein the unit transmission loss is the transmission loss of the unit length signal line parallel to the weft line of the glass fiber cloth in the PCB board to be analyzed due to the glass fiber effect; based on the routing angle of each section of the signal line in the PCB board to be analyzed, the length of each section of the signal line and the unit transmission loss, obtain a second transmission loss of the signal line in the PCB board to be analyzed; wherein the second transmission loss is the transmission loss of the signal line in the PCB board to be analyzed considering the influence of the glass fiber effect; and determine the sum of the first transmission loss and the second transmission loss as the total transmission loss of the PCB board to be analyzed.

[0111] Among them, the memory 220 can be, but is not limited to, RAM (Random Access Memory), ROM (Read Only Memory), PROM (Programmable Read-Only Memory), EPROM (Erasable Programmable Read-Only Memory), EEPROM (Electric Erasable Programmable Read-Only Memory), etc.

[0112] The processor 210 may be an integrated circuit chip with signal processing capabilities. The above-mentioned processor may be a general-purpose processor, including a CPU (Central Processing Unit), an NP (Network Processor), etc.; it may also be a DSP (Digital Signal Processor), an ASIC (Application Specific Integrated Circuit), an FPGA (Field Programmable Gate Array) or other programmable logic devices, discrete gates or transistor logic devices, discrete hardware components. The various methods, steps and logic block diagrams disclosed in the embodiments of the present application may be implemented or executed. A general-purpose processor may be a microprocessor or the processor 210 may also be any conventional processor, etc.

[0113] The electronic device 200 mentioned above includes but is not limited to a personal computer, a server, etc.

[0114] The embodiment of the present application also provides a computer-readable storage medium (hereinafter referred to as storage medium), on which a computer program is stored, and when the computer program is run by a computer such as the above-mentioned electronic device 200, the transmission loss simulation method shown above is executed. The computer-readable storage medium includes: a U disk, a mobile hard disk, a read-only memory, a random access memory, a magnetic disk or an optical disk, and other media that can store program codes.

[0115] The above description is only the preferred embodiment of the present application and is not intended to limit the present application. For those skilled in the art, the present application may have various modifications and variations. Any modification, equivalent replacement, improvement, etc. made within the spirit and principle of the present application shall be included in the protection scope of the present application.

Claims

1. A transmission loss simulation method, characterized in that: include: Obtaining a first transmission loss of a signal line in a PCB board to be analyzed, wherein the first transmission loss is the transmission loss of the signal line in the PCB board to be analyzed without considering the influence of glass fiber effect; Obtaining a unit transmission loss; wherein the unit transmission loss is the transmission loss of a unit length signal line parallel to the weft line of the glass fiber cloth in the PCB board to be analyzed due to the glass fiber effect; Based on the routing angle of each signal line in the PCB board to be analyzed, the length of each signal line and the unit transmission loss, a second transmission loss of the signal line in the PCB board to be analyzed is obtained; wherein the second transmission loss is the transmission loss of the signal line in the PCB board to be analyzed considering the influence of the glass fiber effect; The sum of the first transmission loss and the second transmission loss is determined as the total transmission loss of the PCB board to be analyzed.

2. The method according to claim 1, characterized in that Get the unit transmission loss, including: The transmission loss of the signal line in the PCB board to be analyzed is simulated by using a glass fiber effect simulation model corresponding to the PCB board to be analyzed to obtain the unit transmission loss.

3. The method according to claim 2, characterized in that The transmission loss of the signal line in the PCB board to be analyzed is simulated by using the glass fiber effect simulation model to obtain the unit transmission loss, including: Simulating the glass fiber effect simulation model to obtain a test transmission loss caused by the glass fiber effect; The test signal line in the glass fiber effect simulation model is moved multiple times according to a preset offset, and the glass fiber effect simulation model is simulated after each movement of the test signal line to obtain the test transmission loss of the test signal line per unit length after each movement caused by the glass fiber effect; wherein the offset is less than the interval between adjacent wefts of the glass fiber cloth; Based on all the test transmission losses obtained, the unit transmission loss is obtained.

4. The method according to claim 2, characterized in that: The glass fiber effect simulation model is established by the following steps: Acquire the attribute information of the PCB board to be analyzed, wherein the attribute information includes: signal line specification parameters, glass fiber cloth type, and resin type; Using transversely arranged rectangular blocks to simulate the weft of the glass fiber cloth corresponding to the glass fiber cloth type, and using longitudinally arranged rectangular blocks to simulate the warp of the glass fiber cloth corresponding to the glass fiber cloth type, to obtain a glass fiber cloth model corresponding to the glass fiber cloth type; Based on the signal line specification parameters, a test signal line parallel to the weft line and having a length greater than or equal to the unit length is laid out on the glass fiber cloth model; Based on the resin type, a resin model is established on the glass fiber cloth model to obtain the glass fiber effect simulation model.

5. The method according to claim 3, characterized in that: The offset is 1 / N of the spacing between adjacent wefts of the glass fiber cloth model in the glass fiber effect simulation model, where N is a positive integer greater than or equal to 2; Correspondingly, the number of times the test signal line moves according to the offset is greater than or equal to N.

6. The method according to claim 3, characterized in that The test transmission loss of the test signal line includes: The test transmission loss of the test signal line when the vertical projection area of ​​the test signal line on the glass fiber cloth does not coincide with the weft of the glass fiber cloth, and the test transmission loss of the test signal line when the vertical projection area of ​​the test signal line on the glass fiber cloth coincides with the weft of the glass fiber cloth.

7. The method according to claim 1, characterized in that Based on the routing angle, length and unit transmission loss of each signal line in the PCB board to be analyzed, a second transmission loss of the signal line is obtained, including: Obtaining a glass fiber factor corresponding to a routing angle of each signal line in the PCB board to be analyzed; Based on the glass fiber factor corresponding to the routing angle of each signal line in the PCB board to be analyzed, the length of each signal line, and the unit transmission loss, the third transmission loss of each signal line caused by the glass fiber effect is calculated; Based on all the obtained third transmission losses, the second transmission loss is calculated.

8. The method according to claim 7, characterized in that Obtaining the glass fiber factor corresponding to the routing angle of each signal line in the PCB board to be analyzed, including: Obtain the tangent function value of the routing angle corresponding to each signal line in the PCB board to be analyzed; Based on the tangent function value of the routing angle corresponding to each signal line in the PCB board to be analyzed, the glass fiber factor corresponding to each signal line is calculated; wherein the glass fiber factor corresponding to each signal line is equal to the inverse of the tangent function value of the routing angle of the signal line.

9. A transmission loss simulation device, characterized in that: include: An acquisition module, used for acquiring a first transmission loss of a signal line in a PCB board to be analyzed, wherein the first transmission loss is the transmission loss of the signal line in the PCB board to be analyzed without considering the influence of glass fiber effect; The acquisition module is further used to acquire a unit transmission loss; wherein the unit transmission loss is the transmission loss of a unit length signal line parallel to the weft line of the glass fiber cloth in the PCB board to be analyzed caused by the glass fiber effect; A processing module, configured to obtain a second transmission loss of the signal line in the PCB board to be analyzed based on the routing angle of each signal line segment in the PCB board to be analyzed, the length of each signal line segment and the unit transmission loss; wherein the second transmission loss is the transmission loss of the signal line in the PCB board to be analyzed taking into account the influence of the glass fiber effect; The processing module is further used to determine the sum of the first transmission loss and the second transmission loss as the total transmission loss of the PCB board to be analyzed.

10. An electronic device, characterized in that: include: A memory and a processor, wherein the memory and the processor are connected; The memory is used to store programs; The processor is used to call the program stored in the memory to execute the method according to any one of claims 1 to 8.

11. A computer-readable storage medium, characterized in that: A computer program is stored thereon, and when the computer program is executed by a computer, the method according to any one of claims 1 to 8 is executed.

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