Flip chip welding process quality monitoring system

Abstract

The invention provides a flip chip welding process quality monitoring system, which comprises a data collection module, and is characterized in that data and image data of each device in a flip chip welding process are collected through the data collection module; the data storage module receives the information obtained by the data collection module, and stores the information after preliminary analysis; the data analysis module analyzes and processes the data and the content of the image data through analysis software and then outputs a result; and the data display module receives the analysis result pushed by the data analysis module, outputs the result in real time on visual equipment, and feeds back the result to an operator. According to the invention, quality monitoring is carried out on the flip chip welding process, video analysis and image synthesis technology and an abnormity feedback mechanism are realized through the monitoring camera, the data acquisition device and the image acquisition device, technical personnel can intervene and process in time after abnormity prompt is carried out through the monitoring system, and the traceability and troubleshooting of abnormal problems are facilitated. And poor welding is reduced.

Description

Technical Field

[0001] The invention relates to the field of semiconductor flip-chip mounting, in particular to the field of database technology, and specifically to a flip-chip welding process quality monitoring system. Background Art

[0002] Abnormal situations may occur during the flip chip welding process. Existing equipment usually alarms and shuts down, but it is impossible to monitor the existence of welding problems in real time, and it is also impossible to observe the status of the welding process in real time, such as whether the solder joints are uniform, whether there are false solder joints, cold solder joints, etc. If abnormal situations occur during the welding process, such as equipment failure, operational errors, etc., without image and data monitoring, they will not be discovered and handled in time, and early warning feedback will not be provided, thereby increasing safety risks.

[0003] The existing problems mainly exist in the following aspects:

[0004] 1. The existing flip chip welding process has no quality monitoring system, and it is impossible to monitor the image screen and data trend range of the patch data in real time;

[0005] 2. Abnormal product welding quality has become a chronic problem, and it is impossible to accurately grasp the current status of the problem and trace the source;

[0006] 3. When the equipment operating parameters are abnormal, there is no monitoring system to prompt the abnormality. When the welding process or data monitoring is abnormal, the technicians cannot intervene in time to deal with it. Summary of the invention

[0007] In view of the above-mentioned shortcomings of the prior art, an object of the present invention is to provide a flip chip welding process quality monitoring system to solve the difficulties of the prior art.

[0008] To achieve the above-mentioned and other related purposes, the present invention provides a flip chip welding process quality monitoring system, comprising:

[0009] A data collection module, wherein the data collection module includes an image collection unit and a data collection unit, and the data and image information of each device in the flip chip welding process are collected through the data collection module;

[0010] A data storage module, which receives information obtained from the data collection module and stores it after preliminary analysis;

[0011] Data analysis module: the data analysis module 6 analyzes and processes the data and image data through analysis software and outputs the results;

[0012] The data display module receives the analysis results pushed by the data analysis module, outputs the results in real time on the visualization device, and feeds back to the operator.

[0013] According to the preferred embodiment, the image acquisition unit includes a monitoring camera 1 and an image acquisition device 3. The monitoring camera 1 is installed on each device in the flip-chip soldering process and transmits the collected picture information to the image acquisition device 3 for collecting image data.

[0014] According to a preferred solution, the image acquisition device 3 is a video recorder.

[0015] According to the preferred embodiment, the flip chip soldering process includes a loading machine, a placement machine, a dispensing machine, a reflow soldering device and a unloading machine in sequence.

[0016] According to a preferred solution, the data acquisition unit adopts a data acquisition device 2 installed on the placement machine.

[0017] According to the preferred solution, the data acquisition device 2 collects the position information of the chip placement machine when it is working in real time and the position information of the chip placement head when it is working in real time.

[0018] According to the preferred solution, the data storage module includes a distributed storage device 4 and a central storage device 5;

[0019] The distributed storage device 4 receives data collected from the surveillance camera 1, the image acquisition device 3 and the data acquisition device 2;

[0020] The central storage device 5 receives data after preliminary processing from the distributed storage device 4 .

[0021] According to the preferred solution, the monitoring camera 1 , the image acquisition device 3 and the data acquisition device 2 are respectively provided with respective distributed storage devices 4 .

[0022] According to the preferred solution, the preliminary processing includes adjusting the clarity and contrast of the image data collected by the monitoring camera 1 and the image acquisition device 3;

[0023] It also includes checking the consistency and integrity of the data collected by the data collection device 2.

[0024] According to the preferred solution, the data display module includes a production line monitor 7 and a general monitoring terminal display 8;

[0025] The production line monitor 7 receives the analysis results of the data analysis module 6 and displays them on the production line monitor 7 used by front-line operators. When abnormal data is found, the software issues an alarm prompt;

[0026] The main monitoring terminal display 8 is synchronized with the data on the production line monitor 7 .

[0027] According to the preferred solution, the production line monitor 7 and the main monitoring terminal display 8 simultaneously display the image and data analysis results, including hardware and software information.

[0028] The present invention monitors the quality of the flip-chip soldering process, and implements video analysis and image synthesis technology and an abnormal feedback mechanism through monitoring cameras, data acquisition equipment, and image acquisition equipment. It can enable technical personnel to intervene in time after abnormal prompts are given through the monitoring system, facilitate tracing and troubleshooting of abnormal problems, and reduce the occurrence of poor soldering.

[0029] The best embodiment for carrying out the present invention will be described in more detail below with reference to the accompanying drawings so that the features and advantages of the present invention can be easily understood. BRIEF DESCRIPTION OF THE DRAWINGS

[0030] Figure 1 Shown is a schematic diagram of the process of the present invention;

[0031] Figure 2 Shown is a structural diagram of the present invention;

[0032] Description of symbols

[0033] 1. Surveillance camera; 2. Data acquisition equipment; 3. Image acquisition equipment; 4. Distributed storage equipment; 5. Central storage equipment; 6. Data analysis module. DETAILED DESCRIPTION

[0034] In order to make the purpose, technical solution and advantages of the technical solution of the present invention clearer, the technical solution of the embodiment of the present invention will be clearly and completely described in conjunction with the drawings of specific embodiments of the present invention. The same figure marks in the drawings represent the same parts. It should be noted that the described embodiments are part of the embodiments of the present invention, not all of the embodiments. Based on the described embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the present invention.

[0035] Compared to the embodiments shown in the drawings, feasible embodiments within the scope of the present invention may have fewer components, other components not shown in the drawings, different components, differently arranged components, or differently connected components, etc. In addition, two or more components in the drawings may be implemented in a single component, or a single component shown in the drawings may be implemented as multiple separate components.

[0036] Unless otherwise defined, the technical terms or scientific terms used herein shall have the usual meanings understood by persons of ordinary skill in the field to which the present invention belongs. The words "first", "second" and similar words used in the patent application specification and claims of the present invention do not indicate any order, quantity or importance, but are only used to distinguish different components. Similarly, words such as "one" or "one" do not necessarily indicate a quantity limitation. Words such as "include" or "comprise" mean that the elements or objects appearing before the word include the elements or objects listed after the word and their equivalents, without excluding other elements or objects. Words such as "connect" or "connected" are not limited to physical or mechanical connections, but may include electrical connections, whether direct or indirect. "Up", "down", "left", "right" and the like are only used to indicate relative positional relationships. When the absolute position of the described object changes, the relative positional relationship may also change accordingly.

[0037] The present invention provides a flip chip welding process quality monitoring system, which is used in the flip chip patch welding process. The present invention does not limit the type of welding products, but the flip chip welding process quality monitoring system is particularly suitable for memory sticks in the welding process and patch data in real time.

[0038] In general, the flip chip welding process quality monitoring system proposed in the present invention mainly includes a data collection module, a data storage module, a data analysis module, and a data display module. Figure 1 , which shows the arrangement relationship among the data collection module, data storage module, data analysis module and data display module.

[0039] In order to achieve the purpose of providing early warning feedback at the monitoring end when an abnormality occurs in the welding process or data monitoring, the problem that the existing equipment usually gives an alarm and shuts down when an abnormality occurs in the flip chip welding process in the background technology, but it is impossible to monitor the existence point of the welding problem in real time, and it is also impossible to observe the status of the welding process in real time, such as whether the solder joints are uniform, whether there are false solder joints, cold solder joints, etc. If an abnormal situation occurs during the welding process, such as equipment failure, operating error, etc., without image screen and data monitoring, it will not be possible to discover and handle it in time, as well as provide early warning feedback, thereby increasing the problem of safety risks. For this reason, in the technical solution provided in this embodiment, the flip chip welding process is quality monitored, and video analysis and image synthesis technology and abnormal feedback mechanism are realized through monitoring camera 1, data acquisition device 2 and image acquisition device 3, so that technical personnel can intervene in time after abnormal prompts are given through the monitoring system, which is convenient for tracing the source of abnormal problems and reducing the occurrence of poor welding.

[0040] In terms of structure, Figure 2As shown, the data collection module is installed on the loader, mounter, dispenser, reflow soldering equipment and unloader equipment included in the flip-chip soldering process, respectively, to realize the collection of data and image data. Specifically, the loader, mounter, dispenser, reflow soldering equipment and unloader equipment are respectively installed with monitoring cameras 1, and the data of each monitoring camera 1 is collected through the image acquisition device 3, that is, the video recorder, and the mounter is installed with a data acquisition device 2, which collects the position of the patch in the mounter when it is working in real time and the position information of the patch head when it is working in real time.

[0041] It should be specifically explained that the quality monitoring system provided in this embodiment includes the following modules: a data collection module, a data storage module, a data analysis module, and a data display module. According to the data collection module described above, the data and image data of each device in the flip-chip soldering process can be collected. Next, the information obtained from the data collection module is received in the data storage module, and stored after preliminary analysis. The data analysis module 6 analyzes and processes the content of the data and image data through analysis software, and then outputs the results. Finally, the analysis results pushed by the data analysis module are received through the data display module, and the results are output in real time on the visualization device and fed back to the operator.

[0042] As mentioned above, the data storage module includes a distributed storage device 4 and a central storage device 5, wherein the surveillance camera 1, the image acquisition device 3 and the data acquisition device 2 are respectively provided with respective distributed storage devices 4, which are used to store the image data collected by each and perform preliminary processing on the image data, and then uniformly store the image data in the central storage device 5 for preservation and the next step of data display;

[0043] The preliminary processing includes adjusting the clarity and contrast of the image data collected by the monitoring camera 1 and the image acquisition device 3. The distributed storage device 4 analyzes the image captured by the image acquisition unit through video analysis and image synthesis technology to ensure that the clarity and contrast of the image meet the requirements, so as to achieve accurate positioning and identification of the memory bar;

[0044] On this basis, the consistency and completeness of the data collected by the data acquisition device 2 are checked to check whether the data acquisition unit has completely recorded all necessary information, verify the accuracy of the data collected by the data acquisition unit, such as the location, size, type and other information of the memory, and analyze whether the data collected by the data acquisition unit at different times and between different batches are consistent, so as to ensure the accuracy of the subsequent welding process.

[0045] like Figure 2As shown, the data display module includes a production line monitor 7 and a main monitoring end display 8, wherein the production line monitor 7 is used to receive the analysis results of the data analysis module 6 and display them on the production line monitor 7 used by the front-line operators, and the software will give an alarm prompt when abnormal data is found; and the production line monitor 7 and the main monitoring end display 8 simultaneously and synchronously display the image and data analysis results, including hardware and software information.

[0046] In summary, the quality monitoring system provided in this embodiment includes the following workflow:

[0047] S1: monitoring camera 1, data acquisition device 2 and image acquisition device 3, to collect data and image information;

[0048] S2: After the acquisition is completed, the data and image data are uploaded to the distributed storage device 4 for storage;

[0049] S3: Data and image materials are initially analyzed and screened before being uploaded to the central storage device 5;

[0050] S4: The data and image processing terminal 6 analyzes and processes the data and image materials through software and outputs the results;

[0051] S5: The production line monitor 7 receives the data and the analysis results of the image processing terminal 6 and displays them on the production line display terminal. When there is abnormal data, the software will give an alarm prompt;

[0052] S6: At the same time, the results are synchronized on the main control terminal display 8, and the entire quality welding process monitoring system is completed.

[0053] The above embodiments are merely illustrative of the principles and effects of the present invention, and are not intended to limit the present invention. Anyone familiar with the art may modify or alter the above embodiments without departing from the spirit and scope of the present invention. Therefore, all equivalent modifications or alterations made by a person of ordinary skill in the art without departing from the spirit and technical concept disclosed by the present invention shall still be covered by the claims of the present invention.

Claims

1. A flip chip welding process quality monitoring system, characterized in that: include: A data collection module, wherein the data collection module includes an image collection unit and a data collection unit, and the data and image information of each device in the flip chip welding process are collected through the data collection module; A data storage module, which receives information obtained from the data collection module and stores it after preliminary analysis; A data analysis module, wherein the data analysis module (6) analyzes the data and the contents of the image data through analysis software and outputs the results; The data display module receives the analysis results pushed by the data analysis module, outputs the results in real time on the visualization device, and feeds back to the operator.

2. The flip chip welding process quality monitoring system according to claim 1, characterized in that: The image acquisition unit comprises a monitoring camera (1) and an image acquisition device (3); the monitoring camera (1) is installed on each device in the flip chip welding process, and transmits the acquired picture information to the image acquisition device (3) for collecting image data.

3. The flip chip welding process quality monitoring system according to claim 2, characterized in that: The flip chip soldering process includes a loading machine, a placement machine, a dispensing machine, a reflow soldering device and a unloading machine in sequence.

4. The flip chip welding process quality monitoring system according to claim 3, characterized in that: The data acquisition unit adopts a data acquisition device (2) installed on the chip placement machine.

5. The flip chip welding process quality monitoring system according to claim 4, characterized in that: The data storage module comprises a distributed storage device (4) and a central storage device (5); The distributed storage device (4) receives data collected from the monitoring camera (1), the image acquisition device (3) and the data acquisition device (2); The central storage device (5) receives data that has been preliminarily processed by the distributed storage device (4).

6. The flip chip welding process quality monitoring system according to claim 5, characterized in that: The preliminary processing includes adjusting the clarity and contrast of the image data collected by the monitoring camera (1) and the image acquisition device (3); It also includes checking the consistency and integrity of the data collected by the data collection device (2).

7. The flip chip welding process quality monitoring system according to claim 6, characterized in that: The data display module includes a production line monitor (7) and a general monitoring terminal display (8); The production line monitor (7) receives the analysis results of the data analysis module (6) and displays them on the production line monitor (7) used by front-line operators. When abnormal data is found, the software issues an alarm prompt; The main monitoring terminal display (8) is synchronized with the data on the production line monitor (7).

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