Epoxy resin curing device and curing method for superconducting tape

Abstract

According to the epoxy resin curing device and curing method for the superconducting tape, the resin injection pipe (10) is closed, and the vacuum pump (25) is started to exhaust air, so that the vacuum bag film (19) is in a vacuum state; the resin injection pipe (10) is opened, and the epoxy resin (9) enters the vacuum area through the resin injection pipe (10); after the epoxy resin (9) is fully infiltrated in the vacuum area, the resin injection pipe (10) and the resin delivery pipe (21) are closed, and the vacuum area is subjected to curing treatment; according to the epoxy resin curing device and method for the superconducting tape, the superconducting tape and the epoxy resin are combined by simulating the process of impregnating the epoxy resin under vacuum pressure, and it is guaranteed that no bubbles exist in colloid and the colloid is evenly spread on the surface of the tape.

Description

Technical Field

[0001] The present application relates to the technical field of superconducting tape curing, and in particular to an epoxy resin curing device and method for superconducting tape. Background Art

[0002] In superconducting magnets, epoxy resin is often used to cure the coils to improve the mechanical properties, insulation properties, and thermal conductivity of the magnets. Due to the small temperature margin, low-temperature superconducting magnets are prone to lose their superconductivity due to the cracking of the resin and the heat released by debonding cannot be dissipated. High-temperature superconducting materials are unlikely to lose their superconductivity due to their high temperature margin. However, their multi-layer structure leads to significant anisotropy in mechanical strength. During the cooling process, stress concentration occurs between the layers due to the different cooling shrinkage rates of the layers of material. The cooling shrinkage rate of epoxy resin is much greater than that of superconducting tape, making this situation more serious and generating strong stress on the conductor. When the stress is greater than the range that the conductor can withstand, the superconducting layer that transmits current will crack, peel off, or even break, and the result is that the critical current of the conductor decays.

[0003] Currently, most existing methods for curing superconducting tapes with epoxy resins use a hand-layup process to brush the colloid onto the surface of the tape. However, this method cannot simulate the vacuum pressure impregnation process of an actual coil, and there are problems such as bubbles inside the colloid, uneven brushing, and uneven surface after curing, which affects the test results of the critical current. Summary of the invention

[0004] In view of this, it is necessary to provide an epoxy resin curing device and method for superconducting tapes to ensure that there are no bubbles inside the colloid and the colloid is evenly spread on the surface of the superconducting tape in order to address the technical defects of the prior art.

[0005] To solve the above problems, this application adopts the following technical solutions:

[0006] One of the purposes of the present application is to provide an epoxy resin curing device for superconducting tapes, comprising: a water bath heater (8), an epoxy resin (9), a resin injection tube (10), a glass plate (11), a sealing strip (12), a demoulding cloth (13), a high-temperature superconducting tape (14), an optical fiber grating (15), a vacuum bag film (19), a resin outlet tube (21), a digital display heating plate (22), a resin collector (24) and a vacuum pump (25), wherein the glass plate (11) is mounted on the digital display heating plate (22), the upper surface of the glass plate (11) is sealed and connected to the vacuum bag film (19) to form a vacuum area, and the demoulding cloth (13) is arranged in a relatively arranged manner in the vacuum area, wherein ... The demoulding cloth (13) is located on the upper surface of the glass plate (11), the high-temperature superconducting tape (14) is fixed to the glass plate (11), and a plurality of optical fiber gratings (15) are evenly arranged on the upper surface of the high-temperature superconducting tape (14) and between two welding points thereof. The resin injection pipe (10) and the resin outlet pipe (21) are provided at both ends of the vacuum bag film (19), the resin injection pipe (10) extends into the epoxy resin (9), the epoxy resin (9) is placed in the water bath heating tank (8), the resin outlet pipe (21) is connected to the resin collector (24), and the resin collector (24) is connected to the vacuum pump (25) through a pipeline.

[0007] In some of the embodiments, the glass fiber cloth (18) is disposed on two opposite surfaces of the demoulding cloth (13) disposed opposite to each other.

[0008] In some of the embodiments, a sealing strip (12) is provided on the glass plate (11), the sealing strip (12) surrounds the glass plate (11) to form a rectangle, and there are no bubbles on the contact surface between the glass plate (11) and the sealing strip (12).

[0009] In some of the embodiments, a polyimide tape (20) is provided at the electrically connected portions of the two ends of the high temperature superconducting tape (14).

[0010] In some of the embodiments, the size of the release cloth (13) located above the high-temperature superconducting tape (14) is larger than the size of the high-temperature superconducting tape (14) and smaller than the area surrounded by the sealing strip (12).

[0011] In some embodiments, the size of the vacuum bag film (19) is larger than the rectangular area formed by the sealing strip (12).

[0012] In some of the embodiments, a vacuum gauge (23) is installed on the resin collector (24), and the vacuum gauge (23) observes the vacuum degree of the vacuum bag film (19).

[0013] The second object of the present application is to provide a curing method of the epoxy resin curing device for superconducting tape, comprising the following steps:

[0014] The upper surface of the glass plate (11) is sealed and connected to the vacuum bag film (19) to form a vacuum area, wherein the release cloth (13) is arranged opposite to the release cloth (13), wherein one of the release cloths (13) is located on the upper surface of the glass plate (11);

[0015] One of the demoulding cloths (13) is positioned on the upper surface of the glass plate (11), the high-temperature superconducting tape (14) is arranged between the glass fiber cloths (18), and a plurality of optical fiber gratings (15) are evenly arranged on the upper surface of the high-temperature superconducting tape (14) and between two welding points;

[0016] The high-temperature superconducting tape (14) is fixed to the glass plate (11), and another release cloth (13) is laid on the top of the high-temperature superconducting tape (14);

[0017] The resin injection pipe (10) and the resin outlet pipe (21) are provided at both ends of the vacuum bag film (19), the resin injection pipe (10) extends into the epoxy resin (9), the epoxy resin (9) is placed in the water bath heating tank (8), the resin outlet pipe (21) is connected to the resin collector (24), and the resin collector (24) is connected to the vacuum pump (25) through a pipeline;

[0018] The resin injection pipe (10) is closed, and the vacuum pump (25) is turned on to evacuate air, so that the vacuum bag film (19) is in a vacuum state;

[0019] The resin injection pipe (10) is opened, and the epoxy resin (9) enters the vacuum area through the resin injection pipe (10);

[0020] After the epoxy resin (9) has fully infiltrated the vacuum region, the resin injection pipe (10) and the resin outlet pipe (21) are closed, and the vacuum region is cured;

[0021] After curing is completed, a superconducting tape cured with epoxy resin is obtained from the glass plate (11).

[0022] This application adopts the above technical solution, and its beneficial effects are as follows:

[0023] The present application provides an epoxy resin curing device and a curing method for a superconducting tape, comprising: a water bath heater (8), an epoxy resin (9), a resin injection tube (10), a glass plate (11), a sealing tape (12), a demoulding cloth (13), a high-temperature superconducting tape (14), an optical fiber grating (15), a vacuum bag film (19), a resin outlet tube (21), a digital display heating plate (22), a resin collector (24) and a vacuum pump (25). The resin injection tube (10) is closed, and the vacuum pump (25) is turned on to evacuate air, so that the vacuum bag film (19) is in a vacuum state; the resin injection tube (10) is turned on, and the epoxy resin (9) enters the vacuum area through the resin injection tube (10); the vacuum pump (25) is turned on to evacuate air, so that the vacuum bag film (19) is in a vacuum state; the epoxy resin (9) is turned on to evacuate air from the resin injection tube (10); the vacuum pump (25) is turned on to evacuate air from the resin injection tube (10), and the epoxy resin (9) enters the vacuum area through the resin injection tube (10); the vacuum pump (25) is turned on to evacuate air from the resin injection tube (10). After the epoxy resin (9) is fully infiltrated in the vacuum area, the resin injection pipe (10) and the resin outlet pipe (21) are closed, and the vacuum area is cured; after the curing is completed, the superconducting tape cured with the epoxy resin is obtained from the glass plate (11). The epoxy resin curing device and curing method for the superconducting tape provided in the present application combine the superconducting tape with the epoxy resin by simulating the process of vacuum pressure impregnation of the epoxy resin, ensuring that there are no bubbles inside the colloid and that it is evenly spread on the surface of the tape; and the optical fiber grating is arranged on the surface of the tape to measure the strain during the epoxy resin curing process and the cooling process to liquid nitrogen in real time, so as to correspond to the attenuation amplitude of the critical current, thereby obtaining the correlation between the critical current attenuation and the strain distribution. BRIEF DESCRIPTION OF THE DRAWINGS

[0024] In order to more clearly illustrate the technical solutions of the embodiments of the present application, the drawings required for use in the embodiments of the present application or the description of the prior art will be briefly introduced below. Obviously, the drawings described below are only some embodiments of the present application. For ordinary technicians in this field, other drawings can be obtained based on these drawings without paying any creative work.

[0025] Figure 1 A schematic structural diagram of an epoxy resin curing device for a superconducting tape provided by the present invention;

[0026] Figure 2 A flow chart of the steps of the epoxy resin curing method for superconducting tape provided by the present invention;

[0027] Figure 3 A schematic diagram of the structure of a superconducting tape critical current testing device provided by the present invention;

[0028] Figure 4 A schematic diagram of the IV curve of the superconducting tape provided by the present invention before and after being cured with epoxy resin;

[0029] Figure 5 The strain curve of the superconducting tape during solidification provided by the present invention;

[0030] Figure 6 The present invention provides a strain curve of the superconducting tape during cooling and critical current testing after solidification. DETAILED DESCRIPTION

[0031] Embodiments of the present application are described in detail below, and examples of the embodiments are shown in the accompanying drawings, wherein the same or similar reference numerals throughout represent the same or similar elements or elements having the same or similar functions. The embodiments described below with reference to the accompanying drawings are exemplary and are intended to be used to explain the present application, and should not be construed as limiting the present application.

[0032] In the description of the present application, it should be understood that the terms "upper", "lower", "horizontal", "inside", "outside", etc., indicating orientations or positional relationships, are based on the orientations or positional relationships shown in the accompanying drawings, and are only for the convenience of describing the present application and simplifying the description, rather than indicating or implying that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and therefore should not be understood as a limitation on the present application.

[0033] In addition, the terms "first" and "second" are used for descriptive purposes only and should not be understood as indicating or implying relative importance or implicitly indicating the number of the indicated technical features. Thus, a feature defined as "first" or "second" may explicitly or implicitly include one or more of the features. In the description of this application, the meaning of "plurality" is two or more, unless otherwise clearly and specifically defined.

[0034] In order to make the objectives, technical solutions and advantages of the present application more clearly understood, the present application is further described in detail below in conjunction with the accompanying drawings and embodiments.

[0035] Example 1

[0036] See also Figure 1 , which is a schematic diagram of the structure of the epoxy resin curing device for superconducting tape provided in this embodiment, comprising: water bath heating (8), epoxy resin (9), resin injection pipe (10), glass plate (11), sealing strip (12), demoulding cloth (13), high temperature superconducting tape (14), fiber grating (15), vacuum bag film (19), resin outlet pipe (21), digital display heating plate (22), resin collector (24) and vacuum pump (25). The connection relationship of each component and its implementation method are described in detail below.

[0037] The glass plate (11) is mounted on the digital display heating plate (22). The digital display heating plate (22) provides a heating environment for the impregnation process, which facilitates the resin to fully flow and infiltrate; before work, the surface of the glass plate (11) needs to be wiped with alcohol to avoid the introduction of impurities.

[0038] The upper surface of the glass plate (11) is sealed and connected to the vacuum bag film (19) to form a vacuum area.

[0039] In this embodiment, a sealing strip (12) is provided on the glass plate (11), the sealing strip (12) surrounds the glass plate (11) to form a rectangle, and there are no bubbles on the contact surface between the glass plate (11) and the sealing strip (12). The size of the vacuum bag film (19) is larger than the rectangular area formed by the sealing strip (12) to avoid wrinkles when vacuuming.

[0040] The release cloths (13) are arranged opposite to each other in the vacuum area, wherein one of the release cloths (13) is located on the upper surface of the glass plate (11).

[0041] In this embodiment, the size of the demoulding cloth (13) located above the high-temperature superconducting tape (14) is larger than the size of the high-temperature superconducting tape (14) and smaller than the area surrounded by the sealing strip (12).

[0042] The high-temperature superconducting tape (14) is arranged between the glass fiber cloths (18), and a plurality of optical fiber gratings (15) are evenly arranged on the upper surface of the high-temperature superconducting tape (14) and in the portion between the two welding points.

[0043] In this embodiment, three fiber gratings are evenly arranged on the upper surface of the portion between the two welding points of the high temperature superconducting tape (14). Figure 1 In the fiber grating No. 1 (15), the fiber grating No. 2 (16) and the fiber grating No. 3 (17), three fiber gratings are arranged to measure the strain conditions of the three points.

[0044] In this embodiment, the glass fiber cloth (18) is arranged on two opposite surfaces of the demoulding cloth (13) arranged opposite to each other. The glass fiber cloth (18) can be combined with the epoxy resin infiltration and can reduce the cooling shrinkage rate of the epoxy resin to a certain extent.

[0045] In this embodiment, a polyimide tape (20) is provided at the electrically connected portions of the two ends of the high temperature superconducting tape (14).

[0046] It can be understood that the electrically connected portions at both ends of the high temperature superconducting tape (14) do not need to be impregnated with resin, so a layer of polyimide tape 20 is attached thereon to block the inflow of resin.

[0047] The resin injection tube (10) and the resin outlet tube (21) are provided at both ends of the vacuum bag film (19); the resin injection tube (10) extends into the epoxy resin (9); the epoxy resin (9) is placed in the water bath heating tank (8); the resin outlet tube (21) is connected to the resin collector (24); and the resin collector (24) is connected to the vacuum pump (25) through a pipeline.

[0048] It can be understood that the resin collector (24) is provided to facilitate observation of the vacuum degree of the system and prevent the resin from entering the vacuum pump through the pipeline and causing damage.

[0049] In this embodiment, a vacuum meter (23) is installed on the resin collector (24), and the vacuum meter (23) measures the vacuum degree of the vacuum bag film (19) in real time.

[0050] The epoxy resin curing device for superconducting tape provided in the above embodiment works as follows:

[0051] After the epoxy resin curing device of the superconducting tape is sealed, the resin injection pipe (10) is clamped with a water stop clamp, and the resin outlet pipe (21) is connected to a vacuum pump for exhaustion to ensure that there is no air leakage in the curing device after the exhaust is stopped; the manufactured curing device is connected to the epoxy resin (9) through the resin injection pipe (10) for resin impregnation; a heating environment is provided for the impregnation process through water bath heating (8) and a digital display heating plate (22) to facilitate the resin to flow and infiltrate fully. The vacuum degree of the curing device is observed by installing a resin collector (24) with a vacuum gauge (23), and the resin is prevented from entering the vacuum pump through the pipeline to cause damage.

[0052] After the epoxy resin is fully infiltrated in the curing device, the resin injection pipe (10) and the resin outlet pipe (21) are clamped with a water stop clamp to ensure that the curing device is sealed and leak-free. The curing device is placed in an oven for curing, and the optical fiber demodulator is connected from the vent at the top of the oven to measure the strain in real time; after the curing is completed, the vacuum bag film (19), the demoulding cloth (13) and other auxiliary materials are removed, and the required high-temperature superconducting tape (14) after epoxy resin curing is obtained from the glass plate (11). Note that the demoulding process needs to be careful to avoid damaging the tape and the optical fiber.

[0053] It can be understood that if a small amount of epoxy resin is stained on the electrical connection parts at both ends of the high-temperature superconducting tape (14), it can be ground off with sandpaper, and the voltage signal collection lead wire is welded again on the previous welding point, and it is installed on the superconducting tape critical current test device. According to the critical current test, during the test, the fiber Bragg grating can continuously measure the strain of the cooling process to liquid nitrogen.

[0054] The epoxy resin curing device for superconducting tape provided in the present embodiment 1 combines the superconducting tape with the epoxy resin by simulating the process of vacuum pressure impregnation of epoxy resin, thereby ensuring that there are no bubbles inside the colloid and that it is evenly spread on the surface of the tape; and uses a fiber grating arranged on the surface of the tape to measure in real time the strain during the epoxy resin curing process and the cooling process to liquid nitrogen, so as to correspond to the attenuation amplitude of the critical current, thereby obtaining the correlation between the critical current attenuation and the strain distribution.

[0055] Example 2

[0056] Please refer to Figure 2 , which is a step flow chart of the curing method of the epoxy resin curing device for the superconducting tape provided in Example 2 of the present application, including the following steps S110 to S180, and the implementation method of each step is described in detail below.

[0057] Step S110: The upper surface of the glass plate (11) is sealed and connected to the vacuum bag film (19) to form a vacuum area, wherein the release cloths (13) are arranged opposite to each other in the vacuum area, wherein one of the release cloths (13) is located on the upper surface of the glass plate (11).

[0058] It is understandable that the surface of the glass plate (11) needs to be cleaned with alcohol to avoid the introduction of impurities.

[0059] Step S120: one of the demoulding cloths (13) is positioned on the upper surface of the glass plate (11), the high-temperature superconducting tape (14) is arranged between the glass fiber cloths (18), and a plurality of optical fiber gratings (15) are evenly arranged on the upper surface of the high-temperature superconducting tape (14) and between its two welding points.

[0060] It can be understood that laying a layer of glass fiber cloth 18 on both the upper and lower surfaces of the high-temperature superconducting tape (14) facilitates the infiltration and bonding of the epoxy resin, and can also reduce the cooling shrinkage rate of the epoxy resin to a certain extent.

[0061] Step S130: fixing the high temperature superconducting tape (14) to the glass plate (11), and laying another release cloth (13) on top of the high temperature superconducting tape (14).

[0062] Specifically, another release cloth (13) is laid on the top of the high-temperature superconducting tape (14), and the size of the release cloth (13) should be larger than the high-temperature superconducting tape (14) and smaller than the area surrounded by the rubber strip.

[0063] Step S140: The resin injection tube (10) and the resin outlet tube (21) are provided at both ends of the vacuum bag film (19), the resin injection tube (10) extends into the epoxy resin (9), the epoxy resin (9) is placed in the water bath heating tank (8), the resin outlet tube (21) is connected to the resin collector (24), and the resin collector (24) is connected to the vacuum pump (25) through a pipeline.

[0064] Step S150: close the resin injection pipe (10), start the vacuum pump (25) to evacuate air, so that the vacuum bag film (19) is in a vacuum state.

[0065] Specifically, the resin injection pipe (10) is clamped with a water stop clamp, and the resin outlet pipe (21) is connected to a vacuum pump (25) for evacuation to ensure that there is no air leakage in the mold after the evacuation stops.

[0066] Step S160: Open the resin injection tube (10), and the epoxy resin (9) enters the vacuum area through the resin injection tube (10).

[0067] It can be understood that the water bath heating (8) and the digital display heating plate (22) provide a heating environment for the impregnation process, which is convenient for the resin to fully flow and infiltrate; a resin collector (24) with a vacuum gauge (23) is connected between the resin outlet pipe 21 and the vacuum pump 25 to facilitate the observation of the vacuum degree of the system and prevent the resin from entering the vacuum pump through the pipeline and causing damage.

[0068] Step S170: After the epoxy resin (9) has fully infiltrated the vacuum region, the resin injection pipe (10) and the resin outlet pipe (21) are closed, and the vacuum region is cured.

[0069] Specifically, after the epoxy resin is fully infiltrated, the resin injection tube (10) and the resin outlet tube (21) are clamped with a water stop clamp to ensure that the mold is sealed and leak-free; the entire curing device is placed in an oven for curing, and the optical fiber is led out from the vent at the top of the oven to connect to the optical fiber demodulator to measure the strain in real time.

[0070] Step S180: After curing is completed, a superconducting tape cured with epoxy resin is obtained from the glass plate (11).

[0071] After the curing is completed, the vacuum bag film (19), demoulding cloth (13) and other auxiliary materials are peeled off to obtain the required high-temperature superconducting tape (14) after epoxy resin curing from the glass plate (11). Note that the demoulding process needs to be done carefully to avoid damaging the tape and the optical fiber.

[0072] It can be understood that if a small amount of epoxy resin is stained on the electrical connection parts at both ends of the high-temperature superconducting tape (14), it can be ground off with sandpaper, and the voltage signal collection lead wire is welded again on the previous welding point, and it is installed on the superconducting tape critical current test device. According to the critical current test, during the test, the fiber Bragg grating can continuously measure the strain of the cooling process to liquid nitrogen.

[0073] The epoxy resin curing method for superconducting tape provided in Example 2 combines the superconducting tape with the epoxy resin by simulating the process of vacuum pressure impregnation of epoxy resin, ensuring that there are no bubbles inside the colloid and that it is evenly spread on the surface of the tape; and uses a fiber grating arranged on the surface of the tape to measure in real time the strain during the epoxy resin curing process and the cooling process to liquid nitrogen to correspond to the attenuation amplitude of the critical current, thereby obtaining the correlation between the critical current attenuation and the strain distribution.

[0074] Example 3

[0075] See also Figure 3 , a superconducting tape critical current testing device provided in Example 3 of the present application, which is used to perform a critical current testing on a superconducting tape that has been cured with epoxy resin, and comprises a stainless steel pressing block (1), a copper current conducting plate (2), a test frame insulating bottom plate (3), a high-temperature superconducting tape (4), a voltage signal acquisition lead (5) and an indium sheet (6).

[0076] The copper current conducting plates (2) are two and are arranged at intervals on the insulating bottom plate (3) of the test frame. The copper current conducting plates (2) and the insulating bottom plate (3) of the test frame can be fixed by bolts (7).

[0077] Furthermore, the copper current conductor (2) is L-shaped, and one vertical end of the copper current conductor (2) is used to be connected to a current conductor. A copper nose is welded to one end of the current conductor, and a close electrical connection is achieved with the insulating bottom plate (3) of the test frame through the copper nose and bolts (7).

[0078] The stainless steel pressing block (1) is fixedly mounted on any one of the copper current conducting plates (2), and the indium sheet (6) is arranged between the copper current conducting plate (2) and the insulating bottom plate (3) of the test frame.

[0079] Furthermore, the bolt (7) can pass through the stainless steel pressing block (1) and the copper current conducting plate (2) so as to fix the bolt (7) through the stainless steel pressing block (1) and the copper current conducting plate (2) to the insulating bottom plate (3) of the test frame.

[0080] Furthermore, the stainless steel pressing block (1) is designed to be thick in the middle and thin on both sides, so that the bolts (7) on both sides can apply a pressing force to press the high-temperature superconducting tape (4).

[0081] It can be understood that by padding the indium sheet (6) on the lower surface of the stainless steel pressing block (1) and the upper surface of the copper current conductor (2), the small gap between the high-temperature superconducting tape (4) and the copper current conductor (2) can be filled, thereby reducing the contact resistance.

[0082] The stainless steel pressing block 1 is designed to be thick in the middle and thin on both sides, so that it is convenient for bolts on both sides to apply a clamping force to clamp the high-temperature superconducting tape 4.

[0083] The high-temperature superconducting tapes (4) are connected between the indium sheets (6), and the voltage signal collection leads (5) are electrically connected to the high-temperature superconducting tapes (4).

[0084] Furthermore, the voltage signal collection lead (5) and the high-temperature superconducting tape (4) are electrically connected by welding, and the welding needs to use low-temperature solder (melting point below 200° C.) to avoid burning the tape.

[0085] The epoxy resin curing device for superconducting tape provided in the above embodiment works as follows: a DC power supply inputs a gradually increasing current to the high-temperature superconducting tape (4) through a current lead and a copper current conductor (2). Due to the superconductivity of the high-temperature superconducting tape at liquid nitrogen temperature, the measured voltage value is close to zero. As the current increases, the current value when the voltage value measured by the nanovoltmeter begins to rise is the critical current (the current value corresponding to the voltage rising to 1 μV / cm is defined as the critical current in the experiment). The epoxy resin curing device and testing method for superconducting tape are simple in structure and easy to operate.

[0086] See also Figure 4 , which is a critical current test curve of the strip cured with epoxy resin and not cured provided in Example 3, from Figure 4 It can be seen that the critical current of the high temperature superconducting tape (4) after being cured by epoxy resin has indeed decreased significantly.

[0087] See also Figure 5 , is the strain curve of the high temperature superconducting tape (4) provided in Example 3 during epoxy resin curing (taking fiber Bragg grating No. 2 as an example).

[0088] See also Figure 6 , which is the strain curve of the superconducting tape during the cooling and critical current test after epoxy resin curing provided in Example 3 (taking fiber Bragg grating No. 2 as an example).

[0089] It can be understood that the fiber grating is arranged on the surface of the high-temperature superconducting tape (4) to measure the strain during the epoxy resin curing process and the cooling process to liquid nitrogen in real time to correspond to the attenuation amplitude of the critical current, thereby obtaining the correlation between the critical current attenuation and the strain distribution.

[0090] It can be understood that the technical features of the above-described embodiments can be arbitrarily combined. In order to make the description concise, not all possible combinations of the technical features in the above-described embodiments are described. However, as long as there is no contradiction in the combination of these technical features, they should be considered to be within the scope of this specification.

[0091] The above are only preferred embodiments of the present application, and only specifically describe the technical principles of the present application. These descriptions are only for explaining the principles of the present application and cannot be interpreted as limiting the scope of protection of the present application in any way. Based on the explanation here, any modifications, equivalent substitutions and improvements made within the spirit and principles of the present application, and other specific implementation methods of the present application that can be associated with the technicians in this field without creative work, should be included in the scope of protection of the present application.

Claims

1. An epoxy resin curing device for superconducting tape, characterized in that: include: A water bath heater (8), epoxy resin (9), a resin injection tube (10), a glass plate (11), a sealing strip (12), a demoulding cloth (13), a high-temperature superconducting tape (14), an optical fiber grating (15), a vacuum bag film (19), a resin outlet tube (21), a digital display heating plate (22), a resin collector (24) and a vacuum pump (25), wherein the glass plate (11) is mounted on the digital display heating plate (22), the upper surface of the glass plate (11) is sealed and connected to the vacuum bag film (19) to form a vacuum area, wherein the demoulding cloth (13) arranged opposite to each other is arranged in the vacuum area, wherein one of the demoulding cloths (13) is located in the vacuum area. The glass plate (11) is fixed to the upper surface of the high-temperature superconducting tape (14), and a plurality of optical fiber gratings (15) are evenly arranged on the upper surface of the high-temperature superconducting tape (14) and between two welding points. The resin injection pipe (10) and the resin outlet pipe (21) are arranged at both ends of the vacuum bag film (19). The resin injection pipe (10) extends into the epoxy resin (9), and the epoxy resin (9) is placed in the water bath heating tank (8). The resin outlet pipe (21) is connected to the resin collector (24), and the resin collector (24) is connected to the vacuum pump (25) through a pipeline.

2. The epoxy resin curing device for superconducting tape according to claim 1, characterized in that: The glass fiber cloth (18) is arranged on two opposite surfaces of the demoulding cloth (13) arranged opposite to each other.

3. The epoxy resin curing device for superconducting tape according to claim 1 or 2, characterized in that: A sealing strip (12) is provided on the glass plate (11), the sealing strip (12) surrounds the glass plate (11) to form a rectangle, and there are no bubbles on the contact surface between the glass plate (11) and the sealing strip (12).

4. The epoxy resin curing device for superconducting tape according to claim 1, characterized in that: The electrically connected portions of the two ends of the high-temperature superconducting tape (14) are provided with a polyimide tape (20).

5. The epoxy resin curing device for superconducting tape according to claim 1, characterized in that: The size of the demoulding cloth (13) located above the high-temperature superconducting tape (14) is larger than the size of the high-temperature superconducting tape (14) and smaller than the area surrounded by the sealing strip (12).

6. The epoxy resin curing device for superconducting tape according to claim 3, characterized in that: The size of the vacuum bag film (19) is larger than the rectangular area formed by the sealing strip (12).

7. The epoxy resin curing device for superconducting tape according to claim 1, characterized in that: A vacuum gauge (23) is installed on the resin collector (24), and the vacuum gauge (23) observes the vacuum degree of the vacuum bag film (19).

8. A curing method of the epoxy resin curing device for superconducting tape as claimed in claim 1, characterized in that: The steps include: The upper surface of the glass plate (11) is sealed and connected to the vacuum bag film (19) to form a vacuum area, wherein the release cloth (13) is arranged opposite to the release cloth (13), wherein one of the release cloths (13) is located on the upper surface of the glass plate (11); One of the demoulding cloths (13) is positioned on the upper surface of the glass plate (11), the high-temperature superconducting tape (14) is arranged between the glass fiber cloths (18), and a plurality of optical fiber gratings (15) are evenly arranged on the upper surface of the high-temperature superconducting tape (14) and between two welding points; The high-temperature superconducting tape (14) is fixed to the glass plate (11), and another release cloth (13) is laid on the top of the high-temperature superconducting tape (14); The resin injection pipe (10) and the resin outlet pipe (21) are provided at both ends of the vacuum bag film (19), the resin injection pipe (10) extends into the epoxy resin (9), the epoxy resin (9) is placed in the water bath heating tank (8), the resin outlet pipe (21) is connected to the resin collector (24), and the resin collector (24) is connected to the vacuum pump (25) through a pipeline; The resin injection pipe (10) is closed, and the vacuum pump (25) is turned on to evacuate air, so that the vacuum bag film (19) is in a vacuum state; The resin injection pipe (10) is opened, and the epoxy resin (9) enters the vacuum area through the resin injection pipe (10); After the epoxy resin (9) has fully infiltrated the vacuum region, the resin injection pipe (10) and the resin outlet pipe (21) are closed, and the vacuum region is cured; After curing is completed, a superconducting tape cured with epoxy resin is obtained from the glass plate (11).

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