Substrate processing apparatus, method of controlling substrate processing apparatus, and manufacturing method thereof

Abstract

The invention discloses a substrate processing apparatus, a method of controlling the substrate processing apparatus, and a method of manufacturing the substrate processing apparatus. Specifically disclosed is a method of manufacturing a semiconductor device, which may include: a closing operation of placing a substrate on a support member provided in a cavity and closing the cavity to seal a processing space provided by the cavity; a clamping operation of clamping the chamber by moving the clamping body in a direction facing the chamber after the closing operation; a close contact operation of bringing the chamber into contact with the clamping body after the clamping operation; and a substrate processing operation of drying the substrate by supplying a supercritical fluid into the processing space.

Description

[0001] CROSS-REFERENCE TO RELATED APPLICATIONS

[0002] This application claims priority to and the benefit of Korean Patent Application No. 10-2023-0082876 filed in the Korean Intellectual Property Office on June 27, 2023, the entire contents of which are incorporated herein by reference. Technical Field

[0003] The present invention relates to a substrate processing apparatus, a method for controlling the substrate processing apparatus and a manufacturing method thereof. Background Art

[0004] In order to manufacture semiconductor devices, a desired pattern is formed on a substrate (such as a wafer) through various processes such as photography, etching, ashing, ion implantation, and thin film deposition. Various processing solutions and processing gases are used in each process, and particles and process by-products are generated during the process. Cleaning processes are performed before and after each process to remove these particles and process by-products from the substrate.

[0005] In the cleaning process, the substrate is cleaned by supplying a cleaning liquid to the substrate. The substrate is then dried to remove the cleaning liquid remaining on the substrate. An example of a drying process is a spin drying process, in which the substrate is rotated at high speed to remove the cleaning liquid remaining on the substrate. However, the spin drying process of rotating the substrate to remove the cleaning liquid has the risk of damaging the pattern formed on the substrate. In addition, as the aspect ratio of the pattern increases, the cleaning liquid introduced between the patterns due to the rotation of the substrate may not be fully removed.

[0006] Recently, a supercritical drying process has been adopted, in which the residual cleaning liquid on the substrate is replaced with an organic solvent having a low surface tension (such as isopropyl alcohol (IPA)), and then the substrate is supplied with a supercritical drying gas (e.g., carbon dioxide) to remove the residual organic solvent from the substrate. In the supercritical drying process, the drying gas is supplied into a closed chamber, and the drying gas is heated and pressurized. Both the temperature and pressure of the drying gas rise above the critical point, and the drying gas undergoes a phase change to reach a supercritical state.

[0007] The dry gas in the supercritical state has high solubility and permeability. In other words, when the supercritical dry gas is supplied to the substrate, the dry gas easily penetrates into the pattern on the substrate, and the organic solvent remaining on the substrate is also easily dissolved in the dry gas. Therefore, the pattern formed on the substrate and the organic solvent remaining between the patterns can be easily removed.

[0008] Figure 1 is a schematic diagram showing closed upper and lower chambers in a typical supercritical drying apparatus, and Figure 2 The clamping body is shown Figure 1 Schematic diagram of an example of a chamber.

[0009] Reference Figure 1 and 2 , a typical supercritical drying device includes an upper chamber 1, a lower chamber 2, an O-ring 3 and a clamping body 4. During substrate processing, the lower chamber 2 is in close contact with the upper chamber 1. The upper chamber 1 and the lower chamber 2 are combined with each other to form a treating space in which the substrate is processed. Since it is important for the supercritical drying process to keep the drying gas in a supercritical state, the pressure in the upper chamber 1 and the lower chamber 2 is pressurized and maintained at a high pressure. The clamping body 4 prevents the gap between the upper chamber 1 and the lower chamber 2 from being excessively expanded when the supercritical drying process is performed, and reduces the load applied to the drive that moves the lower chamber 2.

[0010] In order for the clamping body 4 to move frictionlessly with the upper chamber 1 and the lower chamber 2 when clamping the upper chamber 1 and the lower chamber 2, a certain gap needs to exist between the inner surface of the clamping body 4 and the surfaces of the upper chamber 1 and the lower chamber 2. When the gap between the upper chamber 1 and the lower chamber 2 is enlarged, the gap can be used as a space in which the upper chamber 1 and the lower chamber 2 can move. Figure 3 As shown, when high-pressure drying gas is supplied into the upper chamber 1 and the lower chamber 2, the upper chamber 1 and the lower chamber 2 move in the upward direction and the downward direction, respectively, and collide with the clamping body 4. When the upper chamber 1 and the lower chamber 2 collide with the clamping body 4, particles may be generated in the upper chamber 1 and the lower chamber 2, and the position of the substrate supported in the upper chamber 1 and the lower chamber 2 may be distorted, resulting in insufficient drying of the substrate. Summary of the invention

[0011] In order to solve the above problems, the present invention provides a substrate processing apparatus capable of efficiently processing a substrate, a method of controlling the substrate processing apparatus, and a manufacturing method thereof.

[0012] In addition, in order to solve the above problems, the present invention provides a substrate processing device capable of minimizing particles generated in a processing space provided by a chamber due to collision between the chamber and a holder, a method of controlling the substrate processing device, and a method of manufacturing a substrate.

[0013] Furthermore, in order to solve the above-mentioned problems, the present invention provides a substrate processing apparatus capable of minimizing the distortion of a substrate position even when a processing fluid is supplied into a chamber, a method of controlling the substrate processing apparatus, and a method of manufacturing the same.

[0014] The objects of the present invention are not limited thereto, and other objects not mentioned will be clearly understood from the following description by those of ordinary skill in the art.

[0015] An exemplary embodiment of the present invention provides an apparatus for processing a substrate, the apparatus comprising: a chamber defining a processing space in which the substrate is processed, wherein the chamber comprises: a first cavity and a second cavity, the first cavity being provided with a supporting member for supporting the substrate, the second cavity being coupled to the first cavity to define the processing space in which the substrate is processed; a moving unit for moving any one of the first cavity and the second cavity; a clamping body for clamping the chamber; a moving module for moving the clamping body between a clamping position for clamping the chamber and a releasing position for releasing the chamber; and a controller configured to control the moving unit and the moving module, wherein the controller is configured to control the moving unit so that the chamber is in close contact with the clamping body when the first cavity and the second cavity are in a closed position for sealing the processing space, and the clamping body is in the clamping position.

[0016] According to an exemplary embodiment, the controller may control the moving unit so that the first cavity is in close contact with the holder between the first cavity and the second cavity.

[0017] According to an exemplary embodiment, the device may further include: a fluid supply unit for supplying a treatment fluid to the treatment space, and the controller may further control the fluid supply unit to supply the treatment fluid to the treatment space after the first cavity is in close contact with the clamping body.

[0018] According to an exemplary embodiment, the device may further include: a housing having an inner space in which the chamber is disposed, wherein the first cavity may be fixed to the housing; and a buffer member may be installed between the first cavity and the housing.

[0019] According to an exemplary embodiment, the buffer may be configured such that the position of the first cavity is not changed when the first cavity and the second cavity are in close contact with each other, and the position of the first cavity is changed in a direction approaching the housing when the moving unit brings the first cavity into contact with the clamping body.

[0020] According to an exemplary embodiment, the buffer may include a spring.

[0021] According to an exemplary embodiment, the buffer may include: a first magnetic element, which is installed in a shell; and a second magnetic element, which is installed in a first cavity and faces the first magnetic element, and the first magnetic element and the second magnetic element may have the same polarity as each other so as to generate a repulsive force between the first magnetic element and the second magnetic element.

[0022] According to an exemplary embodiment, the buffer may include: a first magnetic element, which is installed in a shell; a second magnetic element, which is installed in a first cavity and faces the first magnetic element; a first current source, which is used to supply current to the first magnetic element; and a second current source, which is used to supply current to the second magnetic element.

[0023] According to an exemplary embodiment, the second cavity may be located below the first cavity, and the moving unit may be configured to move the second cavity in an upward and downward direction.

[0024] According to an exemplary embodiment, the second cavity may be located below the first cavity, and the moving unit may be configured to move the first cavity in an upward and downward direction.

[0025] According to an exemplary embodiment, at least one of the moving unit and the moving module may be configured to move the chamber or the holder in a magnetic levitation manner.

[0026] According to an exemplary embodiment, at least one of the moving unit and the moving module may be configured to include any one selected from the group consisting of a pneumatic cylinder, a hydraulic cylinder, and a motor.

[0027] According to an exemplary embodiment, the holder may have one surface having a shape recessed in a direction away from the chamber so as to be inserted into an edge portion of the chamber in a state of sealing the processing space.

[0028] Another exemplary embodiment of the present invention provides a method for controlling a substrate processing device, the substrate processing device comprising: a chamber, the chamber defining a processing space in which a substrate is processed, wherein the chamber comprises: a first cavity and a second cavity, the first cavity being provided with a supporting member for supporting the substrate, the second cavity being connected to the first cavity to define the processing space in which the substrate is processed; and a clamping body for clamping the chamber, the method comprising: a closing operation, the closing operation moving either the first cavity or the second cavity to seal the processing space; a clamping operation, the clamping operation moving the clamping body to clamp the chamber; a close contact operation, the close contact operation bringing at least one of the first cavity and the second cavity into contact with the clamping body; and a substrate processing operation, the substrate processing operation processing the substrate by supplying a processing fluid to the processing space after performing the close contact operation.

[0029] According to an exemplary embodiment, the close contact operation may include contacting between the first cavity and the second cavity, and between the first cavity and the holder.

[0030] According to example embodiments, when a substrate processing operation is performed, a pressure in the processing space may be greater than a pressure provided by a moving unit that moves any one of the first cavity and the second cavity.

[0031] Yet another exemplary embodiment of the present invention provides a manufacturing method, the manufacturing method comprising: a closing operation of placing a substrate on a supporting member provided in a cavity and closing the cavity to seal a processing space provided by the cavity; a clamping operation of clamping the cavity by moving a clamping body in a direction facing the cavity after the closing operation; a close contact operation of bringing the cavity into contact with the clamping body after the clamping operation; and a substrate processing operation of drying the substrate by supplying a supercritical fluid to the processing space.

[0032] According to an exemplary embodiment, the chamber may include a first cavity provided with a supporting member and a second cavity coupled with the first cavity to provide a processing space, and the close contact operation may include contacting the first cavity with the holder.

[0033] According to an exemplary embodiment, the supercritical fluid supplied to the substrate processing operation may bring the second cavity into contact with the holder.

[0034] According to an exemplary embodiment, the second cavity may be positioned below the first cavity, and the close contact operation may include moving the first cavity in an upward direction to bring the first cavity into contact with the holder.

[0035] According to the exemplary embodiments of the present invention, a substrate can be efficiently processed.

[0036] Further, according to the exemplary embodiment of the present invention, particles generated in a processing space provided by a chamber due to a collision between the chamber and a holder may be minimized.

[0037] Further, according to the exemplary embodiment of the present invention, even if the process fluid is supplied into the chamber, misalignment of the substrate can be minimized.

[0038] The effects of the present invention are not limited to the above-mentioned effects, and unmentioned effects will be clearly understood from the specification and the accompanying drawings by those skilled in the art. BRIEF DESCRIPTION OF THE DRAWINGS

[0039] Figure 1 is a schematic diagram showing the closed upper and lower chambers in a typical supercritical drying apparatus.

[0040] Figure 2 The clamping body is shown Figure 1 Schematic diagram of the chamber.

[0041] Figure 3 is a graph showing that when a supercritical fluid is supplied to Figure 1 Schematic diagram of the situation where the supercritical chamber collides with the clamping body when the supercritical chamber is in the supercritical chamber.

[0042] Figure 4 is a perspective view schematically illustrating a substrate processing apparatus according to an exemplary embodiment of the present invention.

[0043] Figure 5 It is schematically shown Figure 4 Schematic diagram of an exemplary embodiment of a liquid processing chamber.

[0044] Figure 6 It is schematically shown Figure 4 Schematic diagram of an exemplary embodiment of a drying chamber.

[0045] Figure 7 It is schematically shown Figure 6 A three-dimensional view of a housing and a fixing device and a moving module installed in the housing.

[0046] Figure 8 It is shown Figure 6 Schematic diagram of a partially enlarged view of the drying chamber.

[0047] Fig. 9 is a flowchart illustrating a method of controlling a substrate processing apparatus according to an exemplary embodiment of the present invention.

[0048] Fig.10 The drying chamber is shown to perform Fig. 9 Schematic diagram of the closing operation.

[0049] Fig.11 The drying chamber is shown to perform Fig. 9 Schematic diagram of the clamping operation.

[0050] Fig.12 The drying chamber is shown to perform Fig. 9 Schematic diagram of close contact operation.

[0051] Fig.13 The drying chamber is shown to perform Fig. 9 Schematic diagram of substrate processing operations.

[0052] Fig.14 is a schematic diagram illustrating a buffer member according to another exemplary embodiment of the present invention.

[0053] Fig.15 is a schematic diagram illustrating a buffer member according to another exemplary embodiment of the present invention.

[0054] Fig.16is a schematic diagram showing that an upper moving unit of the type is further provided in the drying chamber.

[0055] Fig.17 It is shown Fig.16 A schematic diagram of an upper moving unit moving the first cavity in an upward direction.

[0056] Fig.18 is a schematic diagram illustrating a drying chamber according to another exemplary embodiment of the present invention.

[0057] Fig.19 It is shown Fig.18 Schematic diagram of a drying chamber performing a closing operation and a clamping operation.

[0058] Fig. 20 It is shown Fig.18 Schematic diagram of a drying chamber performing close contact operation.

[0059] The various features and advantages of the non-limiting exemplary embodiments of the present specification can be made clearer after detailed description in conjunction with the accompanying drawings. The drawings are for reference only and should not be interpreted as limiting the scope of the claims. Unless explicitly stated, the drawings should not be considered to be drawn to scale. For the sake of clarity, the various dimensions in the drawings may be exaggerated. DETAILED DESCRIPTION

[0060] Example embodiments will now be described more fully with reference to the accompanying drawings. Example embodiments are provided to make the disclosure thorough and to fully convey the scope to those skilled in the art. Many specific details (such as examples of specific components, equipment and methods) are set forth to provide a thorough understanding of the embodiments of the present disclosure. It will be apparent to those skilled in the art that specific details do not need to be adopted, and example embodiments can be embodied in many different forms, and specific details should not be construed as limiting the scope of the present disclosure. In some example embodiments, known processes, known equipment structures and known technologies are not described in detail.

[0061] The terms used herein are only for the purpose of describing specific example embodiments and are not intended to be restrictive. As used herein, unless the context clearly indicates otherwise, the singular forms "a, an" and "the" may be intended to include plural forms. The terms "comprises, comprising", "including" and "having" are inclusive, and therefore specifically refer to the presence of the feature, integer, step, operation, element and / or component, but do not exclude the presence or increase of one or more other features, integers, steps, operations, elements, components and / or combinations thereof. Unless explicitly identified as an execution order, the method steps, processes and operations described herein should not be interpreted as having to be performed in the specific order discussed or illustrated. It should also be understood that additional or alternative steps may be adopted.

[0062] When an element or layer is referred to as being "on another element or layer," "engaged to another element or layer," "connected to another element or layer," or "coupled to another element or layer," the element or layer may be directly on another element or layer, directly engaged to another element or layer, connected to another element or layer, or coupled to another element or layer, or there may be intermediate elements or layers. Conversely, when an element is referred to as being "directly on another element or layer," "directly engaged to another element or layer," "directly connected to another element or layer," or "directly coupled to another element or layer," there may be no intermediate elements or layers. Other words used to describe the relationship between elements should be interpreted similarly (e.g., "between" versus "directly between," "adjacent" versus "directly adjacent," etc.). As used herein, the term "and / or" includes any and all combinations of one or more of the relevant listed items.

[0063] Although the terms "first", "second", "third", etc. can be used to describe different elements, components, regions, layers and / or sections in this article, unless otherwise specified, these elements, components, regions, layers and / or sections should not be limited by these terms. These terms can only be used to distinguish an element, component, region, layer and / or section from another region, layer and / or section. When used in this article, unless the context clearly indicates, terms such as "first", "second" and other numerical items do not imply order or sequence. Therefore, without departing from the teaching of the example embodiment, the first element, the first component, the first area, the first layer or the first section discussed below can be referred to as the second element, the second component, the second area, the second layer or the second section.

[0064] For ease of description, spatially relative terms (e.g., "inside," "outside," "below," "below," "below," "above," and "above," etc.) may be used herein to describe the relationship of one element or feature shown in the drawings to another (or other) element or feature. Spatially relative terms may be intended to cover different orientations of the device in use or operation in addition to the orientations described in the drawings. For example, if the device in the figure is turned over, an element described as being "below" or "beneath" other elements or features will subsequently be oriented to be "above" the other elements or features. Thus, the example term "below" may cover both above and below orientations. The device may be oriented in other ways (rotated 90 degrees or oriented in other orientations), and the spatially relative descriptors used herein are interpreted accordingly.

[0065] When the terms "same" or "identical" are used in the description of the exemplary embodiments, it should be understood that some imprecision may exist. Therefore, when an element or value is referred to as being the same as another element or value, it should be understood that the element or value is the same as the other element or value within a manufacturing or operating tolerance range (e.g., ±10%).

[0066] When the term "about" or "substantially" is used with a numerical value, it should be understood that the associated numerical value includes a manufacturing or operating tolerance (e.g., ±10%) around the numerical value. In addition, when the words "generally" and "substantially" are used in conjunction with geometric shapes, it should be understood that the exactness of the geometric shape is not required, but the latitude of the shape is within the scope of the present disclosure.

[0067] Unless otherwise defined, all terms (including technical and scientific terms) used herein have the same meaning as commonly understood by one of ordinary skill in the art to which the exemplary embodiments belong. It should be further understood that terms, including those defined in commonly used dictionaries, should be interpreted as having a meaning consistent with their meaning in the context of the relevant art, and will not be interpreted in an idealized or overly formal sense unless explicitly defined herein.

[0068] Hereinafter, the present invention will be described based on an example in which the substrate processing apparatus is a semiconductor apparatus for manufacturing a semiconductor device by processing a substrate W (eg, a wafer).

[0069] Figure 4 is a perspective view schematically illustrating a substrate processing apparatus according to an exemplary embodiment of the present invention.

[0070] Reference Figure 4, the substrate processing device includes an index module 10, a processing module 20 and a controller 30. When viewed from above, the index module 10 and the processing module 20 are arranged in one direction. Hereinafter, the direction in which the index module 10 and the processing module 20 are arranged is referred to as a first direction X, and when viewed from above, a direction perpendicular to the first direction X is referred to as a second direction Y, and a direction perpendicular to both the first direction X and the second direction Y is referred to as a third direction Z.

[0071] The index module 10 transfers the substrate W from the container C containing the substrate W therein to the processing module 20, and contains the substrate W processed in the processing module 20 into the container C. The longitudinal direction of the index module 10 is set in the second direction Y. The index module 10 includes a loading port 12 and an index frame 14. The loading port 12 is located at an opposite side of the processing module 20 based on the index frame 14. The container C containing the substrate W therein is placed in the loading port 12. A plurality of loading ports 12 may be provided, and the plurality of loading ports 12 may be placed along the second direction Y.

[0072] A sealed container such as a Front Open Unified Pod (FOUP) may be used as the container C. The container C may be placed on the load port 12 by a transfer device (not shown) such as an overhead conveyor, an overhead conveyor, or an automated guided vehicle, or by an operator.

[0073] The index robot 120 is disposed in the index frame 14. A guide rail 124 whose longitudinal direction is disposed in the second direction Y is disposed in the index frame 14, and the index robot 120 may be disposed to be movable on the guide rail 124. The index robot 120 includes a hand 122 on which the substrate W is placed, and the hand 122 may be disposed to be movable in forward and backward directions, rotatable around a third direction Z, and movable along the third direction Z. A plurality of hands 322 may be disposed at intervals in the vertical direction, and the hands 322 may be movable forward and backward independently of each other.

[0074] The processing module 20 includes a buffer unit 200, a transfer chamber 300, a liquid processing chamber 400, and a drying chamber 500. The buffer unit 200 provides a space in which the substrate W loaded into the processing module 20 and the substrate W unloaded from the processing module 20 temporarily stay. The liquid processing chamber 400 performs a liquid processing process of processing the substrate W with liquid by supplying liquid onto the substrate W. The drying chamber 500 performs a drying process of removing liquid remaining on the substrate W. The transfer chamber 300 transfers the substrate W between the buffer unit 200, the liquid processing chamber 400, and the drying chamber 500.

[0075] The buffer unit 200 includes a plurality of buffers 220 on which the substrate W is placed. The buffers 220 may be disposed to be spaced apart from each other along the third direction Z. The buffers 220 may be substrate holders supporting the bottom surface of the substrate W. The buffers 220 may be provided in the form of a support frame supporting the bottom surface of the substrate W.

[0076] The front and rear of the buffer unit 200 are open. The front is a face facing the index module 10, and the rear is a face facing the transfer chamber 300. The index robot 120 can approach the buffer unit 200 through the front, and the transfer robot 320 can approach the buffer unit 200 through the rear.

[0077] The longitudinal direction of the transfer chamber 300 may be disposed in the first direction X. The buffer unit 200 may be disposed between the index module 10 and the transfer chamber 300. The liquid processing chamber 400 and the drying chamber 500 may be disposed on a side of the transfer chamber 300. The liquid processing chamber 400 and the transfer chamber 300 may be disposed along the second direction Y. The drying chamber 500 and the transfer chamber 300 may be disposed along the second direction Y. The buffer unit 200 may be located at one end of the transfer chamber 300.

[0078] According to an example, the liquid processing chamber 400 is disposed on both sides of the transfer chamber 300, and the drying chamber 500 is disposed on both sides of the transfer chamber 300, and the liquid processing chamber 400 may be disposed closer to the buffer unit 200 than the drying chamber 500. At one side of the transfer chamber 300, the liquid processing chamber 400 may be disposed in the number of an A×B array (each of A and B is a natural number of 1 or greater than 1) in the first direction X and the third direction Z. Further, at one side of the transfer chamber 300, the drying chamber 500 may be disposed in the number of a C×D array (each of C and D is a natural number of 1 or greater than 1) in the first direction X and the third direction Z. Different from the above, only the liquid processing chamber 400 may be disposed on one side of the transfer chamber 300, and only the drying chamber 500 may be disposed on the other side of the transfer chamber 300.

[0079] The transfer chamber 300 includes a transfer robot 320. A guide rail 324 whose longitudinal direction is set in the first direction X may be provided in the transfer chamber 300, and the transfer robot 320 may be provided to be movable on the guide rail 324. The transfer robot 320 includes a hand 322 on which the substrate W is placed, and the hand 322 may be provided to be movable in the forward and backward directions, rotatable around the third direction Z, and movable along the third direction Z. A plurality of hands 322 may be provided to be spaced apart in the vertical direction, and the plurality of hands 322 may be moved forward and backward independently of each other.

[0080] The controller 30 can control the substrate processing device. The controller 30 may include: a process controller, which is composed of a microprocessor (computer) that performs control of the substrate processing device; a user interface, which is composed of a keyboard in which an operator performs command input operations, etc. to manage the substrate processing device; a display, which is used to visualize and display the operating status of the substrate processing device, etc.; and a storage unit, which stores a control program for executing a process performed in the substrate processing device under the control of the process controller, or stores a program (i.e., a processing scheme) for executing a process in each component according to various data and processing conditions. Further, the user interface and the storage unit may be connected to the process controller. The processing scheme may be stored in a storage medium in the storage unit, and the storage medium may be a hard disk, a portable disk (such as a CD-ROM or a DVD), or a semiconductor memory (such as a flash memory).

[0081] The controller 30 may control the configuration of the substrate processing apparatus to perform a substrate processing method described below.

[0082] Figure 5 It is schematically shown Figure 4 Schematic diagram of an exemplary embodiment of a liquid processing chamber.

[0083] Reference Figure 5 The liquid processing chamber 400 includes a housing 410 , a processing container 420 , a supporting unit 440 , a liquid supply unit 460 , and a lifting unit 480 .

[0084] The housing 410 may have an inner space for processing the substrate W. The housing 410 may have a substantially parallelepiped shape. For example, the housing 410 may have a cubic shape. In addition, the housing 410 may have an opening (not shown) through which the substrate W is loaded or unloaded. In addition, the housing 410 may be equipped with a door (not shown) that selectively opens and closes the opening.

[0085] The processing container 420 may have a cylindrical shape with an open top. The processing container 420 may provide a processing space for processing the substrate W. The support unit 440 supports the substrate W in the processing space. The liquid supply unit 460 supplies a processing liquid to the substrate W supported by the support unit 440. A plurality of types of processing liquids may be provided, and the plurality of types of processing liquids may be sequentially supplied to the substrate W. The lifting unit 480 adjusts a relative height between the processing container 420 and the substrate W placed on the support unit 440.

[0086] In one example, the processing container 420 has a plurality of collecting containers 422, 424, and 426. Each of the collecting containers 422, 424, and 426 has a collecting space for collecting liquid used to process the substrate. Each of the collecting containers 422, 424, and 426 is disposed in an annular shape around the supporting unit 440. As the liquid treatment process proceeds, the processing liquid scattered by the rotation of the substrate W enters the collecting space through the inlets 422a, 424a, and 426a of the respective collecting containers 422, 424, and 426. In one example, the processing container 420 has a first collecting container 422, a second collecting container 424, and a third collecting container 426. The first collecting container 422 is disposed around the supporting unit 440, the second collecting container 424 is disposed around the first collecting container 422, and the third collecting container 426 is disposed around the second collecting container 424.

[0087] The second inlet 424a that introduces liquid into the second collection container 424 may be positioned above the top side of the first inlet 422a that introduces liquid into the first collection container 422, and the third inlet 426a that introduces liquid into the third collection container 426 may be positioned above the top side of the second inlet 424a.

[0088] The supporting unit 440 includes a supporting plate 442 and a driving shaft 444. The upper surface of the supporting plate 442 may be provided in a substantially circular shape and may have a diameter larger than the diameter of the substrate W. An edge region of the top surface of the supporting plate 442 may be provided with supporting pins 442a that support the rear surface of the substrate W. The supporting pins 442a are provided with top ends protruding from the supporting plate 442 so that the substrate W is spaced a predetermined distance from the supporting plate 442.

[0089] The chuck pin 442b is provided to the edge of the top surface of the support plate 442. The chuck pin 442b may be provided at the outer side of the support pin 442a. The chuck pin 442b is provided to protrude upward from the support plate 442 and clamp the lateral portion of the substrate W so that the substrate W is not separated from the support unit 440 when the substrate W rotates. The driving shaft 444 is driven by the driver 446 and is coupled to the center of the lower surface of the support plate 442, and rotates the support plate 442 around its central axis.

[0090] The liquid supply unit 460 may supply the processing liquid to the substrate W. The liquid supply unit 460 may include an arm 461, a nozzle 462, and a driver 463. The nozzle 462 may be installed at one end of the arm 461 in a rod shape. The driver 463 may be configured in the form of a rotating shaft with a third direction Z as an axis of rotation, and may be coupled to the other end of the arm 461. The driver 463 may axially rotate the arm 461 by rotating along the third direction Z as the axis of rotation. Therefore, the position of the nozzle 462 installed at one end of the arm 461 may be changed.

[0091] The nozzle 462 can supply the processing liquid to the substrate W. The processing liquid can be a chemical substance, a rinse solution or an organic solvent. The chemical substance can be a chemical substance with strong acid or strong base properties. Further, the rinse solution can be pure water. In addition, the organic solvent can be isopropyl alcohol (IPA).

[0092] Although Figure 5 Only one nozzle 462 is shown in the figure, but the liquid supply unit 460 may include a plurality of nozzles 462, each of which may be configured to supply a different type of processing liquid. For example, one of the nozzles 462 may supply a chemical substance, another of the nozzles 462 may supply a rinsing liquid, and another of the nozzles 462 may supply an organic solvent. Further, the controller 30 may control the liquid supply unit 460 to supply the rinsing liquid from one of the nozzles 462 to the substrate W, and then supply the organic solvent from another of the nozzles 462. Therefore, the rinsing liquid supplied to the substrate W can be replaced with an organic solvent having a small surface tension.

[0093] The lifting unit 480 may move the processing container 420 in an upward or downward direction. The relative height between the processing container 420 and the substrate W changes as the processing container 420 moves up and down. The lifting unit 480 may include a power generating device such as a motor, a cylinder, or a hydraulic cylinder. The lifting unit 480 may adjust the height of the processing container 420 to distinguish the collection containers 422, 424, and 426 for collecting the processing liquid according to the type of liquid supplied to the substrate W.

[0094] Alternatively, as described above, the processing container 420 may be fixedly installed, and the support plate 442 may be configured to be movable in the up-down direction.

[0095] Figure 6 For schematic illustration Figure 4 A schematic diagram of an exemplary embodiment of a drying chamber, and Figure 7 For schematic illustration Figure 6 A three-dimensional view of a housing and a fixing device and a moving module installed in the housing.

[0096] Reference Figure 6 and Figure 7 According to an exemplary embodiment of the present invention, the drying chamber 500 may include a base frame 510 , a chamber 520 , a fluid supply unit 530 , a fluid discharge unit 540 , a clamping unit 550 , a lower moving unit 560 , and a buffer 570 .

[0097] The base frame 510 may provide an inner space in which a chamber 520 described later may be placed. The base frame 510 may include a housing 512 and a middle plate 514.

[0098] The housing 512 may have a container shape that is generally in a cubic shape. The housing 512 may have an internal space. In the internal space of the housing 512, the chamber 520, the first clamping body 551 and the second clamping body 552 of the clamping unit 550, the lower moving unit 560, and the buffer 570 may be disposed.

[0099] The middle plate 514 may be installed in the inner space of the housing 512, and may have the shape of a plate whose central area is hollow. The inner space of the housing 512 may be divided into an upper space 510a and a lower space 510b by the middle plate 514. The first cavity 521, the first clamping body 551 and the second clamping body 552 may be provided in the upper space 510a, and the lower moving unit 560 may be provided in the lower space 510b. The second cavity 522 may move between the lower space 510b and the upper space 510a by the lower moving unit 560. The second cavity 522 may move between the upper space 510a and the lower space 510b by passing through the hollow formed in the middle plate 514.

[0100] In addition, a plurality of moving modules 553 may be installed on the top of the housing 512. Some of the moving modules 553 may be configured to move the first clamping body 551, and other moving modules 553 may be configured to move the second clamping body 552.

[0101] The chamber 520 may include a first cavity 521 and a second cavity 522. The second cavity 522 may be located below the first cavity 521. The first cavity 521 may be an upper body positioned in an upper portion, and the second cavity 522 may be a lower body positioned in a lower portion.

[0102] The first cavity 521 may have a flat bottom surface and may be shaped such that the height of the center area of ​​the top surface is higher than the height of the edge area of ​​the top surface. The second cavity 522 may have a top surface formed to be recessed from top to bottom to define the processing space 520a, and may be shaped such that the height of the edge area of ​​the top surface is higher than the height of the center area of ​​the bottom surface. When the first cavity 521 and the second cavity 522 are assembled together, at least a portion of the edge area of ​​the first cavity 521 and the second cavity 522 may have a shape inserted into the clamping bodies 551 and 552 described later.

[0103] The chamber 520 may provide a processing space 520a in which a substrate W is processed. The first chamber 521 and the second chamber 522 may be assembled with each other to provide the processing space 520a in which a substrate W is processed. The processing space 520a may be opened or sealed by moving any one of the first chamber 521 and the second chamber 522 .

[0104] For example, the second cavity 522 can move in an upward direction to define a sealed processing space 520a with the first cavity 521 (or optionally with the first cavity 521 and the sealing member 527). This position of the second cavity 522 can be defined as a closed position. Further, the second cavity 522 can move in a downward direction and separate from the first cavity 521 to open the processing space 520a. This position of the second cavity 522 can be defined as an open position.

[0105] The first cavity 521 may be provided with a first supply port 523. The first supply port 523 may be formed by machining a hole in the first cavity 521 itself, or may be provided in the form of a hole in which a tube is inserted into the hole formed in the first cavity 521.

[0106] The first supply port 523 may be connected to a first supply line 531 described later. The first supply port 523 may supply a processing fluid to the processing space 520a. The outlet of the first supply port 523 may be configured to face the lower area of ​​the processing space 520a. The outlet of the first supply port 523 may face the upper surface of the substrate W placed on the support member 528.

[0107] The second cavity 522 may be provided with a second supply port 524 and a discharge port 525. The second supply port 524 and the discharge port 525 may be formed by machining holes in the second cavity 522 itself, or may be provided in the form of a hole in which a tube is inserted.

[0108] The second supply port 524 may be connected to a second fluid supply line 533 described later. The second supply port 524 may supply the processing fluid to the processing space 520a. The outlet of the second supply port 524 may be configured to face the upper area of ​​the processing space 520a. The outlet of the second supply port 524 may be arranged to face the blocking member 529 described later.

[0109] The exhaust port 525 may be connected to an exhaust line 541 described later. The exhaust port 525 may be located in parallel with the second supply port 524. The exhaust port 525 may exhaust the atmosphere of the processing space 520a through the exhaust line 541.

[0110] The chamber 520 may be provided with a heater 526 , a sealing member 527 , a supporting member 528 , and a blocking member 529 .

[0111] The heater 526 may be installed while being buried in the chamber 520. The heater 526 may generate heat to maintain the temperature of the processing space 520a at a set temperature. The set temperature may be a temperature equal to or higher than a critical temperature, at which the processing fluid supplied to the processing space 520a may maintain a supercritical state. The heater 526 may be installed while being buried in the first cavity 521. However, without limitation, the heater 526 may also be installed while being buried in the second cavity 522.

[0112] The sealing member 527 can seal the processing space 520a so that when the second cavity 522 is in the closed position, the processing fluid supplied to the processing space 520a does not leak from the processing space 520a. The sealing member 527 can be an O-ring. The sealing member 527 can be formed of an elastic material. The sealing member 527 can be formed of rubber or an elastic plastic material.

[0113] The sealing member 527 may be installed between the first cavity 521 and the second cavity 522. For example, the sealing member 527 may be installed by being inserted into an annular groove formed in an edge region of a top surface of the second cavity 522.

[0114] The support member 528 may support the substrate W. The support member 528 may be configured to support the bottom surface of the substrate W. The support member 528 may be mounted on the bottom surface of the first cavity 521. The support member 528 may be provided in pairs. The support member 528 may extend in a top-to-bottom direction and may have an end portion of a shape that is bent in a horizontal direction. The support member 528 may be configured to support only the bottom surface edge region of the substrate W, which may reduce the risk of scratching the bottom surface of the substrate W.

[0115] The blocking member 529 may block the high pressure processing fluid supplied from the second supply port 524 from being directly supplied to the lower surface of the substrate W. The blocking member 529 may include a blocking plate 529 a facing the outlet of the second supply port 524 , and legs 529 b making the blocking plate 529 a face away from the second chamber 522 .

[0116] The fluid supply unit 530 may supply the processing fluid to the processing space 520a. The fluid supply unit 530 may supply carbon dioxide as a supercritical fluid to the processing space 520a. The processing fluid supplied to the processing space 520a may dry the substrate W by removing an organic solvent (such as IPA) that may remain on the substrate W.

[0117] The fluid supply unit 530 may include a first supply line 531, a first supply valve 532, a second supply line 533, and a second supply valve 534. The first supply line 531 and the second supply line 533 may receive a treatment fluid from a fluid supply source (not shown), and may supply the treatment fluid to the treatment space 520a. The first supply line 531 may be connected to the first supply port 523 described above to supply the treatment fluid to the upper portion of the treatment space 520a. The second supply line 533 may be connected to the second supply port 524 described above to supply the treatment fluid to the lower portion of the treatment space 520a.

[0118] The first supply valve 532 and the second supply valve 534 may be installed in the first supply line 531 and the second supply line 533, respectively, to allow or block the flow of the treatment fluid in the first supply line 531 and the second supply line 533. The first supply valve 532 and the second supply valve 534 may be provided as automatic valves that can be opened / closed by receiving a control signal from the controller 30.

[0119] The fluid exhaust unit 540 may exhaust the atmosphere of the processing space 520a. The fluid exhaust unit 540 may exhaust the processing fluid supplied to the processing space 520a to the outside of the drying chamber 500. The fluid exhaust unit 540 may include a exhaust line 541, an exhaust valve 542, and a pressure reducer 543.

[0120] The exhaust line 541 may be connected to the exhaust port 525 described above, and the atmosphere of the processing space 520a may be exhausted through the exhaust port 525 to depressurize the processing space 520a. The exhaust line 541 may be connected to a decompressor 543 (e.g., a pump), and the decompressor 543 may provide reduced pressure to exhaust the processing space 520a.

[0121] The discharge valve 542 may allow or block the flow of the treatment fluid in the discharge line 541. The discharge valve 542 may be provided as an automatic valve capable of opening / closing by receiving a control signal from the controller 30.

[0122] The clamping unit 550 may clamp the chamber 520. When the second chamber 522 is in a closed position, the clamping unit 550 may clamp the chamber 520. The clamping unit 550 clamps the chamber 520 during substrate processing to prevent an excessive load from being applied to the lower moving unit 560, thereby sealing the processing space 520a.

[0123] The clamping unit 550 may include a first clamping body 551, a second clamping body 552, and a moving module 553. The first clamping body 551 and the second clamping body 552 may have shapes symmetrical to each other. The first clamping body 551 and the second clamping body 552 may have a central area of ​​a surface facing the chamber 520, and the central area is recessed in a direction away from the chamber 520 to form a groove. The edge area of ​​the chamber 520 may be inserted into the groove.

[0124] The moving module 553 may move the first clamping body 551 and the second clamping body 552 between a clamping position and a release position. The clamping position may be a position for clamping the chamber 520 when the second cavity 522 is in a closed position. Clamping may refer to inserting an edge portion of the chamber 520 into a groove formed in the first clamping body 551 and the second clamping body 552. The release position may refer to a position in which an edge portion of the chamber 520 is disengaged from a groove formed in the first clamping body 551 and the second clamping body 552.

[0125] The mobile module 553 may have a plurality of mobile modules. The mobile module 553 may be mounted on the upper portion of the housing 512. The mobile module 553 may be mounted on the upper portion of the housing 512 to move the first clamping body 551 and the second clamping body 552 in the horizontal direction. The mobile modules 553 may each include a guide rail 553a, a bracket 553b and an actuator 553c. The actuator 553c may be provided as a motor, a cylinder or a hydraulic cylinder. Alternatively, the mobile module 553 may be configured so that the bracket 553b moves along the guide rail 553a in a magnetic suspension manner. The guide rail 553a may extend in the horizontal direction. The bracket 553b may be configured to be movable along the guide rail 553a, and may have a lower portion coupled to the upper portion of the first clamping body 551 and the second clamping body 552.

[0126] exist Figure 6, the moving module 553 is shown as being positioned on the top of the first clamping body 551 and the second clamping body 552, but the present invention is not limited thereto. For example, the moving module 553 may be provided in the form of being mounted on the lower portion of the middle plate 514. That is, the moving module 553 is positioned on the lower side of the first clamping body 551 and the second clamping body 552 to move the first clamping body 551 and the second clamping body 552 in the horizontal direction.

[0127] The lower moving unit 560 can move the second cavity 522, which can be the lower cavity. The lower moving unit 560 can move the second cavity 522 in the up-down direction. The lower moving unit 560 may include a moving plate 561, a lower moving shaft 562 and a lower driver 563. The upper portion of the moving plate 561 may engage with the lower portion of the second cavity 522. The lower portion of the moving plate 561 may be coupled to the lower moving shaft 562. The lower moving shaft 562 may be moved in the up-down direction by the lower driver 563. The lower driver 563 may be provided by any one of the following items: a cylinder, a hydraulic cylinder and a motor. Alternatively, the lower moving unit 560 may be configured as a lower moving shaft 562 that moves in the up-down direction in a magnetic suspension manner.

[0128] The first cavity 521 can be fixed to the top of the housing 512 by a fixing device BO. The fixing device BO can be set as a shoulder bolt. The first cavity 521 and the housing 512 can be separated by the fixing device BO. A plurality of buffers 570 can be set between the first cavity 521 and the housing 512.

[0129] Figure 8 It is shown Figure 6 Schematic diagram of a partially enlarged view of the drying chamber.

[0130] Reference Figure 8 , the fixing device BO may be a shoulder bolt, which may be formed of a head H, a body B, and a threaded portion S. The body B may have a smooth surface, and the threaded portion S may be screwed to the upper portion of the first cavity 521. The head H may be placed on the top surface of the housing 512 as a hanging portion.

[0131] The first cavity 521 may be fixed by a fixing device BO in a form of being suspended to the housing 512. A buffer 570 including a spring may be provided between the first cavity 521 and the housing 512.

[0132] Since the lowest height of the first cavity 521 is limited by the fixture BO, the vertical length of the spring of the buffer 570 is not overstretched. In addition, the first cavity 521 has a certain freedom to move in the upward direction through the body B of the fixture BO. When the first cavity 521 moves in the upward direction through the lower moving unit 560, the buffer 570 can prevent the first cavity 521 from colliding with the housing 512, or can buffer the vibration caused by the collision.

[0133] Fig. 9 is a flowchart illustrating a method of controlling a substrate processing apparatus according to an exemplary embodiment of the present invention. Fig. 9 The operation of the drying chamber 500 shown in FIG. 5 can be implemented by controlling the configuration of the drying chamber 500 through a control signal generated by the controller 30. Further, the controller 30 can be programmed to generate a control signal to enable the drying chamber 500 to implement Fig. 9 The operations shown in .

[0134] By the method of controlling a substrate processing apparatus according to an exemplary embodiment of the present invention, a substrate W such as a wafer may be processed, and a semiconductor device may be manufactured through the process.

[0135] The method of controlling a substrate processing apparatus according to an exemplary embodiment of the present invention may include a closing operation S1, a clamping operation S2, a close contact operation S3, and a substrate processing operation S4. The closing operation S1, the clamping operation S2, the close contact operation S3, and the substrate processing operation S4 may be performed sequentially.

[0136] Fig.10 The drying chamber is shown to perform Fig. 9 Schematic diagram of the closing operation.

[0137] Reference Fig. 9 and Fig.10 , the lower moving unit 560 may move the second cavity 522 in an upward direction to seal the processing space 520a. The lower moving unit 560 may lift the second cavity 522 to a position where the second cavity 522 contacts the first cavity 521 but can compress the sealing member 527. When the closing operation S1 is completed, the upward force applied by the lower moving unit 560 is not transmitted to the first cavity 521, and the upward force can only be transmitted to the first cavity 521 as the sealing member 527 is compressed.

[0138] In this case, the height of the first cavity 521 may remain unchanged. For this purpose, the spring of the buffer 570 may be selected to have an elastic modulus such that it is not compressed by the force applied to the first cavity 521 in the upward direction by compression of the sealing member 527 .

[0139] Fig.11 The drying chamber is shown to perform Fig. 9 Schematic diagram of the clamping operation.

[0140] Reference Fig. 9 and Fig.11 In the clamping operation S2, the moving module 553 may move the first clamping body 551 and the second clamping body 552 in a direction to make the first clamping body 551 and the second clamping body 552 closer to the chamber 520 to clamp the chamber 520. At this time, the first clamping body 551 and the second clamping body 552 may be spaced apart from the chamber 520 by a certain interval so that no friction occurs between the first clamping body 551 and the second clamping body 552 and the chamber 520.

[0141] Fig.12 The drying chamber is shown to perform Fig. 9 Schematic diagram of close contact operation.

[0142] Reference Fig. 9 and Fig.12 , the close contact operation S3 may include bringing the chamber 520 into contact with the first clamping body 551 and the second clamping body 552. The close contact operation S3 may include further moving the second cavity 522 in the closed position to bring the chamber 520 into contact with the first clamping body 551 and the second clamping body 552. More specifically, the second cavity 522 may further move in an upward direction to bring the first cavity 521 into contact with an upper portion of a groove formed in the first clamping body 551 and the second clamping body 552.

[0143] In this case, the buffer 570 having a spring may be compressed by the force applied in the upward direction by the lower moving unit 560. In other words, the spring of the buffer 570 may be a spring having an elastic modulus that may be compressed by the force applied in the upward direction by the lower moving unit 560.

[0144] In other words, the buffer member 570 can be configured so that the position of the first cavity 521 (more specifically, in height) is not changed when the first cavity 521 and the second cavity 522 are in close contact with each other, but when the lower moving unit 560 brings the first cavity 521 into contact with the first clamping body 551 and the second clamping body 552, the first cavity 521 changes its position (more specifically, in height) in a direction that brings the first cavity 521 closer to the shell 512.

[0145] Fig.13 The drying chamber is shown to perform Fig. 9 Schematic diagram of substrate processing operations.

[0146] Reference Fig. 9 and Fig.13, the substrate processing operation S4 may include supplying a high-pressure processing fluid into the processing space 520a to dry the substrate W. The high-pressure processing fluid is supplied to the processing space 520a to increase the pressure in the processing space 520a. As the pressure in the processing space 520a increases, the gap between the first cavity 521 and the second cavity 522 expands. At this time, since the first cavity 521 has moved in the upward direction and is in close contact with the first clamping body 551 and the second clamping body 552 through the close contact operation S3, the height of the first cavity 521 remains unchanged, and only the second cavity 522 moves in the downward direction and is in contact with the first clamping body 551 and the second clamping body 552.

[0147] Although the second cavity 522 may collide with the first clamping body 551 and the second clamping body 552 when the second cavity 522 begins to contact the first clamping body 551 and the second clamping body 552, the supporting member 528 supporting the substrate W is installed on the first cavity 521, which can minimize the impact transmitted to the substrate W, the vibration generated in the substrate W, or the misalignment of the substrate W caused by the collision.

[0148] Fig.14 is a schematic diagram showing a buffer according to another exemplary embodiment of the present invention. Fig.14 , a buffer 580 according to another exemplary embodiment of the present invention may include a first magnetic element 581 installed in a housing 512 and a second magnetic element 582 installed in a first cavity 521. The first magnetic element 581 and the second magnetic element 582 may be configured as permanent magnets. In addition, the first magnetic element 581 and the second magnetic element 582 may be configured to have the same polarity as each other to generate a repulsive force between the first magnetic element 581 and the second magnetic element 582.

[0149] The first magnetic element 581 and the second magnetic element 582 can be permanent magnets with magnetic force, and the magnetic force is as follows: when the first cavity 521 and the second cavity 522 are in close contact with each other, the position of the first cavity 521 (more specifically, in height) is not changed, and when the lower moving unit 560 brings the first cavity 521 into contact with the first clamping body 551 and the second clamping body 552, the position of the first cavity 521 in the direction in which the first cavity 521 approaches the shell 512 is changed.

[0150] Fig.15is a schematic diagram showing a buffer according to another exemplary embodiment of the present invention. A buffer 590 according to another exemplary embodiment of the present invention may include a first magnetic element 591 installed in a housing 512, a second magnetic element 592 installed in a first cavity 521, a first current source 593 supplying current to the first magnetic element 591, and a second current source 594 supplying current to the second magnetic element 592. In other words, the first magnetic element 591 and the second magnetic element 592 may be configured as electromagnets.

[0151] The first current source 593 and the second current source 594 can supply currents of such magnitude that the generated magnetic force does not change the position (more specifically, in height) of the first cavity 521 when the first cavity 521 and the second cavity 522 are in close contact with each other, and changes the position of the first cavity 521 in the direction in which the first cavity 521 approaches the shell 512 when the lower moving unit 560 brings the first cavity 521 into contact with the first clamping body 551 and the second clamping body 552.

[0152] Alternatively, the first current source 593 and the second current source 594 can change the direction of the current supplied to the first magnetic element 591 and the second magnetic element 592 so that the first magnetic element 591 and the second magnetic element 592 have the same polarity as each other, or the first magnetic element 591 and the second magnetic element 592 have different polarities from each other.

[0153] For example, the first magnetic element 591 and the second magnetic element 592 can have the same polarity in the closing operation S1 and the clamping operation S2, and the first magnetic element 591 and the second magnetic element 592 can have different polarities in the close contact operation S3 and the substrate processing operation S4 to make the first cavity 521 contact with the first clamping body 551 and the second clamping body 552.

[0154] Fig.16 is a schematic diagram showing a further arrangement of an upper moving unit in a drying chamber, and Fig.17 It is shown Fig.16 A schematic diagram of an upper moving unit moving the first cavity in an upward direction.

[0155] The upper moving unit 560A is capable of moving the first cavity 521 in an upward direction. The upper moving unit 560A may include an upper moving shaft 561A and an upper driver 562A. The upper moving shaft 561A may be coupled to the first cavity 521. The upper driver 562A may lift the first cavity 521 by changing the height of the upper moving shaft 561A. Changing the height of the first cavity 521 by the upper moving unit 560A may be implemented in the close contact operation S3 described above.

[0156] The above-described example illustrates that the first cavity 521 and the second cavity 522 of the drying chamber 500 are disposed in the up-and-down direction, but is not limited thereto.

[0157] Fig.18 Schematic diagram showing a drying chamber according to another exemplary embodiment of the present invention. Fig.18 The drying chamber 600 may include a high-pressure container 610 (which may be a first chamber), a door assembly 620 , a fluid supply unit 630 , a discharge line 640 , and a clamping unit 650 .

[0158] The high pressure vessel 610 may have a processing space 611 in which a substrate W may be processed. The door assembly 620 may include a door 621 (which may be a second cavity) and a support member 623 supporting the substrate W. The high pressure vessel 610 and the door 621 may be referred to as a chamber.

[0159] The door 621 and the high pressure container 610 may be combined with each other to define the processing space 611 , and the door 621 may be moved between a closed position to seal the processing space 611 and an open position to open the processing space 611 .

[0160] The fluid supply unit 630 may include a first supply line 631 and a second supply line 632, and the first supply line 631 and the second supply line 632 may supply the processing fluid (which may be carbon dioxide) to different locations in the processing space 611. The exhaust line 640 may exhaust the atmosphere of the processing space 611.

[0161] Further, the high pressure container 610 may be formed with an insertion hole 613 into which the clamping body 651 of the clamping unit 650 may be inserted.

[0162] The clamping unit 650 may clamp the door 621. The clamping unit 650 may include a clamping body 651 and a moving unit 652. The clamping body 651 may have a plate shape that may be inserted into the insertion hole 613, and the moving unit 652 may include any one of an air cylinder, a hydraulic cylinder, and a motor, or may move the clamping body 651 in an up and down direction in a magnetic suspension manner.

[0163] Further, in the surface of the clamping body 651, the first buffer member 653 may be provided on the surface facing the processing space 611, and the second buffer member 654 may be provided on the opposite side. The first buffer member 653 may be composed of a first sealing element 653a and a first elastic element 653b, and the second buffer member 654 may be composed of a second sealing element 654a and a second elastic element 654b.

[0164] Fig.19 It is shown Fig.18Schematic diagram of the drying chamber performing closing and clamping operations. Fig.19 When the drying chamber 600 performs a closing operation, the door 621 may be moved to a closed position to seal the processing space 611. Then, the plate-shaped clamping body 651 of the clamping unit 650 may be inserted into the insertion hole 613 to clamp the door 621.

[0165] Fig. 20 It is shown Fig.18 Schematic diagram of performing a close contact operation in a drying chamber of FIG. The close contact operation may be an operation of bringing the door 621 into contact with the clamping body 651. The close contact operation may be achieved by a moving unit (not shown) that moves the door 621 in a lateral direction.

[0166] Alternatively, the fluid supply unit 630 may also be implemented by supplying the treatment fluid to the treatment space 611. When the fluid supply unit 630 supplies the treatment fluid to the treatment space 611, the pressure in the treatment space 611 may be increased. As the pressure in the treatment space 611 increases, the door 621 may move laterally to be in close contact with the clamping body 651. Since the position of the high-pressure container 610 is fixed, only the door 621 may move laterally to be in close contact with the clamping body 651. In this case, the amount of the treatment fluid supplied to the treatment space 611 per unit time may be very small so that when the door 621 is in close contact with the clamping body 651, excessive impact is not transmitted to the door 621. For example, the amount of the treatment fluid supplied to the treatment space 611 per unit time during the close contact operation may be less than the amount of the treatment fluid supplied to the treatment space 611 per unit time during the substrate processing operation.

[0167] It should be understood that what is disclosed herein is an exemplary embodiment, and other variations are possible. The individual elements or features of a particular exemplary embodiment are generally not limited to that particular exemplary embodiment, but are interchangeable, and even if not specifically illustrated or described, may be used for a selected exemplary embodiment where applicable. These modifications should not be considered as departing from the spirit and scope of the present invention, and all modifications obvious to a person of ordinary skill in the art are intended to be included within the scope of the appended claims.

Claims

1. A device for processing a substrate, the device comprising: A chamber, the chamber defining a processing space in which a substrate is processed, wherein the chamber comprises a first cavity and a second cavity, the first cavity being provided with a supporting member for supporting the substrate, the second cavity being coupled to the first cavity to define the processing space in which the substrate is processed; a moving unit, the moving unit being used to move any one of the first cavity and the second cavity; A clamping body, the clamping body is used to clamp the chamber; a moving module for moving the clamping body between a clamping position for clamping the chamber and a releasing position for releasing the chamber; and a controller configured to control the moving unit and the moving module, The controller is configured to control the moving unit so that when the first cavity and the second cavity are in a closed position for sealing the processing space, the chamber is in close contact with the clamping body and the clamping body is in the clamping position.

2. The device according to claim 1, wherein: The controller is configured to control the moving unit so that the first cavity is in close contact with the clamping body between the first cavity and the second cavity.

3. The device according to claim 2, further comprising: a fluid supply unit for supplying a treatment fluid to the treatment space, The controller is further configured to control the fluid supply unit, and is configured to control the fluid supply unit to supply the processing fluid to the processing space after the first cavity is in close contact with the clamping body.

4. The device according to claim 2, further comprising: a housing having an interior space in which the chamber is disposed, wherein the first cavity is fixed to the housing, and A buffer component is installed between the first cavity and the shell.

5. The device according to claim 4, wherein: The buffer is configured so that the position of the first cavity is not changed when the first cavity and the second cavity are in close contact with each other, and When the moving unit brings the first cavity into contact with the clamping body, the position of the first cavity is changed in a direction approaching the housing.

6. The device according to claim 4, wherein: The buffer member includes a spring.

7. The device according to claim 4, wherein: The buffer member comprises: a first magnetic element mounted in the housing; and a second magnetic element, the second magnetic element being installed in the first cavity and facing the first magnetic element, and The first magnetic element and the second magnetic element have the same polarity as each other so as to generate a repulsive force between the first magnetic element and the second magnetic element.

8. The device according to claim 4, wherein: The buffer member comprises: a first magnetic element, the first magnetic element being mounted in the housing; a second magnetic element, the second magnetic element being installed in the first cavity and facing the first magnetic element; a first current source for supplying current to the first magnetic element; and A second current source is used to supply current to the second magnetic element.

9. The device according to claim 1, wherein: The second cavity is located below the first cavity, and The moving unit is configured to move the second cavity in upward and downward directions.

10. The device according to claim 1, wherein: The second cavity is located below the first cavity, and The moving unit is configured to move the first cavity in upward and downward directions.

11. The device according to claim 1, wherein: At least one of the moving unit and the moving module is configured to move the chamber or the holder in a magnetic levitation manner.

12. The device according to claim 1, wherein: At least one of the moving unit and the moving module is configured to include any one selected from the group consisting of a pneumatic cylinder, a hydraulic cylinder, and a motor.

13. The device according to claim 1, wherein: The holder has one surface having a shape that is recessed in a direction away from the chamber so as to be inserted into an edge portion of the chamber in a state of sealing the processing space.

14. A method for controlling a substrate processing device, the substrate processing device comprising: A chamber, wherein the chamber defines a processing space in which a substrate is processed, wherein the chamber comprises a first cavity and a second cavity, wherein the first cavity is provided with a supporting member for supporting the substrate, and the second cavity is coupled to the first cavity to define the processing space in which the substrate is processed; and a clamping body, wherein the clamping body is used to clamp the chamber, and the method comprises: a closing operation of moving any one of the first cavity and the second cavity to seal the processing space; a clamping operation, wherein the clamping operation moves the clamping body to clamp the chamber; a close contact operation, wherein the close contact operation causes at least one of the first cavity and the second cavity to contact the clamping body; A substrate processing operation is performed to process the substrate by supplying a processing fluid into the processing space after performing the close contact operation.

15. The method according to claim 14, wherein: The close contact operation includes making the first cavity contact with the clamping body between the first cavity and the second cavity.

16. The method according to claim 14, wherein: When the substrate processing operation is performed, the pressure in the processing space is greater than the pressure provided by a moving unit that moves any one of the first chamber and the second chamber.

17. A manufacturing method, comprising: a closing operation of placing a substrate on a support member provided in the chamber and closing the chamber to seal a processing space provided by the chamber; a clamping operation of clamping the chamber by moving a clamping body in a direction facing the chamber after the closing operation; a close contact operation, the close contact operation causing the chamber to contact the clamping body after the clamping operation; as well as A substrate processing operation is performed to dry the substrate by supplying a supercritical fluid into the processing space.

18. The manufacturing method according to claim 17, wherein: The chamber includes a first cavity and a second cavity, the first cavity is provided with the supporting member, the second cavity is connected to the first cavity to provide the processing space, and The close contact operation includes bringing the first cavity into contact with the clamping body.

19. The manufacturing method according to claim 18, wherein: The supercritical fluid supplied to the substrate processing operation brings the second cavity into contact with the chuck.

20. The manufacturing method according to claim 18, wherein: The second cavity is positioned below the first cavity, and The close contact operation includes moving the first cavity in an upward direction to bring the first cavity into contact with the clamping body.

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