Semiconductor processing apparatus and semiconductor processing method

Abstract

The application discloses a semiconductor processing device and a semiconductor processing method, wherein the semiconductor processing device comprises a conveying device for conveying a carrier wafer in translation, the carrier wafer comprising a bottom sheet and a semiconductor wafer; an edge blank removing device comprising a lifting mechanism and a suction mechanism, the suction mechanism comprising a plurality of suction pieces arranged along the circumference of the semiconductor wafer, the suction pieces being used for sucking the edge blank of the semiconductor wafer; an air drying device; and a defective product removing device comprising a magnetic suction mechanism and a collecting piece, the magnetic suction mechanism being located above the carrier wafer and being used for sucking defective chips, the collecting piece being located below the magnetic suction mechanism and the carrier wafer, and the defective chips falling into the collecting piece after the carrier wafer is removed. The semiconductor processing device and the semiconductor processing method can improve the efficiency of removing defective products, and efficiently remove the edge blank of the semiconductor wafer.

Description

TECHNICAL FIELD

[0001] The present application relates to the technical field of semiconductor production equipment, in particular to a semiconductor processing device and a semiconductor processing method. BACKGROUND

[0002] In the production of chips, semiconductor wafers are first produced, and then the semiconductor wafers are cut into rows and columns of chips, and then the chips are tested and the defective products are identified.

[0003] For defective chips, a person usually takes a suction tube to remove the defective chips by sucking them.

[0004] However, the existing method for removing defective products is inefficient and consumes a lot of manpower, and also cannot efficiently remove the edge blank of the semiconductor wafer. SUMMARY

[0005] The present application aims to at least solve one of the technical problems existing in the prior art. To this end, the present application provides a semiconductor processing device that can improve the efficiency of removing defective products and efficiently remove the edge blank of the semiconductor wafer.

[0006] The present application also provides a semiconductor processing method applied to the above semiconductor processing device.

[0007] According to the semiconductor processing device of the present application, the semiconductor processing device comprises a conveying device for conveying a wafer in a translational manner, the wafer comprising a substrate and a semiconductor wafer, the top of the substrate being provided with alcohol, the semiconductor wafer being placed on the substrate, and the defective chips of the semiconductor wafer being marked by magnetic ink; an edge blank removal device comprising a lifting mechanism and a suction mechanism, the lifting mechanism being used to lift the wafer from the conveying device to the suction mechanism, the suction mechanism comprising a plurality of suction pieces arranged along the circumference of the semiconductor wafer, the suction pieces being used to suck the edge blank of the semiconductor wafer, and the lifting mechanism being used to place the wafer back on the conveying device after the suction is completed; a drying device located downstream of the edge blank removal device, used to remove the alcohol and static electricity between the semiconductor wafer and the substrate; and a defective product removal device located downstream of the drying device, comprising a magnetic attraction mechanism and a collection piece, the magnetic attraction mechanism being located above the wafer, the magnetic attraction mechanism being used to suck the defective chips to separate the defective chips from the wafer, and the collection piece being located below the magnetic attraction mechanism and the wafer, the suction force of the magnetic attraction mechanism being weakened or disappearing after the wafer is removed, and the defective chips falling into the collection piece.

[0008] According to the semiconductor processing device of the present application, at least the following beneficial effects are achieved:

[0009] The present application can realize automatic removal of the edge blank and the defective chip of the semiconductor wafer in the whole process, has high automation degree and high production efficiency.

[0010] The present application can remove the edge blank of the semiconductor wafer by the edge blank removal device, and the structure of the suction mechanism is simplified.

[0011] The lifting mechanism can lift the wafer to make the semiconductor wafer close to the suction mechanism, so that the suction mechanism can easily remove the edge blank of the semiconductor wafer.

[0012] The present application can remove the edge blank of the semiconductor wafer by the edge blank removal device, and the structure of the suction mechanism is simplified.

[0013] The present application can remove the edge blank of the semiconductor wafer by the edge blank removal device, and the structure of the suction mechanism is simplified.

[0014] The present application can remove the edge blank of the semiconductor wafer by the edge blank removal device, and the structure of the suction mechanism is simplified.

[0015] The present application also provides a semiconductor processing method having the above-mentioned advantages.

[0016] According to the semiconductor processing device, the diameter of the semiconductor wafer is smaller than the diameter of the substrate, and the part of the substrate not covered by the semiconductor wafer is provided with a mark point.

[0017] The present application sets the identification point, so that the semiconductor wafer is placed on the bottom sheet at a corresponding angle relative to the identification point, thus, before the edge blank of the semiconductor wafer is sucked, the longitudinal and transverse arrangement direction of the chip on the semiconductor wafer can be determined through the identification point, the difficulty of identification is reduced, the manufacturing cost is reduced, for example, the image device for identifying the longitudinal and transverse arrangement direction is omitted, and further, the position of the edge blank to be removed is determined, so that the edge blank of the semiconductor wafer is removed more efficiently.

[0018] According to the semiconductor processing equipment, the conveying device comprises a plurality of conveying units, and the plurality of conveying units comprises a first conveying unit corresponding to the edge blank removing device; the first conveying unit comprises two parallel conveying belts, two positioning columns and two limiting plates; the two limiting plates are located on the side away from the two conveying belts, and are used for limiting the carrier wafer on the two conveying belts; the space between the two conveying belts allows the lifting mechanism to lift the carrier wafer; and the two positioning columns are located on the side of the lifting mechanism along the conveying direction of the carrier wafer, and are used for abutting against the edge blank of the bottom sheet to position the center of the carrier wafer and prevent the carrier wafer from moving.

[0019] According to the semiconductor processing equipment, the conveying device comprises a plurality of conveying units, and the plurality of conveying units comprises a first conveying unit corresponding to the edge blank removing device; the first conveying unit comprises two parallel conveying belts, two positioning columns and two limiting plates; the two limiting plates are located on the side away from the two conveying belts, and are used for limiting the carrier wafer on the two conveying belts; the space between the two conveying belts allows the lifting mechanism to lift the carrier wafer; and the two positioning columns are located on the side of the lifting mechanism along the conveying direction of the carrier wafer, and are used for abutting against the edge blank of the bottom sheet to position the center of the carrier wafer and prevent the carrier wafer from moving.

[0020] According to the semiconductor processing equipment, the conveying device comprises a plurality of conveying units, and the plurality of conveying units comprises a first conveying unit corresponding to the edge blank removing device; the first conveying unit comprises two parallel conveying belts, two positioning columns and two limiting plates; the two limiting plates are located on the side away from the two conveying belts, and are used for limiting the carrier wafer on the two conveying belts; the space between the two conveying belts allows the lifting mechanism to lift the carrier wafer; and the two positioning columns are located on the side of the lifting mechanism along the conveying direction of the carrier wafer, and are used for abutting against the edge blank of the bottom sheet to position the center of the carrier wafer and prevent the carrier wafer from moving.

[0021] According to the semiconductor processing equipment, the conveying device comprises a plurality of conveying units, and the plurality of conveying units comprises a first conveying unit corresponding to the edge blank removing device; the first conveying unit comprises two parallel conveying belts, two positioning columns and two limiting plates; the two limiting plates are located on the side away from the two conveying belts, and are used for limiting the carrier wafer on the two conveying belts; the space between the two conveying belts allows the lifting mechanism to lift the carrier wafer; and the two positioning columns are located on the side of the lifting mechanism along the conveying direction of the carrier wafer, and are used for abutting against the edge blank of the bottom sheet to position the center of the carrier wafer and prevent the carrier wafer from moving.

[0022] According to the semiconductor processing equipment, the conveying device comprises a plurality of conveying units, and the plurality of conveying units comprises a first conveying unit corresponding to the edge blank removing device; the first conveying unit comprises two parallel conveying belts, two positioning columns and two limiting plates; the two limiting plates are located on the side away from the two conveying belts, and are used for limiting the carrier wafer on the two conveying belts; the space between the two conveying belts allows the lifting mechanism to lift the carrier wafer; and the two positioning columns are located on the side of the lifting mechanism along the conveying direction of the carrier wafer, and are used for abutting against the edge blank of the bottom sheet to position the center of the carrier wafer and prevent the carrier wafer from moving.

[0023] Meanwhile, since the center of the wafer is accurately located at the set position of the lifting mechanism, rotation adjustment is facilitated, and deviation during rotation is reduced, so that the entire edge blank of the semiconductor wafer can be sucked without increasing the number of suction members or adjusting the positions of the suction members, and omission is avoided.

[0024] According to the semiconductor processing device, the edge blank removing device further comprises an identifier for identifying the mark point, and the lifting mechanism comprises a lifting frame provided with a rotating disc for supporting the wafer, and after the lifting frame lifts the wafer, the edge blank removing device controls the rotating disc to rotate according to the indication information of the identifier, so that the suction members suck different positions of the semiconductor wafer.

[0025] According to the semiconductor processing device, the edge blank removing device further comprises an identifier for identifying the mark point, and the lifting mechanism comprises a lifting frame provided with a rotating disc for supporting the wafer, and after the lifting frame lifts the wafer, the edge blank removing device controls the rotating disc to rotate according to the indication information of the identifier, so that the suction members suck different positions of the semiconductor wafer.

[0026] According to the semiconductor processing device, the lifting mechanism comprises two fixed plates vertically arranged side by side, a power member for driving the lifting frame to lift is arranged between the two fixed plates, a guide column and a guide hole accommodating the guide column are arranged between the fixed plate and the lifting frame, and the guide column and the guide hole cooperatively form a lifting track.

[0027] According to the semiconductor processing device, the lifting mechanism comprises two fixed plates vertically arranged side by side, a power member for driving the lifting frame to lift is arranged between the two fixed plates, a guide column and a guide hole accommodating the guide column are arranged between the fixed plate and the lifting frame, and the guide column and the guide hole cooperatively form a lifting track.

[0028] According to the semiconductor processing device, the lifting mechanism comprises two fixed plates vertically arranged side by side, a power member for driving the lifting frame to lift is arranged between the two fixed plates, a guide column and a guide hole accommodating the guide column are arranged between the fixed plate and the lifting frame, and the guide column and the guide hole cooperatively form a lifting track.

[0029] According to the semiconductor processing device, the number of the suction members is four, the four suction members are uniformly distributed along the circumference of the semiconductor wafer, the suction mechanism comprises a mounting frame, the top of the mounting frame is provided with the suction members, the mounting frame is provided with an opening penetrating through the top and the bottom, and the suction members are arranged along the edge blank of the opening.

[0030] According to the semiconductor processing device, the number of the suction members is four, the four suction members are uniformly distributed along the circumference of the semiconductor wafer, the suction mechanism comprises a mounting frame, the top of the mounting frame is provided with the suction members, the mounting frame is provided with an opening penetrating through the top and the bottom, and the suction members are arranged along the edge blank of the opening.

[0031] According to the semiconductor processing device, the suction member comprises a suction nozzle, a three-axis adjusting seat for mounting the suction nozzle, and the three-axis adjusting seat is capable of adjusting Z-axis displacement, X-axis displacement and Y-axis displacement of the suction nozzle.

[0032] The three-axis adjusting seat is provided, the position of the suction member is adjusted in multiple directions, the device is reasonably adjusted according to the installation condition of the device and the specification of the semiconductor wafer, the use requirement is met, and good adaptability and wide universality are achieved.

[0033] According to the semiconductor processing device, the air-drying device comprises a first air blowing mechanism and a second air blowing mechanism, the conveying device is allowed to convey the wafer between the first air blowing mechanism and the second air blowing mechanism, and the first air blowing mechanism and the second air blowing mechanism are capable of swinging up and down to adjust the blowing direction.

[0034] The first air blowing mechanism and the second air blowing mechanism are provided, the wafer is relatively blown dry, the adhesion of the wafer to the semiconductor wafer is reduced, the qualified chip and the unqualified chip of the semiconductor wafer are easily separated from the wafer, and screening and collection are facilitated.

[0035] Meanwhile, the first air blowing mechanism and the second air blowing mechanism are provided, the distance of each chip to the air blowing mechanism is relatively balanced, each chip is uniformly air-dried, and the air-drying time is shortened and the efficiency is improved.

[0036] According to the semiconductor processing method, the method is applied to the semiconductor processing device, and the processing method comprises the following steps.

[0037] The wafer manufacturing step tests the chip of the semiconductor wafer, marks the unqualified chip with magnetic ink, sprays alcohol on the wafer, and places the semiconductor wafer marked with the magnetic ink on the wafer.

[0038] The suction edge blanking step places the wafer on the loading position of the conveying device, the conveying device moves the wafer to the suction mechanism of the edge blanking removing device, the lifting mechanism lifts the wafer to the suction mechanism, the suction member sucks the edge blank of the semiconductor wafer, after the edge blank is sucked, the lifting mechanism places the wafer on the conveying device.

[0039] The air-drying step moves the wafer to the air-drying device by the conveying device, the air-drying device blows air to the wafer to remove alcohol and static electricity between the wafer and the wafer.

[0040] The bad product removing step is as follows: the conveying device conveys the wafer to the lower side of the magnetic suction mechanism, the magnetic suction mechanism is powered, the magnetic suction mechanism magnetically adsorbs the bad chip marked by the magnetic ink, separates the bad chip from the wafer, the conveying device continues to convey the wafer to the discharging position, then, the magnetic suction mechanism is powered off or powered down, and the bad chip falls into the collecting piece.

[0041] Beneficially, the application removes the edge blank of the semiconductor wafer, removes the bad chip, and leaves the qualified chip by the way of first adsorbing the edge blank of the semiconductor wafer, then air-drying, and finally magnetically adsorbing, realizes the full-process automatic sorting of the semiconductor wafer, and rarely uses manual work, and the production efficiency is high.

[0042] According to a semiconductor processing method of the application,

[0043] In the edge blank suction step, the conveying device moves the wafer to the lower side of the edge blank removing device, including: two limiting plates limit the wafer on two conveying belts, the two conveying belts convey the wafer, two positioning columns abut the wafer to make the wafer stationary, and the center of the wafer is vertically aligned with the center of the rotating disc.

[0044] In the edge blank suction step, the suction piece suctions the edge blank of the semiconductor wafer, including: rotating the rotating disc, the identifier identifies a mark point, then, the rotating disc is stationary, the suction piece suctions a local edge blank of the semiconductor wafer, then, the suction piece stops suction, then, the rotating disc is continuously rotated, the identifier identifies another mark point, then, the rotating disc is again stationary, and the suction piece suctions another local edge blank of the semiconductor wafer.

[0045] The application uses the limiting plate, the conveying belt and the positioning column, which meets the conveying needs and facilitates the connection of the edge blank removing device, so as to position the wafer.

[0046] The application sets the rotating disc and the identifier, controls the rotation of the rotating disc by identifying the mark point, makes different positions of the semiconductor wafer in the suction range of the suction piece, reduces the number of the suction pieces, expands the suction range of the suction mechanism, completely suctions the edge blank of the semiconductor wafer, and avoids omission.

[0047] Additional aspects and advantages of the application will be given in part in the following description, will become apparent from the following description, or will be learned by practice of the application. BRIEF DESCRIPTION OF DRAWINGS

[0048] In order to make the technical solutions of the embodiments of the present application or the prior art clearer, the accompanying drawings needed in the embodiments or prior art description will be briefly introduced. Obviously, the accompanying drawings in the following description are only some embodiments of the present application, and for those skilled in the art, other drawings can be obtained based on these drawings without creative effort.

[0049] Figure 1 is a structural schematic diagram of a semiconductor wafer;

[0050] Figure 2 is a structural schematic diagram of a semiconductor processing apparatus according to an embodiment of the present application;

[0051] Figure 3 is a structural schematic diagram of a semiconductor processing apparatus according to an embodiment of the present application; Figure 2 is a structural schematic diagram of a first conveying unit of a conveying device;

[0052] Figure 4 is a structural schematic diagram of a semiconductor processing apparatus according to an embodiment of the present application; Figure 2 is a structural schematic diagram of an edge blanking part;

[0053] Figure 5 is a structural schematic diagram of a semiconductor processing apparatus according to an embodiment of the present application; Figure 4 is a structural schematic diagram of a lifting mechanism;

[0054] Figure 6 is a structural schematic diagram of a semiconductor processing apparatus according to an embodiment of the present application; Figure 4 is a structural schematic diagram of a suction mechanism;

[0055] Figure 7 is a structural schematic diagram of a semiconductor processing apparatus according to an embodiment of the present application; Figure 2 is a structural schematic diagram of a wind-drying part;

[0056] Figure 8 is a structural schematic diagram of a semiconductor processing apparatus according to an embodiment of the present application; Figure 7 is a structural schematic diagram of a first wind-drying mechanism;

[0057] Figure 9 is a structural schematic diagram of a semiconductor processing apparatus according to an embodiment of the present application; Figure 2 is a structural schematic diagram of a defective product removing part;

[0058] Figure 10 is a work flow diagram of a semiconductor processing method according to an embodiment of the present application;

[0059] Figure 11 is a work flow diagram of a semiconductor processing method applied to a semiconductor processing apparatus; Figure 2

[0060] ​100 - film, 110 - semiconductor wafer, 120 - defective chip, 130 - edge blanking device, 140 - lifting mechanism, 150 - suction mechanism, 160 - suction piece, 170 - edge blank, 180 - air drying device, 190 - defective product rejection device, 200 - magnetic suction mechanism, 210 - collection piece, 220 - identification point, 230 - first conveying unit, 240 - conveying belt, 250 - positioning column, 260 - limiting plate, 270 - identifier, 280 - lifting frame, 290 - rotating disc, 300 - fixing plate, 310 - guide column, 320 - mounting frame, 330 - opening, 340 - suction nozzle, 350 - three-axis adjustment seat, 360 - first air blowing mechanism, 370 - second air blowing mechanism, 380 - rack, 390 - mounting bracket, 400 - cross arm, 410 - mounting plate, 420 - air blowing fan, 430 - mounting assembly, 440 - center mounting hole, 450 - arc-shaped mounting hole. DETAILED DESCRIPTION

[0061] Embodiments of the present application are described in detail below with reference to the attached drawing figures, wherein the same or like reference numerals and characters throughout the figures denote the same or like elements or components. The embodiments described below are exemplary, and are not intended to be limiting of the present application.

[0062] In the description of the present application, it is to be understood that the orientation description, such as the orientation or position relationship indicated by up, down, front, back, left, right, etc. is based on the orientation or position relationship shown in the drawings, and is only for the convenience of describing the present application and simplifying the description, and therefore cannot be understood as indicating or implying that the device or element referred to must have a particular orientation, be constructed and operated in a particular orientation, and therefore cannot be understood as limiting the present application.

[0063] In the description of the present application, the meaning of several is one or more, and the meaning of multiple is two or more. Greater than, less than, more than, etc. are understood as not including the number itself, and above, below, etc. are understood as including the number itself. If it is described as first and second, it is only for the purpose of distinguishing technical features, and cannot be understood as indicating or implying relative importance or implicitly indicating the number of technical features indicated or the order of technical features indicated.

[0064] In the description of the present application, it should be noted that unless otherwise explicitly specified and limited, the terms "mounting, connection and connection" should be understood broadly, for example, it can be fixedly connected, or it can be detachably connected, or integrally connected; it can be mechanically connected, or it can be electrically connected; it can be directly connected, or it can be indirectly connected through an intermediate medium; it can be the communication inside two elements. For those skilled in the art, the specific meaning of the above terms in the present application can be understood according to the specific circumstances.

[0065] A semiconductor processing device and a semiconductor processing method according to an embodiment of the present application are described below with reference to the accompanying drawings.

[0066] Referring to Figure 1 In the production of chips, the semiconductor wafer 110 is first cut out, and the semiconductor wafer 110 is cut into multiple columns and multiple rows to form multiple chips. Then, each chip is tested for electricity, and for defective products, ink is marked for easy color differentiation. Then, the semiconductor wafer 110 is adhered to a plastic film using alcohol, and the defective products marked with ink are sucked out by hand using a pipette.

[0067] At the same time, since the semiconductor wafer 110 is circular and the chips are mostly square, there are inevitably blank edges on the semiconductor wafer 110, and these edge blanks 170 cannot form chips and need to be removed.

[0068] However, the production efficiency of the semiconductor wafer 110 is very high, and the workload of removing defective products and edge blanks 170 is large, requiring a large number of manpower, which has caused great labor pressure. At the same time, manual removal cannot guarantee the quality of removal.

[0069] To this end, referring to Figure 1 The present application aims to provide an embodiment of a semiconductor processing device that can improve the efficiency of removing defective products, and at the same time, efficiently remove the edge blanks 170 of the semiconductor wafer 110 to achieve efficient sorting of chips.

[0070] In this embodiment, the semiconductor processing device includes a rack 380 that forms the installation base of each device to smoothly connect each process and reduce the gap, and also facilitates unified power supply and unified control, reasonable adjustment of production rhythm, and improvement of production capacity.

[0071] In this embodiment, the semiconductor processing device includes a conveying device, an edge blank removal device 130, an air drying device 180, and a defective product removal device 190.

[0072] In some embodiments, the rack 380 can be divided into each device for transportation and arrangement.

[0073] Referring to Figure 2 The rack 380 is provided with a conveying device for conveying a wafer in translation, the wafer including a bottom sheet 100 and a semiconductor wafer 110, the top of the bottom sheet 100 being provided with alcohol, the semiconductor wafer 110 being placed on the bottom sheet 100, and the defective chips 120 of the semiconductor wafer 110 being marked with magnetic ink.

[0074] The embodiment sets the conveying device to translate the wafer, so that the semiconductor wafer 110 can automatically pass through the edge blank removing device 130, the air drying device 180 and the defective product removing device 190 in sequence, thereby achieving automatic removal of the edge blank 170 of the semiconductor wafer 110 and the defective chip 120 in the whole process, and the automation degree is high and the production efficiency is high.

[0075] For the conveying device, the conveying device includes a plurality of conveying units, and the number of conveying units can be increased to match the production capacity. For example, a plurality of edge blank removing devices 130, a plurality of air drying devices 180 and a plurality of defective product removing devices 190 are set according to the production capacity, and the number of conveying units is increased accordingly to meet the arrangement needs.

[0076] In some embodiments, a longer air drying device 180 can be used, and the number of air drying devices 180 can be increased, which has a similar effect. The actual needs are determined.

[0077] The embodiment sets a plurality of conveying units, so that the conveying device can be split into multiple sections, and the number of conveying units can be reasonably arranged according to the production capacity matching condition to meet the production needs. At the same time, corresponding adjustments can be made according to the actual situation of the edge blank removing device 130, the air drying device 180 and the defective product removing device 190 to meet the needs of each part of the work.

[0078] Reference Figure 3 Among the plurality of conveying units, the plurality of conveying units include a first conveying unit 230, and the first conveying unit 230 corresponds to the edge blank removing device 130.

[0079] The first conveying unit 230 includes two parallel conveying belts 240, two positioning columns 250 and two limiting plates 260.

[0080] The two limiting plates 260 are located on the side away from the two conveying belts 240, and the two limiting plates 260 are used to limit the wafer on the two conveying belts 240. The space between the two conveying belts 240 allows the lifting mechanism 140 of the edge blank removing device 130 to lift the wafer. The two positioning columns 250 can be located on the side of the lifting mechanism 140 along the wafer conveying direction, and the two positioning columns 250 are used to abut against the edge blank 170 of the bottom sheet 100 to position the center of the wafer and prevent the wafer from moving.

[0081] The embodiment sets the first conveying unit 230 to include two parallel conveying belts 240, so that the two conveying belts 240 can support the wafer to meet the conveying needs.

[0082] The two limiting plates 260 can limit the wafer on the two conveying belts 240, so that the wafer is prevented from falling off due to the disengagement of one side of the wafer from the conveying belt 240, and the reliability of the conveying is improved.

[0083] In the embodiment, the two positioning columns 250 are arranged, so that when the wafer touches the two positioning columns 250, the wafer is stationary. Since the two positioning columns 250 touch the outer circle of the wafer, the diameter of the outer circle of the wafer is unchanged, and the center of the wafer can be determined according to the geometric relationship. Thus, the center of the wafer can be accurately located at the set position of the lifting mechanism 140, the suction member 160 is aligned with the edge blank 170 of the semiconductor wafer 110, and the need of sucking the edge blank 170 of the semiconductor wafer 110 is met.

[0084] Meanwhile, since the center of the wafer is accurately located at the set position of the lifting mechanism 140, the rotation adjustment is facilitated, and the deviation in the rotation process is reduced. Thus, the number of the suction members 160 or the position of the suction members 160 does not need to be increased, and the entire edge blank 170 of the semiconductor wafer 110 can be sucked and removed, so that the omission is avoided.

[0085] In some embodiments, the two positioning columns 250, the two conveying belts 240, and the two limiting plates 260 can be symmetrically arranged on the left and right sides along the conveying direction, so as to improve the stability of the conveying and the accuracy of the positioning, and ensure that the wafer touches the two positioning columns 250 at the same time and is stationary, so as to accurately transfer the wafer to the suction mechanism 150, and suck the edge blank 170 of the semiconductor wafer 110.

[0086] The two positioning columns 250 can be driven by a cylinder or a motor, and can realize the actions of lifting, translation, or swinging, so as to meet the need of blocking the wafer for positioning, and can be retracted without affecting the continuous conveying of the wafer.

[0087] In some embodiments, the two positioning columns 250 are used to realize the intermittent conveying of the wafer between the conveying units, so as to avoid the wafer from touching each other.

[0088] In the embodiment, the two positioning columns 250, the two conveying belts 240, and the two limiting plates 260 are installed on the same bracket, so as to reduce the installation of the entire conveying unit. However, the embodiment does not exclude the scheme that the positioning column 250 is installed on the lifting mechanism 140 or the suction mechanism, so as to meet other purposes, such as realizing the power sharing, a small stroke of the lifting mechanism 140 enables the positioning column 250 to block the wafer or release the blocking, and another small stroke of the lifting mechanism 140 enables the wafer to be lifted.

[0089] In some embodiments, the first conveying unit 230 can be provided with a mounting bracket 390, which is hollow, so that the space can be reserved for the arrangement of the lifting mechanism 140.

[0090] In some embodiments, the other conveying units can also be provided with the mounting bracket 390, which facilitates the arrangement of other components, such as the collection member 210.

[0091] In some embodiments, the mounting bracket 390 can be provided with four legs, so as to mount the driving roller and the driven roller of the conveying belt 240, while reducing the obstruction.

[0092] In some embodiments, the top of two legs can be connected with the limiting plate 260, so as to simplify the mounting.

[0093] In some embodiments, the pair of legs can be connected with the cross arm 400, so that the conveying belt 240 and the limiting plate 260 protrude to the outside of the mounting bracket 390, so as to stagger the different conveying units, so that the wafer is smoothly moved from one conveying unit to another conveying unit, reduces the jamming, and avoids the damage of the edge of the wafer.

[0094] In some embodiments, the other conveying units can be provided with three or more conveying belts 240, which are arranged side by side, so as to support the wafer from multiple points, and reduce the risk of bending of the wafer.

[0095] In some embodiments, the conveying unit is provided with a sensor for identifying the wafer, which is usually an optical sensor, so as to reasonably control the movement of the conveying belt 240, and avoid the wafer from touching each other.

[0096] In some embodiments, each conveying unit can be provided with a motor, which drives the movement of the conveying belt 240, so that the operation of each conveying unit is relatively independent, and the mutual influence of the parts is reduced.

[0097] In some embodiments, two or more conveying units can share one motor, so as to reduce the number of motors, and reduce the manufacturing cost of the equipment.

[0098] Referring to Figure 4 For the edge blanking device 130, the edge blanking device 130 comprises a lifting mechanism 140 and a suction mechanism 150, the lifting mechanism 140 is used to lift the wafer from the conveying device to the suction mechanism 150, the suction mechanism 150 comprises a plurality of suction members 160, which are arranged along the circumference of the semiconductor wafer 110, the suction member 160 is used to suck the edge blank 170 of the semiconductor wafer 110, after the suction is completed, the lifting mechanism 140 is used to return the wafer to the conveying device.

[0099] The embodiment sets the edge blank removing device 130, and the edge blank removing device 130 comprises the lifting mechanism 140 and the suction mechanism 150. When the wafer moves to the edge blank removing device 130, the lifting mechanism 140 can lift the wafer, so that the semiconductor wafer 110 is close to the suction mechanism 150, and the suction mechanism 150 can conveniently suck the edge blank 170 of the semiconductor wafer 110, and the structure of the suction mechanism 150 is simplified.

[0100] The lifting mechanism 140 makes the wafer separate from the conveying device, and the wafer can be conveniently adjusted, for example, the wafer is rotated, so that the edge blank 170 of the wafer is close to the suction piece 160, and then, all the edge blanks 170 of the semiconductor wafer 110 can be sucked, and the number of the suction pieces 160 is reduced, and the manufacturing cost is reduced.

[0101] In some embodiments, the diameter of the semiconductor wafer 110 can be smaller than the diameter of the wafer 100, and the part of the wafer 100 not covered by the semiconductor wafer 110 is provided with the identification point 220. According to the identification point 220, the semiconductor wafer 110 is placed on the wafer 100 at a set angle and concentrically.

[0102] The embodiment sets the identification point 220, and the semiconductor wafer 110 is placed on the wafer 100 at a corresponding angle relative to the identification point 220. Therefore, before the edge blank 170 of the semiconductor wafer 110 is sucked, the identification point 220 can be used to determine the longitudinal and transverse arrangement direction of the chips on the semiconductor wafer 110, the difficulty of identification is reduced, the manufacturing cost is reduced, for example, the image device for identifying the longitudinal and transverse arrangement direction is omitted, and then, the position of the edge blank 170 to be removed is determined, so that the edge blank 170 of the semiconductor wafer 110 is removed more efficiently.

[0103] In some embodiments, the number of the identification points 220 can be eight, so as to adapt to the arrangement of the chips, the suction piece 160 is conveniently aligned with the edge blank 170, and the accuracy of suction is improved.

[0104] Since the semiconductor wafer 110 is cut into a plurality of rows and a plurality of columns of chips, the edge blank 170 is mainly distributed in four main areas and a sub-area between the two main areas, that is, the edge blank 170 is distributed in eight areas uniformly distributed along the circumference of the semiconductor wafer 110. Therefore, eight identification points 220 are set, the area to be removed can be quickly identified, the angle of rotation adjustment is reduced, the time of rotation adjustment is reduced, and the edge blank 170 is quickly removed.

[0105] In some embodiments, the edge blanking device 130 can further comprise an identifier 270 for identifying the identification point 220, and the lifting mechanism 140 can comprise a lifting frame 280 provided with a rotating disc 290 for supporting the wafer, and after the lifting frame 280 lifts the wafer, the edge blanking device 130 controls the rotating disc 290 to rotate according to the indication information of the identifier 270, so that the suction member 160 sucks the different positions of the semiconductor wafer 110.

[0106] According to the embodiment, the identification point 220 can be used to determine the longitudinal and transverse arrangement information of the chips of the semiconductor wafer 110, so as to control the rotating disc 290 to rotate, and then complete the suction of the edge blank 170 of the semiconductor wafer 110, while the number of the suction member 160 and the rotation angle of the rotating disc 290 are comprehensively reduced, which has the dual advantages of low equipment manufacturing cost and high suction efficiency.

[0107] In some embodiments, the identifier 270 can be a light sensing identifier 270, an image identifier 270, or the like, which can be selected according to actual needs.

[0108] Due to the view relationship, Figure 1 The shape of the identifier 270 in the above embodiment is not easy to display clearly, and therefore, the same type of identifier 270 is also shown in Figure 3 for understanding, but the functions of the two may be different.

[0109] Referring to Figure 5 In some embodiments, the lifting mechanism 140 can comprise two fixed plates 300 arranged side by side, a power member for driving the lifting frame 280 to lift is arranged between the two fixed plates 300, a guide column 310 and a guide hole accommodating the guide column 310 are arranged between the fixed plate 300 and the lifting frame 280, and the guide column 310 and the guide hole cooperate to form a lifting track.

[0110] According to the embodiment, the two fixed plates 300 can be provided with the guide column 310 and the guide hole at the edge blank 170 of the lifting frame 280, so as to guide the lifting of the lifting frame 280, improve the accuracy and stability of the lifting, and reduce the deflection.

[0111] Meanwhile, space is reserved between the two fixed plates 300 to facilitate the arrangement of the power for driving the lifting frame 280 to lift, and at the same time, the power is easily located at the geometric center or the gravity center of the lifting frame 280, so as to realize smooth lifting and smooth lifting, avoid the torque generated by the combined force of the power and the gravity, and reduce the jamming and eccentric wear.

[0112] Meanwhile, space is reserved between the two fixed plates 300 to facilitate the arrangement of the power for driving the rotating disc 290 to rotate, and the structure is compact and occupies small space.

[0113] In some embodiments, the lifting frame 280, the fixing plate 300 and the mounting plate 410 can be provided with waist holes to facilitate the adjustment of the position of the lifting frame 280 and the position of the motor, meet the needs of position adjustment and tensioning the transmission belt, and the mounting plate 410 is used to mount the motor driving the rotation of the rotating disc 290.

[0114] The guide column 310 and the guide hole accommodating the guide column 310 are provided between the fixing plate 300 and the lifting frame 280. It can be understood that one of the fixing plate 300 and the lifting frame 280 is provided with the guide column 310, and the other of the fixing plate 300 and the lifting frame 280 is provided with the guide hole.

[0115] In the present embodiment, the fixing plate 300 is provided with the guide hole, and the lifting frame 280 is provided with the guide column 310, which can make full use of the space inside the fixing plate 300, and at the same time, the lifting frame 280 will be provided with a waist hole for mounting the guide column 310 for adjustment.

[0116] Referring to Figure 6 In some embodiments, the number of suction members 160 can be four, and the four suction members 160 are uniformly distributed along the circumference of the semiconductor wafer 110. The suction mechanism 150 includes a mounting frame 320, the top of which is provided with the suction member 160, and the mounting frame 320 is provided with an upper and lower through opening 330. The suction member 160 is arranged along the edge blank 170 of the opening 330, and the suction member 160 sucks the edge blank 170 of the semiconductor wafer 110 after passing through the opening 330.

[0117] In the present embodiment, four suction members 160 are provided, so that the edge blanks 170 of the four directions of the vertically and horizontally arranged semiconductor chips can be sucked, which not only meets the suction needs, but also sets the number of suction members 160 in an appropriate range, reduces the occupied space, facilitates arrangement, and at the same time, is conducive to reducing the rotation range of the rotating disc 290, for example, the rotating disc 290 can complete the suction of a full circle by rotating at most 90 degrees.

[0118] At the same time, in combination with the eight identification points 220, when the rotating disc 290 is rotated and the identifier 270 identifies one identification point, the rotating disc 290 is stationary, and the four suction members 160 can complete the suction of the four regions. Then, the rotating disc 290 is rotated by 45 degrees, and the other four regions can be sucked. After two rotations, the suction of one semiconductor wafer 110 can be completed, which takes a short time and has high suction efficiency.

[0119] The suction member 160 is mounted on the top of the mounting frame 320, which reduces the shielding of the hand, is convenient to install, and at the same time, is also convenient for position adjustment of the suction member 160.

[0120] In some embodiments, the suction member 160 can include a suction nozzle 340, and a three-axis adjustment seat 350 for mounting the suction nozzle 340, which is capable of Z-axis displacement adjustment, X-axis displacement adjustment and Y-axis displacement adjustment of the suction nozzle 340.

[0121] The three-axis adjustment seat 350 is provided in the embodiment, which can realize multi-directional adjustment of the position of the suction member 160, and can be adjusted according to the installation of the device and the specifications of the semiconductor wafer 110 to meet the use requirements, and has good adaptability and wide versatility.

[0122] For the structure for realizing Z-axis displacement adjustment, X-axis displacement adjustment and Y-axis displacement adjustment, a dovetail groove can be provided to realize direction limitation, and a screw rod and a screw sleeve can be provided, the screw rod is rotationally mounted, the screw sleeve is fixed on the component to be adjusted, the screw rod is rotated to drive the screw sleeve to move, and then the component to be adjusted slides along the dovetail groove to realize displacement adjustment of the corresponding axis, the position adjustment is accurate and continuous, and the use requirements are met.

[0123] In some embodiments, one end of the screw rod can be connected with a knob for facilitating force application.

[0124] Reference Figure 7 For the air drying device 180, the air drying device 180 is located downstream of the edge blank removal device 130, that is, after the edge blank 170 is removed, the carrier wafer moves to the air drying device 180, and the air drying device 180 is used to remove alcohol and static electricity between the semiconductor wafer 110 and the bottom sheet 100.

[0125] The air drying device 180 is provided in the embodiment, which can remove alcohol and static electricity, so that the chips of the semiconductor wafer 110 are easily separated from the bottom sheet 100, and then the defective chips 120 on the bottom sheet 100 are easily collected, the efficiency of removing defective products is improved, and the qualified chips on the bottom sheet 100 are easily separated, and the production efficiency is improved.

[0126] In some embodiments, the air drying device 180 can also be used to dry the magnetic ink on the defective chips 120, so that when the defective chips 120 of the semiconductor wafer 110 are marked with ink, the work of sucking the edge blank 170 can be started without waiting for the ink to dry, and the waiting time is reduced.

[0127] In some embodiments, the air drying device 180 can include a first air blowing mechanism 360 and a second air blowing mechanism 370, the first air blowing mechanism 360 and the second air blowing mechanism 370 allow the conveying device to convey the carrier wafer, and the first air blowing mechanism 360 and the second air blowing mechanism 370 are capable of swinging up and down to adjust the blowing direction.

[0128] The first blowing mechanism 360 and the second blowing mechanism 370 are arranged to blow dry the wafer relatively, reduce the adhesion of the wafer 100 to the semiconductor wafer 110, and make the qualified chips and the defective chips 120 of the semiconductor wafer 110 easily separated from the wafer 100, so as to be screened and collected.

[0129] Meanwhile, the first blowing mechanism 360 and the second blowing mechanism 370 are arranged to make the distance of each chip to the blowing mechanism balanced, so that each chip is evenly dried, which is beneficial to shorten the drying time and improve the efficiency.

[0130] Referring to Figure 8 For the first blowing mechanism 360 and the second blowing mechanism 370, the blowing mechanism can include a long strip-shaped blowing fan 420 and a mounting assembly 430 connected to both ends of the blowing assembly, the mounting assembly 430 includes a center mounting hole 440 and an arc-shaped mounting hole centered on the center mounting hole 440, so that one bolt is mounted in the center mounting hole 440 and the other bolt is mounted in the arc-shaped mounting hole 450, which meets the installation needs and makes the blowing fan 420 rotate around the center mounting hole 440 to meet the needs of adjusting the air outlet direction up and down, and the structure is simple.

[0131] In some embodiments, the mounting assembly 430 can have a pair of buckles, and the blowing fan 420 has a pair of clamping grooves, so that the connection position of the mounting assembly 430 and the blowing fan 420 can be adjusted along the length direction of the blowing fan 420 to install blowing fans 420 of different lengths, or the mounting position of the mounting assembly 430 is adjusted to meet the use needs.

[0132] Since the present embodiment does not involve the improvement of the internal structure of the blowing fan 420, the blowing fan 420 can be selected according to actual needs.

[0133] Referring to Figure 9 For the defective product removing device 190, the defective product removing device 190 is located downstream of the drying device 180, and the defective product removing device 190 includes a magnetic attraction mechanism 200 and a collecting piece 210. The magnetic attraction mechanism 200 is located above the wafer, and the magnetic attraction mechanism 200 is used to attract the defective chips 120 to separate the defective chips 120 from the wafer. The collecting piece 210 is located below the magnetic attraction mechanism 200 and the wafer. After the wafer is removed, the suction force of the magnetic attraction mechanism 200 is weakened or disappears, and the defective chips 120 fall into the collecting piece 210.

[0134] The present embodiment is provided with the defective product removing device 190, so that the magnetic attraction mechanism 200 is powered on, and the defective chips 120 can be removed by using the magnetic ink mark on the defective chips 120, so that only the qualified chips remain on the wafer, which meets the needs of removing defective products.

[0135] When the conveying device removes the wafer, the magnetic attraction mechanism 200 is powered off or the power supply is reduced, so that the magnetism of the magnetic attraction mechanism 200 disappears or weakens, and the defective chips 120 fall to the collecting member 210 due to gravity, which is fast and efficient, and does not require manual suction one by one, thereby saving labor.

[0136] In the embodiment, the number of the defective product removing device 190 is greater than the number of the edge blank removing device 130 according to the needs of production capacity matching.

[0137] In some embodiments, the collecting member 210 can be a barrel to collect the defective chips 120.

[0138] In some embodiments, the collecting member 210 can be connected with a discharge pipe to avoid shutdown caused by cleaning the collecting member 210.

[0139] In some embodiments, the conveying device can have a discharging position to facilitate the collection of the wafer 100 and the qualified chips.

[0140] With reference to Figure 10 The present application also provides an embodiment of a semiconductor processing method, which can also improve the efficiency of removing defective products, and efficiently remove the edge blank 170 of the semiconductor wafer 110 to achieve efficient chip sorting.

[0141] In the embodiment, the processing method mainly includes a wafer manufacturing step S1, an edge blank suction step S2, a drying step S3, and a defective product removing step S4.

[0142] For the same wafer, the wafer manufacturing step S1, the edge blank suction step S2, the drying step S3, and the defective product removing step S4 are sequentially performed. In production, the wafer manufacturing step S1, the edge blank suction step S2, the drying step S3, and the defective product removing step S4 can be simultaneously performed to realize continuous processing of the wafer, that is, to realize continuous production.

[0143] In the wafer manufacturing step S1, first, the chips of the semiconductor wafer 110 are tested, then the defective chips 120 are marked with magnetic ink, then alcohol is sprayed on the wafer 100, and then the semiconductor wafer 110 marked with magnetic ink is placed on the wafer 100, and the semiconductor wafer 110 and the wafer 100 together form a wafer.

[0144] Since the embodiment only uses magnetic ink and does not involve the preparation of magnetic ink, the actual needs can be selected.

[0145] In the edge blank suction step S2, first, the wafer is placed at the loading position of the conveying device, then the conveying device moves the wafer to be directly below the suction mechanism 150 of the edge blank removing device 130, i.e. directly above the lifting mechanism 140, then the lifting mechanism 140 lifts the wafer to the suction mechanism 150, then the suction piece 160 sucks the edge blank 170 of the semiconductor wafer 110, after the edge blank 170 is sucked, the lifting mechanism 140 returns the wafer to the conveying device.

[0146] In the air drying step S3, the conveying device moves the wafer to the air drying device 180, and the air drying device 180 blows air to the wafer to remove alcohol and static electricity between the semiconductor wafer 110 and the wafer 100.

[0147] In some embodiments, the air drying step S3 can include blowing dry the magnetic ink on the defective chip 120 to reduce waiting time, so that the production process is compact, and there is no need to additionally set up a device to dry the ink.

[0148] In the defective product removing step S4, first, the conveying device conveys the wafer to below the magnetic attraction mechanism 200, then the magnetic attraction mechanism 200 is powered on, the magnetic attraction mechanism 200 magnetically attracts the defective chip 120 marked by the magnetic ink, so that the defective chip 120 is separated from the wafer, then the conveying device continues to convey the wafer to the unloading position, then the magnetic attraction mechanism 200 is powered off or reduced, and the defective chip 120 falls to the collection piece 210.

[0149] The embodiment removes the edge blank 170 of the semiconductor wafer 110 by first adsorbing the edge blank 170 of the semiconductor wafer 110, then air drying, and finally magnetically adsorbing, removes the defective chip 120, leaves the qualified chip, and realizes full-process automatic sorting of the semiconductor wafer 110, with little use of manual labor and high production efficiency.

[0150] In some embodiments, the conveying unit of the conveying device can have a positioning column 250 to block the wafer to pass through each device in order.

[0151] Referring to Figure 11 , the application also provides an embodiment of a semiconductor processing method, which is applied to Figures 2 to 9 the semiconductor processing device.

[0152] In the embodiment, the processing method mainly includes a wafer manufacturing step S1, an edge blank suction step S2, an air drying step S3, and a defective product removing step S4.

[0153] The wafer manufacturing step S1, the edge blanking step S2, the air-drying step S3 and the defective product removing step S4 are sequentially performed for the same wafer. In production, the wafer manufacturing step S1, the edge blanking step S2, the air-drying step S3 and the defective product removing step S4 can be simultaneously performed to realize continuous processing of the wafer, i.e., continuous production.

[0154] In the wafer manufacturing step S1, first, the chips of the semiconductor wafer 110 are tested, then, the defective chips 120 are marked with magnetic ink, then, alcohol is sprayed on the base sheet 100 and marking points 220 are punched, then, the semiconductor wafer 110 marked with magnetic ink is placed on the base sheet 100 at a set angle according to the marking points 220, and the semiconductor wafer 110 and the base sheet 100 together form a wafer.

[0155] In the edge blanking step S2, first, the wafer is placed on the loading position of the conveying device, then, the conveying device moves the wafer to the position directly below the suction mechanism 150 of the edge blanking device 130, i.e., directly above the lifting mechanism 140. Specifically, the wafer is limited on the two conveying belts 240 by the two limiting plates 260, the two conveying belts 240 convey the wafer, the two positioning columns 250 abut against the wafer to make it stationary, and the center of the wafer is vertically aligned with the center of the rotating disc 290.

[0156] Then, the lifting mechanism 140 lifts the wafer to the suction mechanism 150.

[0157] Then, the suction member 160 sucks the edge blank 170 of the semiconductor wafer 110. Specifically, the rotating disc 290 is rotated to make the identifier 270 identify a marking point 220, then, the rotating disc 290 is made stationary, the suction member 160 sucks a local edge blank 170 of the semiconductor wafer 110, then, the suction member 160 stops sucking, then, the rotating disc 290 is continuously rotated to make the identifier 270 identify another marking point 220, then, the rotating disc 290 is again made stationary, and the suction member 160 sucks another local edge blank 170 of the semiconductor wafer 110.

[0158] After the edge blank 170 is sucked, the lifting mechanism 140 places the wafer back on the conveying device.

[0159] The limiting plates 260, the conveying belts 240 and the positioning columns 250 are used to meet the conveying needs and facilitate the connection of the edge blanking device 130 to position the wafer.

[0160] The embodiment controls the rotation of the rotating disc 290 by identifying the mark point 220 through the rotating disc 290 and the identifier 270, so that different positions of the semiconductor wafer 110 are within the suction range of the suction member 160, the number of the suction members 160 can be reduced, the suction range of the suction mechanism 150 is enlarged, the edge blank 170 of the semiconductor wafer 110 is completely sucked, and the omission is avoided.

[0161] In the air-drying step S3, the conveying device moves the carrier wafer to the air-drying device 180, and the air-drying device 180 blows air to the carrier wafer to remove the alcohol and static electricity between the semiconductor wafer 110 and the carrier wafer 100.

[0162] In the defective product removing step S4, first, the conveying device conveys the carrier wafer to below the magnetic suction mechanism 200, then, the magnetic suction mechanism 200 is powered on, the magnetic suction mechanism 200 magnetically adsorbs the defective chip 120 marked by the magnetic ink, so that the defective chip 120 is separated from the carrier wafer, then, the conveying device continues to convey the carrier wafer to the discharging position, and then, the magnetic suction mechanism 200 is powered off or reduced, and the defective chip 120 falls to the collecting member 210.

[0163] In the description of the present specification, the description of the terms "one embodiment, some embodiments, illustrative embodiments, examples, specific examples, or some examples" means that the specific features, structures, materials, or characteristics described in connection with the embodiment or example are included in at least one embodiment or example of the present application. In the present specification, the illustrative description of the above terms does not necessarily mean the same embodiment or example. Moreover, the specific features, structures, materials, or characteristics described can be combined in any one or more embodiments or examples as appropriate.

[0164] The terms "first, second, third, fourth" and the like (if any) in the specification and claims of the present application and the above-described drawings are used to distinguish similar objects, and do not necessarily mean a specific order or sequence. It should be understood that the data thus used can be interchanged under appropriate circumstances, so that the embodiments described herein can be implemented in an order other than that illustrated or described herein.

[0165] It should also be noted that in the description of the present specification, the relationship terms such as first and second are only used to distinguish one entity or operation from another entity or operation, and do not necessarily require or imply any such actual relationship or sequence between the entities or operations.

[0166] Furthermore, the term "comprising" and "including" and any of their derivatives, are intended to be taken in their broadest sense as meaning that they include more than the recited items, for example, a process, method, system, product or apparatus that comprises a list of steps or units is not necessarily limited to those steps or units which are recited, but can include additional steps or units that are not expressly listed or inherent to such process, method, product or apparatus.

[0167] Also, the term "comprising" or "including" or any other variation thereof, is intended to cover a non-exclusive inclusion, such that a process, method, article, or apparatus that comprises a list of elements does not include only those elements but can also include other elements not expressly listed or inherent to such process, method, article, or apparatus. An element proceeded by "comprises a... " does not, without more constraints, exclude the existence of additional identical elements in the process, method, article, or apparatus that comprises the recited element.

[0168] The above detailed description of the embodiments of the present application has been given in connection with the accompanying drawings, but the present application is not limited to the above-described embodiments, and various changes can be made within the scope of knowledge of those skilled in the art without departing from the spirit of the present application.

Claims

1. A semiconductor processing device, characterized in that: include: A conveying device is used for conveying a carrier wafer in a translational manner, wherein the carrier wafer comprises a base film (100) and a semiconductor wafer (110), alcohol is provided on the top of the base film (100), the semiconductor wafer (110) is placed on the base film (100), and a defective chip (120) of the semiconductor wafer (110) is marked with magnetic ink; An edge blank removal device (130) includes a lifting mechanism (140) and a suction mechanism (150), wherein the lifting mechanism (140) is used to lift the carrier wafer from the conveying device to the suction mechanism (150), and the suction mechanism (150) includes a plurality of suction members (160), wherein the plurality of suction members (160) are arranged along the circumference of the semiconductor wafer (110), and the suction members (160) are used to suck the edge blank (170) of the semiconductor wafer (110). After the suction is completed, the lifting mechanism (140) is used to return the carrier wafer to the conveying device; An air drying device (180), located downstream of the edge blank removal device (130), is used to remove alcohol and static electricity between the semiconductor wafer (110) and the bottom film (100); The defective product rejection device (190) is located downstream of the air-drying device (180), and includes a magnetic suction mechanism (200) and a collecting member (210). The magnetic suction mechanism (200) is located above the carrier wafer and is used to absorb the defective chip (120) to separate the defective chip (120) from the carrier wafer. The collecting member (210) is located below the magnetic suction mechanism (200) and the carrier wafer. After the carrier wafer is removed, the suction force of the magnetic suction mechanism (200) weakens or disappears, and the defective chip (120) falls to the collecting member (210).

2. The semiconductor processing equipment according to claim 1, wherein: The diameter of the semiconductor wafer (110) is smaller than the diameter of the bottom film (100), and a marking point (220) is provided on a portion of the bottom film (100) that is not blocked by the semiconductor wafer (110). According to the marking point (220), the semiconductor wafer (110) is placed concentrically at a set angle on the bottom film (100).

3. The semiconductor processing equipment according to claim 2, wherein: The conveying device comprises a plurality of conveying units, the plurality of conveying units comprising a first conveying unit (230), the first conveying unit (230) corresponding to the edge blank rejection device (130); The first conveying unit (230) comprises two side-by-side conveying belts (240), two positioning columns (250) and two limiting plates (260); The two limiting plates (260) are located on a side away from the two conveyor belts (240), and the two limiting plates (260) are used to limit the object-carrying wafer on the two conveyor belts (240); The space between the two conveyor belts (240) allows the lifting mechanism (140) to lift the object wafer; The two positioning posts (250) can be located on one side of the lifting mechanism (140) along the conveying direction of the carrier wafer, and the two positioning posts (250) are used to abut against the edge blank (170) of the bottom film (100) to locate the center of the carrier wafer and prevent the carrier wafer from moving.

4. The semiconductor processing equipment according to claim 2, wherein: The edge blank removal device (130) further includes an identifier (270) for identifying the identification point (220), and the lifting mechanism (140) includes a lifting frame (280), and the lifting frame (280) is provided with a rotating disk (290), and the rotating disk (290) is used to support the carrier wafer. When the lifting frame (280) lifts the carrier wafer, the edge blank removal device (130) controls the rotating disk (290) to rotate according to the instruction information of the identifier (270), so that the suction member (160) sucks different positions of the semiconductor wafer (110).

5. The semiconductor processing equipment according to claim 4, wherein: The lifting mechanism (140) includes two fixed plates (300) standing side by side, a power member for driving the lifting frame (280) to move up and down is provided between the two fixed plates (300), a guide column (310) and a guide hole for accommodating the guide column (310) are provided between the fixed plates (300) and the lifting frame (280), and the guide column (310) and the guide hole cooperate to form a lifting track.

6. The semiconductor processing equipment according to claim 1, wherein: The number of the suction members (160) is four, and the four suction members (160) are evenly distributed along the circumference of the semiconductor wafer (110). The suction mechanism (150) includes a mounting frame (320), and the suction members (160) are arranged on the top of the mounting frame (320). The mounting frame (320) is provided with an opening (330) that passes through from top to bottom. The suction members (160) are arranged along the edge blank (170) of the opening (330). After passing through the opening (330), the suction members (160) absorb the edge blank (170) of the semiconductor wafer (110).

7. The semiconductor processing equipment according to claim 1, wherein: The suction member (160) comprises a suction nozzle (340) and a three-axis adjustment seat (350) for mounting the suction nozzle (340), wherein the three-axis adjustment seat (350) is capable of performing Z-axis displacement adjustment, X-axis displacement adjustment, and Y-axis displacement adjustment on the suction nozzle (340).

8. The semiconductor processing equipment according to claim 1, wherein: The air-drying device (180) includes a first air-drying mechanism (360) and a second air-drying mechanism (370). The first air-drying mechanism (360) and the second air-drying mechanism (370) allow the conveying device to convey the carrier wafer. The first air-drying mechanism (360) and the second air-drying mechanism (370) can swing up and down to adjust the blowing direction.

9. A semiconductor processing method, characterized in that: A semiconductor processing device according to any one of claims 1 to 8, wherein the processing method comprises: a carrier wafer manufacturing step, testing the chips of the semiconductor wafer (110), marking defective chips (120) with magnetic ink, spraying alcohol on a film (100), and placing the semiconductor wafer (110) marked with magnetic ink on the film (100); In the step of sucking the edge blank, the carrier wafer is placed at the loading position of the conveying device, the conveying device moves the carrier wafer to the position directly below the sucking mechanism (150) of the edge blank removal device (130), the lifting mechanism (140) lifts the carrier wafer to the sucking mechanism (150), the sucking member (160) sucks the edge blank (170) of the semiconductor wafer (110), and after sucking the edge blank (170), the lifting mechanism (140) puts the carrier wafer back into the conveying device; an air-drying step, wherein the conveying device moves the carrier wafer to the air-drying device (180), and the air-drying device (180) blows air toward the carrier wafer to remove alcohol and static electricity between the semiconductor wafer (110) and the bottom film (100); In the defective product rejection step, the conveying device conveys the carrier wafer to the bottom of the magnetic attraction mechanism (200), and the magnetic attraction mechanism (200) is energized. The magnetic attraction mechanism (200) magnetically attracts the defective chip (120) marked with magnetic ink, so that the defective chip (120) is separated from the carrier wafer. The conveying device continues to convey the carrier wafer to the unloading position, and then the magnetic attraction mechanism (200) is powered off or reduced, and the defective chip (120) falls to the collecting member (210).

10. A semiconductor processing method according to claim 9, characterized in that: The diameter of the semiconductor wafer (110) is smaller than the diameter of the bottom film (100); a portion of the bottom film (100) not blocked by the semiconductor wafer (110) is provided with an identification point (220); and according to the identification point (220), the semiconductor wafer (110) is placed concentrically at a set angle on the bottom film (100); The conveying device includes a plurality of conveying units, and the plurality of conveying units include a first conveying unit (230), and the first conveying unit (230) corresponds to the edge blank removal device (130); the first conveying unit (230) includes two parallel conveying belts (240), two positioning columns (250) and two limit plates (260); the two limit plates (260) are located on the side away from the two conveying belts (240), and the two limit plates (260) are used to limit the carrier wafer on the two conveying belts (240); the space between the two conveying belts (240) allows the lifting mechanism (140) to lift the carrier wafer; the two positioning columns (250) can be located on one side of the lifting mechanism (140) along the conveying direction of the carrier wafer, and the two positioning columns (250) are used to abut the edge blank (170) of the film (100) to locate the center of the carrier wafer and prevent the carrier wafer from moving; The edge blank removal device (130) further includes an identifier (270) for identifying the identification point (220); the lifting mechanism (140) includes a lifting frame (280); the lifting frame (280) is provided with a rotating disk (290); the rotating disk (290) is used to support the carrier wafer; when the lifting frame (280) lifts the carrier wafer, the edge blank removal device (130) controls the rotating disk (290) to rotate according to the instruction information of the identifier (270), so that the suction member (160) sucks different positions of the semiconductor wafer (110); In the edge blank absorption step, the conveying device moves the carrier wafer to directly below the absorption mechanism (150) of the edge blank rejection device (130), including: two limiting plates (260) limiting the carrier wafer on the two conveyor belts (240), the two conveyor belts (240) conveying the carrier wafer, two positioning columns (250) abutting against the carrier wafer to make the carrier wafer stationary, and the center of the carrier wafer and the center of the rotating disk (290) coincide with each other in upper and lower directions; In the step of sucking the edge blank, the suction member (160) sucks the edge blank (170) of the semiconductor wafer (110), including rotating the rotating disk (290) so that the identifier (270) recognizes one of the identification points (220), then stopping the rotating disk (290) and the suction member (160) sucking a local edge blank (170) of the semiconductor wafer (110), then stopping the suction, and then continuing to rotate the rotating disk (290) so that the identifier (270) recognizes another of the identification points (220), then stopping the rotating disk (290) again and the suction member (160) sucking another local edge blank (170) of the semiconductor wafer (110).

Images