Semiconductor cleaning system and cleaning method

Abstract

The invention discloses a semiconductor cleaning system and a cleaning method, which relate to the technical field of semiconductor equipment, and include: an electromagnetically controlled rotation adjustment component, which is installed on the frame surfaces on both sides of the top of a bearing structure and forms a rotation connection, and is used to rotate the electromagnetic coil through a rotation structure. With the cooperation of the electromagnetically controlled rotation adjustment component, the overall contactless suspension and rotation of the semiconductor are effectively realized through electromagnetic control, thereby avoiding mechanical wear in traditional cleaning methods, improving the cleaning effect and service life, and making the combined use of an ultrasonic spray electric adjustment nozzle and an ultrasonic generator controller, which can effectively remove tiny particles and stubborn impurities on the semiconductor surface, ensure the cleaning quality, simplify the process flow, improve production efficiency and reliability, reduce operating costs, and with the cooperation of the semiconductor adjustment control cleaning component, further improve the cleaning effect and ensure the cleanliness of the semiconductor surface.

Description

Technical Field

[0001] The present invention relates to the technical field of semiconductor equipment, and in particular to a semiconductor cleaning system and a cleaning method. Background Art

[0002] In the semiconductor manufacturing process, a grinding process is often used to polish the wafer surface. After grinding, the wafer surface needs to be cleaned to remove the grinding fluid or by-products.

[0003] However, in the prior art, when it is necessary to clean the semiconductor, the semiconductor is conventionally placed in a row on a rack and then lowered into a cleaning tank, or ultrasonic waves are used for auxiliary cleaning. However, although the semiconductor is in the rack, a flexible part can be used to prevent the fixed surface of the semiconductor from producing slip marks, the protected surface of the semiconductor cannot be effectively cleaned due to the protection of the flexible part. Although the flexible part can be rotated on the surface of the semiconductor by a motor rotation structure so that the semiconductor can be completely cleaned, the overall cost is high and the service life cannot be guaranteed. For large-scale semiconductor processing, it cannot effectively meet the existing needs. Therefore, it is necessary to propose a semiconductor cleaning system and cleaning method. Summary of the invention

[0004] The object of the present invention is to provide a semiconductor cleaning system and a cleaning method to solve the problem proposed in the above background technology that when it is necessary to clean the semiconductor, the semiconductor is conventionally placed in a code array on a rack and then lowered into a cleaning tank, or ultrasonic waves are provided for auxiliary cleaning. However, although the semiconductor is in the rack, although a flexible part can be used to prevent the semiconductor from having slip marks on the fixed surface, the protected semiconductor surface cannot be effectively cleaned due to the protection of the flexible part. Although the flexible part can be rotated on the surface of the semiconductor through a motor rotation structure so that the semiconductor can be completely cleaned, the overall cost is high and the service life cannot be guaranteed. For large-scale semiconductor processing, the existing needs cannot be effectively met.

[0005] To achieve the above object, the present invention provides the following technical solution: a semiconductor cleaning system, comprising:

[0006] The electromagnetically controlled rotation adjustment assembly is installed on the surface of the frame on both sides of the top of the bearing structure and forms a rotation connection, which is used to rotate the electromagnetic coil through the rotation structure to achieve contactless suspension and rotation of the semiconductor to be cleaned;

[0007] The rotating slide wheels are arranged in four groups, and the four groups of rotating slide wheels are respectively located at the four ends of the bottom of the electromagnetically controlled rotating adjustment component, and are used to support and provide rotation assistance for the operation of the electromagnetically controlled rotating adjustment component;

[0008] Ultrasonic spray electric regulating nozzles are equally connected and installed on the surface of four groups of multi-section control delivery valve pipes, and are used for ultrasonic spray cleaning of semiconductors to be cleaned when they are in contactless suspension and rotating operation;

[0009] The semiconductor adjustment control cleaning component is installed inside the electromagnetic control rotation adjustment component, and is used to stabilize the semiconductor that needs to be cleaned that is initially placed, and when the electromagnetic control rotation adjustment component is operating, it gradually relaxes the clamping of the semiconductor that needs to be cleaned according to the detection feedback of the magnetic field controller, and simultaneously uses an ultrasonic generator to accurately remove impurities that are difficult to remove on the surface of the semiconductor that needs to be cleaned.

[0010] Preferably, the electromagnetically controlled rotation adjustment component comprises:

[0011] The drive energy-saving control motor, the rotating gear, the inner rotating gear ring and the outer rotating gear ring, the circumference of the drive energy-saving control motor is fastened with a side sliding bearing column frame through a motor bracket, the output end of the drive energy-saving control motor drives the rotating gear to rotate, and the rotating gear is respectively meshed with the inner rotating gear ring and the outer rotating gear ring to form a meshing connection, the side end of the outer rotating gear ring is fastened with an outer rotating cover, the side sliding bearing column frame is used to ensure the stability of the outer rotating cover, the side end of the inner rotating gear ring is fastened with an inner rotating hollow cover, and a plurality of groups of annular array electromagnetic coil control structures are equally arranged on the inner wall surface of the outer rotating cover, the side end of the electromagnetic coil control structure is connected with a magnetic field controller installed inside the outer rotating gear ring through a signal, and the bottom end of the outer rotating gear ring is connected with an automatic telescopic drain valve pipe, and four groups of multi-section quantity control delivery valve pipes are installed on the inner wall surface of the inner rotating hollow cover.

[0012] Preferably, an ultrasonic cleaning liquid tank is installed inside the frame of the supporting structure, and the side end of the ultrasonic cleaning liquid tank is connected to an adapter pump, and the left and right ends of the adapter pump are symmetrically connected to cleaning liquid guiding and distributing pipes, and the top side ends of the cleaning liquid guiding and distributing pipes are connected through the stator-rotor connecting joint and the multi-section quantity control delivery valve pipe.

[0013] Preferably, the side wall of the inner rotating gear ring is connected to a semiconductor carrier drying box via a surface-mounted stator-rotor connecting shaft, the interior of the semiconductor carrier drying box is paved with a flexible water-absorbing material layer, a microwave drying control structure is installed on the top of the semiconductor carrier drying box, and the side end of the semiconductor carrier drying box is connected to an inclined discharge valve end.

[0014] Preferably, the semiconductor regulating control cleaning component comprises:

[0015] A pneumatically controlled iris valve, an electrode, a screen cylinder and an outer frame slot frame. The pneumatically controlled iris valve forms a controlled opening and closing connection with the side end of the semiconductor carrying drying box through the stator and rotor connecting shaft. The screen cylinder is located on the surface of the surrounding frame of the pneumatically controlled iris valve and is tightly connected. The outer frame slot frame is arranged in two groups. The two groups of the outer frame slot frames are located at the left and right ends of the screen cylinder to form an embedded installation.

[0016] Preferably, the electrodes are arranged in two groups, and the two groups of electrodes are installed at the top and bottom of the inner wall surface of the screen cylinder, and the two groups of electrodes are operated by a built-in power supply structure. A sliding positioning groove is provided on the bottom wall surface of the screen cylinder, and the internal sliding connection of the sliding positioning groove is provided with a self-positioning lifting sliding frame, and a flexible fixed layer clamp is provided on the top of the self-positioning lifting sliding frame, and the self-positioning lifting sliding frame is composed of a sliding frame, a positioning detection sensor and a micro pneumatic lifting rod.

[0017] Preferably, two groups of pneumatic guide rods are symmetrically installed inside the two groups of outer frame slots, and the side ends of the two groups of pneumatic guide rods are fastened with an angle rotation adjustment structure. The angle rotation adjustment structure consists of a mounting frame, an angle sensor, a motor rotation structure and a rotating shaft rod. The side ends of the two groups of pneumatic guide rods are fastened with the sides of the mounting frame, and the circumferential side sleeve of the rotating shaft rod is connected with a flexible clamping layer clip.

[0018] Preferably, micro-control rails are symmetrically installed on the top and bottom of the side ends of the flexible clamping layer, and the micro-control rails are internally slidably connected to a position sliding saddle, and an electric-controlled angle adjustment structure is installed on the side end of the position sliding saddle, and an ultrasonic generator controller is installed on the side end of the electric-controlled angle adjustment structure.

[0019] Preferably, a sealed observation door is hinged on the side end of the inner rotating gear ring, an ultrasonic transducer is installed on the inner surface of the sealed observation door, a drain pipe is embedded in the surface of the supporting structure, and the drain pipe and the automatic telescopic drain valve pipe form a corresponding vertical axis.

[0020] A cleaning method for a semiconductor cleaning system comprises the following steps:

[0021] S1. First, the operator slides the placed self-positioning lifting slide frame from the sliding positioning groove, and places it after positioning. Two sets of pneumatic guide rods are used to drive the angle rotation adjustment structure and the flexible clamping layer clamp to contact the placed flexible fixed layer clamp, so that the flexible clamping layer clamps at both ends clamp the semiconductor to be cleaned in the flexible fixed layer clamp. Then the operator takes out the empty self-positioning lifting slide frame and closes the sealed observation door.

[0022] S2. Then, the electromagnetic control rotation adjustment component is started, and the detection feedback of the magnetic field controller controls the rotating electromagnetic coil control structure, so that after the magnetic field force that makes the semiconductor suspend is generated, the two sets of pneumatic guide rods drive the flexible clamping layer clamp to gradually relax the clamping of the semiconductor to be cleaned, and return to the inside of the outer frame slot frame, so that the semiconductor rotates;

[0023] S3. Secondly, after the micro-control linear rail drives the position sliding saddle to adjust, the electronically controlled angle adjustment structure is used in conjunction with the photoelectric sensor installed on the side to drive the ultrasonic generator controller to accurately align with the position of the semiconductor that is difficult to clean;

[0024] S4. Afterwards, an ultrasonic cleaning liquid tank, an adapter pump, a cleaning liquid guide and distribution pipe, a multi-section volume control delivery valve pipe and an ultrasonic spray electric adjustment nozzle are used to form a cleaning spray structure for cleaning the suspended and rotating semiconductor. Then, after the cleaning is completed, the ultrasonic transducer is started to generate a controllable ultrasonic shock wave to push the cleaned semiconductor into the semiconductor carrying drying box, and after being dried by the microwave drying control structure, it is discharged from the inclined discharge valve end. The generated cleaning waste liquid is discharged after the automatic telescopic discharge valve pipe automatically telescopes and forms a corresponding connection with the discharge pipe when the electromagnetically controlled rotating adjustment component rotates and makes the automatic telescopic discharge valve pipe located at the bottom.

[0025] Compared with the prior art, the present invention has the following beneficial effects:

[0026] 1. In the present invention, the position and size of the semiconductor are detected by the magnetic field controller provided in cooperation with the electromagnetic control rotation adjustment component, and feedback is used to adjust the overall operation of the electromagnetic control rotation adjustment component. When the cleaned semiconductor is initially fixed and ensured not to move at the initial start-up, the energy-saving control motor is driven to drive the rotating gear to rotate, and the rotating gear is meshed with the inner rotating gear ring and the outer rotating gear ring, so that the inner rotating gear ring and the outer rotating gear ring rotate synchronously, and the inner rotating gear ring and the outer rotating gear ring are rotationally connected through the rotating ring, that is, the top of the rotating gear drives the inner rotating gear ring and the connected inner rotating gear ring. The hollow cover rotates in the forward direction, and the bottom of the rotating gear drives the outer rotating gear ring and the outer rotating cover connected to it to rotate in the reverse direction, thereby causing the electromagnetic coil control structure located outside the semiconductor to rotate. The slide wheel and the top two side frame surfaces of the supporting structure are then rotated to support and provide rotation assistance for the rotation of the outer rotating cover. The magnetic field strength and direction of the electromagnetic coil control structure are then adjusted to allow the semiconductor to form a contactless suspension, and the magnetic field formed by the rotating electromagnetic coil control structure drives the semiconductor to rotate in the air, ensuring that all surfaces thereof can be evenly cleaned in the subsequent process.

[0027] 2. In the present invention, the adapter pump conveys the cleaning liquid in the ultrasonic cleaning liquid tank to the multi-section control delivery valve pipe through the cleaning liquid guide distribution pipe under the cooperation of the adapter pump, the multi-section control delivery valve pipe and the ultrasonic spray electric adjustment nozzle, so that the ultrasonic spray electric adjustment nozzle automatically adjusts the spray angle and flow rate according to the shape and position of the semiconductor, sprays ultrasonic spray containing cleaning agent, and comprehensively cleans the surface of the semiconductor. During the cleaning process, the semiconductor adjustment control cleaning component gradually relaxes the clamping of the semiconductor according to the feedback of the magnetic field controller, but ensures that the semiconductor will not be subjected to excessive mechanical stress during the cleaning process, and at the same time keeps it rotating stably in the air. After the cleaning is completed, the electromagnetic control rotation adjustment component gradually weakens the magnetic field, and the ultrasonic exchange The energy device generates a controllable ultrasonic shock wave to push the cleaned semiconductor, so that the semiconductor slowly falls into the semiconductor carrying drying box, and starts the microwave drying control structure through the flexible water-absorbing material layer, quickly dries the cleaned semiconductor, and absorbs excess water through the semiconductor flexible water-absorbing material layer, and then discharges the cleaned and dried semiconductor through the inclined discharge valve end. The overall effective contactless suspension and rotation of the semiconductor is achieved through electromagnetic control, avoiding mechanical wear in traditional cleaning methods, improving cleaning effect and service life, and combining the ultrasonic spray electric adjustment nozzle and the ultrasonic generation controller to effectively remove tiny particles and stubborn impurities on the semiconductor surface, ensure cleaning quality, simplify the process flow, improve production efficiency and reliability, and reduce operating costs.

[0028] 3. In the present invention, the semiconductor to be cleaned is placed in the flexible fixed layer clamp of the self-positioning lifting slide frame with the cooperation of the semiconductor adjustment control cleaning component. Then the operator slides the placed self-positioning lifting slide frame from the sliding positioning groove, and places it after positioning. Two sets of pneumatic guide rods are used to drive the angle rotation adjustment structure and the corresponding contact between the flexible clamping layer clamp and the placed flexible fixed layer clamp. The self-positioning lifting slide frame adjusts its height through the micro pneumatic lifting rod so that the flexible fixed layer clamp firmly clamps the semiconductor, and then the flexible clamping layer clamps at both ends clamp the semiconductor to be cleaned in the flexible fixed layer clamp. The pneumatic guide rod guides the horizontal movement of the self-positioning lifting slide frame to ensure its stability during the cleaning process. Then the operator takes out the empty self-positioning lifting slide frame and closes the sealing surface. The pneumatically controlled iris valve is connected to the side end of the semiconductor carrier drying box through the stator and rotor connecting shaft to form a controlled opening and closing connection, and the screen cylinder is located on the surface of the peripheral frame of the pneumatically controlled iris valve and is tightly connected, so that the screen cylinder remains stable when the inner and outer gear rings rotate, and then the two sets of electrodes generate an electric field through the built-in power supply structure, so that positive and negative charges are generated on the surface of the semiconductor, and then the aggregation of positive and negative charges is used to electrostatically aggregate the dust on the surface of the semiconductor, and the distribution of charges is controlled to form magnetic conductivity on the surface of the semiconductor, so that the semiconductor is suspended and rotated, and the cleaning mist generated by the ultrasonic spray electric adjustment nozzle is used for cleaning, and the cleaning mist is used to take away the charges and dust on the surface of the semiconductor, thereby further improving the cleaning effect and ensuring the cleanliness of the semiconductor surface. BRIEF DESCRIPTION OF THE DRAWINGS

[0029] Figure 1 It is a schematic diagram of the main structure of a semiconductor cleaning system of the present invention;

[0030] Figure 2 It is a schematic diagram of the structure of a semiconductor cleaning system in a side view of the present invention;

[0031] Figure 3 It is a structural schematic diagram of an automatic telescopic drain valve tube in a semiconductor cleaning system of the present invention;

[0032] Figure 4 In a semiconductor cleaning system of the present invention Figure 2 A is an enlarged structural diagram;

[0033] Figure 5 It is a partial structural schematic diagram of an electromagnetically controlled rotation adjustment component in a semiconductor cleaning system of the present invention;

[0034] Figure 6 A schematic diagram of the installation position structure of a semiconductor regulating and controlling cleaning component in a semiconductor cleaning system of the present invention;

[0035] Figure 7It is a schematic diagram of the installation position structure of a multi-section volume control delivery valve pipe and an ultrasonic spray electric regulating nozzle in a semiconductor cleaning system of the present invention;

[0036] Figure 8 It is a structural schematic diagram of a semiconductor regulating and controlling cleaning component in a semiconductor cleaning system of the present invention;

[0037] Fig. 9 In a semiconductor cleaning system of the present invention, Figure 8 Schematic diagram of the enlarged structure at B.

[0038] In the figure: 1, bearing structure; 2, electromagnetic control rotation adjustment component; 201, drive energy-saving control motor; 202, rotating gear; 203, inner rotating gear ring; 204, outer rotating gear ring; 205, outer rotating cover; 206, electromagnetic coil control structure; 3, side sliding bearing column frame; 4, rotating slideway wheel; 5, drain pipe; 6, ultrasonic cleaning liquid tank; 7, sealed observation door; 8, ultrasonic transducer; 9, semiconductor adjustment control cleaning component; 901, pneumatic control iris valve; 902, electrode; 903, screen cylinder; 904, outer frame slot frame; 905, pneumatic guide rod; 906, slide Dynamic positioning groove; 907, self-positioning lifting sliding frame; 908, flexible fixed layer clamp; 909, angle rotation adjustment structure; 9090, flexible locking layer clamp; 9091, micro-control linear rail; 9092, position sliding saddle; 9093, electric control angle adjustment structure; 9094, ultrasonic generator controller; 10, adapter pump; 11, cleaning liquid guide distribution pipe; 12, semiconductor carrier drying box; 13, microwave drying control structure; 14, inclined discharge valve end; 15, automatic telescopic discharge valve pipe; 16, multi-section quantity control delivery valve pipe; 17, ultrasonic spray electric adjustment nozzle. DETAILED DESCRIPTION

[0039] The following will be combined with the drawings in the embodiments of the present invention to clearly and completely describe the technical solutions in the embodiments of the present invention. Obviously, the implementation regulations described are only part of the embodiments of the present invention, not all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the present invention.

[0040] In the present invention, reference is made to Figure 1 - Fig. 9 Shown: A semiconductor cleaning system, comprising:

[0041] The electromagnetically controlled rotation adjustment assembly 2 is installed on the top and side surfaces of the supporting structure 1 and forms a rotation connection, and is used to rotate the electromagnetic coil through the rotation structure to achieve contactless suspension and rotation of the semiconductor to be cleaned;

[0042] The rotating slide wheels 4 are arranged in four groups, and the four groups of rotating slide wheels 4 are respectively located at the four ends of the bottom of the electromagnetically controlled rotating adjustment component 2, and are used to support and provide rotation assistance for the operation of the electromagnetically controlled rotating adjustment component 2;

[0043] Ultrasonic spray electric regulating nozzle 17, which is equally connected and installed on the surface of four groups of multi-section control delivery valve pipes 16, is used for ultrasonic spray cleaning of the semiconductor to be cleaned when it forms a non-contact suspension and rotates;

[0044] The semiconductor adjustment control cleaning component 9 is installed inside the electromagnetic control rotation adjustment component 2, and is used to stabilize the semiconductor that needs to be cleaned that is initially placed, and when the electromagnetic control rotation adjustment component 2 is working, it gradually relaxes the clamping of the semiconductor that needs to be cleaned according to the detection feedback of the magnetic field controller, and simultaneously uses an ultrasonic generator to accurately remove impurities that are difficult to remove on the surface of the semiconductor that needs to be cleaned.

[0045] In the present invention, according to Figure 1 - Figure 6 As shown, the electromagnetically controlled rotation adjustment component 2 includes:

[0046] The energy-saving control motor 201 is driven, the rotating gear 202, the inner rotating gear ring 203 and the outer rotating gear ring 204 are fastened to the side sliding bearing column frame 3 on the periphery of the energy-saving control motor 201 through the motor bracket, and the output end of the energy-saving control motor 201 drives the rotating gear 202 to rotate, and the rotating gear 202 is meshed with the inner rotating gear ring 203 and the outer rotating gear ring 204 respectively, and the side end of the outer rotating gear ring 204 is fastened with the outer rotating cover 205, and the side sliding bearing column frame 3 is used to To ensure the stability of the outer rotating cover 205, the side end of the inner rotating gear ring 203 is fastened with the inner rotating hollow cover, and a plurality of groups of annular array electromagnetic coil control structures 206 are equally arranged on the inner wall surface of the outer rotating cover 205. The side end of the electromagnetic coil control structure 206 is connected to the magnetic field controller installed inside the outer rotating gear ring 204 through a signal. The bottom end of the outer rotating gear ring 204 is connected to an automatic telescopic drain valve tube 15, and four groups of multi-section quantity control delivery valve tubes 16 are installed on the inner wall surface of the inner rotating hollow cover.

[0047] An ultrasonic cleaning liquid tank 6 is installed inside the frame of the supporting structure 1, and the side end of the ultrasonic cleaning liquid tank 6 is connected to an adapter pump 10. The left and right ends of the adapter pump 10 are symmetrically connected to a cleaning liquid guiding and distributing pipe 11, and the top side end of the cleaning liquid guiding and distributing pipe 11 is connected through a stator-rotor connecting joint and a multi-section quantity control delivery valve pipe 16.

[0048] The side wall of the inner rotating gear ring 203 is connected to a semiconductor carrier drying box 12 through a surface-mounted stator-rotor connecting shaft. The interior of the semiconductor carrier drying box 12 is paved with a flexible water-absorbing material layer. A microwave drying control structure 13 is installed on the top of the semiconductor carrier drying box 12. The side end of the semiconductor carrier drying box 12 is connected to an inclined discharge valve end 14.

[0049] In a specific scheme, the semiconductor to be cleaned is first placed in the semiconductor carrying drying box 12, and the position and size of the semiconductor are detected by the magnetic field controller, and feedback is used to adjust the overall operation of the electromagnetic control rotation adjustment component 2. When the semiconductor to be cleaned is initially fixed and it is ensured that it will not move in the initial startup, the energy-saving control motor 201 is driven to drive the rotating gear 202 to rotate, and the rotating gear 202 forms a meshing connection with the inner rotating gear ring 203 and the outer rotating gear ring 204, so that the inner rotating gear ring 203 and the outer rotating gear ring 204 rotate synchronously, and the inner rotating gear ring 203 and the outer rotating gear ring 204 form a rotation connection through a swivel, so that the top of the rotating gear 202 drives the inner rotating gear ring 203 and the connected inner rotating gear ring 204 to rotate. The hollow cover forms a positive rotation, and the bottom of the rotating gear 202 drives the outer rotating gear ring 204 and the outer rotating cover 205 connected thereto to form a reverse rotation, thereby causing the electromagnetic coil control structure 206 to rotate outside the semiconductor, and then the sliding wheel 4 and the top two side frame surfaces of the supporting structure 1 are used to support and provide rotation assistance for the rotation of the outer rotating cover 205, and then the magnetic field strength and direction of the electromagnetic coil control structure 206 are adjusted to make the semiconductor form a contactless suspension, and the magnetic field formed by the rotating electromagnetic coil control structure 206 drives the semiconductor to rotate in the air, ensuring that all surfaces thereof can be evenly cleaned in the subsequent cleaning, and then the adapter pump 10 passes the cleaning liquid in the ultrasonic cleaning liquid tank 6 through the ultrasonic cleaning liquid tank 6. The cleaning liquid is delivered to the multi-section control delivery valve pipe 16 through the cleaning liquid delivery distribution pipe 11, so that the ultrasonic spray electric adjustment nozzle 17 automatically adjusts the spray angle and flow rate according to the shape and position of the semiconductor, and sprays ultrasonic spray containing cleaning agent to comprehensively clean the surface of the semiconductor. During the cleaning process, the semiconductor adjustment control cleaning component 9 gradually relaxes the clamping of the semiconductor according to the feedback of the magnetic field controller, but it is necessary to ensure that the semiconductor will not be subjected to excessive mechanical stress during the cleaning process, and at the same time keep it rotating stably in the air. After the cleaning is completed, the electromagnetic control rotation adjustment component 2 gradually weakens the magnetic field, and the ultrasonic transducer 8 generates a controllable ultrasonic shock wave to push the cleaned semiconductor, so that the semiconductor slowly It descends into the semiconductor carrying drying box 12, and starts the microwave drying control structure 13 through the flexible water-absorbing material layer, quickly dries the cleaned semiconductor, and absorbs excess water through the semiconductor flexible water-absorbing material layer, and then discharges the cleaned and dried semiconductor through the inclined discharge valve end 14. The overall contactless suspension and rotation of the semiconductor are effectively achieved through electromagnetic control, avoiding mechanical wear in traditional cleaning methods, improving the cleaning effect and service life, and combining the ultrasonic spray electric adjustment nozzle 17 and the ultrasonic generation controller 9094 to effectively remove tiny particles and stubborn impurities on the semiconductor surface, ensure cleaning quality, simplify the process flow, improve production efficiency and reliability, and reduce operating costs.

[0050] In the present invention, according to Figure 1 , Figure 3 , Figure 5 , Figure 6 , Figure 7 , Figure 8 and Fig. 9 As shown, the semiconductor regulating control cleaning component 9 includes:

[0051] The pneumatically controlled iris valve 901, the electrode 902, the screen cylinder 903 and the outer frame slot frame 904, the pneumatically controlled iris valve 901 forms a controlled opening and closing connection with the side end of the semiconductor carrying drying box 12 through the stator and rotor connecting shaft, the screen cylinder 903 is located on the surface of the surrounding side frame of the pneumatically controlled iris valve 901 and is fastened thereto, and the outer frame slot frame 904 is arranged in two groups, and the two groups of outer frame slot frames 904 are located on the left and right ends of the screen cylinder 903 to form an embedded installation.

[0052] The electrodes 902 are arranged in two groups, and the two groups of electrodes 902 are installed at the top and bottom of the inner wall surface of the screen cylinder 903. The two groups of electrodes 902 are operated by a built-in power supply structure. A sliding positioning groove 906 is provided on the bottom wall surface of the screen cylinder 903. The internal sliding connection of the sliding positioning groove 906 is provided with a self-positioning lifting sliding frame 907. A flexible fixed layer clamp 908 is provided at the top of the self-positioning lifting sliding frame 907. The self-positioning lifting sliding frame 907 is composed of a sliding frame, a positioning detection sensor and a micro pneumatic lifting rod.

[0053] Two groups of pneumatic guide rods 905 are symmetrically installed inside the two groups of outer frame slot frames 904. The side ends of the two groups of pneumatic guide rods 905 are fastened with an angle rotation adjustment structure 909. The angle rotation adjustment structure 909 consists of a mounting frame, an angle sensor, a motor rotation structure and a rotating shaft. The side ends of the two groups of pneumatic guide rods 905 are fastened with the sides of the mounting frame, and the peripheral side of the rotating shaft is sleeved with a flexible clamping layer clip 9090.

[0054] The micro-control rails 9091 are symmetrically installed on the top and bottom of the side ends of the flexible clamping layer 9090, and the internal sliding connection of the micro-control rails 9091 is provided with a position sliding saddle 9092. The side ends of the position sliding saddle 9092 are provided with an electric-controlled angle adjustment structure 9093, and the side ends of the electric-controlled angle adjustment structure 9093 are provided with an ultrasonic generator controller 9094.

[0055] In a specific solution, the semiconductor to be cleaned is placed in the flexible fixed layer clamp 908 of the self-positioning lifting slide frame 907. Then the operator slides the placed self-positioning lifting slide frame 907 from the sliding positioning groove 906, and places it after positioning. Two sets of pneumatic guide rods 905 are used to drive the angle rotation adjustment structure 909 and the flexible clamping layer clamp 9090 to contact the placed flexible fixed layer clamp 908. The self-positioning lifting slide frame 907 adjusts its height through the micro-pneumatic lifting rod so that the flexible fixed layer clamp 908 firmly clamps the semiconductor, and then the flexible clamping layer clamps 9090 at both ends clamp the semiconductor to be cleaned in the flexible fixed layer clamp 908. The pneumatic guide rods 905 guide the horizontal movement of the self-positioning lifting slide frame 907 to ensure its stability during the cleaning process. Then the operator takes out the empty self-positioning lifting slide frame 907. The sliding frame 907 is lifted and lowered, and the sealed observation door 7 is closed, wherein the pneumatically controlled iris valve 901 forms a controlled opening and closing connection with the side end of the semiconductor carrying drying box 12 through the stator and rotor connecting shaft, and the screen cylinder 903 is located on the surface of the peripheral frame of the pneumatically controlled iris valve 901 and is tightly connected, so that the screen cylinder 903 remains stable when the inner rotating gear ring 203 and the outer rotating gear ring 204 rotate, and then the two sets of electrodes 902 generate an electric field through the built-in power supply structure, so that positive and negative charges are generated on the surface of the semiconductor, and then the aggregation of positive and negative charges is used to electrostatically aggregate the dust on the surface of the semiconductor, and the distribution of charges is controlled to form magnetic conductivity on the surface of the semiconductor, and when the semiconductor is suspended and rotated and cleaned by the cleaning mist generated by the ultrasonic spray electric adjustment nozzle 17, the cleaning mist is used to carry away the charges and dust on the surface of the semiconductor.

[0056] In the present invention, according to Figure 1 and Figure 3 As shown, the side end of the inner rotating gear ring 203 is hinged with a sealed observation door 7, the inner surface of the sealed observation door 7 is installed with an ultrasonic transducer 8, and the surface of the supporting frame 1 is embedded with a drain pipe 5, and the drain pipe 5 and the automatic telescopic drain valve pipe 15 form a corresponding vertical axis.

[0057] In a specific scheme, after cleaning is completed, the ultrasonic transducer 8 is started to generate a controllable ultrasonic shock wave to push the cleaned semiconductor into the semiconductor carrying drying box 12 after the pneumatically controlled iris valve 901 is opened, wherein the ultrasonic transducer 8 realizes the directional propagation of ultrasonic waves through phase control and array layout to ensure the directionality and uniformity of the thrust, and the cleaning waste liquid and gas generated are automatically retracted by the automatic retractable drain valve tube 15 to form a corresponding connection with the drain pipe 5 when the electromagnetically controlled rotating adjustment component 2 rotates and makes the automatic retractable drain valve tube 15 located at the bottom end, and the microwave drying control structure 13 is used to dry the relevant structures in the semiconductor adjustment control cleaning component 9.

[0058] The wiring diagram of the driving energy-saving control motor 201, electromagnetic coil control structure 206, ultrasonic transducer 8, pneumatic control iris valve 901, ultrasonic generating controller 9094 and magnetic field controller in the present invention is common knowledge in the field, and its working principle is a well-known technology. The model is selected according to the actual use, so the control method and wiring arrangement of the driving energy-saving control motor 201, electromagnetic coil control structure 206, ultrasonic transducer 8, pneumatic control iris valve 901, ultrasonic generating controller 9094 and magnetic field controller will not be explained in detail.

[0059] Although the present invention has been described in detail with reference to the aforementioned embodiments, it is still possible for those skilled in the art to modify the technical solutions described in the aforementioned embodiments, or to make equivalent substitutions for some of the technical features therein. Any modifications, equivalent substitutions, improvements, etc. made within the spirit and principles of the present invention should be included in the protection scope of the present invention.

Claims

1. A semiconductor cleaning system, characterized in that: Included are: An electromagnetically controlled rotation adjustment component (2) is mounted on the top and side surfaces of the support frame (1) to form a rotation connection, and is used to rotate the electromagnetic coil through the rotation structure to achieve contactless suspension and rotation of the semiconductor to be cleaned; Rotating slide wheels (4) are arranged in four groups, and the four groups of rotating slide wheels (4) are respectively located at four ends of the bottom of the electromagnetically controlled rotating adjustment component (2), and are used to support and provide rotation assistance for the operation of the electromagnetically controlled rotating adjustment component (2); Ultrasonic spray electric regulating nozzles (17) are equally connected and installed on the surface of four groups of multi-section control delivery valve pipes (16), and are used to ultrasonically spray clean the semiconductor to be cleaned when the semiconductor is in non-contact suspension and rotated operation; The semiconductor adjustment control cleaning component (9) is installed inside the electromagnetic control rotation adjustment component (2) and is used to stabilize the semiconductor to be cleaned that is initially placed therein, and when the electromagnetic control rotation adjustment component (2) is in operation, according to the detection feedback of the magnetic field controller, gradually loosens the clamping force on the semiconductor to be cleaned, and simultaneously uses an ultrasonic generator to accurately remove impurities that are difficult to remove from the surface of the semiconductor to be cleaned; The electromagnetically controlled rotation adjustment component (2) comprises: A driving energy-saving control motor (201), a rotating gear (202), an inner rotating gear ring (203) and an outer rotating gear ring (204); the peripheral side of the driving energy-saving control motor (201) is fastened to a side sliding bearing column frame (3) via a motor bracket; the output end of the driving energy-saving control motor (201) drives the rotating gear (202) to rotate; the rotating gear (202) is meshedly connected to the inner rotating gear ring (203) and the outer rotating gear ring (204) respectively; the side end of the outer rotating gear ring (204) is fastened to an outer rotating cover (205); the side sliding bearing column frame (3) To ensure the stability of the outer rotating cover (205), the side end of the inner rotating gear ring (203) is fastened to the inner rotating hollow cover, and multiple groups of annular array electromagnetic coil control structures (206) are equally arranged on the inner wall surface of the outer rotating cover (205). The side end of the electromagnetic coil control structure (206) is connected to the magnetic field controller installed inside the outer rotating gear ring (204) through a signal. The bottom end of the outer rotating gear ring (204) is connected to an automatic telescopic discharge valve pipe (15), and four groups of multi-section control delivery valve pipes (16) are installed on the inner wall surface of the inner rotating hollow cover.

2. The semiconductor cleaning system according to claim 1, characterized in that: An ultrasonic cleaning liquid tank (6) is installed inside the frame of the supporting structure (1), and the side end of the ultrasonic cleaning liquid tank (6) is connected to an adapter pump (10), and the left and right ends of the adapter pump (10) are symmetrically connected to cleaning liquid guide and distribution pipes (11), and the top side ends of the cleaning liquid guide and distribution pipes (11) are connected through stator-rotor connecting joints and a multi-section volume control delivery valve pipe (16).

3. The semiconductor cleaning system according to claim 2, characterized in that: A semiconductor carrier drying box (12) is connected to the side wall of the inner rotating gear ring (203) via a surface-mounted stator-rotor connecting shaft, a flexible water-absorbing material layer is laid inside the semiconductor carrier drying box (12), a microwave drying control structure (13) is installed on the top of the semiconductor carrier drying box (12), and a side end of the semiconductor carrier drying box (12) is connected to an inclined discharge valve end (14).

4. The semiconductor cleaning system according to claim 3, characterized in that: The semiconductor regulating control cleaning component (9) comprises: A pneumatically controlled iris valve (901), an electrode (902), a screen cylinder (903) and an outer frame slot frame (904); the pneumatically controlled iris valve (901) is connected to the side end of the semiconductor carrier drying box (12) via a stator-rotor connecting shaft to form a controlled opening and closing connection; the screen cylinder (903) is located on the surface of the peripheral frame of the pneumatically controlled iris valve (901) and is fastened thereto; the outer frame slot frame (904) is arranged in two groups; the two groups of the outer frame slot frames (904) are located at the left and right ends of the screen cylinder (903) to form an embedded installation.

5. The semiconductor cleaning system according to claim 4, characterized in that: The electrodes (902) are arranged in two groups. The two groups of electrodes (902) are installed at the top and bottom of the inner wall surface of the screen cylinder (903). The two groups of electrodes (902) are operated by a built-in power supply structure. A sliding positioning groove (906) is provided on the bottom wall surface of the screen cylinder (903). The interior of the sliding positioning groove (906) is slidably connected to a self-positioning lifting sliding frame (907). A flexible fixed layer clamp (908) is connected to the top of the self-positioning lifting sliding frame (907). The self-positioning lifting sliding frame (907) is composed of a sliding frame, a positioning detection sensor and a micro pneumatic lifting rod.

6. The semiconductor cleaning system according to claim 5, characterized in that: Two groups of pneumatic guide rods (905) are symmetrically installed inside the two groups of outer frame slot frames (904). The side ends of the two groups of pneumatic guide rods (905) are fastened with an angle rotation adjustment structure (909). The angle rotation adjustment structure (909) consists of a mounting frame, an angle sensor, a motor rotation structure and a rotating shaft rod. The side ends of the two groups of pneumatic guide rods (905) are fastened with the sides of the mounting frame, and the peripheral side of the rotating shaft rod is sleeved with a flexible clamping layer clip (9090).

7. The semiconductor cleaning system according to claim 6, characterized in that: Micro-control rails (9091) are symmetrically installed on the top and bottom of the side ends of the flexible snap-fit ​​layer clamp (9090), and the micro-control rails (9091) are internally slidably connected to a position sliding saddle (9092), and an electrically controlled angle adjustment structure (9093) is installed on the side end of the position sliding saddle (9092), and an ultrasonic generator controller (9094) is installed on the side end of the electrically controlled angle adjustment structure (9093).

8. The semiconductor cleaning system according to claim 7, characterized in that: A sealed observation door (7) is hingedly connected to the side end of the inner rotating gear ring (203), an ultrasonic transducer (8) is installed on the inner surface of the sealed observation door (7), a drain pipe (5) is embedded in the surface of the supporting frame (1), and the drain pipe (5) and the automatic telescopic drain valve pipe (15) form a corresponding vertical axis.

9. A cleaning method for a semiconductor cleaning system, characterized in that: The semiconductor cleaning system according to claim 8 is used, comprising the following steps: S1. First, the operator slides the placed self-positioning lifting slide frame (907) from the sliding positioning groove (906), positions it and places it, and uses two sets of pneumatic guide rods (905) to drive the angle rotation adjustment structure (909) and the flexible clamping layer clamp (9090) to contact the placed flexible fixed layer clamp (908) accordingly, so that the flexible clamping layer clamps (9090) at both ends clamp the semiconductor to be cleaned in the flexible fixed layer clamp (908), and then the operator takes out the empty self-positioning lifting slide frame (907) and closes the sealed observation door (7); S2, then, the electromagnetic control rotation adjustment component (2) is started, and the detection feedback of the magnetic field controller controls the rotating electromagnetic coil control structure (206), so that after the magnetic field force that allows the semiconductor to suspend is generated, the two sets of pneumatic guide rods (905) drive the flexible clamping layer clamp (9090) to gradually loosen the clamping force on the semiconductor to be cleaned, and return to the inside of the outer frame slot frame (904), so that the semiconductor rotates; S3. Secondly, after the micro-control linear rail (9091) drives the position sliding saddle (9092) to adjust, the electronically controlled angle adjustment structure (9093) cooperates with the photoelectric sensor installed on the side to drive the ultrasonic generator controller (9094) to accurately align with the position of the semiconductor that is difficult to clean; S4. Then, an ultrasonic cleaning liquid tank (6), an adaptor pump (10), a cleaning liquid guide distribution pipe (11), a multi-section control delivery valve pipe (16) and an ultrasonic spray electric adjustment nozzle (17) are used to form a cleaning spray structure for cleaning the suspended and rotating semiconductor. Then, after the cleaning is completed, the ultrasonic transducer (8) is started to generate a controllable ultrasonic shock wave to push the cleaned semiconductor into the semiconductor carrying drying box (12), and after being dried by the microwave drying control structure (13), it is discharged from the inclined discharge valve end (14). When the electromagnetically controlled rotation adjustment component (2) rotates and the automatic telescopic discharge valve pipe (15) is located at the bottom, the automatic telescopic discharge valve pipe (15) automatically retracts to form a corresponding connection with the discharge pipe (5) and then is discharged.

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