Core particle module based on MEMS optical switch and broadcast communication

Abstract

The invention relates to a core particle module based on MEMS optical switches and broadcast communication, the core particle module comprises a plurality of core particles, the core particles are used for carrying out core particle packaging on each sub-module circuit with a certain determination function, every two core particles are connected through an MEMS optical switch network, two ends of each MEMS optical switch are respectively connected with two core particles through optical fibers, and the core particles are connected with the MEMS optical switch network. Data transmission is realized in the MEMS optical switch in a broadcast communication mode. The MEMS optical switch and the core particle packaging technology are effectively combined, and the packaging technology has the advantages of being small in size, high in speed and low in energy consumption by means of control of a micro electro mechanical system. The multicast thought in the broadcast thought is used, the interconnectivity among the core particles is improved, the reutilization degree of core particle packaging is improved, and the test efficiency and the error-tolerant rate are improved.

Description

Technical Field

[0001] The present invention relates to the technical field of semiconductor packaging, and in particular to a core module based on MEMS optical switches and broadcast communications. Background Art

[0002] With the continuous advancement of semiconductor technology, chip performance has gradually improved. However, Moore's Law has gradually slowed down, and the optimization of chip area has become more and more extreme. The blind pursuit of increasing the number of transistors that can be accommodated per unit area will inevitably expose problems such as leakage current and poor heat dissipation of silicon circuits. It is urgent to achieve breakthroughs through other advanced technologies, so that both the performance of the circuit can be taken into account and the chip area can be reduced.

[0003] Chip Scale Package (CSP) is a small packaging technology that aims to package integrated circuit chips in a package that is very close to the chip size. Compared with traditional packaging forms, chip packaging can significantly reduce the overall package size, which helps to achieve more compact electronic device design. The connection distance between the chip and the substrate in the chip package is very short, which helps to reduce signal transmission delay and power consumption, and improve system performance. Due to the small package size and short signal transmission distance, chip packaging usually has lower power consumption, which helps to extend battery life. Chip packaging helps to improve heat dissipation performance, because the package is closer to the chip, heat transfer is more efficient, and the stability and reliability of the system are improved. Chip packaging helps to increase integration, so that more functions can be integrated in a single package, which helps to reduce system complexity and improve production efficiency. Chip packaging can reduce material usage and manufacturing processes, thereby reducing manufacturing costs, which is particularly attractive for large-scale production. Chip packaging is widely used in mobile devices, smart wearable devices, wireless communication modules, sensors, medical devices and other fields, meeting the needs of miniaturization, lightweight and high performance.

[0004] When the chip packaging technology is actually used, each submodule can be packaged as a chip, and then multiple submodule chips can be connected together as a chip with complete functions. This not only takes into account the circuit performance, but also facilitates subsequent testing. As for the submodule chip, how to effectively connect the submodules and how to better use this feature have also become a topic worth thinking about. Different from the old packaging technology, the chip packaging makes each submodule independent. If the utilization efficiency of each submodule can be improved and the cost of high-repetition tape-out can be saved, the advantages of the chip packaging can be better demonstrated and better put into application.

[0005] In the field of data transmission, broadcast technology is a key communication method that allows a single sender to send information to all available receivers on the network, which can reduce the storage space occupied. As an efficient means of local area network information dissemination, broadcast technology has the advantages of realizing network discovery, simplifying device configuration, and ensuring the real-time nature of information. Among them, multicast technology is a host sending a shared channel network frame to the remaining multiple hosts. The application of broadcast technology is conducive to data transmission between different hosts. The MEMS optical switch is an optical switch manufactured using micro-electromechanical system (MEMS) technology, which has the advantages of small size, high speed and low energy consumption. It is these advantages that enable the MEMS optical switch to achieve precise switching and routing of optical signals. And because it has a fast response time, it can have more applications for circuit switching and repeated connections. The present invention is based on the idea of ​​broadcasting of the MEMS optical switch to further expand the advantages of chip packaging.

[0006] Therefore, how to use the above-mentioned technology to maximize the advantages of chip packaging, while pursuing high performance of the circuit and the advantages of traditional packaging technology, is a problem that needs to be considered at present. Summary of the invention

[0007] The purpose of the present invention is to overcome the shortcomings of the prior art and provide a core module based on MEMS optical switches and broadcast communications to solve the deficiencies of the prior art.

[0008] The object of the present invention is achieved through the following technical scheme: a core particle module based on MEMS optical switch and broadcast communication, the core particle module includes multiple core particles, the core particles are used to encapsulate each sub-module circuit with a certain function, every two core particles are connected through a MEMS optical switch network, the two ends of the MEMS optical switch are respectively connected to the two core particles through optical fibers, and data transmission is realized inside the MEMS optical switch through broadcast communication.

[0009] The MEMS optical switch network includes an optical splitter group and an optical switch group; the optical splitter group includes M 1×N port optical splitters, and the optical switch group includes N 1×M port optical switches; one end of the optical splitter group and the optical switch group are connected to the core particles through optical fibers, and there are N×M internal channels between the other ends of the optical splitter group and the optical switch group, which are used for broadcast communication of the MEMS optical switch network.

[0010] Each channel of each optical splitter in the optical splitter group forms a connection that can be established or terminated with one channel that has not been connected among the N channels of each switch in the optical switch group through optical fiber; each channel of each optical switch in the optical switch group forms a connection that can be established or terminated with one channel that has not been connected among the N channels of each optical splitter in the optical splitter group through optical fiber; each optical splitter in the optical splitter group and each optical switch in the optical switch group has a channel that can be connected.

[0011] Different MEMS optical switch networks connected to different cores have different internal structures, that is, the port number N values ​​and port number M values ​​of the ports N×M at both ends of different MEMS optical switch networks are different. The internal structure of the specific MEMS optical switch network is determined according to the functions of the two connected cores.

[0012] Each optical switch and optical splitter acts as a different host, and each port of each optical switch and optical splitter acts as a different process. There is a connection between the two processes running in the two hosts, which is established and terminated through a handshake. When a connection needs to be established between two core particles to achieve a certain function, the optical splitter acts as the host to send a shared channel network frame to the other optical switches that act as the destination hosts for multicasting, thereby establishing a connection to achieve different functions between the core particles.

[0013] The connection method between the optical splitter and the optical switch includes a groupcast method and a multicast method; the multicast method includes a certain optical splitter as a host, sending a signal to each optical switch as a host in the opposite optical switch group for connection; the multicast method includes a certain optical splitter as a host, sending a signal to multiple optical switches as hosts in the opposite optical switch group for connection.

[0014] The optical switch comprises a fiber collimator, a fiber collimator group, two MEMS micromirrors and a MEMS controller; a single optical signal emitted from the outside of the optical switch is input into the optical switch, and the input optical signal is first collimated into parallel light by the fiber collimator, and the optical signal output by the fiber collimator is reflected to a second fixed MEMS micromirror by a rotatable MEMS micromirror, and then reflected to the fiber collimator group by the second MEMS micromirror, and finally the optical signal output by the fiber collimator group is output outside the optical switch structure as an output signal processed by the optical switch structure.

[0015] The optical switch group outputs N channels, and the output signals generated in different channels are generated by two MEMS micromirrors; the MEMS controller controls the rotation of the first MEMS micromirror, and different rotation angles of the first MEMS micromirror reflect different optical signal positions on the second MEMS micromirror. The optical signals at different positions are then emitted by the second MEMS micromirror to the optical signal collimator group, and the optical signal at each position corresponds to one channel.

[0016] Each of the optical splitters is made by PLC technology, and each of the optical switches in the optical switch group is made by MEMS technology.

[0017] The present invention has the following advantages: 1. The current chip packaging has been rationally improved and the advanced packaging technology has been further optimized to expand the application scope of advanced packaging technology so that it can better serve integrated circuit manufacturing.

[0018] 2. Effectively combine MEMS optical switches and chip packaging technology, and use the control of micro-electromechanical systems to enable packaging technology to achieve the advantages of small size, high speed and low energy consumption.

[0019] 3. The multicast idea in the broadcast idea is used to improve the connectivity between core particles, improve the reuse of core particle packaging, and improve test efficiency and fault tolerance. BRIEF DESCRIPTION OF THE DRAWINGS

[0020] Figure 1 It is a structural schematic diagram of the present invention; Figure 2 for Figure 1 A schematic diagram of the structure of a MEMS optical switch network used to connect two chips; Figure 3 A schematic diagram of a broadcasting method for the internal channels of a 4×8-port MEMS optical switch; Figure 4 A schematic diagram of another broadcasting method for the internal channels of a 4×8-port MEMS optical switch; Figure 5 A schematic diagram of a broadcasting method for the internal channels of an 8×12-port MEMS optical switch; Figure 6 A schematic diagram of another broadcasting method for the internal channels of an 8×12-port MEMS optical switch; Figure 7 A schematic diagram of a broadcasting mode of an optical splitter in a 4×8 port MEMS optical switch; Figure 8 A schematic diagram of another broadcasting method of an optical splitter in a 4×8-port MEMS optical switch; Fig. 9A schematic diagram of a 1×N port optical switch; Fig.10 Schematic diagram of the fiber collimator structure. DETAILED DESCRIPTION

[0021] In order to make the purpose, technical scheme and advantages of the embodiments of the present application clearer, the technical scheme in the embodiments of the present application will be clearly and completely described below in conjunction with the drawings in the embodiments of the present application. Obviously, the described embodiments are only a part of the embodiments of the present application, rather than all the embodiments. The components of the embodiments of the present application described and shown in the drawings here can be arranged and designed in various different configurations. Therefore, the detailed description of the embodiments of the present application provided below in conjunction with the drawings is not intended to limit the scope of protection of the application claimed for protection, but merely represents the selected embodiments of the present application. Based on the embodiments of the present application, all other embodiments obtained by those skilled in the art without making creative work belong to the scope of protection of the present application. The present invention is further described below in conjunction with the drawings.

[0022] like Figure 1 As shown, the present invention specifically relates to a chip-to-chip broadcasting method based on MEMS optical switches. The present invention lists four chip structures and shows the connection method between chiplets. As can be seen from the figure, the chiplets are connected by a MEMS optical switch network, and the connection network between different chiplets will be different.

[0023] Furthermore, if Figure 2 As shown, the MEMS optical switch network includes the structure of an N×M port MEMS optical switch network, the network includes M 1×N port optical splitters and N 1×M port optical switches, the MEMS optical switch network has N channels connected to the optical splitter at one end and extending out of the network at the other end, which is used to connect to a core particle outside the network; the MEMS optical switch network has M channels connected to the optical switch at one end and extending out of the network at the other end, which is used to connect to another core particle outside the network. There are N×M internal channels between the optical splitter group and the optical switch group. These channels are not permanently connected and unchanged, but can be repeatedly connected and disconnected. Among them, the optical switch is prepared by MEMS technology, and the optical splitter is usually prepared by PLC technology.

[0024] As a permissible broadcast method within a MEMS optical switch network, such as Figure 3 As shown, a possible internal broadcast mode in a 4×8-port MEMS optical switch network is listed when N is 4 and M is 8. The 4×8-port MEMS optical switch network includes 4 1×8-port optical splitters and 8 1×4-port optical switches. There is a connectable channel between each optical splitter and each optical switch. Figure 3The broadcasting method of one of the states is shown, in which the first 1×8-port optical splitter and each of the eight 1×4-port optical switches form a connection path, the second 1×8-port optical splitter and each of the eight 1×4-port optical switches disconnect the path connection, the third 1×8-port optical splitter and each of the eight 1×4-port optical switches form a connection path, and the fourth 1×8-port optical splitter and each of the eight 1×4-port optical switches disconnect the path connection. The connections between the optical splitter and the optical switch are all broadcastable, the path connection can be disconnected, and the disconnected disconnected path can be reconnected. The specific connection method depends on the functions of each component required by the circuit. Figure 4 Another possible internal broadcasting method in a 4×8 port MEMS optical switch network is listed. This connection method is different from Figure 3 The connection method in Figure 4 reflects the broadcastability of the internal connection of the MEMS optical switch network.

[0025] Figure 5 and Figure 6 The internal structure of another MEMS optical switch network with port form is listed, where N is 8, M is 12, and the port form is 8×12. Figure 5 This is a possible internal broadcast mode in an 8×12-port MEMS optical switch network. The 8×12-port MEMS optical switch network includes eight 1×12-port optical splitters and twelve 1×8-port optical switches. There is a connectable channel between each optical splitter and each optical switch. Figure 5 The broadcast connection mode of one state is shown, in which the first 1×12-port optical splitter and each of the 12 1×8-port optical switches form a connection path, the second 1×12-port optical splitter and each of the 12 1×8-port optical switches disconnect the path connection, the third 1×12-port optical splitter and each of the 12 1×8-port optical switches disconnect the path connection, and the fourth 1×12-port optical splitter and each of the 12 1×8-port optical switches form a connection path. The connections between the optical splitter and the optical switch are all broadcastable, the path connection can be disconnected, and the disconnected path can be reconnected. Figure 6 Another possible internal broadcasting method in the 8×12 port MEMS optical switch network is listed. This connection method is different from Figure 5 The connection method in Figure 4 reflects the broadcastability of the internal connection of the MEMS optical switch network.

[0026] The interaction between the chips is achieved by using MEMS optical switches and the broadcast method of data transmission. Figure 3 and Figure 5It belongs to multicast, that is, the optical splitter acts as a host and sends a signal to each optical switch acting as a host in the optical switch group acting as a host group on the opposite side to connect. Figure 3 The multicast mode of the first optical splitter is as follows Figure 7 shown. Figure 4 and Figure 6 It belongs to multicast, that is, the optical splitter acts as a host and sends signals to multiple optical switches acting as hosts on the opposite side to connect. Figure 4 The multicast mode of the first optical splitter is as follows Figure 8 shown.

[0027] The internal structure of a 1×N port MEMS optical switch in a MEMS optical switch network is shown in Figure 2. Fig. 9 As shown, the optical switch includes a fiber collimator, a MEMS micromirror, a MEMS controller, and multiple optical fibers. The external control input into the optical switch includes an optical input and a limit switch. The signals output by the optical switch to the outside world are channels 1 to N. The optical switch implements its functions through MEMS technology. The most significant application of MEMS is as a sensor, which can convert energy from one form to another, and takes into account the small size characteristics of MEMS devices, and fully integrates the mechanical structure and the electrical structure into a system.

[0028] A single optical signal from the outside of the optical switch is input into the optical switch. It first passes through a fiber collimator to collimate the input optical signal into parallel light. Fig.10 As shown. The optical signal output by the fiber collimator is reflected by a rotatable MEMS micromirror to a second fixed MEMS micromirror, and then reflected by the second MEMS micromirror to the fiber collimator group, which is composed of a series of fiber collimators arranged side by side. Finally, the optical signal output by the fiber collimator group will be output outside the optical switch structure as an output signal processed by the optical switch structure.

[0029] The output of a 1×N optical switch listed is N channels, and the output signals generated under different channels are generated by rotating MEMS micromirrors. The MEMS controller controls the rotation of the first MEMS micromirror. The different rotation angles of the rotatable MEMS micromirror reflect different signal positions on the fixed MEMS micromirror. The optical signals at different positions are reflected on the fixed MEMS micromirror. The reflected optical signals are parallel to the optical signals input into a separate optical fiber collimator. The optical signals reflected from different positions on the fixed MEMS micromirror are transmitted into the optical fiber collimator group. The optical signals reflected from each position are transmitted into an optical fiber collimator. Fig. 9 The optical fiber collimator shown is emitted after the output, corresponding to channel 1 to channel N of the output signal respectively.

[0030] The channel switching of different output signals is controlled by the limit switch. The limit switch converts mechanical action into electrical signals through the generation of multicast on-off commands from the outside to control the MEMS controller, and controls the rotation angle of the first MEMS micromirror through the MEMS controller. The optical input signal input to the optical switch through the fiber collimator is reflected by the rotating MEMS micromirror and transmitted to different positions on the second MEMS micromirror. The signals at different positions are then reflected by this fixed MEMS micromirror and output to the fiber collimator group. The optical signals corresponding to the rotation angles of different MEMS micromirrors enter different fiber collimators, thereby performing multicast selection among the N output channels.

[0031] The above is only a preferred embodiment of the present invention. It should be understood that the present invention is not limited to the form disclosed herein, and should not be regarded as excluding other embodiments, but can be used for various other combinations, modifications and improvements, and can be modified within the scope of the concept described herein through the above teachings or the technology or knowledge of the relevant field. The changes and modifications made by those skilled in the art do not deviate from the spirit and scope of the present invention, and should be within the scope of protection of the claims attached to the present invention.

Claims

1. A chip module based on MEMS optical switch and broadcast communication, characterized in that: The core particle module includes multiple core particles, and the core particles are used to encapsulate each sub-module circuit with a certain function. Every two core particles are connected through a MEMS optical switch network. The two ends of the MEMS optical switch are respectively connected to the two core particles through optical fibers. Data transmission is achieved inside the MEMS optical switch through broadcast communication.

2. A chip module based on MEMS optical switch and broadcast communication according to claim 1, characterized in that: The MEMS optical switch network includes an optical splitter group and an optical switch group; the optical splitter group includes M 1×N port optical splitters, and the optical switch group includes N 1×M port optical switches; one end of the optical splitter group and the optical switch group are connected to the core particles through optical fibers, and there are N×M internal channels between the other ends of the optical splitter group and the optical switch group, which are used for broadcast communication of the MEMS optical switch network.

3. A chip module based on MEMS optical switch and broadcast communication according to claim 2, characterized in that: Each channel of each optical splitter in the optical splitter group forms a connection that can be established or terminated with one channel that has not been connected among the N channels of each switch in the optical switch group through optical fiber; each channel of each optical switch in the optical switch group forms a connection that can be established or terminated with one channel that has not been connected among the N channels of each optical splitter in the optical splitter group through optical fiber; each optical splitter in the optical splitter group and each optical switch in the optical switch group has a channel that can be connected.

4. A chip module based on MEMS optical switch and broadcast communication according to claim 2, characterized in that: Different MEMS optical switch networks connected to different cores have different internal structures, that is, the port number N values ​​and port number M values ​​of the ports N×M at both ends of different MEMS optical switch networks are different. The internal structure of the specific MEMS optical switch network is determined according to the functions of the two connected cores.

5. The chip module based on MEMS optical switch and broadcast communication according to claim 2, characterized in that: Each optical switch and optical splitter acts as a different host, and each port of each optical switch and optical splitter acts as a different process. There is a connection between the two processes running in the two hosts, which is established and terminated through a handshake. When a connection needs to be established between two core particles to achieve a certain function, the optical splitter acts as the host to send a shared channel network frame to the other optical switches that act as the destination hosts for multicasting, thereby establishing a connection to achieve different functions between the core particles.

6. A chip module based on MEMS optical switch and broadcast communication according to claim 2, characterized in that: The connection method between the optical splitter and the optical switch includes a groupcast method and a multicast method; the multicast method includes a certain optical splitter as a host, sending a signal to each optical switch as a host in the opposite optical switch group for connection; the multicast method includes a certain optical splitter as a host, sending a signal to multiple optical switches as hosts in the opposite optical switch group for connection.

7. A chip module based on MEMS optical switch and broadcast communication according to any one of claims 2 to 6, characterized in that: The optical switch comprises a fiber collimator, a fiber collimator group, two MEMS micromirrors and a MEMS controller; a single optical signal emitted from the outside of the optical switch is input into the optical switch, and the input optical signal is first collimated into parallel light by the fiber collimator, and the optical signal output by the fiber collimator is reflected to a second fixed MEMS micromirror by a rotatable MEMS micromirror, and then reflected to the fiber collimator group by the second MEMS micromirror, and finally the optical signal output by the fiber collimator group is output outside the optical switch structure as an output signal processed by the optical switch structure.

8. A chip module based on MEMS optical switch and broadcast communication according to claim 7, characterized in that: The optical switch group outputs N channels, and the output signals generated in different channels are generated by two MEMS micromirrors; the MEMS controller controls the rotation of the first MEMS micromirror, and different rotation angles of the first MEMS micromirror reflect different optical signal positions on the second MEMS micromirror, and the optical signals at different positions are then emitted by the second MEMS micromirror to the optical signal collimator group, and the optical signal at each position corresponds to one channel.

9. The chip module based on MEMS optical switch and broadcast communication according to claim 7, characterized in that: Each of the optical splitters is made by PLC technology, and each of the optical switches in the optical switch group is made by MEMS technology.

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