Light emitting diode and preparation method thereof

Abstract

The invention discloses a light-emitting diode and a preparation method thereof, the light-emitting diode comprises a bottom plate, a side plate, a reflecting piece, a light-transmitting piece and a fastener, the reflecting piece is arranged in an LED packaging body, a traditional reflecting cup is replaced, a high ultraviolet reflection side wall can be formed at low cost, and the light extraction efficiency of flip chip packaging is improved. Moreover, different light-emitting angles can be formed by adjusting the angle of the reflecting part of the reflecting piece and matching with the structure of the light-transmitting piece, so that the LED lamp is suitable for different application scenes. Furthermore, the light-transmitting part, the reflecting part, the side plate and the bottom plate are fixed by adopting a hot riveting technology, so that on one hand, the structural strength is increased, and on the other hand, the light degradation of high-strength and long-term irradiation of the light emitted by the light-emitting device is avoided.

Description

Technical Field

[0001] The present invention relates to the technical field of light emitting diodes, and in particular to a light emitting diode and a preparation method thereof. Background Art

[0002] A reflector cup refers to a reflector that uses a point light bulb as a light source and requires long-distance spotlighting. It is usually cup-shaped and is commonly known as a reflector cup. Reflector cups are made of a variety of materials, including metal, plastic, and glass. Plastic packaged reflector cups are injection molded using molds. On a metal skeleton, PPA, PCT, EMC and other materials are injection molded through corresponding molds to form a reflector cup. The metal and PPA and other plastics are integrated, and the shape of the reflector cup is determined by the mold. In the subsequent chip packaging process, after the chip is fixed and the circuit is bonded, the silicone containing phosphor is injected into the microcavity formed by the reflector cup, and then thermally cured to complete the chip packaging.

[0003] The packaging structure composed of a DPC ceramic bracket and a multi-layer electroplated copper dam has a reflective cup angle of nearly 90°. It is thickened through multiple regional electroplating to form a packaging microcavity and a reflective cup. Because the speed of electroplating is difficult to control, the surface of the reflective cup is concave and convex, and it is not easy to reflect mirror reflections. Because the surface treatment requirements of the solid crystal bonding wire function are generally electroplated gold and Ag, and Au and Ag have poor reflectivity to ultraviolet and deep ultraviolet. In the subsequent chip packaging process, after the chip is fixed and the circuit is bonded, the adhesive is applied on the top surface of the reflective cup, and then the glass is placed on the adhesive. Through thermal curing or light curing, the glass and the bracket are sealed to complete the chip packaging.

[0004] In the glass-ceramic-metal packaging structure, HTCC and LTCC methods are used, and multi-layer ceramics are formed by isostatic pressing and co-firing. The formation of the reflector cup depends on the stacking of multiple layers of raw ceramics. Then the reflector cup and the functional area are metallized. Because the surface treatment requirements of the solid crystal bonding wire function are generally electroplated gold and Ag, and Au and Ag have poor reflectivity to ultraviolet and deep ultraviolet. In the subsequent chip packaging process, after the chip is fixed and the circuit is bonded, the metal glass integrated lens is placed on the packaging bracket, and the metal part of the lens is welded to the metal part of the bracket through parallel sealing or laser welding to complete the sealing and mechanical protection of the package body.

[0005] From the above content, it can be seen that the current optoelectronic device packaging, especially the ultraviolet and deep ultraviolet parts, is gradually increasing with the advancement of technology, electrical power and radiation flux. For flip-chip ultraviolet chips, the current packaging structure cannot collect light well or the plastic package is not resistant to ultraviolet rays, and it is impossible to adjust the light-emitting angle through the combination of reflective cups and lenses on the same packaging platform. Summary of the invention

[0006] The technical problem to be solved by the present invention is to provide a light emitting diode which can improve the light extraction efficiency of flip chip packaging.

[0007] The technical problem to be solved by the present invention is also to provide a method for preparing a light emitting diode, which can improve the light extraction efficiency of the flip chip package and avoid light degradation caused by high intensity and long-term irradiation of the light emitted by the light emitting device.

[0008] In order to solve the above problems, the present invention provides a light emitting diode, comprising:

[0009] A base plate, on which a first electrode, a second electrode and a light-emitting diode chip are arranged;

[0010] A side plate, wherein the side plate is connected to the bottom plate and forms a packaging cavity, and the light-emitting diode chip is arranged in the packaging cavity;

[0011] A reflector, the reflector comprising a connected reflective portion and a first mounting portion, the reflective portion is disposed in the packaging cavity and surrounds the light-emitting diode chip, and the first mounting portion is connected to the side plate;

[0012] A light-transmitting member, the light-transmitting member comprising a light-transmitting portion and a second mounting portion connected to each other, the second mounting portion being opposite to the first mounting portion, the first mounting portion being provided with a first mounting hole, the second mounting portion being provided with a second mounting hole, the first mounting hole being connected to the second mounting hole;

[0013] A fastener passes through the first mounting hole and the second mounting hole to achieve packaging of the light-transmitting component, the reflective component, the side plate and the bottom plate.

[0014] In some embodiments, the reflective portion is formed by rotating a first line segment as a generatrix around a vertical axis by 360°, and the first line segment is inclined at a preset angle relative to a horizontal plane;

[0015] Alternatively, the reflecting portion is formed by rotating a first line segment and a second line segment with a common endpoint as a generatrix around a vertical axis by 360°, the first line segment is inclined at a preset angle relative to a horizontal plane, and the second line segment is parallel to the horizontal plane.

[0016] In some embodiments, the material of the fastener is thermoplastic, and the fastener implements the encapsulation of the light-transmitting member, the reflective member, the side plate and the bottom plate through a hot riveting process;

[0017] The fastener is in the shape of a rivet or a rivet stud.

[0018] In some embodiments, a third mounting hole is provided on the side panel, the first mounting hole, the second mounting hole and the third mounting hole are opposite and connected, and the fastener passes through the first mounting hole, the second mounting hole and the third mounting hole to achieve the packaging of the light-transmitting component, the reflective component, the side panel and the bottom panel.

[0019] In some embodiments, the first electrode includes a first conductive portion, a second conductive portion, and a third conductive portion connected in sequence, the first conductive portion is disposed on a side of the bottom plate close to the light-emitting diode chip, the second conductive portion penetrates the bottom plate, and the third conductive portion is disposed on a side of the bottom plate away from the light-emitting diode chip;

[0020] The second electrode includes a fourth conductive part, a fifth conductive part and a sixth conductive part which are connected in sequence, the fourth conductive part is arranged on a side of the base plate close to the light-emitting diode chip, the fifth conductive part passes through the base plate, and the sixth conductive part is arranged on a side of the base plate away from the light-emitting diode chip.

[0021] In some embodiments, a protrusion is provided on the first conductive portion or / and the fourth conductive portion;

[0022] Alternatively, a groove is provided on the first conductive part and / or the fourth conductive part.

[0023] In some embodiments, the reflective portion has a reflective layer on a side facing the light-emitting diode chip;

[0024] The light-transmitting portion is a curved surface;

[0025] The light-transmitting portion has a transmission-enhancing layer and / or a reflection-proof layer on a side facing the light-emitting diode chip.

[0026] To solve the above problems, the present invention also provides a method for preparing a light emitting diode, comprising the following steps:

[0027] A first electrode, a second electrode and a light-emitting diode chip are arranged on the bottom plate, wherein the light-emitting diode chip is electrically connected to the first electrode and the second electrode;

[0028] A side plate is arranged on the bottom plate, the side plate is connected to the bottom plate and forms a packaging cavity, and the light emitting diode chip is arranged in the packaging cavity;

[0029] A reflector is arranged on the side plate, the reflector comprises a reflective portion and a first mounting portion connected to each other, the reflective portion is arranged in the packaging cavity and surrounds the light emitting diode chip, and the first mounting portion is connected to the side plate;

[0030] A light-transmitting member is arranged on the reflective member, the light-transmitting member comprises a light-transmitting portion and a second mounting portion connected to each other, the second mounting portion is opposite to the first mounting portion, a first mounting hole is arranged on the first mounting portion, a second mounting hole is arranged on the second mounting portion, and the first mounting hole is connected to the second mounting hole;

[0031] Fasteners are placed in the first mounting hole and the second mounting hole, and the fasteners are hot pressed to achieve packaging of the light-transmitting member, the reflective member, the side plate and the bottom plate.

[0032] In some embodiments, a third mounting hole is provided on the side panel, and the first mounting hole, the second mounting hole, and the third mounting hole are opposite and connected, and the fasteners are placed in the first mounting hole, the second mounting hole, and the third mounting hole, and the fasteners are hot pressed to achieve the packaging of the light-transmitting component, the reflective component, the side panel, and the bottom panel.

[0033] In some embodiments, the fastener has a hollow cavity, and before hot pressing the fastener, an adhesive is placed in the hollow cavity of the fastener;

[0034] Alternatively, before heat-pressing the fastener, an adhesive is placed around the fastener.

[0035] The implementation of the present invention has the following beneficial effects:

[0036] The light-emitting diode provided by the present invention comprises a bottom plate, a side plate, a reflector, a light-transmitting member and a fastener, wherein the reflector is built into the LED package body, replacing the traditional reflector cup, and can form a high ultraviolet reflective side wall at a low cost, thereby improving the light extraction efficiency of the flip chip package. In addition, by adjusting the angle of the reflective part of the reflector and coordinating with the structure of the light-transmitting member, different light-emitting angles can be formed to adapt to different application scenarios.

[0037] The present invention provides a method for preparing a light-emitting diode, wherein a reflector is built into an LED package body, replacing a traditional reflector cup, and can form a high ultraviolet reflective side wall at a low cost, thereby improving the light extraction efficiency of a flip chip package. In addition, the light-transmitting member, the reflector, the side plate and the bottom plate are fixed by a thermal riveting technique, which, on the one hand, increases the structural strength, and, on the other hand, avoids light degradation caused by high-intensity and long-term irradiation of the light emitted by the light-emitting device. BRIEF DESCRIPTION OF THE DRAWINGS

[0038] Figure 1 A schematic diagram of the structure of a light emitting diode provided in Example 1 of the present invention;

[0039] Figure 2 A schematic diagram of the structure of a light emitting diode provided in Example 2 of the present invention;

[0040] Figure 3A schematic diagram of the structure of a light emitting diode provided in Embodiment 3 of the present invention;

[0041] Figure 4 A schematic diagram of the structure of a light emitting diode provided in Embodiment 4 of the present invention;

[0042] Figure 5 A schematic structural diagram of a reflector of a light emitting diode provided in Embodiment 1 of the present invention;

[0043] Figure 6 A top view of a reflector of a light emitting diode provided in Embodiment 1 of the present invention;

[0044] Figure 7 A schematic structural diagram of a light-transmitting member of a light-emitting diode provided in Embodiment 1 of the present invention;

[0045] Figure 8 A top view of the light-transmitting member of the light-emitting diode provided in Embodiment 1 of the present invention. DETAILED DESCRIPTION

[0046] In order to make the purpose, technical scheme and advantages of the present invention clearer, the present invention is further described in detail below in conjunction with the accompanying drawings and embodiments. Examples of the embodiments are shown in the accompanying drawings, wherein the same or similar reference numerals throughout represent the same or similar elements or elements with the same or similar functions. The embodiments described below with reference to the accompanying drawings are exemplary and are only used to explain the present invention, and should not be construed as limiting the present invention. In addition, it should be understood that the specific embodiments described herein are only used to explain the present invention and are not intended to limit the present invention.

[0047] In the description of the present invention, it is necessary to understand that the orientations or positional relationships indicated by the terms "upper", "lower", "back surface", "front surface", etc. are based on the orientations or positional relationships shown in the accompanying drawings, and are only for the convenience of describing the present invention and simplifying the description, rather than indicating or implying that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and therefore cannot be understood as a limitation on the present invention.

[0048] In the present invention, unless otherwise clearly specified and limited, a first feature being "above" or "below" a second feature may include that the first and second features are in direct contact, or may include that the first and second features are not in direct contact but are in contact through another feature between them. Moreover, a first feature being "above", "above" and "above" a second feature includes that the first feature is directly above and obliquely above the second feature, or simply indicates that the first feature is higher in level than the second feature. A first feature being "below", "below" and "below" a second feature includes that the first feature is directly below and obliquely below the second feature, or simply indicates that the first feature is lower in level than the second feature.

[0049] In the present invention, “preferred” is only used to describe an implementation method or example with better effects, and it should be understood that it does not constitute a limitation on the protection scope of the present invention.

[0050] In the present invention, the technical features described in an open manner include closed technical solutions composed of the listed features, and also include open technical solutions containing the listed features.

[0051] The current optoelectronic device packaging, especially the ultraviolet and deep ultraviolet parts, is gradually increasing in electrical power and radiation flux with the advancement of technology. For flip-chip ultraviolet chips, the current packaging structure cannot collect light well or the plastic package is not resistant enough to ultraviolet rays, and it is impossible to adjust the light-emitting angle through the combination of reflective cups and lenses on the same packaging platform.

[0052] To solve the above problems, the present invention provides a light emitting diode, such as Figures 1 to 8 As shown, including:

[0053] A base plate 1, on which a first electrode 11, a second electrode 12 and a light-emitting diode chip 13 are provided;

[0054] A side plate 2, wherein the side plate 2 is connected to the bottom plate 1 and forms a packaging cavity, and the light-emitting diode chip 13 is arranged in the packaging cavity;

[0055] A reflector 3, wherein the reflector 3 comprises a reflective portion 31 and a first mounting portion 32 connected to each other, wherein the reflective portion 31 is disposed in the packaging cavity and surrounds the LED chip 13, and the first mounting portion 32 is connected to the side plate 2;

[0056] A light-transmitting member 4, the light-transmitting member 4 comprising a light-transmitting portion 41 and a second mounting portion 42 connected to each other, the second mounting portion 42 being opposite to the first mounting portion 32, the first mounting portion 32 being provided with a first mounting hole 33, the second mounting portion 42 being provided with a second mounting hole 43, the first mounting hole 33 being connected to the second mounting hole 43;

[0057] The fastener 5 passes through the first mounting hole 33 and the second mounting hole 43 to achieve packaging of the light-transmitting component 4 , the reflective component 3 , the side plate 2 and the bottom plate 1 .

[0058] Furthermore, the above components are described in detail below.

[0059] The base plate 1 is one of the main structures. In some embodiments, the base plate 1 is made of ceramic or thermoplastic. The base plate 1 is provided with a first electrode 11, a second electrode 12 and a light-emitting diode chip 13, wherein the first electrode 11 and the second electrode 12 are separately provided, and the first electrode 11 and the second electrode 12 are electrically connected to the light-emitting diode chip 13. The base plate 1 is provided with at least one pair of first electrodes 11, second electrodes 12 and at least one light-emitting diode chip 13. The first electrode 11 and the second electrode 12 are made of conductive materials, and the conductive materials include but are not limited to Cu, Au, Ag, Ni, Pd, Ti, W, Co and their alloys.

[0060] In some embodiments, the first electrode 11 includes a first conductive portion, a second conductive portion, and a third conductive portion connected in sequence, the first conductive portion is arranged on a side of the base plate 1 close to the light-emitting diode chip 13, the second conductive portion penetrates the base plate 1, and the third conductive portion is arranged on a side of the base plate 1 away from the light-emitting diode chip 13; the second electrode 12 includes a fourth conductive portion, a fifth conductive portion, and a sixth conductive portion connected in sequence, the fourth conductive portion is arranged on a side of the base plate 1 close to the light-emitting diode chip 13, the fifth conductive portion penetrates the base plate 1, and the sixth conductive portion is arranged on a side of the base plate 1 away from the light-emitting diode chip 13.

[0061] In some embodiments, Figure 2 As shown, the surface of the first conductive portion and / or the fourth conductive portion close to the light emitting diode chip 13 is a plane.

[0062] In some embodiments, Figure 1 As shown, a protrusion 111 is provided on the first conductive part or / and the fourth conductive part; the protrusion 111 is used to assist in positioning the reflector 3. Preferably, the height of the protrusion 111 does not exceed 1 / 3 of the thickness of the light-emitting diode chip 13. If the height of the protrusion 111 is too high, it is easy to block the light emitted by the chip. More preferably, the surface of the protrusion has the same material layer as the reflective part 31, so as to avoid absorption of light and reduce the light extraction of the overall device.

[0063] In some embodiments, Figure 4 As shown, the first conductive part and / or the fourth conductive part is provided with a groove 112. The groove is used to assist in positioning the reflector 3. Preferably, the depth of the groove does not exceed 1 / 2 of the thickness of the bottom plate 1. Too deep a depth of the groove may easily cause a decrease in the packaging strength of the fastener 5.

[0064] In some embodiments, a heat sink 14 is provided on the side of the base plate 1 away from the light emitting diode chip 13. The heat sink 14 conducts heat to the outside of the package to maintain a stable operating temperature of the LED.

[0065] The side panel 2 is also one of the main structures, and the side panel 2 is connected to the bottom panel 1 to form a packaging cavity. In some embodiments, the material of the side panel 2 is thermoplastic. In some embodiments, the side panel 2 is provided with a third mounting hole 21, the first mounting hole 33, the second mounting hole 43 and the third mounting hole 21 are opposite and connected, and the fastener 5 passes through the first mounting hole 33, the second mounting hole 43 and the third mounting hole 21 to achieve the packaging of the light-transmitting member 4, the reflective member 3, the side panel 2 and the bottom panel 1. In some embodiments, during packaging, the fastener 5 and the side panel 2 are both thermoplastic materials, and the fastener 5 is acted on by heating the welding head and applying a certain pressure, so that the material of the fastener 5 softens and finally forms a connection. In the above embodiment, multi-point connection and fixation can be achieved without adding any adhesive, solvent, or filler. It is not easily affected by the light environment, which reduces the material degradation caused by light exposure.

[0066] The reflector 3 is one of the key design structures of the present invention. Figure 5-6 As shown, the reflector 3 includes a connected reflective portion 31 and a first mounting portion 32, wherein the reflective portion 31 is disposed in the packaging cavity and surrounds the light-emitting diode chip 13, and the first mounting portion 32 is connected to the side panel 2. The reflector 3 is built into the LED package body, replacing the traditional reflector cup, and can form a high ultraviolet reflective side wall at a low cost, thereby improving the light extraction efficiency of the flip chip package. In addition, by adjusting the angle of the reflective portion 31 of the reflector 3 and coordinating with the structure of the light-transmitting member 4, different light-emitting angles can be formed to adapt to different application scenarios.

[0067] In some embodiments, the reflective portion 31 is formed by rotating a first line segment as a generatrix around a vertical axis by 360°, and the first line segment is inclined at a preset angle relative to a horizontal plane; preferably, the preset angle is 0° to 90°, excluding 0° and 90°, and the distribution of emitted light of the package is adjusted by controlling the preset angle and the shape of the light-transmitting portion 41. In the above embodiment, the reflective member 3 is hollow.

[0068] Alternatively, the reflective portion 31 is formed by rotating a first line segment and a second line segment with a common endpoint as a generatrix around a vertical axis by 360°, the first line segment is inclined at a preset angle relative to a horizontal plane, and the second line segment is parallel to the horizontal plane. Preferably, the preset angle is 0° to 90°, excluding 0° and 90°, and the distribution of emitted light of the package is adjusted by controlling the preset angle and the shape of the light-transmitting portion 41. Preferably, the shape enclosed by the second line segment is a circular ring, the center circle of the circular ring is empty, and the light-emitting diode chip 13 is arranged in the center circle of the circular ring.

[0069] In some embodiments, the reflector 3 is made of metal, plastic or ceramic, and is an integrally formed part. In some embodiments, the reflector 31 has a reflective layer on the side facing the LED chip 13; preferably, the reflective layer is an aluminum layer or a silver layer.

[0070] The light-transmitting element 4 is made of materials with high transmittance to ultraviolet light, visible light, and infrared light, including but not limited to quartz glass, borosilicate glass, fluoride, high transmittance silica gel, PMMA, and PC. Figure 7 or Figure 8 As shown, in some embodiments, the light-transmitting portion 41 is a curved surface, so that the emitted light can be collected and diffused; the light-transmitting portion 41 has an anti-reflection layer and / or an anti-reflection layer on the side facing the light-emitting diode chip 13 .

[0071] The fastener 5 is one of the key design structures of the present invention. It should be noted that in the prior art, the light-transmitting material is bonded with glue. Although the bonding with glue is relatively strong, it is easily affected by the light environment, causing material degradation and affecting reliability. The material of the fastener 5 in the present invention is thermoplastic plastic, and the fastener 5 is encapsulated by the light-transmitting member 4, the reflective member 3, the side plate 2 and the bottom plate 1 through a hot riveting process; the shape of the fastener 5 is a rivet or a rivet column. The encapsulation is achieved by a hot pressing process during the preparation process. Specifically, the fastener 5 is softened by heating the welding head and applying a certain pressure to the fastener 5, and finally a connection is formed. Preferably, the fastener 5 has a welding head, and a hemispherical connection, a vertical rib rib connection, a flush connection, an arc flanging connection, etc. are formed by using welding heads of different shapes and sizes. The present invention uses hot riveting technology to fix the light-transmitting member 4, the reflective member 3, the side plate 2 and the bottom plate 1, which increases the structural strength on the one hand, and avoids the light degradation caused by high intensity and long-term irradiation of the light emitted by the light-emitting device on the other hand.

[0072] In summary, the light-emitting diode provided by the present invention includes a bottom plate 1, a side plate 2, a reflector 3, a light-transmitting member 4 and a fastener 5, wherein the reflector 3 is built into the LED package body, replacing the traditional reflector cup, and can form a high UV reflective side wall at a low cost, thereby improving the light extraction efficiency of the flip chip package. In addition, by adjusting the angle of the reflective portion 31 of the reflector 3 and coordinating with the structure of the light-transmitting member 4, different light-emitting angles can be formed to adapt to different application scenarios. Moreover, the light-transmitting member 4, the reflector 3, the side plate 2 and the bottom plate 1 are fixed by using a hot riveting technology, which, on the one hand, increases the structural strength, and on the other hand, avoids the light degradation caused by high-intensity and long-term irradiation of the light emitted by the light-emitting device.

[0073] Accordingly, the present invention also provides a method for preparing a light emitting diode, comprising the following steps:

[0074] S1, a first electrode 11, a second electrode 12 and a light-emitting diode chip 13 are arranged on a base plate 1, wherein the light-emitting diode chip 13 is electrically connected to the first electrode 11 and the second electrode 12;

[0075] S2, arranging a side plate 2 on the bottom plate 1, wherein the side plate 2 is connected to the bottom plate 1 and forms a packaging cavity, and the light-emitting diode chip 13 is arranged in the packaging cavity;

[0076] S3, a reflector 3 is provided on the side plate 2, wherein the reflector 3 comprises a reflective portion 31 and a first mounting portion 32 connected to each other, wherein the reflective portion 31 is provided in the packaging cavity and surrounds the LED chip 13, and the first mounting portion 32 is connected to the side plate 2;

[0077] S4, a light-transmitting member 4 is arranged on the reflective member 3, the light-transmitting member 4 includes a light-transmitting portion 41 and a second mounting portion 42 connected to each other, the second mounting portion 42 is opposite to the first mounting portion 32, a first mounting hole 33 is arranged on the first mounting portion 32, a second mounting hole 43 is arranged on the second mounting portion 42, and the first mounting hole 33 is connected to the second mounting hole 43;

[0078] S5. Place fasteners 5 in the first mounting hole 33 and the second mounting hole 43, and heat-press the fasteners 5 to achieve packaging of the light-transmitting component 4, the reflective component 3, the side plate 2, and the bottom plate 1.

[0079] In order to improve the reliability of the package, in some embodiments, the side panel is provided with a third mounting hole, the first mounting hole, the second mounting hole and the third mounting hole are opposite and connected, the fastener is placed in the first mounting hole, the second mounting hole and the third mounting hole, and the fastener is hot pressed to achieve the packaging of the light-transmitting member, the reflective member, the side panel and the bottom panel. Preferably, the fastener has a hollow cavity, and before the fastener is hot pressed, an adhesive is placed in the hollow cavity of the fastener; or, before the fastener is hot pressed, an adhesive is placed around the fastener. After curing, the adhesive is distributed in the gap between the fastener and the mounting hole to enhance the bonding between the fastener and the mounting hole. Preferably, the height of the adhesive added is not higher than the height of the side panel to prevent overflow caused by excessive adhesive, thereby further improving the connection strength of the side panel, the reflective member and the light-transmitting member and improving the reliability of the package.

[0080] The present invention is further described below with reference to specific embodiments.

[0081] Example 1

[0082] This embodiment provides a light emitting diode, such as Figure 1 As shown, including:

[0083] A base plate, on which a first electrode, a second electrode and a light-emitting diode chip are arranged;

[0084] A side plate, wherein the side plate is connected to the bottom plate and forms a packaging cavity, and the light-emitting diode chip is arranged in the packaging cavity;

[0085] A reflector, the reflector comprising a connected reflective portion and a first mounting portion, the reflective portion is disposed in the packaging cavity and surrounds the light-emitting diode chip, and the first mounting portion is connected to the side plate;

[0086] A light-transmitting member, the light-transmitting member comprising a light-transmitting portion and a second mounting portion connected to each other, the second mounting portion being opposite to the first mounting portion, the first mounting portion being provided with a first mounting hole, the second mounting portion being provided with a second mounting hole, the first mounting hole being connected to the second mounting hole;

[0087] A fastener passes through the first mounting hole and the second mounting hole to achieve packaging of the light-transmitting component, the reflective component, the side plate and the bottom plate.

[0088] Example 2

[0089] This embodiment provides a light emitting diode, such as Figure 2 As shown, including:

[0090] A base plate, on which a first electrode, a second electrode and a light-emitting diode chip are arranged;

[0091] A side plate, wherein the side plate is connected to the bottom plate and forms a packaging cavity, and the light-emitting diode chip is arranged in the packaging cavity;

[0092] A reflector, the reflector comprising a connected reflective portion and a first mounting portion, the reflective portion is disposed in the packaging cavity and surrounds the light-emitting diode chip, and the first mounting portion is connected to the side plate;

[0093] A light-transmitting member, the light-transmitting member comprising a light-transmitting portion and a second mounting portion connected to each other, the second mounting portion being opposite to the first mounting portion, the first mounting portion being provided with a first mounting hole, the second mounting portion being provided with a second mounting hole, the first mounting hole being connected to the second mounting hole;

[0094] The side plate is provided with a third mounting hole, the first mounting hole, the second mounting hole and the third mounting hole are opposite and interlinked, and the fastener passes through the first mounting hole, the second mounting hole and the third mounting hole to achieve the packaging of the light-transmitting member, the reflective member, the side plate and the bottom plate. The fastener has a hollow cavity, and before the fastener is hot-pressed, an adhesive is placed in the hollow cavity of the fastener.

[0095] Example 3

[0096] This embodiment provides a light emitting diode, such as Figure 3 As shown, including:

[0097] A base plate, on which a first electrode, a second electrode and a light-emitting diode chip are arranged;

[0098] A side plate, wherein the side plate is connected to the bottom plate and forms a packaging cavity, and the light-emitting diode chip is arranged in the packaging cavity;

[0099] A reflector, the reflector comprising a connected reflective portion and a first mounting portion, the reflective portion is disposed in the packaging cavity and surrounds the light-emitting diode chip, and the first mounting portion is connected to the side plate;

[0100] A light-transmitting member, the light-transmitting member comprising a light-transmitting portion and a second mounting portion connected to each other, the second mounting portion being opposite to the first mounting portion, the first mounting portion being provided with a first mounting hole, the second mounting portion being provided with a second mounting hole, the first mounting hole being connected to the second mounting hole;

[0101] A fastener is provided on the side panel, and a third mounting hole is provided on the side panel. The first mounting hole, the second mounting hole and the third mounting hole are opposite to and connected with each other. The fastener passes through the first mounting hole, the second mounting hole and the third mounting hole to realize the packaging of the light-transmitting component, the reflective component, the side panel and the bottom panel.

[0102] Example 4

[0103] This embodiment provides a light emitting diode, such as Figure 4 As shown, the difference from Example 1 is that a groove is provided on the first conductive part and / or the fourth conductive part, which is the same as Example 1.

[0104] In summary, the light-emitting diode provided by the present invention includes a bottom plate, a side plate, a reflector, a light-transmitting member and a fastener, wherein the reflector is built into the LED package to replace the traditional reflector cup, and can form a high UV reflective side wall at a low cost, thereby improving the light extraction efficiency of the flip chip package. In addition, by adjusting the angle of the reflective portion of the reflector and coordinating the structure of the light-transmitting member, different light-emitting angles can be formed to adapt to different application scenarios. Furthermore, the light-transmitting member, the reflector, the side plate and the bottom plate are fixed by using a thermal riveting technique, which, on the one hand, increases the structural strength, and on the other hand, avoids the light degradation caused by high-intensity and long-term irradiation of the light emitted by the light-emitting device.

[0105] In the description of this specification, the description with reference to the terms "some embodiments", "illustrative embodiments", "examples", "specific examples", or "some examples" means that the specific features, structures, materials or characteristics described in conjunction with the embodiments or examples are included in at least one embodiment or example of the present application. In this specification, the schematic representation of the above terms does not necessarily refer to the same embodiment or example. Moreover, the specific features, structures, materials or characteristics described may be combined in any one or more embodiments or examples in a suitable manner.

[0106] In addition, the above are only preferred embodiments of the present application and are not intended to limit the present application. Any modifications, equivalent substitutions and improvements made within the spirit and principles of the present application should be included in the protection scope of the present application.

Claims

1. A light emitting diode, characterized in that: include: A base plate, on which a first electrode, a second electrode and a light-emitting diode chip are arranged; A side plate, wherein the side plate is connected to the bottom plate and forms a packaging cavity, and the light-emitting diode chip is arranged in the packaging cavity; A reflector, the reflector comprising a connected reflective portion and a first mounting portion, the reflective portion is disposed in the packaging cavity and surrounds the light-emitting diode chip, and the first mounting portion is connected to the side plate; A light-transmitting member, the light-transmitting member comprising a light-transmitting portion and a second mounting portion connected to each other, the second mounting portion being opposite to the first mounting portion, the first mounting portion being provided with a first mounting hole, the second mounting portion being provided with a second mounting hole, the first mounting hole being connected to the second mounting hole; A fastener passes through the first mounting hole and the second mounting hole to achieve packaging of the light-transmitting component, the reflective component, the side plate and the bottom plate.

2. The light emitting diode according to claim 1, characterized in that The reflecting portion is formed by rotating a first line segment as a generatrix around a vertical axis by 360°, and the first line segment is inclined at a preset angle relative to a horizontal plane; Alternatively, the reflecting portion is formed by rotating a first line segment and a second line segment with a common endpoint as a generatrix around a vertical axis by 360°, the first line segment is inclined at a preset angle relative to a horizontal plane, and the second line segment is parallel to the horizontal plane.

3. The light emitting diode according to claim 1, characterized in that The material of the fastener is thermoplastic plastic, and the fastener realizes the packaging of the light-transmitting member, the reflective member, the side plate and the bottom plate through a hot riveting process; The fastener is in the shape of a rivet or a rivet stud.

4. The light emitting diode according to claim 1, characterized in that The side panel is provided with a third mounting hole, the first mounting hole, the second mounting hole and the third mounting hole are opposite and connected, and the fastener passes through the first mounting hole, the second mounting hole and the third mounting hole to realize the packaging of the light-transmitting component, the reflective component, the side panel and the bottom panel.

5. The light emitting diode according to claim 1, characterized in that: The first electrode comprises a first conductive portion, a second conductive portion and a third conductive portion connected in sequence, the first conductive portion is arranged on a side of the bottom plate close to the light emitting diode chip, the second conductive portion penetrates the bottom plate, and the third conductive portion is arranged on a side of the bottom plate away from the light emitting diode chip; The second electrode includes a fourth conductive part, a fifth conductive part and a sixth conductive part which are connected in sequence, the fourth conductive part is arranged on a side of the base plate close to the light-emitting diode chip, the fifth conductive part passes through the base plate, and the sixth conductive part is arranged on a side of the base plate away from the light-emitting diode chip.

6. The light emitting diode according to claim 5, characterized in that The first conductive part and / or the fourth conductive part are provided with a protrusion; Alternatively, a groove is provided on the first conductive part and / or the fourth conductive part.

7. The light emitting diode according to claim 1, characterized in that The reflective portion has a reflective layer on a side facing the light emitting diode chip; The light-transmitting portion is a curved surface; The light-transmitting portion has a transmission-enhancing layer and / or a reflection-proof layer on a side facing the light-emitting diode chip.

8. A method for preparing a light emitting diode according to any one of claims 1 to 7, characterized in that: The following steps are involved: A first electrode, a second electrode and a light-emitting diode chip are arranged on the bottom plate, wherein the light-emitting diode chip is electrically connected to the first electrode and the second electrode; A side plate is arranged on the bottom plate, the side plate is connected to the bottom plate and forms a packaging cavity, and the light-emitting diode chip is arranged in the packaging cavity; A reflector is arranged on the side plate, the reflector comprises a reflective portion and a first mounting portion connected to each other, the reflective portion is arranged in the packaging cavity and surrounds the light emitting diode chip, and the first mounting portion is connected to the side plate; A light-transmitting member is arranged on the reflective member, the light-transmitting member comprises a light-transmitting portion and a second mounting portion connected to each other, the second mounting portion is opposite to the first mounting portion, a first mounting hole is arranged on the first mounting portion, a second mounting hole is arranged on the second mounting portion, and the first mounting hole is connected to the second mounting hole; Fasteners are placed in the first mounting hole and the second mounting hole, and the fasteners are hot pressed to achieve packaging of the light-transmitting member, the reflective member, the side plate and the bottom plate.

9. The method for preparing a light emitting diode according to claim 8, characterized in that: The side panel is provided with a third mounting hole, the first mounting hole, the second mounting hole and the third mounting hole are opposite and connected, the fasteners are placed in the first mounting hole, the second mounting hole and the third mounting hole, and the fasteners are hot pressed to realize the packaging of the light-transmitting component, the reflective component, the side panel and the bottom panel.

10. The method for preparing a light emitting diode according to claim 8 or 9, characterized in that: The fastener has a hollow cavity, and before hot pressing the fastener, an adhesive is placed in the hollow cavity of the fastener; Alternatively, before heat-pressing the fastener, an adhesive is placed around the fastener.

Images