Three-dimensional integrated packaging structure based on dielectric integrated suspension line

Abstract

The invention discloses a three-dimensional integrated packaging structure based on dielectric integrated suspension lines. The three-dimensional integrated packaging structure comprises N layers of dielectric plates, wherein the upper surfaces and the lower surfaces of the dielectric plates are covered with metal; the N layers of dielectric plates are stacked and arranged from bottom to top, any one or more adjacent layers of dielectric plates from the second layer to the (N-1) th layer are patterned and emptied to form at least one air cavity, and metalized through holes are formed in the first layer to the Nth layer to penetrate through the first layer to the Nth layer to form an electric wall around the air cavity; the first layer, the Nth layer and the formed electric wall form an electromagnetic shielding cavity; the second layer to the (N-1) th layer are electrically connected through a three-dimensional vertical interconnection technology, and one or more functional devices are arranged in each air cavity. Collaborative design of functional devices, system circuits and packaging can be realized, influence of packaging on circuit performance is reduced, mutual interference among the functional devices is reduced, independent debugging is facilitated, transmission loss is reduced, high-speed data transmission is facilitated, and system reliability is improved.

Description

Technical Field

[0001] The invention belongs to the technical field of radio frequency microwave circuit packaging, and in particular relates to a three-dimensional integrated packaging structure based on dielectric integrated suspension lines. Background Art

[0002] With the rapid development of wireless communication technologies such as 5G, millimeter-wave radar detection, and terahertz communication, as well as the continuous diversification of application scenarios such as driverless cars, the Internet of Things, and artificial intelligence, people have put forward higher requirements for high power, low power consumption, low cost, lightweight, and high integration of wireless RF systems. The discrete modules and planar integration solutions in traditional board-level RF systems have low integration and system reliability, and it is difficult to meet the increasing integration requirements. Summary of the invention

[0003] In order to solve the above problems existing in the prior art, the present invention provides a three-dimensional integrated packaging structure based on dielectric integrated suspension lines.

[0004] The technical problem to be solved by the present invention is achieved through the following technical solutions:

[0005] The present invention provides a three-dimensional integrated packaging structure based on dielectric integrated suspension lines, comprising: N layers of dielectric plates with metal covering both the upper and lower surfaces;

[0006] Among them, N layers of dielectric plates are stacked from bottom to top, any one layer of the dielectric plates from the 2nd to the N-1th layer or any multiple adjacent layers of dielectric plates are patterned and hollowed out to form at least one air cavity, metallized through holes are opened on the dielectric plates from the 1st to the Nth layer to penetrate the dielectric plates from the 1st to the Nth layer to form an electric wall around the air cavity, the dielectric plates from the 1st layer to the Nth layer and the formed electric wall together constitute an electromagnetic shielding cavity, the dielectric plates from the 2nd to the N-1th layer are electrically connected through a three-dimensional vertical interconnection technology, and one or more functional devices are placed in each air cavity; N is a positive integer greater than or equal to 3.

[0007] In some embodiments, the shape and size of each air cavity matches the shape and size of the functional device placed in the air cavity.

[0008] In some embodiments, when a plurality of air cavities are formed, the sizes of any two air cavities are the same or different, and the functional devices placed in two different air cavities are electrically connected via a three-dimensional vertical interconnection technology.

[0009] In some embodiments, the types of three-dimensional vertical interconnection technology include: direct interconnection of the same layer of metal, interconnection of the same layer of metal through parallel coupling, interconnection of upper and lower layers of metal through metalized vias, interconnection of upper and lower layers of metal through wide-side coupling, interconnection of different layers of metal through cavity coupling, and interconnection of different layers of metal through gap coupling.

[0010] In some embodiments, when N is greater than or equal to 5, the placement of the functional device in an air cavity includes: suspending the functional device in the air cavity.

[0011] In some embodiments, when the functional device in an air cavity is suspended in the air cavity, the functional device in the air cavity is placed on a patterned medium board in the air cavity, and the patterned medium board is connected to the inner wall of the air cavity to support the patterned medium board, and the pattern of the patterned medium board is determined by the projection shape of the functional device placed in the air cavity.

[0012] In some embodiments, each dielectric board is a standard PCB board or LTCC.

[0013] In some embodiments, the functional device in each air cavity is a packaged functional device or a functional device that needs to be packaged.

[0014] In some embodiments, the functional devices placed in different air cavities have different functions.

[0015] In some embodiments, the functional devices include: a filter, a switch, a low noise amplifier, a power amplifier, and a mixer, wherein the filter, the switch, the low noise amplifier, and the power amplifier are placed in different air cavities.

[0016] Compared with the prior art, the present invention has the following beneficial effects:

[0017] The three-dimensional integrated packaging structure based on dielectric integrated suspension lines provided by the present invention can realize the coordinated design of functional devices, system circuits and packaging by forming air cavities and placing functional devices in different air cavities, thereby reducing the impact of packaging on circuit performance; and by packaging different functional devices in different air cavities with good electromagnetic shielding effects, mutual interference between functional devices is reduced, and it is convenient to debug them separately. The three-dimensional integrated packaging structure based on dielectric integrated suspension lines provided by the present invention expands the functional devices from two-dimensional planar interconnection to three-dimensional interconnection between different dielectric layers in the vertical direction, further improving the circuit integration; and, through three-dimensional vertical interconnection, the present invention shortens the length of the interconnection line, reduces transmission loss, is conducive to high-speed data transmission, and improves system reliability.

[0018] The present invention will be further described in detail below with reference to the accompanying drawings and specific implementation methods. BRIEF DESCRIPTION OF THE DRAWINGS

[0019] Figure 1is a schematic diagram of a three-dimensional structure of an exemplary three-dimensional integrated packaging structure based on dielectric integrated suspension lines provided by an embodiment of the present invention;

[0020] Figure 2 The embodiment of the present invention provides Figure 1 A schematic cross-sectional view of a three-dimensional integrated packaging structure based on dielectric integrated suspension lines along the AA direction;

[0021] Figure 3 It is a schematic diagram of the principle of a three-dimensional vertical interconnection technology based on dielectric integrated suspension lines provided by an embodiment of the present invention. DETAILED DESCRIPTION

[0022] The present invention is further described in detail below with reference to specific embodiments, but the embodiments of the present invention are not limited thereto.

[0023] The present invention provides a three-dimensional integrated packaging structure based on dielectric integrated suspension line (SISL), comprising: functional devices and N dielectric plates with metal covering both upper and lower surfaces, and the metal covered on the upper or lower surface of each dielectric plate forms a metal layer. The N dielectric plates are stacked from bottom to top, and any one of the dielectric plates from the second layer to the N-1 layer or any multiple adjacent dielectric plates are patterned and hollowed out to form at least one air cavity, and metalized through holes are provided on the dielectric plates from the first layer to the Nth layer to penetrate the dielectric plates from the first layer to the Nth layer to form an electric wall around the air cavity, and the constructed electric wall forms an electromagnetic shielding cavity together with the dielectric plates from the first layer and the Nth layer, so that the formed air cavity has a good electromagnetic shielding effect, and the dielectric plates from the second layer to the N-1th layer are electrically connected through a three-dimensional vertical interconnection technology, and one or more functional devices are placed in each air cavity; N is a positive integer greater than or equal to 3.

[0024] It should be noted that the above-mentioned dielectric plate is graphically hollowed out, which means that the dielectric plate used to form the air cavity is hollowed out according to the shape of the projection of the functional device to be placed in the air cavity to be formed.

[0025] In some embodiments, the shape and size of each air cavity matches the shape and size of the functional device placed in the air cavity; in this way, the integration level of the three-dimensional integrated packaging structure can be further improved.

[0026] In some embodiments, when N is greater than or equal to 5, the placement of the functional device in an air cavity includes: suspending the functional device in the air cavity.

[0027] In some embodiments, when a functional device in an air cavity is suspended in the air cavity, the functional device in the air cavity is placed on a patterned medium board in the air cavity, and the patterned medium board is connected to the inner wall of the air cavity to support the patterned medium board, and the pattern of the patterned medium board is determined by the projected shape of the functional device placed in the air cavity.

[0028] It should be noted that the above-mentioned patterned dielectric plate refers to a dielectric plate that has been patterned and hollowed out.

[0029] In some embodiments, each dielectric board is a standard PCB board or LTCC.

[0030] In some embodiments, the functional device in each air cavity is a packaged functional device or a functional device that needs to be packaged; thus, when the functional device in each air cavity is a functional device that needs to be packaged, the air cavity used to accommodate the functional device can serve as a package for the functional device, thereby reducing the impact of packaging on circuit performance.

[0031] It should be noted that the functional device placed in each air cavity may be a circuit device or a circuit module, and the present invention is not limited to this.

[0032] In some embodiments, the functions of the functional devices placed in different air cavities are different. Exemplarily, the functional devices include: one or more of RF functional devices such as filters, switches, low noise amplifiers, power amplifiers, mixers, etc., wherein the filters, switches, low noise amplifiers, and power amplifiers are placed in different air cavities.

[0033] In some embodiments, when a plurality of air cavities are formed, the sizes of any two air cavities are the same or different, and the electrical connection between the functional devices placed in two different air cavities is achieved through a three-dimensional vertical interconnection technology.

[0034] In some embodiments, types of three-dimensional vertical interconnection technology include: direct interconnection of the same layer of metal, interconnection of the same layer of metal through parallel coupling, interconnection of upper and lower layers of metal through metalized vias, interconnection of upper and lower layers of metal through wide-side coupling, interconnection of different layers of metal through cavity coupling, and interconnection of different layers of metal through gap coupling.

[0035] For example, Figure 1 is a schematic diagram of a three-dimensional structure of an exemplary three-dimensional integrated packaging structure based on dielectric integrated suspension lines provided by an embodiment of the present invention; Figure 2 Yes Figure 1 A schematic cross-sectional view of a three-dimensional integrated packaging structure based on dielectric integrated suspension lines along the AA direction; Figure 3 The schematic diagram of the principle of three-dimensional vertical interconnection technology based on dielectric integrated suspension lines. Figure 1 , Figure 2 and Figure 3 In the figure, 1 represents the first dielectric layer, 2 represents the second dielectric layer, 3 represents the third dielectric layer, 4 represents the fourth dielectric layer, 5 represents the fifth dielectric layer, 6 represents the sixth dielectric layer, 7 represents the seventh dielectric layer, 8 represents the eighth dielectric layer, 9 represents the ninth dielectric layer, 10 represents the tenth dielectric layer, 11 represents the eleventh dielectric layer, 12 represents the twelfth dielectric layer, 13 represents metallized through-holes, 14 represents metallized through-hole interconnections between different layers, 15 represents metallized broadside coupling interconnections between different layers, and 16 represents metallized flat holes on the same layer. 17 represents the coupling interconnection of metal gaps of different layers, 18 represents the coupling interconnection of different cavities, 19 represents the patch probe, 20 to 28 represent different functional devices (for example, filters, switches, low noise amplifiers, power amplifiers, etc.), specifically, 20 represents functional device A, 21 represents functional device B, 22 represents functional device C, 23 represents functional device D, 24 represents functional device E, 25 represents functional device F, 26 represents functional device G, 27 represents functional device H, and 28 represents functional device I.

[0036] Combination Figure 1 , Figure 2 As shown, the three-dimensional integrated packaging structure includes: a first dielectric plate 1, a second dielectric plate 2, a third dielectric plate 3, a fourth dielectric plate 4, a fifth dielectric plate 5, a sixth dielectric plate 6, a seventh dielectric plate 7, an eighth dielectric plate 8, a ninth dielectric plate 9, a tenth dielectric plate 10, an eleventh dielectric plate 11, a twelfth dielectric plate 12, and functional devices A, B, C, D, E, F, G, H, and I. The first and twelfth dielectric plates serve as bottom plates and cover plates, the sixth, eighth, and tenth dielectric plates serve as support plates and partition plates respectively (some of the functional devices A to I are directly designed or placed on these dielectric plates), and the second to fifth dielectric plates, the seventh dielectric plate, the ninth dielectric plate, and the eleventh dielectric plate are partially hollowed out according to the shapes and sizes of the functional devices to form a plurality of air cavities for accommodating the functional devices. The air cavity is surrounded by metallized vias arranged closely together to serve as an electrical wall, so as to form air cavities of different sizes, mutually isolated and having good electromagnetic shielding effect together with the first dielectric board, the sixth dielectric board, the eighth dielectric board, the tenth dielectric board and the twelfth dielectric board. 20 (i.e., functional device A) is designed or mounted on a portion of the patterned dielectric board 3, such as Figure 2As shown, the patterned dielectric plate is connected to a part of the metal layer of the dielectric plate 3, thereby supporting the patterned dielectric plate, 21 (i.e., functional device B) is designed or installed on a part of the patterned dielectric plate of the dielectric plate 4, the patterned dielectric plate is connected to a part of the metal layer of the dielectric plate 4, thereby supporting the patterned dielectric plate, and 20 and 21 are suspended in different air cavities respectively, and 20 and 21 are also realized through their respective patch probes 19 as shown in FIG. Figure 3 The cavities shown in 18 are coupled and interconnected. 22 (i.e., functional device C) is designed or installed on the dielectric plate 6, and is located on a different dielectric plate from 21, and is vertically interconnected through the gap coupling between different cavities. 23 (i.e., functional device D) is designed or installed on the dielectric plate 6, and is located on the same dielectric plate 6 as 22, and is vertically interconnected through the gap coupling between different cavities. Figure 3 The parallel coupling method shown in 16 is used to realize interconnection. 24 (i.e., functional device E) is designed or installed on the dielectric plate 8 and is located on a different dielectric layer from 23. Figure 3 The metallized vias of different layers shown in 14 are vertically interconnected. 25 (i.e., functional device F) is designed or installed on the dielectric plate 10 and is located on a different dielectric layer from 24. Figure 3 The vertical interconnection is realized by the different layer width side coupling method shown in 15; 26 (i.e., functional device G) is designed or installed on the dielectric plate 10, and is located on a different dielectric layer from 24, through Figure 3 The metallized vias shown in 14 realize vertical interconnection of different layers. Functional devices 20, 21, 22, 23, 24, 25 and 26 are respectively packaged in separate electromagnetic shielding cavities, and the interconnections are isolated to reduce mutual influence and facilitate separate debugging.

[0037] The three-dimensional integrated packaging structure based on dielectric integrated suspension lines provided by the present invention can realize the coordinated design of functional devices, system circuits and packaging by forming air cavities and placing functional devices in different air cavities, thereby reducing the impact of packaging on circuit performance; and by packaging different functional devices in different air cavities with good electromagnetic shielding effects, mutual interference between functional devices is reduced, and it is convenient to debug them separately. The three-dimensional integrated packaging structure based on dielectric integrated suspension lines provided by the present invention expands the functional devices from two-dimensional planar interconnection to three-dimensional interconnection between different dielectric layers in the vertical direction, further improving the circuit integration; and, through three-dimensional vertical interconnection, the present invention shortens the length of the interconnection line, reduces transmission loss, is conducive to high-speed data transmission, and improves system reliability.

[0038] In the description of this specification, the description with reference to the terms "one embodiment", "some embodiments", "example", "specific example", or "some examples" etc. means that the specific features or characteristics described in conjunction with the embodiment or example are included in at least one embodiment or example of the present invention. In this specification, the schematic representation of the above terms does not necessarily refer to the same embodiment or example. Moreover, the specific features or characteristics described may be combined in any one or more embodiments or examples in a suitable manner. In addition, those skilled in the art may combine and combine the different embodiments or examples described in this specification.

[0039] In the specification, the word "comprising" does not exclude other components or steps, and "a" or "an" does not exclude a plurality of components. Certain measures are recorded in different embodiments, but this does not mean that these measures cannot be combined to produce good effects.

[0040] The above contents are further detailed descriptions of the present invention in combination with specific preferred embodiments, and it cannot be determined that the specific implementation of the present invention is limited to these descriptions. For ordinary technicians in the technical field to which the present invention belongs, several simple deductions or substitutions can be made without departing from the concept of the present invention, which should be regarded as falling within the protection scope of the present invention.

Claims

1. A three-dimensional integrated packaging structure based on dielectric integrated suspension lines, characterized in that: include: The N layer has a dielectric plate covered with metal on both the upper and lower surfaces; Among them, N layers of dielectric plates are stacked from bottom to top, any one layer of the dielectric plates from the 2nd layer to the N-1th layer or any multiple adjacent layers of dielectric plates are patterned and hollowed out to form at least one air cavity, metallized through holes are opened on the dielectric plates from the 1st layer to the Nth layer to penetrate the dielectric plates from the 1st layer to the Nth layer to form an electric wall around the air cavity, the dielectric plates from the 1st layer to the Nth layer and the formed electric wall together constitute an electromagnetic shielding cavity, the dielectric plates from the 2nd layer to the N-1th layer are electrically connected through a three-dimensional vertical interconnection technology, and one or more functional devices are placed in each air cavity; N is a positive integer greater than or equal to 3.

2. The three-dimensional integrated packaging structure based on dielectric integrated suspension lines according to claim 1, characterized in that: The shape and size of each air cavity match the shape and size of the functional device placed in the air cavity.

3. The three-dimensional integrated packaging structure based on dielectric integrated suspension lines according to claim 1, characterized in that: When a plurality of air cavities are formed, the sizes of any two air cavities are the same or different, and the functional devices placed in two different air cavities are electrically connected through a three-dimensional vertical interconnection technology.

4. The three-dimensional integrated packaging structure based on dielectric integrated suspension lines according to claim 3, characterized in that: The types of three-dimensional vertical interconnection technology include: direct interconnection of the same layer of metal, interconnection of the same layer of metal through parallel coupling, interconnection of upper and lower layers of metal through metalized vias, interconnection of upper and lower layers of metal through wide-side coupling, interconnection of different layers of metal through cavity coupling, and interconnection of different layers of metal through gap coupling.

5. The three-dimensional integrated packaging structure based on dielectric integrated suspension lines according to claim 1, characterized in that: When N is greater than or equal to 5, the placement of the functional device in an air cavity includes: suspending the functional device in the air cavity.

6. The three-dimensional integrated packaging structure based on dielectric integrated suspension lines according to claim 5, characterized in that: When the functional device in an air cavity is suspended in the air cavity, the functional device in the air cavity is arranged on a patterned medium board in the air cavity, and the patterned medium board is connected to the inner wall of the air cavity to support the patterned medium board, and the pattern of the patterned medium board is determined by the projection shape of the functional device placed in the air cavity.

7. The three-dimensional integrated packaging structure based on dielectric integrated suspension lines according to claim 1, characterized in that: Each layer of dielectric board is a standard PCB board or LTCC.

8. The three-dimensional integrated packaging structure based on dielectric integrated suspension lines according to claim 1, characterized in that: The functional device in each air cavity is a packaged functional device or a functional device that needs to be packaged.

9. The three-dimensional integrated packaging structure based on dielectric integrated suspension lines according to claim 1, characterized in that: The functional devices placed in different air cavities have different functions.

10. The three-dimensional integrated packaging structure based on dielectric integrated suspension lines according to claim 1, characterized in that: The functional devices include: a filter, a switch, a low noise amplifier, a power amplifier, and a mixer, wherein the filter, the switch, the low noise amplifier, and the power amplifier are arranged in different air cavities.

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