Dielectric punching type photonic band gap packaging antenna and preparation method thereof

Abstract

The invention relates to a dielectric punching type photonic band gap packaging antenna and a preparation method thereof, belongs to the technical field of packaging antennas, and solves the problem that the process of enabling the resonant frequency of the antenna to fall within a photonic band gap range of the existing dielectric punching type photonic band gap packaging antenna is relatively complicated. The dielectric punching type photonic band gap packaging antenna comprises a reconstructed wafer and a substrate which are sequentially arranged from bottom to top, a floor metal layer is arranged between the substrate and the reconstructed wafer, a patch antenna is arranged on the upper surface of the substrate, an air hole and a flow channel are formed in the substrate, the air hole penetrates through the upper surface and the lower surface of the substrate, and the flow channel is communicated with the reconstructed wafer. A flow channel medium different from the substrate medium is arranged in the flow channel, and the air holes are not communicated with the flow channel. According to the invention, the channel structure is arranged in the substrate, and the channel medium different from the matrix medium is filled in the channel, so that the dielectric constant of the substrate medium is controllable, the resonant frequency of the antenna is flexible and controllable, and the resonant frequency of the antenna can be more conveniently regulated and controlled to fall into the photonic band gap.

Description

Technical Field

[0001] The present invention relates to the technical field of packaged antennas, and in particular to a dielectric perforated photonic bandgap packaged antenna and a preparation method thereof. Background Art

[0002] Microstrip antennas are widely used in radar, communications and other fields, but the structure of microstrip antennas can support surface waves, which makes the energy bound near the dielectric layer and difficult to radiate, thereby reducing the radiation efficiency of the antenna; at the same time, electromagnetic waves are prone to radiation and diffraction at the place where the dielectric is cut off, which adversely affects the antenna's radiation pattern, resulting in increased fluctuations in the antenna's side lobes and increased back lobes. The PBG (photonic bandgap) structure is a periodic band-stop characteristic structure that can significantly suppress the propagation of electromagnetic waves in certain frequency bands. Applying the PBG structure to microstrip antennas can suppress surface waves and improve the radiation pattern gain. However, the resonant frequency of the microstrip antenna needs to fall within the range of the photonic bandgap in order to suppress the surface waves of the microstrip antenna.

[0003] The existing photonic bandgap (PBG) microstrip antennas mainly include the following: high impedance surface structure (HIGP), which is composed of periodically arranged metal protrusions arranged on a periodic metal plate. It has a compact structure and is easy to integrate. It is widely used in antenna design, but it requires the design of metal vias to increase the thickness of the antenna; planar compact structure (UC-PBG), which does not require the metal patch and the lower ground plate to be connected through metal holes, and adjacent units are connected through metal strips, which is not very convenient to design; floor etching structure, which etches a periodically arranged structure on the ground plate of the dielectric base. The processing is simple, but the presence of voids also increases the backward radiation; dielectric punching structure, which directly punches periodic air holes in the dielectric to achieve the characteristics of the crystal bandgap. It has a simple structure and is easy to analyze its function, but it does not significantly improve the antenna performance at a small size and lacks multiple adjustment functions.

[0004] Among them, for the dielectric perforated photonic bandgap antenna structure, the resonant frequency of the antenna can be made to fall within the photonic bandgap range by optimizing the antenna structure and the photonic bandgap structure. However, the resonant frequency of the optimized antenna will be fixed at a certain value, and the optimization process is relatively complicated. Summary of the invention

[0005] In view of the above analysis, an embodiment of the present invention aims to provide a dielectric perforated photonic bandgap packaged antenna and a preparation method thereof, so as to solve the problem that the existing dielectric perforated photonic bandgap packaged antenna has a relatively complicated process of making the antenna resonant frequency fall within the photonic bandgap range.

[0006] On the one hand, an embodiment of the present invention provides a dielectric perforated photonic bandgap packaged antenna, which includes a reconstructed wafer and a substrate arranged in sequence from bottom to top, a floor metal layer is arranged between the substrate and the reconstructed wafer, a patch antenna is arranged on the upper surface of the substrate, and air holes and flow channels are arranged in the substrate, the air holes pass through the upper and lower surfaces of the substrate, a flow channel medium different from the substrate medium is arranged in the flow channel, and the air holes and the flow channel are not connected.

[0007] Preferably, the number of the flow channels is one or more, and the flow channel comprises two flow channel holes and a channel connecting the two flow channel holes, and the two flow channel holes are respectively arranged on two opposite sides of the substrate.

[0008] Preferably, the air holes are arranged in a matrix form, and a flow channel is provided between two adjacent rows or columns of air holes.

[0009] Preferably, side walls are respectively arranged on two opposite sides of the substrate provided with flow channel holes, and pipes are respectively arranged on the side walls, and the pipes are connected with the plurality of flow channel holes on the sides through the inside of the side walls.

[0010] Preferably, the flow channel medium is a flowing medium or a non-flowing medium.

[0011] Preferably, the air holes are circular holes or square holes.

[0012] Preferably, the reconstructed wafer comprises a chip, a packaging layer, a metal column and a BGA ball, the chip and the metal column are located in the packaging layer, and the BGA ball is located on the lower surface of the packaging layer.

[0013] On the other hand, the present invention provides a method for preparing a dielectric perforated photonic bandgap packaged antenna, which is used to prepare the above-mentioned dielectric perforated photonic bandgap packaged antenna, and the preparation method comprises the following steps:

[0014] Step A: preparing a reconstructed wafer without BGA balls;

[0015] Step B: arranging a patch antenna on the upper surface of the substrate, arranging a floor metal layer on the lower surface, and forming air holes and flow channels on the substrate;

[0016] Step C: welding the reconstructed wafer obtained in step A to the substrate device obtained in step B and implanting BGA balls, and filling the flow channel with flow channel medium.

[0017] Preferably, forming the flow channel on the substrate comprises: etching flow channel holes on two opposite sides of the substrate, etching air holes in the area between the two opposite sides of the substrate, and then etching a channel between the two corresponding flow channel holes.

[0018] Preferably, in step A, the preparation of the reconstructed wafer without BGA balls comprises the following steps:

[0019] Provide carrier board;

[0020] forming a metal layer and metal pillars on the upper surface of the carrier;

[0021] placing a chip on the carrier;

[0022] Plastic encapsulate the chip to form a packaging layer;

[0023] The encapsulation layer is thinned to expose the metal pillars, and a metal layer is formed on the upper surface of the encapsulation layer;

[0024] Debonding and peeling of carrier.

[0025] Compared with the prior art, the present invention can achieve at least one of the following beneficial effects:

[0026] 1. The present invention sets a flow channel structure in the substrate and fills the flow channel with a flow channel medium different from the matrix medium, that is, the dielectric constant of the flow channel medium is different from the dielectric constant of the matrix medium, so that the effective dielectric constant of the overall dielectric layer is different from the dielectric constant of the dielectric layer with only the matrix medium, and the effective dielectric constant of the overall dielectric layer is changed, thereby changing the resonant frequency of the antenna and playing a frequency modulation role, that is, the dielectric constant of the substrate medium is controllable, and then the resonant frequency of the antenna is flexibly controllable, and the resonant frequency of the antenna can be more conveniently adjusted to fall within the photonic band gap, thereby suppressing the antenna surface wave and improving the gain.

[0027] 2. The packaged antenna of the present invention changes the effective dielectric constant of the entire dielectric layer through the flow channel medium, and is less affected by the use environment. Therefore, it has a wide range of applications and few limitations.

[0028] 3. The present invention changes the effective dielectric constant of the entire dielectric layer through the flow channel medium in the flow channel, thereby changing the broadband performance of the antenna.

[0029] 4. In one embodiment, a flowing medium is filled in the flow channel, and as the flowing medium continues to flow in and out, it can further assist in the heat dissipation of the chip.

[0030] In the present invention, the above-mentioned technical solutions can also be combined with each other to achieve more preferred combination solutions. Other features and advantages of the present invention will be described in the subsequent description, and some advantages can become obvious from the description, or can be understood by practicing the present invention. The purpose and other advantages of the present invention can be realized and obtained through the contents particularly pointed out in the description and the drawings. BRIEF DESCRIPTION OF THE DRAWINGS

[0031] The drawings are only for the purpose of illustrating particular embodiments and are not to be considered limiting of the present invention. Like reference symbols denote like components throughout the drawings.

[0032] Figure 1 This is a schematic diagram of the structure of the dielectric perforated photonic bandgap package antenna of the present invention;

[0033] Figure 2 The present invention is a process flow chart of the preparation of the dielectric perforated photonic bandgap package antenna;

[0034] Figure 3 The position arrangement of the flow channel and the air hole in one embodiment of the present invention;

[0035] Figure 4 Graphs showing the antenna resonance frequencies of Example 1 and Comparative Example 1;

[0036] Figure 5 The antenna resonant frequency points of Example 1 and Comparative Example 1 are directional diagrams on the E plane;

[0037] Figure 6 The antenna resonant frequency points of Example 1 and Comparative Example 1 are directional diagrams on the H plane;

[0038] Figure 7 This is the effect of the channel depth on the antenna resonant frequency;

[0039] Figure 8 is the package body temperature diagram of comparative example 2;

[0040] Fig. 9 is a temperature diagram of the package body of Example 1;

[0041] Fig.10 It is the chip cross-section temperature diagram of comparative example 2;

[0042] Fig.11 is a temperature diagram of the chip cross section of Example 1;

[0043] Fig.12 is the chip surface temperature diagram of Comparative Example 2;

[0044] Fig.13 is a chip surface temperature diagram of Example 1;

[0045] Fig.14 1 is a relationship diagram between the photonic band gap range and two resonant frequencies of Example 1 and Comparative Example 1.

[0046] Reference numerals:

[0047] 1-substrate; 2-floor metal layer; 3-patch antenna; 4-air hole; 5-flow channel; 501-flow channel hole; 502-channel; 6-side wall; 7-pipeline; 8-chip; 9-packaging layer; 10-metal column; 11-BGA ball. DETAILED DESCRIPTION

[0048] The preferred embodiments of the present invention are described in detail below in conjunction with the accompanying drawings, wherein the accompanying drawings constitute a part of this application and are used together with the embodiments of the present invention to illustrate the principles of the present invention, but are not used to limit the scope of the present invention.

[0049] The present invention provides a dielectric perforated photonic bandgap package antenna, such as Figure 1 As shown, the dielectric perforated photonic bandgap packaged antenna includes a reconstructed wafer and a substrate 1 arranged in sequence from bottom to top, a floor metal layer 2 is arranged between the substrate 1 and the reconstructed wafer, a patch antenna 3 is arranged on the upper surface of the substrate 1, and air holes 4 and flow channels 5 are arranged in the substrate 1. The air holes 4 pass through the upper and lower surfaces of the substrate 1, and a flow channel medium different from the substrate medium is arranged in the flow channel 5, and the air holes 4 and the flow channel 5 are not connected.

[0050] Compared with the prior art, the present invention sets a flow channel structure in the substrate, and fills the flow channel with a flow channel medium different from the matrix medium, that is, the dielectric constant of the flow channel medium is different from the dielectric constant of the matrix medium, so that the effective dielectric constant of the overall dielectric layer is different from the dielectric constant of the dielectric layer with only the matrix medium, and the effective dielectric constant of the overall dielectric layer is changed, so as to change the resonant frequency of the antenna, and play a frequency modulation role, that is, the dielectric constant of the substrate medium is controllable, and then the resonant frequency of the antenna is flexibly controllable, and the resonant frequency of the antenna can be more conveniently adjusted to fall within the photon band gap, thereby suppressing the antenna surface wave and improving the gain. In addition, the present invention changes the effective dielectric constant of the overall dielectric layer through the flow channel medium in the flow channel, and then can also change the broadband performance of the antenna. The packaged antenna of the present invention changes the effective dielectric constant of the overall dielectric layer through the flow channel medium, and is less affected by the use environment. Therefore, it has a wide range of applications and few limitations.

[0051] Specifically, when the patch antenna 3 radiates outward, when the electromagnetic wave propagates through the dielectric material, the wavelength is inversely proportional to the relative dielectric constant, that is, λ is the wavelength in a given medium, c is the speed of light in the medium, c0 is the speed of light in free space, λ0 is the wavelength of light in free space, ε r is the dielectric constant of the medium, which means that the dielectric constant of the medium will affect the size of the RF / microwave device affected by the wavelength; for microstrip antennas, the operating frequency of a general rectangular patch antenna 3 in the medium can be referred to by the formula L is the length of the rectangular patch, so it can be adjusted byr The size of controls the resonant frequency of the patch antenna 3. The present invention changes the effective dielectric constant ε of the overall substrate dielectric layer by the flow channel medium in the flow channel 5. r , thereby flexibly changing the resonant frequency of the antenna, making it easier to fall within the photonic bandgap. In addition, for microstrip antennas, reducing the dielectric constant of the medium can play a role in broadening the bandwidth of the microstrip antenna. Therefore, the present invention can change the effective dielectric constant ε of the entire dielectric layer through the flow channel medium in the flow channel 5. r , thereby changing the bandwidth of the microstrip antenna.

[0052] Considering the uniformity of the effective dielectric constant of the entire dielectric layer of the substrate 1, the number of the flow channel 5 is one or more, and the flow channel includes two flow channel holes 501 and a channel 502 connecting the two flow channel holes 501, and the two flow channel holes 501 are respectively arranged on two opposite sides of the substrate 1.

[0053] Specifically, the flow channel hole 501 is perpendicular to the surface of the substrate 1 , and the channel 502 is parallel to the surface of the substrate 1 .

[0054] Exemplarily, the air holes 4 are arranged in a matrix form, and a flow channel 5 is provided between two adjacent rows or columns of the air holes 4 .

[0055] For example, Figure 3 As shown, the air holes 4 are arranged in a 5*3 pattern, and a flow channel 5 is provided between two adjacent rows of air holes 4 .

[0056] In order to facilitate the flow of the flow channel medium into the flow channel 5, as shown in FIG. Figure 8 and Fig. 9 As shown (the patch antenna is not shown), the substrate 1 is provided with side walls 6 on two opposite sides of the flow channel hole 502, and the side walls 6 are provided with pipes 7, respectively. The pipes 7 are connected with the multiple flow channel holes 502 on the side through the inside of the side wall 6. The flow channel medium is passed into the flow channel 5 through the pipe 7, and the provision of the two side walls makes it easier for the flow channel medium to flow in the flow channel 5, thereby maintaining the continuous inflow and outflow of the flow channel medium.

[0057] Exemplarily, the flow channel medium is a flowing medium or a non-flowing medium. When the flow channel 4 is filled with the flowing medium, the flowing medium always keeps flowing in the flow channel, and as the flowing medium flows in and out, it can further assist the chip in dissipating heat.

[0058] Exemplarily, the flowing medium is at least one of water, oil and electronic fluorinated liquid.

[0059] Exemplarily, the non-flowing medium may be at least one of an organic medium and a primer, or may be a flowable medium that remains stationary.

[0060] Exemplarily, the substrate 1 is a glass substrate.

[0061] Exemplarily, the patch antenna 3 is rectangular.

[0062] It should be noted that the perforated channel structure is introduced and the structural parameters that affect the antenna performance are optimized at the same time, including factors that may affect the antenna resonant frequency such as patch size and dielectric thickness, factors that affect the photonic bandgap range such as the shape and period of the perforations, factors that affect the antenna resonant frequency and chip heat dissipation characteristics such as channel depth, etc. The optimization method can first set the relevant initial values ​​by empirical values ​​in HFSS, and then perform parameter scanning optimization to find the main parameters that affect the antenna performance and obtain the optimal value through overall simulation.

[0063] Specifically, the method for determining the parameters of the flow channel 5, the flow channel medium, and the photonic band gap structure includes:

[0064] Step (a): Preliminary design of the target resonant frequency. First, based on the selected material system, the size of the patch antenna is obtained according to the empirical formula of the microstrip patch antenna on the dielectric plate in the prior art (the design of the patch antenna is prior art and will not be described in detail here). After obtaining the preliminary model, the photonic bandgap structure and the flow channel are designed on the dielectric. The photonic bandgap structure is designed using the Bragg theory. Then, the flow channel is designed on the basis of minimizing the influence on the perforated structure and achieving the best heat dissipation effect. Then, the overall structure is further optimized, including factors that may affect the antenna resonant frequency, such as the patch size and the dielectric thickness, factors that affect the photonic bandgap range, such as the shape and period of the perforations, and factors that affect the antenna resonant frequency and the heat dissipation characteristics of the chip, such as the flow channel depth.

[0065] Step (b): using the optimization function in the HFSS simulation software, perform a parametric scan on the main influencing parameters in step (a), and observe the results after the scan to determine the appropriate value; if the resonant frequency of the antenna finally falls within the range of the photonic band gap and has a good heat dissipation function under this structure, it is a suitable value;

[0066] Step (c): Based on step (b), the main influencing factors such as the number of flow channel holes 501 and the filling medium material are separately modeled and set to observe their effects on the resonant frequency, bandwidth, and heat dissipation effect indicators, and then select the appropriate material and the number of flow channel holes 501.

[0067] Step (d): For the positions of the flow channel holes 501 and the channels 502, initially the spacing between the flow channel holes 501 and the flow channel holes 501 on the same side of the antenna can be set to an empirical value Pitch to make them evenly arranged, and then a parameter scan is performed on this value to observe its influence on the resonant frequency, bandwidth, and heat dissipation effect. After finding the optimal structure, the position can be adjusted more finely according to the structural characteristics, such as setting a closer spacing between the microchannels near the chip to achieve a better heat dissipation effect.

[0068] It should be noted that the air hole 4 is a circular hole or a square hole, and the initial value of the diameter of the circular hole or the side length of the square hole can generally be taken as 2 / 3 times of the period, and then the optimal size is obtained through software simulation.

[0069] Exemplarily, the reconstructed wafer includes a chip 8 , a packaging layer 9 , a metal pillar 10 and a BGA ball 11 , the chip 8 and the metal pillar 10 are located in the packaging layer 9 , and the BGA ball 11 is located on the lower surface of the packaging layer 9 .

[0070] Exemplarily, the encapsulation layer 9 is epoxy resin or silicon.

[0071] On the other hand, the present invention also provides a method for preparing a dielectric perforated photonic bandgap packaged antenna, which is used to prepare the above-mentioned dielectric perforated photonic bandgap packaged antenna, such as Figure 2 As shown, the preparation method comprises the following steps:

[0072] Step A: preparing a reconstructed wafer without BGA balls;

[0073] Step B: arranging a patch antenna on the upper surface of the substrate (electroplating a metal layer on the upper surface of the substrate), arranging a floor metal layer on the lower surface (electroplating a metal layer on the lower surface of the substrate), and forming air holes and flow channels on the substrate;

[0074] Step C: welding the reconstructed wafer obtained in step A to the substrate device obtained in step B and implanting BGA balls, and filling the flow channel with flow channel medium.

[0075] Specifically, the forming of air holes and flow channels on the substrate includes: etching flow channel holes on two opposite sides of the substrate, etching air holes in the area between the two opposite sides of the substrate, and then etching channels between the two corresponding flow channel holes, thereby forming a flow channel connected by the flow channel holes and the channels.

[0076] Exemplarily, in step A, the preparation of the reconstructed wafer without BGA balls comprises the following steps:

[0077] Provide carrier board;

[0078] forming a metal layer and metal pillars on the upper surface of the carrier;

[0079] placing a chip on the carrier;

[0080] Plastic encapsulate the chip to form a packaging layer;

[0081] The encapsulation layer is thinned to expose the metal pillars, and a metal layer is formed on the upper surface of the encapsulation layer;

[0082] Debonding and peeling of carrier.

[0083] The dielectric perforated photonic bandgap package antenna and the preparation method thereof of the present invention are further described below through specific embodiments.

[0084] Example 1

[0085] This embodiment provides a dielectric perforated photonic bandgap packaged antenna, which includes a reconstructed wafer and an FR-4 glass substrate (80mm*50mm) arranged in sequence from bottom to top, a floor metal layer is arranged between the glass substrate and the reconstructed wafer, and a rectangular patch antenna (37.26mm*28mm) is arranged on the upper surface of the glass substrate; air holes and flow channels are arranged in the substrate.

[0086] The air holes penetrate the upper and lower surfaces of the substrate, and are arranged in a 5*3 pattern. A flow channel is provided between two adjacent rows of air holes, and a flow channel is provided on the outer sides of the two most edge rows of air holes. The air holes are circular holes. The diameter D of the circular holes is 2 / 3 times the period T, the period T=13 mm, the height of the dielectric substrate is 1.6 mm, and the dielectric constant is 4.4 F / m.

[0087] The flow channel is filled with water (dielectric constant is 81F / m), and the air hole is not connected to the flow channel. The number of the flow channels is 6, and the flow channel includes 2 flow channel holes 501 and a channel 502 connecting the 2 flow channel holes 501. The 2 flow channel holes 501 are respectively arranged at two opposite sides of the substrate 1. The flow channel holes 501 are perpendicular to the surface of the substrate 1, and the channel 502 is parallel to the surface of the substrate 1. The depth of the flow channel hole is 0.5mm, and the width of the channel is 3mm. Side walls are respectively arranged on the two opposite sides of the substrate where the flow channel holes are arranged, and pipes are respectively arranged on the side walls. The pipes are connected to multiple flow channel holes on the side through the inside of the side wall. The flow channel medium is passed into the flow channel through the pipe, and the arrangement of the two side walls keeps the flow channel medium flowing in and out continuously.

[0088] The reconstructed wafer comprises a chip, a packaging layer, a metal column and a BGA ball, wherein the chip and the metal column are located in the packaging layer, and the BGA ball is located on the lower surface of the packaging layer. The packaging layer is epoxy resin or silicon.

[0089] Example 2

[0090] This embodiment provides a method for preparing a dielectric perforated photonic bandgap packaged antenna, which is used to prepare the dielectric perforated photonic bandgap packaged antenna of embodiment 1, comprising:

[0091] Step A: Preparing a reconstructed wafer without BGA balls, comprising the following steps:

[0092] Provide carrier board;

[0093] forming a metal layer and metal pillars on the upper surface of the carrier;

[0094] placing a chip on the carrier;

[0095] Plastic encapsulate the chip to form a packaging layer;

[0096] The encapsulation layer is thinned to expose the metal pillars, and a metal layer is formed on the upper surface of the encapsulation layer;

[0097] Debonding and peeling of carrier.

[0098] Step B: Arrange a patch antenna on the upper surface of the substrate (electroplate a metal layer on the upper surface of the substrate), arrange a floor metal layer on the lower surface (electroplate a metal layer on the lower surface of the substrate), and form air holes and flow channels on the substrate, including: etching flow channel holes on two opposite sides of the substrate, etching an air hole in the area between two opposite sides of the substrate, and then etching a channel between the two corresponding flow channel holes, thereby forming a flow channel connected by the flow channel holes and the channel.

[0099] Step C: welding the reconstructed wafer obtained in step A to the substrate device obtained in step B and implanting BGA balls, and filling the flow channel with flow channel medium.

[0100] Methods for determining flow channel parameters, flow channel media, and photonic band gap structures (air hole structures) include:

[0101] Step (a): The resonant frequency is preliminarily designed to be 2.74 GHz. First, based on the selected material system, the size of the patch antenna is obtained according to the empirical formula of the microstrip patch antenna on the dielectric plate in the prior art. After obtaining the preliminary model, the photonic bandgap structure and the flow channel are designed on the dielectric. The photonic bandgap structure is designed using the Bragg theory. Then, the flow channel is designed on the basis of minimizing the influence on the perforated structure and achieving the best heat dissipation effect. Then, the overall structure is further optimized, including factors that may affect the resonant frequency of the antenna, such as the size of the patch and the thickness of the dielectric, factors that affect the range of the photonic bandgap, such as the shape and period of the air holes, and factors that affect the resonant frequency of the antenna and the heat dissipation characteristics of the chip, such as the flow channel depth.

[0102] Step (b): using the optimization function in the HFSS simulation software, perform a parametric scan on the main influencing parameters in step (a), and observe the results after the scan to determine the appropriate value; if the resonant frequency of the antenna finally falls within the range of the photonic band gap and has a good heat dissipation function under this structure, it is a suitable value;

[0103] Step (c): Based on step (b), the number of flow channel holes 501, the filling medium material and other influencing factors that cannot be scanned by parameters are separately modeled and set to observe their influence on the resonant frequency, bandwidth, and heat dissipation effect indicators, and then select the appropriate filling medium material and the number of flow channel holes 501. Finally, it is determined that the filling medium material is water, and the number of flow channel holes on each of the two opposite sides of the substrate is 6;

[0104] Step (d): For the positions of the flow channel holes 501 and the channel 502, the spacing between the flow channel holes 501 and the flow channel holes 501 on the same side of the antenna can be initially set to an empirical value Pitch, such as 13mm, so that they are evenly arranged. Then, a parameter scan is performed on this value to observe its influence on the resonant frequency, bandwidth, and heat dissipation effect. After finding the optimal structure, the position can be adjusted more finely according to the structural characteristics, such as setting a closer spacing between the microchannels near the chip to achieve better heat dissipation. Finally, a heat dissipation structure with a spacing of 13mm between two adjacent flow channels and a flow channel depth of 0.5mm was selected.

[0105] Example 3

[0106] This embodiment provides dielectric perforated photonic bandgap packaged antennas with different channel depths similar to Embodiment 1, except that the channel depths are 0.25 mm, 0.35 mm, 0.45 mm, 0.55 mm, 0.65 mm, and 0.75 mm, respectively.

[0107] Comparative Example 1

[0108] This comparative example provides a dielectric perforated photonic bandgap packaged antenna similar to that of Example 1, except that no flow channel and no flow channel medium are provided in the substrate.

[0109] Comparative Example 2

[0110] This comparative example provides a dielectric perforated photonic bandgap packaged antenna similar to that of Example 1, except that the flow channel medium in the flow channel is in a non-flowing state.

[0111] Test: The performance of the packaged antennas of Example 1, Example 3 and Comparative Examples 1-2 was tested, and the results are as follows: Figure 4-Figure 13 , the results are analyzed as follows:

[0112] Figure 4It is a diagram of the antenna resonant frequency of Example 1 and Comparative Example 1. It can be seen from the diagram that the antenna resonant frequency of Comparative Example 1 is 2.43 GHz, and the corresponding bandwidth is 0.5 GHz; the antenna resonant frequency of Example 1 is 2.74 GHz, and the corresponding bandwidth is 0.7 GHz, indicating that the introduction of the flow channel and the flow channel medium can control the resonant frequency and bandwidth of the antenna.

[0113] Fig.14 : is a relationship diagram between the photonic band gap range and two resonant frequencies of Example 1 and Comparative Example 1, wherein the dotted line corresponding to f1 is the resonant frequency of Comparative Example 1, and the dotted line corresponding to f2 is the resonant frequency of Example 1, and the photonic band gap range is △f. Fig.14 It can be seen that the antenna resonance frequency of Comparative Example 1 does not fall within the photonic band gap, while Example 1 introduces a flow channel and a flow channel medium to make the antenna resonance frequency fall within the photonic band gap, thereby achieving bandwidth expansion.

[0114] Figure 5 The antenna resonant frequency points of Example 1 and Comparative Example 1 are directional diagrams on the E plane; Figure 6 The H-plane radiation diagrams of the antenna resonant frequency points of Example 1 and Comparative Example 1; it can be seen from the figure that the gain of the radiation diagram of Example 1 is higher, because Example 1 controls the resonant frequency of the antenna to fall into the photonic band gap through the flow channel structure and the flow channel medium, thereby suppressing surface waves and improving the gain and back lobe of the antenna.

[0115] Figure 7 The influence of different flow channel depths (depth of flow channel holes) on the antenna resonant frequency of Example 3 is shown in FIG. Figure 7 It can be seen that different flow channel depths make the antenna have different resonant frequencies. It can be seen that the deeper the flow channel depth, the greater the total dielectric constant of the medium, and the more the resonant frequency of the antenna shifts to a lower frequency, which means that the resonant frequency of the antenna can be changed by changing the dielectric constant of the medium. Therefore, the resonant frequency of the antenna can be changed by changing the flow channel depth, thereby facilitating the control of the resonant frequency of the antenna to fall into the photonic band gap.

[0116] Figure 8-Figure 13 The heat dissipation effect diagram of the packaged antenna of Example 1 and Comparative Example 2, wherein: Fig. 9 , Fig.11 , Fig.13 This is a heat dissipation effect diagram of Example 1. Figure 8 , Fig.10 , Fig.12FIG. 2 is a heat dissipation effect diagram of comparative example 2. It can be seen that the maximum temperature inside the package of comparative example 2 can reach 105°C, and the temperature on the chip surface is basically above 104°C. The maximum temperature inside the package of embodiment 1 is 53.4°C, and the temperature on the chip surface is basically around 53°C. Obviously, the continuously flowing flow channel medium in the flow channel of embodiment 1 effectively improves the heat dissipation effect of the package and the chip.

[0117] The above description is only a preferred specific implementation manner of the present invention, but the protection scope of the present invention is not limited thereto. Any changes or substitutions that can be easily conceived by any technician familiar with the technical field within the technical scope disclosed by the present invention should be covered within the protection scope of the present invention.

Claims

1. A dielectric perforated photonic bandgap package antenna, characterized in that: The dielectric perforated photonic bandgap packaged antenna comprises a reconstructed wafer and a substrate (1) arranged in sequence from bottom to top, a floor metal layer (2) being arranged between the substrate (1) and the reconstructed wafer, a patch antenna (3) being arranged on the upper surface of the substrate (1), an air hole (4) and a flow channel (5) being arranged in the substrate (1), the air hole (4) penetrating the upper surface and the lower surface of the substrate (1), a flow channel medium different from the substrate medium being arranged in the flow channel (5), and the air hole (4) and the flow channel (5) being not connected.

2. The dielectric perforated photonic bandgap package antenna according to claim 1, characterized in that: The number of the flow channels (5) is one or more, and the flow channels include two flow channel holes (501) and a channel (502) connecting the two flow channel holes (501), and the two flow channel holes (501) are respectively arranged on two opposite sides of the substrate (1).

3. The dielectric perforated photonic bandgap package antenna according to claim 2, characterized in that: The air holes (4) are arranged in a matrix form, and a flow channel (5) is provided between two adjacent rows or columns of air holes (4).

4. The dielectric perforated photonic bandgap package antenna according to claim 2, characterized in that: Side walls (6) are respectively arranged on two opposite sides of the substrate (1) on which the flow channel holes (502) are arranged, and pipes (7) are respectively arranged on the side walls (6), and the pipes (7) are connected to the plurality of flow channel holes (502) on the side through the interior of the side walls (6).

5. The dielectric perforated photonic bandgap package antenna according to claim 1, characterized in that: The flow channel medium is a flowing medium or a non-flowing medium.

6. The dielectric perforated photonic bandgap package antenna according to claim 1, characterized in that: The air holes (4) are circular holes or square holes.

7. The dielectric perforated photonic bandgap package antenna according to claim 1, characterized in that: The reconstructed wafer comprises a chip (8), a packaging layer (9), a metal column (10) and a BGA ball (11); the chip (8) and the metal column (10) are located in the packaging layer (9), and the BGA ball (11) is located on the lower surface of the packaging layer (9).

8. A method for preparing a dielectric perforated photonic bandgap package antenna, characterized in that: For preparing the dielectric perforated photonic bandgap package antenna according to claims 1-7, the preparation method comprises the following steps: Step A: preparing a reconstructed wafer without BGA balls; Step B: arranging a patch antenna on the upper surface of the substrate, arranging a floor metal layer on the lower surface, and forming air holes and flow channels on the substrate; Step C: welding the reconstructed wafer obtained in step A to the substrate device obtained in step B and implanting BGA balls, and filling the flow channel with flow channel medium.

9. The preparation method according to claim 8, characterized in that: The forming of the flow channel on the substrate includes: etching flow channel holes on two opposite sides of the substrate, etching air holes in the area between the two opposite sides of the substrate, and then etching a channel between the two corresponding flow channel holes.

10. The preparation method according to claim 8, characterized in that: In step A, the preparation of the reconstructed wafer without BGA balls comprises the following steps: Provide carrier board; forming a metal layer and metal pillars on the upper surface of the carrier; placing a chip on the carrier; Plastic encapsulate the chip to form a packaging layer; The encapsulation layer is thinned to expose the metal pillars, and a metal layer is formed on the upper surface of the encapsulation layer; Debonding and peeling of the carrier.

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