Heat exchanger

Abstract

Examples of a heat exchanger are described herein. In some examples, a heat exchanger may include a flow channel. In some examples, the heat exchanger may include a grid structure disposed in the flow channel. In some examples, the heat exchanger may include a duct structure embedded in a grid structure. In some examples, one end of the conduit structure is disposed in a target region of the flow channel.

Description

Background Art

[0001] Some operations generate heat. For example, a computing device processor generates heat when transistors switch to execute instructions. Light emitting diodes (LEDs) generate heat when they convert current into light. Batteries generate heat during charging and discharging due to internal resistance. Vehicle engines generate heat when fuel is burned. In some examples, heat and / or overheating can damage the device and / or can cause inefficient operation. BRIEF DESCRIPTION OF THE DRAWINGS

[0002] Figure 1 is a diagram showing a cross section of an example of a structure;

[0003] Figure 2 is a diagram showing a cross section of an example of a heat exchanger;

[0004] Figure 3 is a diagram showing an example of a temperature map in the dimension of a flow channel;

[0005] Figure 4 is a diagram showing an example of a flow velocity diagram in the dimensions of a heat exchanger;

[0006] Figure 5 is a block diagram of an example of an apparatus that can be used to make the structure or structures described herein;

[0007] Figure 6 is a flow chart illustrating an example of a method for manufacturing a structure;

[0008] Figure 7 is a diagram showing a cross section of an example of a heat exchanger; and

[0009] Figure 8 is a diagram showing a perspective view of an example of a heat exchanger. DETAILED DESCRIPTION

[0010] A heat exchanger is a device that transfers heat between media. For example, a heat exchanger can be used to transfer heat from a heat source (e.g., a processor, LED, internal combustion engine, battery, boiler, etc.) to a substance (e.g., fluid, water, air, etc.). In some examples, a heat exchanger can be used to cool a processor, an engine, an LED bulb, a battery, etc. In some examples, a heat exchanger can be used to transfer heat from a substance (e.g., fluid, water, air, etc.) to an object (e.g., an engine) or a medium.

[0011] In some approaches, the coolant may flow through the cold plate starting at the inlet. For example, the coolant temperature may increase along the flow path. Accordingly, the lowest temperature area on the cooling surface of the cold plate may be located at or near the inlet, which may not be optimal because more heat may be transferred to the cold plate near or in the middle of the flow path. For example, heat may be located in one area of ​​the body (e.g., one area of ​​the body surface). The lowest temperature area of ​​the cooling surface may not be aligned with this local (e.g., hottest) area of ​​the body for cooling, resulting in non-optimal cooling.

[0012] Examples of some of the techniques described herein may include a heat exchanger for target heat transfer (e.g., cooling). Some examples of heat exchangers may include an embedded structure, such as a pipe, for guiding the coolant to the target area. The target area is an area (e.g., volume) of a heat exchanger for target heat exchange (e.g., cooling). For example, the target area may be an area of ​​a heat exchanger for maximum heat transfer, a central area of ​​a heat exchanger, an area of ​​a heat exchanger adjacent to a body to be cooled, an area of ​​a flow channel aligned with a body to be cooled or aligned with the hottest area of ​​a body to be cooled, an area of ​​a flow channel in a vertical direction of the surface of the area to be cooled, etc. Guiding the coolant may enable the flow path to start from the target area (e.g., instead of starting from the entrance). When combined with a cooling structure (e.g., a grid structure), cooling at the target area may be enhanced relative to other methods. In some examples, the flow path may be constructed so that non-target areas may be cooled simultaneously. Some examples of heat exchangers may include cooling structures, such as grid structures, fins, columns, or other heat transfer structures.

[0013] Some examples of the technology described herein can provide a heat exchanger including a grid structure for transferring heat. For example, a heat exchanger can include a flow channel having a grid structure, wherein the grid structure is used to transfer heat from a body of the heat exchanger to a fluid flowing through the flow channel.

[0014] A grid structure is an arrangement of one or more components (e.g., branches, beams, joists, columns, posts, rods, fins, etc.). For example, a grid structure can be constructed along one dimension, two dimensions, and / or three dimensions. Examples of grid structures can include rods, two-dimensional grids, three-dimensional grids, gyroidal structures, cubic grids, body-centered grids, etc. In some examples, the grid structure includes components arranged in a transverse manner. For example, two components in a grid structure can intersect at a diagonal, perpendicular, or oblique (e.g., non-perpendicular and non-parallel) angle.

[0015] Some examples of structures described herein can include a combination of a grid structure with a conduit structure (e.g., a conduit, a tube, a funnel, a duct, a channel, etc.). In some examples, the grid structure and another structure can form a heat exchanger for enhanced cooling performance. Because the conduits can deliver the cooling fluid to the target area, the cooling performance can be enhanced compared to other methods.

[0016] In some examples, the lattice structure, the pipe structure, the heat exchanger, or one or more portions thereof may be manufactured by three-dimensional (3D) printing, one or more other manufacturing techniques, or a combination thereof. Some examples of 3D printing that may be used to manufacture some examples of structures described herein may include fused deposition modeling (FDM), multi-jet fusion (MJF), selective laser sintering (SLS), binder jet, stereolithography (SLA), selective laser melting (SLM), electron beam melting (EBM), metal jet fusion, metal bond printing, liquid resin-based printing, etc. For example, a heat exchanger or a portion thereof may be manufactured using metal 3D printing and / or another 3D printing technique.

[0017] In some examples, additive manufacturing can be used to make 3D objects (e.g., geometric structures, meshes, etc.). Some examples of additive manufacturing can be implemented with 3D printing. For example, thermal energy can be projected onto the material in the build area, where phase changes and solidification in the material may occur at certain voxels. A voxel is a position representation in a 3D space (e.g., a component of a 3D space). For example, a voxel can represent a volume that is a subset of a 3D space. In some examples, voxels can be arranged on a 3D grid. For example, a voxel can be a cuboid or a rectangular prism in shape. In some examples, voxels in a 3D space can be uniform in size or non-uniform in size. Examples of voxel size dimensions may include: 25.4 millimeters (mm) / 150≈170 microns for 150 dots per inch (dpi), 490 microns for 50dpi, 2 mm, 4 mm, etc. The term "voxel level" and its variants may refer to a resolution, scale, or density corresponding to a voxel size.

[0018] Some examples of the geometries and / or structures (e.g., mesh structures, pipe structures, etc.) described herein can be produced by additive manufacturing. For example, some examples can be made of plastics, polymers, semi-crystalline materials, metals, etc. Some additive manufacturing techniques can be powder-based and driven by powder melting. Some examples of the geometries and / or structures (e.g., meshes) described herein can be made by region-based powder bed fusion-based additive manufacturing (such as MJF, metal jet melting, metal bonding printing, SLM, SLS, etc.). Some examples of the methods described herein can be applied to additive manufacturing, where reagents carried by droplets are used for voxel-level thermal modulation.

[0019] In some examples of additive manufacturing, thermal energy can be used to melt materials (e.g., particles, powders, etc.) to form objects (e.g., structures, geometries, meshes, etc.). For example, agents (e.g., fluxes, refiners, etc.) can be selectively deposited to control voxel-level energy deposition, which can trigger phase changes and / or solidification for selected voxels.

[0020] In some examples of 3D printing, a binding agent (e.g., adhesive) may be printed onto the material in the build volume to bind the powder (e.g., particles) and form a precursor object (e.g., a "green part"). The precursor object may be heated (e.g., in a furnace or heating device) to sinter the precursor object and form a solid part.

[0021] In all figures, similar reference numerals may represent similar or identical elements. When a reference is made to an element without a reference numeral, the reference may be made to the element in general, and may not be limited to and / or restricted to any particular figure or diagram. In some examples, the figures are not drawn to scale, and / or the dimensions of certain parts may be exaggerated to more clearly illustrate the examples shown. In addition, the figures provide examples according to the description. However, the description is not limited to the examples provided in the figures.

[0022] Figure 1 1 is a diagram showing a cross-section of an example of structure 120. In some examples, structure 120 may be a heat exchanger and / or may be included in a heat exchanger. Structure 120 may include a flow channel 112. A flow channel is a passage (e.g., a route, a path, etc.) for carrying a substance (e.g., a fluid, water, air, and / or a coolant, etc.). The flow channel may be defined by one or more walls and / or a shell. For example, structure 120 includes a flow channel 112 defined by a shell. In some examples, flow channel 112 may be circular (e.g., tubular), rectangular, irregularly shaped, or a combination thereof. In some examples, the shell may provide one or more walls containing flow channel 112. In some examples, the shell may have a circular (e.g., tubular) shape, a rectangular shape, an irregular shape, or a combination thereof. In some examples, flow channel 112 may be along a linear, wavy, winding, spiral, annular path, and / or other path. In some examples, flow channel 112 may be used to conduct a substance between an inlet and an outlet (eg, for a portion of a path traveling between the inlet and the outlet).

[0023] The structure 120 may include a grid structure 122. In an example, the grid structure 122 includes members (eg, beams) that intersect at diagonal, perpendicular, or oblique (eg, non-perpendicular and non-parallel) angles. Figure 1In the example of FIG. 1 , the members of the mesh structure 122 intersect at a 90° angle. In other examples, the members of the mesh structure may intersect at a different angle or angles (e.g., 15°, 30°, 45°, 70°, 85°, 95°, 110°, 135°, etc.). In some examples, the members of the mesh structure may be curved, spiral, staggered, and / or interwoven, etc.

[0024] In some examples, the lattice structure 122 may be disposed in the flow channel 112. For example, the lattice structure 122 may partially or completely span the flow channel 112. In some examples, the lattice structure 122 may be disposed within the housing. For example, the lattice structure 122 may be included within the housing and / or may partially or completely span between walls of the housing.

[0025] In some examples, mesh structure 122 is a 3D mesh.

[0026] In some examples, the grid structure 122 repeats in multiple directions. For example, the grid structure can repeat in two dimensions or three dimensions. The repeating structure can have one or more shapes that are the same or similar and that repeat in space. For example, a 3D grid structure (e.g., a cell of the grid structure) can repeat in three dimensions (e.g., along the x, y, and z axes). In some examples, the duct structure 124 may or may not have a shape that repeats in space.

[0027] In some examples, the grid structure 122 can allow flow. For example, a substance (e.g., a fluid, water, air, and / or a coolant, etc.) can flow through the grid structure 122 (e.g., around and / or between components of the grid structure 122). In some examples, the structure 120 can be a single-flow heat exchanger or can be included in a single-flow heat exchanger. For example, a heat source can be placed in contact with a heat exchanger (e.g., in contact with one or more housing walls of the structure 120). Heat can be conducted through the grid structure 122. The substance flowing through the grid structure 122 can absorb heat from the grid structure 122. Accordingly, the heat source can dissipate heat to the grid structure 122, which can cool the heat source.

[0028] The structure 120 may include a conduit structure 124. The conduit structure is a hollow body. For example, the conduit structure may be a tubular structure, a cylindrical structure, a funnel structure, a tunnel structure, a tube structure, a hose structure, and / or a conduit structure for conducting a substance (e.g., a fluid, air, water, and / or a coolant, etc.). The conduit structure may follow a linear, curved, spiral, tortuous, wavy path, and / or other path. For example, the conduit structure 124 may have a linear, curved, folded, twisted, spiral, or coiled shape along the axial direction. Although in Figure 1An example of a duct structure 124 is shown in FIG. 1 , although other shapes may be used in some examples.

[0029] The duct structure 124 may be embedded in the mesh structure 122. For example, the duct structure 124 may be adjacent to (e.g., abutting, contacting, etc.) one or more members of the mesh structure 122 in one or a series of directions outward from the duct structure 124. In some examples, the mesh structure 122 may be fused to the outer surface of the duct structure 124. In some examples, the mesh structure 122 may be formed together with the duct structure 124. In some examples, the duct structure 124 may cross the mesh structure 122. For example, the duct structure 124 may pass through one or more members of the mesh structure 122. In some examples, the duct structure 124 may cross the mesh structure 122 by attaching along one or more spans of the mesh structure. In some examples, the duct structure 124 may cross the mesh structure 122 by geometrically merging with the mesh structure 122 (e.g., without disposing the mesh structure 122 in a hollow portion of the duct structure 124). For example, the duct structure 124 may overlap the mesh structure 122 within a certain volume. In some examples, the duct structure 124 can intersect the mesh structure 122 by forming a geometric (e.g., voxel) union between the duct structure 124 and the mesh structure 122 (e.g., excluding the hollow portion of the duct structure 124). In some examples, forming the geometric union can be achieved using Boolean operations. For example, a "Boolean operation" can refer to a union operation in which multiple (e.g., two) models are jointly merged into a single model. In some examples, Boolean operations can be performed on models represented in one or more files (e.g., one or more files for stereolithography, one or more STL files, one or more computer-aided design (CAD) files, one or more mesh model files, etc.) to produce a geometric union between the models.

[0030] In some examples, the conduit structure 124 can be configured to deliver a substance to be passed through the mesh structure 122 to the target area 114. Figure 1 An example of the flow direction 110 of the substance is shown in FIG. In some examples, one end 116 of the conduit structure 124 is disposed in the target region 114 of the flow channel 112. For example, the open end 116 of the conduit structure 124 can deliver the substance (e.g., fluid, coolant, etc.) to the target region 114. Figure 1 The example of target area 114 in the figure is rectangular, but in some examples, different shapes and / or dimensions can be used for the target area. In some examples, the target area can be spherical, circular, elliptical, cuboid, rectangular, prismatic, polygonal, amoeboid-shaped, irregularly shaped, two-dimensional (2D), 3D, etc.

[0031] In some examples, target region 114 may correspond to a heat source location (e.g., a target heat source location, an expected heat source location, etc.). For example, a heat source (or region of a heat source) may be placed in contact with structure 120, with Figure 1 114. For example, a processor, battery cell, LED, etc. may be located approximately in the center of the target area 114, in contact with the wall of the structure 120. The duct structure 124 may direct the fluid to the target area 114, thereby allowing the fluid in the target area 114 to absorb heat transferred from the heat source to the mesh structure 122.

[0032] In some examples, multiple conduit structures and / or multiple target areas may be utilized. For example, structure 120 may include a second conduit structure (in Figure 1 114). The second end of the second conduit structure can be disposed in the second target region of the flow channel 112. In some examples, other numbers (e.g., 3, 4, 5, etc.) of conduit structures and / or target regions can be utilized. For example, multiple conduit structures can be deployed to corresponding target regions. In some examples, multiple conduit structures can be deployed to a single target region (e.g., target region 114).

[0033] In some examples, the grid structure 122 and the duct structure 124 are 3D printed. In some methods, the grid structure 122 and the duct structure 124 can be manufactured simultaneously (e.g., during overlap) via 3D printing. For example, the grid structure 122 and the duct structure 124 can be printed simultaneously (e.g., in the same build). In some examples, during manufacturing, the grid structure 122 can support the duct structure 124. For example, the grid structure 122 can perform two functions: manufacturing support and heat dissipation. In some examples, the grid structure 122 can be a non-sacrificial support for the duct structure 124. For example, the grid structure 122 can be retained (e.g., not removed) after manufacturing. In some examples, the duct structure 124 can be used to facilitate the removal of unprinted materials. For example, after printing, the duct structure 124 can allow air to pass (e.g., for vacuuming, for air blasting, etc.) for powder removal.

[0034] In some examples, the mesh structure 122 and the tube structure 124 are a unitary body. For example, the mesh structure 122 and the tube structure 124 can have the same or similar material composition.

[0035] In some examples, the grid structure 122 and the duct structure 124 can be manufactured separately. For example, the grid structure 122 and the duct structure 124 can be manufactured separately (e.g., independently) and / or can be assembled. For example, the duct structure 124 can be manufactured using a separate technique (e.g., machining) and / or one or more materials (e.g., a flexible plastic hose can be added as a lining for better insulation between hot and cold fluids, etc.). In some examples, the grid structure 122 can be manufactured and a portion can be removed (e.g., drilled out) to accommodate the duct structure 124 that may be inserted into the portion.

[0036] In some examples, structure 120 can be used to transfer (e.g., absorb or dissipate) heat. For example, structure 120 can be included within a heat source, mounted to a heat source, and / or arranged to contact a heat source. For example, structure 120 (e.g., a housing wall of structure 120) can be placed in contact with a processor, an engine, an LED light, a lithium battery, a computing device housing, and / or other heat sources to cool the heat source. For example, structure 120 can be included in a processor liquid cooler. In some examples, structure 120 can receive heated liquid and can cool the liquid (e.g., dissipate heat from the liquid).

[0037] Some examples of the techniques and / or structures described herein can provide enhanced cooling and / or performance. For example, some examples can improve temperature uniformity. For example, in some examples of the structures described herein, the difference between the maximum temperature and the minimum temperature (e.g., temperature drop) of the heat exchanger can be reduced. Some examples can reduce pressure drop. For example, relative to other structures, in some examples of the structures described herein, the pressure drop of the heat exchanger can be reduced.

[0038] Some examples of structures described herein can be manufactured at a relatively low cost. For example, some examples of the technology described herein can provide 3D manufacturing of piping structures embedded in a grid structure (e.g., heat exchangers, 3D printed cold plates, etc.), which can reduce manufacturing costs. Some examples of structures described herein can include various grid structures and / or other heat exchange structures.

[0039] Figure 2 2 is a diagram showing a cross section of an example of the heat exchanger 226. The heat exchanger 226 may be Figure 1 1. An example of a structure 120 is depicted. In this example, a heat exchanger 226 includes a housing 230, a flow channel 232, a grid structure 234, and a pipe structure 236. The heat exchanger 226 can be arranged in a cold plate design, where a heat source can be placed on top of the heat exchanger 226 and / or below the heat exchanger 226.

[0040] The heat exchanger 226 may include an inlet 238 disposed on the housing 230. The inlet is a passage (e.g., a tube, conduit, etc.) through the housing and / or walls of the heat exchanger to allow the input of a substance (e.g., a fluid, coolant, water and / or air, etc.). In some examples, the inlet may include a protruding structure on the outside of the heat exchanger (e.g., a sleeve, a pipe fitting, a cylinder, a threaded protrusion, etc.). In some examples, the inlet may include a groove on the outside of the heat exchanger (such as a threaded groove, a sleeve, a press-fit groove, etc.). In some examples, the inlet may include one or more sealing mechanisms (e.g., a gasket, an O-ring, etc.). Figure 2 In the example shown, the inlet 238 protrudes from the housing 230 of the heat exchanger 226 .

[0041] The heat exchanger 226 may include an outlet 240 disposed on the housing 230. The outlet is a passage (e.g., a tube, conduit, etc.) through the housing and / or walls of the heat exchanger to allow the output of a substance (e.g., a fluid, coolant, water and / or air, etc.). In some examples, the outlet may include a protruding structure on the exterior of the heat exchanger (e.g., a sleeve, a fitting, a cylinder, a threaded protrusion, etc.). In some examples, the outlet may include a groove on the exterior of the heat exchanger (e.g., a threaded groove, a sleeve, a press-fit groove, etc.). In some examples, the outlet may include one or more sealing mechanisms (e.g., a gasket, an O-ring, etc.). Figure 2 In the example shown in FIG. 2 , the outlet 240 protrudes from the housing 230 of the heat exchanger 226 .

[0042] In some examples, a conduit structure may be provided through the inlet. Figure 2 In the example of FIG. 2 , the duct structure 236 is disposed through the inlet 238. For example, the heat exchanger 226 may include a duct structure 236 (e.g., a duct) extending through the inlet 238 into the housing 230, and the duct structure 236 extends outside the inlet 238 (e.g., outside the inner wall 242). The duct structure 236 extends to a target area 252 adjacent to the center of the flow channel 232. One end of the duct structure 236 (e.g., a duct) may be disposed in the target area 252 in the housing 230.

[0043] In this example, the heat exchanger 226 includes a mesh structure 234. The mesh structure 234 can be a 3D mesh disposed in the housing 230. The pipe structure 236 is embedded in the mesh structure 234. For example, the pipe can be embedded in the 3D mesh. In some examples, the heat exchanger 226 can include a mesh structure 234 (e.g., a cooling mesh structure) having a feature and spacing dimension of 2.5 mm. In some examples, the mesh structure 234 (e.g., the heat exchanger 226) can be manufactured by metal 3D printing.

[0044] In this example, a substance (e.g., fluid, coolant, water, and / or air, etc.) may flow into the heat exchanger 226 via the inlet 238, flow through the pipe structure 236, flow through the mesh structure 234, and flow out of the heat exchanger 226 via the outlet 240. For example, the fluid may pass from one end of the pipe structure 236 (e.g., pipe) in the target area 252 to absorb heat from the mesh structure 234 (e.g., 3D mesh), and flow to the outlet 240. Accordingly, the substance may flow through the mesh structure 234 of the heat exchanger 226 while absorbing heat from the mesh structure 234.

[0045] exist Figure 2 In the example of, the inlet 238 and the outlet 240 are arranged on the same side of the heat exchanger 226. In some examples, the inlet and outlet can be on the same side of the heat exchanger, on different sides, on opposite sides, on adjacent sides, etc. For example, some heat exchangers may have a height constraint (e.g., a restriction) that can limit the placement of the inlet and outlet to one or more sides of the heat exchanger. For example, the height constraint may limit the inlet and / or outlet to be set on the top and / or bottom of the heat exchanger. In some examples, the heat exchanger may have one or more width and / or length constraints that can limit the placement of the inlet and / or outlet to the top, bottom and / or other sides of the heat exchanger. Some examples of the technology described herein can achieve target heat exchange (e.g., cooling), even when the inlet position and / or outlet position are constrained. For example, a pipe structure can transport a substance to a target area, wherein the inlet and / or outlet can be set on any side of the heat exchanger. For example, the piping structure may deliver the coolant to a target area even when the inlet and / or outlet are located on the side or on the same side of the heat exchanger.

[0046] In some examples, a structure (e.g., heat exchanger 226) may include channels between the lattice structure and the inner walls of the flow channel. Figure 2 In the example of , the heat exchanger 226 includes a channel 250 (e.g., an internal channel) between the grid structure 234 and the inner wall 242 of the heat exchanger 226. For example, the channel 250 can be a gap between the outer edge of the grid structure 234 and the inner surface of the shell 230 (in the flow channel 232). Figure 2 The example in also shows a second channel 244, a third channel 246, and a fourth channel 248. Channel 250, second channel 244, third channel 246, and fourth channel 248 can provide similar flow resistance in flow directions (e.g., four flow directions, all flow directions, etc.) from target area 252.

[0047] In some examples, the conduit structure can span (e.g., bridge) a channel within a flow channel. For example, Figure 2 The duct structure 236 is shown spanning the channel 250 from the inner wall 242 to the lattice structure 234 (eg, into the lattice structure 234).

[0048] In some examples, the grid structure can be attached to one or more inner walls of the housing. For example, the grid structure 234 can be attached to the top inner wall and the bottom inner wall of the housing 230. In some examples, the grid structure can be suspended in the flow channel on the pipe structure. For example, the grid structure can be suspended on the pipe structure without contacting one or more inner walls of the housing.

[0049] Figure 3 is a diagram showing an example of a temperature diagram 354 in the dimension of a flow channel. For example, diagram 354 shows Figure 2 The temperature in Kelvin (K) of the flow channel 232 in the spatial dimension of the flow channel 232. Figure 3 As shown in FIG. , the lowest temperature region corresponds to the target region 252 of the flow channel 232 (eg, the target region 252 is as shown in FIG. 2 ). Figure 3 ). In this example, the temperature increases as the material flows outward from one end of the pipe structure 236 through the grid structure 234. Some examples of structures and / or techniques described herein can enhance heat exchanger performance (e.g., reduce temperature drop and / or pressure drop). For example, Figure 2 and Figure 3 The example in shows a lower temperature in the target area (eg, 312.7 K (-0.9 degrees Celsius (° C.)) relative to a heat exchanger without a grid structure or a tube structure.

[0050] Figure 4 is a diagram showing an example of a flow rate diagram 456 in the dimensions of a heat exchanger. For example, Figure 4 For example, Figure 456 shows the flow path of the substance. Figure 2 The spatial dimensions of the heat exchanger 226 are in meters per second (MS -1 ) is the flow rate in units. Figure 4 As shown, the flow rate may be higher in the pipe structure 236, while the flow rate may be lower when passing through the mesh structure 234. For example, the flow rate may be reduced when the material flows through the mesh structure 234 (e.g., and partially around the pipe structure 236). In some examples, relative to a heat exchanger without a mesh structure or a pipe structure, Figure 2 and Figure 4 The method in may result in a reduced pressure drop (eg, 1420 Pascals (PA) (-26.3%)).

[0051] Figure 55 is a block diagram of an example of an apparatus 502 that can be used to manufacture one or more structures described herein. Apparatus 502 can be a computing device, such as a personal computer, a server computer, a printer, a 3D printer, a smart phone, a tablet computer, etc. Apparatus 502 can include and / or can be coupled to a processor 504 and / or a memory 506. Processor 504 can be in electronic communication with memory 506. In some examples, apparatus 502 can communicate with (e.g., be coupled to, have a communication link with) a manufacturing device (e.g., a 3D printing device). In some examples, apparatus 502 can be an example of a 3D printing device. Apparatus 502 may include additional components (not shown), and / or some of the components described herein may be removed and / or modified without departing from the scope of the present disclosure.

[0052] Processor 504 may be any of a central processing unit (CPU), a semiconductor-based microprocessor, a graphics processing unit (GPU), a field programmable gate array (FPGA), an application specific integrated circuit (ASIC), and / or other hardware devices suitable for retrieving and executing instructions stored in memory 506. Processor 504 may fetch, decode, and / or execute instructions (e.g., manufacturing instructions 518) stored in memory 506. In some examples, processor 504 may include an electronic circuit or circuits that include electronic components for performing one or more functions of instructions (e.g., manufacturing instructions 518). In some examples, processor 504 may be used to manufacture instructions related to Figure 1 to Figure 2 and / or Figures 7 and 8 One, some or all of the structures described in one, some or all of the above.

[0053] The memory 506 may be any electronic, magnetic, optical, or other physical storage device that contains or stores electronic information (e.g., instructions and / or data). Thus, the memory 506 may be, for example, a random access memory (RAM), an electrically erasable programmable read-only memory (EEPROM), a storage device, an optical disk, etc. In some implementations, the memory 506 may be a non-transitory tangible machine-readable storage medium, where the term "non-transitory" does not encompass transitory propagating signals.

[0054] In some examples, the apparatus 502 may also include a data memory (not shown) on which the processor 504 may store information. The data memory may be a volatile and / or non-volatile memory, such as a dynamic random access memory (DRAM), an EEPROM, a magnetoresistive random access memory (MRAM), a phase change RAM (PCRAM), a memristor, a flash memory, etc. In some examples, the memory 506 may be included in the data memory. In some examples, the memory 506 may be separate from the data memory. In some methods, the data memory may store instructions and / or data similar to the instructions and / or data stored by the memory 506. For example, the data memory may be a non-volatile memory and the memory 506 may be a volatile memory.

[0055] In some examples, the apparatus 502 may include a communication interface (not shown) through which the processor 504 can communicate with one or more external devices (not shown), for example, to receive and / or store information related to one or more objects to be manufactured (e.g., one or more geometric structures, one or more grids, one or more pipeline structures, etc.). The communication interface may include hardware and / or machine-readable instructions to enable the processor 504 to communicate with one or more external devices. The communication interface may implement a wired and / or wireless connection with one or more external devices. In some examples, the communication interface may also include a network interface card and / or may also include hardware and / or machine-readable instructions to enable the processor 504 to communicate with various input and / or output devices. Examples of input devices may include a keyboard, a mouse, a display, another device, an electronic device, a computing device, etc., through which a user may input instructions into the apparatus 502. In some examples, the apparatus 502 may receive 3D model data 508 from one or more external devices (e.g., a 3D scanner, a removable memory, a network device, etc.).

[0056] In some examples, the memory 506 may store 3D model data 508. The 3D model data 508 may be generated by the apparatus 502 and / or received from another device. Some examples of the 3D model data 508 include one or more CAD files, one or more 3D manufacturing format (3MF) files, object shape data, mesh data, geometric data, etc. The 3D model data 508 may indicate the shape of one or more objects. For example, the 3D model data 508 may indicate the shape of one or more geometric structures (e.g., regular geometric structures and / or irregular geometric structures), one or more mesh structures, and / or one or more pipe structures for manufacturing. In some examples, the 3D model data 508 may indicate the shape of one, some, or all of the one or more geometric structures, one or more meshes, one or more pipe structures, one or more heat exchangers, etc. described herein.

[0057] In some examples, processor 504 can execute manufacturing instructions 518 to control a print head to print a 3D mesh structure. In some examples, processor 504 can control a print head and / or can send instructions to a 3D printer to print a 3D mesh structure.

[0058] In some examples, processor 504 may execute manufacturing instructions 518 to control a print head to print a conduit structure that crosses a 3D mesh structure, wherein the conduit structure is used to conduct a fluid to a target area that includes a portion of the 3D mesh structure.

[0059] In some examples, the 3D mesh structure and the pipe structure are printed simultaneously. Figure 1 As described above, the printed 3D mesh structure and the pipeline structure can be printed simultaneously.

[0060] In some examples, the processor 504 can execute manufacturing instructions 518 to control the print head to print a housing around the grid structure. For example, the housing, grid structure, and / or pipe structure can be printed in the build. The housing can form a flow channel. For example, the housing can include a wall containing the flow channel. In some examples, a fluid (e.g., compressed air, water, etc.) can be passed through the flow housing to remove binder residue and / or unmelted powder.

[0061] In some examples, the 3D grid structure can support the tube structure during sintering. Figure 1 As described, the 3D grid structure can support the pipeline structure. In some examples of metal 3D printing, for example, the 3D grid structure and the pipeline structure can be printed as a precursor object, and then sintered to join the metal particles and burn off the binder. During sintering, some structures may be prone to deformation, gravity collapse, etc. In some examples of the technology described herein, the 3D grid structure can support the pipeline structure during sintering to reduce deformation and / or enhance object manufacturing accuracy. In some examples of furnace sintering, the 3D grid structure can reduce (e.g., prevent) sagging in the pipeline structure due to gravity. In some examples of laser sintering (e.g., SLM, EBM, etc.), the 3D grid structure can reduce (e.g., prevent) deformation in the pipeline structure due to residual stress.

[0062] Figure 6 6 is a flowchart illustrating an example of a method 600 for manufacturing a structure. The method 600 and / or one or more elements of the method 600 may be performed by an apparatus (eg, an electronic device). For example, the method 600 may be performed by Figure 5 The described device 502 is executed.

[0063] The device may determine (602) a union between a 3D grid structure and a geometric representation of a pipe structure. For example, the device may store 3D model data representing the 3D grid structure and 3D model data representing the pipe structure (e.g., or other pipe structures). In some examples, the device may determine (602) the union by determining a combination of the 3D grid structure and the pipe structure in a 3D space. In some examples, the first data representing the 3D grid structure may be a set of voxels in the 3D space, wherein the voxels occupied by the 3D grid structure are marked (e.g., marked with "1"). The second data representing the pipe structure may be a set of voxels in the 3D space, wherein the voxels occupied by the pipe structure are marked (e.g., marked with "1"). Unoccupied voxels may also be indicated (e.g., marked with "0"). In some examples, the union between the geometric representation of the 3D grid structure and the pipe structure may be determined by performing a voxel-level OR operation between the first data and the second data. The resulting voxels marked as occupied (e.g., marked with "1") may indicate a union between the 3D grid structure and the geometric representation of the pipe structure. In some examples, unoccupied voxels within the pipeline structure may be kept unoccupied (e.g.,

[0064] "0"), or can be restored to unoccupied after a voxel-level OR operation (e.g.,

[0065] For example, an AND operation may be performed between the voxels within the 3D grid structure and the conduit structure to avoid setting unoccupied voxels within the conduit structure to occupied (e.g., to avoid partially blocking and / or blocking the conduit structure).

[0066] The device can print 604 a heat exchanger by printing a union between a 3D mesh structure and a geometric representation of a pipe structure (e.g., or other pipe structures), wherein the pipe structure crosses the 3D mesh structure. For example, the device can be a 3D printer and / or can send instructions to the 3D printer to print the 3D mesh structure and the pipe structure. In some examples, the device can utilize a geometric model (e.g., one or more CAD files, one or more 3MF files, etc.) that specifies the shape of the union (e.g., mesh, voxel, etc.). For example, the device can control the print head to print the 3D mesh structure and the pipe structure according to the voxel representing the union between the geometric representation of the 3D mesh structure and the pipe structure (e.g., without printing the voxel that is maintained as unoccupied inside the pipe structure). In some methods (e.g., MJF), the union can be printed with a melting agent and melted using a hot lamp to solidify the 3D mesh structure and the pipe structure. In some methods (e.g., metal jet melting), the union can be printed with a binder (e.g., glue) to form a precursor object (e.g., a "green part"). The precursor object can be heated in a furnace to solidify the 3D mesh structure and the pipe structure. In some examples, the thickness of the conduit structure may be similar to or different than the thickness of the 3D mesh structure.

[0067] In some examples, the apparatus may print a plurality of conduit structures (eg, conduit structures) that intersect a 3D mesh structure in a flow channel of a heat exchanger. For example, the apparatus may print a second conduit structure that intersects a 3D mesh structure in a channel of a heat exchanger.

[0068] Some examples of the technology described herein can provide methods for producing various types of grid structures and / or other heat exchange features. For example, some of the manufacturing methods described herein can be performed on a computing device and / or a 3D printer, which can provide relatively low design and / or manufacturing costs.

[0069] Figure 7 758 is a diagram showing a cross-section of an example of a heat exchanger 758. The heat exchanger 758 may be Figure 1 1. An example of a structure 120 is depicted. In this example, a heat exchanger 758 includes a housing 760, a flow channel 762, a grid structure 764, and a duct structure 766. The heat exchanger 758 can be arranged in a cold plate design, where a heat source can be placed on top of the heat exchanger 758 and / or below the heat exchanger 758.

[0070] The heat exchanger 758 may include an inlet 768 disposed on the housing 760. Figure 7 In the example shown, the inlet 768 protrudes from the housing 760 of the heat exchanger 758 .

[0071] The heat exchanger 758 may include an outlet 770 disposed on the housing 760. Figure 7 In the example shown, the outlet 770 protrudes from the housing 760 of the heat exchanger 758 .

[0072] exist Figure 7 In the example of , the duct structure 766 is disposed through the inlet 768. For example, the heat exchanger 758 may include a duct structure 766 (e.g., a tube) extending through the inlet 768 into the shell 760. The duct structure 766 extends outside the inlet 768 (e.g., outside the inner wall 772). The duct structure 766 extends to a target area 782 in the flow channel 762. One end of the duct structure 766 (e.g., a tube) can be disposed in the target area 782 in the shell 760. The duct structure 766 is embedded in the grid structure 764. For example, the tube can be embedded in the 3D grid. In Figure 7 In the example shown, the duct structure 766 has a funnel or nozzle shape.

[0073] In this example, a substance (e.g., fluid, coolant, water, and / or air, etc.) may flow into the heat exchanger 758 via the inlet 768, flow through the pipe structure 766, flow through the mesh structure 764, and flow out of the heat exchanger 758 via the outlet 770. For example, the fluid may pass from one end of the pipe structure 766 (e.g., pipe) in the target area 782 to absorb heat from the mesh structure 764 (e.g., 3D mesh), and flow to the outlet 770. Accordingly, the substance may flow through the mesh structure 764 of the heat exchanger 758 while absorbing heat from the mesh structure 764.

[0074] exist Figure 7 In the example of FIG. 7 , the heat exchanger 758 includes a channel 780 (eg, an internal channel) between the grid structure 764 and the inner wall 772 of the heat exchanger 758 . For example, Figure 7 The duct structure 766 shown in FIG. 7 spans a channel 780 from the inner wall 772 to the lattice structure 764 (eg, into the lattice structure 764 ).

[0075] Figure 8 884 is a perspective view showing an example of a heat exchanger 884. The heat exchanger 884 may be Figure 1 120. In this example, heat exchanger 884 includes housing 886, inlet 890, and / or outlet 892. In some examples, heat exchanger 884 may include internal flow channels and / or a mesh structure ( Figure 8 ). The heat exchanger 884 may be arranged in a cold plate design, where the heat source may be placed below the heat exchanger 884.

[0076] exist Figure 8 In the example of FIG. 8 , the inlet 890 protrudes from the housing 886 of the heat exchanger 884 (e.g., the top side of the housing 886). Figure 8In the example shown in FIG. 8 , the outlet 892 protrudes on the housing 886 of the heat exchanger 884 (eg, the front side of the housing 886 ).

[0077] In some examples, the inlet can be disposed proximate to the target area. For example, the inlet can be disposed on an exterior of the housing and / or heat exchanger aligned with the target area (e.g., overlapping a line along a dimension of the target area). For example, the inlet can be disposed on a side of the housing wall opposite the target area. Figure 8 In the example of , inlet 890 is disposed on a side of the wall of heat exchanger 884 opposite to target region 894. Placing the inlet near the target region can reduce the distance that the substance travels within the heat exchanger before reaching the target region. Reducing the distance traveled can allow the substance to be delivered to the target region at a target temperature. For example, using an inlet closer to the target region can deliver a cooler fluid to the target region than using an inlet farther away from the target region.

[0078] In this example, a substance (e.g., fluid, coolant, water and / or air, etc.) can flow into the heat exchanger 884 via an inlet 890 and out of the heat exchanger 884 via an outlet 892. For example, the fluid can flow from the inlet 890 to the target area 894 to absorb heat from the mesh structure (e.g., 3D mesh), and flow to the outlet 892.

[0079] In some examples, heat exchanger 884 may not include a conduit structure. For example, a substance may enter heat exchanger 884 (eg, to target region 894) through an inlet without a conduit structure.

[0080] In some examples, the heat exchanger 884 may include a conduit structure ( Figure 8 890). For example, the heat exchanger 884 may include a conduit structure (e.g., a tube) extending through the inlet 890 into the housing 886. The conduit structure may extend beyond the inlet 890 into the target area 894. For example, one end of the conduit structure may be disposed in the target area 894 in the housing 886. The conduit structure may be embedded in a grid structure (e.g., a 3D grid). In some examples, the heat exchanger 884 may or may not include an internal channel along the inner wall.

[0081] Although some examples described herein describe heat exchangers for absorbing heat, some examples of the techniques and structures described herein can be used to radiate heat and / or heat an object or medium. For example, a heated fluid can be transferred into a heat exchanger to radiate heat from the heat exchanger (e.g., to heat a cold engine, to heat air).

[0082] As used herein, the term "and / or" may refer to one or more items. For example, the phrase "A, B, and / or C" may refer to any of the following: A (without B and C), B (without A and C), C (without A and B), A and B (but without C), B and C (but without A), A and C (but without B), or all of A, B, and C.

[0083] Although various examples of systems and methods are described herein, the systems and methods are not limited to these examples. Variations of the examples described herein may be implemented within the scope of the present disclosure. For example, the operations, functions, aspects, or elements of the examples described herein may be omitted or combined.

Claims

1. A heat exchanger, comprising: Flow channel; a grid structure, the grid structure being disposed in the flow channel; as well as A pipeline structure is embedded in the grid structure, wherein one end of the pipeline structure is arranged in a target area of ​​the flow channel.

2. The heat exchanger of claim 1, wherein the grid structure is a three-dimensional (3D) grid.

3. The heat exchanger according to claim 2, wherein the grid structure and the pipe structure are 3D printed. 4 . The heat exchanger according to claim 1 , further comprising a second pipe structure embedded in the grid structure, wherein a second end of the second pipe structure is disposed in a second target area of ​​the flow channel.

5. The heat exchanger of claim 1, further comprising an inlet, wherein the conduit structure is disposed through the inlet.

6. The heat exchanger of claim 5, wherein the inlet is disposed on a side of a wall of the heat exchanger opposite to the target area.

7. The heat exchanger of claim 1, further comprising a channel between the grid structure and an inner wall of the flow channel.

8. The heat exchanger of claim 1, wherein the target area corresponds to a heat source location.

9. The heat exchanger of claim 1, wherein the tube structure crosses the grid structure.

10. A heat exchanger, comprising: case; an outlet disposed on the housing; an inlet disposed on the housing; a conduit extending through the inlet into the housing; as well as A three-dimensional (3D) grid is disposed in the housing, wherein the conduit is embedded in the 3D grid. 11 . The heat exchanger according to claim 10 , wherein one end of the pipe is disposed in a target area in the housing.

12. The heat exchanger of claim 11, wherein fluid will pass from one end of the tube in the target area to absorb heat from the 3D grid and flow to the outlet.

13. A device, comprising: Memory; a processor in electronic communication with the memory, wherein the processor is configured to: Controlling the print head to print a three-dimensional (3D) grid structure; as well as The print head is controlled to print a channel structure that crosses the 3D grid structure, wherein the channel structure is used to conduct a fluid to a target area including a portion of the 3D grid structure.

14. The apparatus of claim 13, wherein the 3D mesh structure and the conduit structure are printed simultaneously.

15. The apparatus of claim 13, wherein the processor is configured to control the print head to print a shell around the grid structure.

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