Inspection apparatus and inspection method

Abstract

Provided is an inspection apparatus for inspecting a device to be inspected, the device to be inspected being a rear-surface-irradiation-type imaging device formed on an object to be inspected, light being able to be incident on the imaging device from a rear surface of the imaging device, which is a surface on the opposite side from the side on which a wiring layer is provided, and light being able to be emitted from the rear surface of the imaging device to the object to be inspected. The inspection apparatus includes a mounting table that supports the object to be inspected so as to face the rear surface of the imaging device, the mounting table having: a transparent mounting surface on which the object to be inspected is mounted; and an irradiation unit disposed below the placement surface, the irradiation unit irradiating light to the object to be inspected placed on the placement surface, the irradiation unit having: a light guide plate having an opposing surface opposing the object to be inspected across the placement surface; and a light source unit which is provided in a region on the lateral outer side of the light guide plate and which is capable of emitting light toward a side end surface of the light guide plate, the light guide plate emitting light emitted from the light source unit and incident from the side end surface of the light guide plate from the facing surface to the placement surface, the placement table further comprising an optical member, and an optical member that transmits light from the facing surface of the light guide plate to the object to be inspected placed on the placement surface, the optical member being divided into a plurality of regions and configured so that the light transmittance can be changed for each of the regions.

Description

Technical Field

[0001] The invention relates to an inspection device and an inspection method. Background Art

[0002] The inspection device of Patent Document 1 inspects the imaging device by causing light to enter the imaging device formed on the inspection object and by causing the contact terminal to electrically contact the wiring layer of the imaging device. In Patent Document 1, light enters the imaging device from the back side of the imaging device, which is the side opposite to the side where the wiring layer is provided. The inspection device of Patent Document 1 includes: a mounting table formed by a light-transmitting component, the mounting table mounting the inspection object in a manner opposite to the back side of the imaging device; and a light irradiation mechanism having a plurality of LEDs directed toward the inspection object, the light irradiation mechanism being arranged in a manner opposite to the inspection object across the mounting table.

[0003] Prior art literature

[0004] Patent Literature

[0005] Patent Document 1: Japanese Patent Application Publication No. 2019-106491 Summary of the invention

[0006] Technical problem to be solved by the invention

[0007] The technology of the present invention can irradiate the inspection object with planar light that is uniform within the surface when a side-incident type irradiation unit is used for inspection of a back-illuminated imaging device.

[0008] Technical solutions for solving technical problems

[0009] One embodiment of the present invention is an inspection device for inspecting an inspection object device, wherein the inspection object device is a back-illuminated imaging device formed on an inspection object body, and light can be incident on the imaging device from the back side of the surface of the imaging device on the opposite side of the side where a wiring layer is provided. The inspection device includes a mounting table, which supports the inspection object in a manner opposite to the back side of the imaging device, and the mounting table has: a transparent mounting surface for mounting the inspection object; and an irradiation unit arranged below the mounting surface, which irradiates light to the inspection object mounted on the mounting surface, and the irradiation unit has : A light guide plate having an opposite surface opposite to the inspection object across the loading surface; and a light source portion, which is arranged in an area on the outside of the side of the light guide plate and can emit light to the side end surface of the light guide plate, the light guide plate emits light emitted from the light source portion and incident from the side end surface of the light guide plate from the opposite surface to the loading surface, the loading table also has an optical component that allows light from the opposite surface of the light guide plate to pass (i.e., transmit) to the inspection object loaded on the loading surface, the optical component is divided into a plurality of areas and is configured to be able to change the transmittance (i.e., light transmittance or light transmittance) according to each of the areas.

[0010] Effects of the Invention

[0011] According to the present invention, when a side-incident type irradiation unit is used for inspection of a back-illuminated imaging device, it is possible to irradiate an inspection object with planar light that is uniform within a plane. BRIEF DESCRIPTION OF THE DRAWINGS

[0012] Figure 1 It is a plan view schematically showing the structure of a substrate as an inspection object on which a back-illuminated imaging device is formed.

[0013] Figure 2 It is a cross-sectional view schematically showing the structure of a back-illuminated imaging device.

[0014] Figure 3 It is a perspective view schematically showing the structure of a probe as the inspection device according to the present embodiment.

[0015] Figure 4 It is a front view schematically showing the structure of a probe as the inspection device according to the present embodiment.

[0016] Figure 5 It is a perspective view schematically showing the internal structure of the storage room.

[0017] Figure 6 It is a cross-sectional view schematically showing the structure of the stage.

[0018] Figure 7It is a partially enlarged cross-sectional view of a liquid crystal panel.

[0019] Figure 8 This is a partially enlarged cross-sectional view of another example of a liquid crystal panel.

[0020] Fig. 9 This is a diagram showing another example of the position of the liquid crystal panel within the stage. DETAILED DESCRIPTION

[0021] In the semiconductor manufacturing process, a plurality of semiconductor devices having a predetermined circuit pattern are formed on a substrate such as a semiconductor wafer (hereinafter referred to as a "wafer"). The formed semiconductor devices are inspected for electrical characteristics and the like and sorted into qualified products and unqualified products. The inspection of semiconductor devices is performed, for example, on the substrate before each semiconductor device is divided using an inspection device such as a prober (also called a probe device).

[0022] The probe card of the inspection device is arranged above a stage supporting a substrate, and the probe card has a plurality of probes as needle-shaped contact terminals. When inspecting, the probe card is brought close to the wafer on the stage, and each probe of the probe card contacts each electrode of the semiconductor device formed on the substrate. In this state, an electrical signal is supplied to the semiconductor device via each probe from a test head arranged on the upper part of the probe card. Then, based on the electrical signal received from the semiconductor device by the test head via each probe, it is distinguished whether the semiconductor device is a defective product.

[0023] When the semiconductor device to be inspected is an imaging device such as a CMOS sensor, unlike other general semiconductor devices, the inspection is performed while irradiating light to the imaging device.

[0024] In recent years, as an imaging device, a back-illuminated type imaging device that receives light incident from the back side opposite to the front side where a wiring layer is formed has been developed.

[0025] In an inspection device for inspecting a back-illuminated imaging device, the mounting table supports a substrate so as to face the back surface of the imaging device. In addition, in an inspection device for inspecting a back-illuminated imaging device, the mounting table has: a transparent mounting surface on which the substrate can be mounted; and an irradiation unit disposed below the mounting surface, the irradiation unit being capable of irradiating light toward the substrate mounted on the mounting surface.

[0026] The irradiation part includes, for example: a light guide plate having an opposing surface opposite to the substrate across the mounting surface; and a light source part, which is provided in an area on the outside of the side of the light guide plate and can emit light toward the side end surface of the light guide plate. In addition, in the irradiation part, the light guide plate reflects the light emitted from the light source part and incident from the side end surface of the light guide plate toward the above-mentioned opposing surface through a reflective dot structure or the like, and emits (i.e., emits) light in the form of a plane from the opposing surface. The plane light is irradiated onto the substrate mounted on the mounting surface. In addition, hereinafter, the irradiation part into which the light is incident from the side end surface of the light guide plate as described above is referred to as a side-incident type irradiation part.

[0027] In addition, when the substrate is irradiated with planar light during inspection, it is preferred that the planar light be uniform within the plane. When a side-incident irradiation unit is used, as a method for making the planar light uniform within the plane, a method for adjusting the intensity of the light incident on the side end surface of the light guide plate, a method for adjusting the size and arrangement of the above-mentioned reflection points of the light guide plate, etc. can be considered. However, using these methods, it is difficult to derive the conditions for making the planar light uniform within the plane, that is, it is difficult to make the planar light uniform within the plane.

[0028] Therefore, the technology of the present invention can irradiate the inspection object with planar light that is uniform within the surface when using a side-illuminated irradiator in the inspection of a back-illuminated imaging device.

[0029] Hereinafter, the inspection device and the inspection method of the present embodiment will be described with reference to the drawings. In addition, in this specification and the drawings, the same reference numerals are attached to elements having substantially the same functional configuration, and repeated descriptions are omitted.

[0030] In the technology of the present embodiment, since the device to be inspected is a back-illuminated imaging device, the back-illuminated imaging device will be described first.

[0031] [Back-illuminated camera]

[0032] Figure 1 is a plan view schematically showing the structure of a substrate as an inspection object on which a back-illuminated imaging device is formed. Figure 2 It is a cross-sectional view schematically showing the structure of a back-illuminated imaging device.

[0033] like Figure 1 As shown in FIG. 1 , a plurality of back-illuminated imaging devices D are formed on a substantially disk-shaped wafer W as an example of a substrate.

[0034] The back-illuminated imaging device D is a solid-state imaging element, such as Figure 2As shown, it has a photoelectric conversion unit PD as a photodiode and a wiring layer PL including a plurality of wirings PLa. In addition, light is incident on the back side of the wafer W to the back side illumination type imaging device D, wherein the back side of the wafer W is the surface on the opposite side to the side (i.e., the front side) where the wiring layer PL is provided. The back side illumination type imaging device D receives the light incident from the back side of the wafer W by the photoelectric conversion unit PD via the on chip lens L and the color filter F. The color filter F includes a red filter FR, a blue filter FB, and a green filter FG.

[0035] In addition, an electrode E is formed on the front side Da of the back-illuminated imaging device D, that is, the front side of the wafer W, and the electrode E is electrically connected to the wiring PLa of the wiring layer PL. The wiring PLa is used to input an electrical signal to a circuit element inside the back-illuminated imaging device D, or output an electrical signal from the circuit element to the outside of the back-illuminated imaging device D. The wiring layer PL may include a pixel transistor that controls a signal related to the photoelectric conversion unit.

[0036] [Inspection device]

[0037] Next, the inspection device according to the present embodiment will be described.

[0038] Figure 3 and Figure 4 1 and 2 are a perspective view and a front view respectively showing a schematic structure of a probe 1 as an inspection device of the present embodiment. Figure 4 In order to express Figure 3 Components built into the storage chamber and loading device of the detector 1 described later are partially shown in cross section.

[0039] The probe 1 inspects the electrical characteristics of each of a plurality of back-illuminated imaging devices D (hereinafter, sometimes simply referred to as imaging devices D) formed on a wafer W. Figure 3 and Figure 4 As shown, the probe 1 includes a storage chamber 2, a loading device 3 arranged adjacent to the storage chamber 2, and a tester 4 arranged to cover the storage chamber.

[0040] The storage chamber 2 is a housing having a hollow interior and has a stage 10 as a mounting table. As described later, the stage 10 supports the wafer W so that the back surface of the imaging device D faces the stage 10 .

[0041] The stage 10 is configured to be movable in the horizontal and vertical directions, and can adjust the relative position of a probe card 11 and a wafer W to bring electrodes E on the surface (front face) of the wafer W into contact with probes 11 a of the probe card 11 .

[0042] A probe card 11 is disposed above the stage 10 in the storage chamber 2 so as to face the stage 10. The probe card 11 has a plurality of needle-shaped probes 11a as contact terminals. Each probe 11a is formed to be contactable with a corresponding electrode E on the surface of the wafer W.

[0043] The probe card 11 is connected to the tester 4 via the interface 12. When inspecting the imaging device D, each probe 11a contacts the corresponding electrode E, supplies power input from the tester 4 via the interface 12 to the imaging device D, or transmits a signal from the imaging device D to the tester 4 via the interface 12.

[0044] The sensor bridge 30 and the advancing and retreating mechanism 33 disposed in the storage chamber 2 will be described later.

[0045] The loader 3 takes out the wafer W stored in a FOUP (not shown) as a transport container and transports it to the stage 10 of the storage chamber 2. In addition, the loader 3 receives the wafer W after the inspection of the electrical characteristics of the imaging device D from the stage 10 and stores it in the FOUP.

[0046] The loading device 3 has a control unit 13 that performs various controls, etc. The control unit 13 is composed of, for example, a computer including a processor such as a CPU, a memory, etc., and has a program storage unit. The program storage unit stores a program that controls the actions of the various structural parts of the detector 1 during the electrical characteristics inspection and the illumination distribution acquisition process described later. The above program also performs the calculations required for the electrical characteristics inspection and the illumination distribution acquisition process. In addition, the above program can also be recorded in a computer-readable storage medium and installed in the control unit 13 from the storage medium. The above storage medium can be a storage medium that stores data temporarily or a storage medium that stores data non-temporarily.

[0047] The control unit 13 is connected to the stage 10 via a wiring 14 and to the tester computer 16 via a wiring 15. The control unit 13 controls the operation of the light source unit 52 of the stage 10 described later based on an input signal from the tester computer 16. The control unit 13 may also be provided in the storage room 2.

[0048] The tester 4 has a test board (not shown) for reproducing a part of the circuit structure of the main board on which the imaging device D is mounted. The test board is connected to the tester computer 16. The tester computer 16 determines whether the imaging device D is qualified based on the signal from the imaging device D. In the tester 4, by replacing the test board, the circuit structure of various main boards can be reproduced.

[0049] Furthermore, the detector 1 includes a user interface 17. The user interface 17 is used to display information to the user or allow the user to input instructions, and is composed of, for example, a display panel having a touch panel, a keyboard, and the like.

[0050] In the probe 1 having the above-mentioned components, when inspecting the electrical characteristics of the imaging device D, the tester computer 16 sends data to a test board connected to the imaging device D via the probes 11a. The tester computer 16 determines whether the sent data is correctly processed by the test board based on the electrical signal from the test board.

[0051] [Internal structure of storage room 2]

[0052] Next, use Figure 5 The internal structure of the storage chamber 2 will be further described. Figure 5 It is a perspective view schematically showing the internal structure of the storage room 2 .

[0053] As shown in the figure, in the storage room 2, the stage 10 includes: an X-direction moving unit 21, which is arranged on the base 20 and can move along the X direction in the figure; a Y-direction moving unit 22, which can move along the Y direction in the figure; and a Z-direction moving unit 23, which can move along the Z direction in the figure. These X-direction moving unit 21, Y-direction moving unit 22 and Z-direction moving unit 23 constitute a moving mechanism that moves the stage 10 relative to the illumination sensor 32 described later.

[0054] The X-direction moving unit 21 moves the stage 10 in the X-direction along the guide rail 21a extending in the X-direction by rotating the ball screw 21b. The ball screw 21b is rotated by the drive of a motor (not shown). In addition, the movement amount of the stage 10 can be detected by an encoder (not shown) combined with the motor.

[0055] The Y-direction moving unit 22 moves the stage 10 in the Y direction along the guide rail 22a extending in the Y direction by rotating the ball screw 22b. The ball screw 22b is rotated by the drive of the motor 22c. In addition, the movement amount of the stage 10 can be detected by the encoder 22d combined with the motor 22c.

[0056] With the above configuration, the X-direction moving unit 21 and the Y-direction moving unit 22 move the stage 10 in the X-direction and the Y-direction that are orthogonal to each other along the horizontal plane.

[0057] The Z-direction moving unit 23 has a motor and an encoder (not shown), and can move the stage 10 up and down along the Z direction and detect the amount of movement. The Z-direction moving unit 23 moves the stage 10 toward the probe card 11 so that the electrodes of the imaging device D formed on the wafer W come into contact with the probes. In addition, the stage 10 is configured on the Z-direction moving unit 23 to be rotatable in the θ direction in the figure by driving a motor (not shown).

[0058] Furthermore, a lower imaging unit 24 is disposed inside the storage room 2 .

[0059] The lower imaging unit 24 photographs the probes 11a formed on the probe card 11. The lower imaging unit 24 includes a lower camera (not shown) such as a CMOS (Complementary Metal Oxide Semiconductor) camera and an optical system (not shown) for guiding light from the photographed object to the lower camera. The lower imaging unit 24 photographs the probes 11a formed on the probe card 11 using the lower camera, and the photographed result is output to the control unit 13, for example, to align the electrodes on the wafer W with the probes 11a.

[0060] The lower imaging unit 24 is fixed to the stage 10 , and moves in the X direction, the Y direction, and the Z direction together with the stage 10 .

[0061] A sensor bridge 30 as a mounting portion is disposed vertically between the stage 10 and the probe card 11 inside the storage chamber 2. The sensor bridge 30 is provided with an upper camera 31 as an imaging portion and an illuminance sensor 32 as an illuminance measuring portion.

[0062] The upper camera 31 is used to photograph the wafer W, etc., and is composed of, for example, a CMOS camera, etc. The upper camera 31 may be provided with an optical system similar to the lower camera.

[0063] The illumination sensor 32 is used to obtain the illumination of the wafer W on the mounting surface 40a (see below) of the stage 10. Figure 6 The illumination sensor 32 measures the illumination of light from a portion of the mounting surface. In the following description, the area of ​​the mounting surface (hereinafter referred to as a "unit sensor area") where the illumination sensor 32 measures the illumination in one measurement is an area corresponding to one imaging device D.

[0064] The image capturing result of the upper camera 31 and the measurement result of the illuminance sensor 32 are output to the control unit 13 .

[0065] The sensor bridge 30 is provided with an advance and retreat mechanism 33 (see Figure 4). The advance / retract mechanism 33 includes: a guide rail 33a that guides the advance / retract of the sensor bridge 30; and a drive unit 33b that is composed of a combination of a motor and a ball screw, etc., to drive the sensor bridge 30 to move along the guide rail 33a. The sensor bridge 30, that is, the illuminance sensor 32 moves forward / retract relative to the area opposite to the loading surface of the stage 10 through the advance / retract mechanism 33. Specifically, the illuminance sensor 32 moves between an area on the outside of the loading surface of the stage 10 when viewed from above and a predetermined area opposite to the above loading surface through the advance / retract mechanism 33.

[0066] [Stage 10]

[0067] Next, the structure of the stage 10 will be described. Figure 6 It is a cross-sectional view schematically showing the structure of the stage 10 . Figure 7 It is a partially enlarged cross-sectional view of a liquid crystal panel described later.

[0068] The stage 10 supports the wafer W in such a manner that the back side of the imaging device D faces the stage 10, for example, Figure 6 As shown, there are a top plate 40 , an illuminating portion 50 , a liquid crystal panel 60 and a base 70 .

[0069] The top plate 40 is a flat plate-shaped member made of a light-transmitting material, and its upper surface 40a serves as a mounting surface for mounting the wafer W. The top plate 40 diffuses and transmits the light emitted from the irradiation unit 50 toward the wafer W and transmitted through the liquid crystal panel 60, for example. That is, the top plate 40 is formed so as to function as a diffusion plate, for example. In addition, the top plate 40 is formed in a square shape, for example, in which the length of one side is greater than the diameter of the wafer W in a plan view.

[0070] The “light-transmitting material” mentioned above is a material that transmits light having a wavelength within the inspection range (that is, light from the irradiation unit 50 ), and is, for example, glass.

[0071] The irradiation unit 50 is placed below the placement surface of the stage 10, and irradiates light toward the wafer W placed on the placement surface. In this example, the irradiation unit 50 is arranged below the top plate 40 whose upper surface 40a serves as the placement surface, and irradiates light toward the wafer W placed on the upper surface 40a. In addition, hereinafter, the upper surface 40a of the top plate 40 is sometimes referred to as the placement surface 40a.

[0072] The irradiation unit 50 includes, for example, a light guide plate 51 and a light source unit 52 .

[0073] The light guide plate 51 is a member formed in the shape of a plate, for example, and having an opposing surface 51a opposing the wafer W. The placement surface 40a is located between the wafer W and the opposing surface 51a of the light guide plate 51. The shape and size of the light guide plate 51 in a plan view are, for example, the same as those of the top plate 40. The light guide plate 51 reflects and diffuses light emitted from the light source unit 52 and incident from the side end surface of the light guide plate 51, and emits the light from the opposing surface 51a as planar light. The light guide plate 51 is arranged so that the imaging device formation region of the wafer W is included in the region where the planar light is emitted in a planar view.

[0074] The light source unit 52 is provided in a lateral outer region of the light guide plate 51, and emits light toward the side end surface of the light guide plate 51. The light source unit 52 includes, for example, a plurality of LEDs (not shown) provided along each side of the light guide plate 51.

[0075] In addition, in this embodiment, in order to release the heat of the LED of the light source unit 52 to the outside of the stage 10, a heat sink 53 is provided on the back of a circuit board (not shown) supporting the LED. The heat sink 53 is formed of, for example, a metal material. A path for a refrigerant such as water for cooling the LED of the light source unit 52 may also be formed on the heat sink 53.

[0076] The liquid crystal panel 60 is an example of an optical component that transmits light from the above-mentioned opposite surface 51a of the light guide plate 51 to the wafer W placed on the placement surface 40a, and is divided into a plurality of regions, and is configured to be able to change the light transmittance (light transmittance) for each region (hereinafter referred to as a device region). Specifically, for example, Figure 7 As shown, the liquid crystal panel 60 has a liquid crystal layer 61 and glass substrates 62 and 63 that sandwich and seal the liquid crystal layer 61, and polarizing plates 64 and 65 are provided on the glass substrates 62 and 63 on the opposite side of the liquid crystal layer 61. In addition, in the liquid crystal panel 60, transparent electrodes (not shown) are respectively formed on the glass substrates 62 and 63 for each of the above-mentioned element regions. By changing the voltage applied between the transparent electrodes for each element region, the transmittance of each element region can be adjusted. A circuit (not shown) including a power supply for applying voltage to the above-mentioned transparent electrodes is controlled by the control unit 13. That is, the transmittance of the liquid crystal panel 60 is controlled by the control unit 13.

[0077] In the detector 1, light emitted from the LED of the light source section 52 of the irradiation section 50 and incident from the side end surface of the light guide plate 51 is reflected and diffused inside the light guide plate 51, and is emitted as planar light from the opposite surface 51a opposite to the wafer W. Then, the planar light is incident on the imaging device D of the wafer W, for example, through the liquid crystal panel 60 and the top plate 40.

[0078] The LED of the light source unit 52 emits light including light of a wavelength within the inspection range. The light of a wavelength within the inspection range may be light of a wavelength in the visible light region, or may be light outside the visible light region such as infrared rays depending on the type of the imaging device D.

[0079] The base 70 is arranged at a position opposite to the wafer W on the mounting surface 40a, that is, below the light guide plate 51, and supports the top plate 40, the liquid crystal panel 60, and the irradiation unit 50. The top plate 40, the liquid crystal panel 60, and the light guide plate 51 are located between the base 70 and the wafer W. For example, the top plate 40 is held on the liquid crystal panel 60 by bonding with a transparent adhesive material, the liquid crystal panel 60 is held on the irradiation unit 50 by bonding with a transparent adhesive material, and the irradiation unit 50 is held on the base 70 by bonding with an adhesive material.

[0080] The susceptor 70 may be provided with a temperature adjustment unit (not shown) for adjusting the temperature of the imaging device D of the wafer W placed on the placement surface 40a. The temperature adjustment unit may be provided with at least one of a heater for heating the wafer W (e.g., a resistance heating heater) and a structure for cooling the wafer W (e.g., a flow path of a cooling refrigerant).

[0081] [Illuminance distribution acquisition and transmittance determination processing]

[0082] Next, the illumination distribution acquisition and transmittance determination processing performed by the detector 1 will be described. The illumination distribution acquisition and transmittance determination processing is a process of acquiring the in-plane distribution of the illumination of the light irradiated via the mounting surface 40a of the stage 10 and determining the transmittance of the liquid crystal panel 60, and is performed, for example, when the detector 1 is started, maintained, or during quality control (QC).

[0083] In the illumination distribution acquisition and transmittance determination process, first, the stage 10 can be moved to a predetermined position and a predetermined height in a horizontal plane by the X-direction moving unit 21, the Y-direction moving unit 22, and the Z-direction moving unit 23. The predetermined position is, for example, a position corresponding to one of a plurality of imaging devices formed on the wafer W, that is, a position corresponding to a unit sensor area of ​​the mounting surface 40a.

[0084] In parallel with the movement of the stage 10 or before or after the movement, the sensor bridge 30 is moved by the advancing and retreating mechanism 33 so that the sensor bridge 30 is located in the area above the stage 10 after the movement.

[0085] Next, in a state where (each element region of) the liquid crystal panel 60 is adjusted to a predetermined transmittance (e.g., 50%), the irradiation unit 50 of the stage 10 is controlled to emit planar light from the above-mentioned opposing surface 51a of the light guide plate 51. In addition, at this time, the irradiation unit 50 of the stage 10 is controlled to operate (work) under the same conditions as during inspection, that is, the conditions under which light close to the required illuminance can be irradiated to the wafer W in a state where each element region of the liquid crystal panel 60 has the above-mentioned predetermined transmittance. As a result, light can be irradiated upward from the mounting surface 40a of the stage 10. And the illuminance of the light irradiated from one unit sensor region of the mounting surface 40a is measured by the illuminance sensor 32. Thereafter, the movement of the stage 10 by the X-direction moving unit 21 and the Y-direction moving unit 22 and the measurement of the illuminance by the illuminance sensor 32 are repeated. As a result, the illuminance of the light from each unit sensor region can be measured for all portions of the mounting surface 40a corresponding to at least the imaging device formation region of the wafer W. Based on the measurement result, the control unit 13 can acquire the in-plane distribution of the illuminance of the light irradiated via the placement surface 40 a .

[0086] Next, the control unit 13 determines the light transmittance of each element region of the liquid crystal panel 60. Specifically, the control unit 13 determines the light transmittance of each element region of the liquid crystal panel 60 to eliminate or alleviate the in-plane uniformity of the in-plane distribution of the illuminance of the acquired light, that is, to make the in-plane distribution of the illuminance of the light irradiated through the mounting surface 40a uniform in the plane.

[0087] After the transmittance of each element region of the liquid crystal panel 60 is changed to the determined value, the illumination sensor 32 may be used to perform measurement again to obtain the in-plane distribution of the illumination of the light irradiated via the mounting surface 40a. Furthermore, if the obtained result does not become the required result, the transmittance of each element region of the liquid crystal panel 60 determined may be adjusted based on the obtained result. The above-mentioned acquisition of the in-plane distribution of the illumination of the light irradiated via the mounting surface 40a and the adjustment of the transmittance of the liquid crystal panel 60 may be repeated until the required in-plane distribution is obtained.

[0088] [Example 1 of inspection process]

[0089] Next, an example of inspection processing performed on the wafer W using the probe 1 is described. In the following description, it is assumed that one imaging device D is inspected in one inspection. However, a plurality of imaging devices D may be inspected at once in one inspection using the probe 1. The following inspection processing is performed under the control of the control unit 13.

[0090] For example, first, a wafer W is taken out from a FOUP of the loader 3 and transported into the storage chamber 2. The wafer W is placed on the placement surface 40a of the stage 10 in such a manner that the back surface of the imaging device D formed on the wafer W faces the stage 10 and the back surface of the wafer W abuts against the stage 10.

[0091] Next, the stage 10 is moved by a moving mechanism including the X-direction moving unit 21 and the like, and the probe 11 a provided above the stage 10 comes into contact with the electrode E of the imaging device D to be inspected.

[0092] The irradiation of light from the irradiation unit 50 is performed under predetermined conditions. Thus, for example, all LEDs of the light source unit 52 are turned on, and light from each LED is incident on the side end surface of the light guide plate 51. The incident light is reflected and diffused toward the mounting surface 40a inside the light guide plate 51, and is emitted in a planar shape from the opposite surface 51a of the light guide plate 51 that is opposite to the wafer W.

[0093] The light emitted in a planar manner from the above-mentioned relative surface 51a passes through the liquid crystal panel 60 adjusted to a transmittance determined by the illumination distribution acquisition and transmittance determination processing, diffuses in the top plate 40 while passing through the top plate 40, and is incident on the chip W, that is, on the imaging device D of the inspection object.

[0094] Along with the irradiation of light, a signal for inspection is input to the probe 11a. In this way, the inspection of the imaging device D is performed.

[0095] In the above inspection, the temperature of the chip W is measured by a temperature measuring mechanism (not shown), and based on the result, a temperature regulating unit (not shown) provided on the base 70 is controlled to adjust the temperature of the chip W to a required (expected) value, thereby adjusting the temperature of the imaging device D to a required value.

[0096] Thereafter, the same process as described above is repeated until the inspection of all imaging devices D is completed.

[0097] [Main effects of this embodiment]

[0098] As described above, in this embodiment, the probe 1 includes the stage 10 that supports the wafer W so as to face the back surface of the back-illuminated imaging device D, and the stage 10 includes: a transparent mounting surface 40a on which the wafer W can be mounted; and an irradiation unit 50 that is disposed below the mounting surface 40a and can irradiate light toward the wafer W mounted on the mounting surface 40a. In addition, the irradiation unit 50 includes: a light guide plate 51 that includes an opposing surface 51a that faces the wafer W across the mounting surface 40a; and a light source unit 52 that is provided in a region on the lateral outer side of the light guide plate 51 and emits light toward the side end surface of the light guide plate 51. The light guide plate 51 emits light emitted from the light source unit 52 and incident from the side end surface of the light guide plate 51 in a planar manner from the opposing surface 51a toward the mounting surface 40a. Furthermore, the stage 10 further includes a liquid crystal panel 60 that transmits light from the opposite surface 51a of the light guide plate 51 to the wafer W placed on the placement surface 40a. The liquid crystal panel 60 is divided into a plurality of element regions, and is configured to be able to change the transmittance for each element region. Therefore, in this embodiment, by acquiring the in-plane distribution of the illuminance of the light from the placement surface 40a and adjusting the transmittance of the liquid crystal panel 60 for each element region based on the acquisition result, the in-plane distribution of the illuminance of the light from the placement surface 40a can be made uniform in the plane, specifically, the in-plane distribution of the illuminance of the light from the placement surface 40a can be made uniform in the plane at a required illuminance. That is, according to this embodiment, when the side-incident type irradiation unit 50 is used in the inspection of the back-illuminated imaging device D, the wafer W can be irradiated with planar light that is uniform in the plane, specifically, the wafer W can be irradiated with planar light that is uniform in the plane at a required intensity. When inspecting the imaging devices D formed on the wafer W, if the wafer W is irradiated with planar light uniform within the surface at a required intensity, the deviation between the intensity of the light irradiated to the imaging devices D and the required intensity can be suppressed for each imaging device D. As a result, each imaging device D can be inspected accurately.

[0099] In addition, in this embodiment, the side-incident type irradiation unit 50 is used, and the light source unit 52 of the irradiation unit 50 does not overlap with the light guide plate 51 in a plan view. Therefore, even if a heater is provided on the base 70, the light source unit 52 (specifically, the LED included in the light source unit 52) ​​is not easily affected by the heat generated by the heater.

[0100] Furthermore, in the structure of the detector 1 of the present embodiment, the intensity of the light irradiated to the imaging device D can be roughly adjusted by the power supplied to the light source unit 52 (specifically, the current supplied to the LED of the light source unit 52), and finely adjusted by the light transmittance of the liquid crystal panel 60. Therefore, according to the present embodiment, the intensity of the light irradiated to the imaging device D can be adjusted in a wide range (for example, 0.01 lx to 10000 lx) and with high resolution (for example, 0.1%).

[0101] In addition, when the irradiation intensity of the light irradiated to the imaging device D is adjusted only by the current supplied to the LED of the light source unit 52, it is difficult to make the in-plane distribution of the illuminance of the light from the mounting surface 40a uniform within the plane, and a large amount of power is required to be able to adjust it over a wide range and with high resolution. In the embodiment of the present invention, however, in which the light transmittance of the liquid crystal panel 60 is also used, since the irradiation intensity of the light irradiated to the imaging device D can be adjusted over a wide range and with high resolution, a large amount of power is not required, which is superior in terms of cost.

[0102] [Other examples of inspection processing]

[0103] Next, another example of the inspection process of the wafer W using the probe 1 is described. In addition, the description of the same parts as those of the above-mentioned example 1 of the inspection process is omitted. In addition, in the following description, one imaging device D is inspected in one inspection. However, a plurality of imaging devices D may be inspected at once in one inspection using the probe 1. And, the following inspection process is performed under the control of the control unit 13.

[0104] For example, similarly to Example 1 of the inspection process, the wafer W is mounted on the mounting surface 40a of the stage 10, and then the probe 11a comes into contact with the electrode E of the imaging device D to be inspected.

[0105] Then, as in Example 1 of the inspection process, the irradiation of light from the irradiation unit 50 is performed under predetermined conditions. Thus, light can be emitted in a planar manner from the opposing surface 51a of the light guide plate 51 that is opposed to the wafer W. However, the difference from Example 1 of the inspection process is that the transmittance of the liquid crystal panel 60 is adjusted so that only a specific element area among a plurality of element areas of the liquid crystal panel 60 allows light to pass. Specifically, only the element area corresponding to the imaging device D to be inspected in the liquid crystal panel 60 is adjusted to the transmittance determined in the illumination distribution acquisition and transmittance determination process, and the transmittance of the other element areas is 0%, that is, the other element areas are in a light shielding state. Therefore, among the light emitted in a planar manner from the above-mentioned opposing surface 51a, the light that passes through the liquid crystal panel 60 and the top plate 40 is only the light that enters the element area corresponding to the imaging device D to be inspected of the liquid crystal panel 60. Therefore, light can be irradiated to the wafer W only from the area corresponding to the imaging device D to be inspected on the mounting surface 40a. That is, only the imaging device D to be inspected in the wafer W can be partially irradiated with light.

[0106] Along with the irradiation of light, a signal for inspection is input to the probe 11a. Thus, the imaging device D can be inspected.

[0107] As described above, according to the probe 1, it is also possible to partially irradiate light only to the imaging device D to be inspected in the wafer W.

[0108] [Another example of a liquid crystal panel]

[0109] Figure 8 This is a partially enlarged cross-sectional view of another example of a liquid crystal panel.

[0110] Figure 8 The liquid crystal panel 60A and Figure 7 The difference of the liquid crystal panel 60 is that a filter substrate (an example of a filter component) 100 is provided between the glass substrate 62 and the liquid crystal layer 61, and a plurality of filters F1, F2, and F3 that transmit different wavelengths are formed on the filter substrate 100 in a manner corresponding to the element regions. For example, the filter (also referred to as a filter) F1 transmits only the wavelength of red (R), the filter F2 transmits only the wavelength of green (G), and the filter F3 transmits only the wavelength of blue (B).

[0111] By using this liquid crystal panel 60A, it is possible to irradiate the imaging device D with light of any one of a plurality of mutually different wavelengths using a single light source, without using a plurality of light sources that emit light of mutually different wavelengths.

[0112] (Variation Example)

[0113] Fig. 9 It is a diagram showing another example of the position of the liquid crystal panel 60 on the stage.

[0114] In the above example, the liquid crystal panel 60 is provided below the top plate 40 which functions as a diffuser. Fig. 9 As shown, on the stage 10A, a liquid crystal panel 60 is provided above the diffusion plate 110. In this case, for example, an upper surface 60a of the liquid crystal panel 60 serves as a mounting surface on which a wafer W is mounted.

[0115] However, when the liquid crystal panel 60 is provided below the top plate 40 functioning as a diffuser, the influence of the gap between the element regions of the liquid crystal panel 60 on the light irradiated to the imaging device D and the inspection result can be reduced.

[0116] Alternatively, the diffuser plate may be omitted from the stage.

[0117] The embodiments of the present specification should be considered to be illustrative and non-restrictive in all respects. The above embodiments may be omitted, replaced, or changed in various ways without departing from the claims, the appended notes, and the gist thereof. For example, the constituent elements of the above embodiments may be combined arbitrarily.

[0118] In addition, the effects described in this specification are merely illustrative or exemplary effects and are not intended to limit the present invention. That is, with respect to the technology of the present invention, it is obvious that those skilled in the art can not only obtain the above technical effects according to the description of this specification, but also obtain other effects instead of the above effects.

[0119] In addition, the structures described below also belong to the technical scope of the present invention.

[0120] (1) An inspection device for inspecting an inspection target device, wherein the inspection target device is a back-illuminated imaging device formed on an inspection target body, and light can be incident on the imaging device from the back side of a surface of the imaging device opposite to a side on which a wiring layer is provided,

[0121] The inspection device includes a mounting table that supports the inspection object so as to face the back surface of the imaging device.

[0122] The mounting platform has:

[0123] a transparent placement surface for placing the inspection object; and

[0124] an irradiation unit disposed below the placement surface, the irradiation unit irradiating light toward the inspection object placed on the placement surface,

[0125] The irradiation unit has:

[0126] a light guide plate having an opposing surface opposing the inspection object across the mounting surface; and

[0127] a light source portion, which is disposed in a region outside the lateral side of the light guide plate and can emit light toward a side end surface of the light guide plate,

[0128] The light guide plate emits light emitted from the light source unit and incident from a side end surface of the light guide plate from the opposing surface to the mounting surface.

[0129] The mounting table further includes an optical component that transmits light from the opposite surface of the light guide plate to the inspection object mounted on the mounting surface.

[0130] The optical member is divided into a plurality of regions, and is configured to be able to change light transmittance for each of the regions.

[0131] (2) The inspection device according to (1) above, wherein the optical component is a liquid crystal panel.

[0132] (3) The inspection device according to (2) above, wherein the liquid crystal panel has a plurality of filters that transmit light of different wavelengths, respectively, in a manner corresponding to the regions.

[0133] (4) The inspection device according to any one of (1) to (3), further comprising a control unit.

[0134] The control unit acquires an in-plane distribution of illuminance of light from the placement surface, and adjusts light transmittance of the optical member based on the acquisition result.

[0135] (5) The inspection device according to any one of (1) to (4), further comprising a control unit.

[0136] The control section adjusts the light transmittance of the optical member so that only a specific area among the plurality of areas transmits light.

[0137] (6) An inspection method for inspecting an inspection target device,

[0138] The inspection target device is a back-illuminated imaging device formed on the inspection target body, and light can enter the imaging device from the back side of the surface of the imaging device which is the opposite side to the side where the wiring layer is provided.

[0139] The inspection method comprises:

[0140] A step of placing the inspection object on a transparent placing surface in such a manner that the back surface of the imaging device faces the transparent placing surface;

[0141] The step of causing the light to be emitted toward the side end surface of the light guide plate, and causing the light to be emitted from the opposite surface of the light guide plate opposite to the inspection object, and to be emitted from the mounting surface through an optical component, wherein the optical component is divided into a plurality of regions and is configured to be able to change the light transmittance for each of the regions;

[0142] a step of acquiring an in-plane distribution of the illuminance of light from the mounting surface; and

[0143] The step of adjusting the light transmittance of the optical component based on the acquired result.

[0144] Description of Reference Numerals

[0145] 1 Detector

[0146] 10.10A stage

[0147] 40a Loading surface

[0148] 50 irradiation department

[0149] 51 Light guide plate

[0150] 51a Opposite side

[0151] 52 Light source

[0152] 60, 60A LCD panel

[0153] 60a upper surface

[0154] D Back-illuminated camera

[0155] W chip.

Claims

1. An inspection device for inspecting an inspection target device, wherein: The inspection target device is a back-illuminated imaging device formed on the inspection target body, and light can enter the imaging device from the back side of the surface of the imaging device which is the opposite side to the side where the wiring layer is provided. The inspection device includes a mounting table that supports the inspection object so as to face the back surface of the imaging device. The mounting platform has: a transparent placement surface for placing the inspection object; and an irradiation unit disposed below the placement surface, the irradiation unit being capable of irradiating light toward the inspection object placed on the placement surface, The irradiation unit comprises: a light guide plate having an opposing surface opposing the inspection object across the mounting surface; and a light source portion, which is disposed in a region outside the lateral side of the light guide plate and can emit light toward a side end surface of the light guide plate, The light guide plate allows light emitted from the light source unit and incident from a side end surface of the light guide plate to be emitted from the opposing surface to the mounting surface. The mounting table further includes an optical component that transmits light from the opposite surface of the light guide plate to the inspection object mounted on the mounting surface. The optical member is divided into a plurality of regions, and is configured to be able to change light transmittance for each of the regions.

2. The inspection device according to claim 1, characterized in that: The optical component is a liquid crystal panel.

3. The inspection device according to claim 2, characterized in that: The liquid crystal panel has a plurality of filters that transmit different wavelengths, respectively, in a manner corresponding to the regions.

4. The inspection device according to any one of claims 1 to 3, characterized in that: Also includes a control unit, The control unit acquires an in-plane distribution of illuminance of light from the placement surface, and adjusts light transmittance of the optical member based on the acquisition result.

5. The inspection device according to any one of claims 1 to 3, characterized in that: Also includes a control unit, The control section adjusts the light transmittance of the optical member so that only a specific area among the plurality of areas transmits light.

6. An inspection method, which is a method for inspecting an inspection target device, wherein: The inspection target device is a back-illuminated imaging device formed on the inspection target body, and light can enter the imaging device from the back side of the surface of the imaging device which is the opposite side to the side where the wiring layer is provided. The inspection method comprises: A step of placing the inspection object on a transparent placing surface in such a manner that the back surface of the imaging device faces the transparent placing surface; The step of causing the light to be emitted toward the side end surface of the light guide plate, and causing the light to be emitted from the opposite surface of the light guide plate opposite to the inspection object, and to be emitted from the mounting surface through an optical component, wherein the optical component is divided into a plurality of regions and is configured to be able to change the light transmittance for each of the regions; a step of acquiring an in-plane distribution of the illuminance of light from the mounting surface; and The step of adjusting the light transmittance of the optical component based on the acquired result.

Images