Substrate holder, substrate processing apparatus, and substrate transfer method

Abstract

A substrate holder for receiving and holding a substrate from a transfer arm, the substrate holder comprising: a placement section on which the substrate is placed, the placement section being configured so as to be capable of rising and falling in the vertical direction; a measurement unit that measures at least one of the weight, pressure, and displacement of the placement unit; and a control unit that predicts the state of the transport arm on the basis of the measurement result of the measurement unit. The substrate processing apparatus processes the substrate held by the substrate holder in an air atmosphere. Another substrate processing apparatus is configured so as to be capable of switching between an air atmosphere and a vacuum atmosphere in a state in which the substrate is held by the substrate holder.

Description

Technical Field

[0001] The present invention relates to a substrate holding device, a substrate processing device and a substrate conveying method. Background Art

[0002] Patent Document 1 discloses a substrate transporting device that transports a substrate by vacuum suction. The substrate transporting device includes a plurality of pads each including a flange portion for holding the substrate, and a robot that detachably fixes the plurality of pads.

[0003] Prior art literature

[0004] Patent Literature

[0005] Patent Document 1: Japanese Patent Application Publication No. 2015-103696 Summary of the invention

[0006] Problem that the invention aims to solve

[0007] The technology according to the present disclosure appropriately evaluates the detachability of a substrate with respect to a transfer arm that holds and transfers a substrate.

[0008] Solutions for solving problems

[0009] One embodiment of the present disclosure is a substrate holding device that receives and holds a substrate from a conveying arm, the substrate holding device comprising: a loading portion that is configured to be freely raised and lowered in a vertical direction, the loading portion loading the substrate; a measuring portion that measures at least any one of the weight, pressure, and displacement of the loading portion; and a control portion that predicts the state of the conveying arm based on the measurement results of the measuring portion.

[0010] Effects of the Invention

[0011] According to the present disclosure, it is possible to appropriately evaluate the detachability of a substrate with respect to a transfer arm that holds and transfers a substrate. BRIEF DESCRIPTION OF THE DRAWINGS

[0012] Figure 1 It is a plan view schematically showing the structure of a wafer processing apparatus according to the present embodiment.

[0013] Figure 2 It is a perspective view schematically showing the structure of the transfer arm.

[0014] Figure 3 It is a perspective view schematically showing the structure of the retention mat.

[0015] Figure 4 It is a perspective view schematically showing the structure of a wafer holder.

[0016] Figure 5It is an explanatory diagram showing a state where a wafer is held by a wafer holder.

[0017] Figure 6 It is a perspective view schematically showing the structure of the dynamometer.

[0018] Figure 7 It is an explanatory diagram showing a state where a wafer is transferred from a transfer arm to a wafer holder.

[0019] Figure 8 It is an explanatory diagram showing the change over time of the weight measured by a load cell.

[0020] Fig. 9 It is an explanatory diagram showing the change over time of the weight measured by the load sensor.

[0021] Fig.10 It is an explanatory diagram showing a state where a wafer is transferred from a transfer arm to a wafer holder.

[0022] Fig.11 It is an explanatory diagram showing the change over time of the weight measured by the load sensor.

[0023] Fig.12 It is an explanatory diagram showing a state where a wafer is transferred from a transfer arm to a wafer holder.

[0024] Fig.13 It is a perspective view schematically showing the structure of a wafer holder according to another embodiment. DETAILED DESCRIPTION

[0025] In the manufacturing process of semiconductor devices, a semiconductor wafer (substrate; hereinafter referred to as a "wafer") is subjected to wafer processing such as etching processing in a vacuum atmosphere, for example. This wafer processing is performed using a wafer processing apparatus including a plurality of processing modules.

[0026] For example, a wafer processing apparatus has a structure in which a reduced pressure section in a vacuum atmosphere (under a reduced pressure atmosphere) and a normal pressure section in an atmospheric atmosphere (under a normal pressure atmosphere) are connected to each other via a load lock module.

[0027] The decompression unit includes a common transfer module and a plurality of processing modules connected to the periphery of the transfer module. The wafer is transferred from the transfer module in a vacuum atmosphere to the processing module, and a desired process is performed in the processing module in a vacuum atmosphere.

[0028] The normal pressure section includes a loading port for placing a front-opening FOUP and a loading module with a wafer transfer device. The front-opening FOUP can store a plurality of wafers. In the loading module under the atmospheric atmosphere, wafers are transferred to the front-opening FOUP and the load lock module.

[0029] The load interlock module is configured to be internally capable of switching between a vacuum atmosphere and an atmospheric atmosphere, and wafers are transferred between the reduced-pressure section and the atmospheric-pressure section.

[0030] In the load module, a wafer transfer device that transfers wafers in an atmospheric atmosphere, for example, as disclosed in Patent Document 1, vacuum-adsorbs and transfers wafers by a plurality of pads provided on a robot hand (transfer arm). Further, when transferring a wafer from the wafer transfer device to another module or the like, the evacuation from the plurality of pads is stopped to release the wafer.

[0031] However, sometimes even when the evacuation from the pads is stopped, it is difficult for the wafer to be released from the pad. This is caused by, for example, the adhesiveness of the wafer, but such a difficult release situation has not been assumed for conventional pads. Moreover, when it is difficult for the wafer to be released from the pad, malfunctions such as the wafer flying off (in Japanese: 飛び跳ね) from the transfer arm or the wafer remaining on the transfer arm without being transferred may occur during the wafer transfer.

[0032] In order to avoid such malfunctions, it is necessary to appropriately evaluate the releasability of the wafer from the pad. However, in the past, as described above, the situation where it is difficult for the wafer to be released has not been assumed, and the releasability thereof cannot be evaluated.

[0033] The technology according to the present disclosure appropriately evaluates the releasability of a substrate for a transfer arm that holds and transfers a substrate. Hereinafter, a wafer processing apparatus according to the present embodiment will be described with reference to the drawings. In addition, in this specification and the drawings, elements having substantially the same functional structure are denoted by the same reference numerals, and thus redundant description is omitted.

[0034] <Wafer Processing Apparatus>

[0035] First, a wafer processing apparatus according to the present embodiment will be described. Figure 1 FIG. is a top view showing an outline of the structure of the wafer processing apparatus 1. In the present embodiment, a case where the wafer processing apparatus 1 includes various processing modules for performing COR (Chemical Oxide Removal) processing, PHT (Post Heat Treatment) processing, and CST (Cooling Storage) processing on a wafer W as a substrate will be described. In addition, the structure of various processing modules included in the wafer processing apparatus 1 according to the present disclosure is not limited thereto, and can be arbitrarily selected.

[0036] As Figure 1 shown, the wafer processing apparatus 1 has a structure in which an atmospheric-pressure section 10 and a reduced-pressure section 11 are integrally connected via load interlock modules 20a and 20b.

[0037] The load lock module 20a temporarily holds the wafer W in order to deliver the wafer W transferred from the load module 30 described later of the normal pressure section 10 to the transfer module 60 described later of the decompression section 11. The load lock module 20a holds a plurality of wafers W, for example, two wafers W simultaneously therein.

[0038] The load lock module 20a is connected to the load module 30 and the transfer module 60 via a gate (not shown) provided with a gate valve (not shown). The gate valve ensures airtightness and communication between the load lock module 20a and the load module 30 and the transfer module 60.

[0039] The load lock module 20a is connected to a gas supply unit (not shown) for supplying gas and an exhaust unit (not shown) for exhausting gas, and the load lock module 20a is configured so that the inside of the load lock module 20a can be switched between the atmospheric atmosphere (normal pressure atmosphere) and the vacuum atmosphere (decompression atmosphere) through the gas supply unit and the exhaust unit. That is, the load lock module 20a is configured so that the wafer W can be properly transferred between the normal pressure unit 10 of the atmospheric atmosphere and the decompression unit 11 of the vacuum atmosphere.

[0040] The load lock module 20b temporarily holds the wafer W in order to deliver the wafer W transferred from the transfer module 60 to the load module 30. The load lock module 20b has the same structure as the load lock module 20a, that is, it has a gate valve (not shown), a gate (not shown), an air supply unit (not shown), and an exhaust unit (not shown).

[0041] In addition, the number and arrangement of the load-lock modules 20 a and 20 b are not limited to the present embodiment, and can be set arbitrarily.

[0042] The normal pressure section 10 includes a loading module 30 having a wafer transfer device 40 described later, a loading port 32 for placing a front-opening wafer pod 31 capable of storing a plurality of wafers W, a CST module 33 for cooling the wafers W, and an alignment module 34 for adjusting the orientation of the wafers W in the horizontal direction.

[0043] The interior of the loading module 30 is constituted by a rectangular shell, and the interior of the shell is maintained in an atmospheric atmosphere. A plurality of, for example, three, loading ports 32 are arranged in parallel on one side of the long side of the shell of the loading module 30. Load interlock modules 20a and 20b are arranged in parallel on the other side of the long side of the shell of the loading module 30. A CST module 33 is arranged on one side of the short side of the shell of the loading module 30. An alignment module 34 is arranged on the other side of the short side of the shell of the loading module 30.

[0044] The number and arrangement of the load ports 32 , CST modules 33 , and alignment modules 34 are not limited to the present embodiment and can be arbitrarily set. The type of module provided in the normal pressure section 10 is also not limited to the present embodiment and can be arbitrarily selected.

[0045] The front opening FOUP 31 accommodates a plurality of wafers W, for example, 25 wafers W in one batch. The interior of the front opening FOUP 31 placed on the load port 32 is filled with, for example, air, nitrogen, etc., and is sealed.

[0046] The CST module 33 holds a plurality of wafers W, for example, 35 wafers W, which are greater than the number of wafers contained in the front-opening wafer pod 31, at equal intervals in multiple layers in the wafer holder 200 described later. Furthermore, the plurality of wafers W held in the wafer holder 200 are cooled. The structure of the wafer holder 200 will be described later.

[0047] The alignment module 34 rotates the wafer W to adjust the horizontal orientation. Specifically, when the alignment module 34 performs wafer processing on each of the plurality of wafers W, the alignment module 34 adjusts the wafer W so that the orientation viewed from a reference position (e.g., a notch position) and from a horizontal direction is the same.

[0048] A wafer transfer device 40 for transferring wafers W is provided inside the loading module 30. The wafer transfer device 40 includes transfer arms 41a and 41b for holding and moving the wafers W, a rotating table 42 for rotatably supporting the transfer arms 41a and 41b, and a rotating mounting table 43 on which the rotating table 42 is mounted. A lifting mechanism (not shown) is provided inside the rotating table 42, and the transfer arms 41a and 41b are configured to be able to be lifted and lowered by the lifting mechanism. The wafer transfer device 40 is configured to be movable in the longitudinal direction inside the housing of the loading module 30.

[0049] The decompression unit 11 includes a transfer module 60 for simultaneously conveying two wafers W, a COR module 61 for performing COR treatment on the wafers W, and a PHT module 62 for performing PHT treatment on the wafers W. The interiors of the transfer module 60, the COR module 61, and the PHT module 62 are respectively maintained in a vacuum atmosphere. In addition, a plurality of COR modules 61 and a plurality of PHT modules 62 are provided for the transfer module 60, for example, three.

[0050] The interior of the transfer module 60 is composed of a rectangular housing. As described above, the transfer module 60 is connected to the load lock modules 20a and 20b via gate valves (not shown). After the transfer module 60 sequentially transfers the wafer W loaded into the load lock module 20a to a COR module 61 and a PHT module 62 for COR and PHT treatment, the wafer W is unloaded to the normal pressure section 10 via the load lock module 20b.

[0051] Two stages 61a and 61b are provided inside the COR module 61 for placing two wafers W in a horizontal arrangement. The COR module 61 places the wafers W in a row on the stages 61a and 61b to simultaneously perform COR processing on the two wafers W. In addition, the COR module 61 is connected to a gas supply unit (not shown) for supplying a processing gas, a purge gas, etc., and an exhaust unit (not shown) for exhausting a gas.

[0052] Two work tables 62a and 62b are provided inside the PHT module 62 to arrange two wafers W in a horizontal direction. The PHT module 62 arranges the wafers W on the work tables 62a and 62b to perform PHT processing on the two wafers W simultaneously. In addition, the PHT module 62 is connected to a gas supply unit (not shown) for supplying gas and an exhaust unit (not shown) for exhausting gas.

[0053] The COR module 61 and the PHT module 62 are connected to the transfer module 60 via a gate (not shown) provided with a gate valve (not shown). The gate valve ensures airtightness between the transfer module 60 and the COR module 61 and the PHT module 62 and enables communication between them.

[0054] In addition, the number, arrangement, and type of the processing modules provided in the transfer module 60 are not limited to the present embodiment, and can be arbitrarily set.

[0055] A wafer conveying device 70 for conveying wafers W is provided inside the transfer module 60. The wafer conveying device 70 includes conveying arms 71a and 71b for holding and moving two wafers W, a rotating table 72 for rotatably supporting the conveying arms 71a and 71b, and a rotating mounting table 73 on which the rotating table 72 is mounted. A lifting mechanism (not shown) is provided inside the rotating table 72, and the conveying arms 71a and 71b are configured to be able to be lifted and lowered by the lifting mechanism. In addition, a guide rail 74 extending in the long side direction of the transfer module 60 is provided inside the transfer module 60. The rotating mounting table 73 is provided on the guide rail 74 and is configured to enable the wafer conveying device 70 to move along the guide rail 74.

[0056] The above wafer processing device 1 is provided with a control unit 80. The control unit 80 is, for example, a computer having a CPU, a memory, etc., and has a program storage unit (not shown). The program storage unit stores a program for controlling the processing of the wafer W in the wafer processing device 1. In addition, the above program can also be recorded in a computer-readable storage medium H and installed from the storage medium H to the control unit 80. In addition, the above storage medium H can be transient or non-transient.

[0057] In the wafer processing apparatus 1 configured as above, first, the wafer W is transferred from the front-opening FOUP 31 to the alignment module 34 by the wafer transfer device 40 in the air atmosphere to adjust the horizontal orientation of the wafer W. Next, the wafer W is transferred to the load lock module 20 a by the wafer transfer device 40 .

[0058] Next, in a vacuum atmosphere, the wafer transfer device 70 transfers the wafer W to the COR module 61 for COR processing. Next, the wafer transfer device 70 transfers the wafer W to the PHT module 62 for PHT processing. Next, the wafer transfer device 70 transfers the wafer W to the load lock module 20 b.

[0059] Next, in the air atmosphere, the wafer W is transferred to the CST module 33 by the wafer transfer device 40 for CST processing. Next, the wafer W is transferred to the front opening FOUP 31 by the wafer transfer device 40. In this way, a series of wafer processing in the wafer processing apparatus 1 is completed.

[0060] <Conveying arm>

[0061] Next, the transfer arms 41a and 41b of the wafer transfer device 40 will be described. The transfer arms 41a and 41b have the same structure and are hereinafter collectively referred to as the transfer arm 41. The transfer arm 41 transfers the wafer W by vacuum suction.

[0062] like Figure 2 As shown, the transfer arm 41 has a picker 100 for holding a wafer W and a plurality of, for example, three, holding pads 110 provided on the surface of the picker 100. The picker 100 has a fork shape formed by branching from a base end 101 into two front end portions 102, 102. The three holding pads 110 are provided on the surfaces of the base end 101 and the front end portions 102, 102, respectively.

[0063] like Figure 3As shown, the holding pad 110 has a base 111 provided as a bottom surface and an annular portion 112 provided in an annular shape on the surface of the base 111. The annular portion 112 has an oblong shape, for example, when viewed from above. A through hole 113 for vacuum adsorption is formed in the base 111. The through hole 113 is connected to a gas supply portion (not shown) for supplying gas to the inner side of the holding pad 110 and an exhaust portion (not shown) for vacuuming by sucking the gas inside the holding pad 110.

[0064] When the wafer W is held by the holding pad 110, the suction space 110s formed by the back side of the wafer W, the base 111, and the ring portion 112 is evacuated while the ring portion 112 is in contact with the back side of the wafer W. On the other hand, when the wafer W is separated from the holding pad 110, the suction space 110s is stopped from being evacuated and gas is further supplied to the suction space 110s, and then the wafer W is relatively lifted from the holding pad 110 during delivery to a transfer destination or the like.

[0065] In addition, the structure of the holding pad 110 is not limited to the structure of this embodiment. For example, the planar shape of the holding pad 110 may be a shape other than an oval shape.

[0066] <Wafer holder>

[0067] Next, a wafer holder 200 as a substrate holder provided in a CST module 33 as a substrate processing device is described. The wafer holder 200 holds a plurality of wafers W in multiple layers at equal intervals. Furthermore, inside a processing container (not shown) of the CST module 33, while the wafer holder 200 holds a plurality of wafers W, a fan (not shown) is operated to flow in air at room temperature, thereby cooling the plurality of wafers W.

[0068] like Figure 4 As shown, the wafer holding device 200 has a wafer storage device 201 as a loading portion, and a force gauge 202. The wafer storage device 201 holds a plurality of wafers W in multiple layers. The horizontal center of gravity position of the wafer storage device 201 is designed to coincide with the center position of the wafer W. The force gauge 202 measures the weight of the wafer storage device 201. In addition, there are various types of force gauges 202 as force measuring devices. Figure 4 The load cell 202 shown includes a beam-type load cell 220 described later.

[0069] The wafer storage device 201 has a wafer holding support 210, an auxiliary support 211, a top plate 212, and a bottom plate 213. The wafer storage device 201 is supported by a load sensor 220 described later, and is configured to be able to be raised and lowered in the vertical direction and to be able to be moved in the horizontal direction. In other words, the wafer storage device 201 is not supported by anything other than the load sensor 220. In addition, the auxiliary support 211 is not essential and is provided as needed.

[0070] There are multiple wafer holding pillars 210, for example, three. For example, two auxiliary pillars 211 are provided between each of the three wafer holding pillars 210. These three wafer holding pillars 210 and the two auxiliary pillars 211 are arranged at equal intervals on a semicircle with the same center. The top plate 212 supports the upper ends of the wafer holding pillars 210 and the upper ends of the auxiliary pillars 211. The top plate 212 of the present embodiment has a roughly arc shape when viewed from above, but the planar shape of the top plate 212 is not limited to this. The bottom plate 213 supports the lower ends of the wafer holding pillars 210 and the lower ends of the auxiliary pillars 211. The bottom plate 213 of the present embodiment has a roughly circular shape with a notch formed therein when viewed from above, but the planar shape of the bottom plate 213 is not limited to this.

[0071] On the wafer holding pillar 210, a plurality of mounting members 214 are arranged at equal intervals in the vertical direction. These plurality of mounting members 214 protrude radially inward from the wafer holding pillar 210. In addition, in the three wafer holding pillars 210, the corresponding mounting members 214 are arranged at the same height. Figure 5 As shown, each placement member 214 places the outer circumference of the wafer W, thereby holding the wafer W horizontally in the wafer storage device 201. The number of wafer holding pillars 210 is not limited to this embodiment, but at least three are required to hold the wafer W horizontally.

[0072] like Figure 6 As shown in FIG. 2 , the dynamometer 202 includes a support plate 221 and a load sensor 220 as a measuring part. Figure 6 In order to explain the inner structure of the force gauge 202, the wafer storage device 201 is omitted from the illustration.

[0073] The load sensor 220 supports the bottom plate 213 of the wafer storage device 201 to measure the vertical weight of the wafer storage device 201. The installation position of the load sensor 220 is designed to receive a vertical force at the horizontal center of gravity of the wafer storage device 201. The structure of the load sensor 220 is not limited, and a load sensor that meets the use conditions is used.

[0074] The load sensor 220 is provided in a recessed portion 221a formed in the center of the support plate 221. In addition, the load sensor 220 is provided so as to protrude from the upper surface of the support plate 221. With this structure, a gap is formed between the lower surface of the base plate 213 and the upper surface of the support plate 221, so that the wafer storage device 201 supported by the load sensor 220 can be freely raised and lowered in the vertical direction. The support plate 221 is fixed to the processing container (not shown) of the CST module 33.

[0075] In addition, in the present embodiment, one load sensor 220 is provided, but the number of load sensors 220 is not limited thereto. Since the wafer storage device 201 is supported by the load sensor 220, for example, when a plurality of load sensors 220 are provided, the rigidity for supporting the wafer storage device 201 becomes higher. In this case, the weight of the wafer storage device 201 is measured by linking the measurement results of the plurality of load sensors 220.

[0076] <Wafer Transfer Method>

[0077] Next, a method of transferring the wafer W from the transfer arm 41 of the wafer transfer device 40 to the wafer holder 200 of the CST module 33 and holding the wafer W by the wafer holder 200 will be described. Figure 7 1 is an explanatory diagram showing a state in which the wafer W is transferred from the transfer arm 41 to the wafer holder 200 .

[0078] In addition, while the wafer W is being transferred from the transfer arm 41 to the wafer holder 200 , the weight of the wafer storage device 201 is always measured by the load sensor 220 . The weight data measured by the load sensor 220 is output to the control unit 80 . Figure 8 It is an explanatory diagram showing the change over time of the weight measured by the load sensor 220 . Figure 8 The vertical axis represents weight and the horizontal axis represents time.

[0079] First, if Figure 7 As shown in (a), the transfer arm 41 holding the wafer W by suction enters the wafer storage device 201 (step S1). The wafer W enters between the adjacent mounting members 214 in the vertical direction. Figure 8 As shown, the weight of the wafer storage device 201 is a weight L1 excluding the weight of the wafer W.

[0080] Next, the vacuuming of the suction space 110 s formed between the holding pad 110 of the transfer arm 41 and the wafer W is stopped, and the gas is further supplied to the suction space 110 s. Then, the suction and holding of the wafer W by the transfer arm 41 is stopped.

[0081] Then, if Figure 7As shown in (b) of FIG. 1 , the transfer arm 41 is lowered to transfer the wafer W from the transfer arm 41 to the wafer storage device 201 , and the wafer W is placed on the placement member 214 (step S2 ).

[0082] Here, when the wafer W is held by the wafer storage device 201, the weight of the wafer storage device 201 becomes the weight L2 obtained by adding the weight L1 to the weight of the wafer W. In this regard, in step S2, as described above, sometimes it is difficult for the wafer W to detach from the holding pad 110 even if the vacuuming of the adsorption space 110s is stopped. That is, the wafer W has adhesion, and the wafer W adheres to the holding pad 110, so it is difficult for the wafer W to detach from the holding pad 110. Therefore, when the wafer W is placed on the mounting member 214, a downward load is applied to the wafer storage device 201, causing the wafer storage device 201 to descend. In addition, since the wafer W is placed on the mounting member 214 in a descending manner, the impact at this time also applies a downward load to the wafer storage device 201. Therefore, as Figure 8 As shown, in the load sensor 220, the weight L3 which is larger than the weight L2 is measured.

[0083] Then, if Figure 7 As shown in (c), the transfer arm 41 is withdrawn from the wafer storage device 201 (step S3). Figure 8 As shown, the weight measured by the load sensor 220 is a weight L2 obtained by adding the weight L1 of the wafer storage device 201 and the weight of the wafer W.

[0084] When the wafer W is transferred from the transfer arm 41 to the wafer holder 200 as described above, the control unit 80 monitors Figure 8 The weight measured by the load cell 220 is shown. Based on the weight difference ΔL (= L3-L2) between the weight L3 and the weight L2, the detachability of the wafer W from the holding pad 110 is evaluated. That is, a large weight difference ΔL indicates that the wafer W is difficult to detach, and a small weight difference ΔL indicates that the wafer W is easy to detach.

[0085] In addition, although the wafer W is difficult to detach from the holding pad 110 due to the adhesiveness of the wafer W as described above, when the holding pad 110 deteriorates, the detachability of the wafer W deteriorates. Therefore, in the control unit 80, the state of the holding pad 110 (the state of the transfer arm 41) is predicted based on the weight difference ΔL. And, when the weight difference ΔL exceeds a predetermined threshold value, an alarm is output from the output unit (not shown) of the wafer processing device 1.

[0086] The threshold value of the weight difference ΔL when outputting an alarm can be set arbitrarily. For example, as described above, when the detachability of the wafer W deteriorates, the wafer W may sometimes fly out of the transfer arm 41, and the threshold value may be set in a manner to avoid such flying out. Alternatively, the threshold value may be set based on the timing of replacement of the holding pad 110.

[0087] According to the above embodiment, the wafer holding device 200 includes the force gauge 202, and thus the weight of the wafer storage device 201 can be constantly monitored. Furthermore, the detachability of the wafer W from the holding pad 110 can be numerically evaluated based on the change in the weight of the wafer storage device 201 over time.

[0088] Specifically, for example, Fig. 9 As shown, when three wafers W are transported from the transport arm 41 to the wafer holding device 200, the weight measured by the load sensor 220 increases stepwise. Here, it is assumed that, with respect to the holding pad 110, the first wafer W1 is not fixed, and the peeling property is "large", the second wafer W2 is slightly fixed, and the peeling property is "medium", and the third wafer W3 is quite fixed, and the peeling property is "small". In this case, the weight difference ΔL1 when the first wafer W1 is placed, the weight difference ΔL2 when the second wafer W2 is placed, and the weight difference ΔL3 when the third wafer W3 is placed become larger in sequence (ΔL1<ΔL2<ΔL3). Therefore, the detachability of the wafer W from the holding pad 110 can be quantified for evaluation.

[0089] In the above embodiment, if the detachability of the wafer W from the holding pad 110 further deteriorates, there is a possibility that the wafer W cannot be transferred from the transfer arm 41 to the wafer storage device 201 . Fig.10 4 is an explanatory diagram showing a state in which the wafer W is transferred from the transfer arm 41 to the wafer holding device 200 in this embodiment. Fig.11 It is an explanatory diagram showing the change over time of the weight measured by the load sensor 220 in the present embodiment.

[0090] First, if Fig.10 As shown in (a), the transfer arm 41 holding the wafer W by suction enters the wafer storage device 201 (step T1). This step T1 is the same as step S1 of the above embodiment. Fig.11 As shown, the weight of the wafer storage device 201 is weight L1.

[0091] Then, after stopping the vacuuming of the adsorption space for 110s, Fig.10 As shown in (b), the transfer arm 41 is lowered to transfer the wafer W from the transfer arm 41 to the wafer storage device 201, and the wafer W is placed on the placement member 214 (step T2). This step T2 is the same as step S2 of the above embodiment. Fig.11As shown, the weight of the wafer storage device 201 is weight L3.

[0092] Then, if Fig.10 As shown in (c), the transfer arm 41 is withdrawn from the wafer storage device 201 (step T3). At this time, in this embodiment, since the wafer W has a low detachability, the wafer W is not placed on the placement member 214 by the transfer arm 41, but withdraws together with the transfer arm 41. Fig.11 As shown, the weight of the wafer storage device 201 is a weight L1 excluding the weight of the wafer W.

[0093] As described above, in this embodiment as well, when the wafer W is transferred from the transfer arm 41 to the wafer holding device 200, the control unit 80 monitors Fig.11 The weight measured by the load cell 220 is shown. When the weight after the transfer arm 41 is withdrawn becomes the weight L1, it can be detected that the wafer W is withdrawn while remaining on the transfer arm 41. Therefore, the detachability of the wafer W from the holding pad 110 can be numerically evaluated.

[0094] In addition, in the control unit 80, when the weight of the transfer arm 41 after withdrawal is the weight L1, an alarm (or warning) is output from the output unit (not shown) of the wafer processing device 1. In the present embodiment, the detachability of the wafer W deteriorates to the extent that the wafer W cannot be transferred from the transfer arm 41 to the wafer storage device 201, and the holding pad 110 needs to be replaced. Therefore, an alarm is output to notify the replacement of the holding pad 110. In addition, in the present embodiment ( Fig.11 ) can also be the same as the above implementation ( Figure 8 )'s alarm so that it can be distinguished from it.

[0095] In the wafer holding device 200 of the above embodiment, when the transfer arm 41 holding the wafer W by suction is caused to enter the wafer storage device 201 in steps S1 and T1 , positional deviation of the wafer W on the transfer arm 41 can be detected.

[0096] For example, Fig.12 As shown, sometimes the position of the wafer W is offset in the moving direction relative to the transfer arm 41. In this case, when the transfer arm 41 enters the wafer storage device 201, the wafer W collides with the wafer holding support 210 before the transfer arm 41 reaches the predetermined position. As a result, a moment load is applied to the wafer holding support 210, and the weight measured by the load sensor 220 increases. Specifically, the weight measured by the load sensor 220 increases at a time earlier than the weight L3 when the wafer W is placed as described above. In the control unit 80, the collision of the wafer W is detected based on the increase in weight, and further, it is detected that the position of the wafer W in the transfer arm 41 has shifted.

[0097] <Other Embodiments>

[0098] In the above embodiment, the load sensor 220 for measuring the weight of the wafer storage device 201 is used as the measuring unit, but the measurement object of the measuring unit is not limited to this.

[0099] For example, as the measuring unit, a pressure sensor that measures the vertically downward pressure acting on the wafer storage device 201 may be used. In this case, a pressure gauge equipped with a pressure sensor (not shown) is provided below the wafer storage device 201 instead of the force gauge 202. The change in the pressure of the wafer storage device 201 represents the same behavior as the change in the weight of the above-mentioned wafer storage device 201. Therefore, based on the time-dependent change in the pressure of the wafer storage device 201 measured by the pressure sensor, the detachment of the wafer W from the holding pad 110 can be quantified for evaluation.

[0100] In addition, for example, a laser displacement meter for measuring the vertical displacement of the wafer storage device 201 may be used as the measuring unit. Fig.13 As shown, a plurality of, for example, three laser displacement meters 230 are provided corresponding to the three wafer holding pillars 210. When the wafer W is placed on the placing member 214, a downward load is applied to the wafer storage device 201, causing the wafer storage device 201 to descend. Therefore, based on the time-dependent change in the vertical displacement of the wafer holding pillar 210 measured by the laser displacement meter 230, the detachment of the wafer W from the holding pad 110 can be numerically evaluated.

[0101] In the above embodiment, in steps S2 and T2, the transfer arm 41 is lowered to transfer the wafer W from the transfer arm 41 to the wafer storage device 201, but the wafer storage device 201 may be raised by a lifting mechanism (not shown). In addition, the wafer storage device 201 may be raised while the transfer arm 41 is lowered. If the transfer arm 41 and the wafer storage device 201 are relatively moved in the vertical direction, the wafer W can be transferred from the transfer arm 41 to the wafer storage device 201.

[0102] In the above embodiment, the weight data measured by the load sensor 220 is output to the control unit 80 provided in the wafer processing apparatus 1 , but may be output to another control unit (not shown). In this case, a control unit for the wafer holder 200 is provided.

[0103] In the above embodiment, the wafer holder 200 is installed inside the CST module 33, but the installation object of the wafer holder 200 is not limited to this.

[0104] For example, a wafer holder 200 may be provided inside the alignment module 34 as a substrate processing device. In this case, the wafer holder 200 is configured to hold a single wafer W. Furthermore, the detachability of the wafer W from the holding pad 110 can be numerically evaluated based on the time-dependent change in the weight of the wafer storage device 201 and the like.

[0105] In addition, for example, a wafer holder 200 may be provided inside the load lock modules 20a and 20b as substrate processing devices. In this case, the wafer holder 200 is configured to hold two wafers W. In the following description, an example in which the wafer holder 200 is provided in the load lock module 20a is described, but the same is true for the case in which the wafer holder 200 is provided in the load lock module 20b.

[0106] The transfer arms 41a, 41b (first transfer arms in the present disclosure) of the wafer transfer device 40 and the transfer arms 71a, 71b (second transfer arms in the present disclosure) of the wafer transfer device 70 access the load lock module 20a. In the following, the transfer arms 41a, 41b are collectively referred to as transfer arms 41, and the transfer arms 71a, 71b are collectively referred to as transfer arms 71.

[0107] When the wafer W is transferred from the transfer arm 41 to the wafer holding device 200 , the detachability of the wafer W from the holding pad 110 can be numerically evaluated based on the temporal change in the weight of the wafer storage device 201 .

[0108] When the wafer W is transferred from the transfer arm 71 to the wafer holder 200 , the detachment of the wafer W from the holding pad (not shown) of the transfer arm 71 can be numerically evaluated based on the temporal change in the weight of the wafer storage device 201 .

[0109] Here, the transfer arm 41 holds the wafer W by suction by vacuuming, whereas the transfer arm 71 holds the wafer W by friction. Figure 2 and Figure 3 The transfer arm 41 shown in the figure also has a pick-up 100 composed of a base end 101 and a front end 102, and a holding pad (not shown) provided on the surface of the pick-up 100. The holding pad of the transfer arm 71 is different from the holding pad 110 of the transfer arm 41, and holds the wafer W by friction force.

[0110] In addition, the holding pad of the transfer arm 71 can use a material with low adhesion to the wafer W. In this case, the detachability of the wafer W becomes higher. On the other hand, if the weight of the wafer storage device 201 can be measured as in the wafer holding device 200 of the present embodiment, a material that exerts a large friction force can be used within the limit that can detach the wafer W. Therefore, the degree of freedom of the material of the holding pad can be increased.

[0111] In addition, for example, the wafer holding tool 200 may be applied to the wafer transfer apparatus 40 or 70 to measure the weight of the wafer W when it is held by the transfer arm 41 or 71 .

[0112] The embodiments disclosed herein are to be considered in all respects as illustrative and non-restrictive, and the embodiments described above may be omitted, replaced, or modified in various ways without departing from the appended claims and the gist thereof.

[0113] Description of Reference Numerals

[0114] 41 (41a, 41b): transfer arm; 80: control unit; 200: wafer holding device; 201: wafer storage device; 220: load sensor; W: wafer.

Claims

1. A substrate holding device for receiving and holding a substrate from a transfer arm, the substrate holding device comprising: A placing portion configured to be able to be raised and lowered in a vertical direction, the placing portion placing a substrate; a measuring unit configured to measure at least one of the weight, pressure, and displacement of the placing unit; as well as A control unit predicts a state of the transfer arm based on the measurement result of the measurement unit.

2. The substrate holding device according to claim 1, wherein: The measuring section supports the placing section and measures the weight of the placing section.

3. The substrate holding device according to claim 2, wherein: The transfer arm has a plurality of holding pads for holding the substrate. The control unit predicts the state of the holding pad based on a change in weight measured by the measuring unit when the substrate is placed on the placing unit by the transfer arm.

4. The substrate holding device according to claim 2 or 3, wherein: The transfer arm has a plurality of holding pads for holding the substrate. The control unit predicts the state of the holding pad based on a change in the weight measured by the measuring unit when the transfer arm is withdrawn from the placement unit.

5. The substrate holding device according to any one of claims 2 to 4, wherein: The control unit predicts a state of the substrate on the transfer arm based on a change in the weight measured by the measurement unit when the transfer arm is moved into the placement unit.

6. The substrate holding device according to any one of claims 3 to 5, wherein: When the change in the weight exceeds a threshold value, the control unit outputs an alarm.

7. The substrate holding device according to any one of claims 2 to 6, wherein: The loading portion comprises: Multiple pillars; a mounting member provided on the plurality of pillars and mounting an outer peripheral portion of the substrate; and a bottom plate supporting lower ends of the plurality of pillars, The measuring section supports the bottom plate.

8. A substrate processing apparatus comprising the substrate holding device according to any one of claims 1 to 7, wherein: The transfer arm absorbs, holds and transfers the substrate in an atmospheric atmosphere. The substrate processing apparatus processes the substrate held by the substrate holder in an atmospheric atmosphere.

9. A substrate processing apparatus comprising the substrate holding device according to any one of claims 1 to 7, wherein: The conveying arm comprises a first conveying arm and a second conveying arm. The first transfer arm adsorbs, holds and transfers the substrate in an atmospheric atmosphere. The second transfer arm holds and transfers the substrate in a vacuum atmosphere. The substrate processing apparatus is configured to be switchable between an air atmosphere and a vacuum atmosphere in a state where the substrate is held by the substrate holder.

10. A substrate transporting method, which is a method for transporting a substrate from a transport arm to a substrate holding device so that the substrate is held by the substrate holding device, the substrate transporting method comprising the following steps: The transfer arm holding the substrate is placed in the substrate holding device so as to be able to be lifted and lowered in the vertical direction; The transfer arm and the substrate holding device are relatively moved in a vertical direction to transfer the substrate from the transfer arm to the placement portion; measuring at least any one of the weight, pressure and displacement of the placing portion by a measuring portion of the substrate holding device; as well as The state of the transfer arm is predicted based on the measurement result of the measurement unit.

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