Laser drilling equipment and its working method for ceramic substrate production

Abstract

This invention belongs to the field of laser processing technology, specifically relating to a laser drilling device and its working method for ceramic substrate production. The device includes: a feeding conveyor belt, a discharging conveyor belt, a laser processing platform, a feeding assembly, and a discharging assembly. Magnetic suction heads are provided at the ends of both the feeding and discharging assemblies. Each magnetic suction head includes: a connecting post, a buffer, and an electromagnet. The buffer is disposed on the bottom surface of the connecting post; the electromagnet is fixedly disposed on the bottom surface of the buffer. By using the magnetic suction head to directly contact the ceramic substrate, the ceramic substrate is attracted, and the buffer provides cushioning, preventing the magnetic suction head from pressing against the ceramic substrate ring during descent, thereby reducing the damage rate of the ceramic substrate during transport.

Description

TECHNICAL FIELD

[0001] The application belongs to the technical field of laser processing, and particularly relates to laser drilling, and especially relates to a laser drilling device for ceramic substrate production and a working method thereof. BACKGROUND

[0002] When the ceramic substrate is drilled, the ceramic substrate needs to be transferred between the conveying belt and the laser processing platform.

[0003] In the related art, the ceramic substrate is grabbed by using a magnetic suction mode. In order to avoid the ceramic substrate being pressed and damaged by the magnetic suction head, the magnetic suction force of the electromagnet is increased, and the magnetic suction head is spaced apart from the ceramic substrate by a certain distance. Thus, the ceramic substrate directly collides with the magnetic suction head at the moment when the electromagnet is powered on, and the ceramic substrate is easily damaged.

[0004] Therefore, how to reduce the damage of the ceramic substrate caused by the collision with the magnetic suction head during grabbing is currently urgent to be solved.

[0005] It should be noted that the above information disclosed in the background section of the present application is only used to understand the background of the present application, and therefore, the above description is not considered to constitute the information of the prior art. SUMMARY

[0006] The present application provides at least a laser drilling device for ceramic substrate production and a working method thereof.

[0007] In a first aspect, the present application provides a laser drilling device for ceramic substrate production, comprising:

[0008] a feeding conveying belt, a discharging conveying belt, a laser processing platform, a feeding assembly and a discharging assembly;

[0009] The feeding conveying belt and the discharging conveying belt are both arranged at the side of the laser processing platform.

[0010] The feeding assembly and the discharging assembly are both arranged on the laser processing platform.

[0011] The feeding assembly is adapted to convey the ceramic substrate on the feeding conveying belt to the laser processing platform for laser drilling.

[0012] The discharging assembly is adapted to convey the ceramic substrate after drilling to the discharging conveying belt to complete discharging.

[0013] The end of the feeding assembly and the end of the discharging assembly are both provided with a magnetic suction head.

[0014] The magnetic suction head comprises:

[0015] a connecting column, a buffer and an electromagnet.

[0016] The buffer is arranged on the bottom surface of the connecting column;

[0017] The electromagnet is fixedly arranged on the bottom surface of the buffer.

[0018] In an alternative embodiment, the buffer comprises a connecting plate and a plurality of elastic parts;

[0019] The bottom of the elastic part is fixedly connected with the connecting plate, and the top of the elastic part is fixedly connected with the connecting column through the anti-blocking part.

[0020] In an alternative embodiment, the elastic part comprises a guide rod and a buffer spring;

[0021] The buffer spring is sleeved on the guide rod;

[0022] The bottom of the guide rod is fixedly connected with the connecting plate;

[0023] The top of the guide rod passes through the anti-blocking part.

[0024] In an alternative embodiment, the anti-blocking part comprises a connecting frame, a first clamping block and a second clamping block;

[0025] The first clamping block and the second clamping block are oppositely arranged and are both slidingly arranged in the frame body of the connecting frame;

[0026] The first clamping block and the second clamping block are elastically connected with the connecting frame through corresponding return springs;

[0027] The first clamping block and the second clamping block are respectively arranged on both sides of the guide rod and are adapted to clamp the guide rod.

[0028] In an alternative embodiment, the shapes of the abutting surfaces of the first clamping block and the second clamping block are adapted to the side walls of the guide rod.

[0029] In an alternative embodiment, the side walls of the guide rod are provided with two insertion inclined blocks;

[0030] The first clamping block and the second clamping block are provided with insertion grooves at the positions adapted to the corresponding insertion inclined blocks.

[0031] In an alternative embodiment, the top surface of the first clamping block is provided with a resisting plate;

[0032] The top surface of the second clamping block is provided with a proximity switch;

[0033] The laser drilling equipment for ceramic substrate production further comprises a control module;

[0034] The control module is adapted to receive proximity information of the proximity switch and determine whether the guide rod is stuck according to the proximity information.

[0035] In an alternative embodiment, the step of receiving proximity information of the proximity switch and determining whether the guide rod is stuck according to the proximity information comprises:

[0036] Obtaining a buffer time T;

[0037] When the control module continuously receives the proximity information, it indicates that the guide column is not stuck at this time;

[0038] When the time t that the control module does not receive the proximity information is greater than the buffer time T, it indicates that the guide column is stuck at this time, and a stuck reminder is issued.

[0039] In an alternative embodiment, when the laser drilling equipment for ceramic substrate production is not working, the first clamping block and the second clamping block are expanded, the buffer spring is stretched out from the top of the first clamping block and the second clamping block, and the initial state is restored.

[0040] In a second aspect, the embodiment also provides a working method of the laser drilling equipment for ceramic substrate production as described above, comprising:

[0041] Transporting the ceramic substrate to the feeding conveyor belt;

[0042] The feeding assembly transports the magnetic suction head above the ceramic substrate and pushes the magnetic suction head downward until the magnetic suction head contacts the ceramic substrate, and the electromagnet is powered on to adsorb the ceramic substrate;

[0043] Controlling the feeding assembly to transport the ceramic substrate to the laser processing platform;

[0044] Drilling the ceramic substrate through the laser processing platform;

[0045] After drilling is completed, the unloading assembly transports the magnetic suction head above the ceramic substrate and pushes the magnetic suction head downward until the magnetic suction head contacts the ceramic substrate, and the electromagnet is powered on to adsorb the ceramic substrate;

[0046] Controlling the unloading assembly to transport the ceramic substrate to the unloading conveyor belt.

[0047] The laser drilling equipment for ceramic substrate production and the working method thereof have the advantages that the ceramic substrate is adsorbed by the magnetic suction head directly contacting the ceramic substrate, and the ceramic substrate is buffered by the buffer member to avoid the ceramic substrate being pressed by the magnetic suction head when the magnetic suction head is lowered, thereby reducing the damage rate of the ceramic substrate during transfer.

[0048] Other features and advantages of the present application will be set forth in the descriptions that follow, and in part will be apparent from the description, or can be learned by practice of the application. The purposes and other advantages of the present application will be realized and attained by the structures particularly pointed out in the description, the claims and the appended drawings.

[0049] In order to make the above objectives, features and advantages of the present application more apparent, the preferred embodiments are specifically described herein, and the detailed description is made below with the accompanying drawings. BRIEF DESCRIPTION OF DRAWINGS

[0050] In order to more clearly illustrate the specific embodiments of the present application or the technical solutions in the prior art, the drawings required to be used in the specific embodiments or the prior art description will be briefly introduced below. Obviously, the drawings in the following description are some embodiments of the present application, and for those skilled in the art, other drawings can also be obtained without creative labor based on these drawings.

[0051] Figure 1 A structural schematic diagram of a laser drilling device for ceramic substrate production provided by the embodiments of the present disclosure is shown in the figure.

[0052] Figure 2 A structural schematic diagram of a magnetic suction head provided by the embodiments of the present disclosure is shown in the figure.

[0053] Figure 3 A top view of a magnetic suction head provided by the embodiments of the present disclosure is shown in the figure.

[0054] Figure 4 A top view of an anti-blocking part provided by the embodiments of the present disclosure is shown in the figure.

[0055] Figure 5 A first partial structural schematic diagram of an anti-blocking part provided by the embodiments of the present disclosure is shown in the figure.

[0056] Figure 6 A second partial structural schematic diagram of an anti-blocking part provided by the embodiments of the present disclosure is shown in the figure.

[0057] In the figure: 100, feeding conveyor belt; 200, discharging conveyor belt; 300, laser processing platform; 400, feeding assembly; 500, discharging assembly; 600, magnetic suction head; 610, connecting column; 620, buffer; 621, connecting plate; 622, elastic part; 6221, guide rod; 6221a, plug-in inclined block; 6222, buffer spring; 6223, anti-blocking part; 6223a, connecting frame; 6223b, first clamping block; 6223b1, abutting plate; 6223b2, plug-in slot; 6223c, second clamping block; 6223c1, proximity switch. DETAILED DESCRIPTION

[0058] In order to make the objects, technical solutions and advantages of the embodiments of the present application clearer, the technical solutions of the present application will be described clearly and completely below with reference to the drawings. Obviously, the described embodiments are some but not all of the embodiments of the present application. Based on the embodiments of the present application, all other embodiments obtained by those of ordinary skill in the art without creative efforts should fall within the scope of the present application.

[0059] As used herein, the phrases "in one embodiment", "according to one embodiment", "in some embodiments", and the like, generally mean the particular feature, structure, or characteristic following the phrase can be included in at least one embodiment of the present disclosure. Thus, features, structures, or characteristics can be included in more than one embodiment of the present disclosure, and the phrases "in one embodiment", "according to one embodiment", "in some embodiments", and the like, do not necessarily refer to the same embodiment. As used herein, the terms "for example", "e.g.", and the like, indicate that the particular feature, structure, or characteristic being described serves as an example, instance, or illustration. Any embodiment, aspect, or design described herein as "example" or "exemplary" is not necessarily to be construed as preferred or advantageous over other embodiments, aspects, or designs. Rather, the use of the terms "example", "exemplary", and the like, is intended to present concepts in a concrete manner.

[0060] It should be noted that similar reference numerals and letters refer to like items in the following drawings, and thus, once an item is defined in one drawing, it is not necessary to further define and explain it in subsequent drawings.

[0061] Some embodiments of the present application will be described in detail below with reference to the drawings. The following embodiments and features of the embodiments can be combined with each other without conflict.

[0062] Referring to Figure 1 , Figure 1 A structural schematic diagram of a laser drilling equipment for ceramic substrate production is shown, which comprises a feeding conveying belt 100, a discharging conveying belt 200, a laser processing platform 300, a feeding assembly 400 and a discharging assembly 500. The feeding conveying belt 100 and the discharging conveying belt 200 are arranged at the side edges of the laser processing platform 300. The feeding assembly 400 and the discharging assembly 500 are arranged on the laser processing platform 300. The feeding assembly 400 is adapted to convey the ceramic substrate on the feeding conveying belt 100 to the laser processing platform 300 for laser drilling. The discharging assembly 500 is adapted to convey the ceramic substrate after drilling to the discharging conveying belt 200 to complete discharging.

[0063] Referring to Figure 2The end of the feeding assembly 400 and the discharging assembly 500 is provided with a magnetic suction head 600; the magnetic suction head 600 comprises a connecting column 610, a buffer 620 and an electromagnet; the buffer 620 is arranged on the bottom surface of the connecting column 610; and the electromagnet is fixedly arranged on the bottom surface of the buffer 620. The ceramic substrate is adsorbed by the magnetic suction head 600 in direct contact with the ceramic substrate, and the buffer 620 is used for buffering, so that the ceramic substrate is prevented from being pressed by the magnetic suction head 600 when the magnetic suction head 600 is lowered, thereby reducing the damage rate of the ceramic substrate during transfer.

[0064] In some embodiments, the buffer 620 comprises a connecting plate 621 and a plurality of elastic parts 622; the bottom of the elastic part 622 is fixedly connected with the connecting plate 621, and the top of the elastic part 622 is fixedly connected with the connecting column through an anti-blocking part 6223.

[0065] The plurality of elastic parts 622 are evenly distributed along the circumference of the connecting plate 621, so that the impact force generated when the magnetic suction head 600 contacts the ceramic substrate is evenly absorbed, thereby reducing the deviation of the elastic part 622 and reducing the probability of jamming of the elastic part 622.

[0066] Specifically, the elastic part 622 comprises a guide rod 6221 and a buffer spring 6222; the buffer spring 6222 is sleeved on the guide rod 6221; the bottom of the guide rod 6221 is fixedly connected with the connecting plate 621; and the top of the guide rod 6221 penetrates through the anti-blocking part 6223.

[0067] The anti-blocking part 6223 is arranged to adjust the deviation of the guide rod 6221, thereby reducing the probability of jamming of the guide rod 6221.

[0068] Please refer to Figure 3 and Figure 4 In some embodiments, the anti-blocking part 6223 comprises a connecting frame 6223a, a first clamping block 6223b and a second clamping block 6223c; the first clamping block 6223b and the second clamping block 6223c are oppositely arranged and are slidingly arranged in the frame body of the connecting frame 6223a; the first clamping block 6223b and the second clamping block 6223c are elastically connected with the connecting frame 6223a through corresponding return springs; and the first clamping block 6223b and the second clamping block 6223c are arranged on both sides of the guide rod 6221 respectively and are suitable for clamping the guide rod 6221.

[0069] The guiding rod 6221 is limited by the first clamping block 6223b and the second clamping block 6223c. When the guiding rod 6221 deviates, the deviation of the guiding rod 6221 is buffered by the reset spring, so as to avoid the direct jamming of the guiding rod 6221. After the magnetic suction head 600 is separated from the ceramic substrate, the first clamping block 6223b and the second clamping block 6223c correct the guiding rod 6221 under the action of the reset spring, so as to reduce the probability of jamming of the guiding rod 6221.

[0070] In the preferred embodiment, the shapes of the fitting surfaces of the first clamping block 6223b and the second clamping block 6223c and the side wall of the guiding rod 6221 are matched.

[0071] In some embodiments, the side wall of the guiding rod 6221 is provided with two insertion inclined blocks 6221a, and the first clamping block 6223b and the second clamping block 6223c are provided with insertion grooves 6223b2 at the matched positions of the insertion inclined blocks 6221a. When the buffer spring 6222 is pressed, the two insertion inclined blocks 6221a on the guiding rod 6221 separate the first clamping block 6223b and the second clamping block 6223c, increase the clamping force of the guiding rod 6221, and further reduce the deviation of the guiding rod 6221 and the probability of jamming of the guiding rod 6221.

[0072] Please refer to Figures 5-6 In some embodiments, the top surface of the first clamping block 6223b is provided with a resisting plate 6223b1, and the top surface of the second clamping block 6223c is provided with a proximity switch 6223c1. The ceramic substrate production laser drilling equipment further comprises a control module. The control module is adapted to receive proximity information of the proximity switch 6223c1 and judge whether the guiding rod is jammed according to the proximity information.

[0073] Specifically, the step of receiving the proximity information of the proximity switch 6223c1 and judging whether the guiding rod is jammed according to the proximity information comprises: acquiring a buffer time T; when the control module continuously receives the proximity information, it indicates that the guiding rod is not jammed at this time; when the time t during which the control module does not receive the proximity information is greater than the buffer time T, it indicates that the guiding rod is jammed at this time, and a jamming reminder is issued.

[0074] The buffer time T is artificially set and needs to be greater than the time when the feeding assembly and the discharging assembly take materials.

[0075] In some embodiments, when the laser drilling equipment for ceramic substrate production is not working, the first clamping block 6223b and the second clamping block 6223c are pried apart, the buffer spring 6222 extends from the top of the first clamping block 6223b and the second clamping block 6223c, and the initial state is restored. In order to ensure the elasticity of the buffer spring 6222, when the laser drilling equipment for ceramic substrate production is not working, the first clamping block 6223b and the second clamping block 6223c are manually pried apart, thereby releasing the limit of the buffer spring 6222, making the buffer spring 6222 extend from the top of the first clamping block 6223b and the second clamping block 6223c, and the initial state is restored, thereby improving the service life of the buffer spring 6222.

[0076] At least one embodiment also provides a working method of the laser drilling equipment for ceramic substrate production as described above, comprising:

[0077] S110: transporting the ceramic substrate to the feeding conveying belt 100;

[0078] S120: the feeding assembly 400 transports the magnetic suction head 600 above the ceramic substrate, and pushes the magnetic suction head 600 downward until the magnetic suction head 600 contacts the ceramic substrate, and the electromagnet is powered on to adsorb the ceramic substrate;

[0079] S130: controlling the feeding assembly 400 to transport the ceramic substrate to the laser processing platform 300;

[0080] S140: drilling the ceramic substrate by the laser processing platform 300;

[0081] S150: after the drilling is completed, controlling the discharging assembly to transport the magnetic suction head 600 above the ceramic substrate, and pushing the magnetic suction head 600 downward until the magnetic suction head 600 contacts the ceramic substrate, and the electromagnet is powered on to adsorb the ceramic substrate;

[0082] S160: controlling the discharging assembly 500 to transport the ceramic substrate to the discharging conveying belt 200.

[0083] In summary, the application provides a laser drilling equipment for ceramic substrate production and a working method thereof, which comprises: a feeding conveyor belt 100, a discharging conveyor belt 200, a laser processing platform 300, a feeding assembly 400 and a discharging assembly 500; the feeding conveyor belt 100 and the discharging conveyor belt 200 are arranged on the side of the laser processing platform 300; the feeding assembly 400 and the discharging assembly 500 are arranged on the laser processing platform 300; the feeding assembly 400 is suitable for conveying the ceramic substrate on the feeding conveyor belt 100 to the laser processing platform 300 for laser drilling; the discharging assembly 500 is suitable for conveying the ceramic substrate after drilling to the discharging conveyor belt 200 to complete discharging. Wherein, the end of the feeding assembly 400 and the discharging assembly 500 is provided with a magnetic suction head 600; the magnetic suction head 600 comprises: a connecting column 610, a buffer 620 and an electromagnet; the buffer 620 is arranged on the bottom surface of the connecting column 610; the electromagnet is fixedly arranged on the bottom surface of the buffer 620. By adopting the magnetic suction head 600 directly contacting with the ceramic substrate, the ceramic substrate is adsorbed, and the buffer 620 is buffered, so that the ceramic substrate is prevented from being pressed by the magnetic suction head 600 when it is lowered, thereby reducing the damage rate of the ceramic substrate during transfer

[0084] The above is the ideal embodiment according to the application, and the related personnel can make various changes and modifications without deviating from the technical idea of the application. The technical scope of the application is not limited by the content of the specification, and must be determined by the scope of the claims.

Claims

1. A laser drilling device for producing ceramic substrates, characterized in that, The utility model relates to a laser drilling device for ceramic substrate, including: The upper feeding conveyor belt (100) and the lower feeding conveyor belt (200) are all arranged at the side of the laser processing platform (300); The upper feeding assembly (400) and the lower feeding assembly (500) are all arranged on the laser processing platform (300); The upper feeding assembly (400) is suitable for conveying the ceramic substrate on the upper feeding conveyor belt (100) to the laser processing platform (300) to carry out laser drilling; The lower feeding assembly (500) is suitable for conveying the ceramic substrate after drilling to the lower feeding conveyor belt (200) to complete lower feeding; The end of the upper feeding assembly (400) and the lower feeding assembly (500) is provided with a magnetic suction head (600); The magnetic suction head (600) includes: A connecting column (610), a buffer piece (620) and an electromagnet; The buffer piece (620) is arranged on the bottom surface of the connecting column (610); The electromagnet is fixedly arranged on the bottom surface of the buffer piece (620); The buffer piece (620) includes a connecting plate (621) and a plurality of elastic parts (622); The plurality of elastic parts are evenly distributed along the circumference of the connecting plate; The bottom of the elastic part (622) is fixedly connected with the connecting plate (621), and the top of the elastic part (622) is fixedly connected with the connecting column (610) through an anti-blocking part (6223); The elastic part (622) includes a guide rod (6221) and a buffer spring (6222); The buffer spring (6222) is sleeved on the guide rod (6221); The bottom of the guide rod (6221) is fixedly connected with the connecting plate (621); The top of the guide rod (6221) penetrates through the anti-blocking part (6223); The anti-blocking part (6223) includes a connecting frame (6223a), a first clamping block (6223b) and a second clamping block (6223c); The first clamping block (6223b) and the second clamping block (6223c) are oppositely arranged and are slidingly arranged in the frame body of the connecting frame (6223a); The first clamping block (6223b) and the second clamping block (6223c) are elastically connected with the connecting frame (6223a) through corresponding return springs; The first clamping block (6223b) and the second clamping block (6223c) are arranged on both sides of the guide rod (6221) respectively and are suitable for clamping the guide rod (6221); The shapes of the abutting surfaces of the first clamping block (6223b) and the second clamping block (6223c) and the side wall of the guide rod (6221) are adapted to the side wall of the guide rod (6221); The side wall of the guide rod (6221) is provided with two plug-in inclined blocks (6221a); The plug-in inclined blocks (6221a) are adapted to the plug-in grooves (6223b2) formed in the first clamping block (6223b) and the second clamping block (6223c). ​ 2.The laser drilling device for ceramic substrate production of claim 1, wherein, a top surface of the first clamping block (6223b) is provided with a contact plate (6223b1) ; a top surface of the second clamping block (6223c) is provided with a proximity switch (6223c1) ; the laser drilling device for ceramic substrate production further comprises a control module; the control module is adapted to receive proximity information of the proximity switch (6223c1) and determine whether the guide rod (6221) is stuck according to the proximity information. 3.The laser drilling device for ceramic substrate production of claim 2, wherein, the step of receiving proximity information of the proximity switch (6223c1) and determining whether the guide rod (6221) is stuck according to the proximity information comprises: acquiring a buffer time T; when the control module continuously receives proximity information, it indicates that the guide column is not stuck at this time; when the time t that the control module does not receive proximity information is greater than the buffer time T, it indicates that the guide column is stuck at this time, and a stuck reminder is sent. 4.The laser drilling device for ceramic substrate production of claim 1, wherein, when the laser drilling device for ceramic substrate production is not working, the first clamping block (6223b) and the second clamping block (6223c) are pried open, the buffer spring (6222) extends from the top of the first clamping block (6223b) and the second clamping block (6223c), and the initial state is restored.

5. A working method of a laser drilling apparatus for ceramic substrate production as claimed in any one of claims 1 to 4, characterized in that, comprises: transporting the ceramic substrate to the feeding conveyor (100) ; the feeding assembly (400) transports the magnetic suction head (600) above the ceramic substrate, and pushes the magnetic suction head (600) downward until the magnetic suction head (600) contacts the ceramic substrate, and the electromagnet is powered on to adsorb the ceramic substrate; controlling the feeding assembly (400) to transport the ceramic substrate to the laser processing platform (300) ; drilling the ceramic substrate by the laser processing platform (300) ; after drilling is completed, controlling the discharging assembly (500) to transport the magnetic suction head (600) above the ceramic substrate, and pushing the magnetic suction head (600) downward until the magnetic suction head (600) contacts the ceramic substrate, and the electromagnet is powered on to adsorb the ceramic substrate; controlling the discharging assembly (500) to transport the ceramic substrate to the discharging conveyor (200).

Images