Wafer edge grinding equipment and using method thereof

Abstract

The invention relates to the technical field of wafer polishing, and discloses wafer edge polishing equipment and a using method thereof.The wafer edge polishing equipment comprises a wafer, a protective positioning layer is arranged on the outer wall of the wafer, limiting cones are arranged at the top and the bottom of the wafer, and the tops of the limiting cones at the top of the wafer are fixedly connected to the output end of a hydraulic cylinder; a connecting seat is arranged at the top of the hydraulic cylinder, a motor corresponding to the hydraulic cylinder in position is arranged in the connecting seat, the outer wall of the motor is fixedly connected to the inner wall of the connecting seat, the output end of the motor is fixedly connected to the top end of the hydraulic cylinder through a connecting shaft, and a supporting rod is fixedly connected to the bottom of a limiting cone at the bottom of the wafer. And the supporting rod is rotationally connected to the ground. According to the wafer grinding device, the motor is arranged in the connecting base, then a wafer fixed to the middle of the two limiting cones is driven to rotate, the side, provided with a grinding opening, of the grinding block can be pushed to the edge of the wafer through the electric push rod, and therefore the problem that work is discontinuous, and consequently the efficiency is low is solved.

Description

Technical Field

[0001] The present invention relates to the technical field of wafer grinding, and in particular to a wafer edge grinding device and a use method thereof. Background Art

[0002] Wafer refers to the silicon wafer used to make silicon semiconductor circuits. Its raw material is silicon. High-purity polysilicon is dissolved and mixed with silicon crystal seeds, and then slowly pulled out to form cylindrical single crystal silicon. After grinding, polishing and slicing, the silicon crystal rod is formed into a silicon wafer, that is, a wafer. Domestic wafer production lines are mainly 8-inch and 12-inch.

[0003] After searching, the announcement number: CN202210818874.2 discloses a floating wafer edge grinding method and device, including a fixed grinding table symmetrically arranged at the upper and lower ends, an overflow grinding bucket is provided at the upper end of the fixed grinding table, the overflow grinding bucket includes a water overflow bucket, an overflow grinding ring is provided at the upper end of the water overflow bucket, a plurality of seepage holes are opened on the inner wall of the water overflow bucket, a water inlet pipe connected to the seepage hole is provided inside the fixed grinding table, a clamping cone is slidably penetrated in the middle of the overflow grinding bucket, the clamping cone includes a sliding rod, a motor corresponding to the position of the sliding rod is provided inside the fixed grinding table, the output end of the motor is connected to the sliding rod, a limiting cone is provided at the upper end of the sliding rod, a scanning positioning groove is provided in the middle of the upper end of the limiting cone, an infrared scanning module is provided inside the scanning positioning groove, a negative pressure groove is provided at the upper end of the limiting cone, an air collecting cavity is provided inside the limiting cone, a plurality of air suction holes connected to the inside of the air collecting cavity are opened on the inner wall of the negative pressure groove, an air pump is provided inside the limiting cone, and the air pump is connected to the air collecting cavity.

[0004] In the above invention, it is necessary to use an electric rotating ring to drive the upper rotating petal and the lower rotating petal to exchange positions so that the upper and lower side walls of the wafer can be evenly polished. This will cause intermittent work, resulting in discontinuous work, and thus causing the problem of low efficiency. For this reason, we propose a wafer edge polishing device and its use method. Summary of the invention

[0005] In order to make up for the shortcomings of the above invention, the present invention proposes a wafer edge grinding device and a method of using the same, aiming to improve the problem in the above invention that an electric rotating ring is needed to drive the upper rotating flap and the lower rotating flap to exchange positions, so that both the upper and lower side walls of the wafer can be evenly polished, which will cause intermittent work, resulting in discontinuous work and thus causing low efficiency.

[0006] To achieve the above objectives, the present invention is implemented through the following technical solutions: a wafer edge grinding device and a method of using the same, comprising a wafer, the outer wall of the wafer is provided with a protective positioning layer, the top and bottom of the wafer are provided with limiting cones, the top of the limiting cone at the top of the wafer is fixedly connected to the output end of the hydraulic cylinder, the top of the hydraulic cylinder is provided with a connecting seat, a motor corresponding to the position of the hydraulic cylinder is provided inside the connecting seat, the outer wall of the motor is fixedly connected to the inner wall of the connecting seat, the output end of the motor is fixedly connected to the top of the hydraulic cylinder through a connecting shaft, the bottom of the limiting cone at the bottom of the wafer is fixedly connected to a support rod, the support rod is rotatably connected to the bottom of the splash-proof bucket, the inner wall of the splash-proof bucket is provided with a grinding block, the inner wall of the grinding block is provided with a grinding port, the top of the grinding block is provided with a water spray head, the rear part of the water spray head is connected to the splash-proof bucket through a water pipe and is finally connected to an external water source, and the top of the connecting seat is provided with a sliding translation device.

[0007] Preferably, the sliding translation device includes a top bar and a sliding block, one end of the top bar is fixedly connected to the top of the connecting seat, and the other end is slidably connected to the bottom of the top bar, and legs are fixedly connected to both sides of the top bar.

[0008] Preferably, an electric push rod is provided between the grinding block and the splash-proof bucket, one end of the electric push rod is fixedly connected to a side of the grinding block away from the grinding opening, and the other end of the electric push rod is fixedly connected to the inner wall of the splash-proof bucket.

[0009] Preferably, a one-way filter plate is provided at the lower portion of the splash-proof barrel, and the support rod passes through the center of the one-way filter plate.

[0010] Preferably, a scanning positioning groove is opened in the middle of the upper end of the limiting cone, an infrared scanning module is arranged inside the scanning positioning groove, a negative pressure groove is opened at the upper end of the limiting cone, an air collecting cavity is arranged inside the limiting cone, a plurality of air suction holes connected to the inside of the air collecting cavity are opened on the inner wall of the negative pressure groove, an air pump is arranged inside the limiting cone, and the air pump is connected to the air collecting cavity.

[0011] Preferably, a fine-tuning ring groove is provided at the upper end of the limiting cone, a pressure-equalizing flap is provided at the upper end of the fine-tuning ring groove, a liquid inlet hole is provided inside the fine-tuning ring groove, and the liquid inlet hole is connected to an external water tank through a liquid pump.

[0012] Preferably, a plurality of fine-tuning rods are equidistantly arranged in a circular shape inside the fine-tuning groove ring, the upper ends of the fine-tuning rods are connected to the pressure equalizing flap, and the fine-tuning rods are electrically connected to an external control module.

[0013] Preferably, a close-fitting layer is provided at the upper end of the limiting cone, a plurality of adsorption grooves are opened at the upper end of the close-fitting layer, and the close-fitting layer is made of silicone material.

[0014] Working principle:

[0015] The hydraulic cylinder is started to retract the limiting cone upwards, and the hydraulic cylinder and the limiting cone are moved to the right side of the splash-proof bucket through the slider. After reaching the upper part of the wafer to be processed, the limiting cone is lowered by the hydraulic cylinder. When reaching the surface of the wafer to be processed, the wafer is positioned by scanning the infrared scanning module inside the positioning groove to find the center point of the wafer. After positioning, the wafer is attracted and fixed by the negative pressure groove on the surface of the limiting cone, and then the limiting cone with the wafer is raised by the hydraulic cylinder, and then moved to the upper part of the splash-proof bucket through the slider, and the limiting cone with the wafer is lowered to the upper top of the limiting cone at the top of the support rod by the hydraulic cylinder, and the motor inside the connecting seat is started, thereby The wafer to be processed is driven to rotate rapidly, the water spray head is started to spray water forward, and then the electric push rod is started to push the grinding block to the outer wall of the wafer until the grinding port contacts the outer wall of the wafer. During this period, the water spray head sprays water continuously. After grinding to the requirements, the grinding block is retracted by the electric push rod, and then the limiting cone on the top of the support rod is controlled to inflate air into the negative pressure groove to separate the wafer from the limiting cone at the bottom, and the processed wafer is lifted up by the hydraulic cylinder, and then the processed wafer is moved to the right side of the splash-proof bucket by the slider. After moving into place, the limiting cone at the bottom of the hydraulic cylinder is controlled to inflate air into the negative pressure groove to separate the wafer from the limiting cone at the top to complete the grinding work.

[0016] The present invention provides a wafer edge grinding device and a method for using the same. The device has the following beneficial effects:

[0017] 1. In the present invention, a motor is arranged inside the connecting seat to drive the wafer fixed in the middle of the two limiting cones to rotate, and the electric push rod can push one side of the grinding port of the grinding block to the edge of the wafer. Since the upper and lower parts of the grinding port are chamfered, they can be ground and formed at one time without the need for the reverse side, thereby improving the above invention which needs to use an electric rotating ring to drive the upper rotating petal and the lower rotating petal to exchange positions, so that the upper and lower side walls of the wafer can be evenly ground, which will cause intermittent work, resulting in discontinuous work, thereby causing the problem of low efficiency.

[0018] 2. In the present invention, an external water source can be transported to the inside of the water spray head through a water pipe, and then the water source is sprayed to the surface of the wafer through the water spray head, thereby washing away the fine debris generated during the polishing of the wafer, thereby preventing the fine debris from scratching the surface of the wafer.

[0019] 3. In the present invention, the motor can drive the wafer to rotate, so as to perform grinding on one side of the grinding opening of the grinding block, and at the same time, the water sprayed onto the surface of the wafer can be thrown around, so as to prevent the fine debris formed by grinding from splashing to the middle of the wafer. BRIEF DESCRIPTION OF THE DRAWINGS

[0020] Figure 1 It is a schematic diagram of the structure of the wafer of the present invention;

[0021] Figure 2 A perspective view of the present invention;

[0022] Figure 3 It is a structural breakdown diagram of the present invention;

[0023] Figure 4 It is a three-dimensional diagram of the limiting cone of the present invention;

[0024] Figure 5 This is a structural breakdown diagram of the limiting cone of the present invention;

[0025] Figure 6 It is a three-dimensional view of the grinding block of the present invention.

[0026] Among them, 1. Protective positioning layer; 2. Wafer; 3. Top strip; 4. Leg; 5. Hydraulic cylinder; 6. Limit cone; 7. Splash bucket; 8. Slider; 9. Connecting seat; 10. One-way filter plate; 11. Grinding block; 12. Water spray head; 13. Support rod; 14. Negative pressure groove; 15. Pressure equalizing flap; 16. Scanning positioning groove; 17. Fine-tuning rod; 18. Water pipe; 19. Electric push rod; 20. Grinding mouth. DETAILED DESCRIPTION

[0027] The technical solution of the present invention will be described clearly and completely below in conjunction with the accompanying drawings of the present invention. Obviously, the described embodiments are only part of the embodiments of the present invention, not all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the present invention.

[0028] Example:

[0029] Please see attached Figure 1 -Attached Figure 6The embodiment of the present invention provides a wafer edge grinding device, including a wafer 2, wherein the outer wall of the wafer 2 is provided with a protective positioning layer 1, and the protective positioning layer 1 is doped with infrared reflective particles. Under the scanning of the infrared scanning module, a three-dimensional coordinate system can be established for the wafer 2, and the center point of the wafer 2 can be found, thereby improving the stability of the wafer 2 during the rotation process. At the same time, the protective positioning layer 1 is made of a water-soluble gel and can be gradually dissolved under the erosion of water flow. After the grinding is completed, there is no need to perform unnecessary cleaning on the wafer 2, thereby reducing the process steps. Limiting cones 6 are provided on the top and bottom of the wafer 2, and the limiting cones 6 play a role in fixing the wafer 2. The top of the limiting cone 6 on the top of the wafer 2 is fixedly connected to the output end of the hydraulic cylinder 5, and the hydraulic cylinder 5 plays a role in changing the height of the limiting cone 6. A connecting seat 9 is provided on the top of the hydraulic cylinder 5, and the connecting seat 9 plays a role in connecting the hydraulic cylinder 5 and the slider 8. A motor corresponding to the position of the hydraulic cylinder 5 is provided inside the connecting seat 9, and the outer wall of the motor is fixedly connected to the inner wall of the connecting seat 9, and the output end of the motor is fixedly connected to the hydraulic cylinder 5 through a connecting shaft. The top of the pressure cylinder 5 can drive the hydraulic cylinder 5 to rotate through the output end of the motor, thereby driving the wafer 2 to rotate. The bottom of the limiting cone 6 at the bottom of the wafer 2 is fixedly connected with a support rod 13, and the support rod 13 plays the role of supporting the limiting cone 6. The support rod 13 is rotatably connected to the bottom of the splash-proof bucket 7, and the splash-proof bucket 7 plays the role of collecting the waste residue after grinding and the water source sprayed by the water spray head 12. The inner wall of the splash-proof bucket 7 is provided with a grinding block 11, and the grinding block 11 plays the role of grinding the edge of the wafer 2. The inner wall of the grinding block 11 is provided with a grinding opening 20 The corner of the grinding mouth 20 is an arc-shaped chamfer, which can grind the upper and lower sides of the wafer 2 at the same time. A water spray head 12 is arranged on the top of the grinding block 11. The water spray head 12 sprays water to the surface of the wafer 2. The rear part of the water spray head 12 is connected to the splash-proof bucket 7 through the water pipe 18 and is finally connected to an external water source. Water can be transported to the water spray head 12 through the water pipe 18. A sliding translation device is arranged on the top of the connecting seat 9. The sliding translation device can be used to take the wafer 2 to be processed, and the processed wafer 2 can also be placed.

[0030] The sliding translation device includes a top strip 3 and a slider 8. The length of the top strip 3 is not less than three times the length of the splash-proof bucket 7, so that there is a certain amount of space for taking. One end of the top strip 3 is fixedly connected to the top of the connecting seat 9, and the other end is slidably connected to the bottom of the top strip 3. Legs 4 are fixedly connected to both sides of the top strip 3.

[0031] An electric push rod 19 is arranged between the grinding block 11 and the splash-proof bucket 7 , one end of the electric push rod 19 is fixedly connected to a side of the grinding block 11 away from the grinding opening 20 , and the other end of the electric push rod 19 is fixedly connected to the inner wall of the splash-proof bucket 7 .

[0032] A one-way filter plate 10 is provided at the lower part of the splash-proof barrel 7 , through which the water source carrying the grinding debris can be filtered, and a support rod 13 runs through the center of the one-way filter plate 10 .

[0033] A scanning positioning groove 16 is provided in the middle of the upper end of the limiting cone 6, and an infrared scanning module is provided inside the scanning positioning groove 16. A negative pressure groove 14 is provided at the upper end of the limiting cone 6, and an air collecting cavity is provided inside the limiting cone 6. A plurality of air suction holes connected to the air collecting cavity are provided on the inner wall of the negative pressure groove 14. An air pump is provided inside the limiting cone 6, and the air pump is connected to the air collecting cavity, thereby achieving the effect of effectively fixing the wafer 2.

[0034] A fine-tuning ring groove is provided at the upper end of the limiting cone 6, and a pressure equalizing flap 15 is provided at the upper end of the fine-tuning ring groove. A liquid inlet hole is provided inside the fine-tuning ring groove, and the liquid inlet hole is connected to an external water tank through a liquid pump. The liquid pump is used to pump liquid into the fine-tuning ring groove, so that the pressure equalizing flap 15 expands and contacts the wafer 2, effectively absorbing the vibration generated during the grinding process of the wafer 2 and reducing the damage of the wafer 2 caused by the vibration.

[0035] A plurality of fine-tuning rods 17 are equidistantly arranged in a circular shape inside the fine-tuning groove ring. The upper ends of the fine-tuning rods 17 are connected to the pressure-equalizing flap 15. The fine-tuning rods 17 are electrically connected to an external control module. The fine-tuning rods 17 are utilized to push the wafer 2 to correct its shape, thereby offsetting the shape deviation caused by the adsorption force of the negative pressure groove 14 on the wafer 2.

[0036] A close contact layer is provided at the upper end of the limiting cone 6, and a plurality of adsorption grooves are opened at the upper end of the close contact layer. The close contact layer is made of silicone material. The adsorption grooves on the close contact layer increase the adsorption force on the wafer 2 and make the adsorption force on the wafer 2 more uniform.

[0037] A method for using a wafer edge grinding device comprises the following steps:

[0038] S1, start the hydraulic cylinder 5 to retract the limiting cone 6 upwards;

[0039] S2, move the hydraulic cylinder 5 together with the limiting cone 6 to the right side of the splash-proof bucket 7 through the slider 8;

[0040] S3, after reaching the upper part of the wafer 2 to be processed, the limiting cone 6 is lowered by the hydraulic cylinder 5, and when reaching the surface of the wafer 2 to be processed, the infrared scanning module inside the scanning positioning groove 16 is used to position the wafer 2 to find the center point of the wafer 2;

[0041] S4, after positioning is completed, the wafer 2 is attracted and fixed by the negative pressure groove 14 on the surface of the limiting cone 6;

[0042] S5, then the limiting cone 6 with the wafer 2 is raised by the hydraulic cylinder 5, and then moved to the upper part of the splash-proof bucket 7 by the slider 8;

[0043] S6, lowering the limiting cone 6 with the wafer 2 to the upper top of the limiting cone 6 at the top of the support rod 13 through the hydraulic cylinder 5;

[0044] S7, starting the motor inside the connection seat 9, thereby driving the wafer 2 to be processed to rotate rapidly;

[0045] S8, start the water spray head 12 to spray water forward, and then start the electric push rod 19 to push the grinding block 11 toward the outer wall of the wafer 2 until the grinding opening 20 contacts the outer wall of the wafer 2, during which the water spray head 12 keeps spraying water;

[0046] S9, after grinding to the required level, the grinding block 11 is retracted by the electric push rod 19, and then the limiting cone 6 at the top of the support rod 13 is controlled to inflate air into the negative pressure tank 14 so that the wafer 2 is separated from the limiting cone 6 at the bottom;

[0047] S10, lifting the processed wafer 2 upwards by the hydraulic cylinder 5, and then moving the processed wafer 2 to the right side of the splash-proof bucket 7 by the slider 8;

[0048] S11, after moving into position, controlling the limiting cone 6 at the bottom of the hydraulic cylinder 5 to inflate air into the negative pressure groove 14 so that the wafer 2 is separated from the limiting cone 6 at the top to complete the grinding work.

[0049] Although embodiments of the present invention have been shown and described, it will be appreciated by those skilled in the art that various changes, modifications, substitutions and variations may be made to the embodiments without departing from the principles and spirit of the present invention, and that the scope of the present invention is defined by the appended claims and their equivalents.

Claims

1. A wafer edge grinding device, comprising a wafer (2), characterized in that: The outer wall of the wafer (2) is provided with a protective positioning layer (1), the top and bottom of the wafer (2) are both provided with limiting cones (6), the top of the limiting cone (6) at the top of the wafer (2) is fixedly connected to the output end of the hydraulic cylinder (5), the top of the hydraulic cylinder (5) is provided with a connecting seat (9), a motor corresponding to the position of the hydraulic cylinder (5) is provided inside the connecting seat (9), the outer wall of the motor is fixedly connected to the inner wall of the connecting seat (9), the output end of the motor is fixedly connected to the top of the hydraulic cylinder (5) via a connecting shaft, and the The bottom of the limiting cone (6) at the bottom of the wafer (2) is fixedly connected to a support rod (13), and the support rod (13) is rotatably connected to the bottom of the splash-proof bucket (7). The inner wall of the splash-proof bucket (7) is provided with a grinding block (11), and the inner wall of the grinding block (11) is provided with a grinding opening (20). The top of the grinding block (11) is provided with a water spray head (12), and the rear part of the water spray head (12) is connected to the splash-proof bucket (7) through a water pipe (18) and is finally connected to an external water source. The top of the connecting seat (9) is provided with a sliding translation device.

2. The wafer edge grinding device according to claim 1, characterized in that: The sliding translation device comprises a top bar (3) and a sliding block (8), one end of the top bar (3) is fixedly connected to the top of a connecting seat (9), and the other end is slidably connected to the bottom of the top bar (3), and legs (4) are fixedly connected to both sides of the top bar (3).

3. The wafer edge grinding device according to claim 1, characterized in that: An electric push rod (19) is arranged between the grinding block (11) and the splash-proof bucket (7), one end of the electric push rod (19) is fixedly connected to a side of the grinding block (11) away from the grinding opening (20), and the other end of the electric push rod (19) is fixedly connected to the inner wall of the splash-proof bucket (7).

4. The wafer edge grinding device according to claim 3, characterized in that: A one-way filter plate (10) is arranged at the lower part of the splash-proof barrel (7), and the support rod (13) passes through the center of the one-way filter plate (10).

5. The wafer edge grinding device according to claim 1, characterized in that: A scanning positioning groove (16) is provided in the middle of the upper end of the limiting cone (6), an infrared scanning module is provided inside the scanning positioning groove (16), a negative pressure groove (14) is provided at the upper end of the limiting cone (6), an air collecting cavity is provided inside the limiting cone (6), a plurality of air suction holes connected to the inside of the air collecting cavity are provided on the inner wall of the negative pressure groove (14), and an air pump is provided inside the limiting cone (6), and the air pump is connected to the air collecting cavity.

6. The wafer edge grinding device according to claim 5, characterized in that: The upper end of the limiting cone (6) is provided with a fine-tuning ring groove, the upper end of the fine-tuning ring groove is provided with a pressure equalizing flap (15), and a liquid inlet hole is provided inside the fine-tuning ring groove, and the liquid inlet hole is connected to an external water tank through a liquid pump.

7. The wafer edge grinding device according to claim 6, characterized in that: A plurality of fine-tuning rods (17) are equidistantly arranged in an annular manner inside the fine-tuning groove ring, the upper ends of the fine-tuning rods (17) are connected to the pressure equalizing flap (15), and the fine-tuning rods (17) are electrically connected to an external control module.

8. The wafer edge grinding device according to claim 3, characterized in that: The upper end of the limiting cone (6) is provided with a close-fitting layer, the upper end of the close-fitting layer is provided with a plurality of adsorption grooves, and the close-fitting layer is made of a silica gel material.

9. A method for using a wafer edge grinding device according to any one of claims 1 to 8, comprising the following steps: S1, starting the hydraulic cylinder (5) to retract the limiting cone (6) upwards; S2, moving the hydraulic cylinder (5) together with the limiting cone (6) to the right side of the splash-proof bucket (7) through the slider (8); S3, after reaching the upper part of the wafer (2) to be processed, the limiting cone (6) is lowered by the hydraulic cylinder (5), and when reaching the surface of the wafer (2) to be processed, the infrared scanning module inside the scanning positioning groove (16) is used to position the wafer (2) and find the center point of the wafer (2); S4, after positioning is completed, the wafer (2) is attracted and fixed by the negative pressure groove (14) on the surface of the limiting cone (6); S5, then the limiting cone (6) with the wafer (2) is raised by the hydraulic cylinder (5), and then moved to the upper part of the splash-proof bucket (7) by the slider (8); S6, lowering the limiting cone (6) with the wafer (2) to the upper top of the limiting cone (6) at the top of the support rod (13) by means of a hydraulic cylinder (5); S7, starting the motor inside the connection seat (9), thereby driving the wafer (2) to be processed to rotate rapidly; S8, starting the water spray head (12) to spray water forward, and then starting the electric push rod (19) to push the grinding block (11) toward the outer wall of the wafer (2) until the grinding opening (20) contacts the outer wall of the wafer (2), during which the water spray head (12) continuously sprays water; S9, after grinding to the required level, the grinding block (11) is retracted by the electric push rod (19), and then the limiting cone (6) at the top of the support rod (13) is controlled to inflate air into the negative pressure tank (14) so ​​that the wafer (2) is separated from the limiting cone (6) at the bottom; S10, lifting the processed wafer (2) upwards by means of a hydraulic cylinder (5), and then moving the processed wafer (2) to the right side of the splash-proof bucket (7) by means of a slider (8); S11, after moving into position, controlling the limiting cone (6) at the bottom of the hydraulic cylinder (5) to inflate air into the negative pressure groove (14), thereby separating the wafer (2) from the limiting cone (6) at the top, thereby completing the grinding work.

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