Display device, tiled display device and picture adjustment method

Abstract

The application provides a display device, a spliced display device and a picture adjusting method, relates to the technical field of display, and the display device comprises a display panel, a backlight module and a plurality of light emitting devices, the display panel is located on the light emitting side of the backlight module, the plurality of light emitting devices are arranged on at least one side of the circumferential side of the display panel, and the orthographic projection of the light emitting device on the light emitting surface of the backlight module and the orthographic projection of the display panel on the light emitting surface of the backlight module do not overlap each other. The display device can be used for preparing a spliced display device with zero splicing seams.

Description

TECHNICAL FIELD

[0001] The present application relates to the technical field of display, in particular to a display device, a spliced display device and a picture adjusting method. BACKGROUND

[0002] With the development of science and technology, the application of spliced display devices is more and more widely. The spliced display device is usually spliced by a plurality of independent display devices, and each independent display device comprises a display panel and a backlight module.

[0003] However, there is a black frame at the joint position of the spliced display device, which reduces the display effect of the spliced display device. The joint width is an important physical parameter of the spliced display device. In order to reduce the joint width, the frame of the spliced display device is gradually reduced from 2mm to 0.88mm. Further reducing the joint width is not easy to achieve due to the limitation of the existing process. SUMMARY

[0004] To achieve the above purpose, the embodiments of the present application adopt the following technical solutions:

[0005] In a first aspect, the embodiments of the present application provide a display device, comprising:

[0006] a display panel, the display panel comprising a display area and a peripheral area surrounding the display area;

[0007] a backlight module, electrically connected with the display panel, the display panel being located on the light emitting side of the backlight module;

[0008] a plurality of light emitting devices, disposed on at least one side of the peripheral side of the display panel; the orthogonal projection of the light emitting device on the light emitting surface of the backlight module and the orthogonal projection of the display panel on the light emitting surface of the backlight module do not overlap each other.

[0009] In at least one embodiment of the present application, the display panel comprises a first side, the first side intersects with the light emitting surface of the display panel;

[0010] the display device comprises a plurality of first conductive pad groups, the first conductive pad groups are disposed on the first side, the light emitting device is located on the side of the first conductive pad group away from the first side; one first conductive pad group comprises at least two conductive pads, one light emitting device is electrically connected with each conductive pad in the same first conductive pad group.

[0011] In at least one embodiment of the present application, the display panel comprises an array substrate and a color film substrate arranged oppositely, the first side comprises a first region located on the array substrate and a second region located on the color film substrate;

[0012] The light emitting device and the first conductive pad group are arranged in the first region, and / or the light emitting device and the first conductive pad group are arranged in the second region.

[0013] In at least one embodiment of the present application, the peripheral region includes a binding sub-region, the binding sub-region includes a second side surface, the second side surface intersects with a light exit surface of the display panel;

[0014] The display device includes a plurality of second conductive pad groups, each of the second conductive pad groups includes at least one conductive pad, the second conductive pad groups are arranged on the second side surface, the display panel includes an array substrate and a color film substrate arranged oppositely, and the second conductive pad groups are electrically connected with a drive circuit on the array substrate.

[0015] In at least one embodiment of the present application, the second side surface includes a third region on the array substrate and a fourth region on the color film substrate;

[0016] The second conductive pad groups are arranged in the third region, and / or the second conductive pad groups are arranged in the fourth region.

[0017] In at least one embodiment of the present application, the plurality of light emitting devices includes a first light emitting device, a second light emitting device and a third light emitting device, the light emitting colors of the first light emitting device, the second light emitting device and the third light emitting device are different;

[0018] One of the first light emitting device, one of the second light emitting device and one of the third light emitting device are packaged into one light emitting unit, the light emitting unit extends from a region on the array substrate on the first side surface to a region on the color film substrate on the first side surface.

[0019] In at least one embodiment of the present application, a planar size of each conductive pad in the second conductive pad group is greater than a planar size of each conductive pad in the first conductive pad group, and the conductive pad in the second conductive pad group extends from a region on the array substrate on the second side surface to a region on the color film substrate on the second side surface.

[0020] In at least one embodiment of the present application, the first side surface and the second side surface are the same side surface, and a region between two adjacent light emitting units is provided with at least one second conductive pad group;

[0021] The display device further includes a chip on film, the chip on film covers the second conductive pad groups and extends to a side surface of the backlight module, and a normal projection of the chip on film on the first side surface does not overlap with a normal projection of the light emitting unit on the first side surface.

[0022] The first conductive pad group and the COF are electrically connected, and the second conductive pad group and the COF are bonded together.

[0023] In at least one embodiment of the present application, the first conductive pad group includes positive conductive pads and negative conductive pads, the light emitting unit includes a first pin, a second pin, a third pin and a fourth pin, the positive conductive pads of the first light emitting device, the second light emitting device and the third light emitting device are electrically connected to the first pin, the negative conductive pad of the first light emitting device is electrically connected to the second pin, the negative conductive pad of the second light emitting device is electrically connected to the third pin, and the negative conductive pad of the third light emitting device is electrically connected to the fourth pin.

[0024] The COF covers at least part of the first pin, the second pin, the third pin and the fourth pin, and the COF is bonded to the first pin, the second pin, the third pin and the fourth pin, respectively.

[0025] In at least one embodiment of the present application, the first side and the second side are different sides, and the display device further includes a COF, the COF covering the second conductive pad group and extending to the side of the backlight module.

[0026] The part of the array substrate in the peripheral area further includes a plurality of bonding leads, the first conductive pad group being electrically connected to the COF through the bonding leads, and the second conductive pad group being bonded to the COF.

[0027] In at least one embodiment of the present application, the display device further includes at least one circuit board and at least one L-shaped protective plate, the circuit board being electrically connected to the COF, and the circuit board and the COF being arranged on the same side of the backlight module, and the circuit board being further electrically connected to the backlight module; the circuit board is configured to drive the display panel and the light emitting device simultaneously.

[0028] Part of the protective plate is arranged on the side of the circuit board away from the backlight module, and another part of the protective plate is arranged on the side of the circuit board away from the COF.

[0029] In at least one embodiment of the present application, the display panel further includes at least one third side in addition to the first side, the third side being located in the part of the color film substrate provided with a reflective surface, and the included angle between the reflective surface and a reference surface being an acute angle, the reference surface being a plane perpendicular to the light output surface of the display panel.

[0030] In at least one embodiment of the present application, the acute angle ranges from greater than 0° to less than or equal to 30°.

[0031] In at least one embodiment of the present application, the display device further comprises a reflection portion covering the reflection surface.

[0032] In at least one embodiment of the present application, the light-emitting device has a light-emitting angle ranging from 30° to 60°.

[0033] In at least one embodiment of the present application, the display device further comprises a buffer layer and a plurality of encapsulation portions covering at least light-emitting surfaces of the light-emitting devices, and the buffer layer covers side surfaces of the display panel in which the light-emitting devices are arranged, and the buffer layer comprises a plurality of openings in which the light-emitting devices are arranged.

[0034] In a second aspect, embodiments of the present application provide a spliced display device, comprising at least a first display device and a second display device, wherein the first display device and the second display device are any one of the display devices of the first aspect.

[0035] In the first display device and the second display device, the first display device comprises a first splicing edge, and the second display device comprises a second splicing edge, and the first splicing edge and the second splicing edge are spliced together; a plurality of light-emitting devices are arranged on side surfaces of a region where the first splicing edge or the second splicing edge is located.

[0036] In at least one embodiment of the present application, a plurality of light-emitting devices are arranged on side surfaces of a region where one of the first splicing edge and the second splicing edge is located, and a reflection surface is arranged on side surfaces of a region where the other is located.

[0037] In at least one embodiment of the present application, the spliced display device further comprises a light-adjusting layer and a light-transmitting protective layer, the light-adjusting layer has an arc-shaped light-emitting surface, and the light-adjusting layer comprises a light-transmitting material and diffusion particles; the light-adjusting layer is located in a region between the first splicing edge and the second splicing edge, and covers the light-emitting devices and the reflection surface; and the light-transmitting protective layer covers the light-adjusting layer.

[0038] In at least one embodiment of the present application, the color film substrate of the first display device and the color film substrate of the second display device are both provided with a light-shielding layer near a region where the first splicing edge or the second splicing edge is located, and the light-shielding layer is configured to block light of the light-emitting devices.

[0039] In a third aspect, embodiments of the present application provide a picture adjusting method applied to the spliced display device of any one of the second aspect, and the method comprises:

[0040] Obtaining luminance data and chrominance data of the display panel and the light emitting device under preset conditions respectively; the preset conditions include the same gray scale or the same color of pure screen;

[0041] Comparing and calculating the difference of the luminance data and the difference of the chrominance data of the display panel and the light emitting device under the same conditions;

[0042] According to the difference of the luminance data and the difference of the chrominance data, adjusting the driving voltage of the display panel and the driving voltage of the light emitting device.

[0043] In at least one embodiment of the present application, the step of adjusting the driving voltage of the display panel and the driving voltage of the light emitting device according to the difference of the luminance data and the difference of the chrominance data comprises:

[0044] According to the difference of the luminance data and the difference of the chrominance data, forming an encoding file;

[0045] Storing the encoding file in a timing controller of a circuit board;

[0046] The timing controller generates a first driving voltage and a second driving voltage according to the encoding file; the first driving voltage is configured to drive the display panel, and the second driving voltage is configured to drive the light emitting device. BRIEF DESCRIPTION OF DRAWINGS

[0047] In order to more clearly illustrate the technical solutions in the embodiments of the present application or the prior art, the drawings needed in the embodiment or prior art description will be briefly introduced below. Obviously, the drawings in the following description are only some embodiments of the present application, and those skilled in the art can obtain other drawings according to these drawings without creative labor.

[0048] Figures 1-5B The structural schematic diagram of six display devices provided by the embodiments of the present application;

[0049] Figures 6-8 The schematic diagram of the arrangement mode of three light emitting devices on the first side provided by the embodiments of the present application;

[0050] Figures 9-11 The schematic diagram of the distribution position of the second conductive pad group on the second side provided by the embodiments of the present application;

[0051] Figures 12-13 The schematic diagram of two arrangement modes of the light emitting unit and the second conductive pad group provided by the embodiments of the present application, which are arranged on the same side of the display panel;

[0052] Figures 14-15Two position relation diagrams of the second conductive pad and the light emitting unit provided for the embodiment of the present application;

[0053] Figure 16 Equivalent circuit diagram of the light emitting unit provided for the embodiment of the present application;

[0054] Figures 17-18 Structure diagram of two display devices provided for the embodiment of the present application;

[0055] Figure 19 、 Figure 20 、 Figure 21A 、 Figure 22A Structure diagram of four spliced display devices provided for the embodiment of the present application;

[0056] Figure 21B Diagram of the light emitting angle of the light emitting device at the splicing position of the spliced display device shown in Figure 21A

[0057] Diagram of the light emitting angle of the light emitting device at the splicing position of the spliced display device shown in Figure 22B Figure 22A Diagram of the light emitting angle of the light emitting device at the splicing position of the spliced display device shown in

[0058] Figure 23 Structure diagram of one preparation process of the second conductive pad group provided for the embodiment of the present application; Figure 23

[0059] Structure diagram of another preparation process of the second conductive pad group provided for the embodiment of the present application; Figure 24 Figure 24 Figure 24 Structure diagram of another preparation process of the second conductive pad group provided for the embodiment of the present application;

[0060] Figure 25 Setting mode diagram of the buffer layer in the display device provided for the embodiment of the present application;

[0061] Figure 26 Setting mode diagram of the light transmission protective layer in the spliced display device provided for the embodiment of the present application;

[0062] Figure 27 Flow chart of the picture adjusting method of the spliced display device provided for the embodiment of the present application. DETAILED DESCRIPTION

[0063] ​​​With reference to the drawings, the technical solutions in the embodiments of the present application will be described clearly and completely. Obviously, the described embodiments are only a part of the embodiments of the present application, but not all the embodiments of the present application. Based on the embodiments in the present application, all the other embodiments obtained by those of ordinary skill in the art without creative effort should fall into the scope of the present application.

[0064] In the drawings, the thicknesses of regions and layers can be exaggerated for clarity. Like reference numerals in different drawings denote like or similar elements, and thus their detailed descriptions will be omitted. In addition, the drawings are only schematic illustrations of the present application, and are not necessarily drawn to scale.

[0065] In the embodiments of the present application, the terms "first", "second", "third", "fourth" and the like are used to distinguish between similar or identical items or elements with substantially the same function and role, and are only for clearly describing the technical solutions in the embodiments of the present application, and cannot be understood as indicating or implying relative importance or implicitly indicating the number of the indicated technical features.

[0066] In the embodiments of the present application, the terms "upper", "lower" and the like indicate the orientation or positional relationship shown in the drawings, and are only for the convenience of describing the present application and simplifying the description, and thus cannot be understood as indicating or implying that the indicated device or element must have a particular orientation, be constructed and operated in a particular orientation, and thus cannot be understood as limiting the present application.

[0067] In the description of the specification, the terms "one embodiment", "some embodiments", "exemplary embodiments", "example", "specific example" or "some examples" are intended to indicate that a specific feature, structure, material or characteristic included in the embodiment or example is included in at least one embodiment or example of the present application. The illustrative representation of the above terms does not necessarily mean the same embodiment or example. In addition, the specific features, structures, materials or characteristics can be included in any one or more embodiments or examples in any appropriate manner.

[0068] In the embodiments of the present application, "a plurality of" means two or more, and "at least one" means one or more, unless otherwise explicitly specified.

[0069] The features “parallel”, “perpendicular”, and “same” used in the embodiments of the present application include the strict sense of “parallel”, “perpendicular”, “same” and the case of “approximately parallel”, “approximately perpendicular”, “approximately same” containing a certain tolerance, which is determined by the person skilled in the art within the acceptable deviation range of the specific value considering the measurement and the tolerance related to the measurement of the specific quantity (for example, the limitation of the measurement system). For example, “approximately” can mean within one or more standard deviations, or within 10% or 5% of the value.

[0070] Unless otherwise required by context, the term “comprises” in the specification and claims is to be construed as an open, inclusive meaning, i.e., “comprising, but not limited to”.

[0071] “Same layer” in the embodiments of the present application refers to the relationship between multiple film layers formed by the same material after the same step (for example, one patterning process). Here, “same layer” does not always mean that the thickness of multiple film layers is the same or the height of multiple film layers in the cross-sectional view is the same. The polygons in the present specification are not strictly, but can be approximately triangular, parallelogram, trapezoidal, pentagonal or hexagonal, etc., and there can be some small deformations caused by tolerances.

[0072] In the embodiments of the present application, the term “electrically connected” can mean that two components are directly electrically connected, or that two components are electrically connected via one or more other components.

[0073] With the development of technology, the application of spliced display devices is more and more widely. The spliced display device is usually spliced by a plurality of independent display devices, and each independent display device includes a display panel and a backlight module. However, there is a black frame at the seam position of the spliced display device, which reduces the display effect of the spliced display device. Among them, the seam width is an important physical parameter of the spliced display device, in order to reduce the seam width, the frame of the spliced display device is gradually reduced from 2mm to 0.88mm, and it is not easy to further reduce the seam width due to the limitation of the existing process.

[0074] Based on this, the embodiment of the present application provides a display device, which comprises a display panel, a backlight module and a plurality of light emitting devices, the display panel is located at the light emitting side of the backlight module and is electrically connected with the display panel; the plurality of light emitting devices are arranged on at least one side of the circumferential side of the display panel; the orthographic projection of the light emitting device on the light emitting surface of the backlight module and the orthographic projection of the display panel on the light emitting surface of the backlight module do not overlap each other. By arranging the plurality of light emitting devices on at least one side of the display panel, when the display device is used as a spliced display device, the side provided with the plurality of light emitting devices is spliced with another display device, at this time, the plurality of light emitting devices arranged at the splicing seam position can realize the display of the picture, thereby being beneficial to the preparation of a spliced display device with “zero splicing seam”.

[0075] The display device and the spliced display device provided by the embodiment of the present application will be specifically introduced and described below in combination with the drawings.

[0076] The embodiment of the present application provides a display device, as shown in the figure, Figure 18 The display device comprises:

[0077] The display panel 100 comprises a display area and a peripheral area surrounding the display area;

[0078] The backlight module 200 is electrically connected with the display panel 100, and the display panel 100 is located at the light emitting side of the backlight module 200;

[0079] The plurality of light emitting devices Q are arranged on at least one side of the circumferential side of the display panel 100; the orthographic projection of the light emitting device Q on the light emitting surface of the backlight module 200 and the orthographic projection of the display panel 100 on the light emitting surface of the backlight module 200 do not overlap each other.

[0080] In the exemplary embodiment, the above-mentioned display panel 100 can be a liquid crystal display panel (LCD), and the exemplary liquid crystal display panel can comprise a twisted nematic (TN) type, a vertical alignment (VA) type, an in plane switching (IPS) type and an advanced super dimension switch (ADS) type.

[0081] The liquid crystal display panel can comprise an array substrate 101 and a color film substrate 102, a liquid crystal layer LC (not drawn in the figure) is located between the array substrate 101 and the color film substrate 102; and further comprises a first polaroid 103 and a second polaroid 104 located on the two sides of the array substrate 101 and the color film substrate 102 respectively.

[0082] The array substrate 101 and the color film substrate 102 each include a substrate, and the specific material of the substrate is not limited herein. For example, the substrate can be any one of silicon, glass, quartz, PET, and the like.

[0083] The structure and components included in the array substrate 101 and the color film substrate 102 of the display panel 100 are not limited herein, and can be determined according to the design of the product.

[0084] The active area (AA) refers to an area for display, and a peripheral area surrounding the active area AA is used for wiring and binding a circuit board.

[0085] The backlight module 200 is used to provide a light source with sufficient brightness and uniform brightness distribution for the display device. The specific structure of the backlight module 200 and the type of the light emitter (light source) in the backlight module 200 are not limited herein.

[0086] For example, as shown in FIG. 2, the light emitter 208 (light source) in the backlight module 200 can be a light-emitting diode (LED), a mini light-emitting diode (Mini LED), or a micro light-emitting diode (Micro LED). Figure 17 For example, as shown in FIG. 2, the light emitter 208 (light source) in the backlight module 200 can be a light-emitting diode (LED), a mini light-emitting diode (Mini LED), or a micro light-emitting diode (Micro LED).

[0087] Figure 17 For example, as shown in FIG. 2, the light emitter 208 (light source) in the backlight module 200 can be a light-emitting diode (LED), a mini light-emitting diode (Mini LED), or a micro light-emitting diode (Micro LED).

[0088] For example, as shown in FIG. 2, the light emitter 208 (light source) in the backlight module 200 can be a light-emitting diode (LED), a mini light-emitting diode (Mini LED), or a micro light-emitting diode (Micro LED). Figure 17 For example, as shown in FIG. 2, the light emitter 208 (light source) in the backlight module 200 can be a light-emitting diode (LED), a mini light-emitting diode (Mini LED), or a micro light-emitting diode (Micro LED).

[0089] ​It should be noted that the optical film layer 201 can include a plurality of sub-layers. For example, a diffusion plate, a quantum dot film, a diffusion sheet, and a composite film, etc., wherein the material of the diffusion plate can include any one of glass, polystyrene (PS), polycarbonate (PC), polyethylene (PE), polypropylene (PP), polyvinyl chloride (PVC), polyethylene terephthalate (PET), and acrylic (PMMA); the quantum dot film (QD Enhancement Films, QDEF for short) is a technology of uniformly mixing quantum dot fluorescent powder with a polymer to form a film sheet, for example, the material of the quantum dot film can include perovskite quantum dot material, and the thickness is generally about 100 um; the material of the diffusion sheet can be the same as that of the diffusion plate; the composite film is used to improve the light efficiency, and also used as a protective film for the diffusion plate, the quantum dot film, and the diffusion sheet to prevent scratching or damage.

[0090] In addition, a glue layer can be arranged between the optical film layer 201 and the display panel 100 to achieve the purpose of fixation. Figure 17 The glue layer is not drawn in the figure, and can be referred to the introduction in the related art.

[0091] The backlight module 200 can further include other structures and components, and the specific structures and components included in the backlight module 200 can be referred to the introduction in the related art, which will not be described here.

[0092] Taking the planar shape of the display panel 100 as a rectangle as an example, the display panel 100 has four sides, and the plurality of light emitting devices Q are arranged on at least one side of the peripheral side of the display panel 100, including but not limited to the following cases:

[0093] First, the plurality of light emitting devices Q are arranged on one side of the peripheral side of the display panel 100.

[0094] Second, the plurality of light emitting devices Q are arranged on two sides of the peripheral side of the display panel 100, for example, the plurality of light emitting devices Q are arranged on two adjacent sides (i.e., two connected sides) of the peripheral side of the display panel 100; for another example, the plurality of light emitting devices Q are arranged on two oppositely arranged sides (i.e., two sides substantially parallel to each other) of the peripheral side of the display panel 100.

[0095] Third, the plurality of light emitting devices Q are arranged on three sides of the peripheral side of the display panel 100, i.e., the plurality of light emitting devices Q are arranged on three connected sides of the peripheral side of the display panel 100.

[0096] Fourth, the plurality of light emitting devices Q are arranged on four sides of the peripheral side of the display panel 100, i.e., the plurality of light emitting devices Q are arranged on each side of the peripheral side of the display panel 100.

[0097] Here, the type of the light emitting device Q is not limited, and the light emitting device Q may be, for example, a mini light emitting diode (Mini LED) or a micro light emitting diode (Micro LED).

[0098] In some embodiments, the plurality of light emitting devices Q arranged on the side of the display panel 100 may all be light emitting devices emitting light of a single color, for example, light emitting devices emitting white light, or may all be light emitting devices emitting blue light. At this time, the plurality of light emitting devices Q can be used as a light source, and a color conversion layer needs to be arranged to realize display, where the color conversion layer can include a color filter layer, quantum dot layers of different colors, and specific descriptions of the color conversion layer can be referred to related technologies.

[0099] In some embodiments, the plurality of light emitting devices Q arranged on the side of the display panel 100 can include light emitting devices emitting light of different colors, for example, three light emitting devices emitting red light, green light, and blue light, at this time, the plurality of light emitting devices Q can be directly used for display.

[0100] The light exit surface of the backlight module 200 refers to the surface of the backlight module 200 from which light exits, and the meanings of the light exit surface of the display panel 100 and the light exit surface of the light emitting device Q referred to in the following are similar to this, which will not be repeated hereinafter.

[0101] The light exit surface includes a plane and a curved surface, which is related to the structure of the main body of the exiting light, which is not limited here.

[0102] It should be noted that the "orthographic projection of the light emitting device Q on the light exit surface of the backlight module 200" refers to the orthographic projection of the light emitting device Q on the extension plane of the light exit surface of the backlight module 200. It can be understood that the light exit surface of the backlight module 200 is coplanar with the extension plane of the light exit surface thereof.

[0103] In the display device provided in the embodiments of the present application, a plurality of light emitting devices Q are arranged on at least one side of the display panel 100. When the display device is used as a spliced display device, the side provided with the plurality of light emitting devices Q is spliced with another display device. At this time, the plurality of light emitting devices Q arranged at the splicing position can realize the display of the picture, thereby facilitating the preparation of a spliced display device with "zero splicing seam".

[0104] In at least one embodiment of the present application, as Figures 1-4 , Figure 5A and Figure 5BAs shown, the display panel includes a first side CM1, the first side CM1 intersects with the light exit face of the display panel;

[0105] The display device includes a plurality of first conductive pad groups D1, the first conductive pad groups D1 are arranged on the first side CM1, and the light emitting devices Q are located on the side of the first conductive pad groups D1 away from the first side CM1; one first conductive pad group D1 includes at least two conductive pads (for example, a positive conductive pad electrically connected with the positive electrode of the light emitting device Q and a negative conductive pad electrically connected with the negative electrode of the light emitting device Q), and one light emitting device Q is electrically connected with each conductive pad in the same first conductive pad group D1.

[0106] Exemplarily, the conductive pads in the first conductive pad group D1 can be pads electrically connected with the light emitting devices Q.

[0107] Exemplarily, the conductive pads in the first conductive pad group D1 can be pins of the light emitting devices Q.

[0108] In an exemplary embodiment, when each light emitting device Q is independently packaged, the conductive pads in the above-mentioned first conductive pad group D1 are pads located outside the packaging structure and electrically connected with the light emitting devices Q.

[0109] In an exemplary embodiment, when a plurality of light emitting devices Q of different colors are packaged together to form a light emitting unit P, the conductive pads in the above-mentioned first conductive pad group D1 are pins of each light emitting device Q in the light emitting unit P, and each pin is located inside the packaging structure of the light emitting unit P. The specific case that a plurality of light emitting devices Q of different colors are packaged together to form a light emitting unit P can be referred to the description hereinafter.

[0110] It should be noted that in the drawings provided in the embodiments of the present application, the structure of each conductive pad in the first conductive pad group D1 is not drawn, but each conductive pad in the first conductive pad group D1 is simplified as a whole, and in actual application, each conductive pad in the same first conductive pad group D1 is independently arranged, and each conductive pad has a gap between them.

[0111] In at least one embodiment of the present application, as shown in Figures 1-4 , Figure 5A and Figure 5B , the display panel 100 includes an array substrate 101 and a color film substrate 102 arranged oppositely, the first side CM1 includes a first region Area1 located on the array substrate 101 and a second region Area2 located on the color film substrate 102; the light emitting devices Q and the first conductive pad groups D1 are arranged in the first region, and / or the light emitting devices Q and the first conductive pad groups D1 are arranged in the second region.

[0112] Wherein, the light emitting device Q and the first conductive pad group D1 are arranged in the first area Area1, and / or the light emitting device Q and the first conductive pad group D1 are arranged in the second area Area2, including the following cases:

[0113] First, as shown in Figure 4 , the light emitting device Q and the first conductive pad group D1 are arranged in the first area Area1 (the first side CM1 is located at a part of the array substrate 101).

[0114] Second, as shown in Figure 2 , the light emitting device Q and the first conductive pad group D1 are arranged in the second area Area2 (the first side CM1 is located at a part of the color filter substrate 102).

[0115] Third, as shown in Figure 1 , Figure 5A , Figure 5B , Figure 6 , Figure 7 and Figure 8 , part of the light emitting device Q and the first conductive pad group D1 are arranged in the first area Area1 (the first side CM1 is located at a part of the array substrate 101), and part of the light emitting device Q and the first conductive pad group D1 are arranged in the second area Area2 (the first side CM1 is located at a part of the color filter substrate 102).

[0116] Fourth, as shown in Figure 3 , part of the structure of the light emitting device Q and part of the structure of the first conductive pad group D1 are arranged in the first area Area1 (the first side CM1 is located at a part of the array substrate 101), and part of the structure of the light emitting device Q and part of the structure of the first conductive pad group D1 are arranged in the second area Area2 (the first side CM1 is located at a part of the color filter substrate 102).

[0117] Here, the arrangement of the plurality of light emitting devices Q on the first side CM1 is not limited.

[0118] In an exemplary embodiment, when the display device is applied to a spliced display device, in order to improve the display effect at the splicing position and improve the stability of the fixation of the light emitting device Q on the first side CM1, the light emitting device Q can be distributed as evenly as possible on the first side CM1 of the display panel 100.

[0119] For example, the plurality of light emitting devices Q includes first light emitting devices Q1, second light emitting devices Q2 and third light emitting devices Q3 of different light emitting colors, Figure 6 , Figure 7 and Figure 8 respectively provide the arrangement of the plurality of light emitting devices Q on the first side CM1.

[0120] In at least one embodiment of the present application, asFigure 5A and Figure 5B As shown in FIG. 1, the peripheral region includes a binding sub-region, and the binding sub-region includes a second side CM2 intersecting with the light exit surface of the display panel; the display device includes a plurality of second conductive pad groups D2, each of the second conductive pad groups D2 includes at least one conductive pad, and each of the second conductive pad groups D2 is arranged on the second side CM2 and electrically connected with the driving circuit on the array substrate 101.

[0121] For example, gaps exist between the conductive pads included in each of the second conductive pad groups D2, and gaps also exist between adjacent two of the second conductive pad groups D2, so as to avoid short circuit.

[0122] It should be noted that, in the embodiments of the present application, the second conductive pad groups D2 each include one conductive pad as an example for illustration and drawing of the accompanying drawings.

[0123] Here, the specific material of the conductive pad included in each of the second conductive pad groups D2 is not limited. For example, the material of the conductive pad included in each of the second conductive pad groups D2 includes metal, such as silver (Ag); specifically, it can be a glue material or glue (Ag Ink) containing silver particles.

[0124] In the binding sub-region, a flexible circuit board (FPC) is arranged, and the flexible circuit board and the second conductive pad groups D2 electrically connect the driving circuit in the array substrate 101 of the display panel 100 and the circuit board together, and the circuit board is used to provide a driving signal to the display device.

[0125] Specifically, the driving circuit in the array substrate 101 is electrically connected with the circuit board 2 through the second conductive pad groups D2, the flexible circuit board FPC in sequence; that is, the driving circuit is electrically connected with the second conductive pad groups D2 through a wire L1, the second conductive pad groups D2 are electrically connected with the flexible circuit board FPC, and the flexible circuit board FPC is electrically connected with the circuit board 2 (driving circuit board).

[0126] It should be noted that the first side CM1 of the display panel 100 in the foregoing is also located in the peripheral region of the display panel 100 (not shown in the figure), and whether the first side CM1 is arranged in the binding sub-region is not limited in the foregoing.

[0127] In some embodiments, the first side CM1 can be arranged in a region other than the binding sub-region in the peripheral region, and at this time, the first side CM1 can be arranged (connected) adjacent to the second side CM2; or the first side CM1 can be arranged opposite to the second side CM2 (substantially parallel to each other).

[0128] In some embodiments, the first side CM1 can be arranged in the binding sub-area, and the first side CM1 and the second side CM2 are the same side, i.e., the first conductive pad group D1 and the second conductive pad group D2 are arranged on the same side of the display panel 100, and there is no overlap between the two; wherein the light emitting device Q is located on the side of the first conductive pad group D1 away from the side, and the light emitting device Q is electrically connected with the first conductive pad group D1. Here, the distribution mode of the first conductive pad group D1 and the second conductive pad group D2 is not limited, and can be determined according to the arrangement mode of the light emitting device Q and the setting position of the second conductive pad group D2 and the wire L1 of the driving circuit on the array substrate 101.

[0129] In at least one embodiment of the present application, as shown in Figure 9 、 Figure 10 and Figure 11 , the second side CM2 includes a third area Area3 on the array substrate 101 and a fourth area Area4 on the color film substrate 102; the second conductive pad group D2 is arranged in the third area Area3, and / or the second conductive pad group D2 is arranged in the fourth area Area4.

[0130] Among them, the second conductive pad group D2 is arranged in the third area Area3, and / or the second conductive pad group D2 is arranged in the fourth area Area4 includes but is not limited to the following cases:

[0131] First, as shown in Figure 9 , the second conductive pad group D2 is arranged in the third area Area3 (the second side CM2 is located in part of the area of the array substrate 101);

[0132] Second, as shown in Figure 10 , the second conductive pad group D2 is arranged in the fourth area Area4 (the second side CM2 is located in part of the area of the color film substrate 102);

[0133] Third, as shown in Figure 11 , part of the second conductive pad group D2 is arranged in the third area Area3, and the other part of the second conductive pad group D2 is arranged in the fourth area Area4.

[0134] It should be noted that in actual application, when the above-mentioned second conductive pad group D2 and the first conductive pad group D1 are arranged on different sides of the display panel 100, the second conductive pad group D2 can be arranged in the third area Area3 or the fourth area Area4 according to the design space and the position of the wire L1 of the driving circuit on the array substrate 101.

[0135] When the first conductive pad group D1 and the second conductive pad group D2 are located on the same side of the display panel 100, the first area Area 1 and the third area Area 3 are the same area, and the second area Area 2 and the fourth area Area 4 are the same area. At this time, while considering the position of the second conductive pad group D2 and the wire L1 of the driving circuit on the array substrate 101, it is also necessary to avoid the design position of the first conductive pad group D1 and the light-emitting device Q. Therefore, the second conductive pad group D2 can be located in the third area Area 3 or the fourth area Area 4 based on the above two factors.

[0136] For example, when the first conductive pad group D1 and the second conductive pad group D2 are disposed on the same side of the display panel 100, the orthographic projection of the second conductive pad group D2 on the first side does not overlap with the orthographic projection of the light-emitting device Q on the first side.

[0137] In at least one embodiment of this application, the plurality of light-emitting devices Q include a first light-emitting device Q1, a second light-emitting device Q2, and a third light-emitting device Q3, wherein the first light-emitting device Q1, the second light-emitting device Q2, and the third light-emitting device Q3 emit different colors;

[0138] In an exemplary embodiment, one of the first light-emitting device Q1, the second light-emitting device Q2, and the third light-emitting device Q3 is a red light-emitting device, another is a green light-emitting device, and yet another is a blue light-emitting device.

[0139] For example, the first light-emitting device Q1 can be a red light-emitting device, the second light-emitting device Q2 can be a green light-emitting device, and the third light-emitting device Q3 can be a blue light-emitting device.

[0140] Among them, such as Figures 12-15 As shown, a first light-emitting device Q1, a second light-emitting device Q2, and a third light-emitting device Q3 are packaged into a light-emitting unit P. The light-emitting unit P extends from the region of the first side CM1 located on the array substrate 101 to the region of the first side CM1 located on the color filter substrate 102.

[0141] The packaging method of the light-emitting unit P is not limited here.

[0142] In some embodiments, each light-emitting device Q in the same light-emitting unit P can share a single encapsulation film layer, that is, the encapsulation film layer covers each light-emitting device Q in the same light-emitting unit P.

[0143] In some embodiments, when a first light emitting device Q1, a second light emitting device Q2 and a third light emitting device Q3 are packaged into a light emitting unit P, the first conductive pad group D1 to which the first light emitting device Q1 is electrically connected, the first conductive pad group D1 to which the second light emitting device Q2 is electrically connected, and the first conductive pad group D1 to which the third light emitting device Q3 is electrically connected can all be packaged inside the same light emitting unit P, and the light emitting unit P is arranged on the first side CM1.

[0144] Of course, the light emitting unit P can also have other packaging manners, and specific components can be referred to the introduction of the packaging manner of the light emitting unit P in the related art, which will not be described here.

[0145] In the embodiments of the present application, by first packaging a first light emitting device Q1, a second light emitting device Q2 and a third light emitting device Q3 into a light emitting unit P, and then arranging the light emitting unit P on the first side CM1, the preparation process difficulty of the display device can be greatly reduced, and the preparation efficiency can be improved.

[0146] In at least one embodiment of the present application, the planar size of each conductive pad in the second conductive pad group D2 is greater than the planar size of each conductive pad in the first conductive pad group D1, and as shown in Figures 11-15 , the conductive pads in the second conductive pad group D2 extend from the region of the array substrate 101 on the second side CM2 to the region of the color film substrate 101 on the second side CM2.

[0147] The above-mentioned "planar size" refers to the side length, diagonal, radius, diameter, length in any direction or area of the orthogonal projection pattern of the conductive pads in the second conductive pad group D2 on the second side CM2.

[0148] For example, the area of the planar pattern of each conductive pad in the second conductive pad group D2 is greater than the area of the planar pattern of each conductive pad in the first conductive pad group D1. The "planar pattern" is the above-mentioned orthogonal projection pattern.

[0149] In the embodiments of the present application, since in the subsequent process, the second conductive pad group D2 needs to be directly bound with the flexible circuit board, by setting the planar size of each conductive pad in the second conductive pad group D2 to be greater than the planar size of each conductive pad in the first conductive pad group D1, the contact area of the second conductive pad group D2 with the flexible circuit board can be greatly improved, thereby the stability of the binding and the stability of the conduction can be improved, and the quality of the display device can be improved.

[0150] The flexible circuit board FPC can also be replaced by a chip on film (COF).

[0151] In at least one embodiment of the present application, as shown in Figure 5B ,Figures 12-15 As shown in FIG. 1, the first side CM1 and the second side CM2 are the same side, and the area between the two adjacent light emitting units Q is provided with at least one second conductive pad group D2; as Figure 14 and Figure 15 As shown in FIG. 1, the display device further comprises a chip on film 1, the chip on film 1 covers the second conductive pad group D2 and extends to the side of the backlight module 200, and the orthographic projection of the chip on film 1 on the first side CM1 does not overlap with the orthographic projection of the light emitting unit P on the first side CM1; the first conductive pad group D1 and the chip on film 1 are electrically connected, and the second conductive pad group D2 and the chip on film 1 are bound together.

[0152] In at least one embodiment of the present application, the first conductive pad group D1 comprises a positive conductive pad and a negative conductive pad, as Figure 16 As shown in FIG. 1, the light emitting unit P comprises but is not limited to a first pin Y1, a second pin Y1, a third pin Y3 and a fourth pin Y4, the positive conductive pads of the first light emitting device Q1, the second light emitting device Q2 and the third light emitting device Q3 are electrically connected with the first pin Y1, the negative conductive pad of the first light emitting device Q1 is electrically connected with the second pin Y2, the negative conductive pad of the second light emitting device Q2 is electrically connected with the third pin Y3, and the negative conductive pad of the third light emitting device Q3 is electrically connected with the fourth pin Y4.

[0153] Wherein, the positive conductive pad can be electrically connected with the positive electrode of the light emitting device Q, and the negative conductive pad can be electrically connected with the negative electrode of the light emitting device Q.

[0154] For example, the positive conductive pad and the negative conductive pad can both be the pin of the light emitting device Q.

[0155] As shown in FIG. 1, the chip on film 1 covers at least part of the area of the first pin Y1, the second pin Y2, the third pin Y3 and the fourth pin Y4, and the chip on film 1 is bound together with the first pin Y1, the second pin Y2, the third pin Y3 and the fourth pin Y4 respectively. Figure 14 and Figure 15 As shown in FIG. 1, the chip on film 1 covers at least part of the area of the first pin Y1, the second pin Y2, the third pin Y3 and the fourth pin Y4, and the chip on film 1 is bound together with the first pin Y1, the second pin Y2, the third pin Y3 and the fourth pin Y4 respectively.

[0156] Here, the setting positions of the first pin Y1, the second pin Y1, the third pin Y3 and the fourth pin Y4 of the above-mentioned light emitting unit P are not limited.

[0157] For example, the first pin Y1, the second pin Y1, the third pin Y3 and the fourth pin Y4 can be respectively arranged on different side edges of the light emitting unit P, for example, one of the above-mentioned four pins is arranged on the side edge of the left side of the light emitting unit P, and the remaining three are arranged on the side edge of the lower side of the light emitting unit P.

[0158] For example, the first pin Y1, the second pin Y1, the third pin Y3 and the fourth pin Y4 can be arranged on the same side of the light emitting unit P, for example, the four pins are arranged on the lower side of the light emitting unit P, which facilitates the binding between the pins and the chip on film 1, and avoids short circuit between the pins and the second conductive pad D2.

[0159] Here, the materials of the first pin Y1, the second pin Y1, the third pin Y3 and the fourth pin Y4 of the light emitting unit P are not limited, for example, the materials of the pins can each include metal.

[0160] In other embodiments, the negative conductive pads of the first light emitting device Q1, the second light emitting device Q2 and the third light emitting device Q3 in one light emitting unit P can also be electrically connected with the first pin Y1, the positive conductive pad of the first light emitting device Q1 is electrically connected with the second pin Y2, the positive conductive pad of the second light emitting device Q2 is electrically connected with the third pin Y3, and the positive conductive pad of the third light emitting device Q3 is electrically connected with the fourth pin Y4.

[0161] In the present specification, the positive conductive pads of the first light emitting device Q1, the second light emitting device Q2 and the third light emitting device Q3 are electrically connected with the first pin Y1, the negative conductive pad of the first light emitting device Q1 is electrically connected with the second pin Y2, the negative conductive pad of the second light emitting device Q2 is electrically connected with the third pin Y3, and the negative conductive pad of the third light emitting device Q3 is electrically connected with the fourth pin Y4.

[0162] The "chip on film 1 covers at least part of the area of the first pin Y1, the second pin Y2, the third pin Y3 and the fourth pin Y4" includes but is not limited to the following cases:

[0163] First, as shown in Figure 14 and Figure 15 , the chip on film 1 covers part of the area of the first pin Y1, part of the area of the second pin Y2, part of the area of the third pin Y3 and part of the area of the fourth pin Y4, respectively, so that there is a gap between the chip on film 1 and the light emitting unit P, avoiding short circuit caused by too small distance between the chip on film 1 and other pins or conductive structures of the light emitting unit P.

[0164] Second, as shown in Figure 14 and Figure 15 , when the first pin Y1, the second pin Y2, the third pin Y3 and the fourth pin Y4 are arranged on the same side of the light emitting unit P, and no other pin or conductive structure is arranged on the side, the chip on film 1 can be arranged to completely cover the first pin Y1, the second pin Y2, the third pin Y3 and the fourth pin Y4, thereby increasing the contact area between the chip on film 1 and the above four pins, and improving the stability of binding and conductive stability.

[0165] In at least one embodiment of the present application, as shown in Figure 5A the first side CM1 and the second side CM2 are different sides, the display device further comprises a chip on film 1 covering the second conductive pad group D2 and extending to the side of the backlight module 200; the part of the array substrate 102 located in the peripheral area further comprises a plurality of bonding leads, the first conductive pad group D1 is electrically connected to the chip on film 1 through the bonding leads, and the second conductive pad group D2 is bonded together with the chip on film 1.

[0166] In an example embodiment, a conductive adhesive, such as an anisotropic conductive film (ACF), can also be provided between the second conductive pad group D2 and the chip on film 1, and the second conductive pad group D2 and the chip on film 1 are bonded together through the conductive adhesive.

[0167] The anisotropic conductive film (ACF) can be conductive in a direction perpendicular to the second side CM2 and non-conductive in a direction parallel to the second side CM2.

[0168] It should be noted that the chip on film 1 is provided on the side of the display panel 100 located in the bonding sub-area, when the first side CM1 and the second side CM2 are different sides (i.e. there is a light emitting device Q provided on the side other than the bonding sub-area), the bonding leads located in the peripheral area are needed to be wired to electrically connect the first conductive pad group D1 corresponding to the light emitting device Q and the chip on film 1 together, so as to realize the subsequent circuit board to transmit the driving signal to the light emitting device Q through the chip on film 1, and realize the simultaneous driving of the display panel 100 and the light emitting device Q.

[0169] In at least one embodiment of the present application, as shown in Figure 18 the display device further comprises at least one circuit board 2 and at least one L-shaped protective plate 3, the circuit board 2 and the chip on film 1 are provided on the same side of the backlight module 200, and the circuit board 2 is electrically connected to the backlight module 200 and the chip on film 1 respectively; the circuit board 2 is configured to simultaneously drive the display panel 100 and the light emitting device Q; a part of the protective plate 3 is provided on the side of the circuit board 2 away from the backlight module 200, and another part of the protective plate 3 is provided on the side of the circuit board 2 away from the chip on film 1.

[0170] For example, as shown in Figure 18 at least part of the side of the L-shaped protective plate 3 away from the backlight module 200 is also attached with a flexible film 31 to improve the impact resistance of the protective plate 3 and avoid damage.

[0171] In some embodiments, the display device can include one circuit board 2; in other embodiments, the display device can include two circuit boards 2; wherein the number of circuit boards 2 included in the display device is less than or equal to the number of CTFs 1, and each circuit board 2 is electrically connected to at least part of the second conductive pad group D2 and at least part of the light emitting device Q through at least one CTF 1.

[0172] Wherein the circuit board 2 can also be electrically connected to the backlight module 200.

[0173] The circuit board includes a timing controller (TCON), in some embodiments, the timing controller can provide video signals and audio signals to the display panel 100; in other embodiments, the timing controller can also provide GOA signals to the display panel 100; in yet other embodiments, the timing controller can provide control signals to the backlight module 200 to control the light emitting state and brightness of the light source thereof.

[0174] In the embodiments of the present application, the timing controller also controls the light emitting state and brightness of all light emitting devices Q at the same time. Wherein the light emitting state refers to the bright state or the dark state.

[0175] Specifically, according to the requirements of the display picture, the circuit board 2 transmits different driving signals to the second pin Y2, the third pin Y3 and the fourth pin Y4 of the light emitting unit P, so that the first light emitting device Q1, the second light emitting device Q2 and the third light emitting device Q2 display different colors, thereby realizing the simultaneous driving of the display panel 100 and all light emitting devices Q2 and displaying the same complete picture.

[0176] In at least one embodiment of the present application, as shown in Figure 17 and Figure 22A The display panel 100 further includes at least one third side CM3 in addition to the first side CM1, the third side CM3 is located on the part of the color film substrate 102 provided with a reflecting surface (not labeled), and the included angle β between the reflecting surface and the reference surface Figure 17 The reference surface is a plane perpendicular to the light emitting surface of the display panel 100.

[0177] In at least one embodiment of the present application, as shown in Figure 17 and Figure 22A The angle range of the acute angle β is greater than 0° and less than or equal to 30°.

[0178] For example, the angle of the acute angle β can be 30°, 28°, 25°, 24°, 22°, 20°, 18°, 15°, 13°, 10°, 8°, 5°, 3°.

[0179] In the embodiments of the present application, by setting the angle range of the acute angle β to be greater than 0° and less than or equal to 30°, in the case where the display device is applied to a tiled display device as shown in Figure 20 or as shown in Figure 22A , the side provided with the reflecting surface in one display device and the side provided with the light emitting device Q in another display device are tiled together, and the reflecting surface is relatively steep, so that the reflecting surface can reflect more light into the area close to the left side in the tile gap along the direction of the dotted arrow as shown in Figure 22A , thereby improving the light output uniformity at the tile gap position and improving the display effect of the tiled display device, and achieving the display effect tending to "zero tile gap".

[0180] In at least one embodiment of the present application, as shown in Figure 17 and Figure 22A , the display device further comprises a reflecting portion F, and the reflecting portion F covers the reflecting surface.

[0181] In the exemplary embodiments, the reflecting portion F can comprise a reflecting sheet or a third reflecting layer;

[0182] Exemplarily, the material of the third reflecting layer can comprise white oil, which can comprise resin (for example, epoxy resin, polytetrafluoroethylene resin), titanium dioxide (chemical formula TiO2), and organic solvent (for example, dipropylene glycol methyl ether), etc.

[0183] Exemplarily, the material of the third reflecting layer can further comprise silicon-based white glue.

[0184] Exemplarily, the material of the third reflecting layer can further comprise silver (Ag).

[0185] Exemplarily, the materials of the first reflecting layer 207, the second reflecting layer 210, and the third reflecting layer can be the same.

[0186] In the display device provided by the embodiments of the present application, by providing the reflecting portion F on the third side CM3, the reflecting ability of the reflecting portion F to the light emitting device Q can be further improved, so that more light can be reflected into the area close to the left side in the tile gap along the direction of the dotted arrow as shown in Figure 22A , thereby improving the light output uniformity at the tile gap position and improving the display effect of the tiled display device, and achieving the display effect tending to "zero tile gap".

[0187] In at least one embodiment of the present application, as shown in Figure 25 , the display device further comprises a buffer layer 8 and a plurality of packaging portions 5, the packaging portion 5 covers at least the light emitting surface of the light emitting device Q, and the buffer layer 8 covers the side of the display panel 100 provided with the light emitting device Q, and the buffer layer comprises a plurality of openings K, and the light emitting device Q is arranged in the opening K.

[0188] Exemplarily, each package part 5 wraps one light emitting device Q. The package part 5, while playing a role of encapsulating the light emitting device Q, can also improve the light efficiency of the light emitting device Q due to its special lens structure.

[0189] In some embodiments, the display device can further include a package layer arranged on the side of the light emitting device Q away from the first side CM1 for protecting the light emitting device Q. Exemplarily, the package layer can be an integral layer covering the plurality of light emitting devices Q.

[0190] In the embodiments of the present application, the light emitting device Q is encapsulated by way of example of the package part.

[0191] Exemplarily, the above-mentioned buffer layer 8 can include a buffer material, for example, a flexible high polymer material or foam, so as to avoid damaging the light emitting device Q during transportation and causing light failure.

[0192] Exemplarily, the material of the buffer layer 8 can include ethylene-vinyl acetate copolymer (EVA).

[0193] In some embodiments, when each light emitting device Q is independently encapsulated, the above-mentioned opening K and the light emitting device Q are in one-to-one correspondence; when three light emitting devices Q of different colors are encapsulated into one light emitting unit P, the above-mentioned opening K and the light emitting unit P are in one-to-one correspondence.

[0194] In the exemplary embodiments, the distance between the edge of each opening K and the edge of the light emitting device Q located in the opening K is 1-2 μm.

[0195] In the exemplary embodiments, the distance between the edge of each opening K and the edge of the light emitting unit P located in the opening K is 1-2 μm.

[0196] In at least one embodiment of the present application, the light emitting angle γ of the light emitting device Q ranges from 30° to 60°.

[0197] In the exemplary embodiments, when the display device is applied to a spliced display device as shown in Figure 21A In the exemplary embodiments, when the display device is applied to a spliced display device as shown in Figure 21BAs shown in FIG. 6, the arrowed dashed line is the light emitting direction of the light, the dimension marked with a is the maximum dimension of the encapsulation part 5 in the horizontal direction, and the dimension marked with b is the thickness of the color film substrate 102. In order to improve the light uniformity at the joint position, a part of the light emitted by the light emitting device Q is directly emitted (the light marked with LC), and a part of the light is reflected after being incident on the side surface of the color film substrate 102 of the right display device (the light marked with LB), so that the reflected light is emitted after being scattered. In this way, the light emitted by the light emitting device Q can be emitted as uniformly as possible at the joint position.

[0198] Based on this, in combination with Figure 21B As shown in FIG. 7, tanγ≤b / a is required, and a part of the light emitted by the light emitting device Q is reflected after being incident on the side surface of the color film substrate 102. γ is the light emitting angle of the light emitting device Q.

[0199] It should be noted that, as shown in Figure 21B and Figure 22B The light emitting angle γ of the light emitting device Q refers to the included angle between the light emitted laterally by the light emitting device Q and the light emitted in the forward direction.

[0200] In the exemplary embodiments, in the case where the display device is applied to a spliced display device as shown in Figure 22A , that is, the side edge provided with the reflecting surface in one display device and the side edge provided with the light emitting device Q in another display device are spliced together, in combination with Figure 22B As shown in FIG. 8, the arrowed dashed line is the light emitting direction of the light, the dimension marked with a is the maximum dimension of the encapsulation part 5 in the horizontal direction, the dimension marked with b is the thickness of the color film substrate 102, and the dimension marked with c is the dimension of the orthographic projection of the reflecting surface on the surface of the color film substrate 102 close to the array substrate 101. In order to improve the light uniformity at the joint position, a part of the light emitted by the light emitting device Q is directly emitted (the light marked with LC), and a part of the light is reflected after being incident on the side surface of the color film substrate 102 of the right display device (the light marked with LB), so that the reflected light is emitted after being scattered. In this way, the light emitted by the light emitting device Q can be emitted as uniformly as possible at the joint position.

[0201] Based on this, in combination with Figure 22B As shown in FIG. 9, tanγ≤b / (a+c) is required, that is, a part of the light emitted by the light emitting device Q is reflected after being incident on the reflecting part F arranged on the color film substrate 102.

[0202] On the basis of meeting tanγ≤b / a or tanγ≤b / (a+c), a part of the light emitted by the light emitting device Q is also set to directly emit out, based on the range of the maximum size a of the current packaging portion 5 along the horizontal direction being 0.2-0.4 mm, the thickness of the glass of the color film substrate being 0.5-0.8 mm, and comprehensive consideration, the range of the light emitting angle γ of the light emitting device Q is set to 30°-60°, so that a part of the light emitted by the light emitting device Q directly emits out (the light of mark LC), and a part of the light is reflected after being irradiated onto the side surface of the color film substrate 102 of the right display device, so that the reflected light emits out after being scattered (the light of mark LB), the light uniformity at the splicing position is improved, and the display effect of the spliced display device prepared by the display device is improved.

[0203] Embodiments of the present application provide a spliced display device, which at least comprises a first display device and a second display device, and the first display device and the second display device are both the display device described above.

[0204] As shown in Figure 19 , Figure 20 , Figure 21A and Figure 22A , the first display device (for example, the display device on the left) comprises a first splicing edge, the second display device (for example, the display device on the right) comprises a second splicing edge, and the first splicing edge and the second splicing edge are spliced together; a plurality of light emitting devices Q are arranged on the side surface of the region where the first splicing edge or the second splicing edge is located.

[0205] It should be noted that when the spliced display device comprises three or more than three spliced display devices, one of the two splicing edges spliced together is provided with a light emitting device Q, and the other is not provided.

[0206] In at least one embodiment of the present application, as shown in Figure 20 and Figure 22A , a plurality of light emitting devices Q are arranged on the side surface of the region where one of the first splicing edge and the second splicing edge is located, and a reflecting surface F is arranged on the side surface of the region where the other is located.

[0207] In at least one embodiment of the present application, as shown in Figure 19 , Figure 20 , Figure 21A and Figure 22A , the spliced display device further comprises a light adjusting layer 6 and a light-transmitting protective layer 9 as shown in Figure 26 ; the light adjusting layer 6 has an arc-shaped light emitting surface, and the light adjusting layer 6 comprises a light-transmitting material 62 and diffusion particles 61; the light adjusting layer 6 is located in the region between the first splicing edge and the second splicing edge, and covers the light emitting device Q and the reflecting surface; and the light-transmitting protective layer 9 covers the light adjusting layer 6.

[0208] In an exemplary embodiment, the diffusion particles 61 can include polymer microspheres or inorganic particles.

[0209] For example, the diffusion particles 61 can include at least one of polymethyl methacrylate microspheres or polybutyl methacrylate microspheres.

[0210] In an embodiment of the present application, as shown in Figure 21A By providing the light adjustment layer 6, a portion of the light emitted by the light emitting device Q can directly exit (light marked as LC), and a portion of the light can be reflected after being incident on the side surface of the color filter substrate 102 of the right display device (light marked as LB). Thus, the light emitted by the light emitting device Q can be uniformly emitted at the joint position as much as possible.

[0211] For example, the light-transmissive protective layer 9 can be a protective adhesive.

[0212] In actual applications, multiple display devices need to be spliced together for use. When a customer installs and uses the display devices, the display devices are first spliced, and then the protective adhesive is attached to the joint of the spliced display devices. The protective adhesive can be in the form of an adhesive film, and release paper is covered on the upper and lower surfaces of the adhesive. After the lower release paper is removed, the protective adhesive is attached from one side of the edge of the display device to the other side. During the attachment process, the protective adhesive and the display device are combined by flattening the adhesive with fingers.

[0213] In some embodiments, the light adjustment layer 6 can cover a portion of the light exit side polarizer (the second polarizer 104) of the first display device and the second display device.

[0214] In other embodiments, the light adjustment layer 6 can be tangent to the light exit side polarizer (the second polarizer 104) of the first display device and the second display device, respectively.

[0215] In addition, in order to improve the protection of the light adjustment layer 6 by the light-transmissive protective layer 9, the light-transmissive protective layer 9 can cover a portion of the light exit side polarizer (the second polarizer 104) of the first display device and the second display device.

[0216] In at least one embodiment of the present application, as shown in Figure 21A and Figure 22A The color filter substrate 102 of the first display device near the first splicing edge and the color filter substrate 102 of the second display device near the second splicing edge are both provided with the light shielding layer 7, which is configured to block the light (light marked as LA) of the light emitting device Q to avoid interference of the light emitted by the light emitting device Q with the display panel 100.

[0217] In an exemplary embodiment, the light shielding layer 7 can include one of a metal or a black resin material.

[0218] Exemplarily, the material of the light shielding layer 7 can be a black matrix material.

[0219] Embodiments of the present application also provide a preparation method of each conductive pad in the second conductive pad group D2, which specifically includes the following two cases:

[0220] The first case is as shown in FIG. 1B, wherein the display panel 100 is provided with a plurality of conductive pads in the second conductive pad group D2 on the array substrate 101, and the conductive pads in the second conductive pad group D2 are electrically connected to the conductive wires L1 on the second side CM2 of the display panel 100. Figure 23 As shown in FIG. 1C(1), the display panel 100 is provided with a plurality of conductive pads in the second conductive pad group D2 on the array substrate 101, and the conductive pads in the second conductive pad group D2 are electrically connected to the conductive wires L1 on the second side CM2 of the display panel 100; the conductive pads in the second conductive pad group D2 are formed by using a patterning process. Figure 23 As shown in FIG. 1C(2), the conductive pads in the second conductive pad group D2 are transferred to the second side CM2 of the display panel 100 by using a transfer process, so that the conductive pads in the second conductive pad group D2 are electrically connected to the corresponding conductive wires L1. Exemplarily, the patterning process can include steps such as mask exposure and etching.

[0221] The second case is as shown in FIG. 1D, wherein the conductive material is transferred to the second side CM2 of the display panel 100 as a whole, and then the conductive pads in the second conductive pad group D2 are obtained by using a patterning process (e.g., laser processing). Figure 24 As shown in FIG. 1D(2), the conductive material is transferred to the second side CM2 of the display panel 100 as a whole, and then the conductive pads in the second conductive pad group D2 are obtained by using a patterning process (e.g., laser processing). Figure 24 As shown in FIG. 1D(3), the conductive pads in the second conductive pad group D2 are obtained by using a patterning process (e.g., laser processing).

[0222] Exemplarily, the material of the conductive pads in the second conductive pad group D2 can include silver particle-containing glue (Ag Ink).

[0223] In addition, the transfer process is not specifically limited herein; exemplarily, during the transfer of the conductive pads, a clamp is needed to fix the display panel 100, so as to avoid damage to other components in the display panel 100 caused by the pressure generated during the embossing on the side of the display panel 100.

[0224] For details, refer to the transfer process in the related art, which will not be described herein.

[0225] In some embodiments, when the light emitting device Q is independently packaged (not packaged into a whole light emitting unit P), the conductive pads in the first conductive pad group D1 can also be prepared in the above manner.

[0226] Embodiments of the present application provide a picture adjustment method, which is applied to the spliced display device as described in any one of the preceding embodiments, as shown in FIG. 1E, the method comprises the following steps. Figure 27

[0227] ​S801, respectively acquire the luminance data and the chrominance data of the display panel 100 and the light emitting device Q under a preset condition; the preset condition includes the same gray scale or the same color pure picture;

[0228] In the exemplary embodiment, the luminance data and the chrominance data can be directly measured manually or automatically by optical equipment.

[0229] The same gray scale means that the display panel 100 and the light emitting device Q are under the same gray scale;

[0230] The same color pure picture means that the display panel 100 and the light emitting device Q display the same color pure picture.

[0231] For example, the same gray scale can include L0 gray scale, L156 gray scale, and L255 gray scale.

[0232] For example, the same color pure picture can include white picture, black picture, red picture, green picture, and blue picture.

[0233] S802, compare and calculate the difference of the luminance data and the difference of the chrominance data of the display panel 100 and the light emitting device Q under the same condition;

[0234] S803, adjust the driving voltage of the display panel 100 and the driving voltage of the light emitting device Q according to the difference of the luminance data and the difference of the chrominance data.

[0235] In this way, the display panel 100 and the light emitting device Q with consistent luminance data and chrominance data can be obtained, thereby improving the light uniformity at the seam position of the spliced display device, improving the display effect of the spliced display device, and realizing the spliced display effect of "zero seam".

[0236] In at least one embodiment of the present application, step S803 of adjusting the driving voltage of the display panel 100 and the driving voltage of the light emitting device Q according to the difference of the luminance data and the difference of the chrominance data includes:

[0237] S8031, form a code file (Code) according to the difference of the luminance data and the difference of the chrominance data;

[0238] S8032, store the code file in the timing controller (TCON) of the circuit board 2;

[0239] S8033, the timing controller (TCON) generates a first driving voltage and a second driving voltage according to the code file; the first driving voltage is configured to drive the display panel 100, and the second driving voltage is configured to drive the light emitting device Q.

[0240] In the embodiments of the present application, by using the picture adjustment method, the luminance and chromaticity of the pictures displayed by the adjacent two display devices and the plurality of light emitting devices Q located between the adjacent two display devices can be adjusted to be consistent, thereby improving the picture display quality of the whole spliced display device and further realizing the spliced display effect of "zero splicing seam".

[0241] The above merely provides the specific implementation of the present application, but the protection scope of the present application is not limited to this. Any person skilled in the art can easily think of the changes or replacements within the technical range disclosed by the present application, which should be covered in the protection scope of the present application. Therefore, the protection scope of the present application should be subject to the protection scope of the claims.

Claims

1. A tiled display device, comprising a plurality of display devices, each display device comprising: a display panel comprising a display area and a peripheral area surrounding the display area, the display panel comprising an array substrate and a color film substrate arranged oppositely; a backlight module electrically connected to the display panel, and the display panel is located at the light emitting side of the backlight module; a plurality of light emitting devices arranged on at least one side of the peripheral side of the display panel; the orthogonal projection of the light emitting device on the light emitting surface of the backlight module does not overlap with the orthogonal projection of the display panel on the light emitting surface of the backlight module; the display panel comprises a first side, the first side intersects with the light emitting surface of the display panel; the display device comprises a plurality of first conductive pad groups, the first conductive pad groups are arranged on the first side, and the light emitting device is located on the side of the first conductive pad group away from the first side; one first conductive pad group comprises at least two conductive pads, and one light emitting device is electrically connected to each conductive pad in the same first conductive pad group; the side of one display device without the light emitting device is tiled with the side of another display device with the light emitting device, part of the light emitted by the light emitting device is reflected on the side of the color film substrate, and the light emitting angle γ of the light emitting device ranges from 30° to 60°. 2.The tiled display device of claim 1, wherein the first side comprises a first region on the array substrate and a second region on the color film substrate; the light emitting device and the first conductive pad group are arranged on the first region, and / or the light emitting device and the first conductive pad group are arranged on the second region. The peripheral area comprises a binding sub-area, the binding sub-area comprises a second side, the second side intersects with the light emitting surface of the display panel; the display device comprises a plurality of second conductive pad groups, each second conductive pad group comprises at least one conductive pad, the second conductive pad group is arranged on the second side, the display panel comprises an array substrate and a color film substrate arranged oppositely, and the second conductive pad group is electrically connected to the driving circuit on the array substrate. The second side comprises a third region on the array substrate and a fourth region on the color film substrate; the second conductive pad group is arranged on the third region, and / or the second conductive pad group is arranged on the fourth region. The plurality of light emitting devices comprises a first light emitting device, a second light emitting device and a third light emitting device, and the light emitting colors of the first light emitting device, the second light emitting device and the third light emitting device are different; wherein one first light emitting device, one second light emitting device and one third light emitting device are packaged into one light emitting unit, and the light emitting unit extends from the region of the array substrate on the first side to the region of the color film substrate on the first side. ​ ​ ​ ​ 3. The tiled display apparatus of claim 1, wherein, ​ ​ 4. The tiled display apparatus of claim 3, wherein, ​ ​ 5. The tiled display apparatus of claim 3, wherein, ​ ​ 6. The tiled display apparatus of claim 5, wherein, The planar size of each conductive pad in the second conductive pad group is greater than the planar size of each conductive pad in the first conductive pad group, and the conductive pads in the second conductive pad group extend from the region where the second side is located on the array substrate to the region where the second side is located on the color film substrate.

7. The tiled display apparatus of claim 6, wherein, The first side and the second side are the same side, and at least one second conductive pad group is arranged in the region between two adjacent light emitting units; The display device further comprises a chip on film, the chip on film covers the second conductive pad group and extends to the side of the backlight module, and the orthographic projection of the chip on film on the first side does not overlap with the orthographic projection of the light emitting unit on the first side; The first conductive pad group and the chip on film are electrically connected, and the second conductive pad group and the chip on film are bonded together.

8. The tiled display apparatus of claim 7, wherein, The first conductive pad group comprises positive conductive pads and negative conductive pads, the light emitting unit comprises a first pin, a second pin, a third pin and a fourth pin, the positive conductive pads of the first light emitting device, the second light emitting device and the third light emitting device are electrically connected with the first pin, the negative conductive pad of the first light emitting device is electrically connected with the second pin, the negative conductive pad of the second light emitting device is electrically connected with the third pin, and the negative conductive pad of the third light emitting device is electrically connected with the fourth pin; The chip on film covers at least part of the first pin, the second pin, the third pin and the fourth pin, and the chip on film is bonded with the first pin, the second pin, the third pin and the fourth pin respectively.

9. The tiled display apparatus of claim 6, wherein, The first side and the second side are different sides, and the display device further comprises a chip on film, the chip on film covers the second conductive pad group and extends to the side of the backlight module; The part of the array substrate located in the peripheral region further comprises a plurality of bonding leads, the first conductive pad group is electrically connected with the chip on film through the bonding leads, and the second conductive pad group is bonded with the chip on film.

10. The tiled display apparatus of claim 7 or 9, wherein, The display device further comprises at least one circuit board and at least one L-shaped protective plate, the circuit board is electrically connected with the chip on film, and the circuit board and the chip on film are arranged on the same side of the backlight module, and the circuit board is further electrically connected with the backlight module; the circuit board is configured to drive the display panel and the light emitting device simultaneously; Part of the protective plate is arranged on the side of the circuit board away from the backlight module, and another part of the protective plate is arranged on the side of the circuit board away from the chip on film.

11. The tiled display apparatus of any of claims 1-9, wherein, The display panel further comprises at least one third side in addition to the first side, the third side is located in the part of the color film substrate provided with a reflective surface, the included angle between the reflective surface and a reference surface is an acute angle, and the reference surface is a plane perpendicular to the light emitting surface of the display panel.

12. The tiled display apparatus of claim 11, wherein, The angle range of the acute angle is greater than 0° and less than or equal to 30°.

13. The tiled display apparatus of claim 11, wherein, The display device further comprises a reflective part, and the reflective part covers the reflective surface. The display device further comprises a reflective part, and the reflective part covers the reflective surface.

14. The tiled display apparatus of claim 1, wherein, The display device further comprises a buffer layer and a plurality of encapsulation portions, the encapsulation portions at least covering light-out surfaces of the light-emitting devices, and the buffer layer covering side surfaces of the display panel where the light-emitting devices are arranged, the buffer layer comprising a plurality of openings, and the light-emitting devices being arranged in the openings.

15. The tiled display apparatus of claim 1, wherein, The display device comprises at least a first display device and a second display device. The first display device comprises a first splicing edge, and the second display device comprises a second splicing edge, the first splicing edge and the second splicing edge being spliced together; a plurality of light-emitting devices are arranged on side surfaces of a region where the first splicing edge or the second splicing edge is located.

16. The tiled display apparatus of claim 15, wherein, A plurality of light-emitting devices are arranged on side surfaces of a region where one of the first splicing edge and the second splicing edge is located, and a reflecting surface is arranged on side surfaces of a region where the other of the first splicing edge and the second splicing edge is located.

17. The tiled display apparatus of claim 16, wherein, The spliced display device further comprises a light-adjusting layer and a light-transmitting protective layer, the light-adjusting layer having an arc-shaped light-out surface, the light-adjusting layer comprising a light-transmitting material and diffusion particles; the light-adjusting layer being located in a region between the first splicing edge and the second splicing edge, and covering the light-emitting devices and the reflecting surface; and the light-transmitting protective layer covering the light-adjusting layer.

18. The tiled display apparatus of claim 17, wherein, The color filter substrate of the first display device and the color filter substrate of the second display device are both provided with a light-shielding layer in regions close to the first splicing edge and the second splicing edge, respectively, the light-shielding layer being configured to block light of the light-emitting devices.

19. A picture adjustment method, wherein, The method is applied to the spliced display device as claimed in any one of claims 1-18, and the method comprises: Respectively acquiring luminance data and chrominance data of the display panel and the light-emitting devices under a preset condition; the preset condition including a pure picture of the same gray scale or the same color; Comparing and calculating difference values of the luminance data and difference values of the chrominance data of the display panel and the light-emitting devices under the same condition; Adjusting driving voltages of the display panel and the light-emitting devices according to the difference values of the luminance data and the difference values of the chrominance data.

20. The picture adjustment method of claim 19, wherein, The step of adjusting the driving voltages of the display panel and the light-emitting devices according to the difference values of the luminance data and the difference values of the chrominance data comprises: Forming an encoding file according to the difference values of the luminance data and the difference values of the chrominance data; Storing the encoding file in a timing controller of a circuit board; The timing controller generates a first driving voltage and a second driving voltage according to the encoding file; the first driving voltage is configured to drive the display panel, and the second driving voltage is configured to drive the light-emitting devices.

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