V-cut processing method of rigid-flex printed circuit board with surface flexible board layer

Abstract

The application discloses a V-CUT processing method of rigid-flexible combined plate with a surface flexible plate layer, and processing steps are as follows: pre-etching the flexible plate layer to form an extension area, making a pattern to form a flexible plate, pre-etching the rigid plate layer to make a rigid plate, stacking and pressing in whole, attaching a single-sided flexible copper-clad plate on the surface of the flexible plate, making a surface compensation pattern, making a solder resist pattern layer on the surface of the rigid plate, making a guide groove in the extension area, performing V-CUT processing, and performing micro-etching treatment to form the rigid-flexible combined plate; the extension area is arranged on the processing plate, an auxiliary compensation pattern and a guide groove are made, the guide cutting, auxiliary alignment and transition cutting for the V-CUT processing are formed, the single-sided flexible copper-clad plate is used to replace the original covering film layer, the cutting compensation pattern is made, the problems of pulling, wire drawing and knife rolling of the V-CUT cutter and the polyimide material are prevented, and the high-precision and high-quality V-CUT processing of the rigid-flexible combined plate with the surface flexible plate layer is realized.

Description

TECHNICAL FIELD

[0001] The present application relates to the field of circuit board design and processing, and particularly relates to a V-CUT processing method of a rigid-flexible combined board with a surface flexible board layer. BACKGROUND

[0002] A rigid-flexible combined board (Rigid-Flex PCB, also known as rigid-flexible combined board or rigid-flexible combined board) has the support performance of a rigid board and the bendable performance of a flexible board, and forms excellent effects of flexible installation, high reliability and wide application scenarios, so the rigid-flexible combined board is applied in more and more fields.

[0003] In some special situations for electrical signal transmission, a rigid-flexible combined board with a flexible board on the surface layer appears, that is, the flexible board and the rigid board are respectively located on one side in the laminated structure, rather than the asymmetric structure or the structure that the flexible board is provided with the rigid board on both sides, and the rigid-flexible combined board with the flexible board on the surface layer is generally called a rigid-flexible combined board with a surface flexible board layer.

[0004] If the rigid-flexible combined board with the flexible board on the surface layer needs to be processed by V-CUT, the one side of the flexible board is directly cut by V-CUT, which is easy to cause problems such as wire drawing, pulling and knife rolling; and because the rigid-flexible combined board is an asymmetric laminated structure, the material expansion and contraction performance difference between the flexible board and the rigid board is easy to cause problems such as board warping and board warping in the rigid board area, and problems such as inaccurate alignment, insufficient precision of cutting and insufficient cutting depth of the flexible board in V-CUT are easy to occur, and further, if the product is designed without V-CUT positioning holes on the board surface, the cutting accuracy of V-CUT is further affected.

[0005] Based on the above background and problems, it is necessary to provide a novel V-CUT processing method of a rigid-flexible combined board with a surface flexible board layer. SUMMARY

[0006] The present application aims to solve the V-CUT processing of the rigid-flexible combined board with the flexible board on the surface layer, and the prior art is easy to cause problems such as wire drawing, pulling and knife rolling in the V-CUT processing of the flexible board layer, and insufficient depth and insufficient precision, and provides a V-CUT processing method of a rigid-flexible combined board with a surface flexible board layer, the rigid-flexible combined board includes a flexible board and a rigid board in a laminated structure, the flexible board is located on one side surface of the rigid board, and the rigid-flexible combined board is designed with a V-CUT cutting line on the surface, which is used to form a V-CUT cutting groove.

[0007] The processing method includes the following steps:

[0008] S10: take the flexible plate layer, and pre-enlarge the size of the flexible plate layer according to the design size to form an elongated area distributed on one side of the flexible plate layer, make the flexible plate surface circuit pattern as a whole, and form a flexible plate;

[0009] The junction position of the flexible plate layer and the elongated area is a junction line;

[0010] S20: take the rigid plate layer, pre-enlarge the rigid plate layer according to the elongated area, and make the rigid plate surface circuit pattern to form a rigid plate;

[0011] S30: stack and press the flexible plate and the rigid plate to form a press-bonded plate;

[0012] S40: attach a single-sided flexible copper-clad plate to the surface of the flexible plate of the press-bonded plate, and the copper layer of the single-sided flexible copper-clad plate is located on the outer surface;

[0013] Make a surface compensation pattern to the copper layer with the V-CUT cutting line as the center line, and the width of the surface compensation pattern is greater than the maximum opening width of the V-CUT cutting groove;

[0014] Make a solder resist pattern layer to the surface of the rigid plate of the laminated plate to form a pattern plate as a whole;

[0015] S50: make a guide groove to the surface compensation pattern of the elongated area of the pattern plate with the V-CUT cutting line as the center line, and V-CUT process the pattern plate to form a V-CUT cutting groove and form a V-CUT plate;

[0016] S60: micro-etch the V-CUT plate to form the rigid-flexible combination plate.

[0017] Further, the surface compensation pattern is divided into a guide groove compensation pattern and a cutting compensation pattern; the guide groove compensation pattern is located within the range of the elongated area and presents a trapezoidal pattern from the junction line to the plate edge.

[0018] Further, the flexible plate surface circuit pattern includes a flexible plate compensation pattern, and the flexible plate compensation pattern and the guide groove compensation pattern are distributed corresponding to each other in the interlayer.

[0019] Further, the rigid plate circuit pattern includes a rigid plate compensation pattern, and the rigid plate compensation pattern has the V-CUT cutting line as the center line and a width greater than the maximum opening width of the V-CUT cutting groove of the rigid plate.

[0020] Further, the guide groove is cut from the plate edge to the extension region to form a "V" shaped groove, the bottom of the "V" shaped groove is connected with the V-CUT cutting line, and the cutting is performed by milling or die punching.

[0021] Further, the V-CUT processing is double-sided V-CUT processing.

[0022] Further, the depth of the V-CUT cutting groove on one side of the flexible plate formed by the double-sided V-CUT processing is greater than the depth of the V-CUT cutting groove on one side of the rigid plate.

[0023] Further, the micro-etching treatment is performed by pasting a dry film layer on one side of the rigid plate, exposing, and then performing the micro-etching treatment.

[0024] Further, after the micro-etching treatment is completed, the V-CUT plate is subjected to a strong alkali cleaning treatment.

[0025] Further, the strong alkali cleaning treatment is performed by using NaOH solution or KOH solution or film removal solution to clean the V-CUT plate after the micro-etching treatment is completed.

[0026] The technical scheme of the present application sets an extension region on the processing plate, and makes an auxiliary compensation pattern and a guide groove in the extension region, which has the functions of guiding cutting, assisting alignment, and transition cutting for V-CUT processing. In addition, a single-sided flexible copper-clad plate is used to replace the original cover film layer, and a cutting compensation pattern is made by using the copper layer of the single-sided flexible copper-clad plate. The cutting compensation pattern can effectively provide the functions of transition layer and compression layer for the single-sided copper-clad plate dielectric layer and the flexible plate, effectively prevent the V-CUT tool from being pulled, stretched, and the knife from being rolled with the single-sided copper-clad plate dielectric layer and the flexible plate, and the problems of pulling, stretching, and rolling of the knife with the polyimide material. In addition, the auxiliary micro-etching and strong alkali cleaning treatments can realize high-precision and high-quality V-CUT processing of the rigid-flexible combined plate with a flexible plate layer on the surface. BRIEF DESCRIPTION OF DRAWINGS

[0027] In order to more clearly illustrate the technical scheme in the embodiments of the present application or the prior art, the drawings needed in the following description of the embodiments or the prior art will be briefly introduced. Obviously, the drawings in the following description are only some embodiments of the present application, and other drawings can be obtained by those skilled in the art without creative labor.

[0028] Figure 1 The process flow diagram of the embodiments of the present application is shown in the following figure.

[0029] Figure 2 A schematic view of a planar structure of a pattern plate processed according to an embodiment of the present application;

[0030] Figure 3 A schematic view of a planar structure of a pattern plate processed according to an embodiment of the present application; Figure 2 A schematic view of an A-A cross-sectional structure of the pattern plate according to an embodiment of the present application;

[0031] Figure 4 A schematic view of a planar structure of a pattern plate processed according to an embodiment of the present application; Figure 2 A schematic view of a B-B cross-sectional structure of the pattern plate according to an embodiment of the present application;

[0032] Figure 5 A schematic view of a planar structure of a pattern plate processed according to an embodiment of the present application;

[0033] Figure 6 A schematic view of a C-C cross-sectional structure of the pattern plate according to an embodiment of the present application; Figure 5

[0034] A schematic view of a planar structure of a pattern plate processed according to an embodiment of the present application; Figure 7

[0035] A schematic view of a D-D cross-sectional structure of the pattern plate according to an embodiment of the present application; Figure 8 Figure 7 A schematic view of a planar structure of a pattern plate processed according to an embodiment of the present application.

[0036] Figure 9 Explanation of reference numerals:

[0037] Explanation of reference numerals:

[0038] Reference Name Reference Name 10 Graphic plate 220 Rigid plate 110 V-CUT cutting line 2210 Second circuit layer 120 Extension area 2220 Rigid plate dielectric layer 130 Boundary line 2230 Third circuit layer 2310Y Guide slot compensation pattern 2240 Solder mask pattern layer 2310Q Cutting compensation pattern 2210B Flexible plate compensation pattern 2320 Single-sided flexible copper-clad plate dielectric layer 20 Guide slot plate 2230B Rigid plate compensation pattern 240 Guide slot 2320 Single-sided flexible copper-clad plate dielectric layer 30 V-CUT plate 210 Flexible plate 310 V-CUT cutting slot 2110 First circuit layer 310G Rigid plate V-CUT cutting slot 2120 Flexible plate dielectric layer 40 Rigid-flexible combined plate

[0039] The implementation, functional features and advantages of the present application will be further described with reference to the accompanying drawings. DETAILED DESCRIPTION

[0040] The technical solutions in the embodiments of the present application will be clearly and completely described with reference to the accompanying drawings in the embodiments of the present application. Obviously, the described embodiments are only part of the embodiments of the present application, rather than all the embodiments of the present application. Based on the embodiments in the present application, all other embodiments obtained by those skilled in the art without creative work fall within the scope of protection of the present application.

[0041] It should be noted that all directional indications (such as up, down, left, right, front, back, etc.) in the embodiments of the present application are only used to explain the relative positional relationship, movement condition, etc. between components in a certain posture (as shown in the drawings), and if the certain posture changes, the directional indications also change accordingly.

[0042] ​In addition, the descriptions such as "first", "second" and the like in the present application are only for the purpose of description, and cannot be understood as indicating or implying the relative importance of the indicated technical features or implying the number of the indicated technical features. Therefore, the features defined as "first", "second" can be explicitly or implicitly included at least one of the features. In the description of the present application, the meaning of "a plurality of" is at least two, for example, two, three, etc., unless otherwise specifically limited.

[0043] Please refer to Figure 1 , Figure 1 for the process flow of the embodiment of the present application.

[0044] The V-CUT processing method of the rigid-flexible combined board of the surface flexible board layer provided by the embodiment is processed according to the process flow shown in Figure 1 , which will be described step by step.

[0045] Please refer to Figure 1 , Figure 3 and Figure 4 ; Figure 2 for the schematic diagram of the planar structure of the pattern board processed by the embodiment of the present application; Figure 3 for the schematic diagram of the A-A cross-sectional structure of the embodiment of the present application Figure 2 ; Figure 4 for the schematic diagram of the B-B cross-sectional structure of the embodiment of the present application Figure 2 .

[0046] The V-CUT processing method of the rigid-flexible combined board of the surface flexible board layer of the embodiment, wherein the rigid-flexible combined board includes a flexible board and a rigid board on a laminated structure, the flexible board is located on one side surface of the rigid board, forming a surface flexible board layer structure, and the surface of the rigid-flexible combined board is designed with a V-CUT cutting line 110 for making a V-CUT cutting groove.

[0047] Since the material of the flexible board is polyimide material, and the cover film layer attached to the surface of the flexible board is also polyimide material, which is more flexible and more difficult to process than the epoxy resin material of the rigid board, the V-CUT knife cuts the polyimide material during the V-CUT processing of the rigid-flexible combined board of the surface flexible board layer, which is prone to problems such as pulling and wire drawing, resulting in incomplete processing, and even tearing the flexible board layer. The structure of the flexible board on one side and the rigid board on the other side is an asymmetric structure, and the materials on both sides expand and shrink differently, which is prone to problems such as warping and buckling during processing. During V-CUT processing, inaccurate alignment may cause inaccurate cutting. Therefore, a corresponding solution is needed.

[0048] The processing method steps are:

[0049] Step S10:

[0050] Take the flexible plate layer, including the flexible plate medium layer 2120 and the surface copper layer as shown in Figure 3 The size of the flexible plate layer is pre-enlarged according to the design size, forming an extension area 120 distributed on one side of the flexible plate layer, and the junction position of the flexible plate layer and the extension area is a junction line 130, and the flexible plate surface circuit pattern is formed, that is, the first circuit layer 2110 shown in Figure 3 The flexible plate 210 is formed, as shown in Figure 3 The first circuit layer 2110 and the flexible plate medium layer 2120.

[0051] The extension area 120 is an integral part of the original processing plate, that is, the original processing plate is pre-enlarged in the direction of one side of the V-CUT cutting, and the subsequent V-CUT processing is cut into the original processing plate from the extension area 120, which plays a role of guiding cutting, assisting alignment and transition cutting of the original processing plate; and the extension area 120 is provided with an auxiliary compensation pattern, which will be described in detail below.

[0052] Step S20:

[0053] Take the rigid plate layer, such as the rigid plate medium layer 2220 and the rigid plate surface copper layer as shown in Figure 3 According to the extension area 120, the rigid plate layer is pre-enlarged correspondingly, and the rigid plate surface circuit pattern is formed, that is, the second circuit layer 2210 and the third circuit layer 2230 shown in Figure 3 The rigid plate 220 is formed, as shown in Figure 3 The rigid plate 220 includes the second circuit layer 2210, the rigid plate medium layer 2220 and the third circuit layer 2230.

[0054] In this embodiment, the rigid plate circuit pattern includes a rigid plate compensation pattern 2230B, which takes the V-CUT cutting line 110 as the center line and has a width greater than the maximum opening width of the V-CUT cutting groove of the rigid plate 220.

[0055] Similarly, the rigid plate also includes the extension area 120, and the rigid plate is provided with the compensation pattern 2230B, which can match the surface compensation pattern of the subsequent single-sided flexible copper-clad plate on the one hand, increase the matching of the cutting conditions of double-sided V-CUT, and on the other hand, the compensation pattern 2230B forms a buffer transition layer for V-CUT processing, reduces the damage of V-CUT to the rigid plate substrate, improves the processing precision, and is more suitable for manufacturing high-precision circuit board products.

[0056] Step S30:

[0057] The flexible plate 210 and the rigid plate 220 are stacked and laminated to form a laminated plate.

[0058] Step S40:

[0059] A single-sided flexible copper-clad plate is attached to the surface of the flexible plate of the pressboard 10, which is composed of a single-sided flexible copper-clad plate medium layer 2320 and a copper layer as shown in the figure, and the copper layer of the single-sided flexible copper-clad plate is located on the outer surface; a surface compensation pattern is made to the copper layer with the V-CUT cutting line 110 as the center line, and the width of the surface compensation pattern is greater than the maximum width of the opening of the V-CUT cutting groove, that is, the width of the opening position of the V-CUT cutting groove. Figure 3

[0060] In this embodiment, the single-sided copper-clad plate is used to replace the original cover film design, the single-sided flexible copper-clad plate medium layer 2320 of the single-sided copper-clad plate is used to replace the original cover film layer, and a surface compensation pattern is made to the copper layer to provide cutting protection and cutting transition layer for the single-sided flexible copper-clad plate medium layer 2320 and the flexible plate 210; one side of the single-sided flexible copper-clad plate and the flexible plate 210 can be provided with a glue layer (usually an acrylic glue layer or an epoxy resin glue layer or a polyimide glue layer) to facilitate the combination of the single-sided flexible copper-clad plate and the flexible plate 210, or a double-sided flexible copper-clad plate can be used to etch away one side of the copper layer to form a single-sided flexible copper-clad plate.

[0061] In this embodiment, the surface compensation pattern is divided into a guide slot compensation pattern 2310Y and a cutting compensation pattern 2310Q; the guide slot compensation pattern 2310Y is located within the extension area 120 and presents a trapezoidal pattern from the boundary line 130 to the plate edge.

[0062] The guide slot compensation pattern 2310Y and the cutting compensation pattern 2310Q are connected to form a surface compensation pattern, wherein the guide slot compensation pattern 2310Y provides copper layer conditions for subsequent guide slot manufacturing, and the cutting compensation pattern 2310Q is an important transition layer and compression layer for cutting the single-sided copper-clad plate medium layer 2320 and the flexible plate 210 during V-CUT processing, which can effectively prevent the V-CUT cutter from pulling, stretching and rolling the polyimide material with the single-sided copper-clad plate medium layer 2320 and the flexible plate 210.

[0063] The surface circuit pattern of the flexible plate 210 includes a flexible plate compensation pattern 2210B (as shown in the figure), which is distributed in the interlayer corresponding to the guide slot compensation pattern. Figure 4

[0064] If high-precision processing is required, a compensation pattern 2210B can be further provided on the flexible plate 210, or a compensation pattern 2210B can be provided on each layer of the circuit pattern of the flexible plate, which can provide processing transition effect for each layer and improve the processing precision of each layer.​​

[0065] Subsequently, a solder resist pattern layer 2240 is made on the surface of the rigid plate 220 of the laminate, and a pattern plate is formed as a whole; the solder resist pattern layer 2240 can form further protection for the surface of the rigid plate 220.

[0066] Please refer to Figure 5 , Figure 6 , Figure 7 and Figure 8 ; Figure 5 is a schematic diagram of a planar structure of a guide slot plate processed according to an embodiment of the present application; Figure 6 is a schematic diagram of a C-C cross-sectional structure of the embodiment of the present application Figure 5 ; Figure 7 is a schematic diagram of a planar structure of a V-CUT plate processed according to an embodiment of the present application; Figure 8 is a schematic diagram of a D-D cross-sectional structure of the embodiment of the present application Figure 7 ;

[0067] S50: A guide slot 240 is made on the surface of the extended area 120 of the pattern plate 10 with the V-CUT cutting line 110 as a center line, and the pattern plate 10 is processed by V-CUT to form a V-CUT cutting slot 310 and a V-CUT plate 30.

[0068] The length of the guide slot 240 is less than or equal to the length of the extended area 120; on one hand, the guide slot 240 can give the effective area of the original processing plate a certain regularity and guidance during V-CUT processing, and play a certain auxiliary positioning role when the plate is curved or warped; on the other hand, if the plate edge of the processing plate is not provided with a positioning hole of V-CUT, the whole plate is in a state of being simply clamped (or half-clamped) by the equipment at this time, and positioning may have certain errors at this time; the guide slot 240 can better play a guiding and auxiliary positioning role.

[0069] In the embodiment, the guide slot 240 is cut from the plate edge to the extended area by milling or die cutting, forming a “V”-shaped slot, and the bottom of the “V”-shaped slot is connected with the V-CUT cutting line 110.

[0070] It is worth noting that if a high-precision circuit board product is made, a milling cutter can be used for processing, and at this time, the line layers inside the flexible plate 210 and the rigid plate 220 can be provided with compensation patterns to provide transition layers for each layer and improve the processing precision of each layer, thereby improving the overall processing precision; if the processing precision requirement is conventional, a die cutting method can be used for processing, which is helpful to improve the processing efficiency.

[0071] In the embodiment, the V-CUT processing is cut along the guide groove 240 and V-CUT processing is performed, and the V-CUT processing is double-sided V-CUT processing; if one-time double-sided V-CUT processing is used, the flatness of the circuit board and the condition balance of the two sides are required to be higher, and if single-to-single double-sided V-CUT processing is used, the processing method of the embodiment can also be used.

[0072] In the embodiment, the depth of the V-CUT cutting groove 310 on one side of the flexible plate formed by the double-sided V-CUT processing is greater than the depth of the V-CUT cutting groove 310G on one side of the rigid plate.

[0073] The processing in the different depths of the two sides avoids the warping and warping of the circuit board during processing of the asymmetric structure, and the problem of incomplete cutting depth of the flexible plate during V-CUT processing, especially deepening the V-CUT cutting groove 310 on one side of the flexible plate, and effectively preventing the polyimide material of the flexible plate 210 from being pulled and wired, and because the overall depth of the V-CUT cutting is generally specified (generally 1 / 3 to 2 / 3 of the thickness of the plate), the V-CUT cutting groove 310G on one side of the rigid plate is reduced, but the rigid plate compensation pattern 2230B needs to be cut off to prevent pulling problems during subsequent board disassembly.

[0074] Please refer to Figure 9 , Figure 9 The planar structure diagram of the rigid-flexible combined board processed and formed by the embodiment of the application is shown.

[0075] Step S60:

[0076] The V-CUT plate 30 is subjected to micro-etching treatment to form the rigid-flexible combined board 40; the extension region can be removed by milling and forming.

[0077] In the embodiment, the micro-etching treatment is to paste a dry film layer on one side of the rigid plate 220, expose, and then perform the micro-etching treatment; after the micro-etching treatment is completed, the V-CUT plate 30 is subjected to strong alkali cleaning treatment; the strong alkali cleaning treatment is to clean the V-CUT plate 30 after the micro-etching treatment is completed using NaOH solution or KOH solution or film removal liquid.

[0078] Due to the existence of the cutting compensation pattern 2310Q, the residual copper layer pattern needs to be removed after cutting. A dry film layer is attached to one side of the rigid plate 220 for protection, and the residual cutting compensation pattern 2310Q is removed by micro-etching, which can effectively and high-quality remove the residual copper layer pattern. In addition, the single-sided flexible copper-clad plate is used to replace the cover film layer to process the cover film layer of the flexible plate 210. The single-sided flexible copper-clad plate medium layer and the copper layer of the single-sided flexible copper-clad plate generally have a layer of glue layer (usually an acrylic glue layer). The surface glue layer can be removed by strong alkali cleaning to improve the quality of the cover film. At the same time, the dry film layer attached to one side of the rigid plate 220 can be removed by strong alkali cleaning. The glue layer is generally thin, about 3-5 μm, and can also be selected not to be removed. The concentration of NaOH solution can be 5%-10%, and the concentration of KOH solution can be 3%-5%.

[0079] It should be noted that due to different designs, processing, and application situations of different circuit board products in actual processing and application processes, the drawings of the embodiments are only used to illustrate the implementation process of the embodiments, and do not represent the size ratio of the actual product, nor represent the drawing enlarged in proportion according to the actual situation.

[0080] The above is only the preferred embodiment of the present application, and does not limit the patent scope of the present application. Any equivalent structural transformation, direct / indirect application in other related technical fields, or direct / indirect application in other related technical fields under the inventive concept of the present application are included in the patent protection scope of the present application.

Claims

1. A V-CUT processing method of a rigid-flexible combination board of a surface flexible board layer, the rigid-flexible combination board comprising a flexible board and a rigid board in a laminated structure, the flexible board being located on one side surface of the rigid board, and the rigid-flexible combination board being designed with a V-CUT cutting line on a surface thereof for forming a V-CUT cutting groove; the processing method comprising the following steps: S10: taking a flexible board layer, pre-enlarging the size of the flexible board layer according to a designed size to form an extended area distributed on one side of the flexible board layer, and integrally manufacturing a flexible board surface circuit pattern to form a flexible board; an intersection line being formed at an intersection position of the flexible board layer and the extended area; S20: taking a rigid board layer, pre-enlarging the rigid board layer according to the extended area, and manufacturing a rigid board surface circuit pattern to form a rigid board; S30: stacking and pressing the flexible board and the rigid board to form a pressed board; S40: attaching a single-sided flexible copper-clad plate to a surface of the flexible board of the pressed board, a copper layer of the single-sided flexible copper-clad plate being located on an outer surface; manufacturing a surface compensation pattern on the copper layer with the V-CUT cutting line as a center line, the surface compensation pattern having a width greater than a maximum opening width of the V-CUT cutting groove; manufacturing a solder resist pattern layer on a rigid board surface of the pressed board to integrally form a pattern board; S50: manufacturing a guide groove on the surface compensation pattern of the extended area of the pattern board with the V-CUT cutting line as a center line, and performing V-CUT processing on the pattern board to form a V-CUT cutting groove and a V-CUT board; S60: performing a micro-etching treatment on the V-CUT board to form the rigid-flexible combination board. characterized in that The surface compensation pattern is divided into a guide groove compensation pattern and a cutting compensation pattern; the guide groove compensation pattern is located within the extended area and forms a trapezoidal pattern from the intersection line to a board edge. The flexible board surface circuit pattern comprises a flexible board compensation pattern, the flexible board compensation pattern and the guide groove compensation pattern being distributed in a corresponding interlayer manner. The rigid board circuit pattern comprises a rigid board compensation pattern, the rigid board compensation pattern having the V-CUT cutting line as a center line and a width greater than a maximum opening width of the V-CUT cutting groove of the rigid board. The guide groove is cut from a board edge into the extended area to form a "V"-shaped groove, a bottom of the "V"-shaped groove being connected to the V-CUT cutting line. The cutting is performed by milling or die cutting. The V-CUT processing is performed in a direction along the guide groove. The V-CUT processing is double-sided V-CUT processing. The double-sided V-CUT processing forms the V-CUT cutting groove on one side of the flexible board to have a greater depth than the V-CUT cutting groove on one side of the rigid board. The micro-etching treatment comprises attaching a dry film layer to one side of the rigid board, exposing, and then performing the micro-etching treatment. After the micro-etching treatment is completed, a strong alkali cleaning treatment is performed on the V-CUT board.

2. The V-CUT processing method of a rigid-flex printed circuit board with a surface flexible board layer according to claim 1, wherein, ​ ​ 3. The V-CUT processing method of a rigid-flex printed circuit board of a surface flexible board layer as claimed in claim 2, wherein, ​ ​ 4. The V-CUT machining method of a rigid-flex printed circuit board with a surface flexible board layer according to claim 1, wherein, ​ ​ 5. The V-CUT machining method of a rigid-flex printed circuit board with a surface flexible board layer according to claim 1, wherein, ​ ​ 6. The V-CUT machining method of a rigid-flex printed circuit board with surface flexible layers as claimed in claim 1, wherein, ​ ​ 7. The V-CUT machining method of a rigid-flex printed circuit board of a surface flexible board layer as claimed in claim 6, wherein, ​ 8. The V-CUT machining method of a rigid-flex printed circuit board with surface flexible layers as claimed in claim 1, wherein, ​ 9. The V-CUT processing method of a rigid-flex combined board of a surface flexible board layer according to claim 1 or 8, characterized in that, ​ 10. The V-CUT processing method of a rigid-flex printed circuit board of a surface flexible board layer as claimed in claim 9, wherein, The strong alkali cleaning treatment is to clean the V-CUT plate after the micro-etching treatment using NaOH solution or KOH solution or film removing solution.

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