Liquid cooling device, liquid-cooled electronic device

Abstract

The application discloses a liquid cooling device and a liquid cooling electronic device, and is applied to the field of leakage protection, and relates to the technical field of liquid cooling devices.The liquid cooling device comprises a cold plate body, a liquid cooling circulation pipeline, a supporting component, a hollow part between adjacent cold plate bodies and between the cold plate body and the supporting component, an extension filler, a plurality of filler monomers, a water storage groove on one side surface of the filler monomers close to the liquid cooling circulation pipeline, and sequentially connected filler monomers which are in communication with each other.The liquid cooling device can effectively prevent the liquid cooling electronic device from being damaged by leakage of the cold plate body or the liquid cooling circulation pipeline, is simple to manufacture, can significantly improve the waterproof effect, is suitable for different types of liquid cooling electronic devices, does not need to change the case design, effectively reduces the research and development time and the labor input, and saves the cost.

Description

TECHNICAL FIELD

[0001] The present application relates to the field of liquid leakage protection, in particular to a liquid cooling device and a liquid-cooled electronic device. BACKGROUND

[0002] To address the increasing power consumption of CPUs (Central Processing Unit) and GPUs (Graphics Processing Unit), heat dissipation is often considered to reduce the power consumption of main heat-generating components such as CPUs, GPUs, and memories, and to pursue better PUE (Power Usage Effectiveness).

[0003] Liquid cooling technology generally uses cold plates for heat dissipation. The cold plate is connected to a water collector and a liquid circulation pipeline. The cold plate is attached to the component to be cooled. The liquid circulation pipeline is connected between the water collector and the cold plate, or between the cold plates. The cold plate has a cold pipe at one end for flowing cold water in, flowing through the heat-generating component to carry out heat, and then flowing out hot water through the other end of the cold pipe for continuous circulation to achieve the effect of cooling. However, when the cold plate is not designed well or assembled improperly, a small hole may be formed in the cold plate, causing liquid leakage. If the liquid drops onto the mainboard below, it may cause short circuit of electrical components and damage to the equipment. In addition, liquid leakage may also cause corrosion to electronic components and circuits inside the electronic device, affecting the performance and reliability of the electronic device.

[0004] In related technologies, a liquid leakage detection line is provided on the cold plate or the liquid circulation pipeline. When liquid leakage is detected, an alarm is issued. The machine room personnel discovers and replaces the damaged machine. However, when the machine room personnel cannot replace the machine in time, the liquid leakage may drop onto the mainboard below, causing damage to the machine.

[0005] Therefore, how to improve the reliability of the liquid cooling device is a technical problem to be solved by those skilled in the art at present. SUMMARY

[0006] The purpose of the present application is to provide a liquid cooling device and a liquid-cooled electronic device, which can effectively prevent liquid from falling onto the mainboard and are reliable in use.

[0007] To achieve the above-mentioned purpose, the present application provides the following technical solutions:

[0008] A liquid cooling device, comprising:

[0009] A cold plate body is arranged on a component to be cooled for absorbing heat of the component to be cooled.

[0010] A liquid cooling circulation pipeline is connected with the cold plate body and used to provide cooling medium to the cold plate body;

[0011] A support component is connected with the cold plate body and used to support the cold plate body and be placed on a mainboard. Adjacent the cold plate bodies and between the cold plate body and the support component, there are hollow parts.

[0012] An extension filler includes a plurality of filler units. The filler units are located in the hollow parts, the edges of the filler units are mounted on the edges of the cold plate bodies, the filler units are provided with water storage grooves on one side surface close to the liquid cooling circulation pipeline, and the filler units are connected in sequence and communicate with each other.

[0013] In another aspect, it further includes:

[0014] A water absorption component is arranged in the water storage groove and used to absorb liquid entering the water storage groove. The water absorption component is matched with the size of the water storage groove, and the water absorption component is detachably placed in the water storage groove.

[0015] In another aspect, it further includes:

[0016] A liquid leakage detection line is arranged on the liquid cooling circulation pipeline and used to send a liquid leakage signal when the liquid cooling circulation pipeline leaks.

[0017] The cold plate body is provided with a plurality of water receiving grooves, and the water receiving grooves are located below the liquid leakage detection line to carry the liquid leakage of the liquid cooling circulation pipeline.

[0018] In another aspect, it further includes:

[0019] A first liquid accumulation detection line is arranged in the water receiving groove and used to send a first liquid accumulation signal when the liquid surface in the water receiving groove is higher than a first preset height.

[0020] A controller is connected with the liquid leakage detection line and the liquid accumulation detection line and used to send an alarm signal after receiving the liquid leakage signal and the first liquid accumulation signal.

[0021] In another aspect, it further includes:

[0022] A groove absorption component is arranged in the water receiving groove and used to absorb liquid flowing into the water receiving groove. The top of the groove absorption component is lower than the arrangement height of the first liquid accumulation detection line.

[0023] In another aspect, a welding part is arranged on the liquid cooling circulation pipeline, on the cold plate body, and / or between the liquid cooling circulation pipeline and the cold plate body. The water receiving groove is located below the welding part, and the corners of the water receiving groove are provided with circular arc chamfers.

[0024] In another aspect, the application further comprises:

[0025] fasteners for connecting the extended filler, the cold plate body and the main plate;

[0026] Furthermore, the filler units are located between the cold plate body and the main plate, and the surfaces of the filler units are flush with the surface of the cold plate body.

[0027] In another aspect, the extended filler further comprises a plurality of water guide portions connected between adjacent filler units and communicating with the filler units, and the filler units and the water guide portions are arranged in the hollow portion.

[0028] In another aspect, the extended filler is an integral structure, and the extended filler is made of plastic or resin;

[0029] The size of the filler units is greater than that of the water guide portions, and the edges of the filler units are arranged in abutment with the edges of the cold plate body, so that the liquid flowing onto the surface of the cold plate body flows into the water storage groove of the filler units;

[0030] The filler units are arranged in intervals, and adjacent filler units are connected by at least two water guide portions, and the water guide portions are connected to the side portions of the filler units and extend along the bottom of the support member to connect two filler units.

[0031] The water storage groove is located on the filler unit, and the water guide portion is provided with a flow channel, and the flow channels of the water guide portions are connected between the water storage grooves of two filler units to allow the liquid to flow between adjacent filler units.

[0032] Adjacent filler units, adjacent water guide portions and / or filler units and water guide portions are provided with a clearance space for avoiding electrical elements on the cold plate body or main plate;

[0033] Furthermore, when the extended filler and the cold plate body are installed, the extended filler and the cold plate body are placed on the main plate for fixation, and the cold plate body is positioned corresponding to the component to be cooled, and the extended filler corresponds to the hollow portion.

[0034] The application also provides a liquid-cooled electronic device comprising the liquid-cooled device.

[0035] The liquid cooling device has the beneficial effects that: the hollow parts are filled by arranging the extension fillers on the hollow parts between adjacent cold plate bodies and between the cold plate body and the support component, so that liquid drops on the cold plate body are prevented from falling on the mainboard, and liquid leakage into the mainboard due to large water leakage of the cold plate body, the liquid cooling circulation pipeline or the connection between the cold plate body and the liquid cooling circulation pipeline is effectively avoided; further, the cold plate body is arranged on the component to be cooled, absorbs heat of the component to be cooled and dissipates heat of the component to be cooled, so that the cold plate body is arranged at a position corresponding to the component to be cooled, the cold plate body is supported by the support component for convenience, the support component generally only fixes the side edges of the cold plate body, and a large number of hollow parts are formed between the support component and the cold plate body and between adjacent cold plate bodies, the filler monomers are arranged one by one according to the corresponding positions of the hollow parts to fill all the hollow parts; meanwhile, to facilitate assembly and ensure that the filler monomers are more attached to the cold plate body, the edges of the filler monomers are mounted on the edges of the cold plate body, so that liquid on the surface of the cold plate body can smoothly flow to the filler monomers; further, the water storage tank is arranged on one side surface of the filler monomer close to the liquid cooling circulation pipeline, when the water leakage of the cold plate body or the liquid cooling circulation pipeline is large or when the water leakage occurs and is not timely treated by the staff, the liquid on the surface of the cold plate body increases and then flows into the water storage tank of the filler monomer after collection, so that liquid drops on the mainboard are further avoided, damage to electrical elements on the mainboard is reduced, corrosion is reduced, and normal operation of the liquid cooling electronic equipment is ensured; meanwhile, to further improve reliability, the filler monomers are sequentially connected and communicated with each other, that is, the filler monomers of the hollow parts are communicated with each other, so that when the water leakage at a certain position is large, the water can flow from the water storage tank of the filler monomer at the position to the water storage tanks of other filler monomers, so that the water storage tank is prevented from overflowing due to large water leakage, and the reliability of the waterproof effect is further ensured.

[0036] The liquid cooling device provided by this invention can effectively prevent liquid leakage from the cold plate body or the liquid cooling circulation pipeline from damaging liquid-cooled electronic equipment. It is simple to manufacture, requiring only the design of the extension filler based on the position of the cold plate body, the position of the support component, and the position of the electrical components on the motherboard that need to be avoided. Then, the extension filler and the cold plate body are installed on the motherboard simultaneously, which can significantly improve the waterproof effect. This liquid cooling device is applicable to different types of liquid-cooled electronic equipment without changing the chassis design, effectively reducing R&D time and manpower investment, and saving costs.

[0037] In one embodiment, the system further includes: a leakage detection line disposed on the liquid cooling circulation pipeline, used to issue a leakage signal when the liquid cooling circulation pipeline leaks, reminding personnel to repair in time and indicating the location of the leak point; and the cold plate body is provided with several water-collecting grooves, which are located below the leakage detection line to collect the leakage from the liquid cooling circulation pipeline. When personnel cannot repair the leak point in time, the liquid will drip into the water-collecting grooves, thereby collecting the dripping liquid and effectively preventing the dripping liquid from entering the motherboard, thus playing a supplementary waterproofing role. When the liquid in the water-collecting grooves overflows, the liquid flows from the water-collecting grooves to the water storage tank of the filler unit, which can play a more comprehensive waterproofing role and avoid damage to the motherboard.

[0038] The liquid-cooled electronic device provided by the present invention is equipped with the above-mentioned liquid cooling device. Since the liquid cooling device has the above-mentioned technical effects, the liquid-cooled electronic device equipped with the liquid cooling device should also have the corresponding technical effects. Attached Figure Description

[0039] To more clearly illustrate the technical solutions in the embodiments of the present invention or related technologies, the drawings used in the description of the embodiments or related technologies will be briefly introduced below. Obviously, the drawings described below are only some embodiments of the present invention. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.

[0040] Figure 1 This is a schematic diagram of the structure of the cold plate body and supporting components in the liquid cooling device provided by the present invention;

[0041] Figure 2 for Figure 1 A schematic diagram of the liquid cooling device from another perspective;

[0042] Figure 3 A schematic diagram of a specific embodiment of the liquid cooling device provided by the present invention;

[0043] Figure 4 for Figure 3Structure schematic view of water receiving groove on cold plate body in the shown liquid cooling device;

[0044] Figure 5 As Figure 3 Structure schematic view of extension filler in the shown liquid cooling device;

[0045] Figure 6 Control mode schematic view of the liquid cooling device provided by the present application.

[0046] Reference signs:

[0047] Cold plate body 100; water receiving groove 110; liquid cooling circulation pipeline 200; support component 300; hollow part 400; extension filler 500; filler monomer 510; water guide part 520; flow channel 521; second liquid accumulation detection line 540; controller 600; liquid leakage detection line 610; first liquid accumulation detection line 620; alarm component 630. DETAILED DESCRIPTION

[0048] The core of the present application is to provide a liquid cooling device and a liquid cooling electronic equipment, which can significantly reduce the damage to the mainboard and avoid the corrosion of electrical components caused by liquid leakage.

[0049] The technical solutions in the embodiments of the present application will be clearly and completely described below with reference to the drawings in the embodiments of the present application. Obviously, the described embodiments are only part of the embodiments of the present application, rather than all the embodiments. Based on the embodiments in the present application, all other embodiments obtained by those skilled in the art without creative labor fall within the scope of protection of the present application.

[0050] Please refer to Figures 1 to 3 As shown, Figure 1 Structure schematic view of cold plate body 100 and support component 300 in the liquid cooling device provided by the present application; Figure 2 As Figure 1 Structure schematic view of another view of the liquid cooling device; Figure 3 Structure schematic view of one specific embodiment of the liquid cooling device provided by the present application.

[0051] In this embodiment, the liquid cooling device comprises:

[0052] The cold plate body 100 is arranged on the component to be cooled, and is used for absorbing the heat of the component to be cooled.

[0053] The liquid cooling circulation pipeline 200 is connected with the cold plate body 100, and is used for providing cooling medium to the cold plate body 100.

[0054] The support component 300 is connected with the cold plate body 100, used for supporting the cold plate body 100 and placed on the mainboard, and the hollow part 400 is formed between adjacent cold plate bodies 100 and between the cold plate body 100 and the support component 300;

[0055] The extension filler 500 comprises a plurality of filler units 510, the filler units 510 are located in the hollow part 400, the edges of the filler units 510 are mounted on the edges of the cold plate body 100, the filler units 510 are provided with water storage grooves on the side surfaces close to the liquid cooling circulation pipeline 200, and the filler units 510 are sequentially connected and communicated with each other.

[0056] Specifically, the cold plate body 100 is connected with the water distributor at the cabinet through the pipeline, the cooling medium is distributed to each cold plate body 100 through the water distributor, then the circulation flow is realized through the liquid circulation pipeline, and the heat exchange is completed; the working principle between the water distributor and the cold plate body 100 and the liquid circulation pipeline can be referred to the related technology; the support component 300 and the cold plate body 100 can be fixed through screw connection, the support component 300 is arranged around the cold plate body 100, the cold plate body 100 is supported on the surface of the component to be cooled, and the heat exchange is facilitated; the support component 300 and the cold plate body 100 constitute the cold plate structure of the device; since the layout of the support component 300 and the cold plate body 100 needs to be set according to the position of the component to be cooled, therefore, the hollow part 400 is formed between adjacent cold plate bodies 100 and / or between the cold plate body 100 and the support component 300, that is, the hole is formed on the cold plate structure, in order to place the liquid leakage to drop on the mainboard through the hollow part 400 and damage the electrical elements, therefore, the extension filler 500 is additionally arranged; the shape of the extension filler 500 is determined according to the position and layout of the cold plate body 100 and the support component 300, so as to ensure good waterproof effect.

[0057] The liquid cooling device provided by the application can fill the hollow part 400 by arranging the extension filler 500 on the hollow part 400 between adjacent cold plate bodies 100 and between the cold plate body 100 and the support component 300, so as to avoid that the liquid on the cold plate body 100 drops on the mainboard, and effectively avoid that the liquid leakage enters the mainboard due to large amount of liquid leakage at the cold plate body 100, the liquid cooling circulation pipeline 200 or the connection between the cold plate body 100 and the liquid cooling circulation pipeline 200.

[0058] Further, since the cold plate body 100 is arranged on the component to be cooled, heat of the component to be cooled is absorbed to dissipate heat of the component to be cooled, therefore, the cold plate body 100 is arranged at a position corresponding to the component to be cooled, in order to facilitate arrangement of the cold plate body 100, the cold plate body 100 is supported by the support component 300, generally, the support component 300 only fixes the side edge of the cold plate body 100, and a hollow part 400 is formed between the support component 300 and the cold plate body 100 and between adjacent cold plate bodies 100, the present application sets the plurality of filler units 510 according to the corresponding position of the hollow part 400, and the filler units 510 are set one by one to fill all the hollow parts 400; at the same time, in order to facilitate assembly and ensure that the filler unit 510 is more attached to the cold plate body 100, the edge of the filler unit 510 is mounted on the edge of the cold plate body 100, so as to ensure that the liquid on the surface of the cold plate body 100 can flow to the filler unit 510 smoothly; further, a water storage tank is arranged on the side surface of the filler unit 510 close to the liquid cooling circulation pipeline 200, when the amount of water leakage in the cold plate body 100 or the liquid cooling circulation pipeline 200 is large, or when the water leakage occurs and the staff does not handle it in time, the liquid on the surface of the cold plate body 100 increases and then flows into the water storage tank of the filler unit 510 after gathering, further avoiding the liquid from dropping on the mainboard and reducing damage to the electrical elements on the mainboard, reducing corrosion and ensuring normal operation of the liquid cooling electronic equipment.

[0059] At the same time, in order to further improve the reliability, the filler units 510 are connected in sequence and communicate with each other, that is, the filler units 510 of each hollow part 400 communicate with each other, which is arranged to ensure that when the amount of water leakage at a certain position is large, the water can flow to the water storage tank of other filler units 510 through the water storage tank of the filler unit 510 at this position, avoiding overflow of the water storage tank due to large amount of water leakage, and further ensuring the reliability of the waterproof effect.

[0060] The liquid cooling device provided by the present application can effectively prevent the liquid leakage of the cold plate body 100 or the liquid cooling circulation pipeline 200 from damaging the liquid cooling electronic equipment, is simple to manufacture, only needs to design the extended filler 500 according to the position of the cold plate body 100, the position of the support component 300 and the position of the electrical element to be avoided on the mainboard, then the extended filler 500 and the cold plate body 100 are installed on the mainboard at the same time, which can significantly improve the waterproof effect; the liquid cooling device can be applied to different types of liquid cooling electronic equipment without changing the case design, effectively reducing the research and development time and manpower investment, and saving cost.

[0061] In some embodiments, further comprising: a water absorption component arranged in the water storage groove for absorbing liquid entering the water storage groove; the water absorption component is matched with the size of the water storage groove, and the water absorption component is detachably placed in the water storage groove. Specifically, the water absorption component can be a sponge, and materials capable of achieving water absorption effect can be used. When liquid leakage occurs and has converged to the water storage groove, it indicates that the water leakage is large or the water leakage time is long. Since the water storage groove of the filling piece single body 510 is the last waterproof line, by arranging the water absorption component in the water storage groove, the liquid leakage can be absorbed while converging, effectively preventing the liquid leakage from dropping onto the mainboard. At the same time, by arranging the water absorption component, maintenance is also facilitated. After repairing the water leakage point, the accumulated liquid in the water storage groove can be removed by directly replacing the water absorption component, without the need for other liquid discharge equipment, which is convenient to operate.

[0062] Please refer to Figure 4 and Figure 6 , Figure 4 for Figure 3 the structure diagram of the water receiving groove 110 on the cold plate body 100 of the liquid cooling device shown in the figure; please refer to Figure 6 Figure 6 for the control mode diagram of the liquid cooling device provided by the application.

[0063] In some embodiments, further comprising: a liquid leakage detection line 610 arranged on the liquid cooling circulation pipeline 200 for sending a liquid leakage signal when the liquid cooling circulation pipeline 200 leaks liquid. The wet liquid leakage detection line 610 changes the impedance and sends an alarm to remind the staff to repair in time and gives the position of the water leakage point. In addition, the cold plate body 100 is provided with a plurality of water receiving grooves 110, and the water receiving grooves 110 are located below the liquid leakage detection line 610 to carry the liquid leakage of the liquid cooling circulation pipeline 200. When the staff cannot repair the water leakage point in time, the liquid will drop into the water receiving groove 110, thereby converging the dropped liquid, effectively preventing the dropped liquid from entering the mainboard, and achieving the effect of supplementing waterproof. When the liquid in the water receiving groove 110 overflows, the liquid flows from the water receiving groove 110 into the water storage groove of the filling piece single body 510, which can more comprehensively achieve the waterproof effect and avoid damage to the mainboard.

[0064] In some embodiments, further comprising:

[0065] The first liquid accumulation detection line 620 is arranged in the water receiving groove 110, and is used to send a first liquid accumulation signal when the liquid level in the water receiving groove 110 is higher than a first preset height. Specifically, when arranging the first liquid accumulation detection line 620, the first liquid accumulation detection line 620 can be arranged on the side wall of the water receiving groove 110, and the first liquid accumulation detection line 620 is spaced apart from the bottom of the water receiving groove 110 by a certain distance, so that the water receiving groove 110 has a certain liquid accumulation bearing capacity. That is, when the accumulated water in the water receiving groove 110 has a certain amount, the first liquid accumulation detection line 620 will be submerged. When the first liquid accumulation detection line 620 detects the liquid, it indicates that the water in the water receiving groove 110 is about to be full. At this time, the first liquid accumulation signal can be sent.

[0066] The controller 600 is connected with the liquid leakage detection line 610 and the liquid accumulation detection line, and is used to send an alarm signal after receiving the liquid leakage signal and the first liquid accumulation signal.

[0067] Further, the device further comprises an alarm component 630, and the alarm signal can be sent through the alarm component 630. In order to better distinguish the degree of liquid leakage, when the controller 600 receives the liquid leakage signal, the alarm component 630 can be controlled to send a first alarm signal, such as a beeping sound, a flashing light, etc., indicating that the liquid cooling device has a water leakage point. When the controller 600 receives the first liquid leakage signal, the alarm component 630 can be controlled to send a second alarm signal, such as a louder beeping sound, a brighter flashing light, or a combination of the two, indicating that the liquid cooling device not only has a water leakage point, but also that the liquid leakage of the water leakage point is about to overflow the water receiving groove 110, so as to provide the staff with the need to seal the water leakage point as soon as possible.

[0068] In some embodiments, further comprising:

[0069] The groove adsorption component is arranged in the water receiving groove 110, and is used to adsorb the liquid flowing into the water receiving groove 110. The top of the groove adsorption component is lower than the arrangement height of the first liquid accumulation detection line 620, so that the first liquid accumulation detection line 620 can effectively detect the liquid in the water receiving groove 110. Similarly, the groove adsorption component can also be a sponge, and materials that can have a water absorption effect can be used. Through the arrangement of the groove adsorption component, when liquid leakage occurs and has flowed into the water receiving groove 110, the groove adsorption component can adsorb the liquid leakage while collecting the liquid leakage, effectively preventing the liquid leakage from overflowing. At the same time, through the arrangement of the groove adsorption component, after repairing the water leakage point, the accumulated liquid in the water receiving groove 110 can be removed by directly replacing the groove adsorption component, without the need for other liquid discharge equipment, which is convenient to operate, low in cost, and good in waterproof effect.

[0070] In some embodiments, a welding portion is arranged on the liquid cooling circulation pipeline 200, on the cold plate body 100, and / or between the liquid cooling circulation pipeline 200 and the cold plate body 100; the water receiving groove 110 is located below the welding portion. Since the probability of water leakage of the welding portion is relatively high, the water receiving groove 110 is arranged at a position with high risk, so as to reduce the cost, and a circular arc chamfer is arranged at the corner of the water receiving groove 110, so as to avoid the formation of sharp corners, corrosion, and stress concentration.

[0071] Specifically, the depth of the water receiving groove 110 is 3-5 mm. Of course, the depth of the water receiving groove 110 can be determined according to the position of the cold plate body 100 or the liquid cooling circulation pipeline 200 corresponding to the water receiving groove 110. For the position of the welding point, the probability of water leakage is relatively high, and the amount of water leakage is relatively large. Therefore, the depth and size of the water receiving groove 110 at this position can be appropriately increased. For the position with a relatively small probability of water leakage and a relatively small amount of water leakage, the depth and size of the water receiving groove 110 at this position can be appropriately reduced. Further, the water receiving groove 110 is square-shaped, which is convenient for processing.

[0072] In some embodiments, the liquid cooling device further comprises:

[0073] The second liquid accumulation detection line 540 is arranged in the water storage groove and is used to send a second liquid accumulation signal when the liquid level in the water storage groove is higher than a second preset height. Specifically, when arranging the second liquid accumulation detection line 540, the second liquid accumulation detection line 540 can be arranged on the side wall of the water storage groove, or can be arranged on the side with a higher position of the edge of the extension filler 500. When the liquid in the extension filler 500 reaches a certain amount, the liquid will overflow the second liquid accumulation detection line 540, the second liquid accumulation detection line 540 will be wetted, and the impedance will change, so as to send the second liquid accumulation signal to the controller 600. Further, the second liquid accumulation detection line 540 is spaced apart from the bottom of the water storage groove by a certain distance, so that the water storage groove has a certain liquid accumulation bearing capacity.

[0074] The controller 600 is connected with the second liquid accumulation detection line 540 and is used to control the liquid cooling electronic device to be powered off after receiving the liquid leakage signal, the first liquid accumulation signal, and the second liquid accumulation signal. Specifically, when the controller 600 receives the second liquid accumulation signal, it indicates that not only is there a water leakage point in the liquid cooling device, but also the liquid leakage of the water leakage point has overflowed the water receiving groove 110 and gathered in the water storage groove, i.e., is about to overflow the water storage groove. At this time, the liquid cooling electronic device should be controlled to be powered off, so as to avoid damage to the electrical elements on the mainboard.

[0075] In some embodiments, the liquid cooling device further comprises:

[0076] The fastener is used to connect the extension filler 500, the cold plate body 100, and the mainboard.

[0077] And, the filler unit 510 is located between the cold plate body 100 and the main plate, and the surface of the filler unit 510 is flush with the surface of the cold plate body 100; specifically, the fastener can be a screw, and the fastener can adopt the original connecting piece between the cold plate body 100 and the main plate, and the original structure is utilized to connect the filler unit 510 to the cold plate body 100, which is convenient for material taking and saves cost.

[0078] Please refer to Figure 5 , Figure 5 for Figure 3 the structure diagram of the extension filler 500 in the liquid cooling device shown in the figure.

[0079] In some embodiments, the extension filler 500 further comprises a plurality of water guide portions 520, the water guide portions 520 are connected between adjacent filler units 510, and the water guide portions 520 and the filler units 510 are in communication with each other, and the filler units 510 and the water guide portions 520 are arranged in the hollow portion 400; specifically, the extension direction of the water guide portion 520 is perpendicular to the extension direction of the filler unit 510, which is used to guide the liquid in a certain filler unit 510 into another filler unit 510 to avoid the liquid from overflowing too quickly; when the water guide portion 520 interferes with the position of the support member 300, the water guide portion 520 can pass through the bottom of the support member 300. Of course, as for the extension filler 500, the filler unit 510 can also be arranged in the hollow portion 400, that is, a plurality of filler units 510 are arranged separately and filled in the hollow portion 400, and the filler unit 510 is connected to the cold plate body 100 through the fastener; when there is liquid on the cold plate body 100, the liquid can flow into the water storage groove of the filler unit 510 to prevent water from falling on the main plate.

[0080] In some embodiments, the extension filler 500 is an integral structure, and when the extension filler 500 is processed, the shape, position and number of the filler units 510 and the water guide portions of the extension filler 500 are determined according to the positions of the cold plate body 100 and the support member 300, and then the completed extension filler 500 can be processed by mold opening, which is convenient to operate, has good waterproof effect, and the liquid in the water storage groove can only flow in the filler units 510 and the water guide portions, and will not drip on the main plate.

[0081] Further, the extension filler 500 is a plastic or resin piece, which is relatively light in weight and can avoid the sinking of the case; specifically, the extension filler 500 can be PET (polyethylene terephthalate) or PVC (polyvinyl chloride), which is convenient to process and low in cost.

[0082] The size of the filler unit 510 is greater than that of the water guide part 520, the water guide part 520 can only play a flow guiding capability, of course, can play a certain water storage capability, the edge of the filler unit 510 is arranged in abutment with the edge of the cold plate body 100, and the edge of the filler unit 510 is located at the bottom of the edge of the cold plate body 100, so that the liquid flowing into the surface of the cold plate body 100 is collected into the water storage groove of the filler unit 510, avoiding dripping onto the mainboard;

[0083] The filler units 510 are arranged at intervals, which should be based on the position of the cold plate body 100, the adjacent filler units 510 are communicated through at least two water guide parts 520, the flow speed is improved, the liquid between the filler units 510 is quickly circulated, and the water guide part 520 is connected to the side of the filler unit 510 and extends along the bottom of the support member 300 to connect two filler units 510;

[0084] The water storage groove is located on the filler unit 510, the water guide part 520 is provided with a flow channel 521, the flow channel 521 of the water guide part 520 is communicated between the water storage grooves of two filler units 510 at both ends, so that the liquid flows between the adjacent filler units 510, and the water absorbing member is located in the filler unit 510, avoiding the overflow of the liquid quickly collected in the same filler unit 510;

[0085] The adjacent filler units 510, the adjacent water guide parts 520 and / or the filler units 510 and the water guide parts 520 are provided with a avoiding space for avoiding the cold plate body 100 or the electrical elements on the mainboard, avoiding interference with the electrical elements;

[0086] And when installing the extended filler 500 and the cold plate body 100, the extended filler 500 and the cold plate body 100 are placed on the mainboard for fixation, the cold plate body 100 corresponds to the position of the component to be cooled, the extended filler 500 corresponds to the hollow part 400, ensuring that the extended filler 500 can be smoothly installed on the mainboard, meeting the waterproof effect. Of course, a sealing layer can also be arranged between the extended filler 500 and the mainboard body to prevent the liquid from flowing from the gap between the extended filler 500 and the mainboard body.

[0087] Specifically, in one specific embodiment, the liquid cooling device comprises a cold plate body 100, a liquid cooling circulation pipeline 200, a support component 300, an extended filler 500, a water absorption component, a liquid leakage detection line 610 and a first liquid accumulation detection line 620; the cold plate body 100 is arranged on a component to be cooled; the liquid cooling circulation pipeline 200 is installed on the cold plate body 100 and used to provide cooling medium to the cold plate body 100; the support component 300 is arranged around the cold plate body 100 and used to fix the cold plate body 100, so as to ensure that the cooling medium in the liquid cooling circulation pipeline 200 can smoothly flow into the cold plate body 100; the cold plate body 100 is provided with a water receiving groove 110, and the first liquid accumulation detection line 620 is installed in the water receiving groove 110; the liquid leakage detection line 610 is arranged on the liquid cooling circulation pipeline 200, and when a water leakage point occurs in the liquid cooling circulation pipeline 200, the liquid leakage detection line 610 sends a liquid leakage signal to the controller 600, reminding the staff to timely repair and giving the position of the water leakage point; the extended filler 500 comprises a plurality of filler monomers 510 and a plurality of water guide portions 520, the filler monomers 510 are located in the hollow portion 400, the edges of the filler monomers 510 are connected with the edges of the cold plate body 100 through fasteners, the side surface of the filler monomers 510 close to the liquid cooling circulation pipeline 200 is provided with a water storage groove, the water absorption component is arranged in the water storage groove and used to absorb the liquid entering the water storage groove; the filler monomers 510 are connected in sequence, the water storage grooves of the filler monomers 510 are communicated with each other, the water guide portions 520 are connected between the adjacent filler monomers 510 and communicated with the filler monomers 510, and the filler monomers 510 and the water guide portions 520 are arranged in the hollow portion 400.

[0088] Specifically, the control process of the liquid cooling device comprises:

[0089] When the first liquid accumulation detection line 620 detects liquid, it indicates that the liquid in the water receiving groove 110 is about to be full, at which time the first liquid accumulation signal can be sent out; after the controller 600 receives the liquid leakage signal, the alarm component 630 can send out the first alarm signal, such as a buzzing sound, a flashing light, etc., indicating that the liquid cooling device has a water leakage point; after the controller 600 receives the first liquid leakage signal, the alarm component 630 can send out the second alarm signal, such as a louder buzzing sound, a brighter flashing light, or a combination of the two, indicating that the liquid cooling device not only has a water leakage point, but also that the liquid leakage from the water leakage point is about to overflow the water receiving groove 110, so that the staff can be prompted to seal the water leakage point as soon as possible; when the liquid in the extended filler 500 reaches a certain amount, it will submerge the second liquid accumulation detection line 540, causing the impedance to change and thus sending a second liquid leakage signal to the controller 600, which is connected to the second liquid accumulation detection line 540; when the controller 600 receives the second liquid leakage signal, it indicates that the liquid cooling device not only has a water leakage point, but also that the liquid leakage from the water leakage point has overflowed the water receiving groove 110 and gathered in the water storage tank, and is about to overflow the water storage tank, at which time the liquid cooling electronic device should be powered off to avoid damage to the mainboard.

[0090] Further, water-absorbing sponges can be placed in the water receiving groove 110 and the water storage tank to absorb more liquid. Liquid leakage detection lines can be provided in the water receiving groove 110 and the water storage tank to send out an alarm when the lines are wetted by water, or even directly shut off the electrical components on the mainboard to avoid damage. The water receiving groove 110 can have both water absorption and alarm functions. When the liquid in the water receiving groove 110 overflows, there is the extended filler 500 outside, which is a plastic film, and the water storage tank can carry the liquid that has overflowed from the water receiving groove 110. The water receiving groove 110 is provided at the welding portion of the cold plate structure, which is prone to water leakage, so the waterproof effect is improved.

[0091] The liquid cooling device improves the design of the entire cold plate structure by filling the hollow portion 400 between the cold plate body 100 and the support component 300 with the extended filler 500 to form a complete cold plate structure, avoiding liquid accumulation from falling onto the mainboard. By providing the liquid leakage detection line 610, the first liquid accumulation detection line 620, and the second liquid accumulation detection line 540, different alarm signals can be sent out according to the degree of liquid leakage, or the liquid cooling electronic device can be directly shut off to prevent the cold plate from damaging the machine due to liquid leakage. This design can be applied to various liquid cooling electronic devices, such as switches or servers, and only the cold plate structure needs to be modified to achieve the purpose of preventing liquid leakage from damaging the machine, without considering the case design, reducing the research and development time and manpower. The extended filler 500 is customized according to the avoidance design of the pipeline and electrical components on the mainboard, which is low in cost, light in weight, and has little impact on the case, and can be widely promoted.

[0092] In addition to the liquid cooling device described above, the present application also provides a liquid cooling electronic device comprising the liquid cooling device described above, and other parts of the structure of the liquid cooling electronic device refer to the related art, and will not be described here.

[0093] The various embodiments in the specification are described in a progressive manner, and each embodiment focuses on the differences from other embodiments. The same or similar parts between the various embodiments can be referred to each other.

[0094] The liquid cooling device provided by the present application is described in detail above. The principles and implementation modes of the present application are described by applying specific examples. The above description of the embodiments is only used to help understand the method of the present application and its core idea. It should be pointed out that for ordinary skilled in the art, without departing from the principles of the present application, some improvements and modifications can be made to the present application, and these improvements and modifications also fall within the protection scope of the present application.

Claims

1. A liquid cooling device, characterized in that, include: The cold plate body (100) is disposed on the component to be cooled and is used to absorb the heat of the component to be cooled; A liquid cooling circulation pipeline (200) is connected to the cold plate body (100) and is used to provide a cooling medium to the cold plate body (100); A support member (300) is connected to the cold plate body (100) for supporting the cold plate body (100) and placing it on the main board. There is a hollow portion (400) between adjacent cold plate bodies (100) and between the cold plate body (100) and the support member (300). The extended filler (500) includes a plurality of filler units (510), the filler units (510) are located in the hollow portion (400), the edges of the filler units (510) are installed on the edges of the cold plate body (100), the surface of the filler unit (510) near the liquid cooling circulation pipe (200) is provided with a water storage tank, and each of the filler units (510) is connected in sequence and interconnected with each other; Also includes: A leak detection line (610) is installed on the liquid cooling circulation pipeline (200) to generate a leak signal when the liquid cooling circulation pipeline (200) leaks; and the cold plate body (100) is provided with a plurality of water receiving grooves (110), the water receiving grooves (110) being located below the leak detection line (610) to catch the leak of the liquid cooling circulation pipeline (200); when the liquid in the water receiving groove (110) overflows, the liquid flows from the water receiving groove (110) into the water storage tank; The first liquid accumulation detection line (620) is installed in the water receiving groove (110) and is used to issue a first liquid accumulation signal when the liquid level in the water receiving groove (110) is higher than a first preset height. The second liquid accumulation detection line (540) is installed in the water storage tank and is used to send a second liquid accumulation signal when the liquid level in the water storage tank is higher than the second preset height. The controller (600) is connected to the leakage detection line (610) and the first liquid accumulation detection line (620) and is used to issue an alarm signal after receiving the leakage signal and the first liquid accumulation signal; the controller (600) is also connected to the second liquid accumulation detection line (540) and is used to control the liquid-cooled electronic equipment to power off after receiving the leakage signal, the first liquid accumulation signal and the second liquid accumulation signal.

2. The liquid cooling device according to claim 1, characterized in that, Also includes: A water-absorbing component is disposed inside the water storage tank to absorb the liquid entering the water storage tank; The water-absorbing component is adapted to the size of the water storage tank, and the water-absorbing component can be detachably placed inside the water storage tank.

3. The liquid cooling device according to claim 1, characterized in that, Also includes: A groove adsorption component is disposed in the water receiving groove (110). The groove adsorption component is used to adsorb the liquid flowing into the water receiving groove (110). The top height of the groove adsorption component is lower than the arrangement height of the first liquid accumulation detection line (620).

4. The liquid cooling device according to claim 3, characterized in that, A welding part is provided on the liquid cooling circulation pipeline (200), on the cold plate body (100), and / or between the liquid cooling circulation pipeline (200) and the cold plate body (100); the water receiving groove (110) is located below the welding part, and the corners of the water receiving groove (110) are provided with rounded chamfers.

5. The liquid cooling device according to claim 1, characterized in that, Also includes: Fasteners for connecting the extended filler (500), the cold plate body (100), and the main plate; Furthermore, the filler unit (510) is located between the cold plate body (100) and the main plate, and the surface of the filler unit (510) is flush with the surface of the cold plate body (100).

6. The liquid cooling device according to any one of claims 1 to 5, characterized in that, The extended filler (500) further includes a plurality of water-guiding portions (520), which are connected between adjacent filler units (510) and are in communication with each other. Both the filler unit (510) and the water-guiding portions (520) are located in the hollow portion (400).

7. The liquid cooling device according to claim 6, characterized in that, The extended filler (500) is an integral structural component, and the extended filler (500) is a plastic component or a resin component; The size of the filler unit (510) is larger than the size of the water guiding part (520). The edge of the filler unit (510) is fitted to the edge of the cold plate body (100) so that the liquid flowing into the surface of the cold plate body (100) can be collected into the water storage tank of the filler unit (510). The filler units (510) are arranged at intervals, and adjacent filler units (510) are connected by at least two water-guiding portions (520). The water-guiding portions (520) are connected to the side of the filler unit (510) and extend along the bottom of the support member (300) to connect two filler units (510). The water storage tank is located on the filler unit (510), and the water guiding part (520) is provided with a flow channel (521). The two ends of the flow channel (521) of the water guiding part (520) are connected between the water storage tanks of the two filler units (510) so that the liquid can flow between adjacent filler units (510). A clearance space is provided between adjacent filler units (510), between adjacent water guiding portions (520), and / or between the filler unit (510) and the water guiding portion (520) for avoiding the cold plate body (100) or electrical components on the main board; Furthermore, when installing the extended filler (500) and the cold plate body (100), the extended filler (500) and the cold plate body (100) are simultaneously placed on the main board for fixation, and the cold plate body (100) is aligned with the position of the component to be cooled, and the extended filler (500) is aligned with the hollow portion (400).

8. A liquid-cooled electronic device, comprising a liquid cooling unit, characterized in that, The liquid cooling device is the liquid cooling device according to any one of claims 1 to 7.

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