Partitioned jet two-phase liquid cooling cold plate and control method thereof

Abstract

The application provides a partitioned jet type two-phase liquid cooling cold plate and a control method thereof, and relates to the technical field of cold plate heat dissipation. The partitioned jet type two-phase liquid cooling cold plate comprises a cold plate base body, an evaporation cavity is formed in the cold plate base body, and a heat exchange interface is arranged at the bottom of the cold plate base body; a condenser is in communication with the evaporation cavity; a plurality of nozzles are arranged in a partitioned manner on a plane parallel to the heat exchange interface; a plurality of adjusting assemblies are respectively connected between each nozzle and the cold plate base body; a plurality of temperature sensors are arranged on the heat exchange interface, and the arrangement positions of the plurality of temperature sensors are arranged in one-to-one correspondence with a plurality of preset heating areas of a chip; and a plurality of flow control assemblies are respectively arranged on the plurality of nozzles and used for independently controlling the working medium flow rate of each nozzle. The application can realize partitioned independent heat exchange strengthening and effectively cope with local hot spots of the chip.

Description

Technical Field

[0001] This invention relates to the field of cold plate heat dissipation technology, and in particular to a partitioned jet-type two-phase liquid-cooled cold plate and its control method. Background Technology

[0002] With the continuous improvement of chip integration and power consumption, the heat flux density per unit area during chip operation has increased dramatically. Traditional single-phase microchannel cold plates that rely on single-phase fluid convection heat transfer can no longer meet the heat dissipation requirements of high heat flux density. Therefore, two-phase microchannel cold plates with higher heat transfer capacity have gradually become a research hotspot.

[0003] Most existing two-phase microchannel cold plates adopt an integral uniformly distributed flow channel structure, which specifically includes a base plate, a cover plate, an inlet, an outlet, an inlet distribution chamber, an outlet collection chamber, and multiple parallel microchannels located between the base plate and the cover plate. In use, cooling media such as water, refrigerant, or dielectric fluid enter the inlet distribution chamber through the inlet and are evenly distributed to each microchannel. The microchannels undergo gas-liquid phase change when heated, and the resulting two-phase mixture is collected in the outlet collection chamber and discharged from the outlet. The entire process can achieve enhanced heat transfer under high heat flux density.

[0004] However, in practical applications, since the microchannels of the existing two-phase microchannel cold plates are arranged in a uniform parallel manner and the liquid supply of the inlet distribution cavity to each microchannel is relatively fixed, when local hot spots appear on the chip being cooled, the existing two-phase microchannel cold plates cannot directionally enhance the local liquid supply or enhance the local impact heat transfer effect according to the hot spot location. This results in the temperature of the hot spot area being too high and the temperature of the non-hot spot area being relatively low, with a large temperature difference on the overall surface of the cold plate, which seriously affects the operational reliability and service life of the chip. Summary of the Invention

[0005] Based on this, the purpose of the present invention is to provide a partitioned jet-type two-phase liquid-cooled cold plate and its control method, which aims to solve at least one of the technical problems in the above-mentioned background art.

[0006] One aspect of the present invention is to provide a partitioned jet-type two-phase liquid-cooled cold plate, comprising: The cold plate substrate has an evaporation chamber inside, and the bottom of the cold plate substrate has a heat exchange interface for bonding with the chip to be cooled. A condenser, connected to the evaporation chamber, is used to condense the working fluid vapor from the evaporation chamber; Multiple nozzles are disposed in the evaporation chamber and are arranged in sections on a plane parallel to the heat exchange interface. Each nozzle is used to receive condensed liquid from the condenser and spray it toward the heat exchange interface for cooling. Multiple adjustment components are respectively connected between each of the nozzles and the cold plate substrate, for independently driving each nozzle to reciprocate in a direction perpendicular to the heat exchange interface, so as to adjust the distance between the nozzle orifice and the heat exchange interface. Multiple temperature sensors are disposed on the heat exchange interface, and the positions of the multiple temperature sensors are arranged one-to-one with the multiple preset heating areas of the chip. Multiple flow control components are respectively disposed on multiple nozzles for independently controlling the flow rate of the working fluid injected by each nozzle.

[0007] In addition, the partitioned jet-type two-phase liquid-cooled cold plate according to the present invention may also have the following additional technical features: Furthermore, the nozzle includes a central nozzle and four corner nozzles, with the four corner nozzles symmetrically arranged in pairs on both sides of the central nozzle; The central nozzle is positioned to correspond to the central heating area of ​​the chip, and the four corner nozzles are positioned to correspond one-to-one with the four corner heating areas of the chip.

[0008] Furthermore, the adjustment component includes: The telescopic drive unit is fixed on the cold plate substrate; The guide portion extends in a direction perpendicular to the heat exchange interface; The push plate is fixedly connected to the output end of the telescopic drive unit and slidably engaged with the guide unit; the nozzle is fixedly disposed at the bottom end of the push plate. The first limit switch is located at the upper limit position of the push plate part and is used to issue a stop signal to stop the upward drive of the telescopic drive part when the push plate part moves to the preset highest position. The second limit switch is located at the downward limit position of the push plate part and is used to issue a stop signal to stop the downward drive of the telescopic drive part when the push plate part moves to the preset lowest position.

[0009] Furthermore, it also includes a connecting component, which includes a cooling water inlet pipe, a cooling water outlet pipe, a circulation pipe, and a liquid supply pipe, wherein the outlet end of the cooling water inlet pipe and the inlet end of the cooling water outlet pipe are respectively connected to the condenser; The cold plate substrate is also provided with a gas storage chamber, which is located on the top side of the evaporation chamber and is connected to the evaporation chamber. The gas phase inlet of the condenser is connected to the gas outlet of the gas storage chamber through the circulation pipeline, and the liquid phase outlet of the condenser is connected to the liquid inlet pipeline of each nozzle through the liquid supply pipeline.

[0010] Furthermore, the heat exchange interface is provided with a micron- or nano-scale textured structure to enhance the vaporization nucleus density of nucleated boiling.

[0011] Furthermore, the cooling medium flowing within the partitioned jet-type two-phase liquid-cooled cold plate is a low-boiling-point insulating refrigerant.

[0012] Another aspect of the present invention is to provide a control method for a partitioned jet-type two-phase liquid-cooled plate, the control method being applied to the aforementioned partitioned jet-type two-phase liquid-cooled plate, the control method comprising: Acquire chip temperature data collected by multiple temperature sensors, the chip temperature data including the central region temperature T c and the temperature T of multiple corner areas i ; Based on the temperature T in the central region c and the temperature T of multiple corner areas i The overall weighted temperature T is calculated using normalized weights. avg And determine the maximum temperature T max The maximum temperature T max For T c and each T i The maximum value in; The overall weighted temperature T avg and maximum temperature T max Temperature T in the central area c The results are compared with preset temperature thresholds to obtain the comparison results; Based on the comparison results, the cooling control mode of the nozzle is adjusted to change the flow rate and / or spray distance of the nozzle.

[0013] Furthermore, the overall weighted temperature T avg The calculation formula is:

[0014] in, And the center weight a c Greater than the weight a of any corner i i = 1, 2, 3, 4; The preset temperature threshold includes a first temperature threshold T. th1 Second temperature threshold T th2 T th1 <T th2 ; When T avg ≤T th1 And T max ≤T th1When the first control mode is executed, only the nozzles corresponding to the central area are opened, and the spray flow rate of the opened nozzles is adjusted to the minimum set value and the spray distance is adjusted to the maximum set value. When T avg >T th1 or T max >T th1 And T avg ≤T th2 T max ≤T th2 At that time, the second control mode is executed, keeping the nozzles corresponding to the central area open, and adjusting the temperature T of each corner area accordingly. i Selectively open nozzles in the corresponding corner areas, and adjust the spray distance of the corresponding nozzles based on the temperature of the corner area; When T avg >T th2 or T max >T th2 When the third control mode is executed, all nozzles are opened, and the spray flow of all nozzles is adjusted to the maximum set value, while the spray distance is simultaneously reduced to the minimum set value.

[0015] Furthermore, in the second control mode, selectively opening the nozzles in the corresponding corner regions based on the temperature Ti of each corner region includes: Determine the temperature T in the corner area i Is it greater than the first temperature threshold T? th1 ; If not, the nozzles in the corresponding corner areas will not be turned on; If so, then activate the nozzle in the corresponding corner area, and adjust the spray distance of the corresponding nozzle based on the temperature of that corner area, using the following formula:

[0016] Among them, H i T represents the spray distance between the nozzle and the heat exchange interface in the corresponding area. i This refers to the temperature of the corresponding corner region; H max H is the maximum spray distance. min Minimum spray distance; T mid is the preset midpoint temperature of the curve, and 'a' is the preset steepness parameter with a > 0.

[0017] Furthermore, when the temperature T in the central region c >T th1 If the current control mode is in the first control mode, the second control mode will be forcibly executed; if the current control mode is in the second or third control mode, the current mode will be maintained.

[0018] Furthermore, the control method further includes: calculating the temperature difference ΔT=T during the execution of the cooling control mode. max -T avg When ΔT > ΔT crit At that time, the maximum temperature T max The nozzles in the corresponding area increase the injection flow rate or decrease the injection distance, where ΔT crit This is a preset temperature difference threshold.

[0019] Compared to existing technologies, the advantages of this invention are as follows: This application can achieve independent zoned heat exchange enhancement, effectively addressing localized hot spots on the chip. Specifically, addressing the shortcomings of existing two-phase microchannel cold plates that employ an integral uniform flow channel structure, have fixed liquid supply distribution, and cannot directionally enhance heat exchange based on the location of chip hot spots, this application sets up a zoned nozzle layout with a center and four corners within the evaporation chamber of the cold plate. Each nozzle is equipped with an independent adjustment component and flow control component, enabling dynamic adjustment of the spray flow rate and spray distance of the corresponding nozzle based on the real-time temperature of each zone. In practical applications, when overheating occurs in a certain corner area of ​​the chip, simply activating the nozzle corresponding to that area and adjusting its spray distance and spray flow rate achieves dual enhanced heat exchange through high-momentum droplet impact and sufficient working fluid supply in that localized area, precisely suppressing hot spots. Non-hot spot areas maintain a low-power operation state, thereby significantly reducing the maximum temperature difference on the chip surface and ensuring chip operational reliability and lifespan. Attached Figure Description

[0020] Figure 1 This is a front view of the partitioned jet-type two-phase liquid-cooled plate in the first embodiment of the present invention; Figure 2 This is a schematic diagram of the partitioned arrangement of multiple nozzles in the partitioned jet two-phase liquid cooling plate in the first embodiment of the present invention. Figure 3 This is a cross-sectional view of the nozzles and adjustment components in the partitioned jet two-phase liquid cooling plate of the first embodiment of the present invention. Figure 4 This is a flowchart of the partitioned jet-type two-phase liquid-cooled cold plate control method in the second embodiment of the present invention.

[0021] The above-mentioned figures include the following reference numerals: 10, cold plate substrate; 11, heat exchange interface; 101, evaporation chamber; 102, gas storage chamber; 20, condenser; 201, cooling water inlet pipe; 202, cooling water outlet pipe; 203, circulation pipeline; 204, liquid supply pipeline; 205, liquid inlet pipeline; 206, telescopic pipeline; 30, nozzle; 301, liquid inlet chamber; 302, liquid outlet chamber; 41, telescopic drive unit; 42, guide unit; 421, guide slide; 43, push plate unit; 44, connecting rod; 451, first limit switch; 452, light-shielding baffle; 461, second limit switch; 462, abutment protrusion; 50, temperature sensor; 60, flow control component; 70, chip.

[0022] The following detailed description, in conjunction with the accompanying drawings, will further illustrate the present invention. Detailed Implementation

[0023] To facilitate understanding of the present invention, a more complete description will be given below with reference to the accompanying drawings. Several embodiments of the invention are illustrated in the drawings. However, the invention can be implemented in many different forms and is not limited to the embodiments described herein. Rather, these embodiments are provided so that this disclosure will be thorough and complete.

[0024] It should be noted that when a component is said to be "fixed to" another component, it can be directly on the other component or there may be an intervening component. When a component is said to be "connected to" another component, it can be directly connected to the other component or there may be an intervening component. The terms "vertical," "horizontal," "left," "right," and similar expressions used in this document are for illustrative purposes only.

[0025] Unless otherwise defined, all technical and scientific terms used herein have the same meaning as commonly understood by one of ordinary skill in the art to which this invention pertains. The terminology used herein in the description of the invention is for the purpose of describing particular embodiments only and is not intended to be limiting of the invention. The term "and / or" as used herein includes any and all combinations of one or more of the associated listed items.

[0026] Example 1 Please see Figures 1 to 3The image shows a partitioned jet-type two-phase liquid-cooled cold plate according to the first embodiment of the present invention, including a cold plate substrate 10, a condenser 20, multiple nozzles 30, multiple adjustment components, multiple temperature sensors 50, and multiple flow control components 60. Specifically, a sealed evaporation chamber 101 is formed inside the cold plate substrate 10, and a flat heat exchange interface 11 is provided at the bottom of the cold plate substrate 10. This heat exchange interface 11 is directly attached to the top surface of the chip 70 to be cooled by thermally conductive interface materials such as thermally conductive silicone grease or liquid metal. To improve its boiling heat transfer performance, the heat exchange interface 11 in this embodiment has a micron- or nano-scale textured structure. In practical applications, this textured structure can be formed by laser etching to create a porous microgroove group, or by screen printing and sintering to form a porous copper powder layer, thereby increasing the density of the vaporization core on the wall and reducing the initial boiling superheat.

[0027] The cold plate substrate 10 also includes a gas storage chamber 102, which is located on the top side of the evaporator chamber 101 and is directly connected to the evaporator chamber 101. The condenser 20 is connected to the gas storage chamber 102 and the nozzle 30 via a connecting assembly. The condenser 20 can be a plate heat exchanger or a microchannel parallel condenser 20 of the prior art, and it has independent refrigerant channels and cooling water channels inside. The connecting components include a cooling water inlet pipe 201, a cooling water outlet pipe 202, a circulation pipe 203, and a liquid supply pipe 204. The outlet end of the cooling water inlet pipe 201 and the inlet end of the cooling water outlet pipe 202 are respectively connected to both ends of the cooling water channel of the condenser 20. The gas phase inlet of the condenser 20 is connected to the gas outlet of the gas storage chamber 102 through the circulation pipe 203, which is used to receive and condense the high-temperature working fluid vapor from the evaporation chamber 101. The liquid phase outlet of the condenser 20 is connected to the liquid inlet pipe 205 of each nozzle 30 through the liquid supply pipe 204, which is used to transport the condensed subcooled or saturated liquid working fluid back to the nozzle 30, and finally spray it from the nozzle 30 towards the heat exchange interface 11 to achieve cooling of the chip 70 to be cooled.

[0028] More specifically, such as Figure 1 As shown, in this embodiment, the physical installation height of the condenser 20 is higher than that of the cold plate base 10, and the lowest point of the liquid collection tank inside the condenser 20 is higher than the plane height of the liquid inlet on the nozzle 30. The height difference between the two ranges from 80mm to 150mm. The gravity head formed by the height difference overcomes the resistance generated when the condensate flows in the liquid supply line 204, the flow control component 60, and the internal flow channel of the nozzle 30, ensuring that the condensate can continuously and stably flow back to the nozzle 30, thereby realizing the closed-loop recycling of the condensate. In some embodiments, if the condenser 20 and the nozzle 30 cannot be installed with a physical height difference, a power pump can be installed on the liquid supply line 204 to provide power for the flow of the condensate.

[0029] Furthermore, in this embodiment, the cooling medium flowing inside the partitioned jet-type two-phase liquid-cooled cold plate is a low-boiling-point insulating refrigerant. The low-boiling-point insulating refrigerant can be 3M Novec 7000 fluorinated liquid (boiling point 34°C at normal pressure) or HFE-7100 (boiling point 61°C at normal pressure).

[0030] The evaporation chamber 101 of the cold plate substrate 10 is provided with multiple nozzles 30, which are arranged in sections on a plane parallel to the heat exchange interface 11. Each nozzle 30 is used to receive condensed liquid from the condenser 20 and spray it toward the heat exchange interface 11 for cooling. Specifically, in this embodiment, the evaporation chamber 101 of the cold plate substrate 10 is provided with five nozzles 30, including a central nozzle 30 and four corner nozzles 30. The four corner nozzles 30 are symmetrically arranged on both sides of the central nozzle 30, so that the five nozzles 30 form a symmetrical layout of the center and four corners. The vertical projection of the central nozzle 30 is located at the geometric center of the heat exchange interface 11, and its arrangement position corresponds to the central heating area of ​​the chip 70 to be cooled. The arrangement positions of the four corner nozzles 30 correspond one-to-one with the four corner heating areas of the chip 70 to be cooled.

[0031] Furthermore, each nozzle 30 is provided with an adjustment component between itself and the cold plate substrate 10. This adjustment component is used to independently drive each nozzle 30 to reciprocate in a direction perpendicular to the heat exchange interface 11, thereby adjusting the distance between the nozzle 30's injection orifice and the heat exchange interface 11. In this embodiment, as... Figure 3 and Figure 4As shown, the adjustment assembly in this embodiment includes a telescopic drive unit 41, a push plate unit 43, and a guide unit 42. The telescopic drive unit 41 is a telescopic motor, whose housing is connected to the mounting through-hole on the inner top wall of the cold plate substrate 10 via a threaded connection or interference fit. The axis of the telescopic rod of the telescopic motor is perpendicular to the heat exchange interface 11, and it can perform linear reciprocating motion along its axis under electromagnetic drive. The guide unit 42 extends in a direction perpendicular to the heat exchange interface 11. Specifically, in this embodiment, the guide unit 42 is a straight cylindrical sealing structure fixed to the bottom surface of the housing of the telescopic drive unit 41. The top end of the guide unit 42 is welded to the bottom surface of the housing of the telescopic motor to form a sealed connection. Guide grooves 421 extending axially are respectively provided on two opposite sides of the inner wall of the guide unit 42. The push plate part 43 is fixedly connected to the output end of the telescopic drive part 41 and slidably engaged with the guide part 42. The nozzle 30 is fixedly mounted on the bottom end of the push plate part 43. In this embodiment, the push plate part 43 includes a horizontally arranged mounting plate and two sliders on both sides of the mounting plate. The two sliders are slidably engaged with corresponding guide grooves 421 to precisely guide the vertical movement of the push plate part 43. The top surface of the mounting plate is fixedly connected to the end of the telescopic rod of the telescopic motor by means of threaded connection or snap-fit ​​connection. A connecting rod 44 extends vertically outward from the center of the bottom surface of the mounting plate. The bottom end of the connecting rod 44 passes through the bottom of the guide part 42 and extends outward from the outside of the guide part 42. The bottom end of the connecting rod 44 is fixedly connected to the top end of the nozzle 30 by means of threaded connection or interference fit. When the telescopic rod of the telescopic motor reciprocates along its axial direction, the push part will be driven to synchronously move in a reciprocating linear motion perpendicular to the heat exchange interface 11 along the guide part 42, thereby driving the nozzle 30 to rise and fall synchronously, realizing the adjustment of the spray distance of the nozzle 30.

[0032] To isolate the refrigerant between the inner cavity of the guide section 42 and the evaporator chamber 101, and to prevent damage to the moving parts within the guide section 42, a dynamic sealing ring (not shown) is provided between the circumferential surface of the connecting rod 44 and the wall of the corresponding through hole on the guide section 42. This dynamic sealing ring can be a polytetrafluoroethylene lip seal with spring compensation. Specifically, in this embodiment, the inner lip of the dynamic sealing ring is tightly fitted to the circumferential surface of the connecting rod 44 to form a sliding sealing contact. When the push plate 43 drives the connecting rod 44 and the nozzle 30 to reciprocate in a direction perpendicular to the heat exchange interface 11, the inner lip of the dynamic sealing ring is always dynamically fitted to the circumferential surface of the connecting rod 44, thereby achieving a dynamic seal on the bottom end of the guide section 42. This allows the cylindrical shell of the guide section 42, the static sealing weld between its upper end and the bottom shell of the telescopic motor, and the dynamic seal between its bottom end and the circumferential surface of the connecting rod 44 to together form a closed moving chamber.

[0033] In some embodiments, a small vent hole may be provided on the side wall of the outer casing of the telescopic drive unit 41 or the side wall of the top of the guide unit 42. The diameter of the vent hole ranges from 0.5 mm to 1 mm, and a waterproof and breathable membrane may be provided on the vent hole to prevent external dust or moisture from entering. In practical applications, the vent hole connects the inner cavity of the guide unit 42 to the ambient atmosphere outside the cold plate base 10 through itself or a pipe, ensuring that the internal and external air pressures are balanced when the push plate unit 43 moves, thereby eliminating the air cushion resistance caused by volume changes and ensuring the movement accuracy of the push plate unit 43. It should be understood that the above description of the closed movement chamber of the guide unit 42 means that the inner cavity of the guide unit 42 is isolated and closed relative to the two-phase refrigerant environment in the evaporation chamber 101. The setting of the vent hole does not destroy this medium isolation function; it is only used to balance the static pressure of the inner cavity of the guide unit 42 with the external ambient atmosphere.

[0034] Furthermore, the adjustment component in this embodiment also includes a first limit switch 451 and a second limit switch 461. The first limit switch 451 is located at the upper limit position of the push plate part 43 and is used to issue a stop signal to stop the upward drive of the telescopic drive part 41 when the push plate part 43 moves to the preset highest position. Specifically, in this embodiment, the first limit switch 451 is a miniature slotted photoelectric switch, which is installed on the bottom surface of the housing of the telescopic motor. Correspondingly, the top surface of the mounting plate is vertically provided with a light-shielding baffle 452 for cooperating with the slotted photoelectric switch. When the push plate part 43 moves upward to the preset highest position (at which time the nozzle 30 is in the maximum spray distance state), the light-shielding baffle 452 is inserted into the sensing groove of the slotted photoelectric switch, thereby triggering the downward stop signal.

[0035] The second limit switch 461 is located at the downward limit position of the push plate part 43, and is used to issue a stop signal to stop the downward drive of the telescopic drive part 41 when the push plate part 43 moves to the preset lowest position. Specifically, in this embodiment, the second limit switch 461 is a mechanical contact micro switch, which is fixedly installed on the inner wall of the guide part 42 located at the bottom end of a guide groove 421, with the contact facing upward. Correspondingly, the connection between the mounting plate and the corresponding slider is provided with an abutment protrusion 462. When the push plate part 43 moves down to the preset lowest position (at which time the nozzle 30 is in the minimum spray distance state), the abutment protrusion 462 contacts the contact of the second limit switch 461, thereby triggering the downward stop signal.

[0036] In this embodiment, the nozzle 30 is fixed to the bottom end of the connecting rod 44. Specifically, the top end of the nozzle 30 is provided with a fixing hole for fixed connection with the bottom end of the connecting rod 44. The nozzle 30 has an inlet chamber 301, an outlet chamber 302 directly connected to the inlet chamber 301, and a spray port (not shown) at the bottom of the outlet chamber 302. The inlet chamber 301 is a hollow cylindrical cavity. The upper part of the side wall of the inlet chamber 301 is provided with an inlet. The inlet pipe 205 is connected to the inlet through a telescopic pipe 206. The telescopic pipe 206 can move with the spray. The nozzle 30 adaptively changes its shape or length to compensate for the displacement of the nozzle 30 throughout its entire range between the maximum and minimum spray distances. Specifically, the telescopic pipe 206 can be a flexible hose or a telescopic corrugated pipe, with one end connected to the liquid inlet pipe 205 and the other end connected to the liquid inlet of the nozzle 30. The portion of the pipe that penetrates the cold plate substrate 10 can be fixedly connected to the cold plate substrate 10 using a conventional through-plate sealing joint (not shown). A sealing ring or sealing gasket is provided between the through-plate sealing joint and the cold plate substrate 10 to achieve a static seal. In some embodiments, to prevent minor impurities that may exist in the working fluid from clogging the spray port of the nozzle 30, a filter screen can also be provided inside the liquid inlet.

[0037] The outlet chamber 302 of the nozzle 30 is a conical contraction chamber. Its inlet diameter is the same as the inner diameter of the inlet chamber 301, and the outlet diameter is one-third to one-half of the inlet diameter. The contraction angle (full angle) of the conical inner wall of the outlet chamber 302 is in the range of 15°-30°. In actual application, when the liquid working fluid passes through the outlet chamber 302, the flow velocity will increase due to the reduction of the flow area, thereby converting pressure energy into kinetic energy to increase the initial velocity of the liquid working fluid injection. In this embodiment, the bottom of the liquid outlet chamber 302 is provided with multiple spray nozzles (not shown) arranged in a uniform or annular array. The diameter of each spray nozzle ranges from 0.3mm to 0.5mm, and the sum of the flow areas of the multiple spray nozzles is between three-fifths and nine-tenths of the area at the outlet of the liquid outlet chamber 302. This ensures that each spray nozzle can uniformly spray the liquid working fluid, ultimately spraying it uniformly onto the heat exchange interface 11 in a spray-like showerhead flow pattern. Compared to single-hole jet, this design results in a more uniform distribution of liquid film thickness, which is beneficial for reducing the temperature within the zone. Furthermore, to prevent the liquid working fluid entering the nozzle 30 from prematurely absorbing heat and vaporizing during the time it is in the high-temperature evaporation chamber 101, forming a gas block phenomenon, a heat-insulating coating or heat-insulating sleeve can be applied to the circumferential outer wall of the nozzle 30.

[0038] Furthermore, a plurality of temperature sensors 50 are provided on the heat exchange interface 11 at the bottom of the cold plate substrate 10, and the positions of the plurality of temperature sensors 50 correspond one-to-one with the plurality of preset heating areas of the chip 70 to be cooled. In this embodiment, a temperature sensor 50 is provided at the contact position between the heat exchange interface 11 and the central heating area and the four corner heating areas of the chip 70 to be cooled. Specifically, in this embodiment, mounting holes (not shown in the figure) are provided on the top surface of the heat exchange interface 11 at the corresponding mounting positions. The depth of the mounting holes is less than the wall thickness of the heat exchange interface 11, and the thickness between the bottom surface of the mounting hole and the bottom surface of the heat exchange interface 11 is in the range of 0.3mm-0.8mm. The temperature sensor 50 can be an NTC thermistor, and its temperature sensing chip is tightly fixed to the bottom surface of the mounting hole with thermally conductive adhesive. Furthermore, to avoid interference from lateral heat conduction on the heat exchange interface 11 on the temperature measurement of each zone, an annular groove (not shown) can be provided in the circumferential direction of the mounting hole. This annular groove is used to fill with heat insulation material to cut off the lateral heat flow path along the plane of the heat exchange interface 11, so that each temperature sensor 50 can accurately sense the heat from the corresponding heat-generating area of ​​the chip 70 to be cooled below.

[0039] Furthermore, each nozzle 30 is equipped with a flow control component 60 on its inlet pipe 205, which is connected to the liquid supply pipe 204, for independently controlling the flow rate of the working fluid ejected by each nozzle 30. In this embodiment, the flow control component 60 is a miniature solenoid valve. The inlet of the miniature solenoid valve is connected to the outlet of the inlet pipe 205, and the outlet of the miniature solenoid valve is connected to the inlet on the nozzle 30 through a telescopic pipe 206.

[0040] Furthermore, the partitioned jet-type two-phase liquid-cooled plate of this application also includes a controller (not shown in the figure). The controller is electrically connected to the telescopic drive unit 41 of each adjustment component, each temperature sensor 50, and each flow control component 60 to collect the temperature data of each temperature sensor 50 in real time, and control the corresponding solenoid valve and telescopic motor to adjust the jet flow rate and jet distance of each nozzle 30. Specifically, the controller adjusts the opening degree of the solenoid valve to achieve graded adjustment of the liquid working fluid flow rate of the nozzle 30. It should be noted that the "opening of nozzle 30" or "closing of nozzle 30" mentioned in this application refers to the control of the on / off state of the miniature solenoid valve connected in series on the liquid supply pipeline 204 of the nozzle 30: when the miniature solenoid valve is in the conducting state, the liquid working fluid can flow into the corresponding nozzle 30 and spray out, at which time the nozzle 30 is in the "open" state; when the miniature solenoid valve is in the closed state, the liquid supply pipeline 204 is cut off, and no working fluid is sprayed out of the nozzle 30, at which time the nozzle 30 is in the "closed" state.

[0041] In practical applications, the operating principle of the partitioned jet-type two-phase liquid-cooled cold plate of this application can be as follows: Before startup, the evaporation chamber 101 of the cold plate is filled with a low-boiling-point insulating refrigerant. Since air pockets may exist in the liquid supply line 204, inlet line 205, telescopic line 206, and nozzle 30 during initial power-on or startup after a long period of shutdown, the controller first executes a preheating mode. Specifically, regardless of the current temperature reading, it first sends a conduction signal to all micro-solenoid valves at the minimum flow rate (e.g., 10%), continuously spraying for 5 to 10 seconds. This process aims to utilize the liquid's gravity and siphon effect to push the non-condensable gas in the liquid supply line 204, inlet line 205, telescopic line 206, and the top of the evaporation chamber 101 into the gas storage chamber 102 and finally into the condenser 20, thereby establishing a stable liquid column in the circulation line 203. After preheating, the system reads the actual sensor temperature and then begins the normal control process.

[0042] Under normal operating conditions, the chip 70 to be cooled is attached to the bottom surface of the heat exchange interface 11, and the heat generated by it is transferred to the evaporation chamber 101 through the heat exchange interface 11. The cooling water inlet and outlet of the condenser 20 are connected to an external cold source (such as a cooling tower or chiller unit) through the cooling water inlet pipe 201 and outlet pipe, respectively. The liquid working fluid condensed by the cooling water in the condenser 20 flows into the liquid inlet chamber 301 of the nozzle 30 in sequence through the liquid supply pipe 204, each micro solenoid valve, the liquid inlet pipe 205, the telescopic pipe 206, and the liquid inlet of the nozzle 30 under the action of gravity. The controller independently controls the opening and closing of each micro solenoid valve according to the feedback of the temperature sensors 50 of each zone, and distributes an appropriate amount of liquid working fluid into the corresponding nozzle 30 for spraying. After the liquid working fluid enters the inlet chamber 301 of the nozzle 30, it is first buffered and stabilized within the inlet chamber 301, then accelerated and depressurized through the conical outlet chamber 302, and finally sprayed at high speed and evenly onto the heat exchange interface 11 below in the form of a spray-like stream. The droplet group rapidly spreads into a thin liquid film after impacting the high-temperature wall surface, absorbing a large amount of heat and undergoing nucleation boiling, generating a large amount of steam. The steam, carrying unevaporated droplets, flows upwards in the evaporation chamber 101, and enters the condenser 20 through the gas storage chamber 102, the circulation pipe 203, and the gas phase inlet of the condenser 20. Inside the condenser 20, the steam is condensed into liquid by cooling water, thus completing a thermodynamic cycle. During this process, each regulating component dynamically adjusts the spray distance of the corresponding nozzle 30 according to the controller's instructions, and two limit switches ensure the timely and safe stopping of the nozzle 30's movement. Through the above structural design, this cold plate can dynamically adjust the spray flow rate and spray distance of each zone according to the real-time heat distribution of the chip to be cooled, so as to achieve precise suppression of local hot spots and uniform control of the overall temperature. While ensuring the safe operation of the chip, it minimizes the pump power consumption and working fluid charge of the cooling system.

[0043] Example 2 Please see Figure 4The figure shows a partitioned jet-type two-phase liquid-cooled cold plate control method in the second embodiment of the present invention. The control method specifically includes steps S10-S40: Step S10: Acquire chip temperature data from multiple temperature sensors, including the temperature T of the central region. c and the temperature T of multiple corner areas i。

[0044] Specifically, the temperature T of the central region is obtained by collecting the temperature data from five temperature sensors on the heat exchange interface. c The temperatures of the four corner regions are T1, T2, T3, and T4.

[0045] Step S20: Based on the central region temperature T c and the temperature T of multiple corner areas i The overall weighted temperature T is calculated using normalized weights. avg And determine the maximum temperature T max The maximum temperature T max For T c and each T i The maximum value in.

[0046] Specifically, the formula for calculating the overall weighted temperature is:

[0047] in, And the center weight a c Greater than the weight a of any corner i , i=1, 2, 3, 4. As a specific example, in this embodiment, since the central heat-generating area of ​​the chip is the main heat source, a is set... c =0.4, a1=a2=a3=a4=0.15; simultaneously, determine the maximum temperature T within the current sampling period. max =max(T) c (T1, T2, T3, T4).

[0048] Step S30: Calculate the overall weighted temperature T avg Maximum temperature T max Temperature T in the central area c The results are compared with preset temperature thresholds to obtain the comparison results.

[0049] Specifically, the preset temperature threshold includes a first temperature threshold T. th1 Second temperature threshold T th2 T th1 <T th2 In this embodiment, the first temperature threshold T th1 Set to 55℃, second temperature threshold T th2Set the temperature to 75℃. The overall weighted temperature T calculated in step S02 is then used. avg Maximum temperature T max Respectively compared with the first temperature threshold T th1 Second temperature threshold T th2 Compare them.

[0050] Step S40: Based on the comparison results, adjust the cooling control mode of the nozzle to change the flow rate and / or spray distance of the nozzle.

[0051] Specifically, step S40 includes the following steps S401-S403: Step S401: When T avg ≤T th1 And T max ≤T th1 When the first control mode is executed, only the nozzles corresponding to the central area are turned on, and the spray flow rate of the turned-on nozzles is adjusted to the minimum set value and the spray distance is adjusted to the maximum set value.

[0052] Specifically, in the first control mode, i.e., the light load or idle mode, the controller only outputs start signals to the micro solenoid valve and the telescopic motor corresponding to the central nozzle, respectively, so that the micro solenoid valve is turned on to supply liquid and the opening of the micro solenoid valve is adjusted to the minimum set value. The corresponding telescopic motor drives the central nozzle to move upward to the maximum spray distance H. max The miniature solenoid valves and telescopic motors corresponding to the remaining four corner nozzles remain closed.

[0053] Step S402: When T avg >T th1 or T max >T th1 And T avg ≤T th2 T max ≤T th2 At that time, the second control mode is executed, keeping the nozzles corresponding to the central area open, and adjusting the temperature T of each corner area accordingly. i Selectively open nozzles in the corresponding corner areas, and adjust the spray distance of the corresponding nozzles based on the temperature of the corner area.

[0054] Specifically, the second control mode is the dynamic adjustment mode. In this mode, the controller keeps the miniature solenoid valve corresponding to the central nozzle activated, allowing it to supply liquid. Then, based on the temperature T in each corner area... i Selectively opening nozzles in corresponding corner areas includes: Determine the temperature T in the corner area i Is it greater than the first temperature threshold T? th1 ; If not, the nozzles in the corresponding corner areas will not be turned on; If so, the nozzles in the corresponding corner areas are activated. That is, the micro solenoid valves of the corresponding corner nozzles are activated independently based on the temperature of the four corner areas, and the target spray distance of the corresponding nozzles is calculated according to the following functional relationship:

[0055] Among them, H i T represents the spray distance between the nozzle and the heat exchange interface in the corresponding area. i This refers to the temperature of the corresponding corner region; H max H is the maximum spray distance. min Minimum spray distance; T mid The temperature is the preset midpoint of the curve, and 'a' is a preset steepness parameter where a > 0. As a specific example, in this embodiment, the maximum injection distance H... max The minimum spray distance is 5mm, and the minimum spray distance is H. min Set it to 1.5mm. In this way, when the temperature T in the corner area... i Much lower than T mid At this time, the corresponding nozzle has a large spray distance, and the droplets sprayed from its nozzle cover a wide area but have low impact momentum; when T i Approaching T mid At that time, the distance rapidly moves towards H min When the contraction occurs, the corresponding jet distance is the smallest. The droplets ejected from the jet nozzle cover a small area but have high impact momentum. The high-momentum droplets can directly penetrate the local vapor layer and force-wet the surface of the heat exchange interface, thereby achieving rapid suppression of local hot spots on the chip.

[0056] It should be noted that the parameter T in the above function mid And 'a' needs to be determined through an offline calibration process before leaving the factory. Specifically, T mid Defined as the temperature inflection point where the nozzle spray distance transitions from maximum to minimum, its physical meaning corresponds to the wall superheat threshold at which the zone transitions from low-intensity nucleus boiling to vigorous nucleus boiling. The steps for obtaining this threshold are as follows: Install a cold plate on a simulated heat source that allows independent control of the heat flux density of each zone; slowly increase the heat flux density in the corner areas; record the curve of surface superheat at the heat exchange interface (i.e., the difference between the temperature sensor reading and the working fluid saturation temperature) versus heat flux density; and set the temperature value corresponding to the point where the rate of superheat growth on this curve shows a significant inflection point (i.e., a shift from single-phase heat exchange dominance to nucleus boiling dominance) by adding a preset bias amount and setting it as T. mid The kurtosis parameter 'a' determines the slope of the above function on time T. mid The steepness of the nearby transition is obtained through the following steps: at T midThe heat source temperature is changed in small increments (those skilled in the art can choose 0.2℃~1℃, etc. according to actual test needs). The spray distance is manually adjusted for each temperature step to restore the chip temperature to the target value. The corresponding spray distance values ​​at different temperatures are recorded, and temperature-distance discrete points are plotted. The least squares method is used to fit and obtain the value of a, with the preferred range of a∈[0.3, 0.8].

[0057] Furthermore, in some embodiments, for a conductive corner nozzle, the opening degree of the corresponding miniature solenoid valve is determined based on the temperature T in the corner region. i Adjustments are made, specifically, the opening degree O(T) of the miniature solenoid valve is adjusted according to the following linear relationship. i ):

[0058] Among them, O min For the minimum opening of the miniature solenoid valve (e.g., 10% of full scale), O max This is the maximum opening degree of the miniature solenoid valve (i.e., its full scale).

[0059] When T i ≥T th2 At that time, the opening degree O(T) of the miniature solenoid valve i ) represents the maximum opening O max This seamlessly transitions to the fully open state in the third control mode. When T i Falling back to T th1 At this time, the miniature solenoid valves of the corresponding corner nozzles are turned off, and only the center nozzle continues to operate. Through the above linear proportional adjustment, the jet flow rate in the corner area increases smoothly with the temperature, which avoids the waste of working fluid at low temperatures and ensures the enhanced heat exchange capacity at high temperatures.

[0060] Step S403: When T avg >T th2 or T max >T th2 When the third control mode is executed, all nozzles are opened, and the spray flow of all nozzles is adjusted to the maximum set value, while the spray distance is simultaneously reduced to the minimum set value.

[0061] Specifically, in the third control mode, which is the heavy-load or overheat protection mode, the controller outputs a start signal to the micro solenoid valves corresponding to the center nozzle and the four corner nozzles, causing all micro solenoid valves to be fully open for liquid supply. The controller also adjusts the opening of each micro solenoid valve to its maximum set value, and each telescopic motor drives the nozzle downwards to the minimum spray distance H. min .

[0062] Furthermore, since the central heat-generating area of ​​a chip is typically the densest area of ​​computing cores, its temperature rises the fastest and poses the greatest risk of overheating. To prevent the central area temperature from rapidly spiraling out of control due to a sudden increase in load in the first control mode, the control method of this application also includes a forced intervention strategy for central overheating. Specifically: when the central area temperature T... c >T th1 If the current control mode is in the first control mode, the second control mode will be forcibly executed; if the current control mode is in the second or third control mode, the current mode will be maintained to prioritize the heat dissipation capacity of the heat-generating area in the center of the chip.

[0063] Furthermore, under non-uniform load conditions, isolated hot spots may appear on the chip surface, where the temperature in a certain local area is significantly higher than that in other areas. Therefore, the control method of this application also includes an intervention strategy for excessive local temperature differences. Specifically, during each control cycle of the above-mentioned cooling control mode, the temperature difference ΔT = T is calculated. max -T avg When ΔT > ΔT crit At that time, the nozzle in the region corresponding to the maximum temperature Tmax increases the injection flow rate or decreases the injection distance, where ΔT crit A preset temperature difference threshold (e.g., 8℃) is set. Next, the controller controls T... max The opening degree of the miniature solenoid valve corresponding to the nozzle in the area is increased by one level based on the current opening degree value (e.g., the opening degree is increased by 10% of the full scale) to increase the nozzle spray flow rate; or the spray distance of the nozzle in the area is increased by the calculated value H. i A negative offset (e.g., -0.2mm) is temporarily added to the base, and the final target distance is ensured to be no less than the minimum spray distance H. min This drives the nozzles in the corresponding area to move closer to the heat exchange interface to accelerate the elimination of isolated hot spots. It should be noted that the aforementioned offset is only valid in the current control cycle; in the next cycle, H is recalculated based on the actual temperature of the corresponding area. i The offset does not accumulate to avoid continuous attenuation of the injection distance. When ΔT ≤ ΔT crit At that time, the spray flow rate and spray distance of the corresponding nozzle are restored to the values ​​normally calculated by the cooling control mode of this application.

[0064] Furthermore, to prevent abnormal execution of the cooling control mode due to temperature sensor malfunction, the control method of this application also includes a sensor validity detection strategy, including steps S50-S60: Step S50: Monitor the signal status of each temperature sensor.

[0065] Specifically, the controller checks the signal validity of each temperature sensor in each control cycle to determine whether there are abnormal states such as open circuit, short circuit or values ​​exceeding the reasonable range.

[0066] Step S60: Perform fault tolerance processing based on the exception type and duration.

[0067] Specifically, this includes step S601: When any temperature sensor malfunctions, if the duration of the malfunction is less than a preset duration (e.g., 2 seconds), the controller determines it as a transient interference and uses spatial proximity compensation to obtain the estimated temperature value for that area. Specifically, if the malfunctioning sensor is a sensor in a corner area, the average reading of adjacent normal corner sensors is used as a substitute value; if adjacent normal values ​​cannot be obtained, the last valid historical value recorded by the malfunctioning sensor is used for compensation calculation. The obtained compensation value is used in subsequent T... avg The system performs control logic operations and maintains normal operation in the current control mode. It should be noted that during the period when compensation values ​​are used, the aforementioned intervention strategy for excessive local temperature differences is suspended to avoid erroneous adjustments caused by compensation value deviations.

[0068] Step S602: When the duration of any abnormal temperature sensor reading is greater than or equal to the preset duration (e.g., 2 seconds), or when the central area temperature sensor malfunctions, it is determined that the control system can no longer accurately perceive the core chip state, forcibly executes the third control mode, and outputs an alarm signal. Specifically, in this case, regardless of the current control mode, whether the central overheating forced intervention strategy or the local excessive temperature difference intervention strategy is being executed, the controller immediately forcibly executes the third control mode, that is, opens all nozzles, adjusts the opening of all micro solenoid valves to the maximum set value, and adjusts the spray distance of all nozzles to the minimum set value, operating at full power for cooling to ensure the absolute thermal safety of the chip in the event of an abnormal central area temperature sensor reading. Simultaneously, the controller outputs an alarm signal.

[0069] Once the abnormal sensor signal returns to normal and remains stable for more than the preset recovery time (e.g., 5 seconds), the controller immediately uses the real-time temperature values ​​of each sensor as a basis to re-determine the first, second, or third control mode to be entered according to the control method of this application, and resumes the normal closed-loop control process. The entire process does not require additional buffering or waiting.

[0070] Compared to existing two-phase microchannel cold plates, which employ an integral, uniformly distributed flow channel structure, have a fixed liquid supply distribution, and cannot target heat transfer enhancement based on chip hotspot locations, this application achieves independent zoned heat transfer enhancement through the aforementioned structural design and control method, effectively addressing localized hotspots on the chip. Specifically, by setting a zoned nozzle layout with a center and four corners within the evaporation chamber of the cold plate, and equipping each nozzle with an independent adjustment and flow control component, the spray flow rate and spray distance of the corresponding nozzle can be dynamically adjusted according to the real-time temperature of each zone. In practical applications, when overheating occurs in a corner area of ​​the chip, simply activating the nozzle corresponding to that area and adjusting its spray distance and spray flow rate can achieve dual enhanced heat transfer through high-momentum droplet impact and sufficient working fluid supply in that localized area, precisely suppressing hotspots. Non-hotspot areas maintain a low-power operation state, thereby significantly reducing the maximum temperature difference on the chip surface and ensuring chip operational reliability and lifespan.

[0071] In the description of this specification, references to terms such as "one embodiment," "some embodiments," "example," "specific example," or "some examples," etc., indicate that a specific feature, structure, material, or characteristic described in connection with that embodiment or example is included in at least one embodiment or example of the invention. In this specification, the illustrative expressions of the above terms do not necessarily refer to the same embodiment or example. Furthermore, the specific features, structures, materials, or characteristics described may be combined in any suitable manner in one or more embodiments or examples.

[0072] The embodiments described above are merely illustrative of several implementations of the present invention, and while the descriptions are specific and detailed, they should not be construed as limiting the scope of the present invention. It should be noted that those skilled in the art can make various modifications and improvements without departing from the concept of the present invention, and these modifications and improvements all fall within the scope of protection of the present invention. Therefore, the scope of protection of this application should be determined by the appended claims.

Claims

1. A partitioned jet-type two-phase liquid-cooled cold plate, characterized in that, include: The cold plate substrate has an evaporation chamber inside, and the bottom of the cold plate substrate has a heat exchange interface for bonding with the chip to be cooled. A condenser, connected to the evaporation chamber, is used to condense the working fluid vapor from the evaporation chamber; Multiple nozzles are disposed in the evaporation chamber and are arranged in sections on a plane parallel to the heat exchange interface. Each nozzle is used to receive condensed liquid from the condenser and spray it toward the heat exchange interface for cooling. Multiple adjustment components are respectively connected between each of the nozzles and the cold plate substrate, for independently driving each nozzle to reciprocate in a direction perpendicular to the heat exchange interface, so as to adjust the distance between the nozzle orifice and the heat exchange interface. Multiple temperature sensors are disposed on the heat exchange interface, and the positions of the multiple temperature sensors are arranged one-to-one with the multiple preset heating areas of the chip. Multiple flow control components are respectively disposed on multiple nozzles for independently controlling the flow rate of the working fluid injected by each nozzle; The nozzle includes a central nozzle and four corner nozzles, with the four corner nozzles symmetrically arranged in pairs on both sides of the central nozzle; The central nozzle is positioned to correspond to the central heating area of ​​the chip, and the four corner nozzles are positioned to correspond one-to-one with the four corner heating areas of the chip. The adjustment component includes: The telescopic drive unit is fixed on the cold plate substrate; The guide portion extends in a direction perpendicular to the heat exchange interface; The push plate is fixedly connected to the output end of the telescopic drive unit and slidably engaged with the guide unit; the nozzle is fixedly disposed at the bottom end of the push plate. The first limit switch is located at the upper limit position of the push plate part and is used to issue a stop signal to stop the upward drive of the telescopic drive part when the push plate part moves to the preset highest position. The second limit switch is located at the downward limit position of the push plate part and is used to issue a stop signal to stop the downward drive of the telescopic drive part when the push plate part moves to the preset lowest position.

2. The partitioned jet-type two-phase liquid-cooled plate according to claim 1, characterized in that, It also includes a connecting component, which includes a cooling water inlet pipe, a cooling water outlet pipe, a circulation pipe, and a liquid supply pipe. The outlet end of the cooling water inlet pipe and the inlet end of the cooling water outlet pipe are respectively connected to the condenser. The cold plate substrate is also provided with a gas storage chamber, which is located on the top side of the evaporation chamber and is connected to the evaporation chamber. The gas phase inlet of the condenser is connected to the gas outlet of the gas storage chamber through the circulation pipeline, and the liquid phase outlet of the condenser is connected to the liquid inlet pipeline of each nozzle through the liquid supply pipeline.

3. The partitioned jet-type two-phase liquid-cooled plate according to claim 1, characterized in that, The heat exchange interface has a micron- or nano-scale textured structure.

4. A control method for a partitioned jet-type two-phase liquid-cooled cold plate, characterized in that, The control method is applied to the partitioned jet-type two-phase liquid-cooled cold plate according to any one of claims 1 to 3, and the control method includes: Acquire chip temperature data collected by multiple temperature sensors, the chip temperature data including the central region temperature T c and the temperature T of multiple corner areas i ; Based on the temperature T in the central region c and the temperature T of multiple corner areas i The overall weighted temperature T is calculated using normalized weights. avg And determine the maximum temperature T max The maximum temperature T max For T c and each T i The maximum value in; The overall weighted temperature T avg Maximum temperature T max Temperature T in the central area c The results are compared with preset temperature thresholds to obtain the comparison results; Based on the comparison results, the cooling control mode of the nozzle is adjusted to change the flow rate and / or spray distance of the nozzle.

5. The control method for the partitioned jet-type two-phase liquid-cooled cold plate according to claim 4, characterized in that, The overall weighted temperature T avg The calculation formula is: in, And the center weight a c Greater than the weight a of any corner i i = 1, 2, 3, 4; The preset temperature threshold includes a first temperature threshold T. th1 Second temperature threshold T th2 T th1 <T th2 ; When T avg ≤T th1 And T max ≤T th1 When the first control mode is executed, only the nozzles corresponding to the central area are opened, and the spray flow rate of the opened nozzles is adjusted to the minimum set value and the spray distance is adjusted to the maximum set value. When T avg >T th1 or T max >T th1 And T avg ≤T th2 T max ≤T th2 At that time, the second control mode is executed, keeping the nozzles corresponding to the central area open, and adjusting the temperature T of each corner area accordingly. i Selectively open nozzles in the corresponding corner areas, and adjust the spray distance of the corresponding nozzles based on the temperature of the corner area; When T avg >T th2 or T max >T th2 When the third control mode is executed, all nozzles are opened, and the spray flow of all nozzles is adjusted to the maximum set value, while the spray distance is simultaneously reduced to the minimum set value.

6. The control method for the partitioned jet-type two-phase liquid-cooled cold plate according to claim 5, characterized in that, In the second control mode, the temperature T of each corner area is used as the basis for the control. i Selectively opening nozzles in corresponding corner areas includes: Determine the temperature T in the corner area i Is it greater than the first temperature threshold T? th1 ; If not, the nozzles in the corresponding corner areas will not be turned on; If so, then open the nozzle in the corresponding corner area, and adjust the spray distance of the corresponding nozzle based on the temperature of that corner area, using the following formula: Among them, H i T represents the spray distance between the nozzle and the heat exchange interface in the corresponding area. i This refers to the temperature of the corresponding corner region; H max H is the maximum spray distance. min Minimum spray distance; T mid is the preset midpoint temperature of the curve, and 'a' is the preset steepness parameter with a > 0.

7. The control method for a partitioned jet-type two-phase liquid-cooled cold plate according to claim 5, characterized in that, When the temperature of the central region is T c >T th1 If the current control mode is in the first control mode, the second control mode will be forcibly executed; if the current control mode is in the second or third control mode, the current mode will be maintained.

8. The control method for the partitioned jet-type two-phase liquid-cooled cold plate according to claim 5, characterized in that, The control method further includes: During the execution of the cooling control mode, the temperature difference ΔT=T is calculated. max -T avg When ΔT > ΔT crit At that time, the maximum temperature T max The nozzles in the corresponding area increase the injection flow rate or decrease the injection distance, where ΔT crit This is a preset temperature difference threshold.

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