Electronic equipment
By using a one-way valve system driven by a vibrating device in the electronic device, the flow of the heat exchange medium in the medium channel is realized, the problem of insufficient heat dissipation performance in the prior art is solved, and the heat dissipation ability and efficiency of the electronic device are improved.
Patent Information
- Application Number
- CN202411336099.2
- Authority / Receiving Office
- CN · China
- Patent Type
- Applications(China)
- Current Assignee / Owner
- Filing Date
- 2024-09-24
- Publication Date
- 2024-12-31
AI Technical Summary
The existing electronic equipment lacks heat dissipation performance in high-power consumption applications or high-temperature environments, especially when the overall temperature of the heat-smooth plate or thermally conductive copper tube increases, it affects the condensation effect of the heat exchange medium and leads to a decrease in heat dissipation performance.
The combination of vibrating devices and heat dissipation parts is used to connect the medium channel and sound cavity through a one-way valve. The vibration of the diaphragm changes the pressure in the sound cavity, and drives the heat exchange medium to flow in the medium channel by one-way, taking away the heat from the heating device. Achieve active heat dissipation.
It improves the heat dissipation ability of electronic devices, especially in high temperature or high power consumption, and achieves more effective heat dissipation, enhancing the response speed and efficiency of the heat dissipation system.
Smart Images
Figure CN119233599A_ABST
Abstract
Description
Technical Field
[0001] The present application belongs to the field of heat dissipation technology, and specifically relates to an electronic device. Background Art
[0002] With the development of electronic equipment technology, the functions of electronic equipment are becoming more and more complex, and the power consumption of applications has increased, resulting in an increase in heat generation. When electronic equipment is used in high-power applications such as large-scale games and navigation, or in high-temperature outdoor environments, the heating of electronic equipment is usually more serious, which also puts higher requirements on the heat dissipation performance of electronic equipment.
[0003] In the related technology, electronic devices usually use heat spreaders or heat-conducting copper tubes to dissipate heat, which are equipped with heat exchange medium and capillary structure. When the electronic device is heated, the heat exchange medium in the heated area evaporates, and the steam flows along the capillary structure to the area with lower temperature to take away the heat, and then the steam condenses and liquefies and circulates back. However, when the electronic device is seriously heated, the overall temperature of the heat spreader or heat-conducting copper tube tends to be close, which affects the condensation effect of the heat exchange medium and greatly reduces the heat dissipation performance. Summary of the invention
[0004] The present application aims to provide an electronic device to solve the problem of poor heat dissipation performance of existing electronic devices.
[0005] In order to solve the above technical problems, this application is implemented as follows:
[0006] The present application discloses an electronic device, comprising:
[0007] A vibration device, the vibration device comprising a diaphragm and a sound cavity;
[0008] A heat sink, the heat sink comprising a medium channel, a heat exchange medium is arranged in the medium channel, and the medium channel is connected to the sound cavity through a one-way valve;
[0009] When the vibration device is in working state, the diaphragm vibrates and drives the heat exchange medium in the medium channel to flow through the one-way valve.
[0010] In an embodiment of the present application, the medium channel of the heat sink is connected to the sound cavity of the vibration device through a one-way valve, so that the heat exchange medium in the medium channel can flow between the sound cavity and the medium channel. When the vibration device is in working state, the diaphragm can vibrate to change the pressure in the sound cavity. Since the sound cavity is connected to the medium channel, the heat exchange medium can flow between the medium channel and the sound cavity under the action of the pressure in the sound cavity. According to the electronic device provided by the embodiment of the present application, the heat exchange medium in the medium channel of the heat sink is driven by the pressure of the sound cavity to flow. When the heat exchange medium flows to the heating position of the heating device, it can take away the heat of the heating device without being limited by the temperature of the heating device. When the heat dissipation amount is large, a better heat dissipation effect can be achieved, active heat dissipation is achieved, and the heat dissipation capacity of the electronic device is improved.
[0011] Additional aspects and advantages of the present application will be given in part in the description below, and in part will become apparent from the description below, or will be learned through the practice of the present application. BRIEF DESCRIPTION OF THE DRAWINGS
[0012] The above and / or additional aspects and advantages of the present application will become apparent and easily understood from the description of the embodiments in conjunction with the following drawings, in which:
[0013] Figure 1 is a top view of the loudspeaker and the heat sink in the embodiment of the present application;
[0014] Figure 2 It is a partial cross-sectional view of the cooperation between the speaker and the heat sink in the embodiment of the present application;
[0015] Figure 3 yes Figure 2 Schematic diagram of the one-way valve in the closed state in the middle A part;
[0016] Figure 4 yes Figure 2 Schematic diagram of the one-way valve in the middle A section when it is open;
[0017] Figure 5 is a schematic diagram of the flow direction of the heat exchange medium when the pressure in the sound cavity increases in the embodiment of the present application;
[0018] Figure 6 is a schematic diagram of the flow direction of the heat exchange medium when the pressure in the sound cavity decreases in the embodiment of the present application;
[0019] Figure 7 Schematic diagram of a Tesla one-way valve disposed in a medium channel in an embodiment of the present application;
[0020] Figure 8 yes Figure 7 Enlarged schematic diagram of part B in the middle.
[0021] Figure numerals: 10 - vibration device, 101 - sound cavity, 11 - shell, 12 - diaphragm, 20 - heat sink, 21 - medium channel, 211 - medium inlet, 212 - medium outlet, 213 - installation cavity, 22 - one-way valve, 221 - ball plug, 222 - spring, 223 - Tesla one-way valve, x - first vibration direction, y - second vibration direction. DETAILED DESCRIPTION
[0022] The embodiments of the present application will be described in detail below, and examples of the embodiments are shown in the accompanying drawings, wherein the same or similar reference numerals throughout represent the same or similar elements or elements having the same or similar functions. The embodiments described below with reference to the accompanying drawings are exemplary and are only used to explain the present application, and should not be construed as limitations on the present application. Based on the embodiments in the present application, all other embodiments obtained by ordinary technicians in the field without making creative work are within the scope of protection of the present application.
[0023] The term "first" or "second" in the specification and claims of this application may include one or more of the features explicitly or implicitly. In the description of this application, unless otherwise specified, "plurality" means two or more. In addition, "and / or" in the specification and claims means at least one of the connected objects, and the character " / " generally means that the objects connected before and after are in an "or" relationship.
[0024] In the description of the present application, it should be understood that the terms "center", "longitudinal", "lateral", "length", "width", "thickness", "up", "down", "front", "back", "left", "right", "vertical", "horizontal", "top", "bottom", "inside", "outside", "clockwise", "counterclockwise", "axial", "radial", "circumferential" and the like indicate orientations or positional relationships based on the orientations or positional relationships shown in the accompanying drawings, and are only for the convenience of describing the present application and simplifying the description, and do not indicate or imply that the referred device or element must have a specific orientation, be constructed and operated in a specific orientation, and therefore should not be understood as a limitation on the present application.
[0025] In the description of this application, it should be noted that, unless otherwise clearly specified and limited, the terms "installed", "connected", and "connected" should be understood in a broad sense, for example, it can be a fixed connection, a detachable connection, or an integral connection; it can be a mechanical connection or an electrical connection; it can be a direct connection, or it can be indirectly connected through an intermediate medium, or it can be the internal communication of two components. For ordinary technicians in this field, the specific meanings of the above terms in this application can be understood according to specific circumstances.
[0026] With the development of electronic equipment technology, the functions of electronic equipment are becoming more and more complete and complex, the types of electronic equipment applications and application scenarios are becoming more and more abundant, and their power consumption will also increase, resulting in an increase in the heat generated by electronic equipment. Among them, when electronic equipment is used in high-power applications such as large-scale games and navigation, or in high-temperature outdoor environments, the heating of electronic equipment is usually more serious, which also puts higher requirements on the heat dissipation performance of electronic equipment.
[0027] In order to improve the heat dissipation capacity of electronic devices and meet users' higher demands for heat dissipation when using high-power consumption applications or outdoors, an embodiment of the present application provides an electronic device. According to the electronic device provided by the embodiment of the present application, the heat exchange medium in the medium channel is driven by the pressure of the sound cavity to flow. When the heat exchange medium flows to the heating position of the heating device, it can take away the heat of the heating device without being limited by the temperature of the heating device. When the heat dissipation amount is large, better heat dissipation effect can be achieved, thereby realizing active heat dissipation and improving the heat dissipation capacity of the electronic device.
[0028] It should be noted that the electronic device provided in the embodiment of the present application may include at least one of a mobile phone, a tablet computer, a laptop computer, and a wearable device, and the embodiment of the present application may not limit the specific type of the electronic device.
[0029] The electronic device provided in the embodiment of the present application is further described in detail below in conjunction with the accompanying drawings and specific implementation methods.
[0030] like Figures 1 to 8 As shown, the electronic device provided in the embodiment of the present application may specifically include: a vibration device 10, the vibration device 10 includes a diaphragm 12 and a sound cavity 101, and the pressure in the sound cavity 101 is variable; and a heat sink 20, the heat sink 20 is provided with a medium channel 21 for the circulation of a heat exchange medium, the medium channel 21 is connected to the sound cavity 101 through a one-way valve 22, when the vibration device 10 is in working state, the diaphragm 12 in the vibration device 10 can vibrate and drive the pressure in the sound cavity 101 to change, and at the same time the one-way valve 22 switches between open and closed to promote the one-way circulation of the heat exchange medium in the medium channel 21.
[0031] Specifically, the vibration device 10 includes a shell 11 and a diaphragm 12. The diaphragm 12 is connected to the shell 11 and encloses the shell 11 to form a sound cavity 101. When the diaphragm 12 vibrates, the pressure in the sound cavity 101 changes. A accommodating cavity is provided in the shell 11, and the shell 11 is provided with an opening for communicating with the medium channel 21 of the heat sink 20. It can be understood that since the sound cavity 101 is connected to the medium channel 21, the sound cavity 101 can also be used to accommodate a heat exchange medium. The heat exchange medium enters the medium channel 21 from the sound cavity 101, flows unidirectionally in the medium channel 21, and enters the sound cavity 101 again to complete the unidirectional circulation of the heat exchange medium. The shell 11 can be a metal shell 11 or a plastic shell 11, and the present application does not make specific limitations on this.
[0032] In actual applications, the heat exchange medium in the medium channel 21 of the heat sink 20 is driven by the pressure of the sound cavity 101 to flow. When the heat exchange medium flows to the heating position of the heating device, it can take away the heat of the heating device without being limited by the temperature of the heating device. When the heat dissipation is large, better heat dissipation effect can be achieved, thereby realizing active heat dissipation and improving the heat dissipation capacity of electronic equipment.
[0033] In the embodiment of the present application, the number of the medium channels 21 in the heat sink 20 is multiple, and the multiple medium channels 21 can be arranged at intervals, and each medium channel 21 includes a medium inlet 211 and a medium outlet 212. The medium inlet 211 and the medium outlet 212 of the medium channel 21 are both connected to the sound cavity 101 of the vibration device 10, and the medium channel 21 is used for the circulation of heat exchange medium. It should be noted that in the present application, since the heat exchange medium circulates between the medium channel 21 and the sound cavity 101 of the vibration device 10, in order to reduce the impact on the performance of the vibration device 10, the heat exchange medium can be a non-liquid medium such as air. In practical applications, the heat exchange medium can be a cooling medium, such as cooling air, or a liquid cooling medium such as water, ethanol, ethylene glycol or a mixture of the above various cooling media; in addition, when the above electronic equipment needs to realize the heat conduction function, such as when the electronic equipment is in a low temperature environment, the heat exchange medium can also be a heat transfer medium, and the present application does not make specific restrictions on this.
[0034] In a specific application, when the pressure in the sound cavity 101 changes, the heat exchange medium in the sound cavity 101 is driven by the pressure to flow from the medium inlet 211 into the medium channel 21, or the heat exchange medium in the medium channel 21 is driven by the pressure to flow out of the medium channel 21 from the medium outlet 212, thereby realizing the one-way circulation of the heat exchange medium in the heat sink 20.
[0035] Optionally, the medium channel 21 includes a medium inlet 211 and a medium outlet 212, and the medium inlet 211 and the medium outlet 212 are both connected to the sound cavity 101; the diaphragm 12 has a first vibration direction x and a second vibration direction y, and when the diaphragm 12 vibrates toward the first vibration direction x, the pressure in the sound cavity 101 increases, and the heat exchange medium flows from the sound cavity 101 through the medium inlet 211 into the medium channel 21; when the diaphragm 12 vibrates toward the second vibration direction y, the pressure in the sound cavity 101 decreases, and the heat exchange medium flows from the medium channel 21 through the medium outlet 212 into the sound cavity 101.
[0036] Specifically, the vibration device 10 includes a housing 11 and a diaphragm 12. The diaphragm 12 is a sheet structure. The diaphragm 12 is connected to the housing 11 and encloses the housing 11 to form a sound cavity 101. The diaphragm 12 actually constitutes a part of the sound cavity 101. When the diaphragm 12 vibrates, the pressure in the sound cavity 101 changes. The first vibration direction x of the diaphragm 12 is as follows: Figure 5 In the direction indicated by the middle arrow, the diaphragm 12 vibrates toward the sound cavity 101 and compresses the sound cavity 101, the pressure in the sound cavity 101 increases, and the second vibration direction y is Figure 6 In the direction indicated by the middle arrow, the diaphragm 12 vibrates away from the sound cavity 101, so that the space of the sound cavity 101 is expanded and the pressure is reduced. The housing 11 is provided with a receiving cavity, and the housing 11 is provided with at least two openings, which are respectively used to communicate with the medium inlet 211 and the medium outlet 212 of the medium channel 21 of the heat sink 20.
[0037] It can be understood that since the sound cavity 101 is connected to the medium inlet 211 and the medium outlet 212 of the medium channel 21, the sound cavity 101 can also be used to accommodate heat exchange medium. The heat exchange medium enters the medium channel 21 from the medium inlet 211 in the sound cavity 101, flows unidirectionally in the medium channel 21, flows out from the medium outlet 212, and then enters the sound cavity 101 again, completing the unidirectional circulation of the heat exchange medium.
[0038] In the above process, the vibration of the diaphragm 12 drives the pressure in the sound cavity 101 to change, thereby applying positive pressure or negative pressure to the heat exchange medium in the medium channel 21, driving it to flow into the medium channel 21 from the medium inlet 211, or flow out of the medium channel 21 from the medium outlet 212.
[0039] Optionally, the number of the vibration device 10 is at least one.
[0040] When the electronic device includes a vibration device 10 , the vibration device 10 is a speaker, and the speaker also includes a voice coil. When the speaker is in working state, the voice coil vibrates and drives the diaphragm to vibrate to change the pressure in the sound cavity 101 .
[0041] When the electronic device includes a plurality of vibration devices 10, the plurality of vibration devices 10 are spaced apart along the length direction of the medium channel 21, and at least one vibration device 10 is a speaker, and the remaining vibration devices 10 include at least one of a speaker and a receiver.
[0042] For example, when the electronic device is configured with dual speakers, both speakers can be connected to the medium channel 21 of the heat sink 20. When the heat sink 20 is connected to the sound chambers 101 of multiple speakers at the same time, the heat dissipation effect can be improved; or, the speaker and receiver of the electronic device are both connected to the medium channel 21 of the heat sink 20. At this time, since the working states of the receiver and the speaker can be different, such as when the speaker is working, the speaker can drive the electronic device to achieve heat dissipation, and when the receiver is working, the receiver can drive the electronic device to achieve heat dissipation, thereby expanding the application scenarios of the heat sink 20.
[0043] According to the electronic device provided in the embodiment of the present application, there is no need to add a new structure in the electronic device. It is only necessary to improve the existing heat sink 20 and the speaker or receiver structure to effectively improve the heat dissipation performance, save the internal space of the electronic device, and adapt to the trend of lightweight electronic devices.
[0044] Optionally, the number of one-way valves 22 is at least two, wherein one one-way valve 22 is arranged near the medium inlet 211 and is used to introduce the heat exchange medium in the sound cavity 101 into the medium channel 21, and one one-way valve 22 is arranged near the medium outlet 212 and is used to introduce the heat exchange medium in the medium channel 21 into the sound cavity 101.
[0045] like Figure 2 As shown, in the embodiment of the present application, the heat sink 20 includes two one-way valves 22, one of which is arranged near the medium inlet 211 and is used to introduce the heat exchange medium in the sound cavity 101 into the medium channel 21, and the other one-way valve 22 is arranged near the medium outlet 212 and is used to introduce the heat exchange medium in the medium channel 21 into the sound cavity 101. The medium inlet 211 and the medium outlet 212 of the medium channel 21 of the heat sink 20 are both connected to the sound cavity 101 of the vibration device 10, and the heat exchange medium can flow between the sound cavity 101 and the medium channel 21. The conduction direction of the two one-way valves 22 is the same, both in the direction from the medium inlet 211 to the medium outlet 212. That is: on the side close to the medium inlet 211, the heat exchange medium enters the one-way valve 22 from the sound cavity 101 and flows toward the medium outlet 212 until the other one-way valve 22 on the side close to the medium outlet 212, and the heat exchange medium passes through the one-way valve 22 and flows out from the medium outlet 212 and enters the sound cavity 101.
[0046] Specifically, when the pressure in the sound cavity 101 increases, a positive pressure is formed in the sound cavity 101, the medium inlet 211 is opened, the medium outlet 212 is closed, and the heat exchange medium can only enter the medium channel 21 from the sound cavity 101 through the medium inlet 211; when the pressure in the sound cavity 101 decreases, a negative pressure is formed in the sound cavity 101, the medium outlet 212 is opened, the medium inlet 211 is closed, and the heat exchange medium can only enter the sound cavity 101 from the medium channel 21 through the medium outlet 212. In the above two processes, the heat exchange medium flows unidirectionally between the sound cavity 101 and the medium channel 21. When the heat exchange medium passes through the high-temperature device position, it takes away the heat, and then flows unidirectionally to the low-temperature position and dissipates the heat. In this process, the condensation process of the heat exchange medium can be unaffected by the overall temperature of the heat sink 20, thereby improving the heat dissipation capacity of the electronic device. This layout of the one-way valve 22 with two-way control not only enhances the flow stability of the heat exchange medium, but also improves the response speed and efficiency of the heat dissipation system.
[0047] Optionally, the one-way valve 22 is movably disposed in the medium channel. When the diaphragm vibrates, the one-way valve 22 reciprocates along the length direction of the medium channel 21 to block the medium channel 21 or release the blockage of the medium channel 21 .
[0048] Furthermore, the medium channel 21 is provided with an installation cavity 213 near the medium inlet 211 and near the medium outlet 212. The installation cavity 213 includes an inlet end and an outlet end that are arranged in opposite directions. The one-way valve 22 is movably arranged in the installation cavity 213. When the diaphragm 12 vibrates, the one-way valve 22 moves in the installation cavity 213 and blocks the inlet end, or releases the blockage of the inlet end. In the installation cavity 213 arranged near the medium inlet 211 and the medium outlet 212, the inlet end is used for the heat exchange medium to enter the installation cavity 213, and the outlet end is used for the heat exchange medium to flow out of the installation cavity 213.
[0049] In practical applications, the installation cavity 213 can limit the movement of the one-way valve 22 to achieve more precise control of the flow state of the medium channel 21, thereby improving the response speed and efficiency of heat dissipation of electronic equipment. The design of the installation cavity 213 also enhances the reliability and stability of the system. It provides a stable movement environment for the one-way valve 22, reduces the interference of external factors on its movement trajectory, and ensures that the one-way valve 22 can accurately and reliably perform its blocking and opening functions.
[0050] Optionally, the one-way valve 22 includes a ball plug 221 and a spring 222, wherein the ball plug 221 is disposed near the inlet end, and the spring 222 is disposed near the outlet end. It should be noted that the inlet end and the outlet end are both relative to the flow direction of the heat exchange medium. For example, in the installation cavity 213 near the medium inlet 211, the inlet end is located on the side near the sound cavity 101, and the outlet end is located on the side away from the sound cavity 101; and in the installation cavity 213 near the medium outlet 212, the inlet end is located on the side away from the sound cavity 101, and the outlet end is located on the side near the sound cavity 101.
[0051] The pressure change in the sound cavity 101 drives the one-way valve 22 to switch between a closed state and an open state. Figure 3 As shown, in the closed state, the ball plug 221 abuts against the inlet end under the action of the spring 222 to cut off the flow of the heat exchange medium between the sound cavity 101 and the medium channel 21; Figure 4 As shown, in the open state, the ball plug 221 compresses the spring 222 , and the sound cavity 101 and the medium channel 21 are connected.
[0052] Specifically, Figure 5 As shown, when the diaphragm 12 vibrates upward, the pressure in the sound cavity 101 increases, and in the one-way valve 22 on the left, the ball plug 221 compresses the spring 222 under the action of the positive pressure from the sound cavity 101, and releases the blockage of the inlet end of the installation cavity 213, and the sound cavity 101 and the medium channel 21 are in a conducting state; at the same time, in the one-way valve 22 on the right, the ball plug 221 remains in a state of blocking the inlet end of the right installation cavity 213, and the sound cavity 101 and the medium channel 21 are in a non-conducting state.
[0053] like Figure 6 As shown, when the diaphragm 12 vibrates downward, the pressure in the sound cavity 101 decreases, and in the one-way valve 22 on the right, the ball plug 221 compresses the spring 222 under the negative pressure from the sound cavity 101, and releases the blockage of the inlet end of the installation cavity 213, so that the sound cavity 101 and the medium channel 21 are in a conducting state; at the same time, in the one-way valve 22 on the left, the ball plug 221 remains in a state of blocking the inlet end of the left installation cavity 213, and the sound cavity 101 and the medium channel 21 are in a non-conducting state.
[0054] The spring 222 and the ball plug 221 are both confined in the installation cavity 213. The spring 222 has a simple structure, a variety of models, and is easy to obtain. In practical applications, the specifications and models of the spring 222 can be selected according to the specific structure of the heat sink 20. It should be noted that the end face of the spring 222 is usually circular, and in order to reduce the flow resistance of the heat exchange medium, the end face of the medium channel 21 in the heat spreader is also usually circular. By setting the ball plug 221, it can be well matched with the end face shape of the spring 222 and the medium channel 21, and the blocking effect is better. The shape of the ball plug 221 is more regular and not easy to be stuck, which is also conducive to improving the reliability of the heat sink 20. Further, in the embodiment of the present application, in order to improve the blocking effect of the ball plug 221 on the heat exchange medium, the inlet end of the installation cavity 213 is set to a trumpet-like shape to match the shape of the ball plug 221.
[0055] Optionally, the installation cavity 213 is a cylindrical cavity, and the diameter of the ball plug 221 is larger than the diameter of the inlet end and smaller than the diameter of the installation cavity 213 .
[0056] Since the cross section of the spring 222 is generally circular, when the ball plug 221 is compressed by pressure, or when the spring 222 is subjected to its own restoring force, it switches between compression and extension in the installation cavity 213. Setting the installation cavity 213 as a cylindrical cavity can reduce the probability of the compression spring getting stuck in the installation cavity 213, thereby ensuring the reliability of the one-way valve 22. At the same time, setting the installation cavity 213 as a cylindrical cavity is also conducive to reducing the flow resistance of the heat exchange medium flowing in the installation cavity 213, thereby ensuring the smooth circulation of the heat exchange medium. When the diameter of the ball plug 221 is larger than the diameter of the inlet end, the blocking effect on the heat exchange medium between the medium channel 21 and the installation cavity 213 can be ensured. When the diameter of the ball plug 221 is smaller than the diameter of the installation cavity 213, it can be ensured that the heat exchange medium can pass through the installation cavity 213 smoothly when the ball plug 221 is far away from the inlet end.
[0057] In another optional embodiment of the present application, the one-way valve 22 is a Tesla one-way valve 223 .
[0058] Specifically, Figure 7 , Figure 8 As shown, the two Tesla one-way valves 223 located at the medium inlet 211 and the medium outlet 212 have the same conduction direction. The solution of using the Tesla one-way valve 223 to replace the compression spring 222 and the ball plug 221 can also realize the one-way circulation flow of the cooling fluid for heat dissipation.
[0059] like Figure 7 , Figure 8The Tesla one-way valve 223 shown in the figure adopts a unique loop design. When the heat exchange medium passes through the Tesla one-way valve 223 in the forward direction as shown by the arrow in the figure, the heat exchange medium will be split into two streams at each loop port, and then the two heat exchange media will reunite at the next intersection, thereby achieving an acceleration effect. However, when the heat exchange medium flows into the Tesla one-way valve 223 in the reverse direction, although the heat exchange medium will also be split at the first intersection and reunite at the second intersection, the flow directions of the two heat exchange media are opposite at this time, so huge resistance will be generated, so that the Tesla one-way valve 223 can only pass forward and it is difficult to reverse the flow.
[0060] Optionally, the electronic device further includes a heating device, and the medium channel 21 and the heating device are arranged opposite to each other along the thickness direction of the electronic device and at least partially overlap.
[0061] It can be understood that by arranging the heating device and the medium channel 21 of the heat sink 20 relative to each other along the thickness direction of the electronic device and at least partially overlapping each other, the heat dissipation efficiency and space utilization are improved. This layout enables the heat exchange medium in the medium channel 21 to flow more directly and efficiently through the heating position of the heating device when driven by the sound cavity pressure of the vibration device. Due to the close contact between the heat exchange medium and the heating device, the heat conduction efficiency is greatly improved, thereby quickly absorbing and taking away the heat.
[0062] In summary, the electronic device provided by the embodiments of the present application has at least the following advantages:
[0063] In an embodiment of the present application, the medium channel of the heat sink is connected to the sound cavity of the vibration device through a one-way valve, so that the heat exchange medium in the medium channel can flow between the sound cavity and the medium channel. When the vibration device is in working state, the diaphragm can vibrate to change the pressure in the sound cavity. Since the sound cavity is connected to the medium channel, the heat exchange medium can flow between the medium channel and the sound cavity under the action of the pressure in the sound cavity. According to the electronic device provided by the embodiment of the present application, the heat exchange medium in the medium channel of the heat sink is driven by the pressure of the sound cavity to flow. When the heat exchange medium flows to the heating position of the heating device, it can take away the heat of the heating device without being limited by the temperature of the heating device. When the heat dissipation amount is large, a better heat dissipation effect can be achieved, active heat dissipation is achieved, and the heat dissipation capacity of the electronic device is improved.
[0064] In the description of this specification, the description with reference to the terms "one embodiment", "some embodiments", "illustrative embodiments", "examples", "specific examples", or "some examples" means that the specific features, structures, materials, or characteristics described in conjunction with the embodiment or example are included in at least one embodiment or example of the present application. In this specification, the schematic representation of the above terms does not necessarily refer to the same embodiment or example. Moreover, the specific features, structures, materials, or characteristics described may be combined in any one or more embodiments or examples in a suitable manner.
[0065] Although the embodiments of the present application have been shown and described, those skilled in the art will appreciate that various changes, modifications, substitutions and variations may be made to the embodiments without departing from the principles and spirit of the present application, and that the scope of the present application is defined by the claims and their equivalents.
Claims
1. An electronic device, characterized in that: include: A vibration device, the vibration device comprising a diaphragm and a sound cavity; A heat sink, the heat sink comprising a medium channel, a heat exchange medium is arranged in the medium channel, and the medium channel is connected to the sound cavity through a one-way valve; When the vibration device is in working state, the diaphragm vibrates and drives the heat exchange medium in the medium channel to flow through the one-way valve.
2. The electronic device according to claim 1, characterized in that: The number of the vibration devices is at least one, wherein when the electronic device includes one vibration device, the vibration device is a speaker; when the electronic device includes a plurality of vibration devices, the plurality of vibration devices are spaced apart along the length direction of the medium channel, and at least one of the vibration devices is the speaker, and the remaining vibration devices include at least one of the speakers and receivers.
3. The electronic device according to claim 1, characterized in that: The medium channel comprises a medium inlet and a medium outlet, and both the medium inlet and the medium outlet are connected to the sound cavity; The diaphragm has a first vibration direction and a second vibration direction. When the diaphragm vibrates toward the first vibration direction, the pressure in the sound cavity increases, and the heat exchange medium flows from the sound cavity through the medium inlet into the medium channel; when the diaphragm vibrates toward the second vibration direction, the pressure in the sound cavity decreases, and the heat exchange medium flows from the medium channel through the medium outlet into the sound cavity.
4. The electronic device according to claim 3, characterized in that: The number of the one-way valves is at least two, wherein one of the one-way valves is arranged near the medium inlet and is used to introduce the heat exchange medium in the sound cavity into the medium channel, and one of the one-way valves is arranged near the medium outlet and is used to introduce the heat exchange medium in the medium channel into the sound cavity.
5. The electronic device according to claim 1, characterized in that: The one-way valve is movably arranged in the medium channel. When the diaphragm vibrates, the one-way valve reciprocates along the length direction of the medium channel to block the medium channel or release the blockage of the medium channel.
6. The electronic device according to claim 1, characterized in that: The medium channel is provided with an installation cavity, and the installation cavity includes an inlet end and an outlet end which are arranged in opposite directions. The one-way valve is movably arranged in the installation cavity. When the diaphragm vibrates, the one-way valve moves in the installation cavity and blocks the inlet end, or releases the blockage of the inlet end.
7. The electronic device according to claim 6, characterized in that: The one-way valve includes a ball plug and a spring, the ball plug is arranged close to the inlet end, and the spring is arranged close to the outlet end. When the diaphragm vibrates, the one-way valve switches between a closed state and an open state; wherein, in the closed state, the ball plug abuts against the inlet end under the action of the spring to cut off the flow of the heat exchange medium between the sound cavity and the medium channel; in the open state, the ball plug compresses the spring, and the sound cavity and the medium channel are connected.
8. The electronic device according to claim 7, characterized in that: The installation cavity is a cylindrical cavity, wherein the diameter of the ball plug is larger than the diameter of the inlet end and smaller than the diameter of the installation cavity.
9. The electronic device according to claim 1, characterized in that: The one-way valve is a Tesla one-way valve.
10. The electronic device according to claim 1, characterized in that: The electronic device further includes a heating device, and the medium channel and the heating device are arranged opposite to each other along the thickness direction of the electronic device and at least partially overlap with each other.