Method and apparatus for reinforcing electronic device

Abstract

The invention relates to a method and apparatus for reinforcing an electronic device. An electronic device and a method for assembling an electronic device. The apparatus includes a shielding structure at least partially laterally surrounding the electrical components on the circuit board. The device also includes a cover secured to the top of the shielding structure and covering the electrical component, a spring directly or indirectly applying a loading force to the electronic component, and a fastener securing the cover and the spring to the circuit board.

Description

Technical Field

[0001] The present disclosure relates to methods and apparatus for hardening electronic devices. Background Art

[0002] As electronic device designs trend toward thinner and lighter products, the rigidity of internal components becomes increasingly important. Thin electronic devices are more susceptible to twisting, warping, bending, and / or other external forces. When this occurs, internal components (e.g., electronic packages) are at risk of solder joint failure, cracks, and / or poor thermal performance due to reduced pressure on cooling structures. Therefore, there is a need for an improved method and apparatus for reinforcing electronic devices. Summary of the invention

[0003] According to one aspect of the present disclosure, an electronic device is provided, comprising: a shielding structure that at least partially laterally surrounds an electrical component on a circuit board; a cover that is fixed to the top of the shielding structure and covers the electrical component; a spring that directly or indirectly applies a load force to the electrical component; a cooling structure, wherein the cooling structure is disposed between the cover and the circuit board, and a fastener that fixes the cover and the spring to the circuit board.

[0004] According to another aspect of the present disclosure, a method for assembling an electronic device is provided, the method comprising: fixing a shielding structure to a circuit board to at least partially laterally surround an electrical component on the circuit board; attaching a spring to a fastener; setting a cooling structure between a cover and the circuit board; fixing the cover to the shielding structure; and fixing the cover and the cooling structure to the circuit board, wherein the cover and the cooling structure are fixed to the circuit board using fasteners. BRIEF DESCRIPTION OF THE DRAWINGS

[0005] Some examples of apparatus and / or methods will be described below, by way of example only, and with reference to the accompanying drawings, in which

[0006] Figure 1A shows a schematic cross section of an electronic device having a reinforced cover;

[0007] Figure 1B shows a schematic cross section of an electronic device having a reinforced cover;

[0008] Figure 2 shows a top view of the electronic device with risk areas highlighted;

[0009] Figure 3 A device having a reinforced cover over an electronic assembly is shown;

[0010] Figure 4 A flow chart showing a method for assembling an electronic device with a reinforced cover; and

[0011] Figure 5A and Figure 5B Simulations for circuit boards without and with a reinforcement cover are shown. DETAILED DESCRIPTION

[0012] Some embodiments are now described in more detail with reference to the accompanying drawings. However, other possible examples are not limited to the features of these embodiments described in detail. Other examples may include modifications to features and equivalents and substitutes of features. In addition, the terms used herein to describe certain embodiments should not limit other possible embodiments.

[0013] Throughout the description of the drawings, the same or similar reference numerals refer to the same or similar elements and / or features, which may be the same or implemented in a modified form while providing the same or similar functions. The thickness of lines, layers and / or regions in the drawings may also be exaggerated for clarity.

[0014] When "or" is used to combine two elements A and B, it should be understood that all possible combinations are disclosed, namely only A, only B, and A and B, unless otherwise explicitly defined in individual cases. As alternative wording for the same combination, "at least one of A and B" or "A and / or B" may also be used. The same applies to combinations of more than two elements.

[0015] If a singular form is used, for example, "a", "an", and "the", and there is no explicit or implicit provision that only a single element must be used, further examples may also use multiple elements to implement the same function. If a function is described below as being implemented using multiple elements, further examples may also use a single element or a single processing entity to implement the same function. It should also be understood that the terms "comprises", "comprising", "includes", and / or "comprising" when used describe the presence of specified features, integers, steps, operations, processes, elements, components, and / or groupings thereof, but do not exclude the presence or addition of one or more other features, integers, steps, operations, processes, elements, components, and / or groupings thereof.

[0016] Figure 1A and Figure 1B A schematic cross section of an electronic device 100 is shown having a reinforced cover 110. The electronic device 100 includes a shielding structure 120 that at least partially laterally surrounds an electrical component 102 on a circuit board 104. The device also includes a cover 110 secured to the top of the shielding structure 120 and covering the electrical component 102, a spring 130 that directly and / or indirectly applies a load force to the electrical component 102, and a fastener 140 that secures the cover 110 and the spring 130 to the circuit board 104.

[0017] Figure 2 An electronic device 100 (eg, Figure 1A). Specifically, Figure 2 A top view of an electronic device is shown with risk areas highlighted. Line L1 shows where the backplane below the circuit board 204 will be located. The backplane shown in L1 will be connected to the leaf spring 234 by fasteners 230. The leaf spring then drives the heat pipe 251 cooling structure 250 (directly or indirectly) against the electronic component or component stack between the heat pipe 251 and the circuit board 204. The electrical component is surrounded by a shielding structure 220 (e.g., an EMI fence) and the top is protected by a cover (not shown). The heat pipe 251 is fixed to the electronic component at one proximal end and to the fan 253 at the other distal end. When the circuit board 204 with the electrical component or component stack is subjected to pressure, the highest risk of failure area (as shown by line L2) may be adjacent to the edge of the shielding structure 220 or fence, or adjacent to the bottom plate or backplane (below the circuit board 204, as shown by line L1). Such failures may be caused by twisting, warping, bending and / or other external forces. However, when the cover is secured to the circuit board 204 by the fasteners 230 , the cover can withstand membrane loads during bending because the cover is also connected to the shield structure 220 .

[0018] This lateral stiffness of a cover (e.g., an EMI cover) can be used to increase the stiffness of a circuit board (e.g., a PCB) in the area of ​​an electronic component (e.g., a processor). Lateral stiffness refers to the resistance of an object or structure to deformation or displacement in a horizontal or lateral direction. Lateral stiffness measures the ability of an object to resist bending or flexing when subjected to a lateral load or lateral force. In the context of electronic packaging, lateral stiffness may be important for maintaining the stability and integrity of the package during operation and handling. Higher lateral stiffness ensures that components and structures within the package remain firmly positioned and aligned, reducing the risk of misalignment, damage, or failure. Lateral stiffness can help prevent unwanted movement or vibration that may negatively affect the performance or reliability of the electronic device. By enhancing the lateral stiffness, the overall mechanical stability and robustness of the electronic package is improved, helping to extend its service life and / or achieve optimal functionality.

[0019] like Figure 1A and Figure 1BAs shown, a shielding structure 120 (e.g., an EMI fence or a protective fence) can provide a protective configuration designed to reduce electromagnetic interference (especially electromagnetic interference in the lateral direction). For example, the structure can be constructed of a conductive material and form a barrier around a semiconductor device (e.g., a processor). The structure can be integrated into the circuit board 104, or fixed to the circuit board 104 at the bottom. At its top, the structure can be fixed to a cover 110, such as an EMI cover or a protective cover. The shielding structure 120 can effectively suppress electromagnetic radiation generated by the internal circuit and minimize its impact on adjacent electrical components. The shielding structure 120 acts as a shield to hinder the entry or exit of external electromagnetic signals, thereby maintaining the integrity of the enclosed processor (or other components) and promoting optimal performance of the electronic device 100 or the package as a whole.

[0020] The cover 110 includes a series of protective and practical functions. For example, the cover 110 can be made of a rigid or semi-rigid material such as metal or other conductive materials, and can play a major role in covering and protecting the delicate internal components of the device. The cover 110 can be attached to the lower component using a thermal solution. The thickness of the cover 110 can be 0.10 mm (or at least 0.05 mm, or at least 0.25 mm, or at least 0.15 mm, or at least 0.1 mm) and / or at most 0.2 mm (or at most 0.01 mm, or at most 0.15 mm, or at most 0.45 mm, or at most 1 mm). The cover 110 can provide structural integrity and serve as a barrier to prevent external impact, dust or moisture, and / or can avoid or reduce electromagnetic interference. The cover 110 can integrate thermal management features, including vents, which help to effectively dissipate the heat generated by the processor during operation. The cover 110 can extend above the electrical component 102. For example, the electrical component 102 can be arranged between the cover 110 and the circuit board 104.

[0021] For example, the cover 110 can be secured to the shielding structure 120 using snap connections, interlocking tabs or slots, threaded fasteners, bonding, and / or any combination of these methods. Using the shielding structure 120 to support the cover 110 allows the cover 110 to be used as a reinforcement within a component stack. Using the cover 110 as a top reinforcement can increase the stiffness of the circuit board 104 by 50-120% depending on the design. A schematic diagram of a proposed solution is shown. When the cover 110 is secured to the circuit board 104 (e.g., secured to the stack by screws), the cover can withstand membrane loads during bending due to the cover being connected to the shielding structure 120 (e.g., a fence). This can be further enhanced when the connection to the structure is rigid (e.g., secured with hard corners and snaps).

[0022] Using the cover 110 as a reinforcement can have many benefits. For example, the reinforced cover can reduce the thickness of the connecting circuit board 104 or any backplane 106. Reducing the thickness will also reduce the system height (e.g., Z stacking) and prevent any weight increase. The weight of the system can also be reduced by implementing thinner system components or omitting components such as the backplane 106. Using the cover 110 as a reinforcement can also reduce stress on solder joints, such as stress in a ball grid array (BGA). Reducing BGA stress can also improve the mechanical reliability of the electronic device 100 or package. In addition, this arrangement can prevent wiring layer cracks at the circuit board. Wiring layer cracks refer to fractures or breakages that occur in one of the wiring layers of a circuit board or PCB. PCBs are composed of multiple layers of conductive traces (also called wiring layers) that are interconnected to form electrical paths for the flow of signals and power. These wiring layers are usually separated by an insulating material called a substrate. In addition, using fasteners to fix the cover 110 to the circuit board 104 can minimize the impact on the material or assembly cost of the device.

[0023] The shield structure 120 can partially or completely laterally surround the electrical component 102. For example, the shield structure 120 can completely surround the electrical component 102 on the circuit board. Alternatively, the shield structure 120 can only partially laterally surround the electrical component 102. For example, the shield structure 120 can surround the electrical component 102 along at least 50% (or at least 70% or at least 90%) of the circumference of the electrical component 102. For example, the shield structure 120 can completely surround the electrical component 102 except for openings for structures (e.g., cooling structures 150) extending into the cavity enclosed by the circuit board, the shield structure 120, and the cover 110.

[0024] The shield structure 120 may only partially enclose the assembly to allow access to the interior for certain purposes (e.g., heat dissipation through the heat pipe 151). Figure 2 2, where the shielding structure 220 leaves room for the heat pipe 251 to extend from the electrical assembly to the fan 253. By exposing a portion of the assembly, this can help to more efficiently transfer thermal energy to the external cooling system. Partial encapsulation can also provide accessibility for connectors, mechanical assemblies (e.g., buttons or switches), modularization of subassemblies, and / or signal transmission. For example, the shielding structure 120 may have gaps or slots to enable the transmission of specific signals, such as wireless or RF signals, while still providing partial electromagnetic shielding to protect sensitive internal circuits.

[0025] On the spring screw 134 (e.g. Figure 1B ) or leaf spring 132 (e.g., Figure 1A) applications, the load force refers to the force applied to a processor (e.g., a CPU or GPU) or another component to ensure proper mechanical contact or thermal conduction. The load force can be generated by compression or extension of a spring mechanism. For example, if a spring-loaded screw is tightened or a leaf spring 132 is bent, the resulting load force can be applied to the component or component stack below. This ensures that there is sufficient pressure between, for example, a processor and its heat sink or thermal interface material. This pressure can promote efficient heat transfer and can help maintain optimal thermal performance of the processor. When the cover 110 is attached to a shielding structure 120 (e.g., a shielding fence) and connected by fasteners, the cover 110 transfers a portion of the load to the fence. The load can be transferred closer to the fastener (e.g., a mounting screw), so that board deflection can be reduced.

[0026] The spring 130 is a mechanical component (e.g., comprising metal) designed to store and release mechanical energy. It is characterized by its ability to deform when a force is applied and return to its original shape when the force is removed. Springs are widely used in a variety of applications to provide tension, compression and / or torsion, enabling them to be used for purposes such as shock absorption, maintaining contact pressure, storing energy and / or facilitating mechanical movement.

[0027] The spring 130 can release its stored potential energy as kinetic energy, causing the spring 130 to directly push or pull an object, thereby applying a force (e.g., a load force). The force can be applied directly to a fixed, adjacent, and / or otherwise adjacent component. The force can also be applied or applied indirectly to a series of components that are in direct or indirect contact with the spring 130. This direct and indirect application of force can help to dampen or promote contact pressure between components.

[0028] Fastener 140 can be a device or component for firmly connecting or holding two or more objects together. Fastener 140 can be designed to provide mechanical strength and stability for assembly by establishing reliable and lasting connection. Fasteners are available in various forms, such as screws, bolts, rivets and / or clips. They can also be made of materials such as metal, plastic and / or composite materials. Fastener 140 can have the characteristics of threaded or grooved structure to allow it to be easily inserted, tightened and / or fixed in place. For example, fasteners play a vital role in the assembly of electronic devices, ensuring the structural integrity and reliability of components, and allowing effective maintenance and repair when necessary. Fastener 140 can attach cover 110 with hot solution to the package so that the entire stack can work as a honeycomb structure. Cover 110 can work as a thin film component and can therefore be very thin (e.g., 0.10mm to 0.20mm).

[0029] Figure 1A and Figure 1BThe device may further include a cooling structure 150, which is disposed between the cover 110 and the circuit board 104. For example, the cooling structure 150 is a component or system designed to dissipate heat from an object or environment, thereby reducing its temperature and maintaining thermal balance. The cooling structure 150 can provide a path for transferring heat away from a heat source and dissipating it into the surrounding environment. The cooling structure 150 can be or include a heat pipe 151, a heat exchanger, a liquid cooling system, a radiator, a vapor chamber and / or a cold plate 152. Providing the cooling structure 150 between the cover 110 and the circuit board 104 can enhance heat dissipation and temperature regulation, and improve the overall thermal performance and reliability of the electronic device 100.

[0030] The circuit board 104 (e.g., a printed circuit board (PCB)) can be a rigid or flexible board including a non-conductive material (e.g., fiberglass or epoxy) with conductive paths etched, arranged and / or printed onto its surface. The circuit board 104 can be used as a platform for assembling and interconnecting electrical components so that electrical signals and power can flow between the electrical components to form a functional electronic system or device. The thickness of the circuit board 104 can be at least 0.5 mm (or at least 0.1 mm, at least 0.25 mm, at least 1 mm) and / or at most 2 mm (or at most 1 mm, at most 0.7 mm, or at most 0.5 mm). Using the cover 110 as a reinforcement component enables the PCB thickness to reach 0.50 mm or less.

[0031] The load forces may drive the cooling structure 150 toward the top of the electrical component 102. Driving the cooling structure 150 toward the electrical component 102 may ensure efficient heat dissipation while maintaining proper mechanical contact, promoting optimal thermal performance and component reliability in the electronic package.

[0032] The electrical component 102 may refer to a discrete device, an integrated circuit (IC), and / or a semiconductor component that facilitates the operation and functionality of the electronic device 100 or system. For example, the electrical component 102 may be a processor (e.g., a CPU, a GPU, an XPU, a microcontroller, and / or a digital signal processor), a memory, or a transceiver. These components (which are typically located on the circuit board 104) enable processing, storage, and / or manipulation of electrical signals and data within the electronic device 100. In addition, using the cover 110 as a reinforcement component can reduce the risk of mechanical failure of the CPU and other core area components.

[0033] The cooling structure 150 may extend from the top of the electrical component 102 through an opening in the shield structure 120 or an opening between the shield structure 120 and the cover 110. Extending the cooling structure 150 through an opening in the shield structure 120 may allow for enhanced cooling of specific components or areas within the electronic package while maintaining necessary electromagnetic shielding for sensitive components.

[0034] For example, additional cooling structures, devices, and / or components may be disposed external to the shielding structure 120 and connected via heat pipes 151 or similar components. This may allow for the use of larger or better positioned cooling structures 150, which may be possible or desirable if the cooling structures 150 were fully enclosed by the cover 110 and shielding structure 120. Connecting the cooling structures 150 via openings in the shielding structure 120 may also allow for a reduced height or thickness of the electronic device 100 by reducing the necessary height of the components shielded by the structure and cover 110.

[0035] Figure 2 An example for extending the cooling structure 250 to a fan 253 is shown. The fan can be the cooling structure 250, or an additional cooling structure as a part of the cooling structure system. The fan extending the cooling structure to the outside of the shielding structure can better remove the heat from the electronic components in the shielding structure. Compared to the passive cooling structure, adding a fan to the cooling structure system can also achieve active cooling. The fan also allows better air circulation throughout the device, including air circulation over, around and / or through the electronic device with the cover and shielding structure 220. The fan can also be adjustable, which is advantageous in enclosed or small space inventions, and is efficient under high heat load conditions. This can allow a processor or other electrical component with a higher heat density to be shielded by the cover and shielding structure 220.

[0036] The cooling structure 250 may be or may include a thermal interface material, a vapor chamber, a heat pipe 251, a liquid cooling system, a phase change cooling system, and / or a cold plate. The suitability of the cooling structure 250 depends on the specific application, available space, power requirements, noise considerations, and other factors. Different cooling solutions may be more appropriate in certain circumstances, and the best choice depends on the specific cooling requirements of the electronic package.

[0037] Figure 1B The spring 130 is shown applying a load force to the cover 110 and driving the cooling structure 150 through the cover 110 toward the top of the electrical component 102. Using the spring 130 to apply the load force through the cover 110 can improve mechanical stability and reduce stress on the cooling structure 150 or the electrical component 102. Distributing the load force through the cover 110 can minimize direct pressure on the component, thereby improving its structural integrity and reducing the risk of damage or failure, while still maintaining the necessary electromagnetic shielding for optimal performance and protection.

[0038] The spring 130 can be disposed between the cover 110 and the head 141 of the fastener 140. Providing the spring 130 between the cover 110 and the head 141 of the fastener 140 (e.g., a spring-loaded screw 134) can provide the benefit of consistent and controllable pressure. The spring 130 can apply a constant force to maintain a firm and uniform contact between the cover 110 and the fastener 140. In addition, providing the spring between the cover 110 and the head of the fastener 140 can allow for easy installation and adjustment of the spring.

[0039] Screws with springs may be generally referred to as "spring loaded screws" or "spring screws". These screws feature a coiled spring integrated into the screw assembly, usually between the screw head and the threaded portion. This arrangement of spring and screw can provide a controlled tension or compression force as the screw is tightened or loosened.

[0040] Figure 1A The spring 130 is shown disposed between the cover 110 and the circuit board 104. Providing the spring 130 in this manner may allow the spring 130 to be more independent of the fastener 140. It may also allow the spring 130 to apply a controlled and specific pressure toward a specific component under the cover 110 (e.g., by using a leaf spring 132), rather than uniformly across the entire cover 110. This may be useful when different components require separate load forces.

[0041] The spring 130 can extend from the fastener 140 to the top of the electrical component 102. Extending the spring 130 between the fastener 140 and the electrical component 102 can enable a secure and stable connection between the two. This arrangement can help improve mechanical stability and apply targeted and adjustable pressure to the electrical component 102.

[0042] The electronic device 100 may be a personal computer, laptop computer, tablet computer, smart phone, or other device that includes an electrical component 102 to be shielded and / or cooled.

[0043] Cover 110 may include an aperture through which fastener 140 extends. This may allow for simplified and straightforward assembly of electronic device 100. It may also simplify repair or replacement of components within the electronic device.

[0044] The opening (e.g., screw hole) can be an opening or perforation in the surface or material of the cover 110, which can be specially designed to accommodate the insertion and tightening of the fastener 140. The opening can be a gap of a specific shape and size, providing a firm and precise positioning for the fastener to be positioned and tightened. The shape of the opening can be circular or cylindrical, matching the shape of the fastener (e.g., the threaded portion of the screw), and can be strategically placed in the cover 110 to align with corresponding holes or features in other components (e.g., leaf spring 132, stud 108, circuit board 104 and / or back plate 106). The opening can allow the fastener to pass through and connect with the structure below, and can achieve firm attachment and assembly of different components. The opening can ensure correct alignment, provide stability, and help to fasten the components, enhancing the overall structural integrity and functionality of the electronic device.

[0045] The opening may be provided in a recess 111 or a protrusion 113 of the cover 110. The recess 111 may refer to a lowered or indented area or cavity intentionally formed on a surface. The recess 111 may be a recessed or depressed portion that deviates from the flat or convex surface of the periphery of the cover 110. The recess 111 of the cover 110 may have a depth equal to or greater than the height of the head 141 of the fastener 140. A recess 111 having a depth equal to or greater than the height of the head 141 of the fastener 140 in the cover 110 may provide a flush or recessed fastener 140 integration. This ensures that the head of the fastener 140 is fully contained in the recess 111, providing a level or lowered surface. This may provide improved aesthetics, reduce the risk of getting stuck or accidentally contacted, and / or prevent the head 141 of the fastener 140 from being potentially damaged or falling off.

[0046] A protrusion may refer to a projection or extension extending outward from the surface of the cover 110, forming a protrusion or projection. The protrusion 113 may provide space for a raised component (e.g., a heat pipe 151 or a component stack with electrical components 102) under the cover 110. The recess or protrusion of the cover 110 may allow the cover 110 to better conform to the component it protects.

[0047] A seal may be disposed between the fastener 140 and the opening. Adding a seal between the fastener 140 and the opening may serve as a barrier to prevent dust, moisture, and / or other contaminants from entering the enclosure. Additionally, the seal may help maintain the integrity of the EMI shield by sealing any potential gaps or openings around the fastener 140, thereby reducing the risk of electromagnetic interference leakage or penetration. This may ensure improved performance, reliability, and / or service life of the electrical components within the enclosure.

[0048] Figure 1A and Figure 1BIt is further shown that the cover 110 can be fixed to the shielding structure 120 by a snap connection 122. The snap connection between the cover 110 and the fence can be very strong and allow easy attachment. The snap mechanism ensures a strong and reliable attachment and provides a consistent and uniform pressure distribution across the contact area, thereby ensuring reliable electromagnetic shielding. The strength of the attachment can be so great that it is impossible to disassemble or remove the cover 110 without failure or without possibly destroying the cover 110. This means that the connection between the cover 110 and the fence by the snap connection 122 can have an excellent ability to withstand membrane loads. In addition, when the cover 110 is tightened to the stack by screws, since the cover 110 is connected to the shielding structure 120 by hard corners and snap connections, the cover 110 can withstand membrane loads during bending.

[0049] Fastener 140 can be a screw, bolt and / or rivet. Screws can provide adjustable tension, easy installation and removal, and / or be compatible with a variety of materials, making them versatile and convenient fasteners in electronic devices. Screws can also apply load forces more consistently. Bolts can provide high strength and high load-bearing capacity, ensuring robust and secure connections in electronic devices that are subject to heavy loads or vibrations. Rivets can provide permanent and tamper-proof fastening. Rivets may be ideal for applications that do not require disassembly or removal, providing enhanced robustness and reliability in electronic devices.

[0050] The spring 130 may be a leaf spring 132. Using a leaf spring 132 may provide flexible shock absorption, uniform pressure distribution, adjustable force, space efficiency, and / or long-term reliability. The leaf spring 132 may be secured to the circuit board 104 by additional or further fasteners. Securing the leaf spring 132 to the circuit board 104 using two or more fasteners provides the benefit of firm and evenly distributed pressure, ensuring a reliable electrical connection and minimizing the risk of intermittent contact or signal interruption within the electronic device 100.

[0051] Shielding structure 120 and cover 110 may be grounded. Grounding cover 110 and shielding structure 120 may provide effective electromagnetic shielding by creating a low impedance path for the dissipation of electromagnetic interference, thereby reducing the risk of EMI-related problems and ensuring proper operation of sensitive electrical components within the device.

[0052] The circuit board 104 may include a stud 108, and wherein the fastener 140 is secured to the stud 108 of the circuit board 104. The stud 108 may refer to a cylindrical component or a threaded rod-shaped component that may protrude from a surface of the circuit board 104 or be embedded within the circuit board 104. The stud 108 may serve as a rigid and secure attachment point for other components, thereby allowing various parts or structures to be connected in a mechanical assembly. The stud 108 may include metal or other strong materials and is typically used in conjunction with a nut, a washer, and / or a threaded connection to provide a reliable and adjustable fastening solution.

[0053] The connection with the studs 108 can allow for enhanced mechanical stability and strength of the fastened connection, particularly in applications where the electronic device 100 may be subject to vibration, shock, and / or external forces. In addition, including the studs 108 in the circuit board 104 can reduce the necessity of a separate backplane 106. This can simplify assembly and potentially save space, resulting in a more efficient and cost-effective design of the electronic device 100.

[0054] A spacer may be disposed between the cover 110 and the circuit board 104, and wherein the fastener 140 extends through the spacer. Adding a spacer between the cover 110 and the stacked components may provide a controllable and consistent separation distance. This may ensure proper alignment, prevent contact or interference between components, and / or maintain desired thermal, electrical, and / or mechanical properties within the stack, enhancing the overall performance and reliability of the electronic device 100.

[0055] The circuit board 104 can be disposed between the cover 110 and the back plate 106. The cover 110 can then be secured to the circuit board 104 and the back plate 106 by fasteners 140. The bottom plate or back plate 106 can increase the rigidity of the package, thereby protecting the internal components from mechanical stress and minimizing the risk of damage. The bottom plate or back plate 106 can also absorb shock, dissipate heat, and / or can assist in electromagnetic interference (EMI) shielding.

[0056] The electrical components 102 may be processors, memory devices, integrated circuits, transistors, and / or power supply units. Common electrical components on the circuit board 104 may cover a variety of devices. These components are essential to the operation of electronic devices, performing functions such as data processing, storage, signal amplification, and / or power regulation. In addition, more than one electrical component 102 may be shielded by a single cover 110 and shielding components (e.g., fences) on the circuit board 104.

[0057] Cover 110 may be an electromagnetic interference cover 110. The EMI cover may include conductive material and is designed to minimize electromagnetic radiation and attenuate external electromagnetic interference. Cover 110 may enclose and shield the processor, thereby preventing electromagnetic waves generated by internal circuits from leaking and interfering with adjacent electrical components. EMI cover 110 may also enclose other electrical components within the electronic package, such as a memory module, a graphics card, and / or a communication module.

[0058] In addition, the EMI cover 110 acts as a barrier to prevent external electromagnetic signals from penetrating the enclosed processor and adversely affecting the sensitive operation of the enclosed processor. This contributes to overall system reliability and performance. The cover 110 includes features such as conductive gaskets or seals to ensure a robust electromagnetic seal between the cover 110 and the surrounding packaging structure. The EMI cover 110 also includes appropriate grounding provisions to establish an electrical connection to the package or system ground to dissipate any residual electromagnetic energy. The EMI cover 110, with its unique structure and materials, represents an effective way to control electromagnetic emissions and improve electromagnetic compatibility within electronic packages, thereby contributing to overall system reliability and performance.

[0059] The shielding structure 120 may be an electromagnetic interference fence. An EMI fence may provide effective protection against electromagnetic interference within an electronic package. By surrounding sensitive components or areas, an EMI fence prevents unwanted electromagnetic signals from entering or leaving the enclosure, thereby ensuring proper function and minimizing interference with other nearby electronic devices. The shielding structure 120 may act as a barrier, reducing the risk of electromagnetic noise and maintaining the integrity of signals and data within the electronic package.

[0060] Further details and aspects are mentioned in conjunction with the embodiments described above or below. Figure 1A , Figure 1B and / or Figure 2 The illustrated examples may include one or more optional additional features that may be combined with the proposed concept or one or more examples described below (e.g., Figure 3-5B ) corresponds to one or more aspects mentioned in the specification.

[0061] Figure 3 A device is shown with a reinforced cover 310 over an electronic assembly with a cooling structure 350 in the form of a heat pipe 351 extending to two fans 353. The figure shows that the cover 310 may include an opening 343 through which a fastener 340 extends. This may allow for simplified and straightforward assembly of the electronic device 300. It may also simplify repair or replacement of components within the electronic device.

[0062] The opening 343 can be provided in the protrusion 313 of the cover 310. The protrusion can provide space for raised components (e.g., heat pipe 351 cooling structure 350) under the cover 310 while allowing the rest of the cover 310 to remain closer to the circuit board 304. The protrusion can also provide a raised area around the opening 343, making it more obvious and easier to locate during assembly or disassembly.

[0063] The cover 310 may have a recess 311. The recess 311 may refer to a lowered or indented area or cavity intentionally formed on a surface. The recess 311 may be a recessed or depressed portion that deviates from the surrounding flat or convex surface. The purposes of the recess 311 may be different, including providing space for component placement, accommodating fasteners, and / or enhancing the overall design or function of the structure. In the case where a load force is applied to the cover 310, the recess 311 with the fastener 340 may also extend the cover 310 downward in the area where the fastener 340 is connected to the circuit board 304, while remaining flat or otherwise arranged in an area where no force is required, thereby allowing better or more targeted application of force to the components or circuit boards 304 below.

[0064] The recess 311 of the cover 310 can have a depth equal to or greater than the height of the head of the fastener 340. Having a recess 311 in the cover 310 having a depth equal to or greater than the height of the head of the fastener 340 can provide flush or recessed integration of the fastener 340. This ensures that the head of the fastener 340 is fully contained in the recess 311, providing a level or lowered surface. This can provide improved aesthetics, reduced risk of catching or accidental contact, and / or enhanced protection against potential damage or dislodging of the head 341 of the fastener 340.

[0065] The recesses or protrusions of the EMI cover 310 can allow the cover 310 to better conform to the components it protects. An EMI cover 310 that closely conforms to the shape and contours of the components it shields can create a more efficient and reliable electromagnetic barrier. This close conformance minimizes gaps and spaces that could potentially allow electromagnetic interference to leak or penetrate, thereby ensuring better shielding performance and reducing the risk of interference affecting sensitive electrical components within the enclosure. In addition, this close conformance can reduce the height of the system by allowing components outside the cover 310 to occupy empty space outside the shield.

[0066] A seal may be disposed between fastener 340 and opening 343. Adding a seal between fastener 340 and opening 343 may serve as a barrier to prevent dust, moisture, and / or other contaminants from entering the enclosure. Additionally, the seal may help maintain the integrity of the EMI shield by sealing any potential gaps or openings around fastener 340, thereby reducing the risk of electromagnetic interference leakage or penetration. This may ensure improved performance, reliability, and / or service life of the electrical components within the enclosure.

[0067] The seal can be an EMI gasket or a conductive coating. An EMI gasket (e.g., a gasket comprising a conductive material) can create a reliable seal around the fastener 340 and the opening 343, effectively preventing electromagnetic waves from entering or leaving the enclosure. Similarly, a conductive coating applied to the seal can provide an additional conductive layer and ensure a continuous conductive path, minimizing the possibility of electromagnetic interference. The combination of the two can optimize the overall shielding effect, maintain the integrity of the enclosure, and protect the enclosed electrical components from harmful electromagnetic waves.

[0068] Further details and aspects are mentioned in conjunction with the embodiments described above or below. Figure 1A , Figure 1B , Figure 2 and / or Figure 3 The illustrated examples may include one or more optional additional features that may be combined with the proposed concept or one or more examples described below (e.g., Figure 4-5B ) corresponds to one or more aspects mentioned in the specification.

[0069] Figure 4 A flow chart of a method 400 for assembling an electronic device is shown. The method includes fixing a shielding structure to a circuit board 410 to at least partially laterally surround an electrical component on the circuit board. The shielding structure may be rigidly fixed to the circuit board. This can provide additional strength for the cover and the system. The method also includes attaching a spring to a fastener 420. The method also includes fixing a cover to a shielding structure 430 and a circuit board 432 so that the cover is fixed to the circuit board using a fastener. Fixing the cover to the shielding structure and the circuit board 430, 432 can provide enhanced structural rigidity for both the circuit board and the components attached to the circuit board below the cover. The cover may be rigidly fixed to the shielding structure. This can provide additional strength for the system by better dispersing the forces acting on the cover to the shielding structure. Compared with the method of not fixing the cover to the shielding structure and the circuit board, the method 400 enables the use of thinner circuit boards, and a smaller backplane or no backplane. In addition, compared with other methods, the method 400 can maintain or reduce the height of the system Z stack (e.g., by supporting the use of thinner components or removing some components, such as backplanes). The method 400 may also maintain or reduce system weight (eg, by favoring the use of lighter components or removing some components, such as a backplane).

[0070] Method 400 may also include fastening the fastener to circuit board 436 by connection to the studs on the first side of the circuit board and / or to the back plate adjacent to the second side of the circuit board. This may be optionally done when the cover is fixed to the circuit board 432. Fastening the fastener to the studs or back plate can improve the structural stability and integrity of the electronic package, ensuring a secure and reliable attachment of the assembly. This enhanced fastening mechanism can minimize the risk of loosening or falling off, providing a robust and durable assembly that can withstand various mechanical stresses and vibrations. In addition, fastening the fastener to the studs or back plate provides easy assembly during the manufacturing process, and can improve maintenance and repair processes. Other methods of fixing the cover to the shielding structure and the circuit board may have an increased risk of failure at the edge of the rigid back plate due to a narrower stiffness transition zone. Compared with these methods, the present method can reduce the pressure on any transition area of ​​the back plate, thereby reducing the risk of failure. Since the cover is attached to the shielding structure (e.g., a fence), the cover transfers a portion of the load to a structure closer to the fastener (e.g., a mounting screw), thereby reducing board deflection.

[0071] The method 400 may further include providing a cooling structure 424 between the cover and the circuit board, and securing the cooling structure to the circuit board 434 using fasteners. If a spring is also attached to the cooling structure (e.g., using a leaf spring under the cover), providing the cooling structure 424 may optionally be done when the spring is attached to the fastener 420. Or it may optionally be done before securing the cover to the shielding structure 430 and the circuit board 420. Providing the cooling structure 424 in the electronic device may improve the thermal management capabilities of the electronic package.

[0072] The method may also include providing a spring to apply a load force to drive the cooling structure toward the top of the electrical component 423. This improves the contact and interface between the cooling structure and the component it is intended to cool. The applied load force helps to establish and maintain a consistent and reliable thermal interface, minimizing air gaps and thermal resistance. As a result, the cooling structure can effectively remove heat from the component, optimize its performance, and prevent overheating related problems.

[0073] The method 400 may also include placing a spring between the cover and the head of the fastener 425. This can evenly distribute the load, ensuring uniform pressure and contact between the cover and the fastener. The spring also helps absorb vibration and shock, and provides flexibility for expansion (such as expansion due to thermal changes).

[0074] The method 400 may also include placing springs between the cover and the circuit board 427. This can direct the load to the individual components of the circuit board. The springs can also better absorb shock and vibration, reducing the risk of mechanical stress and damage to the circuit board.

[0075] The method 400 may also include forming an opening in the cover 412, wherein the fastener extends through the opening. This may optionally be done in any processing step before the cover is secured to the circuit board 432 using the fastener. Forming the opening in the cover 412 may allow for easier assembly of the electronic package and ensure accurate positioning and alignment of the fastener. The opening also provides versatility in accommodating screws of different sizes and types, providing options for customization and adaptability during the assembly process.

[0076] The method 400 may further include securing the cover to the shield structure 430 via a snap-fit ​​connection. The snap-fit ​​connection may provide a secure and reliable closure, as well as provide additional strength over other possible connection options (eg, thermal bonding).

[0077] The method 400 may also include grounding the shielding structure and the cover 440. This creates a conductive path that allows EMI and static charge to be dissipated. By grounding both the shielding structure and the cover, any stray EMI or charge can be effectively redirected to ground, minimizing the risk of interference and electrical damage to internal components. In addition, grounding improves the overall electromagnetic compatibility (EMC) of the electronic device, ensures compliance with regulatory standards, and reduces the likelihood of performance issues or failures caused by EMI. Finally, grounding enhances safety by providing a controlled path for electrical current, reducing the risk of electric shock or harm to users and nearby components.

[0078] The method 400 may also include attaching a spacer to the fastener 429 such that the spacer is disposed between the cover and the circuit board. This may allow for a controlled and consistent gap or distance between the cover and the circuit board. The gap may prevent pressure applied by the fastener from directly contacting the circuit board and avoiding potential damage to the circuit board. The spacer may act as a buffer, absorbing shock and vibration, thereby reducing the risk of mechanical stress or shock-related issues. Additionally, the spacer may assist in thermal management by forming a small air gap or allowing for the integration of additional thermal interface materials, thereby improving heat dissipation and temperature regulation within the electronic package.

[0079] Further details and aspects are mentioned in conjunction with the embodiments described above or below. Figure 4 The illustrated examples may include one or more optional additional features corresponding to one or more aspects mentioned in connection with the proposed concept or one or more examples described above or below.

[0080] Figure 5A and Figure 5B A simulation of the load on a circuit board (PCB) 500 without a reinforcement cover and with a reinforcement cover 510 is shown. While differences between the embodiments can be seen, they can have a significant impact on the stiffness of the system. Figure 5AIn the embodiment, fasteners or screws secure the electrical components to the PCB (as shown in 512) below the EMI shield, while in Figure 5B In the example, fasteners 540 or screws pass through the EMI shield to secure the assembly to the PCB. In simulation results under a 1 / 2 lbf load, it is shown that the shield connection increases stiffness by 50% (in the die area). Both the CPU and GPU dies were three-point bent, and the improvement in bending can be seen in Table 1 below.

[0081]

[0082] Table 1: Three-point bending results at 3kgf (6.6lbf) load

[0083] The aspects and features described with respect to a specific example in the foregoing examples may also be combined with one or more further examples to replace the same or similar features of the further examples, or to additionally introduce these features into the further examples.

[0084] Examples may also be or may relate to a (computer) program including a program code, and when the program is executed on a computer, a processor or other programmable hardware component, the program code executes one or more of the above methods. Therefore, the steps, operations or processes of the different methods in the above methods may also be performed by a programmed computer, a processor or other programmable hardware component. Examples may also cover program storage devices, such as digital data storage media, which are machine, processor or computer readable and encode and / or contain machine executable, processor executable or computer executable programs and instructions. For example, program storage devices may include or may be digital storage devices, magnetic storage media (e.g., disks and tapes), hard drives, and / or optically readable digital data storage media. Other examples may also include computers, processors, control units, (field) programmable logic arrays ((F)PLA), (field) programmable gate arrays ((F)PGA), graphics processor units (GPUs), application specific integrated circuits (ASICs), integrated circuits (ICs), or system-on-chip (SoC) systems that are programmed to perform the steps of the above methods.

[0085] It should also be understood that the disclosure of several steps, processes, operations or functions in the specification or claims should not be interpreted as implying that these operations necessarily rely on the order described, unless explicitly stated in individual cases or necessary for technical reasons. Therefore, the foregoing description does not limit the execution of several steps or functions to a specific order. In addition, in further examples, a single step, function, process or operation may include and / or be decomposed into several sub-steps, sub-functions, sub-processes or sub-operations.

[0086] If some aspects have been described with respect to a device or system, these aspects should also be understood as descriptions of corresponding methods. For example, a block, device, or functional aspect of a device or system may correspond to a feature of a corresponding method, such as a method step. Therefore, aspects described with respect to a method should also be understood as descriptions of corresponding blocks, corresponding elements, attributes, or functional features of a corresponding device or corresponding system.

[0087] An example (e.g., Example 1) electronic device includes a shielding structure that at least partially laterally surrounds an electrical component on a circuit board. The device also includes a cover fixed to the top of the shielding structure and covering the electrical component, a spring that directly or indirectly applies a load force to the electrical subassembly, and a fastener that fixes the cover and the spring to the circuit board.

[0088] Another example (eg, Example 2) relates to the previously described example (eg, Example 1), further including a cooling structure, wherein the cooling structure is disposed between the cover and the circuit board.

[0089] Another example (eg, Example 3) relates to the previously described examples (eg, Example 2), wherein the load force drives the cooling structure toward the top of the electrical component.

[0090] Another example (eg, Example 4) relates to the previously described examples (eg, one of Examples 2-3), wherein the cooling structure extends from the top of the electrical component through an opening in the shield structure or an opening between the shield structure and the cover.

[0091] Another example (eg, Example 5) relates to a previously described example (eg, one of Examples 2-4), wherein the cooling structure extends to the fan.

[0092] Another example (e.g., Example 6) relates to the previously described examples (e.g., one of Examples 2-5), wherein the cooling structure is at least one of the following: a thermal interface material; a vapor chamber; a heat pipe; a liquid cooling system; a phase change cooling system; and / or a cold plate.

[0093] Another example (eg, Example 7) relates to the previously described examples (eg, one of Examples 2-6), wherein the spring applies a load force to the cover and urges the cooling structure toward the top of the electrical component through the cover.

[0094] Another example (eg, Example 8) relates to the previously described example (eg, one of Examples 1-7), wherein the spring is disposed between the cover and the head of the fastener.

[0095] Another example (eg, Example 9) relates to the previously described example (eg, one of Examples 1-7), wherein a spring is disposed between the cover and the circuit board.

[0096] Another example (eg, Example 10) relates to the previously described examples (eg, Example 9), wherein the spring extends from the fastener to the top of the electrical component.

[0097] Another example (eg, Example 11) relates to the previously described examples (eg, one of Examples 1-10), wherein the cover includes an opening, wherein the fastener extends through the opening.

[0098] Another example (eg, Example 12) relates to the previously described example (eg, Example 11), wherein the opening is provided in a recess of the cover.

[0099] Another example (eg, Example 13) relates to the previously described example (eg, Example 12), wherein the recess of the cover has a depth equal to or greater than the height of the head of the fastener.

[0100] Another example (eg, Example 14) relates to the previously described example (eg, Example 11), wherein the opening is provided in the protrusion.

[0101] Another example (eg, Example 15) relates to the previously described examples (eg, one of Examples 11-14), further comprising a seal between the fastener and the opening.

[0102] Another example (eg, Example 16) relates to the previously described examples (eg, Example 15), wherein the seal includes at least one of an EMI gasket and / or a conductive coating.

[0103] Another example (eg, Example 17) relates to a previously described example (eg, one of Examples 1-16), wherein the cover is secured to the shielding structure by a snap connection.

[0104] Another example (eg, Example 18) relates to the previously described example (eg, one of Examples 1-17), wherein the fastener is at least one of a screw, a bolt, and / or a rivet.

[0105] Another example (eg, Example 19) relates to the previously described example (eg, one of Examples 1-18), wherein the spring is a leaf spring.

[0106] Another example (eg, Example 20) relates to the previously described example (eg, Example 19), wherein another fastener secures the leaf spring to the circuit board.

[0107] Another example (eg, Example 21) relates to the previously described example (eg, one of Examples 1-20), wherein the shielding structure and the cover are grounded.

[0108] Another example (eg, Example 22) relates to the previously described example (eg, one of Examples 1-21), wherein the circuit board includes a stud, and wherein the fastener is secured to the stud of the circuit board.

[0109] Another example (eg, Example 23) relates to the previously described examples (eg, one of Examples 1-22), further comprising a spacer, wherein the spacer is disposed between the cover and the circuit board, and wherein the fastener extends through the spacer.

[0110] Another example (e.g., Example 24) relates to the previously described examples (e.g., one of Examples 1-23), and also includes a backplate, wherein the circuit board is disposed between the cover and the backplate, wherein the cover is secured to the circuit board and the backplate by fasteners.

[0111] Another example (eg, Example 25) relates to the previously described example (eg, one of Examples 1-24), wherein the electrical component is at least one of a processor, a memory device, an integrated circuit, a transistor, and / or a power supply unit.

[0112] Another example (eg, Example 26) relates to a previously described example (eg, one of Examples 1-25), wherein the cover is an electromagnetic interference cover.

[0113] Another example (eg, Example 27) relates to a previously described example (eg, one of Examples 1-26), wherein the shielding structure is an electromagnetic interference fence.

[0114] One embodiment (e.g., Example 28) is a method for assembling an electronic device, comprising securing a shielding structure to a circuit board to at least partially laterally surround an electrical component on the circuit board. The method further comprises attaching a spring to a fastener and securing a cover to the shielding structure and the circuit board, wherein the cover is secured to the circuit board using the fastener.

[0115] Another example (e.g., Example 29) relates to the previously described examples (e.g., Example 28), wherein the fastener is secured to the circuit board via at least one of a connection to a stud on a first side of the circuit board and / or a connection to a backplane adjacent to a second side of the circuit board.

[0116] Another example (eg, Example 30) relates to the previously described example (eg, one of Examples 28-29), further comprising disposing a cooling structure between the cover and the circuit board, and securing the cooling structure to the circuit board using a fastener.

[0117] Another example (eg, Example 31) relates to the previously described examples (eg, one of Examples 28-30), wherein the spring is arranged to apply a load force to urge the cooling structure toward the top of the electrical component.

[0118] Another example (eg, Example 32) relates to the previously described examples (eg, one of Examples 28-31), wherein the spring is disposed between the cover and the head of the fastener.

[0119] Another example (eg, Example 33) relates to the previously described example (eg, one of Examples 28-31), wherein a spring is disposed between the cover and the circuit board.

[0120] Another example (eg, example 34) relates to the previously described examples (eg, one of examples 28-33), further comprising forming an opening in the cover, wherein the fastener extends through the opening.

[0121] Another example (eg, Example 35) relates to the previously described examples (eg, one of Examples 28-34), further comprising securing the cover to the shielding structure via a snap-fit ​​connection.

[0122] Another example (eg, Example 36) relates to the previously described example (eg, one of Examples 28-35), further comprising grounding the shielding structure and the cover.

[0123] Another example (eg, Example 37) relates to a previously described embodiment (eg, one of Examples 28-36), further comprising attaching a spacer to the fastener, wherein the spacer is disposed between the cover and the circuit board.

[0124] The following claims are hereby incorporated into the detailed description, where each claim may stand on its own as a separate example. It should also be noted that although in the claims a dependent claim refers to a specific combination with one or more other claims, other examples may also include a combination of a dependent claim with the subject matter of any other dependent or independent claim. Such combinations are expressly proposed herein, unless it is stated in individual cases that a specific combination is not intended. Furthermore, features of a claim shall also be included in any other independent claim, even if the claim is not directly qualified as dependent on the other independent claim.

Claims

1. An electronic device, comprising: a shield structure at least partially laterally surrounding an electrical component on the circuit board; a cover, fixed to the top of the shielding structure and covering the electrical components; a spring, directly or indirectly applying a load force to the electrical component; a cooling structure, wherein the cooling structure is disposed between the cover and the circuit board, and A fastener fixes the cover and the spring to the circuit board.

2. The electronic device according to claim 1, wherein: The load force urges the cooling structure toward the top of the electrical component.

3. The electronic device according to claim 2, wherein: The cooling structure extends from a top of the electrical component through an opening in the shield structure or an opening between the shield structure and the cover.

4. The electronic device according to claim 3, wherein: The cooling structure extends to the fan.

5. The electronic device according to claim 1, wherein: The cooling structure is at least one of the following: Thermal interface materials; Steam room; Heat pipes; Liquid cooling system; Phase change cooling system; and / or Cold plate.

6. The electronic device according to claim 1, wherein: The spring applies the load force to the cover and urges the cooling structure through the cover toward the top of the electrical component.

7. The electronic device according to claim 1, wherein: The spring is disposed between the cover and the head of the fastener.

8. The electronic device according to claim 1, wherein: The spring is disposed between the cover and the circuit board.

9. The electronic device according to claim 1, wherein: The cover includes an opening, wherein the fastener extends through the opening.

10. The electronic device according to claim 9, wherein: The opening is provided in a recess of the cover.

11. The electronic device according to claim 10, wherein: The recess of the cover has a depth equal to or greater than the height of the head of the fastener.

12. The electronic device according to claim 1, wherein: The cover is secured to the shielding structure by a snap connection.

13. The electronic device according to claim 1, wherein: The fastener is at least one of the following: Screws; Bolts; and / or rivet.

14. The electronic device according to claim 1, wherein: The spring is a leaf spring.

15. The electronic device according to claim 14, wherein: Another fastener secures the leaf spring to the circuit board.

16. The electronic device according to claim 1, wherein: The circuit board includes a stud, and wherein the fastener is secured to the stud of the circuit board.

17. The electronic device of claim 1, further comprising a back plate, wherein the circuit board is disposed between the cover and the back plate, wherein the cover is secured to the circuit board and the back plate by the fastener.

18. The electronic device according to claim 1, wherein: The cover is an electromagnetic interference cover.

19. The electronic device according to claim 1, wherein: The shielding structure is an electromagnetic interference fence.

20. A method for assembling an electronic device, the method comprising: securing a shield structure to a circuit board to at least partially laterally surround an electrical component on the circuit board; attaching the spring to the fastener; providing a cooling structure between the cover and the circuit board; securing the cover to the shielding structure; as well as The cover and the cooling structure are secured to the circuit board, wherein the cover and the cooling structure are secured to the circuit board using the fastener.

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