Probe with planar non-biased spring element for electronic component contact, method of making such probe, and method of using such probe

Abstract

A method of forming a probe (3500) includes providing a first probe module (3500-U) and a second probe module (3500-L), the first and second probe modules having respective flexible elements (3521-U, 3521-L) that functionally link respective probe arms that directly or indirectly hold first and second ends (3531-U, 3531-L), the first and second probe modules (3500-U, 3521-L) having respective flexible elements (3521-U, 3521-L) functionally connecting respective flexible elements (3521-U, 3521-L), the respective flexible elements (3521-U, 3521-L) functionally connecting respective flexible elements (3521-U, 3521-L). And forming the probe by aligning the first and second probe modules laterally and longitudinally with their respective ends directed away from each other.

Description

[0001] Related Applications

[0002] This application claims priority to and the benefit of the filing dates of U.S. patent application serial number 18 / 295,755, filed on April 4, 2023, and U.S. provisional patent application serial number 63 / 335,885, filed on April 28, 2022, the entire disclosures of which are incorporated herein by reference in their entirety. Technical Field

[0003] Embodiments of the present invention relate to microprobes (e.g., for wafer-level testing or socket testing of integrated circuits, or for making electrical connections to PCBs or other electronic devices), and more particularly, to pin-shaped microprobes (i.e., microprobes having a vertical or longitudinal height that is greater than its width (e.g., 5 times in some embodiments, 10 times in other embodiments, and 20 times in yet other embodiments)) or button-shaped probes, wherein the spring element has a planar configuration in an unbiased state. In some embodiments, the microprobes are at least partially made by an electrochemical manufacturing process, more particularly, by a multi-layer, multi-material electrochemical manufacturing process, and wherein, in some embodiments, multiple probes are put into use while maintaining an array structure, the array structure comprising one or more plates having through holes that engage features of the probes and / or other array holding structures. Background Art

[0004] Probe:

[0005] Many electrical contact probes and pin configurations have been used or proposed commercially, some of which may conform to the prior art, while others do not. For example, examples of such pins, probes, and methods of manufacture are described in patent publications US 2005-0104609, US 2006-0006888, US 2005-0184748, US 2006-0108678, US 2006-0238209, and patents US 7,640,651, US 7,265,565, US 7,412,767, US 7,273,812, US 10,215,775, US 11,262,383.

[0006] Electrochemical Manufacturing:

[0007] Electrochemical fabrication techniques for forming three-dimensional structures from multiple adhered layers have been or are being developed by Microfabric in Van Nuys, California. ® Inc. (formerly MEMGen Corporation) under the process names EFAB and MICAFREEFORM ® Carry out commercial development.

[0008] Various electrochemical manufacturing techniques are described in U.S. Patent No. 6,027,630 issued February 22, 2000 to Adam Cohen.

[0009] Another method of forming microstructures using electrochemical fabrication techniques is taught in U.S. Patent No. 5,190,637 to Henry Guckel, entitled “Formation of Microstructures by Multiple Level Deep X-ray Lithography with Sacrificial Metal Layers”.

[0010] Electrochemical manufacturing provides the ability to form prototypes and commercial quantities of miniature objects, parts, structures, devices, and the like at reasonable cost and in reasonable time. In fact, electrochemical manufacturing is the enabler for the formation of many structures that have heretofore been impossible to make. Electrochemical manufacturing opens the door to new designs and products in many industrial fields. Although electrochemical manufacturing provides this new capability, and it is understood that electrochemical manufacturing techniques can be combined with known designs and structures in various fields to make new structures, certain uses of electrochemical manufacturing provide designs, structures, capabilities, and / or features that are unknown or not obvious in the prior art.

[0011] There is a need in various fields for microdevices with improved properties, reduced manufacturing time, reduced manufacturing costs, simplified manufacturing processes, greater versatility in device design, improved material selection, improved material properties, more cost-effective and lower risk manufacturing of such devices, and / or greater independence between geometric configuration and selected manufacturing process. Summary of the invention

[0012] Some embodiments of the present invention aim to provide an improved probe array, the probe array comprising a probe, the probe comprising a flexible element formed by a plurality of flexible modules, the flexible modules comprising a planar but nonlinear (i.e. non-straight) spring structure when unbiased (i.e. the spring structure is not a straight rod without bends or angles, but has a certain two-dimensional structure in the plane of at least one layer providing bends or curves), wherein the plane of the spring is perpendicular to the longitudinal axis of the probe and provides flexibility along the longitudinal axis of the probe, wherein the flexible modules are stacked in series. The probe with nonlinear spring structure can provide a linear spring rebound force or a nonlinear rebound force when biased.

[0013] In another aspect of the present invention, a method for forming a probe comprises: (a) providing a first probe module, the first probe module comprising at least one first bracket and at least one first flexible element, the at least one first flexible element providing flexibility in a direction substantially perpendicular to a planar configuration by comprising a two-dimensional substantially planar spring when not biased, wherein a first portion of the first flexible element is functionally coupled to the at least one first bracket and a second portion of the first flexible element is functionally coupled to a first end arm capable of elastically moving relative to the bracket, wherein the first end arm directly or indirectly holds a first end end portion, and when the first flexible element is not biased, the first end end portion longitudinally extends beyond the first end portion of the at least one first bracket; and (b) providing a second probe module, the second probe module comprising at least one first bracket and at least one second flexible element, the at least one second The flexible element provides flexibility in a direction substantially perpendicular to the planar structure by including a spring, wherein a first portion of the second flexible element is functionally connected to the at least one second bracket and a second portion of the second flexible element is functionally connected to a second end arm capable of elastically moving relative to the bracket, wherein the second end arm directly or indirectly holds a second end end portion, and when the second flexible element is not biased, the second end end portion extends longitudinally beyond the second end portion of the at least one second bracket; and (c) aligning the first and second modules laterally and longitudinally, wherein their respective ends point away from each other in substantially opposite longitudinal directions, so that at least one first bracket of the first probe module and at least one second bracket of the second probe module are directly or indirectly connected to each other so as to space the at least one first flexible element from the at least one second flexible element.

[0014] Many variations of the above-described aspects of the present invention exist and will be apparent to those skilled in the art after reading the teachings herein.

[0015] In particular, alternative embodiments include, for example: (1) at least one of the first and second probe modules further includes a base, to which the corresponding at least one bracket is connected, wherein the base is located between the at least one first bracket and the at least one second bracket; (2) as a separate aspect or in combination with the first variant, wherein the connection of the probe modules includes elements selected from the group consisting of: (A) applying an adhesive material to at least one of the first and second modules and then using the adhesive material to connect the modules to each other; (B) applying an adhesive material to at least one of the probe modules during a layer-by-layer formation process for constructing the corresponding probe module, Thereafter, the probe modules are joined; (C) the first and second probe modules are joined using ultrasonic welding; (D) the first and second probe modules are joined using laser welding, (E) the first and second probe modules are joined using a hard soldering process; (F) the probe modules are joined using a soft soldering process; (G) the first and second probe modules are at least temporarily joined to each other using friction between features of the first module and features of the second module; (H) the first and second modules are at least temporarily joined to each other using at least one movement selected from the group consisting of: (i) lateral movement, (ii) longitudinal movement, (iii) rotational movement, and (iv) these (i) at least temporarily coupling the first and second probe modules to each other using at least one motion selected from the group consisting of: (i) lateral motion, (ii) longitudinal motion, (iii) rotational motion, and (iv) a combination of these motions, wherein interlocking of the first and second probe modules occurs via engagement of one or more recessed features; (j) at least temporarily coupling the first and second probe modules to each other using at least one motion selected from the group consisting of: (i) lateral motion, (ii) longitudinal motion, (iii) rotational motion, and (iv) a combination of these motions, wherein interlocking of the first and second probe modules occurs via engagement of one or more recessed features; interlocking the first and second probe modules occurs via engagement of one or more interfering features; and (K) at least temporarily coupling the first and second probe modules to each other using at least one motion selected from the group consisting of: (i) lateral motion, (ii) longitudinal motion, (iii) rotational motion, and (iv) a combination of these motions, wherein the interlocking of the first and second probe modules occurs via engagement of a resiliently flexible element on one probe module with a feature on the other probe module, wherein the engagement is selected from the group consisting of: (i) features interfering with each other, (ii) features recessed relative to each other, and (iii) features frictionally engaging with each other;(3) As an aspect alone or in combination with one or more of the preceding variations, at least one feature on one probe module contacts at least one feature on another probe module to provide a fixed joint position of the modules; (4) A third variation in which at least one feature on one probe module includes a plurality of features and at least one feature on the other probe module provides a plurality of features, wherein the plurality of features provide hard stops; (5) A fourth variation in which the plurality of features on each probe module includes at least three features on each probe module; (6) A fifth variation in which the at least three features on each probe module includes at least four features on each probe module; (7) A fourth variation in which the plurality of features providing the plurality of hard stops provide alignment stops along: (A) at least one lateral direction; (B) at least one longitudinal direction; (C) at least one direction at at least two separation points, the at least two separation points are not aligned with the at least one direction; (D) at least one direction at at least three separation points, the at least three separation points are not co-linear and no pair of points are aligned with the at least one direction; (E) at least two perpendicular lateral dimensions; (F) two perpendicular directions; (G) at least one direction and one rotation; (H) at least two perpendicular directions and at least one rotation; (I) at least three perpendicular directions and at least one rotation; (J) at least one direction and at least two perpendicular rotations; and (K) at least one direction and three perpendicular rotations; (8) a probe having the structural features of any of the above aspects or previous variations; (9) an array of probes having the eighth variation; and (10) the ninth variation, wherein the array comprises a plurality of spatially and oriented probes. ;

[0016] Those skilled in the art will understand other aspects of the present invention after reading the teachings herein. Other aspects of the present invention may relate to combinations of the above aspects. These other aspects of the present invention may provide various combinations of the above aspects, and may provide other configurations, structures, functional relationships and processes that are not specifically described above but are described herein, by the overall teachings of this specification, or by the teachings incorporated herein by reference. BRIEF DESCRIPTION OF THE DRAWINGS

[0017] 1A-1F schematically depict the use of adhesion mask plating to form a first layer of a structure, wherein a blanket deposition of a second material covers both openings between deposition locations of the first material and the first material itself.

[0018] FIG. 1G depicts the formation of the first layer completed by planarizing the deposited material to the desired level.

[0019] 1H and 1I depict process states after forming multiple layers of a structure and after releasing the structure from a sacrificial material, respectively.

[0020] Figure 2 Depicted is an isometric view of an exemplary spring module or flexible module having two connected spring elements, a base, and a connecting support or bracket that may be used in or as a probe.

[0021] Figure 3 Depicted is an isometric view of a second exemplary spring module or flex module similar to Figure 2 A module which can be used in or as a probe, except that the two spring elements are thicker and thus provide a greater Figure 2 The element has a larger spring constant.

[0022] Figure 4A- Figure 4D4 Various views are provided of a probe according to another embodiment of the present invention, wherein the probe is formed from two modules back to back and the two modules share a common base which also serves as a stand and has an annular configuration.

[0023] Fig.4E1 Figures 4A to 4B are provided. Figure 4D4 Side view of a probe showing the 17 sample levels from which the probe can be made, where not all layers have a unique configuration.

[0024] Figure 4E2-A to Figure 4E9-B A cross-sectional configuration shown in both a top view (-A) and an isometric view (-B) of the unique configuration of layers L1-L17 is shown, wherein: Fig.4E2-A and FIG. 4E2-B shows a view of layers L1 and L17; Fig.4E3-A and Figure 4E3-B A view of layers L2, L4, L6 and L8 is shown; Figure 4E4-A and Figure 4E4-B A view of layers L3 and L7 is shown; Figure 4E5-A and Figure 4E5-B A view of layer L5 is shown; Fig.4E6-A and Figure 4E6-B A view of layer L9 is shown; Figure 4E7-A and Figure 4E7-B A view of layers L10, L12, L14 and L16 is shown; Figure 4E8-A and Figure 4E8-B A view of layers L11 and L15 is shown; Figure 4E9-A and Figure 4E9-B A view of layer L13 is shown.

[0025] Figure 5A and Figure 5B According to another embodiment of the present invention, before assembling ( Figure 5A ) and as assembled probes ( Figure 5B) isometric view of two oppositely oriented probe modules, wherein the probe is formed as two separate probe modules having the same or different orientations, which are then assembled in a base-to-base manner, with one probe module having a downward facing end and the other probe module having an upward facing end, wherein each probe module is formed with its own corresponding end, end arm, planar spring element, bracket, and base, and wherein each module can be identical or have different features.

[0026] Fig. 6A and Figure 6B According to another embodiment of the present invention, before assembling ( Fig. 6A ) and as assembled probes ( Figure 6B ), wherein the probes are formed as two separate probe modules having the same or different orientations, which are then assembled so that one probe module has an end facing downward and the other probe module has an end facing upward, wherein each module is formed with its own respective end, end arm, planar spring element, and bracket, and wherein according to this embodiment, only one probe module is formed with a base connected to its bracket.

[0027] Figure 7A1-Figure 7C Views are provided of a probe module or a probe assembled from the probe module according to another embodiment of the present invention, wherein none of the probe modules include a base, but a bracket having a configuration capable of being mated from one probe module to another is provided.

[0028] Figure 8A-8C An isometric view of two probe modules in various states of assembly is provided in creating a probe according to another embodiment of the present invention, wherein Fig. 8A The example illustrates the transverse alignment of the probe modules, wherein the moving arrows illustrate the need for transverse separation followed by longitudinal alignment to produce Figure 8B The assembled state shown in the example, Figure 8B This example also illustrates the need for opposite lateral movement to provide such Figure 8C The lateral alignment and mating illustrated in the example, wherein one probe module is provided with a base having a narrow engagement groove, and the other probe module is provided with a base supporting a top cover structure, wherein the top cover structure is separated from the base by a narrower neck area to form an undercut area between the top cover and the base, and the undercut area can effectively engage and retain the base having a slotted structure of the other probe module to provide longitudinal retention.

[0029] Figure 9A-9C A method similar to that for creating a probe according to another embodiment of the present invention is provided. Figure 8A-8CA view of a view of a lower probe module similar to FIG. 1 except that the cap structure attached to the narrower neck portion of the lower probe module has been replaced by a spring element. Figure 8A-8C The spring element may provide a stable lateral connection to the upper probe module for electrical and mechanical purposes without the need for bonding operations or inclusion of other structures which may still be optionally used.

[0030] Figure 10A-10C A method similar to that for creating a probe according to another embodiment of the present invention is provided. Figure 8A-8C and Figure 9A-9C A view of a view of a lower probe module similar to the one shown in FIG. 1 is provided, wherein the probe module is similar to the one shown in FIG. 1 except that the top cover structure of the lower probe module has been modified to have an oblong shape. Figure 8A-8C A probe module, wherein the narrow slot in the upper probe module is a hole or opening having a shape complementary to the oblong shape of the top cover structure but slightly larger in size to allow the top cover structure to be inserted through the opening so as to allow the narrower neck portion and the opening to be at the same longitudinal level so that opposite relative rotational movement of the probe modules about the longitudinal axis of the probe can cause the oblong-shaped top cover structure of the lower probe module to cover the structure surrounding the narrow portion of the opening in the upper probe module so as to interlock the probe modules. DETAILED DESCRIPTION

[0031] Electrochemical Manufacturing Overview

[0032] Figures 1A to 1I show side views of various states in an exemplary multi-layer, multi-material electrochemical manufacturing process. Figures 1A to 1G show various stages of single-layer formation of a multi-layer manufacturing process, in which a second metal is deposited on a first metal and in an opening in the first metal so that the first and second metals form part of the layer. In Figure 1A, a side view of a substrate 82 having a surface 88 is shown, on which a patternable photoresist 84 is located as shown in Figure 1B. In Figure 1C, a resist pattern resulting from curing, exposure, and development of the resist is shown. The patterning of the photoresist 84 results in openings or holes 92 (a)-92 (c) extending from the surface 86 of the photoresist through the thickness of the photoresist to the surface 88 of the substrate 82. In Figure 1D, a metal 94 (e.g., nickel) is shown as having been electroplated into the openings 92 (a)-92 (c). In FIG. 1E , the photoresist has been removed from the substrate (i.e., chemically or otherwise stripped) to expose areas on the substrate 82 that are not covered by the first metal 94. In FIG. 1F , a second metal 96 (e.g., silver) is shown as being blanket plated over the entire exposed portion of the substrate 82 (which is conductive) and the first metal 94 (which is also conductive). FIG. 1G depicts the completed first layer of the structure, which is formed by planarizing the first and second metals to a height that exposes the first metal and setting a thickness for the first layer. In FIG. 1H , the result of repeating the process steps shown in FIGS. 1B to 1G multiple times to form a multi-layer structure is shown, wherein each layer is composed of two materials. For most applications, one of these materials is removed, as shown in FIG. 1I , to produce a desired 3D structure 98 (e.g., a device or apparatus) or multiple such structures.

[0033] Various embodiments of various aspects of the present invention relate to forming three-dimensional structures from materials, some or all of which may be electrodeposited or electroless deposited (as shown in the examples of FIGS. 1A to 1I and discussed in various patent applications incorporated herein by reference). Some of these structures may be formed from a single build level formed from one or more deposited materials, while other structures are formed from multiple build layers, each layer including at least two materials (e.g., two or more layers, more preferably five or more layers, most preferably ten or more layers). In some embodiments, the layer thickness may be as small as one micron or as large as fifty microns. In other embodiments, thinner layers may be used, while in other embodiments, thicker layers may be used. In some embodiments, the microscale structures have lateral features positioned with precision on the order of 0.1 to 10 microns, with minimum feature sizes on the order of a few microns to tens of microns. In other embodiments, structures with less precise feature placement and / or larger minimum features may be formed. In yet other embodiments, higher precision and smaller minimum feature sizes may be desired. In this application, mesoscale and millimeter scale have the same meaning and refer to devices that may have one or more such dimensions, which may extend to the range of 0.5 to 50 mm or larger, with positioning accuracy of features in the range of microns to 100 microns, and minimum feature size on the order of tens of microns to hundreds of microns.

[0034] Various embodiments, alternatives, and techniques disclosed herein may form a multilayer structure using a single patterning technique on all layers or using different patterning techniques on different layers. For example, various embodiments of the present invention may use conformal contact masks and masking operations (i.e., operations using a mask that contacts but does not adhere to a substrate), proximity masks and masking operations (i.e., operations using a mask that selectively shields a substrate at least partially through its proximity to the substrate even without contact), non-conformal masks and masking operations (i.e., masks whose contact surfaces are not significantly conformal and operations based on such masks), and / or adhesion masks and masking operations (masks that adhere to a substrate and operations using such masks, selective deposition or etching will occur on the substrate, rather than just in contact with the substrate) to perform selective patterning operations. Conformal contact masks, proximity masks, and non-conformal contact masks share the characteristic that they are pre-formed and brought to or near the surface to be processed (i.e., the exposed portion of the surface to be processed). These masks can generally be removed without damaging the mask or the surface to which it contacts or is near to be processed. Adhesion masks are typically formed over the surface to be treated (i.e., the portion of the surface to be masked) and bonded to that surface such that they cannot be separated from that surface unless completely destroyed or damaged beyond any point of repeated use. Adhesion masks can be formed in a variety of ways, including: (1) by applying a photoresist, selectively exposing the photoresist, and then developing the photoresist; (2) by selectively transferring a pre-patterned mask material; and / or (3) by directly forming the mask by computer-controlled deposition of material. In some embodiments, the adhesion mask material can be used as a sacrificial material for a layer, or can be used only as a mask material that is replaced by another material (e.g., a dielectric or conductive material) before completing the formation of the layer, where the replacement material will be considered the sacrificial material of the corresponding layer. The mask material may or may not be planarized before or after depositing the material into the voids or openings included therein.

[0035] Patterning operations can be used to selectively deposit materials and / or can be used for selective etching of materials. Selectively etched areas can be selectively filled with different desired materials or filled by blanket deposition, etc. In some embodiments, layer-by-layer construction may involve forming portions of multiple layers at the same time. In some embodiments, deposition associated with certain levels may result in deposition into areas associated with other levels (i.e., areas within the top and bottom boundary levels that define the geometric configuration of different layers). Smalley describes this use of selective etching and / or interlaced material deposition associated with multiple layers in U.S. Patent Application No. 10 / 434,519 filed on May 7, 2003, which is currently U.S. Patent No. 7,252,861, entitled "Methods of and Apparatus for Electrochemically Fabricating Structures Via Interlaced Layers or Via Selective Etching and Filling of Voids". The cited application is incorporated herein by reference.

[0036] The temporary substrate upon which the structure may be formed may be sacrificial (i.e., destroyed or damaged to the point of being unusable during separation of the deposited material) or non-sacrificial (i.e., not destroyed or excessively damaged, i.e., not damaged to the point of being unusable, e.g., having a sacrificial or release layer between the substrate and the initial layer of the structure being formed). Non-sacrificial substrates may be considered reusable, requiring little or no rework (e.g., by re-planning one or more selected surfaces or by applying a release layer, etc.), although they may or may not be reused for a variety of reasons.

[0037] Those skilled in the art will appreciate the definitions of various terms and concepts that can be used to understand the various embodiments of the present invention (whether the device itself, certain methods of making the device, or specific methods of using the device). Some of such terms and concepts are discussed herein, while other such terms are referred to in various patent applications (e.g., U.S. Patent Application No. 16 / 584,818) to which this application claims priority and / or are incorporated herein by reference.

[0038] "Longitudinal" used herein refers to the long dimension of a probe, the end-to-end dimension of a probe, or the end-to-end dimension of a probe. Longitudinal may refer to a substantially straight line extending from one end of a probe to the other end of the probe, or may refer to a curved or stair-step-shaped path with an inclination or even a change of direction along the probe height. When referring to a probe array or a probe to be loaded into an array configuration, the longitudinal dimension may refer to a specific direction in which the probe in the array points or extends, but may also simply refer to the overall height of the array, which begins with a plane comprising a first end, end or base of a plurality of probes, and extends perpendicularly to the plane to a plane comprising a second end, end or top of the probe. The context of use generally clearly indicates what is particularly meant to a person skilled in the art. The intention is that the interpretation applied to the term herein should be as narrow as possible, as long as the details of the description provided or the context in which the term is used ensures. However, if it is reasonable not to have this narrow interpretation, then the broadest reasonable interpretation range should be applied.

[0039] As used herein, "lateral" is related to the term "longitudinal". In terms of stacking of layers, lateral refers to a direction within each layer, or two perpendicular directions within each layer (i.e., one or more directions within the plane of the layer substantially perpendicular to the direction in which the layers are stacked). When referring to an array of probes, lateral generally has a similar meaning, as the lateral dimension is generally a dimension within a plane parallel to the top or bottom plane of the array (i.e., substantially perpendicular to the longitudinal dimension). When referring to the probes themselves, the lateral dimension may be a dimension perpendicular to the overall longitudinal axis of the probe, the local longitudinal axis of the probe (i.e., the local lateral dimension), or simply a dimension similar to the dimension of the array or layer. The context of use generally makes clear what is particularly meant to a person skilled in the art. It is intended that the interpretation applied to the terms herein should be as narrow as possible, as long as the details of the description provided or the context in which the term is used warrants. However, if no such narrow interpretation is reasonable, then the broadest range of reasonable interpretation should apply.

[0040] As used herein, "substantially parallel" means parallel or nearly parallel, i.e., within 15° of parallel, more preferably within 10° of parallel, even more preferably within 5° of parallel, and most preferably within 1° of parallel. If the term is used without clarification, it should be interpreted as within 15° of parallel. When used with a specific clarification, the term should be interpreted in accordance with the specific clarification.

[0041] As used herein, "substantially perpendicular" or "substantially orthogonal" means perpendicular or nearly perpendicular, i.e., within 15° of perpendicular, more preferably within 10° of perpendicular, even more preferably within 5° of perpendicular, and most preferably within 1° of perpendicular. If the term is used without clarification, it should be interpreted as within 15° of perpendicular. When used with a specific clarification, the term should be interpreted in accordance with the specific clarification.

[0042] As used herein, "substantially planar" when referring to a surface refers to a surface that is intended to be planar, although some imperfections may exist as will be understood by one skilled in the art (i.e., when referring to millimeter and micrometer devices (which are the primary device embodiments discussed herein), these imperfections may deviate from planarity by as much as 1 to 5 microns, but are typically submicron in nature). If the term is used without clarification, it should be interpreted as having imperfections that deviate from planarity by no more than 5 microns. When used with a specific clarification, the term should be interpreted in accordance with the specific clarification. When referring to a structure, the term does not refer to an infinitely thin structure, but rather to a structure formed by substantially planar top and bottom surfaces, for example, the top or bottom surface of each layer or a group of successively formed layers of a structure formed using a multi-material multilayer electrochemical manufacturing process, particularly when each layer undergoes a planarization operation such as grinding, fly cutting, chemical mechanical planarization, spreading by spin, and the like. In some cases, a substantially planar structure may also mean that the structure or an element of the structure is small in height or thickness compared to the size of the structure in two perpendicular dimensions (i.e., the ratio of vertical footprint to thickness is greater than 25, preferably greater than 50, more preferably greater than 100, and most preferably greater than 200). If the term is used with respect to a structure without clarification, it should be interpreted as meeting the substantially planar surface criteria for both the upper and lower surfaces. In some cases, a ratio requirement may also apply, i.e., a ratio of at least 25. When used with a specific clarification with respect to a structure, the term should be interpreted in accordance with the specific clarification.

[0043] As used herein, "relatively rigid" refers to the comparison of rigidity between two structural elements when the two structural elements are subjected to a working load or stress, wherein the relatively rigid structural element should reduce deflection or twisting by at least 2 times, more preferably 5 times, and most preferably 10 times, compared to the other structural element. If the term is used with respect to a structural element without clarification, it should be interpreted as meeting the requirement of a factor of 2. When used with a specific clarification with respect to a structural element, the term should be interpreted in accordance with the specific clarification.

[0044] As used herein, "nonlinear configuration" refers to a configuration that is not a straight rod-like configuration, particularly when applied to a physical structure or element. Nonlinear configurations are essentially two-dimensional or three-dimensional configurations with features that include one or more bends or curves. For example, a planar nonlinear configuration may be a planar helical configuration. When referring to a spring, a nonlinear configuration as used herein does not refer to a force-deflection relationship unless such a relationship is specifically and unambiguously indicated.

[0045] Probes with flat spring modules:

[0046] The planar spring or planar flexible element of the present invention can be formed in a variety of different ways and in a variety of different configurations. Typically, the flexible element includes a planar spring having a portion extending from a support to a terminal end or terminal arm in a cantilevered or bridged manner over a gap or open area (e.g., two or more springs starting from different lateral support locations and connected to a common terminal arm, generally referred to herein as one or more cantilevers), into which the spring may deflect during normal operation. These flexible portions typically have a two-dimensional nonlinear configuration in a transverse plane and have a thickness extending perpendicular to the plane (e.g., in a longitudinal direction), wherein the two-dimensional configuration may be in the form of a beam structure having a curved or angled configuration, whose length is much greater than its width, such as at least 5, 10, 20 or even 50 times or more in some variations, wherein the thickness is typically less than the length of the beam, such as at least 5, 10, 20 or even 50 times or more in some variations, or less than the transverse dimension of the spring element, such as 2, 5, 10 or even 20 times or more in some variations. In some embodiments, when the probe or module is formed from multiple adhered layers, the plane of this construction can be parallel to the plane of the layers (e.g., the XY plane). The thickness of the spring (e.g., in the Z direction) can be the thickness of a single layer, or can be the thickness of multiple layers. In some embodiments, the flexible element includes a plurality of spaced-apart planar spring elements.

[0047] In some embodiments, the flexible elements may include planar spring elements that are connected to each other not only at the bracket or end structure, but also at intermediate locations to these end elements. In some such embodiments, the planar spring elements may start at one end (e.g., the bracket or end arm) as one or more thickened springs with a relatively high spring constant, and then provide a reduced spring constant by removing some of the intermediate spring material between the top and bottom of the initial spring structure, thereby transitioning from a small number of initially thicker planar flexible elements (e.g., 1, 2, or 3 elements) to a larger number of thinner planar elements, wherein some of the initial planar elements are divided into 2, 3, 4, 5, or more planar but thinner elements before reaching the other end (e.g., the end arm of the bracket), whereby, for example, spring constants, force requirements, overtravel, stress, strain, current carrying capacity, overall size, and other operating parameters may be tailored to meet the requirements of a given application.

[0048] exist Figure 2 Many of the figures through Figure 5H include reference numbers where the same numbers are used to represent similar structures or features in different embodiments.

[0049] An exemplary spring module is Figure 2-3 shown. Figure 2An isometric view of an exemplary spring module 200 is depicted having two undeflected spring elements 221-1 and 221-2, a base 201 spaced apart from the spring elements, and a connecting support (e.g., a bracket or bridge) 211 bridging a longitudinal module gap MG between the spring elements and the base. Figure 2In the example of , each of the two spring elements is in the form of a planar radially extending spiral extending from a radially displaced bridge 211 via a downwardly extending portion of the end structure to a centrally or axially positioned end element 231. The springs are separated longitudinally by a gap SG. In this example, the bridge 211 connects one end of each spring element together, while the end element 231 connects the other end of the spring element together via an extension of the end structure. The end element 231 is formed with a desired width TW and a desired end height TH extending above the upper spring, each spring element is formed of a desired material and is formed with a desired beam thickness or spring height SH, beam width or spring width SW, spacing between spring turns CS, and a coiled beam length that allows the spring to deflect by a desired amount without exceeding the elastic deflection limit of the structure and the associated materials forming the structure, while providing a desired fixed or variable spring force within its deflection range. In particular, the length of the end can enable a desired compression of the module end toward the base without the base, bridge and spring elements interfering with each other. In some embodiments, for example, the maximum travel distance of the end of each module can be as small as 5μm (μm = micrometer) or less, or can be as large as 500μm (e.g., 25μm, 50μm, 100μm, or 200μm) or more. For example, in some embodiments, the maximum travel distance of each module can be 25μm to 200μm, while in other example embodiments. The maximum travel distance of each module can be 50μm to 150μm. In some embodiments, the maximum travel distance of the end can be set by a hard stop, such as by a spring or a deflection portion of the end in contact with the base, by a stop structure on the base, or possibly by a surface in contact with the end (e.g., the surface of an adjacent module) in contact with the upper portion of the bridge. In other embodiments, the maximum travel distance can be achieved by a flexible spring or an end portion in contact with a soft stop or a flexible reduction structure. The force to achieve the maximum deflection (or stroke) can be as small as 0.1 grams of force to as large as 20 grams of force or more. In some embodiments, a force target of 0.5 grams may be appropriate. In other cases, 1 gram, 2 grams, 4 grams, 8 grams, or more may be suitable. In some embodiments, a module height MH (longitudinal dimension) of 50 μm or less may be targeted, while in other embodiments, a module height of 500 μm or more may be targeted. In some embodiments, the total module radial diameter or width MW may be 100 μm or less, or 400 μm or more (e.g., 150 μm, 200 μm, or 250 μm). One or more spring beam elements of the module may have a spring height SH from 1 μm or less to 100 μm or more (e.g., 10, 20, 30, or 40 μm), and a beam width or spring width SW from 1 μm or less to 100 μm or more (e.g., 10, 20, 30, or 40 μm).The ends may have uniform or varying geometries (e.g., cylindrical, rectangular, conical, multi-pronged, or other configurations, or combinations of configurations). The ends (where they are joined to the spring beams) will typically have a cross-sectional width TW that is greater than the width SW of the beam or beams to which they are connected.

[0050] Figure 3 An isometric view of a second exemplary spring module 300 is shown, which is similar to Figure 2 The difference is that the two spring elements are thicker and thus provide a Figure 2 From another perspective, Figure 3 For example, a greater force will be required for a given deflection, and therefore the yield strength of the combined material and structural geometry will be reached (e.g., the elastic deflection limit is reached), which is greater than Figure 2 The example is small.

[0051] In other embodiments, the spring module may be Figure 2 or Figure 3 The various forms shown are shown. For example: (1) a module can have a single spring element or more than two spring elements; (2) each spring element can have variations in one or more of width, thickness, length, or rotational range; (3) a spring element can vary in the length of the element; (4) a spring element can have a configuration other than an Euler spiral, such as a rectangular spiral, a rectangular spiral with rounded corners, an S-shaped structure, or a C-shaped structure; (5) individual spring elements can be connected to multiple bridging joints, such as to bridging connection points located 180 degrees, 120 degrees, or 90 degrees around the module; (6 ) the bridging joints can be located on different bridging members; (7) the radial extent of the base element can be smaller than the spring / bridging joint so that when the modules are stacked, the base of the higher module can extend below the upper extent of the lower adjacent module when the module end is sufficiently compressed; (8) the module base can be replaced with additional springs that allow the module springs to be compressed in two directions when deflected; (9) the probe tip can be not laterally centered relative to the overall lateral construction of the module (i.e., not coincident with or even colinear with the compression axis or the main build axis when formed layer by layer).

[0052] Figure 4A to Figure 4D4Various views of a probe 3400 or portions thereof are provided, wherein the probe is formed of two back-to-back (or base-to-base) modules, wherein the two modules share a common base having an annular configuration, and wherein the probe includes a number of different features: (1) an annular base or frame 3401 that holds an upper coil spring array 3421-UC and a lower coil spring array 3421-LC by their outermost lateral extents to provide a basic stenting function between the upper and lower spring arrays, wherein the base or frame 3401 has a circular exterior with an interior opening, the interior opening being shaped so as to provide a plurality of different features; The lower opening has opposing arcuate sides 3401-A and narrower opposing flat sides 3401-F, wherein the upper and lower surfaces joining the flat sides provide attachment areas for connection with upper and lower supports or brackets 3411-1, 3411-2, 3412-1 and 3412-2, which in turn support the ends of the helical spring element, and the arcuate areas provide gaps over which the outermost cantilevered portions of the spring can be located (before deformation), wherein the thickness of the base acts as a bracket spacer, wherein portions of the helical spring can be located The probe tips deflect toward each other during compression; (2) each of the upper and lower spring arrays begins its inward path from an opposing pair of brackets with two longitudinally separated coplanar coiled helical cantilever pairs 3421-1U and 3421-2U ​​(located above the base) and 3421-1L and 3421-2L (located below the base), each cantilever of each element splitting into two longitudinally spaced cantilevers midway through its inward stroke, such that four upper cantilever elements UC1-UC4 connect each side of the upper end arm 3431-UA, while four lower cantilever elements LC1-LC4 connect the lower end arms 3431-UA and 3431-UA, respectively. On either side of the end arm 3431-LA, the lower end arm supports the contact or coupling ends 3431-U and 3431-L, respectively; (3) the rotational orientation of the spiral spring element connecting the upper contact end has an opposite rotational orientation relative to the spring element connecting the lower contact end; and (4) the brackets 3411-1, 3411-2, 3412-1 and 3412-2 only provide intermediate bracket functions between the multiple beams of the upper spiral array and between the multiple spiral beams of the lower spiral array, but do not provide bracket functions between the two spring groups because this function is directly provided by the base 3401.

[0053] Figure 4A Figure 4B1 and Figure 4B2 A side view, an upper isometric view, and a lower isometric view are provided, respectively, of probe 3400, in which various features of the probe can be seen. Figure 4B1 A view of the uppermost pair of coil springs of the upper spring section of the probe is provided, and Figure 4B2 A view of the lowermost pair of coil springs of the lower spring section of the probe is provided. Figure 4B1 and Figure 4B2Each of the diagrams provides a view of the upper end 3431-U and the lower end 3431-L together with the central base 3401. FIG. 4A, Figure 4B1 and Figure 4B2 Views of upper brackets 3411-1 and 3411-2 and lower brackets 3412-1 and 3412-2 are also provided, as well as views of the outer portions of longitudinally separated upper cantilever elements 3421-1U and 3421-2U ​​and lower cantilever elements 3421-1L and 3421-2L. It can also be seen that the staggered paths of the coplanar cantilever element pairs extend inwardly from their respective brackets to meet at their respective central ends.

[0054] Fig.4C1 and Figure 4C2 Exploded isometric views of the probe 3400 from the upper and lower perspectives are provided, respectively, so that not only the bottom of the lower cantilever element and the top of the upper cantilever element can be seen, but also the top of the lower cantilever element and the bottom of the upper cantilever element can be seen, as well as the interior of the annular base 3401 including the flat and curved sidewalls 3401-F and 3401-A. Fig.4C1 and Figure 4C2 In FIG. 3 , the upper spring section or upper flexible element 3421-UC of the probe is separated from the central frame or base element 3401, which is in turn separated from the lower spring section or lower flexible element 3421-LC of the probe. Fig.4C1 The upper end 3431-U can be seen in FIG, as well as the tops of the upper and lower spring sections and the top of the center frame element. Figure 4C2 3431-L can be seen, as well as the bottom of the upper and lower spring segments 3421-UC and 3421-LC and the bottom of the central frame element 3401. As shown by the dotted line connecting the exploded elements, the central frame element 3401 supports the outermost lateral extents of the upper and lower spring segments, and more particularly, the central frame element supports the brackets 3411-1, 3411-2, 3412-1 and 3412-2 that support the cantilever elements.

[0055] Figures 4D1 to 4D4Four different cross-sectional views of the probe 3400 are provided, with progressively larger portions of the sides of the probe cut away to reveal the internal structure of the probe, making it easier to see and understand the changes in the cantilever. As the helical element rotates inwardly toward the laterally centered end element, the cantilever element undergoes a transition from two longitudinally separated cantilever elements 3421-2U ​​and 3421-1U above the base 3401 and two longitudinally separated cantilever elements 3421-1L and 3421-2L below the base 3401 to four longitudinally separated cantilever elements UC1-UC4 above the base and four longitudinally separated elements LC1-LC4 below the base, where the beam reaches its respective longitudinally movable end arm elements 3431-UA and 3431-LA (as shown in FIG. 1 ). Figure 4D3 As clearly shown), these end arm elements are connected or become ends 3431-U and 3431-L respectively.

[0056] Fig.4E1 A side view of a probe 3400 similar to FIG. 4A is provided, except that 17 sample layer levels L1 to L17 are defined, each layer having a defined thickness along the longitudinal axis of the probe (i.e., the Z axis shown), and the probe can be manufactured from these layers, for example, by a multi-layer manufacturing process, such as a multi-layer multi-material electrochemical manufacturing process using a single or multiple structural materials (together with sacrificial materials) and using a build axis or layer stacking axis corresponding to the longitudinal axis of the probe. In such a formation embodiment, although the probes can be formed one at a time, it is generally preferred to form the probes in batches by forming hundreds or even thousands of probes simultaneously through sequential layer-by-layer stacking.

[0057] Figure 4E2-A to Figure 4E9-B Cross-sectional configurations are shown in both top view (-A) and isometric view (-B) for eight unique configurations of layers L1-L17.

[0058] Fig.4E2-A and Figure 4E2-B shows a view of layers L1 and L17, where the ends can be seen, which are the lower end 3431-L of layer L1 and the upper end 3431-U of layer L17.

[0059] Figure 4E3-A and Figure 4E3-B Views of layers L2, L4, L6 and L8 are shown providing portions of the planar spring spirals 3421-1L, 3421-2L and their innermost regions forming cantilever segments LC1 to LC4 (not labeled), portions of the lower center end arm 3431-LA, and portions of the lower supports 3412-1 and 3412-2, wherein the double staggered spiral construction can be seen.

[0060] Figure 4E4-A and Figure 4E4-BA view of layers L3 and L7 is shown, in which incomplete helical elements 3421-1L, 3421-2L and stents 3412-1 and 3412-2 (similar to Fig.4E3-A and Figure 4E3-B , but lacks the LC1-LC4 portion). The helical portions reflected in these figures are consistent with Fig.4E3-A and Figure 4E3-B The overlapping and lower layer portions combine to form a thickened spiral section in the outermost lateral portion of the spring, wherein the lower flexible element 3421-LC includes only two thickened cantilever elements as opposed to four thinner cantilever elements LC1-LC4 connecting the end arms at the innermost portion of the spring.

[0061] Figure 4E5-A and Figure 4E5-B A view of layer L5 is shown, which includes a portion of the lower end arm 3431-LA and portions of brackets 3412-1 and 3412-2 that provide a connection between cantilever spring portions 3421-1L and 3421-2L.

[0062] Fig.4E6-A and Figure 4E6-BA view of layer L9 is shown, which includes an annular base 3401 that separates and connects an upper flexible element 3421-UC and a lower flexible element 3421-LC through two portions of the base that serve as a scaffold, wherein some lateral portions of the base align with and engage the springs in the scaffolding regions 3411-1, 3411-2, 3412-1 and 3412-2 of the springs. The actual start of the inward turning spiral of the probe 3400 depends on the intersection of the features of layer L8 with the features of layer L9 and also depends on the intersection of the features of layer L9 with the features of layer L10. In particular, the intersection surface is not perpendicular to the local length of the winding spiral (e.g., so as to provide an intersection surface of minimum width), but is formed at a certain angle so that the outer portion of the spiral beam that intersects the base is supported along its length by a different amount than the inner portion. In some variations, the interface can be provided in a manner such that the interface is provided perpendicular to the local length of the beam, so that the support provided by the base (or other support area) provides a transverse vertical or substantially vertical transition between the supported beam area and the unsupported beam area. In particular, in the interface formed by layers L4 and L5, L5 and L6, L12 and L13, and L13 and L14, and in other beam segmentation areas (such as layers L2 to L3, L3 to L4, L6 to L7, L7 to L8, L10 to L11, L11 to L12, L14 to L15, and L15 to L16), it can be seen that vertical transitions are provided in other beam to support areas, wherein the beam transitions extend along a transverse line that is substantially perpendicular to the instantaneous or local length of the beam. Such vertical and non-vertical intersections and their consistent or varying uses can be used to customize probe performance or operating characteristics. In particular, due to the non-perpendicular intersection with the base and due to the intersections provided by and between the other beams of the cantilever, the outer portion of the cantilever is configured as a single thick beam, while the inner portion of the cantilever structure begins as two beams of medium thickness, with the cantilever terminating as four thinner beams at the probe arm. In some variations, the initial cantilever structure (as they laterally exit the base) can begin with a single thick beam or multiple beams across the width. Other transitions along the length of the beam can also be configured to provide a smooth or perpendicular transition, or can be configured to provide a variable or non-perpendicular transition. Figure 4E7-A and Figure 4E7-B Views of layers L10, L12, L14, and L16 are shown, providing: (1) portions of the upper planar spring spirals 3421-1U and 3421-2U ​​and their innermost extensions forming cantilevered portions UC1 to UC4 (not labeled); (2) portions of the upper center end arms 3431-UA and portions of the upper brackets 3411-1 and 3411-2, where the double staggered spiral configuration can be seen. These are Figure 4E3-A and Figure 4E3-BThe lower flexible element features shown correspond to the upper flexible element. Comparison of these figures shows that the rotational orientation of the helices of the upper flexible element and the lower flexible element have opposite rotational orientations. In some cases, this reversal of direction may be considered beneficial, while in other cases it is unnecessary or even harmful. When the spring element is compressed, the end may tend to rotate in a direction opposite to the inward rotation of the spiral element, which may cause a wiping or scraping effect that may help to crack the oxide coating or cause damage to the contacted surface. The reversal of the wiping direction between the lower probe end and the upper probe end may be desired or undesirable, and therefore can be taken into consideration during the initial probe design. Similarly, a reversal of the relative directions of the separated upper spring elements is feasible, and a reversal of the directions of the separated lower spring elements is also feasible.

[0063] Figure 4E8-A and Figure 4E8-B A view of layers L11 and L15 is shown, in which the incomplete helical elements 3421-1U and 3421-2U ​​and the connecting region of the supports 3411-1 and 3411-2, which bridge the Figure 4E7-A and Figure 4E7-B of the spiral to form a thickened spiral section in the outermost lateral portion of the spring, wherein the upper flexible element 3421-UC includes only two thickened elements as opposed to four thinner elements connecting the end arms 3431-UA at the innermost lateral region of the spiral. Figure 4E8-A and Figure 4E8-B Provides Figure 4E4-A and Figure 4E4-B The lower flexible element shown corresponds to the upper flexible element.

[0064] Figure 4E9-A and Figure 4E9-B A view of layer L13 is shown, which includes a portion of upper end arm 3431-UA and portions of brackets 3411-1 and 3411-2U, which provide a connection between cantilever arms 3421-1U and 3421-2U. Figure 4E9-A and Figure 4E9-B Provides Figure 4E5-A and Figure 4E5-B The lower flexible element counterparts found in the images correspond to the portions of the upper flexible element.

[0065] Figure 4A to Figure 4E9-BMany additional variations of the probe are possible and will be apparent to those skilled in the art after reading the teachings herein, and include, for example: (1) variations in materials; (2) variations in configuration, including the number of turns or partial turns contained in each spring element, the number of staggered springs used on each longitudinal stage, the number of longitudinally spaced springs used (e.g., even, odd, etc.), the number and location of longitudinal beam transitions occurring along the length of the spiral, the direction of rotation of successive spirals (e.g., CW-CCW-CW-CCW-CW, CW-CCW-CCW-CW, etc.), the shape of the ends, the width and thickness of the cantilever beam; (3) using brackets to separate one or both of the upper spring module and the lower spring module from the annular frame, (4) using brackets closer to the central portion of the probe rather than the periphery of the probe; (5) using different types of frames or base structures and / or openings in the frames and base structures; (6) using spring structures that are not pairs of coplanar staggered spirals supported by different brackets, but rather a single spiral on a given longitudinal level or more than two staggered spirals on a given longitudinal level; and (7) variations of features and variations thereof taken from other embodiments and aspects described herein.

[0066] Figure 5A and Figure 5B According to another embodiment of the present invention, before assembling ( Figure 5A ) and as assembled probe 3500 ( Figure 5B ) isometric views of two oppositely oriented probe modules 3500-U and 3500-L, wherein the probe is formed as two separate probe modules having the same or different orientations, and then the probe modules are assembled in a base-to-base manner, wherein one probe module 3500-L (also indicated as the lower probe module 3500-L) has a downward facing end 3531-L and the other probe module 3500-U (also indicated as the upper probe module 3500-U) has an upward facing end 3531-U, wherein each probe module is formed with its own respective end 3531-U or 3531-L, end arm, planar spring element 3521-U or 3521-L, bracket 3511-U or 3511-L, and base 3501-U or 3501-L, and wherein each probe module can be identical or have different features.

[0067] The upper probe module 3500-U of the probe 3500 has an upper flexible element 3521-U, which is a spring element or component connected to an upper probe arm 3531-UA ending at an upper probe end 3531-U, and the lower probe module 3500-L of the probe 3500 has a lower flexible element 3521-L, which is a spring element or component connected to a lower probe arm 3531-LA ending at a lower probe end 3531-L.

[0068] More particularly, the first flexible element 3521-U provides flexibility in a direction substantially perpendicular to the planar construction, wherein a first portion of the first flexible element is functionally connected to at least one bracket, and a second portion of the first flexible element is functionally connected to a first probe arm or upper probe arm 3531-UA ending with a first probe end or upper probe end 3531-U, wherein the first probe arm or upper probe arm can be elastically moved relative to the at least one bracket, wherein the first probe arm 3531-UA directly or indirectly holds the first probe end, and when the first flexible element 3521-U is not biased, the first probe end extends longitudinally beyond the first end of the at least one bracket.

[0069] In addition, the second flexible element 3521-L provides flexibility in a direction substantially perpendicular to the planar construction, wherein a first portion of the second flexible element is functionally connected to at least one bracket and a second portion of the second flexible element is functionally connected to a second probe arm or lower probe arm 3531-LA ending with a second probe end or lower probe end 3531-L, and the second probe arm or lower probe arm can be elastically moved relative to the at least one bracket, wherein the second probe arm 3531-LA directly or indirectly holds the second end, and when the second flexible element 3521-L is not biased, the second end extends longitudinally beyond the second end of the at least one bracket.

[0070] According to one embodiment, the first flexible element 3521-U and the second flexible element 3521-L comprise respective two-dimensional substantially planar springs when unbiased such that the first and second flexible elements provide flexibility in a direction substantially perpendicular to the planar configuration.

[0071] In particular, the first portion of the first flexible element 3521-U and the first portion of the second flexible element 3521-L are longitudinally spaced apart from each other by at least one bracket, and when at least one of the first and second ends is biased toward the other, the second portion of the first flexible element 3521-U and the second portion of the second flexible element 3651-L move longitudinally in a manner selected from the group consisting of: (A) moving closer, and (B) moving further apart.

[0072] Figure 5A The example illustrates longitudinally separated probe modules, wherein the probe modules undergo relative movement in the direction indicated by 3545 so that the bottom of the upper probe module 3500-U contacts the top of the lower probe module 3501-L. Alternatively, the upper probe module 3500-U contacts one or more intermediate materials (e.g., bonding materials or adhesion promoting materials), which in turn contact the lower probe module 3500-L so that once Figure 5B , the two probe modules can be bonded or otherwise held together laterally, longitudinally, and possibly rotationally to form a probe. In some embodiments, the modules can be held together via, for example, soldering, brazing, laser welding, ultrasonic welding, spot welding, using conductive epoxy, or some other adhesive. In some embodiments, diffusion bonding or other cohesive bonding can provide sufficient permanent or temporary bonding.

[0073] In particular, the upper probe module 3500-U and the lower probe module 3500-L are aligned laterally and longitudinally in direction 3545, with their respective ends pointing away from each other in substantially opposite longitudinal directions so that at least one first bracket 3511-U of the upper probe module 3500-U and at least one second bracket 3411-L of the lower probe module 3500-L are directly or indirectly connected to each other so as to space at least one first flexible element 3521-U from at least one second flexible element 3521-L.

[0074] Figure 5A and Figure 5BMany other variations of the embodiments are possible and may include, for example: (1) changes in physical dimensions of probe features, such as spring thickness, spring width, helix length, bracket height, end arm length, probe diameter, or overall height; (2) changes in the end configuration, changes in the shape of the spring, changes in the number of brackets supporting the spring, changes in the number of helical elements supporting the end arm at any given longitudinal level, changes in the number of spring levels forming part of a module, changes in the base configuration, changes in the bracket configuration, changes from a substantially circular configuration to other configurations (such as rectangular, rounded rectangular, hexagonal, elliptical, or other polygonal or curved configurations); (3) changes in the shape of the probe to form the probe; or changes in one or more materials of different parts of the probe; (4) the upper probe module and the lower probe module have different structures formed of different materials; (5) the implementation of features or functions discussed in conjunction with other embodiments or variations of these embodiments described herein; (6) the use of other devices or methods to attach or otherwise integrate the upper and lower probe modules, including, for example, mechanical interlocking, threaded structures, friction provided by springs, releasable or non-releasable latches generated by springs, or forcing one or more features on one or both probe modules to move relative to each other during engagement with another probe module; and (7) the use of more than two separately formed probe modules or structures.

[0075] Fig. 6A and Figure 6B According to another embodiment of the present invention, before assembling ( Fig. 6A ) and as assembled probe 3600 ( Figure 6B ) isometric views of two oppositely oriented probe modules 3600-U and 3600-L, wherein the probes are formed as two separate probe modules having the same or different orientations, and then the probe modules are assembled so that one probe module (also indicated as the lower probe module 3600-L) has a downward facing end 3631-L and the other probe module (also indicated as the upper probe module 3600-U) has an upward facing end 3631-U, wherein each probe module is formed with its respective end 3631-L or 3631-U, end arms, planar spring elements 3621-L and 3621-U, and brackets 3611-L and 3611-U, and wherein only one module is formed with a base 3601-L connected to its bracket 3611-L.

[0076] During assembly, the two probe modules are first Fig. 6A The probe modules are then moved relative to each other in the direction indicated by arrow 3645 so that the bracket 3611-U of the upper probe module 3600-U contacts and is connected to the base 3601-L of the lower probe module 3600-L, as shown in FIG. Figure 6B as shown in .

[0077] and Figure 5A and Figure 5B As in the embodiments, the contact between the bracket of one probe module (particularly the bracket 3611-U of the above-ground probe module 3600-U) and the base of another probe module (particularly the base 3601-L of the underground probe module 3600-L) is direct or indirect, because before the contact, an intermediate bonding or adhesion promoting material may be located on one or both of the surfaces of these elements.

[0078] The two probe modules 3600-U, 3600-L can be bonded or otherwise held together laterally, longitudinally, and rotationally to form a probe. In some embodiments, the probe modules 3600-U, 3600-L can be held together via, for example, soldering, brazing, laser welding, ultrasonic welding, spot welding, using conductive epoxy, or some other adhesive.

[0079] Fig. 6A and Figure 6B Many other alternatives to the embodiments of are possible, and include, for example: (1) Figure 5A and Figure 5B The alternatives mentioned in the embodiments, as well as the use of features associated with other embodiments and their alternatives described herein; (2) the two probe modules can be formed without a base so that assembling the two probe modules to form a probe provides bracket-to-bracket fit; (3) the extended portion of the bracket (i.e., the portion above or below the planar spring 3621-U, 3621-L) can be removed from one of the probe modules so that fit is achieved by connecting the extended bracket of one probe module to the truncated bracket area of ​​the planar spring (multiple planar springs) of another probe module; (4) the base can take an alternative structure, such as a ring structure or a structure with complementary docking features, and (5) the base and / or the bracket itself in the contact area can include features that provide alignment and / or bonding by adhesive, mechanical interlocking, friction, diffusion bonding, or cohesive bonding.

[0080] Figure 7A1-Figure 7C A view of a probe module or a probe assembled by the probe module according to another embodiment of the present invention is provided, wherein the probe modules 3700-U and 3700-L are not provided with a base but are provided with a bracket 3711-U having a structure capable of cooperating with an opposite bracket 3711-L.

[0081] Fig.7A1 and Fig.7A2An isometric view is provided of two complementary probe modules having brackets 3711 with complementary longitudinal, rotational, and radial stop features that can engage one another when the probe modules are coupled in opposite longitudinal orientations.

[0082] Fig.7A1 and Fig.7A2 Each probe module comprises its own corresponding end 3731, end arm, planar spring element 3721, and bracket 3711, wherein the upper mark "U" and the lower mark "L" have been removed because the use of these probe modules as upper or lower probe modules has not yet been specified. Fig.7A1 and Fig.7A2 The stent 3711 includes longitudinally or vertically facing features 3761-V1 and 3761-V2, and transversely facing features 3761-H1 and 3761-H2 that are substantially facing in a positive or negative tangential direction, and radially facing features 3761-R1 and 3761-R2 that are substantially facing in a positive or negative radial direction. Fig.7A1 In the probe module of , one lateral facing feature 3761-H2 is an outer tangential facing mating surface and is rotationally disposed behind another lateral facing feature 3761-H1 as an inner tangential facing mating surface so that a radial facing surface 3761-R1 between lateral facing features 3761-H1 and 3761-H2 (i.e., inner and outer tangential facing mating surfaces) faces radially outward. Fig.7A2 In the probe module, one lateral facing feature as the outer tangential facing mating surface 3761-H2 is rotationally positioned in front of another lateral facing feature as the inner tangential facing mating surface 3761-H1 so that the corresponding intermediate radial facing surface 3761-R2 faces radially inward. Due to these complementary relationships, when one probe module is used as an upper module and the other is used as a lower probe module, the probe modules 37A1 and 37A2 can mate with each other at these surfaces. Figure 7A1-Figure 7A2 In the example shown in , a clear vertical, radial and tangential alignment of the probe module is provided. In variations of this embodiment, other complementary mating surfaces may be used to provide a definitive or hard stop fit along a set of one, two or preferably all three axes of any relevant coordinate system.

[0083] Figure 7B supply Fig.7A1 and Fig.7A2 An isometric view of a probe module oriented and aligned for longitudinal mating, wherein Fig.7A1 The probe module acts as the upper probe module 3700-U, while Fig.7A2The probe module has been rotated from pointing upward to pointing downward and serves as the lower probe module 3700-L, wherein the probe modules 3700-L and 3700-U will move relative to each other in the direction indicated by arrow 3745 to provide a fit, wherein some lateral movement may also be used to ensure face-to-face contact of the mating or alignment surfaces.

[0084] Figure 7C Provided that after the movement, mating, and joining indicated by arrow 3745 to form the complete probe 3700 has occurred, Figure 7B The connection of the probe module can be carried out in a variety of ways as mentioned in the previous embodiments.

[0085] Many additional variations of the probe and / or assembly process will be apparent to those skilled in the art after reading the teachings herein, including methods and features associated with other embodiments and variations thereof.

[0086] Figure 8A-8C Isometric views of two probe modules, specifically an upper probe module 3800-U and a lower probe module 3800-L, in various states of assembly are provided in creating a probe 3800 according to another embodiment of the present invention.

[0087] The upper probe module 3800-U of probe 3800 has an upper flexible element 3821-U, which is a spring element or component connected to an upper probe arm ending at an upper probe end 3831-U, and the lower probe module 3800-L of probe 3800 has a lower flexible element 3821-L, which is a spring element or component connected to a lower probe arm ending at a lower probe end 3831-L.

[0088] Fig. 8A The example illustrates the lateral alignment of the upper and lower probe modules 3800-U and 3800-L, followed by first and second desired mating movements, indicated by movement arrows 3845-1 and 3845-2, respectively, wherein the first desired mating movement comprises a first lateral separation 3845-1 to separate the base 3801-U of the upper probe module 3800-U from the cap structure 3863 (which is attached to the base 3801-L of the lower probe module 3800-L via a narrower neck feature), followed by a longitudinal alignment 3845-2 to produce Figure 8B The assembled state illustrated in FIG. 1 , wherein the upper probe module 3800-U is positioned above the lower probe module 3800-L, and the probe modules 3800-U, 3800-L displace the respective ends 3831-U, 3831-L relative to each other. Arrow 3845-3 shows an additional lateral movement opposite to the movement of 3845-1 to provide a Figure 8C The lateral alignment and mating illustrated in the example, wherein the base 3801-U of the upper probe module 3800-U has a coupling slot 3862, which has multiple alignment features including 3861-R1, 3861-R2 and 3861-V2, and the base 3801-L of the lower probe module 3800-L has an alignment feature 3861-V1 and supports a top cover structure 3863, which is separated from the base 3801-L by a narrower neck area to form an undercut area between the top cover structure 3863 and the base 3801-L of the lower probe module 3800-L, and the undercut area can effectively engage and retain the base 3801-U with a slotted structure of the upper probe module 3800-U through its boundary alignment features to provide longitudinal retention.

[0089] The connection of the probe module can be fully achieved by the alignment and retention features discussed above; however, in some variations, additional attachment, retention, or bonding materials or methods can be used to provide enhanced fit, as described in the previous embodiments. After reading the teachings herein (including methods and features associated with other embodiments and variations thereof), those skilled in the art will understand many additional variations of the probe and / or assembly process.

[0090] Figure 9A-9C A method similar to that of creating a probe 3900 according to another embodiment of the present invention is provided. Figure 8A-8C A view of a view of a probe module 3900-L is provided in which the probe module is similar to the probe module 3900-L except that the top cover feature 3963 that is coupled to the neck portion of the base 3901-L of the lower probe module 3900-L includes a spring element 3964. Figure 8A-8C of the probe modules, the spring elements providing a stable lateral connection to the upper probe module 3900-U for one or both of electrical and mechanical purposes without the need for bonding operation or inclusion of other structures which may still be optionally used.

[0091] The upper probe module 3900-U of probe 3900 has an upper flexible element 3921-U, which is a spring element or component connected to an upper probe arm ending at an upper probe end 3931-U, and the lower probe module 3900-L of probe 3900 has a lower flexible element 3921-L, which is a spring element or component connected to a lower probe arm ending at a lower probe end 3931-L.

[0092] exist Figure 9A-9CIn the example of , the spring element 3964 has two resilient biasing elements oriented in opposite directions, one of which contacts one of the upper module brackets 3911-U (e.g., the left bracket) and the other of which contacts the other upper module bracket 3911-U (e.g., the right bracket), the two resilient biasing elements provide a force tending to laterally center the lower probe module 3900-L between the brackets of the upper probe module 3900-U, and the force tending to provide stable electrical contact between the upper and lower probe modules when the spring element 3964 and the bracket 3911-U are made of conductive metal and neither is provided with a dielectric coating. The spring force also tends to hold the top cover feature 3963 of the lower probe module 3900-U between the brackets 3911-U of the upper probe module 3900-U due to the enhanced friction between the upper and lower probe modules 3900-U, 3900-L.

[0093] As with the other embodiments, many variations are possible and include not only those mentioned in the other embodiments and their variations, but also variations associated with variations of the retaining spring of the spring element of the probe module itself and its interaction with the relative probe module. For example, in some variations, both probe modules can include spring elements. In some examples, the spring element of the probe module can interact with the spring element of the relative probe module, which is contrary to the relatively rigid features on the relative probe module. As another example, in some alternatives, the spring of the probe module can include a protruding element or a recess, which can engage with a complementary feature on or in the bracket of the relative probe module so that the force maintaining the retention is not only based on the friction coefficient combined with the normal force generated by the spring, but also based on the actual interference or even reentrant engagement interaction maintained by the spring force.

[0094] In some further variations, the interactions may be characterized by configurations that provide an angled interface during initial loading and a vertical or even concave interface that resists movement in the separation direction (e.g., a snap-lock configuration). In some variations, the snap-lock configuration may provide a lower residual contact force or even eliminate contact force when the respective elements are engaged, especially when there is no separation bias between the elements.

[0095] In other embodiments, engagement may occur with a shallower slope, while separation may be provided with an inclined interface having a step-like configuration, such that separation is still possible, but requires greater force than required for loading.

[0096] In other embodiments, the horizontal biasing force provided by the interaction between the probe modules caused by the retaining springs may be replaced or supplemented by springs providing bias in the longitudinal direction or in a mixed longitudinal / lateral direction.

[0097] Figure 10A-10C A method similar to that for creating a probe according to another embodiment of the present invention is provided. Figure 8A-8C and Figure 9A-9C , wherein the probe module is similar to the lower probe module 4000-L except that the top cover feature 4063 of the lower probe module 4000-L has been modified to have an oblong shape. Figure 8A-8C The probe module of the embodiment of the present invention is a probe module in which the narrow slot in the upper probe module 4000-U is converted into a hole or opening 4062 having a shape complementary to the top cover feature 4063 but slightly larger in size to allow the top cover feature 4063 to be inserted through the opening 4062 so as to allow the neck portion of the base 4001-L of the lower probe module 4000-L and the opening 4062 of the base 4001-U of the upper probe module 4000-U to be opened when the probe modules are moved relative to each other in the direction indicated by arrow 4045-1. 62 are at the same longitudinal level so that the opposite relative rotational movement of the lower probe module 4000-L and the upper probe module 4000-U about the longitudinal axis of the probe as indicated by arrow 4045-2 can cause the oblong shape of the top cover feature 4063 of the lower probe module 4000-L to cover a portion of the narrow portion of the surrounding opening 4062 of the base 4001-U of the upper probe module 4000-U so as to interlock the upper probe module 4000-U and the lower probe module 4000-L with each other, as shown in FIG. Fig. 10C as shown in .

[0098] The upper probe module 4000-U of the probe 4000 has an upper flexible element 4021-U, which is a spring element or component connected to an upper probe arm ending at an upper probe end 4031-U, and the lower probe module 4000-L of the probe 4000 has a lower flexible element 4021-L, which is a spring element or component connected to a lower probe arm ending at a lower probe end 4031-L.

[0099] As shown in FIG. 40C , the relative rotational movement 4045 - 2 of the lower and upper probe modules 4000 -L and 4000 -U also longitudinally aligns the corresponding brackets 4011 -L and 4011 -U in the final assembly.

[0100] There are many alternatives to this embodiment, and after reading the teachings herein, these alternatives will be apparent to those skilled in the art. As with other embodiments herein, some such variations may have features similar to those found in other embodiments and features similar to those found in variations associated with those other embodiments. In some alternative embodiments, the rigid sidewalls of the narrow portion of the opening in the base of the upper probe module and / or the rigid elongated portion of the top cover structure in the base of the lower probe module may be replaced by a spring structure that engages the relative modules to provide one or both of the electrical docking and / or frictional interference, interlocking, or even bistable mechanical locking of the probe module in a given rotational orientation. In other variations, a spring may be associated with an upper probe module or two probe modules to provide enhanced fit.

[0101] Further comments and conclusions:

[0102] Many embodiments have been proposed above, but without departing from the spirit of the invention, many other embodiments are also feasible. Some of these additional embodiments may be based on the teachings of this article and the combination of various teachings incorporated herein by reference. Some manufacturing embodiments may use a multilayer electrochemical deposition process, while other manufacturing embodiments may not use it. Some embodiments may use a combination of a selective deposition process and a blanket deposition process, while other embodiments may not use both, and some embodiments may use a combination of different processes. For example, some embodiments may not use any blanket deposition process and / or may not use a planarization process when forming successive layers. Some embodiments may use a selective deposition process or a blanket deposition process on some layers that are not electro-deposition processes. For example, some embodiments may use nickel (Ni), nickel phosphorus (Ni-P), nickel cobalt (NiCo), gold (Au), copper (Cu), tin (Sn), silver (Ag), zinc (Zn), solder, rhodium (Rh), rhenium (Re), beryllium copper (BeCu), tungsten (W), rhenium tungsten (ReW), aluminum copper (AlCu), palladium (Pd), palladium cobalt (PdCo), platinum (Pt), molybdenum (Mo), manganese (Mn), steel, P7 alloy, brass, chromium (Cr), chrome, chromium copper (CrCu), other palladium alloys, copper-silver alloys as structural materials or sacrificial materials, while other embodiments may use different materials. For example, some of the above materials may be preferentially used for their elastic properties, while others may be used for their enhanced electrical conductivity, their wear resistance, their barrier properties, their thermal properties (e.g., yield strength at high temperatures or high thermal conductivity), while some may be selected for their bonding properties, separability from other materials, or even for other properties of interest in the desired application or use. Other embodiments may use different materials or different combinations of materials, including dielectrics (e.g., ceramics, plastics, photoresists, polyimides, glass, ceramics or other polymers), other metals, semiconductors, etc. as structural materials, sacrificial materials or pattern materials. For example, some embodiments may use copper, tin, zinc, solder, photoresists or other materials as sacrificial materials. Some embodiments may use different structural materials on different layers or different parts of a single layer. Some embodiments may remove the sacrificial material, while other embodiments may not. Some embodiments may form a probe structure, while other embodiments may use the spring module of the present invention for non-detection purposes (e.g., to bias other operating devices with a desired spring force or flexible joint).

[0103] It should also be understood that probe elements of some aspects of the invention may be formed using processes that are substantially different than those set forth herein, and it is not intended that structural aspects of the invention need be formed only by or by processes that are obvious from those taught herein.

[0104] Although the various sections of this specification are provided with headings, the headings are not meant to limit the teachings in one section of the specification to not be applicable to other sections of the specification. For example, an alternative recognized in connection with one embodiment is intended to be applicable to all embodiments, as long as the features of the different embodiments enable such application and do not contradict or eliminate all advantages of the adopted embodiment.

[0105] It is intended that any aspect of the invention described herein represents an independent invention description that applicants consider to be a comprehensive and complete description of the invention that applicants consider to be capable of being presented as independent claims without the need to introduce additional limitations or elements from other embodiments or aspects described herein for explanation or clarification, which, once written, need not be explicitly presented in these independent claims. It is also understood that any variation of the aspects described herein represents independent and separate features that can form separate independent claims, be added to independent claims separately, or be added as dependent claims to further define the inventions claimed by these corresponding dependent claims (if written).

[0106] In view of the teachings herein, many other embodiments, designs and alternatives in use of the present invention will be obvious to those skilled in the art. Therefore, the present invention is not intended to be limited to the specific illustrative embodiments, alternatives and uses described above, but is only limited by the claims set forth below.

Claims

1. A method of forming a probe (3500, 3600, 3700, 3800, 3900, 4000), comprising: (a) providing a first probe module (3500-U, 3600-U, 3700-U, 3800-U, 3900-U, 4000-U), the first probe module comprising at least one bracket (3511-U, 3611-U, 3711, 3811-U, 3911-U, 4011-U) and at least one first flexible element (3521-U, 3621-U, 3721, 3821-U, 3921-U, 4021-U), the at least one first flexible element comprising a spring element providing flexibility in a direction substantially perpendicular to the planar configuration, wherein a first portion of the first flexible element (3521-U, 3621-U, 3721, 3821-U, 3921-U, 4021-U) is functionally connected to the at least one bracket a first probe arm that is resiliently movable relative to the at least one support, wherein the first probe arm directly or indirectly holds a first end (3531-U, 3631-U, 3731, 3831-U, 3931-U, 4031-U), and the first end longitudinally extends beyond the at least one support (3511-U, 3611-U, 3711, 3811-U, 3911-U, 4011-U) when the first flexible element (3521-U, 3621-U, 3721, 3821-U, 3921-U, 4021-U) is not biased; and (b) providing a second probe module (3500-L, 3600-L, 3700-L, 3800-L, 3900-L, 4000-L), the second probe module comprising at least one bracket (3511-L, 3611-L, 3711, 3811-L, 3911-L, 4011-L) and at least one second flexible element (3521-L, 3621-L, 3721, 3821-L, 3921-L, 4021-L), the at least one second flexible element comprising a spring element providing flexibility in a direction substantially perpendicular to the planar configuration, wherein a first portion of the second flexible element (3521-L, 3621-L, 3721, 3821-L, 3921-L, 4021-L) is functionally connected to the at least one bracket (3511-L, 3611-L, 3711 , 3811-L, 3911-L, 4011-L), and a second portion of the second flexible element is functionally connected to a second probe arm that is resiliently movable relative to the at least one support (3511-L, 3611-L, 3711, 3811-L, 3911-L, 4011-L), wherein the second probe arm directly or indirectly holds a second end (3531-L, 3631-L, 3731, 3831-L, 3931-L, 4031-L), and when the second flexible element (3521-L, 3621-L, 3721, 3821-L, 3921-L, 4021-L) is not biased, the second end longitudinally extends beyond the at least one support (3511-L, 3611-L, 3711, 3811-L, 3911-L, 4011-L); and (c) laterally and longitudinally aligning the first probe module and the second probe module (3500-U, 3600-U, 3700-U, 3800-U, 3900-U, 4000-U; 3500-L, 3600-L, 3700-L, 3800-L, 3900-L, 4000-L) with their respective first and second ends (3531-U, 3631-U, 3731, 3831-U, 3931-U, 4031-U; 3531-L, 3631-L, 3731, 3831-L, 3931-L, 4031-L) pointing away from each other in substantially opposite longitudinal directions so that the first probe module (3500-U, 3600-U, 3700-U, 3800-U, 3900-U, 4000-U) is aligned with the first probe module (3500-U, 3600-U, 3700-U, 3800-U, 3900-U, 4000-U) and the second probe module (3500-L, 3600-L, 3700-L, 3800-L, 3900-L, 4000-L) ) of the at least one bracket (3511-U, 3611-U, 3711, 3811-U, 3911-U, 4011-U) and the at least one bracket (3511-L, 3611-L, 3711, 3811-L, 3911-U, 4011-U) of the second probe module (3500-L, 3600-L, 3700-L, 3800-L, 3900-L, 4000-L) 3911-L, 4011-L) are directly or indirectly connected to each other so as to space the at least one first flexible element (3521-U, 3621-U, 3721, 3821-U, 3921-U, 4021-U) from the at least one second flexible element (3521-L, 3621-L, 3721, 3821-L, 3921-L, 4021-L).

2. The method according to claim 1, wherein: At least one of the first probe module and the second probe module (3500-U, 3600-U, 3700-U, 3800-U, 3900-U, 4000-U; 3500-L, 3600-L, 3700-L, 3800-L, 3900-L, 4000-L) further includes a base (3501-U, 3501-L, 3601-L, 3801-U, 3 801-L, 3901-U, 3901-L, 4001-U, 4001-L, at least one bracket (3511-U, 3611-U, 3811-U, 3911-U, 4011-U; 3511-L, 3611-L, 3811-L, 3911-L, 4011-L) of the first probe module and the second probe module is connected to the base, The base (3501-U, 3501-L, 3601-L, 3801-U, 3801-L, 3901-U, 3901-L, 4001-U, 4001-L) is located on at least one bracket (3511-U) of the first probe module (3500-U, 3600-U, 3700-U, 3800-U, 3900-U, 4000-U) , 3611-U, 3711, 3811-U, 3911-U, 4011-U) and the at least one bracket (3511-L, 3611-L, 3711, 3811-L, 3911-L, 4011-L) of the second probe module (3500-L, 3600-L, 3700-L, 3800-L, 3900-L, 4000-L).

3. The method according to claim 1, wherein: The joining of the first probe module and the second probe module (3500-U, 3600-U, 3700-U, 3800-U, 3900-U, 4000-U; 3500-L, 3600-L, 3700-L, 3800-L, 3900-L, 4000-L) includes an element selected from the group consisting of: (1) applying an adhesive material to at least one of the first probe module and the second probe module (3500-U, 3600-U, 3700-U, 3800-U, 3900-U, 4000-U; 3500-L, 3600-L, 3700-L, 3800-L, 3900-L, 4000-L), and then bonding the first probe module and the second probe module using the adhesive material; (1) bonding the first and second probe modules (3500-U, 3600-U, 3700-U, 3800-U, 3900-U, 4000-U; 3500-L, 3600-L, 3700-L, 3800-L, 3900-L, 4000-L) to each other; (2) applying an adhesive material to at least one of the first and second probe modules (3500-U, 3600-U, 3700-U, 3800-U, 3900-U, 4000-U; 3500-L, 3600-L, 3700-L, 3800-L, 3900-L, 4000-L) during a layer-by-layer formation process of building the corresponding probe modules, and thereafter bonding the first and second probe modules Probe modules (3500-U, 3600-U, 3700-U, 3800-U, 3900-U, 4000-U; 3500-L, 3600-L, 3700-L, 3800-L, 3900-L, 4000-L); (3) using ultrasonic welding to combine the first probe module and the second probe module (3500-U, 3600-U, 3700-U, 3800-U, 3900-U, 4000-U; 3500-L, 3600-L, 3700-L, 3800-L, 3900-L, 4000-L); (4) using laser welding to combine the first probe module and the second probe module (3500-U, 3600-U, 3700- U, 3800-U, 3900-U, 4000-U; 3500-L, 3600-L, 3700-L, 3800-L, 3900-L, 4000-L); (5) using a hard soldering process to combine the first probe module and the second probe module (3500-U, 3600-U, 3700-U, 3800-U, 3900-U, 4000-U; 3500-L, 3600-L, 3700-L, 3800-L, 3900-L, 4000-L); (6) using a soft soldering process to combine the first probe module and the second probe module (3500-U, 3600-U, 3700-U, 3800-U, 3900-U, 4000-U;(7) using friction between features of the first probe module and features of the second probe module to at least temporarily couple the first probe module and the second probe module (3500-U, 3600-U, 3700-U, 3800-U, 3900-U, 4000-U; 3500-L, 3600-L, 3700-L, 3800-L, 3900-L, 4000-L) to each other; ( 8) at least temporarily coupling the first and second probe modules (3500-U, 3600-U, 3700-U, 3800-U, 3900-U, 4000-U; 3500-L, 3600-L, 3700-L, 3800-L, 3900-L, 4000-L) to each other using at least one motion selected from the group consisting of: (i) lateral motion, (ii) longitudinal motion, (iii) rotational motion, and (iv) a combination of these motions, wherein interlocking of the probe modules occurs; (9) at least temporarily coupling the first probe module and the second probe module (3500-U, 3600-U, 3700-U, 3800-U, 3900-U, 4000-U; 3500-L, 3600-L, 3700-L, 3800-L, 3900-L, 4000-L) to each other using at least one motion selected from the group consisting of: (i) lateral motion, (ii) longitudinal motion, (iii) rotational motion, and (iv) a combination of these motions, wherein the first probe module and the second probe module (3500-U, 3600-U, 3700-U, 3800-U, 3900-U, 4000-U; 3500-L, 3600-L, 3700-L, 3800-L, 3900-L, 4000-L) are coupled to each other. , 3600-L, 3700-L, 3800-L, 3900-L, 4000-L) interlocking occurs via engagement of one or more recessed features; (10) at least temporarily connecting the first probe module and the second probe module (3500-U, 3600-U, 3700-U, 3800-U, 3900-U, 4000-U; 3500-L, 3600-L, 3700-L, 3800-L, 3900-L, 4000-L) to each other using at least one movement selected from the group consisting of: (i) lateral movement, (ii) longitudinal movement, (iii) rotational movement, and (iv) a combination of these movements, wherein the first probe module The interlocking of the module and the second probe module (3700-U, 3800-U, 3900-U, 4000-U; 3500-L, 3600-L, 3700-L, 3800-L, 3900-L, 4000-L) is achieved via engagement of one or more interference features (3761-V1, 3761-V2, 3761-H1, 3761-H2, 3761-R1, 3761-R2, 3861-R1, 3861-R2, 3861-V1, 3861-V2, 3863, 3961-V1, 3961-V2, 3964, 4061-R1, 4061-R2, 4061-V1, 4061-V2, 4063) occurs; and (11) at least temporarily coupling the first probe module and the second probe module (3500-U, 3600-U, 3700-U, 3800-U, 3900-U, 4000-U; 3500-L, 3600-L, 3700-L, 3800-L, 3900-L, 4000-L) to each other using at least one motion selected from the group consisting of: (i) lateral motion, (ii) longitudinal motion, (iii) rotational motion, and (iv) a combination of these motions, wherein the first probe module and the second probe module (3500-U, 3600-U, 3700-U, 3800-U, 3900-U, 4000-U;The interlocking of the probe modules (3500-L, 3600-L, 3700-L, 3800-L, 3900-L, 4000-L) occurs via engagement of a resiliently flexible element on one probe module with a feature on another probe module, wherein the engagement is selected from the group consisting of: (i) features that interfere with each other, (ii) features that are recessed relative to each other, and (iii) features that frictionally engage each other.; 4. The method according to claim 1, wherein: At least one feature (3761-V1, 3761-V2, 3761-H1, 3761-H2, 3761-R1, 3761-V2) on one of the first probe module and the second probe module (3500-U, 3600-U, 3700-U, 3800-U, 3900-U, 4000-U; 3500-L, 3600-L, 3700-L, 3800-L, 3900-L, 4000-L) R2, 3861-R1, 3861-R2, 3861-V1, 3861-V2, 3863, 3961-V1, 3961-V2, 3964, 4061-R1, 4061-R2, 4061-V1, 4061-V2, 4063) contacts the first probe module and the second probe module (3500-U, 3600-U, 3700-U, 3800-U, 3900-U, 4000-U ; at least one feature (3761-V1, 3761-V2, 3761-H1, 3761-H2, 3761-R1, 3761-R2, 3861-R1, 3861-R2, 3861-V1, 3861-V2, 3863, 3961-V1, 3961-V2) on another one of 3500-L, 3600-L, 3700-L, 3800-L, 3900-L, 4000-L , 3964, 4061-R1, 4061-R2, 4061-V1, 4061-V2, 4063), thereby providing a fixed connection position of the first probe module and the second probe module (3500-U, 3600-U, 3700-U, 3800-U, 3900-U, 4000-U; 3500-L, 3600-L, 3700-L, 3800-L, 3900-L, 4000-L).

5. The method according to claim 4, wherein: At least one feature (3761-V1, 3761-V2, 3761-H1, 3761-V2) on one of the first probe module and the second probe module (3500-U, 3600-U, 3700-U, 3800-U, 3900-U, 4000-U; 3500-L, 3600-L, 3700-L, 3800-L, 3900-L, 4000-L) 761-H2, 3761-R1, 3761-R2, 3861-R1, 3861-R2, 3861-V1, 3861-V2, 3863, 3961-V1, 3961-V2, 3964, 4061-R1, 4061-R2, 4061-V1, 4061-V2, 4063) includes a plurality of features, and the first probe module and at least one feature (3761-V1, 3761-V2, 3761-H1, 3761-H2) on another one of the second probe modules (3500-U, 3600-U, 3700-U, 3800-U, 3900-U, 4000-U; 3500-L, 3600-L, 3700-L, 3800-L, 3900-L, 4000-L) , 3761-R1, 3761-R2, 3861-R1, 3861-R2, 3861-V1, 3861-V2, 3863, 3961-V1, 3961-V2, 3964, 4061-R1, 4061-R2, 4061-V1, 4061-V2, 4063) provide such multiple features that provide multiple hard stops.

6. The method according to claim 5, wherein: The plurality of features (3761-V1, 3761-V2, 3761-H1, 3761-H2, 3761-R1, 3761-V2) on each of the first probe module and the second probe module (3500-U, 3600-U, 3700-U, 3800-U, 3900U, 4000-U; 3500-L, 3600-L, 3700-L, 3800-L, 3900-L, 4000-L) 1-R2, 3861-R1, 3861-R2, 3861-V1, 3861-V2, 3863, 3961-V1, 3961-V2, 3964, 4061-R1, 4061-R2, 4061-V1, 4061-V2, 4063) includes at least three features on each of the first probe module and the second probe module, and the at least three features cooperate along all three axes of the relevant coordinate system.

7. The method according to claim 6, wherein: The at least three features on each of the first and second probe modules include at least four features on each of the first and second probe modules.

8. The method according to claim 5, wherein: The plurality of features (3761-V1, 3761-V2, 3761-H1, 3761-H2, 3761-R1, 3761-R2, 3861-R1, 3861-R2, 3861-V1, 3861-V2, 3863, 3961-V1, 3961-V2, 3964, 4061-R1, 4061-R2, 4061-V1, 4061-V2, 4063) of providing a plurality of hard stops provide alignment stops along at least two of the following: (1) at least one lateral direction, (2) a longitudinal direction, (3) at least two at least one direction at a separation point, wherein the at least two separation points are not aligned with the at least one direction, (4) at least one direction at at least three separation points, wherein the at least three separation points are not collinear and no pair of points are aligned with the at least one direction, (5) at least two perpendicular lateral dimensions, (6) two perpendicular directions, (5) at least one direction and one rotation, (6) at least two perpendicular directions and at least one rotation, (7) at least three perpendicular directions and at least one rotation, (8) at least one direction and at least two perpendicular rotations, and (9) at least one direction and three perpendicular rotations.

9. The method according to claim 4, wherein: The brackets (3511-U, 3611-U, 3811-U, 3911-U, 4011-U; 3511-L, 3611-L, 3811-L, 3911-L, 4011-L) of the first and second probe modules (3500-U, 3600-U, 3700-U, 3800-U, 3900-U, 4000-U; 3500-L, 3600-L, 3700-L, 3800-L, 3900-L, 4000-L) include at least one feature, wherein the at least one feature is a complementary longitudinal, rotational, and radial stop feature, which is arranged in opposite longitudinal orientations. When the first probe module and the second probe module (3500-U, 3600-U, 3700-U, 3800-U, 3900-U, 4000-U; 3500-L, 3600-L, 3700-L, 3800-L, 3900-L, 4000-L) are connected, the lateral and longitudinal alignment of the first probe module and the second probe module (3500-U, 3600-U, 3700-U, 3800-U, 3900-U, 4000-U; 3500-L, 3600-L, 3700-L, 3800-L, 3900-L, 4000-L) enables the features to be engaged.

10. The method according to claim 1, wherein: The first probe module (3800-U, 3900-U, 4000-U) includes a first base (3801-U, 3901-U, 4001-U) located between its corresponding brackets and provided with a joint slot (3862, 3962, 4062), and the second probe module (3800-L, 3900-L, 4000-L) includes a second base (3801-L, 3901-U, 4001-L) located between its corresponding brackets and provided with a top cover structure (3863, 3963, 4063), the The top cover structure is attached to the second base (3801-L, 3901-U, 4000-L) via a narrower neck region, the method comprising: first lateral separation to separate the first base (3801-U, 3901-U, 4001-U) of the first probe module (3800-U, 3900-U, 4000-U) from the top cover structure (3863, 3963) attached to the second base (3801-L, 3901-L, 4001-L) of the second probe module (3800-L, 3900-L, 4001-L) , 4063) separation; followed by longitudinal alignment, wherein the first probe module (3800-U, 3900-U, 4000-U) is positioned above the second probe module (3800-L, 3900-L, 4001-L), wherein the corresponding first and second ends (3831-U, 3931-U, 4031-U; 3531-L, 3631-L, 3731, 3831-L, 3931-L, 4031-L) are displaced from each other; and additional lateral movement, wherein the additional lateral movement is achieved by attaching the first probe module to the second The top cover structure (3863, 3963, 4063) of the second base (3801-L, 3901-L, 4001-L) of the probe module (3800-L, 3900-L, 4000-L) is engaged with the engaging slot (3862, 3962, 4062) of the first base (3801-U, 3901-U, 4001-U) of the first probe module (3800-U, 3900-U, 4000-U) so that the first probe module and the second probe module (3800-U, 3900-U, 4000-U);The top cover structure (3863, 3963, 4063) is laterally aligned and mated with the second base (3800-L, 3900-L, 4000-L), the engaging slot (3862, 3962, 4062) of the first base (3801-U, 3901-U, 4001-U) has a plurality of alignment features (3861-R1, 3861-R2, 3861-V2, 3961-R1, 3961-R2, 3961-V2, 4061-R1, 4061-R2, 4061-V2), and the top cover structure (3863, 3963, 4063) is aligned with the second base (3801-U, 3901-U, 4001-U) through the narrower neck region. 1-L, 3901-L, 4001-L) to form an undercut region between the top cover structure (3863, 3963, 4063) and the second base (3801-L, 3901-L, 4001-L), the undercut region being capable of effectively engaging and retaining the first base (3801-U, 3901-U, 4001-U) of the first probe module (3800-U, 3900-U, 4000-U) by inserting the top cover structure (3863, 3963, 4063) into the engaging slot (3862, 3962, 4062). ; 11. The method according to claim 1, wherein: The first probe module (3900-U) includes a first base (3901-U) located between its corresponding brackets and provided with an engagement slot (3962), and the second probe module (3900-L) includes a second base (3901-L) located between its corresponding brackets and provided with a spring element (3964), the spring element being attached to the second base (3901-L) via a narrower neck region, the method comprising: first lateral separation to separate the first base (3901-U) of the first probe module (3900-U) from the spring element (3964) attached to the second base (3901-L) of the second probe module (3900-L); 3964) separation; followed by longitudinal alignment, wherein the first probe module (3900-U) is positioned above the second probe module (3900-L), wherein the corresponding ends (3931-U, 3931-L) are displaced from each other; and additional lateral movement, wherein the first probe module and the second probe module (3900-U, 3900-L) are laterally aligned and mated by elastically engaging a spring element (3964) attached to the second base (3901-L) of the second module (3900-L) in an engagement slot (3962) of the first base (3901-U) of the first probe module (3900-U).

12. The method according to claim 11, wherein: The additional lateral movement elastically forces the spring element (3964) of the second probe module (3900-L) into contact with at least one bracket (3911-U) connected to the first base (3901-U) of the first probe module (3900-U).

13. The method according to claim 11, wherein: At least one of the first and second probe modules (3900-U, 3900-L) further comprises an additional spring providing a bias selected from the group consisting of: (i) a longitudinal bias; (ii) a transverse bias or (iii) a mixed longitudinal / transverse bias.

14. The method according to claim 1, wherein: The first probe module (4000-U) includes a first base (4001-U) located between its corresponding brackets and provided with an opening (4062), and the second probe module (4000-L) includes a second base (4001-L) located between its corresponding brackets and provided with a top cover feature (4063) having an oblong shape, the top cover feature being attached to the second base (4001-L) through a narrower neck region, the method comprising: first lateral separation to allow the The first base (4001-U) of the first probe module (4000-U) is separated from the top cover structure (4063) of the second base (4001-L) attached to the second probe module (4000-L); followed by relative movement, wherein the first probe module (4000-U) is positioned above the second probe module (4000-L), wherein the corresponding ends (4031-U, 4031-L) are displaced from each other, and the second base (4001-L) attached to the second probe module (4000-L) is displaced from each other. The top cover structure (4063) of the base (4001-L) is inserted into the opening (4062) of the first base (4001-) of the first probe module (4000-U), and the opening (4062) of the first base (4001-U) of the first module (4000-U) has a shape that is complementary to and slightly larger than the top cover feature (4063) of the second base (4001-L) attached to the second probe module (4000-L) to allow the top cover feature (4063) to pass through. Inserted through the opening (4062); and rotational movement, the rotational movement engaging the first probe module and the second probe module (4000-U, 4000-L) by causing a portion of a top cover structure (4063) attached to the second base (4001-L) of the second probe module (4000-L) to overlap with a portion of an opening (4062) of the first base (4001-U) of the first probe module (4000-U) surrounding the first base (4001-U).

15. The method according to claim 14, wherein: The rotational movement of the first and second probe modules (4000-U, 4000-L) aligns the corresponding brackets (4011-U, 4011-L) longitudinally.

16. A probe for making contact between two electronic circuit elements, comprising: (a) at least one first probe module (3500-U, 3600-U, 3700-U, 3800-U, 3900-U, 4000-U), the at least one first probe module comprising at least one bracket (3511-U, 3611-U, 3711, 3811-U, 3911-U, 4011-U) and at least one first flexible element (3521-U, 3621-U, 3721, 3821-U, 3921-U, 4021-U), the at least one first flexible element comprising a spring element providing flexibility in a direction substantially perpendicular to the planar configuration, wherein a first portion of the first flexible element (3521-U, 3621-U, 3721, 3821-U, 3921-U, 4021-U) is functionally connected to the at least one bracket (3511-U, 3611-U, 3711, 3811-U, 3911-U, 4011-U) 11, 3811-U, 3911-U, 4011-U), and a second portion of the first flexible element (3521-U, 3621-U, 3721, 3821-U, 3921-U, 4021-U) is functionally connected to a first probe arm that is resiliently movable relative to the at least one support, wherein the first probe arm directly or indirectly holds a first end (3531-U, 3631-U, 3731, 3831-U, 3931-U, 4031-U), and when the first flexible element (3521-U, 3621-U, 3721, 3821-U, 3921-U, 4021-U) is not biased, the first end longitudinally extends beyond the at least one support (3511-U, 3611-U, 3711, 3811-U, 3911-U, 4011-U); and (b) at least a second probe module (3500-L, 3600-L, 3700-L, 3800-L, 3900-L, 4000-L), the second probe module comprising at least one bracket (3511-L, 3611-L, 3711, 3811-L, 3911-L, 4011-L) and at least one second flexible element (3521-L, 3621-L, 3721, 3821-L, 3921-L, 4021-L), the at least one second flexible element includes a spring element providing flexibility in a direction substantially perpendicular to the planar configuration, wherein a first portion of the second flexible element (3521-L, 3621-L, 3721, 3821-L, 3921-L, 4021-L) is functionally coupled to the at least one bracket (3521-L, 3621-L, 3721, 3821-L, 3921-L, 4021-L), and a second portion of the second flexible element (3521-L, 3621-L, 3721, 3821-L, 3921-L, 4021-L) is functionally coupled to a second probe arm capable of elastically moving relative to the at least one bracket (3521-L, 3621-L, 3721, 3821-L, 3921-L, 4021-L), wherein the second probe arm directly or indirectly holds the second end (3521-L, 3621-L, 3721, 3821-L, 3921-L, 4021-L) 31-L, 3631-L, 3721, 3831-L, 3931-L, 4031-L), when the second flexible element (3521-L, 3621-L, 3721, 3821-L, 3921-L, 4021-L) is not biased, the second end extends longitudinally beyond the at least one bracket (3521-L, 3621-L, 3721, 3821-L, 3921-L, 4021-L); wherein first portions of the first and second flexible elements (3521-U, 3621-U, 3721, 3821-U, 3921-U, 4021-U; 3521-L, 3621-L, 3721, 3821-L, 3921-L, 4021-L) are longitudinally spaced apart from each other by the at least one bracket (3511-U, 3611-U, 3811-U, 3911-U, 4011-U; 3511-L, 3611-L, 3811-L, 3911-L, 4011-L), and wherein at the first and second ends (3531-U, 3631-U, 3731-L) 1, 3831-U, 3931-U, 4031-U; 3531-L, 3631-L, 3731, 3831-L, 3931-L, 4031-L) are biased toward the other, the second portions of the first and second flexible elements (3521-U, 3621-U, 3721, 3821-U, 3921-U, 4021-U; 3521-L, 3621-L, 3721, 3821-L, 3921-L, 4021-L) move longitudinally in a manner selected from the group consisting of: (A) move closer together, and (B) move further apart; and Among them, at least one bracket (3511-U, 3611-U, 3711, 3811-U, 3911-U, 4011-U) of the first probe module (3500-U, 3600-U, 3700-U, 3800-U, 3900-U, 4000-U) and at least one bracket of the second probe module (3500-L, 3600-L, 3700-L, 3800-L, 3900-L, 4000-L) (3511-L, 3611-L, 3711, 3811-L, 4011-L) are directly or indirectly connected to each other so as to space the at least one first flexible element (3521-U, 3621-U, 3721, 3821-U, 3921-U, 4021-U) from the at least one second flexible element (3521-L, 3621-L, 3721, 3821-L, 3921-L, 4021-L).

17. The probe according to claim 16, wherein: At least one of the first probe module and the second probe module (3500-U, 3600-U, 3700-U, 3800-U, 3900-U, 4000-U; 3500-L, 3600-L, 3700-L, 3800-L, 3900-L, 4000-L) further comprises a base (3501-U, 3501-L, 3601-L, 3 801-U, 3801-L, 3901-U, 3901-L, 4001-U, 4001-L, the corresponding at least one bracket (3511-U, 3611-U, 3811-U, 3911-U, 4011-U; 3511-L, 3611-L, 3811-L, 3911-L, 4011-L) of the at least one probe module is connected to the base, wherein the base (3501-U, 3501-L, 3601-L, 3801-U, 3801-L, 3901-U, 3901-L, 4001-U, 4001-L) is located on at least one bracket (3511) of the first probe module (3500-U, 3600-U, 3700-U, 3800-U, 3900-U, 4000-U) -U, 3611-U, 3711, 3811-U, 3911-U, 4011-U) and at least one bracket (3511-L, 3611-L, 3711, 3811-L, 3911-L, 4011-L) of the second probe module (3500-L, 3600-L, 3700-L, 3800-L, 3900-L, 4000-L).

18. The probe according to claim 16, wherein The first probe module and the second probe module (3700-U, 3800-U, 3900-U, 4000-U; 3700-L, 3800-L, 3900-L, 4000-L) include at least one corresponding feature (3761-V1, 3761-V2, 3761-H1, 3761-H2, 3761-R1, 3761-R2, 3861-R1, 3861-R2, 3861-V1, 3861-V2, 3863, 3961-V1, 3961-V2, 3964, 4061- R1, 4061-R2, 4061-V1, 4061-V2, 4063), the contact between the features of the first probe module and the second probe module (3700-U, 3800-U, 3900-U, 4000-U; 3700-L, 3800-L, 3900-L, 4000-L) provides a fixed connection position of the first probe module and the second probe module (3700-U, 3800-U, 3900-U, 4000-U; 3700-L, 3800-L, 3900-L, 4000-L).

19. The probe according to claim 18, wherein The first and second probe modules (3700-U, 3800-U, 3900-U, 4000-U; 3500-L, 3600-L, 3700-L, 3800-L, 3900-L, 4000-L) include a plurality of features (3761-V1, 3761-V2, 3761-H1, 3761-H2, 3761-R1, 3761-R2, 3861-R1, 3861-R2, 3861-V1, 3861-V2, 3863, 3961-V1, 3961-V2, 3964, 4061-R1, 4061-R2, 4061-V1, 4061-V2, 4063) that mate along at least one axis of a related coordinate system.

20. The probe according to claim 18, wherein The brackets (3711-U, 3711-L) of the first probe module and the second probe module (3700-U, 3700-L) include at least one feature (3761-V1, 3761-V2, 3761-H1, 3761-H2, 3761-R1, 3761-R2), wherein the at least one feature is a complementary longitudinal, rotational, and radial stop feature, and when the first probe module and the second probe module (3700-U, 3700-L) are connected in opposite longitudinal orientations, the lateral and longitudinal alignment of the first probe module and the second probe module (3700-U, 3700-L) enables the features (3761-V1, 3761-V2, 3761-H1, 3761-H2, 3761-R1, 3761-R2) to engage.

21. The probe according to claim 16, wherein The first probe module (3800-U, 3900-U, 4000-U) includes a first base (3801-U, 3901-U, 4001-U) located between its corresponding brackets and provided with an engagement slot (3862, 3962, 4062), and the second probe module (3800-L, 3900-L, 4000-L) includes a second base (3801-L, 3901-L, 4001-L) located between its corresponding brackets and provided with a top cover structure (3863, 3963, 4063), the top cover structure being connected by a narrower neck The area is attached to the second base (3801-L, 3901-L, 4001-L), and the top cover structure (3863, 3963, 4063) of the second base (3801-L, 3901-L, 4001-L) attached to the second probe module (3800-L, 3900-L, 4000-L) is capable of engaging with the first base (3801-U, 3901-U, 4001-U) of the first probe module (3800-U, 3900-U, 4000-L) by being inserted into the engaging slot (3862, 3962, 4062).

22. The probe according to claim 16, wherein The first probe module (3900-U) includes a first base (3901-U) located between its corresponding brackets and provided with a coupling groove (3962), and the second probe module (3900-L) includes a second base (3901-L) located between its corresponding brackets and provided with a spring element (3964), the spring element being attached to the second base (3901-L) via a narrower neck area, the first probe module and the second probe module (3900-U, 3900-L) being coupled by elastically engaging the spring element (3964) attached to the second base (3901-L) of the second module (3900-L) in the coupling groove (3962) of the first base (3901-U) of the first probe module (3900-U).

23. The probe according to claim 22, wherein: At least one of the first and second probe modules (3900-U, 3900-L) further comprises an additional spring providing a bias selected from the group consisting of: (i) a longitudinal bias; (ii) a transverse bias or (iii) a mixed longitudinal / transverse bias.

24. The probe according to claim 16, wherein The first probe module (4000-U) includes a first base (4001-U) located between its corresponding brackets and provided with an opening (4062), and the second probe module (4000-L) includes a second base (4001-L) located between its corresponding brackets and provided with a top cover feature (4063) having an oblong shape, the top cover feature being attached to the second base (4001-L) via a narrower neck region, the opening (4062) of the first base (4001-U) of the first module (4000-U) having a similar opening to the second base (4001-L) attached to the second probe module (4000-L). The top cover feature (4063) is complementary in shape and slightly larger in size to allow the top cover feature (4063) to be inserted through the opening (4062), and the first probe module and the second probe module (4000-U, 4000-L) are joined by overlapping a portion of the top cover structure (4063) attached to the second base (4001-L) of the second probe module (4000-L) with a portion of the opening (4062) of the first base (4001-U) of the first probe module (4000-U) surrounding the first base (4001-U).

25. The probe according to claim 16, wherein The at least one first flexible element (3521-U, 3621-U, 3721, 3821-U, 3921-U, 4021-U) and the at least one second flexible element (3521-L, 3621-L, 3721, 3821-L, 3921-L, 4021-L) include at least one two-dimensional substantially planar spring as a corresponding spring element when not biased, so that the first flexible element and the second flexible element provide flexibility in a direction substantially perpendicular to the planar configuration.

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