A grinding method

Abstract

The present invention relates to the field of grinding, and in particular to a grinding method. A grinding method, the steps are as follows: S1: fix the workpiece to be ground on a grinding table with a solid adhesive film; S11: form a solid adhesive film on a transition plate; S12: place the workpiece to be ground on the solid adhesive film, so that the workpiece to be ground is fixed to the transition plate through the solid adhesive film; S13: fix the transition plate to the grinding table of the grinder. S2: perform grinding on the workpiece to be ground. A grinding method of the present invention improves the single grinding accuracy and achieves better flatness.

Description

Technical Field

[0001] The invention relates to the field of grinding, and in particular to a grinding method. Background Art

[0002] The development of semiconductor information technology has placed extremely high demands on the planarization of carrier materials. In integrated circuit manufacturing, the planarization of materials directly affects the performance and integration of devices. Grinding is a precision machining method that can achieve material planarization by removing the minimum amount of material from the workpiece to provide fine finish and tight dimensional tolerances. Through precision grinding, high-precision planarization of semiconductor materials can be achieved to meet the strict requirements of integrated circuits for material surface flatness, thereby promoting the improvement of semiconductor device performance and the increase of integration.

[0003] See also Figure 1 , which is an existing grinding processing device, including a grinding table 1, a grinding head 2, a grinding fluid nozzle 3 and a clamping mechanism, wherein the clamping mechanism includes a cushion block 4 and a sliding block 5. The upper surface of the grinding table 1 is a plane with a relatively high flatness, the cushion block 4 is placed on the upper surface of the grinding table 1, the surface of the workpiece to be ground is placed horizontally on the cushion block 4 with the surface facing upward, two sliding blocks 5 are arranged on both sides of the upper surface of the grinding table 1 and can slide on the grinding table 1, the two sliding blocks 5 slide toward the workpiece to clamp the workpiece, and when the grinding process is performed, the grinding fluid nozzle 3 continuously sprays the grinding fluid to the workpiece, and the grinding operation is performed on the surface of the workpiece to be ground through the grinding head 2.

[0004] Flatness is the maximum deviation of the plane of the material surface from the ideal plane in all directions. The flatness of semiconductor materials after grinding directly affects the performance and integration of the device, so a new grinding method is urgently needed to improve the flatness of grinding.

[0005] However, the existing grinding processing device has the problem of low processing accuracy and poor flatness of the workpiece after a single grinding process, and it is difficult to meet the current requirements of semiconductor materials for flatness. Summary of the invention

[0006] Based on this, the purpose of the present invention is to overcome the defects or shortcomings of the prior art and provide a grinding method and device.

[0007] A grinding method comprises the following steps:

[0008] S1: The workpiece to be ground is fixed on the grinding table by a solid adhesive film.

[0009] S2: Grinding the workpiece to be ground.

[0010] Compared with the prior art, the grinding method described in the present invention compensates the gap between the workpiece to be ground and the supporting plane through a solid rubber film, reduces the deformation of the workpiece to be ground, thereby improving the single processing accuracy and achieving better flatness of the workpiece surface after single processing.

[0011] Furthermore, the step S1 comprises the following steps:

[0012] S11: forming a solid film on the grinding table.

[0013] S12: placing the workpiece to be ground on the solid adhesive film; heating the workpiece to be ground to melt the solid adhesive film in contact with the workpiece, and then cooling it to room temperature, so that the workpiece to be ground is fixed on the grinding table through the solid adhesive film.

[0014] Alternatively, for the convenience of operation, a transition plate is introduced, and the step S1 includes the following steps:

[0015] S11: forming a solid adhesive film on a transition plate.

[0016] S12: placing the workpiece to be ground on the solid adhesive film; heating the workpiece to be ground to melt the solid adhesive film in contact with the workpiece, and then cooling it to room temperature so that the workpiece to be ground is fixed on the transition plate through the solid adhesive film.

[0017] S13: placing the transition plate fixed with the workpiece to be ground on the grinding table of the grinding machine, and fixing the transition plate with a clamping mechanism on the grinding table.

[0018] By first forming a solid adhesive film and then fixing the workpiece to be ground, the solid adhesive film does not melt into a liquid phase over a large area when compensating the workpiece to be ground and the supporting plane, and the amount of solid adhesive film melted is less, thereby reducing the deformation of the workpiece to be ground caused by the solid phase shrinkage of the hot melt adhesive.

[0019] Furthermore, between the steps S11 and S12, there is also a step of forming a plurality of grooves on the upper surface of the solid film. By grooving the solid film, the stress and strain generated during the bonding process between the workpiece to be ground and the solid film are divided into a plurality of regions by the grooves, and the stress and strain generated during the solidification process of the solid film will not be transmitted to the workpiece to be ground over a large area, thereby preventing the workpiece to be ground from being deformed over a large area.

[0020] Furthermore, the plurality of grooves on the upper surface of the solid film are staggered to form a plurality of square or triangular contact areas on the upper surface of the solid film. Furthermore, the number of the contact areas is 532-2128 / m², the groove width is 0-5 mm, and the depth is 1-5 mm.

[0021] Furthermore, in step S11, a glue tank is provided on the upper surface of the transition plate or the grinding table, and the hot melt adhesive fluid is poured into and spread over the glue tank, and the solid adhesive film is formed after cooling. The glue tank is used to limit the flow of the hot melt adhesive fluid and prevent the hot melt adhesive from flowing out of the range of the transition plate.

[0022] Furthermore, in step S12, the workpiece to be ground is heated to a temperature 5-10° C. lower than the melting point of the hot melt adhesive, so that the contact area between the solid adhesive film and the workpiece to be ground is partially melted, thereby fixing the workpiece to be ground on the solid adhesive film.

[0023] Furthermore, in step S12, when the workpiece to be ground is heated, a pressure of 0-3 g / cm2 is also applied to the workpiece to be ground, so that the workpiece to be ground and the solid adhesive film are more closely attached, thereby improving the fixing effect of the workpiece to be ground.

[0024] In addition, the present invention also provides a grinding device, including a grinding mechanism with a grinding table and a glue mechanism; the glue mechanism includes a glue gun and a heating pad; the glue gun can inject hot melt glue fluid into the upper surface of the grinding table; the heating pad can heat the grinding table or the workpiece to be ground. The workpiece to be ground is fixed on the grinding table by a solid glue film formed by the hot melt glue fluid, and is ground by the grinding mechanism.

[0025] Furthermore, the gluing mechanism also includes a transition plate, which can be fixed on the grinding table, and the glue gun injects hot melt adhesive fluid into the transition plate, and the workpiece to be ground is fixed on the transition plate through a solid adhesive film formed by the hot melt adhesive fluid.

[0026] Furthermore, the gluing mechanism also includes a slotting member, which can slot the solid glue film formed after the hot melt glue fluid is cooled and solidified.

[0027] Furthermore, a glue containing groove is provided on the transition plate or the grinding table.

[0028] For better understanding and implementation, the present invention is described in detail below with reference to the accompanying drawings. BRIEF DESCRIPTION OF THE DRAWINGS

[0029] Figure 1 A schematic diagram of a grinding process structure in the prior art;

[0030] Figure 2 is a flow chart of the grinding method of the present invention;

[0031] Figure 3 It is a schematic diagram of a solid adhesive film having a square contact area after being grooved in the present invention;

[0032] Figure 4It is a front view of the solid adhesive film in which the contact area is square after the grooves are cut in the present invention;

[0033] Figure 5 It is a schematic diagram of a solid adhesive film having a triangular contact area after the grooves are cut in the present invention. DETAILED DESCRIPTION

[0034] In order to improve the precision of grinding, the common method is to improve the type of grinding fluid, the material of the grinding wheel on the grinding head and the numerical control of the grinding wheel. The present invention disassembles and analyzes the existing grinding device and its processing operation process, and finds that the fixing method of the workpiece to be ground during grinding also has a great influence on the precision of grinding. As described in the background technology, the existing grinding process usually adopts a method of clamping the workpiece to be ground from both sides using a mechanical structure to fix the workpiece to be ground. This clamping method allows the workpiece to be ground to be accurately positioned in the horizontal direction, but the accuracy of fixing in the vertical direction is low or even non-fixed. At the same time, the lower surface of the workpiece to be ground and fixed on the grinding table looks flat in the macroscopic view, but it is actually uneven in the microscopic view. During grinding, the unevenness of the lower surface causes a gap between it and the supporting plane. The gap makes it possible for the workpiece to be ground to be deformed, especially for the workpiece to be ground with large size and large deflection. The superposition of the two ultimately leads to the fact that in the actual processing process, the flatness of the workpiece to be ground after one-time processing is difficult to reach a good level.

[0035] Therefore, the present invention takes the fixing method of the workpiece to be ground on the grinding table as the research point for research. Among many fixing methods, the method of fixing the workpiece to be ground on the grinding table by hot melt adhesive is selected to accurately fix the workpiece to be ground in the vertical direction and avoid the gap between the lower surface of the workpiece to be ground and the supporting plane.

[0036] However, in the actual operation process, a new problem arises, that is, if the workpiece to be ground is directly fixed on the grinding table by the melted hot melt adhesive, although the gap between the lower surface of the workpiece to be ground and the supporting plane is filled by the hot melt adhesive, it is still impossible to achieve a higher precision flatness during the grinding process. The present invention is analyzed again and found that when the workpiece to be ground solidifies on the flowing hot melt adhesive, due to the surface tension of the hot melt adhesive fluid and the large-area phase change shrinkage of the hot melt adhesive fluid during the solidification process, the workpiece to be ground will be deformed when fixed.

[0037] In order to avoid the influence of the solidification process of the hot melt adhesive on the workpiece to be ground, the present invention further changes the operation steps of fixing the workpiece to be ground on the grinding table by hot melt adhesive, firstly, the hot melt adhesive fluid is cooled and solidified into a solid adhesive film on the grinding table, and then the workpiece to be ground is placed on the solid adhesive film, and then heated to partially melt the contact surface between the solid adhesive film and the workpiece to be ground, and then the workpiece to be ground is bonded and fixed. This fixing method not only fixes the workpiece to be ground in the vertical direction and fills the gap between the lower surface of the workpiece to be ground and the supporting plane, but also avoids the influence of the hot melt adhesive fluid fixing process on the deformation of the workpiece to be ground.

[0038] The present invention further conducts an in-depth analysis of the stress and strain generated on the workpiece to be ground when the workpiece to be ground is bonded to the solid film. It is believed that when the workpiece to be ground is directly placed on the fixed film, the lower surface of the entire workpiece to be ground is in contact with the solid film and fixed. Such a large contact area will cause the stress and strain generated by the solid film during the fixing process to be transmitted over a large area, which will also cause the ground workpiece to deform over a large area. Therefore, the present invention further studies how to reduce large-area stress and strain, so the solid film is grooved to form multiple independent, small-area bonding areas on the surface of the solid film that are bonded to the workpiece to be ground. Each independent small bonding area only produces a small local stress and strain effect on the workpiece to be ground, and the stress and strain of adjacent areas may also offset each other, thereby reducing the deformation effect of the large-area stress and strain of the solid film on the ground workpiece, so as to minimize the large-area deformation effect of the workpiece to be ground in the vertical direction during the subsequent grinding process.

[0039] Based on the above technical development process, the grinding method of the present invention is finally obtained. The scheme of the present invention is described in detail below in combination with multiple embodiments and drawings.

[0040] Example 1

[0041] The grinding device used in the grinding method of Example 1 of the present invention is an existing general-purpose grinding machine, as described in the background technology, including a grinding table, a grinding head, a grinding fluid nozzle and a clamping mechanism. In this embodiment, the table top of the grinding table is a magnetic table top, and the clamping mechanism is specifically a magnetic positioning pin.

[0042] The workpiece to be ground in this embodiment is a square soda glass with a length and width of 508 mm*610 mm and a thickness of 48 mm. All implementation processes of this embodiment are carried out in a dust-free clean room with a cleanliness level of 10,000.

[0043] Please see attached Figure 2 , Embodiment 1 of the present invention comprises the following steps:

[0044] S1: Fix the workpiece to be ground on the grinding table by means of the solid adhesive film 30 .

[0045] After grinding, the workpiece needs to be taken out from the grinding table for cleaning and reverse grinding. In order to facilitate operation, in this embodiment, a transition plate 10 is introduced during the operation of fixing the workpiece to be ground on the grinding table. The workpiece to be ground is fixed on the transition plate 10 through a solid adhesive film, and then the transition plate 10 is fixed on the grinding table.

[0046] In order to prevent the gap between the transition plate 10 and the grinding table from affecting the grinding effect of the workpiece, the flatness of the front and back sides of the transition plate 10 needs to be high enough. The transition plate 10 in this embodiment is a P20 steel plate with a length and width of 700mm*800mm, a thickness of 50mm, a front flatness of 5μm, and a back flatness of 6μm.

[0047] The step S1 specifically includes the following steps:

[0048] S11: forming a solid adhesive film on a transition plate 10 .

[0049] Specifically, in order to lay the solid adhesive film on a fixed area of ​​the transition plate 10, first place the transition plate 10 horizontally, and use a tape with a width of 1 cm and a thickness of 2 mm to stick a square adhesive groove 20 with a size of 600 mm*700 mm on the front of the transition plate 10 to limit the flow range of the hot melt adhesive. Then use a heating pad to heat the transition plate 10 for 30 minutes. At this time, the temperature of the transition plate 10 measured by a temperature measuring gun is 88±3°C, so that the hot melt adhesive can still remain in a flowing state after being poured into the square adhesive groove 20.

[0050] At the same time, take a beaker and add a hot melt adhesive block, heat it until the adhesive block is completely melted, and obtain a fluid with good fluidity, which is convenient for paving the hot melt adhesive. In this embodiment, the hot melt adhesive used is paraffin hot melt adhesive, which has a melting point of 80° C. and a density of 0.8 g / ml.

[0051] Pour the melted hot melt adhesive into the square adhesive groove 20 formed by the adhesive tape on the transition plate 10 until the entire adhesive groove is covered. After covering, let it stand for 10 minutes to allow the hot melt adhesive to self-level. Then stop heating the transition plate 10. When the hot melt adhesive cools and solidifies and the color changes from colorless and transparent to white, a solid adhesive film 30 is formed.

[0052] S12: placing the workpiece to be ground on the solid adhesive film; heating the workpiece to be ground to melt the solid adhesive film in contact with the workpiece, and then cooling it to room temperature so that the workpiece to be ground is fixed on the transition plate 10 through the solid adhesive film.

[0053] Specifically, the workpiece to be ground is directly covered on the solid adhesive film 30 so that the back of the workpiece to be ground is bonded to the solid adhesive film 30. A heating pad is covered on the workpiece to be ground to heat the workpiece to be ground. A glass plate (508mm*610mm*48mm) of the same size as the workpiece to be ground is pressed on the heating pad directly against the workpiece to be ground, and the surface pressure on the workpiece to be ground is 1.2g / cm². Turn on the heating pad, heat the workpiece to be ground for 60 minutes, and measure the surface temperature of the workpiece to be ground with a temperature gun to be 70±3℃. At this time, the solid adhesive film in contact with the bottom surface of the workpiece to be ground is in a partially melted state, so that the workpiece to be ground is completely bonded to the solid adhesive film. Finally, the heating pad stops heating, allowing the solid adhesive film to cool and solidify, and bond and fix to the workpiece to be ground.

[0054] S13: placing the transition plate 10 fixed with the workpiece to be ground on the magnetic table surface of the grinding table of the grinding device, and fixing the transition plate 10 with magnetic positioning pins.

[0055] S2: Grinding the front side of the workpiece to be ground.

[0056] During the grinding process, the grinding fluid used was Los Petroleum, model LS.SSGP-717, 5% aqueous solution; the grinding wheel used was a 170-mesh resin diamond grinding wheel, and the CNC parameters of the grinding wheel are shown in the following table;

[0057]

[0058] S3: Unfixing the workpiece to be ground.

[0059] Remove the transition plate 10 with the workpiece to be ground fixed from the magnetic table, and then heat the workpiece to be ground again until the solid glue film 30 under the workpiece to be ground changes from white to colorless and transparent, and melts obviously; gently push the workpiece to be ground by hand, and when it can slide in the horizontal direction, use a vacuum suction cup to pull up the workpiece to be ground to complete the release of the workpiece to be ground. Finally, wash the residual glue on the workpiece to be ground with hot water, and then use compressed air to dry the surface moisture of the workpiece to be ground.

[0060] S4: fix the back of the workpiece to be ground upward on the grinding table of the grinder directly with magnetic positioning pins, and grind the back of the workpiece to be ground; then remove the workpiece from the grinding table after grinding, wash the grinding fluid on the surface of the workpiece with water, and use compressed air to blow dry the moisture on the surface of the workpiece.

[0061] Since the processed front side has a relatively high precision flatness, when processing the back side of the workpiece to be ground, the processed front side of the workpiece to be ground can be directly attached to the grinding table and fixed by its magnetic positioning pin.

[0062] When grinding the back of the workpiece, the grinding fluid used is Los Petroleum, model LS.SSGP-717, 5% aqueous solution; the grinding wheel used is a 170-mesh resin diamond grinding wheel, and the numerical control parameters of the grinding wheel are shown in the following table:

[0063]

[0064] Example 2

[0065] The grinding method of Example 2 of the present invention is substantially the same as that of Example 1, with the only difference being that, in step S11, after a solid film is formed on a transition plate 10, grooves are cut on the surface of the solid film 30 to form a plurality of grid-like contact areas.

[0066] Please see attached Figure 3 and attached Figure 4 Specifically, the solid film 30 is grooved with a plastic spatula. After the grooves are formed, a plurality of square contact areas are formed in the solid film 30, the number of which is 532 / m². The width of the groove 40 is 5 mm and the depth is 2 mm.

[0067] And after step S12, when the grinding workpiece is completely bonded and fixed on the solid adhesive film 30, the gaps in the grooves 40 on the upper surface of the solid adhesive film 30 are still clearly visible and are not filled.

[0068] Example 3

[0069] like Figure 5 As shown, the grinding method of Example 3 of the present invention is substantially the same as that of Example 2, with the only difference being that after the solid adhesive film 30 is grooved, the contact area formed is in the shape of a triangle, and the number of the contact areas is 2128 / m².

[0070] Example 4

[0071] The grinding method of the fourth embodiment of the present invention is substantially the same as that of the second embodiment, the only difference being that the width of the grooves on the upper surface of the solid adhesive film 30 is 1 mm.

[0072] Example 5

[0073] The grinding method of the fifth embodiment of the present invention is substantially the same as that of the second embodiment, the only difference being that the width of the grooves on the upper surface of the solid adhesive film 30 is 0.5 mm.

[0074] Comparative Example 1

[0075] In the grinding method of comparative example 1, the workpiece to be ground is directly fixed on the grinding table of the grinding machine by magnetic positioning pins. Then, the workpiece to be ground is ground under the same grinding conditions as in embodiment 1.

[0076] Comparative Example 2

[0077] The grinding method of comparative example 2 is substantially the same as that of comparative example 1, the only difference being that a soft rubber pad is placed between the workpiece to be ground and the grinding table, the rubber pad having a thickness of 1 mm and a hardness of 52A on the Shore A scale, to serve as a buffer during grinding.

[0078] Comparative Example 3

[0079] The grinding method of comparative example 3 is substantially the same as that of example 1, the only difference being that the workpiece to be ground is directly placed on the flowing hot melt adhesive fluid and then cooled and fixed.

[0080] Specifically, in step S11, pour melted hot melt adhesive into the square adhesive groove 20 formed by the adhesive tape on the transition plate 10 until the entire adhesive groove is covered. After covering, let it stand for 10 minutes to allow the hot melt adhesive to self-level, and then directly proceed to step S12 without waiting for the hot melt adhesive to cool and solidify. The workpiece to be ground is directly placed in the flowing hot melt adhesive fluid, and then the hot melt adhesive is cooled and solidified, and the back of the workpiece to be ground is bonded to the solid adhesive film 30 to form a three-layer structure, with the bottom layer being the transition plate 10, the middle layer being the solid adhesive film 30, and the top layer being the workpiece to be ground.

[0081] Test experiment

[0082] After the workpieces ground in Examples 1-5 and Comparative Examples 1-3 were left to stand on a marble platform for 1 hour, a flatness test was performed. The flatness test was performed using the grid method in JJG117-2013, and an electronic level was used to lay out the lines on the plane to be tested at a pitch of 150 mm, in a grid format; after obtaining the horizontal data of each pitch, the flatness of the entire test surface was calculated. The measured flatness is shown in the following table:

[0083]

[0084] By observing the flatness after a single processing in each embodiment and comparative example, it can be found that in comparative example 1, if the existing magnetic table and magnetic positioning pins are used to fix the workpiece to be ground, the flatness of the workpiece after a single grinding process is poor, at more than 30μm. When a soft rubber pad is placed on the back of the workpiece to be ground on the basis of the above-mentioned fixing method, that is, in comparative example 2, the soft rubber pad is used to compensate for the gap between the concave and convex surface of the back of the workpiece and the grinding table and reduce the deformation of the workpiece during the processing. The flatness after a single grinding process is improved, but it is still around 30μm, which cannot meet the higher flatness requirements. The results show that the soft rubber pad has limited effect on compensating the gap between the back of the workpiece and the grinding table. In Comparative Example 3, after the workpiece is fixed by liquid hot melt adhesive, the hot melt adhesive is used to fill the gap on the back of the workpiece, and the workpiece is completely fixed in the vertical direction, so that the flatness is greatly improved. The flatness of the workpiece after a single grinding process reaches about 20μm, indicating that the hot melt adhesive has a good effect on compensating for the uneven gap on the back of the workpiece.

[0085] In Example 1 of the present invention, when the workpiece to be ground is fixed by a solid adhesive film, the solid adhesive film is used to compensate for the gap between the concave-convex surface on the back of the workpiece and the grinding table, and the flatness after a single grinding process reaches within 20 μm. The results show that compared with fixing the workpiece to be ground by liquid hot melt adhesive, the solid adhesive film avoids the deformation of the workpiece caused by the large-area phase change shrinkage of the liquid hot melt adhesive during fixing, thereby improving the flatness after a single grinding process. Further, in Example 2 of the present invention, if the solid adhesive film is grooved to form a plurality of square contact areas to disperse the stress and strain when the workpiece is bonded and fixed with the solid adhesive film, the flatness after a single grinding process can reach within 15 μm. The results show that the solid adhesive film after the groove disperses the contact surface between the workpiece and the solid adhesive film from a complete plane into a plurality of independent small contact surfaces, thereby reducing the stress and strain generated when the workpiece is fixed with the solid adhesive film, and reducing the deformation of the workpiece during the fixing process. In Example 3 of the present invention, if the number of grooves is further increased and the solid film is grooved to form a plurality of triangular contact areas, the flatness after a single grinding process can reach 12 μm, which is an improvement over the flatness achieved by the solid film fixing method of forming a square contact area. The results further illustrate that the flatness of a single grinding process can be greatly improved after the contact surface between the workpiece and the solid film is dispersed from a complete plane into a plurality of independent small contact surfaces. In addition, in Examples 4 and 5 of the present invention, if the width of the grooves is reduced from 5 mm to 1 mm and 0.5 mm, the flatness after a single grinding process can only reach 15 μm, indicating that the reduction in the width of the grooves will reduce the flatness after a single grinding process; the results illustrate that after reducing the width of the grooves, the effective contact area of ​​each independent small contact surface becomes larger, resulting in the stress and strain being relatively poorly dispersed, and further verifying the conclusion that the contact surface between the workpiece and the solid film is dispersed from a complete plane into a plurality of independent small contact surfaces can improve the flatness of a single grinding process.

[0086] Compared with the prior art method of fixing the workpiece to be ground by means of a mechanical clamp, the present invention uses a slotted solid film to fix the workpiece to be ground, which reduces the deformation of the workpiece to be ground and improves the flatness of a single grinding process. Compared with directly compensating the gap by liquid hot melt adhesive, the present invention does not melt into a liquid phase over a large area when compensating the workpiece to be ground and the supporting plane, which reduces the deformation of the workpiece to be ground caused by the surface tension of the liquid; the solid film melts less, which reduces the deformation of the workpiece to be ground caused by the solid phase change and shrinkage of the hot melt adhesive; in addition, the solid film has slots, and the stress and strain generated during the bonding process of the workpiece to be ground and the solid film are divided into multiple areas by the grooves, which will not cause large-area conduction, thereby causing large-area deformation of the workpiece. Compared with manually adding a feeler gauge to compensate the gap, the present invention compensates the workpiece to be ground and the supporting plane by melting the solid film, and the gap filling effect is better; in addition, it does not rely on the operator's judgment of the concave and convex surface of the workpiece to be ground, and it is easier to achieve standardization. In summary, the method of fixing a workpiece by using a grooved solid adhesive film according to the present invention has a good technical effect in improving the flatness of grinding processing.

[0087] Based on the design of the grinding method of the present invention, the present invention further designs a corresponding grinding device, including a grinding mechanism, a glue mechanism and a cleaner. After the workpiece to be ground is fixed on the grinding table of the grinding mechanism by the solid glue film formed by the glue mechanism, the grinding table is used to grind the workpiece to be ground.

[0088] The grinding mechanism includes a frame, a grinding table, a grinding head, and a grinding fluid spray head. The grinding table is fixed on the frame, and a positioning fixture is arranged on it; the grinding mechanism has a mechanical arm, the end of which is arranged above the grinding table and can move in all directions; the grinding head grinds the surface of the workpiece to be ground through the mechanical arm; when the grinding head is grinding, the grinding fluid spray head sprays the grinding fluid toward the grinding head through a mechanical arm.

[0089] The glue applying mechanism includes a glue gun, a slotting part, and a heating pad. The glue gun can spray out hot melt glue fluid, the slotting part can be a slotting knife or an integrated pressed slotting structure in a grid shape, the slotting part can slot the surface of the solid glue film formed by the solidification of the hot melt glue fluid, and the glue gun can directly inject the hot melt glue fluid on the grinding table to form a solid glue film, thereby fixing the workpiece. However, in order to facilitate operation, the glue applying mechanism also has a transition plate with a glue containing groove, which is used to fix the workpiece to be ground through the solid glue film, and is fixed on the grinding table by a positioning fixture.

[0090] In operation, the functional components of the above-mentioned glue-applying mechanism can be used to manually operate the above-mentioned step S1 to form a solid glue film on the transition plate and fix the workpiece to be ground, and then the grinding mechanism can be controlled to grind the workpiece to be ground. In addition, a central console can be further provided on the grinding device to realize automatic control of the above-mentioned glue-applying mechanism, grinding mechanism and cleaning device.

[0091] When the grinding process is controlled by the central console, the transition plate is first fixed on the grinding table by the positioning fixture on the grinding table. The heating pad is placed on the transition plate, and the heating pad is controlled by the central console to heat the transition plate for 30 minutes and then the heating pad is removed. The central console controls a mechanical arm to clamp the glue gun and inject hot melt adhesive fluid with good fluidity into the glue groove of the transition plate, and the hot melt adhesive fluid solidifies after self-leveling to form a solid adhesive film. The central console controls the grooved part to groove the surface of the solid adhesive film. The groove width is 5mm and the depth is 2mm. The solid adhesive film after grooved forms a contact area of ​​532 squares per m². The central console controls a robotic arm to clamp the suction cup to suck the workpiece to be ground, place the workpiece to be ground on the solid adhesive film, make the back of the workpiece to be ground close to the solid adhesive film, and place the heating pad on the workpiece to be ground, control the heating pad to heat the workpiece to be ground for 60 minutes, make the workpiece to be ground and the solid adhesive film completely fit, and then remove the heating pad. Next, the central console sends a signal to the grinding mechanism to grind the workpiece, and at the same time, the grinding fluid nozzle continues to spray grinding fluid to the grinding head. After the grinding process is completed, the central console controls the cleaning device to spray hot water to the workpiece, melt the solid adhesive film and wash away the hot melt adhesive fluid, so that the workpiece is released.

[0092] The terms used in the embodiments of the present application are only for the purpose of describing specific embodiments, and are not intended to limit the embodiments of the present application. The singular forms of "a", "said" and "the" used in the embodiments of the present application and the claims are also intended to include plural forms, unless the context clearly indicates other meanings. It should also be understood that, unless otherwise specified, "multiple" refers to two or more; the term "and / or" used herein refers to and includes any or all possible combinations of one or more associated listed items. When the above description refers to the drawings, unless otherwise indicated, the same numbers in different drawings represent the same or similar elements. In the description of the present application, for those of ordinary skill in the art, the specific meanings of the above terms in the present application can be understood according to the specific circumstances.

[0093] The above-mentioned embodiments only express several implementation methods of the present invention, and the description is relatively specific and detailed, but it cannot be understood as limiting the scope of the invention patent. It should be pointed out that for ordinary technicians in this field, several modifications and improvements can be made without departing from the concept of the present invention, which all belong to the protection scope of the present invention.

Claims

1. A grinding method, characterized in that: The following steps are involved: S1: Fix the workpiece to be ground on the grinding table through a solid adhesive film; Wherein step S1 also includes the following steps: S11: forming a solid adhesive film on a transition plate; S12: placing the workpiece to be ground on the solid adhesive film; heating the workpiece to be ground to melt the solid adhesive film in contact with the workpiece, and then cooling to room temperature so that the workpiece to be ground is fixed on the transition plate through the solid adhesive film; S13: placing the transition plate fixed with the workpiece to be ground on a grinding table of a grinding machine, and fixing the transition plate with a clamping mechanism on the grinding table; S2: Grinding the workpiece to be ground.

2. The grinding method according to claim 1, characterized in that: The step between steps S11 and S12 also includes the step of forming a plurality of grooves on the upper surface of the solid adhesive film.

3. The grinding method according to claim 2, characterized in that: The plurality of grooves on the upper surface of the solid adhesive film are staggered to form a plurality of square or triangular contact areas on the upper surface of the solid adhesive film.

4. A grinding method according to claim 3, characterized in that: The number of contact areas is 532~2128 / m², the groove width is 0~5mm, and the depth is 1~5mm.

5. The grinding method according to claim 3 or 4, characterized in that: In the step S11, a glue containing groove is provided on the upper surface of the transition plate, and hot melt adhesive fluid is poured into and spread over the glue containing groove, and the solid adhesive film is formed after cooling.

6. The grinding method according to claim 5, characterized in that: In the step S12, the workpiece to be ground is heated so that the temperature of the workpiece to be ground is 5-10° C. lower than the melting point of the hot melt adhesive.

7. The grinding method according to claim 6, characterized in that: In the step S12, when the workpiece to be ground is heated, a pressure of 0-3 g / cm2 is also applied to the workpiece to be ground.

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