A chip capacitor tray device

Abstract

The application relates to a chip capacitor tray arranging device, which comprises vibration, driving, material taking, deviation rectifying and tray arranging modules; the driving module is connected with the material taking module and drives the material taking module to pass through the vibration, deviation rectifying and tray arranging modules; the vibration module comprises a vibrating screen and a vibration driver, and the vibrating screen is connected with the vibration driver; the material taking module comprises a first camera and a suction nozzle, the first camera is used for shooting chip capacitors on the vibrating screen, and the suction nozzle is used for adsorbing or desorbing the chip capacitors; the tray arranging module comprises a cam, a cam follower, a clamping jaw device and a collecting box, the cam follower is installed on the clamping jaw device and abuts against the cam, when the cam rotates, the clamping jaw device clamps or releases the collecting box; the deviation rectifying module comprises a second camera, and the second camera is used for shooting the chip capacitors adsorbed by the suction nozzle. The chip capacitor tray arranging device can realize full-automatic tray arranging and does not need manual intervention, so that the tray arranging efficiency and accuracy are improved.

Description

TECHNICAL FIELD

[0001] The present application relates to the field of chip capacitor collection, in particular to a chip capacitor tray placing device. BACKGROUND

[0002] Chip capacitor is a device for storing electric charge, which is composed of two conductors close to each other with an insulating medium in between. It is usually referred to as the ability to store electric charge as capacitance. Capacitor is one of the electronic components widely used in electronic devices, and is widely used in direct current through cross, coupling, bypass, filtering, tuning loop, energy conversion, control and other aspects of the circuit.

[0003] Chip capacitor is small in size, and it is not easy to be regularly placed and collected by existing machines. The accuracy is low when placing, and it is not possible to completely take out when taking out. Usually, manual intervention is required, and the efficiency is low. SUMMARY

[0004] Therefore, the purpose of the present application is to provide a chip capacitor tray placing device to reduce manual intervention during tray placing and improve tray placing efficiency.

[0005] A chip capacitor tray placing device, comprising a vibration module, a driving module, a material taking module, a deviation correcting module, a tray placing module and a control unit; wherein the driving module is connected with the material taking module and can drive the material taking module to move above the vibration module, the deviation correcting module or the tray placing module; the vibration module comprises a vibrating screen and a vibration driver, and the vibrating screen is connected with the vibration driver; the material taking module comprises a first camera and a suction nozzle, the first camera is used to take pictures of chip capacitors on the vibrating screen, and the suction nozzle is rotatable and used to adsorb or desorb chip capacitors; the deviation correcting module comprises a second camera, and the second camera is used to take pictures of chip capacitors on the suction nozzle; the tray placing module comprises a cam, a cam follower, a clamping jaw device and a collection box, the cam follower is installed on the clamping jaw device and abuts against the cam, and when the cam rotates, the clamping jaw device clamps or releases the collection box; the control unit determines the positions of each chip capacitor on the vibrating screen according to the pictures taken by the first camera, the driving module drives the material taking module to move above one of the chip capacitors, and the suction nozzle adsorbs the chip capacitor; the control unit also obtains the deflection angle of the chip capacitor on the suction nozzle according to the pictures taken by the second camera, and the suction nozzle rotates by the deflection angle; when the material taking module moves above the collection box, the suction nozzle desorbs the chip capacitor.

[0006] The chip capacitor tray placing device disclosed in the application comprises a vibration screen, a driving module, a first camera, a control unit, a suction nozzle, a deviation rectifying module, a tray placing module and a cam. When it is necessary to place chip capacitors, the chip capacitors are first placed in the vibration screen, and the stacked chip capacitor products are scattered and laid flat in the vibration screen through vibration of the vibration driver. Then, the driving module moves the material taking module above the vibration screen, the first camera photographs the chip capacitors on the vibration screen, the control unit controls the material taking module to move above one of the chip capacitors, and then the suction nozzle sucks the chip capacitor. After the chip capacitor is sucked by the suction nozzle, the driving module moves the material taking module above the deviation rectifying module, and the second camera photographs to obtain the deflection angle of the chip capacitor. Then, the control unit controls the suction nozzle to rotate by one deflection angle, rotates the chip capacitor to the correct direction, and at the same time, the material taking module moves to the collecting box of the tray placing module to place the chip capacitor. When the collecting box is full of chip capacitors, the cam rotates, the cam follower moves from the concave position of the cam to the convex position, thereby driving the clamping jaw device to move, so that the clamping jaw device loosens the collecting box. At this time, the collecting box can be taken out, and the chip capacitor tray placing is completed. The chip capacitor tray placing device can realize automatic tray placing of chip capacitors. The vibration screen can scatter and lay flat the chip capacitors through vibration, and then the first camera visual function feedback is used to suck and place the chip capacitors one by one, so that the material can be taken out completely. At the same time, the second camera and the control unit are used to complete visual deviation rectification, so that the tray placing efficiency and accuracy are improved.

[0007] As a preferred scheme, the chip capacitor tray placing device further comprises a material cleaning module, the material cleaning module comprises a waste box, when the control unit determines that the posture of the chip capacitor sucked by the material taking module is unqualified according to the picture photographed by the second camera, the driving module drives the material taking module to move above the material cleaning module, and the suction nozzle releases the chip capacitor. That is, when the material taking module sucks the chip capacitor, the chip capacitor with poor posture and unable to correct the posture is moved to the waste box of the material cleaning module after passing through the deviation rectifying module.

[0008] As a preferred scheme, the material cleaning module further comprises a first magnet, a second magnet, a sensor and a base, the first magnet is installed on the waste box, the first magnet is connected with the second magnet, the second magnet is installed on the base, and the sensor is fixed on the base and used to sense whether the waste box exists. When the waste box is taken away, the sensor senses that the waste box is not on the base, and the driving module stops running to ensure safety.

[0009] As a preferred scheme, the material taking module further comprises a lead screw, the lead screw is connected with the first camera and the suction nozzle, and is used to control the vertical movement of the first camera and the suction nozzle. The lead screw can accurately control the movement distance and avoid damaging the chip capacitor.

[0010] As a preferred solution, the swing tray module further comprises a workbench and a collection box carrier, the collection box carrier is fixed on the workbench and located above the cam; the collection box carrier is provided with at least one collection box station, and the collection box station is capable of placing the collection box. The collection box is placed on the collection box station, which facilitates the installation and disassembly of the collection box.

[0011] As a preferred solution, the clamping jaw device comprises a base and a clamping part connected with each other, the base is located below the collection box carrier, the cam follower is located on the base, and the clamping part is located above the collection box. When the clamping jaw device clamps the collection box, the clamping part is pressed on the edge of the collection box. The base and the clamping part are arranged on both sides of the collection box carrier respectively, so that the space is fully utilized and the structure is compact.

[0012] As a preferred solution, the clamping part is provided with a right-angled notch facing the collection box. When the clamping jaw device clamps the collection box, the clamping part is pressed on two adjacent edges of the collection box. The right-angled notch is used to compact the two adjacent edges of the collection box, which facilitates the compacting and loosening of the collection box by the clamping jaw device.

[0013] As a preferred solution, the clamping jaw device has a plurality of clamping jaw devices arranged around the outer side of the cam. The swing tray module further comprises a moving track and a return spring. Each clamping jaw device is installed on the moving track, and the two ends of the return spring are connected with the collection box carrier and the clamping jaw device respectively. When the cam rotates, the clamping jaw device can move along the moving track to approach or move away from the cam, so that the clamping jaw device clamps or loosens the collection box. When the clamping jaw device needs to loosen the collection box, the cam rotates, the cam follower moves from the concave position of the cam to the convex position, the clamping jaw device moves away from the cam, and the return spring is stretched. When the clamping jaw device needs to compact the collection box, the cam rotates, the cam follower moves from the convex position of the cam to the concave position, the return spring is contracted, and the clamping jaw device is pulled to approach the cam.

[0014] As a preferred solution, the swing tray module further comprises an air path assembly. The collection box carrier is provided with an air path, the surface of the collection box station is provided with an air hole, and the air path assembly is in communication with the air path and the air hole. In use, the air path assembly can form a negative pressure, so that the collection box carrier can adsorb the collection box during work, thereby avoiding vibration of the clamping jaw device during resetting and vibration of the collection box.

[0015] As a preferred solution, the swing tray module further comprises an elastic film assembly. The elastic film assembly is detachably connected to the collection box carrier or the workbench. When only the chip capacitor needs to be screened and the swing tray is not needed, the elastic film assembly can be used for collection.

[0016] As a preferred solution, the elastic film assembly comprises a blue film and a jig, the blue film is attached to the surface of the jig, the jig is provided with an air path, the air path assembly is in communication with the air path, and the surface of the jig is provided with an air hole in communication with the air path. In use, the air path assembly can form a negative pressure, so that the blue film is attached to the surface of the jig to form a suitable collection surface. BRIEF DESCRIPTION OF DRAWINGS

[0017] Figure 1 It is a schematic diagram of the overall structure of a chip capacitor tray equipment;

[0018] Figure 2 It is a schematic diagram of the driving module structure of a chip capacitor tray equipment;

[0019] Figure 3 It is a schematic diagram of the local structure of a chip capacitor tray equipment;

[0020] Figure 4 It is a schematic diagram of the vibration module structure of a chip capacitor tray equipment;

[0021] Figure 5 It is an exploded view of the cleaning module of a chip capacitor tray equipment;

[0022] Figure 6 It is a schematic diagram of the deviation correction module structure of a chip capacitor tray equipment;

[0023] Figure 7 It is an exploded view of the tray module of a chip capacitor tray equipment;

[0024] Figure 8 It is a schematic diagram of the material taking module structure of a chip capacitor tray equipment;

[0025] Among them, 1-driving module, 11-first motor, 12-second motor, 2-vibration module, 21-material bin, 22-vibration screen, 23-vibration driver, 3-cleaning module, 31-waste box, 32-first magnet, 33-second magnet, 34-base, 35-sensor, 4-deviation correction module, 41-second camera, 42-fixed seat, 5-tray module, 51-cam, 52-cam follower, 53-claw device, 54-collection box, 55-collection box carrier, 551-collection box station, 56-moving track, 57-elastic film assembly, 58-workbench, 581-air inlet connector, 582-digital display, 6-material taking module, 61-first camera, 62-suction nozzle, 63-screw, 64-solenoid valve assembly, 65-servo motor, 66-synchronous wheel assembly, 67-positive pressure regulating valve, 68-negative pressure regulating valve, 69-connection plate, 71-first direction, 72-second direction, 73-third direction. DETAILED DESCRIPTION

[0026] In order to make the above-mentioned objects, features and advantages of the present invention more obvious and easy to understand, the specific embodiments of the present invention are described in detail below with reference to the accompanying drawings.

[0027] In the following description, many specific details are set forth to facilitate a full understanding of the present invention. However, the present invention may also be implemented in other ways different from those described herein. Those skilled in the art may make similar generalizations without violating the connotation of the present invention. Therefore, the present invention is not limited to the specific embodiments disclosed below.

[0028] Secondly, the term "one embodiment" or "embodiment" herein refers to a specific feature, structure, or characteristic that may be included in at least one implementation of the present invention. The phrase "in one embodiment" appearing in various places throughout this specification does not necessarily refer to the same embodiment, nor does it refer to a separate or selective embodiment that is mutually exclusive of other embodiments.

[0029] Furthermore, the present invention is described in detail with reference to schematic diagrams. For ease of illustration, when describing the embodiments of the present invention, cross-sectional views illustrating device structures may be partially enlarged and not to scale. Furthermore, the schematic diagrams are merely illustrative and should not limit the scope of protection of the present invention. Furthermore, in actual production, the three-dimensional dimensions of length, width, and depth should be included.

[0030] like Figures 1-3 As shown, the chip capacitor wobble plate device described in the present invention includes a drive module 1, a vibration module 2, a material cleaning module 3, a deviation correction module 4, a wobble plate module 5, a material picking module 6, and a control unit. The drive module 1 includes a first motor 11 and a second motor 12. The first motor 11 is connected to the material picking module 6 and drives the material picking module 6 to move in a first direction 71 when in operation. The second motor 12 drives the first motor 11 to move in a second direction 72 when in operation. The movement of the material picking module 6 driven by the first motor 11 and the movement of the first motor 11 driven by the second motor 12 can be achieved through a screw-nut mechanism, or other conventional technologies in the field, which will not be described here. In this embodiment, the first direction 71 and the second direction 72 are located on the same horizontal plane and are perpendicular to each other. The vibration module 2, the material cleaning module 3, the deviation correction module 4, and the wobble plate module 5 are arranged in a straight line along the first direction 71.

[0031] like Figure 4 As shown, the vibration module 2 includes a hopper 21, a vibrating screen 22, and a vibration driver 23. The opening of the hopper 21 faces the vibrating screen 22, and the vibrating screen 22 is connected to the vibration driver 23. The chip capacitors can be placed directly into the vibrating screen 22, or they can be placed into the hopper 21 first and then enter the vibrating screen 22 in batches through the hopper 21. The vibrating screen 22 is vibrated by the vibration driver 23, which spreads and disperses the chip capacitors.

[0032] As shown in Figure 5 The clear material module 3 includes a waste box 31, a first magnet 32, a second magnet 33, a base 34 and a sensor 35. The first magnet 32 is installed on the waste box 31, the first magnet 32 is connected with the second magnet 33, the second magnet 33 is installed on the base 34, and the sensor 35 is fixed on the base 34 for sensing whether the waste box 31 is fixed on the base 34. When the waste box 31 is taken away, the sensor 35 senses that the waste box 31 is not on the base 34, and sends a signal to the control unit, which controls the driving module 1 to stop running to ensure safety.

[0033] As shown in Figure 6 The deviation correction module 4 includes a second camera 41 and a fixing seat 42. The second camera is fixed on the fixing seat 42. The deviation correction module takes a photo of the chip capacitor located above through the second camera 41, and sends the obtained posture information of the chip capacitor to the control unit.

[0034] As shown in Figure 7As shown, the tray placing module 5 comprises a workbench 58, a cam 51, a cam follower 52, a clamping jaw device 53, a collection box 54, a collection box carrier 55, a collection box station 551, a return spring, a moving rail 56, an elastic film assembly 57 and an air path assembly. The cam 51 has four concave positions and four convex positions, which are arranged in sequence with intervals. The cam follower 52, the clamping jaw device 53, the collection box 54 and the moving rail 56 each have four groups. The four groups of clamping jaw devices 53 are arranged around the cam 51, and each group of clamping jaw devices 53 is installed on a corresponding moving rail 56 and can reciprocate along the moving rail 56. Specifically, the reciprocation of the clamping jaw device 53 is realized by a return spring (not shown in the figure). The collection box carrier 55 is fixed to the workbench 58 and located above the cam 51. The collection box carrier 55 has four collection box stations 551. An air path is arranged in the collection box carrier 55, and air holes are arranged on the surface of the collection box station 551, and the air path and the air holes are in communication. In this embodiment, the two ends of the return spring are connected to the clamping jaw device 53 and the collection box carrier 55 respectively. In other embodiments, the return spring can also be installed in the moving rail 56, and the two ends thereof are connected to the bottom end of the clamping jaw device 53 and the end of the moving rail 56 away from the cam 51 respectively. The two ends of the return spring can also be connected to the clamping jaw device 53 and the workbench 58 respectively. The cam follower 52 is installed on the end of the clamping jaw device 53 close to the cam 51 and abuts against the cam 51. The end of the clamping jaw device 53 close to the cam 51 is formed with a right-angled notch. In this embodiment, the collection box 54 is a waffle box, which has a stepped edge. When the cam follower 52 abuts against the concave position of the cam 51, the clamping jaw device 53 abuts against the right-angled edge of the collection box 54 and can compact the edge of the collection box 54. The elastic film assembly 57 is detachably installed on the workbench 58. The elastic film assembly 57 comprises a blue film and a jig. The blue film is attached to the surface of the jig. An air path is arranged in the jig, and air holes are arranged on the surface of the jig, and the air path and the air holes are in communication. The air path assembly comprises an air inlet connector 581 and a digital display table 582. The air inlet connector 581 is connected to the air path in the collection box carrier 55 through a pipeline and is also connected to the air path of the elastic film assembly 57. The digital display table 582 is used to display the pressure conditions in the four collection box stations 551 and the elastic film assembly 57.

[0035] As Figure 8As shown, the taking module 6 includes a first camera 61, a suction nozzle 62, a lead screw 63, a solenoid valve assembly 64, a servo motor 65, a synchronous wheel assembly 66, a positive pressure regulating valve 67, a negative pressure regulating valve 68, and a connecting plate 69. The connecting plate 69 is connected with the first motor 11, the lead screw 63 is rotatably fixed on the connecting plate 69, the first camera 61 and the suction nozzle 62 are sleeved on the lead screw 63, the lead screw rotates to drive the first camera 61 and the suction nozzle 62 to move along a third direction 73, the third direction 73 is perpendicular to the first direction 71 and the second direction 72, and in this embodiment, the third direction 73 is a vertical direction. The first camera 61 is used for taking pictures of the vibrating screen 22 and sending position information of the chip capacitors in the vibrating screen 22 to the control unit. The solenoid valve assembly 64 is electrically connected with the positive pressure regulating valve 67 and the negative pressure regulating valve 68, the positive pressure regulating valve 67 and the negative pressure regulating valve 68 are connected with the suction nozzle 62, the opening and closing of the positive pressure regulating valve 67 and the negative pressure regulating valve 68 can be controlled, thereby adjusting the pressure state of the suction nozzle 62, and the chip capacitors are sucked and placed. The servo motor 65 is connected with the synchronous wheel assembly 66, the synchronous wheel assembly 66 is connected with the suction nozzle 62, the synchronous wheel assembly 66 rotates under the control of the servo motor 65, thereby driving the suction nozzle 62 to rotate, so that the chip capacitors sucked on the suction nozzle 62 rotate to correct the angle.

[0036] The control unit is used for controlling the driving module 1, the vibration module 2, the material cleaning module 3, the deviation rectifying module 4, the tray placing module 5 and the material taking module 6. The control unit can control the driving module 1 to move the material taking module 6 to above the vibration screen 22 of the vibration module; the position of each chip capacitor on the vibration screen can be determined according to the picture taken by the first camera 61, the screw rod 63 and / or the first motor 11 and / or the second motor 12 are controlled to work so that the suction nozzle 62 is moved to above one chip capacitor in the vibration screen 22; when the suction nozzle 62 is above the chip capacitor and the chip capacitor is not sucked, the electromagnetic valve assembly 64 can be controlled to make the suction nozzle 62 in a negative pressure state to suck the chip capacitor; after the chip capacitor is sucked by the suction nozzle 62, the driving module 1 can be controlled to move the material taking module 6 to above the deviation rectifying module 4, and the posture of the chip capacitor is determined by comparing the picture of the chip capacitor sent by the second camera with the standard sample, if the chip capacitor is in an upright posture when being adsorbed or deviates too much from the center of the suction nozzle 62, the posture cannot be corrected, then the driving module 1 is controlled to drive the material taking module 6 to move to above the material cleaning module 3, if the posture is qualified and has a deviation angle, the control unit controls the servo motor 65 to drive the suction nozzle 62 to rotate the corresponding deviation angle to correct the angle, if not, the next step is directly performed; after the angle correction step, the control unit can drive the material taking module 6 to move to above one collecting box 54 in the tray placing module 5, and the electromagnetic valve assembly 64 is controlled to make the suction nozzle 62 in a positive pressure state, so that the chip capacitor falls into the collecting box 54, then the control unit controls the material taking module 6 to move to above the material cleaning module 3 again, and the material throwing process is performed again to ensure that there is no chip capacitor remaining on the suction nozzle 62, so that the chip capacitor is not stuck on the suction nozzle 62, and multiple chip capacitors are stacked when taking the material for the second time.

[0037] The chip capacitor tray placing device of the present application has the following working principle:

[0038] When it is necessary to place the chip capacitors, the chip capacitors are placed in the vibration module 2, the chip capacitors can be directly placed in the vibration screen 22, or are first placed in the stock bin 21 and then enter the vibration screen 22 in batches through the stock bin 21; the vibration screen 22 is vibrated by the vibration driver 23, so that the chip capacitors are laid flat and dispersed. The first motor 11 and the second motor 12 of the driving module 1 drive the material taking module 6 to move to above the vibration screen 22 along the first direction 71 and the second direction 72.

[0039] The first camera 61 of the taking module 6 takes a photo of the vibrating screen 22, the control unit obtains the chip capacitor position information, then controls the rotation of the lead screw 63 to drive the first camera 61 and the suction nozzle 62 to move along the third direction 73, while the first motor 11 and the second motor 12 drive the taking module 6 to move along the first direction 71 and the second direction 72 to above one of the chip capacitors; the control unit controls the electromagnetic valve assembly 64 to open the negative pressure regulating valve 68 and close the positive pressure regulating valve 67, so as to switch to the negative pressure state. For chip capacitors of different sizes and suction distances of different lengths, the negative pressure regulating valve 68 adjusts the suction nozzle 62 to the appropriate pressure, and the chip capacitor is sucked in the air. After the chip capacitor is sucked, the control unit controls the first motor 11 and the second motor 12 to drive the taking module 6 to move along the first direction 71 and the second direction 72 to above the deviation correction module 4, and the second camera 41 takes a photo. The control unit obtains the posture information of the chip capacitor, analyzes through the algorithm and compares with the standard sample posture, judges whether the posture of the chip capacitor when being sucked is qualified, if not, moves to above the cleaning module 3, the electromagnetic valve assembly closes the negative pressure regulating valve 68 and opens the positive pressure regulating valve 67, throws the chip capacitor into the waste box 31, and then the first motor 11 and the second motor 12 drive the taking module 6 to return to above the vibrating module 2 to re-suck the chip capacitor; if the posture of the sucked chip capacitor is qualified, the algorithm is used to determine the deflection angle of the chip capacitor, if the deflection angle of the chip capacitor is not zero, the chip capacitor needs to be corrected, the control unit controls the servo motor 65 to rotate to drive the synchronous wheel assembly 66 to rotate by the above-mentioned deflection angle, and then drives the suction nozzle 62 to rotate, rotates the chip capacitor to the correct direction, and at the same time moves to above one of the collection boxes 54 in the tray module 5. At this time, the control unit controls the electromagnetic valve assembly 64 to open the positive pressure regulating valve 67 and close the negative pressure regulating valve 68, so as to switch to the positive pressure state. Through the positive pressure regulating valve 68, the suction nozzle 62 is adjusted to the appropriate pressure, and the chip capacitor is placed in the collection box 54. Then the control unit drives the taking module 6 to move to above the cleaning module 3 again, and carries out the throwing process again, to complete the tray placing of the chip capacitor.

[0040] When one of the collecting boxes 54 is full, the control unit controls the rotation of the cam 51, the cam follower 52 enters the convex position from the concave position of the cam 51, drives the jaw device 53 to move along the moving guide rail 56, at this time the reset spring is stretched, and the end of the jaw device 53 releases the collecting box 54, takes out the full collecting box 54 from the collecting box station 551, and places a new collecting box 54. Then the cam 51 rotates again, the cam follower 52 enters the concave position from the convex position of the cam 51, at this time the reset spring is contracted, drives the jaw device 53 to reset along the moving guide rail 56, and the end of the jaw device 53 compacts the collecting box 54; when the collecting box 54 is placed in the collecting box station 551, because the air inlet joint 581 is communicated with the air hole on the surface of the collecting box station 551 through the air path in the collecting box carrier 55, the negative pressure generated by the air suction adsorbs the collecting box 54, so as to avoid the vibration caused by the reset spring when resetting, which opens the collecting box 54 and scatters the chip capacitor.

[0041] When only the chip capacitor needs to be screened and does not need to be placed, the elastic film assembly 57 can be used for collection, the air inlet joint 581 is connected with the elastic film assembly 57, the blue film is adsorbed on the surface of the jig to form a suitable collecting surface.

[0042] As shown in Figure 1 The chip capacitor placing device of the embodiment of the present application is a double-station device, has two groups of driving modules 1, vibration modules 2, material cleaning modules 3, deviation correction modules 4, placing modules 5 and material taking modules 6, and can simultaneously place chip capacitors of different sizes.

[0043] The above-described embodiment only expresses one embodiment of the present application, and the description is more specific and detailed, but it cannot be understood as a limitation on the scope of the patent. For ordinary skilled persons in the art, without departing from the concept of the present application, a number of modifications and improvements can be made, which are within the protection scope of the present application.

Claims

1. A chip capacitor panning device, characterized in that: It includes a vibration module, a driving module, a material taking module, a deviation correction module, a swing plate module and a control unit; wherein the driving module is connected to the material taking module and can drive the material taking module to move above the vibration module, the deviation correction module or the swing plate module; The vibration module includes a vibration screen and a vibration driver, and the vibration screen and the vibration driver are connected; The picking module includes a first camera and a suction nozzle, wherein the first camera is used to take pictures of the chip capacitors on the vibrating screen, and the suction nozzle is rotatable and used to adsorb or desorb the chip capacitors; The correction module includes a second camera, which is used to take a picture of the chip capacitor on the nozzle; The swing plate module includes a cam, a cam follower, a clamping device, a workbench, a collection box carrier, a collection box, an air path assembly and an elastic membrane assembly, the cam follower is installed on the clamping device and abuts against the cam, and when the cam rotates, the clamping device clamps or releases the collection box; the collection box carrier is fixed to the workbench and is located above the cam; at least one collection box station is provided on the collection box carrier, and the collection box station can place the collection box; an air path is provided in the collection box carrier, and air holes are provided on the surface of the collection box station; the elastic membrane assembly is detachably connected to the collection box carrier or the workbench; the elastic membrane assembly includes a blue film and a jig, the blue film is attached to the surface of the jig, an air path is provided in the jig, and air holes are provided on the surface of the jig; the air path assembly is connected to the air path and the air holes; The control unit determines the position of each chip capacitor on the vibrating screen based on the picture taken by the first camera, and the driving module drives the material picking module to move above one of the chip capacitors, and the suction nozzle adsorbs the chip capacitor; the control unit also obtains the deflection angle of the chip capacitor on the suction nozzle based on the picture taken by the second camera, and the suction nozzle rotates the deflection angle; when the material picking module moves above the collection box, the suction nozzle detaches the chip capacitor.

2. The chip capacitor wobble device according to claim 1, characterized in that: It also includes a material cleaning module, which includes a waste box. When the control unit determines that the posture of the chip capacitor when being sucked is unqualified based on the picture taken by the second camera, the driving module drives the material picking module to move above the material cleaning module, and the suction nozzle detaches the chip capacitor.

3. The chip capacitor wobble device according to claim 2, characterized in that: The cleaning module also includes a first magnet, a second magnet, a sensor and a base. The first magnet is installed on the waste box, the first magnet is connected to the second magnet, the second magnet is installed on the base, and the sensor is fixed on the base for sensing whether the waste box exists.

4. The chip capacitor wobble device according to claim 1, characterized in that: The material picking module also includes a screw rod, which is connected to the first camera and the suction nozzle and is used to control the vertical movement of the first camera and the suction nozzle.

5. The chip capacitor wobble device according to claim 1, characterized in that: The clamping device includes a base and a clamping portion that are interconnected. The base is located below the collection box carrier, the cam follower is located on the base, and the clamping portion is located above the collection box. When the clamping device clamps the collection box, the clamping portion is pressed against the edge of the collection box.

6. The chip capacitor wobble device according to claim 5, characterized in that: The clamping portion is provided with a right-angled notch facing the collection box. When the clamping jaw device clamps the collection box, the clamping portion is pressed against two adjacent sides of the collection box.

7. The chip capacitor wobble device according to claim 1, characterized in that: There are several clamping devices, which are arranged around the outside of the cam. The swing plate module also includes a movable track and a reset spring. Each clamping device is installed on the movable track. The two ends of the reset spring are respectively connected to the collection box carrier and the clamping device. When the cam rotates, the clamping device can move closer to or away from the cam along the movable track, and the clamping device clamps or releases the collection box.

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