Self-repairing butyl hot melt adhesive for double glass photovoltaic module and preparation method thereof

Abstract

The present application relates to a kind of self-repairing type butyl hot melt adhesive for double glass photovoltaic module and its preparation method.The butyl hot melt adhesive is prepared from raw materials including the following components by weight ratio: butyl rubber 1-40 parts, polyisobutylene 10-80 parts, modified polyisobutylene 5-30 parts, tackifying resin 5-20 parts, water absorbent 1-10 parts, inorganic filler 10-30 parts, reinforcing agent 8-30 parts, antioxidant 0.5-3 parts, light stabilizer 0.5-3 parts, physical crosslinking agent 0.5-4 parts;The modified polyisobutylene is obtained by reacting polyisobutylene succinic anhydride with amino-containing silane coupling agent;The physical crosslinking agent is selected from at least one of amine compounds with di-functionality or more, pyridine compounds, pyridine polymers.The self-repairing type butyl glue has good bonding strength with glass, and also has good self-healing effect.

Description

Technical Field

[0001] The present invention belongs to the technical field of sealants, and in particular relates to a self-repairing butyl hot melt adhesive for double-glass photovoltaic modules and a preparation method thereof. Background Art

[0002] The regular molecular structure of butyl rubber gives it excellent air tightness and very low water vapor permeability. It is widely used in the airtight layer of tire inner tubes, the first seal of insulating glass, building waterproof membranes, special waterproof tapes, and photovoltaic modules.

[0003] Butyl hot-melt adhesive, a single-component, solvent-free, non-fogging, and non-vulcanizing thermoplastic material based on butyl rubber and polyisobutylene, is used as a first-line water barrier edge sealant in photovoltaic modules, particularly those using moisture-sensitive perovskite and heterojunction cells. The dense arrangement of pendant methyl groups in the butyl rubber molecular chain restricts the thermal motion of the polymer molecules, reducing chain flexibility and causing trace crystallization. These structural characteristics give butyl rubber excellent weathering, heat, and alkali resistance, low water vapor permeability, and excellent airtightness. Its air permeability is an order of magnitude lower than that of natural rubber. However, the adhesion of butyl adhesive to glass remains unsatisfactory. Adhesion strength readily deteriorates with aging, and aging under UV, humidity, heat, and high and low temperatures can lead to adhesive failure and delamination. Furthermore, the water vapor barrier property is poor, making it difficult to guarantee the long-term water vapor barrier effect of the sealing tape during use.

[0004] Furthermore, improper application or errors can easily lead to sealant damage, defects, or bubbles, which can degrade the mechanical properties of the butyl hot-melt sealant and, in severe cases, even cause sealing failure, significantly reducing the lifespan of photovoltaic modules. Furthermore, butyl hot-melt sealants lack the ability to repair damage at room temperature, significantly reducing the product's pass rate as an edge sealing system.

[0005] Patent CN112280498A uses a silane coupling agent and polyisobutylene succinic anhydride to prepare silane-modified polyisobutylene succinic anhydride. Although the silane-modified polyisobutylene can improve the adhesion between the butyl hot melt adhesive and the substrate, it does not focus on retaining the carboxyl group, and the resulting butyl adhesive does not have self-healing properties. Summary of the Invention

[0006] Based on this, the present invention provides a self-repairing butyl hot melt adhesive for double-glass photovoltaic modules. The self-repairing butyl adhesive has good bonding strength with the glass and also has good self-healing effect.

[0007] The present invention includes the following technical solutions.

[0008] The first aspect of the present invention is to provide a self-repairing butyl hot melt adhesive for double-glass photovoltaic modules, which is prepared from raw materials comprising the following components in parts by weight:

[0009]

[0010] The modified polyisobutylene is obtained by reacting polyisobutylene succinic anhydride with an amino-containing silane coupling agent;

[0011] The physical cross-linking agent is selected from at least one of amine compounds with difunctionality or higher, pyridine compounds, and pyridine polymers.

[0012] In some embodiments, the self-repairing butyl hot melt adhesive for double-glass photovoltaic modules is prepared from raw materials comprising the following components, in parts by weight:

[0013]

[0014]

[0015] In some embodiments, the self-repairing butyl hot melt adhesive for double-glass photovoltaic modules is prepared from raw materials comprising the following components, in parts by weight:

[0016]

[0017] In some embodiments, the modified polyisobutylene is obtained by reacting polyisobutylene succinic anhydride with an amino-containing silane coupling agent in a molar ratio of 1:0.9-1.1.

[0018] In some embodiments, the modified polyisobutylene is obtained by reacting polyisobutylene succinic anhydride with an amino-containing silane coupling agent in a molar ratio of 1:1.

[0019] In some embodiments, the number average molecular weight of the polyisobutylene succinic anhydride is 1000-3000, preferably 1000-1500.

[0020] In some embodiments, the amino-containing silane coupling agent has the structural formula NHR(CH2) n Si(R1)(OR2)2, wherein R1 is selected from: C1~C3 alkyl, C1~C3 alkoxy; R2 is selected from: C1~C3 alkyl; R is selected from: H, C1~C3 alkyl, amino-substituted C1~C3 alkyl; n is selected from: 2, 3, 4, 5.

[0021] In some embodiments, the amino-containing silane coupling agent is γ-aminopropyltriethoxysilane and / or N-(β-aminoethyl)-γ-aminopropylmethyldimethoxysilane, more preferably N-(β-aminoethyl)-γ-aminopropylmethyldimethoxysilane.

[0022] In some embodiments, the method for preparing the modified polyisobutylene comprises the following steps:

[0023] The polyisobutylene succinic anhydride and the amino-containing silane coupling agent are reacted in an organic solvent at 15° C.-30° C. under an inert gas atmosphere for 1 to 2 hours, and the organic solvent is removed to obtain the modified polyisobutylene.

[0024] In some embodiments, the organic solvent is dichloromethane.

[0025] In some embodiments, the physical crosslinker is selected from at least one of poly(4-vinylpyridine-co-styrene), poly(4-vinylpyridine), bis(2,2,6,6-tetramethyl-4-piperidinyl) sebacate and N,N'-dimethyl-1,6-diaminohexane.

[0026] In some embodiments, the physical crosslinker is poly(4-vinylpyridine).

[0027] In some embodiments, the weight average molecular weight of the poly(4-vinylpyridine) is 50,000 to 70,000.

[0028] In some embodiments, the molar ratio of vinylpyridine to styrene in the poly(4-vinylpyridine-co-styrene) is 1:0.9-1.1, and the weight average molecular weight is 300,000-500,000.

[0029] In some embodiments, the raw Mooney viscosity of the butyl rubber is ML 1+8 It is 40 to 60.

[0030] In some embodiments, the polyisobutylene is composed of two or three of low molecular weight polyisobutylene, medium molecular weight polyisobutylene and high molecular weight polyisobutylene; the viscosity average molecular weight of the low molecular weight polyisobutylene is 400 to 30,000, the viscosity average molecular weight of the medium molecular weight polyisobutylene is 30,000 to 100,000; and the viscosity average molecular weight of the high molecular weight polyisobutylene is 100,000 to 2,000,000.

[0031] In some embodiments, the polyisobutylene is composed of medium molecular weight polyisobutylene and high molecular weight polyisobutylene; the viscosity average molecular weight of the medium molecular weight polyisobutylene is 60,000 to 95,000; the viscosity average molecular weight of the high molecular weight polyisobutylene is 200,000 to 500,000.

[0032] In some embodiments, the polyisobutylene is composed of medium molecular weight polyisobutylene and high molecular weight polyisobutylene; the viscosity average molecular weight of the medium molecular weight polyisobutylene is 70,000 to 80,000; the viscosity average molecular weight of the high molecular weight polyisobutylene is 200,000 to 300,000.

[0033] In some embodiments, the polyisobutylene is composed of medium molecular weight polyisobutylene and high molecular weight polyisobutylene in a mass ratio of 1:1-2.5.

[0034] In some embodiments, the tackifying resin is selected from one or more combinations of C5 petroleum resin, C9 petroleum resin, terpene resin, styrene-grafted terpene resin, polyterpene resin, and natural resin or rosin resin.

[0035] In some embodiments, the water absorbent is selected from one or more combinations of calcium oxide, molecular sieves, calcium sulfate, anhydrous calcium chloride, anhydrous magnesium sulfate, and activated alumina.

[0036] In some embodiments, the inorganic filler is selected from one or more combinations of mica powder, silica powder, kaolin, calcium carbonate, talc, kaolin, clay and diatomaceous earth.

[0037] In some embodiments, the reinforcing agent is selected from one or a combination of carbon black and fumed silica.

[0038] In some embodiments, the antioxidant is selected from pentaerythritol tetrakis[2-(3,5-di-tert-butyl-4-hydroxyphenyl)propionate], octadecyl 3-(3,5-di-tert-butyl-4-hydroxyphenyl)propionate, 2,6-di-tert-butyl-4-methylphenol, tris[2,4-di-tert-butylphenyl]phosphite, 2-methyl-4,6-dinonylphenol, 2,6-di-tert-butyl-α-methoxy-p-cresol, 2,4,6-tri-tert-butylphenol and 2,2,4-trimethyl-1,2-dihydroquinoline polymer. One or more combinations thereof.

[0039] In some embodiments, the light stabilizer is selected from one or more combinations of hindered amine light stabilizers.

[0040] In some embodiments, the light stabilizer is selected from 2'-(2'-hydroxy-3'-tert-butyl-5'-methylphenyl)-5-chlorobenzotriazole and / or 2-[2-hydroxy-5-tert-octylphenyl)benzotriazole.

[0041] The second aspect of the present invention is to provide a method for preparing the self-repairing butyl hot melt adhesive for double-glass photovoltaic modules, comprising the following steps:

[0042] At 110° C. to 160° C., the butyl rubber, polyisobutylene, modified polyisobutylene, tackifying resin and antioxidant are added to a kneader in sequence, and blended under vacuum protection for 20 to 130 minutes; then the inorganic filler, reinforcing agent, water absorbent and physical cross-linking agent are added in sequence, and mixed under vacuum protection for 60 to 180 minutes to obtain the self-repairing butyl hot melt adhesive for double-glass photovoltaic modules.

[0043] In some embodiments, the method for preparing the self-repairing butyl hot melt adhesive for double-glass photovoltaic modules comprises the following steps:

[0044] At 140° C. to 160° C., the butyl rubber, polyisobutylene, modified polyisobutylene, tackifying resin and antioxidant are added to a kneader in sequence, and blended under vacuum protection for 20 to 40 minutes; then the inorganic filler, reinforcing agent, water absorbent and physical cross-linking agent are added in sequence, and mixed under vacuum protection for 100 to 150 minutes to obtain the self-repairing butyl hot melt adhesive for double-glass photovoltaic modules.

[0045] The present invention has the following beneficial effects:

[0046] The present invention graft-modifies polyisobutylene succinic anhydride with an amino-containing silane coupling agent to obtain a modified polyisobutylene having siloxane and carboxyl groups. This modified polyisobutylene is then combined with butyl rubber, polyisobutylene, a specific physical crosslinking agent, and the like through an appropriate formulation to prepare a reactive butyl hot melt adhesive with self-healing properties. In this butyl hot melt adhesive system, the siloxane groups, on the one hand, are used to form a first-layer chemical crosslinking network during a dealcoholization reaction after application, and on the other hand, improve the adhesion of the butyl hot melt adhesive to glass. The carboxyl groups, on the other hand, interact with pyridine and amine groups through hydrogen bonds to form a second-layer physical crosslinking network, enhancing the mechanical properties of the material while also imparting excellent self-healing properties to the butyl hot melt adhesive. With the synergistic coordination of the various components, the butyl hot melt adhesive of the present invention exhibits excellent adhesion to the glass interface, high strength, good mechanical properties, low water vapor transmission rate, and excellent self-healing properties, making it suitable for use in dual-wave photovoltaic modules. Moreover, the non-covalent interactions in the system will undergo reversible dissociation at higher temperatures and will not affect the processing and construction performance of the butyl hot melt adhesive. BRIEF DESCRIPTION OF THE DRAWINGS

[0047] Figure 1 The product NMR of the modified polyisobutylene prepared in Example 1 of the present invention is 1 H-NMR spectrum. DETAILED DESCRIPTION

[0048] To facilitate understanding of the present invention, the present invention will be described more fully below. The present invention can be implemented in many different forms and is not limited to the embodiments described herein. On the contrary, the purpose of providing these embodiments is to make the understanding of the present disclosure more thorough and comprehensive.

[0049] The experimental methods in the following examples, where specific conditions are not specified, are generally carried out under conventional conditions or conditions recommended by the manufacturers. The raw materials and various chemical reagents used in the examples are all commercially available products.

[0050] Unless otherwise defined, all technical and scientific terms used herein have the same meanings as commonly understood by those skilled in the art to which this invention pertains. The terms used in this specification are for the purpose of describing specific embodiments only and are not intended to limit the invention. The term "and / or" as used herein includes any and all combinations of one or more of the associated listed items.

[0051] Furthermore, as used herein, the term "or" is inclusive and equivalent to the term "and / or," unless the context clearly dictates otherwise. The term "based on" is not exclusive and allows for being based on other factors not described, unless the context clearly dictates otherwise. Furthermore, throughout this specification, the meanings of "a," "an," and "the" include plural referents. The meaning of "in" includes "in" and "on."

[0052] The present invention is further described in detail below with reference to specific embodiments.

[0053] In the following embodiments, the normal temperature or room temperature refers to an indoor temperature of 20°C-30°C.

[0054] Example 1

[0055] Polyisobutylene succinic anhydride (M n =1000) and γ-aminopropyltriethoxysilane in a molar ratio of 1:1 were reacted in dichloromethane (based on 1 mol polyisobutylene succinic anhydride: 1 L dichloromethane) at room temperature and under nitrogen atmosphere for 1.5 h. After the reaction, dichloromethane was removed by rotary evaporation to obtain modified polyisobutylene (its NMR 1 H-NMR Figure 1 shown).

[0056] The reaction formula is as follows:

[0057]

[0058] At 150° C., butyl rubber, polyisobutylene mixture, tackifying resin, antioxidant and light stabilizer were added to a kneader in sequence according to Table 1, and the mixture was blended under a vacuum of -0.1 MPa for 30 minutes. Then, inorganic filler, reinforcing agent, water absorbent and pyridine-based polymer were added in sequence, and the mixture was thoroughly mixed under a vacuum of -0.1 MPa for 120 minutes to obtain a self-repairing butyl hot melt adhesive for double-glass photovoltaic modules.

[0059] Table 1

[0060]

[0061]

[0062] Example 2

[0063] Polyisobutylene succinic anhydride (M n =1000) and N-(β-aminoethyl)-γ-aminopropylmethyldimethoxysilane in a molar ratio of 1:1 were reacted in dichloromethane (based on 1 mol of polyisobutylene succinic anhydride: 1 L of dichloromethane) at room temperature under a nitrogen atmosphere for 1.5 hours. After the reaction, the dichloromethane was removed by rotary evaporation to obtain modified polyisobutylene.

[0064] At 150°C, butyl rubber, polyisobutylene mixture, tackifying resin, antioxidant and light stabilizer were added to a kneader in sequence according to Table 2, and the mixture was blended under vacuum protection at -0.1 MPa for 30 minutes. Then, inorganic filler, reinforcing agent, water absorbent and pyridine-based polymer were added in sequence, and the mixture was thoroughly mixed under vacuum protection at -0.1 MPa for 120 minutes to obtain a self-healing butyl hot melt adhesive for double-glass photovoltaic modules.

[0065] Table 2

[0066]

[0067] Example 3

[0068] Polyisobutylene succinic anhydride (M n =1000) and N-(β-aminoethyl)-γ-aminopropylmethyldimethoxysilane in a molar ratio of 1:1 were reacted in dichloromethane (based on 1 mol of polyisobutylene succinic anhydride: 1 L of dichloromethane) at room temperature under a nitrogen atmosphere for 1.5 hours. After the reaction, the dichloromethane was removed by rotary evaporation to obtain modified polyisobutylene.

[0069] At 150°C, butyl rubber, polyisobutylene mixture, tackifying resin, antioxidant and light stabilizer were added to a kneader in sequence according to Table 3, and the mixture was blended under vacuum protection at -0.1 MPa for 30 minutes. Then, inorganic filler, reinforcing agent, water absorbent and difunctional amine were added in sequence, and the mixture was thoroughly mixed under vacuum protection at -0.1 MPa for 120 minutes to obtain a self-healing butyl hot melt adhesive for double-glass photovoltaic modules.

[0070] Table 3

[0071]

[0072]

[0073] Example 4

[0074] Polyisobutylene succinic anhydride (M n =1000) and N-(β-aminoethyl)-γ-aminopropylmethyldimethoxysilane in a molar ratio of 1:1 were reacted in dichloromethane (based on 1 mol of polyisobutylene succinic anhydride: 1 L of dichloromethane) at room temperature under a nitrogen atmosphere for 1.5 hours. After the reaction, the dichloromethane was removed by rotary evaporation to obtain modified polyisobutylene.

[0075] At 150°C, butyl rubber, polyisobutylene mixture, tackifying resin, antioxidant and light stabilizer were added to a kneader in sequence according to Table 4, and the mixture was blended under vacuum protection at -0.1 MPa for 30 minutes. Then, inorganic filler, reinforcing agent, water absorbent and difunctional amine were added in sequence, and the mixture was thoroughly mixed under vacuum protection at -0.1 MPa for 120 minutes to obtain a self-repairing butyl hot melt adhesive for double-glass photovoltaic modules.

[0076] Table 4

[0077]

[0078]

[0079] Comparative Example 1

[0080] The difference between this comparative example and Example 1 is that no pyridine-based polymer is added.

[0081] Polyisobutylene succinic anhydride (M n =1000) and γ-aminopropyltriethoxysilane in a molar ratio of 1:1 in dichloromethane (based on 1 mol of polyisobutylene succinic anhydride: 1 L of dichloromethane) were reacted at room temperature under a nitrogen atmosphere for 1.5 hours. After the reaction, the dichloromethane was removed by rotary evaporation to obtain modified polyisobutylene.

[0082] At 150°C, butyl rubber, polyisobutylene mixture, tackifying resin, antioxidant and light stabilizer were added to a kneader in sequence according to Table 5, and the mixture was blended under a vacuum protection of -0.1 MPa for 30 minutes. Then, inorganic filler, reinforcing agent and water absorbent were added in sequence, and the mixture was thoroughly mixed under a vacuum protection of -0.1 MPa for 120 minutes to obtain a butyl hot melt adhesive for double-glass photovoltaic modules.

[0083] Table 5

[0084]

[0085]

[0086] Comparative Example 2

[0087] The difference between this comparative example and Example 1 is that polyisobutylene succinic anhydride is used to replace the modified polyisobutylene.

[0088] At 150°C, butyl rubber, polyisobutylene mixture, tackifying resin, antioxidant and light stabilizer were added to a kneader in sequence according to Table 6, and the mixture was blended under vacuum protection of -0.1 MPa for 45 minutes. Then, inorganic filler, reinforcing agent, water absorbent and pyridine polymer were added in sequence, and the mixture was thoroughly mixed under vacuum protection of -0.1 MPa for 120 minutes to obtain a butyl hot melt adhesive for double-glass photovoltaic modules.

[0089] Table 6

[0090]

[0091]

[0092] Comparative Example 3

[0093] The difference between this comparative example and Example 1 is that the molar ratio of polyisobutylene succinic anhydride to γ-aminopropyltriethoxysilane is different.

[0094] Polyisobutylene succinic anhydride (M n =1000) and γ-aminopropyltriethoxysilane in a molar ratio of 1:2 in dichloromethane (based on 1 mol of polyisobutylene succinic anhydride: 1 L of dichloromethane) were reacted at room temperature under a nitrogen atmosphere for 1.5 hours. After the reaction, the dichloromethane was removed by rotary evaporation to obtain modified polyisobutylene.

[0095] At 150°C, butyl rubber, polyisobutylene mixture, tackifying resin, antioxidant and light stabilizer were added to a kneader in sequence according to Table 7, and the mixture was blended under vacuum protection at -0.1 MPa for 30 minutes. Then, inorganic filler, reinforcing agent, water absorbent and pyridine-based polymer were added in sequence, and the mixture was thoroughly mixed under vacuum protection at -0.1 MPa for 120 minutes to obtain a self-healing butyl hot melt adhesive for double-glass photovoltaic modules.

[0096] Table 7

[0097]

[0098]

[0099] Comparative Example 4

[0100] The difference between this comparative example and Example 1 is that the preparation method of the modified polyisobutylene is different.

[0101] Polyisobutylene succinic anhydride (M n =1000) was heated to 80° C., γ-aminopropyltriethoxysilane was added in a molar ratio of 1:1, and the mixture was reacted at 80° C. under a nitrogen atmosphere for 30 min to obtain modified polyisobutylene.

[0102] At 150°C, butyl rubber, polyisobutylene mixture, tackifying resin, antioxidant and light stabilizer were added to a kneader in sequence according to Table 8, and the mixture was blended under vacuum protection of -0.1 MPa for 30 minutes. Then, inorganic filler, reinforcing agent, water absorbent and pyridine-based polymer were added in sequence, and the mixture was thoroughly mixed under vacuum protection of -0.1 MPa for 120 minutes to obtain a self-repairing butyl hot melt adhesive for double-glass photovoltaic modules.

[0103] Table 8

[0104]

[0105] The butyl hot melt adhesives prepared in Examples 1 to 4 and Comparative Examples 1 to 4 were subjected to the performance tests shown in Table 9. The performance test methods of the samples in Table 9 are as follows:

[0106] 1. Double-glass shear strength: Shear strength is tested according to the relevant provisions of GB / T 7124-2008.

[0107] 2. Self-healing test: Reassemble the fractured parts of the sample that has completed the shear strength test, place it at room temperature for 7 days, and then perform the double-glass shear strength test according to GB / T 7124-2008.

[0108] 3. Water Vapor Transmission Rate at 38°C: Test according to GB / T 26253-2010. Place the putty on release paper, heat to the appropriate temperature, and then press it into a sheet with a thickness of (1±0.1) mm, a length of not less than 120 mm, and a width of not less than 120 mm. Take a circular test piece with a diameter of not less than 100 mm for testing.

[0109] The results are shown in Table 9.

[0110] No physical cross-linking agent was added to the butyl hot melt adhesive of Comparative Example 1, so it had no self-healing properties, as shown by a significant decrease in the shear strength of the fracture-jointed sample and a higher water vapor permeability than that of Example 1.

[0111] The butyl hot melt adhesive in Comparative Example 2 does not contain modified polyisobutylene, and there are no siloxane groups and carboxyl groups in the system. It is a non-reactive butyl hot melt adhesive, has low bonding shear strength with glass, does not have self-healing properties, has a low material cross-linking density, and its water vapor permeability is much higher than that of Example 1.

[0112] In the comparative example 3, the polyisobutylene succinic anhydride reacts with γ-aminopropyl triethoxysilane at a molar ratio of 1:2 to prepare the modified polyisobutylene. The siloxane groups grafted on the macromolecule will react with the excess silane coupling agent in the air and water vapor to be consumed, which will reduce the adhesive shear strength of the material to the glass and increase the degree of branching, which will reduce the density of the material and increase the water vapor transmission rate.

[0113] In the comparative example 4, the polyisobutylene succinic anhydride and γ-aminopropyl triethoxysilane are reacted at 80°C. Under this reaction condition, the acid anhydride and amine group can easily react to form imide, which will reduce or eliminate the carboxyl content in the system, thus reducing the self-repairing performance of the obtained butyl hot melt adhesive.

[0114] In the examples 1-4, the modified polyisobutylene and the physical crosslinking agent are combined to achieve the self-healing of the butyl hot melt adhesive at room temperature. After the fracture is spliced, the sample restores most of the shear strength. The siloxane contained in the butyl hot melt adhesive can form a first layer of crosslinked network by itself, and also can form a good adhesion with the glass surface. The molecular chain forms a second layer of reversible physical crosslinking network through the electrostatic interaction between the terminal carboxyl group and the amine group of the crosslinking agent. The synergistic combination of the components not only gives the butyl hot melt adhesive good self-repairing performance, but also significantly enhances its mechanical properties.

[0115] Table 9 Performance test results of the butyl hot melt adhesive in the examples

[0116]

[0117] The above examples only express several embodiments of the present application, and the description is more specific and detailed, but it cannot be understood as a limitation on the scope of the patent. It should be noted that for ordinary skilled in the art, without departing from the concept of the present application, several modifications and improvements can be made, which are within the scope of the present application. Therefore, the scope of the patent of the present application should be subject to the appended claims.

Claims

1. A self-repairing butyl hot melt adhesive for double-glass photovoltaic modules, characterized in that: The preparation method is based on the following raw materials: 1~40 parts of butyl rubber, 10-80 parts of polyisobutylene, 5-30 parts of modified polyisobutylene, 5-20 parts of tackifying resin, 1~10 parts of water absorbent, 10~30 parts of inorganic filler, 8~30 parts of reinforcing agent, 0.5~3 parts of antioxidant, 0.5~3 parts of light stabilizer, 0.5~4 parts of physical crosslinking agent; The modified polyisobutylene is obtained by reacting polyisobutylene succinic anhydride with an amino-containing silane coupling agent, wherein the molar ratio of the polyisobutylene succinic anhydride to the amino group in the amino-containing silane coupling agent is 1:0.9-1.1; The structural formula of the amino-containing silane coupling agent is NHR(CH2) n Si(R1)(OR2)2, wherein R1 is selected from: C1~C3 alkyl, C1~C3 alkoxy; R2 is selected from: C1~C3 alkyl; R is selected from: H, amino-substituted C1~C3 alkyl; n is selected from: 2, 3, 4, 5; The preparation method of the modified polyisobutylene comprises the following steps: reacting the polyisobutylene succinic anhydride with an amino-containing silane coupling agent in an organic solvent at 15° C.-30° C. under an inert gas atmosphere for 1 to 2 hours, and removing the organic solvent to obtain the modified polyisobutylene; The physical crosslinking agent is selected from at least one of poly(4-vinylpyridine-co-styrene), poly(4-vinylpyridine), bis(2,2,6,6-tetramethyl-4-piperidinyl) sebacate and N,N'-dimethyl-1,6-diaminohexane.

2. The self-repairing butyl hot melt adhesive for double-glass photovoltaic modules according to claim 1, characterized in that: The preparation method is based on the following raw materials: 1~5 parts of butyl rubber, 30-40 parts of polyisobutylene, 5~10 parts of modified polyisobutylene, 5-10 parts of tackifying resin, 2~6 parts of water absorbent, 15~25 parts of inorganic filler, 5~15 parts of reinforcing agent, 1~3 parts of antioxidant, 1~3 parts of light stabilizer, 1~3 parts of physical crosslinking agent.

3. The self-repairing butyl hot melt adhesive for double-glass photovoltaic modules according to claim 1, characterized in that: The preparation method is based on the following raw materials: 2~4 parts of butyl rubber, 32-35 parts of polyisobutylene, 6~8 parts of modified polyisobutylene, 7-9 parts of tackifying resin, 2~5 parts of water absorbent, 18~22 parts of inorganic filler, 8~12 parts of reinforcing agent, 1~3 parts of antioxidant, 1~3 parts of light stabilizer, 1~3 parts of physical crosslinking agent.

4. The self-repairing butyl hot melt adhesive for double-glass photovoltaic modules according to any one of claims 1 to 3, characterized in that: The number average molecular weight of the polyisobutylene succinic anhydride is 1000-3000.

5. The self-repairing butyl hot melt adhesive for double-glass photovoltaic modules according to claim 4, characterized in that: The number average molecular weight of the polyisobutylene succinic anhydride is 1000-1500.

6. The self-repairing butyl hot melt adhesive for double-glass photovoltaic modules according to any one of claims 1 to 3, characterized in that: The amino-containing silane coupling agent is γ-aminopropyltriethoxysilane and / or N-(β-aminoethyl)-γ-aminopropylmethyldimethoxysilane.

7. The self-repairing butyl hot melt adhesive for double-glass photovoltaic modules according to claim 6, characterized in that: The amino-containing silane coupling agent is N-(β-aminoethyl)-γ-aminopropylmethyldimethoxysilane.

8. The self-repairing butyl hot melt adhesive for double-glass photovoltaic modules according to any one of claims 1 to 3, characterized in that: The organic solvent is dichloromethane.

9. The self-repairing butyl hot melt adhesive for double-glass photovoltaic modules according to any one of claims 1 to 3, wherein the physical crosslinking agent is poly (4-vinyl pyridine). 10 . The self-repairing butyl hot melt adhesive for double-glass photovoltaic modules according to claim 9 , wherein the weight average molecular weight of the poly(4-vinylpyridine) is 50,000 to 70,000.

11. The self-repairing butyl hot melt adhesive for double-glass photovoltaic modules according to any one of claims 1 to 3, characterized in that: The raw Mooney viscosity ML of the butyl rubber 1+8 40 to 60; and / or, The polyisobutylene is composed of two or three of low molecular weight polyisobutylene, medium molecular weight polyisobutylene and high molecular weight polyisobutylene, wherein the viscosity average molecular weight of the low molecular weight polyisobutylene is 400 to 30,000, the viscosity average molecular weight of the medium molecular weight polyisobutylene is 60,000 to 95,000, and the viscosity average molecular weight of the high molecular weight polyisobutylene is 100,000 to 2,000,000; and / or, The tackifying resin is selected from one or more combinations of C5 petroleum resin, C9 petroleum resin, terpene resin, styrene-grafted terpene resin, polyterpene resin and natural resin; and / or, The water absorbing agent is selected from one or more combinations of calcium oxide, molecular sieves, calcium sulfate, anhydrous calcium chloride, anhydrous magnesium sulfate, and activated alumina; and / or, The inorganic filler is selected from one or more combinations of mica powder, silica powder, kaolin, calcium carbonate, talc, kaolin, clay and diatomaceous earth; and / or, The reinforcing agent is selected from one or a combination of carbon black and fumed silica; and / or, The antioxidant is selected from the group consisting of one or more combinations of pentaerythritol tetrakis[2-(3,5-di-tert-butyl-4-hydroxyphenyl)propionate, octadecyl 3-(3,5-di-tert-butyl-4-hydroxyphenyl)propionate, 2,6-di-tert-butyl-4-methylphenol, tris[2,4-di-tert-butylphenyl]phosphite, 2-methyl-4,6-dinonylphenol, 2,6-di-tert-butyl-α-methoxy-p-cresol, 2,4,6-tri-tert-butylphenol and 2,2,4-trimethyl-1,2-dihydroquinoline polymer; and / or The light stabilizer is selected from one or more combinations of hindered amine light stabilizers.

12. The self-repairing butyl hot melt adhesive for double-glass photovoltaic modules according to any one of claims 1 to 3, characterized in that: The polyisobutylene is composed of medium molecular weight polyisobutylene and high molecular weight polyisobutylene, the viscosity average molecular weight of the medium molecular weight polyisobutylene is 60,000 to 95,000, and the viscosity average molecular weight of the high molecular weight polyisobutylene is 200,000 to 500,000; and / or, The light stabilizer is selected from 2'-(2'-hydroxy-3'-tert-butyl-5'-methylphenyl)-5-chlorobenzotriazole and / or 2-(2-hydroxy-5-tert-octylphenyl)benzotriazole.

13. The self-repairing butyl hot melt adhesive for double-glass photovoltaic modules according to claim 12, characterized in that: The polyisobutylene is composed of medium molecular weight polyisobutylene and high molecular weight polyisobutylene in a mass ratio of 1:1-2.

5.

14. A method for preparing the self-repairing butyl hot melt adhesive for double-glass photovoltaic modules according to any one of claims 1 to 13, characterized in that: The following steps are involved: At 110° C. to 160° C., the butyl rubber, polyisobutylene, modified polyisobutylene, tackifying resin and antioxidant are added to a kneader in sequence, and blended under vacuum protection for 20 to 130 minutes; then the inorganic filler, reinforcing agent, water absorbent and physical cross-linking agent are added in sequence, and mixed under vacuum protection for 60 to 180 minutes to obtain the self-repairing butyl hot melt adhesive for double-glass photovoltaic modules.

Images