A chip automated detection system and method

Abstract

The application relates to the technical field of chip automatic detection, and discloses a chip automatic detection system and method, which comprises the following steps: taking the pattern formed by bubbles in a chip under x-ray irradiation as a projection pattern; performing a circle domain planning strategy on the projection pattern to obtain a circle where the projection pattern is located, which is recorded as an execution circle; obtaining execution circles corresponding to all the projection patterns in an execution rectangle to form an execution circle set; performing a pre-division strategy to obtain multiple execution units; obtaining the number of execution circles in an arbitrary execution unit, which is recorded as a first side number; when the first side number is greater than 0, performing a three-dimensional detection strategy to obtain the volume of the execution circles on an execution section; and performing a qualified judgment strategy according to a threshold ratio to judge whether the chip is qualified. Three sides of the chip are irradiated by x-rays, the number of bubbles in the chip is estimated, the bubble porosity is calculated to judge whether the chip is qualified, the detection steps are simplified, and the detection efficiency is improved.

Description

Technical Field

[0001] This invention relates to the field of automated chip testing technology, specifically to an automated chip testing system and method. Background Technology

[0002] Automated chip inspection is a crucial step in the semiconductor manufacturing process, involving the use of computer-controlled equipment to inspect and control the quality of chips. With the advancement of integrated circuit technology, the complexity of chips has increased dramatically, rendering manual inspection inefficient and inaccurate enough to meet production demands. Therefore, automated inspection technology has emerged. Automated inspection technology typically includes vision inspection systems, electronic testing equipment, and specialized software. Vision inspection systems use high-resolution cameras to capture images of the chip surface and identify defects through image processing algorithms. Electronic testing equipment detects functional failures by applying electrical signals to the chip and measuring its response. This inspection data is then analyzed by specialized software to determine whether the chip meets quality standards. Automated chip inspection not only improves inspection speed and accuracy but also significantly reduces production costs while enhancing product reliability.

[0003] Existing technologies for determining chip quality by detecting bubble porosity require chip modeling and analysis of internal bubbles; chip modeling is time-consuming and results in low detection efficiency.

[0004] This solution proposes to irradiate three sides of the chip with X-rays, obtain the number of execution circles captured in three images of each execution unit, calculate the number of execution circles on the execution cross section, and then obtain the volume of bubbles in the area where the chip pads are located to determine whether the chip is qualified. Summary of the Invention

[0005] This invention provides an automated chip testing system and method to help solve the problems mentioned in the background art.

[0006] This invention provides the following technical solution: an automated chip testing method, comprising:

[0007] The cuboid formed by the chip is called a chip cuboid;

[0008] In the cuboid of the chip:

[0009] Let any one face of the chip cuboid be the first side face;

[0010] Let any face perpendicular to the first side be the second side;

[0011] Let any face that is perpendicular to both the first and second side be the third side.

[0012] The chip that needs to be tested is designated as the chip to be tested.

[0013] The first side of the chip to be tested is illuminated with X-rays to obtain a test sample image;

[0014] Obtain the rectangular area of ​​the pads of the chip to be tested on the test sample image, and denote it as the execution rectangle;

[0015] The pattern formed by bubbles inside a chip under X-ray illumination is called a projection pattern.

[0016] Perform a circular domain planning strategy on the projected graphic to obtain the circle containing the projected graphic, which is denoted as the execution circle;

[0017] Obtain the execution circles corresponding to all projected graphics within the execution rectangle, and form an execution circle set;

[0018] The line segment connecting the first side and the second side is denoted as the first edge.

[0019] Set the dividing interval used to divide the first edge;

[0020] The pre-partitioning strategy is executed to obtain multiple execution units;

[0021] For any execution unit;

[0022] The number of execution circles in the execution unit is obtained and denoted as the number of the first side faces;

[0023] Draw a plane perpendicular to the second side and parallel to the third side through the straight line of the execution unit. The cross section of the chip cuboid intercepted by the plane is called the execution section.

[0024] When the number of first side faces is greater than 0, a 3D detection strategy is executed to obtain the volume of the execution circle on the execution cross section;

[0025] Set a threshold ratio for determining whether a chip is qualified;

[0026] Based on the threshold ratio, a pass / fail judgment strategy is executed to determine whether the chip is qualified.

[0027] Optionally, the execution of a circular domain planning strategy on the projected graphic includes:

[0028] Define the dividing lines used to segment the projected graphic;

[0029] Set the division distance used to determine the execution circle;

[0030] Define equidistant lines, which are composed of multiple dividing lines, and the distance between each line is the dividing distance;

[0031] Map the projected graphic onto equidistant lines;

[0032] The line segment formed within the projected graphic after the equidistant line intersects with the projected graphic is called the dividing line segment.

[0033] Optionally, the step of performing a circular domain planning strategy on the projected graphic further includes:

[0034] For any dividing line segment:

[0035] The dividing line segment divides the projected figure into two figures, denoted as the first figure and the second figure, respectively.

[0036] Set the differential value;

[0037] Divide the dividing line segment into segments of equal length, each of which is a differential value. Let the resulting segment be the bottom line segment.

[0038] For any bottom line segment:

[0039] Draw a line perpendicular to the base line segment through the midpoint of the base line segment; this line is called the differential line.

[0040] The point where the differential line intersects with the first figure is marked as the first marker point;

[0041] The point where the differential line intersects with the second figure is marked as the second marker point;

[0042] Measure the distance from the first marker point to the bottom line segment, and record it as the first differential height;

[0043] Measure the distance from the second marker point to the bottom line segment, and record it as the second differential height;

[0044] Calculate the area of ​​the first figure:

[0045] Obtain the first differential height of each bottom edge segment, and denot it as the first left differential height, the second left differential height, ..., the e-th left differential height respectively;

[0046] Get the length of the bottom edge segment, and denote it as the bottom edge length;

[0047] Execute the following formula:

[0048] First left differential height * base length + second left differential height * base length + ... + eth left differential height * base length = area of ​​the first figure.

[0049] Optionally, the step of performing a circular domain planning strategy on the projected graphic further includes:

[0050] Calculate the area of ​​the second figure:

[0051] Obtain the second differential height of each bottom edge segment, and denot it as the first right differential height, the second right differential height, ..., the e-th right differential height, respectively;

[0052] Execute the following formula:

[0053] First right derivative height * base length + second right derivative height * base length + ... + e-th right derivative height * base length = area of ​​the second figure;

[0054] Determine the area of ​​the first figure and the size of the area of ​​the second figure:

[0055] If the area of ​​the first shape is equal to the area of ​​the second shape, obtain the midpoint of the dividing line segment and denote it as the center of the execution circle;

[0056] Obtain the first and second derivative heights corresponding to each bottom edge segment on the dividing line segment;

[0057] Compare all the heights and find the maximum height, which is then recorded as the execution radius;

[0058] The circle formed by taking the center of the execution circle as its center and the radius of the execution circle as its radius is denoted as the execution circle.

[0059] Optionally, the execution pre-partitioning strategy yields multiple execution units, including:

[0060] Obtain the two endpoints of the first edge, and denote them as the first endpoint and the second endpoint, respectively;

[0061] The point that is one division interval away from the first endpoint is designated as the first execution point;

[0062] The point that is two division intervals away from the first endpoint is recorded as the second execution point;

[0063] ...

[0064] The point m intervals away from the first endpoint is the m-th execution point, where the m-th execution point is the second endpoint;

[0065] Draw a straight line perpendicular to the first edge through each execution point on the first side;

[0066] The line and all execution circles whose centers lie on the line are collectively referred to as an execution unit.

[0067] Optionally, the implementation of the stereo detection strategy includes:

[0068] Let the execution circles in the execution unit be the first execution circle, the second execution circle, ..., the nth execution circle;

[0069] Obtain the intersection point of the straight line in the execution unit and the first edge, and draw a straight line perpendicular to the first edge through the intersection point on the second side, which is recorded as the reference line;

[0070] Irradiate the second side with X-rays to obtain execution circles whose centers lie on the reference line, and form a set of reference execution circles;

[0071] Calculate the number of elements in the control circle set, and denote it as the number of the second side face;

[0072] The line segment connecting the first side and the third side is denoted as the second edge.

[0073] On the first side, draw a straight line perpendicular to the second edge through the center of the first execution circle, the second execution circle, ... the nth execution circle, and intersect the second edge at the first verification point, the second verification point, ... the nth verification point;

[0074] Draw a straight line perpendicular to the second edge through each verification point on the third side to obtain the first verification line, the second verification line, ... the nth verification line;

[0075] X-ray is used to illuminate the third side:

[0076] The number of execution circles whose centers lie on the first verification line is obtained and denoted as the first verification number.

[0077] The number of execution circles whose centers lie on the second verification line is obtained and denoted as the second verification number.

[0078] ...

[0079] The number of execution circles whose centers lie on the nth verification line is denoted as the nth verification number.

[0080] Obtain all the verification counts and form a verification count set.

[0081] Optionally, the implementation of the stereo detection strategy includes:

[0082] Iterate through all elements in the verification set and compare the number of the second side;

[0083] Get the number of elements less than the number of the second side, and denote them as the number of the first mark, the number of the second mark, ..., the number of the v-th mark, where v ≦ n;

[0084] Obtain the radius of each execution circle in the set of execution circles, calculate the mean of all radii, and record the result as the mean radius r;

[0085] Calculate (nv) * number of second side faces + number of first marks + number of second marks + ... + number of v-th marks = number of execution circles on the execution section, denoted as u;

[0086] Calculate the volume k of all execution circles on the execution section, k = .

[0087] Optionally, the execution of the qualification determination strategy includes:

[0088] Obtain the volumes of all the execution circles on the execution section corresponding to all execution units, calculate the sum of the volumes, and record the result as the bubble volume x;

[0089] Obtain the volume y of the chip cuboid;

[0090] Calculate x / y, and record the result as the bubble porosity;

[0091] When the bubble porosity is greater than or equal to the threshold ratio, the chip is unqualified;

[0092] When the bubble porosity is less than the threshold ratio, the chip is qualified.

[0093] A system for an automated chip detection method, comprising:

[0094] Data measurement module: Measure the distance from the first marked point to the bottom edge line segment; Measure the distance from the second marked point to the bottom edge line segment; Measure the radius of each execution circle in the control execution circle set;

[0095] Data processing module: Calculate the area of the first figure; Calculate the area of the second figure; Calculate the average value of all the radii; Calculate the number of execution circles on the execution section; Calculate the volumes of all the execution circles on the execution section; Calculate the bubble volume; Calculate the bubble porosity;

[0096] Data judgment module: Judge the sizes of the areas of the first figure and the second figure to obtain the execution circles; Compare the bubble porosity with the threshold ratio to judge whether the chip is qualified.

[0097] The present invention has the following beneficial effects:

[0098] 1. For this automated chip detection method, set the segmentation line for dividing the projection figure, set the segmentation distance for determining the execution circle, set the equidistant line, map the projection figure onto the equidistant line, and record the line segment formed within the projection figure after the intersection of the equidistant line and the projection figure as the segmentation line segment, which simplifies the processing of the figure, makes the calculation more intuitive and manageable, improves the accuracy of measurement, and is the key to subsequent calculations.

[0099] 2. For this automated chip detection method, set the differential value, divide the segmentation line segment into the differential value number of line segments of equal length to obtain the bottom edge line segment. For each bottom edge line segment, measure the first differential height and the second differential height, divide the first figure into multiple rectangles with the bottom edge line segment as the width and the first differential height as the length, divide the second figure into multiple rectangles with the bottom edge line segment as the width and the second differential height as the width, calculate the areas of the rectangles, and then calculate the areas of the first figure and the second figure. When the areas of the first figure and the second figure are equal, obtain the execution circle center and the execution radius to get the execution circle, which confines the irregular figure to a circle, facilitating the subsequent calculation of the bubble volume and improving the efficiency.

[0100] 3. The automated chip detection method obtains the first and second endpoints of the first edge, obtains all execution points according to the division interval, and draws a straight line perpendicular to the first edge through each execution point on the first side. The straight line and all execution circles whose centers are on the straight line are collectively recorded as an execution unit. This helps to subdivide the detection task and improve the efficiency of management and analysis.

[0101] 4. The automated chip detection method involves creating a reference line on the second side when an execution circle appears on the first side, illuminating the second side with X-rays, obtaining the execution circles whose centers are on the reference line, obtaining a set of reference execution circles, and obtaining the number of execution circles on the second side. The number of execution circles on the second side is the maximum number of execution circles appearing directly below all execution circles on the first side, which is used for the first estimation of all execution circles on the execution cross section; this facilitates the subsequent second estimation of the number of execution circles on the execution cross section.

[0102] 5. This automated chip inspection method involves drawing straight lines perpendicular to the second edge through the center of each execution circle on the first side, obtaining multiple verification points. On the third side, similarly, straight lines perpendicular to the second edge are drawn through each verification point, resulting in multiple verification lines. The third side is then illuminated with X-rays, and the number of verifications on each line is recorded, forming a verification count set. This set is used to perform a second estimation of the number of execution circles on the execution cross-section. If a verification count is greater than the count on the second side, it indicates that the verification counts of execution circles on other cross-sections interfered with the estimation during X-ray illumination of the third side, and these are excluded. If a verification count is less than the count on the second side, it indicates that this count is more accurate in calculating the number of execution circles on the cross-section, and it is retained. By combining the counts from the second side and the number of markers, the number of execution circles on the cross-section is calculated, providing a more accurate estimate and improving inspection accuracy.

[0103] 6. This automated chip testing method calculates the average radius of each execution circle in the control execution circle set, and uses this average radius as the radius of each execution circle on the execution cross section. Then, it calculates the volume of all execution circles on an execution cross section, obtains the volume of all execution circles on the execution cross section corresponding to all execution units, obtains the bubble volume, calculates the bubble porosity, and judges whether the chip is qualified by using the threshold ratio and bubble porosity. Since there are more bubbles in the chip pad area and the bubbles are closer to circles, only the bubbles in the pad area are calculated and other bubbles are excluded, simplifying the calculation and improving efficiency.

[0104] 7. This automated chip inspection method uses X-rays to irradiate three sides of the chip, calculates the bubble porosity, and determines whether the chip is qualified. If the chip is qualified, the chip modeling step is omitted; if the chip is unqualified, then a chip model is created. This reduces the number of chips that need to be modeled and improves inspection efficiency. Attached Figure Description

[0105] Figure 1 This is a schematic diagram of the system of the present invention;

[0106] Figure 2 This is a schematic diagram of a test sample image obtained by irradiating the first side with X-rays;

[0107] Figure 3 A schematic diagram for executing rectangles and projected graphics;

[0108] Figure 4 This is a schematic diagram illustrating the relationship between the projected graphic and the execution circle;

[0109] Figure 5 This is a schematic diagram showing the positions of the first, second, and third side faces within the cuboid;

[0110] Figure 6 This is a schematic diagram of a cuboid chip;

[0111] Figure 7 This is a top view obtained by irradiating the first side with X-rays;

[0112] Figure 8 The left view obtained by irradiating the second side with X-rays;

[0113] Figure 9 This is a front view obtained by irradiating the third side with X-rays; Detailed Implementation

[0114] The technical solutions of the embodiments of the present invention will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some embodiments of the present invention, and not all embodiments. Based on the embodiments of the present invention, all other embodiments obtained by those skilled in the art without creative effort are within the scope of protection of the present invention.

[0115] Example 1: The cuboid formed by the chip is denoted as the chip cuboid;

[0116] Reference Figure 6 A schematic diagram of a rectangular chip.

[0117] In the cuboid of the chip:

[0118] Let any one face of the chip cuboid be the first side face;

[0119] Let any face perpendicular to the first side be the second side;

[0120] Let any face that is perpendicular to both the first and second side be the third side.

[0121] In this embodiment, the positions of the first side, the second side, and the third side in the chip cuboid are shown in the figure.

[0122] The chip that needs to be tested is designated as the chip to be tested.

[0123] The first side of the chip to be tested is illuminated with X-rays to obtain a test sample image;

[0124] In this embodiment, refer to Figure 2 , is the sample image for testing;

[0125] Obtain the rectangular area of ​​the pads of the chip to be tested on the test sample image, and denote it as the execution rectangle;

[0126] The pattern formed by bubbles inside a chip under X-ray illumination is called a projection pattern.

[0127] In this embodiment, refer to Figure 3 To execute rectangular and projected graphics;

[0128] Perform a circular domain planning strategy on the projected graphic to obtain the circle containing the projected graphic, which is denoted as the execution circle;

[0129] Obtain the execution circles corresponding to all projected graphics within the execution rectangle, and form an execution circle set;

[0130] The line segment connecting the first side and the second side is denoted as the first edge.

[0131] Set the dividing interval used to divide the first edge;

[0132] The pre-partitioning strategy is executed to obtain multiple execution units;

[0133] For any execution unit;

[0134] The number of execution circles in the execution unit is obtained and denoted as the number of the first side faces;

[0135] Draw a plane perpendicular to the second side and parallel to the third side through the straight line of the execution unit. The cross section of the chip cuboid intercepted by the plane is called the execution section.

[0136] When the number of first side faces is greater than 0, a 3D detection strategy is executed to obtain the volume of the execution circle on the execution cross section;

[0137] Set a threshold ratio for determining whether a chip is qualified;

[0138] Based on the threshold ratio, a pass / fail judgment strategy is executed to determine whether the chip is qualified.

[0139] The circular domain planning strategy applied to the projected graphic includes:

[0140] Define the dividing lines used to segment the projected graphic;

[0141] Set the division distance used to determine the execution circle;

[0142] Define equidistant lines, which are composed of multiple dividing lines, and the distance between each line is the dividing distance;

[0143] Map the projected graphic onto equidistant lines;

[0144] The line segment formed within the projected graphic after the equidistant line intersects with the projected graphic is called the dividing line segment.

[0145] The process involves setting dividing lines to segment the projected graphic, setting the dividing distance to determine the execution circle, setting equidistant lines, mapping the projected graphic onto the equidistant lines, and recording the line segments formed within the projected graphic after the equidistant lines intersect with the projected graphic as dividing line segments. This simplifies graphic processing, makes calculations more intuitive and manageable, and improves measurement accuracy, which is crucial for subsequent calculations.

[0146] The method of performing circular domain planning on the projected graphics also includes:

[0147] For any dividing line segment:

[0148] The dividing line segment divides the projected figure into two figures, denoted as the first figure and the second figure, respectively.

[0149] Set the differential value;

[0150] Divide the dividing line segment into segments of equal length, each of which is a differential value. Let the resulting segment be the bottom line segment.

[0151] For any bottom line segment:

[0152] Draw a line perpendicular to the base line segment through the midpoint of the base line segment; this line is called the differential line.

[0153] The point where the differential line intersects with the first figure is marked as the first marker point;

[0154] The point where the differential line intersects with the second figure is marked as the second marker point;

[0155] Measure the distance from the first marker point to the bottom line segment, and record it as the first differential height;

[0156] Measure the distance from the second marker point to the bottom line segment, and record it as the second differential height;

[0157] Calculate the area of ​​the first figure:

[0158] Obtain the first differential height of each bottom edge segment, and denot it as the first left differential height, the second left differential height, ..., the e-th left differential height respectively;

[0159] Get the length of the bottom edge segment, and denote it as the bottom edge length;

[0160] Execute the following formula:

[0161] First left differential height * base length + second left differential height * base length + ... + eth left differential height * base length = area of ​​the first figure.

[0162] The method of performing circular domain planning on the projected graphics also includes:

[0163] Calculate the area of ​​the second figure:

[0164] Obtain the second differential height of each bottom edge segment, and denot it as the first right differential height, the second right differential height, ..., the e-th right differential height, respectively;

[0165] Execute the following formula:

[0166] First right derivative height * base length + second right derivative height * base length + ... + e-th right derivative height * base length = area of ​​the second figure;

[0167] Determine the area of ​​the first figure and the size of the area of ​​the second figure:

[0168] If the area of ​​the first shape is equal to the area of ​​the second shape, obtain the midpoint of the dividing line segment and denote it as the center of the execution circle;

[0169] Obtain the first and second derivative heights corresponding to each bottom edge segment on the dividing line segment;

[0170] Compare all the heights and find the maximum height, which is then recorded as the execution radius;

[0171] The circle formed by taking the center of the execution circle as its center and the radius of the execution circle as its radius is denoted as the execution circle.

[0172] In this embodiment, as Figure 4 As shown, this illustrates the relationship between the circle and the projected graphic.

[0173] A differential value is set, and the dividing line segment is divided into segments of equal length according to the differential value to obtain the bottom edge segment. For each bottom edge segment, the first differential height and the second differential height are measured. The first shape is divided into multiple rectangles with the bottom edge segment as the width and the first differential height as the length. The second shape is divided into multiple rectangles with the bottom edge segment as the width and the second differential height as the width. The area of ​​the rectangle is calculated, and then the area of ​​the first shape and the area of ​​the second shape are calculated. When the area of ​​the first shape and the area of ​​the second shape are equal, the center and radius of the execution circle are obtained to obtain the execution circle. The irregular shape is confined to the circle, which facilitates the subsequent calculation of the bubble volume and improves efficiency.

[0174] The execution pre-partitioning strategy yields multiple execution units, including:

[0175] Obtain the two endpoints of the first edge, and denote them as the first endpoint and the second endpoint, respectively;

[0176] The point that is one division interval away from the first endpoint is designated as the first execution point;

[0177] The point that is two division intervals away from the first endpoint is recorded as the second execution point;

[0178] ...

[0179] The point m intervals away from the first endpoint is the m-th execution point, where the m-th execution point is the second endpoint;

[0180] Draw a straight line perpendicular to the first edge through each execution point on the first side;

[0181] The line and all execution circles whose centers lie on the line are collectively referred to as an execution unit.

[0182] Obtain the first and second endpoints of the first edge, and obtain all execution points according to the division interval. Draw a straight line perpendicular to the first edge through each execution point on the first side. Record the straight line and all execution circles whose centers are on the straight line as one execution unit. This helps to subdivide the detection task and improve the efficiency of management and analysis.

[0183] The execution of the stereo detection strategy includes:

[0184] Let the execution circles in the execution unit be the first execution circle, the second execution circle, ..., the nth execution circle;

[0185] Obtain the intersection point of the straight line in the execution unit and the first edge, and draw a straight line perpendicular to the first edge through the intersection point on the second side, which is recorded as the reference line;

[0186] Irradiate the second side with X-rays to obtain execution circles whose centers lie on the reference line, and form a set of reference execution circles;

[0187] Calculate the number of elements in the control circle set, and denote it as the number of the second side face;

[0188] When an execution circle appears on the first side, a reference line is drawn on the second side. The second side is then illuminated with X-rays to obtain the execution circles whose centers are on the reference line, thus obtaining a set of reference execution circles. The number of execution circles on the second side is the maximum number that appears directly below all execution circles on the first side. This number is used to estimate all execution circles on the execution cross section for the first time, which facilitates the subsequent second estimation of the number of execution circles on the execution cross section.

[0189] The line segment connecting the first side and the third side is denoted as the second edge.

[0190] On the first side, draw a straight line perpendicular to the second edge through the center of the first execution circle, the second execution circle, ... the nth execution circle, and intersect the second edge at the first verification point, the second verification point, ... the nth verification point;

[0191] Draw a straight line perpendicular to the second edge through each verification point on the third side to obtain the first verification line, the second verification line, ... the nth verification line;

[0192] X-ray is used to illuminate the third side:

[0193] The number of execution circles whose centers lie on the first verification line is obtained and denoted as the first verification number.

[0194] The number of execution circles whose centers lie on the second verification line is obtained and denoted as the second verification number.

[0195] ...

[0196] The number of execution circles whose centers lie on the nth verification line is denoted as the nth verification number.

[0197] Obtain all the verification counts and form a verification count set.

[0198] The execution of the stereo detection strategy includes:

[0199] Iterate through all elements in the verification set and compare the number of the second side;

[0200] Get the number of elements less than the number of the second side, and denote them as the number of the first mark, the number of the second mark, ..., the number of the v-th mark, where v ≦ n;

[0201] On the first side, draw straight lines perpendicular to the second edge through the center of each execution circle, obtaining multiple verification points. On the third side, draw straight lines perpendicular to the second edge through each verification point, obtaining multiple verification lines. Illuminate the third side with X-rays and obtain the number of verifications on each verification line, forming a verification number set. Use this verification number set to perform a second estimation of the number of execution circles on the execution cross-section. If the number of verifications is greater than the number on the second side, it indicates that the verification numbers of execution circles on other execution cross-sections interfered with the estimation when the third side was irradiated with X-rays, and these are excluded. If the number of verifications is less than the number on the second side, it indicates that this verification number is more accurate in calculating the number of execution circles on the execution cross-section, and it is retained. By using the number on the second side and the number of markers, the number of execution circles on the execution cross-section is calculated, providing a more accurate estimation of the number of execution circles on the execution cross-section and improving the accuracy of detection.

[0202] Obtain the radius of each execution circle in the set of execution circles, calculate the mean of all radii, and record the result as the mean radius r;

[0203] Calculate (nv) * number of second side faces + number of first marks + number of second marks + ... + number of v-th marks = number of execution circles on the execution section, denoted as u;

[0204] In this embodiment, as Figure 7 As shown, the first side is illuminated with X-rays, and the resulting image is denoted as the top view, where n=3;

[0205] The execution circles in the execution unit are the first execution circle, the second execution circle, and the third execution circle;

[0206] like Figure 8 As shown, the second side is irradiated with X-rays, and the resulting image is denoted as the left view. Execution circles whose centers lie on the reference line are obtained, forming a set of reference execution circles. There are two execution circles in the set of reference execution circles, denoted as the first reference circle and the second reference circle, respectively.

[0207] The number of second sides is 2;

[0208] like Figure 9 As shown, the third side is illuminated with X-rays, and the resulting image is denoted as the front view;

[0209] Where, the first verification quantity on the first verification line is 2; the second verification quantity on the first verification line is 1; the third verification quantity on the third verification line is 3; traverse all elements in the verification quantity set and compare it with the quantity on the second side: the element that is less than the quantity on the second side is the second verification quantity, v=1;

[0210] The third verification number is obtained by mapping the execution circles on other execution sections onto the third verification line; therefore, the third verification number is excluded.

[0211] Calculate (nv) * number of second side surfaces + number of first marks + number of second marks + ... + number of vth marks = (3-1) * 2 + 1 = 5 = number of execution circles on the execution section, u = 5;

[0212] Calculate the volume k of all execution circles on the execution section, k = .

[0213] The mean radius of each execution circle in the set of execution circles is calculated to obtain the mean radius, which is then used as the radius of each execution circle on the execution cross section. The volume of all execution circles on an execution cross section is then calculated to obtain the volume of all execution circles on the execution cross section corresponding to all execution units, thus obtaining the bubble volume. The bubble porosity is then calculated, and the chip's qualification is determined by the threshold ratio and bubble porosity. Since there are more bubbles in the chip pad area and the bubbles are closer to a circle, only the bubbles in the pad area are calculated, while other bubbles are excluded, simplifying the calculation and improving efficiency.

[0214] The execution qualification determination strategy includes:

[0215] Obtain the volumes of all the execution circles on the execution cross-section corresponding to all execution units, calculate the sum of the volumes, and record the result as the bubble volume x;

[0216] Obtain the volume y of the chip cuboid;

[0217] Calculate x / y, and record the result as the bubble porosity;

[0218] When the bubble porosity is greater than or equal to the threshold ratio, the chip is unqualified;

[0219] When the bubble porosity is less than the threshold ratio, the chip is qualified.

[0220] Irradiate three sides of the chip with X-rays, calculate the bubble porosity, and determine whether the chip is qualified. If the chip is qualified, the step of modeling the chip is omitted. If the chip is unqualified, the chip is modeled. Reduce the number of chips to be modeled and improve the detection efficiency.

[0221] Example 2, refer to Figure 1 , a system based on the chip automatic detection method;

[0222] Data measurement module: Measure the distance from the first marked point to the bottom edge line segment; Measure the distance from the second marked point to the bottom edge line segment; Measure the radius of each execution circle in the control execution circle set;

[0223] Data processing module: Calculate the area of the first figure; Calculate the area of the second figure; Calculate the average value of all the radii; Calculate the number of execution circles on the execution cross-section; Calculate the volumes of all the execution circles on the execution cross-section; Calculate the bubble volume; Calculate the bubble porosity;

[0224] Data judgment module: Judge the sizes of the areas of the first figure and the second figure to obtain the execution circles; Compare the bubble porosity with the threshold ratio to judge whether the chip is qualified.

[0225] It should be noted that in this article, relational terms such as first and second are only used to distinguish one entity or operation from another entity or operation, and do not necessarily require or imply any actual relationship or order between these entities or operations. Moreover, the term "comprising", "including" or any other variant thereof is intended to cover non-exclusive inclusion, so that a process, method, article or device comprising a series of elements not only includes those elements, but also includes other elements not expressly listed, or elements inherent to such process, method, article or device.

[0226] The above description is only a preferred embodiment of the present invention. It should be noted that for those skilled in the art, several improvements and modifications can be made without departing from the technical principles of the present invention, and these improvements and modifications should also be considered within the scope of protection of the present invention.

Claims

1. A chip automatic detection method, comprising: a cuboid formed by a chip is recorded as a chip cuboid; in the chip cuboid: any one face of the chip cuboid is recorded as a first side face; any one face perpendicular to the first side face is recorded as a second side face; any one face perpendicular to the first side face and perpendicular to the second side face is recorded as a third side face; a chip that needs to be detected is recorded as a chip to be detected; the first side face of the chip to be detected is irradiated with x-rays to obtain a detection sample; a rectangular area of the pad of the chip to be detected on the detection sample is obtained, which is recorded as an execution rectangle; a pattern formed by the bubbles inside the chip under x-ray irradiation is recorded as a projection pattern; a circle domain planning strategy is performed on the projection pattern to obtain a circle where the projection pattern is located, which is recorded as an execution circle; the circle domain planning strategy performed on the projection pattern comprises: a segmentation straight line for segmenting the projection pattern is set; a segmentation distance for determining the execution circle is set; an equidistant line is set, which is composed of multiple segmentation straight lines, and the distance between each straight line is the segmentation distance; the projection pattern is mapped onto the equidistant line; the line segment formed inside the projection pattern after the intersection of the equidistant line and the projection pattern is recorded as a segmentation line segment; the execution circles corresponding to all the projection patterns in the execution rectangle are obtained to form an execution circle set; the connecting line segment of the first side face and the second side face is recorded as a first edge; a division interval for dividing the first edge is set; a pre-division strategy is executed to obtain multiple execution units; for any one execution unit; the number of execution circles in the execution unit is obtained, which is recorded as the first side face number; a plane passing through the execution unit is made perpendicular to the second side face and parallel to the third side face, and the cross section of the chip cuboid intercepted by the plane is recorded as an execution cross section; when the first side face number>0, a three-dimensional detection strategy is executed to obtain the volume of the execution circle on the execution cross section; a threshold proportion for judging whether the chip is qualified is set; according to the threshold proportion, a qualification judgment strategy is executed to judge whether the chip is qualified; the pre-division strategy executed to obtain multiple execution units comprises: two endpoints of the first edge are obtained, which are recorded as a first endpoint and a second endpoint respectively; a point 1 division interval away from the first endpoint is recorded as a first execution point; a point 2 division intervals away from the first endpoint is recorded as a second execution point; and so on; a point m division intervals away from the first endpoint is the mth execution point, where the mth execution point is the second endpoint; straight lines perpendicular to the first edge are made through each execution point on the first side face; the straight lines and the execution circles with their centers on the straight lines are collectively recorded as one execution unit; the three-dimensional detection strategy comprises: the execution circles in the execution unit are recorded as a first execution circle, a second execution circle, and so on, an nth execution circle; the intersection point of the straight line and the first edge in the execution unit is obtained, and a straight line perpendicular to the first edge passing through the intersection point on the second side face is recorded as a contrast straight line; the second side face is irradiated with x-rays to obtain execution circles with their centers on the contrast straight line to form a contrast execution circle set; the number of elements in the contrast execution circle set is calculated, which is recorded as a second side face number; the connecting line segment of the first side face and the third side face is recorded as a second edge; Draw a straight line perpendicular to the second edge through the center of the first execution circle, the second execution circle, and so on, the nth execution circle on the first side, respectively, and intersect the second edge at the first verification point, the second verification point, and so on, the nth verification point; Draw a straight line perpendicular to the second edge through each verification point on the third side to obtain the first verification straight line, the second verification straight line, and so on, the nth verification straight line; Irradiate the third side with x-rays: Obtain the number of execution circles with the center on the first verification straight line, denoted as the first verification number; Obtain the number of execution circles with the center on the second verification straight line, denoted as the second verification number; And so on; Obtain the number of execution circles with the center on the nth verification straight line, denoted as the nth verification number; Obtain all verification numbers to form a verification number set; The execution solid detection strategy comprises: Traverse all elements in the verification number set and compare them with the second side number; Obtain elements smaller than the second side number, respectively denoted as the first marked number, the second marked number, and so on, the vth marked number, where v≦n; Obtain the radius of each execution circle in the execution circle set, calculate the average of all radii, and the result is denoted as the radius average r; Calculate (n-v)*the second side number+the first marked number+the second marked number+…+the vth marked number=the number of execution circles on the execution section, denoted as u; Calculate the volume k of all execution circles on the execution section of the computation k = ∑V (k) = ∑πr (k)2 ; The execution qualified judgment strategy comprises: Obtain the volume of all execution circles on the execution section corresponding to all execution units, calculate the sum of the volumes, and the result is denoted as the bubble volume x; Obtain the volume y of the chip cuboid; Calculate x / y, and the result is denoted as the bubble porosity; When the bubble porosity is greater than or equal to the threshold proportion, the chip is unqualified; When the bubble porosity is less than the threshold proportion, the chip is qualified.

2. The method of claim 1, wherein: The execution circle domain planning strategy for the projection figure further comprises: For any one split line segment: The split line segment divides the projection figure into two figures, respectively denoted as the first figure and the second figure; Set a differential value; Divide the split line segment into differential value line segments of equal length, and denote the line segments obtained by the division as bottom edge line segments; For any one bottom edge line segment: Draw a straight line perpendicular to the bottom edge line segment through the midpoint of the bottom edge line segment, denoted as a differential straight line; Denote the point of intersection of the differential straight line and the first figure as the first marked point; Denote the point of intersection of the differential straight line and the second figure as the second marked point; Measure the distance between the first marked point and the bottom edge line segment, denoted as the first differential height; Measure the distance between the second marked point and the bottom edge line segment, denoted as the second differential height; Calculate the area of the first figure: Obtain the first differential height of each bottom edge line segment, respectively denoted as the first left differential height, the second left differential height, and so on, the e-th left differential height; Obtain the length of the bottom edge line segment, denoted as the bottom edge length; Execute the following formula: The first left differential height*the bottom edge length+the second left differential height*the bottom edge length+…+the e-th left differential height*the bottom edge length=the area of the first figure.

3. The method of claim 2, wherein: The execution circle domain planning strategy for the projection figure further comprises: Calculate the area of the second figure: Obtain the second differential height of each bottom edge line segment, respectively denoted as the first right differential height, the second right differential height, and so on, the e-th right differential height; Execute the following formula: The first right differential height * the length of the base + the second right differential height * the length of the base + … + the e right differential height * the length of the base = the area of the second figure; Determine the size of the area of the first figure and the area of the second figure: If the area of the first figure is equal to the area of the second figure, get the midpoint of the division line segment, denoted as the execution center; Get the first differential height and the second differential height corresponding to each base line segment on the division line segment; Compare all the heights and get the maximum height, denoted as the execution radius; The circle obtained by taking the execution center as the center and the execution radius as the radius is denoted as the execution circle.

4. The system for realizing the chip automatic detection method of claim 3, comprising: Data measurement module: measure the distance between the first mark point and the base line segment; measure the distance between the second mark point and the base line segment; Measure the radius of each execution circle in the execution circle set; Data processing module: calculate the area of the first figure; calculate the area of the second figure; calculate the mean of all radii; Calculate the number of execution circles on the execution section; calculate the volume of all execution circles on the execution section; calculate the bubble volume; calculate the bubble porosity; Data judgment module: determine the size of the area of the first figure and the area of the second figure, get the execution circle; compare the bubble porosity with the threshold ratio to determine whether the chip is qualified.

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