Chip test carrier and chip test equipment

Abstract

The invention relates to a chip test carrier and chip test equipment, and relates to the technical field of semiconductors, the chip test carrier comprises a carrier plate main body and a cover plate, the carrier plate main body comprises a bottom plate and a limiting enclosing wall, the bottom plate is provided with a probe, the limiting enclosing wall is arranged on the edge of the bottom plate and surrounds the probe, and the limiting enclosing wall is arranged on the periphery of the bottom plate. The limiting enclosing wall and the bottom plate form a positioning cavity with an opening; the cover plate is detachably arranged on the limiting wall, and the cover plate is configured to block the opening and press the chip to be tested. The chip to be tested is placed in the positioning cavity of the carrier plate main body, and the opening is sealed by the cover plate, so that the direct influence of the external environment on the chip to be tested can be effectively isolated, the physical protection level of the chip is improved, the damage risk is reduced, and the chip to be tested can be better fixed by the positioning cavity and the cover plate. Therefore, the fixing and protecting effects of the to-be-tested chip in the testing process are better, a good testing effect can be achieved, and the yield of products is improved.

Description

Technical Field

[0001] The present application relates to the field of semiconductor technology, and in particular, to a chip testing carrier and a chip testing device. Background Art

[0002] The wafer-level testing of advanced process chips (such as HBM chips) is relatively mature, but there is no good solution for chip-level testing.

[0003] Take HBM chip as an example. HBM chip is a high-performance DRAM based on 3D stacking process, which is designed to meet the high demand for memory bandwidth and capacity in high-performance computing, artificial intelligence and graphics processing. HBM is a new type of memory chip technology that achieves high-speed and high-bandwidth memory access by vertically stacking multiple DRAM chips and using advanced packaging technologies such as through silicon vias (TSV) and micro bumps.

[0004] The manufacturing process of HBM chips mainly includes: thinning and bumping the memory core wafer, and then cutting it to obtain multiple bare dies; thinning and bumping the logic wafer; stacking multiple bare dies on the logic wafer to obtain a stacked wafer; cutting and wafer debonding or peeling the stacked wafer to obtain multiple stacked chips to be tested, and then packaging these stacked chips to be tested into tape and reel packaging and entering the subsequent process of batch shipment.

[0005] In the prior art, all chips need to be tested before they leave the factory. However, the test carriers for chips in the prior art have poor effects on fixing and protecting the chips. The external environment has a great impact on the chips to be tested, making it difficult to achieve good test results. Summary of the invention

[0006] The purpose of the present application is to provide a chip testing carrier and a chip testing device, which can better fix and protect the chip to be tested during the testing process, achieve good testing results, and improve the yield of the product.

[0007] In order to achieve the above object, the present invention provides the following solutions:

[0008] In a first aspect, the present invention provides a chip testing vehicle, comprising:

[0009] A carrier body, the carrier body comprising a bottom plate and a limiting enclosure, the bottom plate is provided with a probe for electrically contacting the chip to be tested, the limiting enclosure is provided at the edge of the bottom plate and surrounds the probe, the limiting enclosure and the bottom plate form a positioning cavity with an opening, the positioning cavity is used to accommodate and position the chip to be tested;

[0010] A cover plate is detachably disposed on the limiting wall, and the cover plate is configured to block the opening and press the chip to be tested.

[0011] In the above technical solution, the chip to be tested is directly exposed to the external environment and is susceptible to physical damage, pollution, electrostatic discharge (ESD) and other problems. By placing the chip to be tested in the positioning cavity of the carrier body and closing the opening with a cover plate, the direct impact of the external environment on the chip to be tested can be effectively isolated, the physical protection level of the chip can be improved, and the risk of damage can be reduced. The positioning cavity can accommodate and position the chip to be tested, and the cover plate is pressed on the chip to be tested, which can better fix the chip to be tested. Therefore, the chip test carrier provided by the present invention can better fix and protect the chip to be tested during the test process, can achieve good test results, and improve the yield of the product.

[0012] In an optional embodiment, locking structures are provided on both side edges of the cover plate, and the locking structures are buckled on the outer side of the limiting enclosure.

[0013] In the above technical solution, the locking structure can ensure the tight connection between the cover plate and the carrier body, reduce the influence of the external environment on the chip to be tested due to looseness or assembly gap, avoid the intrusion of pollutants such as dust and moisture, and further ensure the airtightness of the test environment. In addition, during the test process, the test carrier may be affected by various external forces. The locking structure can effectively prevent the cover plate from accidentally detaching due to external forces such as vibration and impact, ensuring the stability and safety of the chip to be tested.

[0014] In an optional embodiment, the locking structure includes a retaining spring sheet, which is arranged on a side edge of the cover plate and at least partially extends from the edge of the cover plate toward the limiting fence. The outer wall of the limiting fence is provided with a slot, and the retaining spring sheet is correspondingly inserted into the slot and elastically pressed against the outer wall of the limiting fence.

[0015] In the above technical solution, a tight connection between the cover plate and the limiting fence is achieved by using the cooperation of the retaining spring sheet and the retaining groove. The structure is simple and easy to assemble, and the retaining spring sheet elastically rests on the limiting fence, which can ensure that the structure and assembly are more stable, and further ensure the tight connection between the cover plate and the carrier body.

[0016] In an optional embodiment, the locking structure also includes a rotating shaft and a pressing spring sheet, and both side edges of the cover plate are provided with a clamping positioning seat, the rotating shaft can be rotatably mounted on the clamping positioning seat, the pressing spring sheet and the clamping spring sheet are integrally connected to the rotating shaft, and the pressing spring sheet is bent relative to the clamping spring sheet and is arranged on a side of the cover plate away from the bottom plate, and the pressing spring sheet is configured to drive the clamping spring sheet to rotate in a direction of disengaging from the slot in a pressed state.

[0017] In the above technical solution, by providing a pressing spring sheet, when disassembling, one only needs to press down the pressing spring sheet with one's hand to drive the holding spring sheet to unlock, which is very convenient and easy to take out the chip to be tested after the test.

[0018] In an optional embodiment, a positioning hole is provided on the clamping positioning seat, and the end of the rotating shaft is correspondingly assembled in the positioning hole. A torsion spring is also provided at the end of the rotating shaft, and the torsion spring is configured to provide elastic force for the clamping spring to clamp into the clamping slot.

[0019] In the above technical solution, by setting a torsion spring, the elastic force of the clamping spring to clamp into the slot can be provided in a natural state, so as to ensure that the clamping spring can always be clamped into the slot after being assembled in place, thereby ensuring the fixing effect. When disassembling, it is only necessary to press the clamping spring downward and overcome the elastic force of the torsion spring to unlock the clamping spring, which is very convenient.

[0020] In an optional embodiment, the holding spring sheet includes at least two spring sheet legs, the outer side wall of the limiting enclosure is provided with at least two of the slots, and the spring sheet legs are respectively inserted into the slots.

[0021] In the above technical solution, by providing a plurality of spring support legs and a plurality of clamping slots, on the one hand, the fixing clamping effect can be ensured, and on the other hand, alignment can be achieved during assembly to ensure assembly accuracy.

[0022] In an optional embodiment, a hook is provided at one end of the spring leg that is inserted into the slot, and the hook is bent toward the center of the cover plate. The inner wall of the slot is also correspondingly provided with an inwardly concave positioning groove, and the hook is correspondingly inserted into the positioning groove.

[0023] In the above technical solution, by providing a hook, it can be inserted into the positioning groove in the horizontal direction, so that the cover plate and the limiting fence can be better connected tightly in the vertical direction, and the fixing and holding effect is better.

[0024] In an optional embodiment, a pressing block is further provided on one side of the cover plate close to the bottom plate, and the pressing block protrudes toward the bottom plate and abuts against the back side of the chip to be tested.

[0025] In the above technical solution, by providing a pressing block, it can be pressed against the back of the chip to be tested to better press the chip to be tested, ensure the electrical contact between the chip to be tested and the probe, and further ensure the accurate connection of the test circuit.

[0026] In an optional embodiment, the pressing block is used to be provided with an elastic material layer on one side surface of the chip to be tested.

[0027] In the above technical solution, by providing an elastic material layer, on the one hand, it can prevent the chip to be tested from being scratched when the cover plate is pressed together, and on the other hand, it can play a buffering role to avoid damage to the chip to be tested due to excessive downward pressure.

[0028] In an optional embodiment, a temperature control board is further provided in the pressing block, and the temperature control board is used to heat or cool the chip to be tested.

[0029] In an optional embodiment, the carrier body also includes a test board, which is arranged on a side of the base plate away from the limiting wall, and the probe is arranged on the surface of the base plate and electrically contacted with the chip to be tested, and the probe is electrically connected to the test board.

[0030] In the above technical solution, the test board is integrated to facilitate the electrical contacts of the probes, thereby facilitating contact testing by an external test machine.

[0031] In an optional embodiment, the probe includes at least one of a spring needle and a micro-electromechanical system needle.

[0032] Among them, MEMS pin: Due to the high accuracy of MEMS technology, MEMS pin can provide very small contact points to ensure accurate docking with the bumps of the chip to be tested and the test solder joints. This high-precision connection helps reduce test errors and improve the quality of signal transmission.

[0033] Pogo pin: Pogo pin is known for its unique spring structure, which allows the pin to automatically adjust its position when pressure is applied to ensure optimal contact with the contact point. This adaptive ability ensures a stable connection even with slight position deviations. The spring structure of the Pogo pin not only provides good contact performance, but also gives it excellent durability. The spring can withstand multiple plug-ins and compressions without being easily damaged, which is especially important for application scenarios that require frequent testing and replacement of the chip under test.

[0034] In an optional embodiment, a detection pad is further provided on the edge of the test board, the detection pad is connected to the probe, and the detection pad is configured to be connected to a test machine during testing.

[0035] In the above technical scheme, for a high-density chip, such as an HBM chip, the spacing of the micro-bumps is 73um, and the spacing of the test pads is about 165um. These extremely small spacings put forward extremely high requirements on the accuracy during the test process. Due to the extremely small spacing, the traditional test socket faces great challenges when trying to accurately contact with the uBump or the test pad. Even a small deviation or misalignment may lead to poor contact or failure. Therefore, in this embodiment, a probe is designed on the bottom plate to contact the micro-bumps or test pads of the HBM chip, and the probe is also connected to the detection pad. The size of the detection pad is relatively large, and the test machine can test the HBM chip by detecting the pad, thereby reducing the difficulty of the test.

[0036] In an optional embodiment, an alignment mark is provided on the base plate, and the alignment mark is configured to align with the chip to be tested.

[0037] In the above technical solution, by designing alignment marks, alignment can be achieved during the loading process of the chip to be tested, ensuring the accurate alignment between the chip to be tested and the probe, and providing a clear reference point for the grasping robot arm. The robot arm can quickly identify and locate to the correct position, and the chip to be tested can be clamped, hovered, aligned and placed by the robot arm, thereby realizing the automation of the entire process, improving production efficiency, and reducing the uncertainty and errors caused by manual operation.

[0038] In an optional embodiment, a positioning notch is further provided on the limiting fence, and a positioning protrusion is provided on the edge of the cover plate, and the positioning protrusion is matched with the positioning notch to position the cover plate on the limiting fence.

[0039] In the above technical solution, by designing the positioning protrusions and positioning notches, a certain positioning and assembly action can be performed during the buckling process of the cover plate, thereby ensuring that the cover plate is accurately aligned.

[0040] In a second aspect, the present invention provides a chip testing device, comprising a testing machine and a chip testing carrier as described in any one of the aforementioned embodiments, wherein the testing machine is connected to the carrier body and is electrically connected to the probe.

[0041] Other features and advantages of the present application will be described in detail in the subsequent detailed description. BRIEF DESCRIPTION OF THE DRAWINGS

[0042] In order to more clearly illustrate the technical solutions of the embodiments of the present application, the drawings required for use in the embodiments will be briefly introduced below. It should be understood that the following drawings only show certain embodiments of the present application and therefore should not be regarded as limiting the scope. For ordinary technicians in this field, other related drawings can be obtained based on these drawings without paying creative work.

[0043] Figure 1 An overall front view of the chip test carrier provided in an embodiment of the present application;

[0044] Figure 2 Based Figure 1 Schematic diagram of the internal structure of the middle carrier board body;

[0045] Figure 3 for Figure 1 A top view of the main body of the middle carrier board;

[0046] Figure 4 A cross-sectional view of the internal structure of a chip test carrier provided in an embodiment of the present application;

[0047] Figure 5 A cross-sectional view of the internal structure of a chip test carrier provided in another preferred embodiment of the present application;

[0048] Figure 6 A schematic diagram of the probe structure of the chip test carrier provided in an embodiment of the present application;

[0049] Figure 7 A schematic diagram of the probe structure of a chip test carrier provided for applying other preferred embodiments;

[0050] Figure 8 An overall top view of the chip test carrier provided in an embodiment of the present application;

[0051] Fig. 9 An overall bottom view of the chip test carrier provided in an embodiment of the present application;

[0052] Fig.10 An overall side view of the chip testing carrier provided in an embodiment of the present application.

[0053] icon:

[0054] 100-chip test carrier; 110-carrier body; 120-bottom plate; 121-probe; 122-alignment mark; 130-limiting fence; 131-card slot; 132-positioning notch; 133-positioning groove; 140-cover plate; 141-pressing block; 142-elastic material layer; 143-positioning protrusion; 144-holding positioning seat; 150-locking structure; 151-holding spring; 152-rotating shaft; 153-pressing spring; 154-torsion spring; 155-spring support foot; 156-hook; 160-test board; 161-detection pad; 170-temperature control board; 171-temperature sensor; 200-chip to be tested. DETAILED DESCRIPTION

[0055] In order to make the purpose, technical scheme and advantages of the embodiments of the present application clearer, the technical scheme in the embodiments of the present application will be clearly and completely described below in conjunction with the drawings in the embodiments of the present application. Obviously, the described embodiments are part of the embodiments of the present application, rather than all of the embodiments. The components of the embodiments of the present application described and shown in the drawings here can be arranged and designed in various different configurations.

[0056] In the description of this application, it should be noted that the terms "inside", "outside", etc. indicate the orientation or positional relationship based on the orientation or positional relationship shown in the drawings, or the orientation or positional relationship in which the product of the application is usually placed when in use, which is only for the convenience of describing this application and simplifying the description, and does not indicate or imply that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and therefore cannot be understood as a limitation on this application. In addition, the terms "first", "second", etc. are only used to distinguish the description, and cannot be understood as indicating or implying relative importance.

[0057] In the description of this application, it should also be noted that, unless otherwise clearly specified and limited, the terms "disposed" and "connected" should be understood in a broad sense, for example, it can be a fixed connection, a detachable connection, or an integral connection; it can be a direct connection, or an indirect connection through an intermediate medium, or it can be the internal communication of two elements. For ordinary technicians in this field, the specific meanings of the above terms in this application can be understood according to specific circumstances.

[0058] It should be noted that, in the absence of conflict, the features in the embodiments of this application may be combined with each other.

[0059] See also Figures 1 to 3 The embodiment of the present invention provides a chip testing carrier 100, which can better fix and protect the chip 200 to be tested during the test process, achieve good test results, and improve the yield of the product.

[0060] The chip testing carrier 100 provided in an embodiment of the present invention includes a carrier body 110 and a cover plate 140. The carrier body 110 includes a base plate 120 and a limiting wall 130. The base plate 120 is provided with a probe 121 for electrically contacting the chip to be tested 200. The limiting wall 130 is arranged at the edge of the base plate 120 and surrounds the probe 121. The limiting wall 130 and the base plate 120 form a positioning cavity with an opening, and the positioning cavity is used to accommodate and position the chip to be tested 200; the cover plate 140 is detachably arranged on the limiting wall 130, and the cover plate 140 is configured to block the opening and press the chip to be tested 200.

[0061] It should be noted that the chip to be tested 200 is directly exposed to the external environment and is susceptible to physical damage, contamination, and electrostatic discharge (ESD) and other problems. By placing the chip to be tested 200 in the positioning cavity of the carrier body 110 and closing the opening with the cover plate 140, the direct impact of the external environment on the chip to be tested 200 can be effectively isolated, the physical protection level of the chip can be improved, and the risk of damage can be reduced. In addition, the positioning cavity can accommodate and position the chip to be tested 200, and the cover plate 140 is pressed on the chip to be tested 200, which can better fix the chip to be tested 200. Therefore, the chip test carrier 100 provided in the embodiment of the present invention can better fix and protect the chip to be tested 200 during the test process, can achieve good test results, and improve the yield of the product.

[0062] See also Figures 1 to 3 In some embodiments, locking structures 150 are provided on both side edges of the cover plate 140, and the locking structures 150 are buckled on the outside of the limiting fence 130. Preferably, locking structures 150 are provided on both left and right side edges of the cover plate 140, and the two locking structures 150 are buckled on the left and right sides of the limiting fence 130 respectively. The locking structure 150 can ensure a tight connection between the cover plate 140 and the carrier body 110, reduce the influence of the external environment on the chip to be tested 200 due to looseness or assembly gap, avoid the intrusion of pollutants such as dust and moisture, and further ensure the airtightness of the test environment. In addition, during the test process, the test carrier may be affected by various external forces, and the locking structure 150 can effectively prevent the cover plate 140 from accidentally detaching due to external forces such as vibration and impact, thereby ensuring the stability and safety of the chip to be tested 200.

[0063] See also Figure 4 , Figures 8 to 10 Further, the locking structure 150 includes a clamping spring 151, which is arranged on one side edge of the cover plate 140 and at least partially extends from the edge of the cover plate 140 toward the limiting fence. The outer side wall of the limiting fence is provided with a clamping groove 131. The clamping spring 151 is correspondingly clamped into the clamping groove 131 and elastically abuts against the outer side wall of the limiting fence. Specifically, the clamping spring 151 is a metal spring structure, and the left and right side edges of the cover plate 140 are both provided with the clamping spring 151. The cover plate 140 and the limiting fence 130 are tightly connected by using the clamping spring 151 and the clamping groove 131. The structure is simple and easy to assemble. The clamping spring 151 elastically abuts against the limiting fence, which can ensure that the structure and assembly are more stable, and further ensure the tight connection between the cover plate 140 and the carrier body.

[0064] In some embodiments, the locking structure 150 also includes a rotating shaft 152 and a pressing spring piece 153. The edges of both sides of the cover plate 140 are provided with a clamping positioning seat 144. The rotating shaft 152 can be rotatably assembled on the clamping positioning seat 144. The pressing spring piece 153 and the clamping spring piece 151 are integrally connected to the rotating shaft 152. The pressing spring piece 153 is bent relative to the clamping spring piece 151 and is arranged on the side of the cover plate 140 away from the bottom plate 120. The pressing spring piece 153 is configured to drive the clamping spring piece 151 to rotate in the direction of disengaging from the card slot 131 when in a pressed state. Specifically, the rotating shaft 152, the pressing spring sheet 153 and the holding spring sheet 151 are integrally arranged, and the pressing spring sheet 153 and the holding spring sheet 151 are designed to be at an acute angle. When the pressing spring sheet 153 is pressed down by hand, the rotating shaft 152 can be driven to rotate relative to the holding positioning seat 144, and then the holding spring sheet 151 can be driven to rotate, so as to be disengaged from the card slot 131 and unlocked. Therefore, by providing the pressing spring sheet 153, when disassembling, only the pressing spring sheet 153 is pressed down by hand to drive the holding spring sheet 151 to unlock, which is very convenient and easy to take out the chip 200 to be tested after the test.

[0065] It should be noted that in other preferred embodiments of the present invention, the retaining spring piece 151 can also be fixedly set on the edge of the cover plate 140, and the assembly and disassembly actions can be completed by the deformation of the retaining spring piece 151 itself, thereby simplifying the structure and reducing costs.

[0066] In some embodiments, a positioning hole is provided on the holding and positioning seat 144, and the end of the rotating shaft 152 is correspondingly assembled in the positioning hole, and a torsion spring 154 is also provided at the end of the rotating shaft 152, and the torsion spring 154 is configured to provide elastic force for the holding spring piece 151 to be inserted into the card slot 131. Specifically, an assembly port is provided on the holding and positioning seat 144, and a positioning hole is formed on the side wall opposite to the assembly port. The two ends of the rotating shaft 152 are provided with torsion springs 154 and are correspondingly assembled into the assembly port to achieve rotational assembly. At the same time, the torsion spring 154 is sleeved on the end of the rotating shaft 152, and one end of the torsion spring 154 is fixed to the rotating shaft 152, and the other end is fixed to the holding and positioning seat 144, so as to provide elastic force to the rotating shaft 152, and the elastic force can make the holding spring piece 151 elastically abut against the limiting fence 130. By providing the torsion spring 154, the elastic force of the clamping spring 151 to clamp into the clamping slot 131 can be provided in a natural state, so as to ensure that the clamping spring 151 can always be clamped into the clamping slot 131 after being assembled in place, thereby ensuring the fixing effect. When disassembling, the clamping spring 151 can be unlocked by only pressing down the clamping spring 153 and overcoming the elastic force of the torsion spring 154, which is very convenient.

[0067] In some embodiments, the clamping spring 151 includes at least two spring legs 155, and the outer side wall of the limiting fence 130 is provided with at least two slots 131, and the spring legs 155 are respectively inserted into the slots 131. Specifically, the spring legs 155 protrude downward and extend, preferably two, and the outer side of the limiting fence 130 is provided with two slots 131, and the two spring legs 155 are correspondingly inserted into the two slots 131 to achieve assembly. By providing multiple spring legs 155 and multiple slots 131, on the one hand, the fixed clamping effect can be guaranteed, and on the other hand, alignment can be achieved during assembly to ensure assembly accuracy.

[0068] In some embodiments, a hook 156 is provided at one end of the spring support leg 155 that is inserted into the slot 131. The hook 156 is bent toward the center of the cover plate 140. The inner wall of the slot 131 is also correspondingly provided with a concave positioning groove 133. The hook 156 is correspondingly inserted into the positioning groove 133. Specifically, the hook 156 is bent in the horizontal direction, and the positioning groove 133 is concave in the horizontal direction. By providing the hook 156, the positioning groove 133 can be inserted in the horizontal direction, so that the cover plate 140 and the limiting fence 130 can be better connected in the vertical direction, and the fixing and holding effect is better.

[0069] See also Figure 4 In some embodiments, a pressing block 141 is further provided on one side of the cover plate 140 close to the bottom plate 120. The pressing block 141 protrudes toward the bottom plate 120 and abuts against the back of the chip to be tested 200. Specifically, the pressing block 141 can be integrally provided on the bottom surface of the cover plate 140, and the size of the pressing block 141 can be adapted to the size of the chip to be tested 200, so that the pressing block 141 can be pressed exactly against the back of the chip to be tested 200. By providing the pressing block 141, it can be pressed against the back of the chip to be tested 200 to better press the chip to be tested 200, ensure the electrical contact between the chip to be tested 200 and the probe 121, and further ensure the accurate connection of the test circuit.

[0070] Furthermore, the pressing block 141 is used to be provided with an elastic material layer 142 on one side surface of the chip to be tested 200. The elastic material layer 142 may be a silicone layer. 、 Thermally conductive gel, PI layer or Teflon and other materials that can achieve elastic buffering can be provided with an elastic material layer 142, which can prevent the chip under test 200 from being scratched when the cover plate 140 is pressed together, and can also play a buffering role to avoid damage to the chip under test 200 due to excessive downward pressure.

[0071] In other preferred embodiments of the present invention, see Figure 5A temperature control board 170 is also provided in the pressing block 141. The temperature control board 170 is used to heat or cool the chip to be tested so as to keep the test environment within a reasonable temperature range. Specifically, the temperature control board 170 can be a semiconductor refrigeration sheet, which can be led to the outside through internal wires and then electrically connected to an external power source. In addition, the semiconductor refrigeration sheet has a heating surface and a cooling surface, and the heating surface and the cooling surface can be adjusted by reversely connecting the positive and negative poles, so that the temperature control board 170 can heat or cool the chip to be tested as needed.

[0072] Furthermore, in order to better control the temperature in the test environment (i.e., the positioning cavity), a temperature sensor 171 can be added to the inner wall of the limiting fence 130. The temperature sensor 171 is communicated with the temperature control board 170, and can provide real-time feedback on the temperature information in the positioning cavity, so that the temperature control board 170 can adjust the heating and cooling power according to the actual temperature conditions.

[0073] In particular, in an implementation scheme in which the temperature control plate 170 is additionally provided, the pressing block 141 may be made of a heat-conducting material, such as a copper block or an aluminum block, so as to achieve better heat dissipation.

[0074] Please continue to see Figures 4 to 10 In some embodiments, the carrier body 110 also includes a test board 160, which is arranged on a side of the base plate 120 away from the limiting wall 130, and the probe 121 is arranged on the surface of the base plate 120 and is electrically contacted with the chip to be tested 200, and the probe 121 is electrically connected to the test board 160.

[0075] The probe 121 includes at least one of a spring pin and a micro-electromechanical system pin. Among them, micro-electromechanical system pin (MEMS pin): Due to the high accuracy of MEMS technology, the MEMS pin can provide very small contact points to ensure accurate docking with the bumps and test solder joints of the chip 200 to be tested. This high-precision connection helps to reduce test errors and improve the quality of signal transmission. Spring pin (Pogo pin): Pogo pin is known for its unique spring structure, which allows the pin to automatically adjust its position when under pressure to ensure optimal contact with the contact point. This adaptive ability ensures a stable connection even with slight position deviations. The spring structure of the Pogo pin not only provides good contact performance, but also gives it excellent durability. The spring can withstand multiple plug-ins and compressions without being easily damaged, which is particularly important for application scenarios where the chip 200 to be tested needs to be frequently tested and replaced.

[0076] Preferably, in this embodiment, the probe 121 is a MEMS pin, which is arranged on the surface of the base plate 120, and the chip 200 to be tested is electrically connected to the probe 121, wherein the periphery of the base plate 120 is also provided with an electrical connection layer, and the electrical connection layer is connected to the pad on the back of the base plate 120 through the conductive through hole at the bottom, such as Figure 6 In other preferred embodiments of the present invention, the probe 121 is connected to the electrical connection layer at the edge, and the electrical connection layer is directly connected to the pad of the external test board 160 through a metal lead, thereby using the metal lead instead of forming a conductive hole on the bottom plate 120, which greatly reduces the cost. Figure 7 .

[0077] See also Figure 8 and Fig. 9 In some embodiments, a detection pad 161 is also provided at the edge of the test board 160, and the detection pad 161 is connected to the probe 121, and the detection pad 161 is configured to be connected to the test machine during the test. Specifically, the high-density chip can be a 3D / 2.5D chip or an HBM chip, and the pitch of its micro-bumps is less than 50μm. These extremely small pitches put forward extremely high requirements on the accuracy during the test process. Due to the extremely small pitch, the traditional test socket faces great challenges when trying to make accurate contact with the Bump or test pad. Even a slight deviation or misalignment may lead to poor contact or failure. Therefore, in this embodiment, the probe 121 is designed on the base plate 120 to contact the micro-bump or test pad of the HBM chip, and the probe 121 is also connected to the detection pad 161. The size of the detection pad 161 is relatively large, and the test machine can test the HBM chip through the detection pad 161, which reduces the difficulty of testing.

[0078] See also Figure 2 and Figure 3 In some embodiments, an alignment mark 122 is provided on the bottom plate 120, and the alignment mark 122 is configured to align the chip to be tested 200. Specifically, the alignment mark 122 can be a special mark such as a cross mark, and a corresponding mark can also be provided on the chip to be tested 200. When the chip to be tested 200 is actually loaded, the chip to be tested 200 can be aligned by a manipulator and then loaded into the positioning cavity. By designing the alignment mark 122, alignment can be achieved during the loading process of the chip to be tested 200, ensuring accurate alignment between the chip to be tested 200 and the probe 121, and providing a clear reference point for the grabbing robot arm, so that the robot arm can quickly identify and locate to the correct position, and the chip to be tested 200 is clamped, hovered, aligned and placed by the robot arm, thereby realizing the automation of the entire process, improving production efficiency, and reducing the uncertainty and errors caused by manual operation.

[0079] See also Figure 1 and Figure 2In some embodiments, a positioning notch 132 is further provided on the limiting fence 130, and a positioning protrusion 143 is provided on the edge of the cover plate 140. The positioning protrusion 143 is adapted to the positioning notch 132 so that the cover plate 140 is positioned on the limiting fence 130. Specifically, the positioning notch 132 is provided on the front and rear sides of the limiting fence 130, and the positioning protrusion 143 is provided on the front and rear edges of the cover plate 140. The positioning protrusion 143 can just block the positioning notch 132 to ensure the airtightness of the positioning cavity. At the same time, by designing the positioning protrusion 143 and the positioning notch 132, a certain positioning and assembly action can be performed during the buckling process of the cover plate 140 to ensure that the cover plate 140 is accurately aligned.

[0080] In the embodiment of the present application, the tests on the chip 200 to be tested include: logic chip test, dynamic vector aging stress test, TSV test, high-speed performance test, PHY I / O test, 2.5D SIP test, and Burn in test.

[0081] Among them, logic chip test: As one of the core components of HBM KGSD, the performance of the logic chip directly affects the stability and reliability of the entire system. The test content includes functional test, timing test, power consumption test, etc. to ensure that the logic chip can work normally under various working conditions.

[0082] Dynamic vector aging stress test: Dynamic vector aging stress test is designed to simulate the aging of chips during long-term use to evaluate their lifespan and reliability. The specific test method includes: applying specific dynamic vectors to the chip, observing its performance changes under different stress conditions, and thus predicting its service life.

[0083] TSV test: TSV (Through Silicon Via) is a key technology for HBM to achieve vertical chip stacking, and its quality directly affects the speed and stability of data transmission. The test content includes the electrical performance test of TSV resistance, capacitance, inductance, etc., as well as the connection reliability test between TSV and micro bumps.

[0084] High-speed performance test: HBM is designed to provide extremely high data transmission speeds, so high-speed performance testing is an important indicator for evaluating its performance. Specific testing methods include: testing HBM's bandwidth, latency and other key performance indicators through dedicated high-speed testing equipment.

[0085] PHY I / O test: PHY I / O (physical layer input and output) is the interface for HBM to communicate with external devices. Its performance directly affects the quality and efficiency of data transmission. The test content includes the rate, timing, signal integrity and other tests of the I / O interface to ensure the accuracy and stability of data transmission.

[0086] 2.5D SIP test: 2.5D SIP (system-in-package) technology integrates multiple chips and components in one package to form a compact system-level solution. All chips and components in the package need to be fully tested, including functional testing, interconnect testing, thermal testing, etc., to ensure the performance and reliability of the entire system.

[0087] Burn-in test: Burn-in test is an accelerated aging test method designed to quickly expose potential manufacturing defects or early failure modes by simulating long-term operation of chips under extreme conditions.

[0088] After the above test process, repair is usually carried out, including screening and replacement, parameter adjustment, fault analysis, etc. Among them, screening and replacement: the bad chips found in the test are screened out from the production batch and replaced with qualified chips. Parameter adjustment: For some defects that can be optimized by software or firmware adjustment, the performance of the chip may be improved by adjusting the parameters. Fault analysis: Detailed analysis of the failed chip to find out the root cause of the failure so that improvements can be made in the subsequent production process.

[0089] An embodiment of the present invention also provides a chip testing device, including a testing machine and the aforementioned chip testing carrier 100, wherein the chip testing carrier 100 includes a carrier body 110 and a cover plate 140, wherein the carrier body 110 includes a base plate 120, a limiting fence 130 and a testing board 160, wherein the base plate 120 is provided with a probe 121 for electrically contacting the chip to be tested 200, the limiting fence 130 is arranged at the edge of the base plate 120 and surrounds the probe 121, the limiting fence 130 and the base plate 120 form a positioning cavity with an opening, and the positioning cavity is used to accommodate and position the chip to be tested 200; the cover plate 140 is detachably arranged on the limiting fence 130, and the cover plate 140 is configured to block the opening and press the chip to be tested 200. The test board 160 is arranged on a side of the base plate 120 away from the limiting fence 130. One end of the probe 121 is exposed from the base plate 120 and is electrically in contact with the chip to be tested 200. The other end of the probe 121 is connected to the test board 160. The test machine is connected to the test board 160 of the carrier body 110 and is electrically connected to the probe 121.

[0090] The testing machine is in electrical contact with the detection pads 161 on the testing board 160 , so that the testing is implemented through the detection pads 161 .

[0091] In summary, the chip test carrier 100 and chip test equipment provided by the embodiment of the present invention can effectively isolate the direct impact of the external environment on the chip to be tested 200 by placing the chip to be tested 200 in the positioning cavity of the carrier body 110 and closing the opening with the cover plate 140, thereby improving the physical protection level of the chip and reducing the risk of damage, and the positioning cavity can accommodate and position the chip to be tested 200, and the cover plate 140 is pressed on the chip to be tested 200, which can better fix the chip to be tested 200. Therefore, the chip test carrier 100 provided by the present invention can better fix and protect the chip to be tested 200 during the test process, can achieve good test results, and improve the yield of the product. In addition, by locking with a locking device, a close connection between the cover plate 140 and the carrier body 110 can be ensured, and the impact of the external environment on the chip to be tested 200 due to looseness or assembly gap can be reduced.

[0092] The above description is only the preferred embodiment of the present application and is not intended to limit the present application. For those skilled in the art, the present application may have various modifications and variations. Any modification, equivalent replacement, improvement, etc. made within the spirit and principle of the present application shall be included in the protection scope of the present application.

Claims

1. A chip testing vehicle, characterized in that: include: A carrier body (110), the carrier body (110) comprising a bottom plate (120) and a limiting enclosure (130), the bottom plate (120) being provided with a probe (121) for electrically contacting a chip to be tested (200), the limiting enclosure (130) being arranged at an edge of the bottom plate (120) and surrounding the probe (121), the limiting enclosure (130) and the bottom plate (120) forming a positioning cavity with an opening, the positioning cavity being used to accommodate and position the chip to be tested (200); A cover plate (140), the cover plate (140) being detachably arranged on the limiting enclosure (130), and the cover plate (140) being configured to block the opening and press the chip to be tested (200).

2. The chip testing carrier according to claim 1, characterized in that: Locking structures (150) are provided on both side edges of the cover plate (140), and the locking structures (150) are buckled onto the outer side of the limiting enclosure wall (130).

3. The chip testing carrier according to claim 2, characterized in that: The locking structure (150) comprises a retaining spring piece (151), the retaining spring piece (151) being arranged on a side edge of the cover plate (140) and at least partially extending from the edge of the cover plate (140) toward the limiting fence, the outer side wall of the limiting fence being provided with a retaining groove (131), the retaining spring piece (151) correspondingly being inserted into the retaining groove (131) and elastically pressed against the outer side wall of the limiting fence.

4. The chip testing carrier according to claim 3, characterized in that: The locking structure (150) further comprises a rotating shaft (152) and a pressing spring sheet (153). The edges of both sides of the cover plate (140) are provided with a holding and positioning seat (144). The rotating shaft (152) is rotatably mounted on the holding and positioning seat (144). The pressing spring sheet (153) and the holding spring sheet (151) are integrally connected to the rotating shaft (152). The pressing spring sheet (153) is bent relative to the holding spring sheet (151) and is arranged on a side of the cover plate (140) away from the bottom plate (120). The pressing spring sheet (153) is configured to drive the holding spring sheet (151) to rotate in a direction of disengaging from the card slot (131) in a pressed state.

5. The chip testing carrier according to claim 4, characterized in that: A positioning hole is provided on the clamping positioning seat (144), and the end of the rotating shaft (152) is correspondingly assembled in the positioning hole. A torsion spring (154) is also provided at the end of the rotating shaft (152), and the torsion spring (154) is configured to provide elastic force for the clamping spring sheet (151) to clamp into the clamping slot (131).

6. The chip testing carrier according to claim 3, characterized in that: The holding spring sheet (151) comprises at least two spring sheet legs (155), the outer side wall of the limiting enclosure (130) is provided with at least two of the holding slots (131), and the spring sheet legs (155) are respectively inserted into the holding slots (131).

7. The chip testing carrier according to claim 6, characterized in that: A hook (156) is provided at one end of the spring support leg (155) that is inserted into the slot (131); the hook (156) is bent toward the center of the cover plate (140); an inner wall of the slot (131) is also correspondingly provided with an inwardly concave positioning groove (133); the hook (156) is correspondingly inserted into the positioning groove (133).

8. The chip testing carrier according to claim 1, characterized in that: A pressing block (141) is also provided on one side of the cover plate (140) close to the base plate (120); the pressing block (141) protrudes towards the base plate (120) and abuts against the back side of the chip to be tested (200).

9. The chip testing carrier according to claim 8, characterized in that: The pressing block (141) is used to be provided with an elastic material layer (142) on one side surface of the chip to be tested (200).

10. The chip testing carrier according to claim 8, characterized in that: A temperature control board (170) is also provided in the pressing block (141), and the temperature control board (170) is used to heat or cool the chip to be tested.

11. The chip testing carrier according to claim 1, characterized in that: The carrier body (110) further comprises a test board (160), wherein the test board (160) is arranged on a side of the base plate (120) away from the limiting wall (130), and the probe (121) is arranged on a surface of the base plate (120) and is in electrical contact with the chip to be tested (200), and the probe (121) is electrically connected to the test board (160).

12. The chip testing carrier according to claim 11, characterized in that: The probe (121) comprises at least one of a spring needle and a micro-electromechanical system needle.

13. The chip testing carrier according to claim 11, characterized in that: The edge of the test board (160) is also provided with a detection pad (161), the detection pad (161) is connected to the probe (121), and the detection pad (161) is configured to be connected to a test machine during testing.

14. The chip testing carrier according to claim 1, characterized in that: An alignment mark (122) is provided on the base plate (120), and the alignment mark (122) is configured to align with the chip to be tested (200).

15. The chip testing carrier according to claim 1, characterized in that: The limiting enclosure (130) is also provided with a positioning notch (132), and the edge of the cover plate (140) is provided with a positioning protrusion (143), and the positioning protrusion (143) is matched with the positioning notch (132) so that the cover plate (140) is positioned on the limiting enclosure (130).

16. A chip testing device, characterized in that: It comprises a testing machine and a chip testing carrier as claimed in any one of claims 1 to 15, wherein the testing machine is connected to the carrier body (110) and is electrically connected to the probe (121).

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