Heat dissipation device and server

Abstract

The application discloses a heat dissipation device and a server, which comprise air cooling structure and liquid cooling structure. The air cooling structure is used for air cooling and heat dissipation of first and second types of devices, and the liquid cooling structure is used for liquid cooling and heat dissipation of the first type of device. The heat generated by the first type of device is higher than that of the second type of device. The liquid cooling structure specifically comprises a liquid cooling assembly and a heat exchanger. The liquid cooling assembly can conduct the heat generated by the first type of device to the cooling liquid in the liquid supply pipeline of the liquid cooling assembly. The heat exchanger is used for heat exchange between the cooling liquid and external air, and the heat exchanger is arranged at the end of the server. Arranging the heat exchanger at the end of the server can prevent the heat dissipation air from affecting the heat dissipation of other devices of the server, effectively manage the heat, and improve the heat dissipation capacity of the server.

Description

[0001] This application is a divisional application. The application number of the original application is 202111135533.7, and the original application date is September 27, 2021. The entire content of the original application is incorporated into this application by reference. Technical Field

[0002] The present application relates to the technical field of servers, and in particular to a heat dissipation device and a server. Background Art

[0003] With the development of technology, the performance of processors in electronic devices such as servers continues to improve, and their power consumption is also getting higher and higher, which also puts higher requirements on the heat dissipation of electronic devices. Traditional air-cooled radiators cannot effectively solve the heat dissipation problem of processors.

[0004] To improve heat dissipation, high-power devices like processors can be cooled with liquid cooling supplemented by air cooling. However, due to structural limitations, the high-temperature airflow from the radiator can affect the heat dissipation of these functional components. Therefore, finding a more efficient heat dissipation device has become a pressing technical issue. Summary of the Invention

[0005] The present application provides a heat dissipation device and a server, which are used to improve the heat dissipation capacity of the server.

[0006] In the first aspect, the present application provides a heat dissipation device that can be applied to a server, the heat dissipation device includes an air cooling structure and a liquid cooling structure, and the heat dissipation of the server is performed by combining air cooling with liquid cooling. It is assumed that a first type of device and a second type of device are provided in the server, the heat generated by the first type of device is higher than that of the second type of device, the first type of device can be a device with a high heat dissipation capacity such as a processor, and the second type of device can be a device such as a PCIe (peripheral component interconnect express) card; the air cooling structure in the heat dissipation device provided by the present application is used to simultaneously perform air cooling and heat dissipation on the first type of device and the second type of device, while the liquid cooling structure is used to perform targeted liquid cooling and heat dissipation on the first type of device; the liquid cooling structure specifically includes: a liquid cooling component and a heat exchanger, the liquid cooling component can transfer the heat generated by the first type of device to the coolant in the liquid supply pipeline of the liquid cooling component; the heat exchanger is used to perform heat exchange between the coolant and the external air, and the heat exchanger here is provided at the end of the server.

[0007] The heat dissipation device provided in the present application uses a combination of air cooling and liquid cooling to dissipate heat for the first type of devices and the second type of devices in the server, wherein the liquid cooling structure can provide targeted heat dissipation for the first type of devices with higher heat dissipation; the heat exchanger is arranged at the end of the server so that the heat exchanger heat dissipation air outlet does not affect the heat dissipation of other devices in the server, thereby achieving effective heat management, thereby improving the heat dissipation capacity of the server.

[0008] The heat exchanger comprises a heat exchange inner cavity and a fluid replenishment cavity located at the top of the heat exchange inner cavity. The heat exchange inner cavity has a fluid inlet for coolant flow and a fluid outlet for coolant flow. The fluid replenishment cavity is filled with coolant and is connected to the heat exchange inner cavity via a fluid replenishment channel. Specifically, the coolant level in the fluid replenishment cavity is no less than a fluid level threshold, which represents the amount of coolant loss expected over the service life of the heat dissipation device.

[0009] In a specific implementation, the air cooling structure can form an air duct in the chassis of the server, and the heat exchanger of the liquid cooling structure is arranged at the air outlet of the air duct, which will not have an adverse effect on the heat dissipation of other devices.

[0010] In one possible implementation, the air cooling structure includes a partition that divides the server cavity into at least two air ducts, including a first air duct and a second air duct. The heat exchanger is located at the outlet of the first air duct. The first and second type components can be placed in the second air duct, thereby reducing temperature cascades and improving heat dissipation. The partition can be made of sheet metal or plastic.

[0011] The air-cooling structure can also include a cooling fan, specifically located on the air inlet side of the heat exchanger, to provide stronger wind to the heat exchanger, improving the cooling effect. To improve heat dissipation, the liquid-cooling structure can also include an auxiliary heat exchanger, specifically located in the first air duct and connected in series with the heat exchanger.

[0012] Specifically, the partition is parallel to the PCB in the server, and the distance between the partition and the tallest component on the PCB is less than a height threshold. This height threshold ensures that all components on the PCB can achieve effective cooling within the air duct. Optionally, the partition can be removably installed at any of the multiple installation stations perpendicular to the partition, allowing for height adjustment based on different application scenarios.

[0013] In one possible implementation, the liquid cooling component may specifically include a liquid pipeline, a coolant and a circulation pump; the liquid pipeline is connected to the heat exchanger, and the coolant is filled in the liquid pipeline and the heat exchanger; the circulation pump is connected to the liquid pipeline to drive the coolant to circulate between the heat exchanger and the liquid pipeline.

[0014] In order to improve the liquid cooling heat dissipation effect of the first type of devices, the liquid cooling component can also include a cold plate, and part of the liquid pipeline is encapsulated in the cold plate; the cold plate is used to contact the above-mentioned first type of devices to facilitate heat exchange between the first type of devices and the coolant in the liquid pipeline.

[0015] In one possible implementation, the circulation pump is located at a higher position. When a partition is fixed in the cavity of the server, a hollow area can be set on the partition. The hollow area can avoid the circulation pump, which can not only achieve the effect of air duct isolation, but also will not affect the realization of liquid cooling.

[0016] In a second aspect, the present application provides a server, which includes a first type of component, a second type of component, and any of the above-mentioned heat dissipation devices.

[0017] Based on the implementation methods provided in the above aspects, this application can also be further combined to provide more implementation methods. BRIEF DESCRIPTION OF THE DRAWINGS

[0018] Figure 1 A schematic structural diagram of a heat dissipation device provided in an embodiment of the present application applied to a server is shown;

[0019] Figure 2 A schematic structural diagram of another heat dissipation device provided in an embodiment of the present application applied to a server is shown;

[0020] Figure 3 A schematic diagram of the structure of an installation station in a server chassis for adjusting the installation position of a partition in a heat dissipation device provided by an embodiment of the present application is shown;

[0021] Figure 4 A schematic structural diagram of a heat exchanger in a heat dissipation device provided in an embodiment of the present application;

[0022] Figure 5 A schematic structural diagram of a heat exchanger in another heat dissipation device provided in an embodiment of the present application;

[0023] Figure 6 A schematic structural diagram of a heat dissipation device provided in an embodiment of the present application applied to a server;

[0024] Figure 7 A schematic diagram of the structure of the cold plate and liquid pipeline packaging in a heat dissipation device provided in an embodiment of the present application;

[0025] Figure 8 A schematic diagram of the structure of the cold plate and liquid pipeline packaging in another heat dissipation device provided in an embodiment of the present application;

[0026] Figure 9 A schematic structural diagram of a heat dissipation device provided in an embodiment of the present application applied to a server;

[0027] Figure 10 A schematic diagram of a structure in which a liquid cooling structure in a heat dissipation device provided in an embodiment of the present application dissipates heat for a processor;

[0028] Figure 11 A schematic diagram of the structure of another heat dissipation device provided in an embodiment of the present application, wherein the liquid cooling structure dissipates heat for the processor;

[0029] Figure 12 A schematic diagram of the structure of another heat dissipation device provided in an embodiment of the present application, wherein the liquid cooling structure dissipates heat for the processor;

[0030] Figure 13 A schematic diagram of the structure of another heat dissipation device provided in an embodiment of the present application, wherein the liquid cooling structure dissipates heat for the processor;

[0031] Figure 14 A schematic diagram of the structure of another heat dissipation device provided in an embodiment of the present application, wherein the liquid cooling structure dissipates heat for the processor;

[0032] Figure 15 A schematic structural diagram of a heat dissipation device provided in an embodiment of the present application applied to a server;

[0033] Figure 16 A schematic diagram of the structure of a heat dissipation device provided in an embodiment of the present application arranged in a server;

[0034] Figure 17 A schematic diagram of the structure of another heat dissipation device provided in an embodiment of the present application arranged in a server;

[0035] Figure 18 A schematic diagram of the structure of another heat dissipation device provided in an embodiment of the present application arranged in a server;

[0036] Figure 19 A schematic diagram of the structure of a heat dissipation device provided in an embodiment of the present application arranged in a server. DETAILED DESCRIPTION

[0037] Existing servers often use liquid cooling assisted by air cooling for heat dissipation. However, due to the limitations of structural space layout, liquid cooling and air cooling affect each other, resulting in poor heat dissipation effect.

[0038] The present application will be described in further detail below with reference to the accompanying drawings.

[0039] Figure 1The server shown in the chassis 201 is provided with first type devices and second type devices; wherein the heat generated by the first type devices is higher than the heat generated by the second type devices; the first type devices can be devices such as processors 202 that dissipate high power consumption and high heat, and the second type devices can be low power consumption and less heat dissipating devices such as PCIe cards 204. Generally, a PCB (print circuit board) 203 is provided in the chassis 201, the processor 202 is coupled to the PCB 203, and the PCIe card 204 is located in the chassis 201 and is plugged on the PCB 203. Since the heat generated by the first type devices and the second type devices is different, different heat dissipation methods can be used for the first type devices and the second type devices.

[0040] Please continue to refer to Figure 1 The heat dissipation device provided by the present application includes an air cooling structure and a liquid cooling structure, realizing the heat dissipation mode of air cooling plus liquid cooling. The air cooling structure includes a system fan 11, which can be specifically arranged at a relatively front end of the chassis 201. The system fan 11 can form a heat dissipation air duct in the chassis 201, and air cooling is used to dissipate heat for the first type devices and the second type devices. Here, the "end" and "front end" of the server chassis 201 are a relative position concept, and the "end" of the server chassis 201 refers to the position close to the rear panel of the server. Figure 1 The server shown in the figure is taken as a reference, the system fan 11 forms a heat dissipation air duct in the chassis 201, and along the movement direction of the airflow in the heat dissipation channel, the end of the chassis 201 refers to the position close to the rear panel of the server. In combination with Figure 16 The top view of the whole machine structure shown in the figure, the right side area of the chassis 201 is the front panel 220, and the end of the chassis 201 refers to the end side opposite to the front panel 220, for example, the range shown in the area 221 in the figure can be referred to as the end of the chassis 201.

[0041] The liquid cooling structure performs liquid cooling and heat dissipation for the first type of devices, specifically including a liquid cooling component 21 and a heat exchanger 22. The liquid cooling component 21 has a liquid pipeline 211 and a circulation pump 212 connected to the liquid pipeline 211. The liquid pipeline 211 is connected to the heat exchanger 22, and the liquid pipeline 211 and the heat exchanger 22 are filled with coolant, thereby forming a closed circulation system; the circulation pump 212 can drive the coolant to circulate between the liquid cooling pipeline 211 and the heat exchanger 22; the path of the liquid cooling pipeline 211 is set to pass through the first type of devices (taking the processor 202 as an example), so that the heat emitted by the processor 202 can be absorbed into the coolant. Driven by the circulation pump 212, the coolant after absorbing the heat moves to the heat exchanger 22. The heat exchanger 22 is used for heat exchange between the coolant and the outside air. The cooled coolant is driven back to the liquid cooling pipeline 211 by the circulation pump 212, realizing the liquid cooling circulation of the coolant for the first type of devices. The heat exchanger 22 is provided at the end of the server, and the heat dissipated by the heat exchanger 22 can directly contact the outside world without affecting the heat dissipation of other devices (including but not limited to the first type of devices and the second type of devices). Figure 1 In the figure, along the height direction Z of the server chassis 201, the heat exchanger 22 and the PCIe card 204 are positioned side by side.

[0042] To facilitate heat management, please refer to Figure 2 As shown, the air cooling structure also includes a partition 12, which can separate the cavity of the server chassis 201 into at least two air ducts: a first air duct A1 and a second air duct A2. The partition 12 extends along the air flow direction of the system fan 11. The above-mentioned heat exchanger 22 can be specifically arranged at the air outlet of the first air duct A1, which is equivalent to the air cooling of the heat exchanger 22 being achieved only through the first air duct A1. The first type of device (taking the processor 202 as an example) and the second type of device (taking the PCIe card 204 as an example) are arranged in the second air duct A2, and the air cooling of the first type of device and the second type of device is achieved only through the second air duct A2. By setting the partition 12, the air cooling of the heat exchanger 22 is separated from the air cooling of the first type of device and the second type of device, which can reduce the temperature cascade of the heat dissipation structure and thus improve the heat dissipation capacity of the bottleneck device. The material of the partition 12 is not limited, and sheet metal or plastic can be selected.

[0043] Among them, the partition 12 can be parallel to the PCB203 in the server, and the distance between the partition 12 and the highest component in the PCB203 is less than or equal to the height threshold h; assuming that the highest component on the PCB203 is the processor 202, the distance between the partition 12 and the surface of the processor 202 facing away from the PCB203 should not be greater than the height threshold h, and the height threshold h can ensure that all components in the second air duct can achieve air cooling and heat dissipation.

[0044] When different devices can be arranged in the server, the devices located in the second air duct A2 can have different heights, so that the position of the partition plate 12 in the cabinet 201 can be adjusted. As shown in Figure 3 the thickness direction Z of the partition plate 12, a plurality of mounting positions can be provided in the cabinet 201 of the server, and the partition plate 12 can be detachably mounted at any one of the mounting positions as needed. Here, the mounting position refers to a position at which the partition plate 12 can be fixed to the cabinet 201. When the partition plate 12 is mounted at a mounting position, the partition plate 12 has a corresponding position in the cabinet 201, which is related to the horizontal height of the partition plate 12 in the cabinet 201 in the height direction Z of the cabinet 201, that is, a mounting position corresponds to a relative horizontal height of the partition plate 12 in the cabinet 201. For example, each mounting position can be a set of clamping holes M formed in the two side walls of the cabinet 201 parallel to the direction Z. The set of clamping holes M has a clamping groove for accommodating the edge of the partition plate 12. By inserting the edge of the partition plate 12 into the clamping groove formed by the set of clamping holes M, the partition plate 12 can be fixed to the cabinet 201. Such a structure design can also adjust the ventilation amount in the first air duct A1 and the second air duct A2 by adjusting the position of the partition plate 12 in the cabinet 201.

[0045] As for the structure of the heat exchanger 22, the structure of the heat exchanger 22 shown in Figure 4 has a liquid inlet tank 2211, a liquid outlet tank 2212, a flow passage 2213, and a liquid supplement tank 222. The liquid inlet tank 2211 has a liquid inlet P for receiving the cooling liquid delivered by the liquid pipe 211. The liquid outlet tank 2212 has a liquid outlet Q for delivering the cooling liquid to the liquid pipe 211. The liquid inlet tank 2211 and the liquid outlet tank 2212 are connected by at least one flow passage 2213, and a plurality of flow passages 2213 are provided side by side. The outer surface of the flow passage 2213 is provided with a heat dissipation fin 2214, which is shown in a corrugated shape (of course, other shapes are also possible). The liquid supplement tank 222 is located at the top of the heat exchanger 22, and is connected to the liquid outlet tank 2212 by a liquid supplement pipe 223. The liquid supplement tank 222 is welded to the top of the liquid outlet tank 2212.

[0046] Referring to Figure 5The internal structure of the heat exchanger 22 shown is equivalent to forming a heat exchange inner cavity, which specifically includes a liquid inlet cavity W1 formed by the liquid inlet box 2211, a liquid outlet cavity W2 formed by the liquid outlet box 2212, and a circulation channel T formed by the circulation pipe 2213. The coolant in the liquid inlet chamber W1 absorbs the heat dissipated by the first type of device through the liquid inlet P and the liquid pipeline 211. A plurality of parallel circulation channels T are provided between the liquid inlet chamber W1 and the liquid outlet chamber W2. The coolant can enter the liquid outlet chamber W2 from the liquid inlet chamber W1 through the circulation channels T. When the air-cooled air flows through the heat exchanger 22, the higher-temperature coolant in the circulation channels T can exchange heat with the outside air, achieving air-cooled heat dissipation. The coolant that eventually enters the liquid outlet chamber W2 has a lower temperature. The liquid outlet chamber W2 is connected to the liquid pipeline 211 through the liquid outlet Q. The lower-temperature coolant in the liquid outlet chamber W2 can enter the liquid pipeline 211 from the liquid outlet Q and flow along the liquid pipeline 211 to liquid-cool the first type of device. The heat dissipation fins 2214 provided on the outer surface of the circulation channels T can increase the heat dissipation area and improve the heat dissipation effect.

[0047] As a possible implementation, the heat exchanger 22 further includes a refill chamber V formed by a refill tank 222, which is pre-filled with coolant. The refill chamber V is located at the top of the heat exchange inner cavity and is connected to the heat exchange inner cavity via a refill channel F formed by a refill pipe 223. Coolant in the liquid line 211 may experience some loss due to the material of the liquid line 211. Under the action of gravity, the coolant in the refill chamber V can enter the heat exchange inner cavity through the refill channel F, ensuring sufficient coolant for liquid cooling circulation. Generally, the refill chamber V is connected to the liquid outlet cavity W2 via the refill channel F, allowing coolant to be directly added to the coolant after air cooling.

[0048] During operation of the heat sink, the coolant circulates back and forth within the closed circulation system formed by the liquid cooling structure. Some of the liquid may adhere to the inner wall of the heat exchanger 22 and the interior of the liquid pipeline 211. Due to the material properties of the various components of the liquid cooling structure, a small amount of evaporation or leakage may occur (of course, such losses are very small). Based on this consideration, a liquid level threshold can be set for the coolant level within the liquid replenishment chamber 222. This liquid level threshold can be estimated based on the amount of heat dissipated per unit time by the entire liquid cooling structure and the service life of the heat sink. In theory, the liquid level threshold should be at least not less than the amount of heat dissipated per unit time by the liquid cooling structure and the estimated amount over the service life of the heat sink, thereby preventing degradation of heat dissipation performance due to liquid loss.

[0049] The liquid pipe 211 in the liquid cooling assembly 21 is generally a hose, which is convenient for layout according to the position of the processor 202. However, such a liquid pipe 211 is not convenient for heat exchange with the first type of device (taking the processor 202 as an example). Figure 6 As shown, the part of the liquid pipeline 211 for heat dissipation of the first type of device can be packaged in the cold plate 213, and the part of the liquid pipeline 211 can be densely arranged in the cold plate 213 (for example, arranged in a serpentine manner as shown, or arranged in a spiral manner as shown, or arranged in a convolutional manner as shown). The cold plate 213 is fixed in contact with or close to the first type of device, and the cooling liquid in the liquid pipeline 211 in the cold plate 213 can have more sufficient heat exchange with the first type of device, thereby playing a good liquid cooling heat dissipation effect on the first type of device. Generally, the number of the first type of device in the server can be multiple (for example, at least two processors 202), and the cold plate 213 can be provided with a plurality of cold plates 213, so that the cold plate 213 can exchange heat with the processor 202 in a one-to-one manner. It should be understood that in order to enable the cold plate 213 to be close to the processor 202, the cold plate 213 is located in the second air duct A2. Figure 7 Figure 8 As shown, the part of the liquid pipeline 211 for heat dissipation of the first type of device can be packaged in the cold plate 213, and the part of the liquid pipeline 211 can be densely arranged in the cold plate 213 (for example, arranged in a serpentine manner as shown, or arranged in a spiral manner as shown, or arranged in a convolutional manner as shown). The cold plate 213 is fixed in contact with or close to the first type of device, and the cooling liquid in the liquid pipeline 211 in the cold plate 213 can have more sufficient heat exchange with the first type of device, thereby playing a good liquid cooling heat dissipation effect on the first type of device. Generally, the number of the first type of device in the server can be multiple (for example, at least two processors 202), and the cold plate 213 can be provided with a plurality of cold plates 213, so that the cold plate 213 can exchange heat with the processor 202 in a one-to-one manner. It should be understood that in order to enable the cold plate 213 to be close to the processor 202, the cold plate 213 is located in the second air duct A2.

[0050] In order to ensure the smooth flow of the cooling liquid between the liquid pipeline 211 and the heat exchanger 22, a plurality of circulating pumps 212 are provided, for example, as shown, each processor 202 can correspond to a circulating pump 212, and the circulating pump 212 can be fixed on the surface of the cold plate 213. In combination with the above embodiment, the distance between the partition plate 12 and the highest device on the PCB 203 is the maximum height threshold h, so as to take into account the air cooling effect and the compact structure. The processor 202 with the cold plate 213 has a relatively high height, and the cold plate 213 is very close to the partition plate 12; and the circulating pump 212 is arranged on the cold plate 213, and if the circulating pump 212 protrudes from the partition plate 12, a hollow structure capable of avoiding the circulating pump 212 can be formed on the partition plate 12, and the hollow structure capable of avoiding the circulating pump 212 enables the circulating pump 212 to partially enter the first air duct A2. Figure 9 In the above embodiment, one circulating pump 212 is configured for each first type of device, and when the number of the first type of device is at least two, the number of the circulating pump 212 is also two. When the liquid cooling structure performs liquid cooling heat dissipation on multiple first type of devices, taking the processor 202 as an example, the liquid flow path of the cooling liquid in the liquid pipeline 211 can have various implementation modes as shown, wherein the number of the processor 202, the cold plate 213 and the circulating pump 212 is set to be two and one-to-one, and the liquid pipeline 211 is divided into different parts in structure.

[0051] Figures 10 to 14 Please refer to

[0052] Please refer to Figure 10 ​​As shown, the coolant flowing out of the heat exchanger 22 enters the first circulation pump 212a through the liquid pipeline 211a, then enters the second cold plate 213b from the first circulation pump 212a through the liquid pipeline 211b, enters the first cold plate 213a from the second cold plate 213b through the liquid pipeline 211c, then enters the second circulation pump 211b from the first cold plate 213a through the liquid pipeline 211d, and returns to the heat exchanger 22 from the second circulation pump 211b through the liquid pipeline 211e. This structure does not limit the flow path of the coolant. In actual operation, the order of liquid inlet and outlet between the circulation pump 212 and the cold plate 213 can be adjusted according to needs.

[0053] Please refer to Figure 11 As shown, the coolant flowing out of the heat exchanger 22 enters the first circulation pump 212a through liquid pipeline 211a, then enters the second circulation pump 212b from the first circulation pump 212a through liquid pipeline 211b, enters the first cold plate 213a from the second circulation pump 212b through liquid pipeline 211c, then enters the second cold plate 213b from the first cold plate 213a through liquid pipeline 211d, and returns to the heat exchanger 22 from the second cold plate 213b through liquid pipeline 211e. This structural design is equivalent to the coolant first passing through the two circulation pumps 212 and then passing through the two cold plates 213 to liquid-cool the processor 202; wherein, the two cold plates 213 are connected in series.

[0054] Please refer to Figure 12 As shown, the coolant flowing out of the heat exchanger 22 enters the first circulation pump 212a through liquid pipeline 211a, and then enters the second circulation pump 212b from the first circulation pump 212a through liquid pipeline 211b. The second circulation pump 212b has two outlets, one of which enters the first cold plate 213a through liquid pipeline 211c, and the other enters the second cold plate 213b through liquid pipeline 211d. The coolant in the first cold plate 213a enters liquid pipeline 211e, and the coolant in the second cold plate 213b enters liquid pipeline 211f. Liquid pipelines 211e and 211f merge and then merge into liquid pipeline 211g, which then guides the coolant into the heat exchanger 22. This structural design is equivalent to the coolant first passing through the two circulation pumps 212 and then passing through the two cold plates 213 to liquid-cool the processor 202; wherein, the two cold plates 213 are connected in parallel.

[0055] Please refer to Figure 13As shown, the coolant flowing out of the heat exchanger 22 is divided into two paths after passing through liquid pipeline 211a. One path enters the first circulation pump 212a through liquid pipeline 211b, and then enters the first cold plate 213a from the first circulation pump 212a through liquid pipeline 211c. The other path enters the second circulation pump 212b through liquid pipeline 211d, and then enters the second cold plate 213b from the second circulation pump 212b through liquid pipeline 211e. The coolant in the first cold plate 213a enters liquid pipeline 211f, and the coolant in the second cold plate 213b enters liquid pipeline 211g. Liquid pipeline 211f and liquid pipeline 211g merge and then merge into liquid pipeline 211h, which guides the coolant into the heat exchanger 22. This structural design is equivalent to treating one circulation pump 212 corresponding to one cold plate 213 as a group of cooling units, and each cooling unit is connected in parallel.

[0056] Please refer to Figure 14 As shown, the coolant flowing out of the heat exchanger 22 enters the first circulation pump 212a through liquid pipeline 211a, then enters the first circulation pump 212a through liquid pipeline 211b, and enters the second circulation pump 212b from the first circulation pump 212a through liquid pipeline 211c. The second circulation pump 212b then delivers the coolant to the second cold plate 213b through liquid pipeline 211d. The coolant then returns to the heat exchanger 22 from the second cold plate 213b through liquid pipeline 211e. This structure is more concise and saves space.

[0057] It should be understood that Figures 10 to 14 The liquid cooling structure shown is only an example, and since only two processors 202 are shown to be liquid cooled, the liquid cooling structure is relatively simple. By extension, when the number of processors 202 (or first-class devices) is more than two, the specific implementation of the liquid cooling structure can be deformed, integrated and improved on the basis of the above embodiments, so as to achieve more diverse implementation methods, which will not be repeated here.

[0058] In order to improve the heat dissipation effect of the heat exchanger 22, as Figure 15 As shown, the air cooling structure can also include a heat dissipation fan 13. The heat dissipation fan 13 can be specifically arranged on the air inlet side of the heat exchanger 22. The heat dissipation fan 13 can provide air cooling to the heat exchanger 22 alone, further improving the efficiency of heat exchange between the coolant in the heat exchanger 22 and the outside air.

[0059] In addition, the liquid cooling structure also includes an auxiliary heat exchanger 23, which can be connected in series with the heat exchanger 22 to circulate the coolant between the liquid pipeline 211, the heat exchanger 22, and the auxiliary heat exchanger 23. The auxiliary heat exchanger 23 is also used to exchange heat between the coolant and the outside air. Although a single auxiliary heat exchanger 23 is shown here, in actual applications, there can be multiple auxiliary heat exchangers 23, and multiple auxiliary heat exchangers 23 can be connected in series with the heat exchanger 22.

[0060] In combination with the above embodiments, Figure 16 The figure shows a specific embodiment of the heat dissipation device provided by the present application being arranged in a server. Figure 16 As shown in the figure, a circuit board 203 is disposed within a server chassis 201. A processor 202 (equivalent to a first-category device) is coupled to the circuit board 203. A PCIe card 204 (equivalent to a second-category device) plugged into the circuit board 203 is disposed at the rear end of the server. A system fan 11 is disposed between the circuit board 203 and the front end of the server. The system fan 11 drives air to form an airflow from the front end of the server toward the rear end, thereby forming an air duct within the chassis 201. The airflow driven by the system fan 11 cools the circuit board 201, the processor 202, and the PCIe card 204. A heat exchanger 22 in the heat dissipation device is disposed at the rear end of the server. The heat dissipated by the heat exchanger 22 does not affect the heat dissipation of other components. The liquid pipeline 211 in the liquid cooling structure is connected to the heat exchanger 22, and the circulating pump 212 is connected to the liquid pipeline 211 to drive the coolant in the liquid pipeline 211 to circulate between the liquid pipeline 211 and the heat exchanger 22; a cold plate 213 is provided on the liquid pipeline 211 to realize heat exchange between the coolant and the processor 202, and each processor 202 is provided with a corresponding cold plate 213, and each cold plate 213 is provided with a corresponding circulating pump 212. The communication method between the liquid pipeline 211, the circulating pump 212 and the cold plate 213 can refer to Figures 10 to 14 The heat exchanger 22 is also located within the air duct created by the system fan 11, facilitating heat exchange between the hot coolant in the heat exchanger 22 and the outside air, thereby cooling the coolant. A cooling fan 13 is provided at the air inlet of the heat exchanger 22 to enhance the cooling effect of the heat exchanger 22.

[0061] Combine Figure 1 , please refer to Figure 17 The top view of the heat dissipation device layout in the server shows that along the width direction X of the server, the rear end of the server is divided into area B1 and area B2. The heat exchanger 22 can only occupy area B2. The heat exchanger 22 is equivalent to being parallel to the PCIe card 204 along the height direction Z of the server ( Figure 1The heat exchanger 22 is also parallel to the PCIe card 204 along the width direction X of the server (as shown in FIG. 6B). Of course, the heat exchanger 22 can also be parallel to the PCIe card 204 along the height direction Z of the server (as shown in FIG. 6A). Figure 18 As shown in FIG. 6B, along the width direction X of the server, the heat exchanger 22 occupies all the area at the tail end of the server, at this time, along the height direction Z of the server, the heat exchanger 22 blocks the PCIe card 204, and the heat exchanger 22 is equivalent to being parallel to the PCIe card 204 along the height direction Z of the server (as shown in FIG. 6A). Figure 1

[0062] In the structure shown in FIG. 6B, the partition plate 12 is used to separate the air ducts, and the partition plate 12 is not shown in FIG. 6B for the sake of clarity of the liquid cooling structure. The structure of the partition plate 12 provided in the air duct can refer to the structure shown in FIG. 5. Figures 16 to 18 As shown in FIG. 6B, the partition plate 12 separates the air ducts along the height direction of the server, and the partition plate 12 is not shown in the top view shown in FIG. 6B for the sake of clarity of the liquid cooling structure. Figure 19 As shown in FIG. 6B, the partition plate 12 separates the air ducts along the height direction of the server, and the partition plate 12 is not shown in the top view shown in FIG. 6B for the sake of clarity of the liquid cooling structure. Figure 19 As shown in FIG. 6B, the partition plate 12 separates the air ducts along the height direction of the server, and the partition plate 12 is not shown in the top view shown in FIG. 6B for the sake of clarity of the liquid cooling structure.

[0063] Based on the above embodiment, the application further discloses a server with the above heat dissipation device, and the structure of the server can refer to the structure shown in FIG. 6B, and details are not described herein again. Figures 16 to 19 As shown in FIG. 6B, the partition plate 12 separates the air ducts along the height direction of the server, and the partition plate 12 is not shown in the top view shown in FIG. 6B for the sake of clarity of the liquid cooling structure.

[0064] The above is only a specific embodiment of the application, but the protection scope of the application is not limited to this. Any person skilled in the art can easily think of changes or replacements within the technical range disclosed in the application, which should be covered in the protection scope of the application. Therefore, the protection scope of the application should be subject to the protection scope of the claims.​

Claims

1. A heat dissipation device, characterized in that: Applied to a server, the heat dissipation device comprises: cooling fan; A liquid cooling structure for dissipating heat by liquid cooling for a first type of device, wherein the first type of device is a high power consumption device, and the liquid cooling structure comprises: a liquid cooling assembly, configured to conduct heat generated by the first type of device to the coolant in the liquid supply pipeline of the liquid cooling assembly; A heat exchanger for exchanging heat between the coolant and the outside air, wherein the cooling fan is located on the air inlet side of the heat exchanger and provides air cooling and heat dissipation for the heat exchanger alone; a system fan, wherein the system fan forms a heat dissipation duct in the server to cool the first and second types of components; A partition, wherein the partition divides the cavity of the server into at least two air ducts, the at least two air ducts include a first air duct and a second air duct, the partition extends along the air flow direction of the system fan, the heat exchanger is arranged in the first air duct, the first type of device and the second type of device are arranged in the second air duct, and the heat exchanger is located at the air outlet of the first air duct.

2. The heat dissipation device according to claim 1, characterized in that: The liquid cooling structure further includes an auxiliary heat exchanger, which is disposed in the first air duct and connected in series with the heat exchanger.

3. The heat dissipation device according to claim 1, wherein: The liquid cooling assembly includes a liquid pipeline, a coolant and a circulation pump; The liquid pipeline is in communication with the heat exchanger, and the coolant is filled in the liquid pipeline and the heat exchanger; The circulation pump is connected to the liquid pipeline to drive the coolant to circulate between the heat exchanger and the liquid pipeline.

4. The heat dissipation device according to claim 3, characterized in that: The liquid cooling assembly further includes a cold plate, in which part of the liquid pipeline is encapsulated; the cold plate is used to contact the first type of device.

5. The heat dissipation device according to any one of claims 1 to 4, characterized in that: The heat exchanger comprises a heat exchange inner cavity and a fluid replenishing cavity located at the top of the heat exchange inner cavity; The heat exchange inner cavity has a liquid inlet for the coolant to flow in and a liquid outlet for the coolant to flow out. The liquid replenishing cavity is filled with coolant and the liquid replenishing cavity is connected to the heat exchange inner cavity through a liquid replenishing channel.

6. The heat dissipation device according to claim 5, characterized in that: The amount of coolant in the liquid replenishing chamber is not less than a liquid amount threshold, and the liquid amount threshold is the amount of coolant loss in the heat dissipation device within its service life.

7. The heat dissipation device according to claim 1, wherein: The server further includes a second type of device, the heat generated by the second type of device is lower than the heat generated by the first type of device, and the second type of device is located in the second air duct.

8. The heat dissipation device according to claim 1, wherein: The partition is parallel to a printed circuit board PCB in the server, the first type of components and the second type of components are arranged on the PCB, and there is a gap between the partition and the highest component arranged on the PCB.

9. The heat dissipation device according to claim 1 or 8, characterized in that: The partition is made of sheet metal or plastic.

10. The heat dissipation device according to claim 1, wherein: The partition has a hollow area; When the partition is fixed in the cavity of the server, the hollow area is used to avoid the circulation pump of the liquid cooling component.

11. The heat dissipation device according to claim 7, characterized in that: A plurality of installation stations are provided in the server along a direction perpendicular to the partition, and the partition can be detachably installed at any installation station according to the height of the first type of components or the second type of components.

12. A server, characterized in that: A printed circuit board PCB is arranged in the server chassis, and a first type of device and a heat dissipation device according to any one of claims 1 to 11 are coupled to the PCB.

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