Subsystem fault processing method and electronic equipment

Abstract

The invention discloses a subsystem fault processing method and electronic equipment, and relates to the field of terminals.The method comprises the steps that when the electronic equipment detects that a subsystem 1 breaks down, the electronic equipment can control the subsystem 1 to execute hot restart operation. And if the subsystem 1 fails to execute the hot restart operation, the electronic equipment can control the subsystem 1 to execute the cold restart operation. And if the subsystem 1 fails to execute the cold restart operation, the electronic equipment controls the whole equipment to be powered off and restarted, and normal work of the subsystem 1 is recovered. Wherein the cold restart of the subsystem 1 refers to that the processor operated by the subsystem 1 is controlled to be disconnected from the power supply and then connected with the power supply, and the subsystem 1 loaded on the processor is restarted.

Description

Technical Field

[0001] The present application relates to the field of terminals, and in particular to a subsystem fault handling method and electronic equipment. Background Art

[0002] With the development of terminal technology, electronic devices can handle more and more daily matters. For example, users can use electronic devices to make and receive calls, browse the web, watch videos, listen to songs, etc. In the current terminal architecture, electronic devices can be responsible for different functions through different subsystems. For example, electronic devices can be responsible for audio functions through digital signal processing subsystems, so that users can use electronic devices to watch videos, listen to songs, etc.; for example, electronic devices can be responsible for communication functions through mobile communication subsystems, so that users can use electronic devices to make and receive calls, etc. However, when a subsystem fails, the electronic device often needs to restart the entire device to restore the subsystem to normal operation, which makes the subsystem recovery operation more troublesome and the subsystem recovery efficiency is relatively low. At the same time, frequent restarts will also increase the power consumption of electronic devices, seriously interfering with the user experience. Summary of the invention

[0003] The present application provides a subsystem fault handling method and electronic device, which realizes that when a subsystem fails, the electronic device can cut off the power supply to the processor running by the subsystem separately, reduce the impact on other subsystems and the entire electronic device, do not interfere with other functions of the electronic device, take a short time, and have a high efficiency in restoring the normal operation of the subsystem.

[0004] In a first aspect, the present application provides a subsystem failure processing method, including: an electronic device detects that a first subsystem fails. The electronic device hot restarts the first subsystem. If the hot restart of the first subsystem fails, the electronic device cold restarts the first subsystem through a power supply system. If the cold restart of the first subsystem succeeds, the electronic device determines that the first subsystem resumes normal operation. If the cold restart of the first subsystem fails, the electronic device restarts the electronic device.

[0005] In a possible implementation, the electronic device hot restarts the first subsystem, specifically including: the electronic device restarts the first subsystem loaded on the first processor without disconnecting the power supply of the first processor running the first subsystem.

[0006] In a possible implementation, the electronic device cold restarts the first subsystem through the power supply system, specifically including: the electronic device controls the first processor through the power supply system to disconnect power and then connect power to restart the first subsystem loaded on the first processor.

[0007] In a possible implementation, the electronic device restarts the electronic device, specifically including: the electronic device controls each hardware device on the electronic device to disconnect the power supply and then connect the power supply again, and restarts the system loaded on each hardware device.

[0008] In a possible implementation, the electronic device detects that the first subsystem fails, specifically including: the electronic device sends a communication request to the first subsystem through a kernel. Within a first specified time after sending the communication request, if the electronic device does not receive a communication response from the first subsystem through the kernel, the electronic device determines that the first subsystem fails.

[0009] In a possible implementation, if the hot restart of the first subsystem fails, the electronic device cold restarts the first subsystem through the power supply system, specifically including: the electronic device sends a first hot restart instruction to the first subsystem through the kernel. The first hot restart instruction is used to control the first subsystem to perform a hot restart operation. Within a second specified time after sending the first hot restart instruction, when the electronic device does not receive a hot restart response of the first subsystem through the kernel, the electronic device determines that the hot restart of the first subsystem has failed.

[0010] In a possible implementation manner, the electronic device detects that a first subsystem fails, which specifically includes: the electronic device detects that a first module in the first subsystem fails.

[0011] In a possible implementation manner, the electronic device hot-restarting the first subsystem specifically includes: the electronic device hot-restarting the first module in the first subsystem.

[0012] In one possible implementation, if the hot restart of the first subsystem fails, the electronic device cold restarts the first subsystem through the power supply system, specifically including: if the hot restart of the first module in the first subsystem fails, the electronic device cold restarts the first module in the first subsystem through the power supply system.

[0013] In a possible implementation, the first subsystem is used to implement: making and receiving calls, sending and receiving text messages, processing image signals, encoding and decoding, browsing web pages, downloading third-party applications, transmitting data with other electronic devices, playing videos or playing music.

[0014] In a second aspect, the present application provides an electronic device, the electronic device comprising: one or more processors and one or more memories. The one or more memories are coupled to the one or more processors, the one or more memories are used to store computer program codes, the computer program codes include computer instructions, and the one or more processors are used to execute the computer instructions so that the electronic device performs a method as any possible implementation method of the first aspect described above.

[0015] In a third aspect, the present application provides a chip system, which is applied to an electronic device, and the chip system includes one or more processors, which are used to call computer instructions to enable the electronic device to execute a method such as any possible implementation method of the first aspect above.

[0016] In a fourth aspect, the present application provides a computer-readable storage medium comprising instructions, which, when executed on an electronic device, enables the electronic device to execute a method as any possible implementation method of the first aspect described above.

[0017] In a fifth aspect, the present application provides a computer program product, which, when executed on an electronic device, enables the electronic device to execute a method as any possible implementation method in the first aspect described above. BRIEF DESCRIPTION OF THE DRAWINGS

[0018] Figure 1 A schematic diagram of a subsystem fault handling process provided in an embodiment of the present application;

[0019] Figure 2 A schematic diagram of an electronic device architecture provided in an embodiment of the present application;

[0020] Figure 3 A schematic diagram of a specific process of a subsystem fault handling method provided in an embodiment of the present application;

[0021] Figure 4 A schematic diagram of a specific process of another subsystem fault handling method provided in an embodiment of the present application;

[0022] Figure 5 A schematic diagram of a module interaction method provided in an embodiment of the present application;

[0023] Figure 6 A schematic diagram of another module interaction method provided in an embodiment of the present application;

[0024] Figure 7 A schematic diagram of a software module of an electronic device provided in an embodiment of the present application;

[0025] Figure 8A schematic diagram of the hardware structure of an electronic device provided in an embodiment of the present application. DETAILED DESCRIPTION

[0026] The terms used in the following embodiments of the present application are only for the purpose of describing specific embodiments, and are not intended to be used as limitations on the present application. As used in the specification and the appended claims of the present application, the singular expressions "one", "a kind of", "said", "above", "the" and "this" are intended to also include plural expressions, unless there is a clear contrary indication in the context. It should also be understood that the term "and / or" used in the present application refers to any or all possible combinations including one or more of the listed striking ones. In the embodiments of the present application, the terms "first" and "second" are only used for descriptive purposes, and cannot be understood as implying relative importance or implicitly indicating the number of indicated technical features. Thus, the features defined as "first" and "second" can expressly or implicitly include one or more of the features. In the description of the embodiments of the present application, unless otherwise specified, the meaning of "multiple" is two or more.

[0027] The operating system of an electronic device may include a kernel and one or more subsystems. The kernel and the subsystems may run in different processors respectively. Among them, the kernel refers to a system software that supports the operation of the hardware abstraction layer, the control of the disk and the file system, and the operation of the application layer for executing the main functions of the electronic device, and is the most basic part of the operating system. One or more subsystems may include but are not limited to mobile communication subsystems (also recorded as modem subsystems), computing digital signal processing subsystems (also recorded as cdsp subsystems), wireless communication subsystems (also recorded as wlan subsystems) and advanced digital signal processing subsystems (also recorded as adsp subsystems). Electronic devices can control different subsystems to achieve different functions. For example, electronic devices can control the modem subsystem to achieve mobile communication functions such as making and receiving calls and sending and receiving text messages, control the cdsp subsystem to achieve functions such as processing image signals, encoding and decoding, control the wlan subsystem to achieve wireless communication functions such as browsing web pages, downloading third-party applications, and transmitting data with other electronic devices, and control the adsp subsystem to achieve functions such as playing videos and playing music. When a subsystem fails and the electronic device cannot implement the corresponding function through the subsystem, the electronic device needs to perform fault processing on the subsystem through the kernel so that the subsystem can resume normal operation.

[0028] First, a subsystem fault handling process provided by this application is introduced.

[0029] Figure 1 A schematic diagram of a subsystem fault handling process provided in an embodiment of the present application.

[0030] like Figure 1 As shown, the subsystem fault handling process may include:

[0031] S101: The electronic device detects that subsystem 1 (which may be referred to as the first subsystem) fails.

[0032] Electronic devices can detect whether each subsystem has a fault through the core.

[0033] In some embodiments, the electronic device can send a communication request to each subsystem through the kernel at every specified time interval A1, and then, within the specified time length T1 after sending the communication request, the kernel waits for each subsystem to send a communication response. If a subsystem (such as subsystem 1, etc.) works normally, the kernel can receive the communication response of the subsystem within the specified time length T1 after sending the communication request. If a subsystem fails, the kernel cannot receive the communication response of the subsystem within the specified time length T1 after sending the communication request. In other embodiments, when a subsystem fails, the subsystem can send a fault status indication of the subsystem (such as a fault status indication of subsystem 1, etc.) to the kernel. When the electronic device receives the fault status indication of the subsystem through the kernel, it can be determined that the subsystem fails. Not limited to the above examples, the electronic device can also detect that a subsystem fails in other ways, and this application is not limited.

[0034] The electronic device may recognize the communication response sent by each subsystem in the following manner:

[0035] 1). Each subsystem corresponds to its own communication channel (for example, subsystem 1 corresponds to communication channel 1, etc.). The kernel can send communication requests and receive communication responses through the communication channels of each subsystem. If the kernel receives the communication response transmitted by the communication channel within the specified time length T1 (which can be called the first specified time length) after sending the communication request through a certain communication channel, the electronic device determines that the subsystem corresponding to the communication channel is working normally, otherwise it determines that the subsystem corresponding to the communication channel is faulty. For example, the kernel can send a communication request to subsystem 1 through communication channel 1. If the kernel receives the communication response transmitted by communication channel 1 within the specified time length T1 after sending the communication request through communication channel 1, the electronic device determines that subsystem 1 corresponding to communication channel 1 is working normally; if the kernel does not receive the communication response transmitted by communication channel 1 within the specified time length T1 after sending the communication request through communication channel 1, the electronic device determines that subsystem 1 corresponding to communication channel 1 is faulty.

[0036] 2). The communication response of each subsystem can carry the identification of each subsystem (for example, the communication response of subsystem 1 can carry the identification of subsystem 1), and the kernel can determine the sender of the communication response through the identification. If the kernel receives a communication response carrying the identification of the subsystem within the specified time length T1 after sending a communication request to a subsystem, the electronic device determines that the subsystem is working normally, otherwise it determines that the subsystem is faulty. For example, if the kernel receives a communication response carrying the identification of subsystem 1 within the specified time length T1 after sending a communication request to subsystem 1, the electronic device determines that subsystem 1 is working normally; if the kernel does not receive a communication response carrying the identification of subsystem 1 within the specified time length T1 after sending a communication request to subsystem 1, the electronic device determines that subsystem 1 is faulty.

[0037] Not limited to the above examples, the electronic device may also identify the communication responses sent by each subsystem in other ways, and this application does not impose any restrictions.

[0038] S102: The electronic device control subsystem 1 performs a hot restart operation.

[0039] Specifically, if the electronic device detects that subsystem 1 fails, the electronic device may send a hot restart instruction of subsystem 1 to subsystem 1 through the kernel to trigger subsystem 1 to respond to the hot restart instruction and perform a hot restart operation.

[0040] The hot restart of subsystem 1 (also referred to as warm_reboot) means restarting subsystem 1 loaded on the processor without disconnecting the power of the processor running on subsystem 1. The processor running on subsystem 1 may be referred to as a first processor.

[0041] It should be noted that “the electronic device control subsystem 1 performs a hot restart operation” also means “the electronic device hot restart subsystem 1”.

[0042] S103: The electronic device determines whether the hot restart of subsystem 1 is successful.

[0043] Specifically, if the electronic device receives a hot restart response sent by subsystem 1 within a specified time length T2 (also referred to as a second specified time length) after the hot restart instruction of subsystem 1 (also referred to as a first hot restart instruction) is sent to subsystem 1 through the kernel, the electronic device determines that the hot restart of subsystem 1 is successful, otherwise the electronic device determines that the hot restart of subsystem 1 fails. In one possible implementation, the specified time length T2 may be greater than the specified time length T1. In other possible implementations, the size of the specified time length T2 and the specified time length T1 is not limited.

[0044] S104A: If the hot restart of subsystem 1 is successful, the electronic device determines that subsystem 1 resumes normal operation and ends the process.

[0045] It should be noted that one situation where subsystem 1 fails may be as follows: subsystem 1 is abnormal, but can receive data information sent by the kernel (such as the aforementioned communication request, hot restart instruction of subsystem 1, etc.), but cannot respond to each communication request and reply the corresponding communication response (for example, only one or two communication responses are replied after receiving three communication requests, or the communication response cannot be replied), or subsystem 1 can receive the communication request sent by the kernel, and the kernel receives the communication response of subsystem 1 only after the specified time T1 of sending the communication request. In this case, subsystem 1 has a probability of being able to process the hot restart instruction and reply the hot restart response, and execute the hot restart operation to resume normal operation.

[0046] S104B: If the hot restart of subsystem 1 fails, the electronic device controls the entire device to power off and restart to restore the normal operation of subsystem 1.

[0047] Among them, powering off and restarting the entire device (i.e., hard_reset) may refer to: the electronic device controls the hardware devices (including processors, etc.) on the entire electronic device to disconnect the power supply and then connect the power supply again, and restart the system (including the kernel, subsystems, modules in each subsystem, etc.) loaded on each hardware device of the entire electronic device.

[0048] It should be noted that another situation in which subsystem 1 fails may be as follows: subsystem 1 has an abnormality and is unable to receive data information sent by the kernel (such as the aforementioned communication request, the hot restart instruction of subsystem 1, etc.). In this case, subsystem 1 is unable to receive the hot restart instruction of subsystem 1 sent by the kernel, and is even unable to process the hot restart instruction and reply to the hot restart response and perform the hot restart operation. Therefore, within the specified time T2 after the kernel sends the hot restart instruction of subsystem 1 to subsystem 1, the hot restart response sent by subsystem 1 cannot be received, thereby determining that the hot restart of subsystem 1 has failed.

[0049] It should be noted that "the electronic device controls the entire device to power off and restart" is also equivalent to "the electronic device restarts the electronic device."

[0050] It can be seen from the above process that if the hot restart of subsystem 1 fails, the electronic device will control the entire device to power off and restart to restore the normal operation of subsystem 1. This will interfere with other functions of the electronic device and take a long time. The efficiency of restoring the normal operation of subsystem 1 is also low.

[0051] Therefore, the present application provides a subsystem fault handling method, which may include: when the electronic device detects that subsystem 1 fails, the electronic device may control subsystem 1 to perform a hot restart operation. If subsystem 1 fails to perform the hot restart operation, the electronic device may control subsystem 1 to perform a cold restart operation. If subsystem 1 fails to perform the cold restart operation, the electronic device controls the entire device to power off and restart, and restore the normal operation of subsystem 1. Among them, the cold restart of subsystem 1 also means that the processor running by controlling subsystem 1 is disconnected from the power supply and then connected to the power supply to restart the subsystem 1 loaded on the processor. In the subsystem fault handling method, the probability of subsystem 1 resuming normal operation after performing the cold restart operation is relatively high. In this way, the electronic device cuts off the power supply for the processor running by subsystem 1 separately, reduces the impact on other subsystems and the entire electronic device, does not interfere with other functions of the electronic device, takes a short time, and the efficiency of restoring the normal operation of subsystem 1 is also high.

[0052] Next, a device architecture of an electronic device provided in an embodiment of the present application is introduced.

[0053] Figure 2 A schematic diagram of an electronic device architecture provided in an embodiment of the present application.

[0054] like Figure 2 As shown, the electronic device may include: a kernel, one or more subsystems (such as Figure 2 The mobile communication subsystem modem, wireless communication subsystem wlan, computing digital signal processing subsystem cdsp, advanced digital signal processing subsystem adsp, etc.) and power supply system (also called power management integrated circuit, power management integrated circuit, PMIC), etc. Among them:

[0055] The kernel can send data information (such as the aforementioned communication request, hot restart instruction, etc.) to one or more subsystems to control the subsystem to perform corresponding operations in response to the data information sent by the kernel. The kernel can also send instructions to the power supply system (such as a cold restart instruction of a subsystem, a device restart instruction, a cold restart instruction of a module in the subsystem, etc.) to trigger the power supply system to control a subsystem / electronic device / a module in the subsystem to disconnect the power supply, connect the power supply, etc.

[0056] Each subsystem can handle corresponding tasks. For example, the modem subsystem can handle mobile communication tasks such as making and receiving calls and sending and receiving text messages. The cdsp subsystem can handle data computing tasks such as image signals and encoding and decoding. The wlan subsystem can handle wireless communication tasks such as browsing web pages, downloading third-party applications, and transmitting data with other electronic devices. The adsp subsystem can perform audio tasks such as playing videos and playing music. In some possible implementations, each subsystem can include one or more modules, and different modules in the subsystem can perform different functions, such as Figure 2 As shown, the adsp subsystem may include an audio module, a sensor module, and the like.

[0057] Each subsystem may be run on a different processor, or different subsystems may be run on one processor. Each module in a subsystem may be run on a different hardware unit, or different modules may be run on one hardware unit. The processor on which the subsystem is run may include the hardware unit on which each module of the subsystem is run. The subsystem 1 described in the embodiment of the present application may be Figure 2 Any one of the mobile communication subsystem, wireless communication subsystem, computing digital signal processing subsystem, and advanced digital signal processing subsystem shown in, or it may be different from Figure 2 The present application does not limit the subsystems shown.

[0058] The power supply system (PMIC) can control various hardware devices on the electronic device (including the processor running by the core, the processor running by each subsystem, the hardware unit running by each module, etc.) to disconnect the power supply and / or connect the power supply. In other words, the power supply system can control a certain hardware device (such as the processor running by subsystem 1, etc.) to disconnect the power supply and / or connect the power supply, while other hardware devices (such as the processor running by the core, etc.) are not affected; the power supply system can also control all the hardware devices of the entire electronic device to disconnect the power supply and / or connect the power supply together.

[0059] It should be noted that Figure 2 This application is only used for illustrative purposes. In a specific implementation, the device architecture of the electronic device may be different from Figure 2 , this application is not limited.

[0060] Next, the specific process of a subsystem fault handling method provided in an embodiment of the present application is introduced.

[0061] Figure 3 A schematic diagram of a specific flow chart of a subsystem fault handling method provided in an embodiment of the present application.

[0062] like Figure 3As shown, the specific process of the subsystem fault handling method may include:

[0063] S301: The electronic device detects that subsystem 1 has a fault.

[0064] For details, please refer to the previous Figure 1 Description of S101.

[0065] S302: The electronic device control subsystem 1 performs a hot restart operation.

[0066] For details, please refer to the previous Figure 1 Description of S102.

[0067] S303: The electronic device determines whether the hot restart of subsystem 1 is successful.

[0068] For details, please refer to the previous Figure 1 Description of S103.

[0069] Case 1: Subsystem 1 hot restart is successful.

[0070] S304A: If the hot restart of subsystem 1 is successful, the electronic device determines that subsystem 1 resumes normal operation and ends the process.

[0071] Case 2: Hot restart of subsystem 1 fails.

[0072] S304B: If the hot restart of subsystem 1 fails, the electronic device control subsystem 1 performs a cold restart operation.

[0073] The cold restart of the subsystem 1 refers to: disconnecting the power supply of the processor on which the control subsystem 1 runs and then connecting the power supply to restart the subsystem 1 loaded on the processor.

[0074] Specifically, the electronic device can perform a cold restart operation through the power supply system control subsystem 1. If the hot restart of subsystem 1 fails, the electronic device can send a cold restart instruction of subsystem 1 to the power supply system (PMIC) through the kernel. In response to the cold restart instruction of the subsystem 1, the power supply system can control the processor running in subsystem 1 to disconnect the power supply and then connect the power supply to restart the subsystem 1 loaded on the processor.

[0075] It should be noted that “the electronic equipment control subsystem 1 performs a cold restart operation” is also referred to as “the electronic equipment cold restart subsystem 1”.

[0076] S305: The electronic device determines whether the cold restart of subsystem 1 is successful.

[0077] Specifically, when the processor running the power supply of the power supply system (PMIC) control subsystem 1 is disconnected from the power supply and then connected to the power supply, and the subsystem 1 loaded on the processor is restarted, the electronic device can send a communication request to the subsystem 1 through the kernel at a specified time interval A1, and then, within the specified time length T1 after sending the communication request, the kernel waits for the subsystem 1 to send a communication response. If the subsystem 1 cold restart successfully resumes normal operation, the kernel can receive the communication response of the subsystem 1 within the specified time length T1 after sending the communication request. If the subsystem 1 cold restart fails and does not resume normal operation, the kernel cannot receive the communication response of the subsystem 1 within the specified time length T1 after sending the communication request.

[0078] In some embodiments, if the subsystem 1 fails to cold restart and does not resume normal operation, the subsystem 1 may send a fault status indication of the subsystem 1 to the kernel. When the electronic device receives the fault status indication of the subsystem 1 through the kernel, it may be determined that the subsystem 1 fails to cold restart and does not resume normal operation.

[0079] Case 1: Subsystem 1 cold restarts successfully.

[0080] S306A: If the cold restart of subsystem 1 is successful, the electronic device determines that subsystem 1 resumes normal operation and ends the process.

[0081] Case 2: The cold restart of subsystem 1 fails.

[0082] S306B: If the cold restart of subsystem 1 fails, the electronic device controls the entire device to power off and restart to restore the normal operation of subsystem 1.

[0083] For details, please refer to the previous Figure 1 Description of S104B.

[0084] In this way, the subsystem fault handling method provided in the embodiment of the present application is implemented to cut off the power supply to the processor running in subsystem 1 alone, thereby reducing the impact on other subsystems and the entire electronic device, not interfering with other functions of the electronic device, taking a short time, and restoring the normal operation of subsystem 1 with high efficiency.

[0085] The following describes a specific process of another subsystem fault handling method provided in an embodiment of the present application.

[0086] Figure 4 A specific flowchart of another subsystem fault handling method provided in an embodiment of the present application.

[0087] like Figure 4 As shown, the specific process of the subsystem fault handling method may include:

[0088] S401: The electronic device detects that module 1 in subsystem 1 fails.

[0089] Specifically, when module 1 (which may be referred to as the first module) fails, the electronic device may receive a failure status indication of module 1 sent by subsystem 1 through the kernel. When the electronic device receives the failure status indication of module 1 through the kernel, the electronic device may determine that module 1 in subsystem 1 fails. Not limited to this, the electronic device may also detect that module 1 in subsystem 1 fails in other ways, and this application does not limit this.

[0090] S402: Module 1 of the electronic device control subsystem 1 performs a hot restart operation.

[0091] The hot restart of module 1 refers to restarting module 1 loaded on the hardware unit without disconnecting the power supply of the hardware unit on which module 1 is running.

[0092] Specifically, after the electronic device detects that module 1 fails, the electronic device may send a hot restart instruction of module 1 to module 1 through the kernel to trigger module 1 to respond to the hot restart instruction and perform a hot restart operation.

[0093] It should be noted that “module 1 of the electronic device control subsystem 1 performs a hot restart operation” means “module 1 in the electronic device hot restart subsystem 1”.

[0094] S403: The electronic device determines whether the module 1 in the subsystem 1 is hot restarted successfully.

[0095] Specifically, if the electronic device receives a hot restart response sent by module 1 within the specified time length T3 after the kernel sends the hot restart instruction of module 1 to module 1, the electronic device determines that the hot restart of module 1 is successful, otherwise the electronic device determines that the hot restart of module 1 fails. Not limited to this, the electronic device can also determine whether the hot restart of module 1 in subsystem 1 is successful in other ways, and this application does not limit this. Among them, the values ​​of the specified time length T3 and the specified time length T2 can be the same or different, and this application does not limit this.

[0096] Case 1: Module 1 hot restart is successful.

[0097] S404A: If the hot restart of module 1 is successful, the electronic device determines that module 1 in subsystem 1 resumes normal operation and ends the process.

[0098] Case 2: Hot restart of module 1 fails.

[0099] S404B: If the hot restart of module 1 fails, module 1 in the electronic device control subsystem 1 performs a cold restart operation.

[0100] The cold restart of module 1 refers to: disconnecting the power supply of the hardware unit on which the control module 1 runs and then connecting the power supply to restart the module 1 loaded on the hardware unit.

[0101] Specifically, if the hot restart of module 1 fails, the electronic device can send a cold restart instruction of module 1 to the power supply system (PMIC) through the kernel. In response to the cold restart instruction of module 1, the power supply system can control the hardware unit running by module 1 to disconnect the power supply and then connect the power supply to restart the module 1 loaded on the hardware unit.

[0102] It should be noted that “module 1 in the electronic device control subsystem 1 performs a cold restart operation” is also referred to as “module 1 in the electronic device cold restart subsystem 1”.

[0103] S405: The electronic device determines whether the module 1 in the subsystem 1 is cold restarted successfully.

[0104] Specifically, the electronic device may send a status detection request of module 1 to subsystem 1 through the kernel. If, in response to the status detection request of module 1, subsystem 1 sends a normal status indication of module 1 to the kernel, the electronic device determines that the cold restart of module 1 is successful; if, in response to the status detection request of module 1, subsystem 1 sends a fault status indication of module 1 to the kernel, the electronic device determines that the cold restart of module 1 fails. Without limitation to this, the electronic device may also determine whether the cold restart of module 1 is successful in other ways, and this application does not limit this.

[0105] Case 1: Module 1 cold restarts successfully.

[0106] S406A: If the cold restart of module 1 is successful, the electronic device determines that module 1 in subsystem 1 resumes normal operation and ends the process.

[0107] Case 2: Module 1 cold restart fails.

[0108] S406B: If the cold restart of module 1 fails, the electronic device control subsystem 1 performs a cold restart operation.

[0109] Specifically, if the cold restart of module 1 fails and module 1 cannot resume normal operation, the electronic device can send a cold restart instruction of subsystem 1 to the power supply system (PMIC) through the kernel. In response to the cold restart instruction of subsystem 1, the power supply system can control the processor running in subsystem 1 to disconnect the power supply and then connect the power supply to restart the subsystem 1 loaded on the processor. Among them, the processor running in subsystem 1 may include the hardware unit running in module 1. Therefore, when the processor running in subsystem 1 disconnects the power supply and then connects the power supply, the hardware unit running in module 1 also disconnects the power supply and then connects the power supply.

[0110] S407: The electronic device determines whether module 1 can work normally after subsystem 1 is cold restarted.

[0111] Specifically, the electronic device may send a status detection request of module 1 to subsystem 1 through the kernel. If, in response to the status detection request of module 1, subsystem 1 sends a normal status indication of module 1 to the kernel, the electronic device determines that module 1 can work normally; if, in response to the status detection request of module 1, subsystem 1 sends a fault status indication of module 1 to the kernel, the electronic device determines that module 1 cannot work normally. Without limitation to this, the electronic device may also determine whether module 1 can work normally after cold restart of subsystem 1 by other means, and this application does not limit this.

[0112] Case 1: Module 1 can work normally after subsystem 1 is cold restarted.

[0113] S408A: If module 1 can work normally after subsystem 1 is cold restarted, the electronic device determines that module 1 resumes normal operation and ends the process.

[0114] Case 2: Module 1 does not work properly after subsystem 1 is cold restarted.

[0115] S408B: If module 1 cannot work normally after subsystem 1 is cold restarted, the electronic device controls the entire device to power off and restart to restore the normal operation of module 1.

[0116] For details, please refer to the previous Figure 1 Description of S104B.

[0117] In this way, the subsystem fault handling method provided in the embodiment of the present application is implemented to cut off the power supply to the hardware unit running on module 1 separately, thereby reducing the impact on other modules and other subsystems on subsystem 1 and even the entire electronic device, without interfering with other functions of the electronic device, taking a short time, and having a high efficiency in restoring the normal operation of module 1.

[0118] Next, combine Figure 3 A module interaction method provided in an embodiment of the present application is introduced.

[0119] Figure 5 A schematic diagram of a module interaction method provided in an embodiment of the present application.

[0120] like Figure 5 As shown, the module interaction method may specifically include:

[0121] S501: The kernel detects that subsystem 1 fails.

[0122] Specifically, the kernel can send a communication request to each subsystem at a specified time interval A1, and then, within the specified time length T1 after sending the communication request, the kernel waits for each subsystem to send a communication response. If a subsystem (such as subsystem 1, etc.) works normally, the kernel can receive the communication response of the subsystem within the specified time length T1 after sending the communication request. If a subsystem fails, the kernel cannot receive the communication response of the subsystem within the specified time length T1 after sending the communication request. In other embodiments, when a subsystem fails, the subsystem can send a fault status indication of the subsystem (such as a fault status indication of subsystem 1, etc.) to the kernel. When the kernel receives the fault status indication of the subsystem, it can be determined that the subsystem has failed. Not limited to the above examples, the kernel can also detect that subsystem 1 has failed in other ways, and this application is not limited.

[0123] S502: The kernel sends a hot restart instruction of subsystem 1 to subsystem 1.

[0124] The kernel determines whether the hot restart of subsystem 1 is successful:

[0125] Case 1: Subsystem 1 hot restart is successful.

[0126] S503: After receiving the hot restart instruction of subsystem 1, subsystem 1 sends a hot restart response of subsystem 1 to the kernel.

[0127] S504: In response to the hot restart instruction of subsystem 1, subsystem 1 performs a hot restart operation.

[0128] For the description of hot restart of subsystem 1, reference may be made to the aforementioned embodiment and will not be repeated here.

[0129] S505: Within the specified time T2 after sending the hot restart instruction of subsystem 1, the kernel receives the hot restart response of subsystem 1, and determines that the hot restart of subsystem 1 is successful and resumes normal operation.

[0130] Case 2: Hot restart of subsystem 1 fails.

[0131] S506: If the kernel does not receive a hot restart response from subsystem 1 within a specified time period T2 after sending the hot restart instruction for subsystem 1, it is determined that the hot restart of subsystem 1 has failed.

[0132] S507: If the hot restart of subsystem 1 fails, the kernel sends a cold restart instruction of subsystem 1 to the power supply system (pmic).

[0133] S508: In response to the cold restart instruction of subsystem 1, the power supply system controls subsystem 1 to cold restart.

[0134] The power supply system controls the cold restart of subsystem 1, which means that the power supply system disconnects the power supply to the processor running on subsystem 1, and then connects the power supply to restart subsystem 1 loaded on the processor. This process does not affect the running process of other subsystems on the electronic device.

[0135] The kernel determines whether subsystem 1 has been cold restarted successfully:

[0136] Case 1: Subsystem 1 cold restarts successfully.

[0137] S509: The kernel sends a communication request to subsystem 1.

[0138] S510: In response to the communication request, subsystem 1 sends a communication response to the kernel.

[0139] S511: Within the specified time T1 after sending the communication request, the kernel receives a communication response from subsystem 1, and determines that subsystem 1 has been cold restarted successfully and resumes normal operation.

[0140] Case 2: The cold restart of subsystem 1 fails.

[0141] S512: If the kernel does not receive a communication response from subsystem 1 within a specified time period T1 after sending the communication request, it is determined that the cold restart of subsystem 1 has failed.

[0142] S513: If the cold restart of subsystem 1 fails, the kernel sends a device restart instruction to the power supply system.

[0143] S514: In response to the device restart instruction, the power supply system controls the entire device to power off and restart, and restore the normal operation of subsystem 1.

[0144] For details, please refer to the previous Figure 1 Description of S104B.

[0145] Next, combine Figure 4 Another module interaction method provided in an embodiment of the present application is introduced.

[0146] Figure 6 A schematic diagram of another module interaction method provided in an embodiment of the present application.

[0147] like Figure 6 As shown, the module interaction method may specifically include:

[0148] S601: The kernel detects that module 1 in subsystem 1 fails.

[0149] Specifically, when module 1 fails, the kernel may receive a failure status indication of module 1 sent by subsystem 1. When the kernel receives the failure status indication of module 1, the kernel may determine that module 1 in subsystem 1 fails. Not limited to this, the kernel may also detect that module 1 in subsystem 1 fails in other ways, and this application does not limit this.

[0150] S602: The kernel sends a hot restart instruction of module 1 to module 1 in subsystem 1.

[0151] The kernel determines whether module 1 is hot restarted successfully:

[0152] Case 1: Module 1 hot restart is successful.

[0153] S603: After receiving the hot restart instruction of module 1, module 1 sends a hot restart response of module 1 to the kernel.

[0154] S604: In response to the hot restart instruction of module 1, module 1 performs a hot restart operation.

[0155] For the hot restart description of module 1, reference may be made to the aforementioned embodiment and will not be repeated here.

[0156] S605: Within the specified time T3 after sending the hot restart instruction of module 1, the kernel receives the hot restart response of module 1, and determines that the hot restart of module 1 is successful and resumes normal operation.

[0157] Case 2: Hot restart of module 1 fails.

[0158] S606: If the kernel does not receive a hot restart response from module 1 within a specified time period T3 after sending the hot restart instruction for module 1, it is determined that the hot restart of module 1 has failed.

[0159] S607: If the hot restart of module 1 fails, the kernel sends a cold restart instruction of module 1 to the power supply system.

[0160] S608: In response to the cold restart instruction of module 1, the power supply system controls module 1 to cold restart.

[0161] The cold restart of the power supply system control module 1 means that the power supply system disconnects the power supply of the hardware unit operated by the module 1, and then connects the power supply to restart the module 1 loaded on the hardware unit. This process does not affect the operation process of other modules in the subsystem 1 and other subsystems on the electronic device.

[0162] The kernel determines whether the cold restart of module 1 is successful:

[0163] S609: The kernel sends a status detection request of module 1 to subsystem 1.

[0164] Case 1: Module 1 cold restarts successfully.

[0165] S610: In response to the status detection request of module 1, subsystem 1 sends a normal status indication of module 1 to the kernel.

[0166] S611: When receiving the normal status indication of module 1, the kernel can determine that module 1 has been cold restarted successfully and resumes normal operation.

[0167] Case 2: Module 1 cold restart fails.

[0168] S612: In response to the status detection request of module 1, subsystem 1 sends a fault status indication of module 1 to the kernel.

[0169] S613: When receiving the fault status indication of module 1, the kernel may determine that the cold restart of module 1 has failed.

[0170] S614: If the cold restart of module 1 fails, the core sends a cold restart instruction of subsystem 1 to the power supply system.

[0171] S615: In response to the cold restart instruction of the subsystem 1, the power supply system controls the subsystem 1 to cold restart.

[0172] The power supply system controls the cold restart of subsystem 1, which means that the power supply system disconnects the power supply to the processor running on subsystem 1, and then connects the power supply to restart subsystem 1 loaded on the processor. This process does not affect the running process of other subsystems on the electronic device.

[0173] The kernel determines whether module 1 works normally after subsystem 1 is cold restarted:

[0174] S616: The kernel sends a status detection request of module 1 to subsystem 1.

[0175] Case 1: Module 1 can work normally after subsystem 1 is cold restarted.

[0176] S617: In response to the status detection request of module 1, subsystem 1 sends a normal status indication of module 1 to the kernel.

[0177] S618: When receiving the normal status indication of module 1, the kernel can determine that module 1 can work normally.

[0178] Case 2: Module 1 does not work properly after subsystem 1 is cold restarted.

[0179] S619: In response to the status detection request of module 1, subsystem 1 sends a fault status indication of module 1 to the kernel.

[0180] S620: When receiving the fault status indication of module 1, the core may determine that module 1 cannot operate normally.

[0181] S621: If module 1 cannot work normally after subsystem 1 is cold restarted, the kernel sends a device restart instruction to the power supply system.

[0182] S622: In response to the device restart instruction, the power supply system controls the entire device to power off and restart, and restore the normal operation of module 1.

[0183] For details, please refer to the previous Figure 1 Description of S104B.

[0184] Next, a software module of an electronic device provided in an embodiment of the present application is introduced.

[0185] Figure 7 A schematic diagram of a software module of an electronic device provided in an embodiment of the present application.

[0186] The software system of the electronic device can adopt a layered architecture, an event-driven architecture, a micro-core architecture, a micro-service architecture or a cloud architecture. The system is used as an example to illustrate the software structure of an electronic device. The layered architecture divides the software into several layers. Each layer has a clear role and division of labor. The layers communicate with each other through software interfaces. In some embodiments, The system is divided into four layers, from top to bottom: application layer, application framework layer, Android runtime and system library, and kernel layer.

[0187] like Figure 7 As shown, the application layer may include a series of application packages, including camera, calendar, memo, weather, browser, etc.

[0188] like Figure 7 As shown, the application framework layer provides an application programming interface (API) and a programming framework for the applications in the application layer. The application framework layer includes some predefined functions. For example, the application framework layer may include a window manager, a content provider, a phone manager, a resource manager, a notification manager, etc. Among them:

[0189] The window manager is used to manage window programs. The window manager can obtain the display screen size, determine whether there is a status bar, lock the screen, capture the screen, etc.

[0190] Content providers are used to store and retrieve data and make it accessible to applications. The data may include videos, images, audio, calls made and received, browsing history and bookmarks, phone books, etc.

[0191] The phone manager is used to provide communication functions for electronic devices, such as the management of call status (including answering, hanging up, etc.).

[0192] The resource manager provides various resources for applications, such as localized strings, icons, images, layout files, video files, and so on.

[0193] The notification manager enables applications to display notification information in the status bar. It can be used to convey notification-type messages and can disappear automatically after a short stay without user interaction. For example, the notification manager is used to notify download completion, message reminders, etc. The notification manager can also be a notification that appears in the system top status bar in the form of a chart or scroll bar text, such as notifications of applications running in the background, or a notification that appears on the screen in the form of a dialog window. For example, a text message is displayed in the status bar, a prompt sound is emitted, an electronic device vibrates, an indicator light flashes, etc.

[0194] like Figure 7 As shown, Android Runtime includes a core library and a virtual machine. Android runtime is responsible for the scheduling and management of the Android system. The core library consists of two parts: one is the function that the Java language needs to call, and the other is the Android core library. The application layer and the application framework layer run in the virtual machine. The virtual machine executes the Java files of the application layer and the application framework layer as binary files. The virtual machine is used to perform object life cycle management, stack management, thread management, security and exception management, and garbage collection functions. The system library can include multiple functional modules. For example: surface manager, media library, 3D graphics processing library (for example: OpenGL ES), 2D graphics engine (for example: SGL), etc. Among them:

[0195] The surface manager is used to manage the display subsystem and provide the fusion of 2D and 3D layers for multiple applications.

[0196] The media library supports playback and recording of a variety of commonly used audio and video formats, as well as static image files, etc. The media library can support a variety of audio and video encoding formats, such as: MPEG4, H.264, MP3, AAC, AMR, JPG, PNG, etc.

[0197] The 3D graphics processing library is used to implement 3D graphics drawing, image rendering, compositing, and layer processing.

[0198] A 2D graphics engine is a drawing engine for 2D drawings.

[0199] like Figure 7 As shown in Figure 1, the kernel layer is the layer between hardware and software. The kernel layer contains at least display driver, camera driver and audio driver.

[0200] In an embodiment of the present application, the kernel layer may include a subsystem fault processing module. The subsystem fault processing module may be used to detect whether a subsystem and / or a module in a subsystem fails. If a subsystem / a module in a subsystem fails, the subsystem fault processing module may send a hot restart instruction to the subsystem / the module in the subsystem to trigger the subsystem / the module in the subsystem to perform a hot restart operation; or, the subsystem fault processing module may send a cold restart instruction of the subsystem / the module to the power supply system to trigger the power supply system to control the subsystem / the module to perform a cold restart operation; or, the subsystem fault processing module may send a device restart instruction to the power supply system to trigger the power supply system to control the entire electronic device to disconnect the power supply and then connect the power supply to restart the system loaded on each hardware device in the entire electronic device.

[0201] It should be noted that Figure 7 It is only used to illustrate the present application and does not constitute a limitation to the present application.

[0202] The following introduces the hardware structure of an electronic device provided in an embodiment of the present application.

[0203] Figure 8 A schematic diagram of the hardware structure of an electronic device provided in an embodiment of the present application.

[0204] like Figure 8 As shown, the electronic device 100 is the electronic device described in the embodiment of the present application.

[0205] In the embodiment of the present application, the electronic device 100 may be a mobile phone, a tablet computer, a PC, an ultra-mobile personal computer (UMPC), a netbook, a personal digital assistant (PDA), etc. The present application does not impose any restrictions on the specific type of the electronic device.

[0206] like Figure 8As shown, the electronic device 100 may include a processor 801, a memory 802, a sensor module 803, a display screen 804, a wireless communication module 805 (optional), an audio module 806 (optional) and a microphone 807 (optional). The processor 801, the memory 802, the sensor module 803, the display screen 804, the wireless communication module 805, the audio module 806 and the microphone 807 may be connected via a bus.

[0207] It is understandable that the structure shown in the embodiment of the present application does not constitute a specific limitation on the electronic device 100. In other embodiments of the present application, the electronic device 100 may also include Figure 8 More or fewer components may be shown, or some components may be combined or separated, or the components may be arranged differently. Figure 8 The components shown may be implemented in hardware, software or a combination of software and hardware.

[0208] The processor 801 may include one or more processor units, for example, the processor 801 may include an application processor (application processor, AP), a modem processor, a graphics processor (graphics processing unit, GPU), an image signal processor (image signal processor, ISP), a controller, a video codec, a digital signal processor (digital signal processor, DSP), a baseband processor, and / or a neural-network processing unit (neural-network processing unit, NPU), etc. Among them, different processing units can be independent devices or integrated in one or more processors. The controller can generate an operation control signal according to the instruction opcode and the timing signal to complete the control of fetching and executing instructions.

[0209] The processor 801 may also be provided with a memory for storing instructions and data. In some embodiments, the memory in the processor 801 is a cache memory. The memory may store instructions or data that the processor 801 has just used or circulated. If the processor 801 needs to use the instruction or data again, it may be directly called from the memory. This avoids repeated access, reduces the waiting time of the processor 801, and thus improves the efficiency of the system.

[0210] In some embodiments, the processor 801 may include one or more interfaces. The interface may include an inter-integrated circuit (I2C) interface, an inter-integrated circuit sound (I2S) interface, a pulse code modulation (PCM) interface, a universal asynchronous receiver / transmitter (UART) interface, a mobile industry processor interface (MIPI), a general-purpose input / output (GPIO) interface, a subscriber identity module (SIM) interface, and / or a USB interface, etc.

[0211] The memory 802 is coupled to the processor 801 and is used to store various software programs and / or multiple groups of instructions. In a specific implementation, the memory 802 may include a volatile memory, such as a random access memory (RAM); it may also include a non-volatile memory, such as a ROM, a flash memory, a hard disk drive (HDD) or a solid state drive (SSD); the memory 802 may also include a combination of the above-mentioned types of memories. The memory 802 may also store some program codes so that the processor 801 calls the program codes stored in the memory 802 to implement the implementation method of the embodiment of the present application in the electronic device 100. The memory 802 may store an operating system, such as an embedded operating system such as uCOS, VxWorks, RTLinux, etc.

[0212] The sensor module 803 may include multiple sensor devices, such as a fingerprint sensor and a gesture sensor. The fingerprint sensor may be used to collect fingerprints. The electronic device 100 may use the collected fingerprint characteristics to implement fingerprint unlocking, access application locks, fingerprint photography, fingerprint call answering, etc. The gesture sensor may be used to determine the gesture of the electronic device 100. For example, the gesture sensor may determine that the electronic device 100 is in a rolling gesture, or may determine that the electronic device 100 is in a hovering gesture, etc. In some examples, the sensor module 803 may also include a touch sensor. The touch sensor may be provided on the display screen 804, and the touch sensor and the display screen 804 may form a touch screen, also known as a "touch screen". The touch sensor may be used to detect touch operations acting on or near it.

[0213] The display screen 804 can be used to display images, videos, etc. The display screen 804 may include a display panel. The display panel may be a liquid crystal display (LCD), an organic light-emitting diode (OLED), an active-matrix organic light-emitting diode or an active-matrix organic light-emitting diode (AMOLED), a flexible light-emitting diode (FLED), Miniled, MicroLed, Micro-oLed, a quantum dot light emitting diode (QLED), etc. In some embodiments, the electronic device 100 may include 1 or N display screens 804, where N is a positive integer greater than 1.

[0214] The wireless communication module 805 can provide wireless communication solutions applied to the electronic device 100, including wireless local area networks (WLAN) (such as wireless fidelity (Wi-Fi) networks), bluetooth (BT), global navigation satellite system (GNSS), frequency modulation (FM), near field communication (NFC), infrared (IR), etc. The wireless communication module 805 can be one or more devices integrating at least one communication processing module. The wireless communication module 805 receives electromagnetic waves via an antenna, modulates and filters the electromagnetic wave signals, and sends the processed signals to the processor 801. The wireless communication module 805 can also receive signals to be sent from the processor 801, modulate and amplify them, and convert them into electromagnetic waves for radiation through the antenna. In some embodiments, the electronic device 100 can also communicate with the processor 801 through the Bluetooth module ( Figure 8 Not shown), WLAN module ( Figure 8 The WLAN module may provide a solution including one or more Bluetooth communication in basic rate / enhanced data rate (BR / EDR) or Bluetooth low energy (BLE), and a solution including one or more WLAN communication in Wi-Fi direct, Wi-Fi LAN or Wi-Fi softAP.

[0215] The audio module 806 can be used to convert digital audio information into analog audio signal output, and can also be used to convert analog audio input into digital audio signal. The audio module 806 can also be used to encode and decode audio signals. In some embodiments, the audio module 806 can also be arranged in the processor 801, or some functional modules of the audio module 806 can be arranged in the processor 801.

[0216] Microphone 807, which can also be called "microphone" or "microphone", can be used to collect sound signals in the environment surrounding the electronic device, convert the sound signals into electrical signals, and then subject the electrical signals to a series of processing, such as analog-to-digital conversion, to obtain an audio signal in digital form that can be processed by the processor 801 of the electronic device. When making a call or sending a voice message, the user can speak by approaching the microphone 807 with his mouth to input the sound signal into the microphone 807. The electronic device 100 can be provided with at least one microphone 807. In other embodiments, the electronic device 100 can be provided with two microphones 807, which can not only collect sound signals but also realize noise reduction. In other embodiments, the electronic device 100 can also be provided with three, four or more microphones 807 to collect sound signals, reduce noise, identify the source of sound, realize directional recording functions, etc.

[0217] It should be noted that Figure 8 The electronic device 100 shown in the figure is only used to exemplify the hardware structure of the electronic device provided by the present application, and does not constitute a specific limitation to the present application.

[0218] As used in the above embodiments, the term "when..." may be interpreted to mean "if..." or "after..." or "in response to determining..." or "in response to detecting...", depending on the context. Similarly, the phrases "upon determining..." or "if (the stated condition or event) is detected" may be interpreted to mean "if determining..." or "in response to determining..." or "upon detecting (the stated condition or event)" or "in response to detecting (the stated condition or event)", depending on the context.

[0219] In the above embodiments, it can be implemented in whole or in part by software, hardware, firmware or any combination thereof. When implemented using software, it can be implemented in whole or in part in the form of a computer program product. The computer program product includes one or more computer instructions. When the computer program instructions are loaded and executed on a computer, the process or function described in the embodiment of the present application is generated in whole or in part. The computer can be a general-purpose computer, a special-purpose computer, a computer network, or other programmable devices. The computer instructions can be stored in a computer-readable storage medium, or transmitted from one computer-readable storage medium to another computer-readable storage medium. For example, the computer instructions can be transmitted from a website site, computer, server or data center by wired (e.g., coaxial cable, optical fiber, digital subscriber line) or wireless (e.g., infrared, wireless, microwave, etc.) mode to another website site, computer, server or data center. The computer-readable storage medium can be any available medium that a computer can access or a data storage device such as a server or data center that contains one or more available media integration. The available medium can be a magnetic medium, (e.g., a floppy disk, a hard disk, a tape), an optical medium (e.g., a DVD), or a semiconductor medium (e.g., a solid-state hard disk), etc.

[0220] Those skilled in the art can understand that to implement all or part of the processes in the above-mentioned embodiments, the processes can be completed by computer programs to instruct related hardware, and the programs can be stored in computer-readable storage media. When the programs are executed, they can include the processes of the above-mentioned method embodiments. The aforementioned storage media include: ROM or random access memory RAM, magnetic disk or optical disk and other media that can store program codes.

Claims

1. A subsystem fault handling method, characterized in that: include: The electronic device detects a failure in the first subsystem; The electronic device thermally restarts the first subsystem; If the hot restart of the first subsystem fails, the electronic device cold restarts the first subsystem through the power supply system; If the first subsystem is cold restarted successfully, the electronic device determines that the first subsystem resumes normal operation; If the cold restart of the first subsystem fails, the electronic device restarts the electronic device.

2. The method according to claim 1, characterized in that The electronic device hot restarting the first subsystem specifically includes: The electronic device restarts the first subsystem loaded on the first processor without disconnecting the power supply of the first processor running the first subsystem.

3. The method according to claim 1, characterized in that: The electronic device cold restarts the first subsystem through the power supply system, specifically including: The electronic device controls the first processor through the power supply system to disconnect power and then connect power to restart the first subsystem loaded on the first processor.

4. The method according to claim 1, characterized in that The electronic device restarting the electronic device specifically includes: The electronic device controls each hardware device on the electronic device to disconnect the power supply and then connect the power supply to restart the system loaded on each hardware device.

5. The method according to claim 1, characterized in that The electronic device detects that a fault occurs in the first subsystem, specifically including: The electronic device sends a communication request to the first subsystem through the kernel; If the electronic device does not receive a communication response from the first subsystem through the kernel within a first specified time period after sending the communication request, the electronic device determines that a failure occurs in the first subsystem.

6. The method according to claim 1, characterized in that If the hot restart of the first subsystem fails, the electronic device cold restarts the first subsystem through the power supply system, specifically including: The electronic device sends a first hot restart instruction to the first subsystem through the kernel; wherein the first hot restart instruction is used to control the first subsystem to perform a hot restart operation; When the electronic device does not receive a hot restart response of the first subsystem through the kernel within a second specified time period after sending the first hot restart instruction, the electronic device determines that the hot restart of the first subsystem has failed.

7. The method according to claim 1, characterized in that The electronic device detects that a fault occurs in the first subsystem, specifically including: The electronic device detects that a first module in the first subsystem fails.

8. The method according to claim 7, characterized in that The electronic device hot restarting the first subsystem specifically includes: The electronic device hot restarts the first module in the first subsystem.

9. The method according to claim 8, characterized in that If the hot restart of the first subsystem fails, the electronic device cold restarts the first subsystem through the power supply system, specifically including: If the hot restart of the first module in the first subsystem fails, the electronic device cold restarts the first module in the first subsystem through a power supply system.

10. The method according to claim 1, characterized in that The first subsystem is used to implement: making and receiving calls, sending and receiving text messages, processing image signals, encoding and decoding, browsing web pages, downloading third-party applications, transmitting data with other electronic devices, playing videos or playing music.

11. An electronic device, characterized in that: The electronic device comprises: one or more processors and one or more memories; wherein the one or more memories are coupled to the one or more processors, the one or more memories are used to store computer program code, the computer program code comprises computer instructions, and the one or more processors are used to execute the computer instructions so that the electronic device performs the method as described in any one of claims 1-10.

12. A chip system, characterized in that: The chip system is applied to an electronic device, and the chip system includes one or more processors, and the processor is used to call computer instructions so that the electronic device executes the method as described in any one of claims 1-10.

13. A computer-readable storage medium comprising instructions, characterized in that: When the instructions are executed on an electronic device, the electronic device is caused to execute the method as claimed in any one of claims 1 to 10.

14. A computer program product, characterized in that When the computer program product is executed on an electronic device, the electronic device is enabled to execute the method according to any one of claims 1 to 10.

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