Temperature monitoring method for gold wire bonding equipment based on Internet of Things

Abstract

The embodiment of the invention discloses a gold bonding wire equipment temperature monitoring method based on Internet of Things, the gold bonding wire equipment comprises an annealing device and a conveying device, the conveying device is used for conveying a gold bonding wire to pass through the annealing device for annealing, and an annealing infrared imaging sensor is arranged in the annealing device; comprising the following steps: acquiring an annealing thermal imaging image in the annealing device through the annealing infrared imaging sensor; calibrating the position of the gold bonding wire on the annealing thermal imaging image to obtain an annealing temperature distribution diagram of the gold bonding wire; determining the position in the furnace when the temperature of the gold bonding wire rises to a preset temperature based on the annealing temperature distribution diagram; and the target conveying speed of the gold bonding wire is determined on the basis of the in-furnace position, and the problems that the quality of the gold bonding wire is unstable and the use requirement cannot be met due to the fact that the annealing temperature and the annealing time are not accurately controlled in the annealing process at present can be solved.

Description

Technical Field

[0001] The present application relates to the field of semiconductor technology, and in particular to a temperature monitoring method for gold bonding wire equipment based on the Internet of Things. Background Art

[0002] Wire bonding is a connection method that uses thin metal wires and utilizes heat, pressure, and ultrasonic energy to tightly weld the metal wires to the substrate pads to achieve electrical interconnection between the chip and the substrate and information exchange between chips.

[0003] Gold bonding wires are usually used for connection during wire bonding. The gold bonding wires play the role of electrical connection in wire bonding and need to have good toughness and strength. In the production of the bonding wires, the process that plays a major role in the toughness and strength of the gold bonding wires is the annealing process. However, in the current annealing process, the annealing temperature and annealing time are not accurately controlled, which results in the problem of unstable quality of the gold bonding wires and failure to meet usage requirements. Summary of the invention

[0004] The embodiment of the present application provides a temperature monitoring method for bonding gold wire equipment based on the Internet of Things, which can solve the problem of inaccurate control of annealing temperature and annealing time during the current annealing process, thereby causing the quality of the bonding gold wire to be unstable and fail to meet the use requirements.

[0005] In a first aspect, the present application provides a temperature monitoring method for a gold bonding wire device based on the Internet of Things, wherein the gold bonding wire device comprises an annealing device and a conveying device, wherein the conveying device is used to convey the gold bonding wire through the annealing device for annealing, wherein an annealing infrared imaging sensor is provided in the annealing device;

[0006] The method for monitoring the temperature of a gold bonding wire device based on the Internet of Things comprises:

[0007] Acquiring an annealing thermal imaging image in the annealing device by means of the annealing infrared imaging sensor;

[0008] Calibrate the position of the bonding gold wire on the annealing thermal imaging image to obtain an annealing temperature distribution map of the bonding gold wire;

[0009] Determining the position in the furnace when the temperature of the bonding gold wire rises to a preset temperature based on the annealing temperature distribution diagram;

[0010] A target conveying speed of the bonding gold wire is determined based on the position within the furnace.

[0011] In some embodiments, determining the target conveying speed of the bonding gold wire based on the position in the furnace includes:

[0012] Determining the heating time when the temperature of the bonding gold wire rises to the preset temperature based on the position in the furnace;

[0013] Obtaining the holding time of the bonding gold wire during the annealing process;

[0014] Obtaining a heating and holding time of the bonding gold wire based on the heating time and the holding time;

[0015] A target conveying speed of the bonding gold wire is determined based on the temperature rise and soak time and the size of the annealing device.

[0016] In some embodiments, the bonding gold wire device further comprises a cooling device connected to the annealing device, and the conveying device is used to convey the annealed bonding gold wire through the cooling device for cooling, wherein a cooling infrared imaging sensor is provided in the cooling device;

[0017] The step of determining the target conveying speed of the bonding gold wire based on the position in the furnace further includes:

[0018] Acquiring a cooling thermal imaging image in the cooling device by means of the cooling infrared imaging sensor;

[0019] Calibrate the position of the bonding gold wire on the cooling thermal imaging image to obtain a cooling temperature distribution diagram of the bonding gold wire;

[0020] The cooling capacity of the cooling device is increased or decreased based on the cooling temperature distribution map.

[0021] In some embodiments, increasing or decreasing the cooling capacity of the cooling device based on the cooling temperature distribution map includes:

[0022] determining a cooling rate of the bonding gold wire based on the cooling temperature distribution diagram;

[0023] If the cooling speed is greater than a preset cooling speed, reducing the cooling capacity of the cooling device;

[0024] If the cooling speed is lower than the preset cooling speed, the cooling capacity of the cooling device is increased.

[0025] In some embodiments, the gold wire bonding device further comprises a wire winding device, the wire winding device comprises a wire winding reel, and a wire winding infrared imaging sensor is disposed above the wire winding device;

[0026] The method for monitoring the temperature of a gold bonding wire device based on the Internet of Things further includes:

[0027] Detecting the pre-winding temperature of the bonding gold wire when it moves to the winding drum by the winding infrared imaging sensor;

[0028] The winding speed and / or the cooling capacity of the winding device are increased or decreased based on the pre-winding temperature.

[0029] In some embodiments, the increasing and / or decreasing the winding speed and / or cooling capacity of the winding device based on the pre-winding temperature is specifically:

[0030] If the pre-winding temperature is greater than the preset winding temperature, reducing the winding speed of the winding device and / or increasing the cooling capacity of the winding device;

[0031] If the pre-winding temperature is lower than the preset winding temperature, the winding speed of the winding device is increased, and / or the cooling capacity of the winding device is reduced.

[0032] In some embodiments, the bonding gold wire equipment further comprises a wire drawing device, the wire drawing device comprises a heating reel and a drawing die, and a wire drawing infrared imaging sensor is disposed above the wire drawing device;

[0033] The method for monitoring the temperature of a gold bonding wire device based on the Internet of Things further includes:

[0034] The bonding gold wire is heated to a preset wire drawing temperature by the heating drum;

[0035] Wire drawing is performed by the wire drawing device;

[0036] Detecting the pre-wire drawing temperature of the bonding gold wire when it moves to the drawing die by the wire drawing infrared imaging sensor;

[0037] The drawing speed of the bonding gold wire is increased or decreased based on the pre-drawing temperature.

[0038] In some embodiments, the gold wire bonding device further comprises a voltage sensor connected to an input power source of the gold wire bonding device;

[0039] Before acquiring the annealing thermal imaging image in the annealing device by the annealing infrared imaging sensor, the method further includes:

[0040] Acquiring the real-time voltage of the input power supply through the voltage sensor;

[0041] If the real-time voltage is less than the input lower threshold, the gold wire bonding device is powered by a backup power supply.

[0042] In some embodiments, before acquiring the annealing thermal imaging image in the annealing device by the annealing infrared imaging sensor, the method further includes:

[0043] Acquiring the real-time voltage of the input power supply through the voltage sensor;

[0044] If the real-time voltage is greater than the input upper limit threshold, the backup power supply is charged through the input power supply.

[0045] In a second aspect, the present application provides a temperature monitoring system for a gold bonding wire device based on the Internet of Things, wherein the gold bonding wire device comprises an annealing device and a conveying device, wherein the conveying device is used to convey the gold bonding wire through the annealing device for annealing, wherein the annealing device is provided with an annealing infrared imaging sensor;

[0046] The temperature monitoring system for bonding wire equipment based on the Internet of Things includes:

[0047] A detection module, used for acquiring an annealing thermal imaging image in the annealing device through the annealing infrared imaging sensor;

[0048] An analysis module, used to calibrate the position of the bonding gold wire on the annealing thermal imaging image to obtain an annealing temperature distribution map of the bonding gold wire; and determine the position of the bonding gold wire in the furnace when the temperature rises to a preset temperature based on the annealing temperature distribution map;

[0049] An adjustment module is used to determine a target conveying speed of the bonding gold wire based on the position in the furnace.

[0050] The present application provides a temperature monitoring method for a gold bonding wire device based on the Internet of Things, wherein the gold bonding wire device comprises an annealing device and a conveying device, wherein the conveying device is used to convey the gold bonding wire through the annealing device for annealing, wherein the annealing device is provided with an annealing infrared imaging sensor; the method comprises: obtaining an annealing thermal imaging image in the annealing device through the annealing infrared imaging sensor; calibrating the position of the gold bonding wire on the annealing thermal imaging image to obtain an annealing temperature distribution diagram of the gold bonding wire; determining the position of the gold bonding wire in a furnace when the temperature rises to a preset temperature based on the annealing temperature distribution diagram; determining a target conveying speed of the gold bonding wire based on the position in the furnace, and adjusting the annealing time of the gold bonding wire during the annealing process by adjusting the conveying speed of the gold bonding wire, which can solve the problem that the annealing temperature and annealing time currently existing in the annealing process are inaccurately controlled, thereby causing the quality of the gold bonding wire to be unstable and fail to meet the use requirements, thereby improving the quality of the gold bonding wire. BRIEF DESCRIPTION OF THE DRAWINGS

[0051] The technical solution and other beneficial effects of the present application will be made apparent by describing in detail the specific implementation methods of the present application in conjunction with the accompanying drawings.

[0052] Figure 1 This is a flow chart of a temperature monitoring method for a gold bonding wire device based on the Internet of Things provided by an embodiment of the present application;

[0053] Figure 2 This is a schematic diagram of a temperature monitoring system for gold bonding wire equipment based on the Internet of Things provided in one embodiment of the present application. DETAILED DESCRIPTION

[0054] The present application is further described in detail below in conjunction with the accompanying drawings and embodiments. It is to be understood that the specific embodiments described herein are only used to explain the relevant invention, rather than to limit the invention. It is also necessary to explain that, for ease of description, only the parts related to the invention are shown in the accompanying drawings.

[0055] It should be noted that, in the absence of conflict, the embodiments and features in the embodiments of the present application can be combined with each other. The present application will be described in detail below with reference to the accompanying drawings and in combination with the embodiments.

[0056] Wire bonding is a connection method that uses thin metal wires and utilizes heat, pressure, and ultrasonic energy to tightly weld the metal wires to the substrate pads to achieve electrical interconnection between the chip and the substrate and information exchange between chips.

[0057] Existing bonding wires are all obtained by drawing a metal wire with a relatively large outer diameter to a required diameter through a wire drawing machine, and then undergoing tempering (annealing) and winding operations. Among them, the wire drawing machine used for drawing the metal wire, the annealing furnace used for annealing the metal wire, and the winding device used for winding the metal wire can all be called bonding wire equipment. The bonding wire plays the role of electrical connection in lead bonding, and it needs to have good toughness and strength. In the production of bonding wire, the process that plays a major role in the toughness and strength of the bonding wire is the annealing process. However, during the annealing process, the annealing temperature and annealing time are not accurately controlled, which leads to the problem that the quality of the bonding wire is unstable and does not meet the use requirements.

[0058] First, as Figure 1 As shown, in view of the above technical problems, an embodiment of the present application provides a temperature monitoring method of a gold bonding wire device based on the Internet of Things, wherein the gold bonding wire device comprises an annealing device and a conveying device, wherein the conveying device is used to convey the gold bonding wire through the annealing device for annealing, wherein the annealing device is provided with an annealing infrared imaging sensor;

[0059] The method for monitoring the temperature of a gold bonding wire device based on the Internet of Things comprises:

[0060] S101: Acquire an annealing thermal imaging image in the annealing device through the annealing infrared imaging sensor;

[0061] S102: calibrating the position of the bonding gold wire on the annealing thermal imaging image to obtain an annealing temperature distribution map of the bonding gold wire;

[0062] S103: determining the position in the furnace when the temperature of the bonding gold wire rises to a preset temperature based on the annealing temperature distribution diagram;

[0063] S104: Determine a target conveying speed of the bonding gold wire based on the position in the furnace.

[0064] It should be noted that the conveying device is installed in the annealing device, and the conveying device can be a pulley group composed of multiple pulleys. The bonding gold wire is wound on the pulleys for transmission. The conveying device is also provided with a speed sensor for detecting the conveying speed of the bonding gold wire.

[0065] It should be noted that after obtaining the annealing temperature distribution diagram, the temperature change diagram of the bonding gold wire along its extension direction can be calibrated on the diagram, so that the position on the bonding gold wire where the temperature reaches the preset temperature (i.e., the position in the furnace) can be determined, and the position in the furnace is related to the conveying speed of the bonding gold wire, that is, when the conveying speed is relatively high, the position in the furnace is relatively large; when the conveying speed is relatively low, the position in the furnace is relatively small, so the residence time of the bonding gold wire in the annealing device can be changed by adjusting the conveying speed of the bonding gold wire.

[0066] It should be noted that, when performing the annealing process on the bonding gold wire, it is currently usually carried out by controlling the temperature of the annealing device (or annealing furnace), but the temperature of the annealing device is not necessarily equal to the temperature of the bonding gold wire therein. There may be some deviations between the temperature of the annealing device and the temperature of the bonding gold wire therein, which may lead to differences in the quality of multiple batches of produced bonding gold wires. Therefore, the embodiment of the present application adopts the method of measuring the temperature of the bonding gold wire when performing the annealing process, so as to enhance the control of the quality of the bonding gold wire.

[0067] In some embodiments, determining the target conveying speed of the bonding gold wire based on the position in the furnace includes:

[0068] Determining the heating time when the temperature of the bonding gold wire rises to the preset temperature based on the position in the furnace;

[0069] Obtaining the holding time of the bonding gold wire during the annealing process;

[0070] Obtaining a heating and holding time of the bonding gold wire based on the heating time and the holding time;

[0071] A target conveying speed of the bonding gold wire is determined based on the temperature rise and soak time and the size of the annealing device.

[0072] It should be noted that before determining the heating time when the temperature of the bonding gold wire rises to the preset temperature, the conveying speed of the bonding gold wire can be obtained by a speed sensor, and then the heating time required for the temperature of the bonding gold wire to rise to the preset temperature can be determined based on the conveying speed and the position in the furnace. The holding time is usually set according to needs, such as 2 minutes, and the target conveying speed can be determined by the heating time, the holding time and the size of the annealing device. Usually, the target conveying speed fluctuates within a small range. By setting the conveying device and setting the target conveying speed of the bonding gold wire, the bonding gold wire can be annealed during the movement process, thereby improving production efficiency.

[0073] It should be noted that a heating device can be arranged upstream of the annealing device, and the conveying device is used to convey the bonding gold wire through the heating device for heating, and a heating infrared imaging sensor is provided above the heating device, and a heating thermal imaging image in the heating device is obtained by the heating infrared imaging sensor; the position of the bonding gold wire on the heating thermal imaging image is calibrated to obtain a heating temperature distribution map of the bonding gold wire; based on the heating temperature distribution map, the heating amount of the heating device is increased or decreased, wherein the heating rate of the bonding gold wire can be determined according to the heating temperature distribution map, and the heating rate of the bonding gold wire can be controlled by controlling the heating amount of the heating device (such as increasing or decreasing the amount of hot air).

[0074] In some embodiments, the bonding gold wire device further comprises a cooling device connected to the annealing device, and the conveying device is used to convey the annealed bonding gold wire through the cooling device for cooling, wherein a cooling infrared imaging sensor is provided in the cooling device;

[0075] The step of determining the target conveying speed of the bonding gold wire based on the position in the furnace further includes:

[0076] Acquiring a cooling thermal imaging image in the cooling device by means of the cooling infrared imaging sensor;

[0077] Calibrate the position of the bonding gold wire on the cooling thermal imaging image to obtain a cooling temperature distribution diagram of the bonding gold wire;

[0078] The cooling capacity of the cooling device is increased or decreased based on the cooling temperature distribution map.

[0079] In some embodiments, increasing or decreasing the cooling capacity of the cooling device based on the cooling temperature distribution map includes:

[0080] determining a cooling rate of the bonding gold wire based on the cooling temperature distribution diagram;

[0081] If the cooling speed is greater than a preset cooling speed, reducing the cooling capacity of the cooling device;

[0082] If the cooling speed is lower than the preset cooling speed, the cooling capacity of the cooling device is increased.

[0083] It should be noted that the cooling device is located downstream of the annealing device (i.e., the next process). The cooling device can be air-cooled or water-cooled. The real-time cooling speed of the bonding gold wire can be determined based on the cooling temperature distribution diagram of the bonding gold wire and the conveying speed. By increasing or decreasing the cooling capacity of the cooling device, the temperature of the bonding gold wire can be controlled during the movement of the bonding gold wire. There is no need to pause the equipment for cooling, thereby improving production efficiency.

[0084] In some embodiments, the gold wire bonding device further comprises a wire winding device, the wire winding device comprises a wire winding reel, and a wire winding infrared imaging sensor is disposed above the wire winding device;

[0085] The method for monitoring the temperature of a gold bonding wire device based on the Internet of Things further includes:

[0086] Detecting the pre-winding temperature of the bonding gold wire when it moves to the winding drum by the winding infrared imaging sensor;

[0087] The winding speed and / or the cooling capacity of the winding device are increased or decreased based on the pre-winding temperature.

[0088] In some embodiments, the increasing and / or decreasing the winding speed and / or cooling capacity of the winding device based on the pre-winding temperature is specifically:

[0089] If the pre-winding temperature is greater than the preset winding temperature, reducing the winding speed of the winding device and / or increasing the cooling capacity of the winding device;

[0090] If the pre-winding temperature is lower than the preset winding temperature, the winding speed of the winding device is increased, and / or the cooling capacity of the winding device is reduced.

[0091] It should be noted that after being cooled by the cooling device, the bonding gold wire can be temporarily stored on a reel and then wound around the winding reel by the reel. The pre-winding temperature of the bonding gold wire when it moves to the winding reel can be detected by the winding infrared imaging sensor. Compared with the current cooling method that has always been carried out by air cooling, it is more refined. When the pre-winding temperature is greater than the preset winding temperature, the pre-winding temperature can be lowered by reducing the winding speed of the winding device; when the pre-winding temperature is lower than the preset winding temperature, the winding efficiency can be improved by increasing the winding speed of the winding device.

[0092] It should be noted that when the temperature of the bonding gold wire before winding is controlled by increasing or decreasing the cooling capacity of the winding device, the bonding gold wire delivered by the cooling device can be directly connected to the winding reel, and the winding operation can be directly performed to improve production efficiency.

[0093] It should be noted that adjusting the pre-winding temperature of the bonded gold wire by increasing or decreasing the winding speed of the winding device is usually only used within a certain temperature difference range, and a first temperature difference threshold and a second temperature difference threshold may be set, wherein the second temperature difference threshold is greater than the first temperature difference threshold, and when the difference between the pre-winding temperature and the preset winding temperature is less than the first temperature difference threshold, the pre-winding temperature of the bonded gold wire is adjusted by increasing or decreasing the winding speed of the winding device; when the difference between the pre-winding temperature and the preset winding temperature is greater than the first temperature difference threshold, the pre-winding temperature of the bonded gold wire is adjusted by increasing or decreasing the cooling capacity of the winding device; when the difference between the pre-winding temperature and the preset winding temperature is greater than the second temperature difference threshold, the pre-winding temperature of the bonded gold wire is adjusted jointly by increasing or decreasing the winding speed and cooling capacity of the winding device.

[0094] In some embodiments, the bonding gold wire equipment further comprises a wire drawing device, the wire drawing device comprises a heating reel and a drawing die, and a wire drawing infrared imaging sensor is disposed above the wire drawing device;

[0095] The method for monitoring the temperature of a gold bonding wire device based on the Internet of Things further includes:

[0096] The bonding gold wire is heated to a preset wire drawing temperature by the heating drum;

[0097] Wire drawing is performed by the wire drawing device;

[0098] Detecting the pre-wire drawing temperature of the bonding gold wire when it moves to the drawing die by the wire drawing infrared imaging sensor;

[0099] The drawing speed of the bonding gold wire is increased or decreased based on the pre-drawing temperature.

[0100] It should be noted that the wire drawing device is located upstream of the annealing device (i.e., the previous process). When drawing the wire, it is usually necessary to first heat the bonded gold wire to a certain temperature (i.e., the preset wire drawing temperature). Usually, the wire drawing speed of the bonded gold wire is corresponding to the temperature of the bonded gold wire. However, in the process of the bonded gold wire moving to the drawing die, the temperature of the bonded gold wire will drop, and the specific amount of drop is usually unclear. The wire drawing infrared imaging sensor can accurately detect the pre-drawing temperature of the bonded gold wire when it moves to the drawing die, and increase or decrease the wire drawing speed of the bonded gold wire according to the pre-drawing temperature, thereby ensuring the wire drawing quality of the bonded gold wire.

[0101] In some embodiments, the gold wire bonding device further comprises a voltage sensor connected to an input power source of the gold wire bonding device;

[0102] Before acquiring the annealing thermal imaging image in the annealing device by the annealing infrared imaging sensor, the method further includes:

[0103] Acquiring the real-time voltage of the input power supply through the voltage sensor;

[0104] If the real-time voltage is less than the input lower threshold, the gold wire bonding device is powered by a backup power supply.

[0105] In some embodiments, before acquiring the annealing thermal imaging image in the annealing device by the annealing infrared imaging sensor, the method further includes:

[0106] Acquiring the real-time voltage of the input power supply through the voltage sensor;

[0107] If the real-time voltage is greater than the input upper limit threshold, the backup power supply is charged through the input power supply.

[0108] It should be noted that during the production process, the voltage of the power grid (i.e., the input power supply) is often unstable. When the real-time voltage fluctuation of the input power supply is small, voltage stabilization can be achieved through a voltage stabilizer. However, when the real-time voltage of the input power supply is large, it is difficult to stabilize the voltage through a voltage stabilizer. At this time, if the input power supply is used for production, the power of the annealing device will be inaccurate, which will in turn cause the temperature of the annealing device to be inaccurate; the speed control of the wire drawing device and the winding device will be inaccurate, and other problems. At this time, the backup power supply can be enabled to power the bonding wire equipment to ensure the stability of the power supply voltage, and when the real-time voltage is greater than the input upper limit threshold, the backup power supply is charged through the input power supply.

[0109] In summary, the present application provides a temperature monitoring method for a gold bonding wire device based on the Internet of Things, wherein the gold bonding wire device comprises an annealing device and a conveying device, wherein the conveying device is used to convey the gold bonding wire through the annealing device for annealing, wherein the annealing device is provided with an annealing infrared imaging sensor; comprising obtaining an annealing thermal imaging image in the annealing device through the annealing infrared imaging sensor; calibrating the position of the gold bonding wire on the annealing thermal imaging image to obtain an annealing temperature distribution diagram of the gold bonding wire; determining the position of the gold bonding wire in a furnace when the temperature rises to a preset temperature based on the annealing temperature distribution diagram; determining the target conveying speed of the gold bonding wire based on the position in the furnace, and adjusting the annealing time of the gold bonding wire during the annealing process by adjusting the conveying speed of the gold bonding wire. This can solve the problem of inaccurate control of annealing temperature and annealing time during the annealing process, thereby causing the quality of the gold bonding wire to be unstable and fail to meet the use requirements, thereby improving the quality of the gold bonding wire.

[0110] Second, as Figure 2 As shown, an embodiment of the present application provides a temperature monitoring system for a gold bonding wire device based on the Internet of Things, wherein the gold bonding wire device comprises an annealing device and a conveying device, wherein the conveying device is used to convey the gold bonding wire through the annealing device for annealing, wherein the annealing device is provided with an annealing infrared imaging sensor;

[0111] The temperature monitoring system for bonding wire equipment based on the Internet of Things includes:

[0112] A detection module 210, configured to obtain an annealing thermal imaging image in the annealing device through the annealing infrared imaging sensor;

[0113] The analysis module 220 is used to calibrate the position of the bonding gold wire on the annealing thermal imaging image to obtain an annealing temperature distribution map of the bonding gold wire; and determine the position of the bonding gold wire in the furnace when the temperature rises to a preset temperature based on the annealing temperature distribution map;

[0114] The adjustment module 230 is configured to determine a target conveying speed of the bonding gold wire based on the position in the furnace.

[0115] In some embodiments, determining the target conveying speed of the bonding gold wire based on the position in the furnace includes:

[0116] Determining the heating time when the temperature of the bonding gold wire rises to the preset temperature based on the position in the furnace;

[0117] Obtaining the holding time of the bonding gold wire during the annealing process;

[0118] Obtaining a heating and holding time of the bonding gold wire based on the heating time and the holding time;

[0119] A target conveying speed of the bonding gold wire is determined based on the temperature rise and soak time and the size of the annealing device.

[0120] In some embodiments, the bonding gold wire device further comprises a cooling device connected to the annealing device, and the conveying device is used to convey the annealed bonding gold wire through the cooling device for cooling, wherein a cooling infrared imaging sensor is provided in the cooling device;

[0121] The step of determining the target conveying speed of the bonding gold wire based on the position in the furnace further includes:

[0122] Acquiring a cooling thermal imaging image in the cooling device by means of the cooling infrared imaging sensor;

[0123] Calibrate the position of the bonding gold wire on the cooling thermal imaging image to obtain a cooling temperature distribution diagram of the bonding gold wire;

[0124] The cooling capacity of the cooling device is increased or decreased based on the cooling temperature distribution map.

[0125] In some embodiments, increasing or decreasing the cooling capacity of the cooling device based on the cooling temperature distribution map includes:

[0126] determining a cooling rate of the bonding gold wire based on the cooling temperature distribution diagram;

[0127] If the cooling speed is greater than a preset cooling speed, reducing the cooling capacity of the cooling device;

[0128] If the cooling speed is lower than the preset cooling speed, the cooling capacity of the cooling device is increased.

[0129] In some embodiments, the gold wire bonding device further comprises a wire winding device, the wire winding device comprises a wire winding reel, and a wire winding infrared imaging sensor is disposed above the wire winding device;

[0130] The adjustment module 230 is further used for:

[0131] Detecting the pre-winding temperature of the bonding gold wire when it moves to the winding drum by the winding infrared imaging sensor;

[0132] The winding speed and / or the cooling capacity of the winding device are increased or decreased based on the pre-winding temperature.

[0133] In some embodiments, the increasing and / or decreasing the winding speed and / or cooling capacity of the winding device based on the pre-winding temperature is specifically:

[0134] If the pre-winding temperature is greater than the preset winding temperature, reducing the winding speed of the winding device and / or increasing the cooling capacity of the winding device;

[0135] If the pre-winding temperature is lower than the preset winding temperature, the winding speed of the winding device is increased, and / or the cooling capacity of the winding device is reduced.

[0136] In some embodiments, the bonding gold wire equipment further comprises a wire drawing device, the wire drawing device comprises a heating reel and a drawing die, and a wire drawing infrared imaging sensor is disposed above the wire drawing device;

[0137] The adjustment module 230 is further used for:

[0138] The bonding gold wire is heated to a preset wire drawing temperature by the heating drum;

[0139] Wire drawing is performed by the wire drawing device;

[0140] Detecting the pre-wire drawing temperature of the bonding gold wire when it moves to the drawing die by the wire drawing infrared imaging sensor;

[0141] The drawing speed of the bonding gold wire is increased or decreased based on the pre-drawing temperature.

[0142] In some embodiments, the gold wire bonding device further comprises a voltage sensor connected to an input power source of the gold wire bonding device;

[0143] Before acquiring the annealing thermal imaging image in the annealing device by the annealing infrared imaging sensor, the method further includes:

[0144] Acquiring the real-time voltage of the input power supply through the voltage sensor;

[0145] If the real-time voltage is less than the input lower threshold, the gold wire bonding device is powered by a backup power supply.

[0146] In some embodiments, before acquiring the annealing thermal imaging image in the annealing device by the annealing infrared imaging sensor, the method further includes:

[0147] Acquiring the real-time voltage of the input power supply through the voltage sensor;

[0148] If the real-time voltage is greater than the input upper limit threshold, the backup power supply is charged through the input power supply.

[0149] In addition to the above-mentioned methods, devices and systems, the embodiments of the present application may also be a computer program product, which includes computer program instructions, which, when executed by a processor, enable the processor to execute the steps of the method provided by any embodiment of the present application.

[0150] The computer program product may be written in any combination of one or more programming languages ​​to write program codes for performing the operations of the embodiments of the present application, including object-oriented programming languages, such as Java, C++, etc., and conventional procedural programming languages, such as "C" language or similar programming languages. The program code may be executed entirely on the user computing device, partially on the user computing device, as an independent software package, partially on the user computing device and partially on a remote computing device, or entirely on a remote computing device or server.

[0151] In addition, an embodiment of the present application may also be a computer-readable storage medium on which computer program instructions are stored. When the computer program instructions are executed by a processor, the processor executes the steps of the anti-oxidation palladium copper wire rewinding detection method provided in any embodiment of the present application.

[0152] The computer readable storage medium can adopt any combination of one or more readable media. The readable medium can be a readable signal medium or a readable storage medium. The readable storage medium can include, for example, but is not limited to, a system, device or device of electricity, magnetism, light, electromagnetic, infrared, or semiconductor, or any combination of the above. More specific examples (non-exhaustive list) of readable storage media include: an electrical connection with one or more wires, a portable disk, a hard disk, a random access memory (RAM), a read-only memory (ROM), an erasable programmable read-only memory (EPROM or flash memory), an optical fiber, a portable compact disk read-only memory (CD-ROM), an optical storage device, a magnetic storage device, or any suitable combination of the above.

[0153] It should be noted that the terms used in this application are only for describing specific embodiments, rather than limiting the scope of this application. As shown in the specification and claims of this application, unless the context clearly indicates an exception, the words "one", "a", "a kind of" and / or "the" do not specifically refer to the singular, but may also include the plural. The terms "include", "comprise" or any other variant thereof are intended to cover non-exclusive inclusion, so that the process, method or device including a series of elements includes not only those elements, but also includes other elements not explicitly listed, or also includes elements inherent to such process, method or device. In the absence of further restrictions, the elements defined by the sentence "including one..." do not exclude the presence of other identical elements in the process, method or device including the elements.

[0154] It should also be noted that the terms "center", "up", "down", "left", "right", "vertical", "horizontal", "inside", "outside", etc., indicating the orientation or position relationship, are based on the orientation or position relationship shown in the drawings, and are only for the convenience of describing the present application and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and therefore cannot be understood as a limitation on the present application. Unless otherwise clearly specified and limited, the terms "installed", "connected", "connected", etc. should be understood in a broad sense, for example, it can be a fixed connection, a detachable connection, or an integral connection; it can be a mechanical connection or an electrical connection; it can be a direct connection, or it can be an indirect connection through an intermediate medium, or it can be a connection between the two elements. For those of ordinary skill in the art, the specific meanings of the above terms in this application can be understood according to specific circumstances.

[0155] This article uses specific examples to illustrate the principles and implementation methods of this application. The description of the above embodiments is only used to help understand the method and its core ideas of this application. The above is only the preferred implementation method of this application. It should be pointed out that due to the limitations of textual expression and the objective existence of infinite specific structures, ordinary technicians in this technical field can make several improvements, modifications or changes without departing from the principles of the present invention, and can also combine the above technical features in an appropriate manner; these improvements, modifications, changes or combinations, or the direct application of the inventive concept and technical solution to other occasions without improvement, should be regarded as the scope of protection of this application.

[0156] It is understood that the various numbers involved in the embodiments of the present application are only for the convenience of description and are not used to limit the scope of the embodiments of the present application. The size of the sequence number of the above-mentioned processes does not mean the order of execution, and the execution order of each process should be determined by its function and internal logic.

[0157] The methods, devices and systems provided in the embodiments of the present application are introduced in detail above. Specific examples are used herein to illustrate the principles and implementation methods of the present application. The description of the above embodiments is only used to help understand the methods and core ideas of the present application. At the same time, for those skilled in the art, according to the ideas of the present application, there will be changes in the specific implementation methods and application scopes. In summary, the contents of this specification should not be understood as limiting the present application.

Claims

1. A temperature monitoring method for gold bonding wire equipment based on the Internet of Things, characterized in that: The bonding gold wire equipment comprises an annealing device and a conveying device, wherein the conveying device is used to convey the bonding gold wire through the annealing device for annealing, wherein the annealing device is provided with an annealing infrared imaging sensor; The method for monitoring the temperature of a gold bonding wire device based on the Internet of Things comprises: Acquiring an annealing thermal imaging image in the annealing device by means of the annealing infrared imaging sensor; Calibrate the position of the bonding gold wire on the annealing thermal imaging image to obtain an annealing temperature distribution map of the bonding gold wire; Determining the position in the furnace when the temperature of the bonding gold wire rises to a preset temperature based on the annealing temperature distribution diagram; A target conveying speed of the bonding gold wire is determined based on the position within the furnace.

2. The method for monitoring temperature of gold bonding wire equipment based on the Internet of Things according to claim 1, characterized in that: The step of determining a target conveying speed of the bonding gold wire based on the position in the furnace comprises: Determining the heating time when the temperature of the bonding gold wire rises to the preset temperature based on the position in the furnace; Obtaining the holding time of the bonding gold wire during the annealing process; Obtaining a heating and holding time of the bonding gold wire based on the heating time and the holding time; A target conveying speed of the bonding gold wire is determined based on the temperature rise and soak time and the size of the annealing device.

3. The method for monitoring temperature of gold bonding wire equipment based on the Internet of Things according to claim 1, characterized in that: The gold bonding wire equipment further comprises a cooling device connected to the annealing device, the conveying device is used to convey the annealed gold bonding wire through the cooling device for cooling, wherein a cooling infrared imaging sensor is provided in the cooling device; The step of determining the target conveying speed of the bonding gold wire based on the position in the furnace further includes: Acquiring a cooling thermal imaging image in the cooling device by means of the cooling infrared imaging sensor; Calibrate the position of the bonding gold wire on the cooling thermal imaging image to obtain a cooling temperature distribution diagram of the bonding gold wire; The cooling capacity of the cooling device is increased or decreased based on the cooling temperature distribution map.

4. The method for monitoring temperature of gold bonding wire equipment based on the Internet of Things according to claim 3, characterized in that: The increasing or decreasing the cooling capacity of the cooling device based on the cooling temperature distribution diagram comprises: determining a cooling rate of the bonding gold wire based on the cooling temperature distribution diagram; If the cooling speed is greater than a preset cooling speed, reducing the cooling capacity of the cooling device; If the cooling speed is lower than the preset cooling speed, the cooling capacity of the cooling device is increased.

5. The method for monitoring temperature of gold bonding wire equipment based on the Internet of Things according to claim 1, characterized in that: The gold wire bonding device further comprises a winding device, the winding device comprises a winding reel, and a winding infrared imaging sensor is arranged above the winding device; The method for monitoring the temperature of a gold bonding wire device based on the Internet of Things further includes: Detecting the pre-winding temperature of the bonding gold wire when it moves to the winding drum by the winding infrared imaging sensor; The winding speed and / or the cooling capacity of the winding device are increased or decreased based on the pre-winding temperature.

6. The method for monitoring temperature of gold bonding wire equipment based on the Internet of Things according to claim 5, characterized in that: The increasing of the temperature before winding and / or reducing the winding speed and / or the cooling capacity of the winding device are specifically: If the pre-winding temperature is greater than the preset winding temperature, reducing the winding speed of the winding device and / or increasing the cooling capacity of the winding device; If the pre-winding temperature is lower than the preset winding temperature, the winding speed of the winding device is increased and / or the cooling capacity of the winding device is reduced.

7. The method for monitoring temperature of gold bonding wire equipment based on the Internet of Things according to claim 1, characterized in that: The bonding gold wire equipment also includes a wire drawing device, which includes a heating reel and a drawing die, and a wire drawing infrared imaging sensor is provided above the wire drawing device; The method for monitoring the temperature of a gold bonding wire device based on the Internet of Things further includes: The bonding gold wire is heated to a preset wire drawing temperature by the heating drum; Wire drawing is performed by the wire drawing device; Detecting the pre-wire drawing temperature of the bonding gold wire when it moves to the drawing die by the wire drawing infrared imaging sensor; The drawing speed of the bonding gold wire is increased or decreased based on the pre-drawing temperature.

8. The method for monitoring temperature of gold bonding wire equipment based on the Internet of Things according to claim 1, characterized in that: The gold wire bonding device further comprises a voltage sensor connected to an input power supply of the gold wire bonding device; Before acquiring the annealing thermal imaging image in the annealing device by the annealing infrared imaging sensor, the method further includes: Acquiring the real-time voltage of the input power supply through the voltage sensor; If the real-time voltage is less than the input lower threshold, the gold wire bonding device is powered by a backup power supply.

9. The method for monitoring temperature of gold bonding wire equipment based on the Internet of Things according to claim 8, characterized in that: Before acquiring the annealing thermal imaging image in the annealing device by the annealing infrared imaging sensor, the method further includes: Acquiring the real-time voltage of the input power supply through the voltage sensor; If the real-time voltage is greater than the input upper limit threshold, the backup power supply is charged through the input power supply.

10. A temperature monitoring system for gold bonding wire equipment based on the Internet of Things, characterized in that: The bonding gold wire equipment comprises an annealing device and a conveying device, wherein the conveying device is used to convey the bonding gold wire through the annealing device for annealing, wherein the annealing device is provided with an annealing infrared imaging sensor; The temperature monitoring system for bonding wire equipment based on the Internet of Things includes: A detection module, used for acquiring an annealing thermal imaging image in the annealing device through the annealing infrared imaging sensor; An analysis module, used to calibrate the position of the bonding gold wire on the annealing thermal imaging image to obtain an annealing temperature distribution map of the bonding gold wire; and determine the position of the bonding gold wire in the furnace when the temperature rises to a preset temperature based on the annealing temperature distribution map; An adjustment module is used to determine a target conveying speed of the bonding gold wire based on the position in the furnace.

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