Ultra-thin chip packaging device and method

Abstract

The present invention discloses an ultra-thin chip packaging device and method, which relates to the technical field of chip packaging equipment. The workbench comprises a workbench, wherein the inner bottom end of the workbench is provided with a packaging drive adjustment component. In cooperation with the packaging temperature control component, the temperature of the fine part of the ultra-thin chip material is finely adjusted, thereby effectively improving the temperature uniformity of the packaging process, accelerating the thermal reaction speed, and reducing the influence of thermal stress on the ultra-thin chip material. In addition, the plug-in contact arrangement of the heat-conducting push-in piece and the guide groove ensures that heat is quickly and evenly transferred to the surface of the ultra-thin chip material, thereby optimizing the heat conduction efficiency. Alternatively, when the packaging heat accumulates, the temperature is led out through the heat-conducting push-in piece, thereby avoiding overheating of the ultra-thin chip material, thereby causing damage to the ultra-thin chip material or internal defects, thereby increasing the overall performance and lifespan, realizing precise control and fine adjustment of the local temperature during the packaging process, and reducing the damage to the ultra-thin chip material caused by thermal stress.

Description

Technical Field

[0001] The present invention relates to the technical field of chip packaging equipment, and in particular to an ultra-thin chip packaging device and method. Background Art

[0002] Chip is a general term for semiconductor component products. It is the carrier of integrated circuits and is divided from wafers. It is a circuit module that realizes a specific function by integrating multiple electronic components on a silicon plate. It is the most important part of an electronic device, responsible for calculation and storage functions. It is widely used in almost all electronic equipment such as military and civilian industries. Since chips are precision components, they are relatively fragile. In order to fix, seal and protect the chips, special packaging equipment is needed to seal the chips.

[0003] However, in the existing technology, high-density packaging is often used in the packaging process of ultra-thin chips, so that the mold is formed and solidified at a specific temperature to form a stable package body to protect the chip from physical and environmental damage. However, due to the high-density packaging, serious heat accumulation is easily generated, causing the chip to overheat, which can easily cause chip damage or internal defects, affecting the overall performance and lifespan. Therefore, it is necessary to propose a packaging device and method for ultra-thin chips. Summary of the Invention

[0004] The purpose of the present invention is to provide an ultra-thin chip packaging device and method to solve the problem that the above-mentioned background technology proposes that in the ultra-thin chip packaging process, high-density packaging is often used to form a mold and solidify it at a specific temperature to form a stable package body to protect the chip from physical and environmental damage. However, due to the high-density packaging, serious heat accumulation is easily generated, resulting in chip overheating, which can easily cause chip damage or internal defects, affecting the overall performance and life.

[0005] To achieve the above-mentioned object, the present invention provides the following technical solution: an ultra-thin chip packaging device, comprising a workbench, a packaging drive adjustment component is installed at the bottom end of the workbench, and a packaging temperature control component is installed on the top of the packaging drive adjustment component;

[0006] The packaging temperature control component includes a horizontal linear rail, the side end of the horizontal linear rail is slidably connected to the vertical linear rail, the internal sliding connection of the vertical linear rail is connected to the position calibration sliding saddle, the side end of the position calibration sliding saddle is fastened to the packaging structure, the outer circumference of the packaging structure is equally divided and surrounded by a plurality of groups of guide grooves, the bottom of the vertical linear rail is fastened to a vertical short adjustment rail, the side end of the vertical short adjustment rail is internally slidably connected to the side connection slider, the side end of the side connection slider is installed with an electric push guide rod, the side end of the electric push guide rod is fastened to a frame rod, the left and right ends of the frame rod are fastened to the side connection frame, and there is a length difference between the left and right ends of the side connection frame. The side ends of the side connecting frames are fastened to hoop frames, and the bottom of the side ends of the hoop frames are provided with pitch-adjusting gears. The top center end of the pitch-adjusting gears is connected to a servo motor, and the side ends of the pitch-adjusting gears are meshed and connected with stepping racks. The stepping racks are respectively located in the sliding grooves opened on the sides of the left and right side connecting frames and are slidably connected. The side ends of the stepping racks are fastened to the first temperature-controlled heat-conducting arc plate and the second temperature-controlled heat-conducting arc plate, and the surfaces of the first temperature-controlled heat-conducting arc plate and the second temperature-controlled heat-conducting arc plate are equally dividedly provided with multiple groups of micro-advancing pumps, and the side ends of the multiple groups of micro-advancing pumps are installed with micro-phase change columns, and the front ends of the multiple groups of micro-advancing pumps are connected with heat-conducting arc plates.

[0007] Preferably, two sets of reinforcing arms are symmetrically installed at both ends of the top of the workbench, and the side ends of the two sets of reinforcing arms are fastened to the chip processing components. A rotating drive structure is installed on the surface of the workbench, and the top of the rotating drive structure is rotatably connected to a rotating workpiece operating disk, and a pneumatic clamping positioning seat is installed on the top of the rotating workpiece operating disk.

[0008] Preferably, the package drive adjustment component includes a stepping cylinder, which is mounted inside the frame of the workbench, and the side end of the stepping cylinder is connected to a sliding side frame rack, and the bottom of the sliding side frame rack is slidably connected to a slide rail, and the slide rail is installed outside the shell of the rotating drive structure, and the side of the sliding side frame rack is meshed with a driving gear, and the driving gear is fastened to the rotating connecting column and the side bearing seat of the transverse linear rail.

[0009] Preferably, the chip processing assembly includes a discharge conveyor table, the side end of the discharge conveyor table is fastened with a detection roller, the side end of the discharge conveyor table is connected with an airtight detection table, and the side ends of the two groups of reinforcing arms are fastened with a first transverse sliding rail and a second transverse sliding rail respectively through fasteners.

[0010] Preferably, the side end of the first horizontal sliding rail is slidingly connected to a side short vertical groove rail, the side end of the side short vertical groove rail is slidingly connected to a sliding connection side frame, the side end of the sliding connection side frame is installed with a negative pressure regulating cylinder, and the bottom of the negative pressure regulating cylinder is installed with a negative pressure detection adsorption plate.

[0011] Preferably, the side end of the second transverse sliding rail is slidably connected to a sliding clamping frame, the internal clamping installation of the sliding clamping frame is provided with a positioning adsorption structure, the bottom of the positioning adsorption structure is connected to a positioning calibration end, and the bottom of the positioning calibration end is provided with an adsorption end.

[0012] Preferably, a feed positioning assembly is installed on the top wall surface of the workbench, and the feed positioning assembly includes a feed conveyor rack. A dual-axis controlled pneumatic cylinder is installed on the bottom plate surface of the feed conveyor rack, and an adjustable articulated frame is installed on the top of the dual-axis controlled pneumatic cylinder.

[0013] Preferably, the top two ends of the adjusting articulated frame are hinged with force-bearing articulated frames, and the side ends of the force-bearing articulated frames are rotatably connected to positioning arm frames, and the positioning arm frames can limit the ultra-thin chip materials conveyed by the feed conveyor frame after the ultra-thin chip materials reach the adsorption end position.

[0014] Preferably, stable rubber seats are installed at the four ends of the bottom of the workbench, and a feed dust cover is installed at the top side end of the workbench, and the dust cover is used to shield the feed conveyor rack from dust.

[0015] A method for using an ultra-thin chip packaging device comprises the following steps:

[0016] S1. When the ultra-thin chip material to be packaged is transported through the feeding and positioning assembly, when it reaches the side end position of the adsorption end in sequence, the second transverse sliding rail is activated, and the positioning adsorption structure, the positioning calibration end and the adsorption end are used to adsorb the ultra-thin chip material limited by the positioning arm, and the displacement is adjusted to the rotating workpiece operation disk and the pneumatic clamping positioning seat;

[0017] S2. Then, the packaging drive adjustment component is started, so that the packaging temperature control component forms a rotation angle adjustment according to the placement orientation of the ultra-thin chip material. Then, the packaging temperature control component is started to perform temperature-controlled packaging operations on the ultra-thin chip material inside the pneumatic clamping and positioning seat;

[0018] S3, then, the packaging temperature control component sequentially operates on the ultra-thin chip materials in different pneumatic clamping and positioning seats according to the rotation order of the rotating workpiece operation disk;

[0019] S4. After that, the first transverse sliding rail is used to make the negative pressure regulating cylinder and the negative pressure detection adsorption plate adsorb the ultra-thin chip material after detection, and then transfer it to the airtight detection table. After being detected by the airtight detection table, it is conveyed to the next process through the discharge conveying table and the detection roller.

[0020] Compared with the prior art, the present invention has the following beneficial effects:

[0021] 1. In the present invention, by cooperating with the packaging temperature control component, the packaging structure can cooperate with the position calibration sliding saddle to ensure stability and precision during the movement, and flexibly and accurately position the ultra-thin chip material inside the pneumatic clamping positioning seat on a two-dimensional plane. Then, during the packaging operation, the electric push guide rod is activated to make the first temperature-controlled heat-conducting arc plate and the second temperature-controlled heat-conducting arc plate located outside the packaging structure without interfering with the packaging operation. Afterwards, the servo motor-driven pitch-adjusting gear and the stepping rack are engaged and connected, so that the stepping rack can be used to drive the first temperature-controlled heat-conducting arc plate and the second temperature-controlled heat-conducting arc plate to contact the outside of the packaging structure respectively. In cooperation with the vertical short adjustment rail, multiple groups of micro-advanced pumps, micro-phase change columns and heat-conducting arc plates can be connected with multiple groups of guide The connection formed by the connecting groove makes it possible to change the heat absorption and heat conduction operation of the heat-conducting push-in sheet through the micro phase change column according to the real-time needs of the packaging process, accurately control the local temperature change of the package, and realize temperature fine-tuning of the subtle parts of the ultra-thin chip material, effectively improving the temperature uniformity of the packaging process, accelerating the thermal reaction speed, and reducing the impact of thermal stress on the ultra-thin chip material. The plug-in contact setting of the heat-conducting push-in sheet and the connecting groove ensures that heat is quickly and evenly transferred to the surface of the ultra-thin chip material, optimizing the heat conduction efficiency, or when the packaging heat accumulates, the temperature is led out through the heat-conducting push-in sheet to avoid overheating of the ultra-thin chip material and damage or internal defects of the ultra-thin chip material, thereby increasing the overall performance and life, realizing precise control and fine-tuning of local temperature in the packaging process, and reducing the damage of thermal stress to the ultra-thin chip material.

[0022] 2. In the present invention, with the cooperation of the chip processing component, before packaging, the second horizontal sliding rail is started, and the positioning adsorption structure, the positioning calibration end and the adsorption end are used to adsorb the ultra-thin chip material limited by the positioning arm, and the displacement is adjusted to the rotating workpiece operating disk and the pneumatic clamping positioning seat, so that the pneumatic clamping positioning seat can be used to fine-tune the position of the ultra-thin chip according to needs to ensure the accuracy of subsequent packaging processing. After packaging, the first horizontal sliding rail is started to drive the side short vertical groove rail for adjustment, so that the sliding connection side frame drives the negative pressure adjustment cylinder and the negative pressure detection adsorption plate to detect and adsorb the ultra-thin chip material, and then transfer it to the airtight detection table to perform an airtightness test on the ultra-thin chip to verify the integrity of the packaging and eliminate any minor leaks that may cause performance degradation. Afterwards, the detection roller is used to perform a preliminary appearance inspection on the surface of the ultra-thin chip to eliminate obviously defective products to ensure that qualified chips are processed in subsequent steps. Then, the discharge conveyor is responsible for transporting the processed ultra-thin chip material from the processing area to the next process, realizing an integrated operation process, improving production efficiency and processing accuracy, and reducing manual intervention and errors. BRIEF DESCRIPTION OF THE DRAWINGS

[0023] Figure 1 This is a schematic diagram of the main structure of an ultra-thin chip packaging device of the present invention;

[0024] Figure 2 This is a schematic side view of the structure of an ultra-thin chip packaging device of the present invention;

[0025] Figure 3 This is a schematic structural diagram of a chip processing component in an ultra-thin chip packaging device of the present invention;

[0026] Figure 4 This is a structural schematic diagram of a feed positioning assembly in an ultra-thin chip packaging device according to the present invention;

[0027] Figure 5 This is a structural schematic diagram of a packaging drive adjustment component in an ultra-thin chip packaging device of the present invention;

[0028] Figure 6 This is a schematic structural diagram of a packaging temperature control component in an ultra-thin chip packaging device according to the present invention;

[0029] Figure 7 In the packaging device of an ultra-thin chip of the present invention Figure 6 A schematic diagram of the enlarged structure at point A;

[0030] Figure 8 In the packaging device of an ultra-thin chip of the present invention Figure 6 Schematic diagram of the enlarged structure at point B.

[0031] In the figure: 1. Workbench; 2. Stable rubber seat; 3. Strengthening arm; 4. Chip processing component; 41. Discharge conveyor; 42. Inspection roller; 43. Airtightness inspection table; 44. First horizontal sliding rail; 45. Side short vertical groove rail; 46. Sliding connection side frame; 47. Negative pressure adjustment cylinder; 48. Second horizontal sliding rail; 49. Sliding clamping frame; 490. Positioning adsorption structure; 491. Positioning calibration end; 492. Adsorption end; 5. Feed positioning component; 51. Feed conveyor; 52. Double-axis control pneumatic cylinder; 53. Adjustment articulated frame; 54. Force-bearing articulated frame; 55. Positioning arm; 6. Rotation drive structure; 7. Packaging drive adjustment component; 71. Stepping cylinder; 72. Slide rail; 73 , sliding side rack rack; 74, driving gear; 8, rotating workpiece operation disk; 9, pneumatic clamping positioning seat; 10, package temperature control component; 101, horizontal linear rail; 102, vertical linear rail; 103, position calibration sliding saddle; 104, packaging structure; 105, guide groove; 106, vertical short adjustment rail; 107, side joint slider; 108, electric push guide rod; 109, rack rod; 1090, side joint frame; 1091, first temperature control heat conduction arc plate; 1092, second temperature control heat conduction arc plate; 1093, hoop frame; 1094, pitch adjustment gear; 1095, servo motor; 1096, stepping rack; 1097, micro push pump; 1098, micro phase change column; 1099, thermal push sheet. DETAILED DESCRIPTION

[0032] The following will clearly and completely describe the technical solutions in the embodiments of the present invention in conjunction with the accompanying drawings. Obviously, the implementation regulations described are only part of the embodiments of the present invention, not all of the embodiments. All other embodiments obtained by ordinary technicians in this field based on the embodiments of the present invention without making any creative efforts shall fall within the scope of protection of the present invention.

[0033] Reference Figure 1 - Figure 8As shown: an ultra-thin chip packaging equipment, including a workbench 1, the internal bottom end of the workbench 1 is installed with a packaging drive adjustment component 7, and the top of the packaging drive adjustment component 7 is installed with a packaging temperature control component 10; the packaging temperature control component 10 includes a horizontal linear rail 101, the side end of the horizontal linear rail 101 is slidably connected to the vertical linear rail 102, the internal sliding connection of the vertical linear rail 102 is a position calibration sliding saddle 103, the side end of the position calibration sliding saddle 103 is fastened to the packaging structure 104, the outer circumference of the packaging structure 104 is equally divided and surrounded by a plurality of groups of guide grooves 105, the bottom of the vertical linear rail 102 is fastened to a vertical short adjustment rail 106, the side end of the vertical short adjustment rail 106 is slidably connected to the side connection slider 107, the side end of the side connection slider 107 is installed with an electric push guide rod 108, the side end of the electric push guide rod 108 is fastened to a rack rod 109, and the left and right ends of the rack rod 109 are fastened to the side connection rack 10 90, there is a length difference between the left and right side frames 1090, and the side ends of the left and right side frames 1090 are fastened to the hoop frames 1093, and the bottom of the side end of the hoop frames 1093 is provided with a pitch-adjusting gear 1094, and the top center end of the pitch-adjusting gear 1094 is connected to a servo motor 1095, and the side end of the pitch-adjusting gear 1094 is meshed with a stepping rack 1096, which is respectively located in the slide grooves opened on the side of the left and right side frames 1090. The internal sliding connection is that the side ends of the stepping rack 1096 are respectively fastened with the first temperature-controlled heat-conducting arc-connecting plate 1091 and the second temperature-controlled heat-conducting arc-connecting plate 1092, and the surfaces of the first temperature-controlled heat-conducting arc-connecting plate 1091 and the second temperature-controlled heat-conducting arc-connecting plate 1092 are equally divided and surrounded by a plurality of groups of micro-advance pumps 1097, and the side ends of the plurality of groups of micro-advance pumps 1097 are installed with micro-phase change columns 1098, and the front ends of the plurality of groups of micro-advance pumps 1097 are connected with heat-conducting advance plates 1099.

[0034] according to Figure 1 and Figure 2 As shown, two sets of reinforcing arms 3 are symmetrically installed at both ends of the top of the workbench 1, and the side ends of the two sets of reinforcing arms 3 are fastened to the chip processing components 4. A rotating drive structure 6 is installed on the surface of the workbench 1, and the top of the rotating drive structure 6 is rotatably connected to the rotating workpiece operation disk 8. A pneumatic clamping positioning seat 9 is installed on the top of the rotating workpiece operation disk 8. The operator places the ultra-thin chip to be processed on the pneumatic clamping positioning seat 9 through the positioning adsorption structure 490, the positioning calibration end 491 and the adsorption end 492, so as to fine-tune the position of the ultra-thin chip as needed to ensure the accuracy of subsequent packaging processing. Then, the rotating drive structure 6 is started by an external PLC controller, so that it can drive the rotating workpiece operation disk 8 to rotate smoothly, and the rotation speed and rotation time of the rotating workpiece operation disk 8 can be preset and adjusted according to the processing requirements of the ultra-thin chip, so as to adapt to the comprehensive rate of the packaging temperature control component 10, the chip processing component 4 and the feeding positioning component 5.

[0035] according to Figure 2 and Figure 5 As shown, the packaging drive adjustment component 7 includes a stepping cylinder 71, which is mounted inside the frame of the workbench 1, and the side end of the stepping cylinder 71 is connected to a sliding side frame rack 73, and the bottom of the sliding side frame rack 73 is slidably connected to a slide rail 72, and the slide rail 72 is mounted on the outside of the shell of the rotation drive structure 6, and the side of the sliding side frame rack 73 is meshed with a driving gear 74, which is fastened to the side bearing seat of the horizontal linear rail 101 through a rotating connecting column. When the packaging temperature control component 10 needs to operate, the stepping cylinder 71 is started to push the sliding side frame rack 73 to slide inside the slide rail 72, so that the sliding side frame rack 73 and the driving gear 74 form an engaged rotation, and the rotation of the driving gear 74 is used to make the packaging temperature control component 10 connected by the rotating connecting column and the bearing seat rotate and adjust.

[0036] according to Figure 3 As shown, the chip processing component 4 includes a discharge conveyor table 41, the side end of the discharge conveyor table 41 is fastened with a detection roller 42, the side end of the discharge conveyor table 41 is connected to an airtight detection table 43, and the side ends of the two sets of reinforcing arms 3 are fastened with a first transverse sliding rail 44 and a second transverse sliding rail 48 respectively through fasteners. The discharge conveyor table 41 is responsible for transporting the processed ultra-thin chips from the processing area to the next work area, so that during the transportation process, the detection roller 42 is used to perform a preliminary appearance inspection on the surface of the ultra-thin chip to eliminate obviously defective products to ensure that qualified chips are processed in subsequent steps, and the airtight detection table 43 is used to perform an airtightness test on the ultra-thin chip to verify the package integrity and eliminate any minor leaks that may cause performance degradation.

[0037] according to Figure 3 As shown, the side end of the first horizontal sliding rail 44 is slidingly connected to the side short vertical groove rail 45, and the side end of the side short vertical groove rail 45 is slidingly connected to the sliding connection side frame 46. The side end of the sliding connection side frame 46 is installed with a negative pressure regulating cylinder 47, and the bottom of the negative pressure regulating cylinder 47 is installed with a negative pressure detection adsorption plate. During operation, the first horizontal sliding rail 44 is started to drive the side short vertical groove rail 45 to be adjusted, so that the sliding connection side frame 46 drives the negative pressure regulating cylinder 47 and the negative pressure detection adsorption plate to detect and adsorb the ultra-thin chip material, and then transfer it to the airtight detection table 43 for detection.

[0038] according to Figure 3As shown, the side end of the second transverse sliding rail 48 is slidably connected to a sliding clamping frame 49, the internal clamping installation of the sliding clamping frame 49 is provided with a positioning adsorption structure 490, the bottom connection of the positioning adsorption structure 490 is provided with a positioning calibration end 491, the bottom of the positioning calibration end 491 is provided with an adsorption end 492, the second transverse sliding rail 48 is started, and the positioning adsorption structure 490, the positioning calibration end 491 and the adsorption end 492 are allowed to adsorb the ultra-thin chip material limited by the positioning arm 55, and the displacement is adjusted to the rotating workpiece working disk 8 and the pneumatic clamping positioning seat 9.

[0039] according to Figure 4 As shown, a feed positioning assembly 5 is installed on the top wall surface of the workbench 1, and the feed positioning assembly 5 includes a feed conveyor frame 51. A dual-axis controlled pneumatic cylinder 52 is installed on the bottom plate surface of the feed conveyor frame 51, and an adjustment hinge frame 53 is installed on the top of the dual-axis controlled pneumatic cylinder 52. The feed conveyor frame 51 is responsible for receiving and conveying the ultra-thin chip material to the area to be processed. When the ultra-thin chip material is conveyed to the vicinity of the adsorption end 492 of the target area, the dual-axis controlled pneumatic cylinder 52 is started according to the preset program of the external PLC controller, driving the adjustment hinge frame 53 to accurately adjust the position.

[0040] according to Figure 4 As shown, the top two ends of the adjusting articulated frame 53 are hinged with force-bearing articulated frames 54, and the side ends of the force-bearing articulated frame 54 are rotatably connected to the positioning arm frame 55. The positioning arm frame 55 can limit the ultra-thin chip material being transported after the ultra-thin chip material is transported by the feeding conveyor frame 51 to the adsorption end 492 position. When the chip reaches the specified position, the positioning arm frame 55 forms a clamp in cooperation with the adjusting articulated frame 53 and the force-bearing articulated frame 54, and limits the ultra-thin chip material being transported to prevent position deviation due to vibration or other external forces, thereby ensuring the stability of the ultra-thin chip material during adsorption and subsequent processing.

[0041] according to Figure 2 As shown, stable rubber seats 2 are installed at the four ends of the bottom of the workbench 1, and a feed dust cover is installed at the top side end of the workbench 1. The dust cover is used to shield the feed conveyor rack 51 from dust. With the cooperation of the stable rubber seats 2, the stability of the overall ultra-thin chip material is guaranteed during packaging.

[0042] The wiring diagram of the airtightness test platform 43, the dual-axis controlled pneumatic cylinder 52, the stepping cylinder 71, the position calibration sliding saddle 103, the servo motor 1095 and the micro phase change column 1098 in the present invention is common knowledge in the field, and its working principle is a well-known technology. The model is selected according to the actual use, so the control method and wiring layout of the airtightness test platform 43, the dual-axis controlled pneumatic cylinder 52, the stepping cylinder 71, the position calibration sliding saddle 103, the servo motor 1095 and the micro phase change column 1098 will no longer be explained in detail.

[0043] The method of using and working principle of this device: First, the feed conveyor frame 51 is used to receive and convey the ultra-thin chip material to the area to be processed. When the ultra-thin chip material is conveyed to the vicinity of the adsorption end 492 of the target area, the dual-axis controlled pneumatic cylinder 52 is started according to the preset program of the external PLC controller, driving the adjustment hinge frame 53 to accurately adjust the position. When the chip reaches the specified position, the positioning arm frame 55 forms a clamp under the cooperation of the adjustment hinge frame 53 and the force-bearing hinge frame 54, and limits the ultra-thin chip material in conveyance to prevent position deviation caused by vibration or other external forces, thereby ensuring the stability of the ultra-thin chip material during adsorption and subsequent processing. Then the second transverse sliding rail 48 is started, and the positioning adsorption structure 490, the positioning calibration end 491 and the adsorption structure 490 are positioned and adjusted. The attached end 492 adsorbs the ultra-thin chip material limited by the positioning arm 55, and adjusts the displacement to the rotating workpiece operation disk 8 and the pneumatic clamping positioning seat 9, so that the pneumatic clamping positioning seat 9 can fine-tune the position of the ultra-thin chip according to needs, ensuring the accuracy of subsequent packaging processing. Then, the rotation drive structure 6 is started by the external PLC controller, so that it can drive the rotating workpiece operation disk 8 to rotate smoothly, and the speed and rotation time of the rotating workpiece operation disk 8 can be preset and adjusted according to the processing requirements of the ultra-thin chip, so as to adapt to the comprehensive rate of the packaging temperature control component 10, the chip processing component 4 and the feeding positioning component 5. Then, when the packaging temperature control component 10 needs to be operated, the stepping cylinder 71 is started to push the sliding side rack rack 73 inside the slide rail 72 Sliding facilitates the meshing rotation of the sliding rack rack 73 and the driving gear 74, and the rotation of the driving gear 74 is used to rotate and adjust the package temperature control component 10 connected by the rotating connecting column and the bearing seat, and then the double-axis sliding structure composed of the horizontal linear rail 101 and the vertical linear rail 102 enables the package structure 104 to cooperate with the position calibration sliding saddle 103 to ensure stability and precision in the movement process, and flexibly and accurately position the ultra-thin chip material inside the pneumatic clamping positioning seat 9 on a two-dimensional plane. Then, during the packaging operation, the first temperature-controlled heat-conducting arc plate 1091 and the second temperature-controlled heat-conducting arc plate 1092 are located outside the packaging structure 104 by starting the electric push guide rod 108, and It will not interfere with the packaging operation. Then, the pitch-adjusting gear 1094 driven by the servo motor 1095 is engaged with the stepping rack 1096, so that the stepping rack 1096 can be used to drive the first temperature-controlled heat-conducting arc plate 1091 and the second temperature-controlled heat-conducting arc plate 1092 to contact the outside of the packaging structure 104 respectively. In cooperation with the vertical short adjustment rail 106, multiple groups of micro-advancing pumps 1097, micro-phase change columns 1098 and heat-conducting advancing sheets 1099 can be plugged into multiple groups of guide grooves 105, so that according to the real-time needs of the packaging process, the heat absorption and heat conduction effects of the heat-conducting advancing sheets 1099 can be changed through the micro-phase change columns 1098, so as to accurately control the local temperature changes of the package and achieve fine-tuning of the temperature of the fine parts of the ultra-thin chip material.The temperature uniformity of the packaging process is effectively improved, the thermal reaction speed is accelerated, and the influence of thermal stress on the ultra-thin chip material is reduced. The plug-in contact setting of the heat-conducting plate 1099 and the guide groove 105 ensures that the heat is quickly and evenly transferred to the surface of the ultra-thin chip material, optimizing the heat conduction efficiency. When the packaging heat accumulates, the temperature is led out through the heat-conducting plate 1099 to avoid overheating of the ultra-thin chip material and damage or internal defects of the ultra-thin chip material, thereby increasing the overall performance and life. Then, the first horizontal sliding rail 44 is started to drive the side short vertical groove rail 45 is adjusted so that the sliding connecting side frame 46 drives the negative pressure adjustment cylinder 47 and the negative pressure detection adsorption plate to detect and adsorb the ultra-thin chip material. After that, it is transferred to the airtightness detection table 43 for airtightness testing of the ultra-thin chip to verify the package integrity and eliminate any minor leaks that may cause performance degradation. After that, the surface of the ultra-thin chip is subjected to preliminary visual inspection using the inspection roller 42 to eliminate obvious defective products and ensure that qualified chips are processed in the subsequent steps. Then, the discharge conveyor 41 is responsible for transporting the processed ultra-thin chip material from the processing area to the next process.

[0044] Although the present invention has been described in detail with reference to the aforementioned embodiments, it is still possible for those skilled in the art to modify the technical solutions described in the aforementioned embodiments, or to make equivalent substitutions for some of the technical features therein. Any modifications, equivalent substitutions, improvements, etc. made within the spirit and principles of the present invention should be included in the scope of protection of the present invention.

Claims

1. An ultra-thin chip packaging device, characterized by: It comprises a workbench (1), wherein a package drive adjustment component (7) is installed at the inner bottom end of the workbench (1), and a package temperature control component (10) is installed at the top of the package drive adjustment component (7); The package temperature control assembly (10) comprises a horizontal linear rail (101), the side end of the horizontal linear rail (101) is slidably connected to a vertical linear rail (102), the interior of the vertical linear rail (102) is slidably connected to a position calibration sliding saddle (103), the side end of the position calibration sliding saddle (103) is fastened to a package structure (104), the outer circumference of the package structure (104) is equally spaced and provided with a plurality of guide grooves (105), the bottom of the vertical linear rail (102) is fastened to the package structure (104), and the package structure (104) is fastened to the package structure (104). A vertical short adjustment rail (106) is provided, and a side connecting slider (107) is slidably connected to the side end of the vertical short adjustment rail (106), and an electric driving guide rod (108) is installed on the side end of the side connecting slider (107). The side end of the electric driving guide rod (108) is fastened to a frame rod (109), and the left and right ends of the frame rod (109) are fastened to the side connecting frame (1090). There is a length difference between the left and right ends of the side connecting frame (1090). The side ends of the side frames (1090) are fastened to the hoop frames (1093), the side ends of the hoop frames (1093) are provided with pitch-adjusting gears (1094), the top center end of the pitch-adjusting gears (1094) is connected to the servo motor (1095), the side ends of the pitch-adjusting gears (1094) are meshed and connected to the stepping racks (1096), the stepping racks (1096) are respectively located in the inner sliding grooves opened on the sides of the left and right end side frames (1090) and are slidably connected. 96) are respectively fastened to the side ends thereof with a first temperature-controlled heat-conducting arc-connecting plate (1091) and a second temperature-controlled heat-conducting arc-connecting plate (1092), and a plurality of groups of micro-advancing pumps (1097) are equally dividedly arranged around the surfaces of the first temperature-controlled heat-conducting arc-connecting plate (1091) and the second temperature-controlled heat-conducting arc-connecting plate (1092), and a plurality of groups of micro-advancing pumps (1097) are installed with micro-phase change columns (1098) at the side ends thereof, and a plurality of groups of the micro-advancing pumps (1097) are connected with heat-conducting arc-connecting plates (1099) at the front ends thereof.

2. The ultra-thin chip packaging device according to claim 1, characterized in that: Two sets of reinforcing arm frames (3) are symmetrically installed at both ends of the top of the workbench (1), and the side ends of the two sets of reinforcing arm frames (3) are fastened with chip processing components (4). A rotating drive structure (6) is installed on the surface of the workbench (1), and the top of the rotating drive structure (6) is rotatably connected to a rotating workpiece operation disk (8), and a pneumatic clamping positioning seat (9) is installed on the top of the rotating workpiece operation disk (8).

3. The ultra-thin chip packaging device according to claim 2, characterized in that: The package drive adjustment component (7) includes a stepping cylinder (71), which is mounted inside the frame of the workbench (1), and the side end of the stepping cylinder (71) is connected to a sliding side rack (73), and the bottom of the sliding side rack (73) is slidably connected to a slide rail (72), and the slide rail (72) is mounted on the outside of the housing of the rotation drive structure (6), and the side of the sliding side rack (73) is meshed with a driving gear (74), and the driving gear (74) is fastened to the side bearing seat of the horizontal linear rail (101) through a rotating connecting column.

4. The ultra-thin chip packaging device according to claim 3, characterized in that: The chip processing assembly (4) includes a discharge conveying platform (41), the side end of the discharge conveying platform (41) is fastened with a detection roller (42), the side end of the discharge conveying platform (41) is connected with an airtightness detection platform (43), and the side ends of the two groups of reinforcing arm frames (3) are fastened with a first transverse sliding rail (44) and a second transverse sliding rail (48) respectively through fasteners.

5. The ultra-thin chip packaging device according to claim 4, characterized in that: The side end of the first transverse sliding rail (44) is slidably connected to a side short vertical groove rail (45), the side end of the side short vertical groove rail (45) is slidably connected to a sliding connection side frame (46), the side end of the sliding connection side frame (46) is installed with a negative pressure regulating cylinder (47), and the bottom of the negative pressure regulating cylinder (47) is installed with a negative pressure detection adsorption disk.

6. The ultra-thin chip packaging device according to claim 5, characterized in that: The side end of the second transverse sliding rail (48) is slidably connected to a sliding clamping frame (49), the internal clamping installation of the sliding clamping frame (49) is provided with a positioning adsorption structure (490), the bottom of the positioning adsorption structure (490) is connected to a positioning calibration end (491), and the bottom of the positioning calibration end (491) is provided with an adsorption end (492).

7. The ultra-thin chip packaging device according to claim 6, characterized in that: A feed positioning assembly (5) is installed on the top wall surface of the workbench (1), and the feed positioning assembly (5) includes a feed conveying frame (51). A double-axis controlled pneumatic cylinder (52) is installed on the bottom plate surface of the feed conveying frame (51), and an adjustable articulated frame (53) is installed on the top of the double-axis controlled pneumatic cylinder (52).

8. The ultra-thin chip packaging device according to claim 7, characterized in that: The top ends of the adjusting hinged frame (53) are hinged with force-bearing hinged frames (54), and the side ends of the force-bearing hinged frames (54) are rotatably connected to positioning arm frames (55). The positioning arm frames (55) can limit the ultra-thin chip material being transported by the feeding conveying frame (51) after the ultra-thin chip material reaches the adsorption end (492) position.

9. The ultra-thin chip packaging device according to claim 8, characterized in that: The four ends of the bottom of the workbench (1) are mounted with stable rubber seats (2), and the top side ends of the workbench (1) are mounted with a feed dust cover, which is used to shield the feed conveying frame (51) from dust.

10. A method for using an ultra-thin chip packaging device, characterized in that: The packaging device using the ultra-thin chip according to claim 9 comprises the following steps: S1. When the ultra-thin chip material to be packaged is transported through the feeding positioning component (5), when it is transported in sequence to the side end position of the adsorption end (492), the second transverse sliding rail (48) is started, and the positioning adsorption structure (490), the positioning calibration end (491) and the adsorption end (492) are used to adsorb the ultra-thin chip material limited by the positioning arm (55), and the displacement is adjusted to the rotating workpiece operation disk (8) and the pneumatic clamping positioning seat (9); S2, then starting the packaging drive adjustment component (7), so that the packaging temperature control component (10) forms a rotation angle adjustment according to the placement orientation of the ultra-thin chip material, and then the packaging temperature control component (10) is started to perform temperature control packaging operation on the ultra-thin chip material inside the pneumatic clamping positioning seat (9); S3, then, the packaging temperature control component (10) is operated on the ultra-thin chip materials in different pneumatic clamping and positioning seats (9) in sequence according to the rotation order of the rotating workpiece operation disk (8); S4. After that, the first transverse sliding rail (44) is used to make the negative pressure regulating cylinder (47) and the negative pressure detection adsorption plate adsorb the ultra-thin chip material after detection, and then transfer it to the airtight detection table (43). After being detected by the airtight detection table (43), it is transported to the next process through the discharge conveying table (41) and the detection roller (42).

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