Multi-axis motion decoupling structure, wire bonding device and equipment

Abstract

The embodiments of the present application relate to semiconductor chip processing equipment, in particular, a multi-axis motion decoupling structure, a wire bonding device and equipment. The device and equipment include a mounting seat, which is installed on the XY platform of the bonding equipment; a U-axis drive assembly, including a U-axis voice coil motor and a U-axis body, the U-axis voice coil motor includes a U-axis stator and a U-axis mover; a V-axis drive assembly, including a V-axis voice coil motor and a V-axis body, the V-axis voice coil motor includes a V-axis stator and a V-axis mover; a Z-axis drive assembly, including a Z-axis voice coil motor and a Z-axis body, the Z-axis voice coil motor includes a Z-axis stator and a Z-axis mover; a bonding mechanism, which is arranged on the Z-axis body. The embodiments of the present application solve the problem of eccentric disturbance, and greatly improve the motion acceleration of the entire bonding equipment in the X-axis and Y-axis directions. At the same time, the expansion of the XY stroke will not affect the bonding accuracy of the UVZ bonding mechanism, thereby achieving bonding in a larger area, and the range of the bonding area can be further expanded.

Description

Technical Field

[0001] Embodiments of the present application relate to semiconductor chip processing equipment, and in particular to a multi-axis motion decoupling structure, a wire bonding device and equipment. Background Art

[0002] In the manufacturing process of semiconductor devices, it is necessary to connect the pins of the lead frame with the pads of the semiconductor chip mounted on the lead frame through wire bonding equipment. The bonding process is mainly achieved through the wire bonding device on the wire bonding equipment.

[0003] The existing wire bonding equipment generally adopts the traditional XYZ three-axis motion structure, which is realized by the combination of the XY platform and the wire bonding device. Among them, the wire bonding device is installed on the XY platform, and the XY platform is responsible for carrying the wire bonding device to perform XY horizontal motion. The wire bonding device itself realizes the Z-axis longitudinal motion, and the Z-axis longitudinal motion of the existing wire bonding device is realized by reciprocating rotation in the vertical direction. Since the driving force of the Z-axis longitudinal motion is applied by rotation, and the high acceleration requirement of more than 250G during high-speed processing makes the inertia, rotation center and verticality of the Z-axis of the wire bonding device to the welding plane very high. The optimization of the Z-axis inertia of the wire bonding device has reached a bottleneck, and it is difficult to ensure that the rotation center of the Z-axis longitudinal motion and the Z-axis center of gravity are completely coincident, and it is difficult to ensure that the welding head is completely perpendicular to the welding plane. At the same time, the application of force in the longitudinal direction will inevitably cause disturbances to other axes. These problems will lead to poor final bonding and packaging effects.

[0004] Currently, the XY platform is driven by a linear motor, and the maximum acceleration can reach 35-40G; it is difficult to improve it further, and the iteration level is relatively limited. A larger thrust iron core linear motor is required, and the use of a large thrust iron core linear motor will inevitably cause thrust fluctuations, large electrical time constants and other control problems, which will also affect the packaging accuracy. Therefore, it is difficult to further significantly improve the bonding speed of the equipment based on the existing motion structure of the wire bonding equipment. Summary of the invention

[0005] In a first aspect, the embodiments of the present application provide a multi-axis motion decoupling structure for solving the problem of eliminating motion interference during multi-axis parallel linkage in multi-axis linear motion and improving the high-speed motion stability of the multi-axis motion unit.

[0006] The multi-axis motion decoupling structure is arranged in a multi-axis motion unit, and at least one axial motion in the multi-axis motion unit is driven by a voice coil motor. The voice coil motor includes a stator and a mover that moves linearly relative to the stator. The stator includes a stator magnet, and the mover includes a mover coil. The mover coil includes a length segment, and the length of the length segment of the mover coil in the length direction is greater than the covering length of the stator magnet in the length direction.

[0007] In a possible implementation, the air gap width between the mover coil and the stator magnet is greater than the standard air gap width.

[0008] In a possible implementation, a decoupling guide rail is provided between at least two axial directions in the multi-axis motion unit.

[0009] Due to the multi-axis decoupling structure, when the voice coil motor in the multi-axis motion unit is driven by the movement force of other axes, the mover of the axis can still maintain a constant magnetic flux in the length section of the mover coil of the voice coil motor when the mover is displaced by external force, so that the driving force of the axis does not change, that is, it is not affected by the movement of other axes, and the stability of the movement is maintained.

[0010] In a second aspect, an embodiment of the present application provides a wire bonding device, comprising:

[0011] A mounting base, mounted on the XY platform of the bonding equipment;

[0012] The UVZ three-axis motion unit is arranged on the mounting seat, and includes a U-axis drive component, a V-axis drive component and a Z-axis drive component for performing linear motion; at least one drive component among the U-axis drive component, the V-axis drive component and the Z-axis drive component includes the multi-axis motion structure of the first aspect.

[0013] The bonding mechanism is arranged on the Z-axis driving assembly, moves under the drive of the UVZ three-axis motion unit and performs chip bonding processing.

[0014] The three axis drive components of the wire bonding device of this embodiment all drive linear motion. Under the condition of using a voice coil motor and combining the above-mentioned multi-axis motion decoupling, an acceleration of 200G-400G in the Z-axis direction can be achieved. Compared with the existing situation of applying a driving force by rotation, a significant improvement in acceleration is achieved, and at the same time, the problem of high coincidence requirements between the rotation center and the Z-axis center of gravity and eccentric disturbance caused by motion in other directions is solved. In addition, the U-axis drive component and the V-axis drive component are combined to form a UVZ three-axis motion unit of the wire bonding device, so that the UV-direction motion acceleration of the wire bonding device can be added on the basis of the XY platform of the device, greatly improving the motion acceleration of the entire bonding device in the X-axis and Y-axis directions. At the same time, the device structure realizes the separation design of the bonding area and the bonding accuracy. The expansion of the XY stroke will not affect the bonding accuracy of the UVZ bonding mechanism, thereby enabling bonding in a larger area, and the range of the bonding area can be further expanded.

[0015] In one possible implementation, the U-axis drive assembly includes a U-axis voice coil motor and a U-axis body, the U-axis voice coil motor includes a U-axis stator and a U-axis mover, the U-axis body is arranged on the U-axis mover, the U-axis stator includes a U-axis stator magnet, the U-axis mover includes a U-axis mover coil, and the U-axis mover coil includes a first length segment, and the length of the first length segment is greater than the covering length of the U-axis stator magnet.

[0016] In one possible implementation, the Z-axis drive assembly includes a Z-axis voice coil motor and a Z-axis body, the Z-axis voice coil motor includes a Z-axis stator and a Z-axis mover that moves linearly relative to the Z-axis stator, the Z-axis body is disposed on the Z-axis mover, the Z-axis stator is provided with a Z-axis stator magnet, the Z-axis mover is provided with a Z-axis mover coil, the Z-axis mover coil includes a second length segment, and the length of the second length segment is greater than the covering length of the Z-axis stator magnet.

[0017] In one possible implementation, the V-axis drive assembly includes a V-axis voice coil motor and a V-axis body, the V-axis voice coil motor includes a V-axis stator and a V-axis mover that moves linearly relative to the V-axis stator, the V-axis body is disposed on the V-axis mover, the V-axis stator is provided with a V-axis stator magnet, and the V-axis mover is provided with a V-axis mover coil.

[0018] In a possible implementation, a first guide rail extending along the U-axis direction is provided on the Z-axis body, and a first guide rail groove extending along the U-axis direction is provided on the Z-axis mover of the Z-axis voice coil motor, and the first guide rail and the first guide rail groove are slidably connected as a whole.

[0019] In one possible implementation, a horizontal mounting plate is provided above the Z-axis mover, and the horizontal mounting plate is fixed on the mounting seat. The lower surface of the mounting seat is provided with a second guide rail extending along the V-axis, and the second guide rail is connected to a second guide rail groove extending along the V-axis direction, and the second guide rail and the second guide rail groove are slidably connected as a whole.

[0020] In one possible implementation, a transfer block is fixed on the second guide rail groove, the Z-axis mover is provided with a third guide rail extending along the Z-axis direction, the transfer block is provided with a third guide rail groove extending along the Z-axis direction, and the third guide rail and the third guide rail groove are slidably connected as a whole.

[0021] In a third aspect, an embodiment of the present application further provides a wire bonding device, comprising an XY platform, on which the wire bonding apparatus as described in the second aspect above is provided. BRIEF DESCRIPTION OF THE DRAWINGS

[0022] Figure 1 It is a schematic diagram of the structure of a voice coil motor without electromagnetic decoupling;

[0023] Figure 2 It is a schematic structural diagram of a voice coil motor with electromagnetic decoupling according to the first embodiment;

[0024] Figure 3 Schematic diagram of the air gap structure of a voice coil motor without air gap decoupling;

[0025] Figure 4 It is a schematic structural diagram of a voice coil motor with air gap decoupling according to the second embodiment;

[0026] Figure 5 It is a schematic diagram of the structure of the existing bonding equipment;

[0027] Figure 6 is a schematic diagram of a motion coordinate system of the third embodiment;

[0028] Figure 7 is a schematic structural diagram of a wire bonding device according to a third embodiment;

[0029] Figure 8 It is a schematic structural diagram of the wire bonding device of the third embodiment from another perspective;

[0030] Fig. 9 It is a schematic structural diagram of the wire bonding device of the third embodiment from another perspective;

[0031] Fig.10 It is a schematic diagram of the mounting base structure of the third embodiment;

[0032] Fig.11 for Figure 7 A in the enlarged view;

[0033] Fig.12 This is a schematic diagram of the main structure of the V-axis of the third embodiment;

[0034] Fig.13 This is a structural diagram of the grating scale assembly of the third embodiment. DETAILED DESCRIPTION

[0035] In order to make the purpose, technical solution and advantages of the present application clearer, the technical solution of the present application will be described in detail by means of implementation methods with reference to the drawings in the embodiments of the present application. Obviously, the described embodiments are part of the embodiments of the present application, not all of the embodiments. In the absence of conflict, the embodiments in the present application and the features in the embodiments can be combined with each other. Based on the embodiments in the present application, all other embodiments obtained by ordinary technicians in the field without creative work are within the scope of the present application.

[0036] In order to help understand the technical content and technical problems solved in the embodiments of the present application, firstly, the existing bonding technology and principles related to the present application are further explained.

[0037] The embodiments of the present application aim to use a voice coil motor as a three-axis driving mechanism of a wire bonding mechanism to perform a small-range three-axis movement to realize the bonding process of a semiconductor chip. At the same time, based on the fact that the spatial position relationship between the mover of the voice coil motor connected to the driven end and the stator is easily affected by other axial movements, resulting in changes in electromagnetic force, a further optimization scheme is made.

[0038] like Figure 1 As shown, the voice coil motor 100 includes a stator 110 and a mover 120, wherein the stator 110 includes a stator magnet 111, and the mover 120 includes a mover coil 121. During operation, the stator 110 is fixed, and the mover 120 is connected to the driven end. After the mover coil is energized, an electromagnetic field is generated to interact with the stator magnet 111, so that the mover 120 moves, and high-frequency linear reciprocating motion can be achieved. Structurally, the mover is suspended relative to the stator. In order to enable the driven end to move in a preset direction, the driven end is generally guided or limited by a structure to prevent the mover from being displaced in other non-moving directions. However, in a multi-axis motion unit, the driven end is required to have a certain free travel in multiple directions to ensure that each axis can be driven individually or multiple axes can be driven in conjunction. At this time, the driven end cannot be limited to ensure the stable operation of a voice coil motor in a certain direction. For example, when Figure 1When the mover 120 in the three-axis motion platform moves inward and outward directions under the influence of other axial directions, the number and direction of the mover coils 121 covered by the stator magnet 111 change, which causes the driving force in the normal working direction of the voice coil 100 to change and produce fluctuations, affecting the changes in parameters such as the driving speed and stroke in this direction. Therefore, in this case, the driving accuracy and operating frequency of the voice coil motor of the three-axis motion platform cannot stably operate according to the predetermined parameters. One purpose of the first embodiment of the present application is to solve the problem of changes in the driving force after the voice coil motor is subjected to a force in the above-mentioned direction.

[0039] In the first embodiment, the voice coil motor 100 is disposed in a multi-axis motion unit, and at least one axial motion in the multi-axis motion unit is linearly driven by the voice coil motor 100. The multi-axis motion unit in this embodiment is preferably a three-axis motion unit, that is, a motion unit that moves in three perpendicular axes of a spatial rectangular coordinate system, or a motion unit in two perpendicular directions on the same plane. In the three-axis motion unit, the voice coil motor 100 can be used for linear drive in all three directions, or the voice coil motor can be combined with other driving methods to achieve three-axis motion.

[0040] like Figure 2 As shown, there is a length segment 122 on the movable coil 121, and the length of the length segment 122 is greater than the length covered by the stator magnet 111. When the voice coil motor 100 moves in the working direction, when the extension direction of the length segment 122 is displaced by the driving force, the number and direction of the movable coil 121 covered by the stator magnet 111 remain unchanged, so the driving force of the voice coil motor 100 in the working direction remains stable. This working mode is called electromagnetic decoupling in this embodiment, that is, by setting the redundant stroke amount, the driving force caused by the coupling linkage with other axes is substantially decoupled within the redundant stroke amount range, so that the electromagnetic driving force of the voice coil motor 100 during operation remains constant. The portion of the length of the length segment 122 that is greater than the length covered by the stator magnet 111 is the electromagnetic decoupling stroke, which can be distributed proportionally or evenly on both sides of the distance covered by the stator magnet 111, or can be all located on one side of the distance covered by the stator magnet 111. The actual decoupling stroke distribution is set according to the motion range of other axes. The length of the electromagnetic decoupling stroke is set accordingly according to the stroke in the force-applying direction, and the electromagnetic decoupling length is greater than the stroke in the force-applying direction.

[0041] In addition to the above first embodiment, the mover 120 can be displaced in the extension direction of the length section 122 by the driving force, it is also possible to generate displacement in the thickness direction of the mover 120 driven by another axial driving force, such as Figure 3As shown, in order to ensure that the mover 120 can move relative to the stator 110 during operation, there is a gap between the stator 110 and the mover 120, and this gap is called an air gap. The voice coil motor has a standard air gap to ensure that the voice coil motor can work normally. The second embodiment of the present application decouples the displacement of the mover 120 in the thickness direction by optimizing the air gap, which is called air gap decoupling in this embodiment. For details, see Figure 3 and Figure 4 As shown, the width of the air gap 131 between the mover 120 and the stator 110 of the voice coil motor 100 in the second embodiment is greater than the standard air gap 130 width, and an air gap decoupling stroke is formed in the thickness direction of the mover 120. When the mover 120 is offset by the force in the thickness direction, the movement of the mover 120 in the thickness direction does not cause interference between the mover 120 and the stator 110, ensuring that the normal operation of the mover 120 itself is not affected. The air gap decoupling stroke is set accordingly according to the stroke in the force application direction, and the air gap decoupling stroke is greater than the stroke in the force application direction.

[0042] In addition to the electromagnetic decoupling in the first embodiment and the air gap decoupling in the second embodiment to eliminate the disturbance effect of other moving axes on the working direction of the voice coil motor itself, it can also be done by mechanical guide rail decoupling, that is, by setting a decoupling guide rail between two vertical moving axes, when one moving axis moves, the guide rail and guide rail groove of the decoupling guide rail can eliminate the force of the movement of the moving axis in the vertical direction, that is, when one part of the guide rail or the guide rail groove moves in one direction, the other part remains stationary by relative sliding. The specific scheme refers to the structure and principle of the decoupling guide rail on the specific wire bonding device as follows.

[0043] The above three decoupling structures can be selectively used on each axis in the actual three-axis motion unit according to the actual situation. It is not required that each axis has the above three decoupling structures at the same time. Usually, one or two of the above decoupling methods can be used in combination. It is set according to the motion action to be achieved by the three-axis motion unit.

[0044] A third embodiment of the present application provides a wire bonding device capable of achieving high-speed bonding.

[0045] When working, the existing wire bonding equipment uses the bonding mechanism to pull the metal wire to move back and forth between the chip and the lead frame bracket to achieve connection. During this process, the bonding mechanism needs to move in the three directions of the XYZ axis to achieve the bonding process. The above is the bonding process of a single chip. The movement in the three directions of the XYZ axis is a small range movement, and the movement stroke in each direction is small. In the batch processing process, the bonding equipment also needs to move the bonding mechanism to different areas through the movement in the XY axis direction to process chips in different partitions. In this process, the movement stroke on the XY axis is large. Existing bonding equipment uses an XYZ-axis motion mechanism to solve the needs of large-range and small-range movement during the processing process. This solution is the common three-axis motion mechanism. When used on bonding equipment, in addition to the bonding tools, lead mechanisms and other components required for the bonding process, the bonding mechanism also requires some structural parts to realize structural and electrical installation, such as mounting seats, brackets and other components. When the bonding equipment is performing bonding processing, the XYZ motion mechanism needs to drive heavier functional components and structural components to perform large-stroke and large-load movements together. Therefore, the maximum acceleration of the existing bonding equipment in the XY-axis direction can reach 35-40G, which is difficult to further improve.

[0046] Moreover, at the same time Figure 5 As shown, the Z-axis direction of the existing bonding equipment is generally achieved by rotating the bonding tool to make the bonding tool do circular motion in the vertical direction to achieve the Z-axis movement during the bonding process. In fact, it performs a mechanical action similar to an arc-shaped swing arm to simulate the linear motion, so it will cause disturbances to other axes. These problems will lead to poor final bonding packaging effect.

[0047] In order to solve the above problems, Figures 6 to 9 As shown, the wire bonding device of the third embodiment includes:

[0048] A mounting base 1, mounted on an XY platform of a bonding device;

[0049] The mounting base 1 is a basic structural component for mounting the wire bonding device in this embodiment, and is used to mount other components on the wire bonding device and to carry the entire wire bonding device to move on the XY platform of the bonding device during operation.

[0050] The UVZ three-axis motion unit is arranged on the mounting seat 1, and includes a U-axis drive component, a V-axis drive component and a Z-axis drive component for linear motion; at least one of the U-axis drive component, the V-axis drive component and the Z-axis drive component includes a multi-axis motion decoupling structure.

[0051] The bonding mechanism is arranged on the Z-axis driving assembly, moves under the drive of the UVZ three-axis motion unit and performs chip bonding processing.

[0052] The XY platform may be a base having an XY-axis driving mechanism, or may be a gantry-type or other form of platform structure, so as to be able to carry or mount the UVZ three-axis motion unit to move in the XY direction.

[0053] In the third embodiment, a UVZ three-axis motion unit composed of a U-axis drive assembly, a V-axis drive assembly, and a Z-axis drive assembly is arranged on the mounting seat 1 to construct the UVZ motion coordinate system of the wire bonding device itself, which is separated from the platform XY motion coordinate system of the XY platform of the bonding device. The U-axis drive assembly, the V-axis drive assembly, and the Z-axis drive assembly are used to execute the small-range and short-distance movement of the bonding mechanism in the three-axis directions of the UVZ motion coordinate system during the bonding process, so that the U-axis drive assembly, the V-axis drive assembly, and the Z-axis drive assembly of the wire bonding device have a small motion range and a low motion load, which can greatly reduce the inertia of the drive device during movement, greatly increase the acceleration of the bonding mechanism during movement, and can also cooperate with the XY platform of the bonding device to perform drive superposition, so as to further improve the motion acceleration of the bonding mechanism. At the same time, the device structure realizes the separation design of the bonding area and the bonding accuracy, and the expansion of the XY stroke will not affect the bonding accuracy of the UVZ bonding mechanism, so that bonding of a larger area can be achieved, and the range of the bonding area can be further expanded.

[0054] Furthermore, in the third embodiment, the vertical movement of the Z-axis driving component in the UVZ three-axis motion unit of the wire bonding device itself replaces the structural form of the original bonding device simulating the Z-axis linear motion through circular motion in the Z-axis direction, thereby effectively solving the problem that the rotational force has high requirements for the coincidence of the rotation center and the center of gravity and causes eccentric disturbances, making the structural form more stable and able to achieve greater acceleration motion in the Z-axis direction.

[0055] Preferably, in the third embodiment, the U-axis driving assembly, the V-axis driving assembly and the Z-axis driving assembly all use voice coil motors to drive the respective axes.

[0056] like Fig.10 As shown, specifically, in this embodiment, the mounting seat 1 is a structure having an internal mounting space and external horizontal and vertical mounting surfaces.

[0057] like Figure 7 and Figure 8As shown, the U-axis driving assembly includes a U-axis voice coil motor 2 and a U-axis main body 3. The U-axis voice coil motor 2 includes a U-axis stator 21 and a U-axis mover 22. When installed, the U-axis stator 21 is horizontally installed in the mounting seat 1. The U-axis stator 21 is arranged on the mounting seat 1, and the U-axis mover 22 is connected to the U-axis main body 3; the U-axis mover 22 moves in the horizontal direction relative to the U-axis stator, and the U-axis mover 22 is located in the U-axis stator 21 in a horizontal state. U-axis travel space is reserved on both sides of the U-axis stator 21 for the U-axis mover 22 to perform horizontal movement, and the U-axis mover 22 performs U-axis horizontal reciprocating motion in the U-axis travel space.

[0058] The V-axis driving assembly includes a V-axis voice coil motor 4 and a V-axis main body 5. The V-axis voice coil motor is installed vertically downward in the mounting seat 1. The V-axis voice coil motor 4 includes a V-axis stator 41 and a V-axis mover 42. The V-axis stator is installed vertically downward in the mounting seat 1. The V-axis stator 41 is arranged on the mounting seat 1, and the V-axis mover 42 is connected to the V-axis main body 5. When installed, the V-axis stator 41 is vertically installed on the first horizontal mounting surface of the mounting seat 1, and the V-axis mover 42 is located in the V-axis stator 41 in a vertical state. Y-axis travel space is reserved on both sides of the V-axis stator 41 for the V-axis mover 42 to perform horizontal movement. The V-axis mover 42 performs Y-axis horizontal movement in the V-axis travel space.

[0059] The Z-axis driving assembly includes a Z-axis voice coil motor 6 and a Z-axis body 7 . The Z-axis voice coil motor includes a Z-axis stator 61 and a Z-axis mover 62 . The Z-axis stator 61 is disposed on the mounting seat 1 , and the Z-axis mover 62 is connected to the Z-axis body 7 .

[0060] At the same time, if Figure 8 As shown, the U-axis stator 21 includes a U-axis stator magnet 211, and the U-axis mover 22 includes a U-axis mover coil 221. The U-axis mover coil 221 includes a first length segment 222, and the length of the first length segment 222 is greater than the coverage length of the U-axis stator magnet 211. When the U-axis and the V-axis are linked in parallel, the U-axis V-axis voice coil motor will drive the U-axis body to move in the V-axis direction when driving the V-axis movement, and then drive the U-axis mover to move in the V-axis direction. At this time, since the length of the U-axis mover coil 221 covered by the U-axis stator magnet 211 remains unchanged, the driving force of the U-axis voice coil motor 2 on the U-axis remains unchanged, thereby achieving electromagnetic decoupling. Since the movement influence of the U-axis and the V-axis is mutual, the requirement of mutual non-disturbance can be met by performing electromagnetic decoupling in one of the U-axis voice coil motor and the V-axis voice coil motor.

[0061] Similarly, if Figure 8As shown, in this embodiment, the Z-axis stator 61 is provided with a Z-axis stator magnet 611, and the Z-axis mover 62 is provided with a Z-axis mover coil 621, and the Z-axis mover coil 621 includes a second length segment 622, and the length of the second length segment 622 is greater than the coverage length of the Z-axis stator 611 magnet. The portion of the second length segment 622 that is greater than the coverage length of the Z-axis stator magnet 611 constitutes an electromagnetic decoupling stroke, which can avoid the influence of the movement in the V-axis direction on the driving force of the Z-axis mover. The specific principle is similar to that of the U-axis voice coil motor 2, and will not be repeated here.

[0062] The third embodiment solves the disturbance problem when the V-axis is linked to the U-axis or Z-axis in parallel by electromagnetic decoupling. When UV-axis linkage and VZ-axis linkage exist in the linkage scheme in the motion control of the three-axis motion unit, the mutual disturbance of the motion in the two vertical directions can be eliminated. However, in the three-axis motion unit, the three axes will affect each other when linked. The above electromagnetic decoupling scheme solves the disturbance problem when the V-axis is linked to the U-axis or Z-axis in parallel. In actual work, there are still situations where the U-axis and the Z-axis are linked, and the disturbance problem of the U-axis and the Z-axis in the case of UVZ three-way linkage. This embodiment solves this problem by mechanical decoupling the guide rail.

[0063] The setting of mechanical decoupling is based on the layout and mutual structural relationship of each component of the wire bonding device of this embodiment. Therefore, in order to clearly explain the principle of mechanical decoupling, the component morphology and structural relationship of this embodiment are first described in detail as a whole.

[0064] In this embodiment, Figure 7 and Fig.11 As shown, the Z-axis body 7 is provided with a first guide rail 81 extending along the U-axis direction, and the Z-axis mover 62 of the Z-axis voice coil motor is provided with a first guide rail groove 82 extending along the U-axis direction, and the first guide rail 81 and the first guide rail groove 82 are slidably connected as a whole; when the Z-axis mover 62 moves vertically, the Z-axis body 7 makes reciprocating linear motion in the vertical direction, and when the U-axis mover drives the Z-axis body 7 to make linear motion in the horizontal U-axis direction, the horizontal U-axis motion driving force of the Z-axis body 7 is released by the first guide rail 81 and the first guide rail groove 82 and the Z-axis mover, that is, the driving force in the horizontal U-axis direction cannot be transmitted to the Z-axis mover, so the Z-axis mover is not affected by the driving force in the U-axis direction and maintains a standard Z-axis motion straight line, which can ensure both machining accuracy and device safety.

[0065] In this embodiment, a horizontal mounting plate 30 is provided above the Z-axis mover, and the horizontal mounting plate 30 is fixed on the mounting seat 1. The lower surface of the horizontal mounting plate 30 is provided with a second guide rail 91 extending along the V-axis, and the second guide rail 91 is connected to a second guide rail groove 92 extending along the V-axis direction, and the second guide rail 91 and the second guide rail groove 92 are slidably connected as a whole; when the Z-axis mover moves vertically, it drives the Z-axis body 7 to make reciprocating linear motion in the vertical direction, and when the V-axis mover drives the V-axis body to make linear motion in the horizontal Y-axis direction, the second guide rail 91 and the second guide rail groove 92 can make the motion driving force in the horizontal V-axis direction be released by the V-axis decoupling guide rail and the Z-axis mover, that is, the driving force in the horizontal V-axis direction cannot be transmitted to the Z-axis mover, so the Z-axis mover is not affected by the driving force in the horizontal V-axis direction and maintains a standard Z-axis motion straight line.

[0066] In this embodiment, a transfer block 31 is fixed on the second guide groove 92, a third guide 101 extending along the Z-axis direction is provided on the Z-axis mover 62, a third guide groove 102 extending along the Z-axis direction is provided on the transfer block, and the third guide 101 and the third guide groove 102 are slidably connected as one. When the Z-axis mover drives the Z-axis body to make a linear motion in a direction perpendicular to the Z-axis direction, the driving force of the Z-axis mover 62 in the vertical direction on the moving parts on other axes is released by the third guide 101 and the third guide groove 102, that is, the driving force in the Z-axis direction is not transmitted to the U-axis and V-axis directions, so that the various moving parts on the U-axis and V-axis are not disturbed by the motion in the Z-axis direction.

[0067] It should be noted that the guide rails and guide rail grooves of each axis shown in the figure are simplified representations. In fact, during operation, the sliders and tracks of the decoupling guide rails of each axis can translate and slide relative to each other in the linear direction, but are inseparable in the vertical and sliding plane directions. That is, the guide rails and guide rail grooves of each axis can be matched by V-shaped sliders or tracks, or by setting ball bearings or slide grooves to achieve a structure that can translate but not separate. Only when the sliders and tracks of the decoupling guide rails in each direction are not separated from each other during operation can the structural stability of the overall wire bonding device be achieved.

[0068] The decoupling guide rails of the above-mentioned axes are mainly used to prevent the motion in each direction from being transmitted to other axes, thereby avoiding motion disturbance between the various motion axes and releasing disturbance forces. In order to further ensure the accuracy of the linear motion, multiple cross guide rails are also used in this embodiment to accurately guide the linear motion of each axis.

[0069] like Fig. 9As shown, a fourth guide rail 132 extending along the Z-axis direction is provided on the side of the U-axis body in this embodiment, and a fourth guide rail groove 131 extending along the Z-axis direction is provided on the Z-axis body 62. The fourth guide rail 132 and the fourth guide rail groove 131 are slidably connected as a whole and are inseparable in a direction perpendicular to the sliding surface. When the Z-axis mover 62 drives the Z-axis body 7 to move vertically in the Z-axis direction, the fourth guide rail 132 and the fourth guide rail groove 131 guide the movement in the Z-axis direction, thereby maintaining the stability of the Z-axis linear motion.

[0070] The U-axis body is also provided with a fifth guide rail 142 extending along the U-axis direction, and the V-axis body 5 is provided with a fifth guide rail groove 141 extending along the U-axis direction. The fifth guide rail 142 and the fifth guide rail groove 141 are slidably connected as a whole and are inseparable in a direction perpendicular to the sliding surface. When the U-axis mover 22 drives the U-axis body 3 to move horizontally in the U-axis direction, the fifth guide rail 142 moves horizontally in the U-axis direction along with the U-axis body 3. The fifth guide rail 142 and the fifth guide rail groove 141 guide the movement in the U-axis direction, thereby maintaining the stability of the U-axis linear motion.

[0071] The V-axis body 5 is further provided with a sixth guide rail groove 152 extending along the V-axis direction, and the unit base is provided with a sixth guide rail 151 extending along the V-axis direction. The sixth guide rail 151 and the sixth guide rail groove 152 are slidably connected as a whole and are inseparable in a direction perpendicular to the sliding surface. When the V-axis mover 42 drives the V-axis body 5 to move horizontally in the V-axis direction, the sixth guide rail groove 152 follows the V-axis body 5 to move horizontally in the V-axis direction, and the sixth guide rail 151 guides the horizontal movement of the V-axis mover 42 in the V-axis direction and maintains the height of the V-axis mover 42.

[0072] In this embodiment, a cross guide rail is installed between the fourth guide rail 131 and the fourth guide rail groove 132, the fifth guide rail 141 and the fifth guide rail groove 142, and the sixth guide rail 151 and the sixth guide rail groove 152. According to the working principle of the cross guide rail and as shown in the figure, the outer rail of the cross guide rail moves with the corresponding guide groove, and the inner rail of the cross guide rail moves integrally with the corresponding main body.

[0073] like Fig.12 As shown, from the above structural relationship, it can be known that the second guide groove 142 and the third guide groove 152 are installed on the V-axis body 5 at the same time, so the V-axis body needs to include two mounting surfaces to respectively install the second guide groove 142 and the third guide groove 152. In order to make the component structure more compact and reduce the volume of the V-axis body 5, as shown in FIG. Fig. 9As shown, the upper surface of the V-axis body 5 in this embodiment is provided with an upper mounting position 51 for mounting the third guide groove 152, and the lower surface of the V-axis body 5 is provided with a lower mounting position 52 for mounting the second guide groove 142. The V-axis body 5, the second guide groove 142, and the third guide groove 152 are mounted into an integrated structure through the upper mounting position 51 and the lower mounting position 52, which can not only reduce the size of the device, but also make the guide references of the U-axis and the V-axis located on the same component, and the structure is more stable and accurate.

[0074] In order to accurately control and feedback the motion stroke of each axis, it is also necessary to set corresponding devices in the motion direction of each axis to measure the motion stroke of each axis. To achieve this purpose, in this embodiment, corresponding grating ruler components are installed on the moving parts of each axis, such as Fig.13 As shown, the specific structure is set as follows:

[0075] In terms of measurement and control of the Z-axis travel, a Z-axis grating ruler 16 is provided on the Z-axis body 7, and a Z-axis grating ruler reader 17 is provided on the U-axis body.

[0076] In the measurement and control of the U-axis and V-axis strokes, a U-axis grating scale 18 and a V-axis grating scale 19 are provided on the V-axis body, a U-axis grating scale reader 20 is provided on the U-axis body, and a V-axis grating scale reader 21 is provided on the mounting seat.

[0077] In the above embodiments, Figure 7 and Figure 8 As shown, the bonding mechanism includes a bonding tool 22 installed at the front end of the Z-axis body 7, a piezoelectric wire clamp 23 is provided above the bonding tool 22, and the piezoelectric wire clamp 23 is also installed on the Z-axis body. A ring blowing device 24 is also provided next to the bonding tool 22, and the ring blowing device 24 is provided on a sparking mounting seat 25, and the sparking mounting seat 25 is installed on the U-axis body 3.

[0078] Among them, the crimping wire clamp realizes the clamping and release of the bonding gold wire. Through its clamping and opening actions, the movement of UVZ in different timings is coordinated to achieve the formation of various bonding wire arcs.

[0079] The ring blowing device is used to protect the bonding copper wire or alloy wire from oxidation during the ignition and bonding process. The nitrogen-hydrogen mixed protective gas is delivered to the splitter position through the ring blowing device, so that the bonding wire and bonding material are surrounded by the protective gas during ignition, and are not easily oxidized under high temperature and high pressure conditions, thus ensuring the bonding quality.

[0080] The sparking mounting seat is used to install and adjust the position of the ring blowing device so that the hole position of the ring blowing head can always be coaxial with the splitting knife.

[0081] The fourth embodiment of the present invention further provides a wire bonding device with an air gap decoupling structure based on the third embodiment. Based on the voice coil motor of the third embodiment, the air gap width between the mover coil and the stator magnet in the voice coil motor is greater than the standard air gap width.

[0082] In the above-mentioned third and fourth embodiments, the electromagnetic decoupling structure, mechanical decoupling structure and air gap decoupling structure can be used in combination according to different connection relationships and the actual driving actions to be performed, such as one of the electromagnetic decoupling structure, the mechanical decoupling structure and the air gap decoupling structure, or the electromagnetic decoupling structure combined with the mechanical decoupling structure, the electromagnetic decoupling structure combined with the air gap decoupling structure, the mechanical decoupling structure combined with the air gap decoupling structure, or all three.

[0083] A fifth embodiment of the present invention provides a high-speed bonding device, comprising an XY platform, on which the wire bonding device in the third embodiment is arranged.

[0084] The above description is only a preferred embodiment of the present application, and does not limit the patent scope of the present invention. Any equivalent structure or equivalent process transformation made by using the contents of the present invention specification and drawings, or directly or indirectly applied in other related technical fields, are also included in the patent protection scope of the present invention.

Claims

1. A wire bonding device, characterized in that: include: A mounting base, mounted on the XY platform of the bonding equipment; The UVZ three-axis motion unit is arranged on the mounting seat, and includes a U-axis drive assembly, a V-axis drive assembly and a Z-axis drive assembly for performing linear motion; The bonding mechanism is arranged on the Z-axis driving assembly, and moves under the drive of the UVZ three-axis motion unit to perform chip bonding processing; The U-axis driving assembly includes a U-axis voice coil motor and a U-axis body, the U-axis voice coil motor includes a U-axis stator and a U-axis mover, the U-axis body is arranged on the U-axis mover, the U-axis stator includes a U-axis stator magnet, the U-axis mover includes a U-axis mover coil, the U-axis mover coil includes a first length segment, and the length of the first length segment is greater than the covering length of the U-axis stator magnet; The Z-axis driving assembly includes a Z-axis voice coil motor and a Z-axis body, the Z-axis voice coil motor includes a Z-axis stator and a Z-axis mover that moves linearly relative to the Z-axis stator, the Z-axis body is arranged on the Z-axis mover, the Z-axis stator is provided with a Z-axis stator magnet, the Z-axis mover is provided with a Z-axis mover coil, the Z-axis mover coil includes a second length segment, and the length of the second length segment is greater than the covering length of the Z-axis stator magnet; The V-axis driving assembly includes a V-axis voice coil motor and a V-axis body, the V-axis voice coil motor includes a V-axis stator and a V-axis mover that moves linearly relative to the V-axis stator, the V-axis body is arranged on the V-axis mover, the V-axis stator is provided with a V-axis stator magnet, and the V-axis mover is provided with a V-axis mover coil; The Z-axis body is provided with a first guide rail extending along the U-axis direction, and the Z-axis mover of the Z-axis voice coil motor is provided with a first guide rail groove extending along the U-axis direction, and the first guide rail and the first guide rail groove are slidably connected as a whole.

2. The wire bonding device according to claim 1, wherein: A horizontal mounting plate is provided above the Z-axis mover, and the horizontal mounting plate is fixed on the mounting seat. The lower surface of the mounting seat is provided with a second guide rail extending along the V-axis, and the second guide rail is connected to a second guide rail groove extending along the V-axis direction. The second guide rail and the second guide rail groove are slidably connected as a whole.

3. The wire bonding device according to claim 2, wherein: A transfer block is fixed on the second guide rail groove, the Z-axis mover is provided with a third guide rail extending along the Z-axis direction, the transfer block is provided with a third guide rail groove extending along the Z-axis direction, and the third guide rail and the third guide rail groove are slidably connected as a whole.

4. The wire bonding device according to claim 1, wherein: A fourth guide rail extending along the Z-axis direction is provided on the side of the U-axis body, and a fourth guide rail groove extending along the Z-axis direction is provided on the Z-axis body. The fourth guide rail and the fourth guide rail groove are slidably connected as a whole.

5. The wire bonding device according to claim 4, wherein: The U-axis body is also provided with a fifth guide rail extending along the U-axis direction, and the V-axis body is provided with a fifth guide rail groove extending along the U-axis direction. The fifth guide rail and the fifth guide rail groove are slidably connected as a whole.

6. The wire bonding device according to claim 5, characterized in that: The V-axis body is further provided with a sixth guide rail groove extending along the V-axis direction, and the unit base is provided with a sixth guide rail extending along the V-axis direction. The sixth guide rail and the sixth guide rail groove are slidably connected as a whole.

7. The wire bonding device according to claim 1, wherein: The Z-axis main body is provided with a Z-axis grating scale, and the U-axis driving assembly also includes a U-axis main body, the U-axis main body is installed on the U-axis mover, and a Z-axis grating scale reader is provided on the U-axis main body corresponding to the Z-axis grating scale.

8. The wire bonding device according to claim 7, wherein: The V-axis body is provided with a U-axis grating scale and a V-axis grating scale, the U-axis body is provided with a U-axis grating scale reader at a position corresponding to the U-axis grating scale, and the mounting seat is provided with a V-axis grating scale reader at a position corresponding to the V-axis grating scale.

9. A wire bonding device, comprising an XY platform, wherein the wire bonding apparatus according to any one of claims 1 to 8 is arranged on the XY platform.

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