Preparation process of three-dimensional circuit board and three-dimensional circuit board

Abstract

The invention provides a preparation technology of a three-dimensional circuit board and the three-dimensional circuit board, and the preparation technology of the three-dimensional circuit board comprises the steps: carrying out the manufacturing of a conductive wire on a plastic structural part; welding at least two plastic structural parts, wherein the two plastic structural parts are arranged at an included angle; and conducting the two conductive wires to obtain the three-dimensional circuit board. The three-dimensional circuit board provided by the invention is simple in preparation process, relatively low in preparation cost and relatively high in preparation flexibility.

Description

Technical Field

[0001] The present application relates to the field of electronic equipment, and more specifically, to a preparation process of a three-dimensional circuit board and the three-dimensional circuit board. Background Art

[0002] At present, electronic devices are developing towards miniaturization and lightness on the basis of being able to realize their functions. Among them, one of the technical means to achieve miniaturization of electronic devices is to reduce the internal circuit within a limited volume, for example, to make a planar circuit into a three-dimensional circuit, thereby reducing the occupied area of ​​the planar circuit in the electronic device, so that the electronic device can be miniaturized.

[0003] In the related art, laser direct structuring (LDS) technology is usually used to prepare three-dimensional circuits. However, the LDS preparation process is difficult and costly, and the material selection of LDS is limited, resulting in structural limitations of the three-dimensional circuit. Summary of the invention

[0004] In order to solve the above problems, the present application provides a three-dimensional circuit board preparation process and a three-dimensional circuit board. The three-dimensional circuit board provided by the present application has a simple preparation process, a low preparation cost, and a high preparation flexibility.

[0005] In a first aspect, the present application provides a process for preparing a three-dimensional circuit board, comprising: making a conductive trace on a plastic structural member; welding at least two plastic structural members, wherein the two plastic structural members are arranged at an angle; and connecting the two conductive traces to obtain a three-dimensional circuit board.

[0006] Based on the preparation process of the three-dimensional circuit board provided in the embodiment of the present application, a conductive trace is directly prepared on a plastic structural member, and then two plastic structural members are arranged at an angle and welded to connect the conductive traces on the two plastic structural members to obtain a three-dimensional circuit. The preparation process is simple and the preparation cost is low. On the one hand, two or more plastic structural members can be selected with different surfaces, different sizes and different surface flatness. After welding the two or more plastic structural members, the three-dimensional circuit can have more shapes, thereby improving the overall aesthetics of the three-dimensional circuit. On the other hand, by changing the angle between two or more plastic structural members, the overall shape and volume of the three-dimensional circuit can be changed. The preparation flexibility is high and it is applicable to various electronic devices, that is, the applicability of the three-dimensional circuit board is improved.

[0007] In combination with the first aspect, in a possible implementation manner, manufacturing a conductive trace on a plastic structural component includes: preparing the conductive trace on the plastic structural component by pad printing or silk screen printing.

[0008] Based on the above optional methods, the conductive traces prepared by pad printing or silk screen printing have smooth traces, high aesthetics, and low cost.

[0009] In combination with the first aspect, in a possible implementation manner, preparing conductive traces on a plastic structural member by pad printing or silk screen printing includes: at least one conductive trace on the plastic structural member extends to an edge of the plastic structural member.

[0010] In combination with the first aspect, in a possible implementation, manufacturing a conductive trace on a plastic structural component includes: drying and curing a conductive silver paste or a conductive carbon paste at a heat-resistant temperature of the plastic structural component to obtain the conductive trace.

[0011] Based on the above optional methods, when preparing conductive traces on plastic structural parts, the present application can control the temperature to be prepared at a heat-resistant temperature that meets the heat resistance of the plastic structural parts, thereby ensuring the reliability of the preparation. The conductive traces made of conductive silver paste have extremely high bonding strength on plastic structural parts and are difficult to peel off, thereby ensuring the firmness and stability of the conductive traces on plastic structural parts. Conductive carbon paste has low cost, stable performance and good conductivity. The conductive traces prepared by conductive carbon paste have strong adhesion, stability and conductivity on plastic structural parts. That is, the conductive traces obtained after drying and curing the conductive silver paste or conductive carbon paste have strong conductivity and strong firmness with the plastic structural parts, thereby ensuring the firmness and stability between the conductive traces and the plastic structural parts.

[0012] In combination with the first aspect, in a possible implementation, welding at least two plastic structural members includes: clamping the two plastic structural members on different planes respectively; and then ultrasonically welding or laser welding the two plastic structural members.

[0013] Based on the above optional methods, laser welding has a fast welding speed and high efficiency. In addition, laser welding can realize simultaneous processing of multiple laser beams, which can achieve a more precise welding effect and ensure the welding firmness between the two plastic structural parts. Ultrasonic welding has a fast welding speed and high efficiency. At the same time, no additional flux or external heating is required during the welding process. The operation is simple and the welding cost is low. It is suitable for mass production. Moreover, the two plastic structural parts can be seamlessly welded after ultrasonic welding, which is more aesthetically pleasing.

[0014] In combination with the first aspect, in a possible implementation method, the two plastic structural members are clamped in different planes respectively, including: the two plastic structural members are clamped in two planes respectively, and the conduction positions of the conductive traces on the two plastic structural members correspond one to one; the two conductive traces are made conductive, including: the two one-to-one corresponding conduction positions are connected by conductive glue so that the two conductive traces are conductive.

[0015] Based on the above optional methods, the overall shape of the three-dimensional circuit board can be changed by changing the clamping angle between the two plastic structural parts, that is, the operator can change the size of the clamping angle according to different needs, so that the three-dimensional circuit board can be suitable for various electronic devices. In this way, the three-dimensional circuit board has high applicability and preparation flexibility.

[0016] In a second aspect, the present application further provides a three-dimensional circuit board, which adopts the preparation process of the three-dimensional circuit board as described in any optional manner of the first aspect.

[0017] In combination with the second aspect, in a possible implementation manner, the plastic structural member includes at least two sub-structural members, and the two sub-structural members have a planar and / or curved surface structure.

[0018] Based on the above optional method, by welding multiple sub-structures, a single plastic structure can have more sophisticated conductive traces.

[0019] In combination with the second aspect, in a possible implementation manner, a groove is provided on the plastic structural member, and the conductive trace is provided to cover the groove bottom and / or groove wall of the groove.

[0020] Based on the above optional manner, more conductive traces can be arranged on the plastic structural member to increase the conductive area.

[0021] In combination with the second aspect, in a possible implementation, the three-dimensional circuit board includes four plastic structural members, the four plastic structural members form a four-sided cube structure, and a plurality of conductive traces are covered on the inner surface and / or outer surface of the four-sided cube structure.

[0022] Based on the above optional methods, the conductive traces can be arranged on the inner surface, outer surface, or both the inner and outer surfaces of the cubic structure to further reduce the size of the three-dimensional circuit board, which is more conducive to the miniaturization of electronic devices using the three-dimensional circuit board. BRIEF DESCRIPTION OF THE DRAWINGS

[0023] Figure 1 is a flow chart of a process for preparing a three-dimensional circuit board provided in an embodiment of the present application;

[0024] Figure 2 The structure of the three-dimensional circuit board composed of two plastic structural members provided in the embodiment of the present application is schematically shown. Figure 1 ;

[0025] Figure 3 The structure of the three-dimensional circuit board composed of two plastic structural members provided in the embodiment of the present application is schematically shown. Figure 2 ;

[0026] Figure 4It is a schematic structural diagram of a three-dimensional circuit board composed of four plastic structural members provided in an embodiment of the present application.

[0027] Among them, the reference numerals in the figure are:

[0028] 1. Plastic structural parts; 11. Conductive traces;

[0029] 2. Conductive adhesive. DETAILED DESCRIPTION

[0030] In the following description, specific details such as specific system structures, technologies, etc. are provided for the purpose of illustration rather than limitation, so as to provide a thorough understanding of the embodiments of the present application. However, it should be clear to those skilled in the art that the present application may also be implemented in other embodiments without these specific details. In other cases, detailed descriptions of well-known systems, devices, and circuits are omitted to prevent unnecessary details from obstructing the description of the present application.

[0031] At present, electronic devices are developing towards miniaturization and lightness on the basis of being able to realize their functions. Among them, reducing the internal circuit of the electronic device within a limited volume is one of the technical means to achieve miniaturization. For example, a planar circuit is made into a three-dimensional circuit, thereby reducing the occupied area of ​​the planar circuit in the electronic device, so that the electronic device can be miniaturized. Transfer printing technology, three-dimensional inkjet printing technology, in-mold electronics technology (IME) and laser direct structuring technology (LDS) are usually used in related technologies. The following is an exemplary description of these technologies for preparing three-dimensional circuits.

[0032] Transfer printing technology refers to the process of printing pre-made text or patterns onto rubber through ink on a pad printing machine, and then transferring the pre-made text or pattern to the surface of a plastic product through the rubber. Transfer printing technology is usually suitable for curved surfaces with small protrusions and smooth surface transitions. As such, transfer printing technology has certain limitations on the printing surface and printing area, and cannot be applied to large-area production. It is more suitable for devices that do not require large-area printing, such as smart watch rings.

[0033] 3D inkjet printing technology refers to the process of inputting a preset circuit pattern into an inkjet printer through a computer, and then printing the circuit pattern onto the surface of a carrier product using conductive ink. The carrier here can be a circuit board. However, the printing efficiency of 3D inkjet printing technology is low, and 3D inkjet printing technology has certain restrictions on the surface of the carrier, that is, when the carrier is a curved surface, printing is limited and the applicability is low.

[0034] In-mold electronics technology is the combination of in-mold decoration and injection molding technology (IMD) and flexible printed circuits. In-mold electronics technology is also known as in-mold molding technology, which refers to the integration of decoration and circuits through a film, and has a low cost. However, in-mold electronics technology is currently not suitable for large-scale mass production due to limitations such as circuit stretching, component fixation, and the high temperature that components can withstand.

[0035] Laser direct forming technology refers to the process of using laser technology to directly engrave a three-dimensional circuit pattern on an injection-molded plastic structural part, and then forming the pattern into a three-dimensional metal circuit through electroplating. At present, laser direct forming technology is widely used in the production of mobile phone antennas, etc., in which modified plastics containing activatable metal seeds are usually used, which are activated by laser and then electroplated. However, the electroplating process will cause great environmental pollution. In addition, when laser direct forming technology is used to laser engrave an antenna on a frame, the surface formed is not smooth. In order to improve the aesthetics, the antenna is usually formed on the inner side of the frame, which affects the layout of the antenna on the frame, and the preparation process is difficult and the process cost is high.

[0036] In summary, transfer printing technology and three-dimensional inkjet printing technology are both limited by the flatness of the printed surface and have low applicability; in-mold electronics technology has many limiting factors and cannot be mass-produced; laser direct forming technology will cause environmental pollution, and the process is difficult and costly. Moreover, the related technology usually stacks circuit boards to form a three-dimensional circuit, or prepares the circuit on a three-dimensional frame, and the overall shape of the three-dimensional circuit is limited by the circuit board and the frame. To this end, the present application provides a three-dimensional circuit board preparation process and a three-dimensional circuit board. The three-dimensional circuit board provided in the present application has a simple preparation process, a low preparation cost, and a high preparation flexibility.

[0037] The following is an exemplary introduction to the preparation process of the three-dimensional circuit board and the three-dimensional circuit board provided in the present application in conjunction with the accompanying drawings.

[0038] like Figure 1 As shown, in one embodiment provided by the present application, the steps of the preparation process of the three-dimensional circuit board include:

[0039] S1: Conductive traces are made on plastic structural parts.

[0040] It is understandable that in the process of preparing conductive traces on plastic structural parts, since plastic structural parts usually have a certain degree of heat resistance, if the preparation temperature is higher than its heat resistance temperature, the plastic structural parts will be deformed, thereby affecting normal use. If the temperature exceeds a high level, the plastic structural parts may even be scrapped. Therefore, when preparing conductive traces on plastic structural parts, the present application can control the temperature to be within the heat resistance temperature of the plastic structural parts for preparation, thereby ensuring the reliability of preparing the conductive traces.

[0041] Optionally, when the plastic structural member is a low heat-resistant plastic such as polyethylene (PE), polypropylene (PP), polyvinyl fluoride (PVF), polystyrene (PS), polyvinyl chloride (PVC), polybutylene terephthalate (PBT), acrylonitrile-butadiene-styrene copolymer (ABS), and polymethyl methacrylate (PMMA), the conductive traces can be prepared at a temperature below 100°C. For example, taking PMMA as an example, the conductive traces are prepared on PMMA, and the preparation temperature at this time can be 60°C.

[0042] Optionally, when the plastic structural member is a medium heat-resistant plastic such as polyethylene terephthalate (PET), polycarbonate (PC) and nylon (PA), the conductive traces can be prepared at a temperature below 150°C. In this case, the process for preparing the conductive traces is simple and easy to operate. For example, taking PET as an example, when preparing the conductive traces on PET, the preparation temperature can be selected to be 120°C. In this case, the process for preparing the conductive traces is simple and easy to operate.

[0043] Optionally, when the plastic structural parts are high heat-resistant plastics such as polyphenylene sulfide (PPS), polyarylsulfone (PAS), polyetheretherketone (PEEK) and polyimide (PI), the conductive traces can be prepared at a temperature below 250°C. For example, taking PEEK as an example, the heat deformation temperature of PEEK is usually around 230°C. At this time, the preparation temperature can be selected to be 200°C to ensure that PEEK does not undergo thermal deformation. At this time, the process for preparing the conductive traces is simple and easy to operate. Here, it is worth noting that the plastic structural parts can also be any other materials and their blends, and can also include the use of various fillers in the plastic, including but not limited to glass fiber, carbon fiber, aluminum oxide powder, calcium carbonate powder, etc. The operator can select the corresponding plastic structural parts according to actual needs, and this application does not make specific restrictions on this.

[0044] In one example, when the surface of the plastic structural part is flat and has a high flatness, a conductive trace can be prepared on the plastic structural part by silk screen printing. In this way, the conductive trace obtained is flat, has a high aesthetics, and has a low cost.

[0045] In one example, when the surface of a plastic structural part is a curved surface (for example, an arc surface), a conductive trace can be prepared on the plastic structural part by pad printing. In this way, the resulting conductive trace is smooth, and there will be no problem of alignment deviation in the manufacturing process, thereby ensuring the accuracy of the manufacturing.

[0046] Optionally, the conductive trace can be prepared from conductive carbon paste, that is, the conductive trace can be obtained by drying and curing the carbon paste at the heat-resistant temperature of the plastic structural part. For example, when a plastic structural part made of PC material is used to prepare the conductive trace, the conductive carbon paste can be coated on the PC plastic structural part by silk screen printing technology, and heated and cured at 120°C to obtain a graphic film layer, that is, a conductive trace, which has good conductivity and adhesion. Here, it can be understood that the adhesion refers to the strong adhesion of the conductive trace prepared by the conductive carbon paste on the substrate (that is, the PC plastic structural part) and is difficult to peel off, that is, the firmness between the conductive trace and the PC plastic structural part is high. And the cured film formed by curing during the preparation process is not easy to oxidize, has high stability, and can protect and conduct the conductive trace. Therefore, the conductive carbon paste has low cost, stable performance and good conductivity, and the conductive trace prepared by the conductive carbon paste has high conductivity and stability.

[0047] Optionally, the conductive trace can be prepared from conductive silver paste, that is, the conductive silver paste can be dried and cured at the heat-resistant temperature of the plastic structural part to obtain the conductive trace. Exemplarily, when a plastic structural part made of PMMA material is used to prepare the conductive trace, the conductive silver paste can be coated on the PMMA plastic structural part by silk screen printing technology, and heated and cured at 80°C to obtain the conductive trace. The conductive trace has good conductivity, and the conductive trace made of conductive silver paste has extremely high bonding strength on the PMMA plastic structural part and is difficult to peel off, thereby ensuring the firm stability of the conductive trace on the PMMA plastic structural part.

[0048] Here, it is worth noting that after the conductive traces are prepared on the plastic structure, various components can be mounted on the conductive traces according to different requirements to obtain a printed circuit board. Similarly, components can also be mounted in other process steps, and this application does not make specific restrictions on this.

[0049] S2: Weld at least two plastic structural members, wherein the two plastic structural members are arranged at an angle.

[0050] It is worth noting that the two plastic structural parts here can be the same structural parts or different structural parts. The differences here may refer to the surface shape, surface flatness, size and material type of the plastic structural parts. The preparation process is the same, and conductive traces are made on the plastic structural parts. This application does not make any specific restrictions on this.

[0051] Among them, the two plastic structural members can be clamped on two planes respectively, that is, the two plastic structural members are arranged at an angle. Here, it can be understood that at this time, the surface of the plastic structural member has formed a conductive trace, and the conductive position of the conductive trace also corresponds one to one. Then the two plastic structural members are welded according to the preset angle to obtain a three-dimensional circuit board. The preset angle here can refer to the size of the angle corresponding to the shape of the three-dimensional circuit board actually required. For example, when a three-dimensional circuit board with a right angle shape is desired, the two plastic structural members can be welded at 90° (degrees) relative to each other. In this way, by changing the size of the angle between the two plastic structural members, the overall shape of the three-dimensional circuit board can be changed, that is, the operator can change the size of the angle according to different needs, so that the three-dimensional circuit board is suitable for various electronic devices. In this way, the applicability and preparation flexibility of the three-dimensional circuit board are high.

[0052] Optionally, the two plastic structural parts can be clamped on different planes by a robotic arm, and the operator can adjust the clamping position of the robotic arm according to different needs, which is easy to operate.

[0053] In one example, two plastic structural parts can be welded by laser welding. Laser welding uses a high-energy-density laser beam as a heat source to weld two plastic structural parts. Laser welding has fast welding speed and high efficiency. In addition, laser welding can realize simultaneous processing of multiple laser beams, which can achieve a more precise welding effect and ensure the welding firmness between the two plastic structural parts. It is worth mentioning here that laser welding is generally suitable for thermoplastics (for example, PE, PP, PVF, etc.). However, laser welding generally also requires plastic structural parts to have a certain degree of light transmittance in order to achieve a better welding effect. Some plastic structural parts do not have a light transmittance function. Therefore, it is necessary to carry out corresponding light transmittance design for plastic structural parts that are not light-transmitting or have weak light transmittance to ensure the welding effect of laser welding.

[0054] Optionally, when the plastic structural parts are made of engineering plastics, such as PPS or liquid crystal polymer, the light transmittance is low, so carbon black can be added to the bottom material of PPS so that PPS can absorb enough energy to meet the requirements of laser welding and ensure the welding effect of laser welding. It is worth noting that the plastic structural parts can also be made of other engineering plastics that can be processed for light transmission, and this application does not make specific restrictions on this.

[0055] In one example, two plastic structural parts can be welded together by ultrasonic welding. Ultrasonic welding uses the vibration frequency of ultrasonic waves and the contact friction to generate heat energy so that the two plastic structural parts melt at the welding interface and are fixed together. Ultrasonic welding has a fast welding speed and high efficiency. At the same time, no additional flux or external heating is required during the welding process. The operation is simple and the welding cost is low. It is suitable for mass production. Moreover, the two plastic structural parts can be seamlessly welded after ultrasonic welding, which is more aesthetically pleasing. Moreover, compared with laser welding, ultrasonic welding has lower requirements for plastic structural parts and is more applicable.

[0056] S3: Connect the two conductive traces to obtain a three-dimensional circuit board.

[0057] Among them, when the two plastic structural members are fixedly connected by welding, the conducting positions of the conductive traces on the two plastic structural members correspond one to one, and the corresponding conducting positions are connected accordingly to form a three-dimensional circuit board.

[0058] In one example, the conductive trace on at least one plastic structural member extends to the edge of the plastic structural member. At this time, the conductive trace is located at the edge to facilitate the conductive connection with the conductive trace on another plastic structural member. It is worth noting that the conductive trace provided in this embodiment can cover any position on the plastic structural member that can achieve conductive connection, and this application does not make any specific restrictions on this.

[0059] Optionally, the corresponding conductive positions of the two conductive traces can be connected by conductive adhesive (for example, conductive adhesive paste, conductive paint, conductive tape, conductive glue, etc.), and the conductive adhesive has the characteristics of high temperature resistance and can be applied to the conduction between conductive traces on various plastic structural parts. Therefore, by connecting the conductive traces one by one through the conductive adhesive, the aesthetics of the conductive traces can be ensured not to be affected, thereby ensuring the overall aesthetics of the three-dimensional circuit board.

[0060] Optionally, the two conductive traces may be connected via a metal trace (eg, a copper wire), or other conductive members, to which the present application does not impose any specific limitation.

[0061] Here, it is worth noting that after the conductive traces on the two plastic structural parts are connected, various components can be mounted on the conductive traces according to different needs to obtain a printed circuit board. Similarly, components can also be mounted in other process steps, and this application does not make specific restrictions on this.

[0062] In summary, the preparation process of the three-dimensional circuit board provided in the embodiment of the present application is to prepare conductive traces directly on the plastic structural parts, and then set and weld the two plastic structural parts at an angle to connect the conductive traces on the two plastic structural parts to obtain a three-dimensional circuit. The preparation process is simple and the preparation cost is low. On the one hand, two or more plastic structural parts can be selected with different surfaces, different sizes and different surface flatness. After welding the two or more plastic structural parts, the three-dimensional circuit can have more shapes, thereby improving the overall aesthetics of the three-dimensional circuit. On the other hand, by changing the angle between two or more plastic structural parts, the overall shape and volume of the three-dimensional circuit can be changed. The preparation flexibility is high and it is suitable for various electronic devices, that is, the applicability of the three-dimensional circuit is improved.

[0063] Based on the preparation process of the three-dimensional circuit board provided in the embodiment of the present application, the embodiment of the present application can also provide a three-dimensional circuit board, which can be suitable for smart wearable devices, mobile phones and other electronic devices. This application does not make any specific restrictions on this.

[0064] Optional, such as Figure 2As shown, the three-dimensional circuit board may include two plastic structural members 1, the two plastic structural members 1 are vertically welded together, the surfaces of the two plastic structural members 1 are planes, and the two plastic structural members 1 are made with conductive traces 11 of the same size, the two conductive traces 11 are connected by conductive adhesive 2, and the two conductive traces 11 both extend to the edge of the plastic structural member 1. At this time, the conductive adhesive 2 can be directly set on the conductive traces 11 at the edge, reducing the number of conductive adhesives 2 set and saving manufacturing costs. Here, it can be understood that at this time, the two plastic structural members 11 can have the same structure, that is, the same material can be selected, the surface flatness of the material is the same, and the conductive traces 11 made are the same, so that the manufacturing process is simple.

[0065] Optional, such as Figure 3 As shown, the two plastic structural members 1 are arranged in a "T" shape, wherein the conductive trace 11 on one of the plastic structural members 1 extends to the edge of the plastic structural member 11, and the conductive trace 11 on the other plastic structural member 1 is arranged in the middle position, and the conductive traces 11 on the two plastic structural members 11 are connected by a conductive adhesive 2.

[0066] Optional, such as Figure 4 As shown, the three-dimensional circuit board may include four plastic structural members 1, and the four plastic structural members 1 form a four-sided cubic structure. The outer surfaces of the four-sided cubic structure may be provided with conductive traces 11, and the four conductive traces 11 are connected by conductive adhesive 2. Thus, by providing the conductive traces 11 on the four plastic structural members 1, the size of the three-dimensional circuit board is further reduced, which is more conducive to the miniaturization of electronic equipment. Furthermore, the conductive traces 11 may also be provided on the inner surface of the cubic structure, or on the inner and outer surfaces of the cubic structure at the same time, and this application does not make any specific restrictions on this.

[0067] Here, it is worth noting that the conductive trace 11 provided in this embodiment can cover any position on the plastic structural member 1 that can achieve conduction, and this application does not make any specific limitation on this.

[0068] In one example, the surface of the plastic structural component 1 provided in the present application may be provided with at least one groove, and the conductive trace 11 is covered on the bottom and wall of the groove, so that more conductive traces 11 can be arranged on the plastic structural component 1 to increase the conductive area.

[0069] In one example, the plastic structural member 1 provided in the present application may include at least two sub-structures, and the two sub-structures may both be planar structures or curved structures, or one of them may be a planar structure and the other a curved structure. The two sub-structures may be welded on the same plane, or the two sub-structures may be arranged at an angle and welded, and the present application does not impose any specific restrictions on this. Conductive traces 11 are arranged on two or more sub-structures, so that by welding multiple sub-structures, a single plastic structural member 1 can have more sophisticated conductive traces. Multiple sub-structures may also be welded by ultrasonic welding or laser welding, which will not be described in detail.

[0070] In summary, the three-dimensional circuit board provided in the present application has a simple manufacturing process, low preparation cost, high preparation flexibility, and high applicability, which is conducive to the miniaturization development of electronic devices using the three-dimensional circuit board.

[0071] It should be understood that when used in the present specification and the appended claims, the term "comprising" indicates the presence of described features, wholes, steps, operations, elements and / or components, but does not exclude the presence or addition of one or more other features, wholes, steps, operations, elements, components and / or combinations thereof.

[0072] It should also be understood that the term “and / or” used in the specification and appended claims refers to any and all possible combinations of one or more of the associated listed items, and includes these combinations.

[0073] In addition, in the description of the present application specification and the appended claims, the terms "first", "second", "third", etc. are only used to distinguish the descriptions and cannot be understood as indicating or implying relative importance.

[0074] References to "one embodiment" or "some embodiments" etc. described in the specification of this application mean that one or more embodiments of the present application include specific features, structures or characteristics described in conjunction with the embodiment. Therefore, the statements "in one embodiment", "in some embodiments", "in some other embodiments", "in some other embodiments", etc. that appear in different places in this specification do not necessarily refer to the same embodiment, but mean "one or more but not all embodiments", unless otherwise specifically emphasized in other ways. The terms "including", "comprising", "having" and their variations all mean "including but not limited to", unless otherwise specifically emphasized in other ways.

[0075] The embodiments described above are only used to illustrate the technical solutions of the present application, rather than to limit them. Although the present application has been described in detail with reference to the aforementioned embodiments, a person skilled in the art should understand that the technical solutions described in the aforementioned embodiments may still be modified, or some of the technical features may be replaced by equivalents. Such modifications or replacements do not deviate the essence of the corresponding technical solutions from the spirit and scope of the technical solutions of the embodiments of the present application, and should all be included in the protection scope of the present application.

Claims

1. A process for preparing a three-dimensional circuit board, characterized in that: include: Conductive traces are produced on plastic structural parts; Welding at least two of the plastic structural members, wherein the two plastic structural members are arranged at an angle; The two conductive traces are connected to obtain a three-dimensional circuit board.

2. The process for preparing a three-dimensional circuit board according to claim 1, characterized in that: The method of manufacturing the conductive traces on the plastic structural member includes: Conductive traces are prepared on the plastic structural member by pad printing or screen printing.

3. The process for preparing a three-dimensional circuit board according to claim 2, characterized in that: The step of preparing conductive traces on the plastic structural member by pad printing or screen printing comprises: The conductive trace on at least one of the plastic structures extends to an edge of the plastic structure.

4. The process for preparing a three-dimensional circuit board according to claim 2, characterized in that: The method of manufacturing the conductive traces on the plastic structural member includes: The conductive silver paste or the conductive carbon paste is dried and solidified at the heat-resistant temperature of the plastic structural component to obtain the conductive trace.

5. The process for preparing a three-dimensional circuit board according to claim 1, characterized in that: The step of welding at least two of the plastic structural members comprises: Clamping the two plastic structural members in different planes respectively; The two plastic structural parts are then welded by ultrasonic welding or laser welding.

6. The process for preparing a three-dimensional circuit board according to claim 5, characterized in that: The step of clamping the two plastic structural members on different planes comprises: Clamp the two plastic structural members on two planes respectively, and make the conducting positions of the conductive traces on the two plastic structural members correspond one to one; The step of connecting the two conductive traces comprises: The two one-to-one corresponding conducting positions are connected by a conductive adhesive so that the two conductive traces are conducting.

7. A three-dimensional circuit board, characterized in that: The method is prepared by the preparation process according to any one of claims 1 to 6.

8. The three-dimensional circuit board according to claim 7, characterized in that: The plastic structural member includes at least two sub-structural members, and the two sub-structural members have a planar and / or curved surface structure.

9. The three-dimensional circuit board according to claim 7, characterized in that: The plastic structural member is provided with a groove, and the conductive trace is provided to cover the groove bottom and / or groove wall of the groove.

10. The three-dimensional circuit board according to any one of claims 7 to 9, characterized in that: The three-dimensional circuit board includes four plastic structural members, the four plastic structural members form a four-sided cubic structure, and the plurality of conductive traces are covered and arranged on the inner surface and / or outer surface of the four-sided cubic structure.

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